Light emitting device, electronic apparatus, and method of manufacturing light emitting device

Abstract

Provided is a light-emitting device having a plurality of emission colors, which can be manufactured by a simplified process, and in which an increase in resistance of a second electrode, deterioration of optical characteristics, and uneven brightness can be suppressed. The light emitting device includes a plurality of sub-pixels arranged two-dimensionally and corresponding to a plurality of emission colors, respectively, and a connection portion connecting the plurality of different sub-pixels. The light-emitting device has a first electrode, and an organic layer having a light-emitting layer and a second electrode in this order on the first electrode. The first electrode and the organic layer are formed at least in each of the plurality of sub-pixels. A second electrode is formed in the plurality of sub-pixels and the connection portion. A connection portion is formed in a part of an inter-sub-pixel region, which is a region between the plurality of sub-pixels. At least one part of the connecting part is connected with the plurality of sub-pixels with different light emitting colors.

Description

Technical Field

[0001] The present disclosure relates to a light emitting device, an electronic device, and a method of manufacturing a light emitting device. Background Art

[0002] As a light-emitting device using a light-emitting element such as an organic EL element, a display device having a structure in which an organic compound layer including a light-emitting layer and a second electrode are stacked on a first electrode formed in an arrangement pattern spaced apart from each other in units of sub-pixels constituting one pixel is known. A pattern of each layer such as the organic compound layer and the second electrode is formed using a formation method such as a method by a vapor deposition technique, a method by a printing technique, a method by an etching method, or a method using a photolithography method.

[0003] Regarding a display device as one of the light-emitting devices, patent document 1 discloses a technology in which a plurality of sub-pixels are provided for each light-emitting color, each sub-pixel includes an organic compound layer corresponding to each of a plurality of light-emitting colors, and the organic compound layer and the second electrode are patterned so that the organic compound layer and the second electrode are connected between separate sub-pixels having the same light-emitting color.

[0004] Reference List

[0005] Patent Literature

[0006] Patent document 1: Japanese Patent Application Publication No. 2021-163599. Summary of the invention

[0007] Problems to be solved by the present invention

[0008] In Patent Document 1, in the case where the display device has multiple luminous colors, a portion (referred to as an overlapping portion) where multiple second electrodes and multiple organic compound layers are stacked may appear. In Patent Document 1, a manufacturing process is used in which the second electrodes constituting sub-pixels corresponding to different luminous colors are separated from each other in the overlapping portion. In this manufacturing process, each second electrode is formed for each luminous color of the sub-pixel. Therefore, in Patent Document 1, there is room for improvement in terms of the convenience of the manufacturing process.

[0009] Furthermore, in Patent Document 1, in the case where the display device has a plurality of luminous colors, a step (unevenness) is generated at the overlapping portion. Therefore, in Patent Document 1, there is room for improvement in suppressing the step caused by the overlapping portion, suppressing the increase in resistance of the second electrode and the degradation of optical characteristics in the portion where the step is generated, and suppressing the occurrence of brightness unevenness caused by the increase in resistance of the second electrode.

[0010] The present disclosure is made in view of the above points, and an object of the present disclosure is to provide a light-emitting device, an electronic device and a method for manufacturing a light-emitting device, which can facilitate the manufacturing process of a light-emitting device having a plurality of luminous colors and can suppress the increase in resistance of the second electrode, the degradation of optical properties and the uneven brightness.

[0011] Solution to the problem

[0012] The present disclosure is, for example, (1) a light emitting device, comprising:

[0013] A plurality of sub-pixels are arranged two-dimensionally and correspond to a plurality of luminescent colors respectively;

[0014] A connecting portion, connecting a plurality of different sub-pixels;

[0015] a first electrode; and

[0016] On the upper side of the first electrode, there are an organic layer including a light-emitting layer and a second electrode in sequence.

[0017] wherein the first electrode and the organic layer are formed at least in each of the plurality of sub-pixels,

[0018] The second electrode is formed in each of the plurality of sub-pixels and the connection portion,

[0019] In a case where a region between a plurality of sub-pixels is defined as an inter-sub-pixel region, the connection portion is formed in a portion of the inter-sub-pixel region, and

[0020] At least a portion of the connection portion connects a plurality of sub-pixels having different luminescent colors.

[0021] The present disclosure may be (2) an electronic device including the display device according to the above (1).

[0022] Furthermore, the present disclosure may, for example, be a method of manufacturing a light emitting device, the method comprising:

[0023] In a first step, an organic layer including a light-emitting layer is patterned on a first electrode using a mask determined according to a layout of a plurality of sub-pixels;

[0024] A second step is to stack a second electrode on the organic layer; and

[0025] In the third step, the organic layer and the second electrode are removed by etching at a portion separated from a junction of a sub-pixel and a connection portion connecting a plurality of different sub-pixels.

[0026] In addition, the present disclosure is, for example, a method for manufacturing a light emitting device, the method comprising the following steps:

[0027] forming a first organic layer including a first light emitting layer on first electrodes of two first sub-pixels adjacent to each other in a predetermined direction via a first mask;

[0028] After setting a second mask so that a first electrode for forming a third sub-pixel exists between an opening of the first mask and an opening of the second mask, a second organic layer including a second light-emitting layer is formed on the first electrodes of two second sub-pixels adjacent to each other in a predetermined direction via the second mask;

[0029] forming a second electrode and a first protective layer in sequence on the first organic layer and the second organic layer, the second electrode forming the first sub-pixel and the second sub-pixel; and

[0030] The first subpixel and the second subpixel are formed by patterning the first protective layer, the second electrode, the first organic layer, and the second organic layer so that a connection portion connecting the first subpixel and the second subpixel remains in an inter-subpixel region and the first electrode forming the third subpixel is exposed. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a plan view for explaining an example of the display device according to the first embodiment.

[0032] Figure 2 It is magnified Figure 1 FIG. 1 is a partially enlarged plan view of a portion of a region XS surrounded by a dotted line.

[0033] Figure 3 is schematically shown along Figure 2 A sectional view of the state of a longitudinal section taken along line II in FIG.

[0034] Figure 4 is schematically shown along Figure 2 A sectional view of the state of a longitudinal section taken along line II-II in FIG.

[0035] Figure 5 is schematically shown along Figure 2 A sectional view of the state of a longitudinal section taken along line III-III in FIG.

[0036] Figure 6 is a cross-sectional view for explaining an example of an organic layer.

[0037] Figure 7 A. Figure 7 B and Figure 7 C is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0038] Figure 8 A. Figure 8 B and Figure 8C is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0039] Fig. 9 A. Fig. 9 B and Fig. 9 C is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0040] Fig.10 A. Fig.10 B and Fig.10 C is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0041] Fig.11 A. Fig.11 B and Fig.11 C is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0042] Fig.12 A. Fig.12 B and Fig.12 C is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0043] Fig.13 A. Fig.13 B and Fig.13 C is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0044] Fig.14 is a plan view for explaining an example of a display device according to the second embodiment.

[0045] Fig.15 is a plan view for explaining an example of a display device according to the second embodiment.

[0046] Fig.16 A. Fig.16 B. Fig.16 C and Fig.16 D is a plan view for explaining an example of the display device according to the third embodiment.

[0047] Fig.17 A. Fig.17 B. Fig.17 C and Fig.17 D is a plan view for explaining an example of the display device according to the third embodiment.

[0048] Fig.18 A and Fig.18 B is a diagram for explaining an example of the display device according to the fourth embodiment.

[0049] Fig.19 A and Fig.19 B is a diagram for explaining an example of the display device according to the fourth embodiment.

[0050] Fig. 20 A and Fig. 20 B is a diagram for explaining an example of the display device according to the fourth embodiment.

[0051] Fig.21 is a diagram for explaining an example of a display device according to a fourth embodiment.

[0052] Fig. 22 A. Fig. 22 B and Fig. 22 C is a diagram for explaining an example in the case where the display device includes a wavelength selection unit.

[0053] Fig.23 : is a diagram for explaining an example in the case where the display device includes a wavelength selection unit.

[0054] Fig.24 A and Fig.24 B is a diagram for explaining an example in the case where the display device includes a wavelength selection unit.

[0055] Fig.25 : is a diagram for explaining an example in the case where the display device includes a wavelength selection unit.

[0056] Fig.26 It is a cross-sectional view for explaining an embodiment in which a display device includes a wavelength selection unit.

[0057] Fig. 27 A and Fig. 27 B is a diagram for explaining an application example of the display device.

[0058] Fig.28 is a diagram for explaining an application example of the display device.

[0059] Fig.29 is a diagram for explaining an application example of the display device.

[0060] Fig.30 is a diagram for explaining an application example of the display device.

[0061] Fig.31 is a diagram for explaining an application example of the display device.

[0062] Fig.32 A and Fig.32 B is a diagram for explaining an application example of the display device.

[0063] Fig.33 is a plan view for explaining an example of a display device according to a fifth embodiment.

[0064] Fig.34 It is along Fig.33 A cross-sectional view taken along line XXXIV-XXXIV of .

[0065] Fig.35 It is along Fig.33 A cross-sectional view taken along line XXXV-XXXV of .

[0066] Fig.36 It is along Fig.33 A cross-sectional view taken along line XXXVI-XXXVI.

[0067] Fig.37 It is along Fig.33 A cross-sectional view taken along line XXXVII-XXXVII.

[0068] Fig.38 is a plan view of the organic layer.

[0069] Fig.39 is a plan view of the second electrode 39 .

[0070] Fig.40 is a plan view for explaining a sub-pixel layout of a display device according to a modification of the fifth embodiment.

[0071] Fig.41 A and Fig.41 B is a plan view for explaining a sub-pixel layout of a display device according to a modification of the fifth embodiment.

[0072] Fig.42 A and Fig.42 B is a plan view for explaining a sub-pixel layout of a display device according to a modification of the fifth embodiment.

[0073] Fig.43 is a plan view for explaining a sub-pixel layout of a display device according to a modification of the fifth embodiment.

[0074] Fig.44 A. Fig.44 B. Fig.44 C. Fig.44 D and Fig.44 E is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0075] Fig.45 A. Fig.45 B. Fig.45 C and Fig.45 D is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0076] Fig.46 A. Fig.46 B. Fig.46 C and Fig.46D is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0077] Fig.47 A. Fig.47 B. Fig.47 C and Fig.47 D is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0078] Fig.48 A. Fig.48 B. Fig.48 C. Fig.48 D and Fig.48 E is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0079] Fig.49 A. Fig.49 B. Fig.49 C and Fig.49 D is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0080] Fig.50 A. Fig.50 B. Fig.50 C and Fig.50 D is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0081] Fig.51 A. Fig.51 B. Fig.51 C and Fig.51 D is a cross-sectional view for explaining an example of a method of manufacturing a display device.

[0082] Fig.52 is a plan view for explaining a sub-pixel layout of a display device according to a modification of the fifth embodiment.

[0083] Fig.53 is a plan view of the organic layer.

[0084] Fig.54 is a plan view of the second electrode. DETAILED DESCRIPTION

[0085] Hereinafter, examples and the like according to the present disclosure will be described with reference to the drawings. Note that explanation will be given in the following order. In this specification and the drawings, configurations having substantially the same functional configuration are denoted by the same reference numerals, and redundant descriptions are omitted.

[0086] The light emitting device according to the present disclosure can be used as a display device, etc. Therefore, by taking the case where the light emitting device according to the present disclosure is a display device as an example, the light emitting device, the method of manufacturing the light emitting device, and the application example of the electronic device will be described.

[0087] Note that the explanation will be given in the following order.

[0088] 1. Display device

[0089] 1-1. First Embodiment

[0090] 1-2. Second Embodiment

[0091] 1-3. Third Embodiment

[0092] 1-4. Fourth Embodiment

[0093] 1-5. Fifth Embodiment

[0094] 2. Method for manufacturing display device

[0095] 3. Example of the case where the display device includes a wavelength selection unit

[0096] 4. Application Examples

[0097] The following description relates to preferred specific examples of the present disclosure, and the contents of the present disclosure are not limited to these embodiments, etc. In addition, in the following description, directions such as front and back, left and right, and up and down are indicated in consideration of the convenience of description, but the contents of the present disclosure are not limited to these directions. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 In the examples of , etc., it is assumed that the Z-axis direction is the up-down direction (the upper side is the +Z direction, the lower side is the -Z direction), the Y-axis direction is the front-back direction (the front side is the -Y direction, and the rear side is the +Y direction), and the X-axis direction is the left-right direction (the right side is the +X direction, and the left side is the -X direction), and the description will be made based on this. This similarly applies to Figures 6 to 15 , Figures 18 to 21 as well as Figure 33 to Figure 51 For convenience, the Figure 1 The relative size ratios of the size and thickness of each layer shown in each figure in the other drawings are not limited to any actual size ratio. Regarding the definitions and size ratios of these directions, this similarly applies to Figures 2 to 32 as well as Figure 33 to Figure 51 The lateral direction (X direction) and the longitudinal direction (Y direction) are examples of a first direction and a second direction that are orthogonal to each other in a display surface of a display device.

[0098] [1. Display device]

[0099] [1-1. First embodiment]

[0100] [1-1-1. Configuration of display device]

[0101] The display device 10 according to the first embodiment of the present disclosure has multiple luminous colors. In addition, the display device 10 includes a plurality of pixels, and one pixel is formed by a combination of a plurality of sub-pixels 101 corresponding to a plurality of color types (luminous colors). In the display device 10, a plurality of sub-pixels 101 are arranged two-dimensionally. A connection portion 23 connecting different sub-pixels 101 is formed in each sub-pixel 101. The connection portion 23 is formed in a portion of the inter-sub-pixel region. The display device 10 includes a second electrode 15 as described later, and the second electrode 15 is formed in the sub-pixel 101 and the connection portion 23. Then, a portion of the second electrode 15 of the sub-pixel 101 is continuous with a portion of the second electrode 15 of the connection portion 23.

[0102] An example of the display device 10 according to the first embodiment of the present disclosure includes an organic electroluminescent (EL) display device. Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown in and the like, a case where the display device 10 is an organic EL display device 10 (hereinafter, simply referred to as “display device 10 ”) will be described as an example. Figure 1 is a plan view showing an example of the display device 10 . Figure 2 is a schematic diagram showing the Figure 1 FIG. 1 is a plan view of a portion of the enlarged region XS surrounded by the dotted line in FIG. Figure 2 In the display area 10A, a plurality of unit areas are arranged in a predetermined layout, and one sub-pixel 101 is formed inside the unit area (in Figure 2 (inside the hexagonal area divided by the segment line MU). Figure 3 is schematically shown along Figure 2 A cross-sectional view of the state of the cross section taken along line II in FIG. Figure 4 is schematically shown along Figure 2 A cross-sectional view of the state of the cross section taken along the line II-II in FIG. Figure 5 is schematically shown along Figure 2 Note that for ease of description, Figure 3 , Figure 4 and Figure 5 The counter substrate is not shown.

[0103] In the following description, a case where the display device 10 performs display by a top emission method is explained as an example. It is assumed that the top emission method indicates a method in which the light emitting element 104 is provided on a side of the light emitting surface DP rather than on a side of the substrate 11A. Therefore, in the display device 10, the substrate 11A is located on the rear surface side of the display device 10, and the direction (+Z direction) from the substrate 11A toward the light emitting element 104 described later is the direction toward the front surface side (upper surface side) of the display device 10. In the display device 10, light generated from the light emitting element 104 is guided in the +Z direction and emitted to the outside. In the following description, in each layer constituting the display device 10, the display area of ​​the display device 10 (in Figure 1 In the figure, the surface on the display surface side in the display area 10A indicated by hatching is referred to as the first surface (upper surface), and the surface on the rear surface side of the display device 10 is referred to as the second surface (lower surface). Note that this does not prohibit the case where the display device 10 according to the present disclosure is a bottom emission type. The display device 10 is also applicable to a bottom emission type. By the bottom emission method, light generated from the light emitting element 104 is directed to the -Z direction and emitted to the outside.

[0104] The type of sub-pixels, the configuration of the sub-pixels, the configuration of the connection portion, and the details of each configuration formed in each sub-pixel will be further described.

[0105] (Sub-pixel type)

[0106] exist Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 In the example of , three colors of red, green, and blue are determined as multiple color types corresponding to multiple luminous colors of the display device 10, and three types of sub-pixels 101R, sub-pixels 101G, and sub-pixels 101B are set to correspond to the multiple color types of sub-pixels 101. Sub-pixels 101R, sub-pixels 101G, and sub-pixels 101B are red sub-pixels, green sub-pixels, and blue sub-pixels, respectively, and display red, green, and blue, respectively. However, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5The examples of etc. are only examples, and the display device 10 is not limited to the case where a plurality of sub-pixels corresponding to three color types are included. In addition, the wavelengths of light corresponding to the respective color types of red, green, and blue can be determined, for example, as wavelengths in the range of 610nm to 650nm (red wavelength band), the range of 510nm to 590nm (green wavelength band), and the range of 440nm to 480nm (blue wavelength band), respectively. Note that the number of color types of the sub-pixel 101 is not limited to the three colors shown here, and may be two colors, four colors, etc. In addition, the color type of the sub-pixel 101 is not limited to red, green, and blue, and may be yellow, white, etc.

[0107] In addition, the layout of the sub-pixels 101B, 101R, and 101G in the display device 10 is not particularly limited, but Figure 2 In the example of FIG. 1 , in the display area 10A, sub-pixels 101B, 101R, and 101G constituting one pixel are arranged in a delta shape, and each pixel is arranged two-dimensionally. Figure 2 In the display device 10 shown in the example of FIG. 1 , a plurality of sub-pixels 101B, 101R, and 101G corresponding to a plurality of color types are arranged in a two-dimensional and triangular layout. The triangular layout indicates a layout in which a triangle is formed by line segments connecting the centers of the plurality of sub-pixels 101 constituting a pixel. Figure 2 In FIG. 1 , each sub-pixel 101 is defined as a hexagonal shape. Note that Figure 2 is an example, and as will be described later, the layout and shape of the sub-pixels 101B, 101R, and 101G are not limited to the present disclosure. Figure 2 , sub-pixels 101R, 101B, and 101G are respectively represented by symbols R, G, and B. Note that in the display area 10A, a region between the plurality of sub-pixels 101B, 101R, and 101G (a region outside the sub-pixel 101 in a plan view of the display device 10) is defined as an inter-sub-pixel region M.

[0108] In the description of this specification, the sub-pixels 101R, 101G, and 101B are collectively referred to as sub-pixels 101 without particularly distinguishing the types of the sub-pixels 101R, 101G, and 101B.

[0109] (Sub-pixel driving)

[0110] like Figure 1 As shown, the display device 10 generally includes a control circuit (not shown), an H driver 105 and a V driver 106, and a control circuit 107 controls the driving of the H driver 105 and the V driver 106. The H driver 105 and the V driver 106 control the driving of the sub-pixel 101.

[0111] (Sub-pixel configuration)

[0112] exist Figure 3 , Figure 4 , Figure 5 In the example of , the display device 10 includes a first electrode 13 on the upper side of the drive substrate 11, and includes an organic layer 14 and a second electrode 15 in sequence on the first electrode 13. In this case, the first electrode 13, the organic layer 14, and the second electrode 15 formed in sequence on the upper side (+Z direction side) of the drive substrate 11 form a light-emitting element 104 in the sub-pixel 101. Note that in the sub-pixel 101, the portion of the light-emitting element 104 where the organic layer 14 and the second electrode 15 are stacked is referred to as a multilayer structure 22.

