Multi-level envelope tracking power amplifier circuit

By using reconfigurable devices and power modulators in multi-level envelope tracking power amplifiers to adjust the output impedance and operating voltage, the problem of inefficiency of multi-level envelope tracking power amplifiers at different levels and loads is solved, and the multi-level envelope tracking power amplifiers is realized. High efficiency operation and reduced energy consumption.

CN119232090APending Publication Date: 2024-12-31ZTE CORP
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Patent Information

Application Number
CN202310797825.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-06-30
Publication Date
2024-12-31

AI Technical Summary

Technical Problem

Multi-level envelope tracking power amplifiers cannot continuously operate in the optimal efficiency state at different levels and loads, resulting in increased energy consumption and inefficiency.

Method used

By introducing reconfigurable devices and power modulators into the amplifier module, the output impedance value and operating voltage are adjusted to conform to the target efficiency impedance curve, thereby achieving high-efficiency operation.

Benefits of technology

Continuously maintain high-efficiency operation at different levels and loads, avoid energy waste, reduce energy consumption, and improve the overall efficiency of multi-level envelope tracking power amplifiers.

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Patent Text Reader

Abstract

The invention discloses a multi-level envelope tracking power amplifier circuit, which is used for solving the problem that the working efficiency of a multi-level envelope tracking power amplifier is low due to a fixed load. The scheme provided by the invention comprises a power amplifier module comprising at least one envelope tracking power amplifier and at least one reconfigurable device, and the reconfigurable device is used for adjusting an output impedance value of a target envelope tracking power amplifier to a target output impedance value; the power supply modulator is used for adjusting the working voltage of the power amplifier module so as to enable the target envelope tracking power amplifier to be at the target working voltage; wherein the target output impedance value and the target working voltage enable the working efficiency of the target envelope tracking power amplifier to meet an efficiency impedance curve corresponding to the target envelope tracking power amplifier.
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Description

Technical Field

[0001] The present application relates to the field of wireless communications, and in particular to a multi-level envelope tracking power amplifier circuit. Background Art

[0002] When the base station is working in the actual field, the actual output average power needs to be adjusted according to the size of the business volume. Most of the time, the average transmission power is only 50% of the rated load, or even only 30% of the rated load. Since the power amplifier works in a light load state for a long time, the deep power fallback causes the power amplifier to work in a low efficiency area, which will increase the overall power consumption.

[0003] In response to this problem, energy-saving technologies at low power have gradually attracted attention. Among them, multi-level envelope ET power amplifiers are highly competitive. However, the conventional technical solution of multi-level envelope tracking (ET) power amplifiers is a fixed load matching design, which cannot achieve continuous operation of the power amplifier at the optimal efficiency state under different power levels and loads. This is a problem that multi-level ET power amplifiers still need to solve.

[0004] How to improve the efficiency of a multi-level envelope tracking power amplifier and reduce energy consumption is a technical problem to be solved by this application. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a multi-level envelope tracking power amplifier circuit to solve the problem that a fixed load causes low working efficiency of the multi-level envelope tracking power amplifier.

[0006] In a first aspect, a multi-level envelope tracking power amplifier circuit is provided, comprising:

[0007] A power amplifier module, comprising at least one envelope tracking power amplifier and at least one reconfigurable device, wherein the reconfigurable device is used to adjust the output impedance value of the target envelope tracking power amplifier to a target output impedance value;

[0008] A power modulator, used to adjust the operating voltage of the power amplifier module so that the target envelope tracking power amplifier is at a target operating voltage;

[0009] The target output impedance value and the target operating voltage enable the operating efficiency of the target envelope tracking power amplifier to satisfy an efficiency impedance curve corresponding to the target envelope tracking power amplifier.

[0010] In an embodiment of the present application, a multi-level envelope tracking power amplifier circuit includes a power amplifier module and a power modulator, wherein the reconfigurable device in the power amplifier module is used to adjust the output impedance value of the target envelope tracking power amplifier to the target output impedance value, and the power modulator is used to control the operating voltage of the power amplifier module so that the target envelope tracking power amplifier is at the target operating voltage. Then, the operating efficiency of the target envelope tracking power amplifier is controlled from the two aspects of the output impedance value and the operating voltage, so that the operating efficiency satisfies the efficiency impedance curve corresponding to the target envelope tracking power amplifier, and the envelope tracking power amplifier is ensured to be in a high-efficiency operating state to avoid energy waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0012] Figure 1 This is one of the structural schematic diagrams of a multi-level envelope tracking power amplifier circuit in one embodiment of the present application;

