Novel wafer unloading shovel piece device and wafer production line

Abstract

The utility model relates to a novel wafer unloading and shoveling device and a wafer production line. The novel wafer unloading and shoveling device comprises a rack unit, a turnover adsorption unit, a shoveling unit, a slideway unit and a bearing unit. The device has the advantages that the inclination angle and the rotation position of the ceramic plate are accurately controlled by using the overturning adsorption unit, and the problems that the shoveling unit damages a wafer and the wafer cannot fall into the slideway unit due to inaccurate position are avoided; the pneumatic structure and the electric structure are used for adjusting the height position and the horizontal position of the shovel piece unit respectively, the position of the shovel piece unit is accurately controlled, and the problems that wafers cannot be separated and are damaged are avoided; the height position of the bearing unit is adjusted through the electric structure, the position of the wafer box is accurately positioned, and the problem that the wafer cannot enter the wafer box is avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a novel wafer unloading shovel device and wafer production line. Background Technology

[0002] Current mainstream wafer unloading mechanisms adopt a modular design, and their core architecture includes:

[0003] 1. Vertical Motion System: The wafer cassette and the wafer shovel device are raised and lowered in tandem via a pneumatically driven slide.

[0004] 2. Positioning and clamping system: The wafer cassette is rigidly clamped at three points using mechanical positioning blocks.

[0005] 3. Fixed support system: The slide and the slide stage adopt an integrated fixed installation method.

[0006] However, existing wafer unloading and shoveling mechanisms have the following drawbacks:

[0007] 1) Mechanical positioning error: The mechanical clamping method using fixed positioning blocks has a cumulative positioning gap error of 0.1-0.3mm, which can easily cause slight shaking of the wafer cassette during processing;

[0008] 2) Poor specification compatibility: The slide spacing of the fixed load-bearing system is not adjustable, and it can only be adapted to wafers of a single size specification (such as 8-inch / 12-inch wafers, which require different models to be customized).

[0009] 3) Insufficient motion control precision: The open-loop control method of the pneumatically driven slide cannot achieve sub-millimeter positioning, and the blade device has a positional deviation within the stroke range of 0.1-0.5mm;

[0010] 4) Dynamic positioning deviation: Non-contact pneumatic drive cannot compensate for the gravitational deformation of the wafer cassette in real time, resulting in a positional offset of 0.2-0.5mm for the wafer during the transfer process.

[0011] Currently, no effective solutions have been proposed for the problems existing in the related technologies, such as the inability to accurately control the wafer scooping mechanism, the inability to accurately position the wafer cassette, and the inability to unload wafers of different specifications. Utility Model Content

[0012] The purpose of this invention is to address the shortcomings of existing technologies by providing a novel wafer unloading shovel device and wafer production line, thereby solving problems such as the inability to accurately control the shovel mechanism, the inability to accurately position the wafer cassette, and the inability to unload wafers of different specifications.

[0013] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0014] In a first aspect, a novel wafer unloading shovel device is provided, comprising:

[0015] A rack unit, wherein the rack unit is disposed on a horizontal plane;

[0016] A flip adsorption unit is movably disposed on the frame unit for adsorbing ceramic discs with wafers and driving the ceramic discs to reciprocate along a first preset direction, a second preset direction, and a third preset direction.

[0017] A shovel unit is disposed on the frame unit and is used for reciprocating motion along a fourth preset direction and a fifth preset direction, as well as separating wafers from ceramic disks.

[0018] A slide rail unit is disposed in the frame unit and located downstream of the flip adsorption unit, and is used to carry wafers separated from the ceramic disk and to transfer wafers.

[0019] The carrier unit is movably disposed in the rack unit and located downstream of the slide unit, and is used for reciprocating along a sixth preset direction and for carrying the wafer cassette and transferring the wafer to the wafer cassette.

[0020] In some embodiments, the rack unit includes:

[0021] A rack assembly, the rack assembly being disposed on a horizontal plane;

[0022] A first fixing component is disposed on the frame assembly and connected to the flipping adsorption unit;

[0023] A second fixing component is disposed on the frame assembly and connected to the blade unit;

[0024] A third fixing component is disposed on the frame assembly and connected to the slide rail unit;

[0025] A fourth fixing component is disposed on the frame assembly and connected to the load-bearing unit.

[0026] In some embodiments, the flipping adsorption unit includes:

[0027] A first drive assembly is disposed in the rack unit;

[0028] A first support assembly is connected to the first drive assembly and is used to reciprocate along a first preset direction under the action of the first drive assembly.

[0029] A second drive component is disposed on the first support component and is used to follow the first support component in reciprocating motion along a first preset direction;

[0030] The second support assembly is connected to the second drive assembly and is used to reciprocate along a second preset direction under the action of the second drive assembly;

[0031] A third drive component is disposed on the second support component and is used to follow the second support component in reciprocating motion along a second preset direction;

[0032] An adsorption component is movably disposed on the first support component and connected to the third drive component. It is used to follow the first support component in reciprocating motion along a first preset direction, follow the second support component in reciprocating motion along a second preset direction, and reciprocate motion along a third preset direction under the action of the third drive component, as well as to adsorb the ceramic disk on which the wafer is attached.

[0033] In some embodiments, the first driving component includes:

[0034] A first actuator is disposed on the rack assembly;

[0035] A first transmission element is connected to the first actuator and the first support assembly, respectively, and is used to drive the first support assembly to reciprocate along a first preset direction under the action of the first actuator.

[0036] In some embodiments, the first driving component further includes:

[0037] The first connecting element is connected to the first transmission element and the first support assembly respectively, and is used to drive the first support assembly to reciprocate along a first preset direction under the action of the first transmission element.

[0038] In some embodiments, the second driving component includes:

[0039] A second actuator is disposed on the first support assembly and is used to reciprocate along a first preset direction following the first support assembly.

[0040] The second transmission element is connected to the second actuator and the second support assembly respectively, and is used to drive the second support assembly to reciprocate along a second preset direction under the action of the second actuator.

[0041] In some embodiments, the second driving component further includes:

[0042] The second connecting element is connected to the second transmission element and the second support assembly respectively, and is used to drive the second support assembly to reciprocate along a second preset direction under the action of the second transmission element.

[0043] In some embodiments, the third driving component includes:

[0044] A third actuator is disposed on the second support assembly and is used to reciprocate along a second preset direction following the second support assembly.

[0045] The third transmission element is connected to the third actuator and the adsorption assembly respectively, and is used to drive the adsorption assembly to reciprocate along a third preset direction under the action of the third actuator.

[0046] In some embodiments, the third driving component further includes:

[0047] The third connecting element is connected to the third transmission element and the adsorption assembly respectively, and is used to drive the adsorption assembly to reciprocate along a third preset direction under the action of the third transmission element.

[0048] In some embodiments, the flipping adsorption unit further includes:

[0049] At least one rotating component is disposed between the second support assembly and the frame unit to improve the rotational stability of the first support assembly.

[0050] In some embodiments, the rotating assembly includes:

[0051] A first rotating element is disposed in the frame unit;

[0052] The second rotating element is disposed on the second support assembly and rotatably connected to the first rotating element, thereby improving the rotational stability of the second support assembly.

[0053] In some embodiments, the flipping adsorption unit further includes:

[0054] Two sixth support assemblies are symmetrically arranged on the second support assembly 240 and located on the side of the adsorption assembly;

[0055] At least one conveying component is disposed on the side of the adsorption component and is movably connected to the two sixth support components respectively, for conveying ceramic discs.

[0056] In some embodiments, the delivery assembly includes:

[0057] A movable element, which is movably disposed on the side of the adsorption assembly, is used to transfer the ceramic disc;

[0058] A third rotating element is disposed at the first end of the movable element and is rotatably connected to a sixth support assembly.

[0059] A fourth rotating element is disposed at the second end of the movable element and is rotatably connected to another of the sixth support assemblies.

[0060] In some embodiments, the shovel unit includes:

[0061] A fourth drive assembly is disposed in the rack unit;

[0062] The third support assembly is connected to the fourth drive assembly and is used to reciprocate along a fourth preset direction under the action of the fourth drive assembly.

[0063] The fifth drive component is disposed on the third support component and is used to follow the third support component in reciprocating motion along a fourth preset direction;

[0064] The fourth support assembly is connected to the fifth drive assembly and is used to reciprocate along the fourth preset direction following the fifth drive assembly and to reciprocate along the fifth preset direction under the action of the fifth drive assembly.

[0065] A shovel assembly is disposed on the fourth support assembly and is used to follow the fourth support assembly in reciprocating motion along a fourth preset direction and a fifth preset direction to separate the wafer and the ceramic disk.

[0066] In some embodiments, the fourth driving component includes:

[0067] A fourth actuator is disposed in the rack unit;

[0068] The fourth transmission element is connected to the fourth actuator and the third support assembly respectively, and is used to drive the third support assembly to reciprocate along a fourth preset direction under the action of the fourth actuator.

[0069] In some embodiments, the fourth driving component further includes:

[0070] The fourth connecting element is connected to the fourth transmission element and the third support assembly respectively, and is used to drive the third support assembly to reciprocate along a fourth preset direction under the action of the fourth transmission element.

[0071] In some embodiments, the fifth driving component includes:

[0072] The fifth actuator is disposed on the third support assembly and is used to reciprocate along the fourth preset direction following the third support assembly;

[0073] The fifth transmission element is connected to the fifth actuator and the fourth support assembly respectively, and is used to drive the fourth support assembly to reciprocate along a fifth preset direction under the action of the fifth actuator.

