Cleaning device for silicon carbide wafer preparation

Abstract

The invention relates to the technical field of silicon carbide wafer cleaning, in particular to a cleaning device for silicon carbide wafer preparation. Comprising a workbench, a mechanical arm is installed on the workbench, a containing box is installed on the mechanical arm, two sets of elastic telescopic rods distributed in a linear array mode are fixedly connected into the containing box, the telescopic ends of the elastic telescopic rods are fixedly connected with a connecting frame, and a sliding groove is formed in the connecting frame; and a connecting rod is jointly and slidably connected into the sliding grooves distributed in the same group in the linear array mode, the connecting frame is fixedly connected with a first clamp, and the first clamp is slidably connected with a second clamp. The two sets of first clamps and the adjacent second clamps of the silicon carbide wafer are alternately loosened, a solution in the cleaning pool is guided to the clamping position of the silicon carbide wafer through movement of the containing box, the clamping position on the right side of the silicon carbide wafer is cleaned, and the situation that the clamping position of the silicon carbide wafer cannot be cleaned, so that pollutants are left on the silicon carbide wafer is prevented; therefore, the quality of the silicon carbide wafer is influenced.

Description

Technical Field

[0001] The invention relates to the technical field of silicon carbide wafer cleaning, and in particular to a cleaning device for preparing silicon carbide wafers. Background Art

[0002] The silicon carbide wafer cleaning process is an indispensable part of the semiconductor preparation process. After the silicon carbide wafer is cut and formed, impurities such as metal particles, colloids and lubricating oil will remain on the surface of the silicon carbide wafer. Therefore, the silicon carbide wafer needs to be cleaned multiple times in different forms. Generally, several silicon carbide wafers are fixed in a cleaning frame, and then the cleaning frame is placed in different cleaning tanks in turn to clean the silicon carbide wafers in the cleaning frame.

[0003] When cleaning existing silicon carbide wafers, since the silicon carbide wafers need to be fixed, the fixing parts of the silicon carbide wafers will be wrapped by clamping structures of different forms. This results in the clamping parts of the silicon carbide wafers being unable to directly contact the solution in the cleaning tank, resulting in insufficient cleaning force at the clamping parts of the silicon carbide wafers, causing contaminants to remain on them, which in turn affects the quality of the silicon carbide wafers. Summary of the invention

[0004] In order to overcome the shortcomings pointed out in the above background technology, the present invention provides a cleaning device for preparing silicon carbide wafers.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions: a cleaning device for preparing silicon carbide wafers, comprising a workbench, the workbench is provided with a cleaning pool and a water pool distributed in a linear array, the workbench is equipped with a mechanical arm, the mechanical arm is equipped with a holding box, two groups of elastic telescopic rods distributed in a linear array are fixedly connected in the holding box, the two groups of elastic telescopic rods are symmetrically distributed, the telescopic ends of the elastic telescopic rods are fixedly connected to a connecting frame, the connecting frame is provided with a slide groove, the slide grooves distributed in the same group of linear arrays are slidably connected with connecting rods, the connecting rods are slidably connected to the holding box, an elastic member is fixedly connected between the connecting rods and the holding box, a resistance plate is fixedly connected to one end of the connecting rod away from the holding box, a clamp 1 is fixedly connected to the side of the connecting frame away from the adjacent elastic telescopic rod, the clamp 1 is slidably connected to the clamp 2, and an elastic member is fixedly connected between the clamp 2 and the adjacent clamp 1.

[0006] As a further preferred solution, the containing box is fixedly connected with a linear array of symmetrically distributed guide frames, the number of the guide frames is the same as the number of the elastic telescopic rods, and the guide frames are located above the adjacent clamp one and the adjacent clamp two.

[0007] As a further preferred solution, the length of the slide groove is equal to the telescopic length of the telescopic end of the elastic telescopic rod, so as to ensure that the telescopic end of the elastic telescopic rod does not affect the resistance plate when telescoping.

