Wire bonding device, apparatus and method

Abstract

The embodiments of the present application relate to the field of chip product processing equipment, especially wire bonding devices, equipment and methods. The wire bonding device and equipment include: an XY platform unit; a first bonding unit, installed on the XY platform, including a first UVZ drive component and a first bonding mechanism connected to the first UVZ drive component; a second bonding unit, installed on the XY platform, mirror-set with the first bonding unit, including a second UVZ drive component and a second bonding mechanism connected to the second UVZ drive component. In the embodiment of the present application, two bonding units are arranged on the same XY platform unit, both of which can realize three-way movement within a certain range of travel. With the operation of the XY platform unit, two bonding stations can be bonded at the same time. At the same time, the device structure realizes the separation design of the bonding area and the bonding accuracy, so that bonding of a larger area can be realized, and the range of the bonding area can be further expanded.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of chip product processing equipment, especially wire bonding devices, equipment and methods. Background Art

[0002] In the manufacturing process of semiconductor devices, it is necessary to connect the pins of the lead frame with the pads of the semiconductor chip mounted on the lead frame through wire bonding equipment. The bonding process is mainly achieved through the wire bonding mechanism on the wire bonding equipment.

[0003] Existing wire bonding equipment uses separate wire bonding devices to perform semiconductor chip bonding processing in sequence, which has low processing efficiency. It is impossible to synchronously or asynchronously bond the pads on multiple semiconductor chips at the same time, nor is it possible to synchronously or asynchronously bond the pads on the same semiconductor chip. The bonding processing efficiency is difficult to effectively improve. Summary of the invention

[0004] In a first aspect, the embodiments of the present application provide a wire bonding device that solves the problem that existing wire bonding devices cannot perform multi-station bonding processing simultaneously, thereby greatly improving the bonding processing efficiency.

[0005] In order to solve the above problem, the wire bonding device of the embodiment of the present application includes:

[0006] XY stage unit;

[0007] a first bonding unit, mounted on the XY platform, comprising a first UVZ driving assembly and a first bonding mechanism connected to the first UVZ driving assembly;

[0008] The second bonding unit is installed on the XY platform and is arranged in a mirror image with the first bonding unit, and includes a second UVZ driving component and a second bonding mechanism connected to the second UVZ driving component.

[0009] Due to the adoption of the above-mentioned scheme, the wire bonding device of the embodiment of the present application is provided with two bonding units on the same XY platform unit, and the two bonding units are both UVZ three-axis mobile platforms superimposed on the XY platform unit, and both can realize three-way movement within a certain travel range. In conjunction with the operation of the XY platform unit, two bonding stations can be bonded at the same time, and the movement acceleration in the XY direction during the bonding process is greatly improved. At the same time, the device structure realizes the separation design of the bonding area and the bonding accuracy. The expansion of the XY travel will not affect the bonding accuracy of the UVZ bonding mechanism, thereby realizing bonding of a larger area, and the range of the bonding area can be further expanded.

[0010] In a possible implementation, the XY platform includes:

[0011] The XY platform unit includes:

[0012] The platform base includes an X-axis drive assembly mounting position and a Y-axis drive assembly mounting position;

[0013] An X-axis drive assembly is installed on the X-axis drive assembly installation position;

[0014] A Y-axis drive assembly is installed on the Y-axis drive assembly installation position;

[0015] The bonding unit mounting seat is connected to the X-axis driving assembly and the Y-axis assembly, and carries the first bonding unit and the second bonding unit to move in the X-axis and / or Y-axis directions.

[0016] In one possible implementation,

[0017] The X-axis drive assembly includes an X-axis linear motor and an X-axis body, the X-axis linear motor includes an X-axis stator and an X-axis mover, the X-axis stator is fixed on the platform base, the X-axis mover is connected to and drives the X-axis body to move horizontally in the X-axis direction, and the X-axis body is movably mounted on the platform base via a cross guide rail extending along the X-axis direction.

[0018] The Y-axis driving assembly includes a Y-axis linear motor and a Y-axis body, the Y-axis linear motor includes a Y-axis stator and a Y-axis mover, the Y-axis stator is fixed on the platform base, the Y-axis mover is connected to and drives the Y-axis body to move horizontally in the Y-axis direction, the Y-axis body is connected to the bonding unit mounting seat through a guide rail assembly, and an inner buckle structure is provided between the guide rail and the guide groove of the guide rail assembly, so that the guide rail and the guide groove can move relative to each other in the X-axis direction and cannot be separated in the Y-axis direction.

[0019] In a possible implementation, the first UVZ driving component and the second UVZ driving component respectively include:

[0020] The unit base is mounted on the XY platform.

[0021] A U-axis driving assembly, comprising a U-axis voice coil motor and a U-axis body, wherein the U-axis voice coil motor comprises a U-axis stator and a U-axis mover, wherein the U-axis stator is arranged on the unit base, and the U-axis mover is connected to the U-axis body;

[0022] A V-axis driving assembly, the V-axis driving assembly includes a V-axis voice coil motor and a V-axis body, the V-axis voice coil motor includes a V-axis stator and a V-axis mover, the V-axis stator is arranged on the unit base, and the V-axis mover is connected to the V-axis body.

