An electronic device

Abstract

The application provides an electronic device, relates to the technical field of electronic products, and can prevent corrosion of an electrically conductive part between components. The electronic device comprises a first component, a second component, a conductive part and a sealing ring. The conductive part is arranged between the first component and the second component and is electrically conductive with the first component and the second component. The sealing ring is arranged between the first component and the second component, one end of the sealing ring in the axial direction faces the first component, and the other end faces the second component. The conductive part is located in an area surrounded by the sealing ring.

Description

[0001] This application is a divisional application. The original application has the application number 202310851318.X and the original application date is July 11, 2023. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0003] Electronic devices such as mobile phones, tablets, and laptops require electrical conductivity between components, such as between the hinge mechanism and the mid-frame, or between the camera module and the mid-frame. These components must not only meet the conductivity requirements but also prevent corrosion at the conductive points to reduce impedance and passive intermodulation (PIM) characteristics. However, existing technologies often fail to meet these requirements. Summary of the Invention

[0004] This application provides an electronic device that can prevent corrosion at electrically conductive parts between components.

[0005] To achieve the above objectives, this application provides an electronic device comprising a first component, a second component, a conductive element, and a sealing ring. The conductive element is disposed between the first component and the second component and is electrically connected to both components. The sealing ring is disposed between the first component and the second component, with one axial end of the sealing ring facing the first component and the other end facing the second component. The conductive element is located within the area surrounded by the sealing ring.

[0006] In this way, electrical conduction between the first and second components can be achieved by using conductive components, while sealing rings can seal the electrical conduction points between the first and second components, preventing moisture from entering, avoiding corrosion, and ensuring the reliability of the electrical connection. This allows the first or second component to be made of chemically active metals such as magnesium alloys, increasing the range of material choices for the first and second components and helping to reduce the weight of electronic devices.

[0007] The conductive components include, but are not limited to, conductive bosses, conductive pads, conductive springs, and conductive springs.

[0008] In one possible implementation, the conductive component is a conductive spring. The conductive spring is small in size, making it easy to install between the first and second components where space is limited.

[0009] In one possible implementation, the conductive spring includes a fixing part, a spring arm part, and a contact part. The fixing part is fixed to a first component and electrically conductive, while the contact part is in contact with a second component and electrically conductive. The surface of the first component facing the second component is a first surface. The spring arm part includes opposing first and second ends, with the direction from the first end to the second end inclined relative to the first surface. The first end is connected to the fixing part and electrically conductive, and the second end is connected to the contact part and electrically conductive. Thus, during the installation of the conductive spring between the first and second components, the spring arm part can undergo bending deformation towards the first component, thereby accumulating elastic force. This elastic force allows the contact part to stably abut against the second component, ensuring reliable contact between the contact part and the second component. Simultaneously, the conductive spring can adapt to installation between different gaps, and its small thickness allows for installation within gaps with limited height, without affecting the thickness of the electronic device, thus contributing to the miniaturization of electronic devices.

[0010] In one possible implementation, the fixing part includes a third end and a fourth end opposite to each other, with the direction from the third end to the fourth end being a first direction. This first direction is parallel to the first surface. The first end and the fourth end are connected and electrically conductive. The orthographic projection of the first end onto the first surface is the first projection, and the orthographic projection of the second end onto the first surface is the second projection. The direction from the first projection to the second projection is the second direction, which is opposite to the first direction. In this way, along the path third end → fourth end → first end → second end, the conductive spring undergoes at least one reverse bending, thereby reducing the size of the conductive spring in the first direction and preventing the first and second components from being designed to be too large in the first direction, thus contributing to a reduction in the size of the electronic device.

[0011] In one possible implementation, the fixing part and the spring arm part are arranged at intervals along a third direction. This third direction is parallel to the first surface and perpendicular to the first direction. In this way, the projected areas of the fixing part and the spring arm part on the first surface do not overlap, avoiding thickness superposition between them. This helps reduce the height of the conductive spring, thereby reducing the stacked thickness of the first component, the conductive spring, and the second component, which is beneficial for the thinner design of electronic devices.

[0012] In one possible implementation, the conductive spring further includes a connecting portion. The connecting portion is located between the fourth end and the first end, and is connected to and electrically conductive to both the fourth and first ends. The connecting portion extends along a third direction from the fourth end to the first end. This alignment of the fourth end and the first end in the third direction further reduces the size of the conductive spring in the first direction.

[0013] In one possible implementation, the orthographic projection of the spring arm portion onto the first surface is a third projection, and the length of the third projection in the first direction is less than the length of the fixing portion in the first direction. In this way, since the contact portion is connected to the second end, and the fourth end and the first end are aligned in the third direction, the contact portion is located at the center of the conductive spring in the first direction. The area on the second surface surrounded by the sealing ring is defined as the first region, thereby enabling the contact portion to contact the center of this first region in the first direction, further ensuring the reliability of the electrical connection.

[0014] In one possible implementation, the edge of the second end furthest from the first end is the first edge, and the portion of the second end where the first edge is located forms the contact portion. This results in a simple structure for the conductive spring, making it easy to manufacture.

[0015] In one possible implementation, the edge of the second end facing the fixing part is a second edge, which is a flange protruding towards the fixing part. The edge of the second end away from the fixing part is a third edge, which is connected to the first edge by an arc transition edge or an inclined transition edge.

[0016] When a circular arc transition edge connects the third edge and the first edge, the circular arc transition edge protrudes in a direction away from the fixing part, and the circular arc transition edge is tangent to both the first edge and the third edge. When an inclined transition edge connects the third edge and the first edge, one end of the inclined transition edge is connected to the third edge, and the other end extends in a direction away from the first end and is inclined towards the fixing part, and the other end is connected to the first edge.

[0017] In this way, in the third direction, the contact part is closer to the fixing part. That is to say, the contact part is located in the middle of the conductive spring in the third direction, so that the contact part can make contact with the first region in the middle of the third direction, which is beneficial to ensuring the stability and reliability of the electrical connection.

[0018] In one possible implementation, the edge of the fixing part facing the spring arm is provided with a first clearance notch. When the spring arm bends toward the first component to be coplanar with the fixing part, the first clearance notch is opposite to the second edge in the third direction. In this way, the first clearance notch can provide clearance for a portion of the second end at the second edge, preventing the thickness of the spring arm from overlapping with the fixing part when it bends to be coplanar with the fixing part, which is beneficial to further reduce the thickness of the conductive spring sheet. At the same time, the clearance notch can provide clearance for the spring arm, which can reduce the distance between the spring arm and the fixing part in the third direction, and reduce the size of the conductive spring sheet in the third direction.

[0019] In one possible implementation, the spring arm further includes an intermediate section connecting the first end and the second end. The edge of the intermediate section facing the fixing part is a fourth edge, and the edge of the connecting part facing the gap between the intermediate section and the fixing part is a fifth edge. The fourth edge and the fifth edge are connected, and the fourth edge is inclined towards the fixing part in the direction from the second end to the first end. This results in a larger width at the junction between the first end and the intermediate section, higher structural strength and elastic force of the spring arm, enabling reliable contact between the contact part and the second component.

[0020] In one possible implementation, the edge of the fixing part facing the spring arm is provided with a second clearance notch. When the spring arm bends toward the first component to be coplanar with the fixing part, the second clearance notch is opposite to the fourth edge along the third direction. In this way, the second clearance notch can provide clearance for a portion of the middle section at the fourth edge, preventing thickness overlap between the spring arm and the fixing part when the spring arm bends to be coplanar with the fixing part, which helps to further reduce the thickness of the conductive spring sheet. At the same time, the second clearance notch can provide clearance for a portion of the middle section at the fourth edge, which can reduce the distance between the spring arm and the fixing part in the third direction, and reduce the size of the conductive spring sheet in the third direction.

[0021] In one possible implementation, the contact portion includes a contact portion body and a first contact layer. A second end is connected to the contact portion body and is electrically conductive. The first contact layer is disposed on the surface of the contact portion body, and the conductivity of the first contact layer is greater than that of the contact portion body. The first contact layer is in contact with the second component. In this way, the conductivity efficiency between the contact portion body and the second component can be improved, impedance can be reduced, and passive intermodulation characteristics can be enhanced by using the first contact layer.

