A high-density liquid-cooled server and server cabinet system

Abstract

The present invention discloses a high-density liquid-cooled server and a server cabinet system, which relate to the technical field of liquid-cooled servers, including an equipment cabinet, wherein an assembly plate is installed inside the equipment cabinet, a circulation pump is installed above the assembly plate, liquid cooling pipes are symmetrically connected on both sides of the circulation pump, a liquid storage tank is connected on the front side of the circulation pump, a strain thermostatic mechanism is arranged on the front side of the assembly plate, the strain thermostatic mechanism is used for flexibly dissipating heat for the assembly plate, a cold liquid regulating mechanism is used for causing the coolant to generate a spiral flow trajectory during the flow process, and based on the actual situation that the core area of ​​the chip is prone to high temperature when running, targeted heat dissipation management of the high-temperature area is realized, and when an abnormal temperature rise is detected in a specific area, the flow paths of the coolant in the upper and lower areas can be synchronously adjusted in time according to the change in temperature rise, and the flow area of ​​the channel can be reduced by dynamically adjusting the distribution of the coolant flow and combining temperature flexibility.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling servers, and in particular to a high-density liquid cooling server and a server cabinet system. Background Art

[0002] The existing GPU liquid-cooled server is a server that uses liquid cooling technology to dissipate heat from the GPU. It partially or completely replaces the traditional air cooling method with liquid cooling, aiming to improve the heat dissipation efficiency of the server to meet the needs of application scenarios such as high-performance computing, deep learning, and data mining that have extremely high requirements for computing power and heat dissipation.

[0003] In a Chinese patent with patent announcement number CN212411145U, a liquid-cooled server heat dissipation system is disclosed, including: a cold plate, the cold plate is located above the heating element in the liquid-cooled server, the cold plate includes: a refrigerant flow channel and a first circulation pump, the refrigerant flow channel is arranged in the cold plate, connected to the cold plate inlet and the cold plate outlet of the cold plate, the refrigerant in the cold plate flows along the refrigerant flow channel, the first circulation pump is arranged in the cold plate, the first circulation pump is located above the refrigerant flow channel to adjust the flow rate of the refrigerant in the cold plate, and the flow rate of the refrigerant in the system branch is controlled by the built-in first circulation pump, so that the system heat dissipation function matches the demand, accurately dissipates the heat of the liquid-cooled server, and makes the system heat dissipation more efficient and energy-saving.

[0004] However, the devices and prior art in the above patent documents still have the following defects when used specifically: 1. Compared with the use of control valves to electronically control the flow of coolant in the above patent documents, when the temperature of a certain area of ​​the server suddenly rises, the valve needs a certain amount of time to sense the temperature change and make adjustments. Moreover, in high-performance computing scenarios, such as large-scale neural network training in deep learning, the computing load of the server will change dramatically in a very short period of time, causing the local temperature to rise rapidly. This relatively slow response speed cannot meet the heat dissipation requirements in time, causing the server to be in a high temperature state in a short period of time, affecting computing performance and hardware life. At the same time, the liquid cooling system of the server is a whole. Changing the flow of a branch pipe will affect the pressure balance and distribution of the coolant of the entire system. When trying to quickly reduce the temperature of the local high-temperature area, the ideal cooling effect cannot be achieved due to the impact on the overall system.

[0005] 2. Since the specific heat capacity of oil-based coolants is relatively low, the cost is high and the fluidity is poor, while the cost of fluorinated liquids is very high, water-based coolants are generally used in existing liquid cooling devices. Water has a high specific heat capacity and thermal conductivity and is an ideal heat dissipation medium. However, water-based coolants usually contain additives such as rust inhibitors, preservatives, and antifreeze agents to improve the performance of the coolant. For example, adding an appropriate amount of ethylene glycol can lower the freezing point of the coolant so that it can work normally in a low temperature environment. However, during the flow of the coolant, especially in bends, narrow channels, or areas with large changes in flow velocity, the uneven flow will cause a concentration gradient of the additive. For example, in the mainstream area with a faster flow velocity and the stagnant area with a slower flow velocity, the diffusion rate of the additive is different. In the stagnant area, the additive will be relatively enriched, while in the mainstream area, the concentration of the additive is relatively low, resulting in uneven local additive concentration.