[0113] Next, each configuration of the drive substrate 11 and the like will be described. Note that a configuration that can be common between the configuration of each layer in the sub-pixel 101 and a configuration of a layer formed in a connection portion 23 described later will be described together.

[0114] (Drive board)

[0115] like Figures 3 to 5 As shown in the drawings, in the driving substrate 11, an insulating layer 11B is provided on the substrate 11A, and various circuits for driving the plurality of light emitting elements 104 are provided in the insulating layer 11B. Examples of the various circuits include a driving circuit for controlling the driving of the light emitting elements 104, and a power supply circuit for supplying power to the plurality of light emitting elements 104 (neither of which is shown in the drawings). The various circuits are restricted from being exposed to the outside by the insulating layer 11B. In addition, the driving substrate 11 is provided with wiring 11C for connecting the light emitting elements 104, the circuits provided on the substrate 11A, etc. to the first electrode 13, etc. Note that in Figure 3 , Figure 4 and Figure 5 , for convenience of description, the wiring 11C is shown in a state including a contact plug and the like.

[0116] The substrate 11A may include, for example, glass or resin having low moisture permeability and oxygen permeability, or may include a semiconductor in which transistors etc. are easily formed. Specifically, the substrate 11A may be a glass substrate, a semiconductor substrate, a resin substrate or the like.

[0117] (Insulation layer)

[0118] The insulating layer 11B is formed of, for example, an organic material or an inorganic material. The organic material includes, for example, at least one of polyimide and acrylic resin. The inorganic material includes, for example, at least one of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide.

[0119] (Light-emitting element)

[0120] The sub-pixel 101 is provided with a plurality of light emitting elements 104 on the first surface of the driving substrate 11. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 In the example of the above, each light emitting element 104 is an organic electroluminescent element (organic EL element). As the plurality of light emitting elements 104, a color corresponding to the color type of the sub-pixel 101 is provided to be set to be emitted from the light emitting surface (by Figure 1 The light emitting elements 104R, 104G and 104B are formed in the sub-pixels 101R, 101G and 101B, respectively. In addition, a plurality of light emitting elements 104 are arranged corresponding to the arrangement of the sub-pixels 101 of the corresponding color types. Figure 2 , Figure 3 , Figure 4 and Figure 5 In the example of , a plurality of light emitting elements 104 are two-dimensionally arranged in a triangular arrangement pattern. Note that in this specification, the term light emitting element 104 is used without particularly distinguishing the type such as the light emitting elements 104R, 104G, and 104B.

[0121] Each light emitting element 104 has a structure in which a first electrode 13, an organic layer 14, and a second electrode 15 are sequentially stacked. The first electrode 13, the organic layer 14, and the second electrode 15 are sequentially stacked from one side of the drive substrate 11 in a direction (+Z direction) from the second surface toward the first surface.

[0122] (First Electrode)

[0123] A plurality of first electrodes 13 are provided on the first surface side of the drive substrate 11. Figure 3 , Figure 4 , Figure 5 In the examples of , each first electrode 13 is an anode electrode.

[0124] The first electrodes 13 each include at least one of a metal layer and a metal oxide layer. The first electrodes 13 may each include a single-layer film of a metal layer or a metal oxide layer, or a multi-layer film of a metal layer and a metal oxide layer.

[0125] The metal layer contains at least one metal element selected from the group consisting of, for example, chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W) and silver (Ag). The metal layer may contain at least one of the above metal elements as a constituent element of an alloy. Specific examples of alloys include aluminum alloys and silver alloys. Specific examples of aluminum alloys include, for example, AlNd and AlCu.

[0126] The metal oxide layer includes, for example, at least one of a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and titanium oxide (TiO).

[0127] exist Figure 2 , Figure 3 , Figure 4 , Figure 5 In the example of the present invention, the first electrode 13 is formed at least in each sub-pixel 101 and is electrically isolated for each sub-pixel 101. That is, a plurality of first electrodes 13 are provided on the first surface side of the drive substrate 11 and are provided for each sub-pixel 101. Figure 2 , Figure 3 , Figure 4 and Figure 5 In the example of FIG. 1 , the first electrode 13 is formed slightly outside the sub-pixel 101 , but remains electrically isolated for each sub-pixel 101 .

[0128] In addition, it is preferable to form an insulating layer between adjacent first electrodes 13. Figure 2 , Figure 3 , Figure 4 , Figure 5 In the examples of , etc., the insulating layer 12 is formed between adjacent first electrodes 13. The insulating layer 12 may be a layer including an inorganic insulating material such as SiO2, SiN, or SiON formed by a CVD method, a layer including Al2O3 formed by an ALD method, or a layer including an organic insulating material such as polyimide. The insulating layer 12 may be a layer having a single-layer structure or a layer having a multi-layer structure. The insulating layer 12 may be a layer formed of the same material as the insulating layer 11B or a layer formed of a material different from the insulating layer 11B. In the case where the insulating layer 12 is the same as the insulating layer 11B, the insulating layer 12 may be integrated with the insulating layer 11B. Figure 2 , Figure 3 , Figure 4 , Figure 5 In the example of FIG. 1 , the insulating layer 12 electrically isolates each first electrode 13 for each light emitting element 104 (for each sub-pixel 101). Figure 3 , Figure 4As shown in , etc., an opening 12A is formed in the insulating layer 12 on the first surface side, the first surface of the first electrode 13 (the surface facing the second electrode 15) is exposed from the opening 12A of the insulating layer 12, and a portion of the first electrode 13 exposed from the opening 12A faces the organic layer 14 described later without interposing the insulating layer 11B. Note that the insulating layer 11B can be formed not only between adjacent first electrodes 13 but also on the edge of the first electrode 13. The edge of each first electrode 13 is defined by a portion from the outer peripheral edge of the first electrode 13 to a predetermined position close to the center side of the first electrode 13. In this case as well, the insulating layer 11B includes the opening 12A, and the first surface of the first electrode 13 is exposed from the opening 12A.

[0129] (Organic layer)

[0130] The organic layer 14 is disposed on the upper side of the first electrode 13. The organic layer 14 is formed at least in each sub-pixel 101. In the sub-pixel 101, the organic layer 14 is disposed between the first electrode and the second electrode 15. The organic layer 14 is an organic compound layer, and is disposed according to the color type of the sub-pixel 101. For example, organic layers 14R, 14G, and 14B are formed according to sub-pixels 101R, 101G, and 101B, respectively. The organic layer 14R is an organic layer 14 having red as a light-emitting color. The organic layer 14G is an organic layer 14 having green as a light-emitting color. The organic layer 14B is an organic layer 14 having blue as a light-emitting color. In this specification, the term organic layer 14 is used without particularly distinguishing types such as the organic layers 14R, 14G, and 14B.

[0131] like Figure 6 As shown, Figure 3 , Figure 4 , Figure 5 The organic layer 14 shown in and the like has a structure in which a light-emitting layer 142 and a plurality of functional layers 25 as layers other than the light-emitting layer 142 are stacked. Figure 6 is a diagram showing an example of a layer configuration of the light emitting element 104. Note that Figure 6 Light emitting element 104B is shown as an example. Figure 6 In the example shown, the organic layer 14 has a configuration in which a hole injection layer 140, a hole transport layer 141, a light emitting layer 142, and an electron transport layer 143 are stacked in this order from the first electrode 13 toward the second electrode 15 (from the side closer to the first electrode 13). Figure 6As shown, the electron injection layer 144 may be provided between the electron transport layer 143 and the second electrode 15. In this case, in the organic layer 14, the functional layers 25 other than the light-emitting layer 142 are the hole injection layer 140, the hole transport layer 141, the electron transport layer 143, and the electron injection layer 144. Note that in this specification, for the sake of convenience of description, the functional layers 25 such as the hole injection layer 140 and the hole transport layer 141 formed between the light-emitting layer 142 and the first electrode 13 in the organic layer 14 are collectively referred to as the first layer 125A, and the functional layers 25 such as the hole injection layer 140 and the hole transport layer 141 formed between the light-emitting layer 142 and the second electrode 15 in the organic layer 14 are collectively referred to as the second layer 125B.

[0132] Note that Figure 4 In order to facilitate the description, the first layer 125A and the second layer 125B are described, and the description of the hole injection layer 140, the hole transport layer 141, the electron transport layer 143, and the electron injection layer 144 is omitted. Figure 3 and Figure 5 , for convenience of explanation, without distinguishing between the first layer 125A and the second layer 125B, a structure in which a plurality of functional layers 25 excluding the light-emitting layer 142 from the organic layer 14 are stacked is shown as a layer 126. The layer 126 indicates a layer structure of a portion obtained by removing the light-emitting layer 142 from the organic layer 14.

[0133] The hole injection layer 140 is a buffer layer for improving the efficiency of hole injection into the light emitting layer 142 and reducing leakage. Examples of the material of the hole injection layer 140 may include hexaazatriphenylene (HAT). The hole transport layer 141 is used to improve the efficiency of hole transmission to the light emitting layer 142. Examples of the material of the hole transport layer 141 may include N, N'-di(1-naphthyl)-N, N'-diphenyl-1, 1'-diphenyl-4, 4'-diamine (α-NPD).

[0134] The electron transport layer 143 is used to improve the efficiency of electron transport to the light emitting layer 142. Examples of the material of the electron transport layer 143 may include aluminum quinoline, bathophenanthroline, and the like.

[0135] Note that the electron injection layer 144 is used to improve electron injection efficiency. Examples of the material of the electron injection layer 144 may include a simple substance of an alkali metal or an alkaline earth metal such as lithium or lithium fluoride and a compound including these simple substances.

[0136] When an electric field is applied, the light-emitting layer 142 generates light by the recombination of electrons and holes. The light-emitting layer 142 is an organic compound layer containing an organic light-emitting material. As the light-emitting layers 142R, 142G and 142B of the organic layers 14R, 14G and 14B, it is suitable to use a layer containing an organic light-emitting material corresponding to each light-emitting color. For example, in the light-emitting layer 142R of the organic layer 14R, a layer (red light-emitting layer) containing a red light-emitting material can be appropriately used. Specifically, as a red light-emitting material, a material obtained by mixing 4,4-bis(2,2-diphenylamine)biphenyl (DPVBi) with 30% by weight of 2,6-bis[(4'-methoxydiphenylamine)phenyl]-1,5-dicyanonaphthalene (BSN) can be used. In the light-emitting layer 142G of the organic layer 14G and the light-emitting layer 142B of the organic layer 14B, a layer (green light-emitting layer) containing a green light-emitting material and a layer (blue light-emitting layer) containing a blue light-emitting material can be appropriately used respectively. The green light emitting material is not particularly limited, and an organic light emitting material capable of emitting green light can be used. Examples of green light emitting materials include a mixture of DPVBi and coumarin 6. As a blue light emitting material, similar to a red light emitting material, a green light emitting material, etc., an organic light emitting material capable of emitting blue light can be used. Examples of blue light emitting materials include a mixture of DPVBi and 4,4-bis(2-(4-(N,N-diphenylamino)phenyl)vinyl)biphenyl (DPAVBi).

[0137] Note that Figure 5 In the example of FIG. 1 , the organic layer 14 includes the light-emitting layer 142 as a single layer, but may include a plurality of light-emitting layers 142 . When a plurality of light-emitting layers 142 are provided, a layer other than the light-emitting layer may be provided between the light-emitting layers 142 as the functional layer 25 .

[0138] (Correlation between functional layers of sub-pixels corresponding to respective color types)

[0139] For each functional layer 25 defined as a layer other than the light emitting layer 142 of the organic layer 14 , regardless of the color type of the sub-pixel 101 , a common layer may be used, a partially different layer may be used, or a completely different layer may be used.

[0140] For example, any one of the hole injection layer 140, the hole transport layer 141, the electron transport layer 143, and the electron injection layer 144 may be a layer common to the sub-pixel 101R, the sub-pixel 101B, and the sub-pixel 101G. For each of the sub-pixel 101R, the sub-pixel 101B, and the sub-pixel 101G, the hole injection layer 140 and the hole transport layer 141 may be different, and the electron transport layer 143 and the electron injection layer 144 may be a layer common to the sub-pixel 101R, the sub-pixel 101B, and the sub-pixel 101G. In addition, any one of the hole injection layer 140, the hole transport layer 141, the electron transport layer 143, and the electron injection layer 144 may be a different layer for each of the sub-pixel 101R, the sub-pixel 101B, and the sub-pixel 101G. From the viewpoint of simplifying the manufacturing process, it is preferred that at least some of the functional layers 25 are common to the multilayer structure 22 of multiple sub-pixels 101 regardless of the color type of the sub-pixel 101.

[0141] exist Figure 3 and Figure 4 In the example of , the thickness of the hole transport layer 141 of the functional layer 25 may be different in each of the sub-pixel 101R, the sub-pixel 101B, and the sub-pixel 101G. Figure 3 and Figure 4 In the example of FIG. 1 , any one of the hole injection layer 140 , the electron transport layer 143 , and the electron injection layer 144 may be a layer common to the sub-pixel 101R, the sub-pixel 101B, and the sub-pixel 101G.

[0142] (Layer formed at the connection portion of the organic layer)

[0143] exist Figure 3 and Figure 5 In the example of , at least a portion of the functional layer 25 defined as a layer other than the light-emitting layer in the organic layer 14 is formed in the sub-pixel 101 and the connecting portion 23. Each functional layer 25 formed in the connecting portion 23 may be a layer shared with the functional layer 25 formed in one sub-pixel 101, may be a completely different layer, or may be a partially different layer.

[0144] exist Figure 3 In the example of FIG. 1 , as an example of the connection portion 23 connecting the sub-pixel 101R and the sub-pixel 101B, Fig.11 As shown in C, the first portion 122 of the connecting portion 23 can be shared with the combination of functional layers 25 (first layer 125A, second layer 125B and layer 126) formed in the sub-pixel 101R, and the second portion 123 can be shared with the combination of functional layers 25 (first layer 125A, second layer 125B and layer 126) formed in the sub-pixel 101R.

[0145] exist Figure 3 and Figure 5 In the example of FIG. 1 , the light emitting layer 142 of the organic layer 14 extends from one sub-pixel 101 to the connection portion 23 connected to another sub-pixel 101. For each connection portion 23 connected to one sub-pixel 101, the light emitting layer 142 may extend to the connection portion 23. Figure 3 In the example of FIG. 1 , the light-emitting layer 142B provided in the sub-pixel 101B extends to both the connection portion 23 connected to the sub-pixel 101R side and the connection portion 23 connected to the sub-pixel 101G side. Note that in the case where the light-emitting layer 142 extends to the connection portion 23, it is preferable that the light-emitting layer 142 extends only to a portion of the connection portion 23. In this case, the light-emitting layer 142 is included in a portion of the connection portion 23. Note that Figure 3 The example is an example, and does not prohibit the light-emitting layer 142 of the organic layer 14 from extending from one sub-pixel 101 to the connection portion 23 connected to another sub-pixel 101 .

[0146] In addition, in the case where the light emitting layer 142 extends to the connection portions 23 of the plurality of connection portions 23, the light emitting layer 142 extending to some connection portions 23 may be different from the light emitting layer extending to other connection portions 23. In addition, multiple types of light emitting layers 142 may extend to one connection portion 23. In addition, as Figure 3 As shown, in the case where a plurality of light emitting layers 142 extending to the connection portion 23 are formed, the combination of the light emitting layers 142 may be different depending on the connection portion 23. For example, in the case where the light emitting layers 142 extending to some of the connection portions 23 are layers having red as the light emitting color, the light emitting layers 142 extending to other connection portions 23 may be layers having green as the light emitting color. Figure 3 The connection portion 23 shown in FIG. 2 shows a connection portion in which the light emitting layer 142B and the light emitting layer 142R extend to the connection portion 23 and a connection portion in which the light emitting layer 142B and the light emitting layer 142G extend to the connection portion 23. Figure 5 In the embodiment, the light emitting layer 142G and the light emitting layer 142R extend to the connection portion 23. As described above, in the case where the light emitting layer 142 extends to the connection portion 23, the combination of the light emitting layer 142 may differ depending on the arrangement of the connection portion 23.

[0147] In the connection portion 23, the light emitting layer 142 may overlap. Figure 3 In the example of FIG. 1 , in the connection portion 23 connecting the sub-pixel 101R and the sub-pixel 101B, the light-emitting layer 142 of the organic layer 14R and the light-emitting layer 142 of the organic layer 14B extend. In the connection portion 23 connecting the sub-pixel 101B and the sub-pixel 101G, the light-emitting layer 142B of the organic layer 14B and the light-emitting layer 142G of the organic layer 14G extend. In addition, at the connection portion 23, the light-emitting layer 142G and the light-emitting layer 142B overlap each other.

[0148] (Second Electrode)

[0149] The second electrode 15 is provided on the upper side (first surface side) of the organic layer 14. The portion of the second electrode 15 corresponding to the sub-pixel 101 (the portion corresponding to the light emitting element 104) is provided to face the first electrode 13. Figure 2 , Figure 3 , Figure 4 , Figure 5 In the example of , etc., the second electrode 15 is provided as an electrode shared with a plurality of sub-pixels 101 corresponding to a plurality of luminescent colors. The second electrode 15 is formed at least in a plurality of sub-pixels 101 and the connecting portion 23. The second electrode 15 is formed jointly and continuously with at least some of the sub-pixels 101 and the connecting portion 23 connected to the sub-pixel 101. For example, this can be achieved by patterning the second electrode 15 in a layout corresponding to the combined portion of the sub-pixel 101 and the connecting portion 23 using photolithography and etching as described in the manufacturing method described later.

[0150] The second electrode 15 is a cathode electrode. The second electrode 15 is preferably a transparent electrode having transmittance to light generated in the organic layer 14. The transparent electrode herein may be a transparent electrode formed with a transparent conductive layer, or may be a transparent electrode formed with a multilayer structure including a transparent conductive layer and a semi-transparent reflective layer.

[0151] As the transparent conductive layer, it is preferred to use a transparent conductive material having good optical transparency and a small work function. The transparent conductive layer can be formed, for example, of a metal oxide. Specifically, examples of the material of the transparent conductive layer may include a material containing at least one of a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and zinc oxide (ZnO).

[0152] For example, the semi-transparent reflective layer may be formed of a metal layer. Specifically, examples of the material of the semi-transparent reflective layer may include a material containing at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), gold (Au), and copper (Cu). The metal layer may contain the above at least one metal element as a constituent element of an alloy. Specific examples of the alloy include MgAg alloy, AgPdCu alloy, etc.

[0153] (First protective layer)

[0154] exist Figure 3 , Figure 4 , Figure 5In the example shown in FIG. 1 , the first protective layer 16 is preferably formed as a protective layer covering the first surface (exposed surface of the second electrode 15) of the light emitting element 104. The first protective layer 16 makes it difficult for the first surface of the light emitting element 104 to contact with the outside air, and inhibits moisture from entering the light emitting element 104 from the outside environment. The first protective layer 16 has transmittance to the light emitted from the light emitting element 104.

[0155] The first protective layer 16 is formed of an insulating material. For example, a thermosetting resin or the like can be used as the insulating material. An organic insulating material such as polyimide can be used as the insulating material forming the first protective layer 16. In addition, an inorganic insulating material such as SiO2, SiON, AlO, or TiO can be used as the insulating material. In this case, a CVD film containing SiO2, SiON, etc., an ALD film containing AlO, TiO, SiO2, etc., etc. can be exemplified as the first protective layer 16. Note that a CVD film indicates a film formed using chemical vapor deposition. An ALD film indicates a film formed using atomic layer deposition.

