Variable heat pipe thickness and diameter for direct heat pipe attachment and improved thermal management

Abstract

The disclosure relates to variable heat pipe thickness and diameter for direct heat pipe attachment and improved thermal management. Techniques for manufacturing heat pipes including variable wall thickness and / or variable diameter are disclosed. The heat pipe may be formed by thickness processing and expansion processing of the pipe. The heat pipe may include a first portion and a second portion. The first portion may have a first diameter and a first wall thickness. The second portion may have a second diameter greater than the first diameter, and a second wall thickness greater than the first wall thickness.

Description

Technical Field

[0001] The present disclosure relates generally to heat pipes and methods of making heat pipes, including heat pipes having variable tube thickness and diameter for improved thermal management. Background Art

[0002] A heat pipe is an efficient heat transfer device for transferring heat energy from a heat source to a heat sink. It relies on the principles of phase change and capillary action to achieve fast and efficient heat transfer. A heat pipe is usually composed of a sealed vacuum tube containing a working fluid, such as water, methanol, ammonia, or a refrigerant. The operation of a heat pipe is based on a heat transfer cycle involving evaporation, condensation, and phase change. When heat is applied to the evaporator portion of the heat pipe, the working fluid absorbs heat and undergoes a phase change from liquid to vapor. Driven by the pressure gradient established within the system, the generated steam flows toward the cooler end of the heat pipe.

[0003] Traditional heat pipe arrangements include a cold plate to improve the overall performance and efficiency of the heat pipe system. A cold plate is typically a flat metal plate that is thermally connected to a heat sink or component to be cooled. It acts as an interface between the heat pipe and the heat sink, facilitating efficient heat transfer. Using a cold plate requires an increased footprint while adding additional thickness to the heat pipe system.

[0004] The main purpose of a cold plate is to spread the heat transferred by the heat pipes over a larger surface area, thereby improving heat dissipation. It helps achieve uniform temperature distribution and reduce hot spots, especially when dealing with high heat loads or localized heat sources. Cold plates often have fins or other cooling structures to enhance convective heat transfer to the surrounding air. Summary of the invention

[0005] According to one aspect of the present disclosure, a heat pipe is provided, comprising: a first portion including: a first diameter and a first wall thickness; and a second portion including: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness.

[0006] According to another aspect of the present disclosure, a heat pipe is provided, comprising: a first portion extending a first length and having a first wall thickness and a first width; and a second portion extending a second length and having a second wall thickness greater than the first wall thickness and a second width greater than the first width.

[0007] According to another aspect of the present disclosure, a method for forming a heat pipe is provided, the heat pipe having a first portion and a second portion, the method comprising: performing thickness processing on the heat pipe to increase the wall thickness of the first portion of the heat pipe to form a thickened heat pipe including the first portion and the second portion, the first wall thickness of the first portion being greater than the second wall thickness of the second portion; and performing expansion processing on the thickened heat pipe to increase the diameter of the first portion of the thickened heat pipe to form an expanded heat pipe including the first portion and the second portion, the first diameter of the first portion being greater than the second diameter of the second portion.

[0008] According to another aspect of the present disclosure, a system is provided, comprising: a heat pipe, comprising: a first portion, comprising: a first diameter and a first wall thickness; a second portion, comprising: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness, wherein the second portion of the heat pipe is configured to be thermally connected to a heat source; and a heat dissipator, configured to dissipate heat from the first portion of the heat pipe, wherein the heat pipe is configured to transfer heat generated by the heat source from the second portion to the first portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings, which are incorporated herein and constitute a part of this specification, illustrate the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and enable those skilled in the relevant art to make and use the techniques discussed herein.

[0010] Figure 1 A heat pipe system according to the present disclosure is shown, the heat pipe system including heat pipes having variable thickness and diameter.

[0011] Figure 2 A heat pipe system according to the present disclosure is shown, the heat pipe system including heat pipes having variable thickness and diameter.

[0012] Figure 3A-3C Including the edge according to the present disclosure Figure 3D The cross-sectional view of the heat pipe thickness processing mold obtained by the line 3D-3D shown, wherein Figure 3A-3B The process flow of the heat pipe thickness machining operation is shown.

[0013] Figure 3D is a top view of a heat pipe thickness processing mold according to the present disclosure, including a cross-sectional line 3D-3D.

[0014] Figure 4A-4C Including the edge according to the present disclosure Figure 4D The cross-sectional view of the heat pipe expansion processing mold obtained by the line 4D-4D shown, wherein Figure 4A-4C The process flow of the heat pipe expansion processing operation is shown.

[0015] Figure 4D is a top view of a heat pipe expansion processing mold according to the present disclosure, including cross-sectional line 4D-4D.

[0016] Figure 5 An operational flow chart of a method of forming a heat pipe having a variable thickness and diameter according to the present disclosure is shown.

