Combination and splitting device, transmission equipment and combination and splitting method

Abstract

The invention relates to a combination and splitting device, transmission equipment and a combination and splitting method, the device is used for combination and splitting of a plate carrying disc, a plate carrying ring and a base plate, the device comprises a ring carrying table and a lifting table, a through hole is formed in the ring carrying table, and the lifting table can movably penetrate through the through hole in the vertical direction; the size of the through hole is larger than that of the carrier plate, smaller than that of the outer ring of the carrier ring and smaller than that of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring. The assembling and disassembling device can realize high-precision and accurate automatic assembling and disassembling of the carrier plate disc, the carrier plate ring and the substrate.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a combination and splitting device, a transmission device and a combination and splitting method. Background Art

[0002] The epitaxial growth of silicon carbide is to generate epitaxial materials with a certain thickness and concentration on a crystal substrate under a process environment. This process generally uses a graphite disk as a carrier and heat conduction platform. The substrate is usually carried by a carrier ring and a carrier plate, and then placed in an epitaxial reaction chamber for epitaxial growth. During this process, if there is an assembly error between the carrier ring, the carrier plate and the substrate, it will affect the quality of epitaxial growth and cause product defects.

[0003] Existing assembly and disassembly methods include manual assembly and automated assembly and disassembly mechanisms. Manual assembly may cause contamination of the substrate and may easily cause touch damage during transportation; existing automated assembly and disassembly mechanisms only disclose automated assembly and do not mention how to improve assembly accuracy. Summary of the invention

[0004] The present application proposes a combination and splitting device, a transmission device and a combination and splitting method to solve the problem of low and inaccurate splitting and combination precision of a carrier plate, a carrier ring and a substrate in the prior art.

[0005] In order to solve the above problems, the present application proposes a combined disassembly device for the combined disassembly of a carrier plate, a carrier ring and a substrate, comprising: a carrier ring table and a lifting platform, the carrier ring table is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring.

[0006] In one embodiment, the combination and separation device also includes a position identifier, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction, and is used to identify the center position of the ring-carrying platform and the lifting platform, and is also used to identify the center position of the plate carrier, plate carrier ring or substrate on the ring-carrying platform and the lifting platform.

[0007] In one embodiment, the assembly and separation device further comprises a height measuring sensor, which is arranged relative to the ring carrier platform and the lifting platform in the vertical direction and is used to identify the upper surface height of the carrier ring and the upper surface height of the substrate.

[0008] In order to solve the above problems, the present application proposes a transmission device, including the above-mentioned combined splitting device and a transport robot, wherein the transport robot is used to transport the carrier plate, carrier ring and substrate to the carrier ring platform or the lifting platform, and is also used to adjust the posture position of the carrier plate, carrier ring or substrate on the carrier ring platform and the lifting platform.

[0009] In one embodiment, the transport device further comprises a substrate calibrator, and the substrate calibrator is used to adjust the position and posture of the substrate.

[0010] In order to solve the above problems, the present application proposes a combination and disassembly method, which is used to combine and disassemble a carrier plate, a carrier ring and a substrate through a combination and disassembly device, and the combination and disassembly device includes: a carrier ring platform and a lifting platform, the carrier ring platform is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring; the combination and disassembly method includes: controlling the lifting platform to pass through the through hole and rise on the carrier ring platform ; Place the combination of the carrier plate and the carrier ring on the lifting platform; control the lifting platform to pass through the through hole and descend to the carrier ring platform, the carrier ring remains on the carrier ring platform, and the carrier plate follows the lifting platform to descend; move the carrier plate out, control the lifting platform to pass through the through hole and rise to the carrier ring platform; place the substrate on the lifting platform; control the lifting platform to pass through the through hole and descend to the carrier ring platform, the substrate remains on the carrier ring; place the carrier plate on the lifting platform, control the lifting platform to pass through the through hole and rise to the carrier ring platform to combine the carrier plate, the carrier ring and the substrate.

[0011] In one embodiment, the combination and disassembly device also includes a position identifier, which is arranged relative to the carrier ring platform and the lifting platform in the vertical direction. The combination and disassembly method also includes: before placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the through-hole center coordinates of the through hole by a position identifier; after placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the combination center coordinates of the combination of the carrier plate and the carrier ring by a position identifier; adjusting the position of the combination of the carrier plate and the carrier ring to control the deviation of the through-hole center coordinate and the combination center coordinate to be within an allowable range.

