Radio frequency circuit and electronic equipment

Abstract

The invention discloses a radio frequency circuit and electronic equipment. The radio frequency circuit comprises a first power amplification module, a second power amplification module, a first radio frequency path, a second radio frequency path, a combiner and an antenna, the combiner is provided with a first input end, a second input end and an output end, the first input end of the combiner is connected with the first power amplification module through a first radio frequency path, the second input end of the combiner is connected with the second power amplification module through a second radio frequency path, and the output end of the combiner is connected with the antenna; wherein a first working frequency band of the first power amplification module is different from a second working frequency band of the second power amplification module; wherein the target insertion loss of the combiner in the second working frequency band is associated with the impedance of the first radio frequency path, and the impedance of the first radio frequency path is adjustable.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to a radio frequency circuit and an electronic device. Background Art

[0002] With the popularization of 5G (Fifth-Generation) technology, many new 5G frequency bands have been added to mobile terminals such as mobile phones. Due to the size of mobile terminals, the working frequency bands transmitted by antennas need to be combined, that is, one antenna can transmit multiple frequency bands.

[0003] At present, in the related art, a combiner is generally used in the RF circuit of a mobile terminal to combine multiple frequency bands. For example, a mobile terminal such as a mobile phone can use a combiner in the RF circuit to combine the N78 frequency band (a 5G frequency band) and the MHB frequency band (Middle High Band). Among them, the two input ports of the combiner can combine the signals of the N78 frequency band and the MHB frequency band and output them to the same antenna, and then transmit them through the antenna.

[0004] However, there is a problem in the related art that different input ports of a low-isolation combiner affect each other during use, which affects the performance of the combiner in the working frequency band. For example, the frequency intervals of the N78 band (3300MHz to 3800MHz) and the MHB band (1710MHz to 2690MHz) are relatively close, and the degree of isolation between the two input ports of the combiner is relatively low. When the MHB band works alone and the N78 band stops working, the impedance of the N78 path corresponding to the N78 band of the combiner is relatively large, resulting in a sudden decrease in the insertion loss of the combiner in the MHB band, and a relatively serious energy attenuation phenomenon of the MHB band signal power output by the combiner, which affects the performance of the combiner in the MHB band. Summary of the invention

[0005] The present application provides a radio frequency circuit and an electronic device, which at least solve the problem in the related art that different input ports of a low-isolation combiner affect each other during use, thereby affecting the performance of the working frequency band.

[0006] In a first aspect, the present application provides a radio frequency circuit, comprising: a first power amplifier module, a second power amplifier module, a first radio frequency path, a second radio frequency path, a combiner, and an antenna;

[0007] The combiner has a first input end, a second input end and an output end, the first input end of the combiner is connected to the first power amplifier module through the first radio frequency path, the second input end of the combiner is connected to the second power amplifier module through the second radio frequency path, and the output end of the combiner is connected to the antenna; wherein the first operating frequency band of the first power amplifier module is different from the second operating frequency band of the second power amplifier module;

[0008] The target insertion loss of the combiner in the second working frequency band is associated with the impedance of the first radio frequency path, and the impedance of the first radio frequency path is adjustable.

[0009] In a second aspect, the present application provides an electronic device, comprising: a radio frequency circuit as described in the first aspect.

[0010] In an embodiment of the present application, the RF circuit includes a first power amplifier module, a second power amplifier module, a first RF path, a second RF path, a combiner and an antenna; the combiner has a first input end, a second input end and an output end, the first input end of the combiner is connected to the first power amplifier module through the first RF path, the second input end of the combiner is connected to the second power amplifier module through the second RF path, and the output end of the combiner is connected to the antenna; wherein the first operating frequency band of the first power amplifier module is different from the second operating frequency band of the second power amplifier module; wherein the target insertion loss of the combiner in the second operating frequency band is associated with the impedance of the first RF path, and the impedance of the first RF path is adjustable. In this way, the two input ends of the combiner of the RF circuit respectively input the signal of the first working frequency band of the first RF path and the signal of the second working frequency band of the second RF path. In the application scenario where the degree of isolation between the two input ports of the combiner of the RF circuit is low, since the target insertion loss of the combiner in the second working frequency band is associated with the impedance of the first RF path, and the impedance of the first RF path is adjustable, the target insertion loss of the combiner in the second working frequency band can be improved by adjusting the impedance of the first RF path, thereby avoiding the performance of the combiner in the second working frequency band being affected by the impedance of the first RF path to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0012] Figure 1 A schematic diagram of a combiner provided in the related art;

[0013] Figure 2 A schematic diagram of a radio frequency circuit provided in the related art;

[0014] Figure 3 for Figure 2 A schematic diagram of an insertion loss response curve of a combiner of the RF circuit shown in the MHB frequency band;

[0015] Figure 4-1 A schematic diagram of an insertion loss response curve of a combiner in the MHB frequency band when the wiring length at the combiner N78 end is 16 mm provided in an embodiment of the present application;

[0016] Figure 4-2 A schematic diagram of an insertion loss response curve of a combiner in the MHB band when the wiring length at the combiner N78 end is 20 mm provided in an embodiment of the present application;

[0017] Figure 4-3 A schematic diagram of an insertion loss response curve of a combiner in the MHB frequency band when the wiring length at the combiner N78 end is 30 mm provided in an embodiment of the present application;

[0018] Figure 4-4 A schematic diagram of an insertion loss response curve of a combiner in the MHB frequency band when the wiring length at the combiner N78 end is 42 mm provided in an embodiment of the present application;

[0019] Figure 5 A schematic diagram of an insertion loss response curve of a combiner in the MHB band under different output impedances of an N78 power amplifier module provided in an embodiment of the present application;

[0020] Figure 6 A schematic diagram of a radio frequency circuit provided in an embodiment of the present application;

[0021] Figure 7 A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0022] Figure 8 A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0023] Fig. 9 A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0024] Fig.10 A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0025] Fig.11 A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0026] Fig.12 A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0027] Fig.13A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0028] Fig.14 A schematic diagram of another radio frequency circuit provided in an embodiment of the present application;

