Apparatus for connecting a device to a substrate

Abstract

The invention relates to a device for connecting a component (5) to a substrate, the device having a chamber which can be divided into at least two parts. A stamp (11, 111) is provided at a first part (1) and a counter-stamp (31) is provided at a second part (3). In an open state of the chamber, the counter-stamp (31) can be loaded with a starting material. The first part has (1) a wall with an edge which can form an abutment with an opposite edge of the wall of the second part (3) in order to close the chamber. In a closed state of the chamber, a pressure can be exerted via the stamp (11, 111) on the starting material arranged between the stamp (11) and the counter-stamp (31). In an unloaded state, the counter-stamp (31) is spaced apart from a heating device (33). Due to the pressure exerted by the stamp (11, 111), the counter-stamp abuts against the heating device (33).

Description

TECHNICAL FIELD

[0001] The present invention relates to an apparatus for connecting a device with a substrate. BACKGROUND

[0002] With the increasing demand in the electronics industry for the development of efficient and high-temperature-resistant devices, such as chips, the sintering of a connection layer between the device and the substrate is becoming increasingly popular.

[0003] Sintering is known, inter alia, as a method for producing metallic or ceramic components. Here, a green body of fine or coarse particles is formed by compacting a powdered starting material, which acquires its final shape in a subsequent temperature treatment, thus becoming a solid workpiece.

[0004] Here, sintering in accordance with the present application and in the manufacture and processing of devices, such as semiconductor chips, is understood to be a similar method, i.e. the device and the substrate are pressed together using a predetermined pressure and a predetermined temperature for a certain time, thereby forming a connection between the two elements. The current state of the art is the use of paste-like materials, such as silver or copper paste or nanostructured platelets, which are used as a connection between the chip and the substrate, and are sintered by loading pressure and temperature. This sintering as a method for connecting a device with a substrate is known and has proven to be more advantageous than the hitherto used soldering methods based on tin or lead.

[0005] For such a sintering process, specific parameters are defined, such as the set temperature, the pressure and the holding time for the effective fixing of the device on the substrate. From the tests, the parameters can be determined as required. In such a sintering process, it is also advantageous to use an adhesive, which is applied between the device and the substrate. Correspondingly, the layer thickness of the adhesive can constitute a further parameter. As such an adhesive, silver paste can preferably be used.

[0006] Preferably, during the sintering process, no phase change of the adhesive, such as silver paste, occurs, as is the case in soldering methods based on tin and lead. By appropriate use of temperature and pressure, it is caused that the particles of the adhesive diffuse into the surface of the substrate and the device to be fixed. A surface-to-surface connection is thus formed instead of a phase-change connection.

[0007] For the effective fixing, a parallel, uniform force distribution on the surface of the device is required, and this must be ensured. Therefore, a separate force application component is the preferred solution for modern electronics manufacturers, which can ensure a good connection quality. Separate force application means that a separate tool is used for each pair of device and substrate. This leads to high tool costs.

[0008] The use of temperature and pressure is required in order to achieve an effective connection between the device and the substrate, otherwise the connection quality can be poor or too slow for the actual purpose.

[0009] The principle of the method does not lie in a phase change of a connecting agent, such as a silver paste, as is the case in soldering methods based on tin and lead. By means of an appropriate temperature and pressure application, the silver components diffuse into the surfaces of the substrates and the devices to be fixed. Thereby, the contact becomes a surface-to-surface connection, rather than a phase-change contact.

[0010] The expression "die attach" or "die package" is also generally applicable to this type of process.

[0011] The document DE 10 2013 101 124 shows an apparatus and a method for sintering a product. The sintered product comprises a device and a substrate. In order to connect it, the sintered product is inserted into an apparatus having a press station and a press die. By increasing the temperature by means of a heating device, an expansion of a pressure body in the press die is induced, whereby a pressure is exerted onto the sintered product. The device is thus connected with the substrate.

[0012] The document DE 10 2015 120 156 Al discloses an apparatus for material-fit connection of connection partners of power electronics components. Here, a shape-stable frame acts on one of the connection partners, while an elastic pad acts on the second connection partner, in order to build up the pressure required for the connection.

[0013] In order to protect the components to be sintered as well as possible, it is desirable to adjust the heat delivery to the components as precisely as possible during the sintering method.

[0014] There is a need for an apparatus for connecting a device with a substrate, which apparatus enables a precise control of the heat delivery to the components to be sintered. SUMMARY

[0015] The apparatus for connecting a device with a substrate according to the invention is provided with a chamber which can be divided into at least two parts. At the first part, a stamp is provided. At the second part, a counter-stamp is provided. At the side of the counter-stamp facing away from the first part, a heating device is provided. The first part can be displaced in the direction of the second part in order to close the chamber. In the state in which the chamber is open, the counter-stamp can be loaded with an initial material, and in the state in which the chamber is closed, a pressure can be exerted via the stamp on the initial material arranged between the stamp and the counter-stamp. In the unloaded state, the counter-stamp is spaced apart from the heating device and is configured to come into abutment with the heating device as a result of the pressure exerted by the stamp.

[0016] Since the counter-impression is spaced apart from the heating device as a product support, no direct heat transfer occurs. Thus, the initial material on the counter-impression is not exposed to any excessive heat load before the sintering process begins. Only by means of the pressure applied through the impression is the spacing between the counter-impression and the heating device overcome, and then heat is transferred directly to the counter-impression, the initial material and the impression.

[0017] The heating device can be configured in the form of a heating plate, the surface of which directed towards the counter-impression is configured for lying in a planar abutment with the surface of the counter-impression facing away from the first component.

[0018] By means of the planar contact of the surfaces of the heating device and the counter-impression lying in abutment with one another, rapid and uniform heat transfer is possible.

[0019] The counter-impression can be spaced apart from the heating device by means of a pre-tensioning element, the pre-tensioning of which is overcome by the pressure applied through the impression. The pre-tensioning is re-established by the impression after the pressure is applied.

[0020] Thus, even after the sintering process is completed, direct heat transfer is inhibited as soon as the impression is retracted into the starting position.

[0021] The counter-impression can be spaced apart from the heating device in an unloaded state by means of a spring.

[0022] Here, preferably a coil spring or a leaf spring can be used.

[0023] The counter-impression can be spaced apart from the heating device in an unloaded state by means of an air cushion. Air can be delivered to the air cushion via an air channel at least partially guided through the heating device.

[0024] Instead of or in addition to a spring, an air cushion can be used as a pre-tensioning element. Furthermore, the effect of the invention can be improved by delivering air. Thus, after the sintering process, faster cooling can be achieved by delivering cold air. Likewise, if necessary, the counter-impression can also be preheated before the sintering process by means of hot air.

[0025] The apparatus for connecting a device to a substrate according to the invention is provided with a chamber which can be divided into at least two parts. A stamp is provided at the first part. A counter-stamp is provided at the second part. A heating device is provided at the side of the counter-stamp facing away from the first part. The first part can be displaced in the direction of the second part in order to close the chamber. In the open state of the chamber, the counter-stamp can be loaded with initial material, and in the closed state of the chamber, pressure can be applied to the initial material arranged between the stamp and the counter-stamp via the stamp. The shaft of the stamp is accommodated in a stamp guide plate provided at the first part by means of an interference clearance fit, and the pressure body of the stamp has a larger cross-sectional area than the shaft of the stamp. A negative pressure device is provided at the side of the stamp guide plate facing away from the counter-stamp.

[0026] By means of the negative pressure device it is possible to suck the stamp back into the starting position after the sintering process by establishing a negative pressure. Since the pressure body of the stamp has a larger cross-sectional area than the shaft, the pressure body is prevented from being pulled into the stamp guide plate here.