[0023] The Z-axis driving assembly comprises a Z-axis voice coil motor and a Z-axis body. The Z-axis voice coil motor comprises a Z-axis stator and a Z-axis mover. The Z-axis stator is arranged on the unit base, and the Z-axis mover is connected to the Z-axis body.

[0024] In one possible implementation, the U-axis stator includes a U-axis stator magnet, the U-axis mover includes a U-axis mover coil, the U-axis mover coil has a first straight line segment extending in the V direction, and the length of the first straight line segment is greater than the V-direction coverage length of the U-axis stator magnet.

[0025] In one possible implementation, the Z-axis stator includes a Z-axis stator magnet, the Z-axis mover includes a Z-axis mover coil, the Z-axis mover coil has a second straight line segment extending in the V direction, and the length of the second straight line segment is greater than the V-direction coverage length of the Z-axis stator magnet.

[0026] In a possible implementation, the Z-axis body is provided with a first guide rail extending along the U-axis direction, the Z-axis mover of the Z-axis voice coil motor is provided with a first guide rail groove extending along the U-axis direction, and the first guide rail and the first guide rail groove are slidably connected as one;

[0027] A horizontal mounting plate is provided above the Z-axis mover, the horizontal mounting plate is fixed on the unit base, a second guide rail extending along the V-axis is provided on the lower surface of the horizontal mounting plate, a second guide rail groove extending along the V-axis direction is connected to the second guide rail, and the second guide rail groove is slidably connected to form a whole;

[0028] A transfer block is fixed on the second guide rail groove, the Z-axis mover is provided with a third guide rail extending along the Z-axis direction, the transfer block is provided with a third guide rail groove extending along the Z-axis direction, and the third guide rail and the third guide rail groove are slidably connected as a whole.

[0029] In a possible implementation, a fourth guide rail extending along the Z-axis direction is provided on the side of the X-axis body, a fourth guide rail groove extending along the Z-axis direction is provided on the Z-axis body, and the fourth guide rail and the fourth guide rail groove are slidably connected as one body;

[0030] The X-axis body is also provided with a fifth guide rail extending along the U-axis direction, and the V-axis body is provided with a fifth guide rail groove extending along the U-axis direction, and the fifth guide rail and the fifth guide rail groove are slidably connected as one body;

[0031] The V-axis body is further provided with a sixth guide rail groove extending along the V-axis direction, and the unit base is provided with a sixth guide rail extending along the V-axis direction. The sixth guide rail and the sixth guide rail groove are slidably connected as a whole.

[0032] In a second aspect, an embodiment of the present application further provides a novel wire bonding device, comprising at least two wire bonding devices described in the first aspect.

[0033] In a third aspect, the present application also provides a novel wire bonding method, comprising the steps of:

[0034] Get the X-axis range of the bonding processing area;

[0035] The bonding processing zones are divided according to the comparison result of the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and the first bonding unit and / or the second bonding unit are controlled to perform bonding processing in the bonding processing zones.

[0036] In a possible implementation, dividing the bonding processing zone according to a comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and controlling the first bonding unit and / or the second bonding unit to perform bonding processing in the bonding processing zone further includes:

[0037] When the X-axis range of the bonding processing area is less than or equal to twice the U-axis travel, the bonding processing area is equally divided along the U-axis direction into at least two areas less than or equal to the U-axis travel;

[0038] The first bonding unit or the second bonding unit is controlled to perform bonding processing independently.

[0039] In a possible implementation, dividing the bonding processing zone according to a comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and controlling the first bonding unit or the second bonding unit to perform bonding processing in the bonding processing zone further includes:

[0040] When the bonding processing area in the X-axis direction is greater than 2 times the U-axis stroke and less than or equal to 4 times the U-axis stroke, the bonding processing area is equally divided into at least two adjacent bonding processing partitions less than or equal to the U-axis stroke according to a preset length along the U-axis direction;

[0041] If there is a remaining area after the bonding processing area is divided into bonding processing partitions according to a preset length, the remaining area is set on one side of the bonding processing area as the remaining bonding processing partition;

[0042] Controlling the first bonding unit or the second bonding unit to perform bonding processing in the remaining bonding processing partitions;

[0043] The second bonding unit or the first bonding unit is controlled to perform bonding processing in the bonding processing zone.

[0044] In a possible implementation, dividing the bonding processing zone according to a comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and controlling the first bonding unit or the second bonding unit to perform bonding processing in the bonding processing zone further includes:

[0045] When the X-axis direction of the bonding processing area is greater than 4 times the U-axis travel; divide the bonding processing area into two bonding processing partitions along the center line;

[0046] The two bonding processing partitions are further equally divided into a plurality of adjacent bonding processing sub-partitions divided equally according to a preset length into at least two adjacent bonding processing sub-partitions less than or equal to the U-axis stroke;

[0047] If there is a remaining area after dividing the bonding processing sub-area, the remaining area is set on one side of the bonding processing area as the remaining processing area;

[0048] The first bonding unit or the second bonding unit is controlled to perform bonding processing on the bonding processing sub-partition and the remaining processing partitions in sequence in one bonding processing partition respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic diagram of the overall structure of the bonding device of the first embodiment;

