Dimming device, preparation method and dimming structure

Abstract

The embodiment of the invention provides a dimming device, a preparation method and a dimming structure, is used for reducing the risk that black spots appear on the dimming device, and relates to the technical field of display. The preparation method of the dimming device comprises the following steps: forming a first laminated structure; forming a rubber frame on one side of the first laminated structure; a second laminated structure is attached to the side, away from the first substrate, of the rubber frame; laminating the first laminated structure, the rubber frame and the second laminated structure; injecting liquid glue into the first gap through the at least one first opening; and curing the liquid glue to form a second adhesive layer. The dimming device is used for adjusting the light transmittance.

Description

Technical Field

[0001] The present disclosure relates to the field of dimming technology, and in particular to a dimming device and a preparation method thereof, and a dimming structure. Background Art

[0002] Laminated glass is a composite glass product, consisting of two or more pieces of glass and one or more layers of organic polymer interlayer between the glass. The glass and the interlayer are permanently bonded to each other after being subjected to special high-temperature pre-pressing (or vacuuming) and high-temperature and high-pressure processing. Laminated glass can withstand external impacts of a certain energy or temperature changes without breaking. Even if it breaks, the fragments will stick to the interlayer and are not likely to hurt people, thus having a certain degree of safety. Therefore, laminated glass is widely used in the fields of construction, transportation, etc. Summary of the invention

[0003] An object of the embodiments of the present disclosure is to provide a dimming device and a preparation method thereof, and a dimming structure, so as to reduce the risk of black spots appearing in the dimming device.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a method for preparing a dimming device is provided. The preparation method includes forming a first laminated structure; the first laminated structure includes a first substrate, a first adhesive layer and a first functional layer arranged in layers. A glue frame is formed on one side of the first laminated structure; the glue frame is located on the side of the first substrate close to the first functional layer and surrounds the first functional layer; the glue frame has at least one first opening. A second laminated structure is attached to the side of the glue frame away from the first substrate; a first gap is provided between the second laminated structure and the first laminated structure; wherein the first opening is connected to the first gap. The first laminated structure, the glue frame and the second laminated structure are assembled so that the first adhesive layer bonds the first substrate and the first functional layer, and the glue frame bonds the first laminated structure and the second laminated structure. Liquid glue is injected into the first gap through the at least one first opening. The liquid glue is cured to form a second adhesive layer; the second adhesive layer bonds the first laminated structure and the second laminated structure.

[0006] In the above preparation method, the first gap between the first stacked structure and the second stacked structure can release the stress applied by the first adhesive layer on the first functional layer, which can reduce the risk of uneven force on the first functional layer due to inconsistent thickness of the first adhesive layer, thereby reducing the risk of black spots appearing in the dimming device.

[0007] In some embodiments, the orthographic projection of the first adhesive layer on the reference surface is within the range of the orthographic projection of the first substrate on the reference surface, and is spaced from the boundary of the first substrate, the orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first functional layer on the reference surface, and the thickness of the adhesive frame is greater than the sum of the thickness of the first adhesive layer and the thickness of the first functional layer in a direction perpendicular to the first substrate; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer. wherein, between forming the first laminated structure and forming the adhesive frame on one side of the first laminated structure, the preparation method further comprises: applying a force to the first laminated structure to exclude air between the first adhesive layer and the first substrate. the first laminated structure is laminated so that the first adhesive layer bonds the first substrate and the first functional layer.

[0008] In some embodiments, the orthographic projection of the first adhesive layer on the reference plane coincides with the orthographic projection of the first substrate on the reference plane, the orthographic projection of the first functional layer on the reference plane is located within the range of the orthographic projection of the first adhesive layer on the reference plane, and is spaced apart from a boundary of the first adhesive layer, and along a direction perpendicular to the first substrate, the thickness of the adhesive frame is greater than the thickness of the first functional layer; wherein the reference plane is parallel to a surface of the first substrate close to the first functional layer.

[0009] In some embodiments, the first stacked structure further includes a second functional layer and a third adhesive layer, the second functional layer is located on a side of the first functional layer away from the first substrate, and the third adhesive layer is located between the first functional layer and the second functional layer.

[0010] In some embodiments, the second laminated structure includes a second substrate, a fourth adhesive layer and a third functional layer which are stacked, the orthographic projection of the fourth adhesive layer on the reference surface is located within the range of the orthographic projection of the second substrate on the reference surface, and is spaced from the boundary of the second substrate, and the orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the third functional layer on the reference surface; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer. Between forming a glue frame on one side of the first laminated structure and attaching the second laminated structure on the side of the glue frame away from the first substrate, the preparation method further includes: applying pressure to the second laminated structure to remove air between the fourth adhesive layer and the second substrate. The second laminated structure is laminated so that the fourth adhesive layer bonds the second substrate and the third functional layer.

[0011] On the other hand, a dimming device is provided. The display device includes a first stacked structure, a second stacked structure, a second adhesive layer, a glue frame and a sealing block. The first stacked structure includes a first substrate, a first adhesive layer and a first functional layer that are stacked. The second stacked structure is located on a side of the first substrate close to the first adhesive layer, and the second stack includes a second substrate. The second adhesive layer is located between the first stacked structure and the second stacked structure, and is configured to bond the first stacked structure and the second stacked structure. The glue frame is located between the first substrate and the second substrate, and surrounds the first functional layer and the second adhesive layer. The glue frame has at least one first opening, and the projection of the first opening along the first direction at least partially overlaps with the projection of the second adhesive layer along the first direction; wherein the first direction is perpendicular to the side of the glue frame where the first opening is located. The sealing block is located in the first opening and seals the first opening.

[0012] In some embodiments, the thickness of the first adhesive layer is M×d1, and the thickness of the adhesive frame is N×d2; wherein M and N are both positive integers less than 6, and N is greater than M; d1 and d2 are 0.3 mm to 0.5 mm, and d1 is less than or equal to d2.

[0013] In some embodiments, the thickness of the first functional layer is d3, and d3 is less than or equal to 1.1 mm; the thickness of the second adhesive layer is N×d2-M×d1-d3.

[0014] In some embodiments, the material of the adhesive frame is the same as that of the first adhesive layer, and different from that of the sealing block. The material of the first adhesive layer is different from that of the second adhesive layer.

[0015] In some embodiments, the orthographic projection of the first adhesive layer on the reference plane is located within the range of the orthographic projection of the first substrate on the reference plane and is spaced apart from the boundary of the first substrate. The orthographic projection of the first adhesive layer on the reference plane coincides with the orthographic projection of the first functional layer on the reference plane, and the adhesive frame abuts against the first substrate; wherein the reference plane is parallel to the surface of the first substrate close to the first functional layer.

[0016] In some embodiments, the orthographic projection of the first adhesive layer on the reference plane coincides with the orthographic projection of the first substrate on the reference plane, the orthographic projection of the first functional layer on the reference plane is located within the range of the orthographic projection of the first adhesive layer on the reference plane, and is spaced apart from a boundary of the first adhesive layer, and the adhesive frame abuts against the first adhesive layer; wherein the reference plane is parallel to a surface of the first substrate close to the first functional layer.

[0017] In some embodiments, the first functional layer is a dimming functional layer, the dimming functional layer is configured to adjust light transmittance, and the material of the first adhesive layer is PVB or SGP. Alternatively, the first functional layer is a display functional layer, the display functional layer is configured to display images, and the material of the first adhesive layer is OCA, OCR or EVA.

[0018] In some embodiments, the first laminate structure further includes a second functional layer and a third adhesive layer. The second functional layer is located on a side of the first functional layer away from the first substrate. The third adhesive layer is located between the first functional layer and the second functional layer and is configured to bond the first functional layer and the second functional layer.

[0019] In some embodiments, the second stacked structure further includes a fourth adhesive layer located on a side of the second substrate close to the second adhesive layer.

[0020] In some embodiments, the orthographic projection of the fourth adhesive layer on the reference plane coincides with the orthographic projection of the second substrate on the reference plane, and the adhesive frame abuts against the fourth adhesive layer; wherein the reference plane is parallel to the surface of the first substrate close to the first functional layer.

[0021] In some embodiments, the orthographic projection of the fourth adhesive layer on the reference plane is located within the range of the orthographic projection of the second substrate on the reference plane and is spaced from the boundary of the second substrate. The orthographic projection of the fourth adhesive layer on the reference plane coincides with the orthographic projection of the second adhesive layer on the reference plane, and the adhesive frame abuts against the second substrate; wherein the reference plane is parallel to the surface of the first substrate close to the first functional layer.

[0022] In some embodiments, the second stacked structure further includes a third functional layer, the third functional layer is located on a side of the fourth adhesive layer away from the second substrate, and the adhesive frame further surrounds the third functional layer.

[0023] In some embodiments, the dimming device further includes a first shading layer and a second shading layer. The first shading layer is located on a side of the first substrate away from the second substrate and is arranged along the edge of the first substrate. The outer boundary of the orthographic projection of the first shading layer on the first substrate coincides with the boundary of the first substrate, and the inner boundary is located within the inner boundary of the orthographic projection of the plastic frame on the first substrate. The second shading layer is located on a side of the second substrate close to the first substrate and is arranged along the edge of the second substrate. The second shading layer is at least partially located between the second substrate and the plastic frame.

[0024] In some embodiments, the first functional layer includes a flexible circuit board, and the flexible circuit board and the first opening are located on the same side of the plastic frame.

[0025] In some embodiments, there are a plurality of first functional layers, and the plurality of first functional layers are bonded to the first adhesive layer, and there is a gap between two adjacent first functional layers.

