Liquid cooling device and liquid cooling electronic equipment
By setting up extension fillers and detection lines between the cold plate and the support components of the liquid cooling device, the damage to electrical components caused by liquid leakage is solved, and the high reliability and waterproof effect of liquid cooling electronic equipment is achieved. It is suitable for a variety of applications. Device type.
Patent Information
- Application Number
- CN202411332070.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2044-09-24
AI Technical Summary
Existing liquid cooling devices are prone to liquid leakage when the cold plate is poorly designed or assembled, resulting in short circuits and corrosion of electrical components, affecting equipment performance and reliability. The liquid leakage detection technology cannot prevent liquid from dripping onto the main board in time and causing damage.
A liquid cooling device is designed to form a hollow part to collect liquid by providing an extended filler between the cold plate and the support member, and a liquid leakage detection line and a liquid accumulation detection line are arranged on the liquid cooling circulation pipeline, combining the water absorption component and The controller issues an alarm signal to ensure that the liquid does not drip on the motherboard.
Effectively prevent liquid from dripping onto the motherboard, reduce damage and corrosion to electrical components, improve the reliability and waterproof effect of liquid-cooled electronic equipment, and is suitable for different types of liquid-cooled electronic equipment, without changing the chassis design, saving R&D time and cost.
Smart Images

Figure CN119233598A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of liquid leakage protection, in particular to a liquid cooling device and a liquid cooling electronic equipment. Background Art
[0002] In order to solve the increasing power consumption of CPU (Central Processing Unit) and GPU (Graphics Processing Unit) and pursue better PUE (Power Usage Effectiveness), liquid cooling is usually considered to reduce the power consumption of major heat-generating components such as CPU, GPU, memory, etc.
[0003] Liquid cooling technology generally uses a cold plate for heat dissipation. The cold plate is connected to a manifold and a liquid circulation pipeline. The cold plate is fitted with the component to be cooled. The liquid circulation pipeline is connected between the manifold and the cold plate, or between the cold plates. Cold water flows into the cold plate from one end of the cold pipe, flows through the heat-generating component, takes out the heat, and then flows out hot water through the other end of the cold pipe, and circulates continuously to achieve the cooling effect. However, when the cold plate is poorly designed or improperly assembled, it may cause tiny holes in the cold plate, causing liquid leakage. If the liquid drips onto the motherboard below, it will cause a short circuit in the electrical components and damage the equipment. Secondly, liquid leakage may also cause corrosion to the electronic components and circuits inside the electronic equipment, thereby affecting the performance and reliability of the electronic equipment.
[0004] In the related art, a leakage detection line is set on the cold plate or the liquid circulation pipeline. When a leakage is detected, an alarm is issued. After the computer room staff finds out, they will replace the broken machine. However, when the computer room staff cannot replace the machine in time, the leakage may drip onto the mainboard below, causing damage to the machine.
[0005] Therefore, how to improve the reliability of the liquid cooling device is a technical problem that technical personnel in this field currently need to solve. Summary of the invention
[0006] The purpose of the present invention is to provide a liquid cooling device and a liquid cooling electronic device, which can effectively prevent liquid from falling onto a mainboard and are reliable in use.
[0007] To achieve the above object, the present invention provides the following technical solutions:
[0008] A liquid cooling device, comprising:
[0009] The cold plate body is arranged on the component to be cooled and is used to absorb the heat of the component to be cooled;
[0010] A liquid cooling circulation pipeline connected to the cold plate body and used to provide cooling medium to the cold plate body;
[0011] A supporting component connected to the cold plate body, used to support the cold plate body and placed on the main board, with hollow parts between adjacent cold plate bodies and between the cold plate body and the supporting component;
[0012] The extended filling piece includes a plurality of filling piece monomers, wherein the filling piece monomers are located in the hollow portion, the edges of the filling piece monomers are installed on the edges of the cold plate body, a water storage tank is provided on the surface of one side of the filling piece monomer close to the liquid cooling circulation pipeline, and the filling piece monomers are connected in sequence and interconnected.
[0013] On the other hand, it also includes:
[0014] A water absorbing component is arranged in the water storage tank and is used to absorb the liquid entering the water storage tank; the water absorbing component is adapted to the size of the water storage tank, and the water absorbing component can be detachably placed in the water storage tank.
[0015] On the other hand, it also includes:
[0016] A liquid leakage detection line is arranged on the liquid cooling circulation pipeline and is used to send a liquid leakage signal when the liquid cooling circulation pipeline leaks;
[0017] Furthermore, a plurality of water receiving grooves are provided on the cold plate body, and the water receiving grooves are located below the liquid leakage detection line to bear the liquid leakage of the liquid cooling circulation pipeline.
[0018] On the other hand, it also includes:
[0019] a first liquid accumulation detection line, installed in the water receiving groove, and used for sending a first liquid accumulation signal when the liquid level in the water receiving groove is higher than a first preset height;
[0020] The controller is connected to the liquid leakage detection line and the liquid accumulation detection line, and is used for sending an alarm signal after receiving the liquid leakage signal and the first liquid accumulation signal.