[0022] In one possible implementation, the material of the first contact layer includes at least one of gold, nickel, silver, and copper.

[0023] In one possible implementation, the surface of the first component facing the second component is designated as the first surface, and the surface of the second component facing the first component is designated as the second surface. A sealing ring is disposed between the first and second surfaces. This arrangement does not affect the structural strength of the first and second components.

[0024] In one possible implementation, the first surface is provided with a first groove, and at least the fixing part of the conductive spring is accommodated within the first groove. In this way, while maintaining a fixed gap height between the first and second components, the height of the conductive spring can be increased, thereby improving its structural strength and elasticity.

[0025] In one possible implementation, the second component includes a component body and a contact. The contact is fixed to the component body and electrically conductive, and the contact portion contacts the contact. Thus, the second component is formed by assembling the component body and the contact. The component body and the contact can be made of different materials. For example, the component body can be made of a material with high structural strength and low cost (such as steel), and the contact can be made of a material with a higher conductivity than the component body, thereby balancing manufacturing cost and conductivity efficiency.

[0026] In one possible implementation, a second recess is provided on the surface of the component body facing the first component, and the contact is housed within the second recess. This recess, with the contact submerged within the component body, avoids thickness overlap between the component body and the contact, thus facilitating a thinner electronic device. Furthermore, the contact can contact not only the bottom surface of the second recess but also its sides, resulting in a larger contact area between the contact and the component body, thereby improving the conductivity between them.

[0027] In one possible implementation, the contact includes a contact body and a second contact layer. The second contact layer is disposed at least on the surface of the contact body facing the first component, and the conductivity of the second contact layer is greater than that of the contact body. The second end contacts the second contact layer and is electrically conductive. In this way, the conductivity efficiency between the contact body and the second component can be improved, impedance can be reduced, and passive intermodulation characteristics can be enhanced by using the second contact layer.

[0028] In one possible implementation, the electronic device further includes at least one fixing member connected between the first component and the second component. The at least one fixing member is located on the side of the sealing ring opposite to the conductive component. In this way, the conductive component and the sealing ring are not restricted by the position of the fixing member, and can be positioned in a space with ample room, avoiding any impact on the size of the second component or the connection stability between the first and second components.

[0029] In one possible implementation, the fastener is a screw. Screws offer superior connection stability and reliability. Furthermore, the threaded surface of the screw can be provided with an insulating coating, which prevents the first component and the second component from being electrically connected together via the screw.

[0030] In one possible implementation, the first component has a threaded hole, and the second component has a first through hole opposite to the threaded hole. An insulating material with clearance holes is provided between the first and second components, the clearance holes being opposite to and communicating with the through hole and the threaded hole. The screw includes a head and a shank, the head being located on the side of the second component opposite to the first component, and the shank being accommodated within the first through hole, the clearance hole, and the threaded hole. In this way, the insulating material prevents direct contact between the second and first components at the fastener location, thus preventing corrosion.

[0031] In one possible implementation, a boss is provided between the first component and the second component, the boss being connected to one of the first and second components, and insulating material is disposed between the other of the first and second components and the boss. The boss has a second through hole, which is opposite to and communicates with the first through hole, the clearance hole, and the threaded hole. The rod portion is accommodated within the first through hole, the second through hole, the clearance hole, and the threaded hole. In this way, the boss increases the clearance height between the first and second components, preventing other areas of the first surface from contacting other areas of the second surface, thereby reducing the risk of corrosion. Furthermore, the boss prevents the flatness of the first and second surfaces from affecting the reliability of the connection between the first and second components.

[0032] In one possible implementation, multiple fasteners are used, connected between the edge of the second component and the first component. Conductive elements and sealing rings are located on the side of the multiple fasteners facing the center of the second component. This results in a larger spacing between the fasteners, leading to a larger resistance arm and torque when the shaft mechanism rotates. This effectively prevents the second component from separating from the first component, ensuring the stability of the connection between them. Furthermore, since the conductive elements and sealing rings are located on the side of the multiple fasteners facing the center of the second component, their influence on the dimensions of the second component and the stability of the connection between the first and second components can be avoided.

[0033] In one possible implementation, at least one of the first and second components is made of magnesium alloy. Magnesium alloy has low density and good structural strength and rigidity, which helps to reduce the weight of electronic devices while ensuring their structural strength and service life.

[0034] In one possible implementation, the electronic device includes a first mid-frame and a hinge mechanism. The hinge mechanism includes a base, a first swing arm, and a first connector. The first swing arm is rotatably connected to the base, and the first connector is connected to the end of the first swing arm away from the base and fixed to the first mid-frame. The first mid-frame forms a first component, and the first connector forms a second component. Alternatively, the first mid-frame forms the second component, and the first connector forms the first component. In this way, the electronic device is a foldable screen device, which can reduce the weight of the foldable screen device. Attached Figure Description

[0035] Figure 1 Perspective views of electronic devices in an unfolded state provided in some embodiments of this application;

[0036] Figure 2 for Figure 1 A partial exploded view of the electronic device shown.

[0037] Figure 3 for Figure 1 The diagram shows the structure of the electronic device in a folded state.

[0038] Figure 4 for Figure 1 and Figure 2 A schematic diagram of the rear structure of the first middle frame, the second middle frame, and the pivot mechanism in the electronic device shown.

[0039] Figure 5 for Figure 4 The diagram shows a cross-sectional view of the assembly structure along the AA direction.

[0040] Figure 6 This is a partial structural schematic diagram of an electronic device provided in some embodiments of this application;

[0041] Figure 7 for Figure 6 A magnified view of a portion of region I in the electronic device shown;

[0042] Figure 8 for Figure 7 A schematic diagram of the cross-sectional structure of the electronic device shown along the BB direction;

[0043] Figure 9 for Figure 8 Top view of the conductive components and sealing rings in the electronic device shown;

[0044] Figure 10 for Figure 9 A schematic diagram of the conductive components in the structure shown;

[0045] Figure 11 for Figure 10 A schematic diagram of the orthographic projection of the conductive component shown in the first surface;

[0046] Figure 12 for Figure 8 A magnified view of the electronic device shown in region II. Detailed Implementation

[0047] In the embodiments of this application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature.

[0048] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0049] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0050] In the embodiments of this application, the description of two components as "electrically connected" means that when one of the two components is energized, the current on that component can enter the other component through the electrically connected part.

[0051] This application provides an electronic device, which can be a user equipment (UE) or a terminal device, such as a tablet computer (PAD), a laptop computer, a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, and other mobile or fixed terminals. The electronic device includes at least two components, which are electrically connected by a conductive element. The following embodiments are illustrated by using foldable screen devices as examples, such as mobile phones.

[0052] Please see Figure 1 and Figure 2 , Figure 1 This is a perspective view of the electronic device 10 provided in some embodiments of this application in its unfolded state. Figure 2 for Figure 1 The diagram shows a partially exploded view of the electronic device 10. In its unfolded state, the electronic device 10 is approximately rectangular and flat. For ease of description in the following embodiments, an XYZ coordinate system is established for the electronic device 10 in its unfolded state, defining the length direction of the electronic device 10 as the X-axis, the width direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system setting of the electronic device 10 can be flexibly configured according to actual needs and is not specifically limited here. In other embodiments, the shape of the electronic device 10 in its unfolded state can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0053] The electronic device 10 includes a folding screen 1 and a support device 2.

[0054] Foldable screen 1 is used to display images, videos, and other information. Foldable screen 1 can be an organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (micro-organic light-emitting diode) screen, a quantum dot light-emitting diode (QLED) screen, a liquid crystal display (LCD), etc.

