Heat dissipation device and manufacturing method of heat dissipation device

Abstract

The invention discloses a heat dissipation device and a manufacturing method of the heat dissipation device, the heat dissipation device comprises a cover body and a bottom plate assembly, the bottom plate assembly comprises a heat dissipation cavity, a plurality of heat conduction pieces are arranged in a first area of the heat dissipation cavity at first intervals, a plurality of heat conduction pieces are arranged in a second area of the heat dissipation cavity at second intervals, and the heat conduction pieces are arranged in the first area of the heat dissipation cavity at first intervals. The first interval is smaller than the second interval; the cover body at least covers the heat dissipation cavity, and the cover body is provided with a liquid inlet and a liquid outlet which are communicated with the heat dissipation cavity; under the condition that the chip is in an installation state, the face, away from the cover body, of the bottom plate assembly makes contact with the chip, the third area of the chip corresponds to the first area, the fourth area of the chip corresponds to the second area, and the temperature of the third area is higher than that of the fourth area.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation equipment, and in particular to a heat dissipation device and a method for manufacturing the heat dissipation device. Background Art

[0002] Since the advent of semiconductor integrated circuits in the late 1950s, they have been developing rapidly towards smaller size, higher speed, and larger storage capacity. However, with the advent of the post-Moore era, the growth of integrated circuit transistor density has slowed down. Especially in the fifth-generation mobile communication technology (5G), the Internet of Things, high-performance computing, and other high-computing power application fields, engineers have begun to explore the use of multi-layer packaging technology on larger chips to achieve significant improvements in computing power within a limited space. Therefore, higher requirements are also placed on the heat dissipation design of chips. On this basis, with the advancement of complex packaging processes and the introduction of the concept of large and small cores, non-uniform heating chips have begun to appear. Non-uniform heating chips will have extremely high heat flux locally, resulting in local hot spots.

[0003] However, most of the heat dissipation devices in the related art are based on conventional microchannel designs with uniform heat sources, and have poor heat dissipation effects on non-uniform heat-generating chips. Summary of the invention

[0004] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device, which can solve the problem of poor heat dissipation effect on non-uniform heat generation chips in the related art.

[0005] In order to solve the above problems, this application adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present application discloses a heat dissipation device, comprising: a cover body and a base plate assembly, wherein: the base plate assembly comprises a heat dissipation chamber, a first area of ​​the heat dissipation chamber arranges a plurality of heat-conducting members at a first interval, and a second area of ​​the heat dissipation chamber arranges a plurality of heat-conducting members at a second interval, wherein the first interval is smaller than the second interval; the cover body at least covers the heat dissipation chamber, and the cover body is provided with a liquid inlet and a liquid outlet connected to the heat dissipation chamber; when the chip is in an installed state, the surface of the base plate assembly away from the cover body contacts the chip, the third area of ​​the chip corresponds to the first area, and the fourth area of ​​the chip corresponds to the second area, wherein the temperature of the third area is higher than the temperature of the fourth area.

[0007] In a second aspect, an embodiment of the present application discloses a method for manufacturing a heat dissipation device, comprising: welding a cover body, a liquid separator plate and a jet plate in sequence to form a first body of the heat dissipation device; welding a frame plate and a bottom plate in sequence to form a second body of the heat dissipation device, wherein the frame plate is provided with a heat dissipation chamber; welding the first body and the second body in sequence to form the heat dissipation device.

[0008] The embodiment of the present application provides a heat dissipation device, by arranging denser heat-conducting parts in the first area of ​​the heat dissipation chamber of the base plate assembly, and arranging sparser heat-conducting parts in the second area of ​​the heat dissipation chamber, the high temperature area of ​​the chip corresponds to the first area, and the low temperature area of ​​the chip corresponds to the second area. When the chip is dissipating heat, the liquid flows into the heat dissipation chamber through the liquid inlet opened in the cover body, and then the liquid in the heat dissipation chamber flows out through the liquid outlet opened on the cover body, which can achieve local high heat control of the chip while maintaining good temperature uniformity, and improve the heat dissipation effect of the non-uniform heat generation chip. In addition, by dissipating heat from the chip through the heat dissipation device provided by the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, and the service life and packaging life of the high-power large chip can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic diagram of the structure of a heat dissipation device disclosed in an embodiment of the present application;