[0012] In one embodiment, the combination and splitting device is also associated with a transport robot and a substrate calibrator, and the transport robot is also connected to the position identifier, and is used to transport the carrier plate, carrier ring and substrate to the carrier ring table or the lifting platform, and is used to adjust the posture position of the carrier plate, carrier ring or substrate on the carrier ring table and the lifting platform according to the identification information of the position identifier; the combination and splitting method also includes: before placing the substrate on the lifting platform, calibrating the position and posture of the substrate by using a substrate calibrator.

[0013] In one embodiment, the combination and disassembly device also includes a height measuring sensor, which is arranged relative to the carrier ring table and the lifting platform in the vertical direction. The combination and disassembly method also includes: after controlling the lifting platform to pass through the through hole and descend to the carrier ring table, and the substrate remains on the carrier ring, identifying the center coordinates of the carrier ring and the center coordinates of the substrate through a position identifier; identifying the upper surface height of the carrier ring and the upper surface height of the substrate through a height measuring sensor; if the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is within an allowable range, and the height difference between the upper surfaces of the carrier ring and the substrate is within an allowable range; then placing the carrier plate on the lifting platform, and controlling the lifting platform to pass through the through hole and rise to the carrier ring table to combine the carrier plate, the carrier ring and the substrate.

[0014] In one embodiment, if the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the upper surfaces of the carrier ring and the substrate is not within the allowable range, the substrate is placed back into the substrate calibrator by a transport robot to recalibrate the position and posture.

[0015] The combined splitting device of the present invention comprises: a ring-carrying platform and a lifting platform, the ring-carrying platform is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring. The combined splitting device of the present application can utilize the relative movable relationship between the ring-carrying platform and the lifting platform, after the carrier ring is placed on the ring-carrying platform, the lifting platform can be lifted to the upper and lower sides of the ring-carrying platform respectively to realize the assembly of the substrate and the carrier plate on the upper and lower sides of the carrier ring, and under this assembly structure, the carrier plate, the carrier ring and the substrate can be adjusted separately based on the ring-carrying platform and the lifting platform to improve the precision and accuracy of the combination. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1It is a structural schematic diagram of an embodiment of the combined splitting device of the present application;

[0018] Figure 2 It is a structural schematic diagram of an embodiment of a transmission device of the present application;

[0019] Figure 3 It is a schematic diagram of the combined structure of the carrier plate, the carrier ring and the base plate in the present application;

[0020] Figure 4 This is a schematic diagram of the structure of the first working state of an embodiment of the assembly and separation device of the present application;

[0021] Figure 5 This is a schematic diagram of the structure of the second working state of an embodiment of the combined splitting device of the present application;

[0022] Figure 6 It is a structural schematic diagram of the third working state of an embodiment of the combined splitting device of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0024] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0025] The assembly and disassembly device of the present application is used to assemble and disassemble the carrier plate 23, the carrier ring 22 and the substrate 21. Figure 3 The three are detachable independent structures. After the three are assembled, the carrier plate 23 is embedded in the lower side of the carrier ring 22, and the substrate 21 is embedded in the upper side of the carrier ring 22. In the epitaxial reaction process, the substrate 21 is the workpiece to be reacted, which is a crystalline silicon material; the carrier plate 23 and the carrier ring 22 are used to carry the substrate 21. The carrier plate 23 is made of graphite material and can be used as a heat conductor. The carrier ring 22 is made of quartz material to improve the bearing stability. In this embodiment, all three are circular, and a step is formed in the carrier ring 22 for embedding the substrate 21 and the carrier plate 23. Among them, the size of the substrate 21 is larger than the inner ring size of the carrier ring 22, and the outer ring diameter of the substrate 21 is larger than the inner ring diameter of the carrier ring 22.

[0026] like Figure 1The assembly and separation device 49 includes a ring-carrying platform 133 and a lifting platform 140. The ring-carrying platform 133 is formed with a through hole, and the lifting platform 140 can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate 23, smaller than the outer ring size of the carrier ring 22, and smaller than the size of the substrate 21. Corresponding to the circular carrier plate 23, carrier ring 22 and substrate 21, the through hole is also designed to be circular, and the diameter of the through hole is larger than the outer ring diameter of the carrier plate 23, smaller than the outer ring diameter of the carrier ring 22, and smaller than the outer ring diameter of the substrate 21.

