A semiconductor chip package defoaming system and defoaming method

Abstract

The present invention discloses a semiconductor chip encapsulation degassing system and a degassing method in the field of chip packaging technology, including a substrate, a chip, and solder joints, and further including a vacuum chamber. The substrate, the chip, and the solder joints are arranged in the vacuum chamber; a filling mechanism is arranged in the vacuum chamber, and the filling mechanism is used to inject a circle of insulating glue for blocking the gap between the substrate and the chip after the vacuum chamber is evacuated. By switching between the vacuum and atmospheric pressure of the substrate and the chip, the present invention enables the insulating glue to be actively sucked into the gap between the substrate and the chip. And due to the vacuum environment, there is no air in the gap and the insulating glue. At the same time, under atmospheric pressure, the air is blocked by the outer insulating glue, so that the air cannot enter the gap and the insulating glue sucked into the gap, thereby making no bubbles generated in the insulating glue filled in the gap.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to a semiconductor chip packaging defoaming system and a defoaming method. Background Art

[0002] During the semiconductor chip packaging process, after the chip and the substrate are soldered, it is necessary to fill the gap between the chip and the substrate with insulating glue to increase the stability of the semiconductor chip. After the insulating glue is filled, in order to prevent the bubbles entering the insulating glue during the filling process from interfering with the operation of the semiconductor chip, it is necessary to perform defoaming treatment on the semiconductor chip to remove the bubbles in the insulating glue.

[0003] In the traditional packaging defoaming method, usually after the insulating glue is filled, a defoaming device is used to remove the bubbles in the insulating glue. This method is difficult to completely remove the bubbles in the insulating glue, and it is necessary to add a special defoaming device after the insulating glue is filled, and the semiconductor chip needs to be transported, which reduces the production efficiency of the semiconductor chip. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor chip packaging defoaming system and a defoaming method to solve the problems in the above background art that in the traditional packaging defoaming method, usually after the insulating glue is filled, a defoaming device is used to remove the bubbles in the insulating glue. This method is difficult to completely remove the bubbles in the insulating glue, and it is necessary to add a special defoaming device after the insulating glue is filled, and the semiconductor chip needs to be transported, which reduces the production efficiency of the semiconductor chip.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A semiconductor chip packaging defoaming system includes a substrate, a chip, and solder joints, and further includes a vacuum chamber, and the substrate, the chip, and the solder joints are arranged in the vacuum chamber;

[0006] A filling mechanism, the filling mechanism is arranged in the vacuum chamber, and the filling mechanism is used to inject a circle of insulating glue for sealing the gap between the substrate and the chip after the vacuum chamber is evacuated.

[0007] As a further solution of the present invention, the filling mechanism includes a driving device, a rectangular injection tube is arranged below the driving device, the driving device is used to drive the inner wall of the rectangular injection tube to engage with the side wall of the chip, an injection port is opened at the lower end of the inner wall of the rectangular injection tube, the injection port is used to inject the insulating glue, and a material storage mechanism is arranged at the upper end of the rectangular injection tube, and the material storage mechanism is used to inject the insulating glue into the rectangular injection tube or suck the insulating glue out of the rectangular injection tube.

[0008] As a further solution of the present invention, the driving device includes a mounting plate, the upper end of the mounting plate is fixedly connected to the upper end of the vacuum chamber, the lower end of the mounting plate is longitudinally slidably connected with a first driving block, the lower end of the first driving block is horizontally slidably connected with a second driving block, the lower end of the second driving block is rotatably connected with a driving telescopic rod, the lower end of the driving telescopic rod is fixedly connected to the upper end of the rectangular injection tube, and driving units are built in the first driving block, the second driving block and the driving telescopic rod respectively. The driving units are respectively used for driving the first driving block to move longitudinally, driving the second driving block to move horizontally, and driving the driving telescopic rod to rotate and extend.

[0009] As a further solution of the present invention, a liquid pump is externally connected to the material storage mechanism, and the liquid pump is used for pumping and discharging insulating glue.

[0010] As a further solution of the present invention, the material storage mechanism includes a first storage tank, a second storage tank is sleeved outside the first storage tank, both the first storage tank and the second storage tank are fixedly connected to the upper end of the rectangular injection tube, a partition plate is arranged in the rectangular injection tube, the partition plate divides the rectangular injection tube into two independent inner and outer pipelines, the upper ends of the two independent inner and outer pipelines are respectively fixedly communicated with the lower ends of the first storage tank and the second storage tank, and liquid pumps are externally connected to both the first storage tank and the second storage tank.