[0021] On the other hand, it also includes:
[0022] A groove adsorption component is arranged in the water receiving groove, and is used to adsorb liquid flowing into the water receiving groove. The top height of the groove adsorption component is lower than the arrangement height of the first liquid accumulation detection line.
[0023] On the other hand, a welding part is provided on the liquid cooling circulation pipeline, on the cold plate body and / or between the liquid cooling circulation pipeline and the cold plate body; the water receiving groove is located below the welding part, and arc chamfers are provided at the corners of the water receiving groove.
[0024] On the other hand, it also includes:
[0025] A fastener for connecting the extended filler, the cold plate body and the main plate;
[0026] Furthermore, the filler unit is located between the cold plate body and the main board, and the surface of the filler unit is flush with the surface of the cold plate body.
[0027] On the other hand, the extended filling piece further includes a plurality of water guiding parts, the water guiding parts are connected between adjacent filling piece monomers, and the water guiding parts are interconnected with the filling piece monomers, and the filling piece monomers and the water guiding parts are both arranged in the hollow part.
[0028] On the other hand, the extended filling member is an integral structural member, and the extended filling member is a plastic member or a resin member;
[0029] The size of the filling unit is larger than the size of the water guide part, and the edge of the filling unit is arranged to fit the edge of the cold plate body so that the liquid flowing into the surface of the cold plate body can flow into the water storage tank of the filling unit;
[0030] The filling member monomers are arranged at intervals, and adjacent filling member monomers are connected through at least two water guide portions, and the water guide portions are connected to the side portions of the filling member monomers, and the water guide portions extend along the bottom of the supporting component to connect two filling member monomers;
[0031] The water storage tank is located on the filling member monomer, the water guide portion is provided with a flow channel, and both ends of the flow channel of the water guide portion are connected between the water storage tanks of two filling member monomers to allow liquid to flow between adjacent filling member monomers;
[0032] An escape space for evading the electrical components on the cold plate body or the main board is provided between adjacent filling member monomers, between adjacent water guide parts, and / or between the filling member monomers and the water guide parts;
[0033] Furthermore, when installing the extended filling piece and the cold plate body, the extended filling piece and the cold plate body are simultaneously placed on the main board for fixing, and the cold plate body and the component to be cooled are positioned correspondingly, and the extended filling piece corresponds to the hollow portion.
[0034] The present invention also provides a liquid-cooled electronic device, comprising any one of the liquid cooling devices described above.
[0035] The liquid cooling device provided by the present invention has the beneficial effect that: by arranging an extended filling piece on the hollow part between adjacent cold plate bodies and between the cold plate body and the supporting part, the hollow part can be filled, thereby preventing the liquid on the cold plate body from dripping onto the main board, and can effectively prevent the liquid from leaking into the main board due to large water leakage at the cold plate body, the liquid cooling circulation pipeline, or the connection between the cold plate body and the liquid cooling circulation pipeline; further, since the cold plate body is arranged on the component to be cooled, by absorbing the heat of the component to be cooled, To dissipate heat for the component to be cooled, the cold plate body is arranged at a position corresponding to the component to be cooled. To facilitate the arrangement of the cold plate body, the cold plate body is supported by the support member, and the support member generally only fixes the side of the cold plate body. A large number of hollow parts are formed between the support member and the cold plate body, and between adjacent cold plate bodies. The present application arranges a plurality of the filling member monomers, and arranges the filling member monomers one by one according to the corresponding positions of the hollow parts, thereby completing the filling of all the hollow parts. At the same time, in order to The lining of the cold plate body is provided with a water storage tank on one side of the filling unit close to the liquid cooling circulation pipeline. When the water leakage in the cold plate body or the liquid cooling circulation pipeline is large, or when the water leakage occurs and the staff does not handle it in time, the liquid on the surface of the cold plate body increases and then flows into the water storage tank of the filling unit, thereby further avoiding the leakage. Prevent liquid from dripping onto the mainboard, reduce damage to electrical components on the mainboard, reduce corrosion, and ensure the normal operation of liquid-cooled electronic equipment; at the same time, in order to further improve reliability, the present application connects the filling member monomers in sequence and interconnects them, that is, the filling member monomers in each hollow part are interconnected. This arrangement is to ensure that when the amount of water leakage at a certain location is large, it can flow through the water storage tank of the filling member monomer at that location to the water storage tank of other filling member monomers, thereby avoiding overflow of the water storage tank due to large water leakage, and further ensuring the reliability of the waterproof effect.
[0036] The liquid cooling device provided by the present invention can effectively prevent leakage of the cold plate body or the liquid cooling circulation pipeline from damaging the liquid-cooled electronic equipment. It is simple to manufacture and only requires designing the extended filling piece according to the position of the cold plate body, the position of the supporting component, and the position of the electrical components that need to be avoided on the main board. Then, the extended filling piece and the cold plate body are installed on the main board at the same time, which can significantly improve the waterproof effect. The liquid cooling device can be applied to different types of liquid-cooled electronic equipment without changing the chassis design, effectively reducing R&D time and manpower investment, and saving costs.