[0156] (Second protective layer)

[0157] The second protective layer 17 is preferably formed as a protective layer covering the first surface side of the first protective layer 16 and between the light emitting elements 104 adjacent to each other. Figure 3 , Figure 4 , Figure 5 In the example of , etc., a second protective layer 17 is formed on one surface to cover the formation region of the sub-pixel 101 and the inter-sub-pixel region. The second protective layer 17 can be formed of an insulating material similar to the insulating material of the first protective layer 16. Similar to the first protective layer 16, the second protective layer 17 makes it difficult for the first surface of the light-emitting element 104 to contact with the outside air and inhibits moisture from entering the light-emitting element 104 from the external environment. The second protective layer 17 has transmittance to the light emitted from the light-emitting element 104.

[0158] Note that Figure 3 , Figure 4 , Figure 5 In the figures and the like, the first protective layer 16 and the second protective layer 17 are shown separately, but the first protective layer 16 and the second protective layer 17 may form one layer.

[0159] (Sidewall of multi-layer structure)

[0160] like Figure 4 As shown, the multilayer structure 22 in the light emitting element 104 formed in each sub-pixel 101 includes a side wall 24. The side wall 24 includes a side end surface 241 of the organic layer 14 and a side end surface 242 of the second electrode 15. In addition, in each sub-pixel 101, the side wall 24 is covered with a second protective layer 17.

[0161] In at least a portion of the sub-pixel 101, the side end surface 241 of the organic layer 14 and the side end surface 242 of the second electrode 15 are preferably aligned at the position of the boundary between the organic layer 14 and the second electrode 15. Figure 4 In the example, in at least a portion of the sub-pixel 101 , the side end surface 241 of the organic layer 14 and the side end surface 242 of the second electrode 15 form a substantially continuous surface at the position of the boundary between the organic layer 14 and the second electrode 15 .

[0162] In addition, in the side end surface 241 of the organic layer 14 of the side wall 24 of the multilayer structure 22, the side end surface of the light emitting layer 142 and the side end surfaces of the plurality of functional layers 25 are preferably aligned. Figure 4 In the example, in at least a portion of the sub-pixel 101, the side wall 24 of the multilayer structure 22 forms a substantially continuous surface in the up and down directions, and the side end surfaces of the light-emitting layer 142 and the side end surfaces of the plurality of functional layers 25 form a substantially continuous surface.

[0163] As described above, the first protective layer 16 is formed on the upper side of the multilayer structure 22 (the upper side of the second electrode 15). In the case of distinguishing the first protective layer 16 and the second protective layer 17 formed in each sub-pixel 101, the first protective layer 16 includes a side end surface 243. In this case, in at least a portion of the sub-pixel 101, preferably, the side end surface 243 of the first protective layer 16 and the side end surface 242 of the second electrode 15 are aligned at least at the position of the boundary between the first protective layer 16 (protective layer) and the second electrode 15. Figure 4 In the example, the side wall 24 of the multilayer structure 22 and the side end surface of the first protective layer 16 form a substantially continuous surface, and the side end surface of the first protective layer 16 and the side end surface of the second electrode 15 form a substantially continuous surface.

[0164] (Connection)

[0165] The display device 10 includes the connection portion 23 as described above, and the connection portion 23 is defined as a portion that connects a plurality of multilayer structures 22 formed in different sub-pixels 101 and is two-dimensionally arranged at a position between the plurality of different multilayer structures 22, such as Figure 2 , Figure 3 , Figure 5 As shown in Figure 2 In the example of FIG. 1 , the connection portion 23 is arranged in the inter-subpixel region (the outer region of the multilayer structure 22 in the plan view of the display device 10). In addition, in this example, the layer (for example, the hole injection layer 140) arranged on the side closest to the second surface among the functional layers 25 constituting the organic layer 14 formed in the connection portion 23 is in contact with the insulating layer 12. It should be noted that the plan view of the display device 10 indicates a case where the Z-axis direction is regarded as the line of sight direction.

[0166] (Connection Configuration)

[0167] The connecting portion 23 includes at least the second electrode 15. Figure 3 and Figure 5 In the example of , as described above, the connection portion 23 further includes the layer 126 (functional layer 25) other than the light-emitting layer 142 in the organic layer 14. In addition, in this example, a portion of the light-emitting layer 142 extends to the connection portion 23, and a portion of the connection portion 23 includes a portion of the light-emitting layer 142. However, Figure 3 and Figure 5 The illustrated structure of the connection portion 23 is merely an example and does not limit the connection portion 23 of the display device 10 .

[0168] (Layout of the connection section)

[0169] The layout and shape of the connection portion 23 are not particularly limited, but Figure 2 In the example of FIG. 1 , in at least some of the sub-pixels 101 , the plurality of connection portions 23 are connected to different locations on the outer peripheral surface of the multilayer structure 22 . Figure 2 In the example of FIG. 1 , in the sub-pixel 101 , the connection portion 23 is connected to six different positions.

[0170] like Figure 2 As shown in the example of , the connection portion 23 may be formed in a layout connecting the multilayer structures 22 disposed in the sub-pixels 101 having different luminous colors. Figure 2 , the connection portion 23 is formed in a rectangular shape and has one end side connected to the multilayer structure 22 of the sub-pixel 101B and the other end side connected to the multilayer structure 22 provided in the sub-pixel 101R or the sub-pixel 101G. However, this does not deny that the connection portion 23 is formed in a layout that connects the multilayer structures 22 provided in the sub-pixels 101 having the same luminescent color. In addition, the connection portion 23 may be formed in a layout that combines a layout that connects the multilayer structures 22 provided in the sub-pixels 101 having the same luminescent color with a layout that connects the multilayer structures 22 provided in the sub-pixels 101 having different luminescent colors.

[0171] exist Figure 2 , Figure 3 and Figure 5 In the example of FIG. 1 , the connection portion 23 is formed in a layout of the multilayer structure 22 connecting two different sub-pixels 101 , but is not limited thereto. The connection portion 23 may be formed in a layout of the multilayer structure 22 connecting three or more different sub-pixels 101 as described later.

[0172] The shape of the connection portion 23 is not particularly limited as long as the resistance of the second electrode 15 is not significantly affected. Figure 2In the example of , in the plan view of the display device 10, the shape of the connection portion 23 is generally rectangular and linear, but is not limited thereto, and may be a cross, a comb, a triangle, a circle, etc., or a shape extending in a nonlinear shape. In addition, the thickness of the connection portion 23 is not particularly limited as long as the resistance of the second electrode 15 is not significantly affected. For example, in the case where a plurality of connection portions 23 are connected to the multilayer structure 22, the thickness of some connection portions 23 may be different from the thickness of other connection portions 23, or the thickness of the connection portions 23 may be different from each other.

[0173] (Low refractive index layer)

[0174] The low refractive index layer 18 is preferably disposed on the first surface of the second protective layer 17. Figure 2 , Figure 3 , Figure 4 and Figure 5 In the example of FIG. 1 , one surface of the low refractive index layer 18 is formed on the first surface side of the second protective layer 17 .

[0175] The low refractive index layer 18 is preferably a layer having a smaller refractive index than the protective layer (first protective layer 16 or second protective layer 17). The refractive index of the low refractive index layer 18 is preferably less than about 1.7. Examples of materials forming the low refractive index layer 18 include ultraviolet curing resins and thermosetting resins.

[0176] Since the low refractive index layer 18 is provided, the interface reflection of the light emitted laterally from the light emitting element 104 (interface reflection between the protective layer and the low refractive index layer 18) can be increased by the refractive index difference between the protective layer and the low refractive index layer 18. Therefore, the light leakage to the adjacent sub-pixel 101 can be suppressed, and the light extracted to the front can be increased. Note that the light emitted upward from the light emitting element 104 is incident on the interface between the protective layer and the low refractive index layer 18 at a vertical or shallow angle, and is therefore hardly affected by the refractive index difference between the protective layer and the low refractive index layer 18. Therefore, due to the refractive index difference between the protective layer and the low refractive index layer 18, the extraction of the light emitted upward from the light emitting element 104 is hardly reduced.

[0177] (Counter substrate)

[0178] On the first surface side of the low refractive index layer 18, an opposing substrate (not shown) may be provided. As the material of the opposing substrate, the material of the substrate 11A of the drive substrate 11 or the like may be used. For example, a glass substrate may be used as the opposing substrate. The material of the glass substrate is not limited to any specific material as long as the glass substrate is formed of a material that transmits light emitted from the organic layer 14. Examples of the material of the glass substrate include various glass substrates such as high strain point glass, soda glass, borosilicate glass, and lead glass, as well as a quartz substrate.

[0179] [1-1-2. Functions and effects]

[0180] In the case where a display device includes a plurality of sub-pixels having a plurality of luminescent colors and different luminescent colors, a portion (overlapping portion) where second electrodes formed in sub-pixels corresponding to different luminescent colors intersect each other is generated, and a step is sometimes formed in the overlapping portion. In such a display device, the respective second electrodes are formed using a manufacturing process in which second electrodes constituting sub-pixels corresponding to different luminescent colors are separated from each other in the overlapping portion.

[0181] In the display device 10 according to the present disclosure, the second electrode 15 formed in the multilayer structure 22 of the plurality of different sub-pixels 101 is connected at the connection portion 23, and the second electrode 15 is shared (continuous) with the connection portion 23 and the multilayer structure 22. In this case, the plurality of different sub-pixels 101 may be sub-pixels 101 corresponding to different luminous colors. Therefore, in the display device 10, it is not necessary to form the second electrode 15 provided in the sub-pixel 101 corresponding to the different luminous color for each luminous color, and the second electrode 15 provided in the sub-pixel 101 corresponding to a plurality of luminous colors may be formed together, thereby simplifying the manufacturing process.

[0182] In addition, in the display device 10, since the second electrodes 15 constituting the sub-pixels corresponding to different luminescent colors can be formed together, the overlapping portion of the second electrodes can be omitted. Therefore, in the display device 10, the generation of steps (unevenness) accompanying the overlapping portion can be suppressed, and the increase in resistance of the second electrode and the degradation of optical characteristics in the case of the generation of the steps can be suppressed. Then, in the display device 10, the increase in resistance of the second electrode can be suppressed, so that the occurrence of uneven brightness can be suppressed.

[0183] Furthermore, in the display device 10 , since the connection portion 23 is formed in a pattern having a predetermined layout, leakage current can be made smaller than in a case where the connection portion is formed in the entire inter-sub-pixel region.

[0184] [1-2. Second embodiment]

[0185] In the display device 10 of the first embodiment, the layout of the connection portion 23 connected to the sub-pixels 101R, 101G, and 101B is not limited to Figure 2 and can be the same as Figure 2 Examples of different layouts, such as Fig.14 and Fig.15 The layout of the connection portion 23 is similar to Figure 2 An embodiment in which the layout in the example is different is referred to as a second embodiment. Fig.14 and Fig.152 is a diagram showing an example of the layout of the connection section 23 in the display device 10 according to the second embodiment.

[0186] In the display device 10 according to the second embodiment, for example, Fig.14 As shown, the layout of the connection portion 23 may be a layout in which the connection portion 23 is connected to four different positions of one sub-pixel 101. Fig.15 As shown, the layout of the connection portion 23 may be a layout connected to two different positions of one sub-pixel 101 .

[0187] Furthermore, the layout of the connection portion 23 may be a layout that connects to seven or more different locations of one sub-pixel 101. In the display device 10, when one sub-pixel 101 is connected to a plurality of other sub-pixels 101 through the connection portion 23, resistance caused by the connection portion 23 can be suppressed.

[0188] [1-3. Third embodiment]

[0189] In the display device 10 of the first embodiment, the layout of the sub-pixels 101R, 101G, and 101B (the layout of the multilayer structure 22) is not limited to Figure 1 (triangular layout), and can be Figure 1 Examples of different layouts, such as Fig.16 and Fig.17 The layout of the sub-pixel 101 is similar to Figure 1 An embodiment in which the layout in the example is different from that in the example is referred to as a third embodiment. Fig.16 and Fig.17 2 is a diagram showing an example of the layout of the multilayer structure 22 of the sub-pixel 101 in the display device according to the third embodiment.

[0190] (Sub-pixel layout)

[0191] In the display device 10 according to the third embodiment, for example, Fig.16 A. Fig.16 C. Fig.17 A. Fig.17 B. and Fig.17 As shown in C, the sub-pixels 101 may be arranged in a stripe layout. Fig.16 B. Fig.16 D and Fig.16 The square layout shown in D is arranged.

[0192] The stripe type layout indicates a layout in which a plurality of sub-pixels 101 constituting one pixel are arranged side by side. The square type layout indicates a layout in which the centers of a plurality of sub-pixels 101 constituting one pixel are arranged approximately at the vertex positions of a rectangle ( Fig.16 B and Fig.16D) at the vertex positions of the square in the example. This applies similarly to Fig.17 .

[0193] (Connection)

[0194] Furthermore, in the display device 10 according to the third embodiment, a plurality of connection portions 23 are connected to the sub-pixels 101 at different positions. Fig.16 In A, different sub-pixels 101 are connected in the horizontal direction (X direction) by the connection portion 23. Fig.16 In B, different sub-pixels 101 are connected in the horizontal and vertical directions (X and Y directions) by connecting portions 23. Fig.16 A. Fig.16 B and Fig.16 In C, sub-pixels 101 corresponding to different luminescent colors are connected via a connection portion 23. Fig.16 In the example of D, the sub-pixel 101B having two pixels and the sub-pixels 101R and 101G are arranged in a square shape. Then, the connection portion 23 is formed in a cross shape so as to connect the sub-pixel 101B with the sub-pixels 101R and 101G. Fig.16 In D, not only the sub-pixels 101 corresponding to different luminescent colors (sub-pixels 101R, 101B, and 101G) but also a plurality of sub-pixels 101 corresponding to the same luminescent color (sub-pixels 101B and 101B) are connected via the connection portion 23 .

[0195] Fig.17 The layout of the connection part 23 in A is as follows Fig.16 A and Fig.16 C shows a combination of the layouts of the connection parts 23. Fig.17 The layout of the connection part 23 in D is as follows Fig.16 B and Fig.16 D shows a combination of the layouts of the connection parts 23.

[0196] exist Fig.17 In B, the connection portion 23 connecting the sub-pixels 101 adjacent to each other in the lateral direction (X direction) connects the sub-pixels 101 corresponding to different luminous colors, but the connection portion 23 connecting the multilayer structure 22 adjacent to each other in the longitudinal direction (Y direction) connects the sub-pixels 101 corresponding to the same luminous color.

[0197] exist Fig.17 In C, one connection portion 23 connects three or more sub-pixels 101 .

[0198] [1-4. Fourth embodiment]

[0199] A display device 10 according to a fourth embodiment will be described. In the display device 10 according to the fourth embodiment, a resonator structure is further formed in at least a portion of the plurality of sub-pixels 101 in the first embodiment. The second embodiment or the third embodiment may be applied to the display device 10 according to the fourth embodiment. In the display device 10 according to the fourth embodiment, other configurations except the resonator structure may be similar to those of the first to third embodiments, and thus descriptions of other points except the resonator structure are omitted.

[0200] (Resonator Structure)

[0201] A resonator structure is formed in the display device 10. The resonator structure is a cavity structure and causes resonance of light emitted from the organic layer 14. In the display device 10, the resonator structure is formed in each light emitting element 104 (light emitting elements 104R, 104B, and 104G), and the resonator structure includes a first electrode 13, an organic layer 14, and a second electrode 15. Causing resonance of light emitted from the organic layer 14 means causing resonance of light of a specific wavelength included in the emitted light.

[0202] In the resonator structure, a component reflected and resonated between predetermined layers (such as between the first electrode 13 and the second electrode 15 ) in light emitted from the organic layer 14 is enhanced, and the enhanced light is emitted toward the outside from the light emitting surface side (first surface side).

[0203] The organic layer 14 generally uses light of a color type corresponding to the sub-pixel 101 as the emitted light, and the resonator structure causes resonance of light of a specific wavelength included in the emitted light from the organic layer 14. In this case, light of a predetermined wavelength in the emitted light from the organic layer 14 is enhanced. Then, in a state where the light of the predetermined wavelength is enhanced, light is emitted outwardly from the second electrode 15 side (light emitting surface side) of the light emitting element 104. Note that the light of the predetermined wavelength is light corresponding to a predetermined color type, and indicates light corresponding to a color type determined according to the sub-pixel 101. The display device 10 includes light emitting elements 104R, 104G, and 104B corresponding to the sub-pixels 101R, 101G, and 101B. In addition, a resonator structure is formed for each of the light emitting elements 104R, 104G, and 104B. In the resonator structure in the sub-pixel 101R, the red light of the light emitted from the organic layer 14 resonates. In a state where the red light is enhanced, light is emitted toward the outside from the second electrode 15 of the light emitting element 104R. Therefore, red light with excellent color purity can be emitted from the sub-pixel 101R. In the resonator structure in the sub-pixels 101G and 101B, the green light and the blue light of the emitted light from the organic layer 14 resonate respectively. In the sub-pixels 101G and 101B, light is emitted outward from the second electrode 15 of the light emitting elements 104G and 104B in a state where the green light and the blue light are enhanced. Therefore, green light and blue light with excellent color purity can be emitted from the sub-pixels 101G and 101B, respectively.

[0204] Since the resonator structure is formed in the display device 10 in this manner, the color purity of the sub-pixel 101 can be improved.

[0205] A first example to a seventh example will be described below in order as an example case where the display device 10 includes a resonator structure, and the description will be continued.

[0206] (Resonator Structure: First Example)

[0207] Fig.18 A is a schematic cross-sectional view for explaining a first example in the case where the display device 10 has a resonator structure.

[0208] In the first example, the thickness of the first electrode 13 and the thickness of the second electrode 15 are uniform among the sub-pixels 101R, 101G, and 101B.

[0209] In each of the sub-pixels 101R, 101G, and 101B (light emitting elements 104R, 104G, and 104B), the optical adjustment layer 31 is provided on the lower side (second surface side) of the first electrode 13, the reflector 30 is further provided on the second surface side of the optical adjustment layer 31, and the optical adjustment layer 31 is formed between the reflector 30 and the first electrode 13. A resonant cavity structure that resonates light generated by the organic layer 14 (organic layers 14R, 14G, and 14B) is formed between the reflector 30 and the second electrode 15.

[0210] The thickness of the reflector 30 is uniform in the sub-pixels 101R, 101G, and 101B.

[0211] The thickness of the optical adjustment layer 31 varies according to the sub-pixels 101R, 101G, and 101B. Since the thickness of the optical adjustment layer 31 varies according to the sub-pixels 101R, 101G, and 101B, an optical distance for causing resonance suitable for the sub-pixels 101R, 101G, and 101B can be set.

[0212] exist Fig.18 In the example of FIG. 1A, the positions of the first surfaces of the reflectors 30 provided in the sub-pixels 101R, 101G, and 101B are arranged to be aligned in the up-down direction. In the sub-pixels 101R, 101G, and 101B, the positions of the first surfaces of the second electrodes 15 vary with the thickness difference between the optical adjustment layers 31.

[0213] The reflector 30 may be formed of a metal such as aluminum (Al), silver (Ag), or copper (Cu), or an alloy containing these metals as a main component.

[0214] The optical adjustment layer 31 may be formed of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx) or silicon oxynitride (SiOxNy) or an organic resin material such as acrylic resin or polyimide resin. Each optical adjustment layer 31 may be a single layer, or may be a multilayer film formed of a plurality of materials.

