Sensor chip welding equipment

Abstract

The invention discloses sensor chip welding equipment, and relates to the technical field of sensor chip welding, the sensor chip welding equipment comprises a transmission assembly, a welding material conveying assembly, a core pin pressing assembly, a driving assembly, an inner housing, a material blocking assembly and a sensor chip limiting assembly, the transmission assembly comprises a base, a driving part, a transmission shaft, a conveying belt and a limiting groove, the driving component is arranged on the base, the transmission shaft is arranged at the output end of the driving component, the welding material conveying assembly is arranged on the base, the driving assembly is arranged between the first storage box body and the second storage box body, the inner housing is arranged in the outer frame box body, and the material blocking assembly is movably arranged on the inner housing. The sensor chip limiting assembly is detachably arranged on the conveying belt. Therefore, the gunpowder and the tin powder are directly added on the sensor chip in a mixed mode, the core pin and the sensor chip are in limited butt joint, the gunpowder and the tin powder are melted in a hot mode to enable the core pin and the chip to be directly welded and fixed together, efficiency is higher, and the welding yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor chip welding, and in particular to a sensor chip welding device. Background Art

[0002] The sensor chip is a highly integrated component, usually composed of three core parts: sensor, signal conditioning circuit and data processing unit. As the gateway to information, the sensor is responsible for capturing various information from the outside world and converting it into electrical signals. Next, the signal conditioning circuit will perform a series of sophisticated processing on these raw electrical signals, including amplification, filtering and calibration, to ensure the accuracy and stability of the signal. Finally, the data processing unit takes over the baton, further converts the conditioned signal into a digital format, and applies relevant algorithms for in-depth analysis to extract valuable information.

[0003] In the production process of sensor chips, the welding of sensor core pins is a crucial link. Traditionally, the core pins need to be accurately inserted into the sensor chip first, and then tin powder is evenly applied on the contact surface between the core pins and the chip. By precisely controlling the heating temperature, the tin powder will melt quickly, thereby firmly welding the core pins to the chip. However, there are often some problems in this process.

[0004] First, the manual operation of placing the core pin limiter on the chip and moving it to the welding equipment is not only inefficient, but also prone to misalignment. This misalignment may cause poor welding, which in turn affects the performance of the sensor. Secondly, even if the core pin is correctly placed on the chip, the welding equipment may have uneven temperature distribution during the heating process. This will cause the tin powder to not melt fully, making it impossible for the core pin to form a strong welding connection with the chip. This welding defect will also have a serious impact on the subsequent use of the sensor. Summary of the invention

[0005] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0006] To this end, the purpose of the present invention is to propose a sensor chip welding device, which adopts a mixture of gunpowder powder and tin powder and directly adds it to the sensor chip, limits the connection between the core pin and the sensor chip, and uses the gunpowder powder to hot-melt the tin powder so that the core pin is directly welded to the chip and fixed together, which is more efficient and improves the welding yield.

[0007] To achieve the above-mentioned purpose, the present invention proposes a sensor chip welding device, including a transmission component, a soldering material conveying component, a core foot pressing component, a driving component, an inner cover shell, a material blocking component and a sensor chip limiting component, wherein the transmission component includes a base, a driving component, a transmission shaft, a conveyor belt and a limiting groove, wherein the driving component is arranged on the base; the transmission shaft is arranged at the output end of the driving component; the conveyor belt is sleeved on the transmission shaft; the limiting grooves are multiple groups, and multiple groups of limiting grooves are linearly arrayed on the conveyor belt; the soldering material conveying component is arranged on the base, and the soldering material conveying component includes an outer frame box body, a storage box body 1, a storage box body 2 and a unloading baffle, wherein the outer frame box body is arranged on the base; the storage box body 1 is The outer frame box is arranged on the second material storage box; the unloading baffle is composed of two groups, and the two groups of unloading baffles are respectively arranged on the first material storage box and the second material storage box; the core foot pressing assembly is arranged on the outer frame box, and the core foot pressing assembly is used to press and fix the core foot on the sensor chip; the driving assembly is arranged between the first material storage box and the second material storage box, and the driving assembly is used to control the solder to fall in and achieve mixing; the inner cover shell is arranged in the outer frame box; the material blocking assembly is movably arranged on the inner cover shell, and the material blocking assembly is used to control the solder to fall into the sensor chip; the sensor chip limiting assembly is detachably arranged on the conveyor belt, and the sensor chip limiting assembly is used to limit the installation of the sensor chip.

