Method and device for controlling bonding area manufacturing process of semiconductor device

Abstract

This embodiment provides a method and device for controlling the bonding area manufacturing process of a semiconductor device, including: obtaining the design data of a bonding pad; identifying the right-angle positions in the design data of the bonding pad; generating a right-angled triangle with an additional design area corresponding to the right-angle positions; adding the right-angled triangle with the additional design area to the right-angle positions in the design data of the bonding pad to obtain new design data of the bonding pad; performing the manufacturing steps of the bonding pad according to the new design data of the bonding pad; considering factors such as cost and processing time, fitting different factors with the additional design area to obtain the optimal additional design area, reducing material loss, reducing cost, shortening the etching time, not extending the processing time, and ensuring the operating performance of the equipment.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and particularly to a method for controlling a bonding area manufacturing process of a semiconductor device, a device for controlling a bonding area manufacturing process of a semiconductor device, a computer device, and a storage medium. Background Art

[0002] In the existing manufacturing method of the bonding pads on the Bonding board, during the processing of the originally designed right-angle corner position, due to three-sided etching, the corner and the middle position will be etched more, and the finished corner position will become rounded, which does not conform to the original right-angle design of the customer. At the same time, after the middle is etched more, the width is too small, affecting the subsequent Bonding processing. Summary of the Invention

[0003] In view of the above problems, the present embodiment is proposed to provide a device for controlling a bonding area manufacturing process of a semiconductor device, a computer device, and a storage medium that overcome the above problems or at least partially solve the above problems.

[0004] To solve the above problems, the present embodiment discloses a method for controlling a bonding area manufacturing process of a semiconductor device, including:

[0005] Obtaining design data of the bonding pads;

[0006] Identifying right-angle positions in the design data of the bonding pads;

[0007] Generating a right-angled triangle with an additional designed area corresponding to the right-angle position;

[0008] Adding the right-angled triangle with the additional designed area to the right-angle position in the design data of the bonding pads to obtain new design data of the bonding pads;

[0009] Performing the manufacturing steps of the bonding pads according to the new design data of the bonding pads.

[0010] Preferably, the generating a right-angled triangle with an additional designed area corresponding to the right-angle position includes:

[0011] Obtaining material loss index data, equipment processing data, and etching time data;

[0012] Obtaining an initial added area;

[0013] Correcting the initial added area according to the material loss index data, equipment processing data, and etching time data to obtain the additional designed area corresponding to the right-angle position, and generating a right-angled triangle with the additional designed area corresponding to the right-angle position.

[0014] Preferably, the step of fabricating the bonding pad according to the design data of the new bonding pad includes:

[0015] The control device performs a laser drilling operation to obtain a drilled circuit board;

[0016] The drilled circuit board is thickened with electroplated copper in the vias to obtain an electroplated circuit board;

[0017] After forming a dry film circuit pattern on the electroplated circuit board, the copper circuit of the bonding pad is etched to obtain the bonding pad.

[0018] Preferably, the step of correcting the initial added area according to the material loss index data, equipment processing data, and etching time data to obtain the additional design area corresponding to the right-angle position includes:

[0019] Generate a characteristic fitting function according to the material loss index data, equipment processing data, etching time data, historical initial added area, and historical additional design area;

[0020] Correct the initial added area according to the characteristic fitting function to generate the additional design area corresponding to the right-angle position.

[0021] Preferably, the step of adding the right triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain the design data of the new bonding pad includes:

[0022] Identify the right-angle position in the design data of the bonding pad;

[0023] Determine the intersecting right-angle side position of the etching edge from the right-angle position;

[0024] Add the additional design area to the intersecting right-angle side position of the etching edge.

[0025] This embodiment discloses a bonding area manufacturing process control device for a semiconductor device, including:

[0026] A design data acquisition module for acquiring the design data of the bonding pad;

[0027] An identification module for identifying the right-angle position in the design data of the bonding pad;

[0028] A generation module for generating a right triangle of the additional design area corresponding to the right-angle position;

[0029] An addition module for adding the right triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain the design data of the new bonding pad;

[0030] A manufacturing module for performing the manufacturing steps of the bonding pads according to the design data of the new bonding pads.

