Display modules and electronic devices

Abstract

The present application provides a display module and an electronic device, which are used to improve the impact resistance of the display module and ensure the reliability of the electronic device. In the display substrate layer of the display module, the first substrate portion is located in the first panel portion, the second substrate portion is located on one side of the first substrate portion, the second substrate portion is located in the second panel portion, the bent substrate portion is connected to the first substrate portion and the second substrate portion, and is bent relative to the first substrate portion and the second substrate portion, and the bent substrate portion is located in the bent panel portion. In the back support film, the first support film portion is provided on one side of the first substrate portion and the second substrate portion, the through hole of the first support film portion passes through the first support film portion along the thickness direction of the first support film portion, the second hole wall surface of the through hole is spaced apart from and opposite to the first hole wall surface, the second support film portion is located in the through hole, and is connected to the first hole wall surface, and is spaced apart from the second hole wall surface, and at least part of the second support film portion is provided on one side of the bent substrate portion.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and an electronic device. Background Art

[0002] Organic light-emitting diode (OLED) display panels are widely used in electronic devices such as mobile phones and computers due to their high brightness, low power consumption, fast response, and flexibility. Currently, internal signal wiring in OLED display panels often extends from the substrate and bends around the back of the OLED display panel to connect to the display driver. However, when the electronic device is impacted during use, the bend of the OLED display panel can be damaged due to its fragility, reducing the reliability of the electronic device. Summary of the Invention

[0003] The present application provides a display module and an electronic device, which are used to improve the impact resistance of the display module and ensure the reliability of the electronic device.

[0004] In a first aspect, the present application provides a display module comprising a first panel portion, a second panel portion, and a bent panel portion, wherein the second panel portion is located on one side of the first panel portion along a thickness direction of the first panel portion, and the bent panel portion is connected between the first panel portion and the second panel portion and is bent relative to the first panel portion and the second panel portion;

[0005] The display module includes a display substrate layer and a back support film, wherein the display substrate layer includes a first substrate portion, a second substrate portion, and a bent substrate portion, wherein the first substrate portion is located on the first panel portion, the second substrate portion is located on one side of the first substrate portion along the thickness direction of the first substrate portion, the second substrate portion is located on the second panel portion, the bent substrate portion is connected to the first substrate portion and the second substrate portion, and is bent relative to the first substrate portion and the second substrate portion, and is located on the bent panel portion;

[0006] The back support film includes a first support film portion and a second support film portion. The first support film portion is provided on one side of the first substrate portion and the second substrate portion along the thickness direction of the display substrate layer. The first support film portion is provided with a through hole. The through hole penetrates the first support film portion along the thickness direction of the first support film portion. The hole wall surface of the through hole includes a first hole wall surface and a second hole wall surface. The second hole wall surface is spaced apart from and opposite to the first hole wall surface. The second support film portion is located in the through hole and connected to the first hole wall surface and spaced apart from the second hole wall surface. Along the thickness direction of the display substrate layer, at least a portion of the second support film portion is provided on one side of the bent substrate portion.

[0007] The first hole wall surface is located on the first panel portion, and the second hole wall surface is located on the second panel portion, or the first hole wall surface is located on the second panel portion, and the second hole wall surface is located on the first panel portion.

[0008] In the display module shown in the present application, since the second supporting portion is connected to the wall surface of the first hole and is spaced apart from the wall surface of the second hole, the second supporting portion is equivalent to a "cantilever beam" structure. During the bending process of the bending panel portion of the display module, the second supporting portion can bend along the bending substrate portion under the drive of the bending substrate portion. The second supporting portion can effectively support the bending substrate portion, enhance the impact resistance of the display module, thereby improving the impact resistance of the display module and ensuring the reliability of the electronic device.

[0009] In one embodiment, the hole wall surface of the through hole further includes a third hole wall surface, the third hole wall surface is connected between the first hole wall surface and the second hole wall surface, and is spaced apart from the second supporting film portion.

[0010] In the display module shown in the present application, since the second supporting portion is connected to the wall surface of the first hole and is spaced apart from the wall surface of the third hole, the second supporting portion is equivalent to a "cantilever beam" structure. During the bending process of the bending panel portion of the display module, the second supporting portion can bend along the bending substrate portion under the drive of the bending substrate portion. The second supporting portion can effectively support the bending substrate portion, enhance the impact resistance of the display module, thereby improving the impact resistance of the display module and ensuring the reliability of the electronic device.