[0026] In some embodiments, the dimming device further includes a limiting bar, wherein the limiting bar is located in a gap between two adjacent first functional layers, and there is a gap between the limiting bar and the second stacked structure.

[0027] In some embodiments, the dimming device further comprises a limit bar, the limit bar is located in the interval between two adjacent first functional layers, the limit bar contacts the second stacked structure, the limit bar has a plurality of third openings, and at least one third opening is included between two adjacent first functional layers.

[0028] In some embodiments, along the second direction, the size of the first opening is less than or equal to half of the size of the first substrate; wherein the second direction is parallel to the side surface of the plastic frame where the first opening is located.

[0029] On the other hand, a dimming structure is provided, the dimming structure comprising the dimming device as described in any of the above embodiments, and the dimming structure comprises one of a curtain wall, a skylight, a rail transportation vehicle and a passenger car. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0031] Figure 1 to Figure 6 A diagram showing the steps of manufacturing a dimming device according to some embodiments;

[0032] Figure 7 is a structural diagram of a dimming device according to some embodiments;

[0033] Figure 8 is a structural diagram of a first functional layer according to some embodiments;

[0034] Fig. 9 is another structural diagram of the first functional layer according to some embodiments;

[0035] Fig.10 A structural diagram showing a plastic frame including multiple sub-layers according to some embodiments;

[0036] Fig.11 is a structural diagram of the relative positions of the first opening and the flexible circuit board according to some embodiments;

[0037] Fig.12 is another structural diagram of the relative positions of the first opening and the flexible circuit board according to some embodiments;

[0038] Fig.13 is another structural diagram of the relative positions of the first opening and the flexible circuit board according to some embodiments;

[0039] Fig.14 is a structural diagram of the relative positions of the first opening, the exhaust port, and the flexible circuit board according to some embodiments;

[0040] Fig.15 is another structural diagram of the relative positions of the first opening, the exhaust port and the flexible circuit board according to some embodiments;

[0041] Fig.16 is a structural diagram of the baffle position according to some embodiments;

[0042] Fig.17 A diagram showing steps for sealing a first opening according to some embodiments;

[0043] Fig.18 is another structural diagram of a dimming device according to some embodiments;

[0044] Fig.19 A structural diagram showing a force applied to a first stacked structure according to some embodiments;

[0045] Fig. 20 A structural diagram of a first stacked layer including a first functional layer and a second functional layer according to some embodiments;

[0046] Fig.21 A structural diagram of a dimming device including a second adhesive layer according to some embodiments;

[0047] Fig. 22 A structural diagram showing that the fourth adhesive layer is flush with the second substrate according to some embodiments;

[0048] Fig.23 is a structural diagram of a second stacked structure including a third functional layer according to some embodiments;

[0049] Fig.24 A structural diagram showing a force applied to a second stacked structure according to some embodiments;

[0050] Fig.25 A structural diagram of forming a first light shielding layer and a second light shielding layer according to some embodiments;

[0051] Fig.26 A diagram showing the steps of forming a first light shielding layer and a second light shielding layer according to some embodiments;

[0052] Fig. 27 A structural diagram of a dimming device including a plurality of first functional layers according to some embodiments;

[0053] Fig.28 for Fig. 27 A cross-sectional view along section line CC;

[0054] Fig.29 A structural diagram of a dimming device including a limit bar according to some embodiments;

[0055] Fig.30 for Fig.29 A cross-sectional view along section line DD;

[0056] Fig.31 A structural diagram showing a limiting strip provided with a third opening according to some embodiments;

[0057] Fig.32 for Fig.31 A cross-sectional view along section line EE;

[0058] Fig.33 is a structural diagram of a car according to some embodiments. DETAILED DESCRIPTION

[0059] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0060] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0061] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0062] When describing some embodiments, the expression "connection" and its derivatives may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0063] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0064] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0065] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0066] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0067] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0068] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0069] The directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0070] In the related art, the dimming device can be prepared by the following preparation process: first, an initial dimming device is formed, and the initial dimming device includes a first substrate, a first adhesive layer, a first functional layer, a second adhesive layer and a second substrate which are stacked, and the initial dimming device also includes a glue frame, and the glue frame surrounds the first functional layer. Then, the initial dimming device is combined to form a dimming device. Since at least one of the first adhesive layer and the second adhesive layer may have inconsistent thickness, there is no gap between the first functional layer and the first substrate, and there is no gap between the first functional layer and the second substrate during the combination process, resulting in the first functional layer not being able to deform accordingly with the thickness change of the first adhesive layer and / or the second adhesive layer. In this way, the stress applied by the first adhesive layer and / or the second adhesive layer on the first functional layer cannot be released, resulting in some areas of the first functional layer being subjected to heavier force, and some areas being subjected to lighter force, and mura phenomenon occurring in the first functional layer. For example, the first functional layer is a dye liquid crystal dimming functional layer, the materials of the first adhesive layer and the second adhesive layer are polyvinyl butyral (English: Polyvinyl Butyral), the initial dimming device is assembled under high temperature and high pressure, PVB has fluidity at high temperature, which may cause the thickness of at least one of the first adhesive layer and the second adhesive layer to be inconsistent, the dye liquid crystal dimming functional layer is subjected to inconsistent force, and the liquid crystal molecules in the area with heavier force in the dye liquid crystal functional layer move to the area with lighter force, and the liquid crystal molecules are stacked in the area with lighter force, resulting in black spots on the first functional layer. Among them, assembly refers to: the first substrate (first film layer) on one side of the adhesive layer, and the second substrate (second film layer) on the other side of the adhesive layer. After the adhesive layer is subjected to special high temperature pre-pressing (or vacuuming) and high temperature and high pressure process, the first substrate (first film layer), the adhesive layer and the second substrate (second film layer) are permanently bonded together. Exemplarily, the materials of the first substrate and the second substrate are tempered glass, and the tempered glass can be flat glass, single-curved glass or double-curved glass. The inventors found that when the first substrate is a double-curved glass, the mura phenomenon of the dimming device is more obvious. Wherein, single-curved glass refers to glass with curvature in the third direction. Double-curved glass refers to glass with curvature in the third direction and curvature in the fourth direction, and the third direction intersects the fourth direction, for example, the third direction is perpendicular to the fourth direction.

[0071] In order to solve the above problems, an embodiment of the present disclosure provides a method for preparing a dimming device 100 , which includes S100 to S600 .

[0072] like Figure 1 As shown, S100, a first stacked structure 10 is formed.

[0073] The first laminated structure 10 includes a first substrate 11, a first adhesive layer 12 and a first functional layer 13. The material of the first substrate 11 may include a rigid material or a flexible material with high light transmittance (eg, light transmittance greater than 85%).

[0074] like Figure 2 As shown, S200 , a glue frame 20 is formed on one side of the first stacked structure 10 .

[0075] The first adhesive layer 12 may include a plurality of adhesive layers stacked together, that is, the thickness of the first adhesive layer 12 is M×d, where M is the number of adhesive layers and d is the thickness of the adhesive layer. The number of adhesive layers is less than six layers, for example, the number of adhesive layers is one to three layers, that is, M is 1 to 3. For example, the number of adhesive layers is one or three layers, and the embodiments of the present disclosure are not listed one by one. The thickness of the adhesive layer is 0.3mm to 0.5mm, for example, the thickness of the adhesive layer is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one.

[0076] The thickness of the first functional layer is d3, wherein d3 is less than or equal to 1.1 mm, for example, d3 is 1.1 mm, 1 mm, 0.78 mm, 0.38 mm or 0.15 mm, which are not listed one by one in the embodiments of the present disclosure.

[0077] The end of the plastic frame 20 away from the first substrate 11 is farther away from the first substrate 11 than the end of the first functional layer 13 away from the first substrate 11, that is, along the thickness direction of the first laminated structure 10, the upper surface of the plastic frame 20 is higher than the upper surface of the first functional layer 13. In this way, on the one hand, in the subsequent process of bonding the second laminated structure, the plastic frame 20 can make a first gap between the first laminated structure 10 and the second laminated structure. On the other hand, the portion of the plastic frame 20 surrounding the first functional layer 13 is relatively large, which can further reduce the risk of water vapor entering the first functional layer 13. The plastic frame 20 has at least one first opening 21.

[0078] In some embodiments, Figure 2As shown, there is a telescopic gap 1 between the rubber frame 20 and the first functional layer 13, so that the telescopic gap 1 provides accommodation space for the thermal expansion and contraction of the first functional layer 13, which can reduce the risk of the first functional layer 13 and the rubber frame 20 being squeezed against each other, resulting in damage to the first functional layer 13, and improve the service life of the first functional layer 13. In the case where the material of the rubber frame 20 includes PVB, during the lamination process, the material of the rubber frame 20 has fluidity, and the telescopic gap 1 can provide a flow space for the rubber frame 20, reducing the risk of the rubber frame 20 flowing to the surface of the first functional layer 13 away from the first substrate 11. Exemplarily, the telescopic gap 1 is 1 mm to 5 mm, for example, the telescopic gap is 1 mm, 2.5 mm or 5 mm, which can prevent the first functional layer 13 from being squeezed against the rubber frame 20 during thermal expansion and contraction.

[0079] The glue frame 20 may include a plurality of stacked glue layers, that is, the thickness of the glue frame is N×d, where N is the number of glue layers, and the number of glue layers is less than six layers. For example, the number of glue layers is two to five layers, that is, N is 2 to 5. For example, the number of glue layers is two, four or five layers, and the embodiments of the present disclosure are not listed one by one. The thickness of the glue layer is 0.3mm to 0.5mm. For example, the thickness of the glue layer is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one. Among them, the thickness of the glue frame 20 refers to: the distance between the surface of the glue frame 20 away from the first substrate 11 and the surface of the first substrate 11 close to the glue frame 20.

