Embedded PCBA (Printed Circuit Board Assembly) high-voltage power module, controller and electric automobile

Abstract

The invention relates to the technical field of high-voltage power modules, particularly provides an embedded PCBA (Printed Circuit Board Assembly) high-voltage power module, a controller and an electric vehicle, and aims to solve the problems of large overall space size, low integration degree and low power density of the existing high-voltage power module. In order to achieve the purpose, the embedded PCBA high-voltage power module comprises a self-sealing radiator assembly, an embedded power PCBA module, a direct current input terminal, an alternating current output terminal and a signal connecting terminal, the self-sealing radiator assembly is connected into an integrated structure, and the embedded power PCBA module is connected to the self-sealing radiator assembly. The self-sealing radiator assemblies are connected into an integrated structure, and compared with a traditional assembly type heat dissipation water way, the size and the space are greatly reduced; the embedded power PCBA module can be better integrated, and the size of the embedded power PCBA module can be small, so that high power density is obtained. Therefore, the invention has the advantages of small size, small space, high integration level and high power density.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and specifically provides an embedded PCBA high-voltage power module, a controller and an electric vehicle. Background Art

[0002] An electric vehicle is a vehicle that uses electricity as its power source, uses an electric motor to drive its wheels, and complies with all requirements of road traffic and safety regulations.

[0003] At present, the high-voltage power module in the motor controller of the electric drive system of electric vehicles is composed of a power module, a heat dissipation channel, a DC input terminal, an AC output terminal, and a signal interface. Among them, the power module is mostly a traditional plastic-encapsulated full-bridge or plastic-encapsulated half-bridge with a heat dissipation substrate. The heat dissipation channel is mostly assembled and consists of a water-cooled plate, a heat dissipation substrate of the plastic-encapsulated module, a sealing ring, bolts, etc. This structural form has the problems of large overall space size, low degree of integration, and low power density. Especially in the use of 800V systems, this problem is more prominent under higher requirements for electrical insulation.

[0004] Therefore, it is urgent to develop an embedded PCBA (full name: Printed Circuit Board Assembly; Chinese translation: printed circuit board assembly) high-voltage power module, controller and electric vehicle to solve the above problems. Summary of the invention

[0005] The present invention aims to solve the above technical problems, that is, to solve the problems of large overall space size, low degree of integration and low power density of existing high-voltage power modules.

[0006] In the face of the above problems, the inventors found that the embedded power PCBA module is a new component formed by embedding the chip into the PCB. At present, it is mainly used in low-voltage products, but in the past year, the application trend of low-voltage embedded power PCBA to high-voltage power electronics has become more and more obvious. However, there are few studies and reports on its application structure, heat dissipation, interface, etc. in high-voltage power.

[0007] Therefore, the present invention focuses on the pain points of the high-voltage power module unit of the motor controller in the current electric drive system and the lack of application of embedded power PCBA in high-voltage power, and creatively proposes a set of solutions that organically combine the two, providing new ideas and methods for the high integration, flexibility, platformization and high power density of the high-voltage power module unit.

[0008] In a first aspect, the present invention provides an embedded PCBA high-voltage power module, which includes: a self-sealing heat sink assembly connected into an integrated structure; an embedded power PCBA module connected to the self-sealing heat sink assembly; and a DC input terminal, an AC output terminal, and a signal connection terminal connected to the embedded power PCBA module.

[0009] In the preferred technical solution of the above-mentioned embedded PCBA high-voltage power module, the self-sealing radiator assembly includes: a self-sealing radiator having a first surface and a second surface arranged opposite to each other; an inlet and outlet water pipe connected to the first surface of the self-sealing radiator; a frame connected to the second surface of the self-sealing radiator; wherein the frame and the second surface of the self-sealing radiator form a cavity to install the embedded power PCBA module.

[0010] In the preferred technical solution of the above-mentioned embedded PCBA high-voltage power module, an insulating material is arranged in the cavity to achieve electrical insulation of the embedded power PCBA module.