[0027] At the side of the stamp guide plate facing away from the counter-stamp, a cylinder plate can be provided which has a piston which can be moved back and forth in a cylinder bore. The piston has a guide rod at the side pointing towards the stamp, which guide rod is configured to come into abutment with the end face of the shaft when the piston is loaded with pressure and to apply pressure to the stamp.

[0028] Since the guide rod comes into abutment with the end face of the shaft of the stamp only by means of the operating piston, a spacing is established between the guide rod and the shaft in the starting position or retracted position of the piston and the stamp. As a result, heat is transferred from the stamp to the guide rod and the piston.

[0029] The end face of the shaft of the stamp can be flat, and the tip of the guide rod which can come into abutment with the end face of the shaft can be rounded.

[0030] The design achieves that the stamp is tilted in the event that the initial material is not planarly aligned, thereby improving the quality of the sintered product.

[0031] The negative pressure device can be an intermediate control chamber which is formed between the stamp guide plate and the cylinder plate provided at the side of the stamp guide plate facing away from the counter-stamp. The intermediate control chamber can be loaded with negative pressure or positive pressure.

[0032] The design of the intermediate control chamber which can be loaded with positive pressure or negative pressure has the advantage that in the event that the piston or the stamp is jammed, the movability can be restored by introducing positive pressure. By establishing negative pressure, the stamp is brought back into its starting position or retracted position.

[0033] Since the piston is also brought into its retracted position by means of negative pressure from another negative pressure source, there is no risk that the piston is moved out again as a result of overpressure.

[0034] In the following, further advantageous features and effects of the present application are described.

[0035] The present application creates an adaptable tool for the development of surface mounting technology by the merging of surfaces composed of different materials by pressure and specific temperature, which act on the upper surface of the device, which pressure and temperature are generated by a form-fit sealing / locking mechanism of the tool.

[0036] A counterforce does not need to be provided by an external system.

[0037] The tool can be constructed as a sealed pressure chamber (negative or positive pressure). The connection process can be carried out in a high-pressure gas atmosphere or a vacuum atmosphere. The chamber is closed by the shape of the chamber itself. One component of the chamber, preferably the lower component of the chamber, can be brought into position by a drive mechanism such as a motor or, for example, by a hydraulic or pneumatic mechanism.

[0038] The resulting pressure exerted by the tool is compensated by form-fit mechanical internal elements and / or geometry, so that the force counteraction takes a shorter path.

[0039] The substrate can be composed of directly bonded copper or similar ceramic substrates.

[0040] For example, the pressure can be predefined to 40 MPa. The connection process can be carried out for a defined time of, for example, 70-120 seconds at a temperature setting of, for example, between 20°C and 330°C.

[0041] The temperature can be maintained by heating devices in the chamber and can preferably be provided directly at the stamp. Additionally, it can be advantageous to use multiple heating devices in the system.

[0042] Thermal insulation of sensitive components can be carried out in the chamber using insulation layers and / or insulation materials.

[0043] During the connection process, the semiconductor stamp can additionally be protected using a protective film composed of, for example, PTFE material, which is preferably arranged by means of a roller mechanism.

[0044] The chamber can consist of multiple components and is provided for multiple devices (chips) in the form of multiple planes. Simultaneous processing can also be carried out on one plane or on different planes arranged above one another.

[0045] The dimensions of the stamp, in particular the dimensions of its face directed towards the mating face, can correspond exactly to the dimensions of the device (chip). BRIEF DESCRIPTION OF DRAWINGS

[0046] Further advantages of the application will also become apparent from the following description according to the drawings, which show the presently preferred embodiments.

[0047] Figure 1 The device for connecting a component with a substrate according to the application is shown in an open state.

[0048] Figure 2a A side view of the form-fit mechanism of the device is shown, and Figure 2b A cross-sectional view of Figure 2a is shown.

[0049] Figure 3a A cross-sectional view of the form-fit mechanism in a closed state of the device under load is shown, and Figure 3b A cross-sectional view of the device in a closed state without load according to Figure 3a is shown.

[0050] Figure 4a A modification according to Figure 3a is shown, which is provided with a seal, and Figure 4b A modification according to Figure 4b is shown.

[0051] Figure 5 An alternative of the form-fit mechanism is shown.

[0052] Figure 6 Details of the stamp for connecting a component with a substrate are shown.

[0053] Figure 7a A view of the stamp is shown from below, and Figure 7b A side view of the stamp is shown, the axis of which is guided in a stamp guide plate, and Figure 7c A view of the stamp axis guided in the stamp guide plate is shown from above.

[0054] Figure 8 A detailed view of the lower part of the device with means for thermal isolation is shown.

[0055] Figure 9 An alternative of the means for thermal isolation is shown.

[0056] Figure 10 A perspective view of the cylinder plate produced additively is shown.

[0057] Figure 11 A front view of the cylinder plate of Figure 10 is shown.

[0058] Figure 12 A cross-sectional view of the cylinder plate of Figure 10 is shown along the line A-A in Figure 11 .

[0059] Figure 13 perspective view of a cylinder plate of an additively manufactured retrofit.

[0060] Figure 14 perspective view of a cylinder plate of an additively manufactured retrofit.

[0061] Figure 15 perspective view of a multi-piece cylinder plate and a print plate according to an embodiment of the present application.

[0062] Figure 16 front view of a cylinder plate with a print plate according to Figure 15

[0063] Figure 17 top view of a cylinder plate of Figure 15

[0064] Figure 18 top view of a print plate corresponding to line A-A of Figure 16

[0065] Figure 19 perspective arrangement view of a split cylinder plate, a print plate and a counter-print according to an embodiment of the present application.

[0066] Figure 20 view of the arrangement of Figure 19 from the front.

[0067] Figure 21 view of a cylinder plate of Figure 20 from the print plate corresponding to line D-D in Figure 19

[0068] Figure 22 cross-sectional view of the arrangement of Figure 19

[0069] Figure 23 perspective view of an alternative embodiment of an arrangement of a split cylinder plate and a print plate arranged thereunder.

[0070] Figure 24 view of the arrangement of Figure 23 from the front.

[0071] Figure 25 top view of a cylinder plate of the arrangement of Figure 23

[0072] Figure 26 top view of a print plate of the arrangement of Figure 24 corresponding to line A-A in Figure 23

[0073] Figure 27 ​​​​​​​Fig. 6 shows a top view of an alternative embodiment of a cylinder plate.

[0074] Figure 28 Fig. 7 shows a top view of an alternative embodiment of a print plate.

[0075] Figure 29 Fig. 8 shows a top view of a counterpart print according to the application. DETAILED DESCRIPTION

[0076] According to Figures 1 to 29 Embodiments of the application are described. The figures are schematic and details described can be omitted.

[0077] With reference to Figure 1 , the device according to the application is constituted in the form of a chamber having an upper part 1 (first part) and a lower part 3 (second part). The chamber essentially has the shape of a hollow cube with four side walls, a bottom and a top wall. By isolating the lower part 3 from the upper part 1, the chamber can be opened into two parts, the openings of which point towards each other.

[0078] A press plate 31, also called product holder, is provided in the lower part 3, which press plate assumes the function of a counterpart print. The press plate 31 serves to arrange initial materials such as substrates, sinter paste and devices before the sintering process. Arranged below the press plate 31 is a heating plate (heating means) 33. The heating plate 33 serves to radiate heat to the press plate 31 and to heat the same during the sintering process.

[0079] According to Figure 1 , 6 and 7 the upper part is described in more detail. The cylinder plate 19 is provided at the upper part 1 of the chamber at the uppermost position, i.e. the position furthest away from the opening of the upper part 1. The cylinder plate 19 is additively manufactured and has cylinder bores 118, 118a, 118b, 118c in which pistons 117 are accommodated. The cylinder bores 118, 118a, 118b, 118c at the side of the cylinder plate 19 facing away from the respective piston 117 are connected to pressure delivery lines 115, 115', 115a, 115b, 115c. The piston-cylinder arrangement serves as a pneumatic regulating device. Examples of different arrangements of one or more pressure delivery lines are visible from Figures 13 to 18 and Figures 21 to 23 and described above in connection with the cylinder plate 19 according to the application.