[0029] Fig.15 A schematic diagram of an electronic device provided in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 100-RF circuit; 110-first power amplifier module; 120-second power amplifier module; 130-first RF path; 1301-matching device; 140-second RF path; 150-combiner; 160-antenna; 170-connector; 1701-first connector; 1702-second connector; L-target routing; L0-main routing; L01-first main routing; C-target input end of the first power amplifier module; D-target output end of the first power amplifier module; L02-second main routing; L1-spare routing; L2-first spare routing; L3-second spare routing; R1 -first resistor; R2-second resistor; R3-third resistor; R4-fourth resistor; R5-fifth resistor; R6-sixth resistor; R7-seventh resistor; R8-eighth resistor; R-target resistor; 1101-target switch; 1102-amplifier; 1103-first single-pole double-throw switch; 1104-first filter; 1105-coupler; 1106-second single-pole double-throw switch; 1107-first double-pole double-throw switch; 1108-second double-pole double-throw switch; 1109-first low-noise power amplifier; 1110-second low-noise power amplifier; 1111-second filter; 200-electronic device. DETAILED DESCRIPTION

[0032] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0033] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0034] In the description of the present application, it should be understood that the terms "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] At present, with the popularization of 5G technology, many 5G frequency bands have been added to mobile terminals such as mobile phones. Compared with 4G, 5G has added many frequency bands, one of which is the N78 frequency band. Since many 5G frequency bands have been added to mobile phones, but the size of mobile phones is limited, the antennas need to be merged, that is, one antenna needs to transmit multiple frequency bands. A combiner is required for merging. Currently, the MHB+N78 combiner is more commonly used in mobile phones. The frequency range of the MHB band is mainly 1710M~2690MHz. The frequency range of the N78 band is mainly 3300M~3800MHz.

[0037] like Figure 1 In the combiner shown in the figure, ① and ② are the two input ports of the combiner, which input the MHB band signal and the N78 band signal respectively, and ③ is the output port of the combiner. The function of the combiner is to combine the two input signals (MHB band signal and N78 band signal) into one and output it. Among them, the main indicators of the combiner are insertion loss, out-of-band suppression, isolation, etc. Isolation is the degree of isolation between the two input ports. High isolation can prevent mutual interference, protect devices, reduce mutual influence, etc.

[0038] Currently, due to the close frequency interval between the N78 band and the MHB band, the isolation between the two input ports of the combiner is not high. Combiners with low isolation may encounter situations where the input ports affect each other during use.

[0039] For example, Figure 2 In the RF circuit shown, the MHB power amplifier module is connected to the first input port of the combiner, the N78 power amplifier module is connected to the second input port of the combiner, and the output port of the combiner is connected to the antenna. Figure 2 In the RF circuit shown, the routing of the N78 input port may affect the insertion loss of the MHB. For example, when the MHB power amplifier module works alone and the N78 power amplifier module does not work, Figure 3 As shown, the impedance of the routing at the N78 end of the combiner is too large, which may cause a pit in the insertion loss of the combiner in the MHB band (1.71-2.69GHz), which in turn causes the insertion loss value of the combiner to exceed the preset allowable range (e.g., 0 to -2dB) when the combiner operates in the MHB band. At this time, the insertion loss value of the combiner when operating in the MHB band is greatly reduced, and the MHB band signal power output by the combiner shows a relatively serious energy attenuation phenomenon, which affects the working performance of the combiner in the MHB band.

[0040] Among them, if the insertion loss value of the combiner in the MHB band is 0dB, the corresponding insertion loss value (the ratio of the output power of the combiner to the input power) is 100%, there is no energy attenuation in the combiner, and the working performance of the combiner in the MHB band is the best. If the insertion loss value of the combiner in the MHB band is -2dB, the corresponding insertion loss value is about 63.1%, and the power of the MHB band signal output by the combiner has an energy attenuation of about 36.9%, and the working performance of the combiner in the MHB band is basically up to standard. If the insertion loss value of the combiner in the MHB band is below -2dB, it means that the insertion loss value of the combiner in the MHB band is outside the preset allowable range, and the power of the MHB band signal output by the combiner has a relatively serious energy attenuation phenomenon.

[0041] Based on this, for the scenario of using a low-isolation combiner in the RF circuit, the embodiments of the present application can adjust the impedance of the RF path on the input side of the combiner on the RF circuit to reduce the amplitude of the pit in the insertion loss response curve of the combiner in the operating frequency band (for example, the MHB band) or move the pit outside the operating frequency band, thereby solving the problem of the insertion loss pit caused by the mutual influence of the two input ends of the combiner.

[0042] Furthermore, the embodiments of the present application can utilize the routing on the RF circuit or the internal switch of the device to adjust the impedance of the RF path on the input side of the combiner, thereby solving the insertion loss pit problem of the low-isolation combiner while minimizing the additional cost.

[0043] It should be pointed out that the applicant found through simulation experiments that the pit in the insertion loss response curve of the combiner in the MHB band is related to the routing length of the RF path at the N78 end. Based on this, the embodiment of the present application can avoid the insertion loss pit problem in the MHB band by dynamically adjusting the routing length of the RF circuit when the insertion loss response curve has a pit.

[0044] For example, through simulation experiments, it is found that the frequency position of the pit in the MHB band is closely related to the impedance of the wiring at the N78 end of the combiner. The frequency position of the pit can be moved by adjusting the wiring length at the N78 end of the combiner. Figure 4-1 When the length of the line at the combiner N78 end is adjusted to 16mm, the frequency position m4 of the pit in the MHB band is recorded as 2.715GHz, and the insertion loss value at this frequency is -2.558dB. Figure 4-2 When the length of the line at the combiner N78 end is adjusted to 20mm, the frequency position m4 of the pit in the MHB band is recorded as 2.551GHz, and the insertion loss value at this frequency is -0.609dB. Figure 4-3 When the length of the line at the combiner N78 end is adjusted to 30mm, the frequency position m4 of the pit in the MHB band is recorded as 2.126GHz, and the insertion loss value at this frequency is -4.434dB. Figure 4-4 When the length of the line at the combiner N78 end is adjusted to 42mm, the frequency position m4 of the pit in the MHB band is recorded as 1.702GHz, and the insertion loss value at this frequency is -6.058dB. Figure 4-1 to Figure 4-4 It can be seen that in the process of increasing the trace length from 16 mm to 42 mm, the frequency position of the pit decreases from 2.715 GHz to 1.702 GHz, completely spanning the frequency range of 1.71-2.69 GHz of the MHB band.

