A probe device for instantaneous high and low temperature conversion test chip and its test method

Abstract

The present invention relates to the technical field of chip detection devices, and in particular to a probe device for testing chips for instantaneous high and low temperature conversion and a testing method thereof, comprising a base and a cover plate detachably mounted on the base, a cavity for placing a chip to be tested is arranged between the base and the cover plate, a probe for detecting the chip is arranged on the cover plate, and also comprises a compressor, a first gas storage bottle, a second gas storage bottle and at least one vortex tube refrigerator, the output end of the compressor is connected to the vortex chamber of the vortex tube refrigerator, and the cold end of the vortex tube refrigerator is connected to the first gas storage bottle. When in use, the compressor, the vortex tube refrigerator, the first gas storage bottle and the second gas storage bottle cooperate to store gas of required temperature in the first gas storage bottle and the second gas storage bottle, and the gas of required temperature is transported to the oral cavity by controlling the first valve and the second valve, so as to meet the detection requirements of various temperatures, improve the detection efficiency and reduce the detection cost.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection devices, and in particular to a probe device for instantaneous high and low temperature conversion test chips and a test method thereof. Background Art

[0002] With the rapid development of intelligence, the demand for chips is increasing, and the role of chip detection technology is becoming more and more important. Chips are widely used in communications, computers, consumer electronics and other fields in modern society, and the demand for instantaneous high and low temperature conversion testing of chips is imminent. Traditional test probe devices for single high or low temperature detection have problems such as low efficiency and high cost, which has caused great obstacles to the development of measuring chip performance. Summary of the invention

[0003] The technical problem to be solved by the present invention is: in order to solve the problem of low efficiency and high cost of traditional test probe devices for single high or low temperature detection, a probe device for instantaneous high and low temperature conversion test chip and a test method thereof are provided.

[0004] The technical solution adopted by the present invention to solve its technical problems is: a probe device for instantaneous high and low temperature conversion test chip, including a base and a cover plate detachably mounted on the base, a cavity for placing the chip to be detected is arranged between the base and the cover plate, a probe for detecting the chip is arranged on the cover plate, and also includes a compressor, a first gas storage bottle, a second gas storage bottle and at least one vortex tube refrigerator, the output end of the compressor is connected to the vortex chamber of the vortex tube refrigerator, the cold end of the vortex tube refrigerator is connected to the first gas storage bottle, the hot end of the vortex tube refrigerator is connected to the second gas storage bottle, the output end of the first gas storage bottle and the output end of the second gas storage bottle are both connected to the cavity, the output end of the first gas storage bottle is provided with a first valve, and the output end of the second gas storage bottle is provided with a second valve. Compared with the prior art, this solution stores the gas of the required temperature in the first gas storage bottle and the second gas storage bottle through the cooperation of the compressor, the vortex tube refrigerator, the first gas storage bottle and the second gas storage bottle, and transports the gas of the required temperature to the oral cavity by controlling the first valve and the second valve, so as to meet the detection requirements of multiple temperatures, improve the detection efficiency, and reduce the detection cost.

[0005] In order to facilitate the control of the required temperature of the gas, in some preferred embodiments, a third valve is provided between the cold end of the vortex tube refrigerator and the first gas storage bottle. The third valve can control the cold end of the vortex tube refrigerator, control the gas at the cold end of the vortex tube refrigerator to be delivered to the first gas storage bottle or cut off the connection with the first gas storage bottle, so as to meet the use requirements.

[0006] In order to facilitate the control of the required temperature gas, preferably in some embodiments, a fourth valve is provided between the hot end of the vortex tube refrigerator and the second gas storage bottle. The hot end of the vortex tube refrigerator can be controlled by the fourth valve to control the gas at the hot end of the vortex tube refrigerator to be delivered to the second gas storage bottle or to cut off the connection with the second gas storage bottle to meet the use requirements.

