Packaging structure, manufacturing method thereof and camera module

Abstract

The invention relates to a packaging structure, a manufacturing method thereof and a camera module. The packaging structure comprises a substrate, a micro-display and a light-transmitting sheet, the micro-display is located on the substrate, the light-transmitting sheet is located on the side, away from the substrate, of the micro-display, and a packaging layer is arranged between the micro-display and the light-transmitting sheet; a display area of the micro-display corresponds to the position of the light-transmitting sheet, the position, corresponding to the display area, of the packaging layer is hollowed out, a first channel is formed between the edge of at least one side of the micro-display and the packaging layer, and the first channel accommodates the surface and the side face of the edge part of the micro-display. The channel for accommodating the surface and the side surface of the edge part of the micro-display is arranged between the micro-display and the packaging layer, so that the stress of the packaging layer on the micro-display can be reduced, and the service life of a product is prolonged.

Description

Technical Field

[0001] The present application relates to the field of packaging technology, and specifically to a packaging structure and a manufacturing method thereof, and a camera module. Background Art

[0002] With the increasing market demand and miniaturization trend of AR (Augmented Reality) camera modules, the existing technology generally uses integrated injection molding technology based on MOC (Mold on Chip) process to encapsulate Micro-LED display screens. However, due to the different thermal expansion coefficients of the circuit board and the injection molding body in the camera module, when the temperature changes, the two will have different expansion or contraction degrees, which will cause uneven stress transmitted to the Micro-LED display screen, which may cause deformation or displacement of the display screen, affecting the display effect and module life.

[0003] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Summary of the invention

[0004] In response to the above technical problems, the present application provides a packaging structure and a manufacturing method thereof, and a camera module, which can reduce the stress of the packaging layer on the microdisplay and improve the service life of the product.

[0005] In order to solve the above technical problems, the present application provides a packaging structure, including a substrate, a micro display and a light-transmitting sheet;

[0006] The microdisplay is located on the substrate, the light-transmitting sheet is located on a side of the microdisplay away from the substrate, and an encapsulation layer is provided between the microdisplay and the light-transmitting sheet; the display area of ​​the microdisplay corresponds to the position of the light-transmitting sheet, the position of the encapsulation layer corresponding to the display area is hollowed out, and a first channel is formed between the encapsulation layer and at least one side edge of the microdisplay, and the first channel accommodates the edge portion surface and side of the microdisplay.

[0007] In some embodiments, three first channels are formed between the packaging layer and the three side edges of the micro display, and the three first channels are connected.

[0008] In some embodiments, the encapsulation layer further includes a second channel connected to the first channel.

[0009] In some embodiments, a concave area for accommodating the light-transmitting sheet is formed on a side of the encapsulation layer away from the microdisplay, and an arc-shaped chamfer is provided at an edge of the concave area. The height of the concave area corresponding to a preset position of the light-transmitting sheet is greater than the height of the position where the arc-shaped chamfer is located.

[0010] In some embodiments, the height of the concave area corresponding to the position of the light-transmitting sheet is greater than the radius of the arc chamfer.

[0011] The present application also provides a method for manufacturing a packaging structure, comprising the following steps:

[0012] S1. Providing a substrate;

[0013] S2. A microdisplay is provided on the substrate;

[0014] S3. forming an encapsulation layer above the microdisplay, wherein a position on the encapsulation layer corresponding to the display area of ​​the microdisplay is hollowed out, and a first channel is formed between the encapsulation layer and at least one side edge of the microdisplay, wherein the first channel accommodates the edge portion of the surface and the side of the microdisplay;

[0015] S4. A light-transmitting sheet is arranged above the encapsulation layer, and the position of the light-transmitting sheet corresponds to the display area of ​​the microdisplay.