[0008] As a further preferred solution, the second clamp is fixedly connected to a limiting block, the connecting rod is fixedly connected to a limiting frame, and the limiting block is extrusion-fitted with the adjacent limiting frame.

[0009] As a further preferred solution, it also includes symmetrically distributed extrusion plates, which are fixed to the lower side of the adjacent resistance plates, and symmetrically distributed extrusion blocks are fixed to the bottom of the water pool of the workbench, and the extrusion blocks are extrusion-matched with the adjacent extrusion plates.

[0010] As a further preferred solution, the retractable length of the retractable end of the elastic retractable rod is smaller than the minimum projection width of the adjacent extrusion plate on the workbench, so as to ensure that the retractable end of the elastic retractable rod is completely retracted after the extrusion plate moves.

[0011] As a further preferred solution, a card slot rack is fixedly connected in the containing box, and the card slot rack is provided with card slots distributed in a linear array, and the number of the card slots is half the number of the elastic telescopic rods.

[0012] As a further preferred embodiment, a float is also included, which is arranged in one of the cleaning pools on the workbench. A liquid inlet pipe is fixedly connected to the workbench near the cleaning pool. The liquid inlet pipe is connected to an external liquid inlet device. A regulating valve is installed on the liquid inlet pipe. The regulating valve and the float are driven by a rack and pinion.

[0013] As a further preferred scheme, the float is fixedly connected to a symmetrically distributed buoyancy plate, and a drainage port is arranged on the buoyancy plate. The cleaning pool where the float is located on the workbench is provided with symmetrically distributed holes, and the holes are connected with the cleaning pool where the float is located on the workbench, and the holes are sealed and cooperated with the adjacent buoyancy plate, and the holes are connected and cooperated with the drainage port of the adjacent buoyancy plate.

[0014] As a further preferred solution, the liquid inlet pipe is fixedly connected to a water flow housing fixedly connected to the workbench, and is used to guide the grease in the cleaning pool where the float ball on the workbench is located to the hole.

[0015] In summary, the present application includes at least one of the following beneficial technical effects: 1. The present invention alternately loosens two sets of clamps 1 and adjacent clamps 2 of the silicon carbide wafer, and uses the movement of the containing box to guide the solution in the cleaning pool to the clamping part of the silicon carbide wafer, so as to clean the clamping part of the silicon carbide wafer on the right side, thereby preventing the clamping part of the silicon carbide wafer from being unable to be cleaned and causing contaminants to remain thereon, thereby affecting the quality of the silicon carbide wafer; 2. By simultaneously loosening the two sets of clamps 1 and the adjacent clamp 2 of the silicon carbide wafer, the residual solution on the clamping part of the silicon carbide wafer is cleared to prevent the clamping part of the silicon carbide wafer from carrying the solution in one cleaning pool into different cleaning pools, thereby avoiding the mixing of solutions in different cleaning pools, resulting in faster replacement frequency of solutions in the cleaning pools, and thus increasing the cost of cleaning the silicon carbide wafer; 3. Inject the solution into the cleaning tank through the water flow shell, so that the solution pushes the upper grease to flow from left to right. The upper grease is discharged into the hole through the drain port, and the grease is discharged from the right cleaning tank to avoid the grease from affecting the cleaning of the silicon carbide wafer, thereby affecting the cleaning efficiency of the silicon carbide wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the containing box of the present invention; Figure 3 It is a three-dimensional structural cross-sectional view of the containing box of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the elastic telescopic rod of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the resistance plate of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the clamp 1 and the clamp 2 of the present invention; Figure 7 It is a three-dimensional structural cross-sectional view of the workbench of the present invention; Figure 8 It is a schematic diagram of the three-dimensional structure of the buoyancy board of the present invention; Fig. 9 It is a cross-sectional view of the three-dimensional structure of the buoyancy board of the present invention.