[0017] The present disclosure will be described with reference to the accompanying drawings. The drawing in which an element first appears is generally indicated by the leftmost digit(s) in the corresponding reference number. DETAILED DESCRIPTION

[0018] The following detailed description refers to the accompanying drawings, which illustrate exemplary details in which the present disclosure can be implemented. In the following description, many specific details are set forth to provide a thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that various designs (including structures, systems and methods) can be implemented without these specific details. The description and presentation herein are common means for those experienced personnel or technicians in the art to most efficiently convey the substance of their work to other technicians in the art. In other cases, well-known methods, procedures and components are not described in detail to avoid unnecessarily obscuring the present disclosure.

[0019] The present disclosure provides an advantageous solution to improve the transfer of thermal energy from a heat source to a heat sink and improve heat dissipation without the need for a cold plate between the heat pipe and the heat source. The present disclosure provides a heat pipe with variable tube thickness and / or diameter for improved thermal management while reducing the overall size of the heat pipe system by not requiring a cold plate.

[0020] Figure 1 1 shows a heat pipe system 100 according to the present disclosure. The heat pipe system 100 may include a heat pipe 110 including a first portion 116 and a second portion 118. The first portion 116 and the second portion 118 may be located at opposite ends of the heat pipe 110, but other configurations are possible (e.g., see Figure 2 ).

[0021] Heat pipe 110 can be a sealed vacuum tube. Heat pipe 110 can be made of one or more metals, metal alloys, superalloys, and / or other materials with high thermal conductivity. For example, heat pipe 110 can be made of copper, aluminum, or other metals or metal alloys. The inner cavity formed in heat pipe 110 can contain a working fluid, for example, water, methanol, ammonia and / or a refrigerant.

[0022] According to the present disclosure, the first portion 116 may be a thin-walled portion 116, and the second portion 118 may be a thick-walled portion 118 having a greater wall thickness when compared to the wall thickness of the thin-walled portion 116. Figure 1 As shown, the heat pipe system 100 can be installed in a device 102, such as an electronic device (e.g., a computer, a mobile phone, or other electronic device where thermal management may be required). The increased wall thickness in the thick wall portion 118 provides a greater thermal mass compared to the thin wall portion 116 of the heat pipe 110, thereby providing increased heat absorption and / or heat dissipation.

[0023] In an example installation, the first end 112 can be thermally connected to a heat sink (or other heat / heat dissipater) 108 (e.g., a fan), and the second end 114 can be connected to a heat source 106, such as an integrated circuit (e.g., a processor, etc.). For example, the heat source can be a die 106 of a system-on-chip (SOC) package 104. The heat pipe 110 can be configured to transfer heat from one portion of the heat pipe 110 to another portion. For example, the heat pipe 110 can transfer heat (e.g., heat generated by the heat source 106 and transferred to the second end 114) from the second end 114 to the first end 112. The heat transferred to the first end 112 can then be transferred to and / or dissipated by the heat sink 108. For example, the fan 108 can generate an airflow to cool the first end 112 of the heat pipe 110 and / or cool a heat sink (e.g., a heat sink) thermally connected to the first end 112.

[0024] like Figure 1 As shown, the first end 112 can be located in the thin-walled portion 116 of the heat pipe 110, and the second end 114 can be located in the thick-walled portion 118. For example, the thin-walled portion 116 can have a first wall thickness, and the thick-walled portion 118 can have a second wall thickness greater than the first wall thickness. According to the present disclosure, the wall thickness of the thin-walled portion 116 of the heat pipe 110 can have a wall thickness that is the same or similar to the original wall thickness of the tube material used to manufacture the heat pipe 110, while the thick-walled portion 118 of the heat pipe 110 can have a greater wall thickness, wherein the original wall thickness of the tube material is increased during the manufacturing process of the heat pipe 110. According to the present disclosure, the heat pipe 110 having the thin-walled portion 116 and the thick-walled portion 118 can be formed by a single tube structure. Alternatively, the thin-walled portion 116 can be a first tube structure, and the thick-walled portion 118 can be a second tube structure having an increased wall thickness compared to the first tube structure, wherein the first tube structure and the second tube structure are coupled together to form the heat pipe 110.

[0025] According to the present disclosure, the second end 114 of the heat pipe 110 can have a larger diameter than the diameter of the first end 112. For example, the thin-walled portion 116 can have a first diameter, and the thick-walled portion 118 can have a second diameter that is larger than the first diameter. That is, the heat pipe 110 can have a variable diameter along its length and / or can have a variable wall thickness along its length. According to the present disclosure, the wall thickness can vary from the thin-walled portion 116 to the thick-walled portion 118, and / or the diameter of the heat pipe 110 can vary from the first end 112 to the second end 114. Although Figure 1 The heat pipe 110 is described as having two different wall thicknesses and / or two different diameters, but the heat pipe 110 may include one or more additional portions having one or more other diameter and / or wall thickness dimensions. The increased diameter provides a larger surface area (e.g., a larger contact area) at the second end 114 to improve heat transfer from the heat source to the second end 114 of the heat pipe 110. In addition, the increased thickness of the second end 114 provides increased thermal mass in the thick wall portion 118 to increase heat dissipation and / or heat absorption at the second end 114 of the heat pipe 110.

