Intelligent automatic dismounting and mounting equipment for electronic device

Abstract

The invention discloses electronic device intelligent automatic disassembly and assembly equipment which comprises a machine case, a PCB conveying device, a selective tin soldering mechanism and a grabbing device. A partition plate is arranged in the middle of the machine case so as to divide the interior of the machine case into an upper machine bin and a lower machine bin. The left end face of the upper machine bin is provided with a PCB feeding port, and the right end face of the upper machine bin is provided with a PCB discharging port. The partition plate is provided with a passing opening A for communicating the upper cabin with the lower cabin; the PCB conveying device is arranged on the upper machine bin and located above the passing opening A, the left end of the PCB conveying device is connected with the PCB feeding opening, and the right end of the PCB conveying device is connected with the PCB discharging opening; the selective tin soldering mechanism is arranged in the lower machine room so as to carry out desoldering / tin soldering on the electronic device pins in the PCB jacks passing through the upper part of the passing port A; the grabbing device is arranged on the upper machine bin so as to upwards grab the electronic devices with unsoldered pins on the PCB / grab new electronic devices till the pins of the electronic devices are inserted into the jacks of the PCB. The device has the advantages of being capable of well replacing traditional manual operation for mechanical operation of desoldering and assembly welding of electronic devices, high in operation efficiency and high in operation safety.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to intelligent automatic disassembly and assembly equipment for electronic devices. Background Art

[0002] In the prior art, broken electronic components in a PCB are usually manually desoldered and disassembled, and new electronic components are manually soldered and installed to replace the broken electronic components.

[0003] For the traditional manual desoldering and re-soldering related operation methods, there are steps of manually using tweezers to clamp the leads of the disassembled electronic device or the new electronic device and using an electric soldering iron to heat and melt or add solder to the solder joints on the clamped leads. Multiple related steps need to be completed manually, which not only makes the desoldering and re-soldering efficiency of electronic devices low, but also makes it easy to damage the solder joints on the printed circuit board. At the same time, there is also the possibility of scalding the operator's limbs due to the high temperature of the soldering iron tip and the splashing of solder, making the operation unsafe. In particular, when multiple broken electronic devices on a PCB need to be desoldered and disassembled and new electronic devices need to be soldered and replaced, pure manual operation is even more inefficient.

[0004] In this regard, the inventor of this patent combined his work experience, conducted in-depth thinking on the problems encountered in the work, read a large amount of scientific research materials and literature, and through retrieval and novelty search, gradually conceived and designed this application to solve the relevant technical problems. Summary of the invention

[0005] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the purpose of the present invention is to provide an intelligent automatic disassembly and assembly device for electronic devices.

[0006] To achieve one of the above purposes, an intelligent automatic disassembly and assembly device for electronic devices according to an embodiment of the present invention includes:

[0007] A chassis; a partition is horizontally arranged in the middle of the chassis to divide the inside into an upper machine compartment and a lower machine compartment; a PCB board inlet is opened at the lower part of the left front face of the upper machine compartment, and a PCB board outlet is opened at the lower part of the right front face; a port A is opened in the middle of the front of the partition to connect the upper machine compartment with the lower machine compartment;

[0008] PCB board conveying device; the PCB board conveying device is arranged on the upper machine bin and is located above the port A, with its left end connected to the PCB board inlet and its right end connected to the PCB board outlet;

[0009] A selective soldering mechanism; the selective soldering mechanism is arranged in the lower compartment to desolder / solder the pins of the electronic components in the PCB board socket passing through the top of the port A;

[0010] The grabbing device is arranged on the upper machine compartment to upwardly grab the electronic components whose pins on the PCB board are desoldered / grasp new electronic components so that their pins are inserted into the PCB board sockets.

[0011] In addition, the intelligent automatic disassembly and assembly equipment for electronic devices according to the above embodiment of the present invention may also have the following additional technical features:

[0012] According to one embodiment of the present invention, the PCB conveying device comprises a left buffer conveying mechanism, a middle disassembly conveying mechanism and a right buffer conveying mechanism which are sequentially connected from left to right;

[0013] The left end of the left buffer conveying mechanism is connected to the PCB board inlet; the right end of the right buffer conveying mechanism is connected to the PCB board outlet.

[0014] According to one embodiment of the present invention, the PCB board conveying device further includes a forward and backward transfer mechanism A;

[0015] The front-to-back transfer mechanism A is mounted on the partition and is located above the port A; the assembly and disassembly conveying mechanism is fixed on the front-to-back transfer mechanism A so as to be able to move back and forth under the control of the front-to-back transfer mechanism A.

[0016] According to one embodiment of the present invention, the selective soldering mechanism includes a solder pump and a two-dimensional moving mechanism for driving the solder pump to move left and right and up and down;

[0017] The two-dimensional moving mechanism is fixed in the lower machine compartment; the solder pump is fixed on the two-dimensional moving mechanism and has a solder head arranged upward.

[0018] According to one embodiment of the present invention, the two-dimensional moving mechanism includes a left-right moving mechanism and a plurality of lifting mechanisms A fixedly mounted on the left-right moving mechanism; each of the lifting mechanisms A is respectively fixedly mounted with a solder pump;

[0019] The plurality of lifting mechanisms A can work synchronously or individually to correspondingly control the synchronous lifting or individual lifting of the plurality of solder pumps.

