A compressive performance testing device for electronic equipment circuit board and a method of using the same

Abstract

The present invention discloses a compressive performance detection device for a circuit board of an electronic device and a method for using the device, and relates to the technical field of circuit board testing, and aims to solve the technical problem that the existing circuit board compressive performance testing device has a relatively single function. The device comprises a test base frame, and the present invention improves the structure of the existing circuit board compressive performance testing device by arranging a downward pressure cylinder on the test base frame, arranging a mounting plate at the output end of the downward pressure cylinder, and arranging a mode adjustment mechanism on the mounting plate. The mode adjustment mechanism drives a fluctuation adjustment component to move through a counter-moving component of the mode adjustment mechanism. The fluctuation adjustment component causes the structure of the rotating downward pressure component to change, so that when a pressure test head contacts the circuit board for a compressive physical test, a static pressure test state and a dynamic bump test state can be switched, so as to achieve the test of the circuit board's pressure resistance and pressure resistance and impact resistance. The simulation test method with multiple effects is beneficial to improving product quality and reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board testing, and more specifically to a compression performance testing device for a circuit board of an electronic device and a use method thereof. Background Art

[0002] With the rapid development of science and technology, electronic equipment is increasingly used in various fields, especially in the emerging and rapidly developing industry of new energy vehicles, where electronic equipment plays a vital role. As the core component of the electronic control system in new energy vehicles, the stability and reliability of the performance of the on-board circuit board is directly related to the overall safety and service life of the vehicle. Therefore, it is particularly important to conduct a comprehensive and efficient test on the compressive performance of the on-board circuit board.

[0003] At present, the test equipment for the compressive performance of circuit boards in the market generally has the problem of single function. Most traditional test equipment only has the function of pressure testing, that is, evaluating the compressive strength of the circuit board by applying static or dynamic pressure to the circuit board. Although this test method can reflect the pressure resistance of the circuit board to a certain extent, it cannot fully cover the various complex working conditions that the vehicle-mounted circuit board may encounter in the actual use environment. The working environment of new energy vehicles is complex and changeable. The on-board circuit board must not only withstand the vibration and impact from the vehicle driving process, but also maintain stable performance under extreme temperature, humidity and other environmental conditions. Therefore, it is far from enough to rely solely on pressure testing to evaluate the compressive performance of vehicle-mounted circuit boards. Vibration shock testing and strength pressure testing are also indispensable. They can simulate the dynamic stress conditions of the circuit board in actual use, so as to more comprehensively evaluate its compressive performance. Vibration shock testing tests test the stability and reliability of the circuit board under dynamic loads by simulating the vibration and impact during vehicle driving. This test method is particularly important for evaluating the performance of circuit boards under harsh road conditions, which helps to discover and solve potential design defects and manufacturing problems.

[0004] In summary, the existing circuit board compression performance testing equipment has obvious functional limitations and cannot meet the needs of the new energy vehicle industry for comprehensive and efficient testing of on-board circuit boards. In view of this, we propose a compression performance testing device for electronic equipment circuit boards and a method for use. Summary of the invention

[0005] The purpose of the present invention is to provide a compression performance testing device for a circuit board of an electronic device and a method for using the same, so as to solve the technical problem that the existing circuit board compression performance testing device has a relatively single function.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a device for detecting the compressive performance of a circuit board of an electronic device, comprising a test frame, a mounting bracket is provided at the top of the test frame, a downward pressure cylinder is provided on the mounting bracket, a mounting pressure plate is hoisted at the output end of the downward pressure cylinder, a pressure test instrument is provided at one end of the mounting pressure plate close to the test frame, a mode adjustment mechanism is connected to the bottom end of the mounting pressure plate, a pressure test head is connected to the bottom end of the mode adjustment mechanism, an annular clamping mechanism is provided at the bottom end of the test frame directly below the pressure test head, and a driving mechanism is provided on one side of the annular clamping mechanism; the mode adjustment mechanism includes a hoisting balance Assembly, rotating downward pressure assembly, opposing movement assembly and fluctuation adjustment assembly, the hoisting and balancing assembly is hoisted at a position where the bottom end of the mounting pressure plate is directly above the annular clamping mechanism, the rotating downward pressure assembly is arranged on the hoisting and balancing assembly, the opposing movement assembly is installed at the bottom end of the hoisting and balancing assembly, one end of the fluctuation adjustment assembly is connected to the opposing movement assembly, the other end of the fluctuation adjustment assembly is movably inserted in the rotating downward pressure assembly, and the pressure test head is connected to the bottom end of the opposing movement assembly; wherein, the opposing movement assembly drives the fluctuation adjustment assembly to cause the rotating downward pressure assembly to form a static pressure test state or a dynamic bump test state.

[0007] Preferably, the hoisting balancing assembly includes a hoisting rod, a hoisting barrel and a mounting ring plate, the hoisting rod is symmetrically hoisted at the bottom end of the mounting pressure plate, the hoisting barrel is movably sleeved at the bottom end of the hoisting rod, the mounting ring plate is connected to the bottom end of the hoisting barrel, the rotating downward pressure assembly is arranged at the top end of the mounting ring plate, and the oppositely moving assembly is connected to the bottom end of the mounting ring plate.

[0008] Preferably, the rotary pressing assembly includes a spiral pressing cylinder, a spiral groove, a rotating block, a limiting rod, a rotating wheel and a slot, the spiral pressing cylinder is arranged at the top of the mounting ring plate, the spiral groove is opened on the spiral pressing cylinder, the rotating block is rotatably connected to the output end of the pressing cylinder, the limiting rod is symmetrically arranged on the outer wall of the rotating block, the rotating wheel is rotatably sleeved on the limiting rod, a plurality of the slots are symmetrically opened on the spiral groove, and the limiting rod and the rotating wheel are movably inserted in the spiral groove.

