Fingerprint identification module

Abstract

A fingerprint recognition module is provided. The fingerprint recognition module includes a first substrate having a first surface and a second surface opposite to each other and including a central region and an edge region surrounding the central region; a sensing pattern disposed on the first surface of the first substrate in the central region; a cover layer covering the sensing pattern on the first surface of the first substrate; a controller chip disposed on the second surface of the first substrate in the central region; a lower bonding pad disposed on the second surface of the first substrate in the edge region; a second substrate disposed below the edge region and having an opening exposing the central region, the controller chip being accommodated in the opening; and an encapsulation layer at least partially encapsulating the first substrate, the second substrate, and the controller chip, in which the second substrate includes a connection pad electrically connected to the lower bonding pad, the encapsulation layer exposing the capping layer of the first substrate and the connection pad of the second substrate.

Description

Technical Field

[0001] Example embodiments of the inventive concept relate to the field of fingerprint recognition, and more particularly, to a fingerprint recognition module with improved sensing sensitivity. Background Art

[0002] In order to provide improved security and / or enhanced user convenience, various types of biometric identification systems are increasingly being used. Fingerprint sensing devices have been adopted in smart cards due to their small form factor and high performance. Figure 1 A prior art smart card including a fingerprint sensor is shown. The market has an increasing demand for the integration of fingerprint sensors in smart cards.

[0003] Fig.12 This is the first technology in the prior art to install the fingerprint recognition module on the smart card. First, the fingerprint recognition module is mounted on the flexible printed circuit board (FPCB) through the surface mounting (SMT) process, and then the flexible printed circuit board with the fingerprint recognition module mounted is pressed into the smart card by the lamination method. Figure 2 This is the second technology in the prior art for installing a fingerprint recognition module on a smart card. Figure 3 A second technology is shown in which a smart card is installed with a fingerprint recognition module. Figure 4 yes Figure 3 An enlarged view of the fingerprint recognition module shown in . Figure 2 , Figure 3 and Figure 4 The second technology shown is to punch the fingerprint recognition module from a reel-type flexible carrier and then implant it into the smart card through a heat pressing process.

[0004] In the first technology, since the surface mount (SMT) process is used, the current smart card manufacturing equipment production line cannot be used, and the operation is complicated and the cost is high. In the second technology, bonding wires are usually used to connect the fingerprint sensor and the peripheral circuit, so the size of the fingerprint recognition module is much larger than the size of the sensing area. Figure 4 As shown in , the length C1 of the fingerprint recognition module 1 is much larger than the length C2 of the sensing area. In mechanical tests such as bending and winding, the large size of the fingerprint recognition module will lead to a high failure rate of the smart card. Summary of the invention

[0005] In order to solve the above-mentioned technical problems, example embodiments of the inventive concept may provide a fingerprint recognition module having improved sensing sensitivity.

[0006] According to an aspect of an example embodiment of the inventive concept, a fingerprint recognition module is provided, the fingerprint recognition module comprising: a first substrate having a first surface and a second surface opposite to each other and including a central area and an edge area surrounding the central area; a sensing pattern arranged on the first surface of the first substrate in the central area; a covering layer covering the sensing pattern on the first surface of the first substrate; a controller chip arranged on the second surface of the first substrate in the central area; a lower bonding pad arranged on the second surface of the first substrate in the edge area; a second substrate arranged below the edge area and having an opening exposing the central area, the controller chip being accommodated in the opening; an encapsulation layer at least partially encapsulating the first substrate, the second substrate and the controller chip, wherein the second substrate comprises a connection pad electrically connected to the lower bonding pad, and the encapsulation layer exposes the connection pads of the covering layer of the first substrate and the second substrate.

[0007] Further, the thickness of the cover layer may be minimized to just cover the sensing pattern.

[0008] Further, when the fingerprint recognition module is mounted on a smart card, the upper surface of the cover layer may be coplanar with the upper surface of the smart card and contact the finger.

[0009] Furthermore, the sensing pattern may include a first sensing pattern layer and a second sensing pattern layer, the first sensing pattern layer is on the first surface of the first substrate, the second sensing pattern layer is inside the first substrate and close to the first surface of the first substrate, and a sensing capacitor is formed between the first sensing pattern layer and the second sensing pattern layer.

[0010] Further, the first sensing pattern layer may include a plurality of conductive layers that are separated from each other and arranged in a matrix form.

[0011] Furthermore, the fingerprint recognition module may further include: a conductive trace disposed inside the first substrate and on the second surface of the first substrate below the second sensing pattern layer.