[0010] Figure 2 A schematic diagram of the structure of a base plate assembly disclosed in an embodiment of the present application;

[0011] Figure 3 A schematic diagram of the structure of a heat conducting member disclosed in an embodiment of the present application;

[0012] Figure 4 A schematic diagram of liquid flow direction of a liquid separation plate disclosed in an embodiment of the present application;

[0013] Figure 5 A schematic diagram of the structure of a jet plate disclosed in an embodiment of the present application;

[0014] Figure 6 A cross-sectional view of a heat dissipation device disclosed in an embodiment of the present application;

[0015] Figure 7 A schematic diagram of the structure of a frame plate disclosed in an embodiment of the present application;

[0016] Figure 8 This is a flow chart of a method for manufacturing a heat dissipation device disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0018] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0019] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device. Figure 1 is a schematic diagram of the structure of a heat dissipation device disclosed in an embodiment of the present application, Figure 2 This is a schematic structural diagram of a base plate assembly disclosed in an embodiment of the present application.

[0020] like Figure 1 and Figure 2 As shown, the heat dissipation device disclosed in the present application includes: a cover body 100 and a base plate assembly 200, wherein: the base plate assembly 200 includes a heat dissipation chamber, a first area 222 of the heat dissipation chamber arranges a plurality of heat-conducting members 221 at a first interval, and a second area 223 of the heat dissipation chamber arranges a plurality of heat-conducting members 221 at a second interval, wherein the first interval is smaller than the second interval; the cover body 100 at least covers the heat dissipation chamber, and the cover body 100 is provided with a liquid inlet 110 and a liquid outlet 120 connected to the heat dissipation chamber; when the chip is in an installed state, the surface of the base plate assembly 200 away from the cover body 100 contacts the chip, the third area of ​​the chip corresponds to the first area 222, and the fourth area of ​​the chip corresponds to the second area 223, wherein the temperature of the third area is higher than the temperature of the fourth area.

[0021] It should be noted that the height of the heat conducting member 221 is smaller than the height of the heat dissipation chamber. For example, Figure 3 As shown, the height h of the heat conducting member 221 is pin It can be 0.7 to 0.8 times the height of the heat dissipation chamber. In addition, the thickness of the cover 100 can be 300-500 μm, and the diameters of the liquid inlet 110 and the liquid outlet 120 can be 5-8 mm.

[0022] With the heat dissipation device disclosed in the present application, liquid enters the heat dissipation chamber through the liquid inlet 110 opened on the cover body 100, and heat conduction is carried out by contacting the heat conductive member 221 with the liquid in the heat dissipation chamber to achieve heat dissipation for the chip arranged under the base plate assembly 200, and then the liquid in the heat dissipation chamber flows out through the liquid outlet 120 opened on the cover body 100.

[0023] The solution disclosed in the present application arranges the heat-conducting components 221 relatively densely in the first area 222 of the base plate assembly 200 corresponding to the high heat flux density area of ​​the chip, that is, the surface area of ​​the heat-conducting components 221 in contact with the liquid in the first area 222 is relatively large, and arranges the heat-conducting components 221 relatively sparsely in the second area 223 of the base plate assembly 200 corresponding to the low heat flux density area of ​​the chip, that is, the surface area of ​​the heat-conducting components 221 in contact with the liquid in the second area 223 is relatively small. This can achieve local high heat control of the chip while maintaining good temperature uniformity, thereby improving the heat dissipation effect of the chip with non-uniform heat generation.