[0037] In one embodiment, it also includes: a leakage detection line, which is arranged on the liquid cooling circulation pipeline, and is used to send a leakage signal when the liquid cooling circulation pipeline leaks, reminding the staff to repair it in time, and giving the location of the leakage point; and a plurality of water receiving grooves are provided on the cold plate body, and the water receiving grooves are located below the leakage detection line to carry the leakage of the liquid cooling circulation pipeline. When the staff cannot repair the leakage point in time, the liquid will drip into the water receiving groove, thereby collecting the dripping liquid, effectively preventing the dripping liquid from entering the mainboard, and playing a supplementary waterproof effect. When the liquid in the water receiving groove is overflowing, the liquid flows from the water receiving groove to the water storage tank of the filling piece monomer, which can more comprehensively play a waterproof effect and avoid damage to the mainboard.
[0038] The liquid-cooled electronic device provided by the present invention is provided with the above-mentioned liquid cooling device. Since the liquid cooling device has the above-mentioned technical effects, the liquid-cooled electronic device provided with the liquid cooling device should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0040] Figure 1 This is a schematic diagram of the structure of the cold plate body and the supporting components in the liquid cooling device provided by the present invention;
[0041] Figure 2 for Figure 1 A structural schematic diagram of the liquid cooling device from another perspective is shown;
[0042] Figure 3 A schematic structural diagram of a specific implementation of the liquid cooling device provided by the present invention;
[0043] Figure 4 for Figure 3A schematic diagram of the structure of a water receiving groove on a cold plate body in a liquid cooling device shown;
[0044] Figure 5 for Figure 3 A schematic diagram of the structure of an extended filling member in the liquid cooling device shown;
[0045] Figure 6 This is a schematic diagram of the control method of the liquid cooling device provided by the present invention.
[0046] Reference numerals:
[0047] The cold plate body 100; the water receiving groove 110; the liquid cooling circulation pipeline 200; the supporting component 300; the hollow part 400; the extended filling piece 500; the filling piece monomer 510; the water storage tank 511; the water guiding part 520; the flow channel 521; the second liquid accumulation detection line 540; the water absorption component 500; the controller 600; the liquid leakage detection line 610; the first liquid accumulation detection line 620; the alarm component 630. DETAILED DESCRIPTION
[0048] The core of the present invention is to provide a liquid cooling device and a liquid cooling electronic device, which can significantly reduce the damage to the mainboard and avoid the corrosion of electrical components caused by liquid leakage.
[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0050] Please refer to Figures 1 to 3 As shown, Figure 1 This is a schematic structural diagram of a cold plate body 100 and a supporting component 300 in a liquid cooling device provided by the present invention; Figure 2 for Figure 1 A structural schematic diagram of the liquid cooling device from another perspective is shown; Figure 3 This is a schematic structural diagram of a specific implementation of the liquid cooling device provided by the present invention.
[0051] In this embodiment, the liquid cooling device comprises:
[0052] The cold plate body 100 is arranged on the component to be cooled and is used to absorb the heat of the component to be cooled;
[0053] The liquid cooling circulation pipeline 200 is connected to the cold plate body 100 and is used to provide cooling medium to the cold plate body 100;
[0054] The support component 300 is connected to the cold plate body 100 and is used to support the cold plate body 100 and be placed on the main board. There is a hollow part 400 between adjacent cold plate bodies 100 and between the cold plate body 100 and the support component 300.
[0055] The extended filling member 500 includes a plurality of filling member monomers 510, the filling member monomers 510 are located in the hollow portion 400, the edges of the filling member monomers 510 are installed on the edges of the cold plate body 100, a water storage tank 511 is provided on the surface of one side of the filling member monomer 510 close to the liquid cooling circulation pipeline 200, and the filling member monomers 510 are connected in sequence and interconnected.
[0056] Specifically, the cold plate body 100 is connected to the manifold at the cabinet through a pipeline, and the cooling medium is distributed to each cold plate body 100 through the manifold, and then circulated through the liquid circulation pipeline to complete the heat exchange; the working principle between the manifold and the cold plate body 100 and the liquid circulation pipeline can refer to the relevant technology; the support component 300 and the cold plate body 100 can be fixed by screw connection, and the support component 300 is arranged around the cold plate body 100 to support the cold plate body 100 on the surface of the component to be cooled, so as to facilitate heat exchange; the support component 300 and the cold plate body 1 00 constitutes a cold plate structure for installing a device; since the layout of the support component 300 and the cold plate body 100 needs to be set according to the position of the component to be cooled, a hollow part 400 is formed between adjacent cold plate bodies 100, and / or between the cold plate body 100 and the support component 300, that is, a hole is formed on the cold plate structure. In order to prevent leakage from dripping onto the main board through the hollow part 400 and damaging the electrical components, an extended filling piece 500 is additionally provided; the shape of the extended filling piece 500 is determined according to the position and layout of the cold plate body 100 and the support component 300 to ensure a good waterproof effect.
[0057] The liquid cooling device provided by the present invention can fill the hollow part 400 by arranging an extended filling piece 500 on the hollow part 400 between adjacent cold plate bodies 100 and between the cold plate body 100 and the supporting part 300, thereby preventing the liquid on the cold plate body 100 from dripping onto the main board, and can effectively prevent the liquid from leaking into the main board due to large water leakage at the cold plate body 100, the liquid cooling circulation pipeline 200, or the connection between the cold plate body 100 and the liquid cooling circulation pipeline 200.
