A dual-channel heat dissipation device for 3D multi-core chips based on TSV adapter flip-chip bonding

Abstract

The present invention discloses a dual-channel heat dissipation device for 3D multi-core chips based on TSV adapter board flip-chip welding, comprising a manifold microchannel module, a multi-chip assembly, thermal conductive adhesive and a shell; the manifold microchannel module comprises an upper cover plate, a manifold substrate and a microchannel plate from top to bottom; the multi-chip assembly adopts flip-chip welding packaging, comprising a multi-core chip with multiple hot spots, a TSV adapter board and a uniform heat source chip; the present invention adopts a manifold microchannel module with a hybrid structure, which can reduce the flow path and pump work, effectively cool the multi-core chip with multiple hot spots, and at the same time directly etches the microchannel on the TSV adapter board to reduce the contact thermal resistance, realize "embedded" cooling, and greatly improve the heat dissipation efficiency of the vertically interconnected chips. The dual heat dissipation channels solve the problem of heat dissipation difficulty of 3D multi-core chips based on TSV adapter board flip-chip welding packaging.

Description

Technical Field

[0001] The present invention relates to the field of server chip heat dissipation, and in particular to a dual-channel heat dissipation device for 3D multi-core chips based on TSV adapter plate flip-chip bonding. Background Art

[0002] With the advancement of integrated circuit technology, chip manufacturing, and packaging, heterogeneous chip integration has become increasingly widespread. Heterogeneous integration can be applied at the chip level (single chip with multiple cores), in multi-chip modules, or in vertically stacked 3D integrated circuits. It effectively improves space utilization, shortens the distance between wafers, and reduces signal latency within the chip. As the size of electronic devices continues to decrease and their performance continues to improve, heterogeneous integration also presents challenges such as high power consumption and high heat flux.

[0003] Considering the thermal management requirements of heterogeneous integrated chips, it is necessary to develop a heat dissipation solution that is highly stable, efficient, low-energy, and takes up little space. As one of the most promising cooling technologies for electronic devices, microchannel heat dissipation technology has the advantages of good manufacturing process compatibility, good cooling performance, low energy consumption, compact structure, and stable operation. It is widely used in high-performance micro-chip heat dissipation. However, traditional microchannel heat sinks use indirect cooling, which increases the heat transfer path and overall thermal resistance of the heat sink through thermal interface materials attached to the chip surface. At the same time, it is not easy to achieve the development of 3D multi-chip integration and miniaturization. In addition, for high-performance multi-core chips, the heat flux in the hotspot area (core area) of the chip can be 8 times higher than that in the background area. The single uniform heat source condition used by traditional microchannel heat sinks not only results in insufficient heat dissipation in the hotspot area and overcooling in the background area, but also consumes more pump power. The large temperature gradient caused by the difference in heat flux between the hotspot area and the background area will reduce the overall performance and life of the chip. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings and deficiencies of the prior art, an object of the present invention is to provide a dual-channel heat dissipation device for 3D multi-core chips based on TSV adapter plate flip-chip bonding.

[0005] The purpose of the present invention is achieved through the following technical solutions:

[0006] A 3D multi-core chip dual-channel heat dissipation device based on TSV adapter plate flip-chip bonding, including a stacked manifold microchannel module, thermal conductive adhesive, a multi-chip assembly and a housing;

[0007] The manifold microchannel module comprises, from top to bottom, an upper cover plate, a manifold substrate, and a microchannel plate, for effectively cooling a multi-core chip having multiple hot spots;

[0008] The multi-chip assembly adopts flip-chip packaging, including a multi-core chip, a TSV adapter plate and a uniform heat source chip, and is used to cool the 3D interconnected chip. The 3D interconnected chip is a multi-core chip and a uniform heat source chip that are vertically interconnected through the TSV adapter plate.