[0027] The present embodiment can utilize the relative movable relationship between the ring carrier platform 133 and the lifting platform 140. After the carrier ring 22 is placed on the ring carrier platform 133, the lifting platform 140 can be lifted and lowered to the upper and lower sides of the ring carrier platform 133 respectively to realize the assembly of the substrate 21 and the carrier plate 23 on the upper and lower sides of the carrier ring 22. In addition, under this assembly structure, the carrier plate 23, the carrier ring 22 and the substrate 21 can be adjusted separately based on the ring carrier platform 133 and the lifting platform 140 to improve the precision and accuracy of the combination.

[0028] Specifically, the assembly and separation device 49 also includes a position identifier 48, which is arranged relative to the ring-carrying platform 133 and the lifting platform 140 in the vertical direction, and is used to identify the center position of the ring-carrying platform 133 and the lifting platform 140, and is also used to identify the center position of the plate-carrying plate 23, the plate-carrying plate ring 22 and the substrate 21 on the ring-carrying platform 133 and the lifting platform 140. The center position is determined by the position identifier 48, and then the position and posture of the plate-carrying plate 23, the plate-carrying plate ring 22 and the substrate 21 can be controlled and adjusted. In this embodiment, the position identifier 48 is an industrial camera, and the position coordinates are obtained by shooting.

[0029] The combined splitting device 49 also includes a height measuring sensor 131, which is also arranged in the vertical direction relative to the carrier ring platform 133 and the lifting platform 140, and is used to identify the upper surface height of the carrier ring 22 and the upper surface height of the substrate 21. When the substrate 21 is embedded and installed on the upper side of the carrier ring 22, it can be judged whether the substrate 21 and the carrier ring 22 are accurately installed. Installation positioning parts, such as installation notches or installation protrusions, can be set on the substrate 21 and the carrier ring 22. Since it is automatically installed, it is easy for the positioning part to be inaccurately positioned. At this time, the accurate positioning can be judged by detecting the upper surface heights of the two. If the height difference between the two upper surface heights is large, it means that it is not accurately positioned. If the height difference is small and within the preset range, it means that it is accurately positioned.

[0030] The assembly and separation device 49 is mainly used to realize the assembly and separation of the carrier plate 23, the carrier ring 22 and the base plate 21. In addition to the above structure, the assembly and separation device 49 also includes a ring light source 132, which can be used for lighting when the industrial camera is shooting and positioning, so as to improve the accuracy of shooting and positioning; a linear module 134, a linear module fixing plate 135, and a linear module driving motor 137, which are used to drive the lifting platform 140 to move in the vertical direction; and also includes a split assembly mechanism bottom plate 136 and an exhaust fan 10 arranged on the bottom plate, which are used for exhausting and dissipating heat to ensure the stability of the environment.

[0031] During the assembly process, the carrier plate 23, the carrier ring 22 and the substrate 21 need to be transported and adjusted. Therefore, the present application also proposes a transmission device 100 including a combination and separation device 49, and the transmission device 100 includes a transport robot 30, such as Figure 2 , used to transport the plate carrier 23, the plate carrier ring 22 and the substrate 21 to the ring carrier platform 133 or the lifting platform 140, and also used to adjust the posture position of the plate carrier 23, the plate carrier ring 22 or the substrate 21 on the ring carrier platform 133 and the lifting platform 140. The transport robot 30 can specifically perform transport and posture position adjustment according to the above-mentioned position identifier 48.

[0032] The handling robot 30 can be a 4-axis single-arm single-finger horizontal multi-joint SCARA (Selective Compliance Assembly Robot Arm) type robot, equipped with a linear joint for lifting in the Z direction, 3 rotating joints with rotation axes perpendicular to the horizontal plane, and 4 degrees of freedom of movement in four directions. It can also be a 5-axis single-arm double-finger horizontal multi-joint SCARA (Selective Compliance Assembly Robot Arm) type robot, equipped with a linear joint for lifting in the Z direction, 4 rotating joints with rotation axes perpendicular to the horizontal plane, and the robot has 2 end grippers that can rotate freely, both with 4 degrees of freedom of movement in four directions.