[0080] like Figure 3 As shown, S300 , the second stacked structure 40 is attached to the side of the plastic frame 20 away from the first substrate 11 .

[0081] In some embodiments, Figure 3 As shown, the second stacked structure 40 is located on a side of the first functional layer 13 away from the first substrate 11 and has a first gap 2 with the first stacked structure 10. The first gap 2 is connected to the first opening 21. The plastic frame 20 is bonded to the second stacked structure 40.

[0082] The thickness of the first gap 2 is N×d2-M×d1-d3. For example, the thickness of the first gap 2 is 0.1 mm to 1 mm. For example, the thickness of the first gap 2 is 0.1 mm, 0.38 mm, 0.5 mm, 0.78 mm or 1 mm, which are not listed one by one in the embodiments of the present disclosure.

[0083] like Figure 4 As shown, S400, the first stacked structure 10, the plastic frame 20 and the second stacked structure 40 are assembled.

[0084] The first adhesive layer 12 adheres the first substrate 11 and the first functional layer 13 , and the adhesive frame 20 adheres the first stacked structure 10 and the second stacked structure 40 . The adhesive frame 20 abuts against the first functional layer 13 .

[0085] The material of the plastic frame 20 includes PVB, and the process conditions for laminating are high temperature and high pressure. For example, the first laminated structure 10, the plastic frame 20 and the second laminated structure 40 are laminated in an autoclave.

[0086] Under high temperature and high pressure conditions, the material of the adhesive layer has fluidity, so the thickness d of the adhesive frame 20 may remain unchanged or decrease. That is, the thickness of the first adhesive layer 12 changes from M×d to M×d1, and the thickness of the adhesive frame 20 changes from N×d to N×d2, wherein d1 is less than or equal to d, d2 is less than or equal to d, and d1 and d2 are 0.3mm to 0.5mm. For example, d1 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and d2 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one.

[0087] Since the thickness of the glue frame 20 is greater than the thickness of the first adhesive layer 12, the fluidity of the material of the glue layer included in the glue frame 20 is less than or equal to the fluidity of the material of the glue layer included in the first adhesive layer 12, that is, the reduction value of the thickness of the glue layer included in the glue frame 20 is less than or equal to the reduction value of the glue layer included in the first adhesive layer 12, that is, the thickness d2 of the glue layer included in the glue frame 20 is greater than or equal to the thickness d1 of the glue layer included in the first adhesive layer 12.

[0088] Exemplarily, the thickness d2 of the adhesive layer included in the adhesive frame 20 is equal to the thickness d1 of the adhesive layer included in the first adhesive layer 12, that is, d1 and d2 are both 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, which are not listed one by one in the embodiments of the present disclosure.

[0089] Alternatively, illustratively, the thickness d2 of the adhesive layer included in the adhesive frame 20 is greater than the thickness d1 of the adhesive layer included in the first adhesive layer 12. For example, d2 is 0.38 mm and d1 is 0.35 mm, d2 is 0.4 mm and d1 is 0.35 mm, d2 is 0.48 mm and d1 is 0.4 mm, or d2 is 0.5 mm and d1 is 0.48 mm, and the embodiments of the present disclosure are not listed one by one.

[0090] In the case of inconsistent thickness of the first adhesive layer 12, the thicker portion of the first adhesive layer 12 arches in the direction from the first substrate 11 to the second laminated structure 40, and accordingly, the portion of the first functional layer 13 bonded to this portion arches in the direction from the first substrate 11 to the second laminated structure 40. The thinner portion of the first adhesive layer 12 is concave in the direction from the second laminated structure 40 to the first substrate 11, and accordingly, the portion of the first functional layer 13 bonded to this portion moves in the direction from the second laminated structure 40 to the first substrate 11, so that the stress applied by the first adhesive layer 12 on the first functional layer 13 is released, and the risk of uneven force on the first functional layer 13 due to inconsistent thickness of the first adhesive layer 12 can be reduced.

[0091] like Figure 5 As shown, S500, liquid glue is injected into the first gap through at least one first opening of the glue frame 20.

[0092] The liquid glue may be a glue with relatively high light transmittance, for example, the liquid glue may be an optical glue (English: Optical Clear Resin, referred to as: OCR) or an ultraviolet glue (English: Ultraviolet, referred to as: UV).

[0093] like Figure 6 As shown, S600 , the liquid adhesive is cured to form a second adhesive layer 50 .

[0094] The second adhesive layer 50 bonds the first laminate structure 10 and the second laminate structure 40. The second adhesive layer 50 is prepared by a glue pouring and curing process, and the second adhesive layer 50 has no force on the first functional layer 13 or has a small force.

[0095] The cell thickness (the distance between the first substrate 11 and the second substrate 41) of the dimming device 100 prepared according to the above steps has high consistency. For example, the variation value of the cell thickness of the dimming device 100 is less than or equal to 0.1 mm.

[0096] The thickness of the second adhesive layer 50 is equal to the thickness of the first gap 2, that is, the thickness of the second adhesive layer 50 is N×d2-M×d1-d3. For example, the thickness of the second adhesive layer 50 is 0.1 mm to 1 mm. For example, the thickness of the second adhesive layer 50 is 0.1 mm, 0.38 mm, 0.5 mm, 0.78 mm or 1 mm, which are not listed one by one in the embodiments of the present disclosure.

[0097] The embodiment of the present disclosure further provides a dimming device 100, such as Figure 7 As shown, the dimming device 100 includes a first stacked structure 10 , a second stacked structure 40 , a second adhesive layer 50 , an adhesive frame 20 and a sealing block 80 .

[0098] like Figure 7 As shown, the first laminated structure 10 includes a first substrate 11, a first adhesive layer 12 and a first functional layer 13. The material of the first substrate 11 may include a material with high light transmittance (eg, light transmittance greater than 85%), for example, the material of the first substrate 11 is tempered glass.

[0099] The material of the first adhesive layer 12 may include other adhesive materials with high light transmittance, such as optically clear adhesive (OCA), PVB, ethylene vinyl acetate copolymer (EVA), Sentry Glas Plus (SGP), or optical clear resin (OCR). For example, the material of the first adhesive layer 12 includes PVB.

[0100] In some embodiments, the first adhesive layer 12 may include a plurality of laminated adhesive layers, the number of adhesive layers being less than six layers, for example, the number of adhesive layers is one to three layers, and the embodiments disclosed herein are not listed one by one. The thickness of the adhesive layer is 0.3 mm to 0.5 mm, for example, the thickness of the adhesive layer is 0.3 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.45 mm,

[0101] 0.48mm or 0.5mm, the embodiments of the present disclosure are not listed one by one.

[0102] In the process of preparing the dimming device 100, the first adhesive layer 12 needs to undergo a high temperature and high pressure lamination process. Under the condition of high temperature and high pressure, the material of the adhesive layer has fluidity, which can make the thickness of the adhesive layer after high temperature and high pressure less than or equal to the thickness of the adhesive layer before high temperature and high pressure. In other words, the thickness of the first adhesive layer 12 before high temperature and high pressure is M×d, where M is the number of adhesive layers, and d is the thickness of the adhesive layer. The thickness of the first adhesive layer 12 after high temperature and high pressure is N×d1, where d1 is less than or equal to d, and d1 is 0.3mm~0.5mm, for example, d1 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one.

[0103] The thickness of the first adhesive layer 12 can be designed according to the thickness of the dimming device 100. For example, the thickness of the dimming device 100 is less than or equal to 5 mm, and the thickness of the first adhesive layer 12 is 0.3 mm to 0.35 mm. For example, the thickness of the first adhesive layer 12 is 0.3 mm, 0.33 mm or 0.35 mm.

[0104] The thickness of the first functional layer is d3, wherein d3 is less than or equal to 1.1 mm, for example, d3 is 1.1 mm, 1 mm, 0.78 mm, 0.38 mm or 0.15 mm, which are not listed one by one in the embodiments of the present disclosure.

[0105] Figure 8 FIG. 1 is a structural diagram of the first functional layer 13 being a dimming functional layer. Figure 8 As shown, the first functional layer 13 is a dimming functional layer 13A, which is used to adjust the light transmittance. In this case, the material of the first adhesive layer is PVB or SGP, and the first adhesive layer 12 has good adhesion, which can enhance the firmness between the first functional layer 13 and the first substrate 11.

[0106] The dimming functional layer 13A is a polymer dispersed liquid crystal (PDLC) functional layer, an electrochromic (EC) functional layer, a dye liquid crystal functional layer or a suspended particle (Suspended Particle) functional layer. The embodiment of the present disclosure takes the dimming functional layer 13A as an example of a dye liquid crystal functional layer.

[0107] like Figure 8 As shown, the dimming function layer 13A includes a dye liquid crystal panel 131 and a first flexible circuit board 132. The dye liquid crystal panel 131 is used to adjust the light transmittance, and the first flexible circuit board 132 is used to drive the dye liquid crystal panel 131 to adjust the light transmittance.

[0108] The dye liquid crystal panel 131 includes a first substrate layer 1311, a first electrode layer 1312, a first alignment layer 1313, a dye liquid crystal layer 1314, a second alignment layer 1315, a second electrode layer 1316, and a second substrate layer 1317, which are sequentially stacked; the dye liquid crystal panel 131 also includes a sealant 1318. The materials of the first substrate layer 1311 and the second substrate layer 1317 may include glass or plastic. The plastic may include polyethylene terephthalate (PET), polyethylene naphtholate (PEN), polycarbonate (PC), polyphenylene sulfone resin (PPSU), cycloolefin polymer (COP), or polymethyl methacrylate (PMMA).