[0050] Figure 2 It is a structural schematic diagram of the platform base of the first embodiment;

[0051] Figure 3 It is a schematic structural diagram of the driving part of the platform base of the first embodiment;

[0052] Figure 4 is a schematic diagram of the three-dimensional structure of the second embodiment;

[0053] Figure 5 It is a schematic diagram of the three-dimensional structure of the second embodiment in another direction;

[0054] Figure 6 It is a schematic diagram of the three-dimensional structure of the second embodiment in another direction;

[0055] Figure 7 It is a schematic diagram of the structure of a voice coil motor without electromagnetic decoupling stroke;

[0056] Figure 8 for Figure 4 A in the enlarged view;

[0057] Fig. 9 This is a schematic diagram of the connection structure of each shaft body of the second embodiment;

[0058] Fig.10 It is a schematic diagram of the overall structure of the bonding device of the third embodiment;

[0059] Fig.11 It is a schematic diagram of the bonding process flow of the fourth embodiment;

[0060] Fig.12 It is a schematic diagram of the bonding processing range of the fourth embodiment;

[0061] Fig.13 It is a schematic diagram of the bonding processing range of the fifth embodiment;

[0062] Fig.14 It is a schematic diagram of the bonding processing range of the sixth embodiment;

[0063] Fig.15 A schematic diagram of wire bonding classification in the seventh embodiment;

[0064] Fig.16 It is another schematic diagram of wire bonding classification in the seventh embodiment. DETAILED DESCRIPTION

[0065] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described in detail by means of implementation methods with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of the present application.

[0066] Combination Figure 1-Figure 3 As shown, the wire bonding device of the first embodiment of the present application includes:

[0067] XY stage unit 1;

[0068] A first bonding unit 2, mounted on the XY platform 1, comprises a first UVZ driving component 21 and a first bonding mechanism 22 connected to the first UVZ driving component 21;

[0069] The second bonding unit 3 is mounted on the XY platform 1 and is arranged in a mirror image with the first bonding unit 2 , and includes a second UVZ driving component 31 and a second bonding mechanism 32 connected to the second UVZ driving component 31 .

[0070] Among them, the XY platform is the main structure that provides XY direction movement, and is also the installation basis of the first bonding unit 2 and the second bonding unit 3. The XY platform drives the first bonding unit 2 and the second bonding unit 3 to move in the X-axis direction and / or the Y-axis direction at the same time, and moves the first bonding unit 2 and the second bonding unit 3 to the bonding processing area. Then, the first UVZ driving component 21 of the first bonding unit 2 drives the first bonding mechanism 22 to move in the UVZ space rectangular coordinate system to complete the bonding process; and / or the second UVZ driving component 31 of the second bonding unit 3 drives the second bonding mechanism 32 to move in the UVZ space rectangular coordinate system to complete the bonding process.

[0071] The XY platform 1 comprises:

[0072] The platform base 11 includes an X-axis drive assembly mounting position and a Y-axis drive assembly mounting position; the platform base 11 is a structural foundation for mounting the overall wire bonding device on the equipment, and is in a stable fixed state during operation.

[0073] An X-axis drive assembly 12 is installed on the X-axis drive assembly installation position;

[0074] A Y-axis driving assembly 13 is installed on the Y-axis driving assembly installation position;

[0075] The bonding unit mounting base 14 is connected to the X-axis driving assembly 12 and the Y-axis assembly 13, and carries the first bonding unit 2 and the second bonding unit 3 to move in the X-axis and / or Y-axis directions.

[0076] In this embodiment, since the first bonding unit 2 and the second bonding unit 3 need to be installed on the XY platform 1, two parallel mounting planes are provided on the bonding unit mounting seat 14. The first bonding unit 2 and the second bonding unit 3 are mounted on the mounting planes of the bonding unit mounting seat 14 in parallel and relative to each other, forming a mirror image positional relationship.

[0077] The X-axis driving assembly 12 in this embodiment is driven by an X-axis linear motor, which includes an X-axis stator 121 and an X-axis mover 122. The X-axis stator 121 is fixed on the platform base 11, and the X-axis mover 122 is connected to and drives the X-axis body 123 to move horizontally in the X-axis direction. The X-axis body 123 is movably mounted on the platform base 11 through a cross guide rail 124 extending along the X-axis direction. The cross guide rail 124 is used to guide the X-axis mover to move in the X-axis direction and control the height level of the X-axis body 123.

[0078] The Y-axis driving assembly 13 in this embodiment is driven by a Y-axis linear motor, which includes a Y-axis stator 131 and a Y-axis mover 132. The Y-axis stator 131 is fixed on the platform base 11, and the Y-axis mover 132 is connected to and drives the Y-axis body 133 to move horizontally in the Y-axis direction. The Y-axis body 133 is connected to the bonding unit mounting seat 14 through a guide rail assembly 134. The guide rail and guide groove of the guide rail assembly 134 have an inner buckle structure, so that the guide rail and the guide groove can move relative to each other in the X-axis direction and cannot be separated in the Y-axis direction. The bonding unit mounting seat 14 and the X-axis body 123 can move synchronously in the X-axis direction and can move relative to each other in the Y-axis direction.