[0026] For example, when the heat pipe is flattened during manufacturing, the second end 114 having an increased diameter can be configured to increase the pad 115. The increased diameter tube can be flattened to form the pad 115. The heat pipe 110 will have an increased width at the second end 114 (e.g., when flattened) due to the heat pipe 110 having a larger diameter in that portion of the heat pipe 110. That is, the heat pipe 110 (e.g., when flattened) can have a first width in the thin-walled portion 116 and a second width in the thick-walled portion 118, wherein the second width is greater than the first width.

[0027] According to the present disclosure, when flattened, the first portion (e.g., thin-walled portion 116) may have a first height that is less than the first width, and the second portion (thick-walled portion 118) may have a second height that is less than the second width. Since the heat pipe 110 has an increased wall thickness in the thick-walled portion 118, the second height may be greater than the first height. In this configuration, the width (e.g., y-direction) is perpendicular to the height (e.g., z-direction), and both the height and the width are perpendicular to the length (e.g., x-direction) of the heat pipe 110.

[0028] Due to the increased diameter / width of the heat pipe 110 at the second end 114, the pad 115 formed at the second end 114 will have an increased surface area (e.g., a transverse area defined by the xy direction) compared to the other (one or more) portions of the heat pipe 110, which will increase the surface area of ​​the heat pipe 110 in contact (e.g., thermal contact) with the heat source 106. That is, the first end 112 (e.g., in contact with the heat sink 108) may have a first transverse area (e.g., defined by the xy direction (the length and width of the heat pipe 110)), and the second end 114 forming the pad 115 may have a second transverse area (e.g., defined by the xy direction (the length and width of the heat pipe 110)), wherein the second transverse area is greater than the first transverse area.

[0029] According to the present disclosure, the enlarged pad 115 of the heat pipe 110 can be directly connected to the heat source 106. In this example, the direct connection is established by omitting a cold plate or other heat dissipater between the pad 115 and the heat source 106. According to the present disclosure, the direct connection can include a configuration in which a heat or thermal paste, thermal compound, thermal grease, or thermal interface material or gel, etc. is provided between the heat pipe 110 and the heat source 106 and / or the heat sink 108. That is, the direct connection can refer to a configuration in which the cold plate is omitted. In other configurations, the direct connection can refer to a configuration in which a heat or thermal paste, etc. is also omitted.

[0030] The heat pipe 110 advantageously reduces the overall size, thickness, and / or footprint of the heat pipe system 100 while improving thermal conductivity and heat dissipation by including an enlarged pad 115 having an increased wall thickness compared to one or more other portions of the heat pipe 110. Although the heat pipe system 100 may not be configured with a cold plate as described above, the heat pipe system 100 is not limited thereto, and the heat pipe 110 may be used with a cold plate. Alternatively, if a cold plate is used, the heat pipe system 100 may advantageously use a cold plate of reduced thickness and / or size due to the increased wall thickness and diameter (e.g., lateral area) of the heat pipe at the second end 114. In this example, the heat pipe 110 may provide improved thermal energy transfer and improved heat dissipation even in a configuration in which a cold plate is omitted or a cold plate of reduced size is used.

[0031] Figure 2 2. A heat pipe system 200 according to the present disclosure is shown. The heat pipe system 200 may include a heat pipe 210, which is similar to the heat pipe 110, but includes a plurality of thin-walled sections 216 and a plurality of thick-walled sections 218. According to the present disclosure, the heat pipe system 200 is a double-ended system including two heat sources 206 and two heat sinks 208, which are connected to the heat pipe 210. Figure 1 The heat source 106 and the heat sink 108 are similar. In the system 200, similar to the heat pipe system 100, the thick wall portion 218 has an increased diameter compared to the thin wall portion 216 of the heat pipe 210.

[0032] Figure 3A-3C The Figure 3D The cross-sectional view of the heat pipe thickness processing mold obtained by the line 3D-3D shown, wherein Figure 3A-3C 3 and 4 show a process flow 300 for heat pipe thickness machining operations according to the present disclosure. Figure 3A-3C The discussion of the process flow 300 shown can be found in Figure 5 The flow chart of method 500 is shown, including one or more operations of thickness processing 511 .

[0033] Method 300 includes compressing tube 310 using die 320 and piston 322. Figure 3A As shown, the mold 320 includes a cavity 301 configured to receive a tube 310 (eg, Figure 3B-Figure 3C As shown). When viewed from above, the chamber forms a donut shape. That is, the chamber 301 is cylindrical, wherein the cylindrical chamber includes a concentric cylindrical core.