[0109] The materials of the first electrode layer 1312 and the second electrode layer 1316 include a conductive material with high light transmittance. For example, the materials of the first electrode layer 1312 and the second electrode layer 1316 include indium tin oxide (ITO).

[0110] The dye liquid crystal layer 1314 includes dye molecules 1301 and liquid crystal molecules 1302 ( Figure 8The black ellipse represents the dye molecule, and the white ellipse represents the liquid crystal molecule). The angle formed by the long axis direction of the dye molecule 1301 and the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316 is different, and the amount of light absorbed by the dye molecule 1301 is also different. By changing the voltage value between the first electrode layer 1312 and the second electrode layer 1316, the angle formed by the long axis direction of the liquid crystal molecule 1302 and the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316 can be changed, so that the amount of light absorbed by the dye molecule 1301 can be changed by changing the angle formed by the long axis direction of the dye molecule 1301 and the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, and the light transmittance of the dye liquid crystal layer 1314 can be adjusted. For example, when the long axis direction of the dye molecule 1301 is parallel to the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, light can pass through the dye liquid crystal layer 1314, so that the dye liquid crystal functional layer is in a transparent state (bright state). For another example, when the long axis direction of the dye molecule 1301 is perpendicular to the electric field direction between the first electrode layer 1312 and the second electrode layer 1316 , light cannot pass through the dye liquid crystal layer 1314 , so that the dye liquid crystal functional layer is in a dark state.

[0111] The dye liquid crystal layer 1314 further includes a plurality of spacers 1303, which are arranged at intervals, and are located between the second alignment layer 1315 and the first electrode layer 1312, and penetrate the first alignment layer 1313. The plurality of spacers 1303 are used to maintain the distance between the first substrate layer 1311 and the second substrate layer 1317.

[0112] Fig. 9 1 is a structural diagram of the first functional layer 13 and the display functional layer 13B. In other embodiments, Fig. 9As shown, the first functional layer 13 can also be a display functional layer 13B, the display functional layer 13B has a high transmittance, and the display functional layer 13B is used to display images. Exemplarily, the display functional layer 13B is an organic light emitting diode (English: Organic Light Emitting Diode, referred to as: OLED) display functional layer, a quantum dot light emitting diode (English: Quantum Dot Light Emitting Diodes, referred to as: QLED) display functional layer, an active-matrix organic light emitting diode (English: Active-matrix organic light emitting diode, referred to as: AMOLED) display functional layer, a micro light emitting diode (English: Micro Light Emitting Diode, referred to as: Micro LED) or a sub-millimeter light emitting diode (English: Mini Light Emitting Diode, referred to as: Mini LED). Among them, Micro LED refers to an LED whose LED chip size is less than 50μm, and Mini LED refers to an LED whose LED chip size is 50μm to 200μm. For example, the display functional layer 13B is an OLED display functional layer. The display function layer 13B includes a display panel 133 and a second flexible circuit board 134 . The second flexible circuit board 134 is electrically connected to the display panel 133 . The second flexible circuit board 134 is used to drive the display panel 133 to display images.

[0113] like Figure 7 As shown, the second laminated structure 40 is located on the side of the first substrate 11 close to the first adhesive layer 12, and the second laminated structure 40 includes a second substrate 41. The second substrate 41 and the first substrate 11 can be made of the same material, for example, both the first substrate 11 and the second substrate 41 include tempered glass.

[0114] The second adhesive layer 50 is located between the first laminated structure 10 and the second laminated structure 40 , and the second adhesive layer is used to bond the first laminated structure 10 and the second laminated structure 40 .

[0115] The thickness of the second adhesive layer 50 is N×d2-M×d1-d3. Exemplarily, the thickness of the second adhesive layer 50 can be designed according to the thickness of the dimming device 100. For example, the thickness of the dimming device 100 is less than or equal to 5 mm, and the range of the second adhesive layer 50 is 0.1 mm to 1 mm. For example, the thickness of the second adhesive layer 50 is 1.1 mm, 1 mm, 0.78 mm, 0.38 mm or 0.15 mm, which are not listed one by one in the embodiments of the present disclosure.

[0116] The glue frame 20 is located between the first substrate 11 and the second substrate 41, and the glue frame 20 surrounds the first functional layer 13 and the second adhesive layer 50. In this way, the glue frame 20 can prevent external water vapor from entering the first functional layer 13 and the second adhesive layer 50, so as to reduce the risk of water vapor corroding the first functional layer 13 and the second adhesive layer 50. The service life of the dimming device 100 is improved. The glue frame 20 is located on the side of the first substrate 11 close to the first functional layer 13, and surrounds the first functional layer 13. The glue frame can block the water vapor in the air from passing through, so that the glue frame 20 can improve the problem of water vapor in the atmosphere entering the first functional layer 13, reduce the risk of material aging in the first functional layer 13, and improve the service life of the first functional layer 13. Exemplarily, the width of the glue frame 20 can be 5 mm to 50 mm, for example, the width of the glue frame 20 is 5 mm, 25 mm or 50 mm, which can ensure that the glue frame blocks water vapor.

[0117] The material of the plastic frame 20 includes PVB, EVA or SGP, which are not listed one by one in the embodiments of the present disclosure. Fig.10 As shown, the glue frame 20 may include a plurality of glue layers 201 stacked in layers, the number of the glue layers is less than six layers, for example, the number of the glue layers is two to five layers, and the thickness of the glue layers is 0.3 mm to 0.5 mm, for example, the thickness of the glue layers is 0.3 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.45 mm, 0.48 mm or 0.5 mm, and the embodiments of the present disclosure are not listed one by one. That is to say, the thickness of the glue frame 20 is a multiple of the specification of the glue layer.

[0118] In the process of preparing the dimming device 100, the glue frame 20 needs to undergo a high temperature and high pressure lamination process. Under the condition of high temperature and high pressure, the material of the glue layer has fluidity, which can make the thickness of the glue layer after high temperature and high pressure less than or equal to the thickness of the glue layer before high temperature and high pressure. In other words, the thickness of the glue frame before high temperature and high pressure is N×d, where N is the number of layers of the glue layer, and d is the thickness of the glue layer. The thickness of the glue layer after high temperature and high pressure is N×d2, where d2 is less than or equal to d, and d2 is 0.3mm~0.5mm, for example, d2 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one.

[0119] Since the thickness of the glue frame 20 is greater than the thickness of the first adhesive layer 12, the fluidity of the glue layer included in the glue frame 20 is less than or equal to the fluidity of the material of the glue layer included in the first adhesive layer 12, that is, the reduction value of the thickness of the glue layer included in the glue frame 20 is less than or equal to the reduction value of the glue layer included in the first adhesive layer 12, that is, the thickness d2 of the glue layer included in the glue frame 20 is greater than or equal to the thickness d1 of the glue layer included in the first adhesive layer 12.

[0120] Exemplarily, the thickness d2 of the adhesive layer included in the adhesive frame 20 is equal to the thickness d1 of the adhesive layer included in the first adhesive layer 12, that is, d1 and d2 are both 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one. Alternatively, exemplarily, the thickness d2 of the adhesive layer included in the adhesive frame 20 is greater than the thickness d1 of the adhesive layer included in the first adhesive layer 12. For example, d2 is 0.38mm and d1 is 0.35mm, d2 is 0.4mm and d1 is 0.35mm, d2 is 0.4mm and d1 is 0.35mm, d2 is 0.48mm and d1 is 0.4mm, or d2 is 0.5mm and d1 is 0.48mm, and the embodiments of the present disclosure are not listed one by one.

[0121] In some embodiments, the thickness of the first adhesive layer 12 is 0.38 mm, the thickness of the second adhesive layer 50 is 0.38 mm, the thickness of the first functional layer 13 is 0.38 mm, and the thickness of the adhesive frame is 1.14 mm. In other embodiments, the thickness of the first adhesive layer 12 is 0.76 mm, the thickness of the second adhesive layer 50 is 0.38 mm, the thickness of the first functional layer 13 is 0.76 mm, and the thickness of the adhesive frame is 1.9 mm.

[0122] Based on the above structure, the thickness of the glue frame 20 can be changed by changing the number of glue layers 201, which is more convenient. In the case where the first functional layer 13 includes a flexible circuit board (a first flexible circuit board 132 or a second flexible circuit board 134), the flexible circuit board 132 / 134 can extend straight outward and extend from between two adjacent glue layers 201, so that the flexible circuit board 132 / 134 does not need to be bent. Compared with the use of a whole-piece glue frame 20, the flexible circuit board 132 / 134 needs to bend around the glue frame 20 to extend out, and the above-mentioned solution in which the glue frame 20 is formed by multiple glue layers 201 can reduce the risk of damage to the flexible circuit board 132 / 134 caused by bending of the flexible circuit board 132 / 134.

[0123] Exemplarily, the material of the glue frame is PVB film. When the PVB film is not bonded to a substrate or a film layer, the surface of the PVB film is rough, that is, the surface of the PVB film is uneven. On this basis, when the second laminated structure 40 includes a second substrate 41, the glue frame 20 is in contact with the second substrate 41. Since the surface of the glue frame 20 formed by the PVB film is uneven, there is a small gap between the glue frame 20 and the second substrate 41. In the subsequent preparation process, the air in the telescopic gap 1 between the glue frame 20 and the first functional layer 13 can be discharged through the small gap between the glue frame 20 and the second substrate 41, thereby avoiding the generation of bubbles in the dimming device 100.