[0058] Furthermore, since the cold plate body 100 is arranged on the component to be cooled, the heat of the component to be cooled is dissipated by absorbing the heat of the component to be cooled. Therefore, the cold plate body 100 is arranged at a position corresponding to the component to be cooled. In order to facilitate the arrangement of the cold plate body 100, it is supported by the support component 300, and the support component 300 generally only fixes the side of the cold plate body 100, and a large number of hollow parts 400 are formed between the support component 300 and the cold plate body 100, and between adjacent cold plate bodies 100. The present application arranges a plurality of filling member monomers 510, and arranges the filling member monomers 510 one by one according to the corresponding positions of the hollow parts 400, thereby completing the filling of all the hollow parts 400; at the same time, in order to facilitate assembly, ensure The filling member monomer 510 fits more closely to the cold plate body 100, and the edge of the filling member monomer 510 is installed on the edge of the cold plate body 100, ensuring that the liquid on the surface of the cold plate body 100 can flow smoothly to the filling member monomer 510; further, by providing a water storage tank 511 on the surface of one side of the filling member monomer 510 close to the liquid cooling circulation pipeline 200, when the amount of water leakage in the cold plate body 100 or the liquid cooling circulation pipeline 200 is large, or when the water leakage occurs and the staff does not deal with it in time, the liquid on the surface of the cold plate body 100 increases, and then gathers and flows into the water storage tank 511 of the filling member monomer 510, further preventing the liquid from dripping onto the mainboard, reducing damage to the electrical components on the mainboard, reducing corrosion, and ensuring the normal operation of liquid-cooled electronic equipment.
[0059] At the same time, in order to further improve reliability, the present application connects each filling member monomer 510 in sequence and interconnects them, that is, the filling member monomers 510 of each hollow part 400 are interconnected. This arrangement is to ensure that when the amount of water leakage at a certain location is large, it can flow through the water storage tank 511 of the filling member monomer 510 at that location and flow to the water storage tank 511 of other filling member monomers 510, thereby avoiding overflow of the water storage tank 511 due to large water leakage, thereby further ensuring the reliability of the waterproof effect.
[0060] The liquid cooling device provided by the present invention can effectively prevent liquid leakage from the cold plate body 100 or the liquid cooling circulation pipeline 200 from damaging the liquid-cooled electronic equipment. It is simple to manufacture and only requires designing the extended filling piece 500 according to the position of the cold plate body 100, the position of the supporting component 300, and the position of the electrical components that need to be avoided on the mainboard. Then, the extended filling piece 500 and the cold plate body 100 are installed on the mainboard at the same time, which can significantly improve the waterproof effect. The liquid cooling device can be applied to different types of liquid-cooled electronic equipment without changing the chassis design, effectively reducing R&D time and manpower investment, and saving costs.
[0061] In some embodiments, it further includes: a water absorbing component 500, which is arranged in the water storage tank 511 and is used to absorb the liquid entering the water storage tank 511; the water absorbing component 500 is adapted to the size of the water storage tank 511, and the water absorbing component 500 is detachably placed in the water storage tank 511. Specifically, the washing component can be a sponge, and any material that can absorb water can be used. By setting the water absorbing component 500, when leakage occurs and has converged to the water storage tank 511, it means that the leakage is large or the leakage time is long. Since the water storage tank 511 of the filling unit 510 is the last waterproof defense line, the water absorbing component 500 is arranged in the water storage tank 511. While collecting the leaked liquid, the leaked liquid can be absorbed, effectively preventing the leaked liquid from dripping onto the main board; at the same time, the setting of the water absorbing component 500 can also facilitate maintenance. After repairing the leaking point, the accumulated liquid in the water storage tank 511 can be removed by directly replacing the water absorbing component 500, without the need for other drainage equipment, and the operation is convenient.
[0062] Please refer to Figure 4 and Figure 6 , Figure 4 for Figure 3 The schematic diagram of the structure of the water receiving groove 110 on the cold plate body 100 in the liquid cooling device shown in FIG. Figure 6 Figure 6 This is a schematic diagram of the control method of the liquid cooling device provided by the present invention.
[0063] In some embodiments, it also includes: a leakage detection line 610, which is arranged on the liquid cooling circulation pipeline 200, and is used to send a leakage signal when the liquid cooling circulation pipeline 200 leaks. The wet leakage detection line 610 will send an alarm because the impedance will change, reminding the staff to repair it in time and giving the location of the leakage point; and, a plurality of water receiving grooves 110 are provided on the cold plate body 100, and the water receiving grooves 110 are located below the leakage detection line 610 to carry the leakage of the liquid cooling circulation pipeline 200. When the staff cannot repair the leakage point in time, the liquid will drip into the water receiving grooves 110, thereby collecting the dripping liquid, effectively preventing the dripping liquid from entering the mainboard, and playing a supplementary waterproof effect. When the liquid in the water receiving grooves 110 is overflowing, the liquid flows from the water receiving grooves 110 to the water storage tank 511 of the filling member monomer 510, which can more comprehensively play a waterproof effect and avoid damage to the mainboard.