[0011] As a further solution of the present invention, a communicating pipe is fixedly communicated with the upper end of the first storage tank, the upper end of the communicating pipe penetrates through the upper end of the second storage tank, a through hole is vertically penetrated through the upper end of the second storage tank, filter meshes are fixedly connected to the inner walls of the upper end of the communicating pipe and the inner wall of the through hole, and the filter meshes are used for blocking insulating glue.

[0012] As a further solution of the present invention, a sealing block is fixedly connected to the inner side wall of the inner cavity of the rectangular injection tube, a driving rod is drivingly connected to the lower end of the sealing block, a motor is embedded in the sealing block, the motor is used for driving the driving rod to perform vertical displacement, and a baffle is fixedly connected to the lower end of the driving rod.

[0013] A method for removing bubbles in semiconductor chip packaging is as follows:

[0014] S1. First, place the substrate and the chip that have completed thermocompression bonding welding in the fixed position of the vacuum chamber;

[0015] S2. Then, close the vacuum chamber and start the vacuum chamber to make the substrate and the chip in the vacuum chamber in a vacuum environment.

[0016] S3. Next, inject a circle of insulating glue for blocking the gap at the gap between the substrate and the chip through the filling mechanism.

[0017] S4. Finally, close the vacuum chamber to restore the normal air pressure inside the vacuum chamber, so that the insulating glue at the gap between the substrate and the chip enters between the substrate and the chip under atmospheric pressure, completing the filling of the insulating glue.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] 1. By switching between vacuum and atmospheric pressure between the substrate and the chip, the present invention enables the insulating glue at the gap between the substrate and the chip to be actively sucked into the gap. And due to the vacuum environment, there is no air inside the gap and in the insulating glue. At the same time, under atmospheric pressure, the air is blocked by the outer insulating glue, making it impossible for air to enter the gap and the insulating glue sucked into the gap. As a result, no bubbles are generated in the insulating glue filled in the gap.

[0020] 2. The present invention injects the insulating glue through the injection port located at the gap and keeps it beside the gap, so that there is enough insulating glue beside the gap to block air, further avoiding the generation of bubbles in the gap.

[0021] 3. The present invention forms two channels between the inner wall of the rectangular injection tube and the side wall of the chip and between the lower end of the rectangular injection tube and the upper end of the substrate. When the liquid pump sucks, its suction can be concentrated, and then the insulating glue outside the gap is sucked into the rectangular injection tube to complete the cleaning of the insulating glue, thereby ensuring the production quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 is a front sectional schematic diagram of the overall structure of the present invention;

[0024] Figure 3 is a schematic diagram of the structure of the present invention after removing the vacuum chamber and the driving device;

[0025] Figure 4 is Figure 3 the front sectional structure schematic diagram;

[0026] Figure 5 is Figure 4 the enlarged schematic diagram of the structure at A in

[0027] Figure 6 is Figure 3 the schematic diagram of the structure after removing the first storage tank and the second storage tank;

[0028] Figure 7 is Figure 6 the top sectional structure schematic diagram;

[0029] Figure 8 is the schematic diagram of the method flow of the present invention.

[0030] In the accompanying drawings, the list of components represented by each reference numeral is as follows:

[0031] Substrate 11, chip 12, solder joint 13, vacuum chamber 14, rectangular injection tube 22, injection port 23, mounting plate 24, first driving block 25, second driving block 26, driving telescopic rod 27, first storage tank 41, second storage tank 42, partition plate 43, sealing block 51, driving rod 52, baffle 53, connecting pipe 61, filter screen 62. Specific embodiments

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figures 1-8 , the present invention provides a technical solution: a semiconductor chip encapsulation degassing system, including a substrate 11, a chip 12 and a solder joint 13, further including a vacuum chamber 14, and the substrate 11, the chip 12 and the solder joint 13 are arranged in the vacuum chamber 14;

[0034] Filling mechanism, the filling mechanism is arranged in the vacuum chamber 14, and the filling mechanism is used to inject a circle of insulating glue for sealing the gap between the substrate 11 and the chip 12 after the vacuum chamber 14 is evacuated.

