Touch component testing method and device, storage medium and terminal
By using thermal imaging technology in touch component testing, controlling the power supply and collecting thermal imaging data to detect conductive layer faults, the problem of inaccurate detection in the prior art is solved, and precise positioning and accurate detection of conductive layer faults are achieved.
Patent Information
- Application Number
- CN202310779555.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-28
- Publication Date
- 2024-12-31
AI Technical Summary
The existing touch component testing methods have inaccurate short-circuit or open-circuit detection and require manual operation, resulting in inconsistent detection results and possible missed tests or errors.
The power supply device is controlled to connect the power supply to the conductive layer to be tested, and the target thermal imaging data is collected using the thermal imaging device, and the thermal imaging data is compared with the standard thermal imaging data to determine the conductivity test results and accurately locate the fault position.
Accurate detection of the faults of the conductive layer of the touch component is achieved, which avoids the uncertainty of manual operation and improves the accuracy and consistency of the detection results.
Smart Images
Figure CN119224634A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electronic circuit technology, and in particular to a touch component testing method, device, storage medium and terminal. Background Art
[0002] Existing capacitive interactive smart devices (such as tablets or large-size all-in-one computers) can be touched because they contain a touch component.
[0003] In order to avoid touch problems in assembled devices with touch components, it is necessary to ensure that the electrode channels of the conductive layer of the produced touch components will not have short circuits or open circuits with adjacent components or other channels. Summary of the invention
[0004] The embodiments of the present application provide a touch component testing method, device, storage medium and terminal, which can solve technical problems in the touch component testing process.
[0005] In a first aspect, an embodiment of the present application provides a touch component testing method, the method comprising:
[0006] Controlling the power supply device to connect the power supply to the conductive layer to be tested in the touch component;
[0007] Collecting target thermal imaging data of the conductive layer to be tested based on a thermal imaging device;
[0008] A conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data.
[0009] Optionally, determining the conductivity test result of the conductive layer to be tested based on the target thermal imaging data includes: determining the conductivity test result of the conductive layer to be tested based on the target thermal imaging data and standard thermal imaging data corresponding to the conductive layer to be tested.
[0010] Optionally, determining a conductivity test result of the conductive layer to be tested based on the target thermal imaging data and standard thermal imaging data corresponding to the conductive layer to be tested includes:
[0011] Determining thermal imaging parameters at various locations in the conductive layer to be tested based on the target thermal imaging data;
[0012] Comparing the first thermal imaging parameter at each position in the conductive layer to be tested with the second thermal imaging parameter at the corresponding position in the standard thermal imaging data;
[0013] Based on the comparison result of each first thermal imaging parameter and the second thermal imaging parameter respectively corresponding to each first thermal imaging parameter, a conductivity test result of the conductive layer to be tested is determined.
[0014] Optionally, the determining the conductivity test result of the conductive layer to be tested based on the comparison result of each first thermal imaging parameter and the second thermal imaging parameter respectively corresponding to each first thermal imaging parameter comprises:
[0015] When a target first thermal imaging parameter among the first thermal imaging parameters is smaller than a first preset value of a second thermal imaging parameter corresponding to the target first thermal imaging parameter, determining that an open circuit exists at a position corresponding to the target first thermal imaging parameter in the conductive layer to be tested;
[0016] When a target second thermal imaging parameter among the first thermal imaging parameters is greater than a second preset value of a second thermal imaging parameter corresponding to the target second thermal imaging parameter, it is determined that a short circuit exists at a corresponding position of the target second thermal imaging parameter in the conductive layer to be tested.
[0017] Optionally, the open circuit is divided into a micro-open circuit and a complete open circuit according to a difference between the target first thermal imaging parameter and a second thermal imaging parameter corresponding to the target first thermal imaging parameter;
[0018] The short circuit is divided into a micro short circuit and a complete short circuit according to the difference between the target second thermal imaging parameter and the second thermal imaging parameter corresponding to the target second thermal imaging parameter.
[0019] Optionally, determining the thermal imaging parameters at each position in the conductive layer to be tested based on the target thermal imaging data includes: determining an image plane corresponding to the conductive layer to be tested, and establishing a coordinate system in the image plane; and determining the thermal imaging parameters at each position in the conductive layer to be tested based on the coordinates corresponding to the target thermal imaging data in the coordinate system.
[0020] Optionally, there is at least one conductive channel in the conductive layer to be tested, and the control power supply device connects the conductive layer to be tested in the touch component to a power source, including: the control power supply device connects at least one conductive channel in the conductive layer to be tested in the touch component to a power source, wherein the power supply device is one of a constant current power supply, a constant voltage power supply or an AC power supply.
[0021] In a second aspect, an embodiment of the present application provides a touch component testing device, the device comprising:
[0022] A power supply access module, used to control the power supply device to access power to the conductive layer to be tested in the touch component;
[0023] A thermal imaging acquisition module, used for acquiring target thermal imaging data of the conductive layer to be tested based on a thermal imaging device;
[0024] A test result determination module is used to determine a conductivity test result of the conductive layer to be tested based on the target thermal imaging data.