[0009] Preferably, the opposing moving assembly includes a servo motor, a gear, a slide rail, a pulley and a moving rack, the gear is rotatably connected to the bottom end of the mounting platen, the servo motor is arranged inside the pressure test head, the output end of the servo motor is connected to the gear, the slide rail is symmetrically arranged at the bottom end of the mounting platen, the pulley is arranged inside the slide rail, the moving rack is connected to the pulley, and the end of the fluctuation adjustment assembly away from the rotating pressure assembly is connected to the moving rack.

[0010] Preferably, the fluctuation adjustment component includes a connecting arm, a connecting plate and a fluctuation rod, the connecting arm is connected to the movable rack, the connecting plate is connected to one end of the connecting arm away from the movable rack, a plurality of fluctuation rods are connected to one end of the connecting plate away from the connecting arm, the fluctuation rod is movably inserted in the slot at one end away from the connecting plate, and the slot is adapted to the fluctuation rod.

[0011] Preferably, the pressure test head includes a pressure ring plate, a rotating groove A, a rotating groove B, a curved groove, a driving gear, a driven gear, a pressure contact, a locking assembly and a rotating plug rod, the pressure ring plate is connected to the bottom end of the slide rail, the servo motor is arranged inside the pressure ring plate, the rotating groove A is opened on the pressure ring plate, the rotating groove B is opened in a ring shape at equal intervals on the pressure ring plate near the outer side of the rotating groove A, the rotating groove A is communicated with the inside of the rotating groove B, the curved groove is opened on the inner wall of the rotating groove B, the driving gear is rotatably connected to the rotating groove A, the driven gear is rotatably connected to the rotating groove B, the driven gear is meshed and connected to the driving gear, the pressure contact is telescopically connected to the driven gear, one end of the rotating plug rod is connected to the outer wall of the pressure contact, the other end of the rotating plug rod is movably inserted in the curved groove, the locking assembly is arranged on the rotating groove A, and the top of the locking assembly is connected to the driving gear.

[0012] Preferably, the locking assembly includes a fixed ring plate, a locking hole, a rotating block and a locking rod, the fixed ring plate is arranged at a position of the rotating groove A close to the bottom end of the driving gear, the locking hole is opened on the fixed ring plate in a ring shape with equal intervals, the rotating block is rotatably inserted on the fixed ring plate, one end of the rotating block away from the fixed ring plate is connected to the driving gear, one end of the locking rod is connected to the outer wall of the rotating block, and the other end of the locking rod is inserted into the locking hole.

[0013] Preferably, the annular clamping mechanism comprises a bearing plate, a bearing ring, a sliding rod, a rotating ring, a clamping block, a worm gear sleeve, a long hole A and a long hole B, the bearing plate is arranged at the bottom end of the test base frame directly below the pressure test head, the bearing ring is arranged on the bearing plate, the long holes A are arranged on the bearing ring in a circular shape with equal intervals, the bottom end of the sliding rod is movably inserted in the long holes A, the clamping block is sleeved on the sliding rod, the long holes B are arranged on the rotating ring in a circular shape with equal intervals, the rotating ring is movably sleeved on the top end of the sliding rod through the long holes A, the worm gear sleeve is sleeved on the rotating ring, and the output end of the driving mechanism is connected to the worm gear sleeve;

[0014] The clamping block is provided with circuit board grooves, and a plurality of the circuit board grooves form an annular clamping cavity.

[0015] Preferably, the driving mechanism comprises a reduction motor and a worm, the reduction motor is arranged on one side of the annular clamping mechanism, the worm is connected to the output end of the reduction motor, and one end of the worm away from the reduction motor is meshingly connected to the worm gear sleeve.

[0016] The present invention also provides a method for using a device for testing the compressive performance of a circuit board of an electronic device, comprising the following steps:

[0017] S1, circuit board fixing operation;

[0018] The circuit board is placed in the annular clamping mechanism, and the driving mechanism drives the worm gear sleeve to rotate, and the worm gear sleeve drives the rotating ring to rotate. The long hole B of the rotating ring allows the slide bar to slide inside it, driving several clamping blocks to achieve inward contraction and closure. Several circuit board grooves opened on the clamping blocks form an annular clamping cavity, realizing an annular 360-degree clamping of the circuit board;

[0019] S2, anti-stress mode adjustment operation;

[0020] S2.1. Select a specific mode according to the type of pressure resistance test required for the circuit board; if a steady-state pressure resistance test is required, drive the servo motor to drive the gear to rotate, the gear is meshed with the moving rack so that the moving rack moves in opposite directions on the slide rail through the pulley, and the movement of the moving rack drives the connecting arm, the connecting plate and the wave plug to move, and the wave plug is out of the slot;

[0021] S2.2. Select a specific mode according to the type of pressure resistance test required for the circuit board; if impact pressure resistance test is required, drive the servo motor to drive the gear to rotate, the gear is meshed with the moving rack so that the moving rack moves in opposite directions on the slide rail through the pulley, and the movement of the moving rack drives the connecting arm, the connecting plate and the wave insertion rod to move, and the wave insertion rod is inserted into the slot;

[0022] S3, pressure test adjustment operation;

[0023] S3.1. If an overall pressure test is required, the rotating block drives the driving gear to rotate, the driving gear drives several driven gears to rotate, the driven gear drives the pressure contact to rotate, the rotating rod on the pressure contact is movably inserted in the curved groove, causing the pressure contact to move upward, when the pressure contact retracts into the rotating groove B, the locking effect is achieved by inserting the locking rod in the lock hole, so that several pressure contacts retract and the contact area is increased;

[0024] S3.2. If a local pressure test is required, the rotating block drives the driving gear to rotate, the driving gear drives several driven gears to rotate, the driven gear drives the pressure contact to rotate, the rotating rod on the pressure contact is movably inserted in the curved groove, causing the pressure contact to move downward, when the pressure contact moves out of the rotating groove B, the locking effect is achieved by inserting the locking rod in the lock hole, so that several pressure contacts protrude and the contact area is reduced;

[0025] S4, compression resistance test operation;