[0079] By driving the X-axis driving component 12 and the Y-axis driving component 13 in the X-axis direction and the Y-axis direction respectively or simultaneously, the first bonding unit 2 and the second bonding unit 3 on the bonding unit mounting seat 14 can be driven to run in the X-axis direction and the Y-axis direction simultaneously, so that the wire bonding device in this embodiment forms a platform XY motion coordinate system on the overall motion coordinate system, and two bonding unit UVZ motion coordinate systems are superimposed on the platform XY motion coordinate system. First, the first bonding unit 2 and the second bonding unit 3 are only responsible for the movement during the bonding process within a small range, and the large-range movement is carried out through the XY platform. The three-dimensional motion inertia of the first bonding unit 2 and the second bonding unit 3 is greatly reduced. A single bonding unit UVZ motion coordinate system can achieve three-dimensional movement with an acceleration of more than 300G, and the acceleration is increased by more than 10 times, which increases the wire bonding efficiency by more than 2.5 times compared with the traditional method. In addition, the setting method of the double bonding units in this embodiment can double the wire bonding efficiency when working simultaneously. Secondly, during operation, the two bonding units can be controlled separately, and can either follow the same motion trajectory synchronously or follow different motion trajectories separately to adapt to various packaging plans and requirements. In addition, since each bonding unit is an independent UVZ mobile platform, it can achieve three-way movement within the travel range. With the travel of the large XY platform of the unit base, this technical solution can achieve bonding in a larger area while ensuring bonding accuracy.

[0080] What is shown above is an example of the structure of an XY platform. In actual application, a gantry-type or other form of platform structure may also be used so as to be able to carry the first bonding unit 2 and the second bonding unit 3 and move in the XY direction.

[0081] In order to achieve high-speed movement in all directions in the above structural layout, based on the structural layout of the above-mentioned first embodiment, a specific structure of a UVZ drive component of the first bonding unit 2 and the second bonding unit 3 is further proposed through the second embodiment. Since the structures of the first bonding unit 2 and the second bonding unit 3 are in a mirror relationship, the first UVZ drive component is taken as an example for detailed description in the second embodiment.

[0082] like Figure 4-Figure 5 As shown, in the second embodiment, the first UVZ driving component 21 includes:

[0083] The unit base 4 is mounted on the XY platform.

[0084] The U-axis driving assembly 5 includes a U-axis voice coil motor 51 and a U-axis main body 52. ​​The U-axis voice coil motor 51 includes a U-axis stator 511 and a U-axis mover 512. The U-axis stator 511 is arranged on the unit base 4, and the U-axis mover 512 is connected to the U-axis main body 52. ​​When installed, the U-axis stator 511 is horizontally installed in the hollow space of the unit base 4, and the U-axis mover 512 is located in the U-axis stator 511 in a horizontal device. U-axis travel space is reserved on both sides of the U-axis stator 511 for the U-axis mover 512 to perform horizontal movement. The U-axis mover 512 performs U-axis horizontal movement in the U-axis travel space.

[0085] The V-axis driving assembly 6 includes a V-axis voice coil motor 61 and a V-axis main body 62. The V-axis voice coil motor 61 includes a V-axis stator 611 and a V-axis mover 612. The V-axis stator 611 is arranged on the unit base 4, and the V-axis mover 612 is connected to the V-axis main body 62. When installed, the V-axis stator 611 is vertically installed on the unit base 4, and the V-axis mover 612 is located in the V-axis stator 611 in a vertical state. V-axis travel space is reserved on both sides of the V-axis stator 611 for the V-axis mover 612 to perform horizontal movement. The V-axis mover 612 performs V-axis horizontal movement in the V-axis travel space.

[0086] The Z-axis driving assembly 7 includes a Z-axis voice coil motor 71 and a Z-axis body 72 . The Z-axis voice coil motor 71 includes a Z-axis stator 711 and a Z-axis mover 712 . The Z-axis stator 711 is disposed on the unit base 4 , and the Z-axis mover 712 is connected to the Z-axis body 72 .

[0087] In the present embodiment, the first UVZ drive component 21 uses the U-axis voice coil motor 51, the V-axis voice coil motor 61 and the Z-axis voice coil motor 71 as the corresponding drive devices of the U-axis drive component 5, the V-axis drive component 6 and the Z-axis drive component 7. The non-contact operation between the stator and the mover of the voice coil motor can greatly reduce the friction and resistance in the power transmission process of the drive component itself, thereby further improving the drive efficiency and drive speed.