[0017] Among them, the drawings in the specification include the following figure marks: 1. workbench, 2. robotic arm, 3. holding box, 4. elastic telescopic rod, 5. connecting frame, 6. slide groove, 7. connecting rod, 8. resistance plate, 9. clamp one, 10. clamp two, 11. guide frame, 12. limit block, 13. limit frame, 14. extrusion plate, 15. extrusion block, 16. slot frame, 17. float, 18. liquid inlet pipe, 19. regulating valve, 20. buoyancy plate, 21. hole, 22. water flow shell. DETAILED DESCRIPTION

[0018] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below.

[0019] When cleaning existing silicon carbide wafers, since the silicon carbide wafers need to be fixed, the fixing parts of the silicon carbide wafers will be wrapped by clamping structures of different forms. This results in the clamping parts of the silicon carbide wafers being unable to directly contact the solution in the cleaning tank, resulting in insufficient cleaning force at the clamping parts of the silicon carbide wafers, causing contaminants to remain on them, which in turn affects the quality of the silicon carbide wafers.

[0020] Example 1: A cleaning device for preparing silicon carbide wafers, referring to Figure 1-Figure 6As shown, a workbench 1 is included, a control panel is installed on the left side of the workbench 1, and the workbench 1 is provided with a plurality of cleaning pools and a water pool distributed in a linear array. Only three cleaning pools are taken as an example in the figure. The cleaning pool on the right is used to clean grease on the silicon carbide wafer, the cleaning pool in the middle is used to clean metal particles on the silicon carbide wafer, and the cleaning pool on the left is used to clean colloid on the silicon carbide wafer. The workbench 1 is equipped with a mechanical arm 2 electrically connected to the control panel. The mechanical arm 2 is an existing structure and will not be described in detail here. The mechanical arm 2 can slide left and right along the workbench 1, and the mechanical arm 2 itself can move up and down. The robot arm 2 is equipped with a holding box 3 with a plurality of through holes, which is used to introduce the solution in the cleaning pool into the interior of the holding box 3. Two groups of elastic telescopic rods 4 distributed in a linear array are fixedly connected in the holding box 3. The two groups of elastic telescopic rods 4 are symmetrically distributed on the left and right. The telescopic ends of the elastic telescopic rods 4 are fixedly connected to a connecting frame 5. The connecting frame 5 is provided with a slide groove 6. The slide grooves 6 distributed in the same group of linear arrays are slidably connected with a connecting rod 7. The connecting rod 7 is slidably connected to the holding box 3. An elastic member is fixedly connected between the connecting rod 7 and the holding box 3, wherein the elastic member is a tension spring. A resistance plate 8 is fixedly connected to the position of the connecting rod 7 away from the holding box 3. The resistance plate A groove is provided at a position away from the containing box 3 to increase the resistance of the resistance plate 8 when it moves in the solution. A clamp 1 9 is fixedly connected to a position of the connecting frame 5 away from the adjacent elastic telescopic rod 4. The clamp 1 9 is slidably connected to the clamp 2 10. The upper sides of the clamp 1 9 and the adjacent clamp 2 10 are provided with guiding inclined surfaces to facilitate the insertion of the silicon carbide wafer. The opposing surfaces of the clamp 1 9 and the adjacent clamp 2 10 are both flexible surfaces, and the flexible surface of the clamp 1 9 and the flexible surface of the adjacent clamp 2 10 are both smooth surfaces to reduce the friction between the clamp 1 9 and the adjacent clamp 2 10 on the silicon carbide wafer. The clamp 2 10 consists of an approximately wedge-shaped It is composed of a slider and a sliding rod, the sliding rod of clamp 2 10 passes through the adjacent clamp 1 9, and an elastic member is fixedly connected between the sliding rod of clamp 2 10 and the adjacent clamp 1 9, wherein the elastic member is a compression spring, and the length of the slide groove 6 is equal to the telescopic length of the telescopic end of the elastic telescopic rod 4, which is used to prevent the telescopic end of the elastic telescopic rod 4 from affecting the resistance plate 8 during telescoping, that is, when clamp 1 9 and the adjacent clamp 2 10 move and squeeze the adjacent connecting frame 5 to move, the telescopic end of the elastic telescopic rod 4 contracts, but at this time the adjacent slide groove 6 of the connecting frame 5 moves along the adjacent connecting rod 7, so that the connecting rod 7 does not move, thereby avoiding the movement of the resistance plate 8.