[0124] like Figure 5 and Figure 7 As shown, the glue frame 20 has at least one first opening 21, and the projection of the first opening 21 along the first direction M1 at least partially overlaps with the orthographic projection of the second adhesive layer 50 along the first direction M1. In this way, before S500 (injecting liquid glue into the first gap 2 through at least one first opening of the glue frame 20), the first opening 21 is connected to the first gap 2, so that liquid glue can be injected into the dimming device 100 through the first opening 21, and then the liquid glue is fixed to form the above-mentioned second adhesive layer 50. In other words, the second adhesive layer 50 is prepared by the glue filling and curing process, and the second adhesive layer 50 has no force or a small force on the first functional layer 13, which can improve the service life of the first functional layer 13. Among them, the first direction M1 is perpendicular to the side where the first opening 21 is located.

[0125] like Figure 5 and Figure 7 As shown, along the second direction M2, the size of the first opening 21 is less than or equal to one half of the size of the first substrate 11. For example, the size of the first opening 21 is less than or equal to one half, one third or one quarter of the size of the first substrate 11. In other words, along the second direction M2, the size of the first opening 21 is smaller than the size of the side of the plastic frame 20 where the first opening 21 is located. The second direction M2 is parallel to the side of the plastic frame 20 where the first opening 21 is located.

[0126] Exemplarily, the glue frame 20 has one first opening 21, two first openings 21, or three first openings 21. For example, the glue frame 20 has one first opening 21, so that less parts are removed from the glue frame 20, which can reduce the risk of poor sealing of the glue frame 20. For another example, the glue frame 20 has three first openings 21, so that the speed of glue filling can be increased and the preparation time of the dimming device 100 can be reduced.

[0127] Figure 11 to Figure 13 2 are several schematic diagrams showing the positional relationship between the first opening 21 and the flexible circuit board 132 / 134. Fig.11 As shown, the first opening 21 and the flexible circuit board are located on two adjacent sides of the plastic frame 20. For example, the flexible circuit board is located on the upper side of the plastic frame 20, and the first opening 21 is located on the left or right side of the plastic frame 20. Or, illustratively, as Fig.12 As shown, the first opening 21 and the flexible circuit board are located on opposite sides of the plastic frame 20. Alternatively, illustratively, as Fig.13As shown, the first opening 21 and the flexible circuit board are located on the same side of the plastic frame 20. When the dimming device 100 is applied to a car window glass, the flexible circuit board is located on the lower side. In this way, when the car window glass is raised or lowered, the flexible circuit board is hidden in the car door. The first opening 21 and the flexible circuit board are located on the same side of the plastic frame 20. Then, the first opening 21 is also hidden in the car door. Since a sealing block 80 is provided to seal the first opening 21 after the glue filling is completed, the sealing block 80 can also be hidden in the car door by using the above design, so that the sealing block 80 is not easily damaged, thereby reducing the risk of water vapor entering the interior of the dimming device 100 through the first opening 21.

[0128] In some embodiments, Fig.14 As shown, the glue frame 20 also has at least one second opening 22. During the process of injecting liquid glue into the first gap, the second opening 22 can exhaust the air in the first gap, thereby reducing the risk of bubbles in the dimming device 100. Exemplarily, the glue frame 20 also has one second opening 22, two second openings 22, or three second openings 22, which can ensure normal exhaust of the dimming device 100. The first opening 21 and the second opening 22 are located on the same side of the glue frame 20.

[0129] In the case where the first opening 21 and the flexible circuit board are located on the same side of the plastic frame 20, the relative positions of the first opening 21, the second opening 22 and the flexible circuit board can be set according to actual conditions. Fig.14 As shown, the first opening 21 and the second opening 22 are located on the same side of the flexible circuit board. Fig.15 As shown, the first opening 21 is located on one side of the flexible circuit board, and the second opening 22 is located on the other side of the flexible circuit board. When the plastic frame 20 is formed by stacking multiple plastic layers, the flexible circuit board 132 / 134 extends from between two adjacent plastic layers, and there is a certain distance between the flexible circuit board 132 / 134 and the first opening 21 to ensure that the part of the flexible circuit board 132 / 134 located in the plastic frame 20 is completely wrapped by the plastic frame 20, and the multiple plastic layers at the first opening 21 will not be separated by the flexible circuit board 132 / 134, so as to ensure good sealing performance of the plastic frame 20. For example, the distance between the first opening 21 and the flexible circuit board is greater than 30 mm.

[0130] In some embodiments, Fig.16 As shown, in the process of forming the first opening 21 and the second opening 22, a baffle 30 is also used. The plastic frame 20 has an opening. The baffle 30 is located in the opening, and the opening is divided into two sub-openings, one of which is the first opening 21, and the other is the second opening 22. The plastic frame 20 has an opening so that less parts are removed from the plastic frame 20, which can reduce the risk of poor sealing of the plastic frame 20.

[0131] like Figure 7 As shown, the sealing block 80 is located at the first opening 21 and seals the first opening 21. The sealing block 80 can reduce the risk of water vapor entering the second adhesive layer 50 through the first opening 21. Exemplarily, the material of the sealing block 80 is hot melt butyl adhesive.

[0132] On the basis of the above embodiment, after S600 (curing the liquid glue to form the second adhesive layer 50 ), the preparation method further includes S700 .

[0133] like Fig.17 As shown, at S700 , the first opening 21 is sealed.

[0134] Hot-melt butyl adhesive 3 is applied in the first opening 21 . The hot-melt butyl adhesive seals the first opening 21 . The hot-melt butyl adhesive can reduce the risk of water vapor in the air entering the second adhesive layer.

[0135] The dimming device 100 includes a baffle 30 (eg Fig.16 In the case of the embodiment shown in FIG. 1 , before sealing the first opening 21 , the baffle 30 needs to be removed from the first opening 21 .

[0136] In some embodiments, Figure 7 As shown, the material of the rubber frame 20 and the sealing block 80 is the same, for example, the material of the rubber frame 20 is PVB, and the material of the sealing block 80 is hot-melt butyl adhesive.

[0137] The material of the glue frame 20 is the same as that of the first adhesive layer 12, which can improve the identity of the materials in the dimming device 100 and reduce the manufacturing cost of the dimming device 100. In the process of forming the dimming device 100, the material of the glue frame 20 will penetrate into the first adhesive layer 12, and the material of the first adhesive layer 12 will penetrate into the glue frame 20, and the first adhesive layer 12 and the glue frame 20 will become a whole, so that the glue frame 20 and the first substrate 11 are bonded more firmly.

[0138] The material of the first adhesive layer 12 is different from the material of the second adhesive layer 50. The material of the first adhesive layer 12 has good impact resistance, which can reduce the risk of the first substrate 11 being broken due to external impact of a certain energy or temperature difference. The material of the second adhesive layer 50 has good stress absorption performance, which can absorb the stress of the first functional layer 13 on the second adhesive layer 50, that is, it can absorb the stress applied to the first functional layer 13 due to the uneven thickness of the first adhesive layer 12. In this way, the stress of the second adhesive layer 50 on the first functional layer 13 is small or non-existent, which can reduce the risk of uneven stress on the first functional layer 13.

[0139] In some embodiments, the material of the plastic frame is PVB film. When the PVB film is not bonded to a substrate or a film layer, the surface of the PVB film is rough, that is, the surface of the PVB film is uneven. Fig.18 As shown, the orthographic projection of the first adhesive layer 12 on the reference surface is within the range of the orthographic projection of the first substrate 11 on the reference surface, and is spaced from the boundary of the first substrate 11. The orthographic projection of the first adhesive layer 12 on the reference surface coincides with the orthographic projection of the first functional layer 13 on the reference surface. The reference surface is parallel to the surface of the first substrate 11 close to the first functional layer 13.

[0140] In this way, after S200 (forming a glue frame 20 on one side of the first stacked structure 10), the glue frame 20 is in contact with the first substrate 11. Since the surface of the glue frame 20 formed by the PVB film is uneven, there is a small gap between the glue frame 20 and the first substrate 11. In the subsequent preparation process, the air in the expansion gap 1 between the glue frame 20 and the first functional layer 13 can be discharged through the small gap between the glue frame 20 and the first substrate 11, thereby avoiding the generation of bubbles in the dimming device 100.

[0141] In the above embodiment, during the subsequent bonding of the second laminated structure, the thickness of the adhesive frame 20 is greater than the sum of the thickness of the first adhesive layer 12 and the first functional layer 13 , so that a first gap can be formed between the second laminated structure and the first functional layer 13 .

[0142] On the basis of the above embodiment, between S100 (forming the first stacked structure 10 ) and S200 (forming the glue frame 20 on one side of the first stacked structure 10 ), the preparation method further includes S201 - S202 .

[0143] like Fig.19 As shown, S201 , applying pressure to the first stacked structure 10 .

[0144] In some embodiments, the material of the first adhesive layer is a PVB film. When the PVB film is not bonded to a substrate or a film layer, the surface of the PVB film is rough, that is, the surface of the PVB film is uneven. Thus, there is a small gap between the first adhesive layer 12 and the first substrate 11 in the first laminated structure 10, and the small gap can accommodate air. Applying pressure to the first laminated structure 10 can remove the air in the small gap between the first adhesive layer 12 and the first substrate 11, so that the bonding area between the first adhesive layer 12 and the first substrate 11 can be larger, and thus the first adhesive layer 12 and the first substrate 11 can be more firmly connected.

[0145] S202, assembling the first laminated structure 10.

