A circuit board printing method for monitoring alignment between arbitrary layers

Abstract

The present invention provides a circuit board printing method for monitoring the alignment between any layers, comprising the following steps: S1: by designing corresponding coupons on the even-numbered layers of different core boards, the coupons are set by a paint spraying device, and the alignment between any layers of the multilayer board can be monitored by X-Ray; S2: illustrating the symbol size: the outer diameter a of the ring is 0.8mm, the inner diameter b of the ring is 0.5mm, and the diameter c of the circular PAD is 0.4mm; the center distance d of adjacent symbols is 1.0mm; S3: the design of coupons of different layers is shown in FIG4 below, and after the core boards of different layers are hot-melt superimposed, the alignment between the two layers can be determined by the overlap of the circular PADs after any two layers are superimposed. The present invention provides a circuit board printing method for monitoring the alignment between any layers, by designing corresponding coupons on the even-numbered layers of different core boards, and the alignment between any layers of the multilayer board can be monitored by X-Ray. It can effectively monitor the alignment between any core boards of high-layer boards, and provide a basis for quality judgment, improving interlayer alignment, and optimizing expansion and contraction compensation between different core boards.

Description

Technical Field

[0001] The present invention relates to the field of circuit board processing, and in particular to a circuit board printing method for monitoring the alignment degree between arbitrary layers. Background Art

[0002] In today's rapidly developing technological era, the field of electronic technology is undergoing unprecedented changes. As electronic products continue to develop towards miniaturization and high performance, the technical requirements for printed circuit boards (PCBs), as the core components of electronic products, are also increasing. In PCB manufacturing, high-layer boards are more and more widely used. In recent years, with the rapid advancement of technology, the number of layers of products has continued to increase, and the spacing between holes and copper conductors has become smaller and smaller. This trend has brought many challenges, especially the alignment requirements for high-layer boards have become increasingly stringent. High-layer boards play a vital role in electronic equipment. They carry various electronic components and realize circuit connection and signal transmission. In order to ensure product reliability, accurate inter-layer alignment is one of the key factors. If the inter-layer alignment deviates, it may cause poor circuit connection, blocked signal transmission, and even affect the performance and stability of the entire electronic equipment. At present, for some layers that exceed For high-layer 16L boards, the traditional concentric circle coupon method is gradually showing its limitations in determining interlayer alignment. Traditional concentric circle coupons primarily determine interlayer alignment by measuring the relative positions of concentric circle patterns on different layers. However, with the increase in the number of layers and rising design requirements, this method is no longer able to comprehensively and effectively determine whether the alignment between any two layers meets design requirements. On the one hand, traditional methods can only perform limited alignment testing on specific layers and cannot cover all interlayer combinations. For high-layer boards, the alignment between any two layers may affect product quality and performance, and traditional concentric circle coupons are unable to meet the monitoring requirements for any interlayer alignment. On the other hand, as the spacing between the hole and the copper conductor decreases, the requirement for alignment accuracy becomes even higher.Traditional methods may not be able to accurately detect tiny alignment deviations, and thus cannot discover potential quality problems in a timely manner. In the production process of high-layer boards, the alignment deviation of any layer may be magnified in the subsequent manufacturing links, ultimately leading to an increase in product defect rates. In order to meet these challenges and meet the market's increasingly stringent quality requirements for high-layer boards, it is urgent to design a new inter-layer alignment Coupon. This new Coupon should be able to effectively monitor the alignment between any layers and provide accurate quality feedback for the production process. By real-time monitoring of inter-layer alignment, the production process can be adjusted in a timely manner to improve the yield and reliability of the product. The new inter-layer alignment Coupon can Adopt more advanced measurement technology and design concepts. For example, high-precision optical detection equipment can be used in combination with digital image processing technology to achieve accurate measurement of interlayer alignment. At the same time, by optimizing the design structure of Coupon, it can better adapt to the complex structure and tight spacing requirements of high-layer boards. In short, under the background of the rapid development of electronic technology, the requirements for interlayer alignment of high-layer boards are constantly increasing. The traditional concentric circle Coupon method can no longer meet the needs. Designing a new interlayer alignment Coupon is of great significance to improving product yield and reliability. This is not only a challenge faced by the PCB manufacturing industry, but also an opportunity to promote technological progress in the industry.

