Fan and control method thereof, medium and computer equipment

Abstract

The invention relates to the field of household appliances, particularly provides a fan and a control method thereof, a medium and computer equipment, and aims to solve the technical problems of poor refrigeration effect and small adjustable range of refrigeration intensity to a certain extent. To this end, the fan of the present invention comprises: a housing having an air inlet and an air outlet; the air guide piece is arranged on the shell and located between the air inlet and the air outlet; the refrigeration part is connected to the shell, and the refrigeration part is provided with a through hole allowing air to pass through, so that when the air guide part guides the air to flow, the air can pass through the through hole, and therefore the air is refrigerated by the refrigeration part; the control method comprises the steps that a refrigeration intensity adjusting instruction is obtained in the fan running state; and according to the refrigeration intensity adjusting instruction, the opening degree of the through hole, the position of the refrigeration part and / or the operation parameters of the refrigeration part are selectively adjusted.

Description

Technical Field

[0001] The present invention relates to the technical field of household appliances, and specifically provides a fan and a control method thereof, a medium and a computer device. Background Art

[0002] Fans are commonly used household refrigeration equipment. Compared with air conditioners that cool large spaces, fans can cool local spaces and achieve significant energy savings.

[0003] Some fans in the prior art are provided with cooling structures, but these cooling structures can usually only exchange heat with a small part of the air in the fan housing, or only a small area can exchange heat with the air in the fan housing, which results in poor cooling effect of the fans in the prior art. At the same time, the cooling intensity of these fans can be adjusted in a small range and may not meet the expectations of users.

[0004] Accordingly, the art needs to provide a new technical solution to solve the above problems. Summary of the invention

[0005] In order to at least partially overcome the above-mentioned defects, the present invention is proposed. Specifically, the present invention provides a fan and a control method, device and medium thereof that can at least partially solve the technical problems of poor cooling effect of the fan and small adjustable range of cooling intensity.

[0006] A first aspect of the present invention provides a method for controlling a fan, wherein the fan comprises: a shell having an air inlet and an air outlet; an air guide member disposed in the shell and located between the air inlet and the air outlet; a refrigeration member connected to the shell, wherein the refrigeration member has a through hole allowing air to pass through, so that: when the air guide member guides the air flow, the air can pass through the through hole and is thereby cooled by the refrigeration member; the control method comprises: when the fan is in an operating state, obtaining a refrigeration intensity adjustment instruction; and selectively adjusting the opening of the through hole, the position of the refrigeration member and / or the operating parameters of the refrigeration member according to the refrigeration intensity adjustment instruction.

[0007] The cooling part of the fan is provided with a through hole for allowing air to pass through, so that the heat exchange between the fan and the air is more complete, and a better cooling effect is achieved. At the same time, the above three adjustment methods can all adjust the cooling intensity of the fan, but the specific adjustment effects that can be achieved are slightly different. By selectively using one or more of the three adjustment methods, a wider range of adjustment and more refined adjustment of the cooling intensity can be sought, thereby better meeting the needs of users.

[0008] In a technical solution of the above control method, adjusting the position of the refrigeration component includes: translating and / or rotating the refrigeration component to change the ratio between the air flow entering the through hole and the air flow entering the shell.

[0009] Through such a configuration, a possible way of adjusting the position of the refrigeration component is provided. It is understandable that the refrigeration intensity adjustment range that can be achieved by adjusting the opening of the through hole or adjusting the operating parameters of the refrigeration component is limited by the structure of the refrigeration component itself, and adjusting the position of the refrigeration component in the above manner can make the refrigeration intensity adjustment range break through this limitation and obtain a larger adjustment range.

[0010] In a technical solution of the above-mentioned control method, the through holes include multiple ones, and adjusting the position of the refrigeration component includes: translating and / or rotating the refrigeration component so that: when the air guide component guides the air flow, part of the air passes through at least two of the through holes; or the refrigeration component includes multiple ones, and adjusting the position of the refrigeration component includes: adjusting the relative positions between the multiple refrigeration components so that when the air guide component guides the air flow, part of the air passes through the through holes of at least two of the refrigeration components.

[0011] This configuration provides another possible way to adjust the position of the refrigeration component. Adjusting the position of the refrigeration component in this way can significantly increase the refrigeration intensity in a certain area, thereby meeting the user's rapid and extreme demand.

[0012] In a technical solution of the above control method, the refrigeration component has a plurality of refrigeration zones, and the operating parameters include an on / off state of a refrigeration function of the refrigeration zones.

[0013] Through such a configuration, an optional operating parameter is provided. The advantage of adopting such an operating parameter is that it is easy to adjust and its influence on the refrigeration intensity can be stably predicted.

[0014] In a technical solution of the above control method, adjusting the operating parameters specifically includes: adjusting a specified number of the refrigeration zones to an open state or a closed state, and / or adjusting the refrigeration zones at specified positions to an open state or a closed state.

[0015] Such a configuration provides a possible way to adjust the operating parameters, which can achieve a more precise adjustment range.

[0016] In a technical solution of the above control method, the refrigeration component includes: a semiconductor refrigeration part, the through hole is located in the semiconductor refrigeration part, and a heat dissipation part, which is arranged on the heat generating side of the semiconductor refrigeration part; adjusting the operating parameters includes: adjusting the heat dissipation parameters of the heat dissipation part.

