Electroplating processing device for circuit board production

Abstract

The invention relates to the technical field of circuit board processing, in particular to an electroplating processing device for circuit board production, which comprises a box body, a frame, a placing mechanism, a clamping mechanism and a sealing mechanism, the frame is arranged at the top of the box body, the placing mechanism comprises a hydraulic assembly and a placing plate, one end of the hydraulic assembly is connected with one end of the frame, and the other end of the hydraulic assembly is connected with the clamping mechanism; one end of the hydraulic assembly is connected with one end of the placing plate, the other end of the hydraulic assembly is connected with one end of the placing plate, the clamping mechanisms are arranged on the placing plate, the sealing mechanism comprises a sealing plate, a telescopic rod, a long plate, a fixing plate, a through groove, a clamping block, a clamping groove, a first sliding groove and a first sliding block, one end of the sealing plate extends into the placing plate, and the other end of the sealing plate extends into the placing plate. The through groove is formed in the side face of the box body, the clamping groove is formed in the side face of the sealing plate, and one end of the telescopic rod is connected with the side face of the box body.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, in particular to an electroplating processing device for circuit board production. Background Art

[0002] As we all know, circuit board, also known as printed circuit board, is the provider of electrical connection for electronic components. It has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit board is that it greatly reduces wiring and assembly errors, improves the level of automation and production labor rate, and electroplating processing equipment is an indispensable part of circuit board production, which is used to deposit a conductive metal layer on the surface of PCB (printed circuit board).

[0003] Existing electroplating processing equipment for circuit board production generally places the circuit board into a box containing electroplating liquid for processing. However, after the equipment is used, the opening on the top of the box is generally directly exposed to the outside world, and dust particles from the outside can easily enter the inside of the box. When used next time, the dust particles inside the box need to be cleaned up, which wastes a lot of time and reduces work efficiency. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides an electroplating processing device for circuit board production.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a kind of electroplating processing device for circuit board production, comprising a box, a frame, a placement mechanism, a clamping mechanism and a sealing mechanism, wherein the frame is arranged on the top of the box, the placement mechanism comprises a hydraulic component and a placement plate, one end of the hydraulic component is connected to one end of the frame, and the other end of the hydraulic component is connected to one end of the placement plate, the clamping mechanism is arranged on the placement plate, and the clamping mechanism is provided with two, and the sealing mechanism comprises a sealing plate, a telescopic rod, a long plate, a fixing plate, a through groove, a card block, a card slot, a first A slide groove and a first slider, one end of the sealing plate extends into the placement plate, the through groove is opened on the side of the box body, the card slot is opened on the side of the sealing plate, one end of the telescopic rod is connected to the side of the box body, the other end of the telescopic rod is connected to one end of the long plate, one end of the fixed plate is connected to the long plate, and the other end of the fixed plate is connected to one end of the card block, the slide groove is opened on the side of the frame, one end of the slider is slidably connected to the slide groove, two sealing mechanisms are provided, a liquid outlet assembly is provided at the bottom of the front side of the box body, and a connecting block is provided at the top of the sealing plate.

[0008] In order to achieve the limiting effect, the present invention has been improved in that a limiting mechanism is provided on the sealing plate, and the limiting mechanism includes a second slide groove, a second slider and a groove, the second slide groove is opened on the connecting block, one end of the second slider is slidably connected to the second slide groove, the groove is opened on the placement plate, and the second slider matches the groove.

[0009] In order to facilitate the movement of the equipment, the present invention is improved in that a pulley mechanism is provided at the bottom of the box body, and a plurality of the pulley mechanisms are provided, and the plurality of the pulley mechanisms are symmetrically arranged.

[0010] In order to facilitate the operation of the equipment, the present invention is improved in that a controller is provided on the front side of the box body, and the controller is electrically connected to the hydraulic component.

[0011] In order to improve the effect of the engagement, the present invention is improved in that the engagement block matches the engagement slot.

[0012] In order to improve the stability, the present invention is improved in that the two clamping mechanisms are symmetrically arranged.

[0013] In order to achieve the wear-resistant effect, the present invention is improved in that the outer wall of the box body is provided with a wear-resistant layer, and the wear-resistant layer is fixedly connected to the outer wall of the box body.

