Shading type base assembly and camera module

Abstract

The invention relates to a shading type base assembly and a camera module, and the shading type base assembly comprises a circuit board; the photosensitive chip is provided with a photosensitive area and a non-photosensitive area located around the photosensitive area; a plurality of connecting lines; the shading base comprises an annular base body and a mounting part, the mounting part extends from the annular base body to the non-photosensitive area of the photosensitive chip, and at least part of one surface, opposite to the photosensitive chip, of the mounting part is an inclined surface; the light-transmitting element is provided with a light-transmitting area and a light-shielding area located around the light-transmitting area, and the light-transmitting element is fixedly arranged on the side, close to the light-sensing chip, of the installation part so that the light-shielding area can cover the connecting line. According to the shading type base assembly, the reflection direction of the light emitted to the mounting part is changed by using the inclined surface, and the shading area of the light-transmitting element of the shading type base assembly can shade stray light generated by reflection of the shading base and the light emitted to the connecting line, so that stray light generated by reflection of the connecting line is avoided, and the stray light problem in the camera module can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a light-shielding base assembly and a camera module. Background Art

[0002] With the development of intelligent driving technology, the application of vehicle-mounted camera modules is becoming more and more mature, and more and more cars are equipped with camera modules to realize driving assistance systems. In vehicle-mounted camera modules, COB (chip on board) packaged photosensitive chips are increasingly widely used. Generally, COB packages usually have a protective base, which is located in the middle of the imaging optical path between the lens and the photosensitive chip. The surfaces of the various parts of the base are prone to reflect light and generate stray light, affecting the imaging quality. Summary of the invention

[0003] Based on this, it is necessary to provide a light-shielding base assembly and a camera module to address the problem that the COB package base of the existing vehicle-mounted camera module is prone to generate stray light.

[0004] A light-shielding base assembly, comprising:

[0005] Circuit board;

[0006] A photosensitive chip, the photosensitive chip is attached to the circuit board, and the photosensitive chip has a photosensitive area and a non-photosensitive area located around the photosensitive area;

[0007] A plurality of connecting wires, one end of each connecting wire is connected to the circuit board, and the other end of each connecting wire is connected to the non-photosensitive area of ​​the photosensitive chip;

[0008] A light-shielding base, the light-shielding base comprising an annular base and a mounting portion, the annular base protruding from the circuit board to surround the photosensitive chip, the mounting portion extending from the annular base toward the non-photosensitive area of ​​the photosensitive chip, a side of the mounting portion facing away from the photosensitive chip being at least partially an inclined surface, the inclined surface obliquely extending from a side of the mounting portion close to the annular base toward a direction close to the photosensitive chip to a side of the mounting portion away from the annular base; and

[0009] A light-transmitting element having a light-transmitting area and a light-shielding area around the light-transmitting area, wherein the light-transmitting element is fixedly arranged on a side of the mounting portion close to the photosensitive chip so that the light-shielding area covers the connecting wire.

[0010] In one of the embodiments, the light-shielding base further includes a plurality of matting protrusions, and the matting protrusions are protruded from the inclined surface.

[0011] In one embodiment, the matte protrusions are arranged in a zigzag shape on the inclined surface.

[0012] In one embodiment, the light-transmitting element includes a light-transmitting sheet and an ink layer, wherein the ink layer is printed circumferentially on the light-transmitting sheet to form the light-shielding area and the light-transmitting area on the surface of the light-transmitting sheet, and the inner diameter of the ink layer is smaller than the inner diameter of the mounting portion.

[0013] In one embodiment, the ink layer is located on the surface of the light-transmitting sheet close to the photosensitive chip.

[0014] In one embodiment, the ink layer is located on a surface of the light-transmitting sheet away from the photosensitive chip.

[0015] In one embodiment, the surface of the light-transmitting sheet has an anti-reflection film or a light-filtering film.

[0016] In one embodiment, the light-transmitting sheet is bonded to the mounting portion.

[0017] In one embodiment, the light shielding base has a matte black surface.

[0018] In one of the embodiments, the light-shielding base assembly further includes a filter element, and the filter element is disposed on a side of the light-shielding base away from the photosensitive chip.

[0019] A camera module, comprising:

[0020] A sunshade base assembly as described in any of the above; and

[0021] The lens assembly is mounted on the light-shielding base assembly.

