Method for manufacturing heat exchanger, heat exchanger, power storage device, and power storage device pack

Abstract

A heat exchanger manufactured by a method for manufacturing a heat exchanger according to the present disclosure is provided with a specific first metal plate and second metal plate, and a curved metal plate disposed between the first metal plate and the second metal plate and formed by a third metal plate in a curved shape. The zigzag-shaped metal plate has a plurality of mountain portions joined to the first metal plate and a plurality of valley portions joined to the second metal plate. The third metal plate deforms more easily than the first metal plate and the second metal plate. The method comprises the steps of: manufacturing a laminated plate by laminating the first metal plate, the third metal plate, and the second metal plate in this order; joining the first metal plate and the third metal plate in a region of the laminated plate corresponding to the mountain portion; and joining the second metal plate and the third metal plate in a region of the laminated plate corresponding to the valley portion.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2023-107564, filed on June 29, 2023, the disclosure of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a method for manufacturing a heat exchanger, a heat exchanger, an electric storage device, and an electric storage device package. Background Art

[0003] Conventionally, a heat exchanger is used to cool or heat an object to be exchanged with heat (eg, a battery).

[0004] Japanese Patent Publication No. 2013-111640 discloses a method for manufacturing a heat exchanger. The manufacturing method disclosed in Japanese Patent Publication No. 2013-111640 includes a peripheral welding process, a decompression process, an internal welding process, and a bulging process. The peripheral welding process, the decompression process, the internal welding process, and the bulging process are performed in this order. According to the manufacturing method disclosed in Japanese Patent Publication No. 2013-111640, a heat exchanger can be obtained. Fig. 9 The heat exchanger 900 is shown. The heat exchanger 900 is a plate-shaped object.

[0005] In the peripheral welding process, the two plates 910 and 920 are overlapped and welded 930 is formed by laser on the entire periphery of the outer end surface. In the decompression process, the air remaining in the gap between the two plates 910 and 920 is sucked and discharged to the outside from the openings pre-set on the plate surfaces of the two plates 910 and 920 by a vacuum pump. In the internal welding process, the gap between the two plates 910 and 920 is decompressed and maintained, and the two plates 910 and 920 are welded 940 by laser on the plate surfaces of the two plates 910 and 920, which are divided into a bulging portion 901 and a non-bulging portion 902. In the bulging process, a fluid is pressed into the bulging portion 901 to cause it to bulge and deform.

[0006] In the heat exchanger 900 , as the fluid passes through the bulged portion 901 , heat exchange is performed between the fluid passing through the bulged portion 901 and the surrounding fluid outside the heat exchanger 900 .

[0007] like Fig. 9As shown, the heat exchanger 900 has a concave-convex shape on both main surfaces. When the heat exchange object is brought into direct contact with the main surface of the heat exchanger 900, the heat exchange object is likely to be in contact with only a portion of the main surface of the heat exchanger 900 (specifically, the plurality of bulges 901). Therefore, the heat exchange of the heat exchange object may not be carried out efficiently. In addition, when the heat exchange object is brought into indirect contact with the main surface of the heat exchanger 900 via a heat conductive material (such as a heat conductive slurry), in order to efficiently carry out the heat exchange of the heat exchange object, it is necessary to fill the concave-convex concave portions of the main surface of the heat exchanger 900 with a heat conductive material. In other words, the amount of heat conductive material used may increase. Therefore, a method for manufacturing a heat exchanger that can manufacture a heat exchanger with two flat main surfaces is sought. Summary of the invention

[0008] The present disclosure is made in view of the above circumstances. An embodiment of the present disclosure aims to provide a method for manufacturing a heat exchanger, a heat exchanger, a power storage device, and a power storage device package that can manufacture a heat exchanger having both main surfaces flat.

[0009] Means for solving the above-mentioned problems include the following embodiments.

[0010] <1> A method for manufacturing a heat exchanger according to a first aspect of the present disclosure is a method for manufacturing a heat exchanger. The heat exchanger comprises: a first metal plate having at least one first through hole; a second metal plate having at least one second through hole; and a zigzag metal plate disposed between the first metal plate and the second metal plate and formed by a third metal plate in a zigzag shape. The zigzag metal plate has a plurality of mountain portions joined to the first metal plate and a plurality of valley portions joined to the second metal plate. A first flow path communicating with the first through hole is formed between the first metal plate and the zigzag metal plate, and a second flow path communicating with the second through hole is formed between the second metal plate and the zigzag metal plate. The third metal plate is more easily deformed than the first metal plate and the second metal plate. The manufacturing method comprises the following steps: The first metal plate, the third metal plate and the second metal plate are stacked in this order to produce a stacked plate; Joining the first metal body and the third metal plate in a region of the laminated plate corresponding to the mountain portion; and The second metal body and the third metal plate are joined to each other in a region of the laminated plate corresponding to the valley portion.

[0011] "Zigzag" means a shape that bends like the vines of an ivy (that is, wavy). The "flow path" refers to a space for circulating a heat exchange medium. “Easy to deform” means a property of being relatively low in rigidity and easily deformed under pressure.

[0012] In the first mode, when the fluid is pressed into the first through hole and the second through hole of the laminated plate, the portion of the third metal plate in the portion constituting the first flow path and the second flow path is selectively expanded to form the first flow path and the second flow path. At this time, the first metal plate and the second metal plate are respectively difficult to deform. In other words, the first metal plate and the second metal plate are easy to maintain the shape of the state before the fluid is pressed into the first through hole and the second through hole of the laminated plate. As a result, the manufacturing method of the heat exchanger of the first mode can manufacture a heat exchanger with two flat main surfaces. Furthermore, the zigzag metal plate that is difficult to deform is usually manufactured using a metal mold. The metal mold is expensive. As a result, the manufacturing method of the heat exchanger of the first aspect can manufacture the heat exchanger at a low cost.

[0013] <2> According to the <1> The method for manufacturing a heat exchanger described in the foregoing, the method for manufacturing a heat exchanger according to the second aspect of the present disclosure further comprises the following steps: The third metal plate is expanded by pressurizing a fluid into each of the first through hole and the second through hole.

[0014] In the second aspect, the first flow path is formed between the first metal plate and the zigzag metal plate, and the second flow path is formed between the second metal plate and the zigzag metal plate. As a result, the heat exchanger manufacturing method of the second aspect can manufacture a heat exchanger with both main surfaces being flat.

[0015] <3> According to the <1> or <2> In the method for manufacturing a heat exchanger according to the third aspect of the present disclosure, The zigzag metal plate does not have a third through hole connecting the first flow path and the second flow path. The plurality of peaks include a plurality of first peaks formed at first intervals along a first direction orthogonal to a thickness direction of the heat exchanger. The plurality of valley portions include a plurality of first valley portions formed at second intervals along the first direction.

[0016] In the third embodiment, the zigzag metal plate does not have a third through hole. That is, the first flow path is independent of the second flow path. When the fluid is pressed into the first through hole of the laminated plate, the distribution of the magnitude of the pressure applied to the first metal plate tends to become more uniform, compared to the case where the plurality of hills do not include a plurality of first hills formed by the first gap. When the fluid is pressed into the second through hole of the laminated plate, the distribution of the magnitude of the pressure applied to the second metal plate tends to become more uniform, compared to the case where the plurality of valleys do not include a plurality of first valleys formed by the second gap. As a result, the manufacturing method of the heat exchanger of the third embodiment can manufacture a heat exchanger with flatter two main surfaces.

[0017] <4> According to the <3> In the method for manufacturing a heat exchanger according to the fourth aspect of the present disclosure, The first mountain portion and the first valley portion extend along a second direction that is orthogonal to the first direction and the thickness direction of the heat exchanger, respectively. The first mountain portions and the first valley portions are alternately formed along the first direction.

[0018] Compared with the third embodiment, in the fourth embodiment, when the fluid is pressed into the first through hole of the laminated plate, the distribution of the magnitude of the pressure applied to the first metal plate tends to become more uniform. In addition, compared with the third embodiment, when the fluid is pressed into the second through hole of the laminated plate, the distribution of the magnitude of the pressure applied to the second metal plate tends to become more uniform. As a result, the manufacturing method of the heat exchanger of the fourth embodiment can manufacture a heat exchanger with flatter two main surfaces.

[0019] <5> According to the <1> To the <4> The method for manufacturing a heat exchanger according to any one of the above, in the method for manufacturing a heat exchanger according to the fifth aspect of the present disclosure, The first metal plate and the second metal plate each include 6000 series aluminum alloy. The third metal plate includes 1000 series aluminum.