[0020] According to one embodiment of the present invention, the grasping device includes a multi-axis manipulator, a CCD camera positioning mechanism, and a gripper for grasping electronic devices;

[0021] The multi-axis manipulator is fixed on the upper end surface of the partition, and a turntable is provided at its end. A fixing seat and a plug connector are provided adjacent to the lower bottom surface of the turntable; the CCD camera positioning mechanism is detachably fixed on the bottom of the fixing seat; the top of the clamp has a detachable plug socket adapted to be plugged into the plug connector.

[0022] According to one embodiment of the present invention, it also includes a clamping jaw fixing seat for placing the clamping jaw;

[0023] The clamping jaw fixing seat is installed on the partition, and a plurality of clamping slots for clamping jaws of different sizes and models are opened downward on the upper end surface thereof, and a plurality of the clamping slots are cut from top to bottom on the sides thereof to be connected with the clamping jaws;

[0024] The inner diameters of the multiple card slots are smaller than the outer diameter of the detachable plug sockets, so as to correspondingly adapt to support the multiple detachable plug sockets; the lower parts of the multiple clamping claws are adapted to be correspondingly inserted into the multiple card slots through the multiple pick-and-place grooves, and are adapted to be correspondingly moved out of the multiple card slots to the outside of the multiple pick-and-place grooves.

[0025] According to one embodiment of the present invention, it further comprises a waste collection box disposed on the upper compartment;

[0026] The waste collection box is fixedly arranged on the upper end surface of the partition, and the upper part thereof is formed as a waste introduction port.

[0027] According to one embodiment of the present invention, it further comprises a storage tray disposed on the upper compartment for storing a plurality of identical or different electronic devices;

[0028] The upper end surface of the material storage tray is downwardly provided with a plurality of storage slots for storing the same or different electronic devices, and the inner circumference dimensions of the plurality of storage slots are matched with the outer circumference dimensions of the electronic devices stored therein.

[0029] According to one embodiment of the present invention, it also includes a shelf for storing the material storage tray, a lifting mechanism B for driving the shelf to move up and down, a support platform fixed on the upper end surface of the partition and located at the front side of the shelf for carrying the material storage tray, a gripper for grabbing the material storage tray stored in the shelf, and a forward and backward transfer mechanism B for controlling the forward and backward movement of the gripper to pull the grabbed material storage tray forward to the support platform or push the material storage tray from the support platform to the shelf;

[0030] The front end surface of the shelf rack is formed as an opening, and a plurality of tray shelf layers are evenly arranged from top to bottom inside the shelf rack; the partition plate is also provided with a passage B for connecting the upper machine bin with the lower machine bin; the lifting mechanism B is arranged in the lower machine bin, and its top is connected to the shelf rack to control the shelf rack to move up and down along the passage B until any tray shelf layer is flush with the support platform.

[0031] The beneficial effects of the present invention are:

[0032] First, the intelligent automatic disassembly and assembly equipment for electronic devices provided by the present application, in specific implementation, is configured by setting up the chassis, the PCB board conveying device, the selective soldering mechanism and the grasping device to form a whole, so as to desolder the external solder of the solder feet of the electronic components that need to be desoldered in the sockets on the bottom surface of the PCB board, and install new electronic devices for replacement. The related operations are mechanized, which can better replace the traditional manual close-range operations, so as to greatly improve the desoldering and assembly efficiency of electronic devices.

[0033] Second, the present application uses the selective soldering mechanism to desolder electronic components that need to be desoldered and to solder new electronic components that need to be replaced. It can be automatically controlled through a program, so that compared with the uncertainty brought by manual operation, it is not easy to damage the solder joints on the printed circuit board, so that the present application has high reliability. When the present application can better replace the traditional manual close-range operation, there will be no possibility of high temperature of the soldering iron tip and solder splashing that may cause burns to the operator's limbs, making the operation of the present application safe.

[0034] Thirdly, by setting the CCD camera positioning mechanism, it is convenient to accurately take pictures and position the location of the broken electronic device that needs to be replaced on the PCB board, so as to grasp the broken electronic device that needs to be replaced and load the new electronic device to the location of the broken electronic device for replacement. Since the top of the clamp has a detachable plug socket adapted to be plugged into the plug connector, the clamp can be easily replaced, so that it is suitable for replacing clamps of different sizes and models to grasp the adapted electronic device, so that the grasping device of the present application is also very flexible and reliable to use.

[0035] Fourthly, when the tray shelf layer is flush with the support platform, the gripper can be used to grab the storage tray placed on the corresponding tray shelf layer, and under the control of the forward and backward transfer mechanism B, the gripper can be driven to move forward by a preset stroke to pull the grabbed storage tray forward to the support platform for use. On the contrary, when the shelf moves up and down along the port B until a tray shelf layer without a storage tray placed thereon is flush with the support platform, the gripper can be driven to move backward by a preset stroke to push the grabbed storage tray backward from the support platform to the corresponding tray shelf layer without a storage tray placed thereon under the control of the forward and backward transfer mechanism B. Thus, different electronic devices can be placed in different storage trays, so that they can be selectively used according to actual needs, so that the application can be flexibly and reliably obtained when it is implemented.