[0007] In order to improve the detection efficiency, in some preferred embodiments, a first gas storage chamber and a second gas storage chamber are provided between the base and the cover plate, the first gas storage chamber is respectively connected with the input end of the first gas storage bottle and the cavity body, the first gas storage chamber is provided with a fifth valve for cutting off or connecting the cavity body or the first gas storage bottle, the first gas storage chamber is provided with a sixth valve for exhausting to the outside, the second gas storage chamber is respectively connected with the input end of the second gas storage bottle and the cavity body, the second gas storage chamber is provided with a seventh valve for cutting off or connecting the cavity body or the second gas storage bottle, and the second gas storage chamber is provided with an eighth valve for exhausting to the outside. By providing the first gas storage chamber and the second gas storage chamber between the base and the cover plate, the first gas storage chamber and the second gas storage chamber can first discharge a part of the gas into the corresponding first gas storage chamber or the second gas storage chamber for storage, and then the stored gas is transported to the cavity body during detection, which greatly improves the detection efficiency.

[0008] In order to improve the detection efficiency, in some preferred embodiments, there are two vortex tube coolers which are arranged oppositely on two sides of the cover plate.

[0009] In order to ensure reliable temperature detection of the wafer under test, in some preferred embodiments, a rubber pad for fixing the wafer under test is provided on the cover plate.

[0010] In some preferred embodiments, the cover plate is provided with a PCB board, a sealing gasket and a transfer layer, the probe passes through the guide plate and the sealing gasket and is connected to the PCB board, the guide plate is located in the cavity, and one end of the probe passes through the guide plate and contacts the detection chip.

[0011] In some preferred embodiments, a sealing sleeve is provided between the PCB board and the cover plate to ensure that there is no leakage of the detection gas during use of the device and to ensure that the temperature and pressure inside the device are constant.

[0012] A testing method using the above-mentioned probe device for testing a chip for instantaneous high and low temperature conversion comprises the following steps:

[0013] S1. Rotate the base to place the wafer to be tested in the cavity, then rotate the base in the opposite direction and install the base and the cover in place;

[0014] S2. Test the sealing of the probe device;

[0015] S3. After the test is completed, when the sealing requirement is met, close the first valve and the second valve, open the fifth valve, the seventh valve, the sixth valve and the eighth valve, and discharge the gas in the cavity;

[0016] S4, start the compressor, and deliver the required gas to the corresponding first gas cylinder and the second gas cylinder respectively through the vortex tube refrigerator, wait for a period of time, until the gas inside the first gas cylinder and the second gas cylinder reaches the required temperature, close the fifth valve, the seventh valve, the sixth valve and the eighth valve, and open the first valve and / or the second valve to deliver the required gas into the cavity;

[0017] S5, wait for a while, and when the detection is completed, close the first valve and the second valve, and open the fifth valve, the seventh valve, the sixth valve and the eighth valve to discharge the gas in the cavity;

[0018] S6. Wait for a while, rotate the lower cover, take the wafer to be tested out of the device, tighten the lower cover, and the test is completed.

[0019] In some preferred embodiments, in step S2, the compressor is started, and the first valve, the second valve, the third valve and the fourth valve are opened, and the fifth valve and the seventh valve are closed.

[0020] The beneficial effects of the present invention are as follows: when in use, the probe device for instantaneous high and low temperature conversion test chip and the test method thereof of the present invention cooperate through a compressor, a vortex tube refrigerator, a first gas cylinder and a second gas cylinder to store gas of the required temperature in the first gas cylinder and the second gas cylinder, and transport the gas of the required temperature to the oral body by controlling the first valve and the second valve, thereby meeting the detection requirements of multiple temperatures, improving the detection efficiency, reducing the detection cost, and avoiding the problems of low efficiency and high cost of traditional test probe devices for single high temperature or low temperature detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0023] Figure 2 It is a front view of the present invention;

[0024] Figure 3 It is a left side view of the present invention;

[0025] Figure 4 is a top view of the present invention;

[0026] Figure 5 It is a schematic diagram of the internal structure of the present invention;

[0027] Figure 6 It is a schematic diagram of the installation structure between the compressor, the vortex tube refrigerator, the first gas storage bottle and the second gas storage bottle in the present invention.

