Magnetic deviation correcting device for fluid mass transfer local array LED chips and transfer method

Abstract

The invention discloses a fluid mass transfer local array LED chip magnetic force deviation rectifying device and transfer method, and relates to the technical field of semiconductors, the device comprises an X motion platform, a Y motion platform, a deviation rectifying magnetic needle assembly, a camera assembly, a chip transfer assembly and a deviation rectifying platform, the Y motion platform is fixed to the power output end of the X motion platform, and the X motion platform is fixed to the power output end of the Y motion platform; the deviation rectifying magnetic needle assembly and the camera assembly are both fixed to the power output end of the Y motion platform, the chip transferring assembly is arranged under the deviation rectifying magnetic needle assembly and the camera assembly, and the deviation rectifying platform is arranged under the chip transferring assembly. According to the magnetic correction device and the transfer method for the fluid mass transfer of the local array LED chips, correction of the LED chips which fail to transfer on the transfer substrate in the correction platform is completed on the premise that the successfully transferred LED chips are not affected, and the magnetic correction device and the transfer method have the advantages of being high in adjustment precision, free of damage to the chips and capable of being repeatedly used.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a magnetic deviation correction device and a transfer method for a local array LED chip for massive fluid transfer. Background Art

[0002] Mini / Micro LED technology is developing rapidly as a cutting-edge innovation in the display field. With the reduction in the size of LED chips, display devices are rapidly developing in the direction of high resolution and high brightness. Mass transfer technology is the core of achieving high-efficiency display panel manufacturing. At present, a variety of technical paths have been explored in the field of mass transfer of Mini / Micro LED technology, covering precise pick-up-and-release technology, laser peeling technology, roller transfer technology, and self-assembly transfer technology. Among these technical solutions, self-assembly transfer technology is particularly prominent due to its unique advantages. This technology relies on fluid force and magnetic force to drive the chip to complete the transfer. Compared with other transfer technologies, it can transfer chips with smaller sizes and more complex structures, and the number of transfers is far more than other technologies. It is the most promising transfer method.

[0003] In the existing technology, patent application CN202311564639.8 proposes a method for mass transfer of magnetic self-assembly with magnetic force alignment and fluid alignment. The magnetic N electrode of the LED chip is controlled by an external solenoid coil to be close to the circuit board and the non-magnetic P electrode is controlled to fall away from the circuit board. At the same time, the falling LED chip is attracted, fixed and adjusted by the micro-magnetic needle under the circuit board and the flow field. Since the N-type electrode of the chip is magnetic, it maintains a stable posture in the fluid and falls to the substrate. Only the magnetic needle provides magnetic attraction to the N-type electrode. When the flow field is aligned, the P-type electrode will not be on the substrate solder joint, and welding cannot be completed, affecting the transfer efficiency and yield.

[0004] Patent application CN202410998883.3 proposes a permanent magnetic transfer device and method for microchips with zero bias magnetic field. Through the attraction of the zero bias permanent magnetic array magnetic needles on the magnetic LED chip in the flow field, the magnetic needles move to the solder joint position on the transfer substrate under the action of the magnetic needles, and the transfer is completed by straightening the posture under the action of the flow field. Because the magnetic needles are placed in an array, the magnetic induction intensity at the tips of some magnetic needles is much greater than that at the tips of other magnetic needles. Excessive magnetic induction intensity will cause the LED chips to stack on the substrate, and the chip posture cannot be regulated by the flow field, resulting in the inability to complete welding, affecting the transfer efficiency and yield.

[0005] Patent application CN202410878847.3 proposes a low-power magnetic circuit decoupled permanent magnetic bias needle for precise microchip grasping. Through the coupling of the electromagnetic magnetic field and the permanent magnetic field and the self-decoupling of the electromagnetic magnetic field, the magnetic induction intensity at the tip of the magnetic needle is controlled to achieve precise fixed attraction of the chip and complete the chip transfer. Since the overall magnetic field of the device needs to be regulated by the electromagnetic coil, it is not possible to adjust the magnetic field intensity at the tip of some of the permanent magnetic needles. If the magnetic field is adjusted when a single magnetic needle attracts multiple chips, the chips at other magnetic needles will also be affected by the magnetic field regulation, thereby affecting the efficiency of the transfer. Summary of the invention

[0006] The purpose of the present invention is to provide a magnetic correction device and transfer method for local array LED chips for mass transfer of fluid, which can correct the LED chips that have failed to be transferred on the transfer substrate in the correction platform while ensuring that the successfully transferred LED chips are not affected. The device has the advantages of high adjustment accuracy, no damage to the chips, and reusability.