[0088] The first UVZ drive component 2 and the second drive component 3 of the second embodiment are driven by the U-axis voice coil motor 51, the V-axis voice coil motor 61 and the Z-axis voice coil motor 71 respectively, and the movement of the bonding mechanism is controlled by the coordinated movement of the U-axis body 52, the V-axis body 62 and the Z-axis body 72, and the bonding process of the semiconductor chip is realized by a small range of three-axis movement, which effectively improves the efficiency of the bonding process. When the voice coil motor is moving axially, the stator and the mover are non-contact structures, and the mover is connected to the driven end. The spatial position relationship between the mover and the stator is easily affected by other axial movements, resulting in slight changes in the relative position between the mover and the stator, which in turn causes changes in the electromagnetic force, affecting the driving accuracy. Taking the structure of the voice coil motor as an example, Figure 7 As shown, the common voice coil motor 100 includes a stator 110 and a mover 120, wherein the stator 110 includes a stator magnet 111, and the mover 120 includes a mover coil 121. When working, the stator 110 is fixed, and the mover 120 is connected to the driven end. After the mover coil is energized, an electromagnetic field is generated to interact with the stator magnet 111, so that the mover 120 moves along the driving direction D1, and high-frequency linear reciprocating motion can be achieved. However, in a multi-axis motion unit, the driven end must have a certain free stroke in multiple directions to ensure that each axis can be driven individually or multiple axes can be driven in conjunction. At this time, the driving force in other directions can easily cause the voice coil motor to move in the direction of D2. When the mover is subjected to the winding force in the direction of D2, it will move in the direction of D2, and the number and direction of the mover coil 121 covered by the stator magnet 111 will change, so that the driving force in the normal working direction of the voice coil motor 100 changes, generating fluctuations, and affecting the changes in the speed, stroke and other parameters of the drive in this direction.

[0089] Based on the structural relationship in this embodiment, the U-axis voice coil motor 51 and the Z-axis voice coil motor 71 in this embodiment are provided with an electromagnetic decoupling stroke to eliminate the V-axis voice coil motor 61 when driving in the V-axis direction, so that when the movers of the U-axis voice coil motor 51 and the Z-axis voice coil motor 71 move in the V-axis direction, the electromagnetic force between the movers and the stators remains unchanged, thereby maintaining the driving force of the U-axis voice coil motor 51 and the Z-axis voice coil motor 71 in their own driving directions. This method of eliminating the influence of the movement of other axes on their own axial driving force is called decoupling in this embodiment, and the decoupling method by keeping the electromagnetic force unchanged is called electromagnetic decoupling in this embodiment. The specific structure is reflected as follows:

[0090] Combination Figure 5 and Figure 6As shown, the U-axis mover 512 of the U-axis voice coil motor 51 includes a U-axis mover coil 5121, and the U-axis mover coil 5121 has a first straight line segment 5122 extending in the V direction, and the length of the first straight line segment 5122 is greater than the covering length of the U-axis stator 511, and the length of the first straight line segment 5122 that is longer than the U-axis stator 511 is the electromagnetic decoupling distance, and the electromagnetic decoupling distance is set according to the direction and stroke of the V-axis voice coil motor on the V-axis, so that when the V-axis voice coil motor is running, when the U-axis mover 512 moves in the V-axis direction, the length and direction of the U-axis mover coil covered by the U-axis stator 511 do not change, so that the U-axis voice coil motor can stably perform U-axis motion control.

[0091] Similarly, the Z-axis mover 712 of the Z-axis voice coil motor 71 includes a Z-axis mover coil 7121, and the Z-axis mover coil 7121 has a second straight line segment 7122 extending in the V direction, and the length of the second straight line segment 7122 is greater than the covering length of the Z-axis stator 711, and the length of the second straight line segment 7122 that is longer than the Z-axis stator 711 is the electromagnetic decoupling distance, and the electromagnetic structure distance is set according to the direction and stroke of the V-axis voice coil motor on the V-axis, so that when the V-axis voice coil motor is running, when the Z-axis mover 712 moves in the V-axis direction, the length and direction of the Z-axis mover coil covered by the Z-axis stator 7111 do not change, so that the Z-axis voice coil motor can stably perform Z-axis motion control.

[0092] The electromagnetic decoupling of the U-axis voice coil motor 51 and the Z-axis voice coil motor 71 can solve the disturbance problem of the U-axis voice coil motor and the Z-axis voice coil motor when the V-axis voice coil motor is working. In actual operation, the disturbance problem between the U-axis and the Z-axis needs to be considered to achieve the decoupling of the motion in the three directions of the U-axis, the V-axis and the Z-axis, that is, to solve the problem of mutual non-disturbance. In this embodiment, the slide rails and the slide grooves that can slide against each other are used to assist in solving the problem.

[0093] like Figure 8 and Fig. 9 As shown, in this embodiment, the Z-axis body 72 is provided with a first guide rail 811 extending along the U-axis direction, and the Z-axis mover 712 of the Z-axis voice coil motor is provided with a first guide rail groove 812 extending along the U-axis direction. The first guide rail 811 and the first guide rail groove 812 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the Z-axis mover 712 performs vertical up and down Z-axis movement, the Z-axis body 72 is driven to move in the Z-axis direction through the first guide rail 811 and the first guide rail groove 812.

[0094] A horizontal mounting plate 9 is provided above the Z-axis mover, and the horizontal mounting plate 10 is fixed on the unit base. A second guide rail 821 extending along the V-axis is provided on the lower surface of the horizontal mounting plate 10. The second guide rail 821 is connected with a second guide rail groove 822 extending along the V-axis direction. The second guide rail 821 and the second guide rail groove 822 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the Z-axis mover is subjected to a driving force in the V-axis direction, the Z-axis mover 712 can move accordingly along the second guide rail 821 when subjected to a driving force in the V-axis direction, and the driving stroke in the V-axis direction will not be blocked.