[0028] In the figure: 1, base, 2, cover plate, 3, cavity, 4, probe, 5, compressor, 6, first gas cylinder, 7, second gas cylinder, 8, vortex tube refrigerator, 9, first valve, 10, second valve, 11, third valve, 12, fourth valve, 13, fifth valve, 14, sixth valve, 15, seventh valve, 16, eighth valve, 17, rubber pad, 18, PCB board, 19, sealing pad, 20, transfer layer, 21, sealing sleeve, 22, first gas storage chamber, 23, second gas storage chamber, 24, guide plate. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with embodiments:

[0030] The present invention is not limited to the following specific embodiments. A person skilled in the art can implement the present invention in various other specific embodiments according to the contents disclosed in the present invention, or any simple changes or modifications made to the design structure and ideas of the present invention fall within the protection scope of the present invention. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0033] Example 1

[0034] like Figure 1-6 As shown, a probe device for testing a chip for instantaneous high and low temperature conversion comprises a base 1, a cover plate 2, a compressor 5, a first gas storage bottle 6, a second gas storage bottle 7 and two vortex tube refrigerators 8. In this embodiment, the cover plate 2 is threadedly connected to the base 1. Of course, in addition to realizing the threaded connection of the cover plate 2 to the base 1, it can also be connected by snapping with each other to realize that the cover plate 2 can be detachably installed on the base 1. A cavity 3 is provided between the base 1 and the cover plate 2. The cavity 3 is used to place the chip to be tested. A probe 4 is provided on the cover plate 2. The probe 4 is used to detect the chip. The output end of the compressor 5 is connected to the vortex chamber of the vortex tube refrigerator 8, the cold end of the vortex tube refrigerator 8 is connected to the first gas storage bottle 6, so that the low-temperature gas is stored in the first gas storage bottle 6, the hot end of the vortex tube refrigerator 8 is connected to the second gas storage bottle 7, so that the high-temperature gas is stored in the second gas storage bottle 7, the output end of the first gas storage bottle 6 is connected to the cavity 3, and a first valve 9 is arranged on the output end of the first gas storage bottle 6, the output end of the second gas storage bottle 7 is connected to the cavity 3, and a second valve 10 is arranged on the output end of the second gas storage bottle 7.

[0035] A third valve 11 is provided between the cold end of the vortex tube refrigerator 8 and the first gas storage bottle 6 , and a fourth valve 12 is provided between the hot end of the vortex tube refrigerator 8 and the second gas storage bottle 7 .

[0036] A first gas storage chamber 22 is provided between the base 1 and the cover plate 2. The first gas storage chamber 22 is connected to the input end of the first gas cylinder 6 and the cavity 3 respectively. A fifth valve 13 for cutting off or connecting the cavity 3 or the first gas cylinder 6 is provided on the first gas storage chamber 22. A sixth valve 14 for exhausting to the outside is provided on the first gas storage chamber 22.

[0037] A second gas storage chamber 23 is arranged between the base 1 and the cover plate 2, and the second gas storage chamber 23 is connected with the input end of the second gas bottle 7 and the cavity body 3 respectively. The second gas storage chamber 23 is provided with a seventh valve 15 for cutting off or connecting the cavity body 3 or the second gas bottle 7, and the second gas storage chamber 23 is provided with an eighth valve 16 for exhausting to the outside.

[0038] There are two vortex tube refrigerators 8 which are arranged opposite to each other on two sides of the cover plate 2 .

[0039] A PCB board 18, a sealing gasket 19 and a transfer layer 20 are arranged on the cover plate 2. The probe 4 passes through the transfer layer 20 and the sealing gasket 19 and is connected to the PCB board 18. The guide plate 24 is located in the cavity 3. One end of the probe 4 passes through the guide plate 24 and contacts the detection chip. There are holes arranged on the guide plate 24 that are larger than the actual radius of the probe 4, so that the detection data of the probe 4 is more comprehensive and accurate, avoiding economic losses in the use process caused by subsequent wafer data errors. A rubber pad 17 is arranged on the cover plate 2. The rubber pad 17 is used to fix the wafer to be tested. The rubber pad 17 is located in the cavity 3. A sealing sleeve 21 is arranged between the PCB board 18 and the cover plate 2.