[0034] The chamber 301 includes an expanded chamber 303 having an increased width (e.g., in a radial direction). For example, the donut-shaped chamber 301 has an increased diameter in a portion of the expanded chamber 303. Figure 3B As shown, when the tube 310 is inserted into the chamber 301 , an expansion void 321 adjacent to the outer surface of the tube 310 is formed in the expansion chamber 303 .

[0035] Figure 3B The insertion (eg, in the Z direction) of the cavity 301 (see Figure 5 The tube 310 of operation 504) is formed around a portion of the tube 310 to form an expansion gap 321. After the tube 310 is inserted, a piston 322 is set at the top of the inserted tube 310 (see Figure 5 If the tube 310 does not extend to the top of the mold 320, the piston 322 may be partially inserted into the chamber 301. A compressive force 323 may then be applied to the piston 322 in the axial direction of the tube 310 (see Figure 5 In operation 508 ), the axial direction of the tube 310 is consistent with the axial direction of the chamber 301 (eg, the Z direction).

[0036] Figure 3CThe tube 310 is shown to have been compressed by a compressive force 322 applied to a piston 322. The compression of the tube 310 causes the tube 310 to expand into and at least partially fill the expansion void 321, thereby increasing the wall thickness along the tube 310 in the portion of the mold that includes the expansion chamber 303. The resulting compressed tube 310 will have a thick wall portion 318 and a thin wall portion 316. In this example, the thin wall portion 316 has a wall thickness that is the same or similar to the wall thickness of the tube before compression, while the thick wall portion 318 has an increased wall thickness.

[0037] Figure 4A-4C The Figure 4D The cross-sectional view of the heat pipe expansion processing mold obtained by the line 4D-4D shown, wherein Figure 4A-4C 4 and 5. A process flow 400 of a heat pipe expansion process operation according to the present disclosure is shown together. The expansion process may be used to increase the diameter of the tube 410 in at least a portion (e.g., portion 418) of the tube 410. Figure 4A-4C The discussion of the process flow 400 shown can be found in Figure 5 The flow chart of method 500 is shown, including one or more operations of expansion process 517 .

[0038] Method 400 includes expanding tube 410 using molds 405, 406. The mold may include a first portion 405 (e.g., a top portion) and a second portion 406 (e.g., a bottom portion). First portion 405 may include a first void 407, and second portion 406 may include a second void 408. When first portion 405 and second portion 406 of the mold are closed together, first void 407 and second void 408 form a cavity 413. When the closed mold has tube 410 inserted therein, cavity 413 surrounds at least a portion of tube 410, such as Figure 4B The portion 418 of the tube 410 is located within the gaps 407, 408 (lumen 413) and will be expanded, as shown in FIG. Figure 4B-Figure 4C This portion 418 may correspond to the thick-walled portion 318, so that the expanded portion 418 of the tube 410 is a portion that undergoes thickness processing to increase the wall thickness of the tube.

[0039] like Figure 4A As shown, the tube 410 can be placed or inserted into the mold (see Figure 5 Operation 512). The sealing component 409 may then be placed adjacent to the tube 410. The sealing component 409 is configured to contact both ends of the tube in a sealing manner and couple to a fluid source. The sealing component 409 may be referred to as a coupling.

[0040] When the first part 405 and the second part 406 are brought together to close the mold, the first part 405 and the second part 406 can sandwich the sealing member 409 and the tube 410 between the first part 405 and the second part 406, such as Figure 4B After the mold is closed, the fluid from the fluid source is introduced into the hollow center of the tube 410 through the sealing member 409 (see Figure 5 Operation 514). The fluid may be water or other fluids.

[0041] like Figure 4C As shown, the fluid is pressurized, which compresses the tube 410, and the internal force causes the tube 410 to expand outward and at least partially fill the chamber 413. In addition or alternatively, a gas (e.g., air) can be used and introduced into the tube 410 to cause the expansion. According to the present disclosure, the expansion process can be tubular hydroforming, pneumatic forming, or other mechanical expansion processes. After the tube 410 is expanded, the fluid can be removed and the expanded tube 410 can be removed from the mold (see Figure 5 Operation 516).

[0042] Figure 5 1 is a flow chart showing a method 500 of forming a heat pipe having a variable thickness and diameter according to the present disclosure. In some configurations, Figure 5 Two or more of the various operations shown may be performed simultaneously. In addition, the order of the various operations is not limiting, and the operations may be performed in different orders in some configurations.

[0043] Flowchart 500 begins at operation 502 and transitions to operation 504, where a tube is placed into a compression mold (e.g., see Figure 3B ).

[0044] After operation 504, flow chart 500 transitions to operation 506, where a piston is placed on top of the inserted tube. Figure 3B As shown, the piston 322 may be disposed on top of the inserted tube 310. If the tube 310 does not extend to the top of the mold 320, the piston 322 may be partially inserted in the cavity 301.