[0012] Further, the conductive trace may include a plurality of wiring layers and a plurality of vias electrically connecting the plurality of wiring layers to each other.

[0013] Furthermore, the fingerprint recognition module may further include: an upper bonding pad disposed on the first surface of the first substrate in the edge region and electrically connected to the lower bonding pad via a conductive trace.

[0014] Further, the connection pads of the second substrate may be electrically connected to the lower bonding pads via connection bumps.

[0015] Further, the controller chip may be electrically connected to the conductive traces via bottom bumps, and an underfill may be disposed between an active surface of the controller chip and the second surface of the first substrate and covering the bottom bumps.

[0016] Furthermore, the fingerprint recognition module may further include: a passive device, which is arranged between the lower bonding pad and the controller chip on the second surface of the first substrate and is electrically connected to the conductive trace.

[0017] Further, the connection pad of the second substrate may include an upper portion and a lower portion forming a step structure, the upper portion being connected to the lower bonding pad and having a first size, and the lower portion being exposed to the encapsulation layer and having a second size greater than the first size.

[0018] Further, the length of the encapsulation layer may be greater than or equal to the length of the first substrate.

[0019] Further, the encapsulation layer may include an upper portion and a lower portion forming a stepped structure, the upper portion may have a first length and a first thickness, the lower portion may have a second length and a second thickness, the second length is less than the first length, and the second thickness is less than the first thickness, and a portion of the controller chip is encapsulated in the lower portion.

[0020] Further, the first substrate may be a multilayer printed circuit board, and the second substrate may be a lead frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The foregoing and other objects and features of exemplary embodiments of the inventive concept will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0022] Figure 1 A plan view of a prior art smart card including a fingerprint recognition module is shown.

[0023] Figure 2 This is the second technology in the prior art for installing a fingerprint recognition module on a smart card.

[0024] Figure 3 A second technology is shown in which a smart card is installed with a fingerprint recognition module.

[0025] Figure 4 yes Figure 3 An enlarged view of the fingerprint recognition module.

[0026] Figure 5 is a cross-sectional view of a fingerprint recognition module according to an example embodiment of the inventive concept.

[0027] Figure 6 is a cross-sectional view of a fingerprint recognition module according to an example embodiment of the inventive concept.

[0028] Figure 7 is a cross-sectional view of a fingerprint recognition module according to an example embodiment of the inventive concept.

[0029] Fig. 8A , Fig.9A and Fig. 10A is a schematic cross-sectional view of an intermediate step of a module assembly process of a fingerprint recognition module according to an example embodiment of the inventive concept.

[0030] Figure 8B , Fig. 9B and Fig. 10B is a schematic top view of an intermediate step of a module assembly process of a fingerprint recognition module according to an example embodiment of the inventive concept.

[0031] Fig.11 is a schematic top view of a second substrate of a fingerprint recognition module according to an example embodiment of the inventive concept.

[0032] Fig.12 It is the first technology in the prior art to install a fingerprint recognition module on a smart card. DETAILED DESCRIPTION

[0033] Hereinafter, various embodiments of the inventive concept will be more fully described with reference to the accompanying drawings in which some embodiments are shown. However, the inventive concept can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. Instead, these embodiments are provided so that the description will be thorough and complete, and these embodiments will convey the scope of the inventive concept to those skilled in the art. In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity.

[0034] For ease of description, spatially relative terms such as "under", "below", "below", "above", "above", etc. may be used herein to describe the relationship of one element to other elements as shown in the accompanying drawings. It will be understood that in addition to the orientations depicted in the accompanying drawings, the spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the accompanying drawings is turned over, an element previously described as "under" or "below" other elements will subsequently be oriented to be "above" the other elements. Therefore, the term "under" can include both "above" and "below". The device can be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0035] Various elements may be described herein using terms such as first, second, etc., but these elements should not be limited by these terms. The above terms are only used to distinguish one component from another component. For example, without departing from the scope of the inventive concept, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0036] Unless the context clearly indicates otherwise, a singular expression may include a plural expression. Terms such as "include" or "have" may be interpreted as adding the features, numbers, steps, operations, components, parts, or a combination thereof described in the specification.