[0006] 3. At the same time, some additives will precipitate or agglomerate after long-term use or under specific conditions, forming tiny precipitates. These precipitates cannot be evenly dispersed when the coolant flows, and will be deposited at the bottom of the pipe or in areas with lower flow rates, resulting in a decrease in the effective concentration of the additives in these areas, while the concentration of additives in other areas is relatively high, destroying the uniform distribution of the additives in the coolant. The impurity particles generated by these additives are at the micron level and are easily deposited in the microchannels, thereby clogging the channels. In addition, in the coolant circulation system, despite sealing measures, it is still difficult to completely avoid the entry of external substances. For example, during the coolant filling process, tiny particles such as dust and metal chips in the surrounding environment will mix into the coolant. Once these external impurities enter the microchannel flow path, they will also cause blockages.

[0007] In view of this, the present invention proposes a high-density liquid cooling server and a server cabinet system to compensate for and improve the deficiencies of the prior art. Summary of the invention

[0008] In order to solve the above technical problems, the present invention provides a high-density liquid-cooled server and a server cabinet system to solve the technical problems raised in the above background technology.

[0009] To achieve the above objectives, the technical solution adopted by the present invention is: a high-density liquid-cooled server and server cabinet system, including an equipment cabinet, an assembly plate installed inside the equipment cabinet, a circulating pump installed above the assembly plate, liquid cooling pipes are symmetrically connected on both sides of the circulating pump, the front side of the circulating pump is connected to a liquid storage tank, a strain thermostatic mechanism is arranged on the front side of the assembly plate, and a cold liquid regulating mechanism is arranged at the connection position between the circulating pump and the liquid cooling pipe, the strain thermostatic mechanism is used to flexibly dissipate heat for the assembly plate, and the cold liquid regulating mechanism is used to make the coolant produce a spiral flow trajectory during the flow process.

[0010] Furthermore, the strain constant temperature mechanism includes a new type of liquid cooling plate installed on the surface of the assembly plate, a microchannel group is opened inside the new type of liquid cooling plate, a lifting gasket is installed at the bottom of the inner wall of the microchannel group, a plurality of convex beads are evenly fixedly connected to the top of the inner wall of the microchannel group, and the two sides of the convex beads are connected to the adjustment buckle frame.

[0011] Furthermore, the microfluidic channel group is composed of no less than six microchannels, and every two microchannels form a group, which are divided into three groups as a whole to divide the surface of the assembly plate into three areas: upper, middle and lower areas, and the microchannels in the microfluidic channel group are generally relatively flat incomplete arcs.

[0012] Furthermore, the adjusting buckle frame is composed of a central shell and connecting rods dispersed around it. The central shell in the adjusting buckle frame corresponds to the core area of ​​the assembly plate surface. The microchannel group and the liquid cooling pipeline are connected through the adjusting buckle frame.

[0013] Furthermore, the entirety of the adjusting buckle frame is made of boron nitride ceramic material, and a heat-sensitive material is installed inside the adjusting buckle frame at a location where the adjusting buckle frame is connected to the liquid cooling pipe.

[0014] Furthermore, the lifting gasket is located at a recessed position of the bottom wall inside the microchannel group, and the lifting gasket is in the form of an upwardly protruding arc plate as a whole. The microchannel group and the lifting gasket are movably connected via a corrugated gasket.