[0017] In a technical solution of the above control method, the heat dissipation part includes a heat dissipation pipe, which allows a cooling medium to flow therein so as to dissipate heat from the semiconductor refrigeration part; and the "adjusting the heat dissipation parameters of the heat dissipation part" includes: adjusting the cooling medium flow rate in the heat dissipation pipe.

[0018] In a technical solution of the above-mentioned control method, the fan includes: a storage element for storing the cooling medium, and a pumping element connected to the storage element and the heat dissipation pipe so as to pump the cooling medium to the heat dissipation pipe; the "adjusting the cooling medium flow in the heat dissipation pipe" includes: adjusting the pumping power of the pumping element.

[0019] Through such a configuration, several possible structures of the refrigeration component and optional operating parameters under these structures are provided.

[0020] In one technical solution of the above-mentioned control method, the fan includes: a second refrigeration component, at least a portion of the structure of the second refrigeration component extends into the storage component so that the cooling medium absorbs the heat generated when the second refrigeration component is working; the method includes: obtaining a refrigeration mode adjustment instruction; if the refrigeration mode adjustment instruction indicates adjustment to the sleep mode, turning off the refrigeration component and the pumping component, and turning on the second refrigeration component.

[0021] Through such a configuration, a more comfortable sleeping environment can be provided to the user.

[0022] A second aspect of the present invention provides a fan, comprising a controller, wherein the controller is configured to execute the control method as described in any of the above technical solutions.

[0023] A third aspect of the present invention provides a computer device, comprising a control module, wherein the control module is configured to execute the control method as described in any of the above technical solutions.

[0024] A fourth aspect of the present invention provides a computer-readable storage medium, which is suitable for storing multiple program codes, and the program codes are suitable for being loaded and run by a processor to execute the control method described in any of the above technical solutions.

[0025] It can be understood that the fan, the computer device and the computer-readable storage medium all have all the technical effects of any of the control methods described above, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The disclosure of the present invention will become more easily understood with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In addition, similar numbers in the figures are used to represent similar components, among which:

[0027] Figure 1 is a side view of a fan targeted by a control method according to an embodiment of the present invention;

[0028] Figure 2 yes Figure 1 A cross-sectional view of a fan in FIG.

[0029] Figure 3 yes Figure 1 An exploded view of the fan in the

[0030] Figure 4 is a flow chart of a fan control method according to an embodiment of the present invention;

[0031] Figure 5 yes Figure 1 A schematic diagram of the cooling structure of the cooling element of the central fan;

[0032] Figure 6 yes Figure 5 Schematic diagram of the structure of the heat generating side of the refrigeration component.

[0033] Reference numerals list :

[0034] 1: Shell; 11: Air inlet; 12: Air outlet; 2: Air guide; 3: Refrigeration part; 31: Through hole; 32: Semiconductor refrigeration part; 33: Heat dissipation part; 4: Storage part; 5: Pumping part. DETAILED DESCRIPTION

[0035] Some embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0036] An embodiment of the present invention provides a method for controlling a fan. The structure of the fan targeted by the control method will be described first below.

[0037] Figure 1 is a side view of a fan targeted by a control method according to an embodiment of the present invention, Figure 2 yes Figure 1 A cross-sectional view of the fan in FIG. Figure 3 yes Figure 1 Exploded view of the fan in the . Figure 1-Figure 3 The fan control method of this embodiment targets a fan including a housing 1 , an air guide member 2 , and a refrigeration member 3 .

[0038] The shell 1 has an air inlet 11 and an air outlet 12. In this example, the shell 1 is roughly in a cubic shape. The air inlet 11 and the air outlet 12 are respectively arranged on two opposite side walls of the shell 1. However, it can be understood that the shell 1 can have any suitable shape, and the air inlet 11 and the air outlet 12 can include one or more. The air inlet 11 and the air outlet 12 can be arranged at any suitable position of the shell 1. When the air inlet 11 includes multiple air inlets, the multiple air inlets 11 can be arranged on the same side of the shell 1, or on different sides of the shell 1. The same is true for the air outlet 12. Technical personnel in this field can make a selection according to actual needs.

[0039] The air guide 2 is arranged on the housing 1 and is located between the air inlet 11 and the air outlet 12. In the actual working process, it can guide the airflow from the air inlet 11 into the housing 1 and blow it out from the air outlet 12. The air guide 2 can be a fan commonly used in the field, such as a cross-flow fan and an axial flow fan. Those skilled in the art can select a suitable type of fan according to the positions of the air inlet 11 and the air outlet 12, and can determine the power parameters of the fan according to actual use requirements. Preferably, the air inlet 11 and the air outlet 12 can be arranged on the opposite side walls of the housing 1, and a cross-flow fan is used as the air guide 2 to reduce the wind resistance of the air during the flow.