[0074] In some embodiments, the fifth drive component further includes:

[0075] The fifth connecting element is connected to the fifth transmission element and the fourth support assembly respectively, and is used to drive the fourth support assembly to reciprocate along a fifth preset direction under the action of the fifth transmission element.

[0076] In some embodiments, the shovel unit further includes:

[0077] At least one first sliding component is disposed between the third support assembly and the frame unit to improve the sliding stability of the third support assembly.

[0078] In some embodiments, the first sliding component includes:

[0079] A first sliding element is disposed in the frame unit;

[0080] The second sliding element is disposed on the third support assembly and is slidably connected to the first sliding element.

[0081] In some embodiments, the shovel unit further includes:

[0082] A first sensing component is disposed on the side of the fifth driving component and is used to sense the position of the fourth support component.

[0083] In some embodiments, the slide unit includes:

[0084] A slide assembly is disposed in the frame unit and located between the flip adsorption unit and the carrier unit, for carrying wafers separated from the ceramic disk and transferring wafers to the carrier unit;

[0085] At least one guide component is disposed on the upper part of the slide assembly for guiding the sliding direction of the wafer.

[0086] In some embodiments, the slide assembly includes:

[0087] A slide rail element is disposed in the frame unit and located between the flip adsorption unit and the carrier unit, for carrying wafers separated from the ceramic disk and transferring wafers to the carrier unit.

[0088] In some embodiments, the slide assembly further includes:

[0089] A plurality of sixth connecting elements are distributed on the slide element and are detachably connected to the corresponding guide assembly.

[0090] In some embodiments, the guiding component includes:

[0091] A guide element is disposed on the slide assembly.

[0092] In some embodiments, the guiding component further includes:

[0093] A plurality of seventh connecting elements are distributed on the guide element and are detachably connected to the slide assembly.

[0094] In some embodiments, the carrier unit includes:

[0095] A sixth drive assembly is disposed in the rack unit;

[0096] The fifth support assembly is connected to the sixth drive assembly and is used to reciprocate along a sixth preset direction under the action of the sixth drive assembly;

[0097] At least one carrier component is disposed on the fifth support component and is used to follow the fifth support component in reciprocating motion along a sixth preset direction, to carry the wafer cassette, and to transfer the wafer to the wafer cassette.

[0098] In some embodiments, the sixth driving component includes:

[0099] A sixth actuator is disposed in the rack unit;

[0100] The sixth transmission element is connected to the sixth actuator and the fifth support assembly respectively, and is used to drive the fifth support assembly to reciprocate along a preset direction under the action of the sixth actuator.

[0101] In some embodiments, the sixth drive component further includes:

[0102] The eighth connecting element is connected to the sixth transmission element and the fifth support assembly respectively, and is used to drive the fifth support assembly to reciprocate along a sixth preset direction under the action of the eighth transmission element.

[0103] In some embodiments, the carrier component includes:

[0104] A load-bearing element, wherein the load-bearing element is disposed on the fifth support assembly;

[0105] At least one positioning element is disposed on the carrier element for positioning the wafer cassette.

[0106] In some embodiments, the carrier unit further includes:

[0107] At least one mounting component is disposed between the fifth bracket assembly and the corresponding support assembly for mounting the support assembly.

[0108] In some embodiments, the mounting components include:

[0109] A first mounting element is disposed on the fifth bracket assembly;

[0110] A second mounting element is disposed on the support assembly and connected to the first mounting element.

[0111] In some embodiments, the carrier unit further includes:

[0112] At least one second sliding component is provided, which is disposed between the fifth support assembly and the frame unit to improve the sliding stability of the fifth support assembly.

[0113] In some embodiments, the second sliding component includes:

[0114] A third sliding element is disposed in the frame unit;

[0115] A fourth sliding element is disposed on the fifth bracket assembly and is slidably connected to the third sliding element.

[0116] In some embodiments, the carrier unit further includes:

[0117] The second sensing component is disposed on the side of the sixth driving component and is used to sense the position of the fifth support component.

[0118] In some of these embodiments, it also includes:

[0119] The display unit is disposed in the rack unit and is used to display operating parameters.

[0120] In some embodiments, the display unit includes:

[0121] A base assembly disposed on the rack unit;

[0122] A support arm assembly, the first end of which is connected to the base assembly;

[0123] The display component is connected to the second end of the support arm assembly and is used to display operating parameters.

[0124] Secondly, a wafer production line is provided, comprising:

[0125] The novel wafer unloading shovel device as described in the first aspect.

[0126] In some of these embodiments, it also includes:

[0127] A control device is provided, which is connected to the flipping adsorption unit, the shovel unit, and the carrying unit of the novel wafer unloading shovel device.

[0128] In some of these embodiments, it also includes:

[0129] A gas source device is provided, which is connected to the flipping adsorption unit and the shovel unit of the novel wafer unloading shovel device.

[0130] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0131] This invention discloses a novel wafer unloading shovel device and wafer production line. It utilizes a flip-adsorption unit to precisely control the tilt angle and rotation position of the ceramic disk, avoiding problems such as wafer damage due to inaccurate positioning and wafers failing to fall into the slide unit. Pneumatic and electric structures are used to adjust the height and horizontal position of the shovel unit, precisely controlling its position and preventing wafer separation failure or damage. An electric structure is used to adjust the height of the carrying unit, precisely positioning the wafer cassette and preventing wafers from failing to enter the cassette. Attached Figure Description

[0132] Figure 1 This is a schematic diagram (a) of a novel wafer unloading product device according to an embodiment of the present utility model;

[0133] Figure 2 This is a schematic diagram (II) of a novel wafer unloading product device according to an embodiment of the present utility model;

[0134] Figure 3 This is a schematic diagram of a rack unit according to an embodiment of the present utility model;

[0135] Figure 4 This is a schematic diagram of the flipping adsorption unit according to an embodiment of the present utility model;

[0136] Figure 5 This is a schematic diagram of the shovel unit according to an embodiment of the present utility model;

[0137] Figure 6 This is a schematic diagram of a slide rail unit according to an embodiment of the present utility model;

[0138] Figure 7 This is a schematic diagram of the carrier unit according to an embodiment of the present utility model;

[0139] Figure 8 This is a schematic diagram of a display unit according to an embodiment of the present utility model;

[0140] Figure 9 This is a schematic diagram of a wafer production line according to an embodiment of the present invention.

[0141] The reference numerals in the accompanying drawings are as follows: 100, rack unit; 110, rack assembly; 120, first fixing assembly; 130, second fixing assembly; 140, third fixing assembly; 150, fourth fixing assembly;

[0142] 200, Flip adsorption unit; 210, First drive assembly; 211, First actuator; 212, First transmission element; 220, First support assembly; 230, Second drive assembly; 231, Second actuator; 232, Second transmission element; 240, Second support assembly; 250, Third drive assembly; 251, Third actuator; 252, Third transmission element; 260, Adsorption assembly; 270, Sixth support assembly; 280, Conveying assembly; 281, Movable element;

[0143] 300, Shovel unit; 310, Fourth drive assembly; 311, Fourth actuator; 312, Fourth transmission element; 320, Third support assembly; 330, Fifth drive assembly; 331, Fifth actuator; 332, Fifth transmission element; 340, Fourth support assembly; 350, Shovel assembly; 360, First sliding assembly; 361, First sliding element; 362, Second sliding element; 370, First sensing assembly;

[0144] 400. Slide unit; 410. Slide assembly; 411. Slide element; 420. Guide assembly; 421. Guide element;

[0145] 500, Bearing unit; 510, Sixth drive assembly; 511, Sixth actuating element; 512, Sixth transmission element; 520, Fifth support assembly; 530, Bearing assembly; 531, Bearing element; 532, Positioning element; 540, Mounting assembly; 541, First mounting element; 542, Second mounting element; 550, Second sliding assembly; 551, Third sliding element; 552, Fourth sliding element; 560, Second sensing assembly;

[0146] 600. Display unit; 610. Base assembly; 620. Support arm assembly; 630. Display assembly;

[0147] A. New type of wafer unloading shovel device; B. Control device; C. Air source device. Detailed Implementation

[0148] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0149] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0150] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0151] Example 1

[0152] This embodiment relates to a novel wafer unloading product device of this utility model.

[0153] An illustrative embodiment of this utility model, such as Figures 1-2As shown, a novel wafer unloading and shoveling device includes a frame unit 100, a flipping and adsorption unit 200, a shoveling unit 300, a slide unit 400, and a carrying unit 500. The frame unit 100 is disposed on a horizontal plane; the flipping and adsorption unit 200 is movably disposed on the frame unit 100 for adsorbing a ceramic disk containing wafers and for driving the ceramic disk to reciprocate along a first preset direction, a second preset direction, and a third preset direction; the shoveling unit 300 is disposed on the frame unit 100 for reciprocating along a fourth preset direction and a fifth preset direction and for separating the wafer from the ceramic disk; the slide unit 400 is disposed on the frame unit 100 and downstream of the flipping and adsorption unit 200 for carrying the wafer separated from the ceramic disk and for transferring the wafer; the carrying unit 500 is movably disposed on the frame unit 100 and downstream of the slide unit 400 for reciprocating along a sixth preset direction, carrying a wafer cassette, and transferring wafers to the wafer cassette.