[0035] Put the substrate 11 and the chip 12 that have completed thermocompression bonding welding into the fixed position of the vacuum chamber 14 (in actual use, the welding device can be integrated into the vacuum chamber 14 to reduce workpiece transfer), and then close the vacuum chamber 14 and start the vacuum chamber 14, so that the substrate 11 and the chip 12 in the vacuum chamber 14 are in a vacuum environment, and then inject a circle of insulating glue for sealing the gap between the substrate 11 and the chip 12 through the filling mechanism; then close the vacuum chamber 14 to make the pressure in the vacuum chamber 14 return to the normal atmospheric pressure state. Further, the insulating glue at the gap between the substrate 11 and the chip 12 enters between the substrate 11 and the chip 12 under the atmospheric pressure to complete the filling of the insulating glue.

[0036] The present invention switches between vacuum and atmospheric pressure between the substrate 11 and the chip 12, so that the insulating glue can be actively sucked into the gap between the substrate 11 and the chip 12. And because in the vacuum environment, there is no air in the gap and in the insulating glue, and at the same time under the atmospheric pressure, the air is blocked by the outer insulating glue, so that the air cannot enter the gap and the insulating glue sucked into the gap, thereby making no bubbles generated in the insulating glue filled in the gap.

[0037] As a further solution of the present invention, the filling mechanism includes a driving device, a rectangular injection tube 22 is arranged below the driving device, the driving device is used to drive the inner wall of the rectangular injection tube 22 to engage with the side wall of the chip 12, an injection port 23 is opened at the lower end of the inner wall of the rectangular injection tube 22, the injection port 23 is used to inject insulating glue, a material storage mechanism is arranged at the upper end of the rectangular injection tube 22, and the material storage mechanism is used to inject insulating glue into the rectangular injection tube 22 or suck the insulating glue out of the rectangular injection tube 22.

[0038] After the vacuum in the vacuum chamber 14 is pumped out, the driving device drives the rectangular injection tube 22 to move, so that the lower end of the rectangular injection tube 22 fits against the upper end of the substrate 11, the inner wall of the rectangular injection tube 22 is aligned with the side wall of the chip 12, and then the injection port 23 of the rectangular injection tube 22 injects insulating glue. Further, the insulating glue is accumulated between the injection port 23 at the gap and the side wall of the chip 12. Then, the vacuum chamber 14 is closed to allow air to enter the vacuum chamber 14. Further, the air squeezes the insulating glue accumulated at the gap into the gap.

[0039] The present invention injects insulating glue through the injection port 23 at the gap and stays beside the gap, so that there is enough insulating glue beside the gap to block air, further avoiding the generation of bubbles in the gap.

[0040] As a further solution of the present invention, the driving device includes a mounting plate 24, the upper end of the mounting plate 24 is fixedly connected to the upper end of the vacuum chamber 14, a first driving block 25 is longitudinally slidably connected to the lower end of the mounting plate 24, a second driving block 26 is horizontally slidably connected to the lower end of the first driving block 25, a driving telescopic rod 27 is rotatably connected to the lower end of the second driving block 26, the lower end of the driving telescopic rod 27 is fixedly connected to the upper end of the rectangular injection tube 22, and driving units are built into the first driving block 25, the second driving block 26 and the driving telescopic rod 27 respectively. The driving units are respectively used to drive the first driving block 25 to move longitudinally, drive the second driving block 26 to move horizontally, and drive the driving telescopic rod 27 to rotate and extend.

[0041] The driving unit respectively drives the first driving block 25 to move longitudinally, the second driving block 26 to move horizontally, and the driving telescopic rod 27 to rotate according to the position of the chip 12, so that the inner side of the rectangular injection tube 22 is aligned with the chip 12. Then, the driving telescopic rod 27 extends to make the inner side of the rectangular injection tube 22 engage with the chip 12, and during the process, the lower end of the rectangular injection tube 22 does not squeeze the upper end of the chip 12.

[0042] As a further solution of the present invention, a liquid pump is externally connected to the material storage mechanism, and the liquid pump is used to pump and discharge insulating glue.

[0043] After the insulating glue at the gap is filled into the gap under the action of air pressure, start the liquid pump, so that the insulating glue accumulated outside the gap at the injection port 23 is sucked into the material storage mechanism by the liquid pump through the rectangular injection pipe 22. During this process, due to the small gap between the substrate 11 and the chip 12 and the absence of gas in the gap, the insulating glue in the gap will not be sucked out. The insulating glue between the inner wall of the rectangular injection pipe 22 and the side wall of the chip 12 will be sucked into the rectangular injection pipe 22, and the insulating glue between the lower end of the rectangular injection pipe 22 and the upper end of the substrate 11 will be sucked into the rectangular injection pipe 22.