[0033] The transmission device 100 also includes a substrate calibrator 41, which is used to adjust the position and posture of the substrate 21 so that the substrate 21 can be accurately assembled on the carrier ring 22. The function of the substrate calibrator 41 is to calibrate the center position and angle of the substrate 21. It has an identification module that can accurately calculate and identify the center position (x, y) and angle θ of the substrate 21; it has a substrate fixing part and a rotating mechanism that can fix the substrate 21 and rotate with the substrate 21, and can cooperate with the identification module to calculate and identify the center position (x, y) and angle θ of the substrate, and can also adjust the angle θ of the substrate to a specified angle; it has a substrate center position positioning module that can drive the substrate to move and adjust the center position (x, y) of the substrate to a specified position. The substrate center position positioning module can be replaced by a handling robot, and the handling robot 30 adjusts the center position (x, y) of the substrate 21 to a specified value according to the recognition result of the center position (x, y) of the substrate 21.

[0034] The transmission device 100 also includes a material box 42 for placing substrates, a material bin 44 for placing the carrier ring 22 and the carrier plate 23, a reaction chamber 46 for reacting the combined carrier plate 23, the carrier ring 22 and the substrate 21, and a dust adsorption device 45 and a monitoring camera 47. The transmission device 100 mainly uses the transport robot 30 to transport the carrier plate 23, the carrier ring 22 and the substrate 21, and cooperates with the combination and separation device 49 to combine and separate the three. Therefore, the transmission device 100 is centered on the transport robot 30, and other components are arranged around the transport robot 30.

[0035] Based on the above structure, the combination and splitting method of this embodiment includes the following steps.

[0036] S1: Calibrate the relative position and attitude angle relationship between the transport robot 30 and the substrate aligner 41 , and calibrate the relative position and attitude angle relationship between the transport robot 30 and the position identifier 48 .

[0037] S2: Calibrate the relative position and attitude angle relationship between the substrate calibrator 41 and the position identifier 48.

[0038] In steps S1 and S2, the positions of the various components are confirmed, and accurate transportation can then be achieved.

[0039] S3: Identify the through hole center coordinates of the through hole through a position identifier.

[0040] In this step, the ring carrier 133 is photographed by an industrial camera to identify the center coordinates (x1, y1) of the through hole.

[0041] S4: Control the lifting platform to pass through the through hole and rise to the ring-carrying platform.

[0042] Generally, the lifting platform 140 is raised to a height higher than the top surface of the ring-carrying platform 133 by a certain distance, such as Figure 4 .

[0043] S5: placing the assembly of the carrier plate and the carrier ring on the lifting platform.

[0044] Specifically, according to the pre-calibrated and taught points, the transport robot 30 takes out the combination of the carrier ring 22 and the carrier plate 23 that was pre-assembled manually and placed in the silo 44 from the silo 44 and places it on the lifting platform 140 of the assembly and separation device 49.

[0045] S6: Identify the combined center coordinates of the combination of the carrier plate and the carrier ring through a position identifier.

[0046] Specifically, the industrial camera 48 takes a picture of the combination of the carrier ring 22 and the carrier plate 23 on the lifting platform 140, identifies the coordinates (x2, y2) of the camera coordinate system of the center of the center hole of the carrier ring 22, and the posture angle θ2 of the carrier ring 22.

[0047] S7: Adjust the position of the assembly of the carrier plate and the carrier ring to control the deviation between the through hole center coordinate and the assembly center coordinate to be within an allowable range.

[0048] Calculate the deviation between the coordinates (x1, y1) and the coordinates (x2, y2), dx1=x1-x2, dy1=y1-y2, according to the previously taught points and the deviation calculation results (dx1, dy1, the handling robot 30 picks up the carrier ring 22 and carrier plate 23 assembly from the lifting platform 140, and after adjusting the placement point of the assembly according to the deviation calculation results (dx1, dy1), the handling robot 30 puts the carrier ring 22 and carrier plate 23 assembly back to the lifting platform 140, so that the deviation (dx1, dy1) of the coordinates of the center point of the center hole of the carrier ring 22 (x2, y2) and the coordinates of the center point of the center circular hole of the ring carrier platform 133 (x1, y1) is within the allowable error range.

[0049] S8: Control the lifting platform to pass through the through hole and descend to the ring-carrying platform, the plate-carrying ring remains on the ring-carrying platform, and the plate-carrying plate descends with the lifting platform.

[0050] The lifting platform 140 is lowered until the height of the lifting platform is lower than the top surface of the ring-carrying platform 133 by a certain distance. Figure 5 Since the outer diameter of the plate carrier ring 22 is larger than the diameter of the central hole of the ring carrier platform 133 and the outer diameter of the plate carrier plate 22 is smaller than the diameter of the central hole of the ring carrier platform 133 , the plate carrier plate 22 descends with the lifting platform 140 and the plate carrier ring 22 remains on the ring carrier platform 133 .