[0011] In the preferred technical solution of the above-mentioned embedded PCBA high-voltage power module, a protrusion is provided in the area of ​​the self-sealing heat sink assembly corresponding to the connection with the embedded power PCBA module.

[0012] In the preferred technical solution of the above-mentioned embedded PCBA high-voltage power module, the DC input terminal is a DC input flexible terminal, and / or the AC output terminal is an AC output flexible terminal.

[0013] In the preferred technical solution of the above-mentioned embedded PCBA high-voltage power module, the embedded power PCBA module is provided with a plurality of jacks, and the signal connection terminal is inserted into different jacks of the plurality of jacks to achieve flexible installation of the signal connection terminal.

[0014] In the preferred technical solution of the above-mentioned embedded PCBA high-voltage power module, the embedded PCBA high-voltage power module also includes a shielding plate, which is located above the embedded power PCBA module and fixedly connected to the self-sealing heat sink assembly.

[0015] In the preferred technical solution of the above-mentioned embedded PCBA high-voltage power module, the embedded PCBA high-voltage power module also includes an insulating layer, which is arranged between the shielding plate and the embedded power PCBA module, and the DC input terminal, the AC output terminal and the signal connection terminal are configured to pass through the insulating layer and be exposed by the shielding plate.

[0016] In a second aspect, the present invention further provides a controller, the controller comprising the above-mentioned embedded PCBA high-voltage power module, the controller further comprising a mainboard, the mainboard being connected to the embedded PCBA high-voltage power module.

[0017] In a third aspect, the present invention further provides an electric vehicle, comprising the above-mentioned controller.

[0018] In the case of adopting the above technical solution, the embedded PCBA high-voltage power module, controller and electric vehicle of the present invention, the embedded PCBA high-voltage power module includes a self-sealing radiator assembly, an embedded power PCBA module, a DC input terminal, an AC output terminal and a signal connection terminal. The self-sealing radiator assembly is connected into an integrated structure. Compared with the traditional assembled heat dissipation water path, the size and space are greatly reduced; the embedded power PCBA module can be better integrated and the size can be made small, so as to obtain high power density. Therefore, the present invention has the advantages of small size, small space, high integration and high power density. It is particularly suitable for 800V high voltage system.

[0019] In addition, the DC input flexible terminal and the AC output flexible terminal are used to make the DC input terminal and the AC output terminal flexible, so that they can adapt to input components and output components of different heights.

[0020] In addition, by providing multiple jacks in the embedded power PCBA module, the signal connection terminals can be inserted into different jacks of the multiple jacks to match the different position requirements of the motherboard, and the signal connection terminals can be flexibly moved, making the embedded power PCBA module easier to platformize.

[0021] In addition, the shielding plate is fixedly connected to the self-sealing heat sink assembly, so that the shielding plate is grounded through the self-sealing heat sink assembly, and the embedded power PCBA module is electromagnetically shielded. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, in which:

[0023] Figure 1 is a schematic perspective view of an embodiment of an embedded PCBA high-voltage power module of the present invention;

[0024] Figure 2 yes Figure 1 Schematic parts exploded view of embedded PCBA high voltage power module;

[0025] Figure 3 yes Figure 1 A schematic cross-sectional view of the connection position between the shielding plate and the frame;

[0026] Figure 4yes Figure 1 Schematic connection diagram of embedded PCBA high voltage power module and mainboard;

[0027] Figure 5 yes Figure 4 Schematic cross-sectional view of the connection position between the embedded PCBA high-voltage power module and the mainboard.