[0009] further,

[0010] The upper cover plate includes a liquid inlet, a liquid inlet flow channel, a liquid outlet flow channel and a liquid outlet, the liquid inlet is connected to the liquid inlet flow channel, and the liquid outlet is connected to the liquid outlet flow channel;

[0011] The manifold substrate includes a manifold inlet flow channel, a manifold inlet, a manifold outlet, and a manifold outlet flow channel. The manifold inlet flow channel includes two parallel flow channels arranged on both sides of the manifold substrate. The area between the two manifold inlet flow channels includes a plurality of parallel and spaced manifold inlets and manifold outlets. A manifold outlet flow channel is provided in the middle of the manifold outlet and is interconnected.

[0012] The microchannel plate includes a pin fin array, a smooth channel and a rib channel; the pin fin array and the smooth channel are evenly spaced along a first direction, and the channel composed of the pin fin array and the smooth channel and the rib channel are evenly spaced along a second direction.

[0013] Furthermore, the pin-fin array is composed of staggeredly distributed rounded rectangular cylinders, the smooth channel is located on both sides of the pin-fin array, and the rib channel is composed of a rectangular rib array.

[0014] Furthermore, the upper cover plate, manifold substrate and microchannel plate are stacked to form an integral body, one end of the two parallel manifold inlet flow channels on the manifold substrate is connected to the liquid inlet flow channel of the upper cover plate; the manifold outlet flow channel on the manifold substrate is connected to the liquid outlet flow channel of the upper cover plate; the pin-fin array is located below the manifold inlet, and the rib channel is located directly below the manifold outlet.

[0015] Furthermore, the multi-core chip includes a plurality of hotspot areas, background areas and metal bumps;

[0016] The TSV adapter plate includes an adapter plate liquid inlet, a liquid separation area, a microchannel, a liquid collection area, an adapter plate liquid outlet, a through silicon via (TSV) and a solder ball;

[0017] The uniform heat source chip includes metal bumps; the multi-core chip and the uniform heat source chip are welded to the TSV adapter plate through the metal bumps, and then vertical interconnection of the 3D chips is achieved through the through silicon vias (TSVs) on the TSV adapter plate.

[0018] Furthermore, a baffle is provided in the middle of the manifold inlet so that the two ends of the manifold inlet are not connected to each other.

[0019] Furthermore, the shape of the liquid outlet flow channel gradually expands along the fluid flow direction.

[0020] Furthermore, the inner side of the bottom of the shell is welded to the solder ball, and the top of the shell is bonded or welded to the thermal conductive adhesive for packaging.

[0021] Furthermore, it also includes a pipe joint, which includes an inlet pipe joint and an outlet pipe joint; the inlet pipe joint includes a horizontal liquid inlet connected to the liquid inlet of the upper cover plate and a vertical liquid inlet connected to the liquid inlet of the TSV adapter plate; the outlet pipe joint includes a horizontal liquid outlet connected to the liquid outlet of the upper cover plate and a vertical liquid outlet connected to the liquid outlet of the TSV adapter plate.

[0022] Furthermore, the pin-fin array is located directly above the hotspot area; and the rib channel is located above the background area.

[0023] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0024] (1) The present invention adopts a dual-channel heat dissipation device, which can further improve the cooling efficiency compared with the conventional single-channel heat dissipation device and can effectively solve the heat dissipation problem of multiple chips in flip-chip packaging.

[0025] (2) The present invention adopts a manifold microchannel structure. The manifold structure has two inlet flow channels and a baffle is provided in the middle of the manifold inlet, which not only effectively shortens the flow path of the cooling medium, but also has the advantages of jet impact; the microchannel is composed of a mixture of a pin fin array and a rib plate. The staggered rounded rectangular pin fin array has better cooling performance than the rectangular rib plate channel, which is used to efficiently cool the hot spots of the multi-core chip and improve the temperature uniformity of the heat source surface of the multi-core chip.

[0026] (3) The present invention can adapt to the heat flux density of the corresponding hot spot area by changing the density and size of the pin-fin array, thereby meeting the heat dissipation requirements of multi-core chips with different heat flux densities in different hot spot areas.