[0014] (III) Beneficial effects

[0015] Compared with the prior art, the present invention provides an electroplating processing device for circuit board production, which has the following beneficial effects:

[0016] The electroplating processing device for circuit board production has a structure that can seal the box opening through a sealing mechanism after use, thereby preventing external dust particles from entering the box and preventing the staff from cleaning the dust particles in the box when the equipment is used next time, thereby saving a certain amount of time and improving work efficiency. When the equipment is in use, the sealing plate can be limited by a limiting mechanism, thereby preventing the sealing plate from being accidentally pulled and moved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention;

[0018] Figure 2 For the present invention Figure 1 A schematic diagram of the local enlarged structure at point A in the middle;

[0019] Figure 3 For the present invention Figure 1 A schematic diagram of the local enlarged structure at B in the middle;

[0020] Figure 4 It is a schematic diagram of the shaft side structure of the present invention;

[0021] In the figure: 1. box body; 2. pulley mechanism; 3. frame; 4. placement mechanism; 5. hydraulic assembly; 6. placement plate; 7. clamping mechanism; 8. sealing mechanism; 9. sealing plate; 10. telescopic rod; 11. long board; 12. fixed board; 13. through groove; 14. clamping block; 15. clamping groove; 16. first slide groove; 17. first slider; 18. limiting mechanism; 19. connecting block; 20. second slide groove; 21. second slider; 22. groove; 23. controller; 23. liquid outlet assembly. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-4 A plating processing device for circuit board production, comprising a box 1, a frame 3, a placement mechanism 4, a clamping mechanism 7 and a sealing mechanism 8, wherein the frame 3 is arranged on the top of the box 1, the placement mechanism 4 comprises a hydraulic component 5 and a placement plate 6, one end of the hydraulic component 5 is connected to one end of the frame 3, and the other end of the hydraulic component 5 is connected to one end of the placement plate 6, the clamping mechanism 7 is arranged on the placement plate 6, and the clamping mechanism 7 is provided with two, and the sealing mechanism 8 comprises a sealing plate 9, a telescopic rod 10, a long plate 11, a fixing plate 12, a through groove 13, a block 14, a slot 15, a first slide groove 16 and a first slider 17 One end of the sealing plate 9 extends into the placement plate 6, the through groove 13 is opened on the side of the box body 1, the card slot 15 is opened on the side of the sealing plate 9, one end of the telescopic rod 10 is connected to the side of the box body 1, the other end of the telescopic rod 10 is connected to one end of the long plate 11, one end of the fixed plate 12 is connected to the long plate 11, and the other end of the fixed plate 12 is connected to one end of the card block 14, the slide groove is opened on the side of the frame 3, one end of the slider is slidably connected to the slide groove, two sealing mechanisms 8 are provided, a liquid outlet component 24 is provided at the bottom of the front side of the box body 1, and a connecting block 19 is provided at the top of the sealing plate 9.

[0024] When in use, first place the device at the designated location, connect the device to the external mains, then support the device through the box 1, and then push the cover plate 9 to retract the cover plate 9 into the placement plate 6. A damping layer is provided inside the placement plate 6, and the cover plate 9 needs to be pushed with force. Then place the circuit board to be processed on the placement plate 6 and fix it with the clamping mechanism 7. The clamping mechanism 7 includes a vertical plate, bolts, bearings and a clamping plate. By screwing the bolts on the vertical plate and cooperating with the bearings, the clamping plate can be moved so that the circuit board can be fixed. Then pour the plating solution into the box 1. The plating solution is a conventional technology on the market. People in this technical field are clearly aware of the various media included in the plating solution, which will not be described in detail here. Then start the hydraulic assembly 5 on the frame 3 to drive the placement The plate 6 descends, so that the placement plate 6 enters the box 1, so that the circuit board on the placement plate 6 contacts the electroplating liquid, and then the box 1 can be used to process the circuit board. The box 1 is a conventional technology on the market, and the specific components included inside are not described in detail here. The hydraulic component 5 is a conventional waterproof hydraulic component 5 on the market, including hydraulic cylinders, hydraulic rods and other components, which are not described in detail here. After the processing of the circuit board is completed, the hydraulic component 5 is controlled to raise the placement plate 6 to separate the circuit board from the box 1. Then the staff wears protective gloves and can take out the processed circuit board and put it to the next external process for processing. Then the electroplating liquid in the box 1 can be discharged through the liquid outlet component 24, and then the inside of the box 1 can be cleaned through external cleaning equipment. When the equipment is used, Figure 1 As shown, first control the hydraulic assembly 5 to drive the placement plate 6 to descend, so that the placement plate 6 extends into the box body 1 and into the opening of the box body 1. It cannot be lowered too low. The length of the placement plate 6 matches the internal length of the box body 1, so that there is no gap at both ends of the box body 1. Then, pull the connecting block 19 on the top of the sealing plate 9 hard to make the sealing plate 9 extend out of the placement plate 6 and make the sealing plate 9 abut against the inside of the box body 1. Then push the first slider 17 on the first slide groove 16 upward to make the first slider 17 rise to a certain position. The staff needs to hold the first slider 17 and then push the long board 11 to shrink the telescopic rod 10, so that the fixed plate 12 passes through the through slot 1 3, make the fixing plate 12 block the gap between the closing plate 9 and the box body 1, then the block 14 on the fixing plate 12 will extend into the slot 15 opened on the closing plate 9, and then make the first slider 17 descend to make the first slider 17 abut against the long plate 11, and the top opening of the box body 1 can be blocked by the sealing mechanism 8 to prevent external dust particles from entering the interior of the box body 1. When it needs to be used again, the staff only needs to place the plate 6 to wipe the dust on the surface of the sealing mechanism 8. After the sealing mechanism 8 is extended into the box body 1, the position where the seal is extended will cause a part of the top of the interior of the box body 1 to be exposed to the outside world, and it needs to be wiped together.