[0037] It should be understood that when an element or layer is referred to as being "on," "connected to," "coupled to," "attached to," or "in contact with" another element or layer, it may be directly on, connected to, coupled to, attached to, or in contact with another element or layer, or there may be intermediate elements or intermediate layers. In contrast, when an element is referred to as being "directly on," "directly connected to," "directly coupled to," "directly attached to," or "directly in contact with another element or layer," there are no intermediate elements or intermediate layers. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0038] When the term "approximately" or "substantially" is used in conjunction with a numerical value in this specification, it is intended that the relevant numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "approximately" and "substantially" are used in conjunction with a geometric shape, it is intended that the accuracy of the geometric shape is not required but the tolerance of the shape is within the scope of the inventive concept. In addition, regardless of whether a numerical value or shape is modified to "approximately" or "substantially", it should be understood that these values ​​and shapes should be interpreted as including a manufacturing or operating tolerance (e.g., ±10%) around the numerical value or shape. When a range is specified, the range includes all values ​​therebetween, such as increments of 0.1%.

[0039] It should be understood that elements and / or properties thereof may be described herein as being "the same" or "equivalent" to other elements, and it should also be understood that elements and / or properties thereof described herein as being "the same", "equivalent" or "equivalent" to other elements may be "the same", "equivalent" or "equivalent" or "substantially the same", "substantially equivalent" or "substantially equivalent" to other elements and / or properties. Elements and / or properties thereof that are "substantially the same", "substantially equivalent" or "substantially equivalent" to other elements and / or properties will be understood to include elements and / or properties thereof that are the same, equivalent or equivalent to other elements and / or properties within manufacturing tolerances and / or material tolerances. Elements and / or properties thereof that are the same or substantially the same and / or equivalent or substantially equivalent to other elements and / or properties may be the same or substantially the same in structure, the same or substantially the same in function, and / or the same or substantially the same in composition.

[0040] In the following, reference will be made to Figure 5 , Figure 6 and Figure 7 Different implementations of a fingerprint recognition module according to example embodiments of the inventive concept will be described below, wherein like reference numerals refer to like elements throughout the specification.

[0041] Figure 5 FIG. 1 is a cross-sectional view of a fingerprint recognition module according to an exemplary embodiment of the inventive concept. Figure 5 As shown in FIG. 1 , the fingerprint recognition module 100 includes a first substrate 110, a sensing pattern 120, a cover layer 130, a controller chip 140, a lower bonding pad 150, a second substrate 160, and an encapsulation layer 170. The first substrate 110 has a first surface 110A and a second surface 110B opposite to each other and includes a central region CR and an edge region ER surrounding the central region CR.

[0042] In one embodiment, the first substrate 110 may be a multilayer printed circuit board. For example, the first substrate 110 may include a plurality of insulating material layers and a plurality of wiring layers stacked alternately and a plurality of vias electrically connecting the plurality of wiring layers to each other. In another embodiment, the first substrate 110 may be a flexible printed circuit board.

[0043] The sensing pattern 120 is disposed on the first surface 110A of the first substrate 110 in the central region CR of the first substrate 110. The sensing pattern 120 may be formed of a conductive material such as metal. The sensing pattern 120 may sense a touch or press of a finger. The central region CR of the first substrate 110 may serve as a sensing region of the fingerprint recognition module 100.

[0044] In one embodiment, the sensing pattern 120 may include a first sensing pattern layer 121 and a second sensing pattern layer 122. The sensing pattern 120 may be composed of two wiring layers among a plurality of wiring layers disposed in the first substrate 110. The first sensing pattern layer 121 may be disposed on the first surface 110A of the first substrate 110. The second sensing pattern layer 122 may be inside the first substrate 110 and close to the first surface 110A of the first substrate 110. A sensing capacitor for sensing a fingerprint may be formed between the first sensing pattern layer 121 and the second sensing pattern layer 122. The first sensing pattern layer 121 and the second sensing pattern layer 122 may constitute a first electrode and a second electrode of the sensing capacitor, respectively.

[0045] In one embodiment, the first sensing pattern layer 121 may include a plurality of conductive layers spaced apart from each other and arranged in a matrix or grid form. However, the second sensing pattern layer 122 may include a single layer extending integrally, but the inventive concept is not limited thereto.

[0046] The cover layer 130 covers the sensing pattern 120 on the first surface 110A of the first substrate 110. The cover layer 130 may include an insulating material such as a solder resist or epoxy (EMC) to insulate a plurality of conductive layers constituting the first sensing pattern layer 121 from each other.

[0047] In one embodiment, the cover layer 130 may cover the entire area of ​​the upper surface 110A of the first substrate 110 , but the inventive concept is not limited thereto. In another embodiment, the cover layer 130 may be disposed only in the central region CR of the first substrate 110 .