[0080] In order to actuate the pistons 117, fluid, for example air, is introduced into the cylinder bore 118, 118a, 118b, 118c in the cylinder plate 19 via the pressure delivery lines 115, 115', 115a, 115b, 115c, by which the pistons 117 are actuated. By actuation, the pistons 117 move together with the guide rods 113 arranged at the side of the pistons 117 pointing towards the lower part 3 of the chamber in the direction of the lower part 3 of the chamber. Said direction is also referred to in the following as "downward direction" or simply "downward" and corresponds in the figures to the direction from the vane upper side to the vane lower side.

[0081] While it is preferred to actuate all pistons simultaneously by loading the fluid in the pressure delivery lines with a preset pressure, it is alternatively possible to provide a mechanism for individually manipulating the pistons 117. The pistons 117 are returned by applying a negative pressure in the pressure delivery lines 115, 115', 115a, 115b, 115c, by which the pistons 117 and the guide rods 113 return into their starting position.

[0082] Each piston 117 is able to form an abutment via the guide rod 113 with the shaft 111 of the stamp. This takes place in such a way that the rounded end of the guide rod 113, which faces away from the piston 117, is guided by actuating the piston 117 downward towards the flat-constituted end face of the shaft 111, which points towards the piston 117.

[0083] Here, as can be seen in particular from Figure 6 , the guide rods 113 are guided through holes in the upper plate 16 arranged above the stamp guide plate 15. The upper plate 16 also abuts against the inner wall of the upper part 1, so that the space present between the upper plate 16 and the cylinder plate 19 can be loaded with a positive or negative pressure, independently of the pressure in the pressure delivery lines 115, 115', 115a, 115b, 115c. For this purpose, a seal 8 is preferably provided between the inner wall of the upper part 1 and the upper plate 16. The space between the upper plate 16 and the cylinder plate 19 is referred to as intermediate control space 119.

[0084] The shaft 111 of the stamp is cylindrically constituted and is guided through a hole in the stamp guide plate 15. Here, the diameter of the hole is dimensioned so that it slightly exceeds the diameter of the shaft 111 of the stamp, i.e. there is here an interference clearance fit. The clearance dimension is between 8 and 12 pm. Here, a clearance dimension of 10 pm is preferred.

[0085] At the side of the shaft 111 facing away from the piston, there is the pressure body 11 of the stamp, which points towards the pressure plate 31. In Figure 1 seven stamps are shown, but the number of stamps is not limited in any way, but can be chosen arbitrarily. In particular, it is also possible to provide only a single stamp, but a larger number of stamps is preferred.

[0086] Each stamp is made in one piece and consists of a shaft 111 and a pressure body 11. The cylindrical shaft 111 is guided through the stamp guide plate 15 and can be tilted slightly due to an interference clearance fit. Here, the maximum possible degree of tilt can be adjusted by the precise clearance size between the shaft 111 and the hole through the stamp guide plate 15.

[0087] The tilting is achieved by the guide rod 113 having rounded ends which can roll on the flat end face of the shaft 111 pointing towards the piston 117. In this way, the shaft 111 and thus the stamp 11 can be tilted in such a way that the tilted position of the device to be sintered can be compensated. This means that the stamp can adapt to the tilt of the device by tilting when approaching a device which is not precisely aligned in a plane.

[0088] The pressure body 11 of the stamp is cuboid in shape. Its face at the underside facing away from the piston is called the pressure face. The size of the pressure face is slightly larger than the product to be sintered so that it reliably completely covers the component to be sintered even in the case of small positional deviations of the stamp and thus of the pressure body 11, i.e. for example slight twisting.

[0089] The pressure body 11 of the stamp is accommodated in a recess 141 which is provided at the underside of a stamp lower plate 14 which is arranged below the stamp guide plate 15. The thickness of the stamp lower plate 14 and thus of the recess 141 is dimensioned such that the pressure body 11 of the stamp cannot completely move out of the recess during the loading of the pressure by the piston 117. The total height of the starting material and thus the required travel path of the stamp is therefore moved in the micrometer range, whereas the height of the pressure body and the recess is a few millimeters.

[0090] Here, the spacing between the side of the pressure body 11 and the inner wall of the recess 141 is dimensioned to be greater than the spacing between the shaft 111 and the inner wall of the hole. For this reason, it is excluded that the pressure body 11 gets stuck in the recess 141 as a result of the possible tilting of the stamp described above.

[0091] Since the stamp only comes into contact with the guide rod 113 or the piston 117 but is not firmly connected thereto, the stamp remains in the extended position after the pressure has been applied, even though the piston 117 and the guide rod 113 are drawn back into their starting position by loading the pressure delivery line with negative pressure. In Figure 6 the state is shown schematically.

[0092] In order to detach the stamp from the sintered product and to draw it back into its starting position, the intermediate control chamber 119 is loaded with negative pressure and the stamp is sucked back into its starting position as a result of the now existing pressure difference between the area of the pressure body 11 and the intermediate control chamber. Here, however, a small air flow is formed between the shaft 111 and the inner wall of the hole and between the wall of the pressure body 11 and the inner wall of the recess 141.

[0093] However, the small air flow is so small that it is negligible and ends as soon as the upper face of the pressure body 11 around the shaft 111 comes into contact with the die guide plate 15. Since the die pressure body 11 with its upper face rests against the underside of the die guide plate 15, it is prevented that the end face of the shaft 111 abuts against the guide rod 113 of the retracted piston 117. This has the advantage that a thermal decoupling between the hot die and the piston after the sintering process is created.

[0094] Here, the air sucked out of the intermediate space 151 between the end side of the shaft 111 and the upper plate 16 also provides a contribution to the die reset, as can be seen from Figure 6 It can be seen that, on the one hand, the air present in the intermediate space 151 has been enhanced by the reset of the guide rod 113 due to the establishment of the negative pressure in the intermediate control chamber 119.

[0095] As a result of this design it is possible to exchange defective dies at any time without great expense or to perform a complete exchange of all dies depending on the components to be sintered. For this it is only necessary to take the dies down and replace them with other dies.

[0096] If the piston 117 gets stuck despite the thermal decoupling and the sticking cannot be retracted only due to the negative pressure in the pressure lines 115, 115', 115a, 115b, 115c, it is possible to apply pressure onto the underside of the piston by increasing the pressure in the intermediate control chamber 119, thereby releasing the sticking and enabling the piston 117 to be moved back into the starting position.

[0097] It is also to be mentioned here that due to the different cross sections of the piston 117 and the die with the pressure face of the pressure body 11, a minimum ratio of the input pressure applied by the piston 117 onto the guide rod 113 and the shaft 111 to the output pressure of the die face has to be observed. The input pressure is applied onto the circular cross section of the piston 117.

[0098] In a possible design of the die with a square-shaped pressure face, the side length of the square is "a". In both cases, the piston 117 has a circular cross section with a radius of "a". In this case, where the cross section of the die face is square, the ratio of the input area to the output area is minimal. This means that the pressure applied to the device becomes maximal, as can be derived from the following equation:

[0099] P = F / A.

[0100] In the equation, "P" stands for pressure, "F" for force and "A" for cross-sectional area.

[0101] In the case of a square with side length "a", the ratio of the pressure area to the piston area is approximately 1.273. This corresponds to the ratio of the area of a square with side length "a" to the area of a circle inscribed in the cube with diameter "a".

[0102] There is therefore a need to load the piston 117 with a higher pressure than the pressure applied to the initial material. In the example described above, the input pressure must be approximately 51 MPa in order for the desired output pressure of 40 MPa to prevail.