[0027] (4) The present invention etches microchannels directly on the TSV silicon-based adapter plate, eliminating the need for thermal interface materials and achieving the advantages of embedded cooling. This effectively reduces contact thermal resistance, conduction thermal resistance, and pump work, thereby improving the heat dissipation of flip-chip chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the structure explosion of a 3D multi-core chip dual-channel heat dissipation device based on TSV adapter flip-chip bonding;

[0029] Figure 2 This is a schematic structural diagram of a cross-section of the upper cover plate of the present invention;

[0030] Figures 3(a) and 3(b) are schematic diagrams of the structure of the manifold substrate of the present invention;

[0031] Figure 4 1 is a schematic structural diagram of a microchannel plate of the present invention;

[0032] Figure 5 is a schematic structural diagram of a cross-section of a multi-chip module of the present invention;

[0033] Figure 6 This is a flow path diagram of a dual-channel heat sink for a 3D multi-core chip based on TSV adapter flip-chip bonding. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below with reference to the examples, but the embodiments of the present invention are not limited thereto.

[0035] Example

[0036] like Figure 1 As shown, a 3D multi-core chip dual-channel heat dissipation device based on TSV adapter flip-chip bonding includes a manifold microchannel module 1, thermal conductive adhesive 2, a multi-chip assembly 3, a housing 4 and a pipe joint 5; the manifold microchannel module 1 includes an upper cover plate 11, a manifold substrate 12 and a microchannel plate 13 from top to bottom.

[0037] like Figure 2 As shown, the upper cover plate 11 includes a liquid inlet 111, a liquid inlet channel 112, a liquid outlet channel 113 and a liquid outlet 114; the liquid inlet channel 112 extends along the first direction shown in the diagram of the cover plate 11; the shape of the liquid outlet channel 113 gradually expands along the direction of fluid flow.

[0038] In this embodiment, the first direction is along the width direction of the upper cover plate, and the second direction is along the length direction of the manifold substrate.

[0039] As shown in Figures 3(a) and 3(b), the manifold substrate 12 includes a manifold inlet channel 121, a manifold inlet 122, a manifold outlet 123 and a manifold outlet channel 124; the manifold inlet channel 121 and the manifold outlet channel 124 pass through the manifold substrate 12, while the manifold inlet 122 and the manifold outlet 123 do not pass through the manifold substrate 12; the manifold inlet channel 121 includes two parallel channels arranged along the second direction of the manifold substrate 12, and the area between the two manifold inlet channels 121 includes a plurality of parallel and spaced manifold inlets 122 and manifold outlets 123; both ends of the manifold inlet 122 are connected to the manifold inlet channel 121, and a baffle 1221 is provided in the middle to ensure that the manifold inlets 122 at both ends are not connected to each other; a manifold outlet channel 124 is provided in the middle of the manifold outlet 123 and is connected.

[0040] In this embodiment, five manifold outlets are provided between the two parallel flow channels, and the manifold outlets on both sides are smaller in size. Manifold inlets are provided between adjacent manifold outlets. In this embodiment, there are four manifold inlets.

[0041] The manifold inlet and manifold outlet are rectangular.

[0042] like Figure 4 As shown, the microchannel plate 13 includes a pin-fin array 131, smooth channels 132, and ribbed channels 133. The pin-fin array 131 and smooth channels 132 are evenly spaced along a first direction, while the channels formed by the pin-fin array 131 and smooth channels 132 and the ribbed channels 133 are evenly spaced along a second direction. The pin-fin array 131, consisting of staggered rounded rectangular cylinders, is located directly above the hotspot area 311. The smooth channels 132 are located on either side of the pin-fin array 131. The ribbed channels 133, consisting of an array of rectangular ribs, are located above the background area 312.