[0028] The symbols in the figure mean the following:

[0029] 100 embedded PCBA high voltage power modules,

[0030] 101 water inlet and outlet pipes, 102 self-sealing radiator, 103 frame, 104 shielding plate, 105 AC output terminal, 106 DC input terminal, 107 signal connection terminal, 108 embedded power PCBA module, 109 insulation layer, 110 first protrusion, 111 installation interface, 112 second protrusion, 113 hole, 114 first connection structure, 115 third protrusion, 116 mainboard, 117 second connection structure, 118 jack,

[0031] A Self-sealing radiator assembly. DETAILED DESCRIPTION

[0032] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0033] It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0034] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] An electric vehicle is a vehicle that uses electricity as its power source, uses an electric motor to drive its wheels, and complies with all requirements of road traffic and safety regulations.

[0036] At present, the high-voltage power module in the motor controller of the electric drive system on board electric vehicles is composed of a power module, a heat dissipation channel, a DC input terminal, an AC output terminal, and a signal interface. Among them, the power modules are mostly traditional plastic-encapsulated full-bridge or plastic-encapsulated half-bridge with a heat dissipation substrate. The heat dissipation channel is mostly in an assembled form and consists of a water-cooled plate, a heat dissipation substrate of a plastic-encapsulated module, a sealing ring, bolts, etc. This structural form has the problems of large overall space size, low degree of integration, and low power density. Especially in the use of 800V systems, this problem is more prominent under higher requirements for electrical insulation. The positions of the DC input terminals, AC output terminals, and signal terminals are fixed relative to the power module package, which reduces flexibility, compatibility, and platformization. In addition, the traditional power module does not consider the shielding of the power module itself against external electromagnetic radiation, leaving the problem to the application end of the module.

[0037] In the face of the above problems, the inventors found that the embedded power PCBA module is a new component formed by embedding the chip into the PCB. At present, it is mainly used in low-voltage products. In the past year, the application trend of low-voltage embedded power PCBA to high-voltage power electronics has become more and more obvious. However, there are few studies and reports on its application structure, heat dissipation, interface, etc. in high-voltage power.

[0038] Therefore, the present invention focuses on the pain points of the high-voltage power module unit of the motor controller in the current electric drive system and the lack of application of embedded power PCBA in high-voltage power, and creatively proposes a set of solutions that organically combine the two, providing new ideas and methods for the high integration, flexibility, platformization and high power density of the high-voltage power module unit.

[0039] Figure 1 is a schematic perspective view of an embodiment of an embedded PCBA high-voltage power module of the present invention, Figure 1 The overall structure of the embedded PCBA high-voltage power module is shown. Figure 2 yes Figure 1 Schematic parts breakdown diagram of embedded PCBA high voltage power module. Figure 2 The components of the embedded PCBA high-voltage power module are shown. Figure 3 yes Figure 1 A schematic cross-sectional view of the connection position between the shielding plate and the frame, Figure 3 A first connection structure between the shielding plate and the frame is shown. Figure 4 yes Figure 1 Schematic connection diagram of the embedded PCBA high-voltage power module and the mainboard. Figure 5 yes Figure 4 Schematic cross-sectional view of the connection position between the embedded PCBA high-voltage power module and the mainboard.