[0045] Based on this, the embodiment of the present application can reserve a certain length of microstrip line on the N78 path at the N78 end of the combiner, which is not connected by default and is connected when a pit appears, so as to adjust the total routing length of the N78 path, so that the position of the pit appearing on the insertion loss curve of the combiner in the MHB working frequency band is moved outside the frequency range of the MHB band, thereby avoiding the influence of excessive impedance of the N78 path at the N78 end of the combiner on the MHB band performance.

[0046] In addition, the applicant also found through simulation experiments that the insertion loss response curve of the combiner in the MHB band has a pit, which is related to the port impedance of the N78 power amplifier module. Figure 5 As shown, curve ④ is the insertion loss response curve of the combiner in the MHB band when the output impedance of the N78 power amplifier module is an open-circuit impedance (infinite). The frequency point of the pit on curve ④ is about 2.24 GHz, and the insertion loss value at this frequency point is about -2.18 dB; curve ⑤ is the insertion loss response curve of the combiner in the MHB band when the output impedance of the N78 power amplifier module is 50 ohms. The frequency point of the pit on curve ⑤ is about 2.13 GHz, and the insertion loss value at this frequency point is about -1.74 dB. It can be seen that when the output impedance of the N78 power amplifier module is an open-circuit impedance (infinite), the amplitude of the pit in the insertion loss response curve of the combiner in the MHB band is large. When the output impedance of the N78 power amplifier module is 50 ohms, the amplitude of the pit in the insertion loss response curve of the combiner in the MHB band is small. Figure 5 Analysis shows that when the MHB of the combiner works alone and N78 does not work, the output port of the N78 power amplifier module has an open circuit impedance of infinite, and the insertion loss response curve under the MHB band after the combiner has a relatively large pit. The embodiment of the present application can adjust the impedance of the output port of the N78 power amplifier module to 50 ohms to reduce the impact of the pit on the insertion loss response curve under the MHB band.

[0047] Based on this, in the embodiment of the present application, when a pit appears on the insertion loss response curve in the MHB frequency band, the internal switch of the N78 power amplifier module can be used to switch the output end of the N78 power amplifier module to the input port connected to a 50-ohm resistor when the MHB works alone, so that the output impedance of the N78 power amplifier module is 50 ohms (50 ohms can be understood as the optimal working point of the N78 power amplifier module, which is equivalent to the impedance value of the optimal working point of the analog output N78 power amplifier module when working), thereby reducing the pit amplitude of the insertion loss response curve of the combiner in the MHB frequency band, and ensuring that the insertion loss of the combiner in the MHB frequency band is within the preset allowable range.

[0048] In addition, the embodiments of the present application can also combine the above two adjustment methods, by adjusting the output impedance of the N78 power amplifier module and / or adjusting the total routing length of the N78 path, to flexibly adjust the impedance of the N78 path, so that the insertion loss of the combiner in the MHB frequency band is within the preset allowable range.

[0049] The following is combined with Figure 6-Figure 11 The radio frequency circuit and electronic device provided by the embodiments of the present application are described in detail.

[0050] like Figure 6 As shown, an embodiment of the present application provides a radio frequency circuit 100, which may include: a first power amplifier module 110, a second power amplifier module 120, a first radio frequency path 130, a second radio frequency path 140, a combiner 150 and an antenna 160;

[0051] The combiner 150 has a first input end, a second input end and an output end. The first input end of the combiner 150 is connected to the first power amplifier module 110 through the first RF path 130, the second input end of the combiner 150 is connected to the second power amplifier module 120 through the second RF path 140, and the output end of the combiner 150 is connected to the antenna 160; wherein, the first operating frequency band of the first power amplifier module 110 is different from the second operating frequency band of the second power amplifier module 120; wherein, the target insertion loss of the combiner 150 in the second operating frequency band is associated with the impedance of the first RF path 130, and the impedance of the first RF path 130 is adjustable.

[0052] In the embodiment of the present application, when the target insertion loss of the combiner 150 in the second operating frequency band is outside the preset allowable range, the impedance of the first RF path 130 is adjusted so that the target insertion loss is within the preset allowable range.

[0053] The preset allowable range can be set according to actual needs, and this application does not limit it. For example, the preset allowable range is 0 to -2dB.

[0054] In the embodiment of the present application, the first power amplifier module 110 may integrate a plurality of RF devices such as a RF power amplifier, a RF switch, a filter, and a coupler to amplify the RF signal of the first working frequency band. The second power amplifier module 120 may also integrate a plurality of RF devices such as a RF power amplifier, a RF switch, a filter, and a coupler to amplify the RF signal of the second working frequency band.

[0055] Among them, the frequency range of the first working frequency band is different from the frequency range of the second working frequency band. For example, the first working frequency band may be the N78 frequency band, and the second working frequency band may be the MHB frequency band. Alternatively, the first working frequency band may be the MHB frequency band, and the second working frequency band may be the N78 frequency band. It should be noted that the first working frequency band may also be located in other frequency ranges, and the second working frequency band may also be located in other frequency ranges. The embodiment of the present application does not impose specific restrictions on the frequency range of the first working frequency band / the frequency range of the second working frequency band.

[0056] Among them, the combiner 150 is used to combine the RF signal of the first working frequency band received by the first input end and the RF signal of the second working frequency band received by the second input end, and output it to the antenna through the output end, so that the antenna can transmit the RF signals of the first working frequency band and the second working frequency band.

[0057] Among them, in the application scenario where the degree of mutual isolation between the two input ports of the combiner of the RF circuit is low, the two input ports of the combiner may affect each other, thereby affecting the performance of the first working frequency band / the second working frequency band. For example, when the first power amplifier module 110 is not working and the second power amplifier module 120 is working alone, or when the first power amplifier module 110 and the second power amplifier module 120 are working at the same time, the impedance of the first RF path 130 may affect the target insertion loss of the combiner 150 in the second working frequency band, so that the target insertion loss of the combiner 150 in the second working frequency band is outside the preset allowable range, so that the performance of the combiner in the second working frequency band is affected.

[0058] Based on this, when the target insertion loss of the combiner 150 in the second working frequency band is outside the preset allowable range, since the impedance of the first RF path 130 is adjustable, the embodiment of the present application can adjust the impedance of the first RF path 130 so that the target insertion loss of the combiner 150 in the second working frequency band is within the preset allowable range.

[0059] The target insertion loss may include a ratio of an output power at an output end of the combiner 150 to an input power at a second input end of the combiner 150 , and a unit of the insertion loss value may be decibel (dB).