[0016] In some embodiments, the step S3 comprises:

[0017] A compensating member is disposed on at least one side edge of the micro display, wherein a first portion of the compensating member covers a surface and a side of an edge portion of the micro display, and a second portion of the compensating member is connected to the first portion;

[0018] forming the encapsulation layer above the compensation member, and arranging a position of the encapsulation layer corresponding to the display area of ​​the micro display to be hollowed out, and at least an area of ​​the second portion is exposed from the encapsulation layer;

[0019] Removing the compensating member to obtain the first channel and a second channel connected to the first channel;

[0020] The second channel is sealed.

[0021] In some embodiments, removing the compensating piece includes:

[0022] Processing the packaging structure under preset conditions to change the compensating element from a solid state to a fluid state;

[0023] Remove the fluid compensating element.

[0024] In some embodiments, the step S4 comprises:

[0025] A concave area for accommodating the light-transmitting sheet is formed on a side of the encapsulation layer away from the micro display, and an arc-shaped chamfer is provided at an edge of the concave area;

[0026] Setting the height of the preset position of the concave area to be greater than the height of the position where the arc chamfer is located;

[0027] The light-transmitting sheet is arranged at the preset position.

[0028] The present application also provides a camera module, including a packaging structure and at least one lens, wherein the packaging structure is any of the packaging structures described above and / or is manufactured using a manufacturing method of any of the packaging structures described above, and the lens is arranged on the upper surface of the packaging structure, and the lens is arranged above the light-transmitting sheet.

[0029] The packaging structure and manufacturing method of the present application, and the camera module, the packaging structure includes: a substrate, a microdisplay and a light-transmitting sheet; the microdisplay is located on the substrate, the light-transmitting sheet is located on the side of the microdisplay away from the substrate, and a packaging layer is provided between the microdisplay and the light-transmitting sheet; the display area of ​​the microdisplay corresponds to the location of the light-transmitting sheet, the location of the packaging layer corresponding to the display area is hollowed out, and a first channel is formed between at least one side edge of the microdisplay and the packaging layer, and the first channel accommodates the edge surface and side of the microdisplay. The present application sets a channel between the microdisplay and the packaging layer to accommodate the edge surface and side of the microdisplay, which can reduce the stress of the packaging layer on the microdisplay and improve the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a cross-sectional schematic diagram of a packaging structure according to an embodiment of the present application.

[0031] Figure 2 It is one of the overall schematic diagrams of the packaging structure shown according to the embodiment of the present application.

[0032] Figure 3 This is the second overall schematic diagram of the packaging structure shown according to the embodiment of the present application.

[0033] Figure 4 It is an exploded schematic diagram of a packaging structure according to an embodiment of the present application.

[0034] Figure 5 It is a flow chart of a method for manufacturing a packaging structure according to an embodiment of the present application. DETAILED DESCRIPTION

[0035] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0036] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may be used and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0037] Although the terms first, second, etc. are used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element.

[0038] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0039] First embodiment

[0040] like Figure 1 As shown, the packaging structure provided in the embodiment of the present application includes a substrate 40, a micro display 30 and a light-transmitting sheet 10;

[0041] The microdisplay 30 is located on the substrate 40, and the microdisplay 30 is electrically connected to the substrate 40. The light-transmitting sheet 10 is located on the side of the microdisplay 30 away from the substrate 40, and an encapsulation layer 20 is provided between the microdisplay 30 and the light-transmitting sheet 10. The display area of ​​the microdisplay 30 corresponds to the location of the light-transmitting sheet 10, and the location of the encapsulation layer 20 corresponding to the display area is hollowed out, and a first channel 22 is formed between the encapsulation layer 20 and at least one side edge of the microdisplay 30, and the first channel 22 accommodates the edge surface and side surface of the microdisplay 30.

[0042] In some embodiments, the substrate 40 may include a multilayer circuit board having three or more conductive layers separated and bonded together by insulating materials (such as resin and glass fiber prepreg). The multilayer circuit board can accommodate more complex circuits in a smaller space, support higher component density and higher-speed signal transmission, and is conducive to the miniaturization and high performance of the packaging structure.