[0051] S9: Move the plate carrier out, and control the lifting platform to pass through the through hole and rise to the ring carrier.

[0052] According to the previously taught points, the handling robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the silo 44. The lifting platform 140 rises until the height of the lifting platform is higher than the top surface of the ring carrier 133 by a certain distance. Figure 6 .

[0053] S10: Place the substrate into the substrate calibrator to calibrate its position and posture.

[0054] According to the points taught in advance, the handling robot 30 takes the substrate 21 that was manually placed in the material box from the substrate material box 42 and puts it into the substrate calibrator 41. According to the pre-set center position and attitude angle θ3 of the substrate 42, the substrate calibrator 41 identifies and adjusts the center position and attitude angle θ3 of the substrate 42 to the set values ​​to ensure that when the substrate 21 and the carrier ring 22 form a combination in the subsequent steps, the deviation between the center coordinates (x3, y3) of the substrate 21 and the center coordinates (x2, y2) of the center hole of the carrier ring 22 is within the allowable range, and the deviation between the attitude angle θ3 of the substrate 21 and the attitude angle θ2 of the carrier ring 22 is within the allowable range.

[0055] S11: placing the substrate on the lifting platform, controlling the lifting platform to descend to the ring carrier through the through hole, and the substrate remains on the plate carrier ring.

[0056] According to the previously taught points, the transport robot 30 takes the substrate 21 from the substrate calibrator 41 and places it on the lifting platform 140. The lifting platform 140 descends until the height of the lifting platform 140 is a certain distance below the top surface of the carrier ring platform 133. Since the outer diameter of the substrate 21 is larger than the diameter of the central hole of the carrier ring 22, the substrate 21 falls on the carrier ring 22, thereby completing the combination of the substrate 21 and the carrier ring 22.

[0057] S12: Identify the center coordinates of the carrier ring and the center coordinates of the substrate through a position identifier, and identify the upper surface height of the carrier ring and the upper surface height of the substrate through a height measuring sensor.

[0058] If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is within the allowable range, and the height difference between the upper surfaces of the carrier ring and the substrate is within the allowable range; then the carrier plate is placed on the lifting platform, and the lifting platform is controlled to rise through the through hole to the carrier ring platform to combine the carrier plate, the carrier ring and the substrate.

[0059] If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the carrier ring and the upper surface of the substrate is not within the allowable range, the substrate is placed back into the substrate calibrator by the handling robot to re-calibrate the position and posture.

[0060] If multiple calibrations are unsuccessful, the clearing action is performed. According to the previously taught points, the transport robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the silo 44, and an alarm is sounded.

[0061] Specifically, the industrial camera 48 takes a picture of the combination of the substrate 21 and the carrier ring 22 on the carrier ring table 133, identifies the center coordinates (x3, y3) and the attitude angle θ3 of the substrate 21, identifies the center coordinates (x2, y2) and the attitude angle θ2 of the center hole of the carrier ring 22, and determines whether the deviation between the center coordinates (x3, y3) of the substrate 21 and the center coordinates (x2, y2) of the center hole of the carrier ring 22 is within the allowable range, and whether the deviation between the attitude angle θ3 of the substrate 21 and the attitude angle θ2 of the carrier ring 22 is within the allowable range. At the same time, a laser altimeter is used to detect whether the deviation between the upper surface plane height h3 of the substrate 21 and the upper surface plane height h2 of the carrier ring 22 is within the allowable range.

[0062] S13: placing the carrier plate on the lifting platform, and controlling the lifting platform to rise to the carrier ring platform through the through hole to combine the carrier plate, the carrier ring and the substrate.

[0063] According to the previously taught points, the handling robot 30 takes the plate carrier 23 from the silo 44 and places it on the lifting platform 140. The lifting platform 140 of the assembly and separation device 49 is raised until the height of the lifting platform is higher than the top surface of the ring carrier 133 by a certain distance. Since the outer diameter of the plate carrier 22 is smaller than the diameter of the central hole of the ring carrier 133, the plate carrier 22 lifts up the combination of the substrate 21 and the plate carrier ring 22 as the lifting platform 140 is raised, thereby completing the combination of the substrate 21, the plate carrier ring 22 and the plate carrier 23.