[0040] like Figure 1 See also Figure 2-Figure 5 In order to solve the problems of large overall space size, low integration and low power density of the existing high-voltage power module, the present invention provides an embedded PCBA high-voltage power module 100. The embedded PCBA high-voltage power module 100 generally includes: a self-sealing heat sink assembly A (refer to Figure 2 ), embedded power PCBA module 108, DC input terminal 106, AC output terminal 105 and signal connection terminal 107. The self-sealed heat sink assembly A is connected into an integrated structure. The embedded power PCBA module 108 is connected to the self-sealed heat sink assembly A. The embedded power PCBA module 108 is a high-voltage power module that embeds a chip in a PCB. More specifically, the embedded power PCBA module 108 is connected to the self-sealed heat sink assembly A by welding or sintering. The DC input terminal 106, the AC output terminal 105 and the signal connection terminal 107 are all connected to the embedded power PCBA module 108. More specifically, the DC input terminal 106, the AC output terminal 105 and the signal connection terminal 107 are all connected to the embedded power PCBA module 108 by welding. The DC input terminal 106 and the AC output terminal 105 provide input and output current-carrying terminals to the outside, and the signal connection terminal 107 provides an interface for signal connection with the mainboard 116. More specifically, the embedded PCBA high-voltage power module 100 further includes a first protrusion 110, which serves to fix the mainboard 116 (see Figure 4) acts on the embedded PCBA high-voltage power module 100. The embedded PCBA high-voltage power module 100 also includes an installation interface 111, which can be a circular hole or a hole of other shapes. The installation interface 111 provides a fixed installation interface for the entire embedded PCBA high-voltage power module 100. In this embodiment, the number of DC input terminals 106 is six and connected to the first end of the embedded power PCBA module 108, the number of AC output terminals 105 is three and connected to the second end of the embedded power PCBA module 108, and the number of signal connection terminals 107 is six and connected to the embedded power PCBA module 108. Of course, in other embodiments, the number of DC input terminals 106, AC output terminals 105 and signal connection terminals 107 can also be other numbers, depending on the requirements of the embedded PCBA high-voltage power module 100. The number of first protrusions 110 is six and is set at the first end and the second end of the self-sealing heat sink assembly A, and the number of installation interfaces 111 is six and is set at the first end and the second end of the self-sealing heat sink assembly A. Of course, in other implementations, the number of the first protrusions 110 and the mounting interfaces 111 may be other numbers, depending on the requirements of the embedded PCBA high-voltage power module 100 .

[0041] In the case of adopting the above technical solution, the embedded PCBA high-voltage power module 100 of the present invention includes a self-sealed heat sink assembly A, an embedded power PCBA module 108, a DC input terminal 106, an AC output terminal 105 and a signal connection terminal 107. The self-sealed heat sink assembly A is connected into an integrated structure, and the size and space are greatly reduced compared to the traditional assembled heat dissipation water path; the embedded power PCBA module 108 can be better integrated and the size can also be made small, thereby obtaining a high power density. Therefore, the present invention has the advantages of small size, small space, high integration and high power density. It is particularly suitable for 800V high voltage systems. As a possible implementation, Figure 2 As shown, the self-sealing radiator assembly A generally includes: a self-sealing radiator 102, an inlet and outlet pipe 101, and a frame 103. The self-sealing radiator 102 has a first surface and a second surface that are arranged opposite to each other. The self-sealing radiator 102 itself has a complete heat dissipation water channel and is a whole unit, which does not need to be assembled later. The inlet and outlet pipe 101 is connected to the first surface of the self-sealing radiator 102, for example Figure 2 More specifically, in this embodiment, the number of the inlet and outlet water pipes 101 is two and they are correspondingly arranged on both sides of the first surface of the self-sealing radiator 102. The inlet and outlet water pipes 101 provide an external interface for the heat dissipation water path for the embedded PCBA high-voltage power module 100. The frame 103 is connected to the second surface of the self-sealing radiator 102, for example Figure 2The upper surface of the self-sealing heat sink 102 is formed by the frame 103 and the second surface of the self-sealing heat sink 102. The frame 103 and the second surface of the self-sealing heat sink 102 form a cavity to install the embedded power PCBA module 108. In specific implementation, the inlet and outlet water pipes 101, the self-sealing heat sink 102 and the frame 103 can be connected into a whole by brazing. Compared with the traditional assembled heat dissipation water channel, the size and space are greatly reduced, and the risk of coolant leakage is low. Of course, in other embodiments, the self-sealing radiator assembly A may also include: a self-sealing radiator 102 and an inlet and outlet water pipe 101. The self-sealing radiator assembly A may also be in other forms, as long as it can meet the functions of the embedded PCBA high-voltage power module 100, and can be flexibly configured according to requirements.

[0042] As a possible implementation, Figure 2 As shown, an insulating material is arranged in the cavity to achieve electrical insulation of the embedded power PCBA module 108. The insulating material arranged in the cavity may be an insulating gel encapsulated in the cavity. Of course, in other embodiments, other insulating materials may be arranged by common means.