[0020] “6000 series aluminum alloy” refers to an Al—Mg—Si series aluminum alloy specified in JIS. "1000 series aluminum" means pure aluminum specified in JIS.

[0021] The rigidity of 1000 series aluminum is lower than that of 6000 series aluminum alloy. That is, the third metal plate is more easily deformed than the first metal plate and the second metal plate. As a result, the fifth method for manufacturing a heat exchanger can manufacture a heat exchanger with flat main surfaces.

[0022] <6> According to the <1> To the <5> The method for manufacturing a heat exchanger according to any one of the above, in the method for manufacturing a heat exchanger according to the sixth aspect of the present disclosure, The thickness of each of the first metal plate and the second metal plate is greater than 1.00 mm. The thickness of the third metal plate is less than 1.00 mm.

[0023] The third metal plate has a lower rigidity than the first metal plate and the second metal plate. That is, the third metal plate is easier to deform than the first metal plate and the second metal plate. As a result, the sixth method for manufacturing a heat exchanger can manufacture a heat exchanger with flat main surfaces.

[0024] <7> According to the <1> To the <6> The method for manufacturing a heat exchanger according to any one of the above, in the method for manufacturing a heat exchanger according to the seventh aspect of the present disclosure, The zigzag metal plate further has at least one third through hole connecting the first flow path and the second flow path. The plurality of peaks include a plurality of first peaks formed at first intervals along a first direction orthogonal to a thickness direction of the heat exchanger. The plurality of valley portions include a plurality of first valley portions formed at second intervals along the first direction, The first interval is equal to the second interval.

[0025] In the seventh mode, the zigzag metal plate has a third through hole. That is, the first flow path is connected to the second flow path. The first interval is equal to the second interval. Thus, compared with the case where the first interval and the second interval are not equal, when the fluid is pressed into the first through hole and the second through hole of the laminated plate, the distribution of the magnitude of the pressure applied to the first metal plate and the second metal plate is easy to become uniform. As a result, the manufacturing method of the heat exchanger of the seventh mode can manufacture a heat exchanger with flatter two main surfaces.

[0026] <8> According to the <1> To the <7> The method for manufacturing a heat exchanger according to any one of the above, the method for manufacturing a heat exchanger according to the eighth aspect of the present disclosure further comprises the following steps: preparing a first brazing plate having a first solder layer formed on one main surface of the first metal plate for bonding the plurality of mountain portions to the first metal plate, and a second brazing plate having a second solder layer formed on one main surface of the second metal plate for bonding the plurality of valley portions to the second metal plate; Applying a first release agent to a region of the main surface of the first solder layer except for a region where the plurality of peaks are bonded to produce a first brazing sheet with a release agent; and A second brazing sheet with a release agent is produced by applying a second release agent to a region of the main surface of the second solder layer except for a region where the plurality of valleys are bonded, In the production of the laminated plate, the first brazing plate with a release agent, the third metal plate, and the second brazing plate with a release agent are stacked in such a manner that the first metal plate, the first solder layer, the third metal plate, the second solder layer, and the second metal plate are stacked in this order to produce the laminated plate. In joining the first metal plate and the third metal plate and joining the second metal plate and the third metal plate, the laminated plates are heated to braze the first metal plate and the third metal plate and to braze the second metal plate and the third metal plate.

[0027] In the eighth aspect, the first metal plate and the plurality of peaks are joined by brazing. The second metal plate and the plurality of valleys are joined by brazing. As a result, the eighth aspect of the heat exchanger manufacturing method can manufacture the heat exchanger simply compared to the case where the joining method is not brazing.

[0028] <9> A heat exchanger according to a ninth aspect of the present disclosure includes: A first metal plate having at least one first through hole; a second metal plate having at least one second through hole; and a zigzag metal plate disposed between the first metal plate and the second metal plate and formed by a third metal plate in a zigzag shape, The zigzag metal plate has a plurality of mountain portions joined to the first metal plate and a plurality of valley portions joined to the second metal plate. A first flow path communicating with the first through hole is formed between the first metal plate and the zigzag metal plate, and a second flow path communicating with the second through hole is formed between the second metal plate and the zigzag metal plate. The zigzag metal plate is more easily deformed than the first metal plate and the second metal plate.

[0029] In the ninth aspect, the zigzag metal plate is easier to deform than the first metal plate and the second metal plate. That is, the third metal plate is easier to deform than the first metal plate and the second metal plate. The heat exchanger of the ninth aspect is suitably manufactured by the manufacturing method of the heat exchanger of the first aspect. Therefore, the two main surfaces of the heat exchanger of the ninth aspect are flat. As a result, the heat exchanger of the ninth aspect can efficiently regulate the heat of the heat exchange object.

[0030] <10> According to the <9> In the heat exchanger of the tenth aspect of the present disclosure, The main surface of the first metal plate and the main surface of the second metal plate are each flat.

[0031] In the tenth aspect, the main surface of the first metal plate and the main surface of the second metal plate are respectively more likely to directly contact the heat exchange object than when the main surface of the first metal plate and the main surface of the second metal plate are respectively non-planar. As a result, the heat exchanger of the tenth aspect can more efficiently regulate the heat of the heat exchange object.

[0032] <11> According to the <9> In the heat exchanger described above, the thickness of the heat exchanger according to the eleventh aspect of the present disclosure is 10 mm or less.

[0033] The heat exchanger of the eleventh aspect is suitably used as a cooler for cooling a power storage module included in a power storage device of a twelfth aspect described later.

[0034] <12> A power storage device according to a twelfth aspect of the present disclosure includes: a plurality of stacked power storage modules; and The <9> to <11> A heat exchanger according to any one of the above, The plurality of power storage modules each include: an electrode stack including a plurality of electrodes stacked in a stacking direction of the power storage modules with a separator therebetween; an electrolyte contained in an internal space formed between adjacent electrodes; and a sealing body surrounding a side surface of the electrode stack in the stacking direction and sealing the internal space. The plurality of electrodes include a negative terminal electrode, a positive terminal electrode, and a plurality of bipolar electrodes stacked between the negative terminal electrode and the positive terminal electrode. The plurality of bipolar electrodes each include an electrode plate, a positive electrode disposed on a first surface of the electrode plate, and a negative electrode disposed on a second surface of the electrode plate. The electrode stack has electrode exposed portions exposed from the sealing body at one end and the other end in the stacking direction. The heat exchanger is disposed in contact with each other between the power storage modules adjacent to each other in the stacking direction and between the electrode exposed portions facing each other.

[0035] In the twelfth aspect, both main surfaces of the heat exchanger are flat. Therefore, the contact area between the electrode exposed portion and the heat exchanger is larger than when both main surfaces of the heat exchanger are not flat. As a result, the power storage device of the twelfth aspect can efficiently regulate the heat of the power storage module.

[0036] <13> A thirteenth aspect of the present disclosure is a power storage device pack including the above <12> A power storage device as described above, and a lower case for accommodating the power storage device.

[0037] The power storage device pack according to the thirteenth aspect can efficiently regulate heat of the power storage module.

[0038] According to the present disclosure, a method for manufacturing a heat exchanger capable of manufacturing a heat exchanger having both main surfaces flat, a heat exchanger, a power storage device, and a power storage device package are provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Exemplary embodiments of the present invention are described in detail based on the following drawings. Figure 1 It is a cross-sectional view of the heat exchanger according to the first embodiment of the present disclosure. Figure 2 yes Figure 1 A cross-sectional view of the heat exchanger along the C2-C2 line. Figure 3 yes Figure 1 A cross-sectional view of the heat exchanger along line C3-C3. Figure 4 It is a figure for demonstrating the manufacturing method of the heat exchanger which concerns on 1st Embodiment of this disclosure. Figure 5 It is a figure for demonstrating the manufacturing method of the heat exchanger which concerns on 1st Embodiment of this disclosure. Figure 6 It is a cross-sectional view of the power storage device pack according to the first embodiment of the present disclosure. Figure 7 It is a cross-sectional view of the power storage module in the first embodiment of the present disclosure. Figure 8 It is a cross-sectional view of a heat exchanger according to a second embodiment of the present disclosure. Fig. 9 This is a cross-sectional view of a conventional heat exchanger. DETAILED DESCRIPTION

[0040] In the present disclosure, the numerical range indicated by "to" means that the numerical values ​​recorded before and after "to" are respectively included in the range as the minimum and maximum values. In the numerical range recorded in stages in the present disclosure, the upper limit or lower limit recorded in a certain numerical range can be replaced by the upper limit or lower limit of the numerical range recorded in other stages. In the present disclosure, the combination of two or more preferred embodiments is a more preferred embodiment. In the present disclosure, the expression "process" is not only an independent process, but also is included in this expression as long as the desired purpose of the process can be achieved even if it cannot be clearly distinguished from other processes.