[0045] After operation 506, flow chart 500 transitions to operation 508, where a compressive force is applied to the piston to compress the heat pipe in the compression mold to form a thickened heat pipe. Figure 3BAs shown, a compressive force 323 can be applied to the piston 322 in the axial direction of the tube 310 to increase the wall thickness of at least a portion of the heat pipe. The compression of the tube 310 causes the tube 310 to expand into the expansion void 321 and at least partially fill the expansion void 321, thereby increasing the wall thickness along the tube 310 in the portion of the mold including the expansion chamber 303. The resulting compressed tube 310 will have a thick wall portion 318 and a thin wall portion 316.

[0046] After operation 508 , flow chart 500 transitions to operation 510 , where the thickened heat pipe can be removed from the compression mold. Operations 504 through 510 can be collectively referred to as thickness processing 511 .

[0047] At operation 512, the thickened heat pipe may be inserted into an expansion mold. The mold may then be closed around the pipe. For example, Figure 4A As shown, the mold may include a first portion 405 (e.g., a top portion) and a second portion 406 (e.g., a bottom portion). The first portion 405 may include a first void 407, and the second portion 406 may include a second void 408. When the first portion 405 and the second portion 406 of the mold are closed together, the first void 407 and the second void 408 form a cavity 413. A portion 418 of the tube 410 is located within the voids 407, 408 (cavity 413) and will undergo an expansion process, such as Figure 4B-Figure 4C As shown. The portion 418 may correspond to the thick wall portion 318, so that the expanded portion 418 of the tube 410 is the portion that is subjected to thickness processing to increase the wall thickness of the tube. When the first portion 405 and the second portion 406 are brought together to close the mold, the first portion 405 and the second portion 406 may sandwich the sealing member 409 and the tube 410 between the first portion 405 and the second portion 406, as shown. Figure 4B shown.

[0048] After operation 512, flow chart 500 transitions to operation 514, where the inserted tube and mold are sealed and a pressurized fluid and / or gas is applied to the mold and introduced into the hollow portion of the tube enclosed in the mold. Figure 4C As shown, the fluid is pressurized, which compresses the tube 410, and the internal force causes the tube 410 to expand outward and at least partially fill the chamber 413. In addition or alternatively, a gas (e.g., air) can be used and introduced into the tube 410 to cause expansion. According to the present disclosure, the expansion process can be hydroforming, pneumatic forming, or other mechanical expansion processes of the tube material.

[0049] After operation 514, flow chart 500 transitions to operation 516, where the tube and mold can be unsealed, fluid and / or gas can be removed from the tube, and the tube can be removed from the mold. For example, after tube 410 is expanded, the fluid can be removed and the expanded tube 410 can be removed from the mold. Operations 512 to 516 can be collectively referred to as expansion process 517.

[0050] After operation 516, flow chart 500 transitions to operation 518, where a wick may be inserted into the thickened and expanded tube. The tube may then be flattened / squeezed in a radial direction.

[0051] After operation 518 , the flowchart 500 transitions to operation 520 , where a working fluid may be added to the tube and the tube may be sealed to form a heat pipe having a variable thickness and diameter in accordance with the present disclosure.

[0052] After operation 520, flow diagram 500 transitions to operation 522, where the method ends.

[0053] Example

[0054] The following examples relate to various techniques of this disclosure.

[0055] One example (eg, Example 1) relates to a heat pipe comprising: a first portion comprising: a first diameter and a first wall thickness; and a second portion comprising: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness.

[0056] Another example (eg, Example 2) relates to the previously described examples (eg, Example 1), wherein the second portion has a greater thermal mass than the first portion.

[0057] Another example (eg, Example 3) relates to a previously described example (eg, one or more of Examples 1-2), wherein the second portion is configured to be disposed on the heat source without a cold plate.

[0058] Another example (eg, Example 4) relates to the previously described examples (eg, Example 3), wherein the heat source is an integrated circuit.

[0059] Another example (e.g., Example 5) relates to a previously described example (e.g., one or more of Examples 1-4), wherein the second portion is configured to form a flat pad having a larger lateral area than the first portion in response to the heat pipe being flattened.

[0060] Another example (eg, Example 6) relates to a previously described example (eg, one or more of Examples 1-5), wherein the heat pipe is formed of copper or a copper alloy.

[0061] One example (eg, Example 7) relates to a heat pipe comprising: a first portion extending a first length and having a first wall thickness and a first width; and a second portion extending a second length and having a second wall thickness greater than the first wall thickness and a second width greater than the first width.

[0062] Another example (e.g., Example 8) relates to a previously described example (e.g., Example 7), wherein the first portion is a first flat portion having a first height less than the first width, and the second portion is a second flat portion having a second height less than the second width.

[0063] Another example (eg, Example 9) relates to a previously described example (eg, Example 8), wherein the first width is perpendicular to the first height, and the second width is perpendicular to the second height.

[0064] Another example (eg, Example 10) relates to a previously described example (eg, one or more of Examples 8-9), wherein the first length is perpendicular to the first width and the first height, and the second length is perpendicular to the second width and the second height.