[0048] In one embodiment, the thickness of the cover layer 130 can be set to be very thin to minimize the distance between the finger and the sensing pattern 120. For example, the thickness of the cover layer 130 can be minimized to just cover the sensing pattern 120. When the fingerprint recognition module 100 is mounted on a smart card, the upper surface of the cover layer 130 can be substantially coplanar with the upper surface of the smart card. The cover layer 130 can contact the finger and sense the fingerprint.

[0049] In one embodiment, the fingerprint recognition module 100 may further include a conductive trace 123. The conductive trace 123 may be disposed inside the first substrate 110 and on the second surface 110B of the first substrate 110 below the second sensing pattern layer 122. The conductive trace 123 may be composed of a plurality of wiring layers different from the sensing pattern 120 among a plurality of wiring layers disposed in the first substrate 110. The conductive trace 123 may form an internal circuit. The conductive trace 123 may be formed of a conductive material such as a metal, and may include the same or different material as the sensing pattern 120.

[0050] In one embodiment, the conductive trace 123 may include a plurality of wiring layers disposed at different heights and a plurality of vias electrically connecting the plurality of wiring layers to each other. In this case, the first surface 110A and the second surface 110B of the first substrate 110 and the elements disposed on each surface may be electrically connected to each other via the plurality of wiring layers and the plurality of vias. For example, the electrical signal captured by the sensing pattern 120 may be transmitted layer by layer downward to the controller chip 140 via the conductive trace 123.

[0051] The controller chip 140 is disposed on the second surface 110B of the first substrate 110 in the central region CR of the first substrate 110. The controller chip 140 may include a plurality of operation units to issue corresponding instructions to perform detection and processing on signals sent and received between various elements in the fingerprint recognition module 100 (e.g., electrical signals captured by the sensing pattern 120).

[0052] In one embodiment, the controller chip 140 may be electrically connected to the conductive trace 123 via the bottom bump BP in a flip chip manner. For example, the controller chip 140 may be electrically connected to the conductive trace 123 disposed on the second surface 110B of the first substrate 110. In this embodiment, the underfill UF may be disposed between the active surface of the controller chip 140 and the second surface 110B of the first substrate 110 and cover the bottom bump BP.

[0053] The lower bonding pad 150 is disposed on the second surface 110B of the first substrate 110 in the edge region ER of the first substrate 110. The lower bonding pad 150 may electrically connect the first substrate 110 to an external device. In one embodiment, the size of the lower bonding pad 150 may be between tens of microns by tens of microns and hundreds of microns by hundreds of microns.

[0054] In one embodiment, the lower bonding pad 150 may be connected to the conductive trace 123, or may be a portion of the conductive trace 123. For example, a solder resist may be provided on the second surface 110B of the first substrate 110 to cover the conductive trace 123. The lower bonding pad 150 may be a portion of the conductive trace 123 exposed to the solder resist.

[0055] In one embodiment, the fingerprint recognition module 100 may further include an upper bonding pad 180 . The upper bonding pad 180 may be disposed on the first surface 110A of the first substrate 110 in the edge region ER and electrically connected to the lower bonding pad 150 via the conductive trace 123 .

[0056] In another embodiment, upper bonding pad 180 may be connected to conductive trace 123, or may be a portion of conductive trace 123. For example, upper bonding pad 180 may be a portion of conductive trace 123 exposed to cover layer 130.

[0057] In one embodiment, the fingerprint recognition module 100 may further include a passive device 190. The passive device 190 may be disposed between the lower bonding pad 150 and the controller chip 140 on the second surface 110B of the first substrate 110 and electrically connected to the conductive trace 123. In this embodiment, the passive device 190 may be a capacitor or a resistor. The passive device 190 may have a height substantially the same as that of the controller chip 140, but the inventive concept is not limited thereto.

[0058] The second substrate 160 is disposed under the edge region ER of the first substrate 110 and has an opening 161 exposing the center region CR, and the controller chip 140 is accommodated in the opening 161 .

[0059] In one embodiment, the second substrate 160 may be a lead frame. The second substrate 160 may include a plurality of connection pads 162. The plurality of connection pads 162 may be electrically connected to the lower bonding pad 150 via connection bumps CB, respectively. For example, the connection pads 162 may be formed of a conductive material such as a metal. For example, the connection bumps CB may be pre-solder ball bumps, copper (Cu) columns, or gold (Au) bumps.

[0060] The encapsulation layer 170 at least partially encapsulates (eg, surrounds or covers) the first substrate 110 , the second substrate 160 , and the controller chip 140 .