[0044] The present invention forms two channels between the inner wall of the rectangular injection pipe 22 and the side wall of the chip 12 and between the lower end of the rectangular injection pipe 22 and the upper end of the substrate 11, so that when the liquid pump sucks, its suction force can be concentrated, and then the insulating glue outside the gap is sucked into the rectangular injection pipe 22 to complete the cleaning of the insulating glue, thereby ensuring the production quality of the product.

[0045] As a further solution of the present invention, the material storage mechanism includes a first material storage box 41, a second material storage box 42 is sleeved outside the first material storage box 41, both the first material storage box 41 and the second material storage box 42 are fixedly connected to the upper end of the rectangular injection pipe 22, a partition plate 43 is arranged in the rectangular injection pipe 22, and the partition plate 43 divides the rectangular injection pipe 22 into two independent inner and outer layers of pipelines. The upper ends of the two independent inner and outer layers of pipelines are respectively fixedly communicated with the lower ends of the first material storage box 41 and the second material storage box 42, and liquid pumps are externally connected to both the first material storage box 41 and the second material storage box 42.

[0046] The first material storage box 41 and the second material storage box 42 alternately inject and suck the insulating glue at the injection port 23 through the two independent inner and outer layers of pipelines. Further, when an independent pipeline and its corresponding material storage box inject the insulating glue in a vacuum environment, the other group of independent pipelines and its corresponding material storage box can discharge air bubbles in a vacuum environment (during the process of the injection port 23 sucking the insulating glue, since the vacuum box 14 is switched to the normal atmospheric environment, during this process, the insulating glue will be sucked into the material storage box together with a large amount of air, so that there are a large number of air bubbles in the insulating glue in the material storage box).

[0047] As a further solution of the present invention, a communicating pipe 61 is fixedly communicated with the upper end of the first material storage box 41, the upper end of the communicating pipe 61 penetrates through the upper end of the second material storage box 42, a through hole is vertically penetrated through the upper end of the second material storage box 42, and filter meshes 62 are fixedly connected to the inner walls of the upper end of the communicating pipe 61 and the inner wall of the through hole. The filter meshes 62 are used to block the insulating glue.

[0048] The first material storage box 41 and the second material storage box 42 are respectively communicated with the outside through the communicating pipe 61 and the through hole, so as to prevent the insulating glue from being sucked out from the rectangular injection pipe 22 when the equipment is evacuated.

[0049] As a further solution of the present invention, a sealing block 51 is fixedly connected to the inner side wall of the inner cavity of the rectangular injection tube 22. A driving rod 52 is drivingly connected to the lower end of the sealing block 51. A motor is embedded in the sealing block 51 for driving the driving rod 52 to perform vertical displacement. A baffle 53 is fixedly connected to the lower end of the driving rod 52.

[0050] The driving rod 52 drives the baffle 53 to perform vertical displacement, so that the baffle 53 switches between fitting the bottom of the inner cavity of the rectangular injection tube 22 at the lower end and fitting the lower end of the sealing block 51 at the upper end. In the above two positions, the baffle 53 can respectively block the outer independent pipe and the inner independent pipe divided by the partition plate 43 of the rectangular injection tube 22. Correspondingly, when the device is using a certain independent pipe to inject and suck materials at the injection port 23, the baffle 53 blocks the other independent pipe; preventing the cavity of the other independent pipe from interfering with the injection and suction material work.

[0051] A method for removing bubbles from semiconductor chip packaging is as follows:

[0052] S1. First, place the substrate 11 and the chip 12 that have completed thermocompression bonding welding in the fixed positions of the vacuum chamber 14.

[0053] S2. Then, close the vacuum chamber 14 and start the vacuum chamber 14, so that the substrate 11 and the chip 12 in the vacuum chamber 14 are in a vacuum environment.

[0054] S3. Next, inject a circle of insulating glue for blocking the gap through the filling mechanism at the gap between the substrate 11 and the chip 12.

[0055] S4. Finally, close the vacuum chamber 14 to restore the normal air pressure state in the vacuum chamber 14, so that the insulating glue at the gap between the substrate 11 and the chip 12 enters between the substrate 11 and the chip 12 under atmospheric pressure to complete the filling of the insulating glue.