[0008] In addition, the sensor chip welding device proposed in the application may also have the following additional technical features:

[0009] Specifically, the core pin pressing assembly includes a limiting bracket, a core pin follower and a pressing mechanism, wherein the limiting bracket is arranged on the outer frame box; the core pin follower is movably arranged on the limiting bracket, and the core pin follower is used to limit the installation of the core pin to be welded on the sensor chip; the pressing mechanism is arranged on the outer frame box, and the pressing mechanism includes a positioning substrate, a second driving component and a pressing plate, wherein the positioning substrate is arranged on the outer frame box; the second driving component is arranged on the positioning substrate; and the pressing plate is arranged at the output end of the second driving component.

[0010] Specifically, the core foot follower includes a base plate, a through hole, a limit clamp and a fastening component, wherein the base plate is movably arranged on the limit bracket; the through holes are multiple groups, and the multiple groups of through holes are respectively arranged on the base plate; the limit clamps are multiple groups, and each group of limit clamps is detachably arranged in the corresponding through holes; the fastening component is arranged on the limit clamp.

[0011] Specifically, the driving assembly includes an outer frame, a driving component three, a rotating shaft, a material baffle plate, and a mixing mechanism, wherein the outer frame is arranged between the material storage box one and the material storage box two; the driving component three is arranged in the outer frame; the rotating shaft is arranged at the output end of the driving component three; the material baffle plate is arranged on the rotating shaft, and the material baffle plate is attached to the bottom wall of the material storage box one and the material storage box two; the mixing mechanism is arranged on the rotating shaft.

[0012] Specifically, the mixing mechanism includes a driven shaft, a conveying auger and a stirring rod, wherein the driven shaft is arranged on the rotating shaft; the conveying auger is arranged on the driven shaft; and the stirring rod is arranged on the driven shaft.

[0013] Specifically, the material blocking assembly includes a fixed baffle, a material passing mechanism and a reset component, wherein the fixed baffle is arranged on the inner cover shell; the material passing mechanism is arranged on the inner cover shell; and both ends of the reset component are respectively connected to the fixed baffle and the material passing mechanism.

[0014] Specifically, the material passing mechanism includes a movable bottom plate, a side baffle, a limiting shaft and a second material baffle plate, wherein the movable bottom plate is movably arranged on the inner cover shell; the side baffle plate is arranged on the movable bottom plate; the limiting shaft is arranged on the side baffle plate; the second material baffle plate is arranged on the inner cover shell, and the movable bottom plate is attached to the second material baffle plate.

[0015] Specifically, the sensor chip limiting assembly includes a supporting substrate, a clamping shaft, a buffer mechanism, a mounting base, a powder chamber, an ignition groove, an injection hole and a fastening mechanism, wherein the clamping shaft is arranged on the supporting substrate, and the clamping shaft is engaged in the limiting groove; the buffer mechanism is arranged on the supporting substrate; the mounting base is detachably arranged on the supporting substrate; the powder chamber is opened on the mounting base; the ignition groove is opened on the mounting base, and the ignition groove penetrates into the powder chamber; the injection hole is opened on the mounting base; the fastening mechanism is arranged on the supporting substrate, and the fastening mechanism abuts against the mounting base.

[0016] Specifically, the buffer mechanism includes a hollow frame and a guide member, wherein the hollow frame is arranged on the supporting substrate; the guide member is movably arranged in the hollow frame, and the guide member includes a guide plate, a driven plate and a buffer component, wherein the guide plate is movably arranged in the hollow frame; the driven plate is arranged on the top wall of the guide plate; the buffer component is a plurality of groups, and the plurality of groups of buffer components are linearly arrayed on the guide plate.

[0017] Specifically, the fastening mechanism includes a partition and an abutment, wherein the partition is arranged on the supporting base plate; the abutment is arranged on the partition, and the abutment includes a hollow sleeve, a movable shaft, a telescopic component and an abutment plate, wherein the hollow sleeve is arranged on the partition; one end of the movable shaft is movably arranged in the hollow sleeve; the telescopic component is sleeved on the movable shaft; and the abutment plate is arranged at the other end of the movable shaft.

[0018] Compared with the prior art, the sensor chip welding equipment of the present invention has the following advantages:

[0019] Tin powder and gunpowder powder are mixed and added to the position of the sensor chip where the core pin is to be installed. The temperature of the ignition of the gunpowder powder will melt the tin powder, and the core pin is welded by fully hot melting, which makes the welding more firm and more efficient.

[0020] The core pins of the limited conveying and the sensor chips of the limited conveying are limitedly connected during the conveying, and the core pins are limitedly inserted on the sensor chip to be welded, so that the core pins and the chip are limitedly inserted together, thereby achieving higher docking accuracy, avoiding misalignment and improving the molding yield of the sensor chip.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0023] Figure 1 It is a schematic diagram of the structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the internal structure of the outer frame box of the present invention;

[0025] Figure 3 It is a schematic diagram of the structure of the transmission component of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the core pin follower of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the sensor chip limiting component of the present invention;

[0028] Figure 6 It is a schematic diagram of the guide structure of the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the material blocking assembly of the present invention;

[0030] Figure 8It is a schematic diagram of the structure of the material passing mechanism of the present invention;

[0031] Fig. 9 It is a schematic diagram of the structure of the fastening mechanism of the present invention.