[0060] It should be pointed out that since the target insertion loss of the combiner 150 in the second working frequency band is outside the preset allowable range and is affected by the impedance of the first RF path 130, the embodiment of the present application can adjust the impedance of the first RF path 130 so that the target insertion loss of the combiner 150 in the second working frequency band is within the preset allowable range, thereby improving the insertion loss of the combiner in the second working frequency band, avoiding to a certain extent the impact of the impedance of the first RF path on the performance of the combiner in the second working frequency band, and improving the performance of the combiner 150 in the second working frequency band.

[0061] According to the RF circuit provided in the embodiment of the present application, the RF circuit includes a first power amplifier module, a second power amplifier module, a first RF path, a second RF path, a combiner and an antenna; the combiner has a first input end, a second input end and an output end, the first input end of the combiner is connected to the first power amplifier module through the first RF path, the second input end of the combiner is connected to the second power amplifier module through the second RF path, and the output end of the combiner is connected to the antenna; wherein the first operating frequency band of the first power amplifier module is different from the second operating frequency band of the second power amplifier module; wherein the target insertion loss of the combiner in the second operating frequency band is associated with the impedance of the first RF path, and the impedance of the first RF path is adjustable. In this way, the two input ends of the combiner of the RF circuit respectively input the signal of the first working frequency band of the first RF path and the signal of the second working frequency band of the second RF path. In the application scenario where the degree of isolation between the two input ports of the combiner of the RF circuit is low, since the target insertion loss of the combiner in the second working frequency band is associated with the impedance of the first RF path, and the impedance of the first RF path is adjustable, the target insertion loss of the combiner in the second working frequency band is improved by adjusting the impedance of the first RF path, which to a certain extent avoids the performance of the combiner in the second working frequency band being affected by the impedance of the first RF path.

[0062] In practical applications, the impedance of the first RF path 130 is related to the impedance of the wiring on the first RF path 130, the impedance of various devices on the first RF path 130, and the output impedance of the first power amplifier module 110. Based on this, the embodiment of the present application can adjust the impedance of the first RF path 130 by adjusting at least one of the impedance of the wiring on the first RF path 130, the impedance of various devices on the first RF path 130, and the output impedance of the first power amplifier module 110.

[0063] In actual applications, since the cost of laying out wiring on the first RF path 130 is relatively low, in order to minimize the additional cost, the embodiment of the present application can adjust the impedance of the first RF path 130 by adjusting the impedance of the wiring on the first RF path 130.

[0064] For example, in a specific embodiment, Figure 7 As shown, the first RF path 130 includes a target line L, and the first power amplifier module 110 is connected to the first input end of the combiner 150 through the target line L;

[0065] The impedance of the target line L is adjustable, and the impedance of the first RF path 130 is adjusted by adjusting the impedance of the target line L.

[0066] It should be noted that, since the impedance of the first RF path 130 is related to the impedance of the target trace L on the first RF path 130 , the embodiment of the present application can adjust the impedance of the first RF path 130 by adjusting the impedance of the target trace L.

[0067] Among them, in actual applications, the impedance of the target trace may be related to the circuit board layer where the target trace is located, the material used for the circuit board (dielectric constant), the trace width, the distance between the trace and the plane, and the trace length. The embodiment of the present application can adjust the impedance of the target trace L by adjusting at least one of the circuit board layer where the target trace is located, the material used for the circuit board where the target trace is located (dielectric constant), the trace width, the distance between the trace and the plane, and the trace length.

[0068] In this way, the embodiment of the present application can adjust the impedance of the first RF path 130 by adjusting the impedance of the target routing L. Since the cost of laying routing on the first RF path 130 is relatively low, the embodiment of the present application can adjust the impedance of the first RF path on the first input end side of the combiner by adjusting the impedance of the routing. While avoiding the impedance of the first RF path being too large, which causes the target insertion loss of the second working frequency band signal input at the second input end of the combiner to exceed the preset allowable range, additional costs are not increased as much as possible.

[0069] In order to conveniently adjust the impedance of the target trace L, the embodiment of the present application can adjust the length of the target trace to adjust the impedance of the target trace L. In a specific embodiment, the impedance of the target trace L is associated with the length of the target trace, and the length of the target trace L is adjustable. The embodiment of the present application can adjust the impedance of the first RF path on the first input end of the combiner by adjusting the length of the target trace L, while avoiding excessive impedance of the first RF path that causes the target insertion loss of the second working frequency band signal input at the second input end of the combiner to exceed the preset allowable range, while minimizing the additional cost.

[0070] In actual applications, simulation experiments have found that the presence of a pit in the insertion loss response curve of the combiner 150 in the second operating frequency band (i.e., the target insertion loss exceeds the preset allowable range) is related to the routing length of the first RF path. Based on this, the embodiment of the present application can avoid the insertion loss pit problem in the second operating frequency band by dynamically adjusting the routing length of the RF circuit when a pit appears in the insertion loss response curve (i.e., the target insertion loss exceeds the preset allowable range).

[0071] For example, in the embodiment of the present application, a certain length of spare routing can be reserved and the length of the target routing can be adjusted through the spare routing. Figure 7As shown, the target line L may include a main line L0 and a spare line L1 , the spare line L1 is connected to the main line L0 through a connecting device 170 , and the spare line L1 is used to adjust the length of the target line L.

[0072] Among them, the length of the target routing line L in the first working state can be recorded as the first length. In the first working state, the length of the target routing line L can be the length of the main routing line L0. If the target insertion loss of the combiner 150 in the second working frequency band is outside the preset allowable range in the first working state, the embodiment of the present application can adjust the length of the target routing line L through the spare routing in the second working state, so that the length of the target routing line L is adjusted from the first length to the second length, and the second length is obtained based on the length of the main routing line L0 and the length of the spare routing line L1. By adjusting the length of the target routing line L to the second length, the target insertion loss can be within the preset allowable range.

[0073] The first length may be smaller than the second length, or the first length may be larger than the second length, and this application does not impose any specific limitation on this.

[0074] For example, if the first working frequency band is N78 and the second working frequency band is MHB, and the first length is 30 mm, the length of the target line L can be adjusted from the first length 30 mm to 42 mm through the spare line. Figure 4-4 The frequency point of the insertion loss pit 1.702GHz is smaller than the minimum frequency 1.71GHz of the MHB band. The insertion loss pit of the combiner is moved outside the frequency range of the MHB band, so that the target insertion loss of the combiner in the MHB band can be within the preset allowable range.