[0011] In one embodiment, the display module further includes an adhesive layer, which is located between the first supporting film portion and the display substrate layer and is bonded between the first supporting film portion and the display substrate layer.

[0012] In the display module shown in the present application, since the adhesive layer is only bonded between the first supporting portion and the first substrate portion, and between the second supporting portion and the second substrate portion, the second supporting portion is not bonded to the bent substrate portion. The second supporting portion can move relative to the bent substrate portion. During the bending process of the bent substrate portion, the second supporting portion will not increase the bending tension of the bent substrate portion, and the signal wiring inside the bent substrate portion will not be damaged, thereby ensuring the reliability of the display module.

[0013] In one embodiment, the first panel portion has a first end surface connected to the bent panel portion, and the first end surface includes a first hole wall surface. In other words, the connection point between the second support film portion and the first support film portion is located at the starting point of the display module. The second support film portion not only does not affect the support effect of the back support film on the first substrate portion, but also does not increase the bending tension of the bent substrate portion, and the signal routing layer within the bent substrate portion is not damaged, thereby ensuring the reliability of the display module. It can also ensure that the second support film portion effectively supports the bent substrate portion, enhance the impact resistance of the display module, and thus improve the impact resistance of the display module and ensure the reliability of the electronic device.

[0014] In one embodiment, the second panel portion has a second end surface connected to the bent panel portion, and the second support film portion has a free end surface facing the second hole wall surface. The free end surface is located between the second end surface and the second hole wall surface and is spaced apart from the second end surface. In other words, the free end of the second support film portion is located within the second panel portion. The second support film portion can effectively support the entire bent substrate portion, thereby enhancing the impact resistance of the display module, thereby improving the impact resistance of the display module and ensuring the reliability of the electronic device.

[0015] In one embodiment, the display substrate layer includes a substrate and a signal routing layer. Along the thickness direction of the substrate, the signal routing layer is provided on one side of the substrate, and the back support film is provided on the other side of the substrate.

[0016] The display module further includes a metal covering layer, which is disposed on a side of the signal wiring layer facing away from the substrate, and at least a portion of the metal covering layer is located on the bent panel portion;

[0017] The neutral layer of the bent panel portion is located at the signal routing layer.

[0018] During the bending process of the bending panel part, since the neutral layer of the bending panel part is located in the signal routing layer, the bending stress on the signal routing layer of the bending panel part is minimized, which can reduce the risk of damage to the signal routing layer of the bending panel part and ensure the reliability of the display module.

[0019] In one embodiment, the display module further includes a display function layer, which is disposed on a side of the first substrate portion facing away from the second substrate portion and is located in the first panel portion. The display function layer may include devices such as thin film transistors, and the first panel portion is the portion of the display module that performs the display function.

[0020] In one embodiment, the display module further includes a heat dissipation buffer layer disposed between the first substrate portion and the second substrate portion, on a side of the first support film portion facing away from the first substrate portion, and located on the first panel portion. The heat dissipation buffer layer can provide both thermal insulation and heat dissipation for the display module.

[0021] In one embodiment, the first panel portion, the second panel portion, and the bent panel portion enclose a buffer space, and the display module further includes a buffer adhesive portion, which fills the buffer space.

[0022] The buffer rubber portion can support the bent panel portion, effectively support the bent substrate portion, reduce the deformation of the signal routing in the bent substrate portion, and enhance the impact resistance of the display module, thereby improving the impact resistance of the display module and ensuring the reliability of the electronic equipment.

[0023] In a second aspect, the present application provides an electronic device, comprising a processor and any one of the above-mentioned display modules, wherein the display module is electrically connected to the processor.

[0024] In the electronic device shown in the present application, since the second supporting portion is connected to the first hole wall and is spaced apart from the second hole wall, the second supporting portion is equivalent to a "cantilever beam" structure. During the bending process of the bending panel portion of the display module, the second supporting portion can bend along the bending substrate portion under the drive of the bending substrate portion. The second supporting portion can effectively support the bending substrate portion, enhance the impact resistance of the display module, thereby improving the impact resistance of the display module and ensuring the reliability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0026] Figure 1 is a schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application;

[0027] Figure 2 yes Figure 1 A schematic diagram of the partial structure of the display module in the electronic device shown in the first embodiment after being cut along II;