[0032] As shown in the figure: 10, transmission assembly; 101, base; 102, driving component; 103, transmission shaft; 104, conveyor belt; 105, limiting groove; 20, welding material conveying assembly; 201, outer frame box; 202, material storage box 1; 203, material storage box 2; 204, unloading baffle; 30, core foot pressing assembly; 301, limiting bracket; 302, core foot follower; 3021, bottom plate; 3022, through hole; 3023, limit card plate; 3024, fastening component; 303, pressing mechanism; 3031, positioning base plate; 3032, driving component 2; 3033, pressing plate; 40, driving assembly; 401, outer frame; 402, driving component 3; 403, rotating shaft; 404, baffle plate; 405, mixing mechanism; 4051, driven shaft; 4052, conveying auger; 40 53, stirring rod; 50, inner housing; 60, material blocking assembly; 601, fixed baffle; 602, material passing mechanism; 6021, movable bottom plate; 6022, side baffle; 6023, limit shaft rod; 6024, baffle plate 2; 603, reset component; 70, sensor chip limit assembly; 701, support substrate; 702, clamping shaft; 703, buffer mechanism; 7031, hollow frame; 703 2. Guide member; 70321. Guide plate; 70322. Follower plate; 70323. Buffer member; 704. Mounting base; 705. Powder chamber; 706. Ignition groove; 707. Inlet hole; 708. Fastening mechanism; 7081. Partition plate; 7082. Abutment member; 70821. Hollow sleeve; 70822. Movable shaft rod; 70823. Telescopic member; 70824. Abutment plate. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0034] The sensor chip welding device according to the embodiment of the present invention is described below with reference to the accompanying drawings.

[0035] like Figure 1-9As shown, the sensor chip welding equipment of the embodiment of the present invention includes a transmission component 10, a solder delivery component 20, a core pin pressing component 30, a driving component 40, an inner cover shell 50, a material blocking component 60 and a sensor chip limiting component 70.

[0036] The transmission assembly 10 includes a base 101 , a driving component 102 , a transmission shaft 103 , a conveyor belt 104 and a limiting groove 105 .

[0037] Among them, the driving component 102 is arranged on the base 101, the transmission shaft 103 is arranged at the output end of the driving component 102, the conveyor belt 104 is sleeved on the transmission shaft 103, and the limiting grooves 105 are multiple groups, and the multiple groups of limiting grooves 105 are linearly arrayed on the conveyor belt 104.

[0038] It should be noted that the driving component 102 described in this embodiment is a stepper motor, which is operated by controlling the switch and the power supply, and the output end of the driving component 102 is connected to the transmission shaft 103 through the reducer, so that the transmission shaft 103 rotates to drive the conveyor belt 104 to rotate and transport. The sensor chip limit assembly 70 is limitedly engaged in the limit groove 105 and fixed, so that the conveyor belt 104 drives the sensor chip limit assembly 70 to move.

[0039] The soldering material conveying assembly 20 is disposed on the base 101 , and the soldering material conveying assembly 20 includes an outer frame box 201 , a material storage box 1 202 , a material storage box 203 and a discharge baffle 204 .

[0040] The outer frame box 201 is arranged on the base 101, the material storage box 1 202 is arranged on the outer frame box 201, and the material storage box 2 203 is arranged on the outer frame box 201. There are two groups of unloading baffles 204, which are respectively arranged on the material storage box 1 202 and the material storage box 2 203, and the core foot pressing assembly 30 is arranged on the outer frame box 201.

[0041] It should be noted that the bottom walls of the material storage box 1 202 and the material storage box 2 203 are respectively provided with discharge ports, and the discharge baffle 204 is respectively tiltedly arranged on the bottom walls of the discharge ports of the material storage box 1 202 and the material storage box 2 203. Tin powder for welding the sensor chip is placed in the material storage box 1 202, and gunpowder powder is placed in the material storage box 2 203.

[0042] The core pin pressing assembly 30 is used to press and fix the core pin on the sensor chip. The driving assembly 40 is arranged between the material storage box 1 202 and the material storage box 2 203. The driving assembly 40 is used to control the solder to fall in and achieve mixing. The inner cover 50 is arranged in the outer frame box 201. The material blocking assembly 60 is movably arranged on the inner cover 50. The material blocking assembly 60 is used to control the solder to fall into the sensor chip. The sensor chip limiting assembly 70 is detachably arranged on the conveyor belt 104. The sensor chip limiting assembly 70 is used to limit the installation of the sensor chip.