[0021] Reference Figure 3 and Figure 7 As shown, the containing box 3 is fixedly connected with guide frames 11 in a linear array and symmetrically distributed on the left and right. All the symmetrical guide frames 11 are provided with guide grooves on the opposite sides for guiding the silicon carbide wafer into between the second clamp 10 and the adjacent clamp one 9. The number of the guide frames 11 is the same as that of the elastic telescopic rods 4. The guide frames 11 are located above the adjacent clamp one 9 and the adjacent clamp two 10.

[0022] Reference Figure 5 and Figure 6 As shown, the sliding rod of the clamp 2 10 is fixedly connected to the limit block 12, the shape of the limit block 12 is a truncated cone, and the diameter of the limit block 12 gradually decreases from front to back, the connecting rod 7 is fixedly connected to the limit frame 13, the limit frame 13 is provided with wedge-shaped limit parts distributed in a linear array, the number of the wedge-shaped limit parts is the same as the number of the limit blocks 12, the limit blocks 12 are squeezed and matched with the adjacent wedge-shaped limit parts on the adjacent limit frame 13, and when the limit frame 13 moves, all the wedge-shaped limit parts on it squeeze the limit blocks 12 distributed in the linear array on the same side to move, so that the clamp 2 10 distributed in the linear array on the same side moves synchronously.

[0023] When the operator needs to use the device to clean silicon carbide wafers, the operator places several silicon carbide wafers in the holding box 3 and hangs the holding box 3 on the robotic arm 2. When the silicon carbide wafers are placed in the holding box 3, the two left-right symmetrical guide frames 11 jointly guide an adjacent silicon carbide wafer. The operator manually inserts the silicon carbide wafer between the adjacent clamp 2 10 and the adjacent clamp 1 9. The silicon carbide wafer squeezes the adjacent clamp 2 10 to move forward, so that the elastic part of the clamp 2 10 is compressed, and the clamp 2 10 and the adjacent clamp 1 9 clamp the adjacent silicon carbide wafers, and the clamp 2 10 and the adjacent clamp 1 9 are squeezed by the silicon carbide wafer and move in the direction of the adjacent elastic telescopic rod 4. The connecting frame 5 moves and squeezes the telescopic end of the adjacent elastic telescopic rod 4 to move, and the connecting frame 5 drives the upper slide 6 to move to adapt to the clamping of silicon carbide wafers of different diameters.

[0024] When the silicon carbide wafer is clamped between the adjacent clamp 2 10 and the adjacent clamp 1 9, the operator controls the robot arm 2 to move left and right through the control panel, and the robot arm 2 drives the containing box 3 to move left and right and up and down, first placing the containing box 3 into a cleaning tank of the workbench 1, and then placing the containing box 3 into the water tank of the workbench 1, and then placing the containing box 3 into another cleaning tank of the workbench 1, and repeatedly placing the containing box 3 into different solutions to clean the grease, colloidal substances and metal particles on the silicon carbide wafer respectively.