[0028] Figure 3 yes Figure 2 Schematic diagram of the flattened structure of the back support film of the display panel in the display module;

[0029] Figure 4 This is the simulation result diagram of the traditional display module when it is impacted;

[0030] Figure 5 This is a diagram showing simulation results of a display module subjected to impact as shown in an embodiment of the present application;

[0031] Figure 6 yes Figure 1 A schematic diagram of the partial structure of the display module in the electronic device shown in FIG. 1 , cut along line II, in a second embodiment;

[0032] Figure 7 yes Figure 1 The diagram is a partial structural diagram of the display module in the electronic device shown in the third embodiment after being cut along II. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0034] See also Figure 1 , Figure 1 It is a schematic diagram of a partial structure of an electronic device 1000 provided in an embodiment of the present application.

[0035] The electronic device 1000 may be an electronic product such as a mobile phone, tablet computer, personal computer, multimedia player, e-book reader, laptop computer, in-vehicle device, or wearable device. The wearable device may be a wearable electronic product such as a watch, smartwatch, wristband, smart bracelet, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, VR helmet, or electronic health monitoring equipment. It may also be a wearable decorative item such as a belt, waistband, bracelet, anklet, necklace, or ring. The following description will take the electronic device 1000 as a watch as an example.

[0036] The electronic device 1000 includes a device body 100, two fixing straps (not shown) and a connecting mechanism (not shown), the two fixing straps are respectively connected to opposite sides of the device body 100, and the connecting mechanism can be connected to one end of the two fixing straps away from the device body 100. Exemplarily, the connecting mechanism has an unlocked state and a locked state. When the connecting mechanism is in the unlocked state, the two fixing straps can be relatively far apart, and the electronic device 1000 can be taken off from the user's wrist. When the connecting mechanism is in the locked state, the two fixing straps can be relatively close, and the electronic device 1000 can be wearable and fit the user's wrist. It should be noted that the embodiment of the present application does not specifically limit the structure of the connecting mechanism.

[0037] The device body 100 includes a housing 110, a processor (not shown), and a display module 120. The processor and the display module 120 are both mounted on the housing 110. The housing 110 includes a middle frame 111, a rear cover 112, and four fixing ears 113. The rear cover 112 and the four fixing ears 113 are all mounted on the middle frame 111. Specifically, along the thickness direction of the middle frame 111, the rear cover 112 is mounted on one side of the middle frame 111. The rear cover 112 can be integrally formed with the middle frame 111 to increase the overall strength of the housing 110, or the rear cover 112 can be detachably mounted on the middle frame 111 to facilitate maintenance of the electronic components inside the device body 100.

[0038] The four fixing ears 113 are all mounted on the side surfaces of the middle frame 111 and are spaced apart around the middle frame 111. Specifically, two fixing ears 113 are mounted on one side of the middle frame 111 and can be connected to a fixing strap, while the other two fixing ears 113 are mounted on the other side of the middle frame 111 and can be connected to another fixing strap, thereby connecting the housing 110 to the two fixing straps, and further connecting the device body 100 to the two fixing straps. The four fixing ears 113 and the middle frame 111 can be integrally formed to increase the overall strength of the housing 110.

[0039] The processor is installed inside the housing 110. Specifically, the processor is installed inside the middle frame 111. The processor may be a central processing unit (CPU) of the electronic device 1000.

[0040] Along the thickness direction of the housing 110, the display module 120 is installed on one side of the housing 110. Specifically, the display module 120 is installed on the side of the middle frame 111 away from the rear cover 112. That is, along the thickness direction of the middle frame 111, the display module 120 and the rear cover 112 are respectively installed on opposite sides of the middle frame 111. When the user uses the electronic device 1000, the display module 120 faces away from the user's wrist, and the rear cover 112 faces the user's wrist. Among them, the display module 120 is electrically connected to the processor. The processor can send a display signal to the display module 120, and the display module 120 can display information such as images or text based on the display signal.

[0041] Exemplarily, the display module 120 may be an organic light-emitting diode (OLED) display. In other embodiments, the display module 120 may also be an active-matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, a submillimeter light-emitting diode (Mini LED) display, a micro LED (Micro LED) display, or a quantum dot light-emitting diode (QLED) display.

[0042] Please also refer to Figure 2 , Figure 2 yes Figure 1The schematic diagram of the partial structure of the display module 120 in the electronic device 1000 is shown after it is cut along line II in the first embodiment. Figure 1 The II line is given as an example, Figure 1 Indicated by the single line in the middle.