[0022] The mounting portion of the light-shielding base of the above-mentioned light-shielding base assembly utilizes the inclined surface to change the reflection direction of the light directed toward the mounting portion, so that the stray light generated by the reflection of the mounting portion cannot be directed toward the photosensitive area of ​​the photosensitive chip. The light-shielding area of ​​the light-transmitting element of the light-shielding base assembly can not only block the stray light generated by the reflection of the light-shielding base, but also block the light directed toward the connecting wire, thereby avoiding the stray light generated by the reflection of the connecting wire, which can effectively improve the stray light problem in the camera module and improve the imaging quality of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a camera module provided in one embodiment of the present application;

[0024] Figure 2 A schematic structural diagram of a light-shielding base assembly of a camera module according to the above embodiment of the present application is shown;

[0025] Figure 3 A partial enlarged schematic diagram of a light-shielding base of a light-shielding base assembly of a camera module according to the above embodiment of the present application is shown;

[0026] Figure 4 A schematic diagram of a light beam of a COB packaging base according to a solution in the prior art;

[0027] Figure 5 A light schematic diagram of a COB packaging base of another solution in the prior art;

[0028] Figure 6 A light schematic diagram of an example of a light-shielding base assembly of the present application;

[0029] Figure 7 A schematic diagram of light when the light-transmitting element of the light-shielding base assembly of the present application is installed upright;

[0030] Figure 8 A schematic diagram of light rays when the light-transmitting element of the light-shielding base assembly of the present application is inverted;

[0031] Fig. 9 A light diagram of another example of the light-shielding base assembly of the present application.

[0032] Figure numerals: 11, circuit board; 12, photosensitive chip; 121, photosensitive area; 122, non-photosensitive area; 13, connecting line; 14, shading base; 141, annular base; 142, mounting portion; 1421, inclined plane; 143, matte protrusion; 15, light-transmitting element; 151, light-transmitting area; 152, light-shielding area; 153, light-transmitting sheet; 154, ink layer; 16, filter element; P11, first circuit board; P12, first base; P13, first sensing chip; P14, first connecting line; P15, first light-transmitting element; P16, first filter; P21, second circuit board; P22, second base; P23, second sensing chip; P24, second connecting line; P25, second light-transmitting element. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0039] Based on the problem that the base of the COB package of the existing vehicle-mounted camera module is prone to generate stray light, the present application provides a light-shielding base assembly and a camera module. The camera module may include a lens assembly and a light-shielding base assembly, the light-shielding base assembly is installed in the lens assembly, and the light-shielding area of ​​the light-transmitting element of the light-shielding base assembly can not only block the stray light generated by the reflection of the light-shielding base, but also block the light directed to the connecting line, avoiding the reflection of the connecting line to generate stray light, which can effectively improve the stray light problem in the camera module and improve the imaging quality of the camera module.

[0040] For details, please refer to Figures 1 to 3 In some embodiments, the light-shielding base assembly includes a circuit board 11, a photosensitive chip 12, a plurality of connecting wires 13, a light-shielding base 14 and a light-transmitting element 15. The photosensitive chip 12 is attached to the circuit board 11, and the photosensitive chip 12 has a photosensitive area 121 and a non-photosensitive area 122 located around the photosensitive area 121; one end of the connecting wire 13 is connected to the circuit board 11, and the other end of the connecting wire 13 is connected to the non-photosensitive area 122 of the photosensitive chip 12; the light-shielding base 14 includes an annular base body 141 and a mounting portion 142, the annular base body 141 is protruding from the circuit board 11 to surround the photosensitive chip 12, and the mounting portion 142 extends from the annular base body 141 toward the non-photosensitive area 122 of the photosensitive chip 12; the light-transmitting element 15 has a light-transmitting area 151 and a light-shielding area 152 located around the light-transmitting area 151, and the light-transmitting element 15 is fixedly arranged on a side of the mounting portion 142 close to the photosensitive chip 12 so that the light-shielding area 152 covers the connecting wire 13.

[0041] It is understandable that the light-transmitting area 151 of the light-transmitting element 15 of the light-shielding base assembly can allow light to pass through so that the photosensitive chip 12 can sense light and form an image. The light-shielding area 152 of the light-transmitting element 15 can block stray light generated by the reflection of the light-shielding base 14, and prevent the stray light generated by the reflection of the light-shielding base 14 from being directed to the photosensitive chip 12. Since the connector is usually implemented as an exposed gold wire, the light-shielding base assembly uses the light-shielding area 152 of the light-transmitting element 15 to block the light directed to the connector, and can prevent the connection line 13 from reflecting and generating stray light. The light-shielding base assembly can make the light-shielding area 152 closer to the connection line 13 by installing the light-transmitting element 15 on the side of the mounting portion 142 of the light-shielding base 14 close to the photosensitive chip 12. While ensuring that there is no dark corner, more light directed to the connection line 13 can be blocked, thereby effectively improving the stray light effect caused by the reflection of the gold wire in the existing COB packaging base.