[0043] It should be noted that the sensor core pin to be welded is placed on the core pin pressing assembly 30, and after the tin powder and the gunpowder powder are filled in the sensor chip, the core pin is pressed and installed on the sensor chip through the core pin pressing assembly 30. When the driving assembly 40 is in operation, the tin powder and the gunpowder powder are controlled to enter the inner cover 50, and the tin powder and the gunpowder powder entering the inner cover 50 are mixed. When the conveyor belt 104 drives the sensor chip limiting assembly 70 to move, the sensor chip limiting assembly 70 is limited to abut against the material blocking assembly 60, so that the material blocking assembly 60 moves and completes the material dropping.

[0044] Specifically, the steps for welding the sensor chip are as follows: the sensor chip to be welded is installed in the sensor chip limiting assembly 70, the sensor chip limiting assembly 70 with the sensor chip installed is installed in the limiting groove 105, and then the driving component 102 is operated. When the driving component 102 is operated, the conveyor belt 104 is driven to rotate, and then the conveyor belt 104 drives the sensor chip limiting assembly 70 to move. While the sensor chip limiting assembly 70 is gradually moving, it abuts against the material blocking assembly 60 one by one. At this time, the tin powder and the gunpowder powder fall, and the mixed tin powder and the gunpowder powder fall into the sensor chip limiting assembly 70. In the subsequent conveying process, the core foot is pressed onto the sensor chip in the sensor chip limiting assembly 70 through the core foot pressing assembly 30. Then the gunpowder powder is ignited, and the gunpowder powder is ignited to melt the tin powder, and the hot-melted tin powder welds the core foot and the sensor chip together. Rapid assembly, limited filling, and higher efficiency of hot melt welding.

[0045] In one embodiment of the present invention, Figure 1 As shown, the core pin pressing assembly 30 includes a limiting bracket 301 , a core pin follower 302 and a pressing mechanism 303 .

[0046] The limiting bracket 301 is arranged on the outer frame box body 201 , and the core pin follower 302 is movably arranged on the limiting bracket 301 . The core pin follower 302 is used for limiting the installation of the core pin to be welded on the sensor chip.

[0047] It should be noted that the limit bracket 301 is installed on the base 101, and the limit bracket 301 is divided into two groups, with an empty slot in the middle of the two groups of limit brackets 301. The core pin follower 302 moves within the limit bracket 301, and then the core pin is pressed onto the sensor chip through the pressing mechanism 303.

[0048] The pressing mechanism 303 is disposed on the outer frame box 201 , and includes a positioning substrate 3031 , a second driving component 3032 and a pressing plate 3033 .

[0049] The positioning substrate 3031 is disposed on the outer frame box 201 , the second driving component 3032 is disposed on the positioning substrate 3031 , and the pressing plate 3033 is disposed at the output end of the second driving component 3032 .

[0050] It should be noted that the driving component 2 3032 described in this embodiment is a cylinder, which is operated by controlling the switch and the power supply. The driving component 2 3032 pushes the pressing plate 3033 downward, and when the pressing plate 3033 moves downward, the core pins are pressed and plugged onto the sensor chip.

[0051] In one embodiment of the present invention, Figure 4 As shown, the core pin follower 302 includes a bottom plate 3021 , a through hole 3022 , a limit clamping plate 3023 and a fastening component 3024 .

[0052] The bottom plate 3021 is movably arranged on the limiting bracket 301, and there are multiple groups of through holes 3022, which are respectively arranged on the bottom plate 3021. There are multiple groups of limiting clamping plates 3023, each group of limiting clamping plates 3023 is detachably arranged in the corresponding through holes 3022, and the fastening components 3024 are arranged on the limiting clamping plates 3023.

[0053] It should be noted that the fastening component 3024 is an elastic plastic gasket, and the limiting card plate 3023 is pressed against the through hole 3022 through the plastic gasket, and the core pin to be welded is inserted into the limiting card plate 3023. When the pressing plate 3033 is pressed down, the core pin and the limiting card plate 3023 are pressed out of the through hole 3022, so that the core pin is pressed and inserted into the sensor chip.

[0054] In one embodiment of the present invention, Figure 2 As shown, the driving assembly 40 includes an outer frame 401, a driving component 402, a rotating shaft 403, a baffle plate 404, and a mixing mechanism 405.