[0007] To achieve the above-mentioned purpose, the present invention provides a magnetic deflection correction device for local array LED chips of fluid mass transfer, comprising an X motion platform, a Y motion platform, a deflection correction magnetic needle assembly, a camera assembly, a chip transfer assembly and a deflection correction platform, wherein the Y motion platform is fixed to the power output end of the X motion platform, the deflection correction magnetic needle assembly and the camera assembly are both fixed to the power output end of the Y motion platform, the chip transfer assembly is arranged directly below the deflection correction magnetic needle assembly and the camera assembly, and the deflection correction platform is arranged directly below the chip transfer assembly.

[0008] Preferably, the X motion platform comprises an X motion slide, an X motor, and a left X guide rail and a right X guide rail respectively arranged in parallel on both sides of the X motor, the mover of the X motor is fixedly connected to the X motion slide, the X motion slide is slidably connected to both the left X guide rail and the right X guide rail, and a threaded hole for mounting the Y motion platform is arranged on the side end surface of the X motion slide;

[0009] The Y motion platform is fixed to the X motion slide by bolts, and the Y motion platform includes a magnetic needle slide, a Y motor, a Y upper guide rail arranged in parallel on the upper side of the Y motor, and a Y lower guide rail arranged in parallel on the lower side of the Y motor. The mover of the Y motor is fixedly connected to the magnetic needle slide, and the magnetic needle slide is slidably connected to both the Y upper guide rail and the Y lower guide rail.

[0010] The X motor and the Y motor are both linear drives.

[0011] Preferably, the deflection correction magnetic needle assembly is arranged on the side end surface of the magnetic needle slide, and the deflection correction magnetic needle assembly includes a magnetic needle Z motor, a magnetic needle locking cap and a deflection correction magnetic needle, the deflection correction magnetic needle is sleeved with the magnetic needle locking cap, and the magnetic needle locking cap is fixed to the end of the mover of the magnetic needle Z motor by bolts;

[0012] The material of the deviation-correcting magnetic needle is a permanent magnetic material, and its own magnetic density magnitude is 10mT, 20mT, 30mT, 40mT, 50mT, 60mT, 70mT, and 80mT.

[0013] Preferably, the camera assembly is arranged on the side end face of the magnetic needle slide and is arranged in parallel with the correction magnetic needle assembly. The camera assembly includes a camera, a camera clamp, a light source clamp and a light source. The camera is plugged into the camera clamp, the camera clamp is connected to the light source clamp, and the light source clamp is fixedly connected to the light source.

[0014] Preferably, the chip transfer assembly comprises a transfer substrate, a fluid assembly pool disposed on the transfer substrate, and a positioning array magnetic needle disposed on the fluid assembly pool;

[0015] The positioning array magnetic needles are arranged in an array of 22.5mm x 22.5mm, the spacing between each magnetic needle is 2.5mm, and the diameter of the magnetic needle tip is 0.1mm.

[0016] Preferably, the movement strokes of the deviation-correcting magnetic needle assembly in the X direction and the Y direction are 100 mm and 60 mm respectively.

[0017] Preferably, the electrode at one end of the LED chip is composed of an alloy of one or more elements selected from Au, Ag, Cu, Pt, Mo and one or more elements selected from the magnetic conductive materials Co and Ni.