[0041] Hereinafter, embodiments of a method for manufacturing a heat exchanger, a heat exchanger, an electric storage device, and an electric storage device package disclosed herein will be described with reference to the accompanying drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

[0042] (1) First Embodiment The method for manufacturing a heat exchanger according to the first embodiment of the present disclosure is a method for manufacturing a heat exchanger 1A.

[0043] (1.1) Heat exchanger like Figure 1 and Figure 2 As shown, the heat exchanger 1A includes a first metal plate 11, a second metal plate 12, a zigzag metal plate 13A, and a first solder layer 14 (see Figure 2 )、Second solder layer 15 (refer to Figure 2 ). The first solder layer 14 is stacked on the main surface BS11 of the first metal plate 11. The second solder layer 15 is stacked on the main surface BS12 of the second metal plate 11. The zigzag metal plate 13A is arranged between the first metal plate 11 and the second metal plate 12. The zigzag metal plate 13A is brazed to the first metal plate 11 and the second metal plate 12 through the first solder layer 14 and the second solder layer 15. The heat exchanger 1A is a hexahedral object.

[0044] In the following, one side of the thickness direction of the heat exchanger 1A is defined as the positive direction of the Z axis, and the opposite side thereof is defined as the negative direction of the Z axis. One side of the direction in which one side of the main surface of the heat exchanger 1A extends is defined as the positive direction of the X axis (an example of the first direction), and the opposite side thereof is defined as the negative direction of the X axis. One side of the main surface of the heat exchanger 1A in the direction orthogonal to the X axis is defined as the positive direction of the Y axis (an example of the second direction), and the opposite side thereof is defined as the negative direction of the Y axis. The X axis, the Y axis, and the Z axis are orthogonal to each other. In addition, these directions do not limit the directions of the heat exchanger 1A when it is used.

[0045] The thickness L1 (the length L1 in the Z-axis direction) of the heat exchanger 1A (see Figure 2 ) is less than 10 mm. The thickness L1 can be 4 mm to 5 mm. The length L2 of the heat exchanger 1A in the X-axis direction and the length L3 of the heat exchanger 1A in the Y-axis direction can be, for example, 1000 mm to 2000 mm. The length L2 and the length L3 can be the same or different.

[0046] The heat exchanger 1A is suitably used as a cooler for cooling a power storage module of a power storage device pack described later.

[0047] (1.1.1) First metal plate The first metal plate 11 is a flat plate. The main surface TS11 (an example of the main surface) of the first metal plate 11 is flat. The first metal plate 11 has two first through holes TH1. The thickness L4 of the first metal plate 11 (see Figure 2 ) is greater than 1.00 mm. The thickness L4 can be 1.00 mm to 3.00 mm, or can be 1.6 mm. The first metal plate 11 includes a 6000 series aluminum alloy, or can be a 6000 series aluminum alloy. Examples of the 6000 series aluminum alloy include aluminum alloys with alloy numbers such as 6101, 6061, and 6082.

[0048] (1.1.2) Second metal plate The second metal plate 12 is a flat plate. The main surface TS12 (an example of the main surface) of the second metal plate 12 is flat. The second metal plate 12 has two second through holes TH2. The thickness L5 of the second metal plate 12 (see Figure 2 ) is 1.00 mm or more. The thickness L5 may be 1.00 mm to 3.00 mm, or may be 1.6 mm. The second metal plate 12 includes a 6000 series aluminum alloy, or may be a 6000 series aluminum alloy. The second metal plate 12 may be the same as the first metal plate 11 or may be different.

[0049] (1.1.3) Zigzag metal plate The zigzag metal plate 13A is formed by a third metal plate (not shown) in a zigzag shape. The third metal plate is a flat plate. The third metal plate and the zigzag metal plate 13A are respectively easier to deform than the first metal plate 11 and the second metal plate 12. Specifically, the third metal plate is less than 1.00 mm, and can be 0.6 mm to 0.1 mm, or can be 0.3 mm. The third metal plate contains 1000 series aluminum, or can be 1000 series aluminum. As 1000 series aluminum, pure aluminum with alloy numbers such as 1085, 1080, 1070, 1060, 1050, 1050A, etc. can be cited.

[0050] like Figure 2 As shown, the zigzag metal plate 13A has a plurality of mountain portions M13 joined to the first metal plate 11 via the first solder layer 14 , and a plurality of valley portions V13 joined to the second metal plate 12 via the second solder layer 15 .

[0051] The plurality of ridges M13 include a plurality of linear ridges M13A (an example of a first ridge) and a frame-shaped ridge M13B formed along the periphery of the first metal plate 11. The linear ridge M13A extends along the Y-axis direction. The plurality of linear ridges M13A are formed with a first interval L6 spaced apart along the X-axis direction. The frame-shaped ridge M13B surrounds the plurality of linear ridges M13A.

[0052] The plurality of valleys V13 include a plurality of linear valleys V13A (an example of the first valley) and a frame-shaped valley V13B formed along the periphery of the first metal plate 11. The linear valley V13A extends along the Y-axis direction. The plurality of linear valleys V13A are formed with a second interval L7 spaced apart along the X-axis direction. The frame-shaped valley V13B surrounds the plurality of linear valleys V13A. In the first embodiment, the second interval L7 is the same as the first interval L6.

[0053] The frame-shaped mountain portion M13B surrounds the frame-shaped valley portion V13B. In the X-axis direction and the Y-axis direction, a gap L8 is formed between the frame-shaped mountain portion M13B and the frame-shaped valley portion V13B (see Figure 3In the X-axis direction, a gap L8 is formed between the linear mountain portion M13A and the adjacent linear mountain portion M13A (see Figure 2 ). The length of the interval L8 is half the length of the first interval L6 and the length of the second interval L7.

[0054] A first flow path R1 communicating with the first through hole TH1 is formed between the first metal plate 11 and the zigzag metal plate 13A. A second flow path R2 communicating with the second through hole TH2 is formed between the second metal plate 12 and the zigzag metal plate 13A. In the first embodiment, a third through hole for communicating the first flow path R1 with the second flow path R2 is not formed on the zigzag metal plate 13A. The first flow path R1 is independent of the second flow path R2.

[0055] (1.1.4) First solder layer The material of the first solder layer 14 is not particularly limited as long as it can solder the plurality of peaks M13 of the zigzag metal plate 13A to the first metal plate 11 , and may be a known solder. The thickness of the first solder layer 14 may be, for example, 10% of the total thickness of the first metal plate 11 and the first solder layer 14 .

[0056] (1.1.5) Second solder layer The material of the second solder layer 15 is not particularly limited as long as it can solder the plurality of valleys V13 of the zigzag metal plate 13A to the second metal plate 12 , and may be a known solder. The thickness of the second solder layer 15 may be, for example, 10% of the total thickness of the second metal plate 12 and the second solder layer 15 .

[0057] (1.1.6) Action In the heat exchanger 1A, when the cooling medium is supplied to one of the two first through holes TH1, the cooling medium flows through the first flow path R1 and is discharged from the other of the two first through holes TH1. When the cooling medium is supplied to one of the two second through holes TH2, the cooling medium flows through the second flow path R2 and is discharged from the other of the two second through holes TH2. In this way, by circulating the cooling medium inside the heat exchanger 1A, the heat exchanger 1A can cool the heat exchange object that is in thermal contact with the main surface TS11 of the first metal plate 11 and the main surface TS12 of the second metal plate 12.

[0058] (1.2) Heat exchanger manufacturing method The manufacturing method of the heat exchanger of the first embodiment comprises a preparation step, a first release agent coating step, a second release agent coating step, a lamination step, a bonding step, and a press-in step. The order of performing the first release agent coating step and the second release agent coating step is not particularly limited as long as it is performed after the preparation step and before the lamination step. The lamination step, the bonding step, and the press-in step are performed in this order after the first release agent coating step and the second release agent coating step.