[0055] The outer frame 401 is arranged between the material storage box 1 202 and the material storage box 2 203, the driving component 3 402 is arranged in the outer frame 401, and the rotating shaft 403 is arranged at the output end of the driving component 3 402. The material blocking plate 404 is arranged on the rotating shaft 403, and the material blocking plate 404 is attached to the bottom wall of the material storage box 1 202 and the material storage box 2 203, and the mixing mechanism 405 is arranged on the rotating shaft 403.

[0056] It should be noted that tin powder and gunpowder powder are stored in the storage box 1 202 and the storage box 2 203 respectively, and the size of the discharge openings on the bottom walls of the storage box 1 202 and the storage box 2 203 is set according to the amount of tin powder required for soldering the core pins on the sensor chip. The baffle plate 404 is attached to the discharge openings of the storage box 1 202 and the storage box 2 203 during the rotation process, and a corresponding powder discharge hole is provided on the baffle plate 404. The tin powder and gunpowder powder fall into the inner cover shell 50, and the tin powder and gunpowder powder are added according to the set ratio and mixed through the mixing mechanism 405.

[0057] In one embodiment of the present invention, Figure 2 As shown, the mixing mechanism 405 includes a driven shaft 4051 , a conveying auger 4052 and a stirring rod 4053 .

[0058] The driven shaft 4051 is arranged on the rotating shaft 403 , the conveying auger 4052 is arranged on the driven shaft 4051 , and the stirring rod 4053 is arranged on the driven shaft 4051 .

[0059] It should be noted that the driven shaft 4051 rotates synchronously with the rotating shaft 403 . When the driven shaft 4051 rotates, it drives the stirring rod 4053 to rotate, so as to mix the tin powder and the gunpowder powder entering the inner cover shell 50 .

[0060] In one embodiment of the present invention, Figure 7 As shown, the material blocking assembly 60 includes a fixed blocking plate 601 , a material passing mechanism 602 and a reset component 603 .

[0061] The fixed baffle 601 is arranged on the inner cover shell 50 , the material passing mechanism 602 is arranged on the inner cover shell 50 , and two ends of the reset component 603 are respectively connected to the fixed baffle 601 and the material passing mechanism 602 .

[0062] It should be noted that a circular hole is provided on the fixed baffle 601, and the feeding mechanism 602 is limited through the circular hole. Then, the feeding mechanism 602 is limited by the fixed baffle 601, and the reset component 603 is a reset spring, which pushes the feeding mechanism 602 to reset.

[0063] Furthermore, in order to ensure good stability of the material passing mechanism 602 when moving, a slide groove is provided on the bottom wall of the inner cover shell 50, and a slider is provided on the top wall of the material passing mechanism 602. The slider slides in the slide groove to limit the position, and then the material passing mechanism 602 slides in a limited position.

[0064] In one embodiment of the present invention, Figure 8 As shown, the material passing mechanism 602 includes a movable bottom plate 6021 , a side baffle plate 6022 , a limiting shaft rod 6023 and a second baffle plate 6024 .

[0065] The movable bottom plate 6021 is movably arranged on the inner housing 50, and the side baffle 6022 is arranged on the movable bottom plate 6021. The limiting shaft rod 6023 is arranged on the side baffle 6022, the second baffle plate 6024 is arranged on the inner housing 50, and the movable bottom plate 6021 is attached to the second baffle plate 6024.

[0066] It should be noted that there are discharge holes on the baffle plate 5024 and the movable ground variable 6021, and the two discharge holes are of the same size. Tin powder and gunpowder powder slide down from the discharge holes and then fall on the sensor chip to be welded. The limit shaft 6023 is inserted into the round hole of the fixed baffle 601 and slides in a limited position.

[0067] In one embodiment of the present invention, Figure 5 As shown, the sensor chip limiting assembly 70 includes a supporting substrate 701 , a clamping shaft 702 , a buffer mechanism 703 , a mounting base 704 , a powder chamber 705 , an ignition groove 706 , an injection hole 707 and a fastening mechanism 708 .

[0068] The clamping shaft 702 is arranged on the supporting substrate 701, and the clamping shaft 702 is engaged in the limiting groove 105, and the buffer mechanism 703 is arranged on the supporting substrate 701. The mounting base 704 is detachably arranged on the supporting substrate 701, the powder chamber 705 is provided on the mounting base 704, the ignition groove 706 is provided on the mounting base 704, and the ignition groove 706 penetrates into the powder chamber 705. The injection hole 707 is provided on the mounting base 704, and the fastening mechanism 708 is arranged on the supporting substrate 701, and the fastening mechanism 708 is abutted against the mounting base 704.