[0215] Each second electrode 15 is preferably a layer used as a semi-transmissive reflective film. The second electrode 15 can be formed of magnesium (Mg), silver (Ag), a magnesium-silver alloy (MgAg) containing these materials as a main component, an alloy containing an alkali metal or an alkaline earth metal, etc. The configuration of the first electrode 13 and the organic layer 14 is similar to the above, and therefore, it is not explained herein.

[0216] (Resonator Structure: Second Example)

[0217] Fig.18B is a schematic cross-sectional view for explaining a second example in the case where the display device 10 has a resonator structure. The second embodiment has a layer structure similar to that of the first embodiment, except that the positions of the second electrode 15 and the reflector 30 are different from those of the first embodiment.

[0218] In the sub-pixels 101R, 101G, and 101B (light-emitting elements 104R, 104G, and 104B), the upper surfaces of the second electrodes 15 are arranged so that their positions in the up-down direction are aligned. The reflectors 30 provided in the sub-pixels 101R, 101G, and 101B are located at different positions in the up-down direction according to the thickness difference between the optical adjustment layers 31.

[0219] (Resonator Structure: Third Example)

[0220] Fig.19 A is a schematic cross-sectional view for explaining a third example in the case where the display device 10 has a resonator structure. The third example has a layer structure similar to the first example except that the thickness of the reflector 30 varies between the sub-pixels 101R, 101G, and 101B (light emitting elements 104R, 104G, and 104B).

[0221] In the sub-pixels 101R, 101G, and 101B, the upper surfaces of the second electrodes 15 are arranged so that their positions in the up-down direction are aligned. The positions of the first surfaces of the reflectors 30 provided in the sub-pixels 101R, 101G, and 101B vary in the up-down direction according to the thickness difference between the optical adjustment layers 31. However, the positions of the second surfaces of the reflectors 30 are aligned between the sub-pixels 101R, 101G, and 101B.

[0222] (Resonator Structure: Fourth Example)

[0223] Fig.19 B is a schematic cross-sectional view for explaining a fourth example in the case where the display device 10 has a resonator structure. The fourth example is similar to the first example except that the optical adjustment layer 31 is not included and the thickness of the first electrode 13 varies between the sub-pixels 101R, 101G, and 101B (light-emitting elements 104R, 104G, and 104B).

[0224] Regarding the thickness of the first electrode 13 , the respective thicknesses of the first electrode 13 are designed to set an optical distance for causing optical resonance suitable for the sub-pixels 101R, 101G, and 101B.

[0225] (Resonator Structure: Fifth Example)

[0226] Fig. 20A is a schematic cross-sectional view for explaining a fifth example in the case where the display device 10 has a resonator structure. The fifth example is similar to the first example except that the optical adjustment layer 31 is not included and an oxide film 32 is formed on the first surface side of the reflector 30 (the surface side facing the first electrode 13).

[0227] The thickness of the oxide film 32 varies among the sub-pixels 101R, 101G, and 101B (the light emitting elements 104R, 104G, and 104B).

[0228] Regarding the thickness of the oxide film 32 , the respective thicknesses of the oxide film 32 are designed to set an optical distance for causing optical resonance suitable for the sub-pixels 101R, 101G, and 101B.

[0229] The oxide film 32 is a film obtained by oxidizing the surface of the reflector 30 and is formed of, for example, aluminum oxide, tantalum oxide, titanium oxide, magnesium oxide, zirconium oxide, etc. The oxide film 32 serves as an insulating film for adjusting the optical path length (optical distance) between the reflector 30 and the second electrode 15 .

[0230] For example, oxide film 32 having a thickness suitable for sub-pixels 101R, 101G, and 101B may be formed in the following manner.

[0231] First, the substrate on which the reflector 30 is formed is immersed in a container filled with an electrolyte, and an electrode is disposed to face the reflector 30 .

[0232] Then, with the electrode as a reference, a positive voltage is applied to the reflector 30 to anodize the reflector 30. A voltage corresponding to the thickness of the oxide film 32 to be obtained is applied to the reflectors 30 of the sub-pixels 101R, 101G, and 101B. Therefore, oxide films 32 having different thicknesses (oxide films 32 having thicknesses suitable for the sub-pixels 101R, 101G, and 101B) can be formed together on the reflectors 30 of the sub-pixels 101R, 101G, and 101B.

[0233] (Resonator Structure: Sixth Example)

[0234] Fig. 20 B is a schematic cross-sectional view for explaining a sixth example in the case where the display device 10 has a resonator structure.

[0235] In the sixth example, each resonator structure of the display device 10 is formed with a structure in which the first electrode 13, the organic layer 14, and the second electrode 15 are stacked. In the sixth example, each first electrode 13 is a first electrode (also used as a reflector) 33 designed to function as both an electrode and a reflector. The first electrode (also used as a reflector) 33 is formed of a material having an optical constant selected according to the type of the light emitting elements 104R, 104G, and 104B. Since the phase shift of the first electrode (also used as a reflector) 33 changes, an optical distance for generating an optimal resonance corresponding to the wavelength of light of a color to be displayed can be set.

[0236] The first electrode (also used as a reflector) 33 may be formed of a single component metal such as aluminum (Al), silver (Ag), gold (Au) or copper (Cu) or an alloy containing these metals as a main component. For example, the first electrode (also used as a reflector) 33R of the sub-pixel 101R may be formed of copper (Cu), and the first electrode (also used as a reflector) 33G of the sub-pixel 101G and the first electrode (also used as a reflector) 33B of the sub-pixel 101B may be formed of aluminum.

[0237] The second electrode 15 and the organic layer 14 are similar to those of the first example, and therefore, they are not explained herein.

[0238] (Resonator Structure: Seventh Example)

[0239] Fig.21 2 is a schematic cross-sectional view for explaining a seventh example in the case where the display device 10 has a resonator structure.

[0240] In the seventh example, the resonator structure shown in the sixth example is provided for the sub-pixels 101R and 101G (light emitting elements 104R and 104G), and the resonator structure shown in the first example is provided for the sub-pixel 101B (light emitting element 104B).

[0241] [1-5. Fifth embodiment]

[0242] [1-5-1. Configuration of display device]

[0243] (Sub-pixel layout)

[0244] like Fig.33 As shown, a plurality of sub-pixels 101 in the display device 10 according to the fifth embodiment are arranged two-dimensionally in a stripe-type layout. Each sub-pixel 101 has, for example, a rectangular shape in a plan view. The long side of the rectangular shape may be parallel to the Y axis.

[0245] A plurality of sub-pixels 101R constitute a pixel column LR extending in the Y direction (longitudinal direction). A plurality of sub-pixels 101G constitute a pixel column LG extending in the Y direction. A plurality of sub-pixels 101B constitute a pixel column LB extending in the Y direction. Two pixel columns LG are arranged to be adjacent to each other in the X direction (lateral direction). Two pixel columns LR are arranged to be adjacent to each other in the X direction. One pixel column LB is arranged between two pixel columns LG and two pixel columns LR. Two pixel columns LR, one pixel column LB, two pixel columns LG and one pixel column LB are arranged repeatedly in sequence in the X direction. The arrangement spacing of the sub-pixels 101R in the Y direction, the arrangement spacing of the sub-pixels 101G in the Y direction and the arrangement spacing of the sub-pixels 101B in the Y direction may be the same or different. Hereinafter, an example in which these sub-pixels 101R, 101G and 101B are the same will be described.

[0246] A first block BK1 and a second block BK2 are configured, in which pixel columns LR, LB and LG are sequentially arranged in the X direction in the first block BK1, and pixel columns LB, LB and LB are sequentially arranged in the X direction in the second block BK2. The first block BK1 and the second block BK2 are alternately arranged in the X direction. The first block BK1 and the second block BK2 are symmetrical with respect to the axis Ax. Here, the axis Ax is an axis passing between the first block BK1 and the second block BK2 and extending in the Y direction.

[0247] The sub-pixel 101G included in one pixel column LG of two adjacent pixel columns LG and the sub-pixel 101G included in the other pixel column LG are arranged side by side in the X direction. The sub-pixel 101R included in one pixel column LR of two adjacent pixel columns LR and the sub-pixel 101R included in the other pixel column LR are arranged in the X direction. The sub-pixel 101G included in the pixel column LG and the sub-pixel 101R included in the pixel column LR are arranged side by side in the X direction. The sub-pixel 101G included in the pixel column LG and the sub-pixel 101B included in the pixel column LB are arranged to be offset in the Y direction. For example, the offset is approximately 1 / 2 of the arrangement pitch of the sub-pixel 101G in the Y direction. The sub-pixel 101R included in the pixel column LR and the sub-pixel 101B included in the pixel column LB are arranged to be offset in the Y direction. For example, the offset is approximately 1 / 2 of the arrangement pitch of the sub-pixel 101G in the Y direction.

[0248] Sub-pixels 101G and 101G adjacent in the X direction are connected by a connection portion 23G1. Sub-pixels 101G and 101G adjacent in the Y direction are connected by a connection portion 23G2. Sub-pixels 101R and 101R adjacent in the X direction are connected by a connection portion 23R1. Sub-pixels 101R and 101R adjacent in the Y direction are connected by a connection portion 23R2. Sub-pixels 10G and 10R adjacent in the X direction (with sub-pixel 10B interposed therebetween) are connected by a connection portion 23RG. The connection portion 23RG passes between sub-pixels 10B and 10B arranged in the Y direction. In this specification, without particularly distinguishing between the connection portions 23G1, 23G2, 23R1, 23R2 and 23RG, the connection portions 23G1, 23G2, 23R1, 23R2 and 23RG are collectively referred to as the connection portion 23.

[0249] (Layer configuration of display device)

[0250] like Figure 34 to Figure 37 As shown, the display device 10 includes a driving substrate 11 , a plurality of first electrodes 13 , an organic layer 14G, an organic layer 14R, an organic layer 14B, a second electrode 15 , a protective layer 61 , a side wall 62 , an auxiliary electrode 63 and a protective layer 64 .

[0251] (Organic layer)

[0252] like Fig.38 As shown, the organic layer 14G includes a plurality of main bodies 14G0, a plurality of coupling portions 14G1, a plurality of coupling portions 14G2, and a plurality of extension portions 14G3. Each main body 14G0 is a part of a sub-pixel 101G (i.e., a light-emitting element 104G) constituting the organic layer 14G. Each coupling portion 14G1, each coupling portion 14G2, and each extension portion 14G3 are arranged in the inter-sub-pixel region M. The coupling portion 14G1 extends from the main body 14G0 in the lateral direction (+X direction and -X direction) and connects two main bodies 14G0 adjacent in the lateral direction. The coupling portion 14G2 extends from the main body 14G0 in the longitudinal direction (+Y direction and -Y direction) and connects two main bodies 14G0 adjacent in the longitudinal direction. The extension portion 14G3 extends from the body 14G0 in the lateral direction (+X direction and −X direction), and a tip of the extension portion 14G3 is located between two bodies 14G0 and 14R0 adjacent in the lateral direction with the organic layer 14B interposed therebetween.

[0253] like Fig.38As shown, the organic layer 14R includes a plurality of main bodies 14R0, a plurality of coupling portions 14R1, a plurality of coupling portions 14R2, and a plurality of extension portions 14R3. Each main body 14R0 is a portion constituting a sub-pixel 101R (i.e., a light emitting element 104R) in the organic layer 14R. Each coupling portion 14R1, each coupling portion 14R2, and each extension portion 14R3 are arranged in the inter-sub-pixel region M. The coupling portion 14R1 extends from the main body 14R0 in the lateral direction (+X direction and -X direction), and connects two main bodies 14R0 adjacent in the lateral direction. The coupling portion 14R2 extends from the main body 14R0 in the longitudinal direction (+Y direction and -Y direction), and connects two main bodies 14R0 adjacent in the longitudinal direction. The extension portion 14R3 extends from the main body 14R0 in the lateral direction (+X direction and −X direction), and the end of the extension portion 14R3 is located between two main bodies 14R0 and 14G0 adjacent in the lateral direction with the organic layer 14B interposed therebetween.

[0254] like Fig.38 As shown, the organic layer 14B includes a plurality of bodies 140B. In the fifth embodiment, an example in which the organic layer 14B does not include an extension extending from the body 14R0 in a predetermined direction will be described. However, the present disclosure is not limited to this example, and the organic layer 14B may include an extension extending from the body 14R0 in a predetermined direction.

[0255] (Second Electrode)

[0256] like Fig.39 As shown, the second electrode 15 includes a plurality of main bodies 15M0, a plurality of coupling portions 15M1, and a plurality of coupling portions 15M2. Each main body 15M0 is a part of a sub-pixel 101R (light-emitting element 104R) or a sub-pixel 101G (light-emitting element 104G) in the second electrode 15. Each coupling portion 15M1 and each coupling portion 15M2 are arranged in the inter-subpixel region M. The coupling portion 15M1 extends from the main body 15M0 in the lateral direction (+X direction and -X direction) and connects two main bodies 15M0 adjacent in the lateral direction. The coupling portion 15M2 extends from the main body 15M0 in the longitudinal direction (+Y direction and -Y direction) and connects two main bodies 15M0 adjacent in the longitudinal direction. Each sub-pixel 101R and each sub-pixel 101G are electrically connected to each other through the coupling portion 15M1 and the coupling portion 15M2, while each sub-pixel 101B is isolated and not electrically connected to each other.

[0257] (Light-emitting element)

[0258] The subpixel 101R includes a light emitting element 104R. The light emitting element 104R includes a first electrode 13, a body 14R0 of an organic layer 14R, and a body 15M0 of a second electrode 15. The first electrode 13, the body 14R0 of the organic layer 14R, and the body 15M0 of the second electrode 15 are sequentially stacked on the first surface of the drive substrate 11.

[0259] Subpixel 101G includes light emitting element 104G. Light emitting element 104G includes first electrode 13, body 14G0 of organic layer 14G, and body 15M0 of second electrode 15. First electrode 13, body 141G of organic layer 14G, and body 15M0 of second electrode 15 are sequentially stacked on the first surface of drive substrate 11.

[0260] Subpixel 101B includes light emitting element 104B. Light emitting element 104B includes first electrode 13, body 14B0 of organic layer 14B, and body 15M0 of second electrode 15. First electrode 13, body 141B of organic layer 14B, and body 15M0 of second electrode 15 are sequentially stacked on the first surface of drive substrate 11.

[0261] The light emitting elements 104R, 104G, and 104B are two-dimensionally arranged on the first surface of the drive substrate 11 in an arrangement similar to the arrangement of the above-described sub-pixels 101R, 101G, and 101B.

[0262] (Connection)

[0263] The connection portion 23G1 includes a coupling portion 14G1 of the organic layer 14G and a coupling portion 15M1 of the second electrode 15. The coupling portion 14G1 of the organic layer 14G and the coupling portion 15M1 of the second electrode 15 are sequentially stacked on the first surface of the drive substrate 11. The connection portion 23G2 includes a coupling portion 14G2 of the organic layer 14G and a coupling portion 15M2 of the second electrode 15. The coupling portion 14G2 of the organic layer 14G and the coupling portion 15M2 of the second electrode 15 are sequentially stacked on the first surface of the drive substrate 11.

[0264] The connection portion 23R1 includes a coupling portion 14R1 of the organic layer 14R and a coupling portion 15M1 of the second electrode 15. The coupling portion 14R1 of the organic layer 14R and the coupling portion 15M1 of the second electrode 15 are sequentially stacked on the first surface of the drive substrate 11. The connection portion 23R2 includes a coupling portion 14R2 of the organic layer 14R and a coupling portion 15M2 of the second electrode 15. The coupling portion 14R2 of the organic layer 14R and the coupling portion 15M2 of the second electrode 15 are sequentially stacked on the first surface of the drive substrate 11.

[0265] The connection portion 23RG includes an extension portion 14G3 of the organic layer 14G, an extension portion 14R3 of the organic layer 14R, and a coupling portion 15M1 of the second electrode 15. The extension portion 14G3 and the extension portion 14R3 are disposed on the first surface of the drive substrate 11. The extension portion 14G3 and the extension portion 14R3 may partially overlap each other, or the extension portion 14G3 and the extension portion 14R3 may be separated from each other. In the case where the extension portion 14G3 and the extension portion 14R3 partially overlap each other, the extension portion 14G3 may be located on the upper side of the extension portion 14R3, or the extension portion 14R3 may be located on the upper side of the extension portion 14G3. The coupling portion 15M1 is disposed on the first surfaces of the extension portion 14G3 and the extension portion 14R3.

[0266] (Protective layer)

[0267] The protective layer 61 is provided on the first surface of the second electrode 15. The protective layer 61 has transmittance to light emitted from the light emitting element 104. The protective layer 61 can protect the plurality of light emitting elements 104, the plurality of connecting portions 23, etc. For example, the protective layer 61 can inhibit moisture from entering the plurality of light emitting elements 104 and the connecting portions 23 from the external environment.

[0268] (Side wall)

[0269] The side wall 62 covers the side surface of each light emitting element 104. The side wall 62 may further cover the side surface of the connection portion 23. The side wall 62 may have transmittance to the light emitted from the light emitting element 104. The side wall 62 may protect the light emitting element 104. For example, the side wall 62 may suppress moisture from entering the plurality of light emitting elements 104 from the external environment. As the material of the side wall 62, a material similar to that of the first protective layer 16 in the first embodiment may be exemplified.

[0270] (Auxiliary Electrode)

[0271] The auxiliary electrode 63 is disposed on the first surface of the protective layer 61. The auxiliary electrode 63 includes a plurality of connecting portions 631. Each connecting portion 631 is disposed in the hole 611 and connects the auxiliary electrode 63 to the first surface of the light emitting element 104B, specifically, the first surface of the main body 15240 of the second electrode 15. The auxiliary electrode 63 is preferably a transparent electrode that is transmissive to visible light. Here, the transparent electrode includes, for example, a single-layer film of a metal layer, a single-layer film of a transparent conductive oxide layer, or a multilayer film of a metal layer and a transparent conductive oxide layer.

[0272] For example, the metal layer contains at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca) and sodium (Na). The metal layer may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include MgAg alloy, MgAl alloy, AlLi alloy, etc.

[0273] The transparent conductive oxide layer includes a transparent conductive oxide. For example, the transparent conductive oxide includes at least one selected from the group consisting of an indium-containing transparent conductive oxide (hereinafter, referred to as "indium-based transparent conductive oxide"), a tin-containing transparent conductive oxide (hereinafter, referred to as "tin-based transparent conductive oxide"), and a zinc-containing transparent conductive oxide (hereinafter, referred to as "zinc-based transparent conductive oxide").

[0274] Indium-based transparent conductive oxides include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), or fluorine-doped indium oxide (IFO). Tin-based transparent conductive oxides include, for example, tin oxide, antimony-doped tin oxide (ATO), or fluorine-doped tin oxide (FTO). Zinc-based transparent conductive oxides include, for example, zinc oxide, aluminum-doped zinc oxide (AZO), boron-doped zinc oxide, or gallium-doped zinc oxide (GZO).

[0275] (Protective layer)

[0276] The protective layer 64 is provided on the first surface of the auxiliary electrode 63. The protective layer 64 has transmittance to the light emitted from the light emitting element 104. The protective layer 64 can protect the plurality of light emitting elements 104, the plurality of connection portions 23, and the like. For example, the protective layer 61 can suppress the entry of moisture from the external environment into the plurality of light emitting elements 104 and the plurality of connection portions 23. As the material of the protective layer 61, a material similar to that of the first protective layer 16 in the first embodiment can be exemplified.