[0013] Figure 2 This is a second structural schematic diagram of a multi-level envelope tracking power amplifier circuit according to an embodiment of the present application;

[0014] Figure 3 This is a third structural schematic diagram of a multi-level envelope tracking power amplifier circuit according to an embodiment of the present application;

[0015] Figure 4a is a schematic diagram of the circuit structure of a reconfigurable device of a power amplifier module in one embodiment of the present application;

[0016] Figure 4b is based on Figure 4a The efficiency-impedance curves of the envelope tracking power amplifier of the circuit structure shown under three leakage voltages and corresponding loads;

[0017] Figure 4c is based on Figure 4a A schematic diagram of fundamental wave and harmonic impedance matching of the reconfigurable output matching submodule of the circuit structure shown as viewed from port a;

[0018] Figure 4d is based on Figure 4a Schematic diagram of efficiency comparison achievable by the circuit structure shown;

[0019] Figure 5 This is a fourth structural schematic diagram of a multi-level envelope tracking power amplifier circuit according to an embodiment of the present application;

[0020] Figure 6aIt is a schematic diagram of the structure of a power amplifier module based on a Doherty architecture in a multi-level envelope tracking power amplifier circuit in an embodiment of the present application;

[0021] Figure 6b It is a schematic diagram of the structure of a power amplifier module based on the Outphasing architecture in a multi-level envelope tracking power amplifier circuit in one embodiment of the present application;

[0022] Figure 6c It is a schematic diagram of the structure of a power amplifier module based on an LMBA architecture in a multi-level envelope tracking power amplifier circuit in an embodiment of the present application;

[0023] Figure 7 This is a schematic diagram of the basic structure of a reconfigurable device in a multi-level envelope tracking power amplifier circuit according to an embodiment of the present application;

[0024] Figure 8 This is a schematic diagram of the structure of a power amplifier module implemented by a Doherty architecture in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. The numbering of the drawings in this application is only used to distinguish the various steps in the scheme, and is not used to limit the execution order of the various steps. The specific execution order is subject to the description in the specification.

[0026] In order to solve the problems existing in the prior art, an embodiment of the present application provides a multi-level envelope tracking power amplifier circuit, which can be applied to the field of wireless technology, and is particularly suitable for wireless communication systems with high peak-to-average ratio signals.

[0027] In practical applications, the circuit provided in the embodiment of the present application can cover an operating frequency band with a relative operating bandwidth of 10%-30% and has a high-efficiency transmission system under high back-off, and can be specifically applied to base station wireless transmission products, terminal wireless transmission products, etc.

[0028] The multi-level envelope tracking power amplifier circuit provided in the present application relates to envelope tracking technology, wherein the envelope tracking technology can be used to achieve energy saving of a power amplifier (Power Amplifier, PA), and the power amplifier can also be referred to as a power amplifier.

[0029] The present application embodiment provides a multi-level envelope tracking power amplifier circuit, such as Figure 1 As shown, including:

[0030] A power amplifier module 11, comprising at least one envelope tracking power amplifier 111 and at least one reconfigurable device 112, wherein the reconfigurable device is used to adjust the output impedance value of the target envelope tracking power amplifier to a target output impedance value;

[0031] A power modulator 12, used for adjusting the operating voltage of the power amplifier module 11 so that the target envelope tracking power amplifier is at a target operating voltage;

[0032] The target output impedance value and the target operating voltage enable the operating efficiency of the target envelope tracking power amplifier to satisfy an efficiency impedance curve corresponding to the target envelope tracking power amplifier.

[0033] In envelope tracking technology, the power level in the envelope of the input radio frequency (RF) signal is tracked. For any power level, a suitable operating voltage is determined, that is, a higher operating voltage is provided for a higher power, and a lower operating voltage is provided for a lower power. The suitable operating voltage here refers to a voltage that can achieve the required amplification function while avoiding energy waste.

[0034] In practical applications, the specific implementation method of envelope tracking technology is that the RF signal is input to the input end of the envelope tracking power amplifier of the power amplifier module, and the power supply voltage of the power amplifier is changed accordingly according to the envelope change of the input RF signal, so that the power amplifier is at a suitable operating voltage, reducing the loss while ensuring the realization of the amplification function, and achieving a high-efficiency technical effect.