[0003] The currently commonly used concentric circle coupon design can only monitor whether adjacent layers are offset. When the number of layers is large, it cannot effectively monitor the alignment between any layers.

[0004] Therefore, it is necessary to provide a circuit board printing method that monitors the alignment between any layers to solve the above technical problems. Summary of the Invention

[0005] The present invention provides a circuit board printing method for monitoring the alignment between arbitrary layers, which solves the problem that the currently commonly used concentric circle coupon design can only monitor whether adjacent layers are offset, but cannot effectively monitor the alignment between arbitrary layers when the number of layers is large.

[0006] To solve the above technical problems, the present invention provides a circuit board printing method for monitoring the alignment between any layers, comprising the following steps: S1: designing corresponding coupons on even-numbered layers of different core boards, setting the coupons through a paint spraying device, and monitoring the alignment between any layers of the multilayer board through X-ray;

[0007] S2: Example of Symbol size: Ring outer diameter a: 0.8mm, Ring inner diameter b: 0.5mm, PAD diameter c: 0.4mm; Center distance d between adjacent Symbols: 1.0mm;

[0008] S3: Coupon design with different layers. After hot-melt stacking of core boards with different layers, the alignment between any two layers can be determined by the overlap of the circular PADs after stacking.

[0009] S4: Observe the symmetrical layout of the four corners of the work board.

[0010] Preferably, the core panels of different layers can also be stacked by riveting.

[0011] Preferably, in step S1 of the coupon design for monitoring the alignment between any layers, a paint spraying device is required when setting the coupon, and the paint spraying device includes: a moving device; a rotating device is slidably mounted on the bottom of the moving device, the moving device includes a connecting box, a moving slot, a first servo motor and a reciprocating screw, and the rotating device includes a fixed box, a second servo motor, a rotating box and a threaded block;

[0012] Threaded ring plates, four of which are fixedly mounted around the bottom of the rotating device, and the outer surfaces of the threaded ring plates are threadedly engaged with a storage device, which includes a storage cylinder, a feed pipe, a pump body, and a threaded groove;

[0013] The discharging device is threadedly engaged with the bottom of the outer surface of the storage device, and the discharging device includes a discharge cone barrel and a threaded ring block.

[0014] Preferably, the movable groove is opened in the middle of the bottom of the connecting box, the first servo motor is fixedly installed on one side of the outer surface of the connecting box, and the reciprocating screw is fixedly connected to the output shaft of the first servo motor.

[0015] Preferably, the threaded block is threadedly engaged with the outer surface of the reciprocating screw, the fixed box is fixedly installed at the bottom of the threaded block, the second servo motor is fixedly installed in the middle of the bottom of the fixed box, and the rotating box is fixedly connected to the bottom end of the output shaft of the second servo motor.

[0016] Preferably, the storage barrel is threadedly engaged with the outer surface of the threaded ring plate, the feed pipe is fixedly installed on one side of the outer surface of the storage barrel, the thread groove is opened in the middle of the top of the feed pipe, and the pump body is arranged on the surface of the storage barrel.

[0017] Preferably, the threaded ring block is threadably engaged with the bottom of the threaded groove, and the blanking cone barrel is fixedly connected to the bottom of the threaded ring block.

[0018] Preferably, the threaded block and the movable groove are adapted to each other.

[0019] A connecting rod is fixedly installed in the middle of the top of the connection box, and a base is fixedly installed at the bottom end of the connecting rod.

[0020] A control panel is fixedly installed on the top of the fixing box.

[0021] Compared with related technologies, the circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention has the following beneficial effects:

[0022] The present invention provides a circuit board printing method for monitoring the alignment between any layers. By designing corresponding coupons on the even-numbered layers (or odd-numbered layers) of different core boards, the alignment between any layers of the multilayer board can be monitored through X-ray. The alignment between any core boards of a high-layer board can be effectively monitored, providing a basis for quality judgment, improving inter-layer alignment, and optimizing expansion and contraction compensation between different core boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic structural diagram of a first embodiment of a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention;

[0024] Figure 2 A schematic diagram showing an example of Symbol size for a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention;

[0025] Figure 3 A schematic diagram of an arrangement of a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention;

[0026] Figure 4 Coupon designs for different layers of a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention;

[0027] Figure 5 The four corners of the working board of the circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention are symmetrically arranged;

[0028] Figure 6 A schematic structural diagram of a second embodiment of a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention;

[0029] Figure 7 for Figure 6 The schematic diagram of the structure of the mobile device shown;

[0030] Figure 8 for Figure 6 The schematic diagram of the rotating device structure shown;

[0031] Figure 9 for Figure 6 The schematic diagram of the discharging device structure shown;

[0032] Figure 10 for Figure 6The schematic diagram of the storage device structure is shown.