[0026] When the downward stroke of the pressure cylinder drives the installation pressure plate to press down, when the pressure test head contacts the circuit board to be tested, due to the factors of gravity and pressure, the suspension rod is inserted into the suspension tube, and the rotating block moves downward in the spiral groove through the limit rod and the rotary wheel. At this time, if the wave rod is out of the slot, the limit rod and the rotary wheel rotate steadily in the spiral groove and descend to the bottom, and a steady-state pressure test is performed on the circuit board. If the wave rod is inserted into the slot, due to the bulge generated by the wave rod, the limit rod and the rotary wheel contact the bulge generated by the wave rod when they spirally descend in the spiral groove, causing the installation ring plate to generate a vibration impact, driving the pressure test head to perform an impact test on the circuit board, simulating the bumpy state of the driving road to test the pressure resistance performance data of the circuit board.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The present invention improves the structure of the existing circuit board compressive performance test equipment by arranging a downward pressure cylinder on the test base frame, arranging a mounting pressure plate at the output end of the downward pressure cylinder, and arranging a mode adjustment mechanism on the mounting pressure plate. The opposite moving component of the mode adjustment mechanism drives the fluctuation adjustment component to move. The fluctuation adjustment component causes the structure of the rotating downward pressure component to change, so that when the pressure test head contacts the circuit board for a compressive physical test, the static pressure test state and the dynamic bump test state can be switched, so as to test the pressure resistance and pressure resistance and impact resistance of the circuit board. The simulation test method with multiple effects is beneficial to improving product quality and reliability.

[0029] 2. In the present invention, a servo motor is driven to rotate the gear, and the gear is meshed with the moving rack so that the moving rack generates opposite movement on the slide rail through the pulley. The movement of the moving rack drives the connecting arm, the connecting plate and the wave insertion rod to move. The wave insertion rod realizes two states of being inserted into the slot or out of the slot. When the downward stroke of the cylinder drives the installation pressure plate to press down, when the pressure test head contacts the circuit board to be tested, due to the factors of gravity and pressure, the suspension rod is movably inserted into the suspension tube, and the rotating block rotates and moves downward in the spiral groove through the limit rod and the rotating wheel. At this time, if the wave insertion rod is out of the slot, the limit rod and the rotating wheel rotate steadily in the spiral groove and descend to the bottom end, and a steady-state pressure resistance test is performed on the circuit board. If the wave insertion rod is inserted into the slot, a bulge is generated on the wave insertion rod. When the limit rod and the rotating wheel spirally descend in the spiral groove, they contact with the bulge generated by the wave insertion rod, so that the installation ring plate generates a vibration impact and drives the pressure test head to perform an impact test on the circuit board, simulating the bumpy state of the driving road to test the pressure resistance performance data of the circuit board.

[0030] 3. In the present invention, rotating the rotating block drives the driving gear to rotate, the driving gear rotates to drive a number of driven gears to rotate, the driven gear drives the pressure contact to rotate, the rotating rod on the pressure contact is movably inserted in the curved groove, causing the pressure contact to move downward, when the pressure contact moves out of the rotating groove B, the locking effect is achieved by inserting the locking rod in the lock hole, so that a number of pressure contacts protrude, reducing the contact area, realizing the pressure point test in the pressure resistance test process, simulating the local extrusion that may occur in the actual situation, further enriching the device testing function, and more accurately evaluating the pressure resistance of the circuit board in a dynamic and complex environment.

[0031] 4. The annular clamping mechanism of the present invention drives the worm gear sleeve to rotate through the driving mechanism, and the worm gear sleeve drives the rotating ring to rotate. The long hole B of the rotating ring allows the sliding rod to slide inside it, driving a plurality of clamping blocks to realize inward closing movement or opening movement, thereby realizing annular 360-degree clamping of the circuit board. It is suitable for circuit boards of various shapes and sizes, including round, square and other irregularly shaped circuit boards. This uniform clamping also helps to reduce deformation and stress concentration of the circuit board during testing, thereby improving the reliability and accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall top surface structure of the present invention;

[0033] Figure 2 It is a schematic diagram of the overall bottom surface structure of the present invention;

[0034] Figure 3 It is an enlarged view of point A of the present invention;

[0035] Figure 4 It is a schematic diagram of the structure of the mounting bracket, the downward pressure cylinder, the mode adjustment mechanism, the pressure test head and the pressure test instrument of the present invention;

[0036] Figure 5 It is a schematic diagram of the structure of the mode adjustment mechanism and the pressure test head of the present invention;

[0037] Figure 6 It is a schematic diagram of the split structure of the mode adjustment mechanism and the pressure test head of the present invention;

[0038] Figure 7 It is a cross-sectional structural schematic diagram of the rotating pressing assembly and the hoisting balancing assembly of the present invention;

[0039] Figure 8 It is a schematic diagram of the structure of the opposite moving assembly and the fluctuation regulating assembly of the present invention;

[0040] Fig. 9 It is a schematic diagram of the structure of the rotary pressing assembly and the fluctuation regulating assembly of the present invention;

[0041] Fig.10 It is a schematic diagram of the cross-sectional structure of the pressure test head of the present invention;

[0042] Fig.11 It is a schematic diagram of the cross-sectional structure of the pressure ring plate of the present invention;

[0043] Fig.12 It is a schematic diagram of the structure of the annular clamping mechanism and the driving mechanism of the present invention;

[0044] Fig.13 It is a schematic diagram of the disassembled structure of the annular clamping mechanism of the present invention;

[0045] Fig.14 It is a schematic diagram of the structure of the clamping block of the present invention;

[0046] Description of the numbers in the figure:

[0047] 1. Test base frame; 2. Mounting bracket; 3. Pressing cylinder; 4. Mode adjustment mechanism; 5. Pressure test head; 6. Ring clamping mechanism; 7. Driving mechanism; 8. Mounting plate; 9. Pressure test instrument;

[0048] 401, hoisting balance assembly; 402, rotating and pressing assembly; 403, opposite movement assembly; 404, fluctuation adjustment assembly;

[0049] 501, pressure ring plate; 502, rotation groove A; 503, rotation groove B; 504, curved groove; 505, driving gear; 506, driven gear; 507, pressure contact; 508, locking assembly; 509, rotating rod;