[0075] For another example, taking the first working frequency band as the N78 band, the second working frequency band as the MHB band, and the first length as 30 mm, the length of the target line L can be adjusted from the first length of 30 mm to 16 mm through the spare line. Figure 4-1 The frequency point position of the insertion loss pit 2.715GHz is greater than the maximum frequency 2.69GHz of the MHB band. The insertion loss pit of the combiner is moved outside the frequency range of the MHB band, so that the target insertion loss of the combiner in the MHB band can be within the preset allowable range.

[0076] It should be noted that when adjusting the length of the target line through the spare line, the length of the target line can be extended (i.e., the first length can be less than the second length), or the length of the target line can be shortened (i.e., the first length can be greater than the second length). In order to facilitate the adjustment of the length of the target line, the embodiment of the present application can extend the length of the target line, and the spare line L1 can be a wave shape, which is used to extend the length of the target line L.

[0077] In this way, when an insertion loss pit appears in the insertion loss response curve of the combiner, the spare routing is connected to the main routing through compatible routing, and the length of the target routing is adjusted to move the insertion loss pit of the combiner outside the frequency range of the second working frequency band, thereby avoiding the insertion loss pit problem in the second working frequency band. This method does not increase additional costs.

[0078] In practical applications, in order to flexibly adjust the length of the target line, the spare lines L1 may include one or more lines, and the present application does not impose any specific limitation on the number of spare lines L1.

[0079] For example, refer to Figure 7 , the backup line L1 includes one; in the first working state, the first power amplifier module 110 is connected to the first input end of the combiner 150 through the main line L0, and the length of the target line L is the length of the main line L0. In the second working state, the first power amplifier module 110 is connected to the first input end of the combiner 150 through at least part of the main line L0 and the backup line L1, and the length of the target line L is determined based on the length of the main line L0 and the length of the backup line L1.

[0080] The first length of the target line in the first working state is the length of the main line L0.

[0081] The second length of the target line in the second working state is the length of the main line L0 plus the length of the backup line L1 minus L'. L' is the length of a portion of the main line occupied by the connector 170 (i.e., the length of a portion of the main line between the first connector 1701 and the second connector 1702).

[0082] It should be noted that in practical applications, in order to avoid short circuit, in the second working state, a portion of the main wiring occupied by the connecting device 170 (ie, a portion of the main wiring between the first connecting device 1701 and the second connecting device 1702) may not be conductive.

[0083] In practical applications, when the length L' of the portion of the main routing line occupied by the connecting device 170 can be ignored, L' can be recorded as 0, and the length of the target routing line in the second working state can be the sum of the length of the main routing line L0 and the length of the backup routing line L1. The first length is less than the second length, that is, the length of the target routing line is extended during the adjustment process.

[0084] In practical applications, when the length L' of the main line portion occupied by the connecting device 170 is greater than the length of the spare line L1, the length of the target line in the second working state (the second length) is less than the first length, that is, the length of the target line is shortened during the adjustment process.

[0085] In this way, the length of the target routing line is adjusted through a spare routing line, and the process of adjusting the length of the target routing line is simple and easy to implement.

[0086] In another specific embodiment, referring to Figure 8 , the spare line L1 may include a plurality of spare lines, and each of the spare lines L1 is connected to the main line L0 through a connecting device 170;

[0087] Among them, reference Figure 8 The spare lines L1 may include two, and the lengths of the two spare lines L1 may be the same or different. The present application may set the length of each spare line according to actual needs.

[0088] In addition, in other embodiments, the spare lines L1 may also include three, four, or five, etc. The present application may set the number of spare lines according to actual needs.

[0089] In the first working state, the first power amplifier module 110 is connected to the first input end of the combiner 150 through the main line L0, and the length of the target line L is the length of the main line L0.

[0090] Among them, in the second working state, the first power amplifier module 110 is connected to the first input end of the combiner 150 through at least part of the main line L0 and at least one spare line L1 among the multiple spare lines, and the length of the target line L is determined based on the length of the main line L0 and the length of at least one spare line L1.

[0091] refer to Figure 8 In the second working state, the embodiment of the present application can use multiple spare lines for segmented adjustment. The present application can be implemented by stringing one of the spare lines into the main line, or both spare lines can be stringed into the main line to cope with scenarios with main lines of different lengths.

[0092] For example, one backup line is 10 mm, and the other backup line is also 10 mm. For the scenario where the length of the main line is 32 mm, the length of the target line is adjusted to 42 mm by connecting a 10 mm backup line to the main line. The length of the target line is slightly extended during the adjustment process. For the scenario where the length of the main line is 22 mm, the length of the target line is adjusted to 42 mm by connecting both 10 mm backup lines to the main line. The length of the target line is significantly extended during the adjustment process.

[0093] Among them, the embodiment of the present application can set the length and position of each spare line according to the area of ​​the actual PCB (printed circuit board), and the layout is more flexible. When an insertion loss pit appears, there are more options for the length of the introduced spare lines, for example, connecting one of the spare lines alone, or connecting multiple spare lines at the same time. The embodiment of the present application can be selected according to the actual situation such as the length of the main line.

[0094] Compared with simultaneously accessing multiple backup lines, when only one of the backup lines is accessed, the length of the target line is shorter, and the insertion loss impact on the insertion loss of the combiner is smaller.

[0095] In this way, in a scenario where the lengths of the main routing lines set on the first RF path are different, the length of the target routing line can be adjusted more flexibly by performing segmented adjustment through multiple spare routing lines.

[0096] In addition, the first RF path also includes a matching device, which is used to match the output impedance of the first power amplifier module so that the first power amplifier module operates at an optimal operating point. The matching device divides the main routing into two sections, namely, the first main routing between the first power amplifier module and the matching device and the second main routing between the matching device and the combiner. In this case, the spare routing can be set on the first main routing and / or the second main routing to adjust the length of the routing conducted between the first power amplifier module and the matching device and / or the length of the routing conducted between the matching device and the combiner. The embodiments of the present application do not limit the specific setting position of the spare routing.