[0025] In a third aspect, an embodiment of the present application provides a computer storage medium, wherein the computer storage medium stores a plurality of instructions, wherein the instructions are suitable for being loaded by a processor and executing the steps of the above-mentioned method.
[0026] In a fourth aspect, an embodiment of the present application provides a terminal, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is suitable for being loaded by the processor and executing the steps of the above-mentioned device configuration method.
[0027] The beneficial effects brought about by the technical solutions provided in some embodiments of the present application include at least:
[0028] The embodiment of the present application provides a touch component testing method, firstly, the power supply device is controlled to connect the power supply to the conductive layer to be tested in the touch component; then, the target thermal imaging data of the conductive layer to be tested is collected based on the thermal imaging device; finally, the conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data. When the conductive layer to be tested in the touch component fails, the resistance at the position where the failure occurs in the conductive layer to be tested will change, and then when the conductive layer to be tested is connected to the power supply, the thermal imaging data at the position where the failure occurs in the conductive layer to be tested will change, so that the position where the failure occurs in the conductive layer to be tested can be accurately located. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.
[0030] Figure 1 An exemplary system architecture diagram of a touch component testing method provided in an embodiment of the present application;
[0031] Figure 2 A schematic diagram of a flow chart of a touch component testing method provided in an embodiment of the present application;
[0032] Figure 3 A schematic diagram of thermal imaging corresponding to a crack appearing in the conductive layer to be tested provided in an embodiment of the present application;
[0033] Figure 4 A schematic diagram of thermal imaging corresponding to a crack appearing in another conductive layer to be tested provided in an embodiment of the present application;
[0034] Figure 5A schematic diagram of thermal imaging corresponding to a crack appearing in another conductive layer to be tested provided in an embodiment of the present application;
[0035] Figure 6 A schematic diagram of a structure in which there is a short circuit between channels in a conductive layer to be tested provided in an embodiment of the present application;
[0036] Figure 7 A schematic diagram of thermal imaging corresponding to a short circuit between channels in a conductive layer to be tested provided in an embodiment of the present application;
[0037] Figure 8 A thermal imaging schematic diagram showing a micro short circuit between a channel and a floating area in a conductive layer to be tested provided in an embodiment of the present application;
[0038] Fig. 9 A schematic diagram of a flow chart of another touch component testing method provided in an embodiment of the present application;
[0039] Fig.10 A schematic diagram of the structure of a touch component testing device provided in an embodiment of the present application;
[0040] Fig.11 A schematic diagram of the structure of a terminal provided in an embodiment of the present application. DETAILED DESCRIPTION
[0041] In order to make the features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the embodiments of the present application.
[0042] Capacitive interactive smart devices (such as tablets or large-size all-in-one computers) can be touched because they contain a touch component. The basic working principle is: the conductive layer that transmits the signal and the conductive layer that receives the signal are not in the same plane, and a capacitor is formed at the intersection of the electrodes that transmit and receive the signal; when a human hand or a conductive object touches the surface of the cover, part of the charge is absorbed by the finger, resulting in a decrease in the mutual capacitance value here. By detecting the change in the mutual capacitance value, the coordinates of the touch point are obtained.
[0043] In order to avoid touch problems in the assembled touch-screen device, it is necessary to ensure that the electrode channels of the conductive layer produced will not have micro-short circuits with adjacent components or other channels, short circuits, or micro-open circuits or even open circuits in the channels themselves.
[0044] In the related art, a matching capacitive screen control board is used to detect the leakage current or mutual capacitance between channels by connecting the circuit board at the panel offline to identify whether there is a short circuit or an open circuit. The board needs to be manually connected, and the sensitivity of each touch solution board to short circuit or open circuit varies, resulting in inconsistent offline standards. In addition, the touch solution needs to rely on software debugging, which may result in missed detection or even wrong detection.
[0045] Therefore, a touch component testing method is proposed, firstly, the power supply device is controlled to connect the power supply to the conductive layer to be tested in the touch component; then, the target thermal imaging data of the conductive layer to be tested is collected based on the thermal imaging device; finally, the conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data. When the conductive layer to be tested in the touch component fails, the resistance at the position where the failure occurs in the conductive layer to be tested will change, and then when the conductive layer to be tested is connected to the power supply, the thermal imaging data at the position where the failure occurs in the conductive layer to be tested will change, so that the position where the failure occurs in the conductive layer to be tested can be accurately located.
[0046] See also Figure 1 , Figure 1 An exemplary system architecture diagram of a touch component testing method provided in an embodiment of the present application.
[0047] like Figure 1 As shown, the system architecture may include a terminal 101, a network 102, and a server 103. The network 102 is used to provide a medium for a communication link between the terminal 101 and the server 103. The network 102 may include various types of wired communication links or wireless communication links, for example, the wired communication link includes an optical fiber, a twisted pair, or a coaxial cable, and the wireless communication link includes a Bluetooth communication link, a Wireless-Fidelity (Wi-Fi) communication link, or a microwave communication link.