[0043] In some embodiments, the microdisplay 30 is used to superimpose digital information or virtual images within the user's field of vision to achieve an enhanced display effect. The microdisplay 30 may include a display screen such as TFT-LCD, OLED, LED, QLED, Mini-LED, or Micro-LED.

[0044] In some embodiments, the micro display 30 can be disposed on the substrate 40 by DB (Die Bonding) and the electrical connection between the micro display 30 and the substrate 40 can be achieved by WB (Wire Bonding).

[0045] In some embodiments, the light-transmitting sheet 10 is located on a side of the microdisplay 30 away from the substrate 40, for light transmission and protection of the microdisplay 30. The light-transmitting sheet 10 can be made of colorless and transparent glass or resin material. The display area of ​​the microdisplay 30 corresponds to the location of the light-transmitting sheet 10, which is conducive to sufficient light transmission.

[0046] In some embodiments, the area on the microdisplay 30 for displaying images or receiving touch input is the display area (i.e., the active area) of the microdisplay 30, and the other areas of the microdisplay 30 are inactive areas. An encapsulation layer 20 is provided between the microdisplay 30 and the light-transmitting sheet 10, and the position of the encapsulation layer 20 corresponding to the display area is hollowed out to prevent the encapsulation layer 20 from blocking the display image of the microdisplay 30. For the inactive area of ​​the microdisplay 30 and the area on the substrate 40 where the microdisplay 30 is not provided, the encapsulation layer 20 can be formed by an integral injection molding technology to protect the microdisplay 30 and other devices on the substrate 40.

[0047] In some embodiments, a first channel 22 is formed between the edge of at least one side of the microdisplay 30 and the encapsulation layer 20, and the first channel 22 accommodates the edge portion of the surface and side of the microdisplay 30. An isolation channel is formed at at least one side edge of the microdisplay 30 to reduce the contact area between the encapsulation layer 20 and the microdisplay 30, and to reduce the stress of the encapsulation layer 20 on the microdisplay 30. Since the thermal expansion coefficients of the substrate 40 and the encapsulation layer 20 are different, the stresses respectively transmitted to the microdisplay 30 by the substrate 40 and the encapsulation layer 20 are also inconsistent under different application environments. By setting at least one isolation channel (first channel 22) between the encapsulation layer 20 and the microdisplay 30, the embodiment of the present application can effectively avoid deformation or displacement of the microdisplay 30 due to uneven force, thereby improving the overall reliability of the encapsulation structure.

[0048] In some embodiments, three first channels 22 are formed between the encapsulation layer 20 and the three side edges of the micro display 30 , and the three first channels 22 are connected to each other.

[0049] As an implementation method of this embodiment, Figure 2 As shown, interconnected first channels 22 are provided above and on both sides of the micro display 30. In this way, the contact area between the encapsulation layer 20 and the micro display 30 can be greatly reduced, and the stress of the encapsulation layer 20 on the micro display 30 can be reduced.

[0050] As another implementation of this embodiment, the first channel 22 may be provided only above the microdisplay 30, or on both sides or one side of the microdisplay 30. This can reduce the stress of the packaging layer 20 on the microdisplay 30 and simplify the design and manufacturing process of the packaging structure.

[0051] In some embodiments, the encapsulation layer 20 further includes a second channel 23 connected to the first channel 22 .

[0052] As an implementation method of this embodiment, Figure 3 As shown, a second channel 23 connected to the first channel 22 can be provided on the side of the packaging layer 20, and the second channel 23 is in a sealed state in the finished packaging structure. The second channel 23 can be used to guide the compensation piece in a fluid state during the manufacturing process of the first channel 22 to form the first channel 22. Finally, when the packaging structure is completed, the second channel 23 can be sealed with glue to achieve the effect of sealing the channel opening. In other embodiments, a waterproof and breathable membrane can also be provided at the position of the second channel 23 to prevent particles such as dust from entering the interior of the module, and to facilitate the heat dissipation generated by the micro display 30 after operation.