[0043] The display module 120 includes a display panel 10, a polarizer (POL) 20, a cover plate 30, an optically clear adhesive (OCA) layer 40 and a display driver 50. The display panel 10 includes a first panel portion 11, a second panel portion 12 and a bent panel portion 13. The first panel portion 11 includes a first end surface 11a. Along the thickness direction of the first panel portion 11, the second panel portion 12 is located on one side of the first panel portion 11 and is arranged opposite to the first panel portion 11. The second panel portion 12 includes a second end surface 12a, and the second end surface 12a faces the same direction as the first end surface 11a. The bent panel portion 13 is located on the same side of the first panel portion 11 and the second panel portion 12, and is connected between the first panel portion 11 and the second panel portion 12, and is bent relative to the first panel portion 11 and the second panel portion 12. The bent panel portion 13 is located on a side of the first panel portion 11 close to the first end surface 11 a and a side of the second panel portion 12 close to the second end surface 12 a , and is connected between the first end surface 11 a and the second end surface 12 a .

[0044] The polarizer 20, the cover plate 30 and the optical adhesive layer 40 are all located on the side of the first panel portion 11 away from the second panel portion 12. The cover plate 30 is located on the side of the polarizer 20 away from the first panel portion 11, and covers the display panel 10 and the polarizer 20. Exemplarily, the cover plate 30 may be a cover glass (CG). The optical adhesive layer 40 is located between the polarizer 20 and the cover plate 30, and is bonded between the polarizer 20 and the cover plate 30. The display driver 50 is located on the side of the second panel portion 12 away from the first panel portion 11, and is electrically connected to the second panel portion 12 and the processor. The display driver 50 can be installed on the second panel portion 12 by a chip on plastic bonding (COP bonding) process. Exemplarily, the display driver 50 can be an integrated circuit chip (IC).

[0045] In this embodiment, the display panel 10 includes a display substrate layer 14, a display functional layer 15, a back support film (BPF, back pet film) 16, an adhesive layer 17, a heat dissipation buffer layer 18 and a metal cover layer (MCL, metal cover layer) 19. The display substrate layer 14 includes a first substrate portion 141, a second substrate portion 142 and a bent substrate portion 143. Along the thickness direction of the first substrate portion 141, the second substrate portion 142 is located on one side of the first substrate portion 141, and is spaced apart from and opposite to the first substrate portion 141. The bent substrate portion 143 is connected between the first substrate portion 141 and the second substrate portion 142, and is bent relative to the first substrate portion 141 and the second substrate portion 142. Among them, the first substrate portion 141 is located in the first panel portion 11, the second substrate portion 142 is located in the second panel portion 12, and the bent substrate portion 143 is located in the bent panel portion 13.

[0046] Exemplarily, the display substrate layer 14 may include a substrate (not shown) and a signal routing layer (not shown), and the signal routing layer is located on one side of the substrate along the thickness direction of the substrate. The substrate may be made of polyimide (PI), and the signal routing layer may be made of metal materials such as titanium (Ti) and aluminum (Al). It should be noted that the signal routing layer can transmit one or more of an ELVDD signal (anode voltage signal), a GIP signal (gate drive signal), a Demux signal (source conversion signal), a source signal, an ELVSS signal (cathode voltage signal), and a touch panel (TP) signal.

[0047] The display function layer 15 is located on the side of the first substrate portion 141 away from the second substrate portion 142. The display function layer 15 is located on the first panel portion 11. Exemplarily, the display function layer 15 may include a pixel structure and a thin film transistor, etc. The first panel portion 11 is the portion of the display module 120 that performs the display function. Along the thickness direction of the display substrate layer 14, the back support film 16 is located on one side of the display substrate layer 14. Exemplarily, the back support film 16 may be made of polyethylene terephthalate (PET). The back support film 16 may also be called a back protection film (BPF).

[0048] Please also refer to Figure 3 , Figure 3 yes Figure 2 FIG. 1 is a schematic diagram of the flattened structure of the back support film 16 of the display panel 10 in the display module 120 .