[0048] The terminal 101 can interact with the server 103 through the network 102 to receive messages from the server 103 or send messages to the server 103, or the terminal 101 can interact with the server 103 through the network 102 to receive messages or data sent by other users to the server 103. The terminal 101 can be hardware or software. When the terminal 101 is hardware, it can be various terminals, including but not limited to smart watches, smart phones, tablet computers, laptop portable computers and desktop computers. When the terminal 101 is software, it can be installed in the terminals listed above, which can be implemented as multiple software or software modules (for example: used to provide distributed services), or it can be implemented as a single software or software module, which is not specifically limited here.
[0049] In an embodiment of the present application, the terminal 101 controls the power supply device to connect the power supply to the conductive layer to be tested in the touch component; collects target thermal imaging data of the conductive layer to be tested based on the thermal imaging device; and determines the conductivity test result of the conductive layer to be tested based on the target thermal imaging data.
[0050] The server 103 may be a business server that provides various services. It should be noted that the server 103 may be hardware or software. When the server 103 is hardware, it may be implemented as a distributed server cluster consisting of multiple servers, or it may be implemented as a single server. When the server 103 is software, it may be implemented as multiple software or software modules (for example, for providing distributed services), or it may be implemented as a single software or software module, which is not specifically limited here.
[0051] Alternatively, the system architecture may not include the server 103. In other words, the server 103 may be an optional device in the embodiments of this specification. That is, the method provided in the embodiments of this specification may be applied to a system structure that only includes the terminal 101, and the embodiments of this application do not limit this.
[0052] It should be understood that Figure 1 The number of terminals, networks and servers in the figure is only for illustration and any number of terminals, networks and servers may be used according to implementation requirements.
[0053] See also Figure 2 , Figure 2 A flow chart of a touch component testing method provided in an embodiment of the present application. The execution subject of the embodiment of the present application can be a terminal that executes the touch component test, or a processor in the terminal that executes the touch component testing method, or a touch component testing service in the terminal that executes the touch component testing method. For the convenience of description, the specific execution process of the touch component testing method is introduced below by taking the execution subject being the processor in the terminal as an example.
[0054] like Figure 2 As shown, the touch component testing method may at least include:
[0055] S201 , controlling the power supply device to connect power to the conductive layer to be tested in the touch component.
[0056] The data sending and receiving conductive layer materials used in the field of capacitive touch are mostly conductive materials such as SNW, ITO or MetalMesh. No matter what process (spraying, printing, embossing, etching, laser, cutting, etc.) is used to produce the conductive layer, a patterned conductive layer will eventually be obtained as a touch electrode.
[0057] Therefore, in the process of testing the touch component, it is necessary to first connect the power supply to the conductive layer to be tested in the touch component, wherein the conductive layer to be tested in the touch component can be designed into different patterns as needed, so that at least one conductive channel can be formed, and then the power supply device can be controlled to connect the power supply to at least one conductive channel in the conductive layer to be tested in the touch component, wherein the power supply device is one of a constant current power supply, a constant voltage power supply or an AC power supply.
[0058] Specifically, in the process of controlling the power supply device to connect the power supply to at least one conductive channel in the conductive layer to be tested in the touch component, the conductive channels can be tested one by one, or all channels can be tested at the same time. Connecting the power supply to the conductive channel means connecting one end of the conductive channel to the power input and the other end to the ground (if it is an AC power supply, it is connected to the corresponding electrode of zero).
[0059] S202 , collecting target thermal imaging data of the conductive layer to be tested based on a thermal imaging device.
[0060] In the present application, the processor can be connected to a thermal imaging device, wherein the thermal imaging device is generally composed of an optical-mechanical component, a focus / magnification component, an internal non-uniformity correction component (hereinafter referred to as an internal correction component), an imaging circuit component, and an infrared detector / refrigerator component. The optical-mechanical component is mainly composed of an infrared objective lens and a structural component, wherein the infrared objective lens mainly realizes the convergence imaging of the thermal radiation of the scene, and the structural component is mainly used to support and protect the relevant components; the focus / magnification component is mainly composed of a servo mechanism and a servo control circuit, which realizes the focusing, field of view switching and other functions of the infrared objective lens; the internal correction component is composed of an internal correction mechanism and an internal correction control circuit, which is used to realize the internal (non-uniformity) correction function of the infrared thermal imager; the imaging circuit component is generally composed of a detector interface board, a main processing board, a refrigerator drive board, and a power supply board, etc., which cooperate to realize the functions of power-on control, signal acquisition, signal transmission, signal conversion, and interface communication. The infrared detector / refrigerator component mainly converts the infrared radiation transmitted and converged by the infrared objective lens into an electrical signal.