[0024] The embodiment of the present application provides a heat dissipation device, by arranging denser heat-conducting members 221 in the first area 222 of the heat dissipation chamber of the base plate assembly 200, and arranging sparser heat-conducting members 221 in the second area 223 of the heat dissipation chamber, the high temperature area of ​​the chip corresponds to the first area 222, and the low temperature area of ​​the chip corresponds to the second area 223. When the chip is dissipating heat, the liquid flows into the heat dissipation chamber through the liquid inlet 110 opened on the cover body 100, and then the liquid in the heat dissipation chamber flows out through the liquid outlet 120 opened on the cover body 100, which can achieve local high heat control of the chip while maintaining good temperature uniformity, and improve the heat dissipation effect of the non-uniform heat generation chip. In addition, by dissipating heat from the chip through the heat dissipation device provided by the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, and the service life and packaging life of the high-power large chip can be guaranteed.

[0025] In the present application, the heat conducting member 221 may be a micro-needle tooth. Using the micro-needle tooth as the heat conducting member 221 can effectively enhance the overall heat exchange effect, avoid the occurrence of local hot spots, and achieve better temperature control for high heat flux density areas. It should be noted that the micro-needle tooth may be a rectangular columnar structure, which is not specifically limited in the present application.

[0026] In one implementation, when the heat conductive member 221 is a rectangular columnar structure, the spacing length between the heat conductive members 221 may be equal to the width of the bottom surface of the rectangular columnar structure, that is, the bottom surface width of the heat conductive member 221 disposed in the first region 222 is smaller than the bottom surface width of the heat conductive member 221 disposed in the second region 223. When the heat conductive member 221 is a square columnar structure, the spacing length between the heat conductive members 221 may be equal to the side length of the bottom surface square of the square columnar structure, that is, the bottom surface square of the heat conductive member 221 disposed in the first region 222 is smaller than the bottom surface square of the heat conductive member 221 disposed in the second region 223. For example, Figure 3 As shown, the side length d of the bottom square of the heat conducting member 221 disposed in the first area 222 is pin It can be 150-300um, the first interval w pin The side length d of the bottom square of the heat conducting member 221 disposed in the second region 223 may be 150-300 um. pin It can be 300-500um, the second interval w pin In addition, the height of the heat conductive member 221 arranged in the first area 222 and the height of the heat conductive member 221 arranged in the second area 223 can be set according to actual heat dissipation requirements. For example, the height of the heat conductive member 221 arranged in the first area 222 is set to be greater than the height of the heat conductive member 221 arranged in the second area 223.

[0027] In the embodiments of the present application, Figure 1 As shown, the heat dissipation device may further include a flow uniforming component 300, wherein the flow uniforming component 300 includes a plurality of flow uniforming channels and a plurality of drainage channels, wherein the flow uniforming channels and the drainage channels are alternately arranged, wherein the plurality of flow uniforming channels are connected to the liquid inlet 110, wherein a plurality of liquid outlet holes are arranged at intervals in the flow uniforming channel, wherein the liquid outlet holes are connected to the flow uniforming channel and the heat dissipation chamber, and wherein the plurality of drainage channels are connected to the liquid outlet 120 and the heat dissipation chamber.

[0028] The multiple flow channels and the multiple drainage channels on the flow equalizer assembly 300 can be arranged alternately along the preset direction of the flow equalizer assembly 300. For example, the drainage channels 1, 3, and 5 and the flow equalizer channels 2, 4, and 6 are arranged in the preset direction of the flow equalizer assembly 300. The liquid outlet holes can be arranged in one row or in multiple rows along the flow equalizer channels. For example, the diameter of the liquid outlet holes can be 0.8-1.2 mm, and the intervals between the liquid outlet holes can be 2.5-4 mm.

[0029] When cooling the chip, the liquid flows into the multiple flow channels on the flow-uniform component 300 through the liquid inlet 110 provided on the cover 100. After the liquid flows uniformly in each flow channel, it vertically impacts the heat dissipation chamber with the heat conductor 221 through the liquid outlet hole to complete the distributed jet and cool the chip. Then the liquid flows out from the liquid outlet 120 through the drainage channel. The design of the liquid outlet hole adopted in this application can increase the flow rate of the liquid flowing downward, thereby increasing the disturbance and enhancing the heat exchange. The heat dissipation chamber can provide a mixed flow space, extend the jet path, and enhance the heat dissipation effect.