[0035] In the solution provided by the embodiment of the present application, the target envelope tracking power amplifier is any envelope tracking power amplifier in the power amplifier module. Under the control of the power modulator and the control module, the operating voltage and load of the target envelope tracking power amplifier are controlled to meet the efficiency impedance curve corresponding to the target envelope tracking power amplifier, thereby ensuring that the target envelope tracking power amplifier is in a high-efficiency working state.

[0036] Specifically, the reconfigurable device is connected between the output end of the envelope tracking power amplifier and the load impedance, and the output impedance of the envelope tracking power amplifier can be adjusted by controlling the reconfigurable device.

[0037] Through the scheme provided by the embodiment of the present application, the multi-level envelope tracking power amplifier circuit includes a power amplifier module and a power modulator, wherein the reconfigurable device in the power amplifier module is used to adjust the output impedance value of the target envelope tracking power amplifier to the target output impedance value, and the power modulator is used to control the working voltage of the power amplifier module so that the target envelope tracking power amplifier is at the target working voltage. Then, the working efficiency of the target envelope tracking power amplifier is controlled from the two aspects of the output impedance value and the working voltage, so that the working efficiency satisfies the efficiency impedance curve corresponding to the target envelope tracking power amplifier, and the envelope tracking power amplifier is ensured to be in a high-efficiency operating state to avoid energy waste.

[0038] In this scheme, the efficiency impedance curve corresponding to the target envelope tracking power amplifier is determined by the inherent properties of the target envelope tracking power amplifier. In practical applications, the efficiency impedance curve corresponding to the target envelope tracking power amplifier can be pre-calculated according to the inherent parameters of the target envelope tracking power amplifier, or generated by test records and the like. For example, if a test method is adopted, the target envelope tracking power amplifier under different operating voltages is tested separately. In the state of any operating voltage, the output impedance value is changed and the efficiency is recorded. In other words, the relationship between the voltage of the target envelope tracking amplifier and its load, output impedance value, and efficiency is tested. For any operating voltage, the output impedance value corresponding to the optimal efficiency point is determined, and this output impedance value is determined as the output impedance value corresponding to the operating voltage. A curve is generated based on multiple operating voltages and the corresponding output impedance values ​​as the efficiency impedance curve corresponding to the envelope tracking power amplifier.

[0039] The efficiency-impedance curve can specifically be a two-dimensional curve, in which one dimension represents the variable operating voltage and load of the envelope tracking power amplifier, and the other dimension represents the output impedance values ​​corresponding to each operating voltage and load of the envelope tracking power amplifier, that is, the output impedance value with optimal efficiency corresponding to the operating voltage and load.

[0040] The efficiency impedance curve is determined by the structure and properties of the envelope tracking power amplifier itself, and different envelope tracking power amplifiers have different corresponding efficiency impedance curves. If the power amplifier module contains multiple envelope tracking power amplifiers, the corresponding envelope tracking power amplifiers can be controlled separately for each efficiency impedance curve to achieve independent control of each envelope tracking power amplifier, ensuring that each envelope tracking power amplifier in the power amplifier module is in a high-efficiency working state.

[0041] In practical applications, since this solution adjusts the operating voltage and output impedance value of the envelope tracking power amplifier based on the efficiency impedance curve, it can achieve continuous adjustment and continuously ensure that the envelope tracking power amplifier is in a high-efficiency operating state during the continuous adjustment process.

[0042] For example, in practical applications, the envelope tracking power amplifier has a large power back-off, that is, the gain of the envelope tracking power amplifier is greatly reduced, and in this process, the operating voltage of the envelope tracking power amplifier needs to be reduced accordingly. During the reduction process, through the scheme provided in the embodiment of the present application, the output impedance value of the envelope tracking power amplifier changes accordingly with the target operating voltage, so that the operating voltage and output impedance value of the envelope tracking power amplifier in the process of large power back-off continue to meet the efficiency impedance curve, thereby ensuring that the envelope tracking power amplifier continues to maintain a high-efficiency working state during the large back-off process to avoid energy waste.

[0043] Based on the solution provided in the above embodiment, optionally, Figure 2 As shown, the circuit also includes:

[0044] A field programmable gate array (FPGA) module 21 is used to control the reconfigurable device 112 to adjust the output impedance value of the target envelope tracking power amplifier 111 to the target output impedance value according to the efficiency impedance curve, and to control the power modulator 12 to adjust the operating voltage of the power amplifier module 11 according to the efficiency impedance curve, so that the operating efficiency of the target envelope tracking power amplifier 111 satisfies the efficiency impedance curve corresponding to the target envelope tracking power amplifier 111.