[0040] The refrigeration component 3 is connected to the shell 1, and has a through hole 31 that allows air to pass through. It is understandable that in the prior art, in order to avoid affecting the air flow, the refrigeration structure is usually arranged parallel to the air flow direction, or is arranged perpendicular to the air flow direction (windward) only in a small range. However, in these settings, only a small part of the air flowing through the surface of the refrigeration structure can exchange heat with the refrigeration structure, resulting in a poor refrigeration effect. In this example, the refrigeration component 3 has a through hole 31 that allows air to pass through. The air can pass through the through hole 31 and is therefore cooled by the refrigeration component 3, so that a larger heat exchange area between the air and the refrigeration component 3 can be sought, and a better refrigeration effect can be obtained.

[0041] Those skilled in the art can select any suitable refrigeration device as the refrigeration element 3 according to actual needs, and construct it into a form with a through hole 31 to achieve the above-mentioned technical effect. For example, the refrigeration element 3 may include a semiconductor refrigeration device, which is a type of device that uses the thermoelectric effect of a semiconductor to produce cooling. After the power is turned on, electron-hole pairs are generated near the contact on one end, the internal energy is reduced, the temperature is lowered, and heat is absorbed from the outside, which is called the cold end. The other end increases the internal energy and the temperature rises due to the recombination of the electron-hole pairs, and releases heat to the environment, which is called the hot end. For another example, the refrigeration element 3 may be a device with a refrigerant medium inside, and these refrigerants can achieve a refrigeration effect by exchanging heat with the air. The refrigeration element 3 may also be other suitable devices with refrigeration functions, which those skilled in the art can select according to actual needs.

[0042] The refrigeration element 3 can be connected to any suitable position of the housing 1, for example, the refrigeration element 3 can be connected to the inner wall of the housing 1, or to the outer wall of the housing 1, or to other structures connected to the housing 1. In the case where the refrigeration element 3 is connected to the outer wall of the housing 1, the refrigeration element 3 can be connected to the outer wall corresponding to the air inlet 11, or to the outer wall corresponding to the air outlet 12, and in these cases, the refrigeration element 3 can be detachably connected to the housing 1, so that the refrigeration element 3 can be removed from the housing 1 without cooling the blown air. In the case where the refrigeration element 3 is connected to the inner wall of the housing 1, the refrigeration element 3 can be connected to only one inner wall of the housing 1, or to multiple inner walls at the same time. The refrigeration element 3 can include one or more refrigeration elements. In the case where the refrigeration element 3 includes multiple refrigeration elements, the multiple refrigeration elements 3 can be connected to the same wall of the housing 1, or can be connected to different walls of the housing 1 (including the inner wall and the outer wall) respectively. Those skilled in the art can set the refrigeration element 3 at any suitable position according to actual needs, as long as it can cool the air flowing out of the housing 1.

[0043] As a preferred embodiment, the refrigeration component 3 can be arranged at a position corresponding to the air inlet 11 inside the housing 1, so that when the air guide 2 guides the air flow, the air flows through the air inlet 11, the through hole 31 and the air outlet 12 in sequence. This arrangement will bring about a better cooling effect. In the case where there are multiple air inlets 11, there can also be multiple refrigeration components 3, and the multiple refrigeration components 3 can be respectively arranged at positions corresponding to each air inlet 11, so that the air flowing into the multiple air inlets 11 can all pass through the through hole 31 and be cooled by the refrigeration component 3.

[0044] In one possible implementation, refer to Figure 3, part of the structure of the refrigeration component 3 is a plate-like structure. However, it can be understood by those skilled in the art that the refrigeration component 3 can have any suitable structural form, such as at least a part of the structure of the refrigeration component 3 can also be any one of an annular structure, a cylindrical structure, a columnar structure, or even an irregular structure, and the refrigeration component 3 can have multiple of the above-mentioned structural forms at the same time. In the case where the refrigeration component 3 includes multiple refrigeration components 3, the structural forms of the multiple refrigeration components 3 can be the same or different, and those skilled in the art can choose according to actual needs. Compared with other structures, the refrigeration component 3 with a plate-like structure has a larger cooling area under the premise of the same volume.

[0045] The through hole 31 may also have any suitable structural form. For example, the cross-sectional shape of the through hole 31 may be rectangular, circular, triangular or even irregular. The through hole 31 may be a straight hole, a curved hole or even an irregular hole, as long as air can pass through it. The through hole 31 may be set at any suitable position of the refrigeration component 3. The through hole 31 may include one or more. In the case where the through hole 31 includes multiple through holes, the shape, size, extension direction, etc. of the through hole 31 may be the same, different or not completely the same. As described above, the structure of the refrigeration component 3 may be a structure having a hollow part such as an annular structure or a cylindrical structure. In this case, the hollow structure of the refrigeration component 3 may be used as a through hole 31. On this basis, other through holes 31 may no longer be set, or other through holes 31 may continue to be set. Those skilled in the art may flexibly set it according to actual use requirements.

[0046] In a possible implementation, still referring to Figure 3 In the case where at least a part of the structure of the refrigeration component 3 is a plate-like structure, the through hole 31 may include a plurality of through holes 31, and the plurality of through holes 31 may be distributed on the plate-like structure. Through such a structure, the plurality of through holes 31 can produce a flow-equalizing effect on the air, thereby increasing the heat exchange area between the air and the refrigeration component 3, and seeking a better refrigeration effect. In this case, preferably, the structure, size, etc. of the plurality of through holes 31 may be the same, and they may be evenly distributed on the plate-like structure, for example, in a grid-like distribution, a concentric circle-like distribution, a honeycomb-like distribution, etc., to seek a better flow-equalizing effect. Of course, those skilled in the art may also set the through holes 31 on the plate-like structure in any other suitable manner according to actual needs.