[0154] The working principle of this utility model is as follows:

[0155] (a) Shovel blade

[0156] The ceramic disk carrying the chip is conveyed to the upper part of the flip adsorption unit 200;

[0157] The flip adsorption unit 200 operates, moving upward along the second preset direction to a preset position and adsorbing the ceramic disc;

[0158] The flip adsorption unit 200 operates, moving forward along the first preset direction to a preset position;

[0159] The flip adsorption unit 200 operates, rotating along the third preset direction to a preset position;

[0160] The shovel unit 300 operates, moving downwards along the fourth preset direction to a preset position;

[0161] The shovel unit 300 operates by moving forward along the fifth preset direction to a preset position to separate the wafer from the ceramic disk and transport the wafer to the slide unit 400;

[0162] The wafer slides through the slide unit 400 to the wafer cassette located in the carrier unit 500;

[0163] The carrier unit 500 operates by moving upward along the sixth preset direction to a preset position to carry the next chip;

[0164] While the wafer slides through the slide unit 400, the wafer scraping unit 300 moves backward along the fifth preset direction to a preset position, and the flipping and adsorption unit 200 rotates along the third preset direction to a preset position to perform the wafer scraping process for the next wafer.

[0165] (II) Replace the ceramic plate

[0166] After all the wafers in the ceramic disk are transferred to the wafer box, the flip adsorption unit 200 operates and moves backward along the first preset direction to the preset position;

[0167] The flip adsorption unit 200 operates, releasing the adsorption on the ceramic disk, transferring the empty ceramic disk, and placing a new ceramic disk carrying the wafer into it.

[0168] (III) Replacement of the chip cassette

[0169] Repeat the above steps until the wafer cassette is full of wafers, then remove the wafer cassette from the carrier unit 500.

[0170] like Figure 3 As shown, the frame unit 100 includes a frame assembly 110, a first fixing assembly 120, a second fixing assembly 130, a third fixing assembly 140, and a fourth fixing assembly 150. The frame assembly 110 is disposed on a horizontal plane; the first fixing assembly 120 is disposed on the frame assembly 110 and connected to the flipping adsorption unit 200; the second fixing assembly 130 is disposed on the frame assembly 110 and connected to the shovel unit 300; the third fixing assembly 140 is disposed on the frame assembly 110 and connected to the slide rail unit 400; and the fourth fixing assembly 150 is disposed on the frame assembly 110 and connected to the bearing unit 500.

[0171] In some embodiments, the frame assembly 110 is a monolithic aluminum alloy profile frame. The purpose of this structure is to achieve lightweight construction, allow screws and nuts to slide within the profile grooves, and facilitate installation and maintenance.

[0172] In some embodiments, the rack assembly 110 also uses PVC sheet as its side panels. This design aims to be environmentally friendly, acid and corrosion resistant, and extend equipment lifespan.

[0173] In some of these embodiments, for PVC sheets, a zigzag weld is used at the bend.

[0174] In some embodiments, the first fixing component 120 is detachably connected to the frame assembly 110, for example, by bolts. This design allows for adjustment of the position of the first fixing component 120.

[0175] In some of these embodiments, the first fixing component 120 includes, but is not limited to, a mounting plate and a mounting slot.

[0176] In some embodiments, the second fixing component 130 is detachably connected to the frame assembly 110, for example, by bolts. This design allows for adjustment of the position of the second fixing component 130.

[0177] In some embodiments, the second fixing component 130 includes, but is not limited to, a mounting plate.

[0178] In some embodiments, the third fixing component 140 is detachably connected to the frame assembly 110, for example, by bolts. This design allows for adjustment of the position of the third fixing component 140.

[0179] In some of these embodiments, the third fixing component 140 includes, but is not limited to, a mounting plate and a mounting slot.

[0180] In some embodiments, the fourth fixing component 150 is detachably connected to the frame assembly 110, for example, by bolts. This design allows for adjustment of the position of the fourth fixing component 150.

[0181] In some embodiments, the fourth fixing component 150 includes, but is not limited to, a mounting plate.

[0182] like Figure 4 As shown, the flip adsorption unit 200 includes a first driving component 210, a first support component 220, a second driving component 230, a second support component 240, a third driving component 250, and an adsorption component 260. The first drive assembly 210 is disposed on the rack unit 100; the first support assembly 220 is connected to the first drive assembly 210 and is used to reciprocate along a first preset direction under the action of the first drive assembly 210; the second drive assembly 230 is disposed on the first support assembly 220 and is used to follow the first support assembly 220 in reciprocating along the first preset direction; the second support assembly 240 is connected to the second drive assembly 230 and is used to follow the second drive assembly 230 in reciprocating along a second preset direction; the third drive assembly 250 is disposed on the second support assembly 240 and is used to follow the second support assembly 240 in reciprocating along the second preset direction; the adsorption assembly 260 is movably disposed on the first support assembly 220 and connected to the third drive assembly 250, and is used to follow the first support assembly 220 in reciprocating along the first preset direction, follow the second support assembly 240 in reciprocating along the second preset direction, reciprocate along the third preset direction under the action of the third drive assembly 250, and adsorb the ceramic disk on which the wafer is attached.

[0183] Specifically, the first drive assembly 210 is connected to the first fixing assembly 120; the second bracket assembly 240 is movably connected to the first fixing assembly 120.

[0184] The working principle of the flip adsorption unit 200 is as follows:

[0185] (a) Shovel blade

[0186] The second drive component 230 operates, driving the third drive component 250 and the adsorption component 260 to move upward along the second preset direction to the preset position via the second support component 240.

[0187] Adsorption component 260 adsorption ceramic disc;

[0188] The first drive assembly 210 operates, driving the second drive assembly 230, the second support assembly 240, the third drive assembly 250, and the adsorption assembly 260 to move forward along the first preset direction to a preset position via the first support assembly 220;

[0189] The third driving component 250 operates, driving the adsorption component 260 to rotate along the third preset direction to the preset position;

[0190] (II) Replace the ceramic plate

[0191] After all the wafers in the ceramic disk are transferred to the wafer box, the first driving component 210 works, driving the second driving component 230, the second supporting component 240, the third driving component 250, and the adsorption component 260 to move backward to the preset position along the first preset direction through the first support component 220.

[0192] The adsorption component 260 releases the adsorption on the ceramic disc;

[0193] The second drive component 230 operates, driving the third drive component 250 and the adsorption component 260 to move downward along the second preset direction to the preset position via the second support component 240.

[0194] The ceramic disc is removed, and a new ceramic disc is placed on top of the adsorption assembly 260;

[0195] Repeat step (1) until the adsorption component 260 adsorbs the ceramic disc.

[0196] In this invention, the first driving component 210 is inclined, thereby allowing the second support component 240 to rotate around the connection between the second support component 240 and the first fixing component 120. Specifically, under the action of the first driving component 210, the second support component 240 can rotate from a horizontal position to an inclined position, facilitating the scraping unit 300 to scrape the wafer and allowing the wafer to slide downwards under the action of gravity.

[0197] In this utility model, the first drive component 210 is a linear motion mechanism, including but not limited to a cylinder mechanism, a motor mechanism, etc.

[0198] In some of these embodiments, the first drive component 210 is a cylinder mechanism.

[0199] In some embodiments, the first drive assembly 210 includes a first actuating element 211 and a first transmission element 212. The first actuating element 211 is disposed on the frame assembly 110; the first transmission element 212 is connected to the first actuating element 211 and the first support assembly 220 respectively, and is used to drive the first support assembly 220 to reciprocate along a first preset direction under the action of the first actuating element 211.

[0200] The first preset direction is the axial direction of the first transmission element 212.

[0201] The first actuating element 211 is detachably connected to the first fixing assembly 120. For example, it is fixed to the first fixing assembly 120 by means of a mounting bracket, bolts, etc.

[0202] In some of these embodiments, the first actuating element 211 includes, but is not limited to, a cylinder, a motor, etc.

[0203] In some of these embodiments, the first transmission element 212 includes, but is not limited to, a piston structure (such as a combination of a piston and a piston rod), a lead screw, etc.

[0204] Furthermore, the first drive assembly 210 also includes a first connecting element. The first connecting element is connected to the first transmission element 212 and the first support assembly 220 respectively, and is used to drive the first support assembly 220 to reciprocate along a first preset direction under the action of the first transmission element 212.

[0205] The first connecting element is detachably or movably connected to the first transmission element 212. For example, the first connecting element and the first transmission element 212 (such as a piston structure) are connected by bolts or the like; the first connecting element and the first transmission element 212 (such as a lead screw) are connected by a threaded rotation.

[0206] In some of these embodiments, the first connecting element includes, but is not limited to, a connecting plate, a connecting base, a connecting frame, etc.

[0207] The first support assembly 220 is connected to the first transmission element 212 or the first connecting element of the first drive assembly 210, including but not limited to fixed connection, detachable connection, etc.

[0208] In some of these embodiments, the first support assembly 220 includes, but is not limited to, mounting brackets, fixing brackets, etc.

[0209] In this invention, the second drive assembly 230 is arranged perpendicular to the first support assembly 220.

[0210] In this invention, the second drive component 230 is a linear motion mechanism, including but not limited to a cylinder mechanism, a motor mechanism, etc.

[0211] In some of these embodiments, the second drive assembly 230 is a cylinder mechanism.

[0212] In some embodiments, the second drive assembly 230 includes a second actuating element 231 and a second transmission element 232. The second actuating element 231 is disposed on the first support assembly 220 and is used to follow the first support assembly 220 in reciprocating motion along a first preset direction. The second transmission element 232 is connected to both the second actuating element 231 and the second support assembly 240, and is used to drive the second support assembly 240 in reciprocating motion along the second preset direction under the action of the second actuating element 231.

[0213] The second preset direction is the axial direction of the second transmission element 232.

[0214] The second actuator 231 is detachably connected to the first support assembly 220. For example, it is fixed to the first support assembly 220 by means of mounting brackets, bolts, etc.