[0049] The back support film 16 includes a first support film portion 161 and a second support film portion 162. The first support film portion 161 is disposed on one side of the display substrate layer 14 along the thickness direction of the display substrate layer 14. Specifically, the first support film portion 161 is disposed on the side of the first substrate portion 141 facing away from the display function layer 15 and the second substrate portion 142 is disposed on the side facing the first substrate portion 141. The first support film portion 161 is provided with a through hole 163, which passes through the first support film portion 161 along the thickness direction of the first support film portion 161. The hole wall surface of the through hole 163 includes a first hole wall surface 164, a second hole wall surface 165, and a third hole wall surface 166. The first hole wall surface 164 and the second hole wall surface 165 are spaced apart and arranged opposite to each other. The third hole wall surface 166 is connected between the first hole wall surface 164 and the second hole wall surface 165. The first hole wall surface 164 is located on the first panel portion 11, and the second hole wall surface 165 is located on the second panel portion 12. Exemplarily, the first hole wall surface 164 is a part of the first end surface 11 a , that is, the first end surface 11 a includes the first hole wall surface 164 .

[0050] The second supporting film portion 162 is located within the through hole 163 and is connected to the first hole wall 164. It is spaced apart from the second hole wall 165 and the third hole wall 166. Specifically, along the thickness direction of the display substrate layer 14, at least a portion of the second supporting film portion 162 is located on one side of the bent substrate portion 143. That is, at least a portion of the second supporting film portion 162 is located on the bent panel portion 13. Exemplarily, the second supporting film portion 162 may be located in the twisted area of ​​the display panel 10. The second supporting film portion 162 includes a free end surface 167 facing away from the first hole wall 164. The free end surface 167 is located between the second end surface 12a and the second hole wall 165 and is spaced apart from the second end surface 12a. It should be noted that the distance between the free end surface 167 and the second hole wall 165 can be adjusted based on the support strength of the back supporting film 16 for the display substrate layer 14, and this application does not impose any specific restrictions on this.

[0051] During the preparation of the display module 120 shown in this embodiment, the second panel portion 12 is bent to the back side of the first panel portion 11. Since the second supporting film portion 162 is connected to the first hole wall 164 and is spaced apart from the second hole wall 165 and the third hole wall 166, the second supporting film portion 162 is equivalent to a "cantilever beam" structure. The second supporting film portion 162 can be bent from the first panel portion 11 to the second panel portion 12 along the bending substrate portion 143 under the drive of the bending substrate portion 143. The second supporting film portion 162 can effectively support the bending substrate portion 143, enhance the impact resistance of the display module 120, thereby improving the impact resistance of the display module 120 and ensuring the reliability of the electronic device 1000.

[0052] Furthermore, since the first end surface 11a includes the first hole wall surface 164, the connection position between the second support film portion 162 and the first support film portion 161 is located at the bending point of the display module 120. The second support film portion 162 will not only not affect the supporting effect of the back support film 16 on the first substrate portion 141, but also will not increase the bending tension of the bent substrate portion 143. The signal routing layer in the bent substrate portion 143 will not be damaged, thereby ensuring the reliability of the display module 120. It can also ensure that the second support film portion 162 effectively supports the bent substrate portion 143, enhance the impact resistance of the display module 120, thereby improving the impact resistance of the display module 120 and ensuring the reliability of the electronic device 1000. In addition, since the free end surface 167 of the second support film portion 162 is located within the second panel portion 12, the second support film portion 162 can effectively support the entire bent substrate portion 143, thereby enhancing the impact resistance of the display module 120, thereby improving the impact resistance of the display module 120 and ensuring the reliability of the electronic device 1000.

[0053] The adhesive layer 17 is located between the back support film 16 and the display substrate layer 14 and is bonded therebetween. The adhesive layer 17 includes a first adhesive portion 171 and a second adhesive portion 172. The first adhesive portion 171 is located between the first support film portion 161 and the first substrate portion 141 and is bonded thereto. The second adhesive portion 172 is located between the first support film portion 161 and the second substrate portion 142 and is bonded thereto. Exemplarily, the adhesive layer 17 may be an anisotropic conductive film (ACF). The first adhesive portion 171 is located on the first panel portion 11, and the second adhesive portion 172 is located on the second panel portion 12.

[0054] In the display module 120 shown in this embodiment, the adhesive layer 17 is only bonded between the first supporting film portion 161 and the first substrate portion 141, and between the second supporting film portion 162 and the second substrate portion 142. The second supporting film portion 162 is not bonded to the bent substrate portion 143. Therefore, the second supporting film portion 162 can move relative to the bent substrate portion 143. During the bending process of the bent substrate portion 143, the second supporting film portion 162 does not increase the bending tension of the bent substrate portion 143, and the signal wiring within the bent substrate portion 143 is not damaged, thereby ensuring the reliability of the display module 120.