[0064] In some embodiments, it further comprises:
[0065] The first liquid accumulation detection line 620 is installed in the water receiving groove 110, and is used to send a first liquid accumulation signal when the liquid level in the water receiving groove 110 is higher than a first preset height; specifically, when arranging the first liquid accumulation detection line 620, the first liquid accumulation detection line 620 can be arranged on the side wall of the water receiving groove 110, and a certain distance is left between the first liquid accumulation detection line 620 and the bottom of the water receiving groove 110, so that the water receiving groove 110 has a certain liquid accumulation carrying capacity, that is, when the accumulated water in the water receiving groove 110 has a certain amount, it will not exceed the first liquid accumulation detection line 620. When the first liquid accumulation detection line 620 detects liquid, it means that the liquid in the water receiving groove 110 is about to be filled, and the first liquid accumulation signal can be sent at this time;
[0066] The controller 600 is connected to the liquid leakage detection line 610 and the liquid accumulation detection line, and is used to send out an alarm signal after receiving the liquid leakage signal and the first liquid accumulation signal.
[0067] Furthermore, the device also includes an alarm component 630, and an alarm signal can be sent through the alarm component 630. In order to better distinguish the degree of leakage, when the controller 600 receives the leakage signal, it can control the alarm component 630 to send a first alarm signal, such as a buzzer, a flashing light, etc., indicating that a leak has occurred in the liquid cooling device; when the controller 600 receives the first leakage signal, it can control the alarm component 630 to send a second alarm signal, such as a louder buzzer, a brighter flashing light, or a combination of the two methods, indicating that not only a leak has occurred in the liquid cooling device, but also the leakage at the leak is about to overflow the water receiving groove 110, which can provide the staff with the need to seal the leak as soon as possible.
[0068] In some embodiments, it further comprises:
[0069] The groove adsorption component is arranged in the water receiving groove 110. The groove adsorption component is used to absorb the liquid flowing into the water receiving groove 110. The top height of the groove adsorption component is lower than the arrangement height of the first liquid accumulation detection line 620, so as to ensure that the first liquid accumulation detection line 620 can effectively detect the liquid in the water receiving groove 110. Similarly, the groove adsorption component can also be a sponge, and any material that can absorb water can be used. Through the arrangement of the groove adsorption component, when leakage occurs and has flowed to the water receiving groove 110, the arrangement of the groove adsorption component can absorb the leakage while collecting the leakage, so as to effectively prevent the leakage from overflowing. At the same time, through the arrangement of the groove adsorption component, after repairing the water leakage point, the accumulated liquid in the water receiving groove 110 can be removed by directly replacing the groove adsorption component without the need for other drainage equipment. The operation is convenient, the cost is low, and the waterproof effect is good.
[0070] In some embodiments, a welding portion is provided on the liquid cooling circulation pipeline 200, on the cold plate body 100, and / or between the liquid cooling circulation pipeline 200 and the cold plate body 100; the water receiving groove 110 is located below the welding portion. Since the probability of water leakage in the welding portion is relatively high, arranging the water receiving groove 110 at a position with higher risk can reduce costs, and the water receiving groove 110 is provided with arc chamfers at the corners to avoid the formation of sharp corners, which causes corrosion and reduces stress concentration.
[0071] Specifically, the depth of the water receiving groove 110 is 3-5mm. Of course, the depth of the water receiving groove 110 can be determined according to the position of the cold plate body 100 or the liquid cooling circulation pipeline 200 corresponding to the water receiving groove 110. For the position of the welding point, the possibility of water leakage is greater and the amount of water leakage is large. The depth and size of the water receiving groove 110 at this position can be appropriately increased. For the position with a smaller possibility of water leakage and a smaller amount of water leakage, the depth and size of the water receiving groove 110 at this position can be appropriately reduced. Furthermore, the water receiving groove 110 is square, which is convenient for processing.
[0072] In some embodiments, it further comprises:
[0073] The second liquid accumulation detection line 540 is installed in the water storage tank 511, and is used to send a second liquid accumulation signal when the liquid level in the water storage tank 511 is higher than a second preset height; specifically, when arranging the second liquid accumulation detection line 540, the second liquid accumulation detection line 540 can be set on the side wall of the water storage tank 511, or it can also be set on the side of the edge of the extended filling member 500 with a higher position. When the liquid in the extended filling member 500 reaches a certain amount, it will cover the second liquid accumulation detection line 540, and the second liquid accumulation detection line 540 will be soaked, resulting in a change in impedance, thereby sending a second liquid leakage signal to the controller 600, and a certain distance is left between the second liquid accumulation detection line 540 and the bottom of the water storage tank 511, so that the water storage tank 511 has a certain liquid accumulation carrying capacity;
[0074] The controller 600 is connected to the second liquid accumulation detection line 540, and is used to control the liquid-cooled electronic device to be powered off after receiving the liquid leakage signal and the first liquid accumulation signal and the second liquid accumulation signal; specifically, when the controller 600 receives the second liquid leakage signal, it indicates that not only a leak has occurred in the liquid cooling device, but also the leaked liquid at the leak has overflowed the water receiving groove 110 and collected in the water storage tank 511, and is about to overflow the water storage tank 511. At this time, the liquid-cooled electronic device should be powered off to avoid damage to the electrical components on the mainboard.