[0061] Thermal imaging equipment is a device that uses infrared thermal imaging technology to detect the infrared radiation of the target object and convert the image of the temperature distribution of the target object into a visible image through signal processing, photoelectric conversion, etc. Thermal imaging equipment accurately quantifies the actual detected heat and images the entire target object in real time in the form of a surface.
[0062] Furthermore, after the control power supply device connects the power supply to the conductive layer to be tested in the touch component, the conductive layer to be tested will be energized. Since there is resistance in the conductive layer to be tested, heat will be generated after current passes through the resistance. Therefore, the thermal imaging device can be set in a relatively parallel position of the conductive layer to be tested, so that the thermal imaging device can collect target thermal imaging data of the conductive layer to be tested. The target thermal imaging data is also the heat data generated by the heat generated by the resistance in the conductive layer to be tested after current passes through the conductive layer.
[0063] S203 , determining a conductivity test result of the conductive layer to be tested based on the target thermal imaging data.
[0064] Since the conductive channel composed of the conductive layer in the touch component must have a certain resistance value, the resistance distribution at each location varies with the width of the conductive channel. When power is applied, the heat generated by the larger resistance area is greater than that of the smaller resistance area. Therefore, different parts will generate different radiation energy due to the difference in resistance. Therefore, the radiation energy can be detected by thermal imaging equipment, that is, the conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data. When a fault occurs in the conductive layer to be tested in the touch component, the resistance at the location where the fault occurs in the conductive layer to be tested will change. Then, after the conductive layer to be tested is connected to power, the thermal imaging data at the location where the fault occurs in the conductive layer to be tested will change, so as to identify possible circuit abnormalities.
[0065] See also Figure 3 , Figure 3 This is a schematic diagram of thermal imaging corresponding to a crack in the conductive layer to be tested provided in an embodiment of the present application. Figure 4 , Figure 4 This is another thermal imaging schematic diagram corresponding to a crack in a conductive layer to be tested provided in an embodiment of the present application. Figure 5 , Figure 5 A schematic diagram of thermal imaging corresponding to a crack appearing in another conductive layer to be tested provided in an embodiment of the present application.
[0066] Figure 3 , Figure 4 as well as Figure 5 The target area indicated by the middle rectangular schematic bar, which has a thermal imaging display difference with the surrounding area, is the area where cracks appear in the conductive layer to be tested. When cracks appear in part of the conductive layer to be tested in the touch component, the resistance of the area will increase, resulting in increased heat generation, so that the thermal imaging of the area where cracks appear in the conductive layer to be tested and the surrounding area will show obvious differences, thereby identifying possible circuit open conditions based on the changes in thermal imaging data at the location where the fault occurs in the conductive layer to be tested.
[0067] See also Figure 6 , Figure 6This is a schematic diagram of a structure in which there is a short circuit between channels in a conductive layer to be tested provided by an embodiment of the present application. Figure 7 , Figure 7 A schematic diagram of thermal imaging corresponding to a short circuit between channels in a conductive layer to be tested provided in an embodiment of the present application. Figure 6 The medium gray non-shaded area is the conductive layer to be tested. Figure 6 When there is a short circuit between the channels, the corresponding Figure 7 In the thermal imaging, the shadow area between channels, i.e. the floating area, will have obvious changes in the color of the thermal imaging, indicating that the area is generating heat, and the imaging color of the area is different from that of the surrounding areas. Generally, the floating area is not conductive, but the floating area may have conductive materials between channels that have not been cleaned up by laser or etching or silver paste after embossing. Therefore, the cross-domain is also based on the changes in the thermal imaging data at the location where the fault occurs in the conductive layer to be tested to identify possible circuit short circuits.
[0068] See also Figure 8 , Figure 8 A thermal imaging schematic diagram of a micro short circuit between a channel and a floating area in a conductive layer to be tested provided in an embodiment of the present application. Here, the conductive material between the channels may be not cleaned up by laser or etching in the floating area, or the silver paste may not be cleaned after printing, resulting in a micro short circuit between the channel and the floating area in the conductive layer to be tested. At this time, the resistance of the micro short circuit area is reduced, resulting in a decrease in the heat generated, which makes the thermal imaging color of the micro short circuit area and the thermal imaging color of the channel without faults significantly different. Therefore, the change of thermal imaging data at the location where the fault occurs in the conductive layer to be tested is also cross-domain based to identify possible circuit micro short circuits.
[0069] The embodiment of the present application provides a touch component testing method, firstly, the power supply device is controlled to connect the power supply to the conductive layer to be tested in the touch component; then, the target thermal imaging data of the conductive layer to be tested is collected based on the thermal imaging device; finally, the conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data. When the conductive layer to be tested in the touch component fails, the resistance at the position where the failure occurs in the conductive layer to be tested will change, and then when the conductive layer to be tested is connected to the power supply, the thermal imaging data at the position where the failure occurs in the conductive layer to be tested will change, so that the position where the failure occurs in the conductive layer to be tested can be accurately located.