[0095] An adapter block 10 is fixed on the second guide rail groove 822, and the Z-axis mover is provided with a third guide rail 831 extending along the Z-axis direction, and the adapter block 10 is provided with a third guide rail groove 832 extending along the Z-axis direction. The third guide rail 831 and the third guide rail groove are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface, so that the Z-axis mover 712 can move along the direction of the third guide rail 831 and the third guide rail groove 832 along the Z-axis direction relative to the Z-axis stator, thereby driving the Z-axis direction.

[0096] Since the bonding assembly in this embodiment is installed on the Z-axis body 72, the movements of the U-axis body 52 and the V-axis body 62 can be executed on the Z-axis body 72, so that the Z-axis body 72 finally drives the bonding assembly to move in three-dimensional space to realize bonding processing. In order to guide the movement of the U-axis body 52 and the V-axis body 62 and maintain the stability of the linear motion of each axis, a fourth guide rail 841 extending along the Z-axis direction is provided on the side of the U-axis body in this embodiment, and a fourth guide rail groove 842 extending along the Z-axis direction is provided on the Z-axis body 72. The fourth guide rail 841 and the fourth guide rail groove 842 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the Z-axis mover 712 drives the Z-axis body 72 to move vertically in the Z-axis direction, the fourth guide rail 841 and the fourth guide rail groove 842 guide the movement in the Z-axis direction, thereby maintaining the stability of the Z-axis linear motion.

[0097] The U-axis body is also provided with a fifth guide rail 851 extending along the U-axis direction, and the V-axis body 62 is provided with a fifth guide rail groove 852 extending along the U-axis direction. The fifth guide rail 851 and the fifth guide rail groove 852 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the U-axis mover 512 drives the U-axis body 52 to move horizontally in the U-axis direction, the fifth guide rail 851 moves horizontally in the U-axis direction with the U-axis body 52. ​​The fifth guide rail and the fifth guide rail groove 852 guide the movement in the U-axis direction, thereby maintaining the stability of the U-axis linear motion.

[0098] The V-axis body 62 is further provided with a sixth guide rail groove 862 extending along the V-axis direction, and the unit base is provided with a sixth guide rail 861 extending along the V-axis direction. The sixth guide rail 861 and the sixth guide rail groove 862 are slidably connected as a whole and are inseparable in a direction perpendicular to the sliding surface. When the V-axis mover 612 drives the V-axis body 62 to move horizontally in the V-axis direction, the sixth guide rail groove 862 follows the V-axis body 62 to move horizontally in the V-axis direction, and the sixth guide rail 861 guides the horizontal movement of the V-axis mover 612 in the V-axis direction and maintains the height of the V-axis mover 612.

[0099] In the embodiment of the present invention, cross guide rails are installed between the fourth guide rail 841 and the fourth guide rail groove 842, between the fifth guide rail 851 and the fifth guide rail groove 852, and between the sixth guide rail 861 and the sixth guide rail groove 862. According to the working principle of the cross guide rail and in combination with what is shown in the figure, the outer rail of the cross guide rail moves with the corresponding guide groove, and the inner rail of the cross guide rail moves as a whole with the corresponding main body.

[0100] Through the above-mentioned electromagnetic decoupling, combined with the mechanical decoupling achieved by the cooperation between the first guide rail 811 and the first guide rail groove 812 and the sixth guide rail 861 and the sixth guide rail groove 862, it can be achieved that when the U-axis, V-axis and Z-axis three directions are moved individually or in parallel, the driving force of each axis in its own axial direction will not cause disturbances to the driving forces of other axes, thereby achieving precise control of the movement.

[0101] It should be noted that the decoupling guide rails of each axis shown in the figure are simplified representations of the guide rails. In fact, during operation, the sliders and tracks of the guide rails of each axis can translate and slide relative to each other in the linear direction, but cannot be separated in the vertical direction. That is, the sliders and tracks of the guide rails of each axis can be matched by V-shaped sliders or tracks, or by setting balls or slide grooves to cooperate to achieve a structure that can translate but does not separate. Only when the sliders and tracks of the guide rails in each direction do not separate from each other during operation can the structural stability of the overall wire bonding device be achieved.

[0102] In this embodiment, based on the overall structural characteristics, the first guide rail 811 and the first guide rail groove 812, the second guide rail 821 and the second guide rail groove 822, the third guide rail 831 and the third guide rail groove 832 form a linear guide rail structure, and the fourth guide rail 841, the fifth guide rail 851 and the sixth guide rail 861 are cross guide rails. In actual applications, a suitable form of guide rail structure can be selected according to the structure of the installation location.

[0103] It should be understood that, based on the matching structure of the guide rail, the setting directions of the guide rail and the guide rail groove in this embodiment can be interchanged without affecting the guidance of the guide rail and the decoupling of movements in different directions.

[0104] The third embodiment of the present application provides a novel wire bonding device based on the first embodiment.