[0097] For example, refer to Fig. 9 or Fig.10 The first RF path 130 further includes a matching device 1301, the main body wiring L0 includes a first main body wiring L01 and a second main body wiring L02, the first power amplifier module 110 is connected to the matching device 1301 through the first main body wiring L01, and the matching device 1301 is connected to the first input end of the combiner 150 through the second main body wiring L02;

[0098] refer to Fig. 9 , the spare line L1 is connected to the first main line L01 through the connecting device 170, and the spare line L1 is used to adjust the length of the line that is conductive between the first power amplifier module 110 and the matching device 1301;

[0099] Alternatively, refer to Fig.10 The spare line L1 is connected to the second main line L02 through the connecting device 170 , and the spare line L1 is used to adjust the length of the line that is conductive between the matching device 1301 and the combiner 150 .

[0100] In this way, in a scenario where the main routing includes multiple sections, the spare routing can be connected to any section of the main routing through a connecting device without limiting the access position of the spare routing. The position of the spare routing can then be set according to the actual PCB area, making the layout more flexible.

[0101] In a specific example, in order to connect the spare line to the first RF path, the embodiment of the present application can use a connecting device to switchably connect the spare line to the main line. Figure 7 , the connecting device 170 may include a first connecting device 1701 and a second connecting device 1702; the main line L0 has a first middle insertion point and a second middle insertion point, the first middle insertion point of the main line L0 is connected to one end of the spare line L1 through the first connecting device 1701, and the second middle insertion point of the main line L0 is connected to the other end of the spare line L1 through the second connecting device 1702;

[0102] In the first working state, the first connecting device 1701 and the second connecting device 1702 are in the first connection state, the first middle insertion point and the second middle insertion point of the main line L0 are connected, and the backup line L1 is not connected to the main line L0;

[0103] In the first working state, the first middle insertion point and the second middle insertion point of the main wiring L0 are conductive, and a portion of the main wiring L0 between the first connecting device 1701 and the second connecting device 1702 is conductive.

[0104] In the second working state, the first connecting device 1701 and the second connecting device 1702 are in the second connecting state, and the standby line L1 is connected to the main line L0.

[0105] Among them, in the second working state, a part of the main wiring between the first connecting device 1701 and the second connecting device 1702 is not conductive, but the spare wiring L1 is conductive with a part of the main wire L0 between the first connecting device 1701 and the first power amplifier module 110, and a part of the main wiring L0 between the second connecting device 1702 and the combiner 150. In other words, in the second working state, the spare wiring L1 is used to replace a part of the main wiring between the first connecting device 1701 and the second connecting device 1702.

[0106] In this way, the backup routing is switchably connected to the main routing by using a connecting device, so that the backup routing can be connected in series with or disconnected from the main routing, thereby realizing flexible adjustment of the length of the target routing.

[0107] The function of the connecting device is to connect the spare wiring to the main wiring in a switchable manner. The connecting device can be a resistor with a connecting function.

[0108] For example, Fig.11 As shown, in a scenario where the spare routing includes one line, the connecting device may include a first connecting device and a second connecting device, the first connecting device may include a first resistor R1 and a second resistor R2, the second connecting device may include a third resistor R3 and a fourth resistor R4, wherein R1 / R2 / R3 / R4 may be 0 ohm SMD compatible resistors that serve as a connection, R1 / R2 share a pad, and R3 / R4 share a pad.

[0109] Among them, L1 is a spare line, and the wave shape is to increase the line length. The length of L1 can be 26mm (26=42-16). When an insertion loss pit appears in the second working frequency band (such as the MHB band), the insertion loss pit can be moved out of the MHB band range by increasing the length of L1.

[0110] Among them, in the initial state (i.e., the first working state), by default, the resistors R1 and R3 are attached, and R2 / R4 are not attached. At this time, the main line L0 is connected via R1 and R3, and the spare line L1 is not connected to the circuit and does not work. If an insertion loss pit is found in the MHB band during actual measurement and debugging, R1 / R3 can be removed and R2 / R4 can be attached. At this time, the main line L0 is connected via R2 and R4, and the spare line L1 is connected to the circuit, which changes the total length of the first RF path (for example, N78). The frequency point position of the insertion loss pit can be adjusted, and the pit can be moved outside the MHB frequency range to avoid the influence of the impedance of the first RF path on the performance of the second working frequency band. In this way, by using compatible routing, when an insertion loss pit appears, the spare line is connected in series to the circuit, the total length of the first RF path is adjusted, and the frequency point position of the insertion loss pit is moved out of the MHB frequency range, solving the insertion loss pit problem without adding additional costs.

[0111] For example, Fig.12 As shown, in the scenario where the spare routing includes multiple lines, the connecting device may include a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7 and an eighth resistor R8, wherein R1 / R2 / R3 / R4 / R5 / R6 / R7 / R8 can be 0 ohm SMD compatible resistors, which serve as connections, R1 / R2 share a pad, R3 / R4 share a pad, R5 / R6 share a pad, and R7 / 84 share a pad.

[0112] Among them, L2 is the first spare line, L3 is the second spare line, and the wave shape is to increase the line length. The sum of the lengths of L2 and L3 can be 26mm (26=42-16). For example, L2 is 10mm and L3 is 16mm. When an insertion loss pit appears in the second working frequency band (such as the MHB band), the insertion loss pit can be moved out of the MHB band range by increasing the length of L2, or increasing the length of L3, or increasing the length of L2 and L3.

[0113] Among them, in the initial state (i.e., the first working state), by default, the resistors R1, R3, R5, and R7 are attached, and R2 / R4 / R6 / R8 are not attached. At this time, the main line L0 is connected via R1, R3, R5, and R7, and the spare lines L2 and L3 are not connected to the circuit and do not work.

[0114] If an insertion loss pit is found in the MHB band during actual measurement and debugging, if you want to access the L2 length routing, you can remove R1 / R3 and attach R2 / R4. At this time, the main routing L0 is turned on through R2, R4, R5, and R7, and the first backup routing L2 is connected to the circuit, which changes the total routing length of the first RF path (for example, N78). The frequency point position of the insertion loss pit can be adjusted, and the pit can be moved outside the MHB frequency range to avoid the influence of the impedance of the first RF path on the performance of the second working frequency band.

[0115] Alternatively, if you want to access L3 length routing, you can remove R5 / R7 and attach R6 / R8. At this time, the main routing L0 is turned on via R1, R3, R6, and R8, and the second backup routing L3 is connected to the circuit, which changes the total routing length of the first RF path (for example, N78). The frequency point position of the insertion loss pit can be adjusted, and the pit can be moved outside the MHB frequency range to avoid the influence of the impedance of the first RF path on the performance of the second working frequency band.