[0018] A method for transferring a magnetic deviation correction device for a local array LED chip by transferring a large amount of fluid, the steps are as follows:

[0019] S1. After the self-assembly of the fluid magnet is completed, the X-motion platform and the Y-motion platform drive the camera assembly to take photos and samples of the transfer substrate in the correction platform to obtain the position data of the chips with wrong postures and the transfer stacked chips in the transfer substrate;

[0020] S2. After the photo is taken, the X-motion platform and the Y-motion platform drive the correction magnetic needle assembly to move to the position where correction is required, and the magnetic needle Z motor adjusts the correction magnetic needle to the working height;

[0021] S3, the correction magnetic needle adjusts the magnetic field strength at the position where correction is needed, and under the action of the correction magnetic needle, the magnetic field strength at the welding point where correction is needed is weakened;

[0022] S4, turning on the flow field, and correcting the chips with wrong postures and the transferred stacked chips under the joint action of the flow field, the positioning array magnetic needles and the correction magnetic needles;

[0023] S5. After the correction process is completed, the X-motion platform and the Y-motion platform drive the camera assembly to take pictures of the transfer substrate again to confirm the LED chip status on the transfer substrate after the correction process and determine whether the LED chip is aligned.

[0024] Preferably, the magnetic induction intensity 0.5 mm above the needle tip of the positioning array magnetic needle is 70mT-80mT, and when the correction magnetic needle moves above the needle tip of the positioning array magnetic needle, the magnetic induction intensity above the needle tip of the positioning array magnetic needle drops to 20mT-30mT.

[0025] Therefore, the present invention adopts a magnetic correction device and transfer method for the massive transfer of local array LED chips of fluid with the above structure, and uses the positioning array magnetic needles under the transfer substrate to attract the LED chips. At the same time, the correction magnetic needles above the transfer substrate are used to accurately control the magnetic field strength at the chip that failed to be transferred, so that the magnetized LED chip that failed to be transferred can be readjusted. Through the magnetic field coordination of the upper and lower magnetic needles, the chip that failed to be transferred can be corrected without affecting the successfully transferred chip, thereby achieving an accurate self-assembly process and effectively improving the accuracy and efficiency of chip transfer.

[0026] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of an embodiment of a magnetic force deviation correction device for transferring a large amount of fluid to a local array LED chip of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of an X-motion platform according to an embodiment of the present invention;

[0029] Figure 3 It is a schematic diagram of the structure of the Y motion platform according to an embodiment of the present invention;

[0030] Figure 4 This is a schematic structural diagram of a deviation-correcting magnetic needle assembly according to an embodiment of the present invention;

[0031] Figure 5 A schematic diagram of the structure of a camera assembly according to an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the structure of a deviation correction platform according to an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the structure of a deviation-correcting magnetic needle according to an embodiment of the present invention;

[0034] Figure 8 This is a diagram of magnetic induction intensity at 0.5 mm from the tip of the positioning array magnetic needle of an embodiment of the present invention;

[0035] Fig. 9 This is a diagram of the magnetic induction intensity at 0.5 mm from the tip of the positioning array magnetic needle after adding a deviation correction magnetic needle in an embodiment of the present invention;

[0036] Fig.10 This is a schematic diagram of the LED chip before deflection correction according to an embodiment of the present invention;

[0037] Fig.11 Schematic diagram of the LED chip after deflection correction according to an embodiment of the present invention.

[0038] Reference numerals

[0039] 1. X motion platform; 101. Left X rail; 102. X motor; 103. Right X rail; 104. Motion slide; 2. Y motion platform; 201. Y lower rail; 202. Y motor; 203. Y upper rail; 204. Magnetic needle slide; 3. Correction magnetic needle assembly; 301. Magnetic needle Z motor; 302. Magnetic needle lock cap; 303. Correction magnetic needle; 4. Camera assembly; 401. Camera; 402. Camera fixture; 403. Light source fixture; 404. Light source; 5. Chip transfer assembly; 501. Transfer substrate; 502. Fluid assembly pool; 503. Positioning array magnetic needle; 6. Correction platform; 7. LED chip; 701. Normal posture chip; 702. Wrong posture chip; 703. Transfer stack chip. DETAILED DESCRIPTION

[0040] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0041] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0043] Example

[0044] like Figure 1 As shown, a magnetic deflection correction device for local array LED chips of fluid mass transfer comprises an X motion platform 1, a Y motion platform 2, a deflection correction magnetic needle assembly 3, a camera assembly 4, a chip transfer assembly 5 and a deflection correction platform 6. The Y motion platform 2 is fixed to the power output end of the X motion platform 1, the deflection correction magnetic needle assembly 3 and the camera assembly 4 are both fixed to the power output end of the Y motion platform 2, the chip transfer assembly 5 is arranged directly below the deflection correction magnetic needle assembly 3 and the camera assembly 4, and the deflection correction platform 6 is arranged directly below the chip transfer assembly 5.