[0059] Hereinafter, the first metal plate 11 and the first solder layer 14 are collectively referred to as a “first brazing plate 110 .” Hereinafter, the second metal plate 12 and the second solder layer 15 are collectively referred to as a “second brazing plate 120 .”

[0060] (1.2.1) Preparation process In the preparation step, the first brazing plate 110 and the second brazing plate 120 are prepared. The method for preparing the first brazing plate 110 and the second brazing plate 120 is not particularly limited, and any known method may be used.

[0061] (1.2.2) First release agent coating step In the first release agent coating process, Figure 4 As shown, a first release agent is applied to a region RE1 of the main surface S14 of the first solder layer 14 of the first brazing plate 110 excluding a region RM13 to which the plurality of mountain portions M13 are bonded, thereby manufacturing a first brazing plate 1100 with a release agent.

[0062] The first brazing plate with a release agent 1100 includes a first brazing plate 110 and a first release agent coating layer 16. The region RM13 includes a region RM13A to which a plurality of linear peaks M13A are bonded and a region RM13B to which frame-shaped peaks M13B are bonded.

[0063] The method of applying the first release agent is not particularly limited, and examples thereof include the first application method, etc. In the first application method, the masking tape is attached only to the region RM13A of the first solder layer 14 where the plurality of mountain portions M13 are joined, the first release agent is applied to the region (i.e., region RE1) of the first solder layer 14 where the masking tape is not attached, and the masking tape is peeled off from the first solder layer 14. The material of the first release agent is not particularly limited as long as it is a material that prevents the first solder layer 14 from being brazed with the third metal plate, and may be a known release agent (e.g., boron nitride).

[0064] (1.2.3) Second release agent coating step In the second release agent coating process, Figure 5As shown, the second release agent is applied to the region RE2 of the main surface S15 of the second solder layer 15 excluding the region RV13 to which the plurality of valley portions V13 are bonded, thereby manufacturing a second brazing board 1200 with a release agent.

[0065] The second brazing plate 1200 with a release agent includes the second brazing plate 120 and the coating layer 17 of the second release agent. The region RV13 includes a region RV13A to which a plurality of linear valley portions V13A are bonded and a region RV13B to which a frame-shaped valley portion V13B is bonded.

[0066] The method of applying the second release agent is not particularly limited, and for example, a second coating method can be cited. In the second coating method, the masking tape is attached only to the area RV13A of the second solder layer 15 where the plurality of valleys V13 are joined, and the second release agent is applied to the area (i.e., area RE2) of the second solder layer 15 where the masking tape is not attached, and the masking tape is peeled off from the second solder layer 15. The material of the second release agent is not particularly limited as long as it is a material that prevents the second solder layer 15 from being brazed with the third metal plate, and it can be a known release agent. The second release agent can be the same as or different from the first release agent.

[0067] (1.2.4) Lamination process In the lamination process, the first brazing plate 1100 with a release agent, the third metal plate, and the second brazing plate 1200 with a release agent are laminated in such a manner that the first metal plate 11, the first solder layer 14, the third metal plate, the second solder layer 15, and the second metal plate 12 are laminated in this order to produce a laminated plate. The lamination method is not particularly limited as long as it is a well-known method. The size of the third metal plate may be the same as or different from that of the first metal plate 11 or the second metal plate 12.

[0068] (1.2.5) Joining process In the joining process, the laminate is heated to join the first metal plate 11 and the third metal plate, and the second metal plate 12 and the third metal plate are joined. Specifically, in the first embodiment, the first metal plate 11 and the third metal plate are brazed in the region RM13B where the coating layer 16 of the first release agent is not formed. The first metal plate 11 and the third metal plate are not brazed in the region RE1 where the coating layer 16 of the first release agent is formed. The second metal plate 12 and the third metal plate are brazed in the region RV13B where the coating layer 17 of the second release agent is not formed. The second metal plate 12 and the third metal plate are not brazed in the region RE2 where the coating layer 17 of the second release agent is formed. The heating method of the laminate is not particularly limited, as long as it is a known method.

[0069] (1.2.6) Pressing process In the press-in process, the fluid is pressed into the first through hole TH1 and the second through hole TH2 of the laminated plate to expand the third metal plate. The reason why the third metal plate is expanded by the fluid is that the third metal plate and the zigzag metal plate 13A are easily deformed compared with the first metal plate 11 and the second metal plate 12. After the press-in process, the first metal plate 11 and the second metal plate 12 are easy to maintain the shape of the state before the press-in process. By implementing the press-in process, the first flow path R1 and the second flow path R2 are formed. The fluid can be expanded as long as the third metal plate is expanded, and there is no particular limitation, and gas and liquid can be cited. The fluid can be a cooling medium. As a cooling medium, cooling liquid, cooling gas, etc. can be cited. As a cooling liquid, as long as it is a liquid commonly used for cooling, there is no particular limitation. As an example, water, oil, glycol aqueous solution, air conditioning refrigerant, non-conductive liquid, phase change liquid, etc. can be cited. As a cooling gas, air, nitrogen, etc. can be cited. The temperature of the cooling medium is appropriately adjusted according to the type of heat exchange object, etc. From the viewpoint of cleaning the first flow path R1 and the second flow path R2 after the injection step, the fluid is preferably a gas. The method of injecting the fluid is appropriately selected depending on the type of the fluid, etc., and any known method may be used.

[0070] (1.3) Power storage device package like Figure 6 As shown, the power storage device pack 20 according to the first embodiment of the present disclosure includes the power storage device 30 and a lower case 60 . The lower case 60 accommodates the power storage device 30 .

[0071] (1.3.1) Power storage device The power storage device pack 20 includes a power storage device 30 .

[0072] The power storage device 30 is used as a battery for various vehicles such as a forklift, a hybrid vehicle, and an electric vehicle. Figure 6 As shown, the power storage device 30 includes a module stack 31 and a restraining member 32. The restraining member 32 applies a restraining load to the module stack 31 in the stacking direction of the module stack 31.

[0073] The module stack 31 includes a plurality of stacked power storage modules 33 and a plurality of heat exchangers 1A. As an example, the power storage module 33 is a bipolar battery. The power storage module 33 is a secondary battery such as a nickel-hydrogen secondary battery or a lithium-ion secondary battery. The module stack 31 is rectangular when viewed from the stacking direction (ie, the Z direction).

[0074] The power storage modules 33 adjacent to each other in the stacking direction are electrically connected to each other via the heat exchanger 1A. The heat exchanger 1A is respectively arranged between the power storage modules 33 adjacent to each other in the stacking direction and outside the power storage module 33 located at the stacking end. The positive terminal 34 is connected to the heat exchanger 1A arranged on one side outside the power storage module 33 located at the stacking end. The negative terminal 35 is connected to the heat exchanger 1A arranged on the other side outside the power storage module 33 located at the stacking end. The positive terminal 34 and the negative terminal 35 are pulled out from the edge of the heat exchanger 1A in a direction intersecting the stacking direction, for example. The charging and discharging of the power storage device 30 is implemented through the positive terminal 34 and the negative terminal 35.

[0075] The heat exchanger 1A has a function as a connection member that electrically connects the power storage modules 33 to each other, and a function as a heat sink that dissipates heat generated in the power storage modules 33 .

[0076] The restraining member 32 includes a pair of end plates 36 sandwiching the module stack 31 in the stacking direction, and fastening bolts 37 and nuts 38 fastening the end plates 36 to each other. An electrically insulating film F is provided on the surface of the end plate 36 on the module stack 31 side. The film F electrically insulates the end plate 36 from the heat exchanger 1A.

[0077] (1.3.1.1) Storage module like Figure 7 As shown, the power storage module 33 includes an electrode stack 41 and a sealing body 42 made of resin that seals the electrode stack 41. The power storage module 33 is formed in a rectangular parallelepiped shape, for example.

[0078] The electrode stack 41 includes a plurality of electrodes stacked in a stacking direction with a separator 43 interposed therebetween and a current collector (metal plates 50A, 50B) located at the stacking end of the electrode stack 41. The plurality of electrodes include a negative terminal electrode 48, a positive terminal electrode 49, and a plurality of bipolar electrodes 44 stacked between the negative terminal electrode 48 and the positive terminal electrode 49. The stack of the plurality of bipolar electrodes 44 is disposed between the negative terminal electrode 48 and the positive terminal electrode 49.