[0040] Example 2

[0041] Embodiment 2 is an application of Embodiment 1, specifically: a testing method using the above-mentioned probe device for testing a chip for instantaneous high and low temperature conversion, comprising the following steps:

[0042] S1, rotating the base 1, placing the wafer to be tested in the cavity 3, and then rotating the base 1 in the opposite direction to install the base 1 and the cover plate 2 in place, the detection end of the probe 4 contacts the wafer to be tested, and the rubber pad 17 is placed on the wafer to be tested, and the wafer to be tested is fixed in the cavity 3;

[0043] S2, start the compressor 5, open the first valve 9 at the first gas cylinder 6, the second valve 10, the third valve 11 and the fourth valve 12 at the second gas cylinder 7, close the fifth valve 13 and the seventh valve 15, the output end of the compressor 5 outputs gas, the gas passes through the vortex chamber of the vortex tube refrigerator 8 and is divided into two gases of different temperatures, the cold end of the vortex tube refrigerator 8 transports the low-temperature gas to the first gas cylinder 6, the gas in the first gas cylinder 6 enters the cavity 3, the hot end of the vortex tube refrigerator 8 transports the high-temperature gas to the second gas cylinder 7, the gas in the second gas cylinder 7 enters the cavity 3, and the sealing performance of the probe 4 device is tested;

[0044] S3. After the test is completed and the sealing requirement is met, the first valve 9 and the second valve 10 are closed, and the fifth valve 13, the seventh valve 15, the sixth valve 14 and the eighth valve 16 are opened to discharge the gas in the cavity 3;

[0045] S4, start the compressor 5, and deliver the required gas to the corresponding first gas cylinder 6 and second gas cylinder 7 through the cold end and hot end of the vortex tube refrigerator 8, respectively, wait for a period of time, and the gas inside the first gas cylinder 6 and the second gas cylinder 7 reaches the required temperature, close the fifth valve 13, the seventh valve 15, the sixth valve 14 and the eighth valve 16, and open the first valve 9 and / or the second valve 10 to deliver the required gas into the cavity 3;

[0046] S5, wait for a while, and when the detection is completed, close the first valve 9 and the second valve 10, and open the fifth valve 13, the seventh valve 15, the sixth valve 14 and the eighth valve 16 to discharge the gas in the cavity 3;

[0047] S6, wait for a while, rotate the cover plate 2, take the wafer to be tested out of the device, tighten the cover plate 2, and the test is completed.

[0048] In step S4, when the test conditions require a high pressure and high temperature environment, the first valve 9, the third valve 11, the fifth valve 13, the sixth valve 14 and the eighth valve 16 are closed, and the second valve 10, the fourth valve 12 and the seventh valve 15 are opened to supply high temperature and high pressure gas, ensuring that the high temperature and high pressure gas in the second gas storage tank directly hits the wafer under test;

[0049] Alternatively, in step S4, when the test conditions require a low temperature environment, the second valve 10, the fourth valve 12, the sixth valve 14, the seventh valve 15 and the eighth valve 16 are closed, the first valve 9, the third valve 11 and the fifth valve 13 are opened, and low temperature and high pressure gas is delivered to deliver cooling gas into the space where the wafer under test is located;

[0050] Alternatively, in step S4, when the test conditions require the required temperature environment, open the sixth valve 14 and the eighth valve 16, open the first valve 9, the second valve 10, the third valve 11, the fourth valve 12, the fifth valve 13 and the seventh valve 15, and supply low-temperature, high-temperature and high-pressure gases, and the high-temperature gas and the low-temperature gas enter the space where the wafer to be tested is located.