[0030] The heat dissipation device disclosed in the present application can improve the overall heat exchange effect, reduce flow resistance, and improve temperature uniformity by adding a flow-uniformizing component 300 between the cover body 100 and the bottom plate component 200.

[0031] In one implementation, the liquid discharge channel may be a strip-shaped liquid discharge frame, thereby increasing the outflow speed of the liquid.

[0032] In an embodiment of the present application, the uniform flow component 300 may include a liquid separation plate 310 and a jet plate 320, the liquid separation plate 310 includes the multiple uniform flow channels 311 and the multiple drainage channels 312, the jet plate 320 includes the multiple liquid outlet holes 321 and the multiple drainage frames 322, the liquid outlet holes 321 correspond to the uniform flow channels 311, the drainage frames 322 correspond to the drainage channels 312, and the drainage frames 322 connect the drainage channels 312 and the heat dissipation chamber.

[0033] In the present application, the uniform flow assembly 300 may be composed of a liquid separation plate 310 and a jet plate 320. The flow direction of the liquid on the liquid separation plate 310 is as follows: Figure 4 As shown, the liquid separation plate 310 includes a plurality of uniform flow channels 311 and a plurality of drainage channels 312, and the plurality of uniform flow channels 311 and the plurality of drainage channels 312 can be arranged alternately along the preset direction of the liquid separation plate 310, for example, along the preset direction of the liquid separation plate 310, the drainage channels are arranged in the order of 1, 3, 5, and the uniform flow channels are arranged in the order of 2, 4, 6. Exemplarily, the thickness of the liquid separation plate 310 can be 1-1.5 mm, the plurality of uniform flow channels can be a rake-shaped structure, the plurality of drainage channels can also be a rake-shaped structure, the width of the uniform flow channel 311 can be 1-1.5 mm, and the width of the drainage channel 312 can be 1-1.5 mm.

[0034] In one implementation, the liquid separation plate 310 may also include a liquid inlet collecting chamber and a liquid outlet collecting chamber, the liquid inlet collecting chamber is connected to a plurality of uniform flow channels 311, and the liquid outlet collecting chamber is connected to the drainage channel 312. The liquid flowing in through the liquid inlet 110 flows through the liquid inlet collecting chamber and the uniform flow channel 311 in sequence, and the liquid flowing out passes through the drainage channel 312 and the liquid outlet collecting chamber in sequence, and then flows out from the liquid outlet 120.

[0035] The structure of the jet plate 320 is as follows: Figure 5 As shown, the jet plate 320 includes a plurality of liquid outlet holes 321 and a plurality of liquid discharge frames 322. Along the preset direction of the jet plate 320, the liquid discharge frames 1, 3, 5, and the liquid discharge holes 2, 4, 6 are arranged smoothly. It should be noted that the preset direction of the jet plate 320 is the same as the preset direction of the liquid separation plate 310, the liquid discharge frame 322 corresponds to the liquid discharge channel 312, and the liquid outlet hole 321 corresponds to the uniform flow channel 311. Exemplarily, the thickness of the jet plate 320 can be 300-500μm, the liquid discharge frame 322 can be a strip-shaped square frame, the length of the liquid discharge frame 322 can be 20-35mm, and the width of the liquid discharge frame 322 can be 1-1.5mm.

[0036] Figure 6 It is a cross-sectional view of the heat dissipation device. When the chip is cooled, the liquid flows into the multiple uniform flow channels 311 on the liquid separation plate 310 through the liquid inlet 110 opened on the cover body 100. After the liquid flows uniformly in each uniform flow channel 311, it vertically impacts the heat dissipation chamber with the heat conductor 221 through the liquid outlet hole 321 to complete the distributed jet and cool the chip. Then the liquid passes through the drainage frame 322 and the drainage channel 312 in turn and flows out from the liquid outlet 120.