[0215] In some of these embodiments, the second actuating element 231 includes, but is not limited to, a cylinder, a motor, etc.

[0216] In some of these embodiments, the second transmission element 232 includes, but is not limited to, a piston structure (such as a combination of a piston and a piston rod), a lead screw, etc.

[0217] Furthermore, the second drive assembly 230 also includes a second connecting element. The second connecting element is connected to the second transmission element 232 and the second support assembly 240 respectively, and is used to drive the second support assembly 240 to reciprocate along a second preset direction under the action of the second transmission element 232.

[0218] The second connecting element is detachably or movably connected to the second transmission element 232. For example, the second connecting element and the second transmission element 232 (such as a piston structure) are connected by bolts or the like; the second connecting element and the second transmission element 232 (such as a lead screw) are connected by a threaded rotation.

[0219] In some embodiments, the second connecting element includes, but is not limited to, a connecting plate, a connecting base, a connecting frame, etc.

[0220] The second support assembly 240 is connected to the second transmission element 232 or the second connecting element of the second drive assembly 230, including but not limited to fixed connection, detachable connection, etc.

[0221] In some of these embodiments, the second support assembly 240 includes, but is not limited to, mounting brackets, fixing brackets, etc.

[0222] In this invention, the third drive assembly 250 is arranged perpendicular to the second support assembly 240.

[0223] In this invention, the third drive component 250 is a rotational motion mechanism, including but not limited to a motor mechanism.

[0224] In some of these embodiments, the third drive component 250 is a motor mechanism.

[0225] In some embodiments, the third drive assembly 250 includes a third actuator 251 and a third transmission element 252. The third actuator 251 is disposed on the second support assembly 240 and is used to follow the second support assembly 240 in reciprocating motion along a second preset direction. The third transmission element 252 is connected to both the third actuator 251 and the adsorption assembly 260, and is used to drive the adsorption assembly 260 in reciprocating motion along the third preset direction under the action of the third actuator 251.

[0226] The third preset direction is the circumferential direction of the third transmission element 252.

[0227] The third actuator 251 is detachably connected to the second bracket assembly 240. For example, it is fixed to the second bracket assembly 240 by means of mounting brackets, bolts, etc.

[0228] In some of these embodiments, the third actuating element 251 includes, but is not limited to, a motor.

[0229] In some of these embodiments, the third transmission element 252 includes, but is not limited to, a rotating shaft.

[0230] Furthermore, the third drive assembly 250 also includes a third connecting element. The third connecting element is connected to the third transmission element 252 and the adsorption assembly 260 respectively, and is used to drive the adsorption assembly 260 to reciprocate along a third preset direction under the action of the third transmission element 252.

[0231] The third connecting element is detachably connected to the third transmission element 252. For example, the third connecting element and the third transmission element 252 (such as a rotating shaft) are connected by bolts or the like.

[0232] In some embodiments, the third connecting element includes, but is not limited to, a connecting plate, a connecting base, a connecting frame, etc.

[0233] In this invention, the adsorption component 260 is arranged perpendicular to the third driving component 250.

[0234] The adsorption component 260 is connected to the third transmission element 252 or the third connecting element of the third drive component 250, but is not limited to fixed connection, detachable connection, etc.

[0235] In this invention, the adsorption component 260 is a suction cup structure, which adsorbs the ceramic disk through vacuum action.

[0236] like Figure 5 As shown, the scraper unit 300 includes a fourth drive assembly 310, a third support assembly 320, a fifth drive assembly 330, a fourth support assembly 340, and a scraper assembly 350. The fourth drive assembly 310 is disposed on the frame unit 100; the third support assembly 320 is connected to the fourth drive assembly 310 and is used to reciprocate along a fourth preset direction under the action of the fourth drive assembly 310; the fifth drive assembly 330 is disposed on the third support assembly 320 and is used to follow the third support assembly 320 in reciprocating along the fourth preset direction; the fourth support assembly 340 is connected to the fifth drive assembly 330 and is used to follow the fifth drive assembly 330 in reciprocating along the fourth preset direction and to reciprocate along the fifth preset direction under the action of the fifth drive assembly 330; the scraper assembly 350 is disposed on the fourth support assembly 340 and is used to follow the fourth support assembly 340 in reciprocating along the fourth preset direction and the fifth preset direction to separate the wafer from the ceramic disk.

[0237] Specifically, the fourth drive component 310 is connected to the second fixed component 130.

[0238] The working principle of the blade unit 300 is as follows:

[0239] The fourth drive assembly 310 operates, driving the fifth drive assembly 330, the fourth support assembly 340, and the shovel assembly 350 to move downwards along the fourth preset direction to the preset position via the third support assembly 320;

[0240] The fifth drive component 330 operates, driving the shovel component 350 to move forward along the fifth preset direction to the preset position through the fourth support component 340, so as to separate the wafer from the ceramic disk. Under the action of gravity, the wafer slides to the slide unit 400.

[0241] The fifth drive component 330 operates, driving the scraper component 350 to move forward along the fifth preset direction to the preset position via the fourth support component 340, waiting for the scraper process of the next wafer.

[0242] In this invention, the fourth drive component 310 is tilted to match the tilt angle of the wafer at the shovel position.

[0243] In this utility model, the fourth drive component 310 is a linear motion mechanism, including but not limited to a cylinder mechanism, a motor mechanism, etc.

[0244] In some of these embodiments, the fourth drive component 310 is a cylinder mechanism.

[0245] In some embodiments, the fourth drive assembly 310 includes a fourth actuator 311 and a fourth transmission element 312. The fourth actuator 311 is disposed in the frame unit 100; the fourth transmission element 312 is connected to the fourth actuator 311 and the third support assembly 320 respectively, and is used to drive the third support assembly 320 to reciprocate along a fourth preset direction under the action of the fourth actuator 311.

[0246] The fourth preset direction is the axial direction of the fourth transmission element 312.

[0247] The fourth actuator 311 is detachably connected to the second fixing assembly 130. For example, it is fixed to the second fixing assembly 130 by means of a mounting bracket, bolts, etc.

[0248] In some of these embodiments, the fourth actuator 311 includes, but is not limited to, a cylinder, a motor, etc.

[0249] In some of these embodiments, the fourth transmission element 312 includes, but is not limited to, a piston structure (such as a combination of a piston and a piston rod), a lead screw, etc.

[0250] Furthermore, the fourth drive assembly 310 also includes a fourth connecting element. The fourth connecting element is connected to the fourth transmission element 312 and the third support assembly 320 respectively, and is used to drive the third support assembly 320 to reciprocate along a fourth preset direction under the action of the fourth transmission element 312.

[0251] The fourth connecting element is detachably or movably connected to the fourth transmission element 312. For example, the fourth connecting element and the fourth transmission element 312 (such as a piston structure) are connected by bolts or the like; the fourth connecting element and the fourth transmission element 312 (such as a lead screw) are connected by a threaded rotation.

[0252] In some embodiments, the fourth connecting element includes, but is not limited to, a connecting plate, a connecting base, a connecting frame, etc.

[0253] The third support assembly 320 is connected to the fourth transmission element 312 or the fourth connecting element of the fourth drive assembly 310, including but not limited to fixed connection, detachable connection, etc.

[0254] In some of these embodiments, the third support assembly 320 includes, but is not limited to, mounting brackets, fixing brackets, etc.

[0255] In this utility model, the fifth drive component 330 is a linear motion mechanism, including but not limited to a cylinder mechanism, a motor mechanism, etc.

[0256] In some of these embodiments, the fifth drive component 330 is a motor mechanism.

[0257] In some embodiments, the fifth drive assembly 330 includes a fifth actuator 331 and a fifth transmission element 332. The fifth actuator 331 is disposed on the third support assembly 320 and is used to follow the third support assembly 320 in reciprocating motion along a fourth preset direction. The fifth transmission element 332 is connected to both the fifth actuator 331 and the fourth support assembly 340, and is used to drive the fourth support assembly 340 in reciprocating motion along the fifth preset direction under the action of the fifth actuator 331.

[0258] The fifth preset direction is the axial direction of the fifth transmission element 332.

[0259] The fifth actuator 331 is detachably connected to the third support assembly 320. For example, it is fixed to the third support assembly 320 by means of mounting brackets, bolts, etc.

[0260] In some of these embodiments, the fifth actuator 331 includes, but is not limited to, a cylinder, a motor, etc.

[0261] In some of these embodiments, the fifth transmission element 332 includes, but is not limited to, piston structures (such as a combination of piston and piston rod), lead screws, etc.

[0262] In some embodiments, the fifth transmission element 332 further includes a coupling. The coupling is connected to the fifth actuator 331 (motor) and the lead screw, respectively.

[0263] Furthermore, the fifth drive assembly 330 also includes a fifth connecting element. The fifth connecting element is connected to the fifth transmission element 332 and the fourth support assembly 340 respectively, and is used to drive the fourth support assembly 340 to reciprocate along a fifth preset direction under the action of the fifth transmission element 332.

[0264] The fifth connecting element is detachably or movably connected to the fifth transmission element 332. For example, the fifth connecting element and the fifth transmission element 332 (such as a piston structure) are connected by bolts or the like; the fifth connecting element and the fifth transmission element 332 (such as a lead screw) are connected by a threaded rotation.

[0265] In some embodiments, the fifth connecting element includes, but is not limited to, a connecting plate, a connecting base, a connecting frame, etc.

[0266] The fourth bracket assembly 340 is connected to the fifth transmission element 332 or the fifth connecting element of the fifth drive assembly 330, including but not limited to fixed connection, detachable connection, etc.