[0045] like Figure 2 As shown, the X motion platform 1 includes an X motion slide 104, an X motor 102, and a left X guide rail 101 and a right X guide rail 103 respectively arranged in parallel on both sides of the X motor 102, the mover of the X motor 102 is fixedly connected to the X motion slide 104, the X motion slide 104 is slidably connected to the left X guide rail 101 and the right X guide rail 103, and a threaded hole for mounting the Y motion platform 2 is arranged on the side end surface of the X motion slide 104.

[0046] like Figure 3 As shown, the Y motion platform 2 is fixed on the X motion slide 104 by bolts, and the Y motion platform 2 includes a magnetic needle slide 204, a Y motor 202, a Y upper guide rail 203 arranged parallel to the upper side of the Y motor 202, and a Y lower guide rail 201 arranged parallel to the lower side of the Y motor 202. The mover of the Y motor 202 is fixedly connected to the magnetic needle slide 204, and the magnetic needle slide 204 is slidably connected to the Y upper guide rail 203 and the Y lower guide rail 201.

[0047] Both the X motor 102 and the Y motor 202 are linear drives.

[0048] like Figure 4As shown, the deflection correction magnetic needle assembly 3 is arranged on the side end surface of the magnetic needle slide 204, and the deflection correction magnetic needle assembly 3 includes a magnetic needle Z motor 301, a magnetic needle locking cap 302 and a deflection correction magnetic needle 303. The deflection correction magnetic needle 303 is sleeved with the magnetic needle locking cap 302, and the magnetic needle locking cap 302 is fixed to the end of the mover of the magnetic needle Z motor 301 by bolts. The stroke of the magnetic needle Z motor 301 is 5mm; the movement strokes of the deflection correction magnetic needle assembly 3 in the X direction and the Y direction are respectively The diameters of the correcting magnetic needle 303 are 100mm and 60mm respectively; the material of the correcting magnetic needle 303 is permanent magnetic material such as neodymium iron, and the needle head of the correcting magnetic needle 303 can be selected to have a diameter of 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 100μm, 150μm, 200μm, 300μm, 500μm, and 1000μm, which are respectively suitable for Mini / Micro LED chips of different sizes; the magnetic density magnitude of the correcting magnetic needle 303 itself is 10mT, 20mT, 30mT, 40mT, 50mT, 60mT, 70mT, and 80mT, which is suitable for positioning array magnetic needles 503 of different specifications.

[0049] like Figure 5 As shown, the camera assembly 4 is arranged on the side end face of the magnetic needle slide 204, and is arranged in parallel with the correction magnetic needle assembly 3. The camera assembly 4 includes a camera 401, a camera clamp 402, a light source clamp 403 and a light source 404; the camera 401 is plugged into the camera clamp 402, the camera clamp 402 is connected to the light source clamp 403, and the light source clamp 403 is fixedly connected to the light source 404.

[0050] like Figure 6 As shown, the chip transfer component 5 includes a transfer substrate 501, a fluid assembly pool 502 arranged on the transfer substrate 501, and a positioning array magnetic needle 503 arranged on the fluid assembly pool 502. The transfer substrate 501 is sealed and installed in the fluid assembly pool 502, and the fluid assembly pool 502 is fixedly installed on the positioning array magnetic needle 503; the positioning array magnetic needle 503 is arranged in an array of 22.5mmx22.5mm, and the spacing between each magnetic needle is 2.5mm; one end electrode of the LED chip 7 is composed of an alloy of one or more elements of Au, Ag, Cu, Pt, Mo and one or more elements of the magnetic conductive material Co, Ni.

[0051] like Figure 7 As shown, the diameters of the needle tip of the correction magnetic needle 303 are 0.1 mm, 0.2 mm, 0.3 mm, and 0.5 mm for LED chips 7 of different sizes, and the height of the needle tip from the needle platform is 2 mm.