[0064] The combined carrier plate 23, carrier ring 22 and substrate 21 are transported by the transport robot 30 to the reaction chamber 46 for reaction. After the reaction is completed, they are transported to the assembly and disassembly device 49 for disassembly. The specific disassembly steps are as follows.

[0065] S14: The lifting platform 140 of the combined splitting device 49 rises until the height of the lifting platform is a certain distance higher than the top surface of the carrier ring platform 133. According to the previously taught points, the transport robot 30 takes the combination of the substrate 21, the carrier ring 22 and the carrier plate 23 from the reaction chamber 46 and places it on the lifting platform 140.

[0066] S15: The lifting platform 140 of the combined splitting device 49 descends until the height of the lifting platform is a certain distance lower than the top surface of the ring-carrying platform 133. Since the outer diameter of the carrier ring 22 is larger than the diameter of the central circular hole of the ring-carrying platform 133, and the outer diameter of the carrier plate 22 is smaller than the diameter of the central circular hole of the ring-carrying platform 133, the carrier plate 22 descends with the lifting platform 140, and the combination of the substrate 21 and the carrier ring 22 remains on the ring-carrying platform 133, thereby completing the splitting of the combination of the carrier plate 22 and the substrate 21 and the carrier ring 22.

[0067] S16 : According to the previously taught points, the transport robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the silo 44 .

[0068] S17: The lifting platform 140 of the combined splitting device 49 is raised until the height of the lifting platform is higher than the top surface of the carrier ring platform 133 by a certain distance. The substrate 21 is lifted up with the lifting platform 140 and is pushed away from the carrier ring 22, thereby completing the splitting of the substrate 21 and the carrier ring 22.

[0069] S18: The industrial camera 48 detects whether the substrate 21 on the lifting platform 140 is successfully separated from the substrate carrier ring 22. If yes, step S19 is executed, otherwise, an alarm is issued to prompt manual intervention.

[0070] S19 : According to the previously taught points, the transport robot 30 takes the substrate 21 from the lifting platform 140 and puts it into the substrate material box 42 .

[0071] The present application includes multiple embodiments of simple structures and relatively complex structures. The above-mentioned splitting method is based on the steps of the relatively complex structure. For the combined splitting device of the simple structure, the process of the splitting method is similar and can be directly determined based on the above-mentioned splitting method. It also belongs to the protection scope of the present application and will not be repeated here.

[0072] The present application uses vision to accurately locate the center position and angular direction of the carrier plate, carrier ring, and substrate. Through vision and the robot's hand-eye calibration, the robot can perform position correction based on the visually identified positions of the carrier plate, carrier ring, and substrate, and complete the alignment of the carrier plate, carrier ring, and substrate with high precision, thereby ensuring that the assembly accuracy of the combination is improved.

[0073] In the above description of this specification, unless otherwise clearly specified and limited, the terms "fixed", "installed", "connected" or "connected" should be understood in a broad sense. For example, with regard to the term "connection", it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. Therefore, unless otherwise clearly defined in this specification, those skilled in the art can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0074] According to the above description of this specification, those skilled in the art may also understand that the terms used below, such as "up", "down", "front", "back", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", "center", "longitudinal", "lateral", "clockwise" or "counterclockwise", etc., which indicate the orientation or position relationship, are based on the orientation or position relationship shown in the drawings of this specification, and are only for the purpose of facilitating the explanation of the scheme of the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or element involved must have the specific orientation, be constructed and operate in a specific orientation. Therefore, the above-mentioned orientation or position relationship terms cannot be understood or interpreted as limitations on the scheme of the present invention.

[0075] In addition, the terms "first" or "second" used in this specification to refer to numbers or ordinals are only used for descriptive purposes and cannot be understood as explicitly or implicitly indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this specification, the meaning of "plurality" is at least two, such as two, three or more, etc., unless otherwise clearly and specifically defined.

[0076] Although this specification has shown and described a plurality of embodiments of the present invention, it is apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will think of many changes, modifications and alternatives without departing from the thought and spirit of the present invention. It should be understood that in the process of practicing the present invention, various alternatives to the embodiments of the present invention described herein may be adopted. The attached claims are intended to define the scope of protection of the present invention, and therefore cover the modular composition, equivalent or alternatives within the scope of these claims.