[0015] Furthermore, the cold liquid regulating mechanism includes a ratchet group symmetrically installed on the inner walls of the output end and the input end of the circulating pump, the two sides of the circulating pump are symmetrically connected with expansion tubes, the inner walls of the expansion tubes are fixedly connected with spiral rings, the side of the spiral ring close to the circulating pump is fixedly connected with a diversion column, and the side of the spiral ring away from the circulating pump is fixedly connected with a guide shaft.

[0016] Furthermore, the ratchet group is composed of two bevel ratchets, the bevel angles of the bevel ratchets in the ratchet group are set in opposite directions, and the bevel ratchets in the ratchet group are respectively fixedly connected to the inner wall of the circulation pump and the outer wall of the liquid cooling pipe.

[0017] Furthermore, the spiral ring is located at the center of the expansion tube, and the spiral ring as a whole is composed of a plurality of inclined arc plates.

[0018] Furthermore, the diverter column corresponds to the center position of the output end of the circulation pump, and the diverter column as a whole is an inclined quadrangular prism formed by splicing no less than four right-angled triangles.

[0019] Furthermore, the liquid storage tank stores water-based coolant, the circulation pump, the liquid cooling pipeline and the novel liquid cooling plate are interconnected, and the assembly plate and the novel liquid cooling plate are tightly fitted.

[0020] Furthermore, the assembly board includes a computing unit, a video memory controller, a texture unit, and a rasterization unit. The computing unit in the assembly board is generally a module with the highest temperature and is located in the central area of ​​the assembly board.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) In order to better fit the use scenario of the existing GPU server in high-performance computing, the present device, by introducing a new liquid cooling plate, first ensures the uniformity of the initial circulation of the coolant inside the cold plate, and provides a basic and uniform heat dissipation environment for the assembly plate as a whole. More importantly, by introducing the shape and layout design of the new liquid cooling plate, the present device subdivides the assembly plate into three specific areas: upper, middle and lower. This design is based on the actual situation that the core area of ​​the assembly plate is prone to high temperature when the assembly plate is running, and realizes targeted heat dissipation management of the high-temperature area. When the temperature in a specific area is detected to be abnormally high, the flow path of the coolant in the upper and lower areas can be adjusted synchronously according to the change in temperature increase in time. By dynamically adjusting and distributing the coolant flow rate and combining temperature flexibility to reduce the flow area of ​​the channel, the coolant is concentrated in the place where the temperature is too high, achieving efficient heat transfer and local enhanced heat dissipation, avoiding ineffective flow and heat dissipation of the coolant in the low-temperature area, and optimizing the utilization efficiency of the coolant.

[0022] Compared with the prior art method of using a control valve to adjust the flow of coolant, this device is in line with the actual scenario of equipment use and a targeted and efficient heat dissipation method, and has the following advantages: First: In high-performance computing scenarios, the computing performance of the server is extremely sensitive to temperature. Through targeted and efficient local heat dissipation, this device can maintain the temperature of the server under high load within a more stable and suitable range, thereby avoiding the server frequency reduction caused by local high temperature, thereby ensuring the continuous and efficient execution of computing tasks.

[0023] Second: The traditional coolant flow regulation method has a slow response speed. When the local temperature of the server rises rapidly, it cannot adjust the heat dissipation in time, causing the server to experience large temperature fluctuations and thermal shock. The synchronous response characteristics of this device help reduce the risk of such thermal shock, protect the electronic components inside the server, ensure that it works in a stable thermal environment, and help improve the stability and durability of the hardware.

[0024] Third: Compared with the prior art in which the pressure balance and coolant distribution of the entire server liquid cooling system are affected by changing the flow rate of a certain branch pipe, this device can flexibly adjust the local coolant flow channel according to the temperature change of the chip surface, thereby helping to maintain the pressure balance of the entire liquid cooling system and reduce the adverse effects of local heat dissipation adjustments on the coolant distribution of the entire system.