[0043] The upper cover plate 11, the manifold substrate 12 and the microchannel plate 13 are bonded or welded to each other into one body; when the three plates are stacked to form a whole, one end of the two parallel manifold inlet flow channels 121 on the manifold substrate 12 is connected to the liquid inlet flow channel 112 of the upper cover plate 11; the manifold outlet flow channel 124 on the manifold substrate 12 is connected to the liquid outlet flow channel 113 of the upper cover plate 11; the pin fin array 131 of the microchannel plate 13 is located below the manifold inlet 122 of the manifold substrate 12, and the rib channel 133 of the microchannel plate 13 is located directly below the manifold outlet 123 of the manifold substrate 12.

[0044] like Figure 1 and Figure 5 As shown, the multi-chip assembly 3 adopts flip-chip packaging, including a multi-core chip 31, a TSV adapter board 32 and a uniform heat source chip 33; the multi-core chip 31 includes multiple hot spots 311, a background area 312 and metal bumps (small balls) 313; the TSV adapter board 32 includes a liquid inlet 321, a liquid separation area 322, a microchannel 323, a liquid collection area 324, a liquid outlet 325, a through-silicon via TSV 326 and a solder ball (large ball) 327; the uniform heat source chip 33 includes a metal bump 331; the multi-core chip 31 and the uniform heat source chip 33 are respectively welded to the TSV adapter board 32 through the metal bumps 313 and 331, and the vertical interconnection of the 3D chip is realized through the through-silicon via TSV 326 on the TSV adapter board 32.

[0045] The thermal conductive adhesive 2 includes mounting positioning holes 21 and 22 and is placed between the microchannel plate 13 and the multi-core chip 31 to bond them together and reduce the thermal resistance of the two.

[0046] The inner side of the bottom of the housing 4 is welded to the solder balls 327 on the bottom of the TSV adapter plate 32 , and the top is bonded or welded to the thermal conductive adhesive 2 for packaging.

[0047] The pipe joint 5 includes an inlet pipe joint 51 and an outlet pipe joint 52; the inlet pipe joint 51 includes a horizontal liquid inlet 511 connected to the liquid inlet 111 and a vertical liquid inlet 512 connected to the liquid inlet 321; the outlet pipe joint 52 includes a horizontal liquid outlet 521 connected to the liquid outlet 114 and a vertical liquid outlet 522 connected to the liquid outlet 325.

[0048] like Figure 6 As shown, the working process of this embodiment is:

[0049] The cooling medium flowing in from the inlet pipe joint 51 flows along two paths. A part of the cooling medium does not change the flow direction and enters the manifold microchannel module 1. It flows from the horizontal liquid inlet 511 to the liquid inlet 111 of the upper cover plate 11 and then flows into the two inlet flow channels 121 of the manifold substrate 12 through the liquid inlet flow channel 112. After reaching the multiple manifold inlets 122, they move towards each other but do not meet each other. After colliding with the baffle 1221, they rush into the pin fin array 131 to cool the multiple hot spots 311 of the multi-core chip 31. Then, the coolant relies on the diversion effect of the smooth channel 132 to evenly flow through the rib channel 133 to cool the background area 312 of the multi-core chip 31. After the heat absorption is completed, the cooling The cooling medium passes through the manifold outlet 123, the manifold outlet channel 124, the outlet channel 113 and the outlet 114 of the upper cover plate 11, and reaches the horizontal liquid outlet 521, and flows out from the outlet pipe joint 52; another part of the cooling medium changes its flow direction, flows downward from the vertical liquid inlet 512 on the inlet pipe joint 51, enters the heat dissipation channel of the TSV adapter plate 32, and flows in from the liquid inlet 321. Under the buffering effect of the liquid separation area 322, the cooling medium flows evenly through the microchannel 323 and then merges into the liquid collecting area 324, flows from the liquid outlet 325 to the vertical liquid outlet 522 of the outlet pipe joint 52, and merges with the cooling medium flowing out of the horizontal liquid outlet 521 to flow into the external circulation heat exchange circuit.

[0050] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be considered as equivalent replacement methods and are included in the scope of protection of the present invention.