[0037] In the embodiment of the present application, the arrangement area of ​​the uniform flow channel and the drainage channel may be larger than the arrangement area of ​​the heat conducting member 221 on the base plate assembly 200, thereby being able to dissipate heat for the chip more evenly.

[0038] In one implementation, the base plate assembly 200 may include a frame plate 210 and a base plate 220. Figure 7 As shown, the frame plate 210 is provided with the heat dissipation chamber 211, the first area 222 of the bottom plate 220 arranges a plurality of heat conducting members 221 at the first interval, and the second area 223 of the bottom plate 220 arranges a plurality of heat conducting members 221 at the second interval. It should be noted that the positions of the first area 222 and the second area 223 shown in the figure are only an example, and the specific settings of the first area 222 and the second area 223 are not specifically limited in this application.

[0039] For example, the thickness of the frame plate 210 may be 600-1500 μm, and correspondingly, the height of the heat dissipation chamber 211 may be 600-1500 μm, and the length l of the heat dissipation chamber 211 may be 100-1500 μm. cell The width w of the heat dissipation chamber 211 may be 35-40 mm. cell The thickness of the bottom plate 220 may be 30-35 mm, and the thickness of the bottom plate 220 may be 400-600 μm.

[0040] In one implementation, the area of ​​the arrangement region of the heat conducting member 221 on the base plate assembly 200 is larger than the area of ​​the chip, thereby achieving better heat dissipation for the chip.

[0041] Since copper has high thermal conductivity and low cost, the overall material of the heat sink can be red copper.

[0042] The heat sink and the chip are packaged as one to achieve embedded cooling of the chipset, which can reduce the interface thermal resistance. Since the chip is a silicon-based chip, when the chip and the heat sink are welded by diffusion heat, there is a problem of interface reliability risk due to the inconsistent thermal expansion coefficient of copper and silicon. Based on this, in the present application, the heat sink may also include a metal transition layer, which is arranged between the base plate assembly 200 and the chip. The present application separates the base plate assembly 200 from the chip by setting a metal transition layer, which can solve the problem of interface reliability risk due to the inconsistent thermal expansion coefficient of copper and silicon.

[0043] In one implementation, the metal transition layer can be formed by performing TI / NI-Pt-Au sputtering metallization on the surface of the base plate assembly 200 close to the chip. In addition, the temperature of the diffusion heat welding between the chip and the heat sink can be reduced to reduce the impact on the performance of the chip itself.

[0044] The present application also discloses a method for manufacturing a heat dissipation device. Figure 8 As shown, the manufacturing method includes:

[0045] S820, the cover 100, the liquid separation plate 310 and the jet plate 320 are welded in sequence to form a first body of the heat dissipation device.

[0046] S840, welding the frame plate 210 and the bottom plate 220 in sequence to form a second body of the heat dissipation device, wherein the frame plate 210 is provided with a heat dissipation chamber.

[0047] S860: Weld the first body and the second body in sequence to form the heat dissipation device.

[0048] Through the manufacturing method disclosed in the present application, the cover body 100, the liquid separator plate 310 and the jet plate 320 are firstly diffused and welded in sequence to form the first body of the heat dissipation device, the frame plate 210 and the bottom plate 220 are diffused and welded in sequence to form the second body of the heat dissipation device, and then the first body and the second body are diffused and welded or soldered in sequence to form the heat dissipation device. Since the pressure required for diffusion welding of the first body and the second body is smaller than that for diffusion welding of the five layers of the cover body 100, the liquid separator plate 310, the jet plate 320, the frame plate 210 and the bottom plate 220, the possibility of collapse of the heat dissipation chamber can be reduced, and there is no pressure when the first body and the second body are welded by solder, and thus there will be no problem of uneven force on the heat dissipation chamber, which will cause the collapse of the heat dissipation chamber. In addition, the manufacturing method of the heat dissipation device disclosed in the present application can also avoid the phenomenon of liquid channeling of the liquid separator plate 310 and the jet plate 320 caused by misalignment.