[0045] In this solution, the FPGA module is used to implement signal processing and control. In actual implementation, the target operating voltage and target output impedance value are determined according to the efficiency impedance curve and the input RF signal. The power modulator and the power amplifier module are controlled by outputting control signals, so that the envelope tracking power amplifier is in a high-efficiency working state with the target operating voltage and the corresponding output impedance value.

[0046] Based on the solution provided in the above embodiment, optionally, Figure 3 As shown, the circuit also includes:

[0047] The control module 31 is used to adjust the at least one reconfigurable device 112 under the control of the FPGA module 21 to adjust the output impedance value of the target envelope tracking power amplifier 111 to a target output impedance value.

[0048] In this solution, the control module is connected between the FPGA module and the power amplifier module, and can further control the power amplifier module based on the instructions of the FPGA module. When the power amplifier module includes multiple reconfigurable devices, the control module can be used to control the multiple reconfigurable devices separately, effectively improving the controllability of each device.

[0049] Based on the solution provided in the above embodiment, optionally, the FPGA module 21 is further used for:

[0050] An impedance control signal and a power control signal are generated according to the efficiency impedance curve, wherein the impedance control signal is used to control the reconfigurable device 112 , and the power control signal is used to control the power modulator 12 .

[0051] In this solution, the FPGA module can apply envelope tracking technology to instantly calculate the corresponding target operating voltage based on the input RF signal. The target operating voltage refers to a high-efficiency voltage that can achieve the required amplification function without wasting electrical energy. On the basis of determining the target operating voltage, the target output impedance value corresponding to the target operating voltage is determined according to the efficiency impedance curve. Then, a power control signal is generated according to the target operating voltage and sent to the power modulator, and an impedance control signal is generated according to the target output impedance value and sent to the control module, and then the reconfigurable device is controlled through the control module. Among them, the power control signal realizes the operating voltage control of the target envelope tracking power amplifier through the power modulator, and the output impedance control signal realizes the output impedance control of the target envelope tracking power amplifier through the control module.

[0052] After receiving the power control signal, the power modulator supplies power to the power amplifier module according to the power control signal, thereby making the target envelope tracking power amplifier at the target operating voltage. The power modulator can perform fast voltage switching, and send the voltage of the corresponding signal to the power amplifier, so that the envelope tracking power amplifier is at the required target operating voltage.

[0053] After receiving the impedance control signal, the control module adjusts the impedance of the at least one reconfigurable device according to the impedance control signal, thereby adjusting the output impedance value of the target envelope tracking power amplifier to the target output impedance value. The control module can be used to adjust the reconfigurable device according to the impedance control signal to change the impedance value of the output end of the envelope tracking power amplifier, thereby making the operating state of the envelope tracking power amplifier meet the efficiency impedance curve.

[0054] The circuit provided by the embodiment of the present application includes a field programmable gate array FPGA module, a control module, a power modulator and a power amplifier module. The power amplifier module includes an envelope tracking power amplifier and a reconfigurable device. The FPGA module sends a power control signal and an impedance control signal according to the efficiency impedance curve, and the power modulator supplies power to the power amplifier module according to the power control signal, thereby controlling the working voltage of the envelope tracking power amplifier, and adjusting the impedance of the reconfigurable device according to the impedance control signal through the control module, thereby adjusting the output impedance value of the target envelope tracking power amplifier, so that the working efficiency of the target envelope tracking power amplifier meets the efficiency impedance curve, ensuring that the envelope tracking power amplifier is in a high-efficiency operating state and avoiding energy waste.

[0055] The following describes the connection method of each module in the circuit provided in the embodiment of the present application.

[0056] The input end of the reconfigurable output device is electrically connected to the output end of the target envelope tracking power amplifier, the first output end of the FPGA module is electrically connected to the input end of the power modulator, and the second output end of the FPGA module is electrically connected to the input end of the control module, wherein the first output end is used to send a power control signal, and the second output end is used to send an impedance control signal. The output end of the control module is electrically connected to the first input end of the power amplifier module, and the control module is used to adjust the impedance of the reconfigurable device according to the impedance control signal. The output end of the power modulator is electrically connected to the second input end of the power amplifier module, and the power modulator is used to provide an operating voltage to the power amplifier module according to the power control signal.