[0036] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0038] Figure 1 The overall structure of the intelligent automatic disassembly and assembly equipment of electronic devices of the present invention is shown in FIG. Figure 1 ;

[0039] Figure 2 The overall structure of the intelligent automatic disassembly and assembly equipment of electronic devices of the present invention is shown in FIG. Figure 2 ;

[0040] Figure 3 The overall structure of the intelligent automatic disassembly and assembly equipment of electronic devices of the present invention is shown in FIG. 1 after removing the upper compartment and the outer shell of the lower compartment. Figure 1 ;

[0041] Figure 4 yes Figure 3 Enlarged view of E in the middle;

[0042] Figure 5 The overall structure of the intelligent automatic disassembly and assembly equipment of electronic devices of the present invention is shown in FIG. 1 after removing the upper compartment and the outer shell of the lower compartment. Figure 2 ;

[0043] Figure 6 yes Figure 5 Enlarged view of middle F;

[0044] Figure 7 is an exploded view of the grabbing device in an embodiment of the present invention;

[0045] Figure 8 1 is a schematic diagram of the overall structure in which the middle disassembly and assembly conveying mechanism and the front and rear transfer mechanism A are connected together in an embodiment of the present invention;

[0046] Fig. 9 is a schematic diagram of the overall structure of an electronic device placed on the material storage tray in an embodiment of the present invention;

[0047] Fig.10 yes Fig. 9 Exploded diagram of

[0048] Reference numerals:

[0049] Intelligent automatic disassembly and assembly equipment for electronic devices 1000;

[0050] Chassis 10;

[0051] Partition 101;

[0052] Pass A1011;

[0053] Pass B1012;

[0054] Upper cabin 102;

[0055] Lower cabin 103;

[0056] PCB board feeding port 1021;

[0057] PCB board outlet 1022;

[0058] Heightening foot support 104; PCB board conveying device 20;

[0059] Left buffer conveying mechanism 201;

[0060] Middle disassembly and assembly conveying mechanism 202;

[0061] Right buffer conveying mechanism 203;

[0062] Front and rear transfer mechanism A204;

[0063] Selective soldering mechanism 30;

[0064] Solder pump 301;

[0065] Solder head 3011;

[0066] Left and right moving mechanism 302;

[0067] Lifting mechanism A303;

[0068] Grasping device 40;

[0069] Multi-axis manipulator 401;

[0070] Turntable 4011;

[0071] Fixed seat 4012;

[0072] Plug connector 4013;

[0073] Elastic card bead 40131;

[0074] CCD camera positioning mechanism 402;

[0075] Gripping jaws 403;

[0076] Removable plug socket 4031;

[0077] pit 40311;

[0078] Clamping jaw fixing seat 50;

[0079] Card mounting slot 501;

[0080] Pick-and-place slot 502;

[0081] Waste collection box 60;

[0082] Material storage tray 70;

[0083] Storage tank 701;

[0084] Connecting block 702;

[0085] Grab hole 7021;

[0086] Shelf 80;

[0087] Material tray shelf layer 801;

[0088] Lifting mechanism B90;

[0089] Support table 100;

[0090] Grip 110;

[0091] Cylinder claw 1101;

[0092] Front and rear transfer mechanism B120;

[0093] PCB board 2000;

[0094] Electronic devices 3000;

[0095] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0096] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings of the specification, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present invention, but cannot be understood as limiting the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0097] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “circumferential”, “radial”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the drawings of the specification, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0098] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0099] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0100] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0101] The intelligent automatic disassembly and assembly equipment 1000 for electronic components according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0102] Reference Figures 1 to 10 As shown, the electronic device intelligent automatic disassembly and assembly device 1000 provided according to an embodiment of the present invention includes a chassis 10, a PCB board conveying device 20, a selective soldering mechanism 30 and a grasping device 40:

[0103] In this application, the reference Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, a partition 101 is horizontally provided in the middle of the chassis 10 to divide the interior into an upper machine compartment 102 and a lower machine compartment 103; a PCB board inlet 1021 is provided in the lower part of the left front face of the upper machine compartment 102, and a PCB board outlet 1022 is provided in the lower part of the right front face; a through hole A1011 is provided in the middle of the front face of the partition 101 to connect the upper machine compartment 102 with the lower machine compartment 103;

[0104] In the present application, the PCB board conveying device 20 is arranged on the upper machine bin 102 and is located above the port A1011, with its left end connected to the PCB board inlet 1021 and its right end connected to the PCB board outlet 1022;

[0105] In the present application, the selective soldering mechanism 30 is disposed in the lower compartment 103 to desolder / solder the pins of the electronic device 3000 in the socket of the PCB board 2000 passing above the port A1011;

[0106] In the present application, the grabbing device 40 is disposed on the upper machine compartment 102 to grab the electronic device 3000 with the pins desoldered on the PCB board 2000 upwards / grab a new electronic device 3000 so that its pins are inserted into the holes of the PCB board 2000.

[0107] Based on the above, it can be clearly seen that when the present application is implemented, it is mainly used as an intelligent automatic disassembly and assembly device 1000 for electronic devices.

[0108] Specifically, when applying the present application, the present application is assembled in the above manner, and the PCB board 2000 of the electronic device 3000 that needs to be desoldered and replaced is fed into the upper machine bin 102 from the PCB board feed port 1021. When it is transported to the top of the port A1011 through the PCB board conveying device 20, the selective soldering mechanism 30 can be used to melt the solder joints at the solder feet of the broken electronic device 3000 in the socket on the bottom surface of the conveyed PCB board 2000. The melted solder will be melted under the action of gravity. The broken electronic device 3000 will naturally fall off. At this time, there is no solder at the soldering feet of the broken electronic device 3000. The grasping device 40 can be used to grasp the related electronic device 3000 with the pins on the PCB board 2000 for desoldering, and the new electronic device 3000 can be grasped so that its pins are inserted into the sockets on the bottom surface of the PCB board 2000. Then, the selective soldering mechanism 30 is used to solder the soldering feet of the replaced new electronic device 3000. After the solder is solidified, it can be removed. At this time, the new electronic device 3000 is replaced.