[0079] The bipolar electrode 44 has a metal plate 45 as a current collector, a positive electrode 46, and a negative electrode 47. The metal plate 45 has a first surface 45a and a second surface 45b provided on the opposite side of the first surface 45a. The positive electrode 46 is provided on the first surface 45a. The negative electrode 47 is provided on the second surface 45b. The positive electrode 46 is a positive electrode active material layer formed by applying a positive electrode active material to the metal plate 45. The negative electrode 47 is a negative electrode active material layer formed by applying a negative electrode active material to the metal plate 45. In the electrode stack 41, the positive electrode 46 of one bipolar electrode 44 is opposite to the negative electrode 47 of another bipolar electrode 44 adjacent to one side in the stacking direction via the separator 43. In the electrode stack 41, the negative electrode 47 of one bipolar electrode 44 is opposite to the positive electrode 46 of another bipolar electrode 44 adjacent to the other side in the stacking direction via the separator 43.

[0080] The negative terminal electrode 48 includes a metal plate 45 and a negative electrode 47 provided on the second surface 45b of the metal plate 45. The negative terminal electrode 48 is arranged on one end side in the stacking direction so that the second surface 45b faces the center side in the stacking direction of the electrode stack 41. A metal plate 50A is further stacked on the first surface 45a of the metal plate 45 of the negative terminal electrode 48, and the metal plate 50A is electrically connected to the heat exchanger 1A on the side adjacent to the power storage module 33. The negative electrode 47 provided on the second surface 45b of the metal plate 45 of the negative terminal electrode 48 faces the positive electrode 46 of the bipolar electrode 44 at one end in the stacking direction via the separator 43.

[0081] The positive terminal electrode 49 includes a metal plate 45 and a positive electrode 46 provided on a first surface 45a of the metal plate 45. The positive terminal electrode 49 is arranged on the other end side in the stacking direction so that the first surface 45a faces the center side in the stacking direction of the electrode stack 41. A metal plate 50B is further stacked on the second surface 45b of the metal plate 45 of the positive terminal electrode 49, and the other heat exchanger 1A adjacent to the power storage module 33 is electrically connected via the metal plate 50B. The positive electrode 46 provided on the first surface 45a of the metal plate 45 of the positive terminal electrode 49 faces the negative electrode 47 of the bipolar electrode 44 at the other end in the stacking direction via the separator 43.

[0082] The material of the metal plate 45 is metal (e.g., Al, SUS, Ni, Cu, etc.). Each metal plate 45 is one of the metal plates included in the electrode stack 41. Examples of the positive electrode active material constituting the positive electrode 46 include oxide active materials. Examples of the oxide active material include LiCoO2, LiMnO2, LiNiO2, LiVO2, LiNi 1 / 3 Co 1 / 3 Mn 1 / 3 O2 and other rock salt layered active materials, LiMn2O4, Li(Ni 0.5Mn 1.5 )O4 and other spinel active materials, LiFePO4, LiMnPO4, LiNiPO4, LiCuPO4 and other olivine active materials. Examples of negative electrode active materials constituting negative electrode 47 include carbon active materials, oxide active materials and metal active materials. Electrode stack 41 includes a plurality of stacked metal plates 45, 50A, 50B.

[0083] The spacer 43 is a component for preventing the metal plates 45 from short-circuiting each other. The spacer 43 is, for example, a sheet. Examples of the spacer 43 include a porous film made of a polyolefin resin such as polyethylene (PE) or polypropylene (PP), a woven or non-woven fabric made of polypropylene, methylcellulose, etc. The spacer 43 may also be reinforced with a vinylidene fluoride resin compound. In addition, the spacer 43 is not limited to a sheet-shaped one, and a bag-shaped one may also be used.

[0084] The metal plates 50A and 50B are substantially the same components as the metal plate 45. The metal plates 50A and 50B are made of metal (e.g., Al, SUS, Ni, Cu, etc.). The metal plates 50A and 50B are both one of the metal plates included in the electrode stack 41. The metal plates 50A and 50B are formed as uncoated electrodes on which the positive electrode active material layer and the negative electrode active material layer are not coated on the first surface 50a and the second surface 50b. That is, the metal plates 50A and 50B are uncoated electrodes on which no active material layer is provided on both sides.

[0085] The negative terminal electrode 48 is arranged between the metal plate 50A and the bipolar electrode 44 along the stacking direction through the metal plate 50A. The second surface 50b of the metal plate 50A and the first surface 45a of the metal plate 45 of the negative terminal electrode 48 are electrically connected by direct contact without any component in between. The positive terminal electrode 49 is arranged between the metal plate 50B and the bipolar electrode 44 along the stacking direction through the metal plate 50B. The first surface 50a of the metal plate 50B and the second surface 45b of the metal plate 45 of the positive terminal electrode 49 are electrically connected by direct contact without any component in between.

[0086] In the electrode stack 41, the central region of the electrode stack 41 (the region where the active material layer is arranged in the bipolar electrode 44, the negative terminal electrode 48, and the positive terminal electrode 49) bulges in the stacking direction compared with the surrounding region. Therefore, the metal plates 50A and 50B are bent in the direction in which the central regions of the metal plates 50A and 50B are separated from each other.

[0087] The electrode stack 41 has an electrode exposed portion 50d exposed from the sealing body 42 at one end and the other end in the stacking direction (Z-axis direction). The electrode exposed portion 50d is composed of the central area of ​​the negative terminal electrode 48 and the positive terminal electrode 49 exposed from the sealing body 42. Between the storage battery modules 33 adjacent to each other in the stacking direction, the heat exchanger 1A is arranged in contact between the electrode exposed portions 50d facing each other.

[0088] The sealing body 42 is formed of, for example, an insulating resin in a generally rectangular cylindrical shape. The sealing body 42 is provided so as to surround the side surface 41a of the electrode stack 41. The sealing body 42 seals the internal space V provided in the electrode stack 41.

[0089] The sealing body 42 has a plurality of first sealing parts 51 (resin parts) and a second sealing part 52 in a frame shape. The first sealing parts 51 are respectively provided at the edges of the metal plates contained in the electrode stack 41 (i.e., the edge 45c of the metal plate 45 and the edge 50c of the metal plates 50A and 50B). The second sealing part 52 and the plurality of first sealing parts 51 (resin parts) in a frame shape surround the first sealing part 51 from the outside along the side surface 41a and are respectively combined with the first sealing part 51. The first sealing part 51 and the second sealing part 52 are, for example, insulating resins, and as constituent materials of the resin, for example, polypropylene (PP), polyphenylene sulfide (PPS), modified polyphenylene ether (modified PPE), etc. can be cited.

[0090] The first closed portion 51 is continuously provided on the entire circumference of the edge 45c of the metal plate 45 and the edge 50c of the metal plates 50A and 50B, and is in the shape of a rectangular frame when viewed from the stacking direction. The first closed portion 51 is airtightly joined to the metal plate 45, and the first closed portion 51 is airtightly joined to the metal plates 50A and 50B, respectively. When viewed from the stacking direction, the first closed portion 51 extends to the outside of the edge 45c of the metal plate 45 or the edge 50c of the metal plates 50A and 50B. The first closed portion 51 includes an outer portion 51a extending to the outside of the edge of the metal plate 45 or the metal plates 50A and 50B and an inner portion 51b located on the inside of the edge of the metal plate 45 or the metal plates 50A and 50B. A welded layer 53 is formed at the front end portion (outer edge portion) of the outer portion 51a of the first closed portion 51.

[0091] The plurality of first sealing portions 51 include a plurality of first sealing portions 51A provided on the bipolar electrode 44 and the positive terminal electrode 49 , a first sealing portion 51B provided on the negative terminal electrode 48 , a first sealing portion 51C provided on the metal plate 50A, and first sealing portions 51D and 51E provided on the metal plate 50B.

[0092] The first sealing portion 51A is bonded to the first surface 45a of the metal plate 45 of the bipolar electrode 44 and the positive terminal electrode 49. The inner portion 51b of the first sealing portion 51A is located between the edge portions 45c of the metal plates 45 adjacent to each other in the stacking direction. The region where the edge portion 45c of the first surface 45a of the metal plate 45 overlaps with the first sealing portion 51A becomes the bonding region between the metal plate 45 and the first sealing portion 51A.