[0031] Preferably, the generating module includes:

[0032] A first acquisition sub-module for acquiring material loss index data, equipment processing data, and corrosion time data;

[0033] A second acquisition sub-module for acquiring the initial added area;

[0034] A generating sub-module for correcting the initial added area according to the material loss index data, equipment processing data, and corrosion time data to obtain the additional design area corresponding to the right-angle position, and generating a right triangle of the additional design area corresponding to the right-angle position.

[0035] Preferably, the manufacturing module includes:

[0036] A first control sub-module for controlling the equipment to perform laser drilling operations to obtain a drilled circuit board;

[0037] A second control sub-module for thickening the electroplated copper inside the via holes of the drilled circuit board to obtain an electroplated circuit board;

[0038] A third corrosion sub-module for forming a dry film circuit pattern on the electroplated circuit board and corroding the bonding pad copper circuit to obtain the bonding pads.

[0039] This embodiment also discloses a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of the bonding area manufacturing process control of the semiconductor device described above are implemented.

[0040] This embodiment also discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the bonding area manufacturing process control of the semiconductor device described above are implemented.

[0041] This embodiment has the following advantages:

[0042] In an embodiment of the present invention, the method for controlling the bonding area manufacturing process of the semiconductor device includes: obtaining the design data of the bonding pad; identifying the right-angle positions in the design data of the bonding pad; generating a right-angled triangle with an additional design area corresponding to the right-angle positions; adding the right-angled triangle with the additional design area to the right-angle positions in the design data of the bonding pad to obtain the new design data of the bonding pad; performing the manufacturing steps of the bonding pad according to the new design data of the bonding pad; considering factors such as cost and processing time, fitting different factors with the additional design area to obtain the optimal additional design area, reducing material loss, reducing cost, shortening the etching time, not extending the processing time, and ensuring the operating performance of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in this embodiment, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0044] Figure 1 It is a flowchart of the steps of an embodiment of the method for controlling the bonding area manufacturing process of a semiconductor device in this embodiment;

[0045] Figure 2 It is a schematic diagram of the design of the copper circuit of a bonding pad in an embodiment of the present invention;

[0046] Figure 3 It is a schematic diagram of adding an additional design area to the copper circuit of a bonding pad in an embodiment of the present invention;

[0047] Figure 4 It is a schematic diagram of adding a right-angled triangle corresponding to an additional design area to the intersecting right-angled side position of the etching edge in this embodiment;

[0048] Figure 5 It is a block diagram of the structure of an embodiment of the device for controlling the bonding area manufacturing process of a semiconductor device in this embodiment;

[0049] Figure 6 It is an internal structure diagram of a computer device in an embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0050] In order to make the technical problems, technical solutions, and beneficial effects solved by this embodiment clearer, the following further details this embodiment in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention and are not used to limit the present invention.

[0051] In a core concept of an embodiment of the present invention, an additional design area is added at the right-angle position of the bonding region of the bonding pad to form an inclined long triangular side. Due to three-sided etching at the position of the inclined long triangular side, the additional inclined long triangular side part, that is, the additional design area, is etched away. The finished product after etching is exactly close to a right angle, and the width of the bonding pad is more guaranteed, which is more in line with the original right-angle design of the Bonding board. The width of the bonding pad is wider, which is beneficial to the subsequent process; for the size of the additional design area, it can be fitted according to certain factors, such as material loss index data, equipment processing data, etching time data and other factors, to balance the relationship between materials, costs and performance, achieve the best material loss, the shortest etching time, reduce costs, shorten processing time, and ensure product performance.

[0052] The method for controlling the manufacturing process of the bonding region of the semiconductor device provided in this embodiment can be applied to an application environment including a terminal and a server. Among them, the terminal communicates with the server through a network. The terminal can be, but is not limited to, various personal computers, laptop computers, smart phones, tablet computers and portable wearable devices. The server can be implemented by an independent server or a server cluster composed of multiple servers. The terminal is connected to a variety of semiconductor devices, and the embodiments of the present invention do not make too many restrictions on this.