[0109] Obviously, the use of the above-mentioned application will have the following technical effects:

[0110] On the one hand, the present application sets up the chassis 10, the PCB board conveying device 20, the selective soldering mechanism 30 and the grasping device 40 to form a whole, so as to desolder the external solder of the soldering feet of the electronic components that need to be desoldered in the socket on the bottom surface of the PCB board 2000, and install the new electronic components 3000 for replacement. The related operations are mechanized and can better replace the traditional manual close-range operations, so as to greatly improve the desoldering and installation efficiency of the electronic components 3000.

[0111] On the other hand, the present application uses the selective soldering mechanism 30 to desolder the electronic device 3000 that needs to be desoldered and to solder the new electronic device 3000 that needs to be replaced. It can be automatically controlled through a program, so that compared with the uncertainty brought by manual operation, it is not easy to damage the solder joints on the printed circuit board, so that the present application has strong reliability.

[0112] Furthermore, while the present application can better replace the traditional manual close-range operation, there is no possibility of scalding the operator's limbs due to the high temperature of the soldering iron tip and solder splashing, making the present application highly safe to operate.

[0113] Furthermore, through the above-mentioned optimized design, the overall structure of the present application is highly practical and has good use effect.

[0114] Furthermore, in the specific implementation, Figure 3 and Figure 5 As shown, according to one embodiment of the present invention, the PCB conveying device 20 comprises a left buffer conveying mechanism 201, a middle disassembly conveying mechanism 202 and a right buffer conveying mechanism 203 which are sequentially connected from left to right;

[0115] The left end of the left buffer conveying mechanism 201 is connected to the PCB board inlet 1021 ; the right end of the right buffer conveying mechanism 203 is connected to the PCB board outlet 1022 .

[0116] Therefore, it can be clearly seen that the PCB board conveying device 20 described in the present application includes three independent parts, namely the left cache conveying mechanism 201, the middle disassembly and assembly conveying mechanism 202 and the right cache conveying mechanism 203, which are connected in sequence from left to right. They can all work independently and are connected in sequence so that their functions and effects can be better distinguished.

[0117] Specifically, the left buffer conveying mechanism 201 is used for feeding buffer of the PCB board 2000 whose electronic device 3000 needs to be replaced, the middle disassembly and assembly conveying mechanism 202 is used for lifting the PCB board 2000 whose electronic device 3000 needs to be replaced, so as to cooperate with the selective soldering mechanism 30 and the grasping device 40 to desolder the external solder of the solder feet of the electronic components that need to be desoldered in the socket on the bottom surface of the PCB board 2000, and install the new electronic device 3000 for replacement, and the right buffer conveying mechanism 203 is used for discharging buffer of the PCB board 2000 whose electronic device 3000 has been replaced. The three have different functions and work independently, making the application more stable and reliable to use.

[0118] Furthermore, in the specific implementation, continue to compare Figure 3 , Figure 5 and Figure 8 As shown, according to one embodiment of the present invention, the PCB board conveying device 20 further includes a front and rear transfer mechanism A204;

[0119] Among them, the front-to-back transfer mechanism A204 is mounted on the partition 101 and is located above the passage A1011; the intermediate disassembly and assembly conveying mechanism 202 is fixed on the front-to-back transfer mechanism A204 so that it can move forward and backward under the control of the front-to-back transfer mechanism A204.

[0120] Therefore, it is clear that after the PCB board 2000 that needs to replace the electronic device 3000 is transported from the left buffer conveying mechanism 201 to the middle disassembly conveying mechanism 202, the middle disassembly conveying mechanism 202 will be driven by the front-rear transfer mechanism A204 to move backward to a preset position, so as to move the PCB board 2000 that needs to replace the electronic device 3000 backward to the required preset position, and then, the selective soldering mechanism 30 and the grasping device 40 can be used to desolder the external solder of the soldering foot of the electronic component that needs to be desoldered in the socket on the bottom surface of the PCB board 2000, and the new electronic device 3000 can be replaced. 0 is installed for replacement, and then, the middle disassembly and assembly conveying mechanism 202 is driven to move forward to the initial position through the front-rear transfer mechanism A204, so that the left and right ends thereof are re-connected with the right end of the left buffer conveying mechanism 201 and the left end of the right buffer conveying mechanism 203 correspondingly, and thereafter, the PCB board 2000 with the replaced electronic device 3000 is conveniently conveyed to the right buffer conveying mechanism 203 through the middle disassembly and assembly conveying mechanism 202, so that the PCB board 2000 with the replaced electronic device 3000 is conveniently conveyed out from the PCB board discharge port 1022 through the right buffer conveying mechanism 203.

[0121] Regarding the use of the above-mentioned application, if the above-mentioned steps are repeated in a cycle, it can be realized that the present application can be used to dismantle broken electronic devices 3000 on multiple PCB boards 2000 and weld new electronic devices 3000 thereon, and the whole process is an assembly line operation, which can greatly improve the operating efficiency.

[0122] Preferably, in this technical solution, Figure 3 and Figure 5 As shown, according to one embodiment of the present invention, the selective soldering mechanism 30 includes a solder pump 301 and a two-dimensional moving mechanism for driving the solder pump 301 to move left and right and up and down;

[0123] The two-dimensional moving mechanism is fixed in the lower machine compartment 103; the solder pump 301 is fixed on the two-dimensional moving mechanism and has a solder head 3011 arranged upward.