[0025] In the process of cleaning the silicon carbide wafer, the operator drives the holding box 3 to move left and right through the robot arm 2, and the holding box 3 drives the silicon carbide wafer to move back and forth left and right through its internal parts. The following takes the movement of the holding box 3 to the left as an example. The holding box 3 drives the two resistance plates 8 to move to the left, and the resistance plate 8 on the left and the water flow are squeezed. The water flow drives the resistance plate 8 on the left to move to the right, and the resistance plate 8 on the left drives the adjacent connecting rod 7 to move to the right, so that the elastic part between the connecting rod 7 and the holding box 3 is gradually stretched, and the connecting rod 7 slides along the slide groove 6 distributed in the adjacent linear array. At the same time, the connecting rod 7 The adjacent limit frame 13 is driven to move to the right, and the limit frame 13 squeezes the limit block 12 distributed in the adjacent linear array, so that the limit block 12 moves forward, and the limit block 12 drives the adjacent clamp 2 10 to move forward, so that the clamp 2 10 on the right and the adjacent clamp 1 9 lose their clamping of the silicon carbide wafer, and then the connecting rod 7 contacts and drives the connecting frame 5 distributed in the linear array to move to the right through squeezing, the connecting frame 5 moves to the right and drives the telescopic end of the adjacent elastic telescopic rod 4 to move to the right, and the connecting frame 5 drives the adjacent clamp 2 10 and the adjacent clamp 1 9 to move to the right, so that the right side of the silicon carbide wafer loses clamping and blocking.

[0026] After the right side of the silicon carbide wafer loses its clamping and blocking, the containing box 3 moves to the left at the same time so that the solution in the cleaning tank flows from right to left through the containing box 3, cleaning the clamping part on the right side of the silicon carbide wafer, and at the same time flushing the clamp 2 10 and the adjacent clamp 1 9 on the right side to prevent the clamping part of the silicon carbide wafer from being unable to be cleaned and causing contaminants to remain thereon, thereby affecting the quality of the silicon carbide wafer. Then the containing box 3 moves to the right, and the elastic part of the left resistance plate 8 drives it to reset. The right resistance plate 8 is squeezed and moved by the water flow and the above steps are repeated to achieve the cleaning of the clamping part on the left side of the silicon carbide wafer.

[0027] When the operator repeats the above steps to clean the silicon carbide wafers, the operator controls the robot arm 2 to move and reset through the control panel and remove the containing box 3, then turns off the robot arm 2, and finally collects the silicon carbide wafers in the containing box 3 for next use.

[0028] Existing silicon carbide wafers need to be placed in several cleaning pools in sequence during cleaning. In order to prevent solutions in different cleaning pools from mixing with each other, each time the silicon carbide wafer is taken out of the cleaning pool, it is necessary to place the silicon carbide wafer in a water pool for rinsing. However, since the clamping part of the silicon carbide wafer is wrapped by the clamping structure, there will be residual solution at the clamping part of the silicon carbide wafer, causing the clamping part of the silicon carbide wafer to carry the solution in one cleaning pool into different cleaning pools, thereby causing the solutions in the cleaning pools to mix with each other, resulting in a faster frequency of replacing the solutions in the cleaning pools, thereby increasing the cost of cleaning the silicon carbide wafer.

[0029] Example 2: Based on Example 1, refer to Figure 3 , Figure 4 and Figure 7 As shown, it also includes a squeezing plate 14 that is symmetrically distributed on the left and right. The squeezing plate 14 is provided with through holes distributed in a linear array, so that water and solution can pass through the squeezing plate 14 into the containing box 3. The squeezing plate 14 is fixedly connected to the lower side of the adjacent resistance plate 8. The bottom of the pool of the workbench 1 is fixedly connected with squeezing blocks 15 that are symmetrically distributed on the left and right. The squeezing blocks 15 are wedge-shaped blocks. The squeezing blocks 15 are squeezed and matched with the adjacent squeezing plates 14. The retractable length of the retractable end of the elastic telescopic rod 4 is less than the projection width of the adjacent squeezing plate 14 on the workbench 1, which is used to ensure that after the squeezing plate 14 moves, the retractable end of the elastic telescopic rod 4 is completely retracted, thereby ensuring that the silicon carbide wafer loses clamping. A card slot rack 16 is fixedly connected to the containing box 3, and the card slot rack 16 is provided with card slots distributed in a linear array. The number of the card slots is half of the number of the elastic telescopic rods 4, so that the number of the card slots is consistent with the number of silicon carbide wafers, which is used to temporarily fix the silicon carbide wafers that have lost clamping.