[0053] Refer to Figure 1 , which shows a flowchart of the steps of an embodiment of the method for controlling the manufacturing process of the bonding region of a semiconductor device in this embodiment. Specifically, it can include the following steps:

[0054] Step 101, obtain the design data of the bonding pad;

[0055] In the embodiment of the present invention, the bonding pad refers to the metal area in the printed circuit board for connecting electronic components or wires; in the embodiment of the present invention, the design data of the bonding pad refers to the direction of the metal line, the length and width of the metal line, the line spacing, the hole diameter, the minimum distance from the grinding hole to the line, the size and spacing of the pad, the minimum width and font size of the wire, etc. Of course, the design data can also include the design drawing of the bonding pad, and the embodiments of the present invention do not make too many restrictions on this.

[0056] Step 102, identify the right-angle position in the design data of the bonding pad;

[0057] Further, after obtaining the design data of the bonding pad, the right-angle position of the copper line of the bonding pad can be identified according to the design data of the bonding pad.

[0058] Refer to Figure 2, showing a design schematic diagram of a copper circuit of a bonding pad in an embodiment of the present invention; determining an end intersection of a length direction and a width direction of the bonding pad, and identifying whether an angle formed by the length direction and the width direction is 90 degrees. If so, a right-angle position is obtained;

[0059] Further, image recognition can be performed according to the design drawing of the bonding pad, and then combined with data such as the orientation, length and width of the metal circuit, line spacing, and aperture diameter in the design data of the bonding pad to obtain the right-angle position in the bonding pad, and the coordinates of the right-angle position on the design drawing can be obtained. For example, the coordinates of the right-angle position can include the ordinate and the abscissa; if the coordinates of the right-angle position are (23, 46) and the unit is mm, that is, the ordinate of the right-angle position is 23 and the abscissa is 46;

[0060] Step 103, generating a right-angled triangle with an additional design area corresponding to the right-angle position;

[0061] After obtaining the right-angle position, the additional design area corresponding to the right-angle position can be further calculated, and a right-angled triangle with the additional design area corresponding to the right-angle position is generated. In one embodiment, the additional design area may refer to the redundant etching area reserved in the etching process to make the right angle of the etched finished product closer to 90 degrees, which is beneficial to improving the quality of the subsequent wire bonding process; specifically, the additional design area may be a preset value related to the length of the metal circuit;

[0062] For example, the additional design area may be the area of a right-angled triangle with a right-angled side length accounting for 5% of the length of the copper circuit and an area of x square millimeters. Of course, those skilled in the art can also set the additional design area and the lengths of the two right-angled sides of the right-angled triangle according to other conditions, such as setting the additional design area and the lengths of the two right-angled sides of the right-angled triangle according to the cost or etching time. The embodiments of the present invention do not impose too many restrictions on this.

[0063] In a preferred embodiment of the embodiments of the present invention, the generating a right-angled triangle with an additional design area corresponding to the right-angle position includes: obtaining material loss index data, equipment processing data, and etching time data; obtaining an initial added area; and correcting the initial added area according to the material loss index data, equipment processing data, and etching time data to obtain the additional design area corresponding to the right-angle position, and generating a right-angled triangle with the additional design area corresponding to the right-angle position.

[0064] In the embodiments of the present invention, the optimal additional design area can be obtained by fitting the additional design area with historical processing data, where the historical processing data can include material loss index data, equipment processing data, and corrosion time data. The material loss index data refers to the ratio between the weight of the finished material and the total material weight during the bonding pad processing. The equipment processing data can refer to the operating duration of the equipment in all processing procedures. The corrosion time data refers to the time consumed by the corrosion process in the unit material.

[0065] Further applied to the embodiments of the present invention, the method of correcting the initial added area according to the material loss index data, equipment processing data, and corrosion time data to obtain the additional design area corresponding to the right-angle position includes:

[0066] Generating a characteristic fitting function according to the material loss index data, equipment processing data, corrosion time data, historical initial added area, and historical additional design area;

[0067] Correcting the initial added area according to the characteristic fitting function to generate the additional design area corresponding to the right-angle position.