[0050] 601, bearing plate; 602, bearing ring; 603, sliding rod; 604, rotating ring; 605, clamping block; 606, worm gear sleeve; 607, long hole A; 608, long hole B;

[0051] 701, reduction motor; 702, worm;

[0052] 4011, suspension rod; 4012, suspension tube; 4013, installation ring plate;

[0053] 4021, spiral pressing cylinder; 4022, spiral groove; 4023, rotating block; 4024, limiting rod; 4025, rotating wheel; 4026, slot;

[0054] 4031, servo motor; 4032, gear; 4033, slide rail; 4034, pulley; 4035, moving rack;

[0055] 4041, connecting arm; 4042, connecting plate; 4043, wave plug;

[0056] 5081, fixed ring plate; 5082, lock hole; 5083, rotating block; 5084, lock rod;

[0057] 6051, circuit board slot. DETAILED DESCRIPTION

[0058] like Figures 1 to 14 As shown, the present invention relates to a compression performance testing device for a circuit board of an electronic device, comprising a test base frame 1, a mounting bracket 2 is provided at the top of the test base frame 1, a downward pressure cylinder 3 is provided on the mounting bracket 2, a mounting pressure plate 8 is hoisted at the output end of the downward pressure cylinder 3, a pressure test instrument 9 is provided at one end of the mounting pressure plate 8 close to the test base frame 1, a mode adjustment mechanism 4 is connected to the bottom end of the mounting pressure plate 8, a pressure test head 5 is connected to the bottom end of the mode adjustment mechanism 4, an annular clamping mechanism 6 is provided at the bottom end of the test base frame 1 directly below the pressure test head 5, and a driving mechanism 7 is provided on one side of the annular clamping mechanism 6; the mode adjustment mechanism 4 comprises a hoisting balance component 401, a rotating downward pressure component 402, and a counter-moving Component 403 and fluctuation adjustment component 404, the hoisting and balancing component 401 is hoisted at the bottom end of the mounting pressure plate 8 and is located directly above the annular clamping mechanism 6, the rotating and pressing component 402 is arranged on the hoisting and balancing component 401, the opposite moving component 403 is installed at the bottom end of the hoisting and balancing component 401, one end of the fluctuation adjustment component 404 is connected to the opposite moving component 403, and the other end of the fluctuation adjustment component 404 is movably inserted in the rotating and pressing component 402, and the pressure test head 5 is connected to the bottom end of the opposite moving component 403; wherein, the opposite moving component 403 drives the fluctuation adjustment component 404 to cause the rotating and pressing component 402 to form a static pressure test state or a dynamic bump test state.

[0059] The present invention improves the structure of the existing circuit board compressive performance testing equipment by arranging a downward pressure cylinder 3 on a test base frame 1, arranging a mounting pressure plate 8 at the output end of the downward pressure cylinder 3, and arranging a mode adjustment mechanism 4 on the mounting pressure plate 8. The mode adjustment mechanism 4 drives the fluctuation adjustment component 404 to move through the opposite moving component 403. The fluctuation adjustment component 404 changes the structure of the rotating downward pressure component 402, so that when the pressure test head 5 contacts the circuit board for a compressive physical test, the static pressure test state and the dynamic bump test state can be switched, so as to test the pressure resistance and pressure resistance and impact resistance of the circuit board. The simulation test method with multiple effects is beneficial to improving product quality and reliability.

[0060] In the embodiment of the present invention, the hoisting balance assembly 401 includes a suspension rod 4011, a suspension tube 4012 and a mounting ring plate 4013. The suspension rod 4011 is symmetrically suspended at the bottom end of the mounting plate 8. The suspension tube 4012 is movably mounted at the bottom end of the suspension rod 4011. The mounting ring plate 4013 is connected to the bottom end of the suspension tube 4012. The rotating downward pressing assembly 402 is arranged at the top end of the mounting ring plate 4013. The opposite moving assembly 403 is connected to the bottom end of the mounting ring plate 4013. In the present invention, two suspension rods 4011 are arranged at the bottom end of the mounting plate 8. The suspension tube 4012 is movably mounted on the outer wall of the suspension rod 4011. The opening radius of the top end of the suspension tube 4012 is larger than the radius of the suspension rod 4011, so that there is a certain movable gap between the suspension tube 4012 and the suspension rod 4011.

[0061] In an embodiment of the present invention, the rotating pressing assembly 402 includes a spiral pressing cylinder 4021, a spiral groove 4022, a rotating block 4023, a limiting rod 4024, a rotating wheel 4025 and a slot 4026. The spiral pressing cylinder 4021 is arranged at the top of the mounting ring plate 4013, the spiral groove 4022 is opened on the spiral pressing cylinder 4021, the rotating block 4023 is rotatably connected to the output end of the pressing cylinder 3, the limiting rod 4024 is symmetrically arranged on the outer wall of the rotating block 4023, the rotating wheel 4025 is rotatably sleeved on the limiting rod 4024, a plurality of slots 4026 are symmetrically opened on the spiral groove 4022, and the limiting rod 4024 and the rotating wheel 4025 are movably inserted into the spiral groove 4022. A plurality of slots 4026 are vertically provided on both sides of the spiral groove 4022 in the present invention, and a certain movable gap exists between the rotating wheel 4025 rotatably arranged on the limiting rod 4024 and the spiral groove 4022, which is beneficial for the bulge generated after the fluctuation adjustment component 404 is inserted into the slot 4026 when the fluctuation adjustment component 404 is inserted into the slot 4026, so that the limiting rod 4024 drives the rotating block 4023 to produce a simulated bumpy impact effect, thereby performing a performance test on the vehicle circuit board.