[0070] See also Fig. 9 , Fig. 9 A schematic flow chart of another touch component testing method provided in an embodiment of the present application.
[0071] S901, controlling the power supply device to connect power to the conductive layer to be tested in the touch component.
[0072] Regarding step S901, please refer to the above step S201, which will not be repeated here.
[0073] S902. Collect target thermal imaging data of the conductive layer to be tested based on the thermal imaging device
[0074] Regarding step S902, please refer to the above step S202, which will not be repeated here.
[0075] S903 . Determine a conductivity test result of the conductive layer to be tested based on the target thermal imaging data and the standard thermal imaging data corresponding to the conductive layer to be tested.
[0076] In an embodiment of the present application, a touch component without circuit faults can be energized in advance, and thermal imaging data of each conductive layer in the touch component can be obtained, and the thermal imaging data can be used as standard thermal imaging data of the touch component. The standard thermal imaging data of the touch component can then be used as a comparison object for the target thermal imaging data of the conductive layer to be tested, thereby determining the conductivity test result of the conductive layer to be tested.
[0077] Furthermore, the thermal imaging parameters at each position in the conductive layer to be tested can be first determined based on the target thermal imaging data. Since the target thermal imaging data is an image of the temperature distribution of the conductive layer to be tested, in order to facilitate comparison with the standard thermal imaging data, the image plane corresponding to the conductive layer to be tested can be determined, and a coordinate system can be established in the image plane, and then the thermal imaging parameters at each position in the conductive layer to be tested can be determined based on the coordinates corresponding to the target thermal imaging data in the coordinate system.
[0078] Furthermore, since the thermal imaging parameters at each position of the conductive layer in the standard thermal imaging data of the touch component are standard data, the first thermal imaging parameters at each position in the conductive layer to be tested can be compared with the second thermal imaging parameters at the corresponding position in the standard thermal imaging data. Specifically, the first thermal imaging parameters at each position in the conductive layer to be tested can be compared with the standard thermal imaging parameters (i.e., the second thermal imaging parameters) at each position in the conductive layer to be tested.
[0079] Furthermore, based on the comparison result of each first thermal imaging parameter and the second thermal imaging parameter respectively corresponding to each first thermal imaging parameter, the conductivity test result of the conductive layer to be tested is determined.
[0080] Specifically, after comparing the first thermal imaging parameters at each position in the conductive layer to be tested with the standard thermal imaging parameters (i.e., the second thermal imaging parameters) at each position in the conductive layer to be tested, when there is a target first thermal imaging parameter in each first thermal imaging parameter that is less than the first preset value of the second thermal imaging parameter corresponding to the target first thermal imaging parameter, it can be determined that the temperature at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested is less than the temperature at the position corresponding to the second thermal imaging parameter corresponding to the target first thermal imaging parameter in the conductive layer to be tested, that is, the resistance at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested is greater than the resistance at the position corresponding to the second thermal imaging parameter corresponding to the target first thermal imaging parameter in the conductive layer to be tested, then it is determined that there is an open circuit at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested.
[0081] At the same time, the number and specific size of the first preset values can also be set as needed, so that the open circuit is divided into a micro-open circuit and a complete open circuit according to the difference between the target first thermal imaging parameter and the second thermal imaging parameter corresponding to the target first thermal imaging parameter, that is, when the first preset value is set to be small, the difference between the target first thermal imaging parameter and the second thermal imaging parameter corresponding to the target first thermal imaging parameter is also small. At this time, if the temperature at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested is less than the temperature at the position corresponding to the second thermal imaging parameter corresponding to the target first thermal imaging parameter in the conductive layer to be tested, then it is determined that the target first thermal imaging parameter has a micro-open circuit at the corresponding position in the conductive layer to be tested; when the first preset value is set to be large, the difference between the target first thermal imaging parameter and the second thermal imaging parameter corresponding to the target first thermal imaging parameter is also large. At this time, if the temperature at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested is less than the temperature at the position corresponding to the second thermal imaging parameter corresponding to the target first thermal imaging parameter in the conductive layer to be tested, then it is determined that the target first thermal imaging parameter has a complete open circuit at the corresponding position in the conductive layer to be tested.
[0082] Similarly, when there is a target second thermal imaging parameter in each first thermal imaging parameter that is greater than the second preset value of the second thermal imaging parameter corresponding to the target second thermal imaging parameter, it can be determined that the temperature at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested is greater than the temperature at the position corresponding to the second thermal imaging parameter corresponding to the target first thermal imaging parameter in the conductive layer to be tested, that is, the resistance at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested is less than the resistance at the position corresponding to the second thermal imaging parameter corresponding to the target first thermal imaging parameter in the conductive layer to be tested, and then it is determined that there is a short circuit at the position corresponding to the target second thermal imaging parameter in the conductive layer to be tested.