[0057] Optionally, a module power supply can be provided between the FPGA module and the power modulator. The module power supply can be used to provide electrical energy to the power modulator, and the power modulator determines the target operating voltage to be provided to the power amplifier module according to the power control signal. In practical applications, the module power supply can provide multiple voltages to the power modulator according to the actual needs of each module, and the power modulator provides multiple power supply terminals with different voltages to the power amplifier module based on the multiple voltages. For example, when the power amplifier module includes multiple envelope tracking power amplifiers, the power modulator can provide power supply terminals with different voltages to the multiple envelope tracking power amplifiers respectively to meet the different power supply requirements of different envelope tracking power amplifiers.

[0058] Based on the solution provided in the above embodiment, optionally, Figure 4a As shown, the power amplifier module includes a reconfigurable harmonic output matching submodule 101, a reconfigurable fundamental output matching submodule 102, an output drain bias module 103 and an impedance inverter 104;

[0059] Wherein, the input end of the reconfigurable harmonic output matching submodule, the input end of the reconfigurable fundamental output matching submodule, and the input end of the output drain bias module are all electrically connected to the output end of the target envelope tracking power amplifier;

[0060] The power supply end of the output drain bias module is electrically connected to the output end of the power modulator;

[0061] The output end of the reconfigurable fundamental wave output matching submodule is electrically connected to the input end of the impedance inverter;

[0062] The output end of the impedance inverter is electrically connected to the input end of the load impedance of the target envelope tracking power amplifier.

[0063] In order to more clearly describe the implementation process of impedance reconfiguration in this example, an embodiment is provided to describe the circuit structure and its implementation method in detail. In this example, the impedance inverter is specifically a 1 / 4 wavelength impedance inverter.

[0064] In this example, the power amplifier module includes a PIN switch K1, a microstrip line TL1, a microstrip line TL2, a microstrip line TL3, a microstrip line TL4, a microstrip line TL5, a quarter-wavelength line TL6, a series capacitor C1, a grounded capacitor C2, a grounded varactor diode C3, a grounded varactor diode C4, and a grounded capacitor C5.

[0065] Port a is connected to the drain of the envelope tracking power amplifier, port b is the output end connected to the output load impedance of the power amplifier module, and port c is connected to the output end of the power modulator to achieve drain power supply of different gears.

[0066] Capacitor C5 is a DC blocking capacitor, and forms an output drain bias module 103 with microstrip line TL5.

[0067] One end of the microstrip line TL4 is connected to the drain of the envelope tracking power amplifier, and the other end is connected to the grounded varactor diode C4 and the microstrip line TL3 . The microstrip line TL4 and the varactor diode C4 together constitute a reconfigurable harmonic output matching submodule 101 .

[0068] The other end of the microstrip line TL3 is connected to the grounded varactor diode C3 and the microstrip line TL2, the other end of the microstrip line TL2 is connected to the microstrip line TL1 and one end of the PIN switch K1, the other end of the PIN switch K1 is connected to the grounded capacitor C2, and the other end of the microstrip line TL1 is connected to the DC blocking capacitor C1, together forming a reconfigurable fundamental wave output matching submodule 102.

[0069] The other end of the DC blocking capacitor C1 is connected to the output terminal b and the load impedance, wherein the quarter-wavelength line TL6 constitutes an impedance inverter 104 .

[0070] In practical applications, when the power amplifier is in the large back-off working state and the leakage voltage at the C end is switched to the third low voltage (the third low leakage voltage is 26V in this example), the PIN switch K1 is disconnected, and the capacitance values ​​of the varactor diodes C3 and C4 are C31 and C41 respectively under this voltage control, that is, at this time, the microstrip lines TL3, TL2, TL1 and the capacitor C31 realize the fundamental wave output matching under this voltage and load, and the microstrip line TL4 and the capacitor C41 realize the harmonic output matching under this voltage and load.

[0071] When the power amplifier back-off amount decreases and the leakage voltage at the C end switches to the second low voltage (the second low leakage voltage is 36V in this example), the PIN switch K1 is still disconnected, and the capacitances of the varactor diodes C3 and C4 are C32 and C42 respectively under this voltage control, that is, at this time, the microstrip lines TL3, TL2, TL1 and the capacitor C32 realize the fundamental wave output matching under this voltage and load, and the microstrip line TL4 and the capacitor C42 realize the harmonic output matching under this voltage and load.

[0072] When the power amplifier operates at rated full load, the leakage voltage at the C end is switched to the first voltage (the first low leakage voltage is 48V in this example), the PIN switch K1 is closed, and the capacitances of the varactor diodes C3 and C4 are C33 and C43 respectively under this voltage control, that is, at this time, the microstrip lines TL3, TL2, TL1 and the capacitors C2 and C33 achieve fundamental wave output matching under this gear and load, and the microstrip line TL4 and the capacitor C43 achieve harmonic output matching under this voltage and load.