[0051] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A probe device for testing a chip for instantaneous high and low temperature conversion, comprising a base (1) and a cover plate (2) detachably mounted on the base (1), a cavity (3) for placing a chip to be tested is provided between the base (1) and the cover plate (2), and a probe (4) for testing the chip is provided on the cover plate (2), characterized in that: It also comprises a compressor (5), a first gas storage bottle (6), a second gas storage bottle (7) and at least one vortex tube refrigerator (8), wherein the output end of the compressor (5) is in communication with the vortex chamber of the vortex tube refrigerator (8), the cold end of the vortex tube refrigerator (8) is in communication with the first gas storage bottle (6), the hot end of the vortex tube refrigerator (8) is in communication with the second gas storage bottle (7), the output end of the first gas storage bottle (6) and the output end of the second gas storage bottle (7) are both in communication with the cavity (3), the output end of the first gas storage bottle (6) is provided with a first valve (9), and the output end of the second gas storage bottle (7) is provided with a second valve (10); A third valve (11) is provided between the cold end of the vortex tube refrigerator (8) and the first gas storage bottle (6); A fourth valve (12) is provided between the hot end of the vortex tube refrigerator (8) and the second gas storage bottle (7); A first gas storage chamber (22) and a second gas storage chamber (23) are provided between the base (1) and the cover plate (2); the first gas storage chamber (22) is communicated with the input end of the first gas cylinder (6) and the cavity (3) respectively; a fifth valve (13) for cutting off or connecting the cavity (3) and the first gas cylinder (6) is provided on the first gas storage chamber (22); a sixth valve (14) for exhausting gas to the outside is provided on the first gas storage chamber (22); the second gas storage chamber (23) is communicated with the input end of the second gas cylinder (7) and the cavity (3) respectively; a seventh valve (15) for cutting off or connecting the cavity (3) and the second gas cylinder (7) is provided on the second gas storage chamber (23); and an eighth valve (16) for exhausting gas to the outside is provided on the second gas storage chamber (23).

2. The probe device for instantaneous high and low temperature conversion test chip according to claim 1, characterized in that: There are two vortex tube refrigerators (8) which are arranged oppositely on two sides of the cover plate (2).

3. The probe device for testing a chip for instantaneous high and low temperature conversion according to claim 1, characterized in that: The cover plate (2) is provided with a rubber pad (17) for fixing the wafer to be tested.

4. The probe device for testing a chip for instantaneous high and low temperature conversion according to claim 3, characterized in that: A PCB board (18), a sealing gasket (19) and a transfer layer (20) are arranged on the cover plate (2); the probe (4) passes through a guide plate (24) and the sealing gasket (19) and is connected to the PCB board (18); the guide plate (24) is located in the cavity (3); one end of the probe (4) passes through the guide plate (24) and contacts the detection chip.

5. A probe device for testing a chip for instantaneous high and low temperature conversion according to claim 4, characterized in that: A sealing sleeve (21) is provided between the PCB board (18) and the cover plate (2).

6. A testing method using the probe device for testing a chip for instantaneous high and low temperature conversion as claimed in claim 1, characterized in that: The steps include: S1, rotating the base (1), placing the wafer to be tested in the cavity (3), and then rotating the base (1) in the opposite direction and installing the base (1) and the cover plate (2) in place; S2, testing the sealing performance of the probe (4) device; S3. After the test is completed and the sealing requirement is met, the first valve (9) and the second valve (10) are closed, and the fifth valve (13), the seventh valve (15), the sixth valve (14) and the eighth valve (16) are opened to discharge the gas in the cavity (3); S4, starting the compressor (5), and delivering the required gas to the corresponding first gas storage bottle (6) and the second gas storage bottle (7) through the vortex tube refrigerator (8), waiting for a period of time until the gas inside the first gas storage bottle (6) and the second gas storage bottle (7) reaches the required temperature, closing the fifth valve (13), the seventh valve (15), the sixth valve (14) and the eighth valve (16), and opening the first valve (9) and / or the second valve (10) to deliver the required gas into the cavity (3); S5, waiting for a period of time until the detection is completed, closing the first valve (9) and the second valve (10), and opening the fifth valve (13), the seventh valve (15), the sixth valve (14) and the eighth valve (16) to discharge the gas in the cavity (3); S6. Wait for a while, rotate the lower cover plate (2), take the wafer to be tested out of the device, and tighten the lower cover plate (2). The test is completed.

7. The testing method according to claim 6, characterized in that: In step S2, the compressor (5) is started, and the first valve (9), the second valve (10), the third valve (11) and the fourth valve (12) are opened, and the fifth valve (13) and the seventh valve (15) are closed.

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