[0053] Specifically, Figure 4As shown, in the process of making the packaging structure, the micro display 30 is arranged on the substrate 40, and the micro display 30 and the substrate 40 are connected by a gold wire 70. A connector 60 is also provided on the substrate, such as a BTB (Board-to-Board) connector, which is used to achieve mechanical and electrical connection between the two circuit boards. A compensating member 50 is arranged above the micro display 30 to cover the edge surface and sidewall of the micro display 30. Among them, the compensating member 50 includes a first part 51 and a second part 52, which are used to form a first channel 22 and a second channel 23. It can be understood that the first part 51 of the compensating member 50 corresponds to the first channel 22, and the second part 52 corresponds to the second channel 23. A packaging layer 20 is formed above the compensating member 50, covering the micro display 30, the compensating member 50 and the gold wire 70. The material of the compensating member 50 can use a high-temperature melting material or a high-temperature vaporizing material, a material soluble in an organic solvent or water. The compensating member 50 is processed under preset conditions to become a fluid state, and flows out from the corresponding position of the second channel 23, thereby forming a first channel 22 and a second channel 23 between the encapsulation layer 20 and the micro display 30. Then, the second channel 23 can be sealed by dispensing glue to prevent the environment of the encapsulation structure from contaminating the micro display 30. Finally, the light-transmitting sheet 10 is attached above the encapsulation layer 20.

[0054] In some embodiments, a concave area for accommodating the light-transmitting sheet 10 is formed on one side of the encapsulation layer 20 away from the microdisplay 30. The edge of the concave area is provided with an arc chamfer. The height of the concave area corresponding to the preset position of the light-transmitting sheet 10 is greater than the height of the position where the arc chamfer is located.

[0055] As an implementation method of this embodiment, please refer to Figure 1 The side of the encapsulation layer 20 away from the micro display 30 forms a concave area for accommodating the light-transmitting sheet 10. The area in the encapsulation layer 20 for installing the light-transmitting sheet 10 (i.e., the concave area) is larger than the area of ​​the light-transmitting sheet 10 to facilitate installation. The edge of the concave area is provided with an arc chamfer 21. The height of the preset position for attaching the light-transmitting sheet 10 in the concave area is greater than the height of the position where the arc chamfer 21 is located, so that the light-transmitting sheet 10 is fully in contact with the encapsulation layer 20 and is not restricted by the shape of the arc chamfer 21. In addition, the attachment surface between the light-transmitting sheet 10 and the encapsulation layer 20 is relatively flat, which can ensure the flatness requirement of the light-transmitting sheet 10 after attachment.

[0056] In some embodiments, the height of the position of the concave area corresponding to the light-transmitting sheet 10 is greater than the radius of the arc chamfer. By designing the height of the position of the concave area corresponding to the light-transmitting sheet 10 to be greater than the radius of the arc chamfer, it is further ensured that the light-transmitting sheet 10 can be closely attached to the predetermined plane after installation, avoiding any gap or poor contact caused by height mismatch.

[0057] In some embodiments, a glue overflow groove (not shown in the figure) is formed between the arc chamfer 21 and the preset position in the concave area for attaching the light-transmitting sheet 10. The glue overflow groove can guide and limit the flow direction of the glue, effectively inhibit glue overflow, and improve reliability and process yield.

[0058] In some embodiments, an air escape groove (not shown) is designed in the concave area of ​​the packaging layer 20 for supporting the light-transmitting sheet 10 to discharge the gas accumulated in the internal space during the injection molding process, thereby effectively avoiding the problem of warping or even cracking of the assembled product due to gas expansion, further consolidating the structural strength and stability of the product, and ensuring the smooth progress of the assembly operation.