[0267] In some of these embodiments, the fourth support assembly 340 includes, but is not limited to, mounting brackets, fixing brackets, etc.

[0268] The blade assembly 350 is detachably connected to the fourth support assembly 340, for example, by bolting.

[0269] In some of these embodiments, the shovel assembly 350 includes, but is not limited to, shovels.

[0270] like Figure 6 As shown, the slide unit 400 includes a slide assembly 410 and at least one guide assembly 420. The slide assembly 410 is disposed in the rack unit 100 and located between the flip adsorption unit 200 and the carrier unit 500, and is used to carry the wafer separated from the ceramic disk and to transfer the wafer to the carrier unit 500; the guide assembly 420 is disposed on the upper part of the slide assembly 410 and is used to guide the sliding direction of the wafer.

[0271] Specifically, the slide assembly 410 is connected to the third fixing assembly 140.

[0272] In this invention, the slide assembly 410 is inclined to facilitate the downstream sliding of the wafer.

[0273] In some embodiments, the slide assembly 410 includes a slide element 411. The slide element 411 is disposed in the rack unit 100 and located between the flip adsorption unit 200 and the carrier unit 500, for carrying wafers separated from the ceramic disk and transferring wafers to the carrier unit 500.

[0274] Specifically, the slide element 411 is disposed on the third fixing assembly 140.

[0275] The slide element 411 is detachably connected to the third fixing assembly 140. For example, it can be fixed to the third fixing assembly 140 by means of mounting brackets, bolts, etc.

[0276] In some of these embodiments, the slide element 411 includes, but is not limited to, a slide base.

[0277] Furthermore, the slide rail assembly 410 also includes a plurality of sixth connecting elements. The plurality of sixth connecting elements are distributed on the slide rail assembly 411 and are detachably connected to the corresponding guide assembly 420.

[0278] In some of these embodiments, a plurality of sixth connecting elements are arranged in an array on slide element 411.

[0279] In some embodiments, the sixth connecting element includes, but is not limited to, a connecting hole, a connecting block, a connecting groove, etc.

[0280] In some embodiments, there are multiple guide components 420. The multiple guide components 420 are symmetrically arranged on both sides of the slide assembly 410.

[0281] In some embodiments, a plurality of guide components 420 are provided on each side of the slide assembly 410. The plurality of guide components 420 are spaced apart along the width direction of the slide assembly 410.

[0282] For example, there are four guide components 420. Two guide components 420 are disposed on the first side of the slide assembly 410, and two guide components 420 are disposed on the second side of the slide assembly 410. The two guide components 420 located on the relatively inner side can guide wafers of a first specification (such as 6-inch wafers); after the two guide components 420 located on the relatively inner side are removed, the two guide components 420 located on the relatively outer side can guide wafers of a second specification (such as 8-inch wafers).

[0283] In some embodiments, the guide assembly 420 includes a guide element 421. The guide element 421 is disposed on the slide assembly 410.

[0284] Specifically, the guide element 421 is disposed on the slide element 411.

[0285] The guide element 421 and the slide element 411 are detachably connected, including but not limited to plug-in, snap-fit, bolt connection, etc.

[0286] In some embodiments, the guide element 421 includes a first guide and a second guide. The first guide is disposed at a first end of the slide assembly 410 (slide element 411) and is used to guide the wafer; the second guide is disposed at a second end of the slide assembly 410 (slide element 411) and is connected to the first guide to limit the lateral displacement of the wafer.

[0287] The width of the first end of the first guide is smaller than the width of the second end of the first guide. For example, the width of the first guide increases from its first end to its second end. For example, the cross-section of the first guide is triangular (such as a right triangle) or trapezoidal (right trapezoid), and the hypotenuse of the first guide faces the wafer.

[0288] The second guide component is fixedly connected to the first guide component, including but not limited to integral molding and welding.

[0289] The width of the second guide remains constant, and the width of the second guide is equal to the width of the second end of the first guide. The length of the second guide is greater than the length of the first guide. For example, the cross-section of the second guide is rectangular.

[0290] Furthermore, the guide assembly 420 also includes a plurality of seventh connecting elements. The plurality of seventh connecting elements are distributed on the guide element 421 and are detachably connected to the slide assembly 410 respectively.

[0291] A plurality of seventh connecting elements are spaced apart at least along the length direction of the guide element 421. Furthermore, the plurality of seventh connecting elements are also spaced apart along the width direction of the guide element 421.

[0292] In some embodiments, the seventh connecting element includes, but is not limited to, a connecting hole, a connecting block, a connecting groove, etc.

[0293] like Figure 7 As shown, the carrier unit 500 includes a sixth drive assembly 510, a fifth support assembly 520, and at least one carrier assembly 530. The sixth drive assembly 510 is disposed on the rack unit 100; the fifth support assembly 520 is connected to the sixth drive assembly 510 and is used to reciprocate along a sixth preset direction under the action of the sixth drive assembly 510; the carrier assembly 530 is disposed on the fifth support assembly 520 and is used to follow the fifth support assembly 520 in reciprocating along the sixth preset direction, to carry the wafer cassette, and to transfer wafers to the wafer cassette.

[0294] Specifically, the sixth drive assembly 510 is connected to the fourth fixed assembly 150.

[0295] The working principle of the bearing unit 500 is as follows:

[0296] The sixth drive component 510 operates, driving the carrier component 530 and the wafer box to move upward along the sixth preset direction to the preset position via the fifth support component 520;

[0297] After the wafer enters the wafer cassette, the sixth drive component 510 operates, driving the carrier component 530 and the wafer cassette to move upward along the sixth preset direction to the preset position via the fifth support component 520, waiting for the next wafer.

[0298] In this invention, the sixth driving component 510 is tilted to match the tilt angle of the wafer.

[0299] In this utility model, the sixth drive component 510 is a linear motion mechanism, including but not limited to a cylinder mechanism, a motor mechanism, etc.

[0300] In some of these embodiments, the sixth drive component 510 is a motor mechanism.

[0301] In some embodiments, the sixth drive assembly 510 includes a sixth actuator 511 and a sixth transmission element 512. The sixth actuator 511 is disposed in the frame unit 100; the sixth transmission element 512 is connected to the sixth actuator 511 and the fifth support assembly 520 respectively, and is used to drive the fifth support assembly 520 to reciprocate along a preset direction under the action of the sixth actuator 511.

[0302] The sixth preset direction is the axial direction of the sixth transmission element 512.

[0303] The sixth actuator 511 is detachably connected to the fourth fixing assembly 150. For example, it is fixed to the fourth fixing assembly 150 by means of a mounting bracket, bolts, etc.

[0304] In some of these embodiments, the sixth actuator 511 includes, but is not limited to, cylinders, motors, etc.

[0305] In some of these embodiments, the sixth transmission element 512 includes, but is not limited to, piston structures (such as a combination of piston and piston rod), lead screws, etc.

[0306] Furthermore, the sixth drive assembly 510 also includes an eighth connecting element. The eighth connecting element is connected to the sixth transmission element 512 and the fifth support assembly 520 respectively, and is used to drive the fifth support assembly 520 to reciprocate along a sixth preset direction under the action of the eighth transmission element.

[0307] The eighth connecting element is detachably or movably connected to the sixth transmission element 512. For example, the eighth connecting element and the sixth transmission element 512 (such as a piston structure) are connected by bolts or the like; the eighth connecting element and the sixth transmission element 512 (such as a lead screw) are connected by a threaded rotation.

[0308] In some embodiments, the eighth connecting element includes, but is not limited to, a connecting plate, a connecting base, a connecting frame, etc.

[0309] The fifth support assembly 520 is connected to the sixth transmission element 512 or the eighth connecting element of the fifth drive assembly 330, but is not limited to fixed connection, detachable connection, etc.

[0310] In some of these embodiments, the fifth support assembly 520 includes, but is not limited to, mounting brackets, fixing brackets, etc.

[0311] In some embodiments, there are multiple support components 530. These multiple support components 530 are spaced apart along the height direction of the fifth support component 520.

[0312] In some embodiments, the carrier assembly 530 includes a carrier element 531 and at least one positioning element 532. The carrier element 531 is disposed on the fifth support assembly 520; the positioning element 532 is disposed on the carrier element 531 and is used to position the wafer cassette.

[0313] The load-bearing element 531 is fixedly connected to or detachably connected to the fifth support assembly 520, including but not limited to welding, plugging, bolting, etc.

[0314] In some of these embodiments, the support element 531 includes, but is not limited to, a support plate, a support base, etc.

[0315] In some embodiments, there are multiple positioning elements 532. Multiple positioning elements 532 are distributed on the support element 531.

[0316] In some of these embodiments, the positioning element 532 includes, but is not limited to, a positioning groove, a positioning hole, a positioning baffle, a positioning base, etc.

[0317] Furthermore, the novel wafer unloading shovel device also includes a display unit 600. The display unit 600 is located in the frame unit 100 and is used to display operating parameters.

[0318] like Figure 8 As shown, the display unit 600 includes a base assembly 610, a support arm assembly 620, and a display component 630. The base assembly 610 is disposed on the frame unit 100; the first end of the support arm assembly 620 is connected to the base assembly 610; and the display component 630 is connected to the second end of the support arm assembly 620 for displaying operating parameters.

[0319] Specifically, the base assembly 610 is disposed on the rack assembly 110.

[0320] The base assembly 610 is detachably connected to the frame assembly 110, including but not limited to bolt connections.

[0321] In some of these embodiments, the base assembly 610 includes, but is not limited to, a mounting base, a mounting pedestal, a rotating base, etc.