[0055] The foldable screen 1 has a display surface that is exposed to facilitate the presentation of images, videos, and other information to the user. The foldable screen 1 includes a first foldable screen portion 11, a second foldable screen portion 12, and a third foldable screen portion 13, with the third foldable screen portion 13 connected between the first foldable screen portion 11 and the second foldable screen portion 12. Figure 1 In the illustrated electronic device 10, the folding screen 1 is in the unfolded state. The first folding screen portion 11, the third folding screen portion 13, and the second folding screen portion 12 are arranged sequentially along the X-axis, thus the electronic device 10 folds horizontally. In some other embodiments, when the folding screen 1 is in the unfolded state, the first folding screen portion 11, the third folding screen portion 13, and the second folding screen portion 12 can also be arranged sequentially along the Y-axis. Thus, the electronic device 10 folds vertically. When the folding screen 1 is in the unfolded state, a large-screen display can be achieved, providing users with richer information and a better user experience.

[0056] At least the third folding screen portion 13 of the folding screen 1 is a flexible screen structure. Thus, the third folding screen portion 13 can bend and deform under external force, allowing the folding screen 1 to... Figure 1 The unfolded state is folded to the folded state. The first folding screen portion 11 and the second folding screen portion 12 of the folding screen 1 can be a flexible screen structure, a rigid screen structure, or a combination of both; no specific limitation is made here.

[0057] Please see Figure 3 , Figure 3 for Figure 1The diagram shows the structure of the electronic device 10 in a folded state, where the foldable screen 1 is also folded. Specifically, when the foldable screen 1 is folded, the first foldable screen portion 11 and the second foldable screen portion 12 are approximately parallel and opposite to each other. Where the angle θ between the first foldable screen portion 11 and the second foldable screen portion 12 is within 30°, it can be considered that the first foldable screen portion 11 and the second foldable screen portion 12 are approximately parallel. The first foldable screen portion 11 and the second foldable screen portion 12 being opposite to each other means that the display surface of the first foldable screen portion 11 faces the display surface of the second foldable screen portion 12.

[0058] The support device 2 is located on the side of the folding screen 1 that is opposite to the display surface, and the support device 2 is used to support the folding screen 1.

[0059] The support device 2 includes a first housing 21, a second housing 22, and a pivot mechanism 23. The first housing 21 carries the first folding screen portion 11, and the second housing 22 carries the second folding screen portion 12. The pivot mechanism 23 connects the first housing 21 and the second housing 22 and carries the third folding screen portion 13. The pivot mechanism 23 is used to realize the rotation between the second housing 22 and the first housing 21 to support the folding screen 1 in folding between the unfolded state and the folded state.

[0060] When electronic device 10 is in a folded state, please continue reading. Figure 3 The support device 2 protects the outside of the folding screen 1, making the folding screen 1 invisible to the user and preventing it from being scratched by hard objects. This folding screen device is an inward folding screen device, and the size of the electronic device 10 is reduced, making it easy to carry.

[0061] In the above embodiments, optionally, the first housing 21 may include a first mid-frame and a first back cover connected together. The first folding screen portion 11 is supported on the first mid-frame, and the first back cover is located on the side of the first mid-frame opposite to the first folding screen portion 11, and the first back cover can be replaced with a display screen (such as an LCD display). A first receiving cavity is formed between the first mid-frame and the first back cover, which is used to accommodate components such as a first circuit board, a camera module, and a battery, which are fixed to the first mid-frame. Based on this, the first housing 21 can be connected to the pivot mechanism 23 via the first mid-frame.

[0062] Similarly, the second housing 22 may also include a second middle frame and a second back cover connected together. The aforementioned second folding screen portion 12 is supported on the second middle frame, and the second back cover is located on the side of the second middle frame opposite to the second folding screen portion 12. The second back cover can also be replaced by a display screen (such as an LCD display). A second receiving cavity is formed between the second middle frame and the second back cover. This second receiving cavity is used to accommodate components such as the second circuit board, speaker module, array, and battery, which are fixed to the second middle frame. Based on this, the second housing 22 can be connected to the pivot mechanism 23 via the second middle frame.

[0063] It should be noted that, in order to distinguish between the first middle frame and the second middle frame, in the description of the embodiments below, the first middle frame is denoted as A in the accompanying drawings, and the second middle frame is denoted as B in the accompanying drawings.

[0064] Please see Figure 4 , Figure 4 for Figure 1 and Figure 2 This is a schematic diagram of the back structure of the first middle frame A, the second middle frame B, and the hinge mechanism 23 in the electronic device 10 shown. The back refers to the surface of the first middle frame A, the second middle frame B, and the hinge mechanism 23 that faces away from the folding screen 1.

[0065] As described in the above embodiments, the first middle frame A supports the first folding screen portion 11 and fixes the components within the first receiving cavity, while the second middle frame B supports the second folding screen portion 12 and fixes the components within the second receiving cavity. Therefore, the first middle frame A and the second middle frame B provide support. Based on this, to ensure the support strength of the first middle frame A and the second middle frame B, they can be made of metal materials, such as aluminum alloy. Simultaneously, the first middle frame A and the second middle frame B also serve as a reference ground, satisfying the signal return requirements of the components within the first and second receiving cavities.

[0066] Part of the material of the first middle frame A and the second middle frame B can also be used as the radiator of the antenna (not shown in the figure) to realize the transmission and reception of radio frequency signals.

[0067] Please continue reading. Figure 4 The rotating shaft mechanism 23 includes a base 231, a first swing arm 232, a second swing arm 233, a first connecting member 234, and a second connecting member 235.

[0068] What we can know is that Figure 4 The schematic diagram illustrates some of the components included in the rotating shaft mechanism 23, which are in Figure 4The diagram is simplified and does not limit the actual shape, size, position, or structure of these components. In some embodiments, the pivot mechanism 23 may include, in addition to the components described above, a shaft cover, a door panel, an auxiliary swing arm, etc., which will not be described in detail here.

[0069] The base 231 provides a positional reference within the rotating shaft mechanism 23; the base 231 can also be referred to as the center beam. The first swing arm 232 and the second swing arm 233 are rotatably connected to the base 231. The number of the first swing arm 232 and the second swing arm 233 can be one or more. Figure 4 In the illustrated embodiment, there are three first swing arms 232 and three second swing arms 233. The rotation axis of the first swing arm 232 relative to the base 231 is approximately parallel to the rotation axis of the second swing arm 233 relative to the base 231. Here, "approximately parallel" means parallelism within a certain range of error, which can be within 5° of the absolute parallel deviation.

[0070] The first connector 234 and the second connector 235 are also referred to as wedges.

[0071] The first connector 234 is connected to the end of the first swing arm 232 away from the base 231, and the first connector 234 is fixed to the first middle frame A. The connection between the first connector 234 and the first swing arm 232 can be, but is not limited to, a fixed connection, a sliding connection, and a rotating connection.

[0072] Similarly, the second connector 235 is connected to the end of the second swing arm 233 away from the base 231, and the second connector 235 is fixed to the second middle frame B. The connection between the second connector 235 and the second swing arm 233 can be, but is not limited to, a fixed connection, a sliding connection, and a rotating connection.

[0073] When the first middle frame A and the second middle frame B are subjected to a force from the user, they can drive the first swing arm 232 and the second swing arm 233 to rotate relative to the base 231, so that the electronic device 10 can switch between an unfolded state and a folded state.

[0074] In order to ensure the lifespan of the electronic device 10 and improve the reliability of the movement of the rotating mechanism 23, the rotating mechanism 23 is usually made of metal materials, such as steel, including but not limited to stainless steel.

[0075] Based on the above embodiments, the hinge mechanism 23 can be electrically connected to the first middle frame A and the second middle frame B to prevent the hinge mechanism 23 from absorbing the radiation efficiency of the antennas on the first middle frame A and the second middle frame B. Simultaneously, the electrical connection between the hinge mechanism 23 and the first middle frame A and the second middle frame B can also release static electricity from the hinge mechanism 23 to the first middle frame A and the second middle frame B, avoiding power tripping and thus preventing interference with electronic components such as the first circuit board, the second circuit board, the camera module, and the display screen within the electronic device 10. Furthermore, the electrical connection between the hinge mechanism 23 and the first middle frame A and the second middle frame B can also place the first middle frame A and the second middle frame B at the same potential, preventing a potential difference between the first middle frame A and the second middle frame B, thereby avoiding the generation of an electric field between the first middle frame A and the second middle frame B, and further preventing interference with the radio frequency signals and baseband signals transmitted on the flexible printed circuit board (FPC). The FPC is connected between the first circuit board in the first receiving cavity and the second circuit board in the second receiving cavity, and passes through the rotating shaft mechanism 23.