[0277] (Contact electrode)

[0278] The display device 10 may further include a contact electrode (not shown). The contact electrode is provided on the first surface around the display area 10A of the drive substrate 11. The peripheral edge portion of the second electrode 15 is connected to the contact electrode. The contact electrode is an auxiliary electrode connecting the second electrode 15 and the wiring (not shown) in the drive substrate 11.

[0279] The contact electrode may have a closed loop shape surrounding the entire outer periphery of the display region 10A in a plan view, or may have an annular shape surrounding the outer periphery of the display region 10A and being divided at one position or a plurality of positions.

[0280] The contact electrode includes, for example, at least one of a metal layer and a metal oxide layer. More specifically, for example, the contact electrode includes a single-layer film of a metal layer or a metal oxide layer, or a multilayer film of a metal layer and a metal oxide layer. The contact electrode preferably has a configuration similar to that of the above-described first electrode 13. In this case, since the first electrode 13 and the contact electrode can be formed in the same step, the manufacturing process of the display device 10 can be simplified.

[0281] [1-5-2. Function and effect]

[0282] In the display device 10 according to the fifth embodiment described above, the connection portion 23G1 connecting the sub-pixels 101G and 101G adjacent in the X direction includes the coupling portion 14G1 of the organic layer 14G and the coupling portion 15M1 of the second electrode 15. The connection portion 23G2 connecting the sub-pixels 101G and 101G adjacent in the Y direction includes the coupling portion 14G2 of the organic layer 14G and the coupling portion 15M2 of the second electrode 15. Therefore, the sub-pixel 10G and the connection portions 23G1 and 23G2 can be formed in the same step. Therefore, the connection portions 23G1 and 23G2 connecting the sub-pixels 101G and 101G of the same color can be formed by a simple process.

[0283] In addition, the connection portion 23R1 connecting the sub-pixels 101R and 101R adjacent in the X direction includes the coupling portion 14R1 of the organic layer 14R and the coupling portion 15M1 of the second electrode 15. The connection portion 23R2 connecting the sub-pixels 101R and 101R adjacent in the Y direction includes the coupling portion 14R2 of the organic layer 14R and the coupling portion 15M2 of the second electrode 15. Therefore, the sub-pixel 10R and the connection portions 23R1 and 23R2 can be formed in the same step. Therefore, the connection portions 23R1 and 23R2 connecting the sub-pixels 101R and 101R of the same color can be formed by a simple process.

[0284] In the display device 10 according to the fifth embodiment described above, since two sub-pixels 101G and 101G having the same luminescent color are adjacent in the X direction, the organic layer 14G can be separated for each sub-pixel 101G by photolithography after forming one organic layer 14G to cover two adjacent first electrodes 13. Similarly, since two sub-pixels 101R and 101R having the same luminescent color are adjacent in the X direction, the organic layer 14R can be separated for each sub-pixel 101R by photolithography after forming one organic layer 14R to cover two adjacent first electrodes 13. Therefore, the accuracy of the deposition mask for forming the organic layer 14R and the deposition mask for forming the organic layer 14G can be reduced, and high definition of the display device 10 can be achieved.

[0285] [1-5-3. Modification]

[0286] (Edit 1)

[0287] In the fifth embodiment, an example has been described in which the sub-pixels 101G included in one pixel column LG of two adjacent pixel columns LG and the sub-pixels 101G included in the other pixel column LG are arranged to be aligned in the X direction (see Fig.33). However, the arrangement of the sub-pixel 101G is not limited to this example. Fig.40 As shown, the subpixels 101G included in one pixel column LG of two adjacent pixel columns LG and the subpixels 101G included in the other pixel column LG may be arranged to be offset in the Y direction. For example, the offset amount is approximately 1 / 2 of the arrangement pitch of the subpixels 101G in the Y direction.

[0288] (Edit 2)

[0289] In the fifth embodiment, an example has been described in which a plurality of sub-pixels 101 are arranged two-dimensionally in a stripe-type layout (see Fig.33 ). However, the layout of the plurality of sub-pixels 101 is not limited to this example. For example, the plurality of sub-pixels 101 may be arranged two-dimensionally in a triangle or a square. These layouts will be described below.

[0290] (Triangle first layout)

[0291] Fig.41 A is a plan view of a first layout of a triangle. Pixel column LR, pixel column LB, pixel column LG and pixel column LB are arranged repeatedly in sequence in the X direction. Pixel column LR is configured by arranging a plurality of sub-pixels 101R in a staggered manner. Pixel column LG is configured by arranging a plurality of sub-pixels 101G in a staggered manner. Pixel column LB is configured by arranging a plurality of sub-pixels 101B in a staggered manner.

[0292] Each sub-pixel 101G includes two sub-pixel elements 101G1 and 101G2 adjacent in the X direction. Each sub-pixel 101R includes two sub-pixel elements 101R1 and 101R2 adjacent in the X direction.

[0293] Sub-pixel elements 101R1 and 101R2 adjacent in the X direction are connected by a connection portion 23R1. Sub-pixel elements 101G1 and 101G2 adjacent in the X direction are connected by a connection portion 23G1. Sub-pixel elements 101R1 and 101R2 adjacent in the Y direction are connected by a connection portion 23R2. Sub-pixel elements 101G1 and 101G2 adjacent in the Y direction are connected by a connection portion 23G2.

[0294] The sub-pixel elements 101R2 and 101G1 adjacent in the oblique direction (sub-pixel 101B interposed therebetween) are connected by a connection portion 23RG. The sub-pixel elements 101G2 and 101R1 adjacent in the oblique direction (sub-pixel 101B interposed therebetween) are connected by a connection portion 23RG. Here, the oblique direction refers to the direction between the X direction and the Y direction and the direction between the X direction and the -Y direction.

[0295] Sub-pixels 101R, 101G, and 101B have, for example, a substantially hexagonal shape in a plan view. For example, sub-pixel elements 101R1 and 101R2 and sub-pixel elements 101G1 and 101G2 have a substantially trapezoidal shape in a plan view. Sub-pixel elements 101R1 and 101R2 are arranged so that the lower bases of the substantially trapezoidal shapes face each other in a plan view. Sub-pixel elements 101R1 and 101R2 are arranged so that the lower bases of the substantially trapezoidal shapes face each other in a plan view.

[0296] (Triangle second layout)

[0297] Fig.41 B is a plan view of a triangular second layout. The difference between the triangular second layout and the triangular first layout is that sub-pixels 101G and 101R have a generally circular shape in a plan view. For example, sub-pixel elements 101R1 and 101R2 and sub-pixel elements 101G1 and 101G2 have a generally semicircular shape in a plan view. Sub-pixel elements 101R1 and 101R2 are arranged so that their generally semicircular chords are opposite to each other. Sub-pixel elements 101G1 and 101G2 are arranged so that their generally semicircular chords are opposite to each other.

[0298] (Triangle third layout)

[0299] Fig.42 A is a plan view of the third triangular layout. Pixel column LR, pixel column LB, pixel column LG and pixel column LB are arranged repeatedly in the X direction. In this case, pixel column LR is configured by linearly arranging a plurality of sub-pixels 101R. Pixel column LG is configured by linearly arranging a plurality of sub-pixels 101G. Pixel column LB is configured by linearly arranging a plurality of sub-pixels 101B.

[0300] The sub-pixel elements 101R1 and 101R2 adjacent to each other in the X direction are connected via the connection portion 23R1. The sub-pixel elements 101G1 and 101G2 adjacent to each other in the X direction are connected via the connection portion 23G1.

[0301] The connection portions 23R1 of the sub-pixels 101R and 101R adjacent to each other in the Y direction are connected by a connection portion 23R2. The connection portions 23G1 of the sub-pixels 101G and 101G adjacent to each other in the Y direction are connected by a connection portion 23G2.

[0302] The sub-pixel elements 101R2 and 101G1 adjacent in the X direction (with the sub-pixel 101B interposed therebetween) are connected via the connection portion 23RG. The sub-pixel elements 101G2 and 101R1 adjacent in the X direction (with the sub-pixel 101B interposed therebetween) are connected via the connection portion 23RG.

[0303] The sub-pixels 101R, 101G, and 101B have, for example, a substantially hexagonal shape in a plan view. The configuration of the sub-pixels 101R, 101G, and 101B is similar to that of the triangular first layout.

[0304] (Triangle fourth layout)

[0305] Fig.42 B is a plan view of a triangular fourth layout. The difference between the triangular fourth layout and the triangular third layout is that sub-pixels 101G and 101R have a roughly diamond shape in a plan view. Sub-pixel elements 101R1 and 101R2 and sub-pixel elements 101G1 and 101G2 have, for example, a roughly triangular shape in a plan view. Sub-pixel elements 101R1 and 101R2 are arranged so that the sides of the roughly triangular shape are opposite to each other. Sub-pixel elements 101G1 and 101G2 are arranged so that the sides of their roughly triangular shapes are opposite to each other.

[0306] Note that the shapes of the sub-pixels 101R, 101G, and 101B in a plan view are not limited to the above-mentioned roughly hexagonal shape, roughly circular shape, and roughly diamond shape, and may be shapes other than these shapes. For example, the shapes of the sub-pixels 101G and 101R may have a roughly elliptical shape or a roughly polygonal shape other than a roughly diamond shape in a plan view. The shapes of the sub-pixel elements 101R1, 101R2, 101G1, and 101G2 in a plan view are not limited to the above-mentioned roughly trapezoidal shape, roughly circular shape, and roughly triangular shape, and may be other shapes. For example, the shape of each of the sub-pixel elements 101R1, 101R2, 101G1, and 101G2 may be a roughly polygonal shape, such as a roughly semi-elliptical shape or a roughly quadrilateral shape.

[0307] (Square layout)

[0308] Fig.43 It is a plan view of a square layout. One pixel includes sub-pixel 101R, sub-pixel 101G, sub-pixel 10B, and sub-pixel 10B arranged in two dimensions in a square layout. Pixel column LGB, pixel column LGB, pixel column LRB, and pixel column LRB are arranged repeatedly in the X direction. Pixel column LGB is configured by repeatedly arranging sub-pixel 10G, sub-pixel 10G, sub-pixel 10B, and sub-pixel 10B in the Y direction. Pixel column LRB is configured by repeatedly arranging sub-pixel 10R, sub-pixel 10R, sub-pixel 10B, and sub-pixel 10B in the Y direction.

[0309] The sub-pixel 101G included in one pixel column LGB of the two adjacent pixel columns LGB and LGB and the sub-pixel 101G included in the other pixel column LGB are arranged side by side in the X direction. The sub-pixel 101B included in one pixel column LGB of the two adjacent pixel columns LGB and LGB and the sub-pixel 101B included in the other pixel column LGB are arranged side by side in the X direction.

[0310] The sub-pixel 101R included in one pixel column LRB of the two adjacent pixel columns LRB and LRB and the sub-pixel 101R included in the other pixel column LRB are arranged in the X direction. The sub-pixel 101B included in one pixel column LRB of the two adjacent pixel columns LRB and LRB and the sub-pixel 101B included in the other pixel column LRB are arranged in the X direction.

[0311] In two adjacent pixel columns LGB and LRB, the sub-pixel 101G included in the pixel column LGB and the sub-pixel 101B included in the pixel column LRB are arranged side by side in the X direction. In two adjacent pixel columns LGB and LRB, the sub-pixel 101B included in the pixel column LGB and the sub-pixel 101R included in the pixel column LRB are arranged side by side in the X direction.

[0312] Two sub-pixels 101G arranged in the X direction are connected by a connection portion 23G1. Two sub-pixels 101R arranged in the X direction are connected by a connection portion 23R1. The sub-pixel 101R and the sub-pixel 101G adjacent in the oblique direction are connected by a connection portion 23RG.

[0313] (Edit 3)

[0314] In the fifth embodiment, the example in which the sub-pixels 101G and 101G adjacent in the X direction and the sub-pixels 101G and 101G adjacent in the Y direction are connected by different connecting portions 23G1 and 23G2 has been described (see Fig.33 ). However, the connection form of the sub-pixels 101G and 101G adjacent in the X direction and the sub-pixels 101G and 101G adjacent in the Y direction is not limited to this example. Fig.52 As shown, the adjacent sub-pixels 101G and 101G in the X direction and the adjacent sub-pixels 101G and 101G in the Y direction may be connected by one connection portion 23G3. The plurality of sub-pixels 101G included in the two pixel columns LG may be connected by the connection portion 23G3. The connection portion 23G3 is provided in the inter-sub-pixel region M.

[0315] Similar to the sub-pixels 101G and 101G adjacent to each other in the X direction and the sub-pixels 101G and 101G adjacent to each other in the Y direction, as shown in FIG. Fig.52As shown, the adjacent sub-pixels 101R and 101R in the X direction and the adjacent sub-pixels 101R and 101R in the Y direction may also be connected by a connection portion 23R3. The plurality of sub-pixels 101R included in the two pixel columns LR may be connected by the connection portion 23R3. The connection portion 23R3 is provided in the inter-sub-pixel region M.

[0316] However, when the sub-pixels 101G and 101G adjacent in the X direction and the sub-pixels 101G and 101G adjacent in the Y direction are connected by one connection portion 23G3, the sub-pixels 101R and 101R adjacent in the X direction and the sub-pixels 101R and 101R adjacent in the Y direction may be connected by different connection portions 23R1 and 23R2. In contrast, when the sub-pixels 101R and 101R adjacent in the X direction and the sub-pixels 101R and 101R adjacent in the Y direction are connected by one connection portion 23R3, the sub-pixels 101G and 101G adjacent in the X direction and the sub-pixels 101G and 101G adjacent in the Y direction may be connected by different connection portions 23G1 and 23G2.

[0317] Fig.53 1 is a plan view of organic layers 14R, 14G, and 14B in the case where the display device 10 includes connecting portions 23G3 and 23R3. The organic layer 14G includes a plurality of main bodies 14GL and a plurality of extensions 14G3. Each main body 14GL is a portion constituting a plurality of sub-pixels 101G included in two pixel columns LG and a plurality of connecting portions 23G3 that connect the sub-pixels 101G to each other. The plurality of main bodies 14GL have a stripe shape. Each extension 14G3 is a portion constituting a connecting portion 23RG that connects the sub-pixels 101G and 101R adjacent in the lateral direction with the organic layer 14B interposed therebetween. The extension 14G3 extends from the main body 14GL in the lateral direction (+X direction and -X direction), and the end of the extension 14G3 is located between the main bodies 14GL and 14RL adjacent in the lateral direction, with the organic layer 14B interposed therebetween.

[0318] The organic layer 14R includes a plurality of main bodies 14RL and a plurality of extensions 14R3. Each main body 14RL is a part constituting a plurality of sub-pixels 101R included in two pixel columns LR and a plurality of connection parts 23R3 connecting the sub-pixels 101R to each other. The plurality of main bodies 14RL has a stripe shape. Each extension part 14R3 is a part constituting a connection part 23RG, which connects the sub-pixels 101R and 101G adjacent in the lateral direction with the organic layer 14B interposed therebetween. The extension part 14R3 extends from the main body 14RL in the lateral direction (+X direction and -X direction), and the end of the extension part 14R3 is located between the main bodies 14RL and 14GL adjacent in the lateral direction, with the organic layer 14B interposed therebetween.

[0319] Fig.54 2 is a plan view of the second electrode 15 in the case where the display device 10 includes the connection parts 23G3 and 23R3. The second electrode 15 includes a plurality of bodies 15ML, a plurality of bodies 15M0, and a plurality of coupling parts 15M1. Each body 15ML is a part constituting a plurality of sub-pixels 101G included in two pixel columns LG, a plurality of connection parts 23G3 connecting the plurality of sub-pixels 101G to each other, a plurality of sub-pixels 101R included in two pixel columns LR, and a plurality of connection parts 23R3 connecting the plurality of sub-pixels 101R to each other. The plurality of bodies 15ML have a stripe shape. Each of the coupling parts 15M1 is a part constituting the connection part 23RG, which connects the sub-pixels 101R and 101G adjacent in the lateral direction with the sub-pixel 101B interposed therebetween. The coupling part 15M1 extends from the body 15ML in the lateral direction (+X direction and -X direction), and connects the bodies 15ML adjacent in the lateral direction.

[0320] (Edit 4)

[0321] In the fifth embodiment, an example has been described in which the organic layer 14G includes a coupling portion 14G1, a coupling portion 14G2, and an extension portion 14G3. However, the configuration of the organic layer 14G is not limited thereto. For example, the organic layer 14G may not include at least one of the coupling portion 14G1, the coupling portion 14G2, and the extension portion 14G3. The organic layer 14G may include an extension portion extending from the main body 14G0 in the lateral direction (+X direction and -X direction) instead of the coupling portion 14G1. The end of the extension portion is located between two main bodies 14G0 adjacent in the lateral direction. The organic layer 14G may include an extension portion extending from the main body 14G0 in the longitudinal direction (+Y direction and -Y direction) instead of the coupling portion 14G2. The end of the extension portion is located between two main bodies 14G0 adjacent in the length direction.

[0322] In the fifth embodiment, an example has been described in which the organic layer 14R includes a coupling portion 14R1, a coupling portion 14R2, and an extension portion 14R3. However, the configuration of the organic layer 14R is not limited thereto. For example, the organic layer 14R may not include at least one of the coupling portion 14R1, the coupling portion 14R2, and the extension portion 14R3. The organic layer 14R may include an extension portion extending from the main body 14R0 in the lateral direction (+X direction and -X direction) instead of the coupling portion 14R1. The end of the extension portion is located between two bodies 14R0 adjacent in the lateral direction. The organic layer 14R may include an extension portion extending from the main body 14R0 in the longitudinal direction (+Y direction and -Y direction) instead of the coupling portion 14R2. The end of the extension portion is located between two bodies 14R0 adjacent in the length direction.

[0323] (Edit 5)

[0324] In the fifth embodiment, an example has been described in which two sub-pixels 101G of the same luminous color are adjacent in the X direction and two sub-pixels 101R of the same luminous color are adjacent in the X direction. However, the layout of the sub-pixels 101G and the sub-pixels 101R is not limited thereto. For example, only two sub-pixels in one of the sub-pixels 101G and the sub-pixel 101G may be arranged adjacent to each other.

[0325] (Edit 6)

[0326] The display device 10 according to the fifth embodiment may have a resonator structure in at least a part of the plurality of sub-pixels 101. The resonator structure is as described in the fourth embodiment.

[0327] [2. Method of manufacturing display device]

[0328] [2-1-1. Contents of the manufacturing method]

[0329] Reference Figures 7 to 13 The method of manufacturing a light-emitting device is described, taking the case where the light-emitting device is the display device 10 described in the first embodiment as an example. However, here, the description will be continued by taking the following case as an example: the hole injection layer 140, the electron transport layer 143, and the electron injection layer 144 are common to a plurality of sub-pixels 101 in the layer (functional layer 25) other than the light-emitting layer 142 in the organic layer 14, and the hole transport layer 141 is different. Note that Figures 7 to 9 is schematically shown along with Figure 2 A cross-sectional view (process cross-sectional view) of the manufacturing process at a position corresponding to the cross-section taken along line II in FIG. Fig.10 is schematically shown along with Figure 2 A cross-sectional view (process cross-sectional view) of the manufacturing process at a position corresponding to the cross-section taken along line II-II in FIG. Figures 11 to 13is schematically shown along with Figure 2 A cross-sectional view of the manufacturing process at a position corresponding to the cross-sectional view taken along line III-III in FIG. Figure 2 The longitudinal section taken along line II-II is similar to the longitudinal section taken along Figure 2 A longitudinal cross section taken on line II in FIG. 1 is formed until immediately before the resist is provided, and therefore illustration is omitted.