[0030] After the silicon carbide wafers inside have undergone a cleaning step, the operator places the holding box 3 into the water pool of the workbench 1 through the robot arm 2 to rinse the cleaning solution adhered to the silicon carbide wafers. The robot arm 2 drives the holding box 3 to align with the water pool of the workbench 1 and move downward. The holding box 3 drives the two extrusion plates 14 thereon to move downward. After the extrusion plates 14 move to contact with the adjacent extrusion blocks 15, the extrusion plates 14 are squeezed by the adjacent extrusion blocks 15, so that the two extrusion plates 14 move toward each other. The extrusion plates 14 drive the adjacent resistance plates 8 to move, so that the two resistance plates 8 move toward each other. The resistance plates 8 drive the adjacent connecting rods 7 to move, and the elastic parts of the resistance plates 8 are gradually stretched. The connecting rods 7 move and repeat the above steps to drive the adjacent clamps 1 9 and the adjacent clamps 2 10 to gradually lose their contact with the carbon through the adjacent connecting frames 5. The silicon carbide wafer is clamped, and the connecting frame 5 drives the adjacent clamp 1 9 and the adjacent clamp 2 10 to move through the above steps, so that the two different groups of clamps 1 and adjacent clamps 2 at the left and right symmetric positions of the silicon carbide wafer gradually move back to back, and the silicon carbide wafer moves downward by its own gravity, and the silicon carbide wafer is gradually clamped into the adjacent card slots on the card slot frame 16, and the silicon carbide wafer is temporarily fixed, and the clamping parts of the adjacent clamps 1 9 and the adjacent clamps 2 10 on the silicon carbide wafer are cleaned to prevent the solution from penetrating into the clamping parts of the silicon carbide wafer, causing the silicon carbide wafer to carry the solution in a cleaning tank into different cleaning tanks, thereby avoiding the mixing of solutions in different cleaning tanks (causing contamination after the solutions are mixed and need to be replaced), thereby reducing the replacement frequency of the solutions in the cleaning tanks and reducing the cost of cleaning the silicon carbide wafers.

[0031] After the silicon carbide wafer is cleaned in the water tank, the robot arm 2 drives the containing box 3 to move upward, the extrusion block 15 gradually loses the extrusion on the adjacent extrusion plate 14, and the elastic part of the resistance plate 8 drives it to reset, the resistance plate 8 drives the adjacent extrusion plate 14 to reset, the resistance plate 8 drives the adjacent connecting rod 7 to reset, the telescopic end of the elastic telescopic rod 4 drives the adjacent connecting frame 5 to reset, the connecting frame 5 drives the adjacent clamp 1 9 and the adjacent clamp 2 10 to move and reset, the clamp 1 9 and the adjacent clamp 2 10 squeeze the silicon carbide wafer through their smooth surfaces to reset, so that the clamp 1 9 and the adjacent clamp 2 10 resume clamping the silicon carbide wafer.

[0032] Example 3: Based on Example 2, refer to Figure 2 and Figure 7-Figure 9 As shown, it also includes a float 17, which is arranged in the cleaning pool on the right side of the workbench 1. A liquid inlet pipe 18 is fixedly connected to the position of the workbench 1 near the cleaning pool on the right side. The liquid inlet pipe 18 is connected to an external liquid inlet device, and the external liquid inlet device is electrically connected to the control panel. When the device is working, the operator turns on the external liquid inlet device through the control panel to make the external liquid inlet device transport the solution into the liquid inlet pipe 18. After the device stops working, the operator turns off the external liquid inlet device through the control panel. A regulating valve 19 is installed on the liquid inlet pipe 18, and the regulating valve 19 and the float 17 are driven by a gear rack, wherein the regulating valve 19 is a ball valve. When the float 17 moves downward, the ball valve of the regulating valve 19 rotates to open.