[0103] In the case where the pressure surface is not a square, but for example a rectangle, the ratio can be similarly determined. The input pressure required for different die surfaces can for example be provided in tabular form or for different output pressures in the form of a family of characteristic curves.

[0104] The details of the lower part 3 are described in more detail, inter alia, in accordance with Figure 1 , Figure 8 and Figure 9 .

[0105] A heat insulation in the form of a cooling plate 37, an insulation plate 35, a heating plate 33 and a product holder 31 are arranged on the lower part 3 of the chamber in the order from bottom to top. The product holder 31 serves as a counter-die and is used to carry a substrate, on which devices can be sintered.

[0106] In order to improve the quality of the sintered product, it is desirable to perform the heat transfer to the initial material as simultaneously as possible with the pressure application by the die. For this purpose, a thermal insulation is provided between the heating plate 33 and the product holder 31 arranged thereabove, as can be seen schematically in Figure 8 .

[0107] In order to cause the thermal insulation, a pre-tensioning element 32 is provided between the underside of the product holder 31 and the bottom wall of the lower part 3, which pre-tensions the product holder 31 upwards, spaced apart from the heating plate 33. The pre-tensioning element 32 can be constituted in the form of a spring, for example a coil spring, as is shown schematically in Figure 8 , but is not limited thereto.

[0108] Instead of the coil spring shown schematically, for example, other types of springs, for example leaf springs, hydraulic or pneumatic pistons or mechanical mechanisms, for example a rack, can also be used as pre-tensioning elements.

[0109] Due to the pre-tensioning element 32, the product carrier 31 is in a position spaced apart from the heating plate 33 in which a heat transfer takes place at most in a reduced manner, since there is an air gap between the product carrier 31 and the heating plate 33 as an insulator. As soon as the die is actuated and begins to exert pressure on the initial material and the product carrier carrying the initial material, the pre-tensioning force of the pre-tensioning element 32 is overcome and the product carrier 31 is brought into abutment with the heating plate 33. In this state, a direct heat transfer from the heating plate 33 to the product carrier 31 and further to the initial material takes place.

[0110] Thus, the initial material is simultaneously exposed to pressure and heat until the pressure load by the die is ended by resetting the piston 117. At the same time as the pressure load ends, the product carrier 31 is removed from the heating plate 33 again by the pre-tensioning force of the pre-tensioning element 32, so that further heating of the product carrier 31 and the initial material is prevented by the heating plate 33, which is still always hot.

[0111] It is noted that: Figure 8 the view only shows the components important for thermal isolation, but the overall structure can be constituted as shown in Figure 1 For example, there can be thermal insulation, cooling means, etc. between the heating plate 33 and the bottom wall of the lower part 3.

[0112] Figure 9 An alternative for thermal isolation of the product carrier and the heating plate is shown schematically. According to the alternative, the heating plate is provided with a plurality of through-going holes (air passages) pointing from the lower side of the heating plate to the upper side of the heating plate, which are connected with an air transport channel 36 leading through the bottom wall of the lower part 3 and a thermal insulation 35 of the heating plate 33. In order to thermally isolate the product carrier 31 from the heating plate 33, air or other suitable fluid is transported through the air transport channel 36 until the pressure is applied to the die by the piston 117 is activated. After the air has passed through the plurality of air passages in the heating plate 33, the air forms an air cushion between the heating plate 33 and the product carrier, which ensures in addition to thermal isolation an additional insulation against radiant heat.

[0113] By interrupting the air transport at the point in time of the pressure actuation of the piston 117, the air cushion between the heating plate 33 and the product carrier 31 is eliminated. The product carrier 31 is brought into abutment with the heating plate and is thus immediately heated. The heat is simultaneously transferred to the initial material, which is then under pressure generated by the die.

[0114] In order to perform the sintering process, the apparatus is closed by bringing the upper part 1 and the lower part 3 together. The process is described in particular according to Figures 1 to 5 .

[0115] The side wall of the upper part 1 has a recess 131 at its edge pointing towards the lower part 3. In close proximity to the recess 131 there are corresponding protrusions 137a and 137b. The side wall of the lower part 3 has corresponding protrusions 39 which, when the edge of the upper part 1 is in abutment with the edge of the lower part 3, introduce the recess 131 between the protrusions 137a and 137b. Additionally, a seal is arranged outside the protrusions 39 of the lower part 3 which, with closure of the chamber, seals the interior of the chamber in a fluid-tight manner with respect to the outside.

[0116] In each of the protrusions 137a, 137b, 39 there are holes 133a, 133b and 391 which are arranged transversely to the opening or closing direction of the chamber, the cross-sections of which overlap one another in the abutment state, i.e. when the chamber is closed. The holes 133a, 133b and 391 are in the form of oblong holes. This means that the length li of the holes 133a, 133b of the upper part and the length l2 of the holes 391 in the lower part 3 exceed the width b of the holes 133a, 133b and 391. The hole 133b which is located inside is a blind hole.

[0117] In the drawing, the proportions of the holes are shown exaggerated. In fact, it is sufficient that the lengths li and l2 exceed the width b of the holes 133a, 133b and 391 by approximately 0.5 mm.

[0118] The diameter of the holes can be 5 to 40 mm, for example, depending on the number of holes. The same diameter range applies to the pin or pins. Here, a tolerance of up to 2 mm of H7 is feasible. If the hole chosen is larger than the pin, automatic centring is advantageously achieved via the upper pressure point, i.e. the point at which the pin comes into contact with the hole wall, whereby a high-precision fit is completely unnecessary.

[0119] Due to the proportions of the holes 133a, 133b and 391, the cylindrical pin 135 in the abutment state can be easily guided through all the holes due to the play created by the oblong hole shape. Once the piston 117 has exerted a pressure load onto the stamp and via the latter onto the lower part 3 of the chamber, the situation as shown in Figure 3a arises.

[0120] Due to the pressure load, a force F acts downwards, whereby the lower part 3 of the chamber is displaced downwards from the abutment state until it is no longer possible to displace it further due to the now obstructing pin 135. It is thus feasible by means of the form fit to absorb the force acting on the lower part without having to provide a costly hydraulic station or the like.

[0121] As can be seen from Figure 2a , a plurality of series of holes 133a, 133b and 391 are provided, onto which the resulting force F is distributed. It is thus possible to reduce the requirements in terms of material properties of the pin.

[0122] After locking the chamber, the stamp is actuated, the pressure of which acts on the initial material. Thus, on the initial material, for example a substrate, a layer of silver paste as a connecting agent and a chip as a device, which are placed on the product holder 31, a predetermined pressure is generated, which acts on the initial material. According to the application, a pressure of 40 to 50 MPa can be achieved.

[0123] In the chamber, temperatures between 20°C and 330°C can be achieved in the region between the product holder 31 and the stamp lower plate 14. By this, the connection process can be completed in 70 to 120 seconds. It is advantageous here that the heating plate is arranged such that the heat is emitted directly to the product holder 31.

[0124] The required pressure is established by applying a gas under high pressure to the pistons 117 in the cylinders of the cylinder plate 19.

[0125] If required, a positive or negative pressure can also be established in the chamber by introducing or removing a gas therefrom, and / or a gas such as nitrogen can be conveyed to promote the connection process, or a reaction gas can be conveyed.

[0126] In the case of a duration of the stated state for a predetermined time, a sintering process takes place, i.e. the connection of the silver molecules to the device and the substrate.

[0127] Once the pressure load on the stamp has ended, the lower part 3 can be brought into abutment with the upper part 1 again, as can be seen in Figure 3b In this state, the pins 135 can simply be removed from the holes 133a, 133b and 391 again, and the chamber can be opened in order to remove the device, which has completed sintering.

[0128] In Figure 4a and 4b a variant is shown, in which additionally a seal 311 is arranged inside and outside the protrusion 39. The seal 311 can seal the interior of the chamber liquid-tight not only in the abutment state (see Figure 4b ) but also in the pressure load state (see Figure 4a ).