[0062] The opposite moving component 403 includes a servo motor 4031, a gear 4032, a slide rail 4033, a pulley 4034 and a movable rack 4035. The gear 4032 is rotatably connected to the bottom end of the mounting plate 8. The servo motor 4031 is arranged inside the pressure test head 5. The output end of the servo motor 4031 is connected to the gear 4032. The slide rail 4033 is symmetrically arranged at the bottom end of the mounting plate 8. The pulley 4034 is arranged inside the slide rail 4033. The movable rack 4035 is connected to the pulley 4034. The end of the fluctuation adjustment component 404 away from the rotating pressing component 402 is connected to the movable rack 4035. In the present invention, the driving servo motor 4031 drives the gear 4032 to rotate, and the gear 4032 engages with the movable rack 4035 so that the movable rack 4035 moves in opposite directions on the slide rail 4033 through the pulley 4034. The movement of the movable rack 4035 drives the fluctuation adjustment component 404 to move in opposite directions, and the fluctuation adjustment component 404 realizes two states of being inserted into the slot 4026 or being detached from the slot 4026.

[0063] The fluctuation adjustment component 404 includes a connecting arm 4041, a connecting plate 4042 and a fluctuation rod 4043. The connecting arm 4041 is connected to the movable rack 4035. The connecting plate 4042 is connected to the end of the connecting arm 4041 away from the movable rack 4035. A plurality of fluctuation rods 4043 are connected to the end of the connecting plate 4042 away from the connecting arm 4041. The end of the fluctuation rod 4043 away from the connecting plate 4042 is movably inserted into the slot 4026, and the slot 4026 is adapted to the fluctuation rod 4043. In the present invention, the servo motor 4031 drives the gear 4032 to rotate, and the gear 4032 is meshed with the moving rack 4035 so that the moving rack 4035 moves in opposite directions on the slide rail 4033 through the pulley 4034. The moving rack 4035 moves to drive the connecting arm 4041, the connecting plate 4042 and the wave insertion rod 4043 to move. The wave insertion rod 4043 can be inserted into the slot 4026 or out of the slot 4026. When the pressing cylinder 3 drives the installation pressing plate 8 to press down, when the pressure test head 5 contacts the circuit board to be tested, due to the factors of gravity and pressure, the suspension rod 4011 is movably inserted into the suspension tube 4012, and the rotating block 4023 is moved by the limit rod 4 024 and the rotating wheel 4025 rotate and move downward in the spiral groove 4022. At this time, if the wave rod 4043 is disengaged from the slot 4026, the limit rod 4024 and the rotating wheel 4025 rotate steadily in the spiral groove 4022 and descend to the bottom, and a steady-state pressure resistance test is performed on the circuit board. If the wave rod 4043 is inserted into the slot 4026, due to the bulge generated by the wave rod 4043, the limit rod 4024 and the rotating wheel 4025 contact the bulge generated by the wave rod 4043 when spirally descending in the spiral groove 4022, so that the mounting ring plate 4013 generates a vibration impact, which drives the pressure test head 5 to perform an impact test on the circuit board, simulating the bumpy state of the driving road to test the compression resistance performance data of the circuit board.

[0064] As another embodiment of the present invention, the pressure test head 5 includes a pressure ring plate 501, a rotating groove A502, a rotating groove B503, a curved groove 504, a driving gear 505, a driven gear 506, a pressure contact 507, a locking assembly 508 and a rotating rod 509, the pressure ring plate 501 is connected to the bottom end of the slide rail 4033, the servo motor 4031 is arranged inside the pressure ring plate 501, the rotating groove A502 is opened on the pressure ring plate 501, and the rotating groove B503 is opened in a circular shape at equal intervals on the pressure ring plate 501 near the outer side of the rotating groove A502, and the rotating groove A502 and the rotating groove B503 is internally connected, and the curved groove 504 is provided on the inner wall of the rotating groove B503. The driving gear 505 is rotatably connected to the rotating groove A502, and the driven gear 506 is rotatably connected to the rotating groove B503. The driven gear 506 is meshingly connected to the driving gear 505. The pressure contact 507 is telescopically connected to the driven gear 506. One end of the rotating rod 509 is connected to the outer wall of the pressure contact 507, and the other end of the rotating rod 509 is movably inserted in the curved groove 504. The locking assembly 508 is provided on the rotating groove A502, and the top end of the locking assembly 508 is connected to the driving gear 505.

[0065] The locking assembly 508 includes a fixed ring plate 5081, a locking hole 5082, a rotating block 5083 and a locking rod 5084. The fixed ring plate 5081 is arranged at a position close to the bottom end of the rotating groove A502 and the driving gear 505. The locking holes 5082 are arranged in a ring shape and at equal intervals on the fixed ring plate 5081. The rotating block 5083 is rotatably inserted on the fixed ring plate 5081. One end of the rotating block 5083 away from the fixed ring plate 5081 is connected to the driving gear 505. One end of the locking rod 5084 is connected to the outer wall of the rotating block 5083, and the other end of the locking rod 5084 is inserted into the locking hole 5082.

[0066] In the present invention, the rotating block 5083 drives the active gear 505 to rotate, and the rotation of the active gear 505 drives a number of driven gears 506 to rotate, and the driven gear 506 drives the pressure contact 507 to rotate, and the rotating insertion rod 509 on the pressure contact 507 is movably inserted in the curved groove 504, causing the pressure contact 507 to move downward. When the pressure contact 507 moves out of the rotating groove B503, the locking effect is achieved by inserting the locking rod 5084 in the locking hole 5082, so that a number of pressure contacts 507 protrude, reducing the contact area, realizing the pressure point test in the pressure resistance test process, simulating the local extrusion that may occur in the actual situation, further enriching the device testing function, and more accurately evaluating the pressure resistance performance of the circuit board in a dynamic and complex environment.