[0069] It should be noted that the clamping shaft 702 is arranged on the supporting substrate 701 and is clamped in the limiting groove 105. It moves with the rotation of the conveyor belt 104, and the supporting substrate 701 is manually removed for welding after the powder injection is completed. In the process of the conveyor belt 104 driving the supporting substrate 701 to move, the buffer mechanism 703 and the movable bottom plate 6021 are in contact and connected, thereby pushing the movable bottom plate 6021 to move in a limited manner. In the process of the movable bottom plate 6021 moving in a limited manner, the movable bottom plate 6021 is pushed to align with the discharge holes on the second baffle plate 6024. At this time, the discharge hole is located directly above the powder cavity 705, and the mixed welding powder falls into the powder cavity 705. When the buffer mechanism 703 and the movable bottom plate 6021 are separated, they are reset by the reset component 603, and the mixed material no longer falls. The powder material falling into the powder chamber 705 enters the sampling hole 707, and gunpowder powder is added to the ignition groove 706, and the gunpowder powder is ignited to ignite the powder material in the sampling hole 707, so that the tin powder therein is melted, and the core pin and the sensor chip are welded together.

[0070] In one embodiment of the present invention, Figure 6 As shown, the buffer mechanism 703 includes a hollow frame 7031 and a guide member 7032 .

[0071] The hollow frame 7031 is disposed on the supporting substrate 701 , and the guide member 7032 is movably disposed in the hollow frame 7031 . The guide member 7032 includes a guide plate 70321 , a driven plate 70322 and a buffer component 70323 .

[0072] The guide plate 70321 is movably arranged in the hollow frame 7031 , the driven plate 70322 is arranged on the top wall of the guide plate 70321 , and the buffer components 70323 are multiple groups, and the multiple groups of buffer components 70323 are linearly arrayed on the guide plate 70321 .

[0073] It should be noted that the guide member 7032 is a 7-shaped guide plate frame. After the guide member 7032 pushes the movable base plate 6021 to move to the end point, the movable base plate 6021 stops moving and the guide member 7032 is affected by the inclined end surface. The guide plate 70321 moves downward, and the guide member 7032 gradually separates from the movable base plate 6021, realizing automatic feeding and blocking.

[0074] In one embodiment of the present invention, Fig. 9 As shown, the fastening mechanism 708 includes a partition 7081 and an abutment member 7082 .

[0075] The partition 7081 is disposed on the supporting substrate 701 , and the abutting member 7082 is disposed on the partition 7081 .

[0076] The abutment member 7082 includes a hollow sleeve 70821 , a movable shaft 70822 , a telescopic member 70823 and an abutment plate 70824 .

[0077] Among them, the hollow sleeve 70821 is set on the partition 7081, one end of the movable shaft 70822 is movably set in the hollow sleeve 70821, the telescopic component 70823 is sleeved on the movable shaft 70822; and the abutment plate 70824 is set at the other end of the movable shaft 70822.

[0078] It should be noted that the partition 7081 is installed on the supporting substrate 701, and the movable shaft 70822 drives the abutment plate 70824 to abut against the mounting base 704 through the telescopic component 70823, thereby limiting and fixing the mounting base 704. The telescopic component 70823 is a telescopic spring.

[0079] Specifically, the steps of welding the sensor's core pins and chip together are:

[0080] The steps of adding the mixture of tin powder and gunpowder powder to the sensor chip are as follows: tin powder and gunpowder powder are respectively filled into the storage box 1 202 and the storage box 2 203, and the driving component 3 402 is operated. When the driving component 3 402 is operated, the rotating shaft 403 is driven to rotate, and the baffle plate 404 rotates and moves from below the storage box 1 202 and the storage box 2 203 during the rotation process. During the rotation process, the discharge port below the storage box 1 202 and the storage box 2 203 is opened, so that the tin powder and gunpowder powder fall into the inner cover shell 50 in proportion. During the operation of the driving component 3 402, the driven shaft 4051 and the stirring rod 4053 are synchronously driven to rotate, and the stirring rod 4053 and the conveying auger 4052 rotate, thereby stirring and mixing the tin powder and gunpowder powder falling into the inner cover shell 50.

[0081] At this time, the driving component 102 is operated. When the driving component 102 is operated, it drives the transmission shaft 103 to rotate. The rotation of the transmission shaft 103 drives the conveyor belt 104 to rotate, and the chip to be welded is placed in the mounting base 704. The mounting base 704 is mounted on the supporting substrate 701 through the fastening mechanism 708, and the supporting substrate 701 is inserted into the limiting groove 105 through the clamping shaft 702. The sensor chip moves synchronously with the supporting substrate 701 on the conveyor belt 104. During the movement of the sensor chip, the buffer mechanism 703 and the movable bottom plate 6021 are in contact and connected, thereby pushing the movable bottom plate 6021 to move in a limited manner. The movable bottom plate 6021 slides in a limited manner on the fixed baffle 601 through the limiting shaft rod 6023. During the limited movement of the movable bottom plate 6021, the discharge holes on the movable bottom plate 6021 and the baffle plate 2 6024 are pushed to align. At this time, the discharge hole is located directly above the powder cavity 705, and the mixed welding powder falls into the powder cavity 705. When the buffer mechanism 703 and the movable bottom plate 6021 are separated, they are reset by the reset component 603, and the mixed material no longer falls. The powder falling into the powder cavity 705 enters the sampling hole 707, and gunpowder powder is added to the ignition groove 706.