[0129] Due to the form fit, all the pressure that is formed during the sintering process is absorbed by the chamber itself. Thus, no further structural measures are required to absorb or dissipate the high pressure.

[0130] From Figure 5An alternative for designing a form fit is schematically visible in the middle. Here, instead of the above described design, each side wall of the upper part 1 and the lower part 3 is provided with a flange-like protrusion 431, 433. The protrusions 431, 433 have a bevel at their faces pointing away from each other. To establish the form fit, a C-shaped clamp 435 is guided via the protrusions. The clamp 435 has a corresponding bevel at its leg inner faces pointing at the bevels of the protrusions, so that a planar contact between the leg inner faces of the clamp 435 and the bevels of the protrusions 431, 433 is possible. In case of the alternative described here, the pressure is absorbed by the C-shaped clamp 435, which can easily be removed again after the end of the sintering process due to the bevels.

[0131] Instead of the above described cylindrical pins, the form fit can also be realized by means of conical pins and corresponding conical drillings, for example.

[0132] The above described process can advantageously be carried out automatically.

[0133] According to the prior art, the counter force required due to the pressing process has to be applied by means of external structures. There, the mechanism to move the carrier assembly upwards to hold the substrate ensures an external force which is required to lock the substrate in place and to generate the counter force required for the process. However, this leads to a heavy and very complex machine structure.

[0134] Due to the form fit according to the invention, the invention creates an internal counter force mechanism. Therefore, no external force source is required to provide the counter force.

[0135] To prepare the connection process, the paste is printed onto the substrate and the device (chip) is arranged on the paste, i.e. the substrate is equipped with the chip on the paste. The printed and assembled chip substrate is then introduced into the chamber.

[0136] Since the tool is adaptable, the position of the stamp corresponds to the corresponding position of the chip on the substrate. The film can advantageously be placed over the chip, for example via a roller attached at the side of the tool. The film can be renewed after each connection process. This can be performed by renewing the roller with a film or by changing the position of the existing film. The latter can be performed by continuing to pull the film wound on the roller and here changing the position of the film. PTFE or similar plastic can be used as film material, for example, but is not limited thereto.

[0137] The connection process is run at a predetermined temperature and a predetermined pressure for a predetermined period of time to effectively sinter the device onto the substrate. Before and after the connection process, the device and / or other initial materials (e.g. the substrate and the silver paste) can advantageously be preheated or cooled by a preheating or cooling device.

[0138] In the following, the connection process according to the invention is described in more detail. Figures 10 to 29The arrangement of the cylinder plate 19 according to the application and of the cylinder plate 19, the stamping plate 15 and the counter-stamping 31 of the device according to the application for connecting a device to a substrate is described in more detail.

[0139] It should also be noted that not every element is provided with a reference numeral in the figures for greater clarity. For example, in Figure 10 only one cylinder bore is provided with the reference numeral 118. However, the remaining cylinder bores are similar to the cylinder bore provided with the reference numeral, apart from their position.

[0140] Figures 10 to 14 The cylinder plate 19 in Figure 10 is manufactured by additive manufacturing. For this purpose, a liquid material is applied layer by layer to a working surface. After the application, the liquid material solidifies, so that a further layer can be applied to the existing solidified material layer. The application takes place in such a way that regions in the finished cylinder plate which are not provided with material are omitted. Here, in particular the cylinder bores 118 and the pressure delivery lines 115. As can be seen, for example, from Figure 11 the pressure delivery lines 115 lead from the interfaces 116 at one side of the cylinder plate 19 to the cylinder bores 118. Figure 10 A front view of the cylinder plate of Figure 12 is shown, and Figure 10 a sectional view of the cylinder plate of Figure 11 is shown along the line A-A in

[0141] Further design options for the additively manufactured cylinder plate can be seen from Figure 13 and Figure 14

[0142] In Figure 13 the pressure delivery lines 115' are formed in a curved form instead of the straight-line design of Figures 10 to 12 . Thereby, the volume occupied in the cylinder plate 19 by the pressure delivery lines 115' is reduced, thereby further improving the strength of the cylinder plate 19.

[0143] In Figure 14 the cylinder bores are divided into three groups of cylinder bores 118a, 118b and 118c. Each of these individual groups is supplied with pressure medium from an interface 116a, 116b, 116c by its own pressure delivery line 115a, 115b or 115c. The pressure delivery lines 115a, 115b and 115c are all in the same plane. Only at the intersection and at the intersection point of two lines, for example the line 115a and the line 115b, one of the pressure delivery lines is guided above the other. From Figure 21 ​As shown, for example, pressure delivery line 115a is guided above pressure delivery lines 115b and 115c to supply cylinder boreholes 118a, 118a, which are located above and to the right of the figure, away from the interface. Similarly, pressure delivery line 115c is guided above pressure delivery line 115b at its intersection with pressure delivery line 115b.

[0144] Figures 15 to 29 The arrangement of the cylinder plate 19, the printing plate 15, and the mating printing plate 31 in an embodiment of the cylinder plate 19 according to the present invention or in a device for connecting a device to a substrate is shown.

[0145] exist Figures 15 to 29 The image shows a cylinder plate 19, an impression plate 15, and a mating impression 31, which only have features for compensating for thermal expansion, while other details, such as pressure delivery lines, cylinders, and impressions, are not shown.

[0146] Figure 15 A perspective view of a multi-piece cylinder plate and a printing template according to an embodiment of the present invention is shown. Figure 16 Showing according to Figure 15 A front view of a cylinder plate with a printing template. Figure 17 Show Figure 15 Top view of the cylinder plate.

[0147] The cylinder plate 19 is constructed in multiple parts, consisting of four components 19a, 19b, 19c, and 19d. Each component 19a, 19b, 19c, and 19d has a rectangular shape. All four components 19a, 19b, 19c, and 19d are arranged such that they abut against each other at mating point A. Here, in the described embodiment, mating point A corresponds to the midpoint of the cylinder plate 19, which is also the zero point.

[0148] For connection to an upper component of a device used to connect a device to a substrate, pins 20a, 20b, 20c, and 20d are provided, which are received in holes 195a, 195b, 195c, and 195d located at the corners of the cylinder plate 19. Holes 195a, 195b, 195c, and 195d are configured as elongated holes, the longitudinal axis of which lies on the line connecting the corresponding corner of the cylinder plate 19 or the corresponding corner of the corresponding component 19a, 19b, 19c, and 19d to a mating point A. Therefore, the longitudinal axes of the elongated holes intersect at mating point A, which in this embodiment also corresponds to the zero point. Here, pins 20a, 20b, 20c, and 20d are fastened to the upper component of the device used to connect the device to the substrate and extend into the elongated holes 195a, 195b, 195c, and 195d of the cylinder plate 19. For this reason, when the chamber is opened, the cylinder plate 19 can be easily removed in the downward direction.

[0149] This arrangement gives rise to the fact that, in the event of heating of the cylinder plate 19, the zero point (the point of contact A) remains in place, while the outer corners of the cylinder plate 19 or of each component 19a, 19b, 19c, 19d can be displaced along the axis of the corresponding long hole 195a, 195b, 195c, 195d as a result of thermal expansion of the respective pin 20a, 20b as a guide.

[0150] In order to compensate for the thermal expansion of the impression guide plate 15, the latter is likewise provided with long holes 155a, 155a' and 155a", 155b, 155b' and 155b", 155c, 155c' and 155c", 155d, 155d' and 155d", as can be seen from Figure 18 In addition, the impression plate 15 is connected to the four components 19a, 19b, 19c, 19d of the cylinder plate 19 via the pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d". This connection takes place in a similar manner to the connection of the cylinder plate 19 to the upper component. The pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are thus fixed at the cylinder plate 19 and protrude into the long holes 155a, 155a' and 155a", 155b, 155b' and 155b", 155c, 155c' and 155c", 155d, 155d' and 155d" of the impression plate 15.