[0068] Specifically applied to the embodiments of the present invention, the material loss index data is expressed as ; the equipment processing data is expressed as ; the corrosion time data is expressed as ; then the historical initial added area is expressed as ;

[0069] The historical additional design area is expressed as ; then the fitting function of the above relationship can be expressed as : Through the above historical data, iterative fitting is performed on the fitting function to obtain the characteristic fitting function: ; where represents the fitted material loss index data; represents the fitted equipment processing data; represents the fitted corrosion time data;

[0070] Input the new initial added area into the characteristic fitting function: , and obtain the output additional design area ; The above fitting method is only an example in the embodiments of the present invention, and other linear regression equations can also be used to fit the above data. The embodiments of the present invention do not impose too many restrictions on this.

[0071] In the embodiments of the present invention, considering factors such as cost and processing time, different factors are fitted with the additional design area to obtain the optimal additional design area, reducing material loss, lowering costs, shortening the etching time, not extending the processing time, and ensuring the operating performance of the equipment.

[0072] Step 104: Add the right-angled triangle of the additional design area to the right-angled position in the design data of the bonding pad to obtain the new design data of the bonding pad.

[0073] After obtaining the additional design area, the right-angled triangle corresponding to the additional design area can be added to the right-angled position in the design data of the bonding pad to obtain the new design data of the bonding pad.

[0074] Refer to Figure 3 , which shows a design schematic diagram of adding an additional design area to the copper circuit of the bonding pad in the embodiments of the present invention; 3 represents the right-angled triangle corresponding to the additional design area (the white slender part), and 2 represents the copper circuit of the bonding pad.

[0075] In the embodiments of the present invention, adding the right-angled triangle of the additional design area to the right-angled position in the design data of the bonding pad, adding the right-angled triangle of the additional design area to the right-angled position in the design data of the bonding pad to obtain the new design data of the bonding pad includes: identifying the right-angled position in the design data of the bonding pad; determining the intersecting right-angled side position of the etching edge from the right-angled position; adding the additional design area to the intersecting right-angled side position of the etching edge.

[0076] Specifically, first identify the right-angled position in the design data of the bonding pad. Specifically, the right-angled position can be identified by means of image recognition, or by identifying whether the angle formed by the length direction and the width direction is 90 degrees at the intersection of the ends of the length direction and the width direction, and then obtain the intersecting right-angled side position of the etching edge according to the right-angled position; add the right-angled triangle corresponding to the additional design area to the intersecting right-angled side position of the etching edge.

[0077] Regarding the method of adding the right-angled triangle corresponding to the additional design area to the intersecting right-angled side position of the etching edge, as shown in the schematic diagram in Figure 4 , set a coincidence origin 7 and a coincidence side 8 in the right-angled triangle corresponding to the additional design area, and add the right-angled triangle corresponding to the additional design area to the intersecting right-angled side position of the etching edge by making the coincidence origin 7 coincide with the right-angled point 5 of the etching edge and the coincidence side 8 connect with the intersecting right-angled side 6 of the etching edge.

[0078] Step 105: Perform the manufacturing steps of the bonding pad according to the new design data of the bonding pad.

[0079] Furthermore, according to the design data of the new bonding pad with a right triangle added in advance for modification, the bonding pad manufacturing steps are carried out to offset the over-etched part during the processing, so that the finished product after etching is exactly close to a right angle, the width of the bonding pad is wider, and it is more consistent with the original right-angle design of the bonding pad;

[0080] Specifically, the steps of manufacturing the bonding pad according to the design data of the new bonding pad include: controlling the device to perform laser drilling operation to obtain the circuit board after drilling; thickening the through holes and electroplating copper in the drilled circuit board to obtain the electroplated circuit board; after forming a dry film circuit pattern on the electroplated circuit board, etching out the bonding pad copper circuit to obtain the bonding pad; other manufacturing processes and steps can also be used, and the embodiments of the present invention do not limit this too much.