[0047] In a possible implementation, the extension direction of the plate-like structure can be perpendicular to the air flow direction in the housing 1, or at least form an angle. In other words, the plate-like structure can be arranged facing the wind, and the advantage of the windward arrangement is that the range of air that the refrigeration element 3 can contact can be increased, thereby obtaining a better cooling effect. Since the plate-like structure has a plurality of through holes 31, the windward arrangement of the plate-like structure does not result in a reduction in the fan air volume.

[0048] In a possible implementation, the projection of the plate-like structure on the plane where the air inlet 11 is located can cover the air inlet 11. With such a configuration, almost all of the air flowing through the air inlet 11 will contact the refrigeration element 3 and be cooled, thereby achieving a better cooling effect.

[0049] The fan control method provided by the present invention will be described below. The fan control method can be applied to the fan described in any of the above embodiments to adjust the cooling intensity thereof.

[0050] Reference Figure 4 , the fan control method provided by the embodiment of the present invention includes:

[0051] Step S401: When the fan is in operation, a cooling intensity adjustment instruction is obtained.

[0052] Step S402: selectively adjusting the opening of the through hole, the position of the refrigeration component and / or the operating parameters of the refrigeration component according to the refrigeration intensity adjustment instruction.

[0053] In step S401, the cooling intensity adjustment instruction may be any instruction indicating the cooling intensity adjustment action, or an instruction involving the cooling intensity adjustment action during execution. In some cases, in addition to indicating the cooling intensity adjustment action, the cooling intensity adjustment instruction may also indicate other actions, such as air volume and wind speed adjustment.

[0054] Further, in step S401, the refrigeration intensity adjustment instruction may be obtained in any suitable manner, for example, the refrigeration intensity adjustment instruction input by the user may be received. For another example, the refrigeration intensity adjustment instruction may be generated by parsing other instructions input by the user, such as the user inputting the desired temperature, and the refrigeration intensity adjustment instruction is generated according to the user's desired temperature and the current ambient temperature. For another example, the current ambient temperature may be obtained, and the refrigeration intensity adjustment instruction may be automatically generated according to the current ambient temperature and a pre-set control logic. Those skilled in the art may make settings according to actual needs, and there is no limitation to this.

[0055] In step S402, the opening of the through hole 31, the position of the refrigeration component 3 and / or the operating parameters of the refrigeration component 3 may be selectively adjusted according to the refrigeration intensity adjustment instruction to adjust the refrigeration intensity of the fan to be compatible with the refrigeration intensity adjustment instruction.

[0056] As an example, a mapping table between refrigeration intensity and through-hole opening, refrigeration component operating parameters, and refrigeration component position may be prepared in advance, and after obtaining a refrigeration intensity adjustment instruction, the adjustment may be completed according to the mapping table.

[0057] The above three adjustment methods can all adjust the cooling intensity, but the specific adjustment effects that can be achieved are slightly different. By selectively using one or more of the three adjustment methods, it is possible to seek fine adjustment of the cooling intensity, thereby better meeting the needs of users. When faced with different cooling intensity adjustment instructions, the specific adjustment methods to be selected for adjustment can be determined by those skilled in the art based on the specific adjustment effects that can be achieved by the above three adjustment methods in the targeted fans. The relevant parts below will also give some examples, which will not be repeated here.

[0058] The following will describe the cooling intensity adjustment effects that can be achieved by the above three adjustment methods respectively.

[0059] Regarding adjusting the opening of through hole 31:

[0060] It can be understood that when the opening of the through hole 31 changes, the amount of air allowed to pass through the through hole 31 will change, resulting in a change in the contact area between the refrigeration component 3 and the air, which in turn causes a change in the refrigeration intensity. At the same time, when the opening of the through hole 31 changes, it will also affect the wind resistance of the fan to a certain extent, resulting in changes in the wind speed, wind volume, etc. of the fan. Therefore, when the refrigeration intensity adjustment instruction indicates the adjustment of the refrigeration intensity while also indicating the adjustment of the wind volume, wind speed, etc., it can be preferred to adjust the opening of the through hole 31.

[0061] Adjusting the opening of the through hole 31 here may refer to continuously adjusting the opening of the through hole 31 between 0 and the maximum opening, or may refer to jumpily adjusting the opening of the through hole 31 between 0 and the maximum opening, or between 0, the maximum opening, and one or more openings within the range of 0 and the maximum opening. In the case where there are multiple through holes 31, the openings of the multiple through holes 31 may be adjusted synchronously, or the opening of each through hole 31 may be adjusted separately.

[0062] As a way to adjust the opening of the through hole 31, an opening adjustment mechanism may be provided at the through hole 31, which may include a movable baffle structure and a driving structure capable of driving the baffle structure to move to adjust the opening, and the opening of the through hole 31 may be adjusted by sending instructions to the opening adjustment mechanism. Obviously, those skilled in the art may also adjust the opening of the through hole 31 by adopting other structures, and may specify a corresponding control method according to the specific structure adopted.