[0146] The first adhesive layer 12 bonds the first substrate 11 and the first functional layer 13. Exemplarily, the material of the first adhesive layer 12 is PVB, and the process conditions for the lamination of the first laminated structure 10 are high temperature and high pressure. Alternatively, exemplarily, the material of the first adhesive layer 12 is EVA, the temperature of the lamination of the first laminated structure 10 is lower than that of the lamination of PVB, and the pressure of the lamination of the first laminated structure 10 is lower than that of the lamination of PVB. In this way, the lamination process of EVA is relatively simple, which can reduce the preparation cost of the first laminated structure 10. Alternatively, exemplarily, the material of the first adhesive layer 12 is SGP, the strength of SGP is higher than that of PVB, and the shear modulus of SGP is higher than that of PVB. When the thickness of the first adhesive layer 12 is the same, the strength of the first adhesive layer 12 composed of SGP is higher than that of the first adhesive layer 12 composed of PVB, thereby improving the strength of the first laminated structure 10.

[0147] like Fig.18 As shown, the orthographic projection of the first functional layer 13 on the reference surface coincides with the orthographic projection of the first adhesive layer 12 on the reference surface. Compared with the orthographic projection of the first functional layer 13 on the reference surface, it is located within the orthographic projection of the first adhesive layer 12 on the reference surface and is spaced from the boundary of the first adhesive layer 12. In the process of applying pressure to the first laminated structure 10 and putting the first laminated structure 10 together, the entire first adhesive layer 12 of some embodiments of the present disclosure is compressed, which can make the thickness of the first adhesive layer 12 consistent, so that the first functional layer 13 can be subjected to a relatively uniform force.

[0148] In other embodiments, Figure 7 As shown, the orthographic projection of the first adhesive layer 12 on the reference surface coincides with the orthographic projection of the first substrate 11 on the reference surface, and the orthographic projection of the first functional layer 13 on the reference surface is located within the range of the orthographic projection of the first adhesive layer 12 on the reference surface, and is spaced from the boundary of the first adhesive layer 12. In this way, the first adhesive layer 12 covers the first substrate 11, and when the first substrate 11 is broken by an external impact of a certain energy or a temperature difference change, any part of the first substrate 11 will adhere to the first adhesive layer 12, reducing the risk of fragments of the first substrate 11 flying around.

[0149] In the subsequent process of bonding the second stacked structure, the thickness of the plastic frame 20 is greater than the thickness of the first functional layer 13 , so that a first gap can be provided between the second stacked structure and the first functional layer 13 .

[0150] Fig. 20 FIG. 1 is a structural diagram of the first stacked structure 10 further including a second functional layer 14. In some embodiments, Fig.19As shown, the first laminated structure 10 further includes a second functional layer 14 and a third adhesive layer 15, the second functional layer 14 is located on a side of the first functional layer 13 away from the first substrate 11, and the third adhesive layer 15 is located between the first functional layer 13 and the second functional layer 14, and is used to bond the first functional layer 13 and the second functional layer 14. After S200 (forming a glue frame 20 on one side of the first laminated structure 10), the end of the glue frame 20 away from the first substrate 11 is farther away from the first substrate 11 than the end of the second functional layer 14 away from the first substrate 11, that is, along the thickness direction of the first laminated structure 10, the upper surface of the glue frame 20 is higher than the upper surface of the second functional layer 14.

[0151] The types of the first functional layer 13 and the second functional layer 14 can be set according to actual conditions. For example, the first functional layer 13 is a dye liquid crystal functional layer, and the second functional layer 14 is also a dye liquid crystal functional layer. The first functional layer 13 can have a different light transmittance from the second functional layer 14. The first functional layer 13 and the second functional layer 14 can cooperate to enable the dimming device 100 to have at least two regions with different light transmittances. Alternatively, the first functional layer 13 and the second functional layer 14 can cooperate to reduce the dark state light transmittance of the dimming device.

[0152] Alternatively, illustratively, the first functional layer 13 is a dye liquid crystal functional layer, and the second functional layer 14 is a touch functional layer. The touch functional layer is electrically connected to the dye liquid crystal functional layer, so that the light transmittance of the dye liquid crystal functional layer can be adjusted by the touch functional layer, which is convenient for operation. For example, the light transmittance can be adjusted by gesture by swiping a finger.

[0153] Alternatively, illustratively, the first functional layer 13 is a display functional layer, and the second functional layer 14 is a dye liquid crystal functional layer. Alternatively, the first functional layer 13 is a display functional layer, and the second functional layer 14 is a touch functional layer.

[0154] The third adhesive layer 15 is used to connect the first functional layer 13 and the second functional layer 14. The material of the third adhesive layer 15 can be the same as that of the first adhesive layer 12. For example, the materials of the third adhesive layer 15 and the first adhesive layer 12 are both PVB.

[0155] Based on the above embodiments, Figure 4As shown, in the process of S400 (joining the first laminated structure 10, the plastic frame 20 and the second laminated structure 40), the first gap 2 provides a moving space for the first functional layer 13 and the second functional layer 14. In the case of inconsistent thickness of the first adhesive layer 12, the thicker part of the first adhesive layer 12 arches in the direction from the first substrate 11 to the second substrate 41, and accordingly, the part of the first functional layer 13 bonded to this part arches in the direction from the first substrate 11 to the second substrate 41, and the corresponding part of the second functional layer 14 arches in the direction from the first substrate 11 to the second substrate 41. The thinner part of the first adhesive layer 12 is concave in the direction from the second substrate 41 to the first substrate 11, and accordingly, the part of the first functional layer 13 bonded to this part is concave in the direction from the second substrate 41 to the first substrate 11, and the corresponding part of the second functional layer 14 is concave in the direction from the second substrate 41 to the first substrate 11. In this way, the stress exerted by the first adhesive layer 12 on the first functional layer 13 and the second functional layer 14 is released, which can reduce the risk of uneven stress on the first functional layer 13 and the second functional layer 14 due to inconsistency of the first adhesive layer 12 .

[0156] In the case of inconsistent thickness of the third adhesive layer 15, the thicker portion of the third adhesive layer 15 arches in the direction from the first substrate 11 to the second substrate 41, and accordingly, the portion of the second functional layer 14 bonded to this portion arches in the direction from the first substrate 11 to the second substrate 41. The thinner portion of the third adhesive layer 15 is concave in the direction from the second substrate 41 to the first substrate 11, and accordingly, the portion of the second functional layer 14 bonded to this portion is concave in the direction from the second substrate 41 to the first substrate 11, so that the stress applied by the third adhesive layer 15 on the first functional layer 13 and the second functional layer 14 can be released, which can reduce the risk of uneven force on the first functional layer 13 and the second functional layer 14 due to the inconsistency of the third adhesive layer 15.

[0157] In some embodiments, Fig.21 As shown, the second laminated structure includes a second substrate 41 and a fourth adhesive layer 42 which are stacked. The fourth adhesive layer 42 is located on a side of the second substrate 41 close to the second adhesive layer 50. The fourth adhesive layer 42 can reduce the risk of the second substrate 41 being broken by an external impact of a certain energy or a temperature difference change. Even if the second substrate 41 is broken, the fragments of the second substrate 41 will stick to the fourth adhesive layer 42, thereby reducing the risk of the fragments of the second substrate 41 flying around. The material of the fourth adhesive layer 42 includes EVA, PVB or SGP.

[0158] For example, Fig.21As shown, the orthographic projection of the fourth adhesive layer 42 on the reference surface coincides with the orthographic projection of the second substrate 41 on the reference surface, and the adhesive frame 20 abuts against the fourth adhesive layer 42. In this way, the fourth adhesive layer 42 covers the second substrate 41, and when the second substrate 41 is broken by an external impact of a certain energy or a temperature difference change, any part of the second substrate 41 will adhere to the fourth adhesive layer 42, reducing the risk of fragments of the second substrate 41 flying around.

[0159] Or, for example, Fig. 22 As shown, the orthographic projection of the fourth adhesive layer 42 on the reference surface is within the range of the orthographic projection of the second substrate 41 on the reference surface, and is spaced from the boundary of the second substrate 41. The orthographic projection of the fourth adhesive layer 42 on the reference surface coincides with the orthographic projection of the second adhesive layer 50 on the reference surface. On the one hand, the adhesive frame 20 abuts against the second substrate 41, which can reduce the risk of inconsistent spacing between the first substrate 11 and the second substrate 41 caused by the inconsistency of the fourth adhesive layer 42. On the other hand, the material of the fourth adhesive layer includes PVB. Since the surface of the adhesive frame 20 formed by the PVB film is uneven, there is a small gap between the adhesive frame 20 and the first substrate 11. In the subsequent preparation process, the air in the telescopic gap 1 between the adhesive frame 20 and the first functional layer 13 can be discharged through the small gap between the adhesive frame 20 and the first substrate 11, thereby avoiding the generation of bubbles in the dimming device 100.

[0160] In other embodiments, Fig.23 As shown, the second laminated structure 40 includes a laminated second substrate 41, a fourth adhesive layer 42 and a third functional layer 43. The third functional layer may be a dimming functional layer, a display functional layer or a touch functional layer.

[0161] The surface of the second substrate 41 close to the third functional layer 43 is bonded to the glue frame 20, and a first gap 2 is provided between the first laminated structure 10 and the third functional layer 43. The orthographic projection of the fourth adhesive layer 42 on the reference surface is located within the range of the orthographic projection of the second substrate 41 on the reference surface, and is spaced from the boundary of the second substrate 41. The orthographic projection of the fourth adhesive layer 42 on the reference surface coincides with the orthographic projection of the third functional layer 43 on the reference surface. The glue frame 20 also surrounds the third functional layer 43, and the glue frame 20 can reduce the risk of water vapor entering the third functional layer 43.

[0162] Based on the above embodiment, between S200 (forming the plastic frame 20 on one side of the first laminated structure 10 ) and S300 (bonding the second laminated structure 40 on the side of the plastic frame 20 away from the first substrate 11 ), the preparation method further includes S301 - S302 .