[0322] The outrigger assembly 620 is detachably connected to the base assembly 610, including but not limited to bolt connections.

[0323] In some of these embodiments, the outrigger assembly 620 includes, but is not limited to, a support arm.

[0324] The display assembly 630 is detachably connected to the support arm assembly 620, including but not limited to bolt connections.

[0325] In some of these embodiments, the display component 630 includes, but is not limited to, a display screen.

[0326] The method of using this utility model is as follows:

[0327] (a) Shovel blade

[0328] The second drive component 230 operates, driving the third drive component 250 and the adsorption component 260 to move upward along the second preset direction to the preset position via the second support component 240.

[0329] Adsorption component 260 adsorption ceramic disc;

[0330] The first drive assembly 210 operates, driving the second drive assembly 230, the second support assembly 240, the third drive assembly 250, and the adsorption assembly 260 to move forward along the first preset direction to a preset position via the first support assembly 220;

[0331] The third driving component 250 operates, driving the adsorption component 260 to rotate along the third preset direction to the preset position;

[0332] The fourth drive assembly 310 operates, driving the fifth drive assembly 330, the fourth support assembly 340, and the shovel assembly 350 to move downwards along the fourth preset direction to the preset position via the third support assembly 320;

[0333] The fifth drive component 330 operates, driving the shovel component 350 to move forward along the fifth preset direction to the preset position through the fourth support component 340, so as to separate the wafer from the ceramic disk. Under the action of gravity, the wafer slides to the slide component 410.

[0334] The fifth drive component 330 operates, driving the scraper component 350 to move forward along the fifth preset direction to the preset position through the fourth support component 340, waiting for the scraper process of the next wafer;

[0335] The sixth drive component 510 operates, driving the carrier component 530 and the wafer box to move upward along the sixth preset direction to the preset position via the fifth support component 520;

[0336] After the wafer enters the wafer cassette via the slide assembly 410, the sixth drive assembly 510 operates, driving the carrier assembly 530 and the wafer cassette to move upward along the sixth preset direction to a preset position via the fifth support assembly 520, waiting for the next wafer;

[0337] (II) Replace the ceramic plate

[0338] After all the wafers in the ceramic disk are transferred to the wafer box, the first driving component 210 works, driving the second driving component 230, the second supporting component 240, the third driving component 250, and the adsorption component 260 to move backward to the preset position along the first preset direction through the first support component 220.

[0339] The adsorption component 260 releases the adsorption from the ceramic disc;

[0340] The second drive component 230 operates, driving the third drive component 250 and the adsorption component 260 to move downward along the second preset direction to the preset position via the second support component 240.

[0341] The ceramic disc is removed, and a new ceramic disc is placed on top of the adsorption assembly 260;

[0342] Repeat step (1) until the adsorption component 260 adsorbs the ceramic disc;

[0343] (III) Replacement of the chip cassette

[0344] Repeat the above steps until the wafer cassette is full of wafers, then remove the wafer cassette from the carrier assembly 530.

[0345] The technical effects of this utility model are as follows:

[0346] 1) The tilt angle and rotation position of the ceramic disk are precisely controlled by the flip adsorption unit to avoid problems such as damage to the wafer by the spatula unit or failure of the wafer to fall into the slide unit due to inaccurate positioning;

[0347] 2) The height and horizontal position of the shovel unit are adjusted by pneumatic and electric structures respectively, so as to accurately control the position of the shovel unit and avoid problems such as failure to separate the wafer or damage to the wafer;

[0348] 3) The height of the carrier unit is adjusted by using an electric structure to accurately position the wafer box and avoid the problem of wafers not being able to enter the wafer box.

[0349] Example 2

[0350] This embodiment is a modified embodiment of Embodiment 1. The difference between this embodiment and Embodiment 1 is that the structure of the flip adsorption unit 200 is different.

[0351] Furthermore, the flip adsorption unit 200 also includes at least one rotating component. The rotating component is disposed between the second support assembly 240 and the frame unit 100 to improve the rotational stability of the second support assembly 240.

[0352] Specifically, the rotating component is disposed between the second support component 240 and the first fixing component 120.

[0353] In some embodiments, there are multiple rotating components. These rotating components are spaced apart along the side length direction of the second support assembly 240. The side length direction of the second support assembly 240 is the side length direction of the second support assembly 240 closest to the slide rail unit 400 (this can be either the width direction or the length direction).

[0354] In this invention, the rotating component includes, but is not limited to, a hinge structure, including but not limited to a hinge structure, a hinge-like structure, etc.

[0355] In some embodiments, the rotating assembly includes a first rotating element and a second rotating element. The first rotating element is disposed in the frame unit 100; the second rotating element is disposed in the second support assembly 240 and rotatably connected to the first rotating element, thereby improving the rotational stability of the second support assembly 240.

[0356] Specifically, the first rotating element is disposed on the first fixed assembly 120.

[0357] The first rotating element is detachably connected to the first fixed assembly 120, including but not limited to bolt connections.

[0358] In some of these embodiments, the first rotating element includes, but is not limited to, a hinge, a latch, etc.

[0359] The second rotating element is detachably connected to the second support assembly 240, including but not limited to bolt connections.

[0360] In some of these embodiments, the second rotating element includes, but is not limited to, hinges, etc.

[0361] Furthermore, the flip adsorption unit 200 also includes two sixth support assemblies 270 and at least one conveying assembly 280. The two sixth support assemblies 270 are symmetrically arranged on the second support assembly 240 and located on the side of the adsorption assembly 260; the conveying assembly 280 is arranged on the side of the adsorption assembly 260 and is movably connected to the two sixth support assemblies 270 respectively, for conveying the ceramic disc.

[0362] The sixth support assembly 270 is fixedly connected to the second support assembly 240 or detachably connected. For example, by welding, bolting, etc.

[0363] One sixth support assembly 270 is located on the side of the adsorption assembly 260 closer to the slide unit 400 (e.g., the left side), and the other sixth support assembly 270 is located on the side of the adsorption assembly 260 away from the slide unit 400 (e.g., the right side).

[0364] In some of these embodiments, the sixth bracket assembly 270 includes, but is not limited to, a mounting bracket, a mounting support plate, etc.

[0365] In this invention, the conveying assembly 280 includes, but is not limited to, a conveying roller structure and a conveying cylinder structure.

[0366] In some embodiments, there are multiple conveying assemblies 280. The multiple conveying assemblies 280 are spaced apart along the length of the sixth support assembly 270.

[0367] Preferably, at least one conveying component 280 is provided on one side (e.g., the front side) of the adsorption component 260, and at least one conveying component 280 is provided on the other side (e.g., the rear side) of the adsorption component 260.

[0368] In some embodiments, the conveying assembly 280 includes a movable element 281, a third rotating element, and a fourth rotating element. The movable element 281 is movably disposed on the side of the adsorption assembly 260 for conveying the ceramic disc; the third rotating element is disposed at the first end of the movable element 281 and rotatably connected to a sixth support assembly 270; the fourth rotating element is disposed at the second end of the movable element 281 and rotatably connected to another sixth support assembly 270.

[0369] In some of these embodiments, the movable element 281 includes, but is not limited to, a conveyor roller, a conveyor cylinder, etc.

[0370] In some embodiments, the third rotating element includes a first rotating shaft and at least one first limiting ring. The first rotating shaft is disposed at the first end of the movable element 281 and is rotatably connected to the sixth support assembly 270; the first limiting ring is disposed at the end of the first rotating shaft to prevent the first rotating shaft from separating from the sixth support assembly 270.

[0371] In some embodiments, there are two first limiting rings. One first limiting ring is disposed at the first end of the first rotating shaft and located on one side of the sixth support assembly 270; the other first limiting ring is disposed at the second end of the first rotating shaft and located on the other side of the sixth support assembly 270.

[0372] The purpose of setting two first limiting rings is to restrict the position of the first rotating shaft and prevent the first rotating shaft from being displaced along its axial direction.

[0373] In some embodiments, the fourth rotating element includes a second rotating shaft and at least one second limiting ring. The second rotating shaft is disposed at the second end of the movable element 281 and is rotatably connected to the sixth support assembly 270; the second limiting ring is disposed at the end of the second rotating shaft to prevent the second rotating shaft from separating from the sixth support assembly 270.

[0374] In some embodiments, there are two second limiting rings. One second limiting ring is disposed at the first end of the second rotating shaft and located on one side of the sixth support assembly 270; the other second limiting ring is disposed at the second end of the second rotating shaft and located on the other side of the sixth support assembly 270.

[0375] The purpose of setting two second limiting rings is to restrict the position of the second rotating shaft and prevent the second rotating shaft from being displaced along its axial direction.

[0376] The usage method of this embodiment is basically the same as that of Embodiment 1, and will not be repeated here.

[0377] The technical effects of this embodiment are as follows:

[0378] 1) The rotational stability of the second support assembly 240 is improved by using a rotating component, thereby limiting the rotational path of the second support assembly 240;

[0379] 2) Utilize conveying components to improve the conveying stability of ceramic discs and avoid problems such as dropping or damage.

[0380] Example 3

[0381] This embodiment is a modified embodiment of Embodiments 1 and 2. The difference between this embodiment and Embodiments 1 and 2 is that the structure of the shovel unit 300 is different.

[0382] Furthermore, the shovel unit 300 also includes at least one first sliding component 360. The first sliding component 360 is disposed between the third support assembly 320 and the frame unit 100 to improve the sliding stability of the third support assembly 320.

[0383] Specifically, the first sliding component 360 is disposed between the third support component 320 and the second fixing component 130.