[0063] About adjusting the operating parameters of refrigeration unit 3:

[0064] The operating parameters of the refrigeration element 3 may include all parameters that can affect the refrigeration capacity of the refrigeration element 3. For example, when the refrigeration element 3 includes a semiconductor refrigeration device, the operating parameters may include whether the semiconductor refrigeration device is turned on or not, the operating current of the semiconductor refrigeration device, etc. For another example, when the refrigeration element 3 includes a structure provided with a refrigeration medium, the operating parameters may include the circulation efficiency of the refrigeration medium, etc. This adjustment method will hardly change the air volume of the fan while adjusting the refrigeration intensity.

[0065] When adjusting the operating parameters of the refrigeration component 3, only one operating parameter may be adjusted, or multiple operating parameters may be adjusted simultaneously. When different refrigeration intensity adjustment instructions are obtained, the adjusted operating parameters may be the same or different. Technical personnel in this field may make adjustments according to actual needs without limitation.

[0066] About adjusting the position of refrigeration unit 3:

[0067] It is understandable that when the position of the refrigeration element 3 changes, the refrigeration range of the refrigeration element 3, the contact area between the refrigeration part and the air, etc. will change accordingly, thereby causing the refrigeration intensity to change. This adjustment method will hardly change the air volume of the fan while adjusting the refrigeration intensity.

[0068] Further, it can be understood that, when the position of the refrigeration component 3 remains unchanged, whether it is adjusting the opening of the through hole 31 or adjusting the operating parameters of the refrigeration component 3, the adjustment range that can be achieved is limited by the structure of the refrigeration component 3 itself. This limitation can be overcome to a certain extent by adjusting the position of the refrigeration component 3. For example, when the opening of the through hole 31 is adjusted to the maximum and the operating parameters of the refrigeration component 3 are adjusted to the highest, the refrigeration component 3 itself reaches the maximum refrigeration intensity. On this basis, if the position of the refrigeration component 3 is adjusted to increase the contact area between the refrigeration side and the air, the refrigeration intensity can be further improved. Combining this adjustment method with the adjustment method described above can seek a larger adjustment range or a more refined adjustment range, thereby better meeting the needs of users.

[0069] As an implementation method of adjusting the position of the refrigeration component 3, a driving mechanism connected to the refrigeration component 3 may be provided, and a command may be sent to the driving mechanism to drive the refrigeration component 3 to move so as to change the position of the refrigeration component 3. Those skilled in the art may reasonably select the driving mechanism and set the range of the position of the refrigeration component 3 to be allowed to be adjusted according to the specific position adjustment method to be implemented, and this is not limited.

[0070] The following will be Figure 1-Figure 3 , Figure 4 and Figure 5Taking the fan shown in FIG. 1 as an example, specific implementation methods of the above three adjustment methods are described respectively.

[0071] Regarding the adjustment of the opening of through hole 31:

[0072] In one possible implementation, refer to Figure 2 , the through hole 31 may include multiple through holes 31. In this case, when adjusting the opening of the through hole 31, the opening of the multiple through holes 31 can be adjusted synchronously, for example, the opening of the multiple through holes 31 can be adjusted from 50% to 70%. Alternatively, the through holes 31 can be divided into multiple control groups. When adjusting the opening of the through holes 31, the opening of the through holes 31 in each group can be adjusted synchronously, and the opening of the through holes 31 between different groups can be adjusted separately. Alternatively, the opening of each through hole 31 can also be controlled separately. Those skilled in the art can reasonably select the control method according to actual use requirements, which will not be repeated here.

[0073] In a possible implementation, the opening adjustment of the through hole 31 may be associated with the adjustment of the operating parameters of the refrigeration component 3. For example, while adjusting the operating parameters of the refrigeration component 3 to increase its refrigeration intensity, the through hole 31 may be synchronously adjusted to increase its opening.

[0074] In a possible implementation, the opening adjustment of the through holes 31 may also be associated with the position adjustment of the refrigeration component 3. For example, some through holes 31 may no longer have air flowing through them due to the adjustment of the position of the refrigeration component 3. In this case, these through holes 31 may be synchronously adjusted to have an opening of 0.

[0075] About adjusting the position of refrigeration unit 3:

[0076] In a possible implementation, the ratio between the air flow entering the through hole 31 and the air flow entering the shell 1 can be changed by translating and / or rotating the refrigeration element 3. As described above, the through hole 31 may include one or more. In the case where the through hole 31 includes more than one, the air flow in the through hole 31 here refers to the total flow of air in the multiple through holes 31. It can be understood that the air passing through the through hole 31 can have a relatively sufficient contact with the refrigeration element 3, so the degree of cooling will be higher than the air that does not pass through the through hole 31. When the ratio between the air flow entering the through hole 31 and the air flow entering the shell 1 changes, it means that the proportion of air passing through the through hole 31 changes, thereby changing the overall cooling intensity.