[0065] Another example (eg, Example 11) relates to a previously described example (eg, one or more of Examples 7-10), wherein the first width is perpendicular to the first length, and the second length is perpendicular to the second width.

[0066] Another example (eg, Example 12) relates to a previously described example (eg, one or more of Examples 7-11), wherein the second portion has a greater thermal mass than the first portion.

[0067] Another example (eg, Example 13) relates to a previously described example (eg, one or more of Examples 7-12), wherein the second portion is configured to be disposed on the heat source without a cold plate.

[0068] Another example (e.g., Example 14) relates to a previously described example (e.g., one or more of Examples 7-13), wherein the first portion has a first lateral area defined by a first length and a first width, and the second portion has a second lateral area defined by a second length and a second width, the second lateral area being greater than the first lateral area.

[0069] An example (e.g., Example 15) relates to a method for forming a heat pipe, the heat pipe having a first portion and a second portion, the method comprising: performing thickness processing on the heat pipe to increase the wall thickness of the first portion of the heat pipe to form a thickened heat pipe including the first portion and the second portion, the first wall thickness of the first portion being greater than the second wall thickness of the second portion; and performing expansion processing on the thickened heat pipe to increase the diameter of the first portion of the thickened heat pipe to form an expanded heat pipe including the first portion and the second portion, the first diameter of the first portion being greater than the second diameter of the second portion.

[0070] Another example (e.g., Example 16) relates to the previously described example (e.g., Example 15), and further includes: inserting a wick into the expanded heat pipe in the axial direction of the expanded heat pipe; and extruding the heat pipe in a radial direction perpendicular to the axial direction to form a flat heat pipe.

[0071] Another example (eg, Example 17) relates to the previously described examples (eg, one or more of Examples 15-16), further comprising: adding a working fluid into an inner cavity of the flat heat pipe; and sealing the flat heat pipe with the working fluid therein.

[0072] Another example (e.g., Example 18) relates to the previously described examples (e.g., one or more of Examples 15-17), wherein performing thickness processing on the heat pipe includes compressing the heat pipe in an axial direction to increase the wall thickness of a first portion of the heat pipe.

[0073] Another example (e.g., Example 19) relates to the previously described examples (e.g., one or more of Examples 15-18), wherein performing thickness processing on the heat pipe also includes: before compressing the heat pipe in an axial direction, placing the heat pipe in a mold having a first part and a second part, the first part having a gap adjacent to the outer surface of the heat pipe and extending away from the heat pipe in a radial direction, and the second part of the mold contacting the outer surface of the heat pipe, wherein the gap extends in the axial direction a distance corresponding to the axial distance of the first part of the heat pipe, and compression of the heat pipe increases the wall thickness of the first part of the heat pipe and at least partially fills the gap.

[0074] Another example (e.g., Example 20) relates to the previously described examples (e.g., one or more of Examples 15-19), wherein performing an expansion process on the thickened heat pipe includes temporarily sealing the heat pipe and injecting a pressurized fluid or gas into the temporarily sealed heat pipe so that the diameter of a first portion of the thickened heat pipe is increased to form an expanded heat pipe.

[0075] An example (e.g., Example 21) relates to a system comprising: a heat pipe comprising: a first portion comprising: a first diameter and a first wall thickness; a second portion comprising: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness, wherein the second portion of the heat pipe is configured to be thermally connected to a heat source; and a fan configured to generate an airflow to cool the first portion of the heat pipe, wherein the heat pipe is configured to transfer heat generated by the heat source from the second portion to the first portion.

[0076] One example (e.g., Example 22) relates to a system comprising: a heat pipe comprising: a first portion comprising: a first diameter and a first wall thickness; a second portion comprising: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness, wherein the second portion of the heat pipe is configured to be thermally connected to a heat source; and a heat dissipator configured to dissipate heat from the first portion of the heat pipe, wherein the heat pipe is configured to transfer heat generated by the heat source from the second portion to the first portion.

[0077] Another example (eg, Example 23) relates to a previously described example (eg, Example 22), wherein the heat dissipater includes a heat sink.

[0078] Another example (eg, Example 24) relates to a previously described example (eg, one or more of Examples 22-23), wherein the heat dissipater includes a fan.

[0079] One example (e.g., Example 25) relates to a system comprising: a heat transfer device comprising: a first portion comprising: a first diameter and a first wall thickness; a second portion comprising: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness, wherein the second portion of the heat transfer device is configured to be thermally connected to a heat source; and a heat dissipation device for generating an airflow to cool the first portion of the heat transfer device, wherein the heat transfer device is configured to transfer heat generated by the heat source from the second portion to the first portion.

[0080] One example (e.g., Example 26) relates to a system comprising: a heat transfer device comprising: a first portion comprising: a first diameter and a first wall thickness; a second portion comprising: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness, wherein the second portion of the heat transfer device is configured to be thermally connected to a heat source; and a heat dissipation device for dissipating heat from the first portion of the heat transfer device, wherein the heat transfer device is configured to transfer heat generated by the heat source from the second portion to the first portion.