[0093] In the present embodiment, the first sealing portion 51A is formed by a double-layer structure by folding a film in half. The outer edge of the first sealing portion 51A embedded in the second sealing portion 52 is the folded portion (bent portion) of the film. The first layer of film constituting the first sealing portion 51A is bonded to the first surface 45a. The inner edge of the second layer of film is located outside the inner edge of the first layer of film, forming a step portion for placing the spacer 43. The inner edge of the second layer of film is located inside the edge of the metal plate 45.

[0094] The first sealing portion 51B is bonded to the first surface 45a of the metal plate 45 of the negative terminal electrode 48. The inner portion 51b of the first sealing portion 51B is located between the edge 45c of the metal plate 45 of the negative terminal electrode 48 and the edge 50c of the metal plate 50A, which are adjacent to each other in the stacking direction. The region where the edge 45c of the first surface 45a of the metal plate 45 overlaps with the inner portion 51b of the first sealing portion 51B becomes the bonding region between the metal plate 45 and the first sealing portion 51B. The first sealing portion 51B is also bonded to the second surface 50b of the metal plate 50A. The region where the edge 50c of the second surface 50b of the metal plate 50A overlaps with the first sealing portion 51B becomes the bonding region between the metal plate 50A and the first sealing portion 51B. The first sealing portion 51B is also bonded to the edge 50c of the second surface 50b of the metal plate 50A.

[0095] The first closed portion 51C is joined to the first surface 50a (outer surface) of the metal plate 50A. The area where the edge 50c of the first surface 50a of the metal plate 50A overlaps with the first closed portion 51C becomes the joining area between the metal plate 50A and the first closed portion 51C. The first surface 50a of the metal plate 50A has an electrode exposed portion 50d (hereinafter also referred to as "exposed surface 50d") exposed from the first closed portion 51C. The heat exchanger 1A is arranged in contact with the exposed surface 50d.

[0096] The outer edges of the first sealing parts 51B and 51C embedded in the second sealing part 52 are continuous with each other. That is, the first sealing parts 51B and 51C are formed by folding a film around the edge 50c of the metal plate 50A. The outer edges of the first sealing parts 51B and 51C are the folded parts of the film. The film constituting the first sealing parts 51B and 51C is joined to the edge 50c on both the first surface 50a and the second surface 50b of the metal plate 50A.

[0097] The first sealing portion 51D is bonded to the first surface 50a of the metal plate 50B. The inner portion 51b of the first sealing portion 51D is located between the edge 45c of the metal plate 45 of the positive terminal electrode 49 and the edge 50c of the metal plate 50B, which are adjacent to each other in the stacking direction. The area where the edge 50c of the first surface 50a of the metal plate 50B overlaps with the first sealing portion 51D becomes the bonding area between the metal plate 50B and the first sealing portion 51D.

[0098] The first sealing portion 51E is disposed at the edge 50c of the second surface 50b (outer surface) of the metal plate 50B. The first sealing portion 51E is not joined to the metal plate 50B. The second surface 50b of the metal plate 50B has an exposed surface 50d exposed from the first sealing portion 51E. The heat exchanger 1A is disposed in contact with the exposed surface 50d.

[0099] The outer edges of the first sealing parts 51D and 51E embedded in the second sealing part 52 are continuous with each other. That is, the first sealing parts 51D and 51E are formed by folding a film around the edge 50c of the metal plate 50B. The outer edges of the first sealing parts 51D and 51E are the folded parts of the film. The film constituting the first sealing parts 51D and 51E is joined to the edge 50c on the first surface 50a of the metal plate 50B.

[0100] A plurality of internal spaces V are provided in the electrode stack 41. Each internal space V is provided between adjacent metal plates. The internal space V is a space separated airtightly and liquid-tightly by the metal plates and the sealing body 42 between adjacent metal plates in the stacking direction. The internal space V contains, for example, an electrolyte (not shown). The electrolyte contains, for example, a non-aqueous solvent and a supporting salt. Examples of the non-aqueous solvent include organic solvents such as carbonates, ethers, esters, nitriles, sulfones, and lactones. Examples of the supporting salt include lithium salts such as LiPF6. The electrolyte is impregnated in the separator 43, the positive electrode 46, and the negative electrode 47.

[0101] (1.3.2) Lower shell The power storage device package 20 includes a lower shell 60. The lower shell 60 accommodates the power storage device 30. The shape of the lower shell 60 is not particularly limited as long as it is a shape that accommodates the power storage module 33, and any known shape is acceptable. The material of the lower shell 60 may be metal or resin. The power storage device package 20 may also be fixed to the lower shell 60. The method for fixing the power storage device package 20 is appropriately selected according to the material of the lower shell 60, etc., and examples thereof include a method using fastening parts, welding, clamping, welding, etc. Examples thereof include bolts, nuts, screws, rivets, and pins. Examples of welding include metal welding and brazing.

[0102] (1.3.3) Cooling device The power storage device pack 20 may include a cooling device (not shown) for supplying a cooling medium to the heat exchanger 1A. The cooling device may be a known device.

[0103] (1.3.4) Upper shell The power storage device package 20 may also include an upper case (not shown) that covers the power storage device 30. The shape of the upper case is not particularly limited as long as it covers the power storage device 30, and any known shape is sufficient. The material of the upper case may be metal or resin. The upper case is fixed to the lower case 60. The method for fixing the upper case is not particularly limited, and the same method as the method exemplified as the method for fixing the power storage device package 20 can be cited.

[0104] (1.4) Effects As reference Figure 1 to Figure 7 As described above, the method for manufacturing a heat exchanger of the first embodiment is a method for manufacturing a heat exchanger 1A. The heat exchanger 1A includes a first metal plate 11, a second metal plate 12, and a zigzag metal plate 13A. The third metal plate is easier to deform than the first metal plate 11 and the second metal plate 12. The method for manufacturing a heat exchanger includes a lamination step and a bonding step. Thus, when the fluid is pressed into the first through hole TH1 and the second through hole TH2 of the laminated plate, the portion of the third metal plate in the portion constituting the first flow path R1 and the second flow path R2 is selectively expanded. At this time, the first metal plate 11 and the second metal plate 12 are difficult to deform. The manufacturing method of the heat exchanger of the first embodiment can manufacture the heat exchanger 1A with flat main surface TS11 and main surface TS12. Furthermore, the method for manufacturing the heat exchanger according to the first embodiment can manufacture a heat exchanger having flat main surfaces TS11 and TS12 at a lower cost than when using a metal mold for the zigzag metal plate 13A.

[0105] As reference Figure 1 to Figure 7 As described above, the method for manufacturing a heat exchanger according to the first embodiment includes the press-fitting step. Thus, the first flow path R1 is formed between the first metal plate 11 and the zigzag metal plate 13A, and the second flow path R2 is formed between the second metal plate 12 and the zigzag metal plate 13A. As a result, the heat exchanger manufacturing method of the first embodiment can manufacture the heat exchanger 1A having flat main surfaces TS11 and TS12.

[0106] As reference Figure 1 to Figure 7 As described above, in the first embodiment, the zigzag metal plate 13A does not have a third through hole that connects the first flow path R1 and the second flow path R2. The plurality of peaks M13 include a plurality of linear peaks M13A (an example of the first peak). The plurality of valleys V13 include a plurality of linear valleys V13A (an example of the first valley). Thus, the first flow path R1 is independent from the second flow path R2. Compared with the case where the plurality of mountain portions M13 do not include the plurality of linear mountain portions M13A formed by the first gap L6, when the fluid is pressed into the first through hole TH1 of the laminated plate, the distribution of the magnitude of the pressure applied to the first metal plate 11 tends to become more uniform. Compared with the case where the plurality of valley portions V13 do not include the plurality of linear valley portions V13A formed by the second gap L7, when the fluid is pressed into the second through hole TH2 of the laminated plate, the distribution of the magnitude of the pressure applied to the second metal plate 12 tends to become more uniform. As a result, the method for manufacturing a heat exchanger according to the first embodiment can manufacture a heat exchanger 1A having flat main surfaces TS11 and TS12.

[0107] As reference Figure 1 to Figure 7 As described above, in the first embodiment, the linear peaks M13A and the linear valleys V13A extend along the Y-axis direction (an example of the second direction). The linear peaks M13A and the linear valleys V13A are alternately formed along the X-axis direction (an example of the first direction). Thus, when the fluid is pressed into the first through hole TH1 of the laminated plate, the distribution of the magnitude of the pressure applied to the first metal plate 11 is easy to become uniform. When the fluid is pressed into the second through hole TH2 of the laminated plate, the pressure applied to the second metal plate 12 is easy to become uniform. As a result, the manufacturing method of the heat exchanger of the first embodiment can manufacture the heat exchanger 1A with flat main surfaces TS11 and TS12.