[0033] Numbers in the figure: 1. Moving device, 101. Connecting box, 102. Moving groove, 103. First servo motor, 104. Reciprocating screw, 2. Rotating device, 201. Fixed box, 202. Second servo motor, 203. Rotating box, 204. Threaded block, 3. Control panel, 4. Storage device, 41. Storage cylinder, 42. Feed pipe, 43. Pump body, 44. Threaded groove, 5. Discharging device, 51. Unloading cone barrel, 52. Threaded ring block, 6. Connecting rod, 7. Base, 8. Threaded ring plate. DETAILED DESCRIPTION

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0035] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 ,in, Figure 1 A schematic structural diagram of a first embodiment of a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention; Figure 2 A schematic diagram showing an example of Symbol size for a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention; Figure 3 A schematic diagram of an arrangement of a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention; Figure 4 Coupon designs for different layers of a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention; Figure 5 The present invention provides a circuit board printing method for monitoring the alignment between arbitrary layers. The working board has a symmetrical layout at the four corners. A circuit board printing method for monitoring the alignment between arbitrary layers includes the following steps: S1: by designing corresponding coupons on the even layers of different core boards, the coupons are set by a paint spraying device, and the alignment between arbitrary layers of the multilayer board can be monitored by X-Ray, as follows Figure 1 As shown;

[0036] S2: Example of Symbol size: Ring outer diameter a: 0.8mm, Ring inner diameter b: 0.5mm, PAD diameter c: 0.4mm; Center distance d between adjacent Symbols: 1.0mm;

[0037] S3: Coupon design with different layers. After hot-melt stacking of core boards with different layers, the alignment between any two layers can be determined by the overlap of the circular PADs after stacking.

[0038] S4: Observe the symmetrical layout of the four corners of the work board.

[0039] The core panels of different layers can also be stacked by riveting.

[0040] Symbol size can be changed. As a measurement reference, take the even-numbered layers as an example. Figure 4 The first picture shows the display of the second layer. The even numbers are set to 2, 4, 6, etc. The first even-numbered picture is the second stacked circuit board. One point is sprayed on the board with the horizontal and vertical coordinates of 1, 1. The second even-numbered picture is the fourth stacked circuit board. Two points are sprayed on the board with the horizontal and vertical coordinates of 2, 2. When the first, second and third circuit boards are stacked, the point in the middle of the connecting hole is visually observed, and the distance between the points can be measured to determine whether there is an offset.

[0041] The working principle of the circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention is as follows:

[0042] During operation, first of all, because layer deviation mainly occurs between different core boards, the probability of layer deviation between the same core boards is relatively small. Therefore, in order to reduce the size of the entire coupon and facilitate monitoring, coupon graphics are only designed on the even-numbered layers (or odd-numbered layers, whichever is greater) of different core boards;

[0043] Note 2: Numbers and letters represent corresponding levels; A stands for 10, B for 12, C for 14, D for 16, E for 18, F for 20, and so on.

[0044] like Figure 2 As shown in the figure, the parameters such as the symbol size are illustrated as follows: the outer diameter of the ring a: 0.8mm, the inner diameter of the ring b: 0.5mm, the diameter of the circle PAD c: 0.4mm; the center distance between adjacent symbols d: 1.0mm.

[0045] The coupon designs for different levels are as follows Figure 4 As shown, the hot-melt or riveted stacking of core panels of different layers is shown in the last figure above. The alignment between the two layers can be determined by the overlap between the circular PADs or circles after any two layers are stacked.