[0330] (First Electrode Formation Step)

[0331] like Figure 7 A and Fig.11 As shown in FIG. 1A , the first electrode 13 is patterned on the drive substrate 11 provided with circuits, contact plugs, etc. according to the layout of the sub-pixel 101. The insulating layer 12 is patterned between adjacent first electrodes 13. An opening 12A is formed in the insulating layer 12, and the first electrode 13 is exposed from the opening 12A.

[0332] (First step)

[0333] The organic layer 14 including the light emitting layer is patterned on the first electrode 13 using a mask determined according to the layout of the plurality of sub-pixels 101. This step is referred to as a first step.

[0334] In the first step, for example, Figure 7 B and Fig.11 B, a first layer 125A (hole injection layer 140 and hole transport layer 141) corresponding to the organic layer 14B of the sub-pixel 101B is formed. Figure 7 C and Fig.11 C, a mask 150 is disposed above the first layer 125A to form the light emitting layer 142 (light emitting layer 142B). Here, the mask 150 is a mask 150B corresponding to the sub-pixel 101B. The mask 150 is determined for each color type of the plurality of sub-pixels 101 corresponding to each of the plurality of light emitting colors, and masks 150B, 150G, and 150R corresponding to the corresponding sub-pixels 101B, 101G, and 101R are prepared.

[0335] More specifically, for example, the mask 150B includes a plurality of openings arranged in a similar arrangement pattern to the plurality of sub-pixels 101B. When the organic layer 14B is formed, the mask 150B is arranged to face the first surface of the drive substrate 11 so that each opening is located above the first electrode 13 of the sub-pixel 10B. The mask 150G includes a plurality of openings arranged in a similar arrangement pattern to the plurality of sub-pixels 101G. When the organic layer 14G is formed, the mask 150G is arranged to face the first surface of the drive substrate 11 so that each opening is located above the first electrode 13 of the sub-pixel 10G. The mask 150R includes a plurality of openings arranged in a similar arrangement pattern to the plurality of sub-pixels 101R. When the organic layer 14R is formed, the mask 150R is arranged to face the first surface of the drive substrate 11 so that each opening is located above the first electrode 13 of the sub-pixel 10R.

[0336] Next, if Figure 8 A and Fig.12 As shown in FIG. 1A, the mask 150B is changed to the mask 150G corresponding to the sub-pixel 101G, and the light-emitting layer 142G corresponding to the sub-pixel 101G is formed. Note that in this case, it is preferable to further additionally form the hole transport layer 141 to have a thickness suitable for the sub-pixel 101G. In this case, after setting the mask 150G, the hole transport layer 141 is additionally formed, and the light-emitting layer 142G corresponding to the sub-pixel 101G is further formed.

[0337] In addition, if Figure 8 B and Fig.12 B, the mask 150G is changed to the mask 150R corresponding to the sub-pixel 101R, and the light-emitting layer 142R corresponding to the sub-pixel 101R is formed. Note that in this case, it is preferable to further additionally form the hole transport layer 141 to have a thickness suitable for the sub-pixel 101R. In this case, after setting the mask 150R, the hole transport layer 141 is additionally formed, and the light-emitting layer 142R corresponding to the sub-pixel 101R is further formed. As described above, in the case of forming a plurality of sub-pixels 101 corresponding to a plurality of light-emitting colors, in the first step, it is preferable to change the mask 150 for each color type of the sub-pixel 101 to form the light-emitting layer 142 corresponding to the plurality of sub-pixels 101.

[0338] After forming the light emitting layer 142 corresponding to the sub-pixel 101, the second layer 125B (the electron transport layer 143 and the electron injection layer 144) is formed. Figure 8 C and Fig.12 As shown in C. Figure 8 C and Fig.12In the example of C, a common layer is used for the second layer 125B regardless of the sub-pixel 101. However, this is an example, and similar to the first layer 125A, the second layer 125B may also include layers having different thicknesses, etc., according to the color type of the sub-pixel 101.

[0339] (Step 2)

[0340] After the first step, the second step is performed. The second step is a step of stacking the second electrode 15 on the organic layer 14. In the second step, Figure 8 C and Fig.12 The second electrode 15 is formed on the entire surface on the first surface side as shown in C. After the second electrode 15 is formed, a protective layer (first protective layer 16) is formed.

[0341] (Third step)

[0342] The third step is a step of removing, by etching, a portion of the organic layer 14 and the second electrode in which the combination is separated from the sub-pixel and a portion of a connection portion connecting a plurality of different sub-pixels.

[0343] In the third step, if Fig. 9 A. Fig.10 A and Fig.13 As shown in FIG. 1A , the resist 151 is disposed on the first protective layer 16. The resist 151 is formed in a pattern corresponding to the combined portion of the sub-pixel 101 and the connection portion 23. Fig. 9 As shown in A, the first protective layer 16, the second electrode 15 and the portion of the organic layer 14 not covered by the resist 151 are removed by etching. Fig.10 B and Fig.13 As shown in B, the first protective layer 16, the second electrode 15 and the organic layer 14 remain in the portion forming the connection portion 23 except for the portion corresponding to the sub-pixel 101. Fig.10 B and Fig.13 As shown in FIG. 1B, it is preferred to form the side wall 24 of the multilayer structure 22. Then, the resist 151 is removed, and a second protective layer 17 is further formed on one surface, such as Fig. 9 C, 10C and 13C. Furthermore, as necessary, a low refractive index layer 18 and the like are formed. Thus, the display device 10 is obtained.

[0344] In the case where a mask 150 having a pattern corresponding to the layout of the sub-pixel 101 is set and the light-emitting layer 142 is patterned, preferably, the position of the mask 150 is precisely set at a position corresponding to the layout of the sub-pixel 101, but the position of the mask 150 may be arranged at a position offset within a predetermined range (within an allowable range) from the position corresponding to the layout of the sub-pixel 101. Since the portion deviating from the joining portion of the sub-pixel 101 and the connecting portion 23 is removed by etching, the portion of the light-emitting layer 142 and the functional layer 25 that deviates from the sub-pixel 101 and the connecting portion 23 due to the position deviation of the mask 150 is eliminated. Figures 7 to 13 In the illustrated example, a resist covering the joining portion of the sub-pixel 101 and the connecting portion 23 is formed using a photolithography method, and a portion deviating from the joining portion of the sub-pixel 101 and the connecting portion 23 is removed using an etching method.

[0345] The mask used in the step of forming the organic layer 14 is not particularly limited as long as the layout of each layer constituting the organic layer 14 (such as the light-emitting layer 142) can be formed (patterned) in a desired size, and for example, a fine metal mask (FMN), a film mask, etc. can be exemplified.

[0346] The formation method of each of the light emitting layer 142 and the other layers 126 other than the light emitting layer forming the organic layer 14 is not particularly limited, and examples thereof include a vapor deposition method and a coating method.

[0347] Examples of a method of forming the second electrode 15 include a vapor deposition method and a sputtering method. Similar to the method of forming the second electrode, examples of a method of forming the first protective layer 16 and the second protective layer 17 include a vapor deposition method and a sputtering method.

[0348] [2-1-2. Functions and effects]

[0349] According to the above-mentioned method for manufacturing a display device, even in the case of providing a plurality of sub-pixels having a plurality of luminescent colors and different luminescent colors, it is not necessary to form a pattern of the second electrode for each type of sub-pixel, and therefore, it is possible to achieve convenience in the manufacturing process. In addition, according to the above-mentioned method for manufacturing a display device, during the process of forming the organic layer 14 of each of the plurality of types of sub-pixels 101R, 101G, and 101B, it is not necessary to expose to the atmosphere, and the plurality of types of sub-pixels 101 can be formed in a vacuum state.

[0350] In addition, in the method of manufacturing a display device, since the light-emitting layer 142 constituting the organic layer 14 is formed using the mask 150, in the case where the mask 150 is positionally deviated, a state in which the light-emitting layers 142 of adjacent sub-pixels 101 overlap in the sub-pixel region M or a state in which the light-emitting layer 142 extends to the outside of the sub-pixel 101 may be formed according to the size of the positional deviation. If such a state is formed in a wide range in the display region 10A, the color gamut and resolution of the image displayed in the display region 10A may be adversely affected. In this regard, in the above-mentioned method of manufacturing a display device, a portion deviated from a portion corresponding to the sub-pixel 101 and the connection portion 23 is removed using a photolithography method and etching. Therefore, the positions of the side end faces of the corresponding layers (such as the light-emitting layer 142 constituting the organic layer formed in each sub-pixel) are aligned, and the state in which the light-emitting layers 142 of adjacent sub-pixels 101 overlap in the inter-sub-pixel region M in the portion other than the connection portion 23 and the state in which the light-emitting layer 142 extends to the outside of the sub-pixel 101 can be limited to a limited range. Therefore, a display device having excellent color gamut and resolution of an image displayed in the display region 10A can be obtained.

[0351] [2-1-3. Modification of manufacturing method]

[0352] In the above description of the manufacturing method of the display device, the hole injection layer 140 is shared by multiple types of sub-pixels 101R, 101G and 101B, but the manufacturing method is not limited to this. The thickness of the hole injection layer 140 may be different in multiple types of sub-pixels 101R, 101G and 101B. In this case, before the hole injection layer 140 of the organic layer 14 for forming the sub-pixel of the first color (for example, the sub-pixel 101B) is formed in the first step, the mask 150 (modification) is set. The case where the mask 150 is set before the hole injection layer 140 is formed in the first step in this way is called a modification of the manufacturing method. For example, in the modification of the manufacturing method, the first layer 125A (hole injection layer 140 and hole transport layer 141) and the light-emitting layer 142 are formed in a state where the mask 150B of the sub-pixel 101B is set. Note that when the second layer 125B (electron transport layer 143 and electron injection layer 144) is also different in several types of sub-pixels 101R, 101G, and 101B, the electron transport layer 143 and electron injection layer 144 are formed with the mask 150B being continuously set.

[0353] Next, the mask 150B is changed to the mask 150G, and similarly to the sub-pixel 101B, the first layer 125A (hole injection layer 140 and hole transport layer 141) and the light-emitting layer 142 corresponding to the sub-pixel 101G are formed. In addition, in the case where the second layer 125B (electron transport layer 143 and electron injection layer 144) is different in the several types of sub-pixels 101R, 101G, and 101B, the state in which the mask 150G is set is continued to form the electron transport layer 143 and the electron injection layer 144 corresponding to the sub-pixel 101G.

[0354] Note that in the case where the second layer 125B is common to multiple types of sub-pixels 101R, 101G, and 101B, after the first layer 125A and the light-emitting layer 142 are formed for the sub-pixels 101R, 101G, and 101B, the second layer 125B can be formed with the mask 150 removed.

[0355] In the modification of the manufacturing method, steps other than the above-mentioned first step are performed similarly to those of the above-mentioned manufacturing method, and therefore description thereof will be omitted.

[0356] [2-2-1. Contents of manufacturing method]

[0357] In the following, reference will be made to Fig.44 A to Fig.51 D describes a method for manufacturing the display device 10 according to the fifth embodiment. Fig.44 A to Fig.51 Reference numerals R, G, and B described below of the drive substrate 11 in D respectively represent formation positions of the sub-pixels 10R, 10G, and 10B in the X direction. Fig.44 A to Fig.47 D corresponds to Fig.34 The cross section shown (along Fig.33 Process diagram of the invention (a cross-sectional view taken along line XXXIV-XXXIV in FIG). Fig.48 A to Fig.51 D corresponds to Fig.35 The cross section shown (along Fig.33 Process diagram of the cross section taken along line XXXV-XXXV in FIG.

[0358] (First Electrode Formation Step)

[0359] First, a metal layer and a metal oxide layer are sequentially formed on the first surface of the drive substrate 11 by, for example, a sputtering method, and then the metal layer and the metal oxide layer are patterned by, for example, a photolithography method. Fig.44 A and Fig.48 As shown in FIG. 1A , a plurality of first electrodes 13 are formed on the first surface of the driving substrate 11 .

[0360] (Step of forming an organic layer having green as luminescent color)

[0361] Next, if Fig.44 B and Fig.48 As shown in FIG. 1B , the mask 71 is arranged to face the first surface of the drive substrate 11, so that the opening 71A of the mask 71 is located above the two columns of first electrodes 13 corresponding to the two adjacent pixel columns LG. At this time, the two columns of first electrodes 13 corresponding to the two adjacent pixel columns LG may be exposed from one opening 71A, or the two adjacent sub-pixels 101G may be exposed from one opening 71A. Thereafter, for example, an organic layer 14G is formed on the first surface of the drive substrate 11 through the mask 71 by a vapor deposition method. Therefore, the two columns of first electrodes 13 corresponding to the two adjacent pixel columns LG are covered by the organic layer 14G.

[0362] When the organic layer 14G is formed, the organic layer 14G may be formed in the formation region of the organic layer 14B (for example, on the first electrode 13 for forming the organic layer 14B) due to formation variation, deposition blur, etc. Here, the formation variation refers to variation due to the formation accuracy of the opening 71A of the mask 71, misalignment between the drive substrate 11 and the mask 71, thermal expansion of the mask 71, etc. The deposition blur refers to a phenomenon in which the boundary of the deposition pattern is blurred due to winding, vignetting, etc. of the deposition material.

[0363] The mask 71 has a plurality of openings 71A arranged two-dimensionally in a stripe-type layout. The openings 71A may be arranged in the same pattern as two adjacent pixel columns LG, or may be arranged in the same pattern as two adjacent sub-pixels 101G. The width of the openings 71A in the X direction is, for example, approximately twice the arrangement pitch of the sub-pixels 101 in the X direction. The edges of the openings 71A of the mask 71 are, for example, located between the first electrode 13 for forming the sub-pixel 101G and the first electrode 13 for forming the sub-pixel 101B. The mask 71 is, for example, a fine metal mask (FMM) or a film mask.

[0364] (Step of forming an organic layer having red as luminescent color)

[0365] Next, if Fig.44 C and Fig.48As shown in FIG. 3C, the mask 72 is arranged to face the upper surface of the first surface of the drive substrate 11 so that the opening 72A of the mask 72 is located above the two columns of first electrodes 13 corresponding to the two adjacent pixel columns LR. At this time, the two columns of first electrodes 13 corresponding to the two adjacent pixel columns LR may be exposed from one opening 72A, or the two adjacent sub-pixels 101R may be exposed from one opening 72A. The mask 72 is arranged so that the first electrode 13 for forming one sub-pixel 101B exists between the opening 71A of the mask 71 and the opening 72B of the mask 72. Thereafter, for example, an organic layer 14R is formed on the first surface of the drive substrate 11 through the mask 72 by a vapor deposition method. Therefore, the two columns of first electrodes 13 corresponding to the two adjacent pixel columns LR are covered by the organic layer 14R.

[0366] When forming the organic layer 14R, the organic layer 14R may be formed in the formation region of the organic layer 14B (for example, on the first electrode 13 for forming the organic layer 14R) due to formation variation, vapor deposition blurring, etc., similar to the above-described organic layer 14G.

[0367] The mask 72 has a plurality of openings 72A arranged two-dimensionally in a stripe-type layout. The openings 72A may be arranged in the same pattern as two adjacent pixel columns LR, or may be arranged in the same pattern as two adjacent sub-pixels 101R. The width of the openings 72A in the X direction is, for example, approximately twice the arrangement pitch of the sub-pixels 101 in the X direction. The edges of the openings 72A of the mask 72 are, for example, located between the first electrode 13 for forming the sub-pixel 101R and the first electrode 13 for forming the sub-pixel 101B. The mask 72 is, for example, a fine metal mask (FMM) or a film mask.

[0368] (Second Electrode Formation Step)

[0369] Next, if Fig.44 D and Fig.48 As shown in FIG. 2D , the second electrode 15 is formed on the first surface of the organic layer 14R and the first surface of the organic layer 14G by, for example, a vapor deposition method or a sputtering method.

[0370] (Protective layer formation step)

[0371] Next, if Fig.44 D and Fig.48 As shown in FIG. 2 , a protective layer 61 is formed on the first surface of the second electrode 15 by, for example, a CVD method or a vapor deposition method.

[0372] (Step of patterning the organic layer, the second electrode and the protective layer)

[0373] Next, the protective layer 61, the second electrode 15, the organic layer 14G, and the organic layer 14R are patterned by, for example, photolithography. More specifically, as shown in FIG. Fig.44 E and Fig.48 As shown in FIG. E, a photoresist layer 73 having a predetermined pattern is formed on the first surface of the protective layer 61. Fig.45 A and Fig.49 As shown in FIG. 1A, the protective layer 61, the second electrode 15, the organic layer 14G, and the organic layer 14R are processed by dry etching, for example, and then the photoresist layer 73 is removed. As a result, a plurality of light-emitting elements 104G, a plurality of light-emitting elements 104R, a plurality of connection portions 23G1, a plurality of connection portions 23G2, a plurality of connection portions 23R1, a plurality of connection portions 23R2, and a plurality of connection portions 23RG are formed on the first surface of the drive substrate 11, and the first electrode 13 for forming the sub-pixel 101B is exposed. Hereinafter, a block including a plurality of light-emitting elements 104G, a plurality of light-emitting elements 104R, a plurality of connection portions 23G1, a plurality of connection portions 23G2, a plurality of connection portions 23R1, a plurality of connection portions 23R2, a plurality of connection portions 23RG, and a protective layer 61 formed on the first surface of the light-emitting elements 104G and 104R and the connection portions 23G1, 23G2, 23R1, 23R2, and 23RG is referred to as a multilayer body 105RG.

[0374] (Sidewall Formation Step)

[0375] Next, if Fig.45 B and Fig.49 As shown in FIG. 1B , an insulating layer 62 a is formed on the first surface of the drive substrate 11 by, for example, a CVD method or a vapor deposition method so as to follow the shape of the plurality of multilayer bodies 105RG. Next, the insulating layer 62 a is etched back by, for example, dry etching, thereby forming a side wall 62 on the side surface of the multilayer body 105RG and exposing the first electrode 13 for forming the sub-pixel 101B again, as shown in FIG. Fig.45 C and Fig.49 As shown in C.

[0376] (Step of forming an organic layer having blue light emitting color)

[0377] Next, if Fig.45 D and Fig.49 As shown in FIG. 2D , the organic layer 14B is formed over the entire display region 10A on the first surface of the drive substrate 11 so as to follow the shape of the multilayer body 105RG on which the side wall 62 is formed, for example, by vapor deposition.

[0378] (Second Electrode Formation Step)

[0379] Next, if Fig.45 D and Fig.49As shown in FIG. 4D , the second electrode 15 is formed on the first surface of the organic layer 14B by, for example, a vapor deposition method or a sputtering method so as to follow the shape of the multilayer body 105RG on which the side wall 62 is formed.

[0380] (Protective layer formation step)

[0381] Next, if Fig.45 D and Fig.49 As shown in FIG. 1 , a protective layer 61a is formed on the first surface of the second electrode 15 by, for example, a CVD method or a vapor deposition method so as to follow the shape of the multilayer body 105RG forming the side wall 62 on the side surface. Thus, each of the plurality of recesses 61b is formed above the first electrode 13 for forming the sub-pixel 101B.