[0025] (2) The device adopts a gradient flow channel structure in the microchannel design of the liquid cooling plate. This design ensures a smooth transition of the coolant during the flow process by avoiding sudden changes in pipe diameter or sharp turns. Since the stagnant area is an area where the flow velocity is extremely low or almost zero in the fluid flow, it will reduce the heat exchange efficiency and increase the energy consumption of the system. The device uses a gradient flow channel structure to enable the coolant to flow more evenly through the entire liquid cooling plate, thereby effectively reducing these unfavorable areas and improving the overall heat dissipation performance. Compared with the direct current channel and curved U-shaped channel commonly used in the prior art, the gradient flow channel structure can not only ensure the smooth flow of the fluid, but also provide sufficient fluid mixing and heat exchange, thereby achieving more efficient heat dissipation performance.

[0026] This device also brings many positive effects by coordinating the lifting gaskets and convex beads correspondingly arranged inside the microchannel. The specific analysis is as follows: 1. Make up for the arc bottom depression and prevent the accumulation of additives: The lifting gasket is set at the bottom wall depression position inside the microchannel group, thereby making up for the arc bottom depression in the gradient microchannel, avoiding the depression causing the accumulation of additives at the bottom, affecting the uniformity of the coolant and the heat dissipation effect. The existence of the lifting gasket effectively avoids this phenomenon, thereby ensuring that the additives can flow evenly with the coolant, thereby improving the overall performance of the heat dissipation system.

[0027] 2. Keep the microchannel unobstructed and prevent blockage: The lifting gasket is designed as an upwardly protruding arc plate. It not only fits tightly with the bottom wall of the microchannel group, but also is movably connected with it through the corrugated gasket. As a result, when the coolant flows, the lifting gasket can shake slightly. This shaking helps to break possible blockages and keep the microchannel unobstructed, thereby ensuring the smooth flow of coolant and efficient heat dissipation.

[0028] 3. Destroy bubbles and improve heat dissipation efficiency: Some bubbles will be generated during the flow of coolant. These bubbles will interfere with the normal flow of the fluid and reduce the heat dissipation efficiency. Through the corresponding cooperation between the lifting gasket and the convex beads, the bubbles are more likely to come into contact with each other during the generation process, and then be broken and dispersed.

[0029] (3) In order to improve the problem of concentration gradient of additives in water-based coolants during flow, the present device introduces a spiral ring so that the coolant is guided to produce a spiral flow trajectory during flow. This flow pattern significantly enhances the mixing effect of the coolant and promotes the effective diffusion of additives between different flow layers. Compared with traditional straight or curved flow channels, the spiral flow channel increases the contact area and contact time between the fluid and the flow channel wall through its unique geometric configuration, thereby increasing the shear force and turbulence intensity inside the fluid. Secondly, under the action of spiral flow, additives are no longer limited to a specific flow layer or area, but can be dispersed throughout the entire flow. This avoids the problem of too low concentration of additives in the mainstream area with faster flow rate and excessive enrichment of additives in the stagnant area with slower flow rate, thereby ensuring the stability and consistency of coolant performance. Finally, the design of the spiral flow channel also helps to improve the overall heat dissipation efficiency of the cooling system. Due to the uniform distribution of additives, the thermal conductivity and heat exchange capacity of the coolant are fully utilized, which means that under the same heat dissipation conditions, the liquid cooling device with spiral flow channels can transfer heat from heat sources such as assembly plates to the coolant more quickly, and discharge heat from the system through the effective circulation of the coolant, thereby achieving a more efficient heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the main stereoscopic structure of the present invention.

[0031] Figure 2 It is a schematic diagram of the three-dimensional structure of the back side of the server cabinet of the present invention.

[0032] Figure 3 This is a schematic diagram of the three-dimensional structure of the novel liquid cooling plate of the present invention.

[0033] Figure 4 This is an exploded view of the back of the server cabinet of the present invention.

[0034] Figure 5 It is a schematic diagram of the internal three-dimensional structure of the expansion tube of the present invention.

[0035] Figure 6 For the present invention Figure 5 A schematic diagram of the partially enlarged three-dimensional structure in the middle.