[0075] In some embodiments, it further comprises:
[0076] A fastener for connecting the extended filler 500, the cold plate body 100 and the main plate;
[0077] In addition, the filler unit 510 is located between the cold plate body 100 and the main board, and the surface of the filler unit 510 is flush with the surface of the cold plate body 100; specifically, the fastener can be a screw, and the fastener can adopt the original connecting piece between the cold plate body 100 and the main board, and utilize the original structure to connect the filler unit 510 to the cold plate body 100, which is convenient for material acquisition and saves costs.
[0078] Please refer to Figure 5 , Figure 5 for Figure 3 A schematic structural diagram of an extended filling piece 500 in a liquid cooling device is shown.
[0079] In some embodiments, the extended filling piece 500 also includes a plurality of water guiding portions 520, the water guiding portions 520 are connected between adjacent filling piece monomers 510, and the water guiding portions 520 and the filling piece monomers 510 are interconnected, and the filling piece monomers 510 and the water guiding portions 520 are both arranged in the hollow portion 400; specifically, the extension direction of the water guiding portions 520 is perpendicular to the extension direction of the filling piece monomers 510, and is used to guide the liquid in a filling piece monomer 510 into another filling piece monomer 510 to prevent the liquid from overflowing too quickly; when the water guiding portions 520 interfere with the position of the support component 300, the water guiding portions 520 can pass through the bottom of the support component 300. Of course, regarding the extended filling piece 500, a filling piece monomer 510 may also be provided only in the hollow part 400, that is, a plurality of filling piece monomers 510 are provided separately to fill the hollow part 400, and the filling piece monomer 510 is connected to the cold plate body 100 by fasteners. When there is liquid on the cold plate body 100, it can flow into the water storage tank 511 of the filling piece monomer 510 to prevent the accumulated water from falling onto the main board.
[0080] In some embodiments, the extended filling piece 500 is an integrated structural part. When processing the extended filling piece 500, the shape, position and number of the filling piece monomer 510 and the water-conducting component of the extended filling piece 500 are first determined according to the position of the cold plate body 100 and the supporting component 300. Then, the completed extended filling piece 500 can be processed by opening a mold, which is convenient for operation. The extended filling piece 500 has a good waterproof effect. The liquid in the water storage tank 511 can only flow in each filling piece monomer 510 and the water-conducting component, and will not drip onto the mainboard.
[0081] Furthermore, the extended filling piece 500 is a plastic piece or a resin piece, which is light in weight and prevents the chassis from sinking; specifically, the extended filling piece 500 can be PET (polyethylene terephthalate) or PVC (polyvinyl chloride), which is easy to process and has low cost;
[0082] The size of the filling member monomer 510 is larger than the size of the water guide portion 520. The water guide portion 520 can only play a role in guiding flow, and of course, can play a certain role in storing water. The edge of the filling member monomer 510 is arranged in close contact with the edge of the cold plate body 100. The edge of the filling member monomer 510 is located at the bottom of the edge of the cold plate body 100, so that the liquid flowing into the surface of the cold plate body 100 can flow into the water storage tank 511 of the filling member monomer 510 to avoid dripping onto the main board.
[0083] The filling member monomers 510 are arranged at intervals, which should be based on the position of the cold plate body 100. The adjacent filling member monomers 510 are connected by at least two water guide parts 520 to improve the flow speed and ensure the rapid flow of liquid between the filling member monomers 510. The water guide parts 520 are connected to the side of the filling member monomers 510, and the water guide parts 520 extend along the bottom of the support component 300 to connect the two filling member monomers 510.
[0084] The water storage tank 511 is located on the filling member monomer 510, and the water guide part 520 is provided with a flow channel 521. The two ends of the flow channel 521 of the water guide part 520 are connected between the water storage tanks 511 of two filling member monomers 510, so that liquid can flow between adjacent filling member monomers 510. The water absorbing component 500 is located in the filling member monomer 510 to prevent the accumulated liquid from quickly gathering in the same filling member monomer 510 and overflowing.
[0085] An escape space for evading the electrical components on the cold plate body 100 or the main board is provided between adjacent filling member monomers 510, between adjacent water guide portions 520, and / or between the filling member monomers 510 and the water guide portions 520 to avoid interference with the electrical components;
[0086] Furthermore, when installing the extended filler 500 and the cold plate body 100, the extended filler 500 and the cold plate body 100 are simultaneously placed on the mainboard for fixing, and the cold plate body 100 corresponds to the position of the component to be cooled, and the extended filler 500 corresponds to the hollow part 400, so as to ensure that the extended filler 500 can be smoothly installed on the mainboard to meet the waterproof effect. Of course, a sealing layer can also be provided between the extended filler 500 and the mainboard body to prevent the accumulated liquid from flowing from the gap between the extended filler 500 and the mainboard body.