[0046] like Figure 4 As shown, taking the even-numbered layers as an example, Figure 4 The first picture shows the display of the second layer. The even numbers are set to 2, 4, 6, etc. The first even-numbered picture is the second stacked circuit board. One point is sprayed on the board with the horizontal and vertical coordinates of 1, 1. The second even-numbered picture is the fourth stacked circuit board. Two points are sprayed on the board with the horizontal and vertical coordinates of 2, 2. When the first, second and third circuit boards are stacked, the point in the middle of the connecting hole is visually observed, and the distance between the points can be measured to determine whether there is an offset.

[0047] Compared with related technologies, the circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention has the following beneficial effects:

[0048] The present invention provides a circuit board printing method for monitoring the alignment between any layers. By designing corresponding coupons on the even-numbered layers (or odd-numbered layers) of different core boards, the alignment between any layers of the multilayer board can be monitored through X-ray. The alignment between any core boards of a high-layer board can be effectively monitored, providing a basis for quality judgment, improving inter-layer alignment, and optimizing expansion and contraction compensation between different core boards. Example

[0049] Please refer to Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10 Based on the first embodiment of this application, which provides a circuit board printing method for monitoring alignment between arbitrary layers, the second embodiment of this application provides another circuit board printing method for monitoring alignment between arbitrary layers. The second embodiment is merely a preferred embodiment of the first embodiment, and implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0050] Specifically, the difference of the circuit board printing method for monitoring the alignment between arbitrary layers provided by the second embodiment of the present application is that, in a circuit board printing method for monitoring the alignment between arbitrary layers, in step S1 of the coupon design for monitoring the alignment between arbitrary layers, a paint spraying device is required when setting the coupon, and the paint spraying device includes: a moving device 1; a rotating device 2 is slidably installed at the bottom of the moving device 1, the moving device 1 includes a connecting box 101, a moving slot 102, a first servo motor 103 and a reciprocating screw 104, and the rotating device 2 includes a fixed box 201, a second servo motor 202, a rotating box 203 and a threaded block 204;

[0051] Threaded ring plates 8, four of which are fixedly mounted around the bottom of the rotating device 2, and the outer surfaces of the threaded ring plates 8 are threadedly engaged with the storage device 4, which includes a storage cylinder 41, a feed pipe 42, a pump body 43 and a threaded groove 44;

[0052] The discharging device 5 is threadedly engaged with the bottom of the outer surface of the storage device 4, and the discharging device includes a discharge cone barrel and a threaded ring block.

[0053] The movable slot 102 is opened in the middle of the bottom of the connection box 101 , the first servo motor 103 is fixedly installed on one side of the outer surface of the connection box 101 , and the reciprocating screw 104 is fixedly connected to the output shaft of the first servo motor 103 .

[0054] The threaded block 204 is threadedly engaged with the outer surface of the reciprocating screw 104, the fixed box 201 is fixedly installed at the bottom of the threaded block 204, the second servo motor 202 is fixedly installed in the middle of the bottom of the fixed box 201, and the rotating box 203 is fixedly connected to the bottom end of the output shaft of the second servo motor 202.

[0055] The storage cylinder 41 is threadedly engaged with the outer surface of the threaded ring plate 8, the feed pipe 42 is fixedly installed on one side of the outer surface of the storage cylinder 41, the threaded groove 44 is opened in the middle of the top of the feed pipe 42, and the pump body 43 is arranged on the surface of the storage cylinder 41.

[0056] The threaded ring block 52 is threadably engaged with the bottom of the threaded groove 44 , and the blanking cone 51 is fixedly connected to the bottom of the threaded ring block 52 .

[0057] The threaded block 204 is adapted to the movable groove 102 .

[0058] A connecting rod 6 is fixedly mounted in the middle of the top of the connection box 101 , and a base 7 is fixedly mounted at the bottom end of the connecting rod 6 .

[0059] A control panel 3 is fixedly mounted on the top of the fixing box 201 .

[0060] The working principle of the circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention is as follows:

[0061] During operation, the storage cylinder 41 is first rotated to disengage the threaded groove 44 from the threaded ring plate 8. After the storage cylinder 41 is removed, the unloading cone barrel 51 is rotated, and the threaded ring block 52 is removed from the threaded groove 44 for cleaning.

[0062] The spraying material is added to the interior of the storage cylinder 41 through the feed pipe 42 , and a mounting cap is threadedly mounted on the surface of the feed pipe 42 .