[0067] As another embodiment of the present invention, the annular clamping mechanism 6 includes a bearing plate 601, a bearing ring 602, a slide rod 603, a rotating ring 604, a clamping block 605, a worm gear sleeve 606, a long hole A607 and a long hole B608. The bearing plate 601 is arranged at the bottom end of the test base 1 and is located directly below the pressure test head 5. The bearing ring 602 is arranged on the bearing plate 601. The long holes A607 are arranged on the bearing ring 602 in an annular shape with equal intervals. The bottom of the slide rod 603 is provided with a plurality of holes. The end is movably inserted into the long hole A607, the clamping block 605 is sleeved on the sliding rod 603, the long holes B608 are arranged in a ring shape with equal intervals on the rotating ring 604, the rotating ring 604 is movably sleeved on the top of the sliding rod 603 through the long hole A607, the worm gear sleeve 606 is sleeved on the rotating ring 604, and the output end of the driving mechanism 7 is connected to the worm gear sleeve 606; a circuit board slot 6051 is opened on the clamping block 605, and a plurality of circuit board slots 6051 form an annular clamping cavity. The annular clamping mechanism 6 in the present invention drives the worm gear sleeve 606 to rotate through the driving mechanism 7, and the worm gear sleeve 606 drives the rotating ring 604 to rotate. The long hole B608 of the rotating ring 604 allows the sliding rod 603 to slide inside it, driving a plurality of clamping blocks 605 to achieve an inward closing movement or an open movement, thereby achieving an annular 360-degree clamping of the circuit board. It is suitable for circuit boards of various shapes and sizes, including round, square and other irregularly shaped circuit boards. This uniform clamping also helps to reduce deformation and stress concentration of the circuit board during testing, thereby improving the reliability and accuracy of the test.

[0068] As another embodiment of the present invention, the driving mechanism 7 includes a reduction motor 701 and a worm 702. The reduction motor 701 is arranged on one side of the annular clamping mechanism 6. The worm 702 is connected to the output end of the reduction motor 701. The end of the worm 702 away from the reduction motor 701 is meshed and connected to the worm gear sleeve 606. In the present invention, the reduction motor 701 drives the worm 702 to rotate, and the worm 702 drives the worm gear sleeve 606 to rotate, so that the annular clamping mechanism 6 in the present invention has a certain self-locking property. In the application of the annular clamp, this feature helps to ensure that the clamp will not accidentally loosen due to external factors when clamping the circuit board, thereby improving the stability and reliability of the clamping. Example

[0069] This embodiment provides a method for using a device for testing the compressive performance of a circuit board of an electronic device, comprising the following steps:

[0070] S1, circuit board fixing operation;

[0071] The circuit board is placed in the annular clamping mechanism 6, and the driving mechanism 7 drives the worm gear sleeve 606 to rotate, and the worm gear sleeve 606 drives the rotating ring 604 to rotate. The long hole B608 of the rotating ring 604 allows the slide bar 603 to slide inside it, driving the plurality of clamping blocks 605 to achieve inward contraction and closure. The plurality of circuit board grooves 6051 provided on the clamping blocks 605 form an annular clamping cavity, thereby achieving an annular 360-degree clamping of the circuit board.

[0072] S2, anti-stress mode adjustment operation;

[0073] S2.1. Select a specific mode according to the type of compression test required for the circuit board; if a steady-state compression test is required, drive the servo motor 4031 to drive the gear 4032 to rotate, the gear 4032 is meshed with the moving rack 4035 so that the moving rack 4035 moves in opposite directions on the slide rail 4033 through the pulley 4034, the moving rack 4035 moves to drive the connecting arm 4041, the connecting plate 4042 and the wave plug 4043 to move, and the wave plug 4043 is separated from the slot 4026;

[0074] S2.2. Select a specific mode according to the type of pressure resistance test required for the circuit board; if impact pressure resistance test is required, drive the servo motor 4031 to drive the gear 4032 to rotate, the gear 4032 is engaged with the moving rack 4035 so that the moving rack 4035 moves in opposite directions on the slide rail 4033 through the pulley 4034, and the moving rack 4035 moves to drive the connecting arm 4041, the connecting plate 4042 and the wave insertion rod 4043 to move, and the wave insertion rod 4043 is inserted into the slot 4026;

[0075] S3, pressure test adjustment operation;

[0076] S3.1. If an overall pressure test is required, the rotating block 5083 is rotated to drive the driving gear 505 to rotate, and the driving gear 505 rotates to drive a plurality of driven gears 506 to rotate, and the driven gear 506 drives the pressure contact 507 to rotate, and the rotating plug 509 on the pressure contact 507 is movably inserted in the curved groove 504, so that the pressure contact 507 moves upward. When the pressure contact 507 retracts into the rotating groove B503, the locking effect is achieved by inserting the locking rod 5084 in the locking hole 5082, so that a plurality of pressure contacts 507 retract, thereby increasing the contact area;

[0077] S3.2. If a local pressure test is required, the rotating block 5083 is rotated to drive the driving gear 505 to rotate, and the driving gear 505 rotates to drive a plurality of driven gears 506 to rotate, and the driven gear 506 drives the pressure contact 507 to rotate, and the rotating plug 509 on the pressure contact 507 is movably inserted in the curved groove 504, so that the pressure contact 507 moves downward. When the pressure contact 507 moves out of the rotating groove B503, the locking effect is achieved by inserting the locking rod 5084 in the locking hole 5082, so that a plurality of pressure contacts 507 protrude, reducing the contact area;

[0078] S4, compression resistance test operation;

[0079] When the downward stroke of the pressing cylinder 3 drives the installation pressure plate 8 to press down, when the pressure test head 5 contacts the circuit board to be tested, due to the factors of gravity and pressure, the suspension rod 4011 is movably inserted into the suspension tube 4012, and the rotating block 4023 rotates and moves downward in the spiral groove 4022 through the limit rod 4024 and the rotating wheel 4025. At this time, if the wave insertion rod 4043 is disengaged from the slot 4026, the limit rod 4024 and the rotating wheel 4025 rotate steadily in the spiral groove 4022 and descend to the bottom, and a steady-state pressure resistance test is performed on the circuit board. If the wave insertion rod 4043 is inserted into the slot 4026, due to the bulge generated by the wave insertion rod 4043, the limit rod 4024 and the rotating wheel 4025 spirally descend in the spiral groove 4022 and contact the bulge generated by the wave insertion rod 4043, so that the installation ring plate 4013 generates a vibration impact, which drives the pressure test head 5 to perform an impact test on the circuit board, simulating the bumpy state of the driving road to test the pressure resistance performance data of the circuit board.