[0105] like Fig.10 As shown, the third embodiment of the present application also provides a new type of wire bonding equipment, including at least two wire bonding devices described in the first embodiment. In this embodiment, two wire bonding devices a with XY platforms having double bonding units are arranged on a wire bonding device. The two wire bonding devices a can respectively realize the packaging tasks on their respective workstations. The left wire bonding device performs bonding on the left workstation, and the material is transported from the material box of the left loading and unloading platform to the left workbench. After the bonding is completed, it returns to the material box of the left loading and unloading platform for unloading, and then the upper layer of material is continued to be transported to the left workbench for bonding, and the reciprocating cycle continues until all materials are bonded. In the same principle, the right wire bonding device performs the material bonding work in the material box of the right loading and unloading platform. In this way, the overall packaging efficiency can be doubled again. Compared with the traditional method, the ideal situation can achieve an increase of more than 10 times.

[0106] The fourth embodiment of the present application also provides a novel wire bonding method. The wire bonding method of this embodiment is implemented based on the bonding device and apparatus including two bonding units in the first and third embodiments, so as to achieve the purpose of reasonably allocating and fully mobilizing the two bonding units to work together. Fig.11 As shown, the wire bonding method of this embodiment includes the steps of:

[0107] S1. Obtain the X-axis range of the bonding processing area;

[0108] S2. Divide the bonding processing area into zones according to the comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and control the first bonding unit and / or the second bonding unit to perform bonding processing in the bonding processing zone.

[0109] Among them, the X-axis direction range of the bonding processing area in step S1 refers to the range that the XY platform and the bonding unit of the bonding device need to move during the wire bonding process. The working mode and working order of the first bonding unit and the second bonding unit can be selected by dividing the bonding processing partitions in step S2, so as to achieve the purpose of improving the bonding processing efficiency. Among them, controlling the first bonding unit and / or the second bonding unit to perform bonding processing in the bonding processing partition means that one of the first bonding unit and the second bonding unit can be selected to operate alone, or the first bonding unit and the second bonding unit can be controlled to operate synchronously or alternately to perform bonding processing.

[0110] The following further describes in detail the ranges of three common bonding processing areas in three embodiments, wherein the maximum U-axis stroke of the first bonding unit and the second bonding unit in the following embodiments is 11.5 mm.

[0111] like Fig.12 As shown, in the fourth embodiment, the bonding processing partitions are divided according to the comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and the first bonding unit and / or the second bonding unit are controlled to perform bonding processing in the bonding processing partitions further include:

[0112] When the X-axis range of the bonding processing area is less than or equal to twice the U-axis travel, the bonding processing area is equally divided along the U-axis direction into at least two areas less than or equal to the U-axis travel;

[0113] The first bonding unit or the second bonding unit is controlled to perform bonding processing independently.

[0114] That is, when the X-direction range of the bonding area is ≤23mm, that is, less than or equal to twice the U-axis travel of the bonding unit, control either the first bonding unit or the second bonding unit to run while the other is stationary for bonding. At this time, the 23mm area can be equally divided into two 11.5mm areas. The XY platform only needs to move once in the X direction, and then the UV direction movement on the bonding unit is used to cover the entire area. The above division is designed with the minimum number of XY platform movements. Of course, it can also be divided into multiple smaller areas for bonding.

[0115] like Fig.13 As shown, in the fifth embodiment, the bonding processing partition is divided according to the comparison result of the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and the first bonding unit or the second bonding unit is controlled to perform bonding processing in the bonding processing partition further includes:

[0116] When the bonding processing area in the X-axis direction is greater than 2 times the U-axis stroke and less than or equal to 4 times the U-axis stroke, the bonding processing area is equally divided into at least two adjacent bonding processing partitions less than or equal to the U-axis stroke according to a preset length along the U-axis direction;

[0117] If there is a remaining area after the bonding processing area is divided into bonding processing partitions according to a preset length, the remaining area is set on one side of the bonding processing area as the remaining bonding processing partition;

[0118] Controlling the first bonding unit or the second bonding unit to perform bonding processing in the remaining bonding processing partitions;

[0119] The second bonding unit or the first bonding unit is controlled to perform bonding processing in the bonding processing zone.

[0120] That is, when the X-direction range of the bonding area is between 23 and 46 mm, the bonding area can be divided into two parts of 23 mm width (area 1 and area 2) + remaining width (area 3), and the two parts are respectively allocated to two bonding units for bonding processing. The bonding unit responsible for area 3 will complete the bonding task before the bonding unit responsible for area 1 and area 2, stop running in advance, and dock at a safe position. The control scheme of the bonding unit responsible for area 1 and area 2 is the same as that of the fourth embodiment above. For the bonding work in this range, the XY platform moves at least once in the X direction, and then the UV axis on the bonding unit is used to cover the entire area.