[0049] After welding the heat sink, the heat sink is reduced by hydrogen or nitrogen-hydrogen mixed gas to avoid oxidation of the heat sink.

[0050] In addition, the surface of the base plate away from the frame plate 210 can be nano-processed to make the surface smoother, and the surface of the base plate away from the frame plate 210 can be TI / NI-Pt-Au sputtering metallization treated to separate the base plate from the chip and solve the problem of interface reliability risk caused by inconsistent thermal expansion coefficients of copper and silicon.

[0051] In the present application, the cover body 100, the liquid separation plate 310, the jet plate 320, the frame plate 210 and the bottom plate 220 are processed separately. For example, the bottom plate 220 arranged with the heat conductive member 221 can be processed by computer number control (CNC), cutting process or etching process, the cover body 100, the liquid separation plate 310 and the frame plate 210 can be processed by CNC, and the jet plate 320 can be processed by etching process.

[0052] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0053] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A heat dissipation device, characterized in that: include: A cover and base assembly, wherein: The base plate assembly includes a heat dissipation chamber, a first area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a first interval, and a second area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a second interval, wherein the first interval is smaller than the second interval; The cover body at least covers the heat dissipation chamber, and the cover body is provided with a liquid inlet and a liquid outlet communicating with the heat dissipation chamber; When the chip is in an installed state, the surface of the base plate assembly away from the cover body contacts the chip, the third area of ​​the chip corresponds to the first area, and the fourth area of ​​the chip corresponds to the second area, wherein the temperature of the third area is higher than the temperature of the fourth area.

2. The heat dissipation device according to claim 1, characterized in that: It also includes a uniform flow component, which includes a plurality of uniform flow channels and a plurality of drainage channels, the uniform flow channels and the drainage channels are alternately arranged, the plurality of uniform flow channels are connected to the liquid inlet, the uniform flow channel is provided with a plurality of liquid outlet holes at intervals, the liquid outlet holes are connected to the uniform flow channel and the heat dissipation chamber, and the plurality of drainage channels are connected to the liquid outlet and the heat dissipation chamber.

3. The heat dissipation device according to claim 2, characterized in that: The liquid discharge channel is a strip-shaped liquid discharge frame.

4. The heat dissipation device according to claim 2, characterized in that: The uniform flow component includes a liquid separator plate and a jet plate, the liquid separator plate includes the multiple uniform flow channels and the multiple drainage channels, the jet plate includes the multiple liquid outlet holes and the multiple drainage frames, the liquid outlet holes correspond to the uniform flow channels, the drainage frames correspond to the drainage channels, and the drainage frames connect the drainage channels and the heat dissipation chamber.

5. The heat dissipation device according to claim 2, characterized in that: The arrangement area of ​​the flow-uniform channel and the drainage channel is larger than the arrangement area of ​​the heat-conducting member on the bottom plate assembly.

6. The heat dissipation device according to claim 1, characterized in that: The base plate assembly includes a frame plate and a base plate, the frame plate is provided with the heat dissipation chamber, a plurality of heat conducting members are arranged at the first interval in the first area of ​​the base plate, and a plurality of heat conducting members are arranged at the second interval in the second area of ​​the base plate.

7. The heat dissipation device according to claim 1, characterized in that: The area of ​​the arrangement region of the heat conducting member on the base plate assembly is larger than the area of ​​the chip.

8. The heat dissipation device according to claim 1, characterized in that: It also includes a metal transition layer, which is arranged between the base plate component and the chip.

9. A method for manufacturing a heat dissipation device, characterized in that: include: The cover body, the liquid separation plate and the jet plate are welded in sequence to form a first body of the heat dissipation device; Welding the frame plate and the bottom plate in sequence to form the second body of the heat dissipation device, wherein the frame plate is provided with a heat dissipation chamber; The first body and the second body are welded in sequence to form the heat dissipation device.

10. The manufacturing method according to claim 9, characterized in that: Also includes: The surface of the bottom plate away from the frame plate is subjected to nano-processing and metallization processing.

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