[0080] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A compressive performance testing device for electronic equipment circuit boards, characterized in that: The test frame (1) comprises a test base frame (1), wherein a mounting bracket (2) is provided at the top of the test base frame (1), a downward pressure cylinder (3) is provided on the mounting bracket (2), a mounting pressure plate (8) is hoisted at the output end of the downward pressure cylinder (3), a pressure test instrument (9) is provided at one end of the mounting pressure plate (8) close to the test base frame (1), a mode adjustment mechanism (4) is connected at the bottom end of the mounting pressure plate (8), a pressure test head (5) is connected at the bottom end of the mode adjustment mechanism (4), an annular clamping mechanism (6) is provided at a position directly below the pressure test head (5) at the bottom end of the test base frame (1), and a driving mechanism (7) is provided on one side of the annular clamping mechanism (6); The mode adjustment mechanism (4) comprises a hoisting balancing component (401), a rotating pressing component (402), an opposing moving component (403) and a fluctuation adjustment component (404); the hoisting balancing component (401) is hoisted at a position directly above the annular clamping mechanism (6) at the bottom end of the mounting pressure plate (8); the rotating pressing component (402) is arranged on the hoisting balancing component (401); the opposing moving component (403) is installed at the bottom end of the hoisting balancing component (401); one end of the fluctuation adjustment component (404) is connected to the opposing moving component (403); the other end of the fluctuation adjustment component (404) is movably inserted into the rotating pressing component (402); and the pressure test head (5) is connected to the bottom end of the opposing moving component (403); The oppositely moving component (403) drives the fluctuation regulating component (404) so ​​that the rotating pressing component (402) forms a static pressure test state or a dynamic bump test state; The hoisting balance component (401) comprises a suspension rod (4011), a suspension tube (4012) and a mounting ring plate (4013); the suspension rod (4011) is symmetrically suspended at the bottom end of the mounting pressure plate (8); the suspension tube (4012) is movably sleeved at the bottom end of the suspension rod (4011); the mounting ring plate (4013) is connected to the bottom end of the suspension tube (4012); the rotating downward pressing component (402) is arranged at the top end of the mounting ring plate (4013); and the oppositely moving component (403) is connected to the bottom end of the mounting ring plate (4013); The rotary pressing component (402) comprises a spiral pressing cylinder (4021), a spiral groove (4022), a rotating block (4023), a limiting rod (4024), a rotating wheel (4025) and a slot (4026); the spiral pressing cylinder (4021) is arranged at the top of the mounting ring plate (4013); the spiral groove (4022) is opened on the spiral pressing cylinder (4021); the rotating block (4023) is rotatably connected to the output end of the pressing cylinder (3); the limiting rod (4024) is symmetrically arranged on the outer wall of the rotating block (4023); the rotating wheel (4025) is rotatably sleeved on the limiting rod (4024); a plurality of slots (4026) are symmetrically opened on the spiral groove (4022); the limiting rod (4024) and the rotating wheel (4025) are movably inserted into the spiral groove (4022); The opposing moving component (403) comprises a servo motor (4031), a gear (4032), a slide rail (4033), a pulley (4034) and a movable rack (4035); the gear (4032) is rotatably connected to the bottom end of the mounting plate (8); the servo motor (4031) is arranged inside the pressure test head (5); the output end of the servo motor (4031) is connected to the gear (4032); the slide rail (4033) is symmetrically arranged at the bottom end of the mounting plate (8); the pulley (4034) is arranged inside the slide rail (4033); the movable rack (4035) is connected to the pulley (4034); and one end of the fluctuation adjustment component (404) away from the rotating pressing component (402) is connected to the movable rack (4035); The fluctuation adjustment component (404) comprises a connecting arm (4041), a connecting plate (4042) and a fluctuation insertion rod (4043), wherein the connecting arm (4041) is connected to the movable rack (4035), the connecting plate (4042) is connected to one end of the connecting arm (4041) away from the movable rack (4035), a plurality of fluctuation insertion rods (4043) are connected to one end of the connecting plate (4042) away from the connecting arm (4041), and one end of the fluctuation insertion rod (4043) away from the connecting plate (4042) is movably inserted into the slot (4026), and the slot (4026) is adapted to the fluctuation insertion rod (4043).

2. The device for testing the compressive performance of a circuit board of an electronic device according to claim 1, characterized in that: The pressure test head (5) comprises a pressure ring plate (501), a rotating groove A (502), a rotating groove B (503), a curved groove (504), a driving gear (505), a driven gear (506), a pressure contact (507), a locking assembly (508) and a rotating plug rod (509), wherein the pressure ring plate (501) is connected to the bottom end of the slide rail (4033), the servo motor (4031) is arranged inside the pressure ring plate (501), the rotating groove A (502) is opened on the pressure ring plate (501), the rotating groove B (503) is opened in a circular shape at equal intervals on the pressure ring plate (501) near the outer side of the rotating groove A (502), and the rotating groove A (502) is connected to the inside of the rotating groove B (503). The curved groove (504) is formed on the inner wall of the rotating groove B (503); the driving gear (505) is rotatably connected to the rotating groove A (502); the driven gear (506) is rotatably connected to the rotating groove B (503); the driven gear (506) is meshingly connected to the driving gear (505); the pressure contact (507) is telescopically connected to the driven gear (506); one end of the rotating rod (509) is connected to the outer wall of the pressure contact (507); the other end of the rotating rod (509) is movably inserted into the curved groove (504); the locking assembly (508) is arranged on the rotating groove A (502); and the top end of the locking assembly (508) is connected to the driving gear (505).

3. The compression resistance testing device for electronic device circuit board according to claim 2, characterized in that: The locking assembly (508) comprises a fixed ring plate (5081), a locking hole (5082), a rotating block (5083) and a locking rod (5084); the fixed ring plate (5081) is arranged at a position of the rotating groove A (502) close to the bottom end of the driving gear (505); the locking holes (5082) are arranged on the fixed ring plate (5081) in a ring shape and are equidistantly spaced; the rotating block (5083) is rotatably inserted on the fixed ring plate (5081); one end of the rotating block (5083) away from the fixed ring plate (5081) is connected to the driving gear (505); one end of the locking rod (5084) is connected to the outer wall of the rotating block (5083); and the other end of the locking rod (5084) is inserted into the locking hole (5082).