[0124] Therefore, by setting the front-to-back transfer mechanism A204, it is convenient to drive the PCB board 2000 on which the electronic device 3000 needs to be replaced to move to the desired front-to-back position. By setting the two-dimensional moving mechanism, it is convenient to control the solder pump 301 to move left and right and up and down to the preset position, so as to desolder the broken electronic device 3000 on the PCB board 2000 moved to the desired front-to-back position and to solder the replaced new electronic device 3000. The whole formed by the front-to-back transfer mechanism A204 and the two-dimensional moving mechanism can be used as a three-dimensional moving mechanism to accurately locate the position of the electronic device 3000 that needs to be replaced on the PCB board 2000, so that the disassembly and assembly of the electronic device 3000 is accurate and reliable.

[0125] In addition, in the specific implementation, Figure 3 and Figure 5 As shown, according to one embodiment of the present invention, the two-dimensional moving mechanism includes a left-right moving mechanism 302 and a plurality of lifting mechanisms A303 fixedly mounted on the left-right moving mechanism 302; each of the lifting mechanisms A303 is respectively fixedly mounted with a solder pump 301;

[0126] The plurality of lifting mechanisms A303 may work synchronously or individually, so as to correspondingly control the synchronous lifting or individual lifting of the plurality of solder pumps 301 .

[0127] In this regard, it should be made clear that there may be multiple broken electronic components 3000 on the PCB board 2000 that need to be replaced, and the number of solder feet of each electronic component 3000 and the size enclosed by the outer periphery of the solder feet are different. At this time, the multiple lifting mechanisms A303 can be made to work synchronously or separately to correspondingly control the synchronous lifting or separate lifting of the multiple solder pumps 301. When the size models of the solder heads 3011 arranged on the upper parts of the multiple solder pumps 301 are different, it is convenient to use different solder pumps 301 to melt and desolder the external solder joints of the lower pins of broken electronic components 3000 at different positions and to solder the solder feet of the replaced new electronic components 3000.

[0128] In this way, the present application has strong flexibility and adaptability in use.

[0129] Furthermore, in the specific implementation, Figure 4 and Figure 7 As shown, according to one embodiment of the present invention, the grasping device 40 includes a multi-axis manipulator 401, a CCD camera positioning mechanism 402, and a gripper 403 for grasping the electronic device 3000;

[0130] Among them, the multi-axis manipulator 401 is fixed on the upper end surface of the partition 101, and a turntable 4011 is provided at its end, and a fixed seat 4012 and a plug connector 4013 are provided adjacent to the lower bottom surface of the turntable 4011; the CCD camera positioning mechanism 402 is detachably fixed at the bottom of the fixed seat 4012; the top of the clamp 403 has a detachable plug seat 4031 adapted to be plugged into the plug connector 4013.

[0131] From this, it can be clearly seen that:

[0132] On the one hand, by setting up the CCD camera positioning mechanism 402, it is convenient to accurately photograph and locate the position of the broken electronic device 3000 that needs to be replaced on the PCB board 2000, so as to combine the multi-axis manipulator 401 and the clamp 403 to grab the broken electronic device 3000 that needs to be replaced and load the new electronic device 3000 to the position of the broken electronic device 3000 for replacement.

[0133] On the other hand, since the top of the clamp 403 has a detachable plug socket 4031 adapted to be plugged into the plug connector 4013, the clamp 403 can be easily replaced, making it suitable for replacing clamps 403 of different sizes and models to grasp the adapted electronic device 3000, so that the grasping device 40 described in the present application is also very flexible and reliable to use.

[0134] Furthermore, through the above-mentioned optimized design, the overall use effect of the present application can be effectively improved.

[0135] Again, in this technical solution, Figure 3 and Figure 4 As shown, according to one embodiment of the present invention, the present invention further comprises a clamping jaw 403 fixing seat for placing the clamping jaw 403;

[0136] The clamping jaw 403 fixing seat is installed on the partition 101, and a plurality of clamping slots 501 for clamping the clamping jaws 403 of different sizes and types are opened downward on the upper end surface thereof, and a plurality of the clamping slots 501 are cut from top to bottom on the sides thereof to be connected with the clamping jaws 403;

[0137] Moreover, the inner diameters of the plurality of card slots 501 are smaller than the outer diameters of the detachable plug socket 4031 and the outer diameters of the bottoms of the clamps 403, so as to correspondingly adapt to supporting the plurality of detachable plug sockets 4031; the lower parts of the plurality of clamps 403 are adapted to be correspondingly inserted into the plurality of card slots 501 through the plurality of pick-and-place slots 502, and to be correspondingly moved out of the plurality of card slots 501 to the outside of the plurality of pick-and-place slots 502.

[0138] In this regard, it is clear that:

[0139] On the one hand, the present application prepares a plurality of different sizes and models of clamps 403 for replacement, so that the application can be adapted according to the appearance and structure of the actual electronic device 3000 to be disassembled and assembled, so that the use of the present application is indeed more flexible and reliable.

[0140] On the other hand, the multi-axis manipulator 401 controls the clamping jaw 403 inserted thereon to be inserted into the corresponding card slot 501 through any of the pick-and-place slots 502, and then, the clamping jaw 403 inserted in the corresponding card slot 501 is kept stationary and withdrawn upward from the multi-axis manipulator 401, so as to facilitate the separation between the detachable plug socket 4031 of the clamping jaw 403 and the plug connector 4013 provided at the bottom of the multi-axis manipulator 401; conversely, the clamping jaw 403 supported in a certain card slot 501 is kept stationary, and the multi-axis manipulator 401 is moved downward, so as to facilitate the plug-in connection between the detachable plug socket 4031 of the clamping jaw 403 and the plug connector 4013 provided at the bottom of the multi-axis manipulator 401.