[0108] As reference Figure 1 to Figure 7 As described above, in the first embodiment, the first metal plate 11 and the second metal plate 12 each include a 6000 series aluminum alloy, and the third metal plate includes a 1000 series aluminum. That is, the third metal plate is more easily deformed than the first metal plate 11 and the second metal plate 12. As a result, the method for manufacturing a heat exchanger according to the first embodiment can manufacture the heat exchanger 1A having flat main surfaces TS11 and TS12.

[0109] As reference Figure 1 to Figure 7 As described above, in the first embodiment, the thickness of each of the first metal plate 11 and the second metal plate 12 is 1.00 mm or more. The thickness of the third metal plate is less than 1.00 mm. That is, the third metal plate is more easily deformed than the first metal plate 11 and the second metal plate 12. As a result, the method for manufacturing a heat exchanger according to the first embodiment can manufacture the heat exchanger 1A having flat main surfaces TS11 and TS12.

[0110] As reference Figure 1 to Figure 7As described above, the method for manufacturing a heat exchanger according to the first embodiment further includes a preparation step, a first mold release agent application step, and a second mold release agent application step. Thus, the first metal plate 11 and the plurality of peaks M13 are joined by brazing. The second metal plate 12 and the plurality of valleys V13 are joined by brazing. As a result, the heat exchanger manufacturing method of the first embodiment can manufacture the heat exchanger 1A simply compared to the case where the joining method is not brazing.

[0111] As reference Figure 1 to Figure 7 As described above, the heat exchanger 1A of the first embodiment includes a first metal plate 11, a second metal plate 12, and a zigzag metal plate 13A. The zigzag metal plate 13A has a plurality of mountain portions M13 joined to the first metal plate 11, and a plurality of valley portions V13 joined to the second metal plate 12. A first flow path R1 is formed between the first metal plate 11 and the zigzag metal plate 13A, and a second flow path R2 is formed between the second metal plate 12 and the zigzag metal plate 13A. The zigzag metal plate 13A is easier to deform than the first metal plate 11 and the second metal plate 12. The heat exchanger 1A is suitably manufactured by the heat exchanger manufacturing method of the first embodiment. Therefore, the main surface TS11 and the main surface TS12 of the heat exchanger 1A are flat. As a result, the heat exchanger 1A can efficiently cool the power storage module 33 .

[0112] As reference Figure 1 to Figure 7 As described above, in the heat exchanger 1A according to the first embodiment, the main surface TS11 of the first metal plate 11 and the main surface TS12 of the second metal plate are each flat. Thus, compared with a case where the main surface TS11 of the first metal plate 11 and the main surface TS12 of the second metal plate 12 are not planar, the main surface TS11 of the first metal plate 11 and the main surface TS12 of the second metal plate 12 are more likely to directly contact the power storage module 33. As a result, the heat exchanger 1A can cool the power storage module 33 more efficiently.

[0113] As reference Figure 1 to Figure 7 As described above, in the first embodiment, the thickness of the heat exchanger 1A is 10 mm or less. Therefore, the heat exchanger 1A is suitably used as a cooler for cooling the power storage modules 33 included in the power storage device 30 .

[0114] As reference Figure 1 to Figure 7 As described above, the power storage device 30 of the first embodiment includes a plurality of power storage modules 33 and a plurality of heat exchangers 1A. A heat exchanger 1A is disposed in contact with and between the mutually opposing electrode exposed portions 50d between the power storage modules 33 adjacent to each other in the stacking direction. The main surfaces TS11 and TS12 of the heat exchanger 1A are flat. Therefore, the contact area between the electrode exposed portion 50d and the heat exchanger 1A is larger than when the main surfaces TS11 and TS12 of the heat exchanger 1A are not flat. As a result, the power storage device 30 can efficiently cool the power storage module 33 .

[0115] As reference Figure 1 to Figure 7 As described above, the power storage device package 20 according to the first embodiment includes the power storage device 30 and the lower case 60 . Thus, the power storage device pack 20 can efficiently cool the power storage modules 33 .

[0116] (2) Second Embodiment The method for manufacturing the heat exchanger according to the second embodiment of the present disclosure is mainly the same as the method for manufacturing the heat exchanger according to the first embodiment, except that the zigzag metal plate has through holes.

[0117] The method for manufacturing a heat exchanger according to the second embodiment is a method for manufacturing a heat exchanger 1B.

[0118] like Figure 8 As shown, the heat exchanger 1B includes a first metal plate 11, a second metal plate 12, a zigzag metal plate 13B, and a first solder layer 14 (see Figure 2 )、Second solder layer 15 (refer to Figure 2 ) The structure of the zigzag metal plate 13B is the same as that of the zigzag metal plate 13A except that the zigzag metal plate 13B has a third through hole TH3 that connects the first flow path R1 and the second flow path R2.

[0119] As reference Figure 8 As described above, in the second embodiment, the zigzag metal plate 13B further has a plurality of third through holes TH3 that connect the first flow path R1 and the second flow path R2. The plurality of mountain portions M13 include a plurality of linear mountain portions M13A (an example of the first mountain portion). The plurality of valley portions V13 include a plurality of linear valley portions V13A (an example of the first valley portion). The first interval L6 is equal to the second interval L7.

[0120] Thus, when the fluid is pressed into the first through hole TH1 and the second through hole TH2 of the laminated plate, the distribution of the magnitude of the pressure applied to the first metal plate 11 and the second metal plate 12 is easily uniform, compared with the case where the first interval L6 and the second interval L7 are not equal. As a result, the manufacturing method of the heat exchanger of the second embodiment can manufacture the heat exchanger 1B with flatter main surfaces TS11 and TS12.

[0121] (3) Modification The manufacturing method of the heat exchanger of the first embodiment and the second embodiment comprises a preparation step, a first release agent coating step, a second release agent coating step, a lamination step, a bonding step, and a pressing step, but the manufacturing method of the heat exchanger disclosed in the present invention only needs to comprise a lamination step and a bonding step, and may not comprise at least one of the preparation step, the first release agent coating step, the second release agent coating step, and the pressing step.

[0122] In the first embodiment, the plurality of hills M13 include a plurality of linear hills M13A, and the plurality of valleys V13 include a plurality of linear valleys V13A. However, in the method for manufacturing a heat exchanger disclosed herein, the plurality of hills M13 may not include a plurality of linear hills M13A, and the plurality of valleys V13 may not include a plurality of linear valleys V13A.

[0123] In the first embodiment, the first interval L6 and the second interval L7 are equal, but the first interval L6 and the second interval L7 may be different. In the first embodiment, the first flow path R1 and the second flow path R2 are independent. Therefore, even if the first interval L6 and the second interval L7 are different, the manufacturing method of the heat exchanger of the first embodiment can manufacture a heat exchanger with flat main surface TS11 and main surface TS12.

[0124] In the first embodiment and the second embodiment, the plurality of linear mountain portions M13A (an example of the first mountain portion) and the plurality of linear valley portions V13A (an example of the first valley portion) extend along the Y-axis direction, respectively. However, in the present disclosure, the plurality of linear mountain portions M13A and the plurality of linear valley portions V13A may not extend along the Y-axis direction. For example, the first mountain portion and the second valley portion may also be curved toward the positive direction of the Y-axis.

[0125] In the first embodiment and the second embodiment, the first metal plate 11 and the second metal plate 12 each contain a 6000 series aluminum alloy, and the third metal plate contains a 1000 series aluminum. However, in the present disclosure, the first metal plate 11 and the second metal plate 12 each may not contain a 6000 series aluminum alloy, and the third metal plate may not contain a 1000 series aluminum. The material of each of the first metal plate 11, the second metal plate 12, and the third metal plate is appropriately selected according to the thickness of each of the first metal plate 11, the second metal plate 12, and the third metal plate, and any metal may be used.

[0126] In the first embodiment and the second embodiment, the thickness of each of the first metal plate 11 and the second metal plate 12 is 1.00 mm or more, and the thickness of the third metal plate is less than 1.00 mm, but in the present disclosure, the thickness of each of the first metal plate 11 and the second metal plate 12 may be less than 1.00 mm, and the thickness of the third metal plate may be 1.00 mm or more. The thickness of each of the first metal plate 11, the second metal plate 12, and the third metal plate is appropriately selected according to the material of each of the first metal plate 11, the second metal plate 12, and the third metal plate.