[0042] More specifically, if Figure 2 As shown, in some embodiments, at least part of a side of the mounting portion 142 facing away from the photosensitive component is an inclined surface 1421, and the inclined surface 1421 extends obliquely from a side of the mounting portion 142 close to the annular seat body 141 to a side of the mounting portion 142 away from the annular seat body 141. In this way, the mounting portion 142 uses the inclined surface 1421 to change the reflection direction of the light directed toward the mounting portion 142, so that the stray light reflected by the mounting portion 142 cannot be directed into the photosensitive area 121 of the photosensitive chip 12, thereby effectively improving the stray light effect generated by the reflection of the light shielding base 14.

[0043] Alternatively, if Figure 3 As shown, in some embodiments, the shading base 14 further includes a plurality of extinction protrusions 143, and the extinction protrusions 143 are convexly arranged on the inclined surface 1421. In this way, the plurality of extinction protrusions 143 can increase the surface complexity of the inclined surface 1421 to reduce the reflectivity of the inclined surface 1421 to light, thereby improving the stray light effect generated by the reflection of the shading base 14.

[0044] Preferably, if Figure 3 As shown, in one embodiment, the matt protrusions 143 are arranged in a sawtooth shape on the inclined surface 1421. In other words, the matt protrusions 143 have a toothed structure, and the matt protrusions 143 are arranged at intervals on the inclined surface 1421, so that the plurality of matt protrusions 143 present a sawtooth structure on the cross section of the mounting portion 142 along the plane perpendicular to the inclined surface 1421. In addition, according to the optical analysis requirements of the camera module, the matt protrusions 143 can also be implemented as having other structures such as arc-shaped structures, and arranged on the inclined surface 1421 according to the arrangement obtained by the analysis.

[0045] More preferably, in one embodiment, the light shielding base 14 can be implemented as a black matte surface to weaken the reflection of light by absorbing optical light.

[0046] Alternatively, if Figure 2 As shown, in some embodiments, the light-transmitting element 15 includes a light-transmitting sheet 153 and an ink layer 154, the ink layer 154 is circumferentially printed on the light-transmitting sheet 153 to form the light-shielding area 152 and the light-transmitting area 151 on the surface of the light-transmitting sheet 153, and the inner diameter of the ink layer 154 is smaller than the inner diameter of the mounting portion 142. In other words, the window size of the light-shielding base 14 is larger than the window size of the ink layer 154 of the light-transmitting element 15, that is, the distance between the light-shielding base 14 and the optical axis of the camera module is larger than the distance between the ink layer 154 of the light-transmitting element 15, so that the ink layer 154 can be used to block stray light generated by reflection at the inner sharp corner of the light-shielding base 14, thereby preventing stray light from entering the photosensitive area 121 of the photosensitive chip 12.

[0047] Optionally, in some embodiments, the ink layer 154 is located on the surface of the light-transmitting sheet 153 close to the photosensitive chip 12 , that is, the light-transmitting element 15 is mounted upright on the light-shielding base 14 .

[0048] Preferably, in some embodiments, the ink layer 154 is located on the surface of the light-transmitting sheet 153 away from the photosensitive chip 12 , that is, the light-transmitting element 15 is flipped on the light-shielding base 14 .

[0049] It can be understood that, while keeping the window sizes of the light-transmitting element 15 and the light-shielding base 14 unchanged, the ink layer 154 in the structure in which the light-transmitting element 15 is flipped on the light-shielding base 14 is closer to the photosensitive chip 12, and has a better light-shielding effect.

[0050] Optionally, in some embodiments, the light-transmitting sheet 153 may be implemented as a glass material, or may be implemented as a member made of other light-transmitting materials.

[0051] Optionally, in some embodiments, the surface of the light-transmitting sheet 153 has an anti-reflection film or a filter film. When the surface of the light-transmitting sheet 153 is provided with an anti-reflection film, the reflected light on the surface of the light-transmitting sheet 153 can be reduced or eliminated, and the light transmittance of the light-transmitting element 15 is increased; when the surface of the light-transmitting sheet 153 is provided with a filter film, light of a set wavelength can be transmitted, so as to filter out stray light in the external environment, which is beneficial to improving the imaging quality of the camera module.

[0052] Optionally, in some embodiments, the light-transmitting sheet 153 is bonded to the mounting portion 142. The light-transmitting sheet 153 can be bonded and fixed to the mounting portion 142 by adhesives such as glue to prevent impurities such as dust and water vapor from entering the light-shielding base 14 and contacting the photosensitive chip 12, thereby ensuring that the camera module has a high imaging quality.