[0043] In a specific implementation, under an 800V high voltage system, the embedded power PCBA module 108 in the cavity can be encapsulated with insulating gel, thereby solving the electrical insulation problem of the components on the embedded power PCBA module 108 and the surrounding metal.

[0044] As a possible implementation, Figure 2 As shown, a protrusion, namely a third protrusion 115, is provided in the area of ​​the self-sealing heat sink assembly A corresponding to the connection of the embedded power PCBA module 108. More specifically, the third protrusion 115 is provided on the self-sealing heat sink 102. The third protrusion 115 provides a complete plane for the connection process between the embedded power PCBA module 108 and the self-sealing heat sink 102, thereby ensuring the connection reliability between the embedded power PCBA and the self-sealing heat sink 102. In addition, the third protrusion 115 also allows enough gap between the embedded power PCBA module 108 and the bottom of the self-sealing heat sink 102 to allow the insulating gel to flow in, thereby ensuring electrical insulation.

[0045] In the process of implementing the present invention, the inventors also found that the positions of the DC input terminal 106 and the AC output terminal 105 in the prior art are fixed relative to the power module package, which reduces the flexibility.

[0046] As a possible implementation method, in order to solve the above problems, Figure 2As shown, the DC input terminal 106 is a DC input flexible terminal, and / or the AC output terminal 105 is an AC output flexible terminal. The DC input flexible terminal and the AC output flexible terminal are both existing flexible terminals, and the specific structures of the DC input flexible terminal and the AC output flexible terminal are not described in detail in this embodiment.

[0047] In the above embodiment, the DC input flexible terminal and the AC output flexible terminal are used to make the DC input terminal 106 and the AC output terminal 105 flexible, providing an external electrical connection interface, so as to adapt to input components and output components of different heights.

[0048] In the process of implementing the present invention, the inventors also found that the positions of the signal terminals in the prior art are fixed relative to the power module package, resulting in poor compatibility and reduced platformization.

[0049] As a possible implementation method, in order to solve the above problems, Figure 2 As shown, the embedded power PCBA module 108 is provided with a plurality of jacks 118 , and the signal connection terminal 107 is inserted into different jacks 118 of the plurality of jacks 118 to achieve flexible installation of the signal connection terminal 107 .

[0050] In the above embodiment, by providing a plurality of jacks 118 in the embedded power PCBA module 108, the signal connection terminal 107 is inserted into different jacks 118 of the plurality of jacks 118 to match the mainboard 116 (refer to Figure 4 ) Different position requirements are met, and the signal connection terminal 107 is flexibly moved. The signal connection terminal 107 is flexibly placed on the embedded power PCBA module 108 through the SMT process to adapt to different requirements, so that the embedded PCBA high-voltage power module 100 has good compatibility and is easier to platformize.

[0051] In the process of implementing the present invention, the inventors also found that the existing power modules do not consider the shielding of the module itself against external electromagnetic radiation, but leave the problem to the user end of the module.

[0052] As a possible implementation method, in order to solve the above problem, Figure 2 As shown, the embedded PCBA high voltage power module 100 further includes a shielding plate 104, which is located above the embedded power PCBA module 108, and the shielding plate 104 is fixedly connected to the self-sealing heat sink assembly A. Figure 2 See also Figure 3In a specific implementation, a hole 113 is provided on the shielding plate 104, and a second protrusion 112 is provided on the frame 103, so that the shielding plate 104 is connected to the second protrusion 112 on the frame 103 by riveting through the hole 113 on the shielding plate 104 to form a first connection structure 114 to fix the shielding plate 104. The shielding electrical path of the shielding plate 104 is connected to the frame 103 through the first connection structure 114, such as Figure 2 As shown, the frame 103 is connected to the mounting interface 111 of the self-sealing heat sink 102, and the mounting interface 111 is connected to the housing of the motor controller, and finally connected to the ground, solving the electromagnetic interference problem of the embedded power PCBA module 108 itself. In specific implementation, the material of the shielding plate 104 can be aluminum alloy or stainless steel. Of course, in other implementations, it can also be other metal plates in the prior art.