Claims

1. A combined splitting device, characterized in that: The combined disassembly device is used for the combined disassembly of a carrier plate, a carrier ring and a substrate, and comprises: a carrier ring platform and a lifting platform, wherein the carrier ring platform is formed with a through hole, and the lifting platform can be movably arranged in the vertical direction through the through hole; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring.

2. The assembly and separation device according to claim 1, characterized in that: The combined splitting device also includes a position identifier, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction, and is used to identify the center position of the ring-carrying platform and the lifting platform, and is also used to identify the center position of the plate carrier, plate carrier ring or substrate on the ring-carrying platform and the lifting platform.

3. The assembly and separation device according to claim 1, characterized in that: The combined disassembly device further comprises a height measuring sensor, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction and is used to identify the upper surface height of the plate-carrying ring and the upper surface height of the substrate.

4. A transmission device, characterized in that: The transmission equipment includes a combined splitting device and a transport robot as described in any one of claims 1 to 3, and the transport robot is used to transport the carrier plate, carrier ring and substrate to the carrier ring platform or the lifting platform, and is also used to adjust the posture position of the carrier plate, carrier ring or substrate on the carrier ring platform and the lifting platform.

5. The transmission device according to claim 4, characterized in that: The transport device further includes a substrate calibrator, which is used to adjust the position and posture of the substrate.

6. A combination splitting method, characterized in that: The combined disassembly method is used to combine and disassemble a carrier plate, a carrier ring and a substrate by a combined disassembly device, wherein the combined disassembly device comprises: a carrier ring platform and a lifting platform, wherein the carrier ring platform is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring; the combined disassembly method comprises: Controlling the lifting platform to pass through the through hole and rise on the ring-carrying platform; Placing the combination of the carrier plate and the carrier ring on the lifting platform; Control the lifting platform to pass through the through hole and descend to the ring-carrying platform, the plate-carrying ring remains on the ring-carrying platform, and the plate-carrying plate descends along with the lifting platform; The plate carrier is moved out, and the lifting platform is controlled to pass through the through hole and rise to the ring carrier; placing the substrate on the lifting platform; Control the lifting platform to pass through the through hole and descend to the ring-carrying platform, and the substrate remains on the plate-carrying ring; The carrier plate is placed on the lifting platform, and the lifting platform is controlled to pass through the through hole and rise to the carrier ring platform to combine the carrier plate, the carrier ring and the substrate.

7. The combination and separation method according to claim 6, characterized in that: The assembly and disassembly device further includes a position identifier, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction. The assembly and disassembly method further includes: Before placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the through hole center coordinates of the through hole by a position identifier; After placing the combination of the plate carrier plate and the plate carrier ring on the lifting platform, identifying the combination center coordinates of the combination of the plate carrier plate and the plate carrier ring by a position identifier; The position of the combination of the carrier plate and the carrier ring is adjusted to control the deviation between the center coordinate of the through hole and the center coordinate of the combination within an allowable range.

8. The combination and separation method according to claim 7, characterized in that: The combined disassembly device is also associated with a handling robot and a substrate calibrator, and the handling robot is also connected to the position identifier, and is used to carry the plate carrier, the plate carrier ring and the substrate to the ring carrier table or the lifting table, and is used to adjust the posture position of the plate carrier, the plate carrier ring or the substrate on the ring carrier table and the lifting table according to the identification information of the position identifier; The combined splitting method also includes: Before placing the substrate on the lifting platform, the position and posture of the substrate is calibrated by a substrate calibrator.

9. The combination and separation method according to claim 8, characterized in that: The assembly and disassembly device further includes a height measuring sensor, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction. The assembly and disassembly method further includes: After the lifting platform is controlled to pass through the through hole and descend to the carrier ring platform and the substrate remains on the carrier ring, the center coordinates of the carrier ring and the center coordinates of the substrate are identified by a position identifier; the height of the upper surface of the carrier ring and the height of the upper surface of the substrate are identified by a height measuring sensor; If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is within the allowable range, and the height difference between the upper surface of the carrier ring and the substrate is within the allowable range; The carrier plate is placed on the lifting platform, and the lifting platform is controlled to pass through the through hole and rise to the carrier ring platform to combine the carrier plate, the carrier ring and the substrate.

10. The combination and separation method according to claim 9, characterized in that: If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the upper surface of the carrier ring and the substrate is not within the allowable range; The substrate is then placed back into the substrate calibrator by the transport robot to recalibrate the position and posture.

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