[0052] like Figure 8As shown, when the magnetic induction intensity at the tip of an individual magnetic needle in the positioning array magnetic needle 503 is much greater than the magnetic induction intensity of other magnetic needles, it is easy to cause the attraction of additional chips during the transfer process, and the problem of the chip posture being unable to be adjusted due to excessive magnetic force.

[0053] like Fig. 9 As shown, when the deviation-correcting magnetic needle 303 intervenes, the excessive magnetic induction intensity of the magnetic needle will drop to a value close to the magnetic induction intensity of other magnetic needle tips. At this intensity, only one LED chip 7 can be attracted, and the posture is easily controlled by the flow field.

[0054] like Figure 10-11 As shown, a method for transferring a magnetic deviation correction device for a local array LED chip by transferring a large amount of fluid, the steps are as follows:

[0055] S1. After the self-assembly of the flux magnet is completed, the X motion platform 1 and the Y motion platform 2 drive the camera assembly 4 to take photos and samples of the transfer substrate 501 in the correction platform 6 to obtain the position data of the posture error chip 702 and the transfer stack chip 703 in the transfer substrate 501;

[0056] S2. After the photo is taken, the X motion platform 1 and the Y motion platform 2 drive the correction magnetic needle assembly 3 to move to the position where correction is required, and at the same time, the magnetic needle Z motor 301 adjusts the correction magnetic needle 303 to the working height;

[0057] S3, the correction magnetic needle 303 adjusts the magnetic field strength at the position where correction is needed. Under the action of the correction magnetic needle 303, the magnetic field strength at the welding point where correction is needed is weakened, but the magnetic field strength at other positions is not affected;

[0058] S4, turning on the flow field, and correcting the attitude error chip 702 and the transfer stack chip 703 under the joint action of the flow field, the positioning array magnetic needle 503 and the correction magnetic needle 303;

[0059] S5, after the correction process is completed, the X motion platform 1 and the Y motion platform 2 drive the camera assembly 4 to take pictures of the transfer substrate 501 again, confirm the status of the LED chip 7 on the transfer substrate 501 after the correction process, and determine whether the LED chip 7 is aligned.

[0060] The magnetic induction intensity 0.5 mm above the needle tip of the positioning array magnetic needle 503 is 70 mT-80 mT. When the correction magnetic needle 303 moves above the needle tip of the positioning array magnetic needle 503, the magnetic induction intensity above the needle tip of the positioning array magnetic needle 503 drops to 20 mT-30 mT.

[0061] Specific working process: the camera component 4 takes a picture of the chip transfer component 5 after the flow magnetic self-assembly process is completed to determine the position of the chip 702 with the wrong posture and the transfer stack chip 703. Then the X motion platform 1 and the Y motion platform 2 adjust the correction magnetic needle component 3 to the position where the chip needs to be corrected. The magnetic needle Z motor 301 adjusts the correction magnetic needle 303 to a suitable working height, and turns on the flow field. Under the joint action of the flow field, the correction magnetic needle 303 and the positioning array magnetic needle 503, the chip that failed to transfer is corrected. After the correction is completed, all chips in the transfer substrate 501 are in the state of chips 701 with normal posture.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A magnetic deviation correction device for local array LED chips during massive fluid transfer, characterized in that: The invention comprises an X motion platform, a Y motion platform, a deflection correction magnetic needle assembly, a camera assembly, a chip transfer assembly and a deflection correction platform, wherein the Y motion platform is fixed to the power output end of the X motion platform, the deflection correction magnetic needle assembly and the camera assembly are both fixed to the power output end of the Y motion platform, the chip transfer assembly is arranged directly below the deflection correction magnetic needle assembly and the camera assembly, and the deflection correction platform is arranged directly below the chip transfer assembly.