[0382] (Step of patterning the organic layer, the second electrode and the protective layer)

[0383] Next, if Fig.46 A and Fig.50 As shown in A, a resist layer 74 is formed in each recess 61b. Fig.46 B and 50B, the protective layer 61a, the second electrode 15 and the organic layer 14B are processed by, for example, dry etching. Therefore, the protective layer 61a, the second electrode 15 and the organic layer 14B located on the multilayer body 105RG are removed, and the protective layer 61a, the second electrode 15 and the organic layer 14B located between the multilayer body 105RG and the first electrode 13 for forming the sub-pixel 101B in the plan view are removed. Thereafter, the photoresist layer 73 is removed. Therefore, a plurality of light-emitting elements 104B are further formed on the first surface of the drive substrate 11. Hereinafter, a block including the light-emitting element 104B and the protective layer 61 formed on the first surface of the light-emitting element 104B is referred to as the multilayer body 105B.

[0384] (Sidewall Formation Step)

[0385] Next, if Fig.46 C and Fig.50 As shown in FIG. 3 , an insulating layer 62 a is formed on the first surface of the drive substrate 11 by, for example, a CVD method or a vapor deposition method so as to follow the shapes of the multilayer body 105RG and the plurality of multilayer bodies 105B. Next, the insulating layer 62 a is etched back by, for example, dry etching to form side walls 62 on the side surfaces of each multilayer body 105B, as shown in FIG. Fig.46 D and Fig.50 As shown in D.

[0386] (Forming step of auxiliary electrode)

[0387] Next, the protective layer 61 of the multilayer body 105B is patterned by, for example, photolithography to form the holes 611 in the protective layer 61. More specifically, as shown in FIG. Fig.47 A and Fig.51 As shown in FIG. 1A , a photoresist layer 75 having a predetermined pattern is formed on the first surface and the sidewall 62 of the protective layer 61. Fig.47 B and Fig.51 As shown in FIG. 2B , the protective layer 61 is processed by dry etching, for example, to form a hole 611 in the protective layer 61. After removing the photoresist layer 75, as shown in FIG. Fig.47 C and Fig.51 C, the auxiliary electrode 63 is formed on the first surface of the protective layer 61 by vapor deposition or sputtering, and a connection portion 631 is formed in the hole 611. Thus, the auxiliary electrode 63 is connected to the second electrode 15 of the light emitting element 104B via the connection portion 631.

[0388] (Protective layer formation step)

[0389] Next, if Fig.47 D and Fig.51 As shown in FIG. 6D , a protective layer 64 is formed on the second surface of the auxiliary electrode 63 by, for example, a CVD method or a vapor deposition method. As described above, the desired display device 10 is obtained.

[0390] [2-2-2. Effects]

[0391] As a method for applying an organic layer with a red luminous color, an organic layer with a green luminous color, and an organic layer with a blue luminous color separately, a pattern deposition method using a fine metal mask (FMM) or a film mask is generally used, and a method in which the material for forming the organic layer is dissolved in a solvent and each color is applied by inkjet. However, in these methods, the deposition accuracy and coating accuracy are insufficient, and patterning may be difficult. In particular, in high-definition display devices of 3000ppi or higher, the deposition accuracy and coating accuracy are insufficient, and patterning tends to be difficult. Therefore, a method for forming each luminous layer separately by patterning an organic layer with a red luminous color, an organic layer with a green luminous color, and a luminous layer with a blue luminous color by a photolithography method has been studied. However, in this method, a total of three photolithography processes are required to form each luminous layer separately. Therefore, due to the increase in the number of manufacturing processes of the display device, the production volume may be reduced.

[0392] On the other hand, in the method for manufacturing the display device 10 according to the fifth embodiment described above, the organic layer 14R having a red light emitting color and the organic layer 14G having a green light emitting color are simultaneously patterned by a photolithography method, and then, the organic layer 14B having a blue light emitting color is patterned separately by a photolithography method, thereby separately forming the organic layers 14R, 14G, and 14B. Therefore, in this method, the organic layers 14R, 14G, and 14B can be separately formed by a total of two photolithography processes. Therefore, since the manufacturing process of the display device 10 can be reduced, the production volume can be improved.

[0393] Furthermore, in the method of manufacturing the display device 10 according to the fifth embodiment described above, a plurality of light emitting elements 12R, 12G, and 12B are formed on the first surface of the drive substrate 11 as follows. First, the region for forming the organic layer 14B is used as an edge region, and the organic layer 14G of the two pixel columns LG and the organic layer 14R of the two pixel columns LR are formed via masks 71 and 72 by a vapor deposition method or the like. Next, the second electrode 15 and the protective layer 61 are sequentially formed to cover the organic layer 14R and the organic layer 14G. Next, the organic layer 14R and the organic layer 14G are simultaneously patterned together with the second electrode 15 and the protective layer 61 by a photolithography method, thereby forming a plurality of light emitting elements 104R and 104G on the first surface of the drive substrate 11. Next, the organic layer 14B is formed on the entire display region 10A by a vapor deposition method or the like, and then the second electrode 15 and the protective layer 61 are sequentially formed on the organic layer 14B. Next, the organic layer 14B is patterned together with the second electrode 15 and the protective layer 61 by photolithography, and a plurality of light-emitting elements 104B are further formed on the first surface of the drive substrate 11. Therefore, compared with the case where the organic layers 14R, 14G, and 14B are all formed through a mask by a vapor deposition method, the production volume can be improved, and the definition of the display device 10 can be improved. For example, a high-definition display device 10 of 3000 ppi or higher can be provided.

[0394] Furthermore, in the method of manufacturing the display device 10 according to the fifth embodiment described above, since the two sub-pixels 101G and 101G having the same luminescent color are adjacent in the X direction, the organic layer 14G can be separated for each sub-pixel 101G by photolithography after forming one organic layer 14G to cover the two adjacent first electrodes 13. Similarly, since the two sub-pixels 101R and 101R having the same luminescent color are adjacent to each other in the X direction, the organic layer 14R can be separated for each sub-pixel 101R by photolithography after forming one organic layer 14R to cover the two adjacent first electrodes 13. Therefore, the precision of the masks 71 and 72 can be reduced, and high definition of the display device 10 can be achieved.

[0395] [2-2-3. Modification of manufacturing method]

[0396] In the above description of the method of manufacturing the display device, an example of forming the plurality of organic layers 14G and the plurality of organic layers 14R by a vapor deposition method using the mask 71 and the mask 72 has been described, but the method of forming these layers is not limited to this example. For example, the plurality of organic layers 14G and the plurality of organic layers 14R may be formed by applying a material for forming the organic layer 14G and a material for forming the organic layer 14R on the first surface of the drive substrate 11 by an inkjet method and curing the materials.

[0397] [3. Example of a case where a display device includes a wavelength selection unit]

[0398] In each example of the above-mentioned display device and the method for manufacturing the display device, the description of the wavelength selection unit and the lens exemplified by the color filter and the like is omitted, but this does not deny that the wavelength selection unit and the lens are provided in the display device of the present disclosure, and the wavelength selection unit and the lens can be provided. Note that the wavelength selection unit is not limited to the color filter.

[0399] (Color filter, lens component)

[0400] In the display device 10, as Fig.26 As shown, the wavelength selection unit and the lens member may be provided on the first surface side of the low refractive index layer 18 in each sub-pixel 101. Fig.26 As shown, for example, the color filter 19 can be exemplified as a wavelength selection unit. A color filter corresponding to the color type of the sub-pixel 101 is preferably provided as the color filter 19. For example, a red filter 19R, a green filter 19G, and a blue filter 19B can be respectively provided as color filters of sub-pixels 101R, 101G, and 101B. Color purity can be improved by providing a filter. At this time, the light absorption layer 21 is preferably provided between adjacent color filters 19. The light absorption layer 21 can be exemplified by a black matrix portion, etc. In addition, a lens unit 20 can be formed on the color filter 19. Examples of the lens unit 20 include a convex lens. Since the lens unit 20 is formed, the direction in which light travels can be adjusted.

[0401] (Relationship between normal lines passing through the centers of the light emitting unit, the lens member, and the wavelength selecting unit)

[0402] In the following description, the relationship between the normal line LN extending through the center of the light emitting unit, the normal line LN′ extending through the center of the lens member, and the normal line LN″ extending through the center of the wavelength selection unit is described. Here, the light emitting unit is, for example, the light emitting element 104. The lens member is, for example, the lens unit 20 provided on the color filter. The wavelength selection unit is, for example, the red filter 19R, the green filter 19G, and the blue filter 19B.

[0403] Note that the size of the wavelength selection unit can be appropriately changed according to the light emitted from the light emitting unit, or in the case where the light absorbing unit (e.g., black matrix portion) is provided between the wavelength selection units of adjacent light emitting units, the size of the light absorbing unit can be appropriately changed according to the light emitted from the light emitting unit. In addition, the size of each wavelength selection unit can be appropriately changed according to the distance (offset) d0 between the normal line extending through the center of the light emitting unit and the normal line extending through the center of the wavelength selection unit. The planar shape of each wavelength selection unit can be the same as, similar to, or different from the planar shape of each lens member.

[0404] In the following, reference Fig. 22 A. Fig. 22 B. Fig. 22 C and Fig.23 , the relationship of a normal line passing through the center of each component in a case where the light emitting unit 51, the wavelength selecting unit 52, and the lens member 53 are arranged in this order will be described.

[0405] like Fig. 22 As shown in A, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selection unit 52, and the normal line LN' passing through the center of the lens member 53 may coincide with each other. That is, D0=0 and d0=0 may be satisfied. Here, D0 represents the distance (offset) between the normal line LN extending through the center of the light emitting unit 51 and the normal line LN' extending through the center of the lens member 53, and d0 represents the distance (offset) between the normal line LN extending through the center of the light emitting unit 51 and the normal line LN" extending through the center of the wavelength selection unit 52.

[0406] like Fig. 22 B, the normal line LN extending through the center of the light emitting unit 51 and the normal line LN" extending through the center of the wavelength selection unit 52 may coincide with each other, but the normal line LN extending through the center of the light emitting unit 51 and the normal line LN" extending through the center of the wavelength selection unit 52 may not coincide with the normal line LN' extending through the center of the lens member 53. That is, D0>0 and d0=0 may be satisfied.

[0407] like Fig. 22 C, the normal line LN extending through the center of the light emitting unit 51 may not coincide with the normal line LN" extending through the center of the wavelength selection unit 52 and the normal line LN' extending through the center of the lens member 53, and the normal line LN" extending through the center of the wavelength selection unit 52 may coincide with the normal line LN' extending through the center of the lens member 53. That is, D0>0, d0>0 and D0=d0 may be satisfied.

[0408] like Fig.23As shown, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selection unit 52, and the normal line LN' passing through the center of the lens member 53 may not coincide with each other. That is, D0>0, d0>0 and D0≠d0 may be satisfied. Here, the center of the wavelength selection unit 52 (given by Fig.23 The position indicated by the black square in FIG. 1 is preferably located at a position connecting the center of the light emitting unit 51 and the center of the lens member 53 (indicated by Fig.23 Specifically, when the distance between the center of the light emitting unit 51 and the center of the wavelength selection unit 52 in the thickness direction ( Fig.23 When the distance in the vertical direction is LL1, and the distance between the center of the wavelength selection unit 52 and the center of the lens member 53 in the thickness direction is LL2,

[0409] D0>d0>0, and

[0410] Consider manufacturing changes,

[0411] d0: D0 = LL1: (LL1 + LL2)

[0412] Preferably satisfied.

[0413] Here, the thickness direction indicates the thickness direction of the light emitting unit 51 , the wavelength selecting unit 52 , and the lens member 53 .

[0414] In the following, reference Fig.24 A. Fig.24 B and Fig.25 , the relationship of a normal line passing through the center of each component in a case where the light emitting unit 51, the lens member 53, and the wavelength selecting unit 52 are arranged in this order will be described.

[0415] like Fig.24 As shown in FIG. 4A , a normal line LN passing through the center of the light emitting unit 51, a normal line LN″ passing through the center of the wavelength selection unit 52, and a normal line LN′ passing through the center of the lens member 53 may coincide with each other. That is, D0>0 and d0=0 may be satisfied.

[0416] like Fig.24 B, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selection unit 52, and the normal line LN' passing through the center of the lens member 53 do not coincide with each other, and the normal line LN" passing through the center of the wavelength selection unit 52 and the normal line LN' passing through the center of the lens member 53 may coincide with each other. That is, D0>0, d0>0 and D0=d0 can be satisfied.

[0417] like Fig.25As shown, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selection unit 52, and the normal line LN' passing through the center of the lens member 53 may not coincide with each other. Here, the center of the lens member 53 (at Fig.41 The position indicated by the black circle in FIG. 5 is preferably located at the center of the connecting light emitting unit 51 and the center of the wavelength selection unit 52 (at Fig.41 Specifically, between the center of the light emitting unit 51 and the center of the lens member 53 in the thickness direction ( Fig.41 In the case where the distance in the vertical direction (in the vertical direction) is represented by LL2, and the distance in the thickness direction between the center of the lens member 53 and the center of the wavelength selection unit 52 is represented by LL1,

[0418] Preferably the following expression is satisfied,

[0419] d0>D0>0

[0420] And, in consideration of manufacturing variations, the following expression is preferably satisfied,

[0421] D0:d0=LL2:(LL1+LL2).

[0422] Here, the thickness direction indicates the thickness direction of the light emitting unit 51 , the wavelength selecting unit 52 , and the lens member 53 .

[0423] [3. Application examples]

[0424] (Electronic Devices)

[0425] The display device 10 according to the first to fifth embodiments described above can be provided in various electronic devices. Specifically, the display device is preferably provided in a device requiring high image resolution and used near the eyes for viewing in an enlarged state, and the device includes an electronic viewfinder of a video camera or a single-lens reflex camera, a head-mounted display, etc.

[0426] (Specific example 1)

[0427] Fig. 27 A is a front view showing an example of the appearance of the digital still camera 310 . Fig. 27 B is a rear view showing an example of the appearance of a digital still camera 310. The digital still camera 310 is a single-lens reflex type of an interchangeable lens, and includes an interchangeable imaging lens unit (interchangeable lens) 312 located approximately at the center of the front surface of a camera body (camera body) 311 and a grip 313 to be held on the front left side by a photographer.

[0428] The monitor 314 is disposed at a position offset to the left from the center of the rear surface of the camera body 311. An electronic viewfinder (eyepiece window) 315 is disposed above the monitor 314. By looking at the electronic viewfinder 315, the photographer can visually recognize the optical image of the subject guided from the imaging lens unit 312 and determine the picture composition. Any one of the display devices 10 according to the above-described first to fifth embodiments and modifications can be used as the electronic viewfinder 315.

[0429] (Specific Example 2)

[0430] Fig.28 3 is a perspective view showing an example of the appearance of the head mounted display 320. For example, the head mounted display 320 includes ear hook portions 322 worn on the user's head on both sides of a display unit 321 in the shape of glasses. As the display unit 321, any one of the display devices 10 according to the above-described first to fifth embodiments and modifications can be used.

[0431] (Specific example 3)

[0432] Fig.29 3 is a perspective view showing an example of the appearance of a television device 330. The television device 330 includes, for example, a video display screen unit 331 including a front panel 332 and a filter glass 333, and the video display screen unit 331 includes any one of the display devices 10 according to the above-described first to fifth embodiments and modifications.

[0433] (Specific example 4)

[0434] Fig.30 An example of the appearance of a see-through head-mounted display 340 is shown. The see-through head-mounted display 340 includes a main body 341 , an arm 342 , and a lens barrel 343 .

[0435] The body 341 is connected to the arm 342 and the glasses 350. Specifically, the end of the body 341 in the longitudinal direction is coupled to the arm 342, and one side of the side surface of the body 341 is coupled to the glasses 350 via a connecting member. Note that the body 341 may be directly mounted on the head of a human body.

[0436] The main body 341 includes a control panel and a display unit for controlling the operation of the see-through head mounted display 340. The arm 342 connects the main body 341 and the lens barrel 343, and supports the lens barrel 343. Specifically, the arm 342 is coupled to the end of the main body 341 and the end of the lens barrel 343, and fixes the lens barrel 343. In addition, the arm 342 includes a signal line for communicating data related to an image to be provided from the main body 341 to the lens barrel 343.

[0437] The lens barrel 343 projects image light supplied from the main body 341 toward the eyes of the user wearing the see-through head-mounted display 340 through the eyepiece 351 via the arm 342. In this see-through head-mounted display 340, the display unit of the main body 341 includes one of the above-described display devices 10 and the like.

[0438] (Specific Example 5)

[0439] Fig.31 3 is a perspective view showing an example of the appearance of a smartphone 360. Fig.31 As shown, the smartphone 360 ​​includes a display unit 361 that displays information such as pixels and an operation unit 362 that includes buttons and the like that receive user operation inputs. The display device 10 according to the above-described first to fifth embodiments and modifications can be applied to the display unit 361.

[0440] (Specific Example 6)

[0441] Any of the display devices 10 and the like described above may be included in a vehicle or in various displays.

[0442] Fig.32 A and Fig.32 B is a diagram showing an example of the interior configuration of a vehicle 500 provided with various displays. Specifically, Fig.32 A is a diagram showing an example of the internal state of the vehicle 500 from the rear to the front of the vehicle 500, and Fig.32 B is a diagram showing an example of the interior state of the vehicle 500 from the oblique rear to the oblique front of the vehicle 500 .

[0443] The vehicle 500 includes a central display 501, a console display 502, a head-up display 503, a digital rearview mirror 504, a steering wheel display 505, and a rear entertainment display 506. At least one of these displays includes any one of the above-mentioned display devices 10, etc. For example, all of these displays may include one of the above-mentioned display devices 10, etc.

[0444] The central display 501 is provided at a position of the instrument panel facing the driver's seat 508 and the passenger seat 509 . Fig.32 A and Fig.32B shows an example of a central display 501 having a horizontally long shape extending from the driver's seat 508 side to the passenger seat 509 side, but the screen size and arrangement position of the central display 501 are arbitrary. The central display 501 can display information sensed by various sensors. As a specific example, the central display 501 can display an image captured by an image sensor, an image of the distance to obstacles in front of or to the side of the vehicle 500, a distance measured by a ToF sensor, a passenger's body temperature detected by an infrared sensor, and the like. The central display 501 can be used to display, for example, at least one of safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information.

[0445] Safety-related information is information about drowsiness sensing, sensing of looking outside, sensing of mischief of children riding together, presence or absence of wearing of seat belts, sensing of departure of passengers, etc., and is information sensed by, for example, a sensor set to overlap with the rear surface side of the central display 501. Operation-related information uses a sensor to sense gestures related to operations performed by the occupant. The gestures to be sensed may include operations of various devices in the vehicle 500. For example, the operations of air conditioning equipment, navigation devices, audio-visual (AV) devices, lighting devices, etc. are detected. The life log includes life logs of all occupants. For example, the life log includes a record of actions of each occupant in the vehicle. By acquiring and storing the life log, the state of each occupant at the time of the accident can be checked. Health-related information uses a sensor such as a temperature sensor to sense the body temperature of the occupant, and the health status of the occupant is estimated based on the sensed body temperature. Alternatively, the face of the occupant can be imaged with an image sensor, and the health status of the occupant can be estimated based on the imaged facial expression. In addition, a conversation with the occupant can be conducted by automatic voice, and the health status of the occupant can be estimated based on the content of the response from the occupant. Authentication / identification related information includes a keyless entry function that uses sensors to perform facial authentication, and a function that automatically adjusts seat height and position through facial recognition. Entertainment related information includes a function that uses sensors to detect operating information about an AV device used by an occupant, and a function that uses sensors to recognize an occupant's face and provides content suitable for the occupant through the AV device.