[0087] Specifically, in a specific embodiment, the liquid cooling device includes a cold plate body 100, a liquid cooling circulation pipeline 200, a support component 300, an extended filling piece 500, a water absorption component 500, a liquid leakage detection line 610 and a first liquid accumulation detection line 620; the cold plate body 100 is arranged on the component to be cooled; the liquid cooling circulation pipeline 200 is installed on the cold plate body 100, and is used to provide a cooling medium to the cold plate body 100; the support component 300 is arranged around the cold plate body 100, and is used to fix the cold plate body 100 to ensure that the cooling medium in the liquid cooling circulation pipeline 200 can smoothly flow into the cold plate body 100; a water receiving groove 110 is provided on the cold plate body 100, and the first liquid accumulation detection line 620 is installed in the water receiving groove 110; the liquid leakage detection line 610 is arranged on the liquid cooling circulation pipeline 200, and when a water leakage point appears in the liquid cooling circulation pipeline 200, the liquid leakage detection line 610 is connected to the cold plate body 100. 0 sends a leakage signal to the controller 600 to remind the staff to repair in time and give the location of the leakage point; the extended filling piece 500 includes a plurality of filling piece monomers 510 and a plurality of water guide parts 520, the filling piece monomers 510 are located in the hollow part 400, the edge of the filling piece monomer 510 is connected to the edge of the cold plate body 100 by a fastener, and a water storage tank 511 is provided on the surface of the filling piece monomer 510 close to the liquid cooling circulation pipeline 200, and the water absorption component 500 is arranged in the water storage tank 511 to absorb the liquid entering the water storage tank 511; each filling piece monomer 510 is connected in sequence, and the water storage tank 511 of each filling piece monomer 510 is interconnected, and the water guide part 520 is connected between adjacent filling piece monomers 510, and the water guide part 520 is interconnected with the filling piece monomer 510, and the filling piece monomer 510 and the water guide part 520 are both arranged in the hollow part 400.
[0088] Specifically, the control process of the liquid cooling device includes:
[0089] When the first liquid accumulation detection line 620 detects liquid, it indicates that the liquid in the water receiving groove 110 is about to be filled, and a first liquid accumulation signal can be issued at this time; when the controller 600 receives the liquid leakage signal, it can control the alarm component 630 to issue a first alarm signal, such as a buzzer, a flash light, etc., indicating that a water leak occurs in the liquid cooling device; when the controller 600 receives the first liquid leakage signal, it can control the alarm component 630 to issue a second alarm signal, such as a louder buzzer, a brighter flash light, or a combination of the two, indicating that not only a water leak occurs in the liquid cooling device, but also the liquid at the leak is about to overflow the water receiving groove 1 10. It can provide the staff with the need to seal the leaking point as soon as possible; when the liquid in the extended filling piece 500 reaches a certain amount, it will cover the second liquid accumulation detection line 540. The second liquid accumulation detection line 540 is soaked, which causes the impedance to change, thereby sending the second leakage signal to the controller 600. The controller 600 is connected to the second liquid accumulation detection line 540. When the controller 600 receives the second leakage signal, it means that not only a leaking point has appeared in the liquid cooling device, but the leaking liquid at the leaking point has overflowed the water receiving groove 110 and collected in the water storage tank 511, and is about to overflow the water storage tank 511. At this time, the liquid-cooled electronic equipment should be powered off to avoid damage to the motherboard.
[0090] Furthermore, absorbent sponges can be placed in the water receiving groove 110 and the water storage tank 511 to absorb more liquid. Leakage detection lines can be set in the water receiving groove 110 and the water storage tank 511. When water soaks the leakage detection line, an alarm can be issued, or even the electrical components on the main board can be directly shut down to avoid damage. The water receiving groove 110 can take care of the water absorption and alarm functions. When the liquid in the water receiving groove 110 overflows, there is an extended filling piece 500 on the outside. The extended filling piece 500 is a plastic film piece. By setting the water storage tank 511, it can carry the liquid overflowing from the water receiving groove 110. The water receiving groove 110 is set at the welding part of the cold plate structure. Since the welding part is prone to water leakage, the waterproof effect is improved.
[0091] The liquid cooling device improves the design of the entire cold plate structure and uses an extended filling piece 500 to fill the hollow part 400 between the cold plate body 100 and the supporting component 300 to form a complete cold plate structure to prevent the accumulated liquid from flowing onto the mainboard. By setting a leakage detection line 610, a first accumulation detection line 620 and a second accumulation detection line 540, different alarm signals can be issued according to the degree of leakage, or the liquid-cooled electronic equipment can be directly shut down to prevent the cold plate from leaking and damaging the machine. The device can be applied to various liquid-cooled electronic equipment, such as switches or servers. Only the cold plate structure design needs to be modified to prevent the leakage from damaging the machine. The chassis design does not need to be considered, thereby reducing research and development time and manpower. The extended filling piece 500 is customized and is completely designed in accordance with the avoidance of the electrical components on the pipeline and the mainboard. It is low in cost, light in weight, has little impact on the chassis, and can be widely promoted.
[0092] In addition to the above-mentioned liquid cooling device, the present invention further provides a liquid-cooled electronic device including the above-mentioned liquid cooling device. For the structures of other parts of the liquid-cooled electronic device, please refer to the relevant technology and will not be described in detail herein.
[0093] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0094] The above is a detailed introduction to the liquid cooling device provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.