[0076] To achieve the above objectives, the first connector 234 is fixed to the first middle frame A while also being electrically connected to the first middle frame A, and the second connector 235 is fixed to the second middle frame B while also being electrically connected to the second middle frame B.

[0077] For details, please refer to Figure 5 , Figure 5 for Figure 4 The diagram shows a cross-sectional view of the assembly structure along the AA direction. The first middle frame A and the first connector 234 are fastened together by screws K. A boss 2341 is provided on the surface of the first connector 234 facing the first middle frame A. The boss 2341 and the first connector 234 are integrally formed and made of the same material, steel. The screws K pass through the boss 2341. Thus, the fastening force of the screws K allows the boss 2341 to be in close contact with the first middle frame A, achieving electrical conductivity between the first middle frame A and the first connector 234.

[0078] Similarly, the connection method between the second connector 235 and the second middle frame B can be implemented with reference to the fixing method between the first connector 234 and the first middle frame A, and will not be described in detail here.

[0079] With technological advancements, there is a growing demand for increasingly lighter electronic devices 10. To achieve this weight reduction, the first middle frame A and the second middle frame B within the electronic device can be made of magnesium alloy. Magnesium alloy is an alloy composed of magnesium as a base and other elements. It has a low density but high rigidity and strength, ensuring structural strength of both the first and second middle frames A and B while achieving weight reduction. Furthermore, magnesium alloy is an abundant raw material, which helps reduce the cost of the electronic device.

[0080] However, magnesium alloys are highly chemically reactive and have a very low equilibrium potential. In humid or solution environments, they are prone to galvanic corrosion when in contact with different types of metals. Furthermore, the rotating shaft mechanism 23 is a moving mechanism, and it is difficult to achieve a sealed seal. Moist air or moisture from outside the electronic device can easily enter the space where the rotating shaft mechanism 23 is located, and subsequently enter the gaps between the first connector 234 and the first middle frame A, and between the second connector 235 and the second middle frame B. Additionally, as described above, the boss 2341 is made of steel, a material different from that of the first middle frame A and the second middle frame B. Therefore, corrosion will occur at the points on the first middle frame A that contact the boss 2341, and at the points on the second middle frame B that contact the boss of the second connector 235. Corrosion of the magnesium alloy increases impedance and reduces the reliability of the electrical connection.

[0081] To resolve the above issues, please refer to Figures 6-8 , Figure 6 This is a partial structural schematic diagram of the electronic device 10 provided in some embodiments of this application. Figure 7 for Figure 6 A magnified view of a portion of region I in the electronic device 10 shown. Figure 8 for Figure 7 The diagram shows a cross-sectional view of the electronic device 10 along the BB direction. In this embodiment, the electronic device 10 includes a first component 3 and a second component 4.

[0082] The first component 3 and the second component 4 can be in the form of a plate, sheet, block, etc. This application uses the example of both the first component 3 and the second component 4 being in the form of a plate for illustration. Furthermore, the first component 3 and the second component 4 are made of conductive materials. Specifically, the first component 3 and the second component 4 can be made of conductive metal.

[0083] In some embodiments, please refer to Figure 6 and Figure 7 The first component 3 can be the first middle frame A mentioned above, and the second component 4 can be the first connector 234 mentioned above.

[0084] In some other embodiments, the first component 3 may be the first connector 234 described above, and the second component 4 may be the first middle frame A described above; or, the first component 3 may be the second middle frame B described above, and the second component 4 may be the second connector 235 described above; or, the first component 3 may be the second connector 235 described above, and the second component 4 may be the second middle frame B described above.

[0085] In other embodiments, when the electronic device 10 is a product other than a foldable screen device, the first component 3 and the second component 4 may also be other components.

[0086] This embodiment and the embodiments described below are exemplified by the first component 3 being the first middle frame A and the second component 4 being the first connector 234. This should not be considered as a special limitation on the structural form of the first component 3 and the second component 4.

[0087] Please refer to this carefully. Figure 7 and Figure 8 The electronic device 10 also includes a conductive element 5 and a sealing ring 6.

[0088] The conductive element 5 is disposed between the first component 3 and the second component 4, and is electrically connected to the first component 3 and the second component 4.

[0089] The sealing ring 6 is disposed between the first component 3 and the second component 4, with one axial end of the sealing ring 6 facing the first component 3 and the other end facing the second component 4.

[0090] The sealing ring 6 may be made of materials including, but not limited to, foam, rubber, and silicone. The axial direction of the sealing ring 6 refers to the direction of extension of the central axis of the cylindrical space surrounding the sealing ring 6. The shape of the sealing ring 6 can be circular, square, polygonal, triangular, rectangular, etc. Please refer to [link / reference]. Figure 9 , Figure 9 for Figure 8 The top view of the conductive component 5 and the sealing ring 6 in the electronic device 10 shown is provided. The sealing ring 6 is roughly rectangular in shape.

[0091] In some embodiments, please refer to Figure 8 The surface of the first component 3 facing the second component 4 is defined as the first surface S1, and the surface of the second component 4 facing the first component 3 is defined as the second surface S2. The first sealing ring 6 is disposed between the first surface S1 and the second surface S2.

[0092] Based on the above, the sealing ring 6 can be fixed to the first surface using processes such as adhesive bonding or hot pressing, with the sealing ring 6 in contact with but not connected to the second surface S2. Alternatively, the sealing ring 6 can be fixed to the second surface S2 using processes such as adhesive bonding or hot pressing, with the sealing ring 6 in contact with but not connected to the first surface S1. This facilitates the separation of the first component 3 and the second component 4 for maintenance and also facilitates the installation of the sealing ring 6 between the first component 3 and the second component 4. Simultaneously, it can fix the position of the sealing ring 6 between the first component 3 and the second component 4, preventing misalignment of the sealing ring 6.

[0093] In some other embodiments, the first surface S1 and / or the second surface S2 may be provided with an annular limiting groove, in which at least a portion of the sealing ring 6 is accommodated, thereby limiting the sealing ring 6 by means of the annular limiting groove, which can also prevent the sealing ring 6 from being misaligned.

[0094] Based on the above, please refer to Figure 9The conductive component 5 is located within the area surrounded by the sealing ring 6.

[0095] In this way, the conductive component 5 can achieve electrical conduction between the first component 3 and the second component 4, while the sealing ring 6 can seal the electrical conduction part between the first component 3 and the second component 4 to prevent moisture from entering, avoid corrosion, and ensure the reliability of the electrical connection. This allows the first component 3 or the second component 4 to be made of chemically active metals such as magnesium alloys, increasing the range of material choices for the first component 3 and the second component 4, which helps to reduce the weight of the electronic device 10.

[0096] Based on the above, optionally, at least one of the first component 3 and the second component 4 is made of magnesium alloy. Magnesium alloy has low density, good structural strength and rigidity, which helps to reduce the weight of electronic device 10 and ensure the structural strength and service life of electronic device 10.

[0097] The conductive component 5 includes, but is not limited to, conductive bosses, conductive pads, conductive springs, conductive springs, etc., and the material of the conductive component 5 includes, but is not limited to, metals such as stainless steel, spring steel, aluminum alloy, magnesium alloy, and titanium alloy, as well as non-metals such as graphite and graphene. The conductive component 5 may also be rubber doped with metal particles or graphite particles.