[0073] Figure 4b It is the LoadPull data of the envelope tracking power amplifier in the above example under three leakage voltages and corresponding loads, namely 26V@43.9dBM, 36V@47.6dBM and 48V@49.2dBM. The black dotted arrow shows the maximum efficiency impedance migration trajectory under the three leakage voltages and loads.

[0074] Furthermore, the fundamental wave and harmonic impedance matching of the reconfigurable output matching submodule in the present application example as viewed from port a is as follows: Figure 4c As shown. Figure 4c It is also shown that a fixed load impedance point ( Figure 4c The LoadPull data is used to compare the efficiency that can be achieved in this example design with the efficiency that can be achieved with fixed impedance matching. Figure 4d As shown, it is obvious that the solution provided by the embodiment of the present application can control the envelope tracking power amplifier to continuously operate at the optimal efficiency point under a large back-off amount.

[0075] Based on the solution provided in the above embodiment, optionally, Figure 5As shown, the power amplifier module 11 also includes:

[0076] The reconfigurable input matching submodule 51 is used to adjust the impedance under the control of the FPGA module 21 so that the input impedance value of the target envelope tracking power amplifier 111 matches the target operating voltage.

[0077] Figure 5 In the circuit structure diagram shown, the module power supply is an optional module. On the basis of the reconfigurable device connected to the output end of the target envelope tracking power amplifier, a reconfigurable input matching submodule is also connected to the input end of the envelope tracking power amplifier in this example. The reconfigurable input matching submodule is controlled by the FPGA module, and the reconfigurable device in the reconfigurable input matching submodule is adjusted based on the state signal by the control module, thereby adjusting the input impedance value of the input end of the envelope tracking power amplifier.

[0078] In this example, the reconfigurable input matching submodule includes a reconfigurable device. Under the control of the control module, the impedance value of the gate of the envelope tracking power amplifier can be controlled by adjusting the reconfigurable device, thereby controlling the actual gain of the envelope tracking power amplifier during the application process. Furthermore, the envelope tracking power amplifier is controlled to be in a target operating voltage and a high-efficiency operating state corresponding to the voltage from multiple aspects of input impedance value, output impedance value and gain.

[0079] Based on the solution provided in the above embodiment, optionally, the output end of the reconfigurable input matching submodule 51 is electrically connected to the input end of the target envelope tracking power amplifier, and the reconfigurable input matching submodule 51 is used to receive an input RF signal.

[0080] Optionally, the power amplifier module 11 is implemented based on at least one of the following architectures: Doherty architecture, Outphasing architecture, LMBA architecture. The power amplifier modules of these three architectures are described below. Among them, any reconfigurable output matching submodule or reconfigurable input matching submodule includes the reconfigurable device described in any of the above examples.

[0081] like Figure 6a As shown, the power amplifier module based on the Doherty architecture includes a power divider, multiple envelope tracking power amplifiers, multiple reconfigurable input matching submodules corresponding to the envelope tracking power amplifiers, and multiple reconfigurable output matching submodules corresponding to the envelope tracking power amplifiers;

[0082] The power divider is used to convert the input radio frequency signal RF in The output terminals of at least one of the reconfigurable output matching submodules are respectively output to the reconfigurable input matching submodules, wherein the output terminal of at least one of the reconfigurable output matching submodules is electrically connected to the input terminal of the load impedance through an impedance inverter.

[0083] In this example, the power amplifier module includes a Carry envelope tracking power amplifier and a Peak envelope tracking power amplifier, and the input and output ends of the two envelope tracking power amplifiers are respectively connected to a reconfigurable input matching submodule and a reconfigurable output matching submodule. Among them, the impedance inverter is specifically a 1 / 4 wavelength impedance inverter.

[0084] like Figure 6b As shown, the power amplifier module based on the Outphasing architecture includes multiple envelope tracking power amplifiers, multiple reconfigurable input matching submodules corresponding to the envelope tracking power amplifiers, multiple reconfigurable output matching submodules corresponding to the envelope tracking power amplifiers, and a non-separable coupler;

[0085] The multiple reconfigurable input matching submodules are used to respectively receive different radio frequency signals and output them to corresponding envelope tracking power amplifiers, and the multiple reconfigurable output matching submodules are electrically connected to the input end of the load impedance through the non-separable coupler.