[0025] In this embodiment, the sealing plate 9 is provided with a limiting mechanism 18, which includes a second slide groove 20, a second slider 21 and a groove 22. The second slide groove 20 is provided on the connecting block 19, one end of the second slider 21 is slidably connected with the second slide groove 20, and the groove 22 is provided on the placement plate 6. The second slider 21 matches the groove 22. When the sealing plate 9 is retracted to a certain position of the placement plate 6, the position of the slider matches the position of the groove 22, and then the second slider 21 on the second slide groove 20 is extended into the groove 22, so that the sealing plate 9 can be limited to prevent the sealing plate 9 from being moved by unexpected forces.

[0026] The above-mentioned equipment is not convenient to move. In order to solve this problem, in this embodiment, a pulley mechanism is provided at the bottom of the box body 1. There are several pulley mechanisms, and the several pulley mechanisms are symmetrically arranged.

[0027] The above-mentioned device is not convenient to operate. In order to solve this problem, in this embodiment, a controller 23 is provided on the front side of the box body 1 , and the controller 23 is electrically connected to the hydraulic assembly 5 .

[0028] In order to improve the engagement effect, in this embodiment, the engagement block 14 matches the engagement slot 15 .

[0029] The stability of the above-mentioned clamping mechanism 7 is relatively poor. In order to solve this problem, in this embodiment, the two clamping mechanisms 7 are symmetrically arranged.

[0030] The outer wall of the box body 1 has a poor wear resistance and is easily worn out after long-term use. In order to solve this problem, in this embodiment, the outer wall of the box body 1 is provided with a wear-resistant layer, and the wear-resistant layer is fixedly connected to the outer wall of the box body 1.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electroplating processing device for circuit board production, comprising a box (1), a frame (3), a placement mechanism (4), a clamping mechanism (7) and a sealing mechanism (8), characterized in that: The frame (3) is arranged on the top of the box body (1); the placement mechanism (4) includes a hydraulic component (5) and a placement plate (6); one end of the hydraulic component (5) is connected to one end of the frame (3); the other end of the hydraulic component (5) is connected to one end of the placement plate (6); the clamping mechanism (7) is arranged on the placement plate (6); two clamping mechanisms (7) are provided; the sealing mechanism (8) includes a sealing plate (9), a telescopic rod (10), a long plate (11), a fixed plate (12), a through groove (13), a block (14), a slot (15), a first slide groove (16) and a first slide block (17); one end of the sealing plate (9) extends into the placement plate (6) In the embodiment, the through groove (13) is provided on the side of the box body (1), the card groove (15) is provided on the side of the sealing plate (9), one end of the telescopic rod (10) is connected to the side of the box body (1), the other end of the telescopic rod (10) is connected to one end of the long plate (11), one end of the fixed plate (12) is connected to the long plate (11), the other end of the fixed plate (12) is connected to one end of the card block (14), the slide groove is provided on the side of the frame (3), one end of the slider is slidably connected to the slide groove, two sealing mechanisms (8) are provided, a liquid outlet assembly (24) is provided at the bottom of the front of the box body (1), and a connecting block (19) is provided at the top of the sealing plate (9).

2. The electroplating processing device for circuit board production according to claim 1, characterized in that: The sealing plate (9) is provided with a limiting mechanism (18), and the limiting mechanism (18) comprises a second slide groove (20), a second slider (21) and a groove (22), wherein the second slide groove (20) is provided on the connecting block (19), one end of the second slider (21) is slidably connected to the second slide groove (20), and the groove (22) is provided on the placing plate (6), and the second slider (21) matches the groove (22).

3. The electroplating processing device for circuit board production according to claim 2, characterized in that: The bottom of the box body (1) is provided with a pulley mechanism, and a plurality of the pulley mechanisms are provided, and the plurality of the pulley mechanisms are symmetrically arranged.

4. The electroplating processing device for circuit board production according to claim 3 is characterized in that: A controller (23) is provided on the front of the box body (1), and the controller (23) is electrically connected to the hydraulic assembly (5).

5. The electroplating processing device for circuit board production according to claim 4, characterized in that: The card block (14) matches the card slot (15).

6. The electroplating processing device for circuit board production according to claim 5, characterized in that: The two clamping mechanisms (7) are symmetrically arranged.

7. The electroplating processing device for circuit board production according to claim 5, characterized in that: The outer wall of the box body (1) is provided with a wear-resistant layer, and the wear-resistant layer is fixedly connected to the outer wall of the box body (1).

Images