[0081] Add an extra inclined long triangle side at the right angle position, change the right angle side to an inclined triangle design, then prepare the front process of the board material, control the device to perform mechanical or laser drilling, control the device to remove the residue of the glue slag on the board material in the hole, control the device to thicken the through holes and electroplate copper, control the device to make a dry film circuit pattern, control the device to etch out the bonding pad copper circuit, control the device to strip the dry film, and then perform a drying operation.

[0082] In the embodiments of the present invention, the method for controlling the bonding area manufacturing process of the semiconductor device includes: obtaining the design data of the bonding pad; identifying the right angle position in the design data of the bonding pad; generating a right triangle with an additional designed area corresponding to the right angle position; adding the right triangle with the additional designed area to the right angle position in the design data of the bonding pad to obtain the design data of the new bonding pad; performing the bonding pad manufacturing steps according to the design data of the new bonding pad; considering factors such as cost and processing time, fitting different factors with the additional designed area to obtain the optimal additional designed area, reducing material loss, reducing cost, shortening the etching time, not extending the processing time, and ensuring the operation performance of the device.

[0083] It should be noted that for the method embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the embodiments of the present invention are not limited by the described action sequence, because according to the embodiments of the present invention, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily essential for the embodiments of the present invention.

[0084] Refer to Figure 5, showing a structural block diagram of an embodiment of a bonding area manufacturing process control device for a semiconductor device according to this embodiment, which may specifically include the following modules:

[0085] A design data acquisition module 301, configured to acquire the design data of the bonding pad;

[0086] An identification module 302, configured to identify the right-angle positions in the design data of the bonding pad;

[0087] A generation module 303, configured to generate a right-angled triangle with an additional design area corresponding to the right-angle position;

[0088] An addition module 304, configured to add the right-angled triangle with the additional design area to the right-angle position in the design data of the bonding pad to obtain the design data of the new bonding pad;

[0089] A manufacturing module 305, configured to perform the manufacturing steps of the bonding pad according to the design data of the new bonding pad.

[0090] Preferably, the generation module includes:

[0091] A first acquisition sub-module, configured to acquire material loss index data, equipment processing data, and etching time data;

[0092] A second acquisition sub-module, configured to acquire an initial addition area;

[0093] A generation sub-module, configured to correct the initial addition area according to the material loss index data, equipment processing data, and etching time data to obtain the additional design area corresponding to the right-angle position, and generate a right-angled triangle with the additional design area corresponding to the right-angle position.

[0094] Preferably, the manufacturing module includes:

[0095] A first control sub-module, configured to control the equipment to perform laser drilling operations to obtain a drilled circuit board;

[0096] A second control sub-module, configured to thicken the electroplated copper in the vias of the drilled circuit board to obtain an electroplated circuit board;

[0097] A third etching sub-module, configured to etch out the bonding pad copper circuit after forming a dry film circuit pattern on the electroplated circuit board to obtain a bonding pad.

[0098] Preferably, the generation sub-module includes:

[0099] A generation unit, configured to generate a characteristic fitting function according to the material loss index data, equipment processing data, etching time data, historical initial addition area, and historical additional design area;

[0100] A correction unit, configured to correct the initial added area according to the feature fitting function to generate an additional design area corresponding to the right-angle position.

[0101] Preferably, the adding module includes:

[0102] An identification sub-module, configured to identify the right-angle position in the design data of the bonding pad;

[0103] A determination sub-module, configured to determine the intersecting right-angle side position of the etching edge from the right-angle position;

[0104] An adding sub-module, configured to add the additional design area to the intersecting right-angle side position of the etching edge.

[0105] For the apparatus embodiment, since it is basically similar to the method embodiment, the description is relatively simple. For related parts, refer to the partial description of the method embodiment.

[0106] For the specific limitations on the bonding area manufacturing process control device of the semiconductor device, reference can be made to the limitations on the bonding area manufacturing process control method of the semiconductor device in the above text, which will not be elaborated here. Each module in the above bonding area manufacturing process control device of the semiconductor device can be implemented in whole or in part by software, hardware, and their combination. The above modules can be embedded in the processor of the computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above modules.

[0107] The above provided bonding area manufacturing process control device of the semiconductor device can be used to execute the bonding area manufacturing process control method provided in any of the above embodiments, and has corresponding functions and beneficial effects.