[0077] by Figure 2 Take the refrigeration element 3 with a middle plate structure as an example. Figure 2In the position shown in the figure, the projection range of the refrigeration component 3 on the plane where the air inlet 11 is located completely covers the air inlet 11, and the ratio between the air flow rate entering the through hole 31 and the air flow rate entering the shell 1 is close to 1. If the refrigeration component 3 is translated vertically upward or downward, or the refrigeration component 3 is rotated with the central axis of the shell 1 in the vertical direction as the rotation axis, after the translation and rotation, part of the through holes 31 will no longer face the air inlet, and the flow rate of the part of the through holes 31 will be reduced, thereby causing the ratio between the air flow rate in the through holes 31 and the air flow rate entering the shell 1 to change. Those skilled in the art can reasonably plan the path of the driving member when driving the refrigeration component 3 to move according to the specific spatial layout in the shell 1, the specific structural form of the refrigeration component 3, etc., which will not be repeated here.

[0078] In a possible implementation manner, when there are multiple refrigeration components 3 , the above adjustment method may be used to adjust the position of each refrigeration component 3 respectively.

[0079] In a possible implementation, the through holes may include multiple ones, and the refrigeration component 3 may be translated and / or rotated so that part of the air passes through at least two through holes 31. In this embodiment, the refrigeration component 3 may be configured as, for example, an arc-shaped plate structure, so that, at a certain angle, air passes through two or more through holes 31 of the refrigeration component 3.

[0080] Alternatively, the refrigeration element 3 may include multiple refrigeration elements 3, and the relative positions of the multiple refrigeration elements 3 may be adjusted to allow part of the air to pass through the respective through holes of at least two refrigeration elements 3.

[0081] It can be understood that each time the air passes through a through hole 31, it will undergo a relatively sufficient heat exchange with the refrigeration component 3, and through the above adjustment, part of the air will pass through at least two through holes 31, or, pass through the through holes 31 of at least two refrigeration components 3, that is, this part of the air will undergo at least two heat exchanges with the refrigeration component 3, thereby, the intensity of cooling this part of the air will be improved.

[0082] One advantage of this adjustment method is that it can significantly increase the cooling intensity in a certain area, meeting the user's demand for rapid cooling. Figure 2Similarly, the plate-like structure can completely cover the air inlet 11. In this use state, the temperature of the air blown out by the fan will be more uniform. In the second use state, the two refrigeration components 3 can be adjusted to a state where they completely overlap each other when viewed from the air flow direction. In this way, part of the air will flow through the through holes 31 of the two refrigeration components 3 in turn. The cool feeling of this part of the air after being blown out will be greatly increased compared to the first use state, meeting the user's rapid cooling needs.

[0083] Obviously, in this embodiment, there is no limit to the number of refrigeration components 3. Those skilled in the art may determine the specific number of refrigeration components 3 and the possible positional relationship between the refrigeration components 3 according to actual needs, which will not be elaborated here.

[0084] Regarding adjusting the operating parameters of refrigeration element 3.

[0085] In one embodiment, the refrigeration component 3 may have multiple refrigeration zones, and the operating parameters may include the on / off status of the refrigeration function of the refrigeration zone. Those skilled in the art may select a suitable method to enable the refrigeration component 3 to form multiple refrigeration zones in which the refrigeration function can be independently turned on or off, according to the type of refrigeration component 3 specifically used. For example, when the refrigeration component 3 includes a semiconductor refrigeration device, the semiconductor refrigeration device can be divided into multiple groups, and the power supply of the semiconductor refrigeration device of each group can be independently controlled, thereby forming multiple refrigeration zones. The advantage of using such operating parameters is that they are easy to adjust, and the degree of their influence on the refrigeration intensity can be stably predicted.

[0086] Furthermore, in the above embodiment, when adjusting the operating parameters of the refrigeration component 3, a specified number of refrigeration zones may be adjusted to an open state or a closed state, and / or refrigeration zones at designated positions may be adjusted to an open state or a closed state.

[0087] It is understandable that the number of refrigeration zones opened will directly affect the refrigeration intensity. The more refrigeration zones opened, the higher the refrigeration intensity. When the number of refrigeration zones opened is the same, the different locations of the opened refrigeration zones may also lead to different refrigeration intensities. Therefore, when adjusting the operating parameters, you can only adjust the number of openings, or you can adjust both the number of openings and the locations of the opened refrigeration zones at the same time to seek a more precise adjustment range.

[0088] Similarly, in a possible implementation, the refrigeration component 3 may include multiple components, and the operating parameters may include the on / off state of the refrigeration component 3. When adjusting the operating parameters of the refrigeration component 3, a specified number of refrigeration components may be adjusted to an on state or a off state, and / or, a refrigeration component at a specified position may be adjusted to an on state or a off state. In the case where the refrigeration component 3 includes multiple components, each refrigeration component 3 may further include multiple refrigeration partitions, and those skilled in the art may set them according to actual needs.

[0089] In one embodiment, reference Figure 5 and Figure 6 , the refrigeration element 3 may include a semiconductor refrigeration portion 32 and a heat dissipation portion 33. The semiconductor refrigeration portion 32 may include the semiconductor refrigeration device described above, and the through hole 31 may be provided on the semiconductor refrigeration plate 32. The semiconductor refrigeration portion 32 has a refrigeration side (corresponding to the cold end of the semiconductor device) and a heat generating side (corresponding to the hot end of the semiconductor device).