[0059] The packaging structure of the embodiment of the present application includes: a substrate, a microdisplay and a light-transmitting sheet; the microdisplay is located on the substrate, the light-transmitting sheet is located on the side of the microdisplay away from the substrate, and a packaging layer is provided between the microdisplay and the light-transmitting sheet; the display area of ​​the microdisplay corresponds to the location of the light-transmitting sheet, the location of the packaging layer corresponding to the display area is hollowed out, and a first channel is formed between at least one side edge of the microdisplay and the packaging layer, and the first channel accommodates the edge surface and side of the microdisplay. The present application sets a channel between the microdisplay and the packaging layer to accommodate the edge surface and side of the microdisplay, which can reduce the stress of the packaging layer on the microdisplay and improve the service life of the product.

[0060] Second embodiment

[0061] like Figure 5 As shown, a method for manufacturing a packaging structure provided in an embodiment of the present application includes the following steps:

[0062] S1. Provide a substrate.

[0063] In some embodiments, the substrate may include a multilayer circuit board having three or more conductive layers separated and bonded together by insulating materials (such as resin and glass fiber prepreg). The multilayer circuit board can accommodate more complex circuits in a smaller space, support higher component density and higher-speed signal transmission, and is conducive to the miniaturization and high performance of the packaging structure.

[0064] S2. Arrange a microdisplay on a substrate.

[0065] In some embodiments, the micro display may be disposed on the substrate by DB (Die Bonding) and the electrical connection between the micro display and the substrate may be achieved by WB (Wire Bonding).

[0066] S3. Form an encapsulation layer above the microdisplay, hollow out a position on the encapsulation layer corresponding to the display area of ​​the microdisplay, and form a first channel between the encapsulation layer and at least one side edge of the microdisplay, the first channel accommodating the edge portion surface and side of the microdisplay.

[0067] In some embodiments, an encapsulation layer may be formed on the microdisplay by integrated injection molding technology to protect the microdisplay and other devices on the substrate. At the same time, an isolation channel is formed on at least one side edge of the microdisplay to reduce the contact area between the encapsulation layer and the microdisplay, thereby alleviating the stress of the encapsulation layer on the microdisplay.

[0068] In some embodiments, step S3 comprises:

[0069] A compensating member is disposed on at least one side edge of the microdisplay, wherein a first portion of the compensating member covers a surface and a side of an edge portion of the microdisplay, and a second portion of the compensating member is connected to the first portion;

[0070] Forming an encapsulation layer above the compensation member, arranging a hollowing out of a position of the encapsulation layer corresponding to a display area of ​​the micro display, and at least an area of ​​the second portion is exposed from the encapsulation layer;

[0071] Removing the compensating member to obtain a first channel and a second channel connected to the first channel;

[0072] Seal the second channel.

[0073] As an implementation of this embodiment, a compensating member is provided above the microdisplay to cover the edge surface and sidewalls of the microdisplay. The compensating member may include a first portion and a second portion to form a first channel and a second channel. The first portion corresponds to the first channel, the second portion corresponds to the second channel, and an encapsulation layer is formed above the compensating member to cover the microdisplay and the compensating member. The compensating member is removed to form the first channel and the second channel between the encapsulation layer and the microdisplay. The second channel may then be sealed by dispensing to prevent the environment in which the encapsulation structure is located from contaminating the microdisplay.

[0074] In some embodiments, removing the compensating member includes:

[0075] Processing the package structure under preset conditions to change the compensating element from a solid state to a fluid state;

[0076] Remove the fluid compensating element.

[0077] As an implementation method of this embodiment, the material of the compensating member can be a high-temperature molten material or a high-temperature vaporized material, or a material soluble in an organic solvent or water. The compensating member is processed under preset conditions to become a fluid state, and flows out of the corresponding position of the second channel to remove the compensating member and form the first channel and the second channel.

[0078] S4. A light-transmitting sheet is disposed above the encapsulation layer, and the position of the light-transmitting sheet corresponds to the display area of ​​the microdisplay.