[0033] Reference Figure 1 and Figure 7-Figure 9 As shown, the float 17 is fixedly connected to a buoyancy plate 20 which is symmetrically distributed front and back, and a drainage port is arranged on the buoyancy plate 20 at a position away from the float 17. Holes 21 which are symmetrically distributed front and back are arranged at the cleaning pool where the float 17 is located on the workbench 1. The uppermost side of the hole 21 is aligned with the lowermost side of the drainage port on the adjacent buoyancy plate 20. The sum of the weight of the float 17 and the weight of the buoyancy plate 20 is equal to the buoyancy of the solution in the cleaning pool on the right side of the workbench 1, and the density of the float 17 and the density of the buoyancy plate 20 are both less than the density of the solution in the cleaning pool on the right side of the workbench 1. The float 17 relies on its buoyancy with the buoyancy plate 20 to align the lowermost side of the drainage port of the buoyancy plate 20 with the lowermost side of the drainage port of the buoyancy plate 20. The liquid surface of the solution is flat, the density of the solution in the cleaning pool on the right side of the workbench 1 is greater than the density of grease. After grease floats on the upper surface of the solution in the cleaning pool on the right side, the float 17 sinks a part due to the density of the grease, and the hole 21 is connected with the cleaning pool where the float 17 on the workbench 1 is located. The hole 21 is sealed with the adjacent buoyancy plate 20, and the hole 21 is connected with the discharge port of the adjacent buoyancy plate 20. The liquid inlet pipe 18 is fixedly connected with a water flow shell 22 fixedly connected to the workbench 1. The water flow shell 22 disperses the water flow into the surface of the solution in the adjacent cleaning pool, so as to guide the grease in the cleaning pool where the float 17 on the workbench 1 is located to the hole 21.

[0034] When the operator needs to clean the grease on the silicon carbide wafer, the operator places the containing box 3 and the silicon carbide wafer into the cleaning pool on the right through the robot arm 2. The solution in the cleaning pool on the right is gradually reduced after use, so that the position of the float 17 will drop after each use. The float 17 drives the regulating valve 19 through the gear rack. The valve of the regulating valve 19 rotates and opens the circulation. The solution in the liquid inlet pipe 18 is injected into the cleaning pool on the right through the water flow shell 22. After the solution amount in the cleaning pool on the right returns to normal, the float 17 moves upward and resets due to the buoyancy. The float 17 drives the regulating valve 19 through the gear rack, so that the valve of the regulating valve 19 is closed.

[0035] When the amount of solution in the right cleaning pool returns to normal, if there is a large amount of grease floating in the cleaning pool, the buoyancy of the float 17 will change due to the grease, causing the buoyancy of the float 17 to decrease, and the float 17 moves downward and drives the symmetrically distributed buoyancy plates 20 to move downward. The buoyancy plates 20 drive the drain port to move downward, causing the hole 21 to be connected to the drain port. At the same time, the downward movement of the float 17 will pass through the valve of the rack and pinion transmission regulating valve 19. The regulating valve 19 opens and allows the solution in the liquid inlet pipe 18 to be injected into the cleaning pool on the right through the water flow shell 22. The solution flows from left to right, causing the upper layer of grease to be discharged into the hole 21 through the drain port, and the grease is discharged from the right cleaning pool to prevent the grease from affecting the cleaning of the silicon carbide wafer, thereby affecting the cleaning efficiency of the silicon carbide wafer.

[0036] In summary, the invention includes but is not limited to the above embodiments. Any equivalent substitution or partial improvement made under the spirit and principle of the invention shall be deemed to be within the protection scope of the invention.

Claims

1. A cleaning device for preparing silicon carbide wafers, comprising a workbench (1), the workbench (1) being provided with cleaning pools distributed in a linear array and a water pool, the workbench (1) being equipped with a robotic arm (2), the robotic arm (2) being equipped with a containing box (3), wherein: The invention also comprises two groups of elastic telescopic rods (4) distributed in a linear array, the two groups of elastic telescopic rods (4) distributed in a linear array are both fixedly connected in the containing box (3), the two groups of elastic telescopic rods (4) are symmetrically distributed, the telescopic ends of the elastic telescopic rods (4) are fixedly connected to connecting frames (5), the connecting frames (5) are provided with sliding grooves (6), the sliding grooves (6) distributed in the same group of linear arrays are slidably connected to connecting rods (7), the connecting rods (7) are slidably connected to the containing box (3), an elastic member is fixedly connected between the connecting rods (7) and the containing box (3), one end of the connecting rod (7) away from the containing box (3) is fixedly connected to a resistance plate (8), a side of the connecting frame (5) away from the adjacent elastic telescopic rod (4) is fixedly connected to a first clamp (9), the first clamp (9) is slidably connected to a second clamp (10), and an elastic member is fixedly connected between the second clamp (10) and the adjacent first clamp (9).