[0083] Similarly, the short circuit is divided into a micro short circuit and a complete short circuit according to the difference between the target second thermal imaging parameter and the second thermal imaging parameter corresponding to the target second thermal imaging parameter. That is, when the second preset value is set to be small, the difference between the target second thermal imaging parameter and the second thermal imaging parameter corresponding to the target second thermal imaging parameter is also small. At this time, if the temperature at the position corresponding to the target second thermal imaging parameter in the conductive layer to be tested is greater than the temperature at the position corresponding to the second thermal imaging parameter corresponding to the target second thermal imaging parameter in the conductive layer to be tested, then it is determined that there is a micro short circuit at the position corresponding to the target second thermal imaging parameter in the conductive layer to be tested; when the second preset value is set to be large, the difference between the target second thermal imaging parameter and the second thermal imaging parameter corresponding to the target second thermal imaging parameter is also large. At this time, if the temperature at the position corresponding to the target second thermal imaging parameter in the conductive layer to be tested is greater than the temperature at the position corresponding to the second thermal imaging parameter corresponding to the target second thermal imaging parameter in the conductive layer to be tested, then it is determined that there is a complete short circuit at the position corresponding to the target first thermal imaging parameter in the conductive layer to be tested.
[0084] In the embodiment of the present application, the conductivity test result of the conductive layer to be tested is determined by comparing the target thermal imaging data with the standard thermal imaging data corresponding to the conductive layer to be tested, so that the location and type of the fault in the conductive layer can be determined more accurately.
[0085] See also Fig.10 , Fig.10 A schematic diagram of the structure of a touch component testing device provided in an embodiment of the present application.
[0086] like Fig.10 As shown, the touch component testing device 1000 includes:
[0087] A power supply access module 1001, used to control the power supply device to access power to the conductive layer to be tested in the touch component;
[0088] Thermal imaging acquisition module 1002, used for acquiring target thermal imaging data of the conductive layer to be tested based on a thermal imaging device;
[0089] The test result determination module 1003 is used to determine the conductivity test result of the conductive layer to be tested based on the target thermal imaging data.
[0090] In one embodiment, the test result determination module 1003 is further configured to determine a conductivity test result of the conductive layer to be tested based on the target thermal imaging data and the standard thermal imaging data corresponding to the conductive layer to be tested.
[0091] In one embodiment, the test result determination module 1003 is further used to determine the thermal imaging parameters at each position in the conductive layer to be tested based on the target thermal imaging data;
[0092] Compare the first thermal imaging parameter at each position in the conductive layer to be tested with the second thermal imaging parameter at the corresponding position in the standard thermal imaging data;
[0093] Based on the comparison results of each first thermal imaging parameter and the second thermal imaging parameters respectively corresponding to each first thermal imaging parameter, a conductivity test result of the conductive layer to be tested is determined.
[0094] In one embodiment, the test result determination module 1003 is further used to determine that an open circuit exists at a position corresponding to the target first thermal imaging parameter in the conductive layer to be tested when a target first thermal imaging parameter among the first thermal imaging parameters is less than a first preset value of a second thermal imaging parameter corresponding to the target first thermal imaging parameter;
[0095] When a target second thermal imaging parameter among the first thermal imaging parameters is greater than a second preset value of the second thermal imaging parameter corresponding to the target second thermal imaging parameter, it is determined that a short circuit exists at a corresponding position of the target second thermal imaging parameter in the conductive layer to be tested.
[0096] In one embodiment, the test result determination module 1003 is further configured to divide the open circuit into a micro-open circuit and a complete open circuit according to a difference between a target first thermal imaging parameter and a second thermal imaging parameter corresponding to the target first thermal imaging parameter;
[0097] The short circuit is divided into a micro short circuit and a complete short circuit according to the difference between the target second thermal imaging parameter and the second thermal imaging parameter corresponding to the target second thermal imaging parameter.
[0098] In one embodiment, the test result determination module 1003 is further used to determine the image plane corresponding to the conductive layer to be tested, and to establish a coordinate system in the image plane;
[0099] Based on the coordinates corresponding to the target thermal imaging data in the coordinate system, the thermal imaging parameters at each position in the conductive layer to be tested are determined.
[0100] In one embodiment, there is at least one conductive channel in the conductive layer to be tested, and the power access module 1001 is also used to control the power supply device to access power for at least one conductive channel in the conductive layer to be tested in the touch component, wherein the power supply device is one of a constant current power supply, a constant voltage power supply or an AC power supply.
[0101] In an embodiment of the present application, the touch component testing device includes: a power supply access module, which is used to control the power supply device to access the power supply for the conductive layer to be tested in the touch component; a thermal imaging acquisition module, which is used to acquire the target thermal imaging data of the conductive layer to be tested based on the thermal imaging device; and a test result determination module, which is used to determine the conductivity test result of the conductive layer to be tested based on the target thermal imaging data. When the conductive layer to be tested in the touch component fails, the resistance at the position where the fault occurs in the conductive layer to be tested will change, and then when the conductive layer to be tested is connected to the power supply, the thermal imaging data at the position where the fault occurs in the conductive layer to be tested will change, so that the position where the fault occurs in the conductive layer to be tested can be accurately located.