[0079] In some embodiments, the light-transmitting sheet is located on a side of the microdisplay away from the substrate for light transmission and protection of the microdisplay. The light-transmitting sheet can be made of colorless and transparent glass or resin material. The display area of ​​the microdisplay corresponds to the location of the light-transmitting sheet, which is conducive to sufficient light transmission.

[0080] In some embodiments, step S4 comprises:

[0081] A concave area for accommodating the light-transmitting sheet is formed on a side of the encapsulation layer away from the microdisplay, and an arc-shaped chamfer is provided at an edge of the concave area;

[0082] Setting the height of the preset position of the concave area to be greater than the height of the position where the arc chamfer is located;

[0083] A light-transmitting sheet is arranged at a preset position.

[0084] As an implementation method of this embodiment, a concave area for accommodating a light-transmitting sheet is formed on one side of the encapsulation layer away from the microdisplay, and the area in the encapsulation layer for installing the light-transmitting sheet (i.e., the concave area) is larger than the area of ​​the light-transmitting sheet to facilitate installation. The edge of the concave area is provided with an arc chamfer, and the height of the preset position for attaching the light-transmitting sheet in the concave area is greater than the height of the position where the arc chamfer is located, so that the light-transmitting sheet is in full contact with the encapsulation layer and is not restricted by the shape of the arc chamfer. In addition, the attachment surface between the light-transmitting sheet and the encapsulation layer is relatively flat, which can ensure the flatness requirement of the light-transmitting sheet after attachment.

[0085] In some embodiments, the height of the position of the light-transmitting sheet corresponding to the concave area is greater than the radius of the arc chamfer. By designing the height of the position of the light-transmitting sheet corresponding to the concave area to be greater than the radius of the arc chamfer, it is further ensured that the light-transmitting sheet can be closely attached to the predetermined plane after installation, avoiding any gap or poor contact caused by height mismatch.

[0086] In some embodiments, a glue overflow groove is formed between the preset position for attaching the light-transmitting sheet in the arc chamfer and the concave area. The glue overflow groove can guide and limit the flow direction of the glue, effectively inhibit glue overflow, and improve reliability and process yield.

[0087] In some embodiments, an air escape groove is designed in the concave area of ​​the packaging layer for supporting the light-transmitting sheet to discharge the gas accumulated in the internal space during the injection molding process, thereby effectively avoiding the problem of warping or even cracking of the product after assembly due to gas expansion, further consolidating the structural strength and stability of the product, and ensuring the smooth progress of the assembly operation.

[0088] For example, after the encapsulation layer is formed by integral injection molding, the temperature is raised to 175-240°C to melt or vaporize the compensation parts inside the encapsulation structure, or the semi-finished product is immersed in an organic solvent or water so that the compensation parts dissolve in water. The compensation parts in a fluid state are removed through the reserved second channel, so that a first channel is formed between the microdisplay and the encapsulation layer to reduce mutual contact, thereby achieving the purpose of reducing stress transfer. Then, after assembling the light-transmitting sheet by dispensing glue, the escape groove and the second channel opening of the compensation part are sealed by dispensing glue to prevent dirt from entering.

[0089] The manufacturing method of the packaging structure of the present application includes: providing a substrate. Arranging a microdisplay on the substrate. Forming an encapsulation layer above the microdisplay, hollowing out the position on the encapsulation layer corresponding to the display area of ​​the microdisplay, forming a first channel between at least one side edge of the microdisplay and the encapsulation layer, the first channel accommodating the edge surface and side of the microdisplay. Arranging a light-transmitting sheet above the encapsulation layer, the position of the light-transmitting sheet corresponding to the display area of ​​the microdisplay. The embodiment of the present application can reduce the stress exerted by the encapsulation layer on the microdisplay and improve the service life of the product by forming a channel between the microdisplay and the encapsulation layer to accommodate the edge surface and side of the microdisplay.