[0036] Figure 7 It is a schematic diagram of the three-dimensional structure of the cold liquid regulating mechanism of the present invention.

[0037] Figure 8 It is a schematic diagram of the three-dimensional structure of the strain constant temperature mechanism of the present invention.

[0038] Fig. 9 It is a schematic diagram of the three-dimensional structure of the adjusting buckle frame of the present invention.

[0039] Fig.10 Schematic diagram of the internal three-dimensional structure of the microfluidic channel of the present invention.

[0040] Fig.11 For the present invention Fig.10 Schematic diagram of the partially enlarged three-dimensional structure at point B in the middle.

[0041] The numbers in the figure are: 1. Equipment cabinet; 11. Assembly plate; 12. Circulation pump; 13. Liquid cooling pipe; 14. Liquid storage tank; 2. Strain constant temperature mechanism; 21. New liquid cooling plate; 22. Microchannel group; 23. Lifting gasket; 24. Bead; 25. Adjustment buckle bracket; 3. Cold liquid control mechanism; 31. Ratchet group; 32. Expanding tube; 33. Spiral ring; 34. Diverter column; 35. Guide shaft. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] It should be noted that the structures and working principles of the above-mentioned equipment cabinet 1, assembly board 11, circulation pump 12, liquid cooling pipe 13, liquid storage tank 14 and other components belong to the prior art and will not be repeated here.

[0044] It should be noted that this device focuses on displaying the back view of the equipment cabinet 1 and the assembly board 11, but the front structure of the equipment cabinet 1 and the assembly board 11 is no different from the internal structure of the traditional GPU cabinet. The dimensions of the front frame, including height, width and depth, all follow traditional standards. The layout of the power supply, network and other interfaces remains the same, and the position and type remain unchanged, and will not be described in detail here.

[0045] Example 1: Please refer to Figure 1 and Figure 2 As shown, a high-density liquid-cooled server and server cabinet system include an equipment cabinet 1, an assembly plate 11 is installed inside the equipment cabinet 1, a circulation pump 12 is installed above the assembly plate 11, liquid cooling pipes 13 are symmetrically connected to both sides of the circulation pump 12, the front side of the circulation pump 12 is connected to a liquid storage tank 14, a strain thermostatic mechanism 2 is arranged on the front side of the assembly plate 11, and a cold liquid regulating mechanism 3 is arranged at the connection position of the circulation pump 12 and the liquid cooling pipe 13. The strain thermostatic mechanism 2 is used for flexibly dissipating heat for the assembly plate 11, and the cold liquid regulating mechanism 3 is used for causing the coolant to generate a spiral flow trajectory during the flow process.

[0046] It should be noted that the liquid storage tank 14 stores water-based coolant, the circulating pump 12, the liquid cooling pipe 13 and the new liquid cooling plate 21 are all interconnected, and the assembly board 11 and the new liquid cooling plate 21 are tightly fitted. The assembly board 11 includes a computing unit, a video memory controller, a texture unit and a rasterization unit. The computing unit in the assembly board 11 is generally the module with the highest temperature and is located in the central area of ​​the assembly board 11.

[0047] Specifically, when the assembly board 11 inside the GPU liquid-cooled server generates heat during operation, the heat is first transferred to the new liquid-cooling plate 21 that fits closely therewith through heat conduction. Since the new liquid-cooling plate 21 is made of a high thermal conductivity material such as copper, the heat can diffuse rapidly in the cold plate. Secondly, the water-based coolant in the liquid storage tank 14 enters the microchannel group 22 in the new liquid-cooling plate 21 driven by the circulating pump 12. In the microchannel flow channel, the coolant is in full contact with the new liquid-cooling plate 21, absorbs the heat conducted from the new liquid-cooling plate 21, and its own temperature rises. The heated coolant flows out of the new liquid-cooling plate 21 and flows to the external heat dissipation device through the liquid-cooling pipe 13. In the heat dissipation device, the coolant releases the heat it carries to the external environment. After the coolant temperature drops, it flows back to the new liquid-cooling plate 21 to start the next round of heat absorption cycle.