Claims

1. A dual-channel heat dissipation device for 3D multi-core chips based on TSV adapter flip-chip bonding, characterized in that: It includes a stacked manifold microchannel module, a thermal conductive adhesive, a multi-chip assembly and a housing; The manifold microchannel module comprises, from top to bottom, an upper cover plate, a manifold substrate, and a microchannel plate, for effectively cooling a multi-core chip having multiple hot spots; The multi-chip assembly adopts flip-chip packaging, including a multi-core chip, a TSV adapter plate and a uniform heat source chip, and is used to cool the 3D interconnected chip. The 3D interconnected chip is a multi-core chip and a uniform heat source chip that are vertically interconnected through the TSV adapter plate; The upper cover plate includes a liquid inlet, a liquid inlet flow channel, a liquid outlet flow channel and a liquid outlet, the liquid inlet is connected to the liquid inlet flow channel, and the liquid outlet is connected to the liquid outlet flow channel; The manifold substrate includes a manifold inlet flow channel, a manifold inlet, a manifold outlet, and a manifold outlet flow channel. The manifold inlet flow channel includes two parallel flow channels arranged on both sides of the manifold substrate. The area between the two manifold inlet flow channels includes a plurality of parallel and spaced manifold inlets and manifold outlets. A manifold outlet flow channel is provided in the middle of the manifold outlet and is interconnected. The microchannel plate includes a pin-fin array, a smooth channel and a rib channel; the pin-fin array and the smooth channel are evenly spaced along a first direction, and the channel composed of the pin-fin array and the smooth channel and the rib channel are evenly spaced along a second direction; The upper cover plate, the manifold substrate, and the microchannel plate are stacked to form an integral body; one end of the two parallel manifold inlet flow channels on the manifold substrate is connected to the liquid inlet flow channel of the upper cover plate; the manifold outlet flow channel on the manifold substrate is connected to the liquid outlet flow channel of the upper cover plate; the pin-fin array is located below the manifold inlet, and the rib channel is located directly below the manifold outlet; A baffle is provided in the middle of the manifold inlet so that the two ends of the manifold inlet are not connected to each other.

2. The dual-channel heat dissipation device for 3D multi-core chips according to claim 1, characterized in that: The pin-fin array is composed of staggeredly distributed rounded rectangular cylinders, the smooth channel is located on both sides of the pin-fin array, and the rib channel is composed of a rectangular rib array.

3. The dual-channel heat dissipation device for 3D multi-core chips according to any one of claims 1 to 2, characterized in that: The multi-core chip includes a plurality of hot spots, background areas and metal bumps; The TSV adapter plate includes an adapter plate liquid inlet, a liquid separation area, a microchannel, a liquid collection area, an adapter plate liquid outlet, a through silicon via (TSV) and a solder ball; The uniform heat source chip includes metal bumps; the multi-core chip and the uniform heat source chip are welded to the TSV adapter plate through the metal bumps, and then vertical interconnection of the 3D chips is achieved through the through silicon vias (TSVs) on the TSV adapter plate.

4. The dual-channel heat dissipation device for 3D multi-core chips according to claim 1, characterized in that: The shape of the liquid outlet flow channel gradually expands along the fluid flow direction.

5. The dual-channel heat dissipation device for 3D multi-core chips according to claim 3, characterized in that: The inner side of the bottom of the shell is welded with the solder ball, and the top of the shell is bonded or welded with heat conductive adhesive for packaging.

6. The dual-channel heat dissipation device for 3D multi-core chips according to claim 3, characterized in that: It also includes a pipe joint, which includes an inlet pipe joint and an outlet pipe joint; the inlet pipe joint includes a horizontal liquid inlet connected to the liquid inlet of the upper cover plate and a vertical liquid inlet connected to the liquid inlet of the TSV adapter plate; the outlet pipe joint includes a horizontal liquid outlet connected to the liquid outlet of the upper cover plate and a vertical liquid outlet connected to the liquid outlet of the TSV adapter plate.

7. The dual-channel heat dissipation device for 3D multi-core chips according to claim 3, characterized in that: The pin-fin array is located directly above the hotspot area; the rib channel is located above the background area.

Images