[0446] For example, the console display 502 may be used to display life log information. The console display 502 is disposed near a shift lever 511 of a center console 510 between a driver's seat 508 and a passenger seat 509. The console display 502 may also display information detected by different sensors. In addition, the console display 502 may display an image of the vehicle's surroundings captured with an image sensor, or may display an image of the distance to obstacles present in the vehicle's surroundings.

[0447] The head-up display 503 is virtually displayed behind the windshield 512 in front of the driver's seat 508. For example, the head-up display 503 can be used to display at least one of safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. In many cases, the head-up display 503 is virtually set in front of the driver's seat 508 and is suitable for displaying information directly related to the operation of the vehicle 500, such as the speed of the vehicle 500, the remaining amount of fuel (battery), etc.

[0448] The digital rearview mirror 504 can display not only the rear of the vehicle 500 but also the status of rear seat occupants, and therefore, for example, can be used to display life log information by arranging sensors on the rear surface side of the digital rearview mirror 504 in an overlapping manner.

[0449] The steering wheel display 505 is disposed near the center of the steering wheel 513 of the vehicle 500. The steering wheel display 505 may be used to display, for example, at least one of safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. Specifically, the steering wheel display 505 is located near the driver's hand and is suitable for displaying life log information such as the driver's body temperature, or is suitable for displaying information about the operation of an AV device, an air conditioning device, and the like.

[0450] The rear entertainment display 506 is attached to the rear side of the driver's seat 508 or the passenger seat 509 and is used to allow the occupants in the rear seat to enjoy watching / listening. The rear entertainment display 506 can be used to display, for example, at least one of safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. Specifically, when the rear entertainment display 506 is located in front of the occupants in the rear seat, information related to the occupants in the rear seat is displayed. For example, information about the operation of an AV device or an air-conditioning device can be displayed, or the measurement results of the body temperature of the occupants in the rear seat with a temperature sensor can be displayed.

[0451] The sensor can be arranged on the rear surface side of the display device 10, etc. in an overlapping manner, so that the distance to the object present in the surrounding environment can be measured in this configuration. Optical distance measurement methods are roughly divided into passive and active types. By the passive method, distance measurement is performed by receiving light from the object without projecting light from the sensor to the object. Passive methods include lens focusing methods, stereo methods, and monocular vision methods. Active methods include distance measurement performed by projecting light onto the object, and using sensors to receive reflected light from the object to measure the distance. Active methods include optical radar methods, active stereo methods, illumination difference stereo methods, moiré morphology methods, and interference methods. Any of the above-mentioned display devices 10, etc. can be used for distance measurement by any of these methods. By setting the sensor on the rear surface side of the above-mentioned display device 10, etc. in an overlapping manner, the above-mentioned passive or active distance measurement can be performed.

[0452] Although the display device according to the first to fourth embodiments, the display device according to the fifth embodiment, the display device according to each example, the method of manufacturing the display device, and the application examples have been specifically described as examples of the light-emitting device of the present disclosure, the present disclosure is not limited to the display device according to the first to fourth embodiments, and various modifications of the display device according to the fifth embodiment, the display device according to each example, the method of manufacturing the display device, and the above-mentioned application examples based on the technical concept of the present disclosure can be made.

[0453] For example, the configurations, methods, steps, shapes, materials, numerical values, etc. illustrated in the display devices according to the above-mentioned first to fourth embodiments, the display devices according to the fifth embodiment, and the display devices according to the respective examples are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, etc. may be used as needed.

[0454] Without departing from the main purpose of the present disclosure, the above-mentioned display device according to the first to fourth embodiments, the display device according to the fifth embodiment, the display device according to each example, the method of manufacturing the display device, and the configuration, method, steps, shape, material, numerical value, etc. of the application example may be combined with each other.

[0455] Unless otherwise specified, the materials exemplified in the display devices according to the above-mentioned first to fourth embodiments, the display device according to the fifth embodiment, the display device according to each example, the method of manufacturing the display device, and the application examples may be used alone or in combination of two or more.

[0456] Furthermore, the present disclosure may also adopt the following configurations. (1)

[0458] A light emitting device, comprising:

[0459] A plurality of sub-pixels are arranged two-dimensionally and correspond to a plurality of luminescent colors respectively;

[0460] A connecting portion, connecting a plurality of different sub-pixels;

[0461] a first electrode; and

[0462] On the upper side of the first electrode, there are an organic layer including a light-emitting layer and a second electrode in sequence.

[0463] The first electrode and the organic layer are formed at least in each of the plurality of sub-pixels.

[0464] The second electrode is formed in the plurality of sub-pixels and the connection portion,

[0465] In a case where a region between a plurality of sub-pixels is defined as an inter-sub-pixel region, the connection portion is formed in a portion of the inter-sub-pixel region, and

[0466] At least a portion of the connection portion connects a plurality of sub-pixels having different luminescent colors. (2)

[0468] The light emitting device according to (1) above, wherein:

[0469] The organic layer includes a plurality of functional layers as layers other than the light emitting layer, and

[0470] At least a portion of the functional layer is formed in the sub-pixel and the connection portion. (3)

[0472] The light emitting device according to (1) or (2) above, wherein:

[0473] The light emitting layer extends from the sub-pixel to a portion of the connecting portion. (4)

[0475] The light emitting device according to any one of (1) to (3) above, wherein:

[0476] The plurality of light emitting layers extend to at least some of the connecting portions. (5)

[0478] The light emitting device according to any one of (1) to (4) above, wherein:

[0479] The organic layer includes a light-emitting layer and a plurality of functional layers as layers other than the light-emitting layer,

[0480] In at least a portion of the sub-pixel, the light emitting layer and the functional layer include side end surfaces, and

[0481] The side end surfaces of the light emitting layer are aligned with the side end surfaces of the plurality of functional layers. (6)

[0483] The light emitting device according to any one of (1) to (5) above, wherein:

[0484] In at least a portion of the sub-pixel, each of the organic layer and the second electrode includes a side end surface, and the side end surface of the organic layer is aligned with the side end surface of the second electrode. (7)

[0486] The light emitting device according to any one of (1) to (6) above, further comprising:

[0487] a protective layer covering the second electrode,

[0488] In at least a portion of the sub-pixel, each of the organic layer, the second electrode and the protective layer includes a side surface, and the side surface of the organic layer, the side surface of the second electrode and the side surface of the protective layer are aligned. (8)

[0490] The light emitting device according to any one of (1) to (7) above, wherein:

[0491] At least some of the connection portions connect sub-pixels having the same luminescent color. (9)

[0493] The light emitting device according to any one of (1) to (8) above, wherein:

[0494] At least some of the connecting portions connect three or more sub-pixels. (10)

[0496] The light emitting device according to any one of (1) to (9) above, wherein:

[0497] The plurality of sub-pixels are arranged in a layout selected from a triangle type, a square type, and a stripe type. (11)

[0499] The light emitting device according to any one of (1) to (10) above, wherein:

[0500] Two sub-pixels having predetermined colors are arranged adjacent to each other. (12)

[0502] The light emitting device according to (11), wherein:

[0503] The connection portion includes a connection portion connecting sub-pixels having the same luminescent color and a connection portion connecting sub-pixels having different luminescent colors. (13)

[0505] The light emitting device according to (1), wherein:

[0506] The plurality of sub-pixels include a plurality of first sub-pixels having a first luminescent color, a plurality of second sub-pixels having a second luminescent color, and a plurality of third sub-pixels having a third luminescent color,

[0507] The plurality of first sub-pixels are arranged such that two of the first sub-pixels are adjacent to each other in a predetermined direction,

[0508] The plurality of second sub-pixels are arranged such that two of the second sub-pixels are adjacent to each other in a predetermined direction, and

[0509] The plurality of third sub-pixels are arranged between the first sub-pixel and the second sub-pixel. (14)

[0511] The light emitting device according to (13), wherein:

[0512] The connection part includes:

[0513] A first connecting portion connecting adjacent first sub-pixels;

[0514] a second connecting portion connecting second sub-pixels adjacent to each other; and

[0515] The third connection portion connects the first sub-pixel and the second sub-pixel adjacent to each other. (15)

[0517] The light emitting device according to (14), further comprising:

[0518] an auxiliary electrode, disposed above the second electrode,

[0519] The auxiliary electrode is connected to the third sub-pixel. (16)

[0521] An electronic device, comprising:

[0522] A display device according to any one of (1) to (10) and (11) to (15) above. (17)

[0524] A method for manufacturing a light emitting device, the method comprising:

[0525] In a first step, an organic layer including a light-emitting layer is patterned on a first electrode using a mask determined according to a layout of a plurality of sub-pixels;

[0526] A second step is to stack a second electrode on the organic layer; and

[0527] In the third step, the organic layer and the second electrode are removed by etching at a portion separated from a junction of a sub-pixel and a connection portion connecting a plurality of different sub-pixels. (18)

[0529] According to the method for manufacturing a light emitting device according to (17) above,

[0530] determining a mask for each of the color types of a plurality of sub-pixels corresponding to each of the plurality of emission colors, respectively, and

[0531] The first step includes forming light emitting layers corresponding to a plurality of sub-pixels by changing a mask for a color type of each sub-pixel. (19)

[0533] A method for manufacturing a light emitting device, the method comprising the following steps:

[0534] forming a first organic layer including a first light emitting layer on first electrodes of two first sub-pixels adjacent to each other in a predetermined direction via a first mask;

[0535] After setting a second mask so that a first electrode for forming a third sub-pixel exists between an opening of the first mask and an opening of the second mask, a second organic layer including a second light-emitting layer is formed on the first electrodes of two second sub-pixels adjacent to each other in a predetermined direction via the second mask;

[0536] forming a second electrode and a first protective layer in sequence on the first organic layer and the second organic layer, the second electrode forming a first sub-pixel and a second sub-pixel; and

[0537] The first subpixel and the second subpixel are formed by patterning the first protective layer, the second electrode, the first organic layer, and the second organic layer so that a connection portion connecting the first subpixel and the second subpixel remains in an inter-subpixel region and the first electrode forming the third subpixel is exposed. (20)

[0539] The method for manufacturing a light emitting device according to (19), further comprising the following steps:

[0540] sequentially forming a third organic layer including a third light emitting layer, a second electrode forming a third sub-pixel, and a second protective layer to cover the first sub-pixel and the second sub-pixel; and

[0541] The third organic layer is patterned to form a second electrode of a third sub-pixel and a second protective layer to form a third sub-pixel.

[0542] Reference Mark List

[0543] 10 Display device

[0544] 10A Display area

[0545] 11. Driver board

[0546] 11A base plate

[0547] 11B Insulation layer

[0548] 11C Cabling

[0549] 12 Insulation layer

[0550] 12A Opening

[0551] 13. First electrode

[0552] 14 Organic layer

[0553] 14B Organic layer

[0554] 14B0 Main Body

[0555] 14G Organic Layer

[0556] 14G0 Main Body

[0557] 14G1 Coupling

[0558] 14G2 Coupling

[0559] 14G3 Extension

[0560] 14GL Entity

[0561] 14R Organic layer

[0562] 14R0 Main Body

[0563] 14R1 Coupling

[0564] 14R2 Coupling

[0565] 14R3 Extension

[0566] 14RL Main body

[0567] 15. Second electrode

[0568] 15M0 Main Body

[0569] 15M1 Coupling

[0570] 15M2 Coupling

[0571] 15ML Body

[0572] 16 First protective layer

[0573] 17 Second protective layer

[0574] 18 Low refractive index layer

[0575] 19 Color Filters

[0576] 19B Blue filter

[0577] 19G Green filter

[0578] 19R Red filter

[0579] 20 lens units

[0580] 21 Light absorption layer

[0581] 22 Multilayer structure

[0582] 23, 23G1, 23G2, 23G3, 23R1, 23R2, 23R3, 23RG Connector

[0583] 24 Sidewall

[0584] 25 Functional Layer

[0585] 30 Reflector

[0586] 31 Optical Adjustment Layer

[0587] 32 Oxide film

[0588] 51 light emitting units

[0589] 52 wavelength selection unit

[0590] 53 Lens component

[0591] 101 sub-pixels

[0592] 101B sub-pixel

[0593] 101G Sub-Pixel

[0594] 101R sub-pixel

[0595] 104 Light-emitting elements

[0596] 104B Light Emitting Element

[0597] 104G Light Emitting Component

[0598] 104R Light Emitting Element

[0599] 105 H Driver

[0600] 106 V Driver

[0601] 107 Control Circuit

[0602] 122 Part 1

[0603] 123 Part 2

[0604] 125A First Floor

[0605] 125B Second Floor

[0606] 126th floor

[0607] 140 Hole injection layer

[0608] 141 Hole transport layer

[0609] 142 Luminous layer

[0610] 142B Luminescent layer

[0611] 142G Luminous layer

[0612] 142R Luminescent layer

[0613] 143 Electron Transport Layer

[0614] 144 Electron injection layer

[0615] 150 Mask

[0616] 150B Mask

[0617] 150G Mask

[0618] 150R Mask

[0619] 151 Resist

[0620] 241 Side surface

[0621] 242 side surface

[0622] 243 Side surface

[0623] 310 Digital Still Camera

[0624] 320 Head-mounted display

[0625] 330 TV sets

[0626] 340 See-through Head-Mounted Display

[0627] 360 Smartphone

[0628] 500 vehicles

[0629] 501 Central Display

[0630] 502 Console Display

[0631] 503 Head-up display

[0632] 504 Digital rearview mirror

[0633] 505 Steering wheel display

[0634] 506 Rear Entertainment Display

[0635] A X Axis

[0636] BK1 first piece

[0637] BK2 second piece

[0638] DP luminous surface

[0639] IR pixel columns

[0640] LG Pixel Column

[0641] LB Pixel Column

[0642] LN Normal

[0643] LN' Normal

[0644] M Inter-subpixel area

[0645] MU Section Line

[0646] XS area.

Claims

1. A light emitting device, comprising: A plurality of sub-pixels are arranged two-dimensionally and correspond to a plurality of luminescent colors respectively; A connecting portion, connecting a plurality of different sub-pixels; a first electrode; as well as On the upper side of the first electrode, there are an organic layer including a light-emitting layer and a second electrode in sequence. The first electrode and the organic layer are formed at least in each of the plurality of sub-pixels. The second electrode is formed in the plurality of sub-pixels and the connecting portion, In the case where a region between the plurality of sub-pixels is defined as an inter-sub-pixel region, the connection portion is formed in a portion of the inter-sub-pixel region, and At least a portion of the connection portion connects the plurality of sub-pixels having different luminescent colors.

2. The light emitting device according to claim 1, wherein: The organic layer includes a plurality of functional layers as layers other than the light emitting layer, and At least a portion of the functional layer is formed in the sub-pixel and the connection portion.

3. The light emitting device according to claim 1, wherein: The light emitting layer extends from the sub-pixel to a portion of the connection portion.

4. The light emitting device according to claim 1, wherein: A plurality of the light emitting layers extend to at least some of the connecting portions.

5. The light emitting device according to claim 1, wherein: the organic layer includes the light-emitting layer and a plurality of functional layers as layers other than the light-emitting layer, In at least a portion of the sub-pixel, the light emitting layer and the functional layer include side end surfaces, and The side end surface of the light emitting layer is aligned with the side end surfaces of the plurality of functional layers.

6. The light emitting device according to claim 1, wherein: In at least a portion of the sub-pixel, each of the organic layer and the second electrode includes a side end surface, and the side end surface of the organic layer is aligned with the side end surface of the second electrode.

7. The light emitting device according to claim 1, further comprising: a protective layer covering the second electrode, In at least a portion of the sub-pixel, each of the organic layer, the second electrode and the protective layer includes a side surface, and the side surface of the organic layer, the side surface of the second electrode and the side surface of the protective layer are aligned.

8. The light emitting device according to claim 1, wherein: At least some of the connection portions connect the sub-pixels having the same luminescent color.

9. The light emitting device according to claim 1, wherein: At least some of the connection portions connect three or more of the sub-pixels.

10. The light emitting device according to claim 1, wherein: The plurality of sub-pixels are arranged in a layout selected from a triangle type, a square type, and a stripe type.

11. The light emitting device according to claim 1, wherein: Two of the sub-pixels having a predetermined color are arranged adjacent to each other.

12. The light emitting device according to claim 11, wherein: The connection portion includes a connection portion connecting the sub-pixels having the same luminescent color and a connection portion connecting the sub-pixels having different luminescent colors.

13. The light emitting device according to claim 1, wherein: The plurality of sub-pixels include a plurality of first sub-pixels having a first luminescent color, a plurality of second sub-pixels having a second luminescent color, and a plurality of third sub-pixels having a third luminescent color, The plurality of first sub-pixels are arranged such that two of the first sub-pixels are adjacent to each other in a predetermined direction, The plurality of second sub-pixels are arranged such that two of the second sub-pixels are adjacent to each other in the predetermined direction, and The plurality of third sub-pixels are arranged between the first sub-pixel and the second sub-pixel.

14. The light emitting device according to claim 13, wherein: The connecting portion comprises: A first connecting portion, connecting the first sub-pixels adjacent to each other; a second connecting portion, connecting the second sub-pixels adjacent to each other; and The third connecting portion connects the first sub-pixel and the second sub-pixel adjacent to each other.

15. The light emitting device according to claim 14, further comprising: an auxiliary electrode, disposed above the second electrode, Wherein, the auxiliary electrode is connected to the third sub-pixel.

16. An electronic device comprising: The display device according to claim 1.

17. A method for manufacturing a light emitting device, the method comprising: In a first step, an organic layer including a light-emitting layer is patterned on a first electrode using a mask determined according to a layout of a plurality of sub-pixels; The second step is to stack a second electrode on the organic layer; as well as In a third step, a portion of the organic layer and the second electrode separated from a junction between the sub-pixel and a connection portion connecting a plurality of different sub-pixels is removed by etching.

18. The method for manufacturing a light emitting device according to claim 17, wherein: determining the mask for each color type of a plurality of the sub-pixels corresponding to each of a plurality of emission colors, respectively, and The first step includes forming the light emitting layers corresponding to the plurality of the sub-pixels by changing the mask for each color type of the sub-pixels.

19. A method for manufacturing a light emitting device, the method comprising the following steps: forming a first organic layer including a first light emitting layer on first electrodes of two first sub-pixels adjacent to each other in a predetermined direction via a first mask; After setting a second mask so that a first electrode for forming a third sub-pixel exists between an opening of the first mask and an opening of the second mask, a second organic layer including a second light-emitting layer is formed on the first electrodes of two second sub-pixels adjacent to each other in the predetermined direction via the second mask; forming a second electrode and a first protective layer on the first organic layer and the second organic layer in sequence, wherein the second electrode forms a first sub-pixel and a second sub-pixel; as well as The first sub-pixel and the second sub-pixel are formed by patterning the first protective layer, the second electrode, the first organic layer, and the second organic layer so that the connection portion connecting the first sub-pixel and the second sub-pixel remains in the inter-sub-pixel area and the first electrode forming the third sub-pixel is exposed.

20. The method for manufacturing a light emitting device according to claim 19, further comprising the following steps: sequentially forming a third organic layer including a third light-emitting layer, a second electrode forming a third sub-pixel, and a second protective layer to cover the first sub-pixel and the second sub-pixel; as well as The third organic layer is patterned to form the second electrode of the third sub-pixel and the second protection layer to form the third sub-pixel.

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