[0163] like Fig.24 In S301 , pressure is applied to the second stacked structure 40 .

[0164] There is a small gap between the fourth adhesive layer 42 and the second substrate 41 in the formed second laminated structure 40, and the small gap can accommodate air. Applying pressure to the second laminated structure 40 can remove the air in the small gap between the fourth adhesive layer 42 and the second substrate 41, so that the bonding area between the fourth adhesive layer 42 and the second substrate 41 can be larger, and the fourth adhesive layer 42 can connect the second substrate 41 and the third functional layer 43 more firmly.

[0165] S302, assembling the second laminated structure 40.

[0166] The fourth adhesive layer 42 bonds the second substrate 41 and the third functional layer 43, and the orthographic projection of the third functional layer 43 on the reference surface coincides with the orthographic projection of the fourth adhesive layer 42 on the reference surface. Compared with the orthographic projection of the third functional layer on the reference surface, which is located within the orthographic projection of the fourth adhesive layer on the reference surface and is spaced from the boundary of the fourth adhesive layer, in the process of applying pressure to the second laminated structure 40 and assembling the second laminated structure 40, the entire fourth adhesive layer 42 of some embodiments of the present disclosure is compressed, so that the thickness of the fourth adhesive layer 42 is consistent and the force on the third functional layer 43 is relatively uniform.

[0167] In some embodiments, the dimming device 100 is used for a vehicle window glass, and the first adhesive layer 12 is closer to the interior of the vehicle than the second adhesive layer 50. Fig.25 As shown, the dimming device 100 also includes a first light shielding layer 60 and a second light shielding layer 70. The first light shielding layer 60 is located on the side of the first substrate 11 away from the second substrate 41, and the first light shielding layer 60 is arranged along the edge of the first substrate 11. The outer boundary of the orthographic projection of the first light shielding layer 60 on the first substrate 11 coincides with the boundary of the first substrate 11, and the inner boundary is located within the inner boundary of the orthographic projection of the rubber frame 20 on the first substrate 11, that is, the inner boundary is the center of the dimming device compared to the inner boundary of the orthographic projection of the rubber frame 20 on the reference surface. In this way, the first light shielding layer 60 covers the rubber frame 20, and the first light shielding layer 60 can reduce the risk of ultraviolet light irradiating the rubber frame 20, reduce the risk of aging of the rubber frame 20, and increase the service life of the rubber frame 20.

[0168] The second light shielding layer 70 is located on the side of the second substrate 41 close to the first substrate 11, and the second light shielding layer 70 is arranged along the edge of the second substrate 41, and at least part of the second light shielding layer 70 is located between the second substrate 41 and the rubber frame 20, that is, the outer boundary of the orthographic projection of the second light shielding layer 70 on the second substrate 41 coincides with the boundary of the second substrate 41, and the inner boundary coincides with the inner boundary of the orthographic projection of the rubber frame 20 on the reference surface, or the inner boundary is the center of the dimming device compared to the inner boundary of the orthographic projection of the rubber frame 20 on the reference surface. In this way, the second light shielding layer 70 covers the rubber frame 20, and the second light shielding layer 70 can reduce the risk of ultraviolet light irradiating the rubber frame, reduce the risk of aging of the rubber frame 20, and increase the service life of the rubber frame 20. The second light shielding layer 70 is located on the side of the second substrate 41 close to the first substrate 11, so that the risk of scratching the second light shielding layer 70 by objects outside the vehicle can be reduced.

[0169] When the dimming device 100 includes a first light shading layer 60 and a second light shading layer 70 , the first light shading layer 60 and the second light shading layer 70 can also reduce the risk of ultraviolet light irradiating the sealing block 80 , reduce the risk of aging of the sealing block 80 , and increase the service life of the sealing block 80 .

[0170] On the basis of the above embodiment, after S700 (sealing the first opening 21 ), the preparation method further includes S800 .

[0171] like Fig.26 As shown, S800, forming a first light shielding layer 60.

[0172] The first light shielding layer 60 is located on the side of the first laminated structure 10 away from the second laminated structure 40, and is arranged along the edge of the first laminated structure 10. The outer boundary of the orthographic projection of the first light shielding layer 60 on the reference surface coincides with the boundary of the orthographic projection of the first laminated structure 10 on the reference surface, and the inner boundary is the center of the dimming device compared to the inner boundary of the orthographic projection of the plastic frame 20 on the reference surface, that is, the first light shielding layer 60 covers the plastic frame 20. In this way, the first light shielding layer 60 can reduce the risk of ultraviolet light irradiating the plastic frame 20, reduce the risk of aging of the plastic frame 20, and increase the service life of the plastic frame 20.

[0173] Before S300 (bonding the second stacked structure 40 on the side of the plastic frame 20 away from the first substrate 11 ), the preparation method further includes S900 .

[0174] like Fig.26 As shown, S900, forming a second light shielding layer 70.

[0175] The second light shielding layer 70 is located on the surface of the second substrate 41 and is arranged along the edge of the second light shielding layer 70. In the process of S300 (attaching the second laminated structure 40 on the side of the rubber frame 20 away from the first substrate 11), the second light shielding layer 70 is located on the side of the second substrate 41 close to the first functional layer 13, which can reduce the risk of scratching the second light shielding layer 70 by objects outside the vehicle. At least part of the second light shielding layer 70 is located between the second substrate 41 and the rubber frame 20, that is, the outer boundary of the orthographic projection of the second light shielding layer 70 on the reference surface coincides with the boundary of the orthographic projection of the second laminated structure 40 on the reference surface, and the inner boundary coincides with the inner boundary of the orthographic projection of the rubber frame 20 on the reference surface, or the inner boundary is closer to the center of the dimming device than the inner boundary of the orthographic projection of the rubber frame 20 on the reference surface. In this way, the second light shielding layer 70 covers the rubber frame 20. The second light shielding layer 70 can reduce the risk of ultraviolet light irradiating the rubber frame, reduce the risk of aging of the rubber frame 20, and increase the service life of the rubber frame 20.

[0176] In some embodiments, Fig. 27 and Fig.28 As shown, there are multiple first functional layers 13, and the multiple first functional layers 13 are all bonded to the first adhesive layer 12. Generally, it is difficult to prepare a larger first functional layer 13, and it is relatively simple to prepare a smaller first functional layer 13. In this way, when the dimming device 100 is large in size, multiple smaller first functional layers 13 are used to replace a larger first functional layer 13, which can reduce the difficulty of preparing the dimming device 100. There is a gap between two adjacent first functional layers 13, so that the risk of collision between the two adjacent first functional layers 13 can be reduced. The second adhesive layer 50 is partially located in the gap between the two adjacent first functional layers 13.

[0177] Exemplarily, the plurality of first functional layers 13 are arranged in an array, for example, a plurality of first functional layers 13 are arranged in a rectangular array, or for another example, a plurality of first functional layers 13 are arranged in a circular array.

[0178] In some embodiments, Fig.29 and Fig.30 As shown, the dimming device further includes a limit bar 90, which is located in the interval between two adjacent first functional layers 13. The limit bar 90 is used to separate the two adjacent first functional layers 13 to reduce the risk of collision between the two adjacent first functional layers 13. There is a gap between the limit bar 90 and the second laminated structure 40, so that during the process of injecting liquid glue into the dimming device 100, the liquid glue can fill the first gap between each first functional layer 13 and the second laminated structure 40 through the gap between the limit bar 90 and the second laminated structure 40.

[0179] Exemplarily, the surface of the limiting strip 90 away from the first substrate 11 is higher than the surface of the first functional layer 13 away from the first substrate. Alternatively, exemplarily, the surface of the limiting strip 90 away from the first substrate 11 is substantially flush with the surface of the first functional layer 13 away from the first substrate. Alternatively, exemplarily, the surface of the limiting strip 90 away from the first substrate 11 is lower than the surface of the first functional layer 13 away from the first substrate. In the case where the surface of the limiting strip 90 away from the first substrate 11 is lower than the surface of the first functional layer 13 away from the first substrate, the second adhesive layer 50 is partially located in the interval between two adjacent first functional layers 13.

[0180] In other embodiments, Fig.31 and Fig.32 As shown, the dimming device further includes a limit strip 90, which is located in the interval between two adjacent first functional layers 13. The limit strip 90 is used to separate the two adjacent first functional layers 13 and reduce the risk of collision between the two adjacent first functional layers 13. The limit strip 90 contacts the second laminated structure 40, so that the limit strip 90 can reduce the risk of water vapor in the first functional layer 13 entering the adjacent first functional layer 13. The limit strip 90 has a plurality of third openings 91, and at least one third opening 91 is included between two adjacent first functional layers 13. In this way, during the process of injecting liquid glue into the dimming device 100, the liquid glue can flow through the third openings 91 to the first gap between each first functional layer 13 and the second laminated structure 40, thereby filling the first gap. The liquid glue also fills the third openings 91 so that the second adhesive layer 50 is partially located in the third openings 91.

[0181] In some embodiments, the embodiments of the present disclosure further provide a dimming structure, the dimming structure includes a dimming device 100, and the dimming structure includes one of a skylight, a curtain wall, a rail transportation vehicle, a car, and a billboard.

[0182] The dimming device 100 can be used in the field of architecture. For example, the dimming device 100 is used in a skylight or a curtain wall. The dimming device 100 can be used in the glass of a partition. Compared with the case where a brick wall is used to separate a room in the field of architecture, the light device 100 of the embodiment of the present disclosure is thinner, so the dimming device 100 can save space. The company logo can also be displayed on the partition glass. In this case, the dimming structure including the dimming device 100 can be, for example, a skylight, a curtain wall, etc.