[0090] Figure 5 and Figure 6 The schematic diagrams of the structures of the cooling side and the heat generating side of the semiconductor refrigeration unit 32 are shown respectively. Figure 6 The heat dissipation unit 33 can be arranged on the heat generating side of the semiconductor refrigeration unit 32 to dissipate heat therefrom, thereby ensuring that the refrigeration side of the semiconductor refrigeration unit can continuously and high-quality refrigeration. In this case, the operating parameters may also include the heat dissipation efficiency of the heat dissipation unit 33.

[0091] It is understandable that, for semiconductor devices, when the cold end and the hot end reach a certain temperature difference, a balance point will be reached, at which time the temperature of the cold and hot ends will not continue to change, and the heat dissipation portion 33 is set to reduce the temperature of the hot end, thereby reducing the temperature of the cold end. Based on this, when the heat dissipation efficiency of the heat dissipation portion 33 increases, the temperature of the cooling side of the cooling element 3 will be reduced, and when the heat dissipation effect of the heat dissipation portion 33 decreases, the temperature of the cooling side of the cooling element 3 will be increased, thereby achieving the adjustment of the cooling intensity.

[0092] In one possible implementation, refer to Figure 6 The heat dissipation part 33 includes a heat dissipation pipe arranged around the through hole, and the heat dissipation pipe allows a cooling medium to flow therein so as to dissipate heat for the semiconductor refrigeration part 33. The cooling medium here can be water, ice, ice crystals, dry ice, etc., and the user can select a suitable medium as the cooling medium according to his own conditions. This heat dissipation method can achieve a better heat dissipation effect, thereby ensuring a better refrigeration effect. The heat dissipation pipe is arranged around the through hole 31 to ensure a better heat dissipation effect. Obviously, the heat dissipation pipe can also be arranged in other ways, such as being arranged around the edge of the heat-generating side of the semiconductor refrigeration part 32, and those skilled in the art can choose according to actual needs.

[0093] In this case, the heat dissipation efficiency of the heat dissipation part 33 can be adjusted by adjusting the flow rate of the cooling medium in the heat dissipation pipe. Obviously, the arrangement of the heat dissipation part 33 is not limited to this. For example, the heat dissipation part 33 can also be a radiation heat dissipation device such as a heat dissipation fin, and its heat dissipation efficiency can be adjusted by adjusting its extension direction. For another example, the heat dissipation part 33 can be a heat dissipation fan, and its heat dissipation efficiency can be adjusted by adjusting its power.

[0094] In one possible approach, referring to Figure 2 The fan may be provided with a storage element 4 and a pumping element 5. The storage element 4 is used to store the cooling medium, and the pumping element 5 is used to pump the cooling medium in the storage element 4 into the heat dissipation pipe, thereby realizing a continuous supply of the cooling medium. The storage element 4 may be any suitable container, which may be arranged inside the housing 1 or outside the housing 1, and the pumping element 5 may be any suitable pump structure. The pumping element 5 may be arranged to pump the cooling medium flowing out of the heat dissipation pipe back into the storage element 4, or may be arranged to pump the cooling medium flowing out of the heat dissipation pipe to other locations, such as a sewer, etc., and those skilled in the art may select according to actual needs.

[0095] In this case, the flow rate of the cooling medium in the heat dissipation pipe can be adjusted by adjusting the power of the pumping member 5. Obviously, the method of conveying the cooling medium to the heat dissipation pipe is not limited to this. For example, the heat dissipation pipe can be connected to the tap water pipe so that the tap water flows into the heat dissipation pipe as the cooling medium. This method can avoid the noise caused by the operation of the pumping member 5, but it may cause a waste of water resources to a certain extent. In addition, the temperature of the tap water cannot be artificially controlled and may not meet the heat dissipation requirements at certain times. In this case, a structure such as a throttle valve can be set in the heat dissipation pipe to adjust the flow rate of the cooling medium.

[0096] Furthermore, in the above embodiment, the refrigeration component 3 needs to turn on the pumping component 5 during the refrigeration process. Although this will bring a better refrigeration effect, it will also cause the fan to have a larger noise during cooling. In some cases, such as when sleeping, the user does not require a very good cooling effect, but would like the fan to run as quietly as possible.

[0097] To this end, in some embodiments, the fan may also include a second refrigeration element (not shown in the figure), and at least a portion of the structure of the second refrigeration element may extend into the storage element 4 so that the cooling medium in the storage element 4 absorbs the heat generated when the second refrigeration element is working.

[0098] The second refrigeration element can be a refrigeration element of the same type as the refrigeration element 3, or a refrigeration element of a different type from the refrigeration element 3, and there is no limitation on this. Compared with the refrigeration element 3, the second refrigeration element dissipates heat by direct contact with the cooling medium, and the heat dissipation efficiency is relatively low, and the refrigeration effect is relatively poor, but the advantage of the second refrigeration element is that it does not need to turn on the pumping element 5 when working, so it can well meet the user's use needs when sleeping.

[0099] In this case, the control method may further include: obtaining a cooling mode adjustment instruction, and if the cooling mode adjustment instruction indicates adjustment to the sleep mode, turning off the cooling element 3 and the pumping element 5, and turning on the second cooling element, thereby providing a more comfortable sleeping environment for the user. In other modes other than the sleep mode, the second cooling element may remain in a closed state or in an open state, and those skilled in the art may set it according to actual needs, and there is no limitation on this.