[0081] Another example (e.g., Example 27) relates to a previously described example (e.g., one or more of Examples 25-26), wherein the heat transfer device has an axial length extending in an axial direction, the first portion forms a first axial portion of the heat transfer device extending in the axial direction, and the second portion forms a second axial portion of the heat transfer device extending in the axial direction.

[0082] Another example (eg, Example 28) relates to a previously described example (eg, one or more of Examples 25-27), wherein the heat transfer device is a heat pipe.

[0083] Another example (eg, Example 29) relates to a previously described example (eg, one or more of Examples 25-28), wherein the heat dissipation device includes a fan.

[0084] Another example (eg, Example 30) relates to a previously described example (eg, one or more of Examples 25-29), wherein the heat dissipation device includes a heat sink.

[0085] Another example (eg, Example 31) relates to a previously described example (eg, one or more of Examples 21-30), wherein the second portion is configured to be disposed on the heat source without a cold plate.

[0086] Another example (eg, Example 32) relates to a previously described example (eg, one or more of Examples 21-31), wherein the second portion has a greater thermal mass than the first portion.

[0087] Another example (eg, Example 33) relates to a previously described example (eg, one or more of Examples 21-32), wherein the heat source is an integrated circuit.

[0088] Another example (eg, Example 34) relates to a previously described example (eg, one or more of Examples 21-33), wherein the second portion is configured to form a flat pad having a larger lateral area than the first portion.

[0089] Another example (eg, Example 35) relates to a heat pipe formed by the method of one or more of Examples 15-20.

[0090] Another example (eg, Example 36) relates to a heat transfer device formed by the method of one or more of Examples 15-20.

[0091] Another example (eg, Example 37) involves a heat pipe as shown and described.

[0092] Another example (eg, Example 38) involves a heat transfer device as shown and described.

[0093] Another example (eg, Example 39) involves an apparatus as shown and described.

[0094] Another example (eg, Example 40) involves a method as shown and described.

[0095] in conclusion

[0096] The above description will fully reveal the general nature of the embodiments of the present disclosure, so that other personnel can easily modify and / or adjust these specific embodiments for various applications by applying the knowledge in the art, without excessive experimentation, and without departing from the general concept of the present disclosure. Therefore, according to the teachings and guidance provided herein, such adjustments and modifications are intended to be within the meaning and scope of the equivalents of the disclosed embodiments. It should be understood that the wording or terminology herein is for descriptive purposes rather than limitation, so the terms or wording of this specification should be interpreted by a skilled person according to these teachings and guidance.

[0097] Each described embodiment may include a particular feature, structure, or characteristic, but not every embodiment may include the particular feature, structure, or characteristic. Furthermore, these phrases do not necessarily all refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with one embodiment, it should be considered that it is within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether or not explicitly described.

[0098] The exemplary embodiments described herein are provided for illustrative purposes only and are not limiting. Other embodiments are also possible, and the exemplary embodiments may be modified. Therefore, this specification is not intended to limit the present disclosure. On the contrary, the scope of the present disclosure is limited only by the following claims and their equivalents.

[0099] Throughout the drawings, unless otherwise noted, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures.

[0100] The terms "at least one" and "one or more" may be understood to include numbers greater than or equal to one (e.g., one, two, three, four, etc.). The term "plurality" may be understood to include numbers greater than or equal to two (e.g., two, three, four, five, etc.).

[0101] The words "multiple" and "plurality" in the specification and claims clearly refer to quantities greater than one. Therefore, any phrase that explicitly refers to the above words when referring to the number of elements (e.g., "multiple [elements]", "plurality [elements]") clearly refers to more than one of the elements. The terms "group of...", "set of...", "set of...", "series of...", "sequence of...", "grouping of...", etc. (if any) in the specification and claims refer to a quantity equal to or greater than one, i.e., one or more. The terms "proper subset", "reduced subset" and "smaller subset" refer to a subset of a set that is not equal to the set, illustratively, to a subset of a set that contains fewer elements than the set.

[0102] The phrase "at least one of" with respect to a group of elements may be used herein to indicate at least one element from the group consisting of the elements. The phrase "at least one of" with respect to a group of elements may be used herein to indicate a selection of: one of the listed elements, one of a plurality of listed elements, a plurality of individually listed elements, or a plurality of a plurality of individually listed elements.

Claims

1. A heat pipe comprising: A first portion comprising: a first diameter and a first wall thickness; and The second portion includes: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness.

2. The heat pipe according to claim 1, wherein: The second portion has a greater thermal mass than the first portion.

3. The heat pipe according to any one of claims 1 to 2, wherein: The second portion is configured to be disposed on a heat source without a cold plate.

4. The heat pipe according to claim 3, wherein: The heat source is an integrated circuit.

5. The heat pipe according to any one of claims 1 to 2, wherein: The second portion is configured to form a flat pad having a larger lateral area than the first portion in response to the heat pipe being flattened.