Claims
1. A liquid cooling device, characterized in that: include: A cold plate body (100) is arranged on a component to be cooled and is used to absorb heat from the component to be cooled; A liquid cooling circulation pipeline (200) connected to the cold plate body (100) and used to provide cooling medium to the cold plate body (100); A support component (300) connected to the cold plate body (100) and used to support the cold plate body (100) and be placed on the main board, with a hollow portion (400) between adjacent cold plate bodies (100) and between the cold plate body (100) and the support component (300); An extended filling piece (500) comprises a plurality of filling piece monomers (510), wherein the filling piece monomers (510) are located in the hollow portion (400), and the edges of the filling piece monomers (510) are mounted on the edges of the cold plate body (100), and a water storage tank (511) is provided on a surface of one side of the filling piece monomer (510) close to the liquid cooling circulation pipeline (200), and the filling piece monomers (510) are connected in sequence and are interconnected.
2. The liquid cooling device according to claim 1, characterized in that: Also includes: The water absorbing component (500) is arranged in the water storage tank (511) and is used to absorb liquid entering the water storage tank (511); the water absorbing component (500) is adapted to the size of the water storage tank (511), and the water absorbing component (500) is detachably placed in the water storage tank (511).
3. The liquid cooling device according to claim 1, characterized in that: Also includes: A liquid leakage detection line (610), arranged on the liquid cooling circulation pipeline (200), and used to send a liquid leakage signal when the liquid cooling circulation pipeline (200) leaks liquid; Furthermore, a plurality of water receiving grooves (110) are provided on the cold plate body (100), and the water receiving grooves (110) are located below the liquid leakage detection line (610) to receive the liquid leakage of the liquid cooling circulation pipeline (200).
4. The liquid cooling device according to claim 3, characterized in that: Also includes: A first liquid accumulation detection line (620) is installed in the water receiving groove (110) and is used to send a first liquid accumulation signal when the liquid level in the water receiving groove (110) is higher than a first preset height; The controller (600) is connected to the liquid leakage detection line (610) and the liquid accumulation detection line, and is used to issue an alarm signal after receiving the liquid leakage signal and the first liquid accumulation signal.
5. The liquid cooling device according to claim 4, characterized in that: Also includes: A groove adsorption component is arranged in the water receiving groove (110), the groove adsorption component is used to adsorb liquid flowing into the water receiving groove (110), and the top height of the groove adsorption component is lower than the arrangement height of the first liquid accumulation detection line (620).
6. The liquid cooling device according to claim 5, characterized in that: A welding portion is provided on the liquid cooling circulation pipeline (200), on the cold plate body (100), and / or between the liquid cooling circulation pipeline (200) and the cold plate body (100); the water receiving groove (110) is located below the welding portion, and arc chamfers are provided at the corners of the water receiving groove (110).
7. The liquid cooling device according to claim 1, characterized in that: Also includes: A fastener, used for connecting the extended filling piece (500), the cold plate body (100) and the main plate; Furthermore, the filler unit (510) is located between the cold plate body (100) and the main board, and the surface of the filler unit (510) is flush with the surface of the cold plate body (100).
8. The liquid cooling device according to any one of claims 1 to 7, characterized in that: The extended filling piece (500) further comprises a plurality of water guiding portions (520), wherein the water guiding portions (520) are connected between adjacent filling piece monomers (510), and the water guiding portions (520) and the filling piece monomers (510) are interconnected, and the filling piece monomers (510) and the water guiding portions (520) are both arranged in the hollow portion (400).
9. The liquid cooling device according to claim 8, characterized in that: The extended filling piece (500) is an integral structural piece, and the extended filling piece (500) is a plastic piece or a resin piece; The size of the filling unit (510) is larger than the size of the water guide portion (520), and the edge of the filling unit (510) is arranged to fit the edge of the cold plate body (100) so that liquid flowing into the surface of the cold plate body (100) can flow into the water storage tank (511) of the filling unit (510); The filling piece monomers (510) are arranged at intervals, and adjacent filling piece monomers (510) are connected via at least two water guide portions (520), and the water guide portions (520) are connected to the side portions of the filling piece monomers (510), and the water guide portions (520) extend along the bottom of the supporting component (300) to connect the two filling piece monomers (510); The water storage tank (511) is located on the filling member monomer (510), the water guide portion (520) is provided with a flow channel (521), and both ends of the flow channel (521) of the water guide portion (520) are connected between the water storage tanks (511) of two filling member monomers (510) to allow liquid to flow between adjacent filling member monomers (510); An escape space for evading the cold plate body (100) or electrical components on the main board is provided between adjacent filling piece monomers (510), between adjacent water guide portions (520), and / or between the filling piece monomers (510) and the water guide portions (520); Furthermore, when installing the extended filling piece (500) and the cold plate body (100), the extended filling piece (500) and the cold plate body (100) are simultaneously placed on the main board for fixation, and the cold plate body (100) is positioned to correspond to the position of the component to be cooled, and the extended filling piece (500) corresponds to the hollow portion (400).
10. A liquid-cooled electronic device, comprising a liquid cooling device, characterized in that: The liquid cooling device is the liquid cooling device according to any one of claims 1 to 9.
Citation Information
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