4. The compression resistance testing device for electronic device circuit board according to claim 3 is characterized in that: The annular clamping mechanism (6) comprises a bearing plate (601), a bearing ring (602), a sliding rod (603), a rotating ring (604), a clamping block (605), a worm gear sleeve (606), a long hole A (607) and a long hole B (608), wherein the bearing plate (601) is arranged at a position directly below the pressure test head (5) at the bottom end of the test base frame (1), the bearing ring (602) is arranged on the bearing plate (601), and the long holes A (607) are arranged in a circular shape and are evenly spaced from each other on the bearing ring (60 2), the bottom end of the slide bar (603) is movably inserted into the long hole A (607), the clamping block (605) is sleeved on the slide bar (603), the long holes B (608) are arranged in a circular shape and are evenly spaced on the rotating ring (604), the rotating ring (604) is movably sleeved on the top end of the slide bar (603) through the long hole A (607), the worm gear sleeve (606) is sleeved on the rotating ring (604), and the output end of the driving mechanism (7) is connected to the worm gear sleeve (606); The clamping block (605) is provided with a circuit board slot (6051), and a plurality of the circuit board slots (6051) form an annular clamping cavity.

5. The device for testing the compressive performance of a circuit board of an electronic device according to claim 4, characterized in that: The driving mechanism (7) comprises a reduction motor (701) and a worm (702); the reduction motor (701) is arranged on one side of the annular clamping mechanism (6); the worm (702) is connected to an output end of the reduction motor (701); and one end of the worm (702) away from the reduction motor (701) is meshingly connected to the worm gear sleeve (606).

6. The method for using the device for testing the compressive performance of a circuit board of an electronic device according to claim 5, characterized in that: The following steps are involved: S1, circuit board fixing operation; The circuit board is placed in the annular clamping mechanism (6), and the driving mechanism (7) drives the worm gear sleeve (606) to rotate, and the worm gear sleeve (606) drives the rotating ring (604) to rotate, and the long hole B (608) of the rotating ring (604) allows the sliding rod (603) to slide inside it, driving the plurality of clamping blocks (605) to achieve inward retraction and closure, and the plurality of circuit board grooves (6051) provided on the clamping blocks (605) form an annular clamping cavity, thereby achieving an annular 360-degree clamping of the circuit board; S2, anti-stress mode adjustment operation; S2.

1. Select a specific mode according to the type of pressure resistance test required for the circuit board; if a steady-state pressure resistance performance test is required, drive the servo motor (4031) to drive the gear (4032) to rotate, the gear (4032) is meshed with the moving rack (4035) so that the moving rack (4035) moves in opposite directions on the slide rail (4033) through the pulley (4034), the moving rack (4035) moves to drive the connecting arm (4041), the connecting plate (4042) and the wave plug (4043) to move, and the wave plug (4043) is separated from the slot (4026); S2.

2. Select a specific mode according to the type of pressure resistance test required for the circuit board; if an impact pressure resistance test is required, drive the servo motor (4031) to drive the gear (4032) to rotate, the gear (4032) is meshed with the moving rack (4035) so that the moving rack (4035) moves in opposite directions on the slide rail (4033) through the pulley (4034), the moving rack (4035) moves to drive the connecting arm (4041), the connecting plate (4042) and the wave insertion rod (4043), and the wave insertion rod (4043) is inserted into the slot (4026); S3, pressure test adjustment operation; S3.

1. If an overall pressure test is required, the rotating block (5083) is rotated to drive the driving gear (505) to rotate, and the driving gear (505) rotates to drive a plurality of driven gears (506) to rotate, and the driven gear (506) drives the pressure contact (507) to rotate, and the rotating plug rod (509) on the pressure contact (507) is movably inserted in the curved groove (504), so that the pressure contact (507) moves upward, and when the pressure contact (507) retracts into the rotating groove B (503), the locking effect is achieved by inserting the locking rod (5084) into the locking hole (5082), so that a plurality of pressure contacts (507) retract, thereby increasing the contact area; S3.

2. If a local pressure test is required, the rotating block (5083) is rotated to drive the driving gear (505) to rotate, and the driving gear (505) rotates to drive a plurality of driven gears (506) to rotate, and the driven gear (506) drives the pressure contact (507) to rotate, and the rotating plug rod (509) on the pressure contact (507) is movably inserted in the curved groove (504), so that the pressure contact (507) moves downward. When the pressure contact (507) moves out of the rotating groove B (503), the locking effect is achieved by inserting the locking rod (5084) in the locking hole (5082), so that a plurality of pressure contacts (507) protrude, thereby reducing the contact area; S4, compression resistance test operation; When the downward stroke of the pressing cylinder (3) drives the mounting plate (8) to press downward, when the pressure test head (5) contacts the circuit board to be tested, due to the factors of gravity and pressure, the suspension rod (4011) is movably inserted into the suspension tube (4012), and the rotating block (4023) rotates and moves downward in the spiral groove (4022) through the limit rod (4024) and the rotating wheel (4025). At this time, if the wave insertion rod (4043) is separated from the slot (4026), the limit rod (4024) and the rotating wheel (4025) are in the spiral groove (4022). The circuit board is subjected to a steady-state compression test after the steady-state rotation descends to the bottom. If the wave rod (4043) is inserted into the slot (4026), the wave rod (4043) generates a bulge, and the limit rod (4024) and the rotating wheel (4025) contact the bulge generated by the wave rod (4043) when they descend in a spiral groove (4022), so that the mounting ring plate (4013) generates a vibration impact, which drives the pressure test head (5) to perform an impact test on the circuit board, thereby simulating the bumpy state of a driving road to test the compression performance data of the circuit board.

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