[0141] Furthermore, through the above-mentioned optimized design, the clamping jaw 403 described in the present application can be easily assembled and disassembled.

[0142] Preferably, in this technical solution, Figure 7As shown, the outer wall of the lower end of the plug connector 4013 is uniformly protruded outwardly with a plurality of elastic beads 40131, and the inner wall of the detachable plug socket 4031 is recessed inwardly to form a plurality of pits 40311. When a little force is applied to make the plug connector 4013 and the detachable plug socket 4031 plug-in connected, the plurality of elastic beads 40131 can be correspondingly inserted into the plurality of pits 40311, so that the plug connector 4013 and the detachable plug socket 4031 are connected. 31 can be firmly plugged in and connected together for use; conversely, when a little force is applied to pull the plug connector 4013 out of the detachable plug socket 4031, the plurality of elastic beads 40131 can be correspondingly squeezed out of the plurality of recesses 40311 to achieve the separation of the plug connector 4013 and the detachable plug socket 4031. In this way, the plug connector 4013 and the detachable plug socket 4031 of the present application can be easily and effortlessly disassembled and assembled.

[0143] And preferably, in this technical solution, the control Figure 3 and Figure 5 As shown, according to one embodiment of the present invention, the present invention further comprises a waste collection box 60 disposed in the upper compartment 102;

[0144] The waste collection box 60 is fixedly mounted on the upper end surface of the partition 101, and the upper portion thereof is formed as a waste inlet.

[0145] Thus, the broken electronic components 3000 that have been desoldered can be grabbed by the grabbing device 40 and stored in the waste collection box 60, so that they can be easily recovered and reused.

[0146] And in the specific implementation, the reference Figure 3 , Figure 5 , Fig. 9 and Fig.10 As shown, according to one embodiment of the present invention, the present invention further comprises a storage tray 70 disposed on the upper compartment 102 for storing a plurality of identical or different electronic devices 3000;

[0147] The upper end surface of the storage tray 70 is downwardly opened with a plurality of storage slots 701 for storing the same or different electronic devices 3000 , and the inner circumference dimensions of the plurality of storage slots 701 are adapted to the outer circumference dimensions of the electronic devices 3000 stored therein.

[0148] Thus, the new electronic device 3000 that needs to be replaced is pre-installed in the material storage tray 70, so that it can be easily grabbed by the grabbing device 40 to replace the broken electronic device 3000 on the PCB board 2000, so that materials can be obtained nearby.

[0149] At the same time, in this technical solution, continue to compare Figure 3 and Figure 5 As shown, according to one embodiment of the present invention, the present invention further comprises a shelf 80 for storing the material storage tray 70, a lifting mechanism B90 for driving the shelf 80 to move up and down, a support platform 100 fixedly mounted on the upper end surface of the partition 101 and located at the front side of the shelf 80 for carrying the material storage tray 70, a gripper 110 for grabbing the material storage tray 70 stored in the shelf 80, and a forward and backward transfer mechanism B120 for controlling the forward and backward movement of the gripper 110 to pull the grabbed material storage tray 70 forward to the support platform 100 or push the material storage tray 70 from the support platform 100 to the shelf 80;

[0150] Among them, the front end surface of the shelf rack 80 is formed as an open opening, and a plurality of tray shelf layers 801 are evenly arranged from top to bottom inside the shelf rack; the partition 101 is also provided with a passage B1012 for connecting the upper machine warehouse 102 with the lower machine warehouse 103; the lifting mechanism B90 is arranged in the lower machine warehouse 103, and its top is connected to the shelf rack 80 to control the shelf rack 80 to move up and down along the passage B1012 until any of the tray shelf layers 801 is flush with the support platform 100.

[0151] Therefore, when the shelf 80 moves up and down along the port B1012 until the tray shelf layer 801 on which a storage tray 70 is placed is flush with the support platform 100, the gripper 110 can be used to grab the storage tray 70 placed on the corresponding tray shelf layer 801, and under the control of the front and rear transfer mechanism B120, the gripper 110 can be driven to move forward a preset stroke to pull the grabbed storage tray 70 forward to the support platform 100 for use.

[0152] On the contrary, when the shelf 80 moves up and down along the port B1012 until a certain tray shelf layer 801 on which no material storage tray 70 is placed is flush with the support platform 100, the gripper 110 can be driven to move backward a preset stroke under the control of the front-rear transfer mechanism B120 to push the grabbed material storage tray 70 backward from the support platform 100 to the corresponding tray shelf layer 801 on which no material storage tray 70 is placed.

[0153] Therefore, different electronic devices 3000 are placed in different material storage trays 70, so that they can be selectively used according to actual needs, making the application more flexible and reliable in obtaining materials nearby during specific implementation.

[0154] Preferably, in this technical solution, Figure 5 and Figure 6As shown, the shelf 80, the lifting mechanism B90, the support platform 100, the gripper 110 and the front and rear transfer mechanism B120 are each provided with two groups, so that the two shelf racks 80 can be used synchronously or alternately. When they are used alternately, the used electronic devices 3000 in the storage tray 70 on the shelf rack 80 that is not currently in use can be prepared, so that the application can be used uninterruptedly and the working efficiency can be greatly improved.