[0082] The steps of installing the core pin on the limit sensor are as follows: first, place the sensor core pin to be welded on the limit card plate 3023, and the limit card plate 3023 is embedded in the through hole 3022 through the fastening component 3024. The bottom plate 3021 moves in the limit position on the limit bracket 301, and moves to the bottom of the pressing plate 3033, and the driving component 2 3032 is operated. The driving component 2 3032 pushes the pressing plate 3033 to move downward, and the limit card plate 3023 with the core pin is pushed out of the through hole 3022 during the downward movement of the pressing plate 3033. The sensor chip with the mixed material moves synchronously with the conveyor belt 104. When the injection hole 707 moves to the bottom of the pressing plate 3033, the core pin is pressed into the injection hole 707, and the assembly of the core pin and the sensor chip is completed.

[0083] The welding steps are as follows: ignite the gunpowder powder to ignite the powder in the injection hole 707, melt the tin powder therein, and weld the core pin and the sensor chip together.

[0084] In summary, the sensor chip welding equipment of the embodiment of the present invention adopts a mixture of gunpowder powder and tin powder and adds them directly to the sensor chip, limits the connection between the core pin and the sensor chip, and uses the gunpowder powder to heat-melt the tin powder so that the core pin is directly welded to the chip and fixed together, which is more efficient and improves the welding yield rate.

[0085] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A sensor chip welding device, characterized in that: It comprises a transmission component (10), a soldering material conveying component (20), a core pin pressing component (30), a driving component (40), an inner cover shell (50), a material blocking component (60) and a sensor chip limiting component (70), wherein: The transmission assembly (10) comprises a base (101), a driving component (102), a transmission shaft (103), a conveyor belt (104) and a limiting groove (105), wherein: The driving component (102) is arranged on the base (101); The transmission shaft (103) is arranged at the output end of the driving component (102); The conveyor belt (104) is sleeved on the transmission shaft (103); The limiting grooves (105) are multiple groups, and the multiple groups of limiting grooves (105) are arranged in a linear array on the conveyor belt (104); The soldering material conveying assembly (20) is arranged on the base (101), and comprises an outer frame box (201), a first material storage box (202), a second material storage box (203) and a discharge baffle (204), wherein: The outer frame box (201) is arranged on the base (101); The material storage box body 1 (202) is arranged on the outer frame box body (201); The second material storage box (203) is arranged on the outer frame box (201); The unloading baffles (204) are in two groups, and the two groups of unloading baffles (204) are respectively arranged on the first storage box (202) and the second storage box (203); The core pin pressing assembly (30) is arranged on the outer frame box (201), and the core pin pressing assembly (30) is used to press and fix the core pin on the sensor chip; The driving component (40) is arranged between the first material storage box (202) and the second material storage box (203), and the driving component (40) is used to control the solder to fall in and achieve mixing; The inner cover shell (50) is arranged inside the outer frame box (201); The material blocking assembly (60) is movably arranged on the inner cover shell (50), and the material blocking assembly (60) is used to control the solder to fall into the sensor chip; The sensor chip limiting assembly (70) is detachably arranged on the conveyor belt (104), and the sensor chip limiting assembly (70) is used for limiting the installation of the sensor chip.

2. The sensor chip welding equipment according to claim 1, characterized in that: The core pin pressing assembly (30) comprises a limiting bracket (301), a core pin follower (302) and a pressing mechanism (303), wherein: The limiting bracket (301) is arranged on the outer frame box (201); The core pin follower (302) is movably arranged on the limiting bracket (301), and the core pin follower (302) is used for limiting the installation of the core pin to be welded on the sensor chip; The pressing mechanism (303) is arranged on the outer frame box (201), and comprises a positioning substrate (3031), a second driving component (3032) and a pressing plate (3033), wherein: The positioning substrate (3031) is arranged on the outer frame box (201); The second driving component (3032) is arranged on the positioning substrate (3031); The pressing plate (3033) is arranged at the output end of the second driving component (3032).