[0151] Each component 19a, 19b, 19c, 19d is thus connected to the impression guide plate at three of its corners. Only the corner at the point of contact A is free of a long hole.

[0152] Pins 1519a to 1519d” are arranged in elongated holes 155a, 155a', and 155a” of the impression guide plate 15, the orientation of which is such that the longitudinal axes of the elongated holes intersect at zero points B1, B2, B3, or B4 of the impression plate. In the cold state, points B1, B2, B3, and B4 correspond to the midpoints of components 19a, 19b, 19c, and 19d of the cylinder plate 19, respectively. The arrangement of elongated holes 155a, 155a', and 155a” and pins 1519a to 1519d” of the impression guide plate 15 effectively compensates for the different thermal expansions between the cylinder plate 19 (the four components 19a, 19b, 19c, and 19d) and the impression guide plate 15. Therefore, determining the zero points B1, B2, B3, and B4 of the mold guide plate 15 ensures that, despite thermal expansion, the zero points do not shift relative to their corresponding points on the cylinder plate 19 positioned above the mold plate 15. Thus, pressure can be precisely applied to the mold 11 at all times, regardless of thermal expansion. Therefore, the mold is preferably arranged such that one of the zero points B1, B2, B3, or B4 of the mold plate is located on the central axis of the mold 11.

[0153] Therefore, it is always ensured that even when the individual boards 15 and 19 undergo thermal expansion during equipment operation, the mold 11 always acts on the components on the substrate with sufficient precision, thereby avoiding defective products.

[0154] In the above embodiments, the hole is configured as an elongated hole, such that the zero point or the zero point of the printing template corresponds to the midpoint of the plate component of the plate or multi-piece plate.

[0155] Figure 19 The illustration shows a three-dimensional arrangement of separate cylinder plates, printing plates, and paired printing molds according to one embodiment of the present invention. Figure 20 Shown from the front Figure 19 A view of the layout. Figure 21 Showing the corresponding Figure 20 The line DD in the middle is observed from the printing template. Figure 19 A view of the cylinder plate. Figure 22 Show Figure 19 A cross-sectional view of the arrangement.

[0156] Figure 19 The view corresponds to Figure 15 The view of the product carrier is shown, but it is also useful as a complementary pairing of the molds. The top view of the product carrier is shown from... Figure 29 visible.

[0157] As from Figure 19 As can be seen, the multi-piece cylinder plate 19, printing template 15, and product carrier 31 are arranged in a top-to-bottom order. As described above, the cylinder plate 19 is attached to the upper part 1 of the device for connecting the device to the substrate via pins 20a, 20b, 20c, and 20d (see, for example...). Figure 1) at.

[0158] The pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are fixed at the cylinder plate 19, as already described above according to the Figure 18 It is apparent from Figure 21 It is apparent from Figure 21 A bottom view of the cylinder plate 19 is shown. The downwardly projecting end portions of the pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are accommodated in the long holes 155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 155d', 155d" of the mold plate 15 and serve to guide the mold plate upon thermal expansion.

[0159] The mold plate 15 is also provided at its lower side with pins 3115a, 3115b, 3115c and 3115d, the downwardly projecting end portions of which project into the long holes 315a, 315b, 315c and 315d of the product carrier (counter-mold 31) in the case of a closed chamber, in order to guide the expansion of the pins upon thermal expansion. The long holes 315a, 315b, 315c and 315d are also arranged such that the longitudinal axes of the pins intersect in the counter-mold zero point C. It is thus ensured that the counter-mold zero point C remains in place despite thermal expansion, whereas Figure 29 The products P shown by the rectangles in the middle are displaced together upon heating during the process corresponding to thermal expansion.

[0160] However, it is ensured by the defined mold plate zero points B, B1, B2, B3, B4 that the positions reached by the products in the range of thermal expansion are sufficiently covered by the mold 11 in order to load the preset pressure.

[0161] While the application has been described above according to the currently preferred embodiments, it should be noted that alternative solutions with respect to the orientation of the holes and pins are feasible.

[0162] For example, the zero points defined by the long holes and the cylindrical pins can be freely chosen. While the zero points are located in the center of the cylinder plate according to the embodiments, the zero points can also be defined at other locations, if desired.

[0163] This is simply achieved by changing the orientation of the long holes so that their longitudinal axes intersect at other locations. It can thus be meaningful in some applications to set the zero point of the tool at a specific point on the component to be pressed. In this case, the longitudinal axes of the long holes do not lie on the line connecting the corners and the midpoint of the cylinder plate.

[0164] In this embodiment, the pins and the holes as long holes are arranged in the corners of the cylinder plate. However, it can be meaningful to also arrange the pins and holes at other locations in the edge region of the cylinder plate, for example in the middle of each side of the cylinder plate, or to arrange a plurality of holes at each side of the steel plate.

[0165] In the following description, according to Figures 23 to 28 Alternative solutions are shown with respect to the arrangement of the holes. Although the holes are also configured as long holes, the zero point of the cylinder plate 19 and / or the die plate 15 can be defined at any location on the plate or plate part that deviates from the midpoint. This is achieved by rotating the long holes and / or changing the location of the long holes so that their longitudinal axes intersect at the location of the set zero point.

[0166] According to Figure 25 , the long holes 195a, 195b, 195c, 195d are displaced along the edge from the corners of the cylinder plate 19. However, the long holes are oriented as before so that their longitudinal axes intersect in the zero point A, which corresponds to the midpoint of the cylinder plate 19 and the butt joint of the four partial plates 19a, 19b, 19c, 19d.

[0167] However, Figure 26 The long holes 155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 115d, 155d', 155d" in the die plate shown in Fig. 5 are rotated so that their longitudinal axes intersect at the die plate zero points B1, B2, B3, B4, which do not coincide with the midpoint of the virtual partial plates of the die plate 15. The pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are fixed at corresponding locations at the underside of the cylinder plate 19.

[0168] From Figure 27 and Figure 28 Further alternative designs of the cylinder plate 19 and the die plate 15 can be seen in which the zero point likewise does not coincide with the midpoint of the plate or partial plate.

[0169] It should also be noted that other suitable guide elements can be used instead of the described pins. A mating spring is mentioned as an example of this.

[0170] The present disclosure relates to further design solutions of the device for connecting a component with a substrate according to the subject matter defined in the following, in addition to the invention claimed in the claims.

[0171] I. Device for connecting a component with a substrate with form fit

[0172] Subject I.1. Device for connecting a component with a substrate, having

[0173] a chamber which can be divided into at least two parts, wherein

[0174] a stamp (11, 111) is provided at the first part (1), and

[0175] a counter-stamp (31) is provided at the second part (3), wherein

[0176] the first part (1) has a wall with an edge which can abut against an opposite edge of the wall of the second part (3) to close the chamber, wherein

[0177] in the state in which the chamber is open, the counter-stamp (31) can be loaded with initial material, and

[0178] in the state in which the chamber is closed, pressure can be exerted via the stamp (11) on the initial material arranged between the stamp (11, 111) and the counter-stamp (31), wherein

[0179] in the closed state, the first part (1) and the second part (3) can be locked by means of form fit, such that opening the chamber by separating the first part (1) from the second part (3) is prohibited.

[0180] Subject I.2. Device according to subject I.1, wherein

[0181] each edge has a recess (131) with a hole (133a, 113b; 391) and / or a protrusion (137; 39) which can abut against a protrusion (39; 137) and / or a recess (131) of the opposite edge, wherein the cross section of the hole (133a, 133b) of the protrusion (137a, 137b) of the wall of the first part (1) at least partially overlaps the cross section of the hole (391) of the protrusion (39) of the wall of the second part (3) in the state in which abutment is formed, and

[0182] the form fit can be established by means of a pin (135) which is guided through both holes (133a, 133b; 391).