[0127] In the case where the manufacturing method of the heat exchanger disclosed in the present invention does not have a preparation step, a first release agent coating step, and a second release agent coating step (hereinafter, "the first case"), the multiple mountain portions of the zigzag metal plate may be joined to the first metal plate by a joining method other than brazing, and the multiple valley portions of the zigzag metal plate may be joined to the second metal plate by a joining method other than brazing. As a joining method other than brazing, it is appropriately selected according to the materials of the first metal plate, the second metal plate, and the third metal plate, and examples thereof include welding (such as laser welding), cladding (such as friction stir welding (FSW), friction stir spot welding (FSSW), etc.). In the case where the manufacturing method of the heat exchanger disclosed in the present invention is the first case, the heat exchanger 1A and the heat exchanger 1B may not have the first solder layer 14 and the second solder layer 15, respectively. In the case where the manufacturing method of the heat exchanger disclosed in the present invention is the first case, the joining of the first metal body and the third metal plate in the area of ​​the stacked plate corresponding to the mountain portion, and the joining of the second metal body and the third metal plate in the area of ​​the stacked plate corresponding to the valley portion, can be implemented separately instead of simultaneously.

[0128] In the heat exchanger 1A and the heat exchanger 1B, the main surface TS11 and the main surface TS12 are planar, but in the present disclosure, the main surface TS11 and the main surface TS12 may also be non-planar. For example, a protrusion protruding in the thickness direction (Z-axis direction) of the heat exchanger 1A and the heat exchanger 1B may be formed on the periphery of each of the main surface TS11 and the main surface TS12.

[0129] The thickness of each of the heat exchanger 1A and the heat exchanger 1B is 10 mm or less. However, in the present disclosure, the thickness of each of the heat exchanger 1A and the heat exchanger 1B may exceed 10 mm.

[0130] In the first embodiment and the second embodiment, the heat exchange medium is a cooling medium, but in the present disclosure, the heat exchange medium may also be a heating medium. In the case where the heat exchange medium is a heating medium, the heat exchanger 1A and the heat exchanger 1B can heat the heat exchange object that is in thermal contact with the main surface TS11 and the main surface TS12, respectively. As the heating medium, a heating liquid, a heating gas, etc. can be cited. As the heating liquid, as long as it is a liquid commonly used as a heating liquid, there is no particular limitation. As an example, water, oil, a glycol aqueous solution, a refrigerant for air conditioning, a non-conductive liquid, a phase change liquid, etc. can be cited. The heating gas can be air, water vapor, etc. The temperature of the heating medium is appropriately adjusted according to the type of the heat exchange body, etc.

Claims

1. A method for manufacturing a heat exchanger, which is a method for manufacturing a heat exchanger. The heat exchanger comprises: a first metal plate having at least one first through hole; a second metal plate having at least one second through hole; and a zigzag metal plate disposed between the first metal plate and the second metal plate and formed by a third metal plate in a zigzag shape. The zigzag metal plate has a plurality of mountain portions joined to the first metal plate and a plurality of valley portions joined to the second metal plate. A first flow path communicating with the first through hole is formed between the first metal plate and the zigzag metal plate, and a second flow path communicating with the second through hole is formed between the second metal plate and the zigzag metal plate. The third metal plate is more easily deformed than the first metal plate and the second metal plate. The manufacturing method comprises the following steps: The first metal plate, the third metal plate and the second metal plate are stacked in this order to produce a stacked plate; Joining the first metal plate and the third metal plate in a region of the laminated plate corresponding to the mountain portion; and The second metal plate and the third metal plate are joined to each other in a region of the laminated plate corresponding to the valley portion.

2. The method for manufacturing a heat exchanger according to claim 1, wherein: It also has the following steps: The third metal plate is expanded by pressurizing a fluid into each of the first through hole and the second through hole.

3. The method for manufacturing a heat exchanger according to claim 1 or 2, wherein: The zigzag metal plate does not have a third through hole connecting the first flow path and the second flow path. The plurality of peaks include a plurality of first peaks formed at first intervals along a first direction orthogonal to a thickness direction of the heat exchanger. The plurality of valley portions include a plurality of first valley portions formed at second intervals along the first direction.

4. The method for manufacturing a heat exchanger according to claim 3, wherein: The first mountain portion and the first valley portion extend along a second direction that is orthogonal to the first direction and the thickness direction of the heat exchanger, respectively. The first mountain portions and the first valley portions are alternately formed along the first direction.

5. The method for manufacturing a heat exchanger according to claim 1 or 2, wherein: The first metal plate and the second metal plate each include 6000 series aluminum alloy. The third metal plate includes 1000 series aluminum.

6. The method for manufacturing a heat exchanger according to claim 1 or 2, wherein: The thickness of each of the first metal plate and the second metal plate is greater than 1.00 mm. The thickness of the third metal plate is less than 1.00 mm.

7. The method for manufacturing a heat exchanger according to claim 1 or 2, wherein: The zigzag metal plate further has at least one third through hole connecting the first flow path and the second flow path. The plurality of peaks include a plurality of first peaks formed at first intervals along a first direction orthogonal to a thickness direction of the heat exchanger. The plurality of valley portions include a plurality of first valley portions formed at second intervals along the first direction, The first interval is equal to the second interval.

8. The method for manufacturing a heat exchanger according to claim 1 or 2, wherein: It also has the following steps: preparing a first brazing plate having a first solder layer formed on one main surface of the first metal plate for bonding the plurality of mountain portions to the first metal plate, and a second brazing plate having a second solder layer formed on one main surface of the second metal plate for bonding the plurality of valley portions to the second metal plate; Applying a first release agent to a region of the main surface of the first solder layer except for a region where the plurality of peaks are bonded, thereby manufacturing a first brazing plate with a release agent; as well as A second release agent is applied to a region of the main surface of the second solder layer except for a region where the plurality of valleys are bonded, thereby manufacturing a second brazing plate with a release agent. In the production of the laminated plate, the first brazing plate with a release agent, the third metal plate, and the second brazing plate with a release agent are stacked in such a manner that the first metal plate, the first solder layer, the third metal plate, the second solder layer, and the second metal plate are stacked in this order to produce the laminated plate. In joining the first metal plate and the third metal plate and joining the second metal plate and the third metal plate, the laminated plates are heated to braze the first metal plate and the third metal plate and to braze the second metal plate and the third metal plate.

9. A heat exchanger comprising: A first metal plate having at least one first through hole; a second metal plate having at least one second through hole; and a zigzag metal plate disposed between the first metal plate and the second metal plate and formed by a third metal plate in a zigzag shape, The zigzag metal plate includes a plurality of mountain portions joined to the first metal plate and a plurality of valley portions joined to the second metal plate. A first flow path communicating with the first through hole is formed between the first metal plate and the zigzag metal plate, and a second flow path communicating with the second through hole is formed between the second metal plate and the zigzag metal plate. The zigzag metal plate is more easily deformed than the first metal plate and the second metal plate.

10. The heat exchanger according to claim 9, wherein: The main surface of the first metal plate and the main surface of the second metal plate are respectively planar.

11. The heat exchanger according to claim 9, wherein: The thickness is less than 10mm.

12. An electric storage device comprising: a plurality of stacked power storage modules; and The plurality of heat exchangers according to any one of claims 9 to 11 are provided between the power storage modules adjacent to each other in the stacking direction of the power storage modules, The plurality of power storage modules each include: an electrode stack including a plurality of electrodes stacked in a stacking direction of the power storage modules with a separator therebetween; an electrolyte contained in an internal space formed between adjacent electrodes; and a sealing body surrounding a side surface of the electrode stack in the stacking direction and sealing the internal space. The plurality of electrodes include a negative terminal electrode, a positive terminal electrode, and a plurality of bipolar electrodes stacked between the negative terminal electrode and the positive terminal electrode. The plurality of bipolar electrodes each include an electrode plate, a positive electrode disposed on a first surface of the electrode plate, and a negative electrode disposed on a second surface of the electrode plate. The electrode stack has electrode exposed portions exposed from the sealing body at one end and the other end in the stacking direction. The heat exchanger is disposed in contact with each other between the power storage modules adjacent to each other in the stacking direction and between the electrode exposed portions facing each other. 13 . An electric storage device package comprising the electric storage device according to claim 12 and a lower case for accommodating the electric storage device.

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