[0098] Since the conductive component 5 is located within the area surrounded by the sealing ring 6, the area occupied by the conductive component 5 in the XY plane affects the size of the sealing ring 6. Specifically, the smaller the area occupied by the conductive component 5 in the XY plane, the smaller the sealing ring 6, and the smaller the impact on the dimensions of the first component 3 and the second component 4 in the XY plane. Simultaneously, since the conductive component 5 is located between the first component 3 and the second component 4, the height of the conductive component 5 in the Z-axis direction affects the height of the sealing ring 6, and also affects the stacking thickness of the first component 3 and the second component 4. Specifically, the smaller the height of the conductive component 5 in the Z-axis direction, the smaller the height of the sealing ring 6, the lower the material cost and sealing difficulty, and the smaller the stacking thickness of the first component 3 and the second component 4, which is more conducive to the thinning of electronic devices.

[0099] In some embodiments, please continue reading Figure 8 and Figure 9 The conductive component 5 is a conductive spring. The conductive spring is small in size, which makes it easy to install between the first component 3 and the second component 4 in the limited space. At the same time, it is conducive to the thinning of electronic devices and avoids affecting the size of the first component 3 and the second component 4.

[0100] There are various structural forms of conductive spring contacts. For some embodiments, please refer to... Figure 8 The conductive spring includes a fixing part 51, a spring arm part 52, and a contact part 53.

[0101] The fixing part 51 is fixed to the first component 3 and electrically conductive. In some embodiments, the fixing part 51 may be fixed to the first component 3 and electrically conductive by spot welding, or it may be fixed to the first component 3 and electrically conductive by conductive adhesive. This application is illustrated by example of fixing the fixing part 51 to the first component 3 by spot welding and electrically conductive, which should not be considered as a special limitation of this application.

[0102] In some embodiments, please continue reading Figure 8 The first surface S1 is provided with a first groove C1, and at least the fixing part 51 of the conductive spring is housed in the first groove C1. In this way, under the premise that the gap height between the first component 3 and the second component 4 is constant, the height of the conductive spring in the Z-axis direction can be increased, thereby improving the structural strength and elasticity of the conductive spring.

[0103] Based on the above, the fixing part 51 is specifically fixed to the bottom surface of the first sink C1 by spot welding and is electrically connected to the first component 3.

[0104] In some embodiments, please continue reading Figure 8 The first settling groove C1 can be set in the area surrounded by the sealing ring 6 on the first surface S1. In this way, it can avoid the presence of a step difference at the position of the sealing ring 6 on the first surface S1, ensuring the sealing performance of the sealing ring 6 and preventing corrosion.

[0105] In some embodiments, the depth of the first groove C1 can be greater than or equal to 0.1 mm and less than or equal to 0.2 mm. Specifically, the depth of the first groove C1 can be 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, or 0.2 mm. When the depth of the first groove C1 is within this range, the depth of the first groove C1 is moderate, which can increase the height of the conductive spring in the Z-axis direction while avoiding affecting the structural strength of the first component 3.

[0106] The contact portion 53 is in contact with and electrically conductive with the second component 4. In some embodiments, the contact portion 53 may include a contact portion body and a first contact layer (not shown). The first contact layer is disposed on the surface of the contact portion body, and the conductivity of the first contact layer is greater than the conductivity of the contact portion body. The first contact layer is in contact with the second component 4.

[0107] In this way, the conductivity of the contact body and the second component 4 can be improved by using the first contact layer, and the impedance and passive intermodulation (PIM) characteristics can be reduced.

[0108] In the above embodiments, the material of the first contact layer includes, but is not limited to, at least one of gold, nickel, silver, and copper. In some embodiments, the material of the first contact layer is gold, which has high conductivity and can significantly improve the conductivity between the contact body and the second component 4, thereby reducing impedance and PIM characteristics.

[0109] The first contact layer can be formed on the surface of the contact body using processes such as electroplating, vacuum plating, or thermal spraying; this application does not specifically limit this.

[0110] Please continue reading. Figure 8 The spring arm portion 52 includes a first end portion 521 and a second end portion 522. The direction from the first end portion 521 to the second end portion 522 is inclined relative to the first surface S1. The direction from the first end portion 521 to the second end portion 522 is parallel to the first surface S1. Figure 8 The line i connecting the first end 521 and the second end 522. Specifically, the tilt angle of the direction from the first end 521 to the second end 522 relative to the first surface S1 can be greater than 0° and less than 90°, specifically 15°, 30°, 45°, 60°, 80°, etc., which is not specifically limited in this application.

[0111] It should be noted that, in the above embodiments and the following embodiments, the two opposing "ends" on a component refer to portions that are respectively adjacent to two opposing edges on the component, where one edge is located on the side of one end away from the other end, and the other edge is located on the side of the other end away from the first end. Therefore, the direction from one end to the other end refers to the direction from the midpoint of one edge to the midpoint of the other edge.

[0112] For examples, please refer to Figure 10 , Figure 10 for Figure 9 The diagram shows the structure of the conductive element 5. The spring arm portion 52 includes a sixth edge L6 and a first edge L1 opposite to each other; the sixth edge L6 is located on the side of the first end portion 521 away from the second end portion 522 and is adjacent to the first end portion 521; the first edge L1 is located on the side of the second end portion 522 away from the first end portion 521 and is adjacent to the second end portion 522. Based on this, the direction from the first end portion 521 to the second end portion 522 refers to the direction from the midpoint O1 of the sixth edge L6 to the midpoint O2 of the first edge L1. In the following embodiments, the same descriptions should be understood in the same way, and will not be repeated hereafter.

[0113] Based on the above, the first end 521 is connected to the fixing part 51 and is electrically conductive. The second end 522 is connected to the contact part 53 and is electrically conductive. Specifically, the second end 522 is connected to the contact part body of the contact part 53 and is electrically conductive.

[0114] In this way, during the installation of the conductive spring between the first component 3 and the second component 4, the spring arm 52 can bend and deform towards the first component 3, thereby accumulating elastic force. This elastic force allows the contact part 53 to stably abut against the second component 4, thus ensuring the reliability of the contact between the contact part 53 and the second component 4. Simultaneously, the conductive spring can adapt to installation between different gaps, and its small thickness allows for installation within gaps of limited height without affecting the thickness of the electronic device, thus contributing to the miniaturization of electronic devices.

[0115] Understandably, the size of the conductive spring affects the size of the first component 3 and the second component 4, as well as the thickness of the electronic device. Specifically, the larger the projected area of ​​the conductive spring in the XY plane, the larger the dimensions of the first component 3 and the second component 4 in the X-axis and Y-axis directions need to be designed. This is to ensure that the first component 3 and the second component 4 can shield the conductive spring, preventing it from being exposed, and also to facilitate a stable electrical connection between the first component 3 and the second component 4. The greater the height of the conductive spring in the Z-axis direction, the greater the stacking thickness of the first component 3, the conductive spring, and the second component 4 in the Z-axis direction, which is less conducive to the thinner design of the electronic device.

[0116] Therefore, in some embodiments, please refer to [the relevant documentation]. Figure 10 The fixing part 51 includes a third end 511 and a fourth end 512 opposite to each other. The direction from the third end 511 to the fourth end 512 is a first direction D1, which is parallel to the first surface S1. For an example, please refer to [reference needed]. Figure 10 The first direction, D1, is opposite to the Y-axis direction.

[0117] Based on the above, please continue to refer to... Figure 10 The first end 521 is connected to the fourth end 512 and is electrically conductive.

[0118] Please see Figure 11 , Figure 11 for Figure 10 The diagram shows the orthographic projection of the conductive element 5 onto the first surface S1. The orthographic projection of the first end 521 onto the first surface S1 is the first orthographic projection X1, and the orthographic projection of the second end 522 onto the first surface S1 is the second orthographic projection X2. The direction from the first orthographic projection X1 to the second orthographic projection X2 is the second direction D2, which is opposite to the first direction D1. Here, "opposite" does not mean absolutely opposite, but rather approximately opposite within a certain allowable error range.

[0119] In this way, the conductive spring is bent in the reverse direction at least once along the path from the third end 511 to the fourth end 512, then to the first end 521, and finally to the second end 522. This reduces the size of the conductive spring in the first direction D1 and prevents the first component 3 and the second component 4 from being designed to be too large in the first direction D1, thereby helping to reduce the size of the electronic device.