[0108] In one embodiment, a computer device is provided. The computer device can be a terminal, and its internal structure diagram can be as Figure 6As shown. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected via a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal via a network connection. The computer program, when executed by the processor, implements a method for simulating the daylighting rate. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covering the display screen, or a button, a trackball, or a touchpad provided on the housing of the computer device, or an external keyboard, touchpad, or mouse, etc.

[0109] Those skilled in the art can understand that Figure 6 the structure shown in is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0110] In one embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, the following steps are implemented:

[0111] Obtain the design data of the bonding pad;

[0112] Identify the right-angle positions in the design data of the bonding pad;

[0113] Generate a right-angled triangle with an additional design area corresponding to the right-angle position;

[0114] Add the right-angled triangle with the additional design area to the right-angle position in the design data of the bonding pad to obtain the design data of the new bonding pad;

[0115] Perform the manufacturing steps of the bonding pad according to the design data of the new bonding pad.

[0116] Preferably, the generating a right-angled triangle with an additional design area corresponding to the right-angle position includes:

[0117] Obtain the material loss index data, equipment processing data, and corrosion time data;

[0118] Obtain the initial added area;

[0119] Modify the initial added area according to the material loss index data, equipment processing data, and corrosion time data to obtain the additional design area corresponding to the right-angle position, and generate a right triangle with the additional design area corresponding to the right-angle position.

[0120] Preferably, the step of manufacturing the bonding pad according to the design data of the new bonding pad includes:

[0121] Control the equipment to perform a laser drilling operation to obtain a drilled circuit board;

[0122] Perform through-hole internal and electroplated copper thickening on the drilled circuit board to obtain an electroplated circuit board;

[0123] After forming a dry film circuit pattern on the electroplated circuit board, etch the copper circuit of the bonding pad to obtain the bonding pad.

[0124] Preferably, the step of modifying the initial added area according to the material loss index data, equipment processing data, and corrosion time data to obtain the additional design area corresponding to the right-angle position includes:

[0125] Generate a characteristic fitting function according to the material loss index data, equipment processing data, corrosion time data, historical initial added area, and historical additional design area;

[0126] Modify the initial added area according to the characteristic fitting function to generate the additional design area corresponding to the right-angle position.

[0127] Preferably, the step of adding the right triangle with the additional design area to the right-angle position in the design data of the bonding pad to obtain the design data of the new bonding pad includes:

[0128] Identify the right-angle position in the design data of the bonding pad;

[0129] Determine the intersecting right-angle side position of the corrosion edge from the right-angle position;

[0130] Add the additional design area to the intersecting right-angle side position of the corrosion edge.

[0131] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0132] Obtain the design data of the bonding pad;

[0133] Identify the right-angle position in the design data of the bonding pad;

[0134] Generate a right triangle with the additional design area corresponding to the right-angle position;

[0135] Add the right-angled triangle with the additional design area to the right-angled position in the design data of the bonding pad to obtain the new design data of the bonding pad;

[0136] Perform the manufacturing steps of the bonding pad according to the new design data of the bonding pad.

[0137] Preferably, generating the right-angled triangle with the additional design area corresponding to the right-angled position includes:

[0138] Obtain the material loss index data, equipment processing data, and etching time data;

[0139] Obtain the initial added area;

[0140] Modify the initial added area according to the material loss index data, equipment processing data, and etching time data to obtain the additional design area corresponding to the right-angled position, and generate the right-angled triangle with the additional design area corresponding to the right-angled position.

[0141] Preferably, the manufacturing steps of the bonding pad according to the new design data of the bonding pad include:

[0142] Control the equipment to perform laser drilling operation to obtain the drilled circuit board;

[0143] Perform copper thickening in the vias of the drilled circuit board to obtain the electroplated circuit board;

[0144] After forming a dry film circuit pattern on the electroplated circuit board, etch out the bonding pad copper circuit to obtain the bonding pad.