[0048] Please refer to Figures 7 to 11 As shown, the strain constant temperature mechanism 2 includes a new liquid cooling plate 21 installed on the surface of the assembly plate 11, and a microchannel group 22 is opened inside the new liquid cooling plate 21. The bottom of the inner wall of the microchannel group 22 is installed with a lifting gasket 23, and the top of the inner wall of the microchannel group 22 is evenly fixedly connected with a plurality of convex beads 24, and the two sides of the convex beads 24 are connected with adjustment buckle frames 25.

[0049] It should be noted that the microfluidic group 22 is composed of no less than six microchannels, and every two microchannels form a group, and the whole is divided into three groups to divide the surface of the assembly plate 11 into three areas: upper, middle and lower. The microchannels in the microfluidic group 22 are generally in a relatively gentle incomplete arc shape. The adjusting buckle frame 25 is composed of a concentrated shell in the center position and connecting rods dispersed around. The concentrated shell in the adjusting buckle frame 25 corresponds to the core area of ​​the surface of the assembly plate 11. The microfluidic group 22 and the liquid cooling pipe 13 are connected through the adjusting buckle frame 25. The adjusting buckle frame 25 is made of boron nitride ceramic material as a whole, and the inside of the adjusting buckle frame 25 at the connection position with the liquid cooling pipe 13 is installed with thermosensitive materials. The lifting gasket 23 is located at the recessed position of the bottom wall inside the microfluidic group 22. The lifting gasket 23 is generally in the form of an arc-shaped plate that bulges upward. The microfluidic group 22 and the lifting gasket 23 are movably connected through a corrugated gasket.

[0050] Specifically, when the entire device is in the just-operating state, the water-based coolant in the liquid storage tank 14 will flow evenly into the microchannel group 22 through the liquid cooling pipe 13, thereby providing a basic and uniform heat dissipation environment for the entire assembly board 11. Since the computing unit is generally located near the central area of ​​the GPU core, when the device is continuously in a high-performance computing scenario, the middle area of ​​the assembly board 11 will consume a large amount of electrical energy. According to Joule's law, the consumption of electrical energy will be converted into thermal energy, thereby generating a large amount of heat. Since the computing unit is the core part of the GPU for computing and usually occupies an important part of the core area in the chip layout, the computing unit located near the core center area has the highest temperature during use.

[0051] Since there are many bonds between atoms or ions in the crystal structure of boron nitride ceramics, the bonding force between atoms or ions in boron nitride ceramic materials is relatively strong, which enables boron nitride ceramic materials to effectively transfer heat energy. Therefore, when the temperature in the middle area of ​​the assembly plate 11 rises, its heat will be conducted to the position of the thermosensitive material inside the liquid cooling pipe 13 through the connecting rod in the adjusting buckle frame 25. The thermosensitive material is specifically a nickel-titanium shape memory alloy, which is mainly composed of nickel and titanium, wherein the nickel content is about 49% to 51% atomic percentage, and correspondingly, the titanium Ti content is also controlled at about 49% to 51% atomic percentage. When it is subjected to the input of thermal energy, the molecules will absorb this part of the thermal energy and convert it into molecular thermal motion, which will cause the mutual interaction between the molecules. The acting force is weakened, and the equilibrium position between molecules changes, which leads to an increase in the volume of the material, that is, thermal expansion. When the temperature drops, it can return to its original shape. Therefore, according to the actual situation that the core area of ​​the assembly plate 11 is prone to high temperature when it is running, the device uses the principle of thermal conductivity and thermosensitive materials to achieve targeted heat dissipation management of high-temperature areas. When an abnormal increase in temperature is detected in a specific area, the flow paths of the coolant in the upper and lower areas can be adjusted synchronously according to the change in temperature increase in time. By dynamically adjusting the distribution of the coolant flow rate and combining temperature flexibility to reduce the flow area of ​​the channel, the coolant is concentrated in the place where the temperature is too high, achieving efficient heat transfer and local enhanced heat dissipation, avoiding ineffective flow and heat dissipation of the coolant in the low-temperature area, and optimizing the utilization efficiency of the coolant.