[0102] One or more embodiments of the present specification further provide a computer storage medium, wherein the computer storage medium stores a plurality of instructions, wherein the instructions are suitable for being loaded by a processor and executing the steps of any of the methods in the above embodiments.
[0103] One or more embodiments of the present specification also provide a computer program product including instructions, and when the computer program product is executed on a computer or a processor, the computer or the processor executes the steps of any one of the methods in the above embodiments.
[0104] For further information, see Fig.11 , Fig.11 A schematic diagram of the structure of a terminal provided in an embodiment of the present application. Fig.11 As shown, the terminal 1100 may include: at least one processor 1101 , at least one network interface 1104 , a user interface 1103 , a memory 1105 , and at least one communication bus 1102 .
[0105] The communication bus 1102 is used to realize the connection and communication between these components.
[0106] The user interface 1103 may include a display screen (Display) and a camera (Camera), and the optional user interface 1103 may also include a standard wired interface and a wireless interface.
[0107] The network interface 1104 may optionally include a standard wired interface or a wireless interface (such as a WI-FI interface).
[0108] Among them, the processor 1101 may include one or more processing cores. The processor 1101 uses various interfaces and lines to connect the various parts of the entire terminal 1100, and executes various functions and processes data of the terminal 500 by running or executing instructions, programs, code sets or instruction sets stored in the memory 1105, and calling data stored in the memory 1105. Optionally, the processor 1101 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 1101 can integrate one or more combinations of processors (Central Processing Unit, CPU), image processors (Graphics Processing Unit, GPU) and modems. Among them, the CPU mainly processes operating systems, user interfaces, and applications; the GPU is responsible for rendering and drawing the content that needs to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 1101, and it can be implemented separately through a chip.
[0109] Among them, the memory 1105 may include a random access memory (Random Access Memory, RAM) and may also include a read-only memory (Read-Only Memory). Optionally, the memory 1105 includes a non-transitory computer-readable storage medium. The memory 1105 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 1105 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 1105 may also be optionally at least one storage device located away from the aforementioned processor 1101. As Fig.11 As shown, the memory 1105 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a touch component testing program.
[0110] exist Fig.11In the terminal 1100 shown, the user interface 1103 is mainly used to provide an input interface for the user and obtain the data input by the user; and the processor 1101 can be used to call the touch component test program stored in the memory 1105 and specifically perform the following operations:
[0111] Controlling the power supply device to connect the power supply to the conductive layer to be tested in the touch component;
[0112] Collect target thermal imaging data of the conductive layer to be tested based on a thermal imaging device;
[0113] A conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data.
[0114] Optionally, determining the conductivity test result of the conductive layer to be tested based on the target thermal imaging data includes: determining the conductivity test result of the conductive layer to be tested based on the target thermal imaging data and standard thermal imaging data corresponding to the conductive layer to be tested.
[0115] Optionally, determining a conductivity test result of the conductive layer to be tested based on the target thermal imaging data and standard thermal imaging data corresponding to the conductive layer to be tested includes:
[0116] Determine the thermal imaging parameters at each position in the conductive layer to be tested based on the target thermal imaging data;
[0117] Compare the first thermal imaging parameter at each position in the conductive layer to be tested with the second thermal imaging parameter at the corresponding position in the standard thermal imaging data;
[0118] Based on the comparison results of each first thermal imaging parameter and the second thermal imaging parameters respectively corresponding to each first thermal imaging parameter, a conductivity test result of the conductive layer to be tested is determined.
[0119] Optionally, determining the conductivity test result of the conductive layer to be tested based on the comparison result of each first thermal imaging parameter and the second thermal imaging parameter respectively corresponding to each first thermal imaging parameter includes:
[0120] When a target first thermal imaging parameter among the first thermal imaging parameters is smaller than a first preset value of a second thermal imaging parameter corresponding to the target first thermal imaging parameter, determining that an open circuit exists at a position corresponding to the target first thermal imaging parameter in the conductive layer to be tested;
[0121] When a target second thermal imaging parameter among the first thermal imaging parameters is greater than a second preset value of the second thermal imaging parameter corresponding to the target second thermal imaging parameter, it is determined that a short circuit exists at a corresponding position of the target second thermal imaging parameter in the conductive layer to be tested.
[0122] Optionally, the open circuit is divided into a micro-open circuit and a complete open circuit according to the difference between the target first thermal imaging parameter and the second thermal imaging parameter corresponding to the target first thermal imaging parameter;
[0123] The short circuit is divided into a micro short circuit and a complete short circuit according to the difference between the target second thermal imaging parameter and the second thermal imaging parameter corresponding to the target second thermal imaging parameter.