[0086] In this example, the power amplifier module includes envelope tracking power amplifiers PA1 and PA2, and the input and output ends of the two envelope tracking power amplifiers are respectively connected to a reconfigurable input matching submodule and a reconfigurable output matching submodule. In addition, the input RF signal of PA1 is RF in,a , the input RF signal of PA2 is RF in,b , where Chireix is ​​a non-separating coupler.

[0087] like Figure 6c As shown, the power amplifier module based on the LMBA architecture includes multiple envelope tracking power amplifiers, multiple reconfigurable input matching submodules corresponding to the envelope tracking power amplifiers, and multiple reconfigurable output matching submodules corresponding to the envelope tracking power amplifiers;

[0088] Among the multiple envelope tracking power amplifiers, there is at least one first envelope tracking power amplifier for receiving a first radio frequency signal different from other envelope tracking power amplifiers, and among the multiple envelope tracking power amplifiers, there are multiple second envelope tracking power amplifiers for receiving the same second radio frequency signal;

[0089] Among them, multiple reconfigurable input matching sub-modules connected to the second envelope tracking power amplifier receive the second RF signal through a first bridge, and multiple reconfigurable output matching sub-modules connected to the second envelope tracking power amplifier are electrically connected to the input end of the load impedance through a second bridge.

[0090] In this example, the power amplifier module includes envelope tracking power amplifiers PA1, PA2 and PA3, and the input and output ends of the three envelope tracking power amplifiers are respectively connected to a reconfigurable input matching submodule and a reconfigurable output matching submodule. in,a The input RF signal of PA2 and PA3 is RF in,b The input end of the reconfigurable input matching submodule connected to PA2 and PA3 receives the RF signal through the first bridge. in,a , Accordingly, the output end of the reconfigurable output matching submodule connected to PA2 and PA3 is grounded through a bridge.

[0091] Based on the solution provided by any of the above embodiments, the at least one reconfigurable device is electrically connected to the load impedance of the target envelope tracking power amplifier.

[0092] Through the solution provided in the embodiment of the present application, the reconfigurable device in the power amplifier module can achieve the optimal impedance matching of the envelope tracking power amplifier under different power levels and loads. Figure 7 The L-type reconfigurable matching basic architecture shown illustrates the reconfigurable device of this solution.

[0093] Where R L It is the load impedance of the power amplifier module. jX and jB are the series reactance element and the parallel reactance element respectively. When the X value is positive, it represents the inductance, and when the X value is negative, it represents the capacitance. When the B value is positive, it represents the capacitance, and when the B value is negative, it represents the inductance. Both values ​​are adjustable. n +jb n It is the optimal impedance of the power amplifier tube under different levels and loads.

[0094] exist Figure 5 The reconfigurable input / output matching submodule shown satisfies the following equation (1-1):

[0095]

[0096] From the above formula (1-1), we can solve X and B respectively:

[0097]

[0098]

[0099] From the above expressions of X and B, it can be seen that when the optimal impedance a n +jb n When changes, the values ​​of X and B change accordingly, thereby achieving reconfigurable matching of optimal impedance.

[0100] Optionally, the reconfigurable device includes a variable capacitor. The control module can be used to adjust the capacitance value of the variable capacitor according to the impedance control signal. The reconfigurable devices jX and jB can be implemented by reconfigurable devices such as variable capacitors, varactor diodes, PIN diodes, etc., which are not limited here.

[0101] In addition to using a single reconfigurable element to form a reconfigurable device, a combination of multiple elements can also be used to form a reconfigurable device. Optionally, the reconfigurable device includes a switch and a fixed value capacitor electrically connected to each other. The control module can be used to adjust the on / off state of the switch according to the impedance control signal.

[0102] In practical applications, reconfigurable functions can be realized based on a single reconfigurable element or a reconfigurable element group composed of multiple elements. Figure 8 Further explain this plan.

[0103] Figure 8 The schematic diagram of the structure of a power amplifier module with a reconfigurable input matching submodule and a reconfigurable output matching submodule implemented by a Doherty architecture is shown. In this example, the fundamental impedance and harmonic impedance under different leakage voltages and loads are reconfigured by controlling the working states of multiple PIN diodes and varactor diodes in the reconfigurable device.