[0384] In some embodiments, there are multiple first sliding components 360. The multiple first sliding components 360 are spaced apart along the length direction of the third support component 320.

[0385] In this invention, the first sliding component 360 includes, but is not limited to, a sliding rail structure.

[0386] In some embodiments, the first sliding assembly 360 includes a first sliding element 361 and a second sliding element 362. The first sliding element 361 is disposed on the rack unit 100; the second sliding element 362 is disposed on the third support assembly 320 and is slidably connected to the first sliding element 361.

[0387] Specifically, the first sliding element 361 is disposed on the second fixed component 130.

[0388] The first sliding element 361 is detachably connected to the second fixing component 130, including but not limited to bolt connection.

[0389] In some of these embodiments, the first sliding element 361 includes, but is not limited to, a slide rail.

[0390] The second sliding element 362 is detachably connected to the third bracket assembly 320, including but not limited to bolt connection.

[0391] In some of these embodiments, the second sliding element 362 includes, but is not limited to, a slider.

[0392] Furthermore, the shovel unit 300 also includes a first sensing component 370. The first sensing component 370 is disposed on the side of the fifth drive component 330 and is electrically or communicatively connected to the fifth drive component 330, for sensing the position of the fourth support component 340 (or the fifth connecting element of the fifth drive component 330) so that the fifth drive component 330 can determine whether to stop working.

[0393] The first sensing component 370 is detachably connected to the third support component 320, including but not limited to bolt connections.

[0394] In some embodiments, the first sensing component 370 includes a first sensing bracket and a plurality of first sensors. The first sensing bracket is disposed on the third bracket component 320; the plurality of first sensors are distributed on the first sensing bracket and are electrically or communicatively connected to the fifth driving component 330, respectively, for sensing the position of the fourth bracket component 340 (or the fifth connecting element of the fifth driving component 330) so that the fifth driving component 330 can determine whether to stop working.

[0395] Generally, a first sensor is set at the first end of the first sensing bracket, and a first sensor is set at the second end of the first sensing bracket. Using these two positions, it can be determined whether the fourth bracket assembly 340 (or the fifth connecting element of the fifth drive assembly 330) has reached the shovel position or the initial position.

[0396] Furthermore, a first sensor is positioned in the middle of the first sensing bracket. This position allows the scraper assembly 350 to complete scraping without returning to its initial position, thereby reducing the travel path and improving scraping efficiency.

[0397] The usage method of this embodiment is basically the same as that of Embodiments 1 to 2, and will not be repeated here.

[0398] The technical effects of this embodiment are as follows:

[0399] 1) The sliding stability of the third support assembly is improved by using the first sliding component, thereby limiting the sliding path of the third support assembly;

[0400] 2) The first sensing component is used to sense the movement position of the fourth support component to avoid the problem that the chip shovel component cannot separate the chip because it has not reached the preset position.

[0401] Example 4

[0402] This embodiment is a modified embodiment of Embodiments 1 to 3. The difference between this embodiment and Embodiments 1 to 3 is that the structure of the supporting unit 500 is different.

[0403] Furthermore, the support unit 500 also includes at least one mounting component 540. The mounting component 540 is disposed between the fifth support component 520 and the corresponding support component 530, and is used to mount the support component 530.

[0404] In some embodiments, there are multiple mounting components 540. These mounting components 540 are spaced apart along the height direction of the fifth support assembly 520.

[0405] The number of mounting components 540 matches the number of carrier components 530. Generally, the number of mounting components 540 is equal to the number of carrier components 530. That is, there is a one-to-one correspondence between mounting components 540 and carrier components 530.

[0406] In some embodiments, the mounting assembly 540 includes a first mounting element 541 and a second mounting element 542. The first mounting element 541 is disposed on the fifth bracket assembly 520; the second mounting element 542 is disposed on the support assembly 530 and connected to the first mounting element 541.

[0407] Specifically, the second mounting element 542 is disposed on the carrier element 531.

[0408] The first mounting element 541 is fixedly connected to the fifth bracket assembly 520, for example by welding or integral molding.

[0409] In some of these embodiments, the first mounting element 541 includes, but is not limited to, a mounting shaft, a mounting base, etc.

[0410] The second mounting element 542 is fixedly connected to the bearing element 531, for example, by welding or integral molding.

[0411] The second mounting element 542 is detachably connected to the first mounting element 541, for example, by plugging in.

[0412] In some of these embodiments, the second mounting element 542 includes, but is not limited to, a mounting shaft, a mounting base, etc.

[0413] Furthermore, the support unit 500 also includes at least one second sliding component 550. The second sliding component 550 is disposed between the fifth support component 520 and the frame unit 100 to improve the sliding stability of the fifth support component 520.

[0414] Specifically, the second sliding component 550 is disposed between the fifth support component 520 and the fourth fixing component 150.

[0415] In some embodiments, there are multiple second sliding components 550. These multiple second sliding components 550 are spaced apart along the width direction of the fifth support assembly 520.

[0416] In this invention, the second sliding component 550 includes, but is not limited to, a sliding rail structure.

[0417] In some embodiments, the second sliding assembly 550 includes a third sliding element 551 and a fourth sliding element 552. The third sliding element 551 is disposed on the rack unit 100; the fourth sliding element 552 is disposed on the fifth support assembly 520 and is slidably connected to the third sliding element 551.

[0418] Specifically, the third sliding element 551 is disposed on the fourth fixing component 150.

[0419] The third sliding element 551 is detachably connected to the fourth fixing component 150, including but not limited to bolt connection.

[0420] In some of these embodiments, the third sliding element 551 includes, but is not limited to, a slide rail.

[0421] The fourth sliding element 552 is detachably connected to the fifth bracket assembly 520, including but not limited to bolt connection.

[0422] In some embodiments, the fourth sliding element 552 includes, but is not limited to, a slider.

[0423] Furthermore, the support unit 500 also includes a second sensing component 560. The second sensing component 560 is disposed on the side of the sixth drive component 510 and is used to sense the position of the fifth support component 520 (or the eighth connecting element of the sixth drive component 510).

[0424] Specifically, the second sensing component 560 is disposed on the side of the sixth transmission element 512.

[0425] In some embodiments, the second sensing component 560 includes a second sensing bracket and a plurality of second sensors. The second sensing bracket is disposed on the side of the sixth drive component 510 (sixth transmission element 512); the plurality of second sensors are distributed on the second sensing bracket and are electrically or communicatively connected to the fifth drive component 330, respectively, for sensing the position of the fifth bracket component 520 (or the eighth connecting element of the sixth drive component 510) so that the sixth drive component 510 can determine whether to stop operating.

[0426] Generally, a second sensor is installed at the first end of the second sensing bracket, and a second sensor is installed at the second end of the second sensing bracket. Using these two positions, it can be determined whether the fifth bracket assembly 520 (or the eighth connecting element of the sixth drive assembly 510) has reached the bearing position or the initial position.

[0427] Furthermore, a plurality of second sensors are arranged in the middle of the second sensing bracket. The plurality of second sensors are spaced apart along the height direction of the second sensing bracket. Using these multiple positions, the position of the bearing element 531 can be precisely controlled.

[0428] The usage method of this embodiment is basically the same as that of Embodiments 1 to 3, and will not be repeated here.

[0429] The technical effects of this embodiment are as follows:

[0430] 1) The sliding stability of the fifth support assembly is improved by using the second sliding component, thereby limiting the sliding path of the fifth support assembly;

[0431] 2) The second sensing component is used to sense the movement position of the fifth support component to avoid the problem that the chip cannot enter the chip box because the support component has not reached the preset position.

[0432] Example 5

[0433] This embodiment relates to the wafer production line of this utility model.

[0434] An illustrative embodiment of this utility model, such as Figure 9 As shown, a wafer production line includes a novel wafer unloading shovel device A as described in Example 1.

[0435] Furthermore, the wafer production line also includes a control device B. The control device B is connected to the flipping and adsorption unit 200, the shovel unit 300, and the carrying unit 500 of the novel wafer unloading shovel device A.

[0436] Furthermore, the control device B is also connected to the display unit 600.

[0437] Specifically, the control device B is connected to the first drive assembly 210, the second drive assembly 230, the third drive assembly 250, the adsorption assembly 260, the fourth drive assembly 310, the fifth drive assembly 330, the sixth drive assembly 510, and the display assembly 630, respectively.

[0438] In some of these embodiments, the control device B includes, but is not limited to, a central control unit, a PLC, etc.

[0439] Furthermore, the wafer production line also includes an air source device C. The air source device C is connected to the flipping adsorption unit 200 and the scraper unit 300 of the novel wafer unloading scraper device A.

[0440] Specifically, the gas source device C is connected to the first drive assembly 210, the second drive assembly 230, the adsorption assembly 260, and the fourth drive assembly 310, respectively.

[0441] In some of these embodiments, the gas source device C includes, but is not limited to, a vacuum assembly, a gas pump structure, etc.

[0442] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel wafer unloading shovel device, characterized in that, include: A rack unit, wherein the rack unit is disposed on a horizontal plane; A flip adsorption unit is movably disposed on the frame unit for adsorbing ceramic discs with wafers and driving the ceramic discs to reciprocate along a first preset direction, a second preset direction, and a third preset direction. A shovel unit is disposed on the frame unit and is used for reciprocating motion along a fourth preset direction and a fifth preset direction, as well as separating wafers from ceramic disks. A slide rail unit is disposed in the frame unit and located downstream of the flip adsorption unit, for carrying wafers separated from the ceramic disk and for transferring wafers. The carrier unit is movably disposed in the rack unit and located downstream of the slide unit, and is used for reciprocating along a sixth preset direction and for carrying the wafer cassette and transferring the wafer to the wafer cassette.