[0061] In one embodiment, the encapsulation layer 170 may be formed of EMC. The encapsulation layer 170 may include the same or different material as the cover layer 130. In one embodiment, the length of the encapsulation layer 170 may be greater than the length of the first substrate 110. In this embodiment, the encapsulation layer 170 may cover the side surface of the first substrate 110 and the passive surface of the controller chip 140. For example, the upper surface of the encapsulation layer 170 may be substantially coplanar with the upper surface of the cover layer 130.

[0062] The encapsulation layer 170 exposes the cover layer 130 disposed on the first substrate 110 and the connection pad 162 disposed on the second substrate 160 .

[0063] In one embodiment, the cover layer 130 may not be provided, and the encapsulation layer 170 may extend and cover the first surface 110A of the first substrate 110 and expose the upper bonding pad 180 to replace the cover layer 130. In one embodiment, the encapsulation layer 170 may expose the lower surface of the connection pad 162. For example, the lower surface of the encapsulation layer 170 may be substantially coplanar with the lower surface of the connection pad 162.

[0064] In one embodiment, the encapsulation layer 170 may include an upper portion 170U and a lower portion 170L forming a stepped structure. The upper portion 170U may have a first length L1 and a first thickness T1. The lower portion 170L may have a second length L2 and a second thickness T2. The second length L2 may be less than the first length L1. The second thickness T2 may be less than the first thickness T1. In this embodiment, a portion of the controller chip 140 may be encapsulated in the lower portion 170L of the encapsulation layer 170.

[0065] In one embodiment, the connection pad 162 may include an upper portion 162U and a lower portion 162L forming a stepped structure. The upper portion 162U may be connected to the lower bonding pad 150 and have a first size, and the lower portion 162L may be exposed to the encapsulation layer 170 and have a second size greater than the first size. For example, the lower portion 162L of the connection pad 162 may have a size of several millimeters.

[0066] When the fingerprint recognition module 100 is mounted on a smart card, the connection pad 162 may electrically connect the fingerprint recognition module 100 to an external circuit in the smart card.

[0067] Figure 6 1 is a cross-sectional view of a fingerprint recognition module according to an exemplary embodiment of the inventive concept. In addition to the length of the encapsulation layer 170A, Figure 6 The fingerprint recognition module 200 shown is Figure 5 The structures of the fingerprint recognition modules 100 shown are basically the same.

[0068] See also Figure 6 , the length of the encapsulation layer 170A of the fingerprint recognition module 200 may be equal to the length of the first substrate 110. In this case, the encapsulation layer 170A may expose two opposite side surfaces of the first substrate 110.

[0069] Figure 7 is a cross-sectional view of a fingerprint recognition module according to an exemplary embodiment of the inventive concept. Except that the encapsulation layer 170B includes only an upper portion and does not include a lower portion, Figure 7 The fingerprint recognition module 300 shown is Figure 5 The structures of the fingerprint recognition modules 100 shown are basically the same.

[0070] See also Figure 7 , the encapsulation layer 170B of the fingerprint recognition module 300 may include only the upper portion. In this case, the controller chip 140 may be encapsulated in the upper portion of the encapsulation layer 170B. Figure 5 and Figure 6 Compared with the fingerprint recognition modules 100 and 200 shown in FIGS. 1 and 2 , the controller chip 140 of the fingerprint recognition module 300 may have a smaller thickness, and the encapsulation layer 170B may have a uniform thickness.

[0071] Fig. 8A , Fig.9A and Fig. 10A is a schematic cross-sectional view of an intermediate step of a module assembly process of a fingerprint recognition module according to an example embodiment of the inventive concept. Figure 8B , Fig. 9B and Fig. 10B is a schematic top view of an intermediate step of a module assembly process of a fingerprint recognition module according to an exemplary embodiment of the inventive concept. Figure 5 Take the fingerprint recognition module 100 shown in FIG. as an example, referring to FIG. 8A to FIG. 10B To describe the module assembly process.

[0072] Reference Fig. 8A In step S1, the controller chip 140 and the optional passive components 190 are mounted on the second surface 110B of the first substrate 110. Figure 8B, prepare a second substrate 160. The second substrate 160 may be a lead frame. The second substrate 160 may include a plurality of connection pads 162 to be electrically connected to the first substrate 110 and an opening 161 for accommodating the controller chip 140.