[0053] In the above embodiment, the shielding plate 104 is fixedly connected to the self-sealing heat sink assembly A, so that the shielding plate 104 is grounded through the self-sealing heat sink assembly A, and the embedded power PCBA module 108 is electromagnetically shielded.

[0054] As a possible implementation, Figure 2 As shown, the embedded PCBA high-voltage power module 100 further includes an insulating layer 109, which is disposed between the shielding plate 104 and the embedded power PCBA module 108, and the DC input terminal 106, the AC output terminal 105, and the signal connection terminal 107 are configured to pass through the insulating layer 109 and be exposed from the shielding plate 104. In a specific implementation, the insulating layer 109 is a gel layer. Of course, in other implementations, the insulating layer 109 can also be composed of other existing insulating materials.

[0055] The embedded PCBA high-voltage power module 100 is a high-voltage power module formed by deep integration of an embedded power PCBA module 108, a self-sealing heat sink 102, a frame 103, an inlet and outlet water pipe 101, a shielding plate 104, a DC input terminal 106, an AC output terminal 105, a signal connection terminal 107 and an insulating layer 109. It solves the application form of the embedded power PCBA module 108 in the 800V system, reduces the space size and improves the power density compared to the traditional power module.

[0056] As a possible implementation, Figure 4 See also Figure 5 , Figure 1-3 The present invention also provides a controller, which generally includes the above-mentioned embedded PCBA high-voltage power module 100 and a mainboard 116, and the mainboard 116 is connected to the embedded PCBA high-voltage power module 100. In specific implementation, the controller can be a motor controller of an electric vehicle, or other controllers. Figure 4 As shown, the signal connection between the embedded PCBA high-voltage power module 100 and the mainboard 116 is achieved by crimping or welding the signal connection terminal 107 and the mainboard 116. The connection between the embedded PCBA high-voltage power module 100 and the mainboard 116 is achieved by riveting the first protrusion 110 on the self-sealing heat sink 102 to form a second connection structure 117. In addition, the motor controller may also include busbar capacitors, filter components, high-voltage input plug-ins, three-phase output plug-ins, etc.

[0057] In the above embodiment, the controller includes an embedded PCBA high-voltage power module 100, and the embedded PCBA high-voltage power module 100 includes a self-sealing heat sink assembly A, an embedded power PCBA module 108, a DC input terminal 106, an AC output terminal 105 and a signal connection terminal 107. The self-sealing heat sink assembly A is connected into an integrated structure, and the size and space are greatly reduced compared to the traditional assembled heat dissipation water path; the embedded power PCBA module 108 can be better integrated and the size can also be made small, thereby obtaining a high power density. Therefore, the present invention has the advantages of small size, small space, high integration and high power density. It is particularly suitable for 800V high voltage systems.

[0058] In addition, the DC input flexible terminal and the AC output flexible terminal make the DC input terminal 106 and the AC output terminal 105 flexible, so that they can adapt to input components and output components of different heights.

[0059] In addition, by providing a plurality of jacks 118 in the embedded power PCBA module 108, the signal connection terminal 107 can be inserted into different jacks 118 of the plurality of jacks 118 to match the different position requirements of the mainboard 116, and the signal connection terminal 107 can be flexibly moved, making the embedded power PCBA module 108 easier to platformize.

[0060] In addition, the shielding plate 104 is fixedly connected to the self-sealing heat sink assembly A, so that the shielding plate 104 is grounded through the self-sealing heat sink assembly A, and the embedded power PCBA module 108 is electromagnetically shielded.

[0061] The above-mentioned embedded PCBA high-voltage power module 100 can be directly used in the motor controller of the electric drive system, which not only solves the shortcomings of the prior art mentioned in the above-mentioned background technology, but also makes the layout of the entire motor controller more flexible.