[0120] Based on the above embodiments, the direction parallel to the first surface S1 and perpendicular to the first direction D1 is defined as the third direction D3. The fixing part 51 and the spring arm part 52 can be arranged along the Z-axis direction or along the third direction D3. This application does not make specific limitations on this.

[0121] In some embodiments, please continue reading Figure 10 The fixing part 51 and the spring arm part 52 are arranged at intervals along the third direction D3.

[0122] In this way, the projection area of ​​the fixing part 51 on the first surface S1 and the projection area of ​​the spring arm part 52 on the first surface S1 do not overlap, which can avoid the thickness superposition of the fixing part 51 and the spring arm part 52 in the Z-axis direction. This is beneficial to reduce the height of the conductive spring in the Z-axis direction, thereby reducing the stacking thickness of the first component 3, the conductive spring and the second component 4 in the Z-axis direction, which is beneficial to the thin design of electronic devices.

[0123] In some embodiments, please continue reading Figure 10 The conductive spring also includes a connecting portion 54. The connecting portion 54 is located between the fourth end 512 and the first end 521, and is connected to and electrically conductive to both the fourth end 512 and the first end 521. Furthermore, the connecting portion 54 extends along the third direction D3 from the fourth end 512 to the first end 521.

[0124] In this way, the fourth end 512 and the first end 521 are aligned in the third direction D3, which can further reduce the size of the conductive spring in the first direction D1.

[0125] In some embodiments, please refer to the following: Figure 10 and Figure 11 The orthographic projection of the spring arm 52 onto the first surface S1 is the third projection X3, and the length of the third projection X3 in the first direction D1 is less than the length of the fixing part 51 in the first direction D1.

[0126] In this way, since the contact portion 53 is connected to the second end portion 522, and the fourth end portion 512 and the first end portion 521 are aligned in the third direction D3, the contact portion 53 is located at the middle position of the conductive spring in the first direction D1. The area surrounded by the sealing ring 6 on the second surface S2 is defined as the first region, thereby enabling the contact portion 53 to contact the middle position of the first region in the first direction D1, which can further ensure the reliability of the electrical connection.

[0127] Based on the above embodiments, the contact portion 53 may be disposed on the side of the second end portion 522 away from the first end portion 521, or it may be disposed on the second end portion 522, or it may be disposed on the side of the second end portion 522 facing the fixing portion 51, or it may be disposed on the side of the second end portion 522 away from the fixing portion 51.

[0128] In some embodiments, please refer to Figure 10 The edge of the second end 522 that is away from the first end 521 is the first edge L1, and the portion of the second end 522 where the first edge L1 is located forms the aforementioned contact portion 53. In this way, the structure of the conductive spring is simple and easy to manufacture.

[0129] Based on the above embodiments, optionally, please refer to... Figure 10 The edge of the second end 522 facing the fixing part 51 is the second edge L2, which is a flange protruding towards the fixing part 51. The edge of the second end 522 away from the fixing part 51 is the third edge L3, and the third edge L3 is connected to the first edge L1 by an arc transition edge or an inclined transition edge.

[0130] When a circular arc transition edge C connects the third edge L3 and the first edge L1, please refer to... Figure 10 The arc transition edge C protrudes away from the fixing part 51, and the arc transition edge C is tangent to both the first edge L1 and the third edge L3.

[0131] When there is an inclined transition edge connecting the third edge L3 and the first edge L1, one end of the inclined transition edge is connected to the third edge L3, and the other end extends away from the first end 521 and is inclined towards the fixing part 51, and the other end is connected to the first edge L1.

[0132] In this way, on the third direction D3, the contact portion 53 is closer to the fixing portion 51. That is, the contact portion 53 is located in the middle position of the conductive spring on the third direction D3, so that the contact portion 53 can make contact with the middle position of the first region on the third direction D3, which is beneficial to ensuring the stability and reliability of the electrical connection.

[0133] In some embodiments, please refer to Figure 10The fixing part 51 has a first clearance notch a1 on the edge facing the spring arm part 52. When the spring arm part 52 bends toward the first component 3 to be coplanar with the fixing part 51, the first clearance notch a1 is opposite to the second edge L2 along the third direction D3.

[0134] In this way, the first clearance notch a1 can provide clearance for a portion of the second end 522 at the second edge L2, preventing the spring arm 52 from overlapping with the fixing part 51 in the Z-axis direction when it bends to be coplanar with the fixing part 51, which helps to further reduce the thickness of the conductive spring sheet. At the same time, the first clearance notch a1 can provide clearance for the spring arm 522, which can reduce the distance between the spring arm 52 and the fixing part 51 in the third direction D3, and reduce the size of the conductive spring sheet in the third direction D3.

[0135] It is known that the elastic force of the conductive spring is generated by the deformation of the spring arm 52. Please refer to [further details]. Figure 10 The portion of the spring arm 52 located between the first end 521 and the second end 522 is defined as the middle portion 523. The structural strength of the spring arm 52 is determined by the width W at the junction between the first end 521 and the middle portion 523. The larger the width W, the higher the structural strength of the spring arm 522, the less easily it is deformed, and the greater the elastic force generated after deformation.

[0136] Therefore, in some embodiments, please refer to [the relevant documentation]. Figure 10 The spring arm portion 52 also includes an intermediate section 5231. The intermediate section 5231 is connected between the first end portion 521 and the second end portion 522.

[0137] The intermediate segment 5231 can be a segment of the intermediate part 523 or the entire intermediate part 523. This application uses the intermediate segment 5231 as a segment of the intermediate part 523 as an example for illustration.

[0138] Please continue reading. Figure 10 The edge of the intermediate segment 5231 facing the fixing part 51 is defined as the fourth edge L4, and the edge of the connecting part 54 facing the gap between the intermediate segment 5231 and the fixing part 51 is defined as the fifth edge L5. The fourth edge L4 and the fifth edge L5 are connected, and the fourth edge L4 is inclined towards the fixing part 51 in the direction from the second end 522 to the first end 521.

[0139] In this way, the width W at the junction between the first end 521 and the middle part 523 is larger, the structural strength of the spring arm part 52 is higher, and the elastic force is greater, which enables the contact part 53 to reliably contact the second component 4.

[0140] Based on the above embodiments, please continue to refer to Figure 10The fixing part 51 has a second clearance notch a2 on the edge facing the spring arm part 52. When the spring arm part 52 bends toward the first part 3 to be coplanar with the fixing part 51, the second clearance notch a2 is opposite to the fourth edge L4 along the third direction D3.

[0141] In this way, the second clearance notch a2 can provide clearance for a portion of the middle section 5231 at the fourth edge L4, preventing thickness overlap between the spring arm 52 and the fixing part 51 in the Z-axis direction when the spring arm 52 bends to be coplanar with the fixing part 51, which helps to further reduce the thickness of the conductive spring sheet. At the same time, the second clearance notch a2 can provide clearance for a portion of the middle section 5231 at the fourth edge L4, which can reduce the distance between the spring arm 52 and the fixing part 51 in the third direction D3, and reduce the size of the conductive spring sheet in the third direction D3.

[0142] In some embodiments, please refer to Figure 10 The fixing part 51, the connecting part 54, the elastic arm part 52 and the contact part body can be integrally formed or welded together. This application is illustrated by way of example, which is that the fixing part 51, the connecting part 54, the elastic arm part 52 and the contact part body are integrally formed. This should not be regarded as a special limitation on this application.

[0143] In some embodiments, please refer to the following: Figure 8 and Figure 10 The first end portion 521 of the fixing part 51, the connecting part 54, and the elastic arm part 52 can be accommodated in the first sink C1, and the fixing part 51 is fixed to the bottom surface of the first sink C1. This structure is simple and easy to implement.

[0144] Based on any of the above embodiments, the second component 4 can be a single structural component or can be assembled from multiple structural components. This application does not make any specific limitation in this regard.