[0063] An external power supply controls the first servo motor 103 to rotate and drive the reciprocating screw 104 to rotate. The reciprocating screw 104 rotates the thread to engage the threaded block 204. The threaded block 204 drives the fixed box 201 to slide left and right. The output shaft of the second servo motor 202 is controlled by an external power supply to rotate and drive the rotating box 203 and the storage device 4 to rotate, thereby adjusting the spraying position and selecting the spraying color.

[0064] Compared with related technologies, the circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention has the following beneficial effects:

[0065] The present invention provides a circuit board printing method for monitoring the alignment between any layers. By rotating the storage cylinder 41 so that the threaded groove 44 is threadedly engaged and disengaged from the threaded ring plate 8, the storage device 4 is disassembled for cleaning. The user can also disassemble the blanking cone barrel 51 from the surface of the storage device 4 to improve the cleaning effect of the storage device 4. At the same time, multiple storage devices 4 are provided to store multiple colors for spraying, thereby improving the recognition of different marks. The device has a simple structure and strong practicality. The operator can conveniently disassemble the storage device 4 storing paint, which is convenient for the operator to disassemble and clean the storage device 4, thereby keeping the inside of the storage device 4 clean, reducing pigment residue, and maintaining the singleness of color during the next spraying.

[0066] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A circuit board printing method for monitoring the alignment between arbitrary layers, characterized in that: The following steps are involved: S1: By designing corresponding coupons on the even-numbered layers of different core boards, the coupons are set through a spraying device, and the alignment between any layers of the multilayer board can be monitored by X-ray; S2: Symbol size: ring outer diameter a: 0.8mm, ring inner diameter b: 0.5mm, circle PAD diameter c: 0.4mm; center distance d between adjacent symbols: 1.0mm; S3: Coupon design with different layers. After hot-melt stacking of core boards with different layers, the alignment between any two layers can be determined by the overlap of the circular PADs after stacking. S4: Observe the symmetrical layout of the four corners of the work board; The different layers of core plates can also be stacked by riveting; In step S1 of the coupon design for monitoring the alignment between any layers, a spray paint device is required when setting the coupon, and the spray paint device includes: a moving device; a rotating device is slidably mounted on the bottom of the moving device, the moving device includes a connecting box, a moving slot, a first servo motor and a reciprocating screw, and the rotating device includes a fixed box, a second servo motor, a rotating box and a threaded block; Threaded ring plates, four of which are fixedly mounted around the bottom of the rotating device, and the outer surfaces of the threaded ring plates are threadedly engaged with a storage device, which includes a storage cylinder, a feed pipe, a pump body, and a threaded groove; The discharging device is threadedly engaged with the bottom of the outer surface of the storage device, and the discharging device includes a discharge cone barrel and a threaded ring block.

2. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 1, characterized in that: The movable groove is opened in the middle of the bottom of the connection box, the first servo motor is fixedly installed on one side of the outer surface of the connection box, and the reciprocating screw is fixedly connected to the output shaft of the first servo motor.

3. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 1, characterized in that: The threaded block is threadedly engaged with the outer surface of the reciprocating screw, the fixed box is fixedly installed at the bottom of the threaded block, the second servo motor is fixedly installed in the middle of the bottom of the fixed box, and the rotating box is fixedly connected to the bottom end of the output shaft of the second servo motor.

4. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 1, characterized in that: The storage barrel is threadedly engaged with the outer surface of the threaded ring plate, the feed pipe is fixedly installed on one side of the outer surface of the storage barrel, the thread groove is opened in the middle of the top of the feed pipe, and the pump body is arranged on the surface of the storage barrel.

5. The method for printing a circuit board for monitoring the alignment between arbitrary layers according to claim 1, characterized in that: The threaded ring block is threadably engaged with the bottom of the threaded groove, and the blanking cone barrel is fixedly connected to the bottom of the threaded ring block.

6. A circuit board printing method for monitoring alignment between arbitrary layers according to claim 1, characterized in that: The threaded block is matched with the moving groove.

7. A circuit board printing method for monitoring alignment between arbitrary layers according to claim 1, characterized in that: A connecting rod is fixedly installed in the middle of the top of the connection box, and a base is fixedly installed at the bottom end of the connecting rod.

8. A circuit board printing method for monitoring alignment between arbitrary layers according to claim 7, characterized in that: A control panel is fixedly installed on the top of the fixing box.

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