[0090] Third embodiment

[0091] The present application also provides a camera module, including a packaging structure and at least one lens. The packaging structure is the packaging structure described in the first embodiment above and / or is manufactured using the manufacturing method of the packaging structure described in the second embodiment. The lens is arranged on the upper surface of the packaging structure, and the lens is arranged above the light-transmitting sheet.

[0092] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A packaging structure, characterized in that: It includes a substrate, a micro display and a light-transmitting sheet; The microdisplay is located on the substrate, the light-transmitting sheet is located on a side of the microdisplay away from the substrate, and an encapsulation layer is provided between the microdisplay and the light-transmitting sheet; the display area of ​​the microdisplay corresponds to the position of the light-transmitting sheet, the position of the encapsulation layer corresponding to the display area is hollowed out, and a first channel is formed between the encapsulation layer and at least one side edge of the microdisplay, and the first channel accommodates the edge portion surface and side of the microdisplay.

2. The packaging structure according to claim 1, characterized in that: Three first channels are formed between the three side edges of the micro display and the packaging layer, and the three first channels are connected.

3. The packaging structure according to any one of claims 1 or 2, characterized in that: The encapsulation layer further includes a second channel connected to the first channel.

4. The packaging structure according to claim 1, characterized in that: A concave area for accommodating the light-transmitting sheet is formed on one side of the packaging layer away from the microdisplay, and an arc-shaped chamfer is provided at the edge of the concave area. The height of the concave area corresponding to a preset position of the light-transmitting sheet is greater than the height of the position where the arc-shaped chamfer is located.

5. The packaging structure according to claim 4, characterized in that: The height of the concave area corresponding to the position of the light-transmitting sheet is greater than the radius of the arc chamfer.

6. A method for manufacturing a packaging structure, characterized in that: The following steps are involved: S1. Providing a substrate; S2. A microdisplay is provided on the substrate; S3. forming an encapsulation layer above the microdisplay, wherein a position on the encapsulation layer corresponding to the display area of ​​the microdisplay is hollowed out, and a first channel is formed between the encapsulation layer and at least one side edge of the microdisplay, wherein the first channel accommodates the edge portion of the surface and the side of the microdisplay; S4. A light-transmitting sheet is arranged above the encapsulation layer, and the position of the light-transmitting sheet corresponds to the display area of ​​the microdisplay.

7. The manufacturing method according to claim 6, characterized in that: The S3 step comprises: A compensating member is disposed on at least one side edge of the micro display, wherein a first portion of the compensating member covers a surface and a side of an edge portion of the micro display, and a second portion of the compensating member is connected to the first portion; forming the encapsulation layer above the compensation member, and arranging a position of the encapsulation layer corresponding to the display area of ​​the micro display to be hollowed out, and at least an area of ​​the second portion is exposed from the encapsulation layer; Removing the compensating member to obtain the first channel and a second channel connected to the first channel; The second channel is sealed.

8. The method according to claim 7, characterized in that: The removing of the compensating member comprises: Processing the packaging structure under preset conditions to change the compensating element from a solid state to a fluid state; Remove the fluid compensating element.

9. The manufacturing method according to claim 6, characterized in that: The S4 step comprises: A concave area for accommodating the light-transmitting sheet is formed on a side of the encapsulation layer away from the micro display, and an arc-shaped chamfer is provided at an edge of the concave area; Setting the height of the preset position of the concave area to be greater than the height of the position where the arc chamfer is located; The light-transmitting sheet is arranged at the preset position.

10. A camera module, characterized in that: It includes a packaging structure and at least one lens, the packaging structure is the packaging structure as described in any one of claims 1 to 5 and / or is manufactured using the manufacturing method of the packaging structure as described in any one of claims 6 to 9, the lens is arranged on the upper surface of the packaging structure, and the lens is arranged above the light-transmitting sheet.

Images