[0053] Optionally, in some embodiments, the annular base 141 is bonded to the circuit board 11. The annular base 141 can be bonded and fixed to the circuit board 11 by adhesives such as glue to prevent impurities such as dust and water vapor from entering the light shielding base 14 and contacting the photosensitive chip 12, thereby ensuring that the camera module has a high imaging quality.

[0054] Preferably, if Figure 2 As shown, in some embodiments, the inner diameter of the ink layer 154 is smaller than the inner diameter of the mounting portion 142. In other words, the window size of the light shielding base 14 is larger than the window size of the ink layer 154 of the light-transmitting element 15, that is, the distance between the light shielding base 14 and the optical axis of the camera module is larger than the distance between the ink layer 154 of the light-transmitting element 15, so that the ink layer 154 can be used to block stray light generated by reflection at the inner sharp corner of the light shielding base 14, thereby preventing stray light from entering the photosensitive area 121 of the photosensitive chip 12.

[0055] Preferably, if Figure 1 As shown, in some embodiments, the light-shielding base assembly may further include a filter element 16, which is disposed on a side of the light-shielding base 14 away from the photosensitive chip 12, and is used to transmit light of a set wavelength so as to filter out stray light in the external environment and only allow light of a specific wavelength in the external environment to enter, thereby helping to improve the imaging quality of the camera module.

[0056] Exemplarily, the light-shielding base assembly of the present application is further described below in conjunction with specific examples.

[0057] like Figure 4The figure shows a light schematic diagram of a COB packaging base of a scheme in the prior art, wherein the COB packaging base of the scheme includes a first circuit board P11, a first base P12, a first sensing chip P13, a first connecting line P14, a first light-transmitting element P15 and a first filter P16. In the COB packaging base of the scheme, the first light-transmitting element P15 is mounted on the first base P12, and the silk-screen ink layer of the first light-transmitting element P15 is on the upper surface of the first light-transmitting element P15. The light a directed to the first base P12 is reflected by the first base P12 and directed to the photosensitive area 121 of the first sensing chip P13; the light b directed to the first connecting line P14 is reflected by the first connecting line P14, and after being directed to the first filter P16, it is reflected by the first filter P16 and directed to the photosensitive area 121 of the first sensing chip P13. The silk-screen ink layer of the first light-transmitting element P15 cannot cover the light a and the light b.

[0058] like Figure 5 The figure shows a light schematic diagram of a COB packaging base of another scheme in the prior art, wherein the COB packaging base of the other scheme includes a second circuit board P21, a second base P22, a second sensing chip P23, a second connecting line P24 and a second light-transmitting element P25, wherein the window size of the second base P22 is the same as the window size of the first base P12, the window size of the second light-transmitting element P25 is the same as the window size of the first light-transmitting element P15, and the size of the photosensitive area 121 of the second sensing chip P23 is the same as the size of the photosensitive area 121 of the first sensing chip P13. In the COB packaging base of another scheme, the second light-transmitting element P25 is inverted on the second base P22, and the silk-screen ink layer of the second light-transmitting element P25 is on the lower surface of the second light-transmitting element P25. After the light c directed to the second base P22 is reflected by the second base P22, it is directed to the photosensitive area 121 of the second chip, and the silk-screen ink layer of the second light-transmitting element P25 cannot cover the light c.

[0059] like Figure 6Shown is a light schematic diagram of a light-shielding base assembly provided by an example of the present application. In the light-shielding base assembly of the example, the window size of the light-transmitting element 15 is the same as the window size of the first light-transmitting element P15 of the above-mentioned one scheme and the second light-transmitting element P25 of the other scheme, the window size of the light-shielding base 14 is the same as the window size of the first base P12 of the above-mentioned one scheme and the second base P22 of the other scheme, the size of the photosensitive area 121 of the photosensitive chip 12 is the same as the size of the photosensitive area 121 of the first photosensitive chip 12 of the above-mentioned one scheme and the second photosensitive chip 12 of the other scheme, and the incident angles of light a, light b and light c are also the same as those of one scheme and the other scheme. The light a directed to the light shielding base 14 is intercepted by the ink layer 154 of the light-transmitting element 15, so that the light a does not reach the light shielding base 14, and thus it will not be reflected to generate stray light; the light b directed to the connecting line 13 is intercepted by the ink layer 154 of the light-transmitting element 15, so that the light b cannot reach the connecting line 13, and thus it will not be reflected to generate stray light; the light c directed to the light shielding base 14 is reflected by the inclined surface 1421 of the light shielding base 14, and directed to a direction away from the photosensitive chip 12, thereby preventing stray light from entering the photosensitive chip 12. Therefore, under the same conditions, the light shielding photosensitive component of the present application can better improve the stray light problem of the camera module.