[0183] Subject I.3. Device according to subject I.2, wherein

[0184] At least one of the holes (133a, 133b; 391) has a cross section with a length (li; l2) greater than a width (b), wherein the length (li, l2) of the cross section extends in the opening direction of the chamber.

[0185] Subject I.4. The device according to subject I.3, wherein

[0186] In the state of abutment, the center axis of the hole (133a, 133b) of the protrusion (137a, 137b) of the wall of the first component (1) is different from the center axis of the hole (391) of the protrusion (39) of the wall of the second component (3).

[0187] Subject I.5. The device according to any one of subjects I.2 to I.4, wherein

[0188] In the closed state of the chamber, during the application of pressure by the stamp (11) via the initial material onto the counter stamp (31), the pin (135) is clamped between the inner wall section of the protrusion (39) of the second component (3) pointing towards the first component (1) and the inner wall section of the hole (133a, 133b) of the protrusion (137a, 137b) of the first component pointing towards the second component (3), while the pin (135) can be introduced into the holes (133a, 133b; 391) and taken out in a freely movable manner in the state of non-application of pressure.

[0189] Subject I.6. The device according to any one of subjects I.1 to I.5, wherein

[0190] At least the edge of the first component (1) or the edge of the second component (3) has a seal (311) which can establish a gas-tight state of the chamber in the closed state of the chamber independently of the application of pressure by the stamp (11) via the initial material onto the counter stamp (31).

[0191] Subject I.7. The device according to subject I.1, wherein

[0192] The first component (1) has at the edge a first protrusion (431) in the form of a flange pointing out of the chamber, and

[0193] The second component (3) has at the edge a second protrusion (433) in the form of a flange pointing out of the chamber, wherein

[0194] A form fit can be established by bringing the face of the first protrusion (431) pointing towards the second protrusion (433) into abutment with the face of the second protrusion (433) pointing towards the first protrusion (431) and attaching a clamp (435) via the two flange-like protrusions (431, 433).

[0195] Subject I.8. The device according to subject I.7, wherein

[0196] The face of the first protrusion (431) facing away from the second protrusion (433) and / or the face of the second protrusion (433) facing away from the first protrusion (431) is beveled.

[0197] Subject I.9. The device according to subject I.8, wherein

[0198] Each inner face of the clamp (435) to be in abutment with the beveled face of the first and / or second protrusion (431; 433) has a corresponding bevel.

[0199] Subject I.10. The device according to subject I.7, I.8 or I.9, wherein

[0200] The clamp (435) is rotatably connected at one of its ends to a wall of the first part (1) or to a wall of the second part (3) and is able to establish and cancel the form fit by rotating the clamp around the connection point.

[0201] II. A device for connecting a component with a substrate, having a cylinder plate produced by additive manufacturing

[0202] Subject II.1. Cylinder plate (19) for a device for connecting a component with a substrate, the device having a chamber which can be divided into at least two parts, wherein the cylinder plate (19) is provided at a first part (1) of the chamber and

[0203] In the cylinder plate (19) are formed:

[0204] A cylinder bore (118; 118a, 118b, 118c) for accommodating a reciprocally movable piston (117) which is able to form an abutment with a stamp (11, 111) when loaded with a gaseous pressure medium to transmit a pressure in order to press the stamp against a counter-stamp (31) provided at a second part (3), and

[0205] A pressure delivery line (115; 115a, 115b, 115c) via which a pressure medium can be delivered to the cylinder bore (118; 118a, 118b, 118c) to actuate the piston (117),

[0206] characterized in that

[0207] The cylinder plate (19) is produced by means of additive manufacturing.

[0208] Subject II.2. The cylinder plate according to subject II.1, wherein

[0209] A plurality of cylinder bores (118) with reciprocating pistons (117) accommodated therein are provided in the cylinder plate (19), and each cylinder bore can be supplied with pressure medium via a pressure delivery line (115; 115a, 115b, 115c) embodied in the cylinder plate.

[0210] Subject II.3. Cylinder plate according to subject II.1 or II.2, wherein

[0211] A plurality of cylinder bores (118a, 118b, 118c) are provided in the cylinder plate (19), and the individual cylinder bores (118a, 118b, 118c) are combined into groups, and

[0212] The cylinder bores (118a, 118b, 118c) of a group can be supplied with pressure medium via their own pressure delivery line (115a, 115b, 115c) embodied in the cylinder plate (19).

[0213] Subject II.4. Cylinder plate according to any one of subjects II.1 to II.3, wherein a plurality of pressure delivery lines (115a, 115b, 115c) are provided in a single plane of the cylinder plate (19), and

[0214] A tangential or intersecting (115a: 115b, 115a: 115c, 115c: 115b) of two different pressure delivery lines is avoided by the second pressure delivery line (115a; 115c; 115a) bypassing the first pressure delivery line (115b; 115c) via a second plane of the cylinder plate (19).

[0215] Subject II.5. Cylinder plate according to any one of subjects II.1 to II.4, wherein

[0216] At least one section of the pressure delivery line (115; 115a, 115b, 115c) is embodied in a manner different from a straight line.

[0217] Subject II.6. Cylinder plate according to any one of subjects II.1 to II.5, wherein

[0218] The pressure delivery line (115) has a circular cross-section or a cross-section different from a circular cross-section.

[0219] Subject II.7. Cylinder plate according to any one of subjects II.1 to II.6, wherein

[0220] The pressure delivery line (115) has a diameter of between 0.1 mm and 1 mm.

[0221] Subject II.8. Cylinder plate according to any one of subjects II.1 to II.7, wherein

[0222] The cylinder plate (19) is made of aluminum or an aluminum alloy.

[0223] Subject II.9. The cylinder plate according to any one of subjects II.1 to II.8, wherein

[0224] The cylinder plate comprises a plurality of parts (19a, 19b, 19c, 19d).

[0225] Subject II.10. The cylinder plate according to any one of subjects II.1 to II.9, wherein

[0226] The cylinder plate (19; 19a, 19b, 19c, 19d) has a hole (195a, 195b, 195c, 195d) in the corner region for bearing at an upper part (1) of an apparatus for connecting a device with a substrate via a pin (20a, 20b, 20c, 20d).

[0227] Subject II.11. The cylinder plate according to subject II.10, wherein

[0228] The hole (195a, 195b, 195c, 195d) is configured as a slot, the longitudinal axes of which have an intersection point defining a zero point.

[0229] Subject II.12. The cylinder plate according to subject II.11, wherein each longitudinal axis lies on a line connecting a respective corner of the cylinder plate (19; 19a, 19b, 19c, 19d) with a midpoint (A) of the cylinder plate (19) or with a joint point (A) of the parts (19a, 19b, 19c, 19d) of the cylinder plate.

[0230] Subject II.13. An apparatus for connecting a device with a substrate, having

[0231] a chamber, which is divisible into at least two parts, wherein

[0232] a stamp (11, 111) is provided at the first part (1), and

[0233] a counter-stamp (31) is provided at the second part (3), wherein

[0234] the first part (1) is capable of forming an abutment with the second part (3) to close the chamber, wherein

[0235] in an open state of the chamber, the counter-stamp (31) is capable of being loaded with an initial material, and

[0236] in a closed state of the chamber, the initial material arranged between the stamp (11, 111) and the counter-stamp (31) is capable of being subjected to pressure via the stamp (11), wherein

[0237] At the first part, a cylinder plate according to any one of the subject matters II.1 to II.12 is provided, and the pressure of the gaseous pressure medium in the pressure delivery line (115; 115a, 115b, 115c) is transmitted onto the stamp (11, 111) by means of the piston (117).

[0238] Subject matter II.14. A method for producing a cylinder plate (19) having cylinder bores (118) which are connected via pressure delivery lines (115) with interfaces (193), wherein

[0239] The cylinder plate (19) is additively manufactured by coating the material which solidifies after coating layer by layer onto the production surface,

[0240] wherein when coating the material, the cylinder bores (118) and the pressure delivery lines (115) are dispensed with.