[0183] The dimming device 100 can also be applied to the field of transportation, for example, the dimming device 100 is applied to rail transportation vehicles or cars. Rail transportation vehicles may include subways, light rails, aerial rail trains, trams, and maglev trains, which are not listed one by one in the embodiments of the present disclosure. Automobiles may include passenger cars, commercial vehicles, trucks, or buses, which are not listed one by one in the embodiments of the present disclosure. In this case, the dimming structure including the dimming device 100 may be, for example, a rail transportation vehicle, a car, and the like.

[0184] The implementation of the present disclosure is described by taking the dimming structure of a car 1000 as an example. Fig.33 As shown, the automobile 1000 includes a vehicle body 1010 and a window glass 1020 installed on the vehicle body 1010. The window glass 1020 can be one or more of the front window glass, sunroof glass, rear window glass or side window glass of the automobile. The window glass 1020 includes the dimming device 100 of any of the above embodiments. The dimming device 100 can also be applied to the central control touch screen in the automobile 1000.

[0185] The dimming device 100 may also be applied in the field of advertising. For example, the dimming device 100 may be applied in billboards.

[0186] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0187] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A method for preparing a dimming device, characterized in that: include: forming a first laminated structure; the first laminated structure comprises a first substrate, a first adhesive layer and a first functional layer which are stacked; forming a glue frame on one side of the first stacked structure; The plastic frame is located on a side of the first substrate close to the first functional layer and surrounds the first functional layer; the plastic frame has at least one first opening; A second stacked structure is attached to a side of the plastic frame away from the first substrate; a first gap is formed between the second stacked structure and the first stacked structure; wherein the first opening is connected to the first gap; Laminating the first laminated structure, the adhesive frame and the second laminated structure, so that the first adhesive layer bonds the first substrate and the first functional layer, and the adhesive frame bonds the first laminated structure and the second laminated structure; injecting liquid glue into the first gap through the at least one first opening; The liquid adhesive is cured to form a second adhesive layer; the second adhesive layer bonds the first laminated structure to the second laminated structure.

2. The preparation method according to claim 1, characterized in that: The orthographic projection of the first adhesive layer on the reference surface is located within the range of the orthographic projection of the first substrate on the reference surface and is spaced from the boundary of the first substrate; the orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first functional layer on the reference surface; and along a direction perpendicular to the first substrate, the thickness of the adhesive frame is greater than the sum of the thickness of the first adhesive layer and the thickness of the first functional layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer; Wherein, between forming the first stacked structure and forming a glue frame on one side of the first stacked structure, the preparation method further includes: Applying a force to the first stacked structure to remove air between the first adhesive layer and the first substrate; The first laminated structure is laminated so that the first adhesive layer bonds the first substrate and the first functional layer.

3. The preparation method according to claim 1, characterized in that: The orthographic projection of the first adhesive layer on the reference plane coincides with the orthographic projection of the first substrate on the reference plane, the orthographic projection of the first functional layer on the reference plane is located within the range of the orthographic projection of the first adhesive layer on the reference plane, and is spaced apart from a boundary of the first adhesive layer, and along a direction perpendicular to the first substrate, the thickness of the adhesive frame is greater than the thickness of the first functional layer; wherein the reference plane is parallel to a surface of the first substrate close to the first functional layer.

4. The preparation method according to claim 1, characterized in that: The first stacked structure further includes a second functional layer and a third adhesive layer, the second functional layer is located on a side of the first functional layer away from the first substrate, and the third adhesive layer is located between the first functional layer and the second functional layer.

5. The preparation method according to any one of claims 1 to 4, characterized in that: The second laminated structure comprises a second substrate, a fourth adhesive layer and a third functional layer which are stacked, the orthographic projection of the fourth adhesive layer on the reference surface is located within the range of the orthographic projection of the second substrate on the reference surface, and is spaced from the boundary of the second substrate, and the orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the third functional layer on the reference surface; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer; Between forming a glue frame on one side of the first stacked structure and attaching the second stacked structure to a side of the glue frame away from the first substrate, the preparation method further includes: applying pressure to the second laminate structure to remove air between the fourth adhesive layer and the second substrate; The second laminated structure is laminated so that the fourth adhesive layer bonds the second substrate and the third functional layer.

6. A dimming device, characterized in that: include: A first laminated structure comprises a first substrate, a first adhesive layer and a first functional layer which are stacked; A second laminate structure is located on a side of the first substrate close to the first adhesive layer, the second laminate comprising a second substrate; a second adhesive layer, located between the first laminated structure and the second laminated structure, and configured to bond the first laminated structure and the second laminated structure; a glue frame, located between the first substrate and the second substrate and surrounding the first functional layer and the second adhesive layer, the glue frame having at least one first opening, the projection of the first opening along a first direction at least partially overlapping with the projection of the second adhesive layer along the first direction; wherein the first direction is perpendicular to the side of the glue frame where the first opening is located; The sealing block is located in the first opening and seals the first opening.

7. The dimming device according to claim 6, characterized in that: The thickness of the first adhesive layer is M×d1, and the thickness of the adhesive frame is N×d2; wherein M and N are both positive integers less than 6, and N is greater than M; d1 and d2 are 0.3 mm to 0.5 mm, and d1 is less than or equal to d2.

8. The dimming device according to claim 7, characterized in that: The thickness of the first functional layer is d3, and d3 is less than or equal to 1.1 mm; The thickness of the second adhesive layer is N×d2-M×d1-d3.

9. The dimming device according to claim 6, characterized in that: The material of the adhesive frame is the same as that of the first adhesive layer, and different from that of the sealing block; and the material of the first adhesive layer is different from that of the second adhesive layer.

10. The dimming device according to claim 6, characterized in that: The orthographic projection of the first adhesive layer on the reference surface is located within the range of the orthographic projection of the first substrate on the reference surface and is spaced apart from the boundary of the first substrate. The orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first functional layer on the reference surface, and the adhesive frame abuts against the first substrate; wherein the reference surface is parallel to a surface of the first substrate close to the first functional layer.

11. The dimming device according to claim 6, characterized in that: The orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first substrate on the reference surface, the orthographic projection of the first functional layer on the reference surface is located within the range of the orthographic projection of the first adhesive layer on the reference surface, and is spaced apart from the boundary of the first adhesive layer, and the adhesive frame abuts against the first adhesive layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

12. The dimming device according to claim 6, characterized in that: The first functional layer is a dimming functional layer, the dimming functional layer is configured to adjust light transmittance, and the material of the first adhesive layer is PVB or SGP; or The first functional layer is a display functional layer, and the display functional layer is configured to display an image. The material of the first adhesive layer is OCA, OCR or EVA.

13. The dimming device according to claim 6, characterized in that: The first stacked structure further comprises: a second functional layer, located on a side of the first functional layer away from the first substrate; The third adhesive layer is located between the first functional layer and the second functional layer, and is configured to bond the first functional layer and the second functional layer.

14. The dimming device according to claim 6, characterized in that: The second stacked structure further comprises: The fourth adhesive layer is located on a side of the second substrate close to the second adhesive layer.

15. The dimming device according to claim 14, characterized in that: The orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the second substrate on the reference surface, and the adhesive frame abuts against the fourth adhesive layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

16. The dimming device according to claim 14, characterized in that: The orthographic projection of the fourth adhesive layer on the reference surface is located within the range of the orthographic projection of the second substrate on the reference surface and is spaced apart from the boundary of the second substrate. The orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the second adhesive layer on the reference surface, and the adhesive frame abuts against the second substrate; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

17. The dimming device according to claim 16, characterized in that: The second stacked structure further comprises: The third functional layer is located on a side of the fourth adhesive layer away from the second substrate, and the adhesive frame also surrounds the third functional layer.

18. The dimming device according to any one of claims 6 to 17, characterized in that: Also includes: A first light shielding layer is located on a side of the first substrate away from the second substrate and is arranged along an edge of the first substrate, wherein an outer boundary of an orthographic projection of the first light shielding layer on the first substrate coincides with a boundary of the first substrate, and an inner boundary of the first light shielding layer is located within an inner boundary of an orthographic projection of the rubber frame on the first substrate; The second light shielding layer is located on a side of the second substrate close to the first substrate and is arranged along an edge of the second substrate. The second light shielding layer is at least partially located between the second substrate and the glue frame.

19. The dimming device according to any one of claims 6 to 17, characterized in that: The first functional layer includes a flexible circuit board, and the flexible circuit board and the first opening are located on the same side of the plastic frame.

20. The dimming device according to any one of claims 6 to 17, characterized in that: There are a plurality of first functional layers, and the plurality of first functional layers are all bonded to the first adhesive layer, and there is a gap between two adjacent first functional layers.

21. The dimming device according to any one of claims 6 to 17, characterized in that: The dimming device also includes: The limiting strip is located in the interval between two adjacent first functional layers, and there is an interval between the limiting strip and the second stacked structure.

22. The dimming device according to any one of claims 6 to 17, characterized in that: The dimming device also includes: The limiting bar is located in the interval between two adjacent first functional layers, and the limiting bar is in contact with the second stacked structure; the limiting bar has a plurality of third openings, and at least one third opening is included between two adjacent first functional layers.

23. The dimming device according to any one of claims 6 to 17, characterized in that: Along the second direction, the size of the first opening is less than or equal to half of the size of the first substrate; wherein the second direction is parallel to the side surface of the plastic frame where the first opening is located.

24. A dimming structure, characterized in that: It comprises a dimming device as described in any one of claims 6 to 23; the dimming structure comprises one of a curtain wall, a skylight, a rail transportation vehicle and a passenger car.

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