[0155] It should be added that in the specific implementation, Figure 5 , Figure 6 , Fig. 9 and Fig.10 As shown, according to the electronic device intelligent automatic disassembly and assembly equipment 1000 provided in an embodiment of the present invention, the rear end of the gripper 110 is provided with a cylinder claw 1101 that can be opened / closed left and right, and the front end of the storage tray 70 is provided with two connecting blocks 702 facing forward, and the two connecting blocks 702 are provided with gripping holes 7021 opposite to each other;

[0156] The lifting mechanism B90 controls the shelf 80 to move up and down until the material storage tray 70 placed on a certain material tray shelf layer 801 is flush with the gripper 110, and then the front-rear transfer mechanism B120 controls the gripper 110 to move backward by a preset stroke, and the cylinder claw 1101 opens in the left and right directions so as to be inserted into the two grabbing holes 7021, so that the gripper 110 can grab the material storage tray 70, and under the control of the front-rear transfer mechanism B120, the grabbed material storage tray 70 can be pulled forward to the support platform 100.

[0157] On the contrary, the lifting mechanism B90 controls the shelf 80 to move up and down until a certain tray shelf layer 801 without a storage tray 70 is flush with the gripper 110, and then the front-rear transfer mechanism B120 controls the gripper 110 to move backward by a preset stroke, so as to push the storage tray 70 from the support platform 100 to the corresponding tray shelf layer 801 of the shelf 80 without a storage tray 70, and to close the cylinder claw 1101 in the left and right directions, that is, to enable it to be withdrawn from the two grasping holes 7021, so that the gripper 110 can be detached from the storage tray 70.

[0158] Thus, through the above-mentioned optimized design, the shelf 80, the lifting mechanism B90, the support platform 100, the gripper 110 and the front-rear transfer mechanism B120 described in the present application can be coordinated very reliably.

[0159] It is further necessary to add that, in a specific implementation, a height-adjusting foot support 104 is respectively fixed at the four corners of the bottom of the chassis 10 described in the present application, so that when the heights of the four height-adjusting foot supports 104 are adjusted respectively, the chassis 10 described in the present application can be stably supported and fixed to the ground, etc.

[0160] It is further necessary to add that, in the specific implementation, according to the intelligent automatic disassembly and assembly equipment 1000 for electronic devices provided in an embodiment of the present invention, the structures of the left cache conveying mechanism 201, the middle disassembly and assembly conveying mechanism 202 and the right cache conveying mechanism 203 described in the present application are basically the same as the structure of the "PCB board clamping and conveying device" provided in the invention patent "Selective soldering machine with intelligent switching of solder pump" with patent number "202311042236.7". In the field of PCB board clamping and conveying, it is a conventional structure in the prior art and can be directly purchased and assembled in the existing market for use; and, the front and rear transfer mechanism A204, the left and right moving mechanism 302, the lifting mechanism A303, the lifting mechanism B90 and the front and rear transfer mechanism B120 described in the present application are preferably screw-driven linear modules, wheel-driven linear modules or cylinder-driven linear modules, etc., which are also common in the prior art and can be directly purchased and assembled in the market for use, so their details are not described in detail here.

[0161] Other embodiments and the like are not described here by way of example.

[0162] To sum up, the intelligent automatic disassembly and assembly equipment 1000 for electronic devices provided by the present application, in specific implementation, is configured by setting up the chassis 10, the PCB board conveying device 20, the selective soldering mechanism 30 and the grasping device 40 to form a whole, so as to desolder the external solder of the solder feet of the electronic components that need to be desoldered in the socket on the bottom surface of the PCB board 2000, and install the new electronic device 3000 for replacement. The related operations are purely mechanized, which can better replace the traditional manual close-range operations, so as to greatly improve the desoldering and assembly efficiency of the electronic device 3000.

[0163] Furthermore, the present application uses the selective soldering mechanism 30 to desolder the electronic device 3000 that needs to be desoldered and to solder the new electronic device 3000 that needs to be replaced. It can be automatically controlled through a program, so that compared with the uncertainty brought by manual operation, it is not easy to damage the solder joints on the printed circuit board, so that the present application has high reliability. When the present application can better replace the traditional manual close-range operation, there is no possibility of scalding the operator's limbs due to the high temperature of the soldering iron tip and solder splashing, making the operation of the present application safe.

[0164] In addition, by setting the CCD camera positioning mechanism 402, it is convenient to accurately take pictures and position the location of the broken electronic device 3000 that needs to be replaced on the PCB board 2000, so as to grasp the broken electronic device 3000 that needs to be replaced and load the new electronic device 3000 to the location of the broken electronic device 3000 for replacement by combining the multi-axis manipulator 401 and the clamping claw 403. Since the top of the clamping claw 403 is equipped with a detachable plug socket 4031 that is plug-connected with the plug connector 4013, the clamping claw 403 can be easily replaced, so that it is suitable for replacing the clamping claw 403 of different sizes to grasp the adapted electronic device 3000, so that the grasping device 40 of the present application is also very flexible and reliable to use.

[0165] Furthermore, when the material tray shelf layer 801 is flush with the support platform 100, the gripper 110 can be used to grab the material storage tray 70 placed on the corresponding material tray shelf layer 801, and under the control of the front-rear transfer mechanism B120, the gripper 110 can be driven to move forward a preset stroke to pull the grabbed material storage tray 70 forward to the support platform 100 for use. Conversely, when the shelf 80 moves up and down along the port B1012 until a material tray shelf layer 801 on which no material storage tray 70 is placed is flush with the support platform 100, the gripper 110 can be driven to move backward a preset stroke to push the grabbed material storage tray 70 backward from the support platform 100 to the corresponding material tray shelf layer 801 on which no material storage tray 70 is placed. Therefore, different electronic devices 3000 are placed in different material storage trays 70, so that they can be selectively used according to actual needs, making the application flexible and reliable in obtaining materials nearby during specific implementation.