[0145] In some embodiments, please refer back to the reference. Figure 8 The second component 4 may include a component body 41 and a contact 42. The contact 42 is fixed to the component body 41 and electrically conductive, and the contact portion 53 is in contact with the contact 42.

[0146] Thus, the second component 4 is formed by assembling the component body 41 and the contact 42. The component body 41 and the contact 42 can be made of different materials. For example, the component body 41 can be made of a material with high structural strength and low cost (such as stainless steel), and the contact 42 can be made of a material with a higher conductivity than the component body 41, thereby balancing manufacturing cost and conductivity efficiency.

[0147] In the above embodiments, the contact member 42 may be recessed within the component body 41 or protrude from the surface of the component body 41. In some embodiments, please continue reading. Figure 8 The surface of the component body 41 facing the first component 3 is provided with a second recess C2. The contact member 42 is accommodated in the second recess C2.

[0148] In this way, the contact 42 is recessed within the component body 41, which avoids thickness overlap between the component body 41 and the contact 42, thus facilitating the reduction of the thickness of the electronic device. Simultaneously, the contact 42 can contact not only the bottom surface of the second recessed groove C2 but also its side surface, resulting in a larger contact area between the contact 42 and the component body 41, thereby improving the conductivity between them.

[0149] In some embodiments, the contact element 42 can be fixed to the bottom surface of the second settling tank C2 using processes such as spot welding or conductive adhesive bonding. This connection method is simple and easy to operate.

[0150] In the above embodiment, the surface of the component body 41 facing the first component 3 and the surface of the contact member 42 facing the first component 3 are joined to form the second surface S2. Based on this, the second groove C2 is disposed in the area of ​​the second surface S2 surrounded by the sealing ring 6. This avoids any step difference at the position of the sealing ring 6 on the second surface S2, ensuring the sealing performance of the sealing ring 6 and preventing corrosion.

[0151] In some embodiments, please refer to Figure 8 The depth of the second recess C2 is greater than or equal to 0.1 mm and less than or equal to 0.2 mm. Specifically, the depth of the second recess C2 can be 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, or 0.2 mm. When the depth of the second recess C2 is within this range, the depth of the second recess C2 is moderate, which can facilitate the thinning of electronic devices while avoiding affecting the structural strength of the component body 41.

[0152] In some embodiments, please refer to Figure 8 The thickness of the contact element 42 can be greater than or equal to 0.05 mm and less than or equal to 0.15 mm. In this way, the thickness of the contact element 42 is moderate, which can ensure the structural strength of the contact element 42, and at the same time, it can be embedded in the second sink C2.

[0153] In some embodiments, the contact element 42 may be made of the same material or multiple materials. For further details on some embodiments, please refer to [link / reference needed]. Figure 8The contact 42 may include a contact body 421 and a second contact layer 422. The second contact layer 422 is at least disposed on the surface of the contact body 421 facing the first component 3, and the conductivity of the second contact layer 422 is greater than the conductivity of the contact body 421. Based on this, the second end 522 contacts and is electrically connected to the second contact layer 422. In this way, the conductivity efficiency between the contact body and the second component 4 can be improved, and the impedance and PIM characteristics can be reduced by using the second contact layer 422.

[0154] The material of the contact body 421 includes, but is not limited to, copper, copper alloy, aluminum alloy, magnesium alloy, etc. In some embodiments, the conductivity of the contact body 421 is greater than that of the component body 41. This can improve the conductivity efficiency from the contact body 421 to the component body 41, and reduce impedance and PIM characteristics.

[0155] The material of the second contact layer 422 includes, but is not limited to, at least one of gold, nickel, silver, and copper. In some embodiments, the second contact layer 422 is made of gold, which has high conductivity and can significantly improve the conductivity between the conductive element 5 and the second component 4, thereby reducing impedance and PIM characteristics.

[0156] The second contact layer 422 may be disposed only on the surface of the contact body 421 facing the first component 3, and not on other surfaces of the contact body 421. Alternatively, the second contact layer 422 may be disposed on all surfaces of the contact body 421, or on at least two surfaces including the surface facing the first component 3. This application does not specifically limit this. This application uses the example of the second contact layer 422 being disposed only on the surface of the contact body 421 facing the first component 3, which should not be considered as a special limitation of this application.

[0157] The first component 3 and the second component 4 are fixedly connected. In some embodiments, please refer back to the previous section. Figure 7 The electronic device 10 also includes at least one fastener 7. "At least one" means one or more. At least one fastener 7 is connected between the first component 3 and the second component 4. The first component 3 is fixedly connected to the second component 4 by means of the at least one fastener 7.

[0158] Based on the above, optionally, at least one fastener 7 is located on the side of the sealing ring 6 opposite to the conductive element 5.

[0159] In this way, the conductive component 5 and the sealing ring 6 are not restricted by the position of the fixing component 7. The conductive component 5 and the sealing ring 6 can be set in a space with ample space, avoiding any impact on the size of the second component 4 and the connection stability between the first component 3 and the second component 4.

[0160] In the above embodiments, the number of fasteners 7 can be one or more. See also the following for some embodiments. Figure 7 There are multiple fasteners 7, which are connected between the edge of the second component 4 and the first component 3. The conductive element 5 and the sealing ring 6 are located on the side of the multiple fasteners 7 facing the center of the second component 4.

[0161] In this way, the spacing between the multiple fixing parts 7 is relatively large. When the rotating shaft mechanism 23 rotates, the resistance arm of the multiple fixing parts 7 is large, and the resulting resistance torque is large, which can effectively prevent the second component 4 from separating from the first component 3 and ensure the connection stability between the second component 4 and the first component 3. At the same time, since the conductive part 5 and the sealing ring 6 are located on the side of the multiple fixing parts 7 facing the center of the second component 4, the conductive part 5 and the sealing ring 6 can avoid affecting the size of the second component 4 and the connection stability between the first component 3 and the second component 4.

[0162] In any of the above embodiments, the fastener 7 includes, but is not limited to, screws, bolts, rivets, and clips. This application uses a screw as an example to illustrate the fastener 7. When the fastener 7 is a screw, the connection stability and reliability between the first component 3 and the second component 4 are superior. Furthermore, the threaded surface of the screw may be provided with an insulating coating, which can prevent the first component 3 and the second component 4 from being electrically connected together by the screw.

[0163] For details, please refer to Figure 12 , Figure 12 for Figure 8 The enlarged view of the electronic device 10 in region II shows that the first component 3 has a threaded hole h1, and the second component 4 has a first through hole h2, which is opposite to the threaded hole h1. An insulating material 8 is provided between the first component 3 and the second component 4. The insulating material 8 is made of materials including, but not limited to, Mylar, rubber, and silicone. The insulating material 8 has a clearance hole h3, which is opposite to and communicates with the first through hole h2 and the threaded hole h1.

[0164] The screw 7 includes a head and a shank. The head is located on the side of the second component 4 opposite to the first component 3, and the shank is accommodated in the first through hole h2, the clearance hole h3 and the threaded hole h1.

[0165] In this way, by using the insulating material 8, direct contact between the second component 4 and the first component 3 at the location of the fixing member 7 can be avoided, thus preventing corrosion.

[0166] In some embodiments, please continue reading Figure 12The thickness of the insulating material 8 can be greater than or equal to 0.03 mm and less than or equal to 0.1 mm. When the thickness of the insulating material 8 is within this range, the insulation performance can be guaranteed, effectively preventing contact between the first component 3 and the second component 4 at the fixing part 7. At the same time, it can avoid increasing the stacking thickness of the insulating material 8, which is beneficial to the thinning of the electronic device 10.

[0167] In some embodiments, please continue reading Figure 12 A boss 43 is provided between the first component 3 and the second component 4. The boss 43 is connected to one of the first component 3 and the second component 4, and the insulating material 8 is disposed between the other of the first component 3 and the second component 4 and the boss 43.