[0100] The present invention also provides a fan, which includes a controller, and the controller is configured to execute the control method described in any of the above embodiments.

[0101] The present invention also provides a computer device, which includes a control module, and the control module is configured to execute the control method described in any of the above embodiments.

[0102] In the description of the present invention, "control module" may include hardware, software or a combination of the two. A module may include hardware circuits, various suitable sensors, communication ports, memory, and may also include software parts, such as program code, or a combination of software and hardware. The processor may be a central processing unit, a microprocessor, an image processor, a digital signal processor or any other suitable processor. The processor has data and / or signal processing functions. The processor may be implemented in software, hardware or a combination of the two. Non-temporary computer-readable storage media include any suitable media that can store program code, such as a disk, a hard disk, an optical disk, a flash memory, a read-only memory, a random access memory, etc.

[0103] Further, it should be understood that since the setting of the control module is only for illustrating the functional unit corresponding to the control method of the present invention, the physical device corresponding to the control module can be the processor itself, or a part of the software in the processor, a part of the hardware, or a part of the combination of software and hardware. Therefore, the number of control modules is only one and is only schematic. It can be understood by those skilled in the art that the control module can be adaptively split according to actual conditions. The specific splitting form of the control module will not cause the technical solution to deviate from the principle of the present invention. Therefore, the technical solutions after splitting will fall within the protection scope of the present invention.

[0104] The present invention also provides a computer-readable storage medium, which is suitable for storing a plurality of program codes, and the program codes are suitable for being loaded and run by a processor to execute the control method described in any of the above embodiments.

[0105] It is understood by those skilled in the art that all or part of the processes in the fan control method of the present invention can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of each of the above-mentioned method embodiments can be implemented. Among them, the computer program includes a computer program code, and it can be understood that the program code includes but is not limited to the program code for executing the above-mentioned fan control method. For the convenience of explanation, only the part related to the present invention is shown. The computer program code can be in the form of source code, object code, executable file or some intermediate form. The computer-readable storage medium may include: any entity or device, medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory, random access memory, electric carrier signal, telecommunication signal and software distribution medium that can carry the computer program code. It should be noted that the content contained in the computer-readable storage medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable storage medium does not include electric carrier signal and telecommunication signal.

[0106] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A method for controlling a fan, characterized in that: The fan comprises: A housing having an air inlet and an air outlet; An air guide member, which is arranged on the housing and located between the air inlet and the air outlet; A refrigeration element connected to the housing, wherein the refrigeration element has a through hole allowing air to pass through, so that: when the air guide element guides the air flow, the air can pass through the through hole and thus be cooled by the refrigeration element; the control method comprises: In the fan running state, obtaining a cooling intensity adjustment instruction; According to the refrigeration intensity adjustment instruction, the opening of the through hole, the position of the refrigeration component and / or the operating parameters of the refrigeration component are selectively adjusted.

2. The method according to claim 1, characterized in that Adjusting the position of the refrigeration component includes: The refrigeration element is translated and / or rotated to change the ratio between the air flow entering the through hole and the air flow entering the shell.

3. The method according to claim 1 or 2, characterized in that: The through holes include a plurality of holes, and adjusting the position of the refrigeration component includes: The refrigeration element is translated and / or rotated so that: when the air guide element guides the air flow, part of the air passes through at least two of the through holes; and / or The refrigeration components include a plurality of components, and adjusting the positions of the refrigeration components includes: The relative positions of the plurality of refrigeration components are adjusted so that, when the air guide component guides the air flow, part of the air passes through the respective through holes of at least two of the refrigeration components.

4. The method according to claim 1, characterized in that: The refrigeration component has a plurality of refrigeration zones, and the operating parameters include an on / off state of a refrigeration function of the refrigeration zones.

5. The method according to claim 4, characterized in that Adjusting the operating parameters specifically includes: A specified number of the refrigeration zones are adjusted to an open state or a closed state, and / or, the refrigeration zones at specified positions are adjusted to an open state or a closed state.

6. The method according to claim 1, characterized in that The refrigeration element comprises: A semiconductor refrigeration unit, wherein the through hole is located in the semiconductor refrigeration unit, and A heat dissipation unit, which is arranged on the heat generating side of the semiconductor refrigeration unit; Adjusting the operating parameters includes: Adjust the heat dissipation parameters of the heat dissipation unit.

7. The method according to claim 6, characterized in that The heat dissipation part includes a heat dissipation pipeline, and the heat dissipation pipeline allows a cooling medium to flow therein so as to dissipate heat for the semiconductor refrigeration part; The “adjusting the heat dissipation parameters of the heat dissipation unit” includes: Adjust the cooling medium flow in the heat dissipation pipeline.

8. A fan, comprising a controller, characterized in that: The controller is configured to execute the control method according to any one of claims 1 to 7.

9. A computer device, characterized in that: The computer device comprises a control module, and the control module is configured to execute the control method according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium is suitable for storing a plurality of program codes, and the program codes are suitable for being loaded and run by a processor to execute the control method according to any one of claims 1 to 7.

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