[0124] Optionally, determining the thermal imaging parameters at each position in the conductive layer to be tested based on the target thermal imaging data includes: determining an image plane corresponding to the conductive layer to be tested, and establishing a coordinate system in the image plane; determining the thermal imaging parameters at each position in the conductive layer to be tested based on the coordinates corresponding to the target thermal imaging data in the coordinate system.
[0125] Optionally, there is at least one conductive channel in the conductive layer to be tested, and the power supply device is controlled to connect the conductive layer to be tested in the touch component to a power source, including: controlling the power supply device to connect at least one conductive channel in the conductive layer to be tested in the touch component to a power source, wherein the power supply device is one of a constant current power supply, a constant voltage power supply or an AC power supply.
[0126] In the several embodiments provided in the embodiments of the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.
[0127] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0128] In addition, each functional module in each embodiment of the present application can be integrated into a processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The above integrated modules can be implemented in the form of hardware or in the form of software functional modules.
[0129] If the integrated module is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program code.
[0130] It should be noted that, for the above-mentioned method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present application are not limited by the described action sequence, because according to the embodiments of the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the embodiments of the present application.
[0131] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0132] The above is a description of a touch component testing method, device, storage medium and terminal provided in the embodiments of the present application. For those skilled in the art, according to the ideas of the embodiments of the present application, there may be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the embodiments of the present application.
Claims
1. A touch component testing method, characterized in that: The method comprises: Controlling the power supply device to connect the power supply to the conductive layer to be tested in the touch component; Collecting target thermal imaging data of the conductive layer to be tested based on a thermal imaging device; A conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data.
2. The method according to claim 1, characterized in that The step of determining a conductivity test result of the conductive layer to be tested based on the target thermal imaging data comprises: A conductivity test result of the conductive layer to be tested is determined based on the target thermal imaging data and the standard thermal imaging data corresponding to the conductive layer to be tested.
3. The method according to claim 2, characterized in that The step of determining a conductivity test result of the conductive layer to be tested based on the target thermal imaging data and the standard thermal imaging data corresponding to the conductive layer to be tested comprises: Determining thermal imaging parameters at various locations in the conductive layer to be tested based on the target thermal imaging data; Comparing the first thermal imaging parameter at each position in the conductive layer to be tested with the second thermal imaging parameter at the corresponding position in the standard thermal imaging data; Based on the comparison result of each first thermal imaging parameter and the second thermal imaging parameter respectively corresponding to each first thermal imaging parameter, a conductivity test result of the conductive layer to be tested is determined.
4. The method according to claim 3, characterized in that: The step of determining the conductivity test result of the conductive layer to be tested based on the comparison result of each first thermal imaging parameter and the second thermal imaging parameter respectively corresponding to each first thermal imaging parameter comprises: When a target first thermal imaging parameter among the first thermal imaging parameters is smaller than a first preset value of a second thermal imaging parameter corresponding to the target first thermal imaging parameter, determining that an open circuit exists at a position corresponding to the target first thermal imaging parameter in the conductive layer to be tested; When a target second thermal imaging parameter among the first thermal imaging parameters is greater than a second preset value of a second thermal imaging parameter corresponding to the target second thermal imaging parameter, it is determined that a short circuit exists at a corresponding position of the target second thermal imaging parameter in the conductive layer to be tested.
5. The method according to claim 4, characterized in that The open circuit is divided into a micro open circuit and a complete open circuit according to the difference between the first target thermal imaging parameter and the second thermal imaging parameter corresponding to the first target thermal imaging parameter; The short circuit is divided into a micro short circuit and a complete short circuit according to the difference between the target second thermal imaging parameter and the second thermal imaging parameter corresponding to the target second thermal imaging parameter.
6. The method according to claim 3, characterized in that The step of determining the thermal imaging parameters at each position in the conductive layer to be tested based on the target thermal imaging data comprises: Determining an image plane corresponding to the conductive layer to be tested, and establishing a coordinate system in the image plane; Based on the coordinates corresponding to the target thermal imaging data in the coordinate system, thermal imaging parameters at each position in the conductive layer to be tested are determined.
7. The method according to claim 1, characterized in that The conductive layer to be tested has at least one conductive channel, and the control power supply device connects the conductive layer to be tested in the touch component to a power source, including: The control power supply device connects at least one conductive channel in the conductive layer to be tested in the touch component to a power supply, wherein the power supply device is one of a constant current power supply, a constant voltage power supply or an alternating current power supply.
8. A touch component testing device, characterized in that: The device comprises: A power supply access module, used to control the power supply device to access power to the conductive layer to be tested in the touch component; A thermal imaging acquisition module, used for acquiring target thermal imaging data of the conductive layer to be tested based on a thermal imaging device; A test result determination module is used to determine a conductivity test result of the conductive layer to be tested based on the target thermal imaging data.
9. A computer storage medium, characterized in that: The computer storage medium stores a plurality of instructions, and the instructions are suitable for being loaded by a processor and executing the steps of the method according to any one of claims 1 to 7.
10. A terminal, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method according to any one of claims 1 to 7 when executing the program.