[0145] Preferably, modifying the initial added area according to the material loss index data, equipment processing data, and etching time data to obtain the additional design area corresponding to the right-angled position includes:

[0146] Generate a feature fitting function according to the material loss index data, equipment processing data, etching time data, historical initial added area, and historical additional design area;

[0147] Modify the initial added area according to the feature fitting function to generate the additional design area corresponding to the right-angled position.

[0148] Preferably, adding the right-angled triangle with the additional design area to the right-angled position in the design data of the bonding pad to obtain the new design data of the bonding pad includes:

[0149] Identify the right-angled position in the design data of the bonding pad;

[0150] Determine the intersecting right-angle side position of the corrosion edge from the right-angle position;

[0151] Add the additional design area to the intersecting right-angle side position of the corrosion edge.

[0152] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in this application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0153] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0154] Those skilled in the art should understand that the embodiments of this embodiment can be provided as a method, a device, or a computer program product. Therefore, this embodiment can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, this embodiment can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk memory, CD-ROM, optical memory, etc.) containing computer-usable program code.

[0155] This embodiment is described with reference to the flowcharts and / or block diagrams of devices, terminal devices (systems), and computer program products according to this embodiment. It should be understood that each flow and / or block in the flowchart and / or block diagram, as well as the combination of flows and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal devices to generate a machine, such that the instructions executed by the processor of the computer or other programmable data processing terminal devices generate a device for implementing the functions specified in one or more of the flows Figure 1 one or more of the flows and / or blocks Figure 1 or one or more of the blocks.

[0156] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal device to work in a specific manner, such that the instructions stored in the computer-readable memory generate a manufactured article including an instruction method that implements the functions specified in one or more of the flows Figure 1 one or more of the flows and / or blocks Figure 1 or one or more of the blocks.

[0157] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device, such that a series of operation steps are executed on the computer or other programmable terminal device to generate a computer-implemented process, and thus the instructions executed on the computer or other programmable terminal device provide steps for implementing the functions specified in one or more of the flows Figure 1 one or more of the flows and / or blocks Figure 1 or one or more of the blocks.

[0158] Although the preferred embodiments of this embodiment have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concepts. Therefore, the appended claims are intended to be construed as including the preferred embodiments and all changes and modifications that fall within the scope of this embodiment.

[0159] Finally, it should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, apparatus, article or terminal device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, apparatus, article or terminal device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, apparatus, article or terminal device comprising the element.

[0160] The above has introduced in detail a bonding area manufacturing process control method for a semiconductor device, a bonding area manufacturing process control device for a semiconductor device, a computer device and a storage medium provided by the present invention. Specific examples are used in this text to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A method for controlling the manufacturing process of a bonding region of a semiconductor device, characterized in that, Including: Obtaining the design data of the bonding pad; Identifying the right-angle positions in the design data of the bonding pad; Generating a right-angled triangle with an additional design area corresponding to the right-angle position; the additional design area refers to the extra corrosion area reserved in the etching process to make the right angle of the etched finished product closer to 90 degrees; Adding the right-angled triangle with the additional design area to the right-angle position in the design data of the bonding pad to obtain the new design data of the bonding pad; Performing the manufacturing steps of the bonding pad according to the new design data of the bonding pad; The generating of the right-angled triangle with an additional design area corresponding to the right-angle position includes: Obtaining the material loss index data, equipment processing data, and etching time data; wherein, the material loss index data refers to the ratio between the weight of the finished product material and the total material weight during the processing of the bonding pad; the equipment processing data refers to the running duration of the equipment in all processing procedures; the etching time data refers to the time consumed by the etching process in the unit material; Obtaining the initial added area; Correcting the initial added area according to the material loss index data, equipment processing data, and etching time data to obtain the additional design area corresponding to the right-angle position, and generating the right-angled triangle with the additional design area corresponding to the right-angle position; The correcting the initial added area according to the material loss index data, equipment processing data, and etching time data to obtain the additional design area corresponding to the right-angle position includes: Generating a characteristic fitting function according to the material loss index data, equipment processing data, etching time data, historical initial added area, and historical additional design area; Correcting the initial added area according to the characteristic fitting function to generate the additional design area corresponding to the right-angle position; Among them, the material loss index data is expressed as ; the equipment processing data is expressed as ; the corrosion time data is expressed as ; then the historical initial added area is expressed as ; the historical additional design area is expressed as ; then the fitting function is expressed as : Through iterative fitting of the historical data for this fitting function, the characteristic fitting function is obtained: ; among them, represents the material loss index data after fitting; represents the equipment processing data after fitting; represents the corrosion time data after fitting; Add the new initial added area to the feature fitting function: to obtain the output additional design area .