[0055] The heat dissipation buffer layer 18 is located on the side of the back support film 16 facing away from the adhesive layer 17. Specifically, the heat dissipation buffer layer 18 is located on the side of the first support film portion 161 facing away from the first adhesive portion 171. For example, the heat dissipation buffer layer 18 can be made of a super clean foam (SCF) structure. The heat dissipation buffer layer 18 is located on the first panel portion 11 and provides both cushioning and heat dissipation for the display module 120.

[0056] The metal covering layer 19 is located on the side of the display substrate layer 14 away from the back support film 16. Specifically, at least part of the metal covering layer 19 is located on the bent panel portion 13. In this embodiment, the metal covering layer 19 includes a first covering portion 191, a second covering portion 192 and a bent covering portion 193. The first covering portion 191 is located on the side of the first substrate portion 141 away from the first adhesive portion 171. The second covering portion 192 is located on the side of the second substrate portion 142 away from the second adhesive portion 172. The bent covering portion 193 is located on the side of the bent substrate portion 143 away from the second support film portion 162. Exemplarily, the metal covering layer 19 is made of a metal material. Among them, the first covering portion 191 is located on the first panel portion 11, the second covering portion 192 is located on the second panel portion 12, and the bent covering portion 193 is located on the bent panel portion 13.

[0057] The metal covering layer 19 can adjust the neutral layer of the bending panel portion 13 to ensure that the neutral layer of the bending panel portion 13 is located on the signal routing layer of the bending panel portion 13, so as to reduce the bending stress borne by the signal routing of the bending panel portion 13 during the bending process, avoid damage to the signal routing inside the bending substrate portion 143, and ensure the reliability of the display module 120.

[0058] It should be noted that the neutral layer of the bending panel portion 13 refers to a transition layer in the bending panel portion 13 that is neither subjected to tension nor compression during the bending process. In this case, the length of the neutral layer remains the same as before the bending process. Alternatively, the neutral layer of the bending panel portion 13 may also refer to a transition layer in the bending panel portion 13 that is subjected to the least compression and pressure during the bending process. In this case, the length of the neutral layer is minimized compared to before the bending process.

[0059] Next, taking a stamping area of ​​2mm*2mm, and taking a conventional display module and the display module 120 shown in the present application as an example of being impacted under the same extrusion force value, the impact resistance of the display module 120 shown in the present application is analyzed.

[0060] See also Figure 4 and Figure 5 , Figure 4 This is the simulation result of the traditional display module when it is impacted. Figure 51 is a diagram showing simulation results of the display module 120 subjected to impact as shown in the embodiment of the present application.

[0061] from Figure 4 and Figure 5 As can be seen, in the display module 120 shown in the present application, after the bent panel portion 13 is squeezed and deformed, the bent substrate portion 143 contacts the second support film portion 162, and the second support film portion 162 provides support for the bent substrate portion 143. Under the same squeezing force, the maximum stress value of the bent panel portion in a conventional display module is 570.9 MPa, while the maximum stress value of the bent panel portion 13 in the display module 120 shown in the present application is 146.0 MPa. Compared with conventional display modules, the maximum stress value of the bent panel portion 13 in the display module 120 shown in the present application is reduced by 75%. In other words, compared with conventional display modules, the display module 120 shown in the present application has better impact resistance and greater reliability.

[0062] See also Figure 6 , Figure 6 yes Figure 1 The display module 120 in the electronic device 1000 is shown as a partial structural diagram of the second embodiment after being cut along II.

[0063] The display module 120 shown in this embodiment differs from the display module 120 shown in the first embodiment described above in that the first hole wall surface 164 is located in the second panel portion 12, and the second hole wall surface 165 is located in the first panel portion 11. For example, the first hole wall surface 164 is located on the second end surface 12a, that is, the second end surface 12a includes the first hole wall surface 164. The free end surface 167 of the second supporting film portion 162 is located between the first end surface 11a and the second hole wall surface 165, and is spaced apart from the first end surface 11a.