2. The novel wafer unloading shovel device according to claim 1, characterized in that, The rack unit includes: A rack assembly, the rack assembly being disposed on a horizontal plane; A first fixing component is disposed on the frame assembly and connected to the flipping adsorption unit; A second fixing component is disposed on the frame assembly and connected to the blade unit; A third fixing component is disposed on the frame assembly and connected to the slide rail unit; A fourth fixing component, wherein the fourth fixing component is disposed on the frame assembly and connected to the support unit; and / or The flipping adsorption unit includes: A first drive assembly is disposed in the rack unit; A first support assembly is connected to the first drive assembly and is used to reciprocate along a first preset direction under the action of the first drive assembly. A second drive component is disposed on the first support component and is used to follow the first support component in reciprocating motion along a first preset direction; The second support assembly is connected to the second drive assembly and is used to reciprocate along a second preset direction under the action of the second drive assembly; A third drive component is disposed on the second support component and is used to follow the second support component in reciprocating motion along a second preset direction; An adsorption component, movably disposed on the first support component and connected to the third drive component, is used to reciprocate along a first preset direction following the first support component, reciprocate along a second preset direction following the second support component, reciprocate along a third preset direction under the action of the third drive component, and adsorb a ceramic disk containing wafers; and / or The shovel unit includes: A fourth drive assembly is disposed in the rack unit; The third support assembly is connected to the fourth drive assembly and is used to reciprocate along a fourth preset direction under the action of the fourth drive assembly. The fifth drive component is disposed on the third support component and is used to follow the third support component in reciprocating motion along a fourth preset direction; The fourth support assembly is connected to the fifth drive assembly and is used to reciprocate along the fourth preset direction following the fifth drive assembly and to reciprocate along the fifth preset direction under the action of the fifth drive assembly. A shovel assembly, disposed on the fourth support assembly, is used to reciprocate along a fourth preset direction and a fifth preset direction following the fourth support assembly to separate the wafer from the ceramic disk; and / or The slide unit includes: A slide assembly is disposed in the frame unit and located between the flip adsorption unit and the carrier unit, for carrying wafers separated from the ceramic disk and transferring wafers to the carrier unit; At least one guide component, the guide component being disposed on the upper part of the slide assembly, is used to guide the sliding direction of the wafer; and / or The carrier unit includes: A sixth drive assembly is disposed in the rack unit; The fifth support assembly is connected to the sixth drive assembly and is used to reciprocate along a sixth preset direction under the action of the sixth drive assembly; At least one carrier component is disposed on the fifth support component and is used to follow the fifth support component in reciprocating motion along a sixth preset direction, to carry the wafer cassette, and to transfer the wafer to the wafer cassette.

3. The novel wafer unloading shovel device according to claim 2, characterized in that, The first driving component includes: A first actuator is disposed on the rack assembly; A first transmission element, connected to both the first actuator and the first support assembly, is used to drive the first support assembly to reciprocate along a first preset direction under the action of the first actuator; and / or The second driving component includes: A second actuator is disposed on the first support assembly and is used to reciprocate along a first preset direction following the first support assembly. A second transmission element, connected to both the second actuator and the second support assembly, is used to drive the second support assembly to reciprocate along a second preset direction under the action of the second actuator; and / or The third driving component includes: A third actuator is disposed on the second support assembly and is used to reciprocate along a second preset direction following the second support assembly. A third transmission element, connected to both the third actuator and the adsorption assembly, is used to drive the adsorption assembly to reciprocate along a third preset direction under the action of the third actuator; and / or The fourth driving component includes: A fourth actuator is disposed in the rack unit; A fourth transmission element, which is connected to both the fourth actuator and the third support assembly, is used to drive the third support assembly to reciprocate along a fourth preset direction under the action of the fourth actuator; and / or The fifth driving component includes: The fifth actuator is disposed on the third support assembly and is used to reciprocate along the fourth preset direction following the third support assembly; A fifth transmission element, which is connected to both the fifth actuator and the fourth support assembly, is used to drive the fourth support assembly to reciprocate along a fifth preset direction under the action of the fifth actuator; and / or The slide rail assembly includes: A slide rail element, disposed in the rack unit and located between the flip-adsorption unit and the carrier unit, is used to carry wafers separated from the ceramic disk and to transfer wafers to the carrier unit; and / or The guiding component includes: Guide elements, the guide elements being disposed on the slide assembly; and / or The sixth driving component includes: A sixth actuator is disposed in the rack unit; A sixth transmission element, which is connected to both the sixth actuator and the fifth support assembly, is used to drive the fifth support assembly to reciprocate along a preset direction under the action of the sixth actuator; and / or The carrier component includes: A load-bearing element, wherein the load-bearing element is disposed on the fifth support assembly; At least one positioning element is disposed on the carrier element for positioning the wafer cassette.

4. The novel wafer unloading shovel device according to claim 3, characterized in that, The first driving component also includes: A first connecting element is connected to both the first transmission element and the first support assembly, and is used to drive the first support assembly to reciprocate along a first preset direction under the action of the first transmission element; and / or The second driving component also includes: The second connecting element is connected to the second transmission element and the second support assembly respectively, and is used to drive the second support assembly to reciprocate along a second preset direction under the action of the second transmission element; and / or The third driving component also includes: A third connecting element, which is connected to both the third transmission element and the adsorption assembly, is used to drive the adsorption assembly to reciprocate along a third preset direction under the action of the third transmission element; and / or The fourth driving component also includes: A fourth connecting element, which is connected to both the fourth transmission element and the third support assembly, is used to drive the third support assembly to reciprocate along a fourth preset direction under the action of the fourth transmission element; and / or The fifth driving component also includes: The fifth connecting element is connected to both the fifth transmission element and the fourth support assembly, and is used to drive the fourth support assembly to reciprocate along a fifth preset direction under the action of the fifth transmission element; and / or The slide rail assembly also includes: A plurality of sixth connecting elements are distributed on the slide rail element and are detachably connected to the corresponding guide assembly; and / or The guiding component also includes: A plurality of seventh connecting elements, wherein the plurality of seventh connecting elements are distributed on the guide element and are detachably connected to the slide assembly; and / or The sixth drive component also includes: The eighth connecting element is connected to the sixth transmission element and the fifth support assembly respectively, and is used to drive the fifth support assembly to reciprocate along a sixth preset direction under the action of the sixth transmission element.

5. The novel wafer unloading shovel device according to claim 2, characterized in that, The flip adsorption unit further includes: At least one rotating assembly, disposed between the second support assembly and the frame unit, is used to improve the rotational stability of the second support assembly; and / or The flip adsorption unit further includes: Two sixth support assemblies are symmetrically arranged on the second support assembly and located on the side of the adsorption assembly; At least one conveying assembly, disposed on the side of the adsorption assembly and movably connected to each of the two sixth support assemblies, is used to convey ceramic discs; and / or The shovel unit also includes: At least one first sliding component is disposed between the third support assembly and the frame unit to improve the sliding stability of the third support assembly; and / or The shovel unit also includes: A first sensing component, disposed on the side of the fifth drive component, is used to sense the position of the fourth support component; and / or The carrier unit further includes: At least one mounting component is disposed between the fifth bracket assembly and the corresponding load-bearing assembly for mounting the load-bearing assembly; and / or The carrier unit further includes: At least one second sliding component is disposed between the fifth support assembly and the frame unit to improve the sliding stability of the fifth support assembly; and / or The carrier unit further includes: The second sensing component is disposed on the side of the sixth driving component and is used to sense the position of the fifth support component.

6. The novel wafer unloading shovel device according to claim 5, characterized in that, The rotating assembly includes: A first rotating element is disposed in the frame unit; A second rotating element, disposed on the second support assembly and rotatably connected to the first rotating element, is used to improve the rotational stability of the second support assembly; and / or The conveying assembly includes: A movable element, which is movably disposed on the side of the adsorption assembly, is used to transfer the ceramic disc; A third rotating element is disposed at the first end of the movable element and is rotatably connected to a sixth support assembly. A fourth rotating element, wherein the fourth rotating element is disposed at the second end of the movable element and is rotatably connected to another of the sixth support assemblies; and / or The first sliding component includes: A first sliding element is disposed in the frame unit; A second sliding element is disposed on the third bracket assembly and slidably connected to the first sliding element; and / or The installation components include: A first mounting element is disposed on the fifth bracket assembly; A second mounting element is disposed on the carrier assembly and connected to the first mounting element; and / or The second sliding component includes: A third sliding element is disposed in the frame unit; A fourth sliding element is disposed on the fifth bracket assembly and is slidably connected to the third sliding element.

7. The novel wafer unloading shovel device according to any one of claims 1 to 6, characterized in that, Also includes: The display unit is disposed in the rack unit and is used to display operating parameters.

8. The novel wafer unloading shovel device according to claim 7, characterized in that, The display unit includes: A base assembly disposed on the rack unit; A support arm assembly, the first end of which is connected to the base assembly; The display component is connected to the second end of the support arm assembly and is used to display operating parameters.

9. A wafer production line, characterized in that, include: The novel wafer unloading shovel device as described in any one of claims 1 to 8.

10. The wafer production line according to claim 9, characterized in that, Also includes: A control device is connected to the flipping adsorption unit, the shovel unit, and the carrying unit of the novel wafer unloading shovel device, respectively. and / or A gas source device is provided, which is connected to the flipping adsorption unit and the shovel unit of the novel wafer unloading shovel device.

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