2. The method according to claim 1, characterized in that, The performing the manufacturing steps of the bonding pad according to the new design data of the bonding pad includes: Controlling the equipment to perform laser drilling operations to obtain the drilled circuit board; Performing through-hole internal and electroplated copper thickening on the drilled circuit board to obtain the electroplated circuit board; After forming a dry film circuit pattern on the electroplated circuit board, etching out the bonding pad copper circuit to obtain the bonding pad.

3. The method according to claim 1, wherein The adding the right-angled triangle with the additional design area to the right-angle position in the design data of the bonding pad to obtain the new design data of the bonding pad includes: Identifying the right-angle positions in the design data of the bonding pad; Determining the intersecting right-angle side positions of the etching edge from the right-angle positions; Adding the additional design area to the intersecting right-angle side positions of the etching edge.

4. A bonding area manufacturing process control device for a semiconductor device, characterized in that, Including: A design data acquisition module for obtaining the design data of the bonding pad; An identification module for identifying the right-angle positions in the design data of the bonding pad; A generation module for generating a right-angled triangle with an additional design area corresponding to the right-angle position; the additional design area refers to the extra corrosion area reserved in the etching process to make the right angle of the etched finished product closer to 90 degrees; An adding module, configured to add a right triangle of the additional design area to a right-angle position in the design data of the bonding pad, so as to obtain new design data of the bonding pad; A manufacturing module, configured to perform the manufacturing steps of the bonding pad according to the new design data of the bonding pad; The generating module includes: A first obtaining sub-module, configured to obtain material loss index data, equipment processing data, and corrosion time data; wherein, the material loss index data refers to the ratio between the weight of the finished material and the total material weight during the processing of the bonding pad; the equipment processing data refers to the running duration of the equipment in all processing procedures; the corrosion time data refers to the time consumed by the corrosion process in the unit material; A second obtaining sub-module, configured to obtain an initial added area; A generating sub-module, configured to correct the initial added area according to the material loss index data, equipment processing data, and corrosion time data, so as to obtain the additional design area corresponding to the right-angle position, and generate a right triangle of the additional design area corresponding to the right-angle position; The generating sub-module includes: A generating unit, configured to generate a feature fitting function according to the material loss index data, equipment processing data, corrosion time data, historical initial added area, and historical additional design area; A correcting unit, configured to correct the initial added area according to the feature fitting function, so as to generate an additional design area corresponding to the right-angle position; Among them, the material loss index data is expressed as ; the equipment processing data is expressed as ; the corrosion time data is expressed as ; then the historical initial added area is expressed as ; the historical additional design area is expressed as ; then the fitting function is expressed as : Through iterative fitting of the historical data for this fitting function, the characteristic fitting function is obtained: ; among them, represents the fitted material loss index data; represents the fitted equipment processing data; represents the fitted corrosion time data; Add the new initial added area to the feature fitting function: to obtain the output additional design area .

5. The device according to claim 4, characterized in that, The manufacturing module includes: A first control sub-module, configured to control the equipment to perform laser drilling operations, so as to obtain a drilled circuit board; A second control sub-module, configured to perform through-hole internal and electroplated copper thickening on the drilled circuit board, so as to obtain an electroplated circuit board; A third corrosion sub-module, configured to etch out the bonding pad copper circuit after forming a dry film circuit pattern on the electroplated circuit board, so as to obtain the bonding pad.

6. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, the steps of the bonding area manufacturing process control method of the semiconductor device according to any one of claims 1 to 3 are implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the steps of the bonding area manufacturing process control method of the semiconductor device according to any one of claims 1 to 3 are implemented.

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