[0168] For an example, please refer to Figure 12 The boss 43 can be connected to the second component 4. The boss 43 can be integrally formed with the component body 41 of the second component 4, or it can be connected to the component body 41 by means of adhesive, welding or other methods. This application does not make specific limitations in this regard. The insulating material 8 is disposed between the first component 3 and the boss 43.

[0169] In other examples, the boss 43 can be connected to the first component 3. The boss 43 can be integrally formed with the first component 3, or it can be connected to the first component 3 by means of adhesive, welding, etc. This application does not make specific limitations in this regard. The insulating material 8 is disposed between the second component 4 and the boss 43.

[0170] Based on any of the above embodiments, the boss 43 is provided with a second through hole h4, which is opposite to and communicates with the first through hole h2, the clearance hole h3, and the threaded hole h1. The shank of the screw 7 is accommodated in the first through hole h2, the second through hole h4, the clearance hole h3, and the threaded hole h1.

[0171] In this way, the boss 43 can increase the gap height between the first component 3 and the second component 4, preventing other areas of the first surface S1 from contacting other areas of the second surface S2, thereby reducing the risk of corrosion. In addition, the boss 43 can prevent the flatness of the first surface S1 and the second surface S2 from affecting the connection reliability between the first component 3 and the second component 4.

[0172] In some embodiments, please refer to Figure 12 The height of the boss 4 can be greater than or equal to 0.03 mm and less than or equal to 0.2 mm. When the height of the boss 4 is within this range, the gap between the first component 3 and the second component 4 is moderate. On the one hand, the stacking thickness of the first component 3 and the second component 4 is moderate, which is conducive to the thinning of the electronic device 10. On the other hand, it can effectively prevent other areas of the first surface S1 from contacting other areas of the second surface S2, reducing the risk of corrosion.

[0173] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0174] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes: A first component and a second component, wherein the first component includes a hole for receiving a fixing member, the fixing member being used to fix the second component to the first component; the second component includes a component body and a contact member that are fixedly connected and electrically conductive, the contact member including a contact member body and a second contact layer that are fixedly connected and electrically conductive, the conductivity of the second contact layer being greater than the conductivity of the contact member body, and the conductivity of the contact member body being greater than the conductivity of the component body. A conductive element is located between the first component and the second component and in contact with the second contact layer, and is used to conduct electricity with the first component and the second contact layer; the surface of the first component facing the second component is a first surface, and a first groove is provided on the first surface, and the conductive element is partially housed in the first groove; A sealing ring is located between the first component and the second component, with one axial end of the sealing ring facing the first component and the other end facing the second component; a conductive element is located within the area surrounded by the sealing ring; and a hole is located on the side of the sealing ring opposite to the conductive element. A boss is located between the first component and the second component. The boss is connected to the first component. A second through hole is provided in the boss. The second through hole is used to accommodate a fixing member. The second through hole is opposite to and communicates with the hole. An insulating material is located at the position of the fastener between the boss and the second component.

2. The electronic device according to claim 1, characterized in that, The conductive element is a conductive spring.

3. The electronic device according to claim 2, characterized in that, The conductive spring includes a fixing part, a spring arm part, and a contact part; The fixing part is fixed to the first component and is electrically conductive, and the contact part is in contact with the second contact layer and is electrically conductive; The surface of the first component facing the conductive spring is the first surface. The spring arm includes a first end and a second end opposite to each other. The direction from the first end to the second end is inclined relative to the first surface. The first end is connected to the fixing part and is electrically conductive, and the second end is connected to the contact part and is electrically conductive.

4. The electronic device according to claim 3, characterized in that, The fixing part includes a third end and a fourth end opposite to each other, and the direction from the third end to the fourth end is a first direction, which is parallel to the first surface; The first end is connected to the fourth end and is electrically conductive. The orthographic projection of the first end onto the first surface is the first projection, and the orthographic projection of the second end onto the first surface is the second projection. The direction from the first projection to the second projection is the second direction, which is opposite to the first direction.

5. The electronic device according to claim 4, characterized in that, The fixing part and the elastic arm part are arranged at intervals along a third direction; Wherein, the third direction is parallel to the first surface, and the third direction is perpendicular to the first direction.

6. The electronic device according to claim 5, characterized in that, The conductive spring also includes a connecting portion; The connecting part is located between the fourth end and the first end, and the connecting part is connected to both the fourth end and the first end and is electrically conductive; The connecting portion extends along the third direction from the fourth end to the first end.

7. The electronic device according to claim 6, characterized in that, The orthographic projection of the elastic arm portion onto the first surface is a third projection, and the length of the third projection in the first direction is less than the length of the fixing portion in the first direction.

8. The electronic device according to claim 7, characterized in that, The edge of the second end that is away from the first end is the first edge, and the portion of the second end where the first edge is located forms the contact portion.

9. The electronic device according to claim 8, characterized in that, The edge of the second end away from the fixing part is the third edge, and the third edge is connected to the first edge by an arc transition edge or an inclined transition edge.

10. The electronic device according to claim 7, characterized in that, The edge of the second end facing the fixing part is a second edge, which is a flange protruding towards the fixing part; the edge of the fixing part facing the spring arm part is provided with a first clearance notch; When the spring arm bends toward the first component to be coplanar with the fixing part, along the third direction, the first clearance notch is opposite to the second edge.

11. The electronic device according to any one of claims 6-10, characterized in that, The spring arm also includes an intermediate section, which connects the first end and the second end; The edge of the middle section facing the fixing part is the fourth edge, and the edge of the connecting part facing the gap between the middle section and the fixing part is the fifth edge; The fourth edge is connected to the fifth edge, and along the direction from the second end to the first end, the fourth edge is inclined toward the fixing part.

12. The electronic device according to claim 11, characterized in that, The fixing part has a second clearance notch at the edge facing the elastic arm part; When the spring arm bends toward the first component to be coplanar with the fixing part, along the third direction, the second clearance notch is opposite to the fourth edge.

13. The electronic device according to any one of claims 3-10, characterized in that, The contact portion includes a contact portion body and a first contact layer; The second end is connected to the contact body and is electrically conductive; the first contact layer is located on the surface of the contact body, and the conductivity of the first contact layer is greater than the conductivity of the contact body; The first contact layer is in contact with the second contact layer.

14. The electronic device according to claim 13, characterized in that, The material of the first contact layer includes at least one of gold, nickel, silver and copper.

15. The electronic device according to any one of claims 1-14, characterized in that, The surface of the second component facing the first component is the second surface; The sealing ring is located between the first surface and the second surface.

16. The electronic device according to claim 3, characterized in that, At least the fixing part of the conductive spring is housed in the first sink groove.

17. The electronic device according to any one of claims 1-16, characterized in that, The fastener is a screw.

18. The electronic device according to claim 17, characterized in that, The hole is a threaded hole, which is used to be opposite to the first through hole of the second component when the second component is fixedly connected to the first component; The insulating material is provided with clearance holes, which are opposite to and communicate with the threaded holes; The screw includes a head and a shank, the head being located on the side of the second component opposite to the first component, and the shank being received within the first through hole, the clearance hole, and the threaded hole.

19. The electronic device according to claim 18, characterized in that, The second through hole is opposite to and communicates with the clearance hole and the threaded hole; The rod portion is housed within the first through hole, the second through hole, the clearance hole, and the threaded hole.

20. The electronic device according to any one of claims 1-19, characterized in that, The number of fasteners is multiple, and the multiple fasteners are used to connect the edge of the second component and the first component; The conductive element and the sealing ring are located on one side of the plurality of fixing elements facing the center of the second component.

21. The electronic device according to any one of claims 1-20, characterized in that, At least one of the first component and the second component is made of magnesium alloy.

22. The electronic device according to any one of claims 1-21, characterized in that, The first component is the middle frame, and the second component is the connecting part on the rotating shaft mechanism; The rotating shaft mechanism includes a base, a swing arm, and a connector. The swing arm is rotatably connected to the base, and the connector is connected to the end of the swing arm away from the base. The connector is used to fix the swing arm to the middle frame by means of the fastener.

23. The electronic device according to any one of claims 1-22, characterized in that, The electronic device is a foldable screen device.

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