3. The sensor chip welding equipment according to claim 2, characterized in that: The core pin follower (302) comprises a bottom plate (3021), a through hole (3022), a limit clamping plate (3023) and a fastening component (3024), wherein: The bottom plate (3021) is movably arranged on the limiting bracket (301); The through holes (3022) are multiple groups, and the multiple groups of through holes (3022) are respectively arranged on the bottom plate (3021); The position-limiting clamping plates (3023) are provided in a plurality of groups, and each group of the position-limiting clamping plates (3023) is detachably arranged in the corresponding through hole (3022); The fastening component (3024) is arranged on the limiting clamping plate (3023).

4. The sensor chip welding equipment according to claim 1, characterized in that: The driving assembly (40) comprises an outer frame (401), a driving component three (402), a rotating shaft (403), a material blocking plate (404), and a material mixing mechanism (405), wherein: The outer frame (401) is arranged between the first material storage box (202) and the second material storage box (203); The driving component three (402) is arranged in the outer frame (401); The rotating shaft (403) is arranged at the output end of the driving component three (402); The material baffle plate (404) is arranged on the rotating shaft (403), and the material baffle plate (404) is attached to the bottom walls of the first material storage box (202) and the second material storage box (203); The mixing mechanism (405) is arranged on the rotating shaft (403).

5. The sensor chip bonding device according to claim 4, characterized in that: The mixing mechanism (405) comprises a driven shaft (4051), a conveying auger (4052) and a stirring rod (4053), wherein: The driven shaft (4051) is arranged on the rotating shaft (403); The conveying auger (4052) is arranged on the driven shaft (4051); The stirring rod (4053) is arranged on the driven shaft (4051).

6. The sensor chip welding equipment according to claim 1, characterized in that: The material blocking assembly (60) comprises a fixed baffle (601), a material passing mechanism (602) and a reset component (603), wherein: The fixed baffle (601) is arranged on the inner casing (50); The material passing mechanism (602) is arranged on the inner cover shell (50); Two ends of the reset component (603) are respectively connected to the fixed baffle (601) and the material passing mechanism (602).

7. The sensor chip bonding device according to claim 6, characterized in that: The material passing mechanism (602) comprises a movable bottom plate (6021), a side baffle plate (6022), a limit shaft rod (6023) and a second baffle plate (6024), wherein: The movable bottom plate (6021) is movably arranged on the inner cover shell (50); The side baffle (6022) is arranged on the movable bottom plate (6021); The limiting shaft rod (6023) is arranged on the side baffle plate (6022); The second material baffle plate (6024) is arranged on the inner cover shell (50), and the movable bottom plate (6021) is attached to the second material baffle plate (6024).

8. The sensor chip bonding device according to claim 1, characterized in that: The sensor chip limiting assembly (70) comprises a supporting substrate (701), a clamping shaft (702), a buffer mechanism (703), a mounting base (704), a powder chamber (705), an ignition groove (706), an injection hole (707) and a fastening mechanism (708), wherein: The clamping shaft (702) is arranged on the supporting base plate (701), and the clamping shaft (702) is clamped in the limiting groove (105); The buffer mechanism (703) is arranged on the supporting substrate (701); The mounting base (704) is detachably arranged on the supporting substrate (701); The powder chamber (705) is provided on the mounting base (704); The ignition groove (706) is provided on the mounting base (704), and the ignition groove (706) penetrates into the powder cavity (705); The injection hole (707) is provided on the mounting base (704); The fastening mechanism (708) is arranged on the supporting substrate (701), and the fastening mechanism (708) abuts against the mounting base (704).

9. The sensor chip bonding device according to claim 8, characterized in that: The buffer mechanism (703) comprises a hollow frame (7031) and a guide member (7032), wherein: The hollow frame (7031) is arranged on the supporting substrate (701); The guide member (7032) is movably disposed in the hollow frame (7031), and the guide member (7032) includes a guide plate (70321), a driven plate (70322) and a buffer component (70323), wherein: The guide plate (70321) is movably arranged in the hollow frame (7031); The driven plate (70322) is arranged on the top wall of the guide plate (70321); The buffer components (70323) are multiple groups, and the multiple groups of buffer components (70323) are arranged in a linear array on the guide plate (70321).

10. The sensor chip bonding device according to claim 8, characterized in that: The fastening mechanism (708) comprises a partition (7081) and an abutment member (7082), wherein: The partition (7081) is arranged on the supporting substrate (701); The abutment member (7082) is disposed on the partition (7081), and the abutment member (7082) includes a hollow sleeve (70821), a movable shaft (70822), a telescopic member (70823) and an abutment plate (70824), wherein: The hollow sleeve (70821) is arranged on the partition (7081); One end of the movable shaft (70822) is movably disposed in the hollow sleeve (70821); The telescopic component (70823) is sleeved on the movable shaft (70822); The abutment plate (70824) is arranged at the other end of the movable shaft (70822).

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