2. A cleaning device for preparing silicon carbide wafers according to claim 1, characterized in that: The containing box (3) is fixedly connected with guide frames (11) in a linear array and symmetrically distributed, the number of the guide frames (11) is the same as the number of the elastic telescopic rods (4), and the guide frames (11) are located above the adjacent clamp 1 (9) and the adjacent clamp 2 (10).

3. A cleaning device for preparing silicon carbide wafers according to claim 2, characterized in that: The length of the slide groove (6) is equal to the telescopic length of the telescopic end of the elastic telescopic rod (4), and is used to ensure that the telescopic end of the elastic telescopic rod (4) does not affect the resistance plate (8) when it is telescoping.

4. A cleaning device for preparing silicon carbide wafers according to claim 1, characterized in that: The second clamp (10) is fixedly connected to a limiting block (12), the connecting rod (7) is fixedly connected to a limiting frame (13), and the limiting block (12) is pressed and matched with an adjacent limiting frame (13).

5. A cleaning device for preparing silicon carbide wafers according to claim 1, characterized in that: It also includes symmetrically distributed extrusion plates (14), the extrusion plates (14) being fixedly connected to the lower side of the adjacent resistance plates (8), and the bottom of the pool of the workbench (1) being fixedly connected to symmetrically distributed extrusion blocks (15), the extrusion blocks (15) being extrusion-matched with the adjacent extrusion plates (14).

6. A cleaning device for preparing silicon carbide wafers according to claim 5, characterized in that: The retractable length of the retractable end of the elastic retractable rod (4) is smaller than the projection width of the adjacent extrusion plate (14) on the workbench (1), so as to ensure that the retractable end of the elastic retractable rod (4) is completely retracted after the extrusion plate (14) moves.

7. A cleaning device for preparing silicon carbide wafers according to claim 2, characterized in that: A card slot frame (16) is fixedly connected inside the containing box (3), and the card slot frame (16) is provided with card slots distributed in a linear array, the number of which is half the number of the elastic telescopic rods (4).

8. A cleaning device for preparing silicon carbide wafers according to claim 6, characterized in that: It also includes a float (17), the float (17) being arranged in one of the cleaning pools on the workbench (1), a liquid inlet pipe (18) being fixedly connected to a position of the workbench (1) close to the cleaning pool, the liquid inlet pipe (18) being connected to an external liquid inlet device, a regulating valve (19) being installed on the liquid inlet pipe (18), and a gear rack transmission being provided between the regulating valve (19) and the float (17).

9. A cleaning device for preparing a silicon carbide wafer according to claim 8, characterized in that: The float (17) is fixedly connected to symmetrically distributed buoyancy plates (20), and a drainage port is provided on the buoyancy plates (20). A cleaning pool on the workbench (1) where the float (17) is located is provided with symmetrically distributed holes (21), and the holes (21) are connected to the cleaning pool where the float (17) is located on the workbench (1), and the holes (21) are blocked and matched with the adjacent buoyancy plates (20), and the holes (21) are connected and matched with the drainage port of the adjacent buoyancy plates (20).

10. A cleaning device for preparing silicon carbide wafers according to claim 9, characterized in that: The liquid inlet pipe (18) is fixedly connected to a water flow housing (22) fixedly connected to the workbench (1), and is used to guide the grease in the cleaning pool where the float (17) on the workbench (1) is located to the hole (21).

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