[0241] Subject matter II.15. The method according to subject matter II.14, wherein the pressure delivery lines (115, 115a, 115b, 115c) lie in the only plane of the cylinder plate, and tangential or intersecting of two different pressure delivery lines (115a: 115b; 115a: 115c; 115c: 115b) is made by bypassing the pressure delivery line (115b; 115c) via a second plane by another pressure delivery line (115a; 115a, 115c).

[0242] III. Cylinder plate for a device for connecting a device with a substrate and such a device, and in particular a cylinder plate which compensates thermal expansion

[0243] Subject matter III.1. A cylinder plate (19) for a device for connecting a device with a substrate, the device having a chamber which can be divided into at least two parts, wherein the cylinder plate (19) is provided at a first part (1) of the chamber, and

[0244] In the cylinder plate (19) are formed:

[0245] cylinder bores (118; 118a, 118b, 118c) for accommodating a reciprocally movable piston (117) which can abut against the stamp (11, 111) when loaded with gaseous pressure medium to transmit the pressure in order to press the stamp against a counter stamp (31) provided at a second part (3), and

[0246] pressure delivery lines (115; 115a, 115b, 115c) via which pressure medium can be delivered to the cylinder bores (118; 118a, 118b, 118c) to actuate the piston (117),

[0247] characterized in that

[0248] The cylinder plate (19) has holes (195a, 195b, 195c) at its edges, which constitute a receiving for guide elements, preferably play pins (20a, 20b, 20c, 20d), by means of which the cylinder plate can be connected to the first part (1) of the chamber.

[0249] Subject III.2. Cylinder plate according to subject III.1, wherein

[0250] The cylinder plate is composed of a plurality of parts (19a, 19b, 19c, 19d), wherein each part (19a, 19b, 19c, 19d) has at least one hole (195a, 195b, 195c, 195d).

[0251] Subject III.3. Cylinder plate according to subject III.1 or III.2, wherein

[0252] The holes (195a, 195b, 195c, 195d) are constituted at least in the corner regions of the cylinder plate (19; 19a, 19b, 19c, 19d).

[0253] Subject III.4. Cylinder plate according to any one of subjects III.1 to III.3, wherein

[0254] The holes (195a, 195b, 195c, 195d) are constituted as long holes, the longitudinal axes of which have an intersection point defining a zero point (A).

[0255] Subject III.5. Cylinder plate according to subject III.4, wherein each longitudinal axis lies on a line connecting the respective corner of the cylinder plate (19; 19a, 19b, 19c, 19d) with the zero point (A) corresponding to the midpoint of the cylinder plate (19, 19a, 19b, 19c, 19d).

[0256] Subject III.6. Cylinder plate according to subject III.4, wherein the cylinder plate is composed of a plurality of parts (19a, 19b, 19c, 19d) and the zero point (A) corresponds to the abutment point of the plurality of parts (19a, 19b, 19c, 19d).

[0257] Subject III.7. Cylinder plate according to subject III.4, wherein the cylinder plate is composed of a plurality of parts (19a, 19b, 19c, 19d) and the zero point (A) is spaced apart from the abutment point of the plurality of parts.

[0258] Subject III.8. Cylinder plate according to any one of subjects III.4 to III.7. Wherein the cylinder plate is composed of a plurality of parts (19a, 19b, 19c, 19d) which are composed in the form of rectangles having the same length and the same width.

[0259] Subject III.9. An apparatus for connecting a device with a substrate, having

[0260] a chamber which can be divided into at least two parts, wherein

[0261] a stamp (11, 111) is provided at the first part (1) and

[0262] a counter stamp (31) is provided at the second part (3), wherein

[0263] the first part (1) can form an abutment with the second part (3) to close the chamber, wherein

[0264] in the open state of the chamber, the counter stamp (31) can be loaded with an initial material, and

[0265] in the closed state of the chamber, a pressure can be exerted on the initial material arranged between the stamp (11, 111) and the counter stamp (31) via the stamp (11), wherein

[0266] a cylinder plate according to any one of subjects III.1 to III.8 is provided at the first part, which is attached at the first part (1) by means of pins (20a, 20b, 20c, 20d).

[0267] Subject III.10. Apparatus according to subject III.9, wherein

[0268] the stamp (11, 111) is guided in a stamp plate (15) which has holes (155a, 155b, 155c, 155d) in its edge region in which pins (1519a, 1519b, 1519c, 1519d) for attaching the stamp plate (15) at the cylinder plate (19) with play are accommodated.

[0269] Subject III.11. Apparatus according to subject III.10, wherein

[0270] the holes (155a, 155b, 155c, 155d) are configured as long holes, the central axes of which intersect in the stamp plate zero point.

[0271] Subject III.12. Apparatus according to subject III.11, wherein

[0272] The cylinder plate (19) is divided into a plurality of parts (19a, 19b, 19c, 19d) and the mold plate (15) is virtually divided according to the parts (19a, 19b, 19c, 19d) of the cylinder plate, wherein each virtual part of the mold plate (15) has a plurality of holes (155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 155d, 155d', 155d") in its edge region.

[0273] Subject III.13. The apparatus according to subject III.12, wherein

[0274] The plurality of holes (155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 155d, 155d', 155d") are configured as long holes and the center axes of the long holes of each virtual part intersect in the mold plate zero point (B1, B2, B3, B4).

[0275] Subject III.14. The apparatus according to any one of subjects III.9 to III.13, wherein

[0276] The counter-mold (31) has holes (315a, 315b, 315c, 315d) in its edge region, in which holes pins (3115a, 3115b, 3115c, 3115d) with play are accommodated, which are used to guide the counter-mold (31) at the mold plate (15).

[0277] Subject III.15. The apparatus according to subject III.14, wherein the holes (315a, 315b, 315c, 315d) of the counter-mold are configured as long holes, the center axes of which intersect in the counter-mold zero point (C).

Claims

1. An apparatus for connecting a device to a substrate, comprising: A chamber that can be divided into at least two parts, wherein An impression (11) is provided at the first component (1), and A matching mold (31) is provided at the second component (3). in The first component (1) is capable of shifting toward the second component (3) to close the chamber, wherein With the chamber open, initial material can be loaded onto the mating impression (31), and In the closed state of the chamber, pressure can be applied to the initial material disposed between the impression (11) and the mating impression (31) via the impression (11), wherein The shaft (111) of the impression (11) is accommodated in the impression guide plate (15) provided at the first component (1) by means of an interference fit, and The pressure body of the mold (11) has a larger cross-sectional area than the shaft (111) of the mold (11), wherein A negative pressure device is provided on the side of the impression guide plate (15) opposite to the mating impression (31).

2. The device according to claim 1, wherein, A cylinder plate (19) is provided on the side of the impression guide plate (15) opposite to the mating impression (31), the cylinder plate having a piston (117) capable of reciprocating in a cylinder bore, the piston having a guide rod (113) on the side pointing toward the impression (11), the guide rod being configured to be in contact with the end face of the shaft (111) and apply pressure to the impression (11) when pressure is applied to the piston (117).

3. The device according to claim 2, wherein The end face of the shaft (111) of the mold (11) is flat, and The tip of the guide rod (113) that abuts against the end face of the shaft (111) is rounded.

4. The device according to any one of claims 1 to 3, wherein the negative pressure device is an intermediate control chamber formed between the impression guide plate (15) and a cylinder plate (19) disposed on the side of the impression guide plate (15) opposite to the mating impression (31), the intermediate control chamber being capable of applying negative pressure.

5. The device according to claim 3, wherein in the retracted position of the piston (117) and the mold (11), there is a gap between the tip of the guide rod (113) and the end face of the shaft (111) of the mold (11).

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