[0060] like Figure 7 The figure shows a schematic diagram of light when the light-transmitting element 15 of the light-shielding base assembly of the present application is installed upright on the light-shielding base 14. In the light-shielding base assembly, the light-transmitting element 15 is fixed to the light-shielding base 14 in an upright manner, and the ink layer 154 of the light-transmitting element 15 cannot block the light d directed toward the connecting line 13.

[0061] like Figure 8 The figure shows a schematic diagram of light when the light-transmitting element 15 of the light-shielding base assembly of the present application is inverted on the light-shielding base 14. In the light-shielding base assembly, the light-transmitting element 15 is fixed to the light-shielding base 14 in an inverted manner. Without changing the window size of the light-shielding base 14 and the window size of the light-transmitting element 15, the incident angle of the light d is kept unchanged. The ink layer 154 of the light-transmitting element 15 can block the light d directed toward the connecting line 13. Therefore, compared with the structure in which the light-transmitting element 15 is upright, the inverted structure of the light-transmitting element 15 can achieve a better light-shielding effect.

[0062] like Fig. 9As shown, a light schematic diagram of a light-shielding base assembly is provided for another example of the light-shielding base of the present application, wherein the window size of the light-shielding base 14 is larger than the window size of the light-transmitting element 15, and when the light e directed toward the sharp corner of the mounting portion 142 of the light-shielding base 14 is reflected and then directed toward the sensing area of ​​the sensing chip, the light-transmitting element 15 can block the light e directed toward the connecting line 13, therefore, when the inner diameter of the ink layer 154 is smaller than the inner diameter of the mounting portion 142, the light-transmitting element 15 can achieve a better light-shielding effect.

[0063] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A light-shielding base assembly, characterized in that: include: Circuit board; A photosensitive chip, the photosensitive chip is attached to the circuit board, and the photosensitive chip has a photosensitive area and a non-photosensitive area located around the photosensitive area; A plurality of connecting wires, one end of each connecting wire is connected to the circuit board, and the other end of each connecting wire is connected to the non-photosensitive area of ​​the photosensitive chip; A light-shielding base, the light-shielding base comprising an annular base and a mounting portion, the annular base protruding from the circuit board to surround the photosensitive chip, the mounting portion extending from the annular base toward the non-photosensitive area of ​​the photosensitive chip, a side of the mounting portion facing away from the photosensitive chip being at least partially an inclined surface, the inclined surface obliquely extending from a side of the mounting portion close to the annular base toward a direction close to the photosensitive chip to a side of the mounting portion away from the annular base; and A light-transmitting element having a light-transmitting area and a light-shielding area around the light-transmitting area, wherein the light-transmitting element is fixedly arranged on a side of the mounting portion close to the photosensitive chip so that the light-shielding area covers the connecting wire.

2. The light-shielding base assembly according to claim 1, characterized in that: The light-shielding base further includes a plurality of matting protrusions, and the matting protrusions are protruding from the inclined surface.

3. The light-shielding base assembly according to claim 2, characterized in that: The matte protrusions are arranged on the inclined surface in a zigzag shape.

4. The light-shielding base assembly according to any one of claims 1 to 3, characterized in that: The light-transmitting element includes a light-transmitting sheet and an ink layer, wherein the ink layer is printed on the light-transmitting sheet in a circumferential manner to form the light-shielding area and the light-transmitting area on the surface of the light-transmitting sheet, and the inner diameter of the ink layer is smaller than the inner diameter of the mounting portion.

5. The light-shielding base assembly according to claim 4, characterized in that: The ink layer is located on the surface of the light-transmitting sheet close to the photosensitive chip.

6. The light-shielding base assembly according to claim 4, characterized in that: The ink layer is located on a surface of the light-transmitting sheet away from the photosensitive chip.

7. The light-shielding base assembly according to claim 4, characterized in that: The surface of the light-transmitting sheet is provided with an anti-reflection film or a light-filtering film.

8. The light-shielding base assembly according to claim 4, characterized in that: The light-transmitting sheet is bonded to the mounting portion.

9. The light-shielding base assembly according to any one of claims 1 to 3, characterized in that: The light blocking base has a matte black finish.

10. The light-shielding base assembly according to any one of claims 1 to 3, characterized in that: The light-shielding base assembly further includes a filter element, and the filter element is arranged on a side of the light-shielding base away from the photosensitive chip.

11. A camera module, characterized in that: include: The light-shielding base assembly according to any one of claims 1 to 10; and The lens assembly is mounted on the light-shielding base assembly.

Images