[0056] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0057] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging degassing system, comprising a substrate (11), a chip (12) and a solder joint (13), characterized in that: It further includes a vacuum chamber (14), and the substrate (11), the chip (12) and the solder joint (13) are arranged in the vacuum chamber (14); A filling mechanism, the filling mechanism is arranged in the vacuum chamber (14), and the filling mechanism is used to inject a circle of insulating glue for blocking the gap between the substrate (11) and the chip (12) after evacuating the vacuum chamber (14); The filling mechanism includes a driving device, a rectangular injection tube (22) is arranged below the driving device, the driving device is used to drive the inner wall of the rectangular injection tube (22) to engage with the side wall of the chip (12), an injection port (23) is opened at the lower end of the inner wall of the rectangular injection tube (22), the injection port (23) is used to inject the insulating glue, a material storage mechanism is arranged at the upper end of the rectangular injection tube (22), and the material storage mechanism is used to inject the insulating glue into the rectangular injection tube (22) or suck the insulating glue out of the rectangular injection tube (22); The driving device includes a mounting plate (24), the upper end of the mounting plate (24) is fixedly connected to the upper end of the vacuum chamber (14), a first driving block (25) is longitudinally slidably connected to the lower end of the mounting plate (24), a second driving block (26) is horizontally slidably connected to the lower end of the first driving block (25), a driving telescopic rod (27) is rotatably connected to the lower end of the second driving block (26), the lower end of the driving telescopic rod (27) is fixedly connected to the upper end of the rectangular injection tube (22), and driving units are built in the first driving block (25), the second driving block (26) and the driving telescopic rod (27), and the driving units are respectively used to drive the first driving block (25) to move longitudinally, drive the second driving block (26) to move horizontally, and drive the driving telescopic rod (27) to rotate and extend; A liquid pump is externally connected to the material storage mechanism, and the liquid pump is used to pump and discharge the insulating glue; The material storage mechanism includes a first material storage tank (41), a second material storage tank (42) is sleeved outside the first material storage tank (41), both the first material storage tank (41) and the second material storage tank (42) are fixedly connected to the upper end of the rectangular injection tube (22), a partition plate (43) is arranged in the rectangular injection tube (22), and the partition plate (43) divides the rectangular injection tube (22) into two independent inner and outer pipelines. The upper ends of the two independent inner and outer pipelines are respectively fixedly communicated with the lower ends of the first material storage tank (41) and the second material storage tank (42), and liquid pumps are externally connected to both the first material storage tank (41) and the second material storage tank (42).

2. The semiconductor chip packaging defoaming system according to claim 1, wherein: The upper end of the first material storage tank (41) is fixedly communicated with a connecting pipe (61), the upper end of the connecting pipe (61) penetrates through the upper end of the second material storage tank (42), a through hole is vertically opened at the upper end of the second material storage tank (42), and filter nets (62) are fixedly connected to the inner walls of the upper end of the connecting pipe (61) and the inner wall of the through hole, and the filter nets (62) are used to block the insulating glue.

3. A semiconductor chip packaging degassing system according to claim 2, wherein: A sealing block (51) is fixedly connected to the inner side wall of the inner cavity of the rectangular injection tube (22). A driving rod (52) is drivingly connected to the lower end of the sealing block (51). A motor is embedded in the sealing block (51), and the motor is used to drive the driving rod (52) to perform vertical displacement. A baffle (53) is fixedly connected to the lower end of the driving rod (52).

4. A semiconductor chip package degassing method, applicable to any one of the semiconductor chip package degassing systems of claims 1-3, characterized in that; The method is as follows: S1. First, place the substrate (11) and the chip (12) that have completed thermocompression bonding welding in the fixed positions of the vacuum chamber (14). S2. Then, close the vacuum chamber (14) and start the vacuum chamber (14) so that the substrate (11) and the chip (12) in the vacuum chamber (14) are in a vacuum environment. S3. Next, inject a circle of insulating glue for sealing the gap through a filling mechanism at the gap between the substrate (11) and the chip (12). S4. Finally, close the vacuum chamber (14) to restore the normal air pressure state in the vacuum chamber (14), so that the insulating glue at the gap between the substrate (11) and the chip (12) enters between the substrate (11) and the chip (12) under atmospheric pressure, completing the filling of the insulating glue.

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