[0052] Example 2: Based on implementation 1, please refer to Figures 2 to 7 As shown, the cold liquid regulating mechanism 3 includes a ratchet group 31 symmetrically installed on the inner wall of the output end and the input end of the circulation pump 12, and the two sides of the circulation pump 12 are symmetrically connected with the expansion tube 32, and the inner side walls of the expansion tube 32 are fixedly connected with a spiral ring 33, and the side of the spiral ring 33 close to the circulation pump 12 is fixedly connected with a diversion column 34, and the side of the spiral ring 33 away from the circulation pump 12 is fixedly connected with a guide shaft 35.

[0053] It should be noted that the ratchet group 31 is composed of two beveled ratchets, the bevel angles of the beveled ratchets in the ratchet group 31 are set in opposite directions, and the beveled ratchets in the ratchet group 31 are fixedly connected to the inner wall of the circulation pump 12 and the outer wall of the liquid cooling pipe 13 respectively, the spiral ring 33 is located at the center position inside the expansion tube 32, and the spiral ring 33 as a whole is composed of a combination of several inclined arc plates, the diverter column 34 corresponds to the center position of the output end of the circulation pump 12, and the diverter column 34 as a whole is an inclined quadrangular prism composed of no less than four right-angled triangles.

[0054] Specifically, when the water-based coolant in the liquid storage tank 14 is driven by the circulating pump 12 to flow into the liquid cooling pipe 13, it will first pass through the expansion tube 32. During this flow process, when the coolant enters the spiral ring 33 composed of a plurality of inclined arc plates, the inclination angle of the arc plate will guide the flow of the coolant. Since the arc plate is not installed perpendicular to the flow direction of the coolant, but is inclined, the coolant will be subjected to an oblique force when it hits the surface of the arc plate. This oblique force will change the flow direction of the coolant, and it will no longer flow in a straight line, but will begin to deviate to one side. Since multiple arc plates are combined to form the spiral ring 33, the coolant will enter the next arc plate immediately after passing through one arc plate. The effect of each arc plate on the change of the flow direction of the coolant will accumulate. Finally, with the cooling The coolant continuously passes through the inclined curved plates, and its flow direction is constantly changed. Each time it passes through a curved plate, the coolant will turn once based on the original flow direction, thus forming a final spiral flow trajectory. This flow mode significantly enhances the mixing effect of the coolant and promotes the effective diffusion of additives between different flow layers. Compared with traditional straight or curved flow channels, the spiral flow channel increases the contact area and contact time between the fluid and the flow channel wall through its unique geometric configuration, thereby increasing the shear force and turbulence intensity inside the fluid. Secondly, under the action of spiral flow, additives are no longer limited to specific flow layers or regions, but can be more evenly dispersed throughout the flow channel, which avoids the problem of too low additive concentration in the mainstream area with faster flow velocity and excessive enrichment of additives in the stagnant area with slower flow velocity.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-density liquid-cooled server and server cabinet system, comprising an equipment cabinet (1), wherein an assembly plate (11) is installed inside the equipment cabinet (1), a circulation pump (12) is installed above the assembly plate (11), liquid cooling pipes (13) are symmetrically connected to both sides of the circulation pump (12), and a liquid storage tank (14) is connected to the front side of the circulation pump (12), characterized in that: A strain thermostatic mechanism (2) is arranged on the front side of the assembly plate (11); a cooling liquid regulating mechanism (3) is arranged at the connection position between the circulation pump (12) and the liquid cooling pipe (13); the strain thermostatic mechanism (2) is used to flexibly dissipate heat from the assembly plate (11); the cooling liquid regulating mechanism (3) is used to make the cooling liquid generate a spiral flow trajectory during the flow process; the strain thermostatic mechanism (2) comprises a new liquid cooling plate (21) mounted on the surface of the assembly plate (11); a micro-cooling plate (21) is provided inside the new liquid cooling plate (21); A flow channel group (22), wherein the bottom of the inner wall of the micro-flow channel group (22) is equipped with a lifting gasket (23), the top of the inner wall of the micro-flow channel group (22) is evenly fixedly connected with a plurality of convex beads (24), and the two sides of the convex beads (24) are connected with an adjustment buckle frame (25); the micro-flow channel group (22) is composed of no less than six micro-channels, and each two micro-channels form a group, and the whole is divided into three groups to divide the surface of the assembly plate (11) into three areas of upper, middle and lower, and the micro-channels in the micro-flow channel group (22) are generally in a relatively gentle incomplete arc shape; The cold liquid regulating mechanism (3) comprises a ratchet assembly (31) symmetrically mounted on the inner wall of the output end and the input end of the circulation pump (12); the two sides of the circulation pump (12) are symmetrically connected with expansion tubes (32); the inner side walls of the expansion tubes (32) are fixedly connected with spiral rings (33); the side of the spiral ring (33) close to the circulation pump (12) is fixedly connected with a diversion column (34); and the side of the spiral ring (33) away from the circulation pump (12) is fixedly connected with a guide shaft (35); The ratchet group (31) is composed of two inclined surface ratchets, the inclined surface angles of the inclined surface ratchets in the ratchet group (31) are arranged in opposite directions, and the inclined surface ratchets in the ratchet group (31) are respectively fixedly connected to the inner side wall of the circulation pump (12) and the outer side wall of the liquid cooling pipe (13); The spiral ring (33) is located at the center of the expansion tube (32), and the spiral ring (33) is composed of a plurality of inclined arc plates. The flow dividing column (34) corresponds to the central position of the output end of the circulation pump (12), and the flow dividing column (34) as a whole is composed of no less than four right-angled triangles spliced ​​together to form an inclined quadrangular prism.