[0064] During the preparation of the display module 120 shown in this embodiment, the first panel portion 11 is bent to the back side of the second panel portion 12. Since the second supporting film portion 162 is connected to the first hole wall 164 and is spaced apart from the second hole wall 165 and the third hole wall 166, the second supporting film portion 162 is equivalent to a "cantilever beam" structure. The second supporting film portion 162 can be bent from the second panel portion 12 to the first panel portion 11 along the bending substrate portion 143 under the drive of the bending substrate portion 143. The second supporting film portion 162 can effectively support the bending substrate portion 143, enhance the impact resistance of the display module 120, thereby improving the impact resistance of the display module 120 and ensuring the reliability of the electronic device.

[0065] See also Figure 7 , Figure 7 yes Figure 1The display module 120 in the electronic device 1000 is shown as a partial structural diagram of the third embodiment after being cut along II.

[0066] The display module 120 shown in this embodiment is different from the display module 120 shown in the first and second embodiments described above in that the first panel portion 11, the second panel portion 12 and the bent panel portion 13 enclose a buffer space 101. In this embodiment, the display module 120 further includes a buffer glue portion 60, which fills the buffer space 101. Exemplarily, the buffer glue portion 60 can be in the form of glue dispensing or glue pouring. The buffer glue portion 60 can support the bent panel portion 13, effectively support the bent substrate portion 143, reduce the deformation of the signal routing in the bent substrate portion 143, and enhance the impact resistance of the display module 120, thereby improving the impact resistance of the display module 120 and ensuring the reliability of the electronic device 1000.

[0067] During the preparation process of the display module 120 shown in this embodiment, since the second supporting film portion 162 is connected to the first hole wall 164 and is spaced apart from the second hole wall 165 and the third hole wall 166, the second supporting film portion 162 is equivalent to a "cantilever beam" structure. The second supporting film portion 162 can be bent along the bending substrate portion 143 under the drive of the bending substrate portion 143. The second supporting film portion 162 can effectively support the bending substrate portion 143, enhance the impact resistance of the display module 120, thereby improving the impact resistance of the display module 120 and ensuring the reliability of the electronic device 1000.

[0068] The above description is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application; the embodiments of this application and the features of the embodiments can be combined with each other unless there is a conflict. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A display module, characterized in that: The display panel includes a first panel portion, a second panel portion, and a bent panel portion. The second panel portion is located on one side of the first panel portion along the thickness direction of the first panel portion. The bent panel portion is connected between the first and second panel portions and is bent relative to the first and second panel portions. The display driver is located on a side of the second panel portion facing away from the first panel portion and is electrically connected to the second panel portion. The display module includes a display substrate layer, a display function layer, and a back support film. The display substrate layer includes a first substrate portion, a second substrate portion, and a bent substrate portion. The first substrate portion is located on the first panel portion. Along the thickness direction of the first substrate portion, the second substrate portion is located on one side of the first substrate portion. The second substrate portion is located on the second panel portion. The bent substrate portion is connected to the first substrate portion and the second substrate portion, and is bent relative to the first substrate portion and the second substrate portion. The bent substrate portion is located on the bent panel portion. The display function layer is located on a side of the first substrate portion facing away from the second substrate portion, and is located on the first panel portion; The back support film includes a first support film portion and a second support film portion. Along the thickness direction of the display substrate layer, the first support film portion is provided on one side of the first substrate portion and the second substrate portion. The first support film portion is provided with a through hole, and the through hole penetrates the first support film portion along the thickness direction of the first support film portion. The hole wall surface of the through hole includes a first hole wall surface, a second hole wall surface and a third hole wall surface. The second hole wall surface is spaced apart from and opposite to the first hole wall surface. The third hole wall surface is connected between the first hole wall surface and the second hole wall surface. The second support film portion is located in the through hole and connected to the first hole wall surface. It is spaced apart from the second hole wall surface and the third hole wall surface. Along the thickness direction of the display substrate layer, at least a portion of the second support film portion is provided on one side of the bent substrate portion. The first hole wall surface is located in the first panel portion, and the second hole wall surface is located in the second panel portion, or the first hole wall surface is located in the second panel portion, and the second hole wall surface is located in the first panel portion.

2. The display module according to claim 1, wherein: The display module further includes an adhesive layer, which is located between the first supporting film portion and the display substrate layer and is bonded between the first supporting film portion and the display substrate layer.

3. The display module according to claim 1 or 2, characterized in that: The first panel portion has a first end surface connected to the bent panel portion, and the first end surface includes the first hole wall surface.