[0073] Reference Fig.9A In step S2, the first substrate 110 is turned over so that the second surface 110B faces downward and the first surface 110A faces upward. Fig. 9B , the first substrate 110 is mounted on the second substrate 160 so that the lower bonding pads 150 disposed on the second surface 110B of the first substrate 110 are aligned with the connection pads 162 disposed on the second substrate 160 .

[0074] At this time, the controller chip 140 may be inserted into the opening 161. Then, a soldering process is performed to electrically connect the lower bonding pad 150 to the connection pad 162 via the connection bump CB.

[0075] Reference Fig. 10A In step S3, an encapsulation layer 170 is formed to at least partially encapsulate the first substrate 110, the second substrate 160 and the controller chip 140. At this time, referring to Fig. 10B The encapsulation layer 170 may cover the rest of each connection pad 162 except the lower surface. When viewed from a top view, only the lead frame can be seen, and the connection pads cannot be seen.

[0076] Fig.11 is a schematic top view of a second substrate of a fingerprint recognition module according to an exemplary embodiment of the inventive concept. Fig.11 The plurality of second substrates 160 may be lead frames in the form of reels that match the current smart card production line. After completing step S3, the plurality of second substrates 160 may be lead frames that are connected to each other as shown in FIG. Fig. 10B Multiple structures shown in .

[0077] Next, in step 4 , the fingerprint recognition module 100 may be punched out from each lead frame to complete the module assembly process of the fingerprint recognition module 100 .

[0078] As a summary and review, the fingerprint recognition module of the exemplary embodiment of the inventive concept can reduce the gap between the finger and the sensor pattern that senses the fingerprint to improve the sensitivity of the sensor module. The fingerprint recognition module of the exemplary embodiment of the inventive concept can be produced using the current infrastructure for manufacturing smart cards to reduce the complexity and cost of the process. The fingerprint recognition module of the exemplary embodiment of the inventive concept can achieve a smaller size to improve the mechanical performance of the product.

[0079] While embodiments of the inventive concept have been shown and described herein, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the inventive concept as defined by the appended claims.

Claims

1. A fingerprint recognition module, comprising: a first substrate having a first surface and a second surface opposite to each other and including a central region and an edge region surrounding the central region; a sensing pattern disposed on the first surface of the first substrate in the central region; a covering layer, covering the sensing pattern on the first surface of the first substrate; a controller chip disposed on the second surface of the first substrate in the central region; a lower bonding pad disposed on the second surface of the first substrate in the edge region; a second substrate disposed below the edge region and having an opening exposing the central region, wherein the controller chip is accommodated in the opening; an encapsulation layer, at least partially encapsulating the first substrate, the second substrate and the controller chip, The second substrate includes a connection pad electrically connected to the lower bonding pad, and the encapsulation layer exposes the cover layer of the first substrate and the connection pad of the second substrate.

2. The fingerprint recognition module according to claim 1, wherein: The thickness of the cover layer is minimized to just cover the sensing pattern.

3. The fingerprint recognition module according to claim 2, wherein: When the fingerprint recognition module is mounted on a smart card, the upper surface of the cover layer is coplanar with the upper surface of the smart card and contacts the finger.

4. The fingerprint recognition module according to claim 1, wherein: The sensing pattern includes a first sensing pattern layer and a second sensing pattern layer. The first sensing pattern layer is on the first surface of the first substrate, and the second sensing pattern layer is inside the first substrate and close to the first surface of the first substrate. A sensing capacitor is formed between the first sensing pattern layer and the second sensing pattern layer.

5. The fingerprint recognition module according to claim 4, wherein: The first sensing pattern layer includes a plurality of conductive layers that are separated from each other and arranged in a matrix form.

6. The fingerprint recognition module according to claim 4, further comprising: The conductive trace is arranged inside the first substrate and on the second surface of the first substrate below the second sensing pattern layer.

7. The fingerprint recognition module according to claim 6, wherein: The conductive trace includes a plurality of wiring layers and a plurality of vias electrically connecting the plurality of wiring layers to each other.

8. The fingerprint recognition module according to claim 6, further comprising: An upper bonding pad is disposed on the first surface of the first substrate in the edge region and is electrically connected to the lower bonding pad via a conductive trace.

9. The fingerprint recognition module according to claim 1, wherein: The connection pads of the second substrate are electrically connected to the lower bonding pads via the connection bumps.

10. The fingerprint recognition module according to claim 6, wherein: The controller chip is electrically connected to the conductive traces via the bottom bumps, The bottom filler is disposed between the active surface of the controller chip and the second surface of the first substrate and covers the bottom bumps.

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