2. A high-density liquid-cooled server and server cabinet system according to claim 1, characterized in that: The adjusting buckle frame (25) is composed of a central shell at a central position and connecting rods dispersed around the central shell, the central shell in the adjusting buckle frame (25) corresponds to the core area of ​​the surface of the assembly plate (11), and the microchannel group (22) and the liquid cooling pipeline (13) are connected through the adjusting buckle frame (25).

3. A high-density liquid-cooled server and server cabinet system according to claim 1, characterized in that: The entirety of the adjusting buckle frame (25) is made of a boron nitride ceramic material, and a heat-sensitive material is installed inside the adjusting buckle frame (25) at a location where the adjusting buckle frame (25) is connected to the liquid cooling pipe (13).

4. A high-density liquid-cooled server and server cabinet system according to claim 1, characterized in that: The lifting gasket (23) is located at a recessed position of the bottom wall inside the microchannel group (22); the lifting gasket (23) is in the form of an upwardly protruding arc plate as a whole; the microchannel group (22) and the lifting gasket (23) are movably connected via a corrugated gasket.

5. A high-density liquid-cooled server and server cabinet system according to claim 1, characterized in that: The liquid storage tank (14) stores water-based coolant, the circulating pump (12), the liquid cooling pipe (13) and the novel liquid cooling plate (21) are all interconnected, and the assembly plate (11) and the novel liquid cooling plate (21) are tightly fitted.

6. A high-density liquid-cooled server and server cabinet system according to claim 1, characterized in that: The assembly board (11) comprises a computing unit, a video memory controller, a texture unit and a rasterization unit. The computing unit in the assembly board (11) is generally a module with the highest temperature and is located in the central area of ​​the assembly board (11).

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