[0166] Furthermore, the intelligent automatic disassembly and assembly equipment 1000 for electronic devices provided in the present application is indeed extremely practical and has excellent use effects, which makes the present application bound to have a good market promotion value, and the present application is bound to be very popular and will be effectively popularized.

[0167] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0168] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An intelligent automatic disassembly and assembly device for electronic devices, characterized in that: include: A chassis; a partition is horizontally arranged in the middle of the chassis to divide the interior into an upper compartment and a lower compartment; a PCB board inlet is provided on the left end surface of the upper compartment, and a PCB board outlet is provided on the right end surface; a port A is provided on the partition to connect the upper compartment with the lower compartment; PCB board conveying device; the PCB board conveying device is arranged on the upper machine bin and is located above the port A, with its left end connected to the PCB board inlet and its right end connected to the PCB board outlet; A selective soldering mechanism; the selective soldering mechanism is arranged in the lower compartment to desolder / solder the pins of the electronic components in the PCB board socket passing through the top of the port A; The grabbing device is arranged on the upper machine compartment to upwardly grab the electronic components whose pins on the PCB board are desoldered / grasp new electronic components so that their pins are inserted into the PCB board sockets.

2. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 1, characterized in that: The PCB conveying device comprises a left buffer conveying mechanism, a middle disassembly conveying mechanism and a right buffer conveying mechanism which are sequentially connected from left to right; The left end of the left buffer conveying mechanism is connected to the PCB board inlet; the right end of the right buffer conveying mechanism is connected to the PCB board outlet.

3. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 2, characterized in that: The PCB board conveying device also includes a front and rear transfer mechanism A; The front-to-back transfer mechanism A is mounted on the partition and is located above the port A; the assembly and disassembly conveying mechanism is fixed on the front-to-back transfer mechanism A so as to be able to move back and forth under the control of the front-to-back transfer mechanism A.

4. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 3, characterized in that: The selective soldering mechanism includes a solder pump and a two-dimensional moving mechanism for driving the solder pump to move left and right and up and down; The two-dimensional moving mechanism is fixed in the lower machine compartment; the solder pump is fixed on the two-dimensional moving mechanism and has a solder head arranged upward.

5. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 4, characterized in that: The two-dimensional moving mechanism includes a left-right moving mechanism and a plurality of lifting mechanisms A fixedly mounted on the left-right moving mechanism; each lifting mechanism A is respectively fixedly mounted with a solder pump; The plurality of lifting mechanisms A can work synchronously or individually to correspondingly control the synchronous lifting or individual lifting of the plurality of solder pumps.

6. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 1, characterized in that: The grabbing device includes a multi-axis manipulator, a CCD camera positioning mechanism and a gripper for grabbing electronic devices; The multi-axis manipulator is fixed on the upper end surface of the partition, and a turntable is provided at its end. A fixing seat and a plug connector are provided adjacent to the lower bottom surface of the turntable; the CCD camera positioning mechanism is detachably fixed on the bottom of the fixing seat; the top of the clamp has a detachable plug socket adapted to be plugged into the plug connector.

7. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 6, characterized in that: Also includes a clamping jaw fixing seat for placing the clamping jaw; The clamping jaw fixing seat is installed on the partition, and a plurality of clamping slots for clamping jaws of different sizes and models are opened downward on the upper end surface thereof, and a plurality of the clamping slots are cut from top to bottom on the sides thereof to be connected with the clamping jaws; The inner diameters of the multiple card slots are smaller than the outer diameter of the detachable plug sockets, so as to correspondingly adapt to support the multiple detachable plug sockets; the lower parts of the multiple clamping claws are adapted to be correspondingly inserted into the multiple card slots through the multiple pick-and-place grooves, and are adapted to be correspondingly moved out of the multiple card slots to the outside of the multiple pick-and-place grooves.

8. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 1, characterized in that: It also includes a waste collection box disposed on the upper cabin; The waste collection box is fixedly arranged on the upper end surface of the partition, and the upper part thereof is formed as a waste introduction port.

9. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 1, characterized in that: Also included is a storage tray disposed on the upper compartment for storing a plurality of identical or different electronic devices; The upper end surface of the material storage tray is downwardly provided with a plurality of storage slots for storing the same or different electronic devices, and the inner circumference dimensions of the plurality of storage slots are matched with the outer circumference dimensions of the electronic devices stored therein.

10. The intelligent automatic disassembly and assembly equipment for electronic devices according to claim 9, characterized in that: It also includes a shelf for storing the material storage tray, a lifting mechanism B for driving the shelf to move up and down, a support platform fixed on the upper surface of the partition and located at the front side of the shelf for carrying the material storage tray, a gripper for grabbing the material storage tray stored in the shelf, and a forward and backward transfer mechanism B for controlling the forward and backward movement of the gripper to pull the grabbed material storage tray forward to the support platform or push the material storage tray from the support platform to the shelf; The front end surface of the shelf rack is formed as an opening, and a plurality of tray shelf layers are evenly arranged from top to bottom inside the shelf rack; the partition plate is also provided with a passage B for connecting the upper machine bin with the lower machine bin; the lifting mechanism B is arranged in the lower machine bin, and its top is connected to the shelf rack to control the shelf rack to move up and down along the passage B until any tray shelf layer is flush with the support platform.

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