[0104] See also Figure 8 The circuit provided in this example specifically includes: Carry power amplifier tube (shown as C in the figure), Peak power amplifier tube (shown as P in the figure). Carry power amplifier tube reconfigurable input matching submodule 1, Carry power amplifier tube reconfigurable output matching submodule 2, Peak power amplifier tube reconfigurable input matching submodule 3, Peak power amplifier tube reconfigurable output matching submodule 4, Carry power amplifier tube output 1 / 4 wavelength impedance inverter 5, Peak power amplifier tube input phase adjustment 1 / 4 wavelength transmission line 6, load impedance Z L .

[0105] Through the embodiments of the present application, a single reconfigurable element of a variable capacitance diode and a combination of multiple elements of a switch-connected custom capacitor together constitute a reconfigurable device. Based on the multi-level ET power amplifier, a reconfigurable input / output matching submodule is applied, and the state of the reconfigurable device in the power amplifier module is flexibly controlled through the power modulator and the control module. The load impedance is adjusted under different levels and loads to meet the efficiency impedance curve, and the optimal load matching is achieved, so that the power amplifier can continue to work at the optimal efficiency point under a large back-off amount. This solution can reduce the transmitter energy consumption under high peak-to-average ratio signals and further achieve the goal of green energy.

[0106] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0107] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0108] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0109] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0110] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0111] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0112] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0113] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0114] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0115] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A multi-level envelope tracking power amplifier circuit, characterized in that: include: A power amplifier module, comprising at least one envelope tracking power amplifier and at least one reconfigurable device, wherein the reconfigurable device is used to adjust the output impedance value of the target envelope tracking power amplifier to a target output impedance value; A power modulator, used to adjust the operating voltage of the power amplifier module so that the target envelope tracking power amplifier is at a target operating voltage; The target output impedance value and the target operating voltage enable the operating efficiency of the target envelope tracking power amplifier to satisfy an efficiency impedance curve corresponding to the target envelope tracking power amplifier.

2. The circuit according to claim 1, characterized in that Also includes: A field programmable gate array (FPGA) module is used to control the reconfigurable device to adjust the output impedance value of the target envelope tracking power amplifier to the target output impedance value according to the efficiency impedance curve, and to control the power modulator to adjust the operating voltage of the power amplifier module according to the efficiency impedance curve so that the operating efficiency of the target envelope tracking power amplifier satisfies the efficiency impedance curve corresponding to the target envelope tracking power amplifier.

3. The circuit according to claim 2, characterized in that Also includes: A control module is used to adjust the at least one reconfigurable device under the control of the FPGA module to adjust the output impedance value of the target envelope tracking power amplifier to the target output impedance value.

4. The circuit according to claim 3, characterized in that The FPGA module is also used for: An impedance control signal and a power control signal are generated according to the efficiency impedance curve, wherein the impedance control signal is used to control the reconfigurable device, and the power control signal is used to control the power modulator.

5. The circuit according to any one of claims 1 to 4, characterized in that: The power amplifier module includes a reconfigurable harmonic output matching submodule, a reconfigurable fundamental output matching submodule, an output drain bias module and an impedance inverter; Wherein, the input end of the reconfigurable harmonic output matching submodule, the input end of the reconfigurable fundamental output matching submodule, and the input end of the output drain bias module are all electrically connected to the output end of the target envelope tracking power amplifier; The power supply end of the output drain bias module is electrically connected to the output end of the power modulator; The output end of the reconfigurable fundamental wave output matching submodule is electrically connected to the input end of the impedance inverter; The output end of the impedance inverter is electrically connected to the input end of the load impedance of the target envelope tracking power amplifier.

6. The circuit according to claim 3 or 4, characterized in that The power amplifier module also includes: A reconfigurable input matching submodule is used to adjust the impedance under the control of the FPGA module so that the input impedance value of the target envelope tracking power amplifier matches the target operating voltage.

7. The circuit according to claim 6, characterized in that The output end of the reconfigurable input matching submodule is electrically connected to the input end of the target envelope tracking power amplifier, and the reconfigurable input matching submodule is used to receive an input radio frequency signal.

8. The circuit according to claim 7, characterized in that The power amplifier module is implemented based on at least one of the following architectures: Doherty architecture, Outphasing architecture, and LMBA architecture.

9. The circuit according to any one of claims 1 to 4, characterized in that: The at least one reconfigurable device is electrically connected to a load impedance of the target envelope tracking power amplifier.

10. The circuit according to claim 9, characterized in that The reconfigurable device includes a variable capacitor.

11. The circuit according to claim 9, characterized in that The reconfigurable device includes a switch and a fixed-value capacitor electrically connected to each other.