4. The display module according to claim 1 or 2, wherein: The second panel portion has a second end surface connected to the bent panel portion, and the second supporting membrane portion has a free end surface facing the second hole wall surface. The free end surface is located between the second end surface and the second hole wall surface and is spaced apart from the second end surface.

5. The display module according to claim 3, wherein: The second panel portion has a second end surface connected to the bent panel portion, and the second supporting membrane portion has a free end surface facing the second hole wall surface. The free end surface is located between the second end surface and the second hole wall surface and is spaced apart from the second end surface.

6. The display module according to any one of claims 1, 2 and 5, characterized in that: The display substrate layer includes a substrate and a signal wiring layer. Along the thickness direction of the substrate, the signal wiring layer is arranged on one side of the substrate, and the back support film is arranged on the other side of the substrate; The display module further includes a metal covering layer, the metal covering layer being disposed on a side of the signal wiring layer facing away from the substrate, and at least a portion of the metal covering layer being located on the bent panel portion; Wherein, the neutral layer of the bent panel portion is located in the signal routing layer.

7. The display module according to claim 3, wherein: The display substrate layer includes a substrate and a signal wiring layer. Along the thickness direction of the substrate, the signal wiring layer is arranged on one side of the substrate, and the back support film is arranged on the other side of the substrate; The display module further includes a metal covering layer, the metal covering layer being disposed on a side of the signal wiring layer facing away from the substrate, and at least a portion of the metal covering layer being located on the bent panel portion; Wherein, the neutral layer of the bent panel portion is located in the signal routing layer.

8. The display module according to claim 4, wherein: The display substrate layer includes a substrate and a signal wiring layer. Along the thickness direction of the substrate, the signal wiring layer is arranged on one side of the substrate, and the back support film is arranged on the other side of the substrate; The display module further includes a metal covering layer, the metal covering layer being disposed on a side of the signal wiring layer facing away from the substrate, and at least a portion of the metal covering layer being located on the bent panel portion; Wherein, the neutral layer of the bent panel portion is located in the signal routing layer.

9. The display module according to any one of claims 1, 2, 5, 7 and 8, characterized in that: The display module further includes a heat dissipation buffer layer, which is disposed between the first substrate portion and the second substrate portion, and is disposed on a side of the first supporting film portion away from the first substrate portion, and is located on the first panel portion.

10. The display module according to claim 3, wherein: The display module further includes a heat dissipation buffer layer, which is disposed between the first substrate portion and the second substrate portion, and is disposed on a side of the first supporting film portion away from the first substrate portion, and is located on the first panel portion.

11. The display module according to claim 4, wherein: The display module further includes a heat dissipation buffer layer, which is disposed between the first substrate portion and the second substrate portion, and is disposed on a side of the first supporting film portion away from the first substrate portion, and is located on the first panel portion.

12. The display module according to claim 6, wherein: The display module further includes a heat dissipation buffer layer, which is disposed between the first substrate portion and the second substrate portion, and is disposed on a side of the first supporting film portion away from the first substrate portion, and is located on the first panel portion.

13. The display module according to any one of claims 1, 2, 5, 7, 8 and 10 to 12, characterized in that: The first panel portion, the second panel portion, and the bent panel portion enclose a buffer space. The display module further includes a buffer adhesive portion, and the buffer adhesive portion fills the buffer space.

14. The display module according to claim 3, wherein: The first panel portion, the second panel portion, and the bent panel portion enclose a buffer space. The display module further includes a buffer adhesive portion, and the buffer adhesive portion fills the buffer space.

15. The display module according to claim 4, wherein: The first panel portion, the second panel portion, and the bent panel portion enclose a buffer space. The display module further includes a buffer adhesive portion, and the buffer adhesive portion fills the buffer space.

16. The display module according to claim 6, wherein: The first panel portion, the second panel portion, and the bent panel portion enclose a buffer space. The display module further includes a buffer adhesive portion, and the buffer adhesive portion fills the buffer space.

17. The display module according to claim 9, wherein: The first panel portion, the second panel portion, and the bent panel portion enclose a buffer space. The display module further includes a buffer adhesive portion, and the buffer adhesive portion fills the buffer space.

18. An electronic device, characterized in that: The device comprises a processor and a display module according to any one of claims 1 to 17, wherein the display module is electrically connected to the processor.

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