[0116] Alternatively, if you want to connect L2 and L3 length lines, you can remove R1 / R3 / R5 / R7 and attach R2 / R4 / R6 / R8. At this time, the main line L0 is turned on via R2, R4, R6, and R8, and the first backup line L2 and the second backup line L3 are both connected to the circuit, changing the total length of the first RF path (for example, N78). The frequency point position of the insertion loss pit can be adjusted, and the pit can be moved outside the MHB frequency range to avoid the influence of the impedance of the first RF path on the performance of the second working frequency band.

[0117] Among them, the embodiment of the present application can select the routing length of the access N78 channel according to the frequency position of the pit in actual conditions, and move the frequency position of the pit outside the MHB frequency range.

[0118] In this way, by using the method of compatible chip resistors and compatible routing, when an insertion loss pit occurs, the spare routing is connected in series to the circuit, the total routing length of the first RF path is adjusted, and the frequency point position of the insertion loss pit is moved out of the MHB frequency range, thereby solving the insertion loss pit problem without adding additional costs.

[0119] In other embodiments (not shown), the connection device may also be a single-pole double-throw switch. For example, the first connection device may be a first single-pole double-throw switch, and the second connection device may be a second single-pole double-throw switch. The spare line L1 may be switchably connected to the main line through the two single-pole double-throw switches. Alternatively, in other embodiments, the connection device may also be a capacitor or an inductor. For example, Fig.11 The four resistors R1 / R2 / R3 / R4 shown are replaced with four capacitors of the same type or four inductors of the same type, etc. It should be noted that the connecting device can be a device with a connecting function such as a resistor, a capacitor, an inductor or a switch device, and the embodiment of the present application does not limit the specific type of the connecting device.

[0120] In addition, since the insertion loss response curve of the combiner in the second working frequency band (such as the MHB band) has a pit, it is related to the port impedance of the first power amplifier module (such as the N78 power amplifier module). Based on this, the embodiment of the present application can use the internal switch of the N78 power amplifier module when the insertion loss response curve in the MHB band has a pit, so that when the MHB works alone, the output end of the N78 power amplifier module is switched to the input port connected to the 50-ohm resistor, so that the output impedance of the N78 power amplifier module is 50 ohms, thereby reducing the pit amplitude of the insertion loss response curve of the combiner in the MHB band, and ensuring that the insertion loss of the combiner in the MHB band is within the preset allowable range. The following is an example.

[0121] In a specific embodiment, reference Figure 6 The output impedance value of the first power amplifier module 110 is adjustable. By adjusting the output impedance value of the first power amplifier module 110, the target insertion loss of the combiner 150 in the second working frequency band is increased.

[0122] Among them, the embodiment of the present application can adjust the output impedance value of the first power amplifier module to increase the target insertion loss of the combiner 150 in the second working frequency band when the insertion loss response curve in the second working frequency band (for example, the MHB band) suddenly decreases, thereby avoiding to a certain extent the performance of the combiner in the second working frequency band being affected by the impedance of the first RF path.

[0123] In this way, the embodiment of the present application can increase the target insertion loss of the combiner 150 in the second working frequency band by adjusting the output impedance value of the first power amplifier module 110, thereby avoiding to a certain extent the performance of the combiner in the second working frequency band being affected by the impedance of the first RF path.

[0124] In order to avoid adding additional costs as much as possible, in a specific example, the embodiment of the present application can use the original RF switch inside the first power amplifier module to adjust the output impedance value of the first power amplifier module when the insertion loss response curve suddenly decreases in the second working frequency band (for example, the MHB band).

[0125] For example, Fig.13 As shown, the RF circuit 100 also includes a target resistor R; the first power amplification module 110 includes a target input terminal C, a target switch 1101 and a target output terminal D, the target input terminal C of the first power amplification module 110 is connected to the target resistor R, the target input terminal C of the first power amplification module 110 is connected to the target switch 1101, the target switch 1101 is connected to the target output terminal D of the first power amplification module 110, and the target output terminal D of the first power amplification module 110 is connected to the first input terminal of the combiner 150;

[0126] When the target switch 1101 is in the on state, the target resistor R is connected to the target output terminal D of the first power amplifier module 110 via the target input terminal C of the first power amplifier module 110 and the target switch 1101, and the impedance value output by the first power amplifier module 110 is the target impedance value of the target resistor R.

[0127] Among them, the target switch 1101 can be the original RF switch inside the first power amplifier module 110. When the first power amplifier module 110 is not working, the target switch 1101 can be used to switch the target output terminal D of the first power amplifier module 110 to the target resistor R connected to the target input terminal C of the first power amplifier module 110, so that the impedance value output by the first power amplifier module 110 is the target impedance value of the target resistor R, wherein the target impedance value of the target resistor R can be 50 ohms, simulating the optimal working point of the first power amplifier module 110 during normal operation. At this time, refer to the attached Figure 5 , the pit in the insertion loss response curve in the second working frequency band (for example, the MHB band) becomes smaller, so that the target insertion loss of the combiner 150 in the second working frequency band increases, which to a certain extent avoids the performance of the combiner in the second working frequency band being affected by the impedance of the first RF path.

[0128] In practical applications, taking the first power amplifier module 110 as an N78 power amplifier module as an example, refer to Fig.14, the N78 power amplifier module may include a target switch 1101, an amplifier 1102, a first single-pole double-throw switch 1103, a first filter 1104, a coupler 1105, a second single-pole double-throw switch 1106, a first double-pole double-throw switch 1107, a second double-pole double-throw switch 1108, a first low-noise power amplifier 1109, a second low-noise power amplifier 1110, and a second filter 1111. The N78 power amplifier module has a transmission signal input terminal Tx_IN, a first receiving terminal Rx_1, a first input terminal SRS_IN_1, a second input terminal SRS_IN_2, a second receiving terminal Rx_2, a power detection signal input terminal CPL_IN, a power detection signal output terminal CPL_OUT, a first antenna output terminal TRX_ANT, a second antenna output terminal MIMO_ANT, a first output terminal SRS_OUT_1, and a second output terminal SRS_OUT_2.

[0129] The target input terminal C of the first power amplifier module 110 may be the SRS_IN_1 port, which is generally an unused port and is connected to the ground by a 50 ohm resistor by default. The target switch 1101 may be a radio frequency switch, and the target output terminal D of the first power amplifier module 110 may be the TRX_ANT port.