6. The heat pipe according to any one of claims 1 to 2, wherein: The heat pipe is formed of copper or a copper alloy.

7. A heat pipe comprising: a first portion extending a first length and having a first wall thickness and a first width; as well as A second portion extends a second length and has a second wall thickness greater than the first wall thickness and a second width greater than the first width.

8. The heat pipe according to claim 7, wherein: The first portion is a first flat portion having a first height less than the first width, and the second portion is a second flat portion having a second height less than the second width.

9. The heat pipe according to claim 8, wherein: The first width is perpendicular to the first height, and the second width is perpendicular to the second height.

10. The heat pipe according to claim 9, wherein: The first length is perpendicular to the first width and the first height, and the second length is perpendicular to the second width and the second height.

11. The heat pipe according to any one of claims 7 to 10, wherein: The first width is perpendicular to the first length, and the second length is perpendicular to the second width.

12. The heat pipe according to any one of claims 7 to 10, wherein: The second portion has a greater thermal mass than the first portion.

13. The heat pipe according to any one of claims 7 to 10, wherein: The second portion is configured to be disposed on a heat source without a cold plate.

14. The heat pipe according to any one of claims 7 to 10, wherein: The first portion has a first transverse area defined by the first length and the first width, and the second portion has a second transverse area defined by the second length and the second width, the second transverse area being greater than the first transverse area.

15. A method for forming a heat pipe having a first portion and a second portion, the method comprising: Performing thickness processing on the heat pipe to increase the wall thickness of the first portion of the heat pipe to form a thickened heat pipe including the first portion and the second portion, wherein a first wall thickness of the first portion is greater than a second wall thickness of the second portion; as well as An expansion process is performed on the thickened heat pipe to increase a diameter of the first portion of the thickened heat pipe to form an expanded heat pipe including the first portion and the second portion, wherein a first diameter of the first portion is greater than a second diameter of the second portion.

16. The method according to claim 15, further comprising: Inserting a liquid wick into the expansion heat pipe in the axial direction of the expansion heat pipe; as well as The heat pipe is extruded in a radial direction perpendicular to the axial direction to form a flat heat pipe.

17. The method according to claim 16, further comprising: adding a working fluid into the inner cavity of the flat heat pipe; and sealing the flat heat pipe having the working fluid therein.

18. The method according to any one of claims 15 to 17, wherein: Performing thickness processing on the heat pipe includes compressing the heat pipe in an axial direction to increase the wall thickness of the first portion of the heat pipe.

19. The method according to claim 18, wherein: Performing thickness processing on the heat pipe further includes: Prior to compressing the heat pipe in the axial direction, placing the heat pipe in a mold having a first portion and a second portion, the first portion having a void adjacent to an outer surface of the heat pipe and extending away from the heat pipe in a radial direction, and the second portion of the mold in contact with the outer surface of the heat pipe, The gap extends in the axial direction by a distance corresponding to an axial distance of the first portion of the heat pipe, and compression of the heat pipe increases the wall thickness of the first portion of the heat pipe and at least partially fills the gap.

20. The method according to any one of claims 15 to 17, wherein: Performing an expansion process on the thickened heat pipe includes temporarily sealing the heat pipe and injecting a pressurized fluid or gas into the temporarily sealed heat pipe so that the diameter of the first portion of the thickened heat pipe increases to form the expanded heat pipe.

21. The method according to any one of claims 15 to 17, wherein: (i) performing thickness processing on the heat pipe comprises: placing the heat pipe into a mold having a first portion and a second portion, the first portion having a void adjacent to an outer surface of the heat pipe and extending radially away from the heat pipe, and the second portion of the mold contacting the outer surface of the heat pipe, and compressing the heat pipe in an axial direction to increase the wall thickness of the first portion of the heat pipe, the void extending in the axial direction by a distance corresponding to the axial distance of the first portion of the heat pipe, and the compression of the heat pipe causes the wall thickness of the first portion of the heat pipe to increase and at least partially fill the void; and (ii) performing an expansion process on the thickened heat pipe includes temporarily sealing the heat pipe and injecting a pressurized fluid or gas into the temporarily sealed heat pipe so that the diameter of the first portion of the thickened heat pipe increases to form the expanded heat pipe.

22. A system comprising: Heat pipe, comprising: A first portion comprising: a first diameter and a first wall thickness; a second portion comprising: a second diameter greater than the first diameter and a second wall thickness greater than the first wall thickness, wherein the second portion of the heat pipe is configured to be thermally connected to a heat source; and A heat dissipater is configured to dissipate heat from the first portion of the heat pipe, wherein the heat pipe is configured to transfer heat generated by the heat source from the second portion to the first portion.

23. The system of claim 22, wherein: The heat dissipater includes a heat sink.

24. The system according to any one of claims 22-23, wherein: The heat dissipater includes a fan.

25. The system of claim 24, wherein: The fan is configured to generate an air flow to cool the first portion of the heat pipe.

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