2. According to claim 1, a magnetic deviation correction device for local array LED chips of fluid mass transfer, characterized in that: The X motion platform includes an X motion slide, an X motor, and a left X guide rail and a right X guide rail respectively arranged in parallel on both sides of the X motor, the mover of the X motor is fixedly connected to the X motion slide, the X motion slide is slidably connected to the left X guide rail and the right X guide rail, and a threaded hole for mounting the Y motion platform is provided on the side end surface of the X motion slide; The Y motion platform is fixed to the X motion slide by bolts, and the Y motion platform includes a magnetic needle slide, a Y motor, a Y upper guide rail arranged in parallel on the upper side of the Y motor, and a Y lower guide rail arranged in parallel on the lower side of the Y motor. The mover of the Y motor is fixedly connected to the magnetic needle slide, and the magnetic needle slide is slidably connected to both the Y upper guide rail and the Y lower guide rail. The X motor and the Y motor are both linear drives.

3. The magnetic force correction device for local array LED chips of fluid mass transfer according to claim 1, characterized in that: The deflection correction magnetic needle assembly is arranged on the side end surface of the magnetic needle slide, and the deflection correction magnetic needle assembly includes a magnetic needle Z motor, a magnetic needle locking cap and a deflection correction magnetic needle, the deflection correction magnetic needle is sleeved with the magnetic needle locking cap, and the magnetic needle locking cap is fixed to the end of the mover of the magnetic needle Z motor by bolts; The material of the deviation-correcting magnetic needle is a permanent magnetic material, and its own magnetic density magnitude is 10mT, 20mT, 30mT, 40mT, 50mT, 60mT, 70mT, and 80mT.

4. The magnetic deviation correction device for local array LED chips of fluid mass transfer according to claim 1, characterized in that: The camera assembly is arranged on the side end surface of the magnetic needle slide and is arranged in parallel with the correction magnetic needle assembly. The camera assembly includes a camera, a camera clamp, a light source clamp and a light source. The camera is plugged into the camera clamp, the camera clamp is connected to the light source clamp, and the light source clamp is fixedly connected to the light source.

5. The magnetic force correction device for local array LED chips during fluid mass transfer according to claim 1, characterized in that: The chip transfer assembly comprises a transfer substrate, a fluid assembly pool disposed on the transfer substrate, and a positioning array magnetic needle disposed on the fluid assembly pool; The positioning array magnetic needles are arranged in an array of 22.5mm x 22.5mm, the spacing between each magnetic needle is 2.5mm, and the diameter of the magnetic needle tip is 0.1mm.

6. The magnetic force correction device for local array LED chips during fluid mass transfer according to claim 3, characterized in that: The movement strokes of the deviation-correcting magnetic needle assembly in the X and Y directions are 100 mm and 60 mm respectively.

7. A method for transferring a large amount of fluid to a local array LED chip magnetic correction device as claimed in any one of claims 1 to 6, characterized in that: Here are the steps: S1. After the self-assembly of the fluid magnet is completed, the X-motion platform and the Y-motion platform drive the camera assembly to take photos and samples of the transfer substrate in the correction platform to obtain the position data of the chips with wrong postures and the transfer stacked chips in the transfer substrate; S2. After the photo is taken, the X-motion platform and the Y-motion platform drive the correction magnetic needle assembly to move to the position where correction is required, and the magnetic needle Z motor adjusts the correction magnetic needle to the working height; S3, the correction magnetic needle adjusts the magnetic field strength at the position where correction is needed, and under the action of the correction magnetic needle, the magnetic field strength at the welding point where correction is needed is weakened; S4, turning on the flow field, and correcting the chips with wrong postures and the transferred stacked chips under the joint action of the flow field, the positioning array magnetic needles and the correction magnetic needles; S5. After the correction process is completed, the X-motion platform and the Y-motion platform drive the camera assembly to take pictures of the transfer substrate again to confirm the arrangement of the LED chips on the transfer substrate after the correction process and determine whether the LED chips are aligned.

8. The method for transferring a large amount of fluid to a local array LED chip magnetic correction device according to claim 7, characterized in that: The magnetic induction intensity at 0.5 mm above the needle tip of the positioning array magnetic needle is 70 mT-80 mT. When the deviation correction magnetic needle moves above the needle tip of the positioning array magnetic needle, the magnetic induction intensity above the needle tip of the positioning array magnetic needle drops to 20 mT-30 mT.

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