[0130] In the embodiment of the present application, the original RF switch inside the N78 power amplifier module is used to enable the output port TRX_ANT of the N78 power amplifier module to be switched to the port SRS_IN_1 connected to the 50-ohm resistor R when the MHB works alone. This can increase the target insertion loss of the combiner 150 in the second working frequency band, reduce the insertion loss pit of the combiner MHB, and to a certain extent avoid the performance of the combiner in the second working frequency band being affected by the impedance of the first RF path without increasing additional costs.

[0131] In addition, if the reduced insertion loss pit meets the requirements (i.e., the target insertion loss after being increased is within the preset allowable range), there is no need to adjust the length of the routing in the N78 RF path; if the reduced insertion loss pit (i.e., the target insertion loss after being increased) still does not meet the requirements, the length of the routing in the N78 RF path can continue to be adjusted until the target insertion loss of the combiner in the MHB band is within the preset allowable range.

[0132] In this way, by utilizing the RF switch inside the N78 power amplifier module, when the MHB works alone, the output port TRX_ANT of the N78 power amplifier module is switched to the port SRS_IN_1 connected to the 50-ohm resistor R, so that the output impedance of the N78 power amplifier module is 50 ohms, and the target insertion loss of the combiner 150 in the second working frequency band is increased, thereby reducing the insertion loss pit of the combiner MHB.

[0133] Based on the same concept as the radio frequency circuit provided in any of the above embodiments, an embodiment of the present application further provides an electronic device.

[0134] refer to Fig.15 An embodiment of the present application provides an electronic device 200, which may include the radio frequency circuit 100 provided in any of the above embodiments.

[0135] In the embodiment of the present application, the electronic device 200 may be a device with a communication function. The electronic device may be a terminal or other device other than a terminal. Exemplarily, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR) / virtual reality (virtual reality, VR) device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), etc., which is not specifically limited in the embodiment of the present application.

[0136] In an embodiment of the present application, the electronic device 200 may include the radio frequency circuit 100 provided in any of the above embodiments, and may implement all functions of the radio frequency circuit, which will not be described again here to avoid repetition.

[0137] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0138] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A radio frequency circuit, characterized in that: include: A first power amplifier module, a second power amplifier module, a first radio frequency path, a second radio frequency path, a combiner and an antenna; The combiner has a first input end, a second input end and an output end, the first input end of the combiner is connected to the first power amplifier module through the first radio frequency path, the second input end of the combiner is connected to the second power amplifier module through the second radio frequency path, and the output end of the combiner is connected to the antenna; wherein the first operating frequency band of the first power amplifier module is different from the second operating frequency band of the second power amplifier module; The target insertion loss of the combiner in the second working frequency band is associated with the impedance of the first radio frequency path, and the impedance of the first radio frequency path is adjustable.

2. The radio frequency circuit according to claim 1, characterized in that: The first radio frequency path includes a target line, and the first power amplifier module is connected to the first input end of the combiner through the target line; The impedance of the target routing line is adjustable, and the impedance of the first RF path is adjusted by adjusting the impedance of the target routing line.

3. The radio frequency circuit according to claim 2, characterized in that: The impedance of the target routing line is associated with the length of the target routing line, and the length of the target routing line is adjustable.

4. The radio frequency circuit according to claim 3, characterized in that: The target routing includes a main routing and a spare routing, the spare routing is connected to the main routing via a connecting device, and the spare routing is used to adjust the length of the target routing.

5. The radio frequency circuit according to claim 4, characterized in that: The spare wiring is wavy.

6. The radio frequency circuit according to claim 4, characterized in that: The backup routing includes one; In a first working state, the first power amplifier module is connected to the first input end of the combiner through the main wiring, and the length of the target wiring is the length of the main wiring; In the second working state, the first power amplifier module is connected to the first input end of the combiner through at least part of the main line and the backup line, and the length of the target line is determined based on the length of the main line and the length of the backup line.

7. The radio frequency circuit according to claim 4, characterized in that: The backup routing includes a plurality of backup routings, and each of the plurality of backup routings is connected to the main routing through the connecting device; In a first working state, the first power amplifier module is connected to the first input end of the combiner through the main wiring, and the length of the target wiring is the length of the main wiring; In the second working state, the first power amplifier module is connected to the first input end of the combiner through at least part of the main routing and at least one spare routing among the multiple spare routings, and the length of the target routing is determined based on the length of the main routing and the length of the at least one spare routing.

8. The radio frequency circuit according to claim 4, characterized in that: The first RF path further includes a matching device, the main body wiring includes a first main body wiring and a second main body wiring, the first power amplifier module is connected to the matching device through the first main body wiring, and the matching device is connected to the first input end of the combiner through the second main body wiring; The spare routing is connected to the first main routing through the connecting device, and the spare routing is used to adjust the length of the routing conducted between the first power amplifier module and the matching device; or, the spare routing is connected to the second main routing through the connecting device, and the spare routing is used to adjust the length of the routing conducted between the matching device and the combiner.

9. The radio frequency circuit according to claim 4, characterized in that: The connecting device includes a first connecting device and a second connecting device; the main line has a first middle insertion point and a second middle insertion point, the first middle insertion point of the main line is connected to one end of the backup line through the first connecting device, and the second middle insertion point of the main line is connected to the other end of the backup line through the second connecting device; In a first working state, the first connecting device and the second connecting device are in a first connection state, the first middle insertion point and the second middle insertion point of the main wiring are connected, and the backup wiring is not connected to the main wiring; In the second working state, the first connecting device and the second connecting device are in a second connection state, and the backup wiring is connected to the main wiring.

10. The radio frequency circuit according to claim 1, characterized in that: The output impedance value of the first power amplifier module is adjustable, and the target insertion loss is increased by adjusting the output impedance value of the first power amplifier module.

11. The radio frequency circuit according to claim 10, characterized in that: The RF circuit also includes a target resistor; the first power amplifier module includes a target input terminal, a target switch and a target output terminal, the target input terminal of the first power amplifier module is connected to the target resistor, the target input terminal of the first power amplifier module is connected to the target switch, the target switch is connected to the target output terminal of the first power amplifier module, and the target output terminal of the first power amplifier module is connected to the first input terminal of the combiner; When the target switch is in the on state, the target resistor is connected to the target output end of the first power amplifier module via the target input end of the first power amplifier module and the target switch, and the impedance value output by the first power amplifier module is the target impedance value of the target resistor.

12. An electronic device, characterized in that: include: A radio frequency circuit as claimed in any one of claims 1 to 11.

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