[0062] As a possible implementation, see Figure 1-Figure 5 The present invention also provides an electric vehicle, which includes the above-mentioned controller.

[0063] In the above embodiment, the electric vehicle includes a controller, the controller includes the above embedded PCBA high-voltage power module 100, the embedded PCBA high-voltage power module 100 includes a self-sealing radiator assembly A, an embedded power PCBA module 108, a DC input terminal 106, an AC output terminal 105 and a signal connection terminal 107, the self-sealing radiator assembly A is connected into an integrated structure, and the size and space are greatly reduced compared to the traditional assembled heat dissipation water circuit; the embedded power PCBA module 108 can be better integrated and the size can also be made small, so as to obtain high power density. Therefore, the present invention has the advantages of small size, small space, high integration and high power density. It is particularly suitable for 800V high voltage systems.

[0064] In addition, the DC input flexible terminal and the AC output flexible terminal make the DC input terminal 106 and the AC output terminal 105 flexible, so that they can adapt to input components and output components of different heights.

[0065] In addition, by providing a plurality of jacks 118 in the embedded power PCBA module 108, the signal connection terminal 107 can be inserted into different jacks 118 of the plurality of jacks 118 to match the different position requirements of the mainboard 116, and the signal connection terminal 107 can be flexibly moved, making the embedded power PCBA module 108 easier to platformize.

[0066] In addition, the shielding plate 104 is fixedly connected to the self-sealing heat sink assembly A, so that the shielding plate 104 is grounded through the self-sealing heat sink assembly A, and the embedded power PCBA module 108 is electromagnetically shielded.

[0067] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. An embedded PCBA high-voltage power module, characterized in that: It includes: A self-sealing radiator assembly connected into an integral structure; An embedded power PCBA module connected to the self-sealing heat sink assembly; as well as A DC input terminal, an AC output terminal, and a signal connection terminal are connected to the embedded power PCBA module.

2. The embedded PCBA high-voltage power module according to claim 1, characterized in that: The self-sealing radiator assembly comprises: A self-sealing heat sink having a first surface and a second surface disposed oppositely; an inlet and outlet water pipe connected to the first surface of the self-sealing radiator; a frame connected to the second surface of the self-sealing heat sink; The frame and the second surface of the self-sealing heat sink form a cavity to install the embedded power PCBA module.

3. The embedded PCBA high-voltage power module according to claim 2, characterized in that: Insulating material is arranged in the cavity to achieve electrical insulation of the embedded power PCBA module.

4. The embedded PCBA high-voltage power module according to claim 1, characterized in that: A protrusion is provided in the self-sealing heat sink assembly in an area corresponding to the area connected to the embedded power PCBA module.

5. The embedded PCBA high-voltage power module according to claim 1, characterized in that: The DC input terminal is a DC input flexible terminal, and / or the AC output terminal is an AC output flexible terminal.

6. The embedded PCBA high-voltage power module according to claim 1, characterized in that: The embedded power PCBA module is provided with a plurality of jacks, and the signal connection terminal is inserted into different jacks of the plurality of jacks to achieve flexible installation of the signal connection terminal.

7. The embedded PCBA high-voltage power module according to claim 1, characterized in that: The embedded PCBA high-voltage power module also includes a shielding plate, which is located above the embedded power PCBA module and is fixedly connected to the self-sealing heat sink assembly.

8. The embedded PCBA high-voltage power module according to claim 7, characterized in that: The embedded PCBA high-voltage power module also includes an insulating layer, which is arranged between the shielding plate and the embedded power PCBA module. The DC input terminal, the AC output terminal and the signal connection terminal are configured to pass through the insulating layer and be exposed from the shielding plate.

9. A controller, characterized in that: The controller comprises the embedded PCBA high-voltage power module according to any one of claims 1 to 8, and the controller further comprises a mainboard, which is connected to the embedded PCBA high-voltage power module.

10. An electric vehicle, characterized in that: The electric vehicle comprises the controller according to claim 9.

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