[0121] like Fig.14 As shown, in the sixth embodiment, the bonding processing partitions are divided according to the comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and the first bonding unit or the second bonding unit is controlled to perform bonding processing in the bonding processing partitions further includes:

[0122] When the X-axis direction of the bonding processing area is greater than 4 times the U-axis travel; divide the bonding processing area into two bonding processing partitions along the center line;

[0123] The two bonding processing partitions are further equally divided into a plurality of adjacent bonding processing sub-partitions divided equally according to a preset length into at least two adjacent bonding processing sub-partitions less than or equal to the U-axis stroke;

[0124] If there is a remaining area after dividing the bonding processing sub-area, the remaining area is set on one side of the bonding processing area as the remaining processing area;

[0125] The first bonding unit or the second bonding unit is controlled to perform bonding processing on the bonding processing sub-partition and the remaining processing partitions in sequence in one bonding processing partition respectively.

[0126] That is, when the X-direction range of the bonding area is 46 to 69 mm or larger, the bonding area can be equally divided into two parts (area 1-3 and area 1'-3'). In the figure, 46~ means more than 46 mm. The two parts are respectively assigned to two bonding units for bonding. The areas of the two parts can be further divided at intervals of 11.5 mm. After every 11.5 mm range is bonded, the large XY of the unit base needs to be moved once, so that the bonding unit can bond the next 11.5 mm range until all ranges are bonded. In this case, the large XY platform needs to be moved twice in the X direction, and more times when the evenly divided range is smaller. The two bonding units move synchronously and work and stop at the same time.

[0127] The fourth to sixth embodiments are control modes corresponding to different bonding area sizes. In actual production and processing, when there are many material bonding arcs or there are obvious classifications, the bonding tasks of different arcs can be assigned to two bonding units for bonding. Fig.15 and Fig.16 As shown, the seventh embodiment can divide the wires to be bonded into two groups according to two methods:

[0128] The first method can be classified according to the direction of the leads: the three lines diagonally pointing to the upper left are line group 1; the three lines diagonally pointing to the upper right are line group 2;

[0129] The second classification method can be classified according to the bonding position: the four wires that bond the chip to the bracket are wire group 1; the two wires that bond the chip to the ground end are wire group 2.

[0130] At this time, the two groups of classified wires can be independently assigned to two bonding units for bonding work, so that the control logic and program of each bonding unit can be simplified, thereby improving efficiency and reducing control risks.

[0131] In some SiP (System In a Package) packaging fields, there is a need to bond two different types of wires in one lead frame. The materials or wire diameters of the wires may be different. For example, gold wire and copper wire need to be bonded on a device at the same time. For some important connections, gold wire bonding is used to ensure the bonding quality; for some unimportant pins, copper wire bonding is used to optimize costs. The traditional solution can only be divided into two wire bonding devices for separate bonding. This requirement can be directly achieved through the wire bonding devices, equipment and methods in the above embodiments, and the bonding work of gold wire and copper wire can be assigned to two bonding units respectively.

[0132] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wire bonding device, characterized in that: include: XY stage unit; a first bonding unit, mounted on the XY platform, comprising a first UVZ driving assembly and a first bonding mechanism connected to the first UVZ driving assembly; a second bonding unit, mounted on the XY platform, mirror-imaged with the first bonding unit, comprising a second UVZ driving assembly and a second bonding mechanism connected to the second UVZ driving assembly; The XY platform drives the first bonding unit and the second bonding unit to move in the X-axis direction and / or the Y-axis direction at the same time, moves the first bonding unit and the second bonding unit to the bonding processing area, and then the first UVZ driving component of the first bonding unit drives the first bonding mechanism to move in the UVZ space rectangular coordinate system to complete the bonding processing; and / or the second UVZ driving component of the second bonding unit drives the second bonding mechanism to move in the UVZ space rectangular coordinate system to complete the bonding processing; The first UVZ drive assembly and the second UVZ drive assembly respectively include: The unit base is mounted on the XY platform. A U-axis driving assembly, comprising a U-axis voice coil motor and a U-axis body, wherein the U-axis voice coil motor comprises a U-axis stator and a U-axis mover, wherein the U-axis stator is arranged on the unit base, and the U-axis mover is connected to the U-axis body; A V-axis driving assembly, the V-axis driving assembly comprising a V-axis voice coil motor and a V-axis body, the V-axis voice coil motor comprising a V-axis stator and a V-axis mover, the V-axis stator being arranged on the unit base, and the V-axis mover being connected to the V-axis body; A Z-axis driving assembly, comprising a Z-axis voice coil motor and a Z-axis body, wherein the Z-axis voice coil motor comprises a Z-axis stator and a Z-axis mover, wherein the Z-axis stator is arranged on the unit base, and the Z-axis mover is connected to the Z-axis body; The U-axis stator includes a U-axis stator magnet, the U-axis mover includes a U-axis mover coil, the U-axis mover coil has a first straight line segment extending in the V direction, and the length of the first straight line segment is greater than the V-direction coverage length of the U-axis stator magnet; The Z-axis stator includes a Z-axis stator magnet, the Z-axis mover includes a Z-axis mover coil, the Z-axis mover coil has a second straight line segment extending in the V direction, and the length of the second straight line segment is greater than the V-direction coverage length of the Z-axis stator magnet.

2. The wire bonding device according to claim 1, wherein: The Z-axis body is provided with a first guide rail extending along the U-axis direction, the Z-axis mover of the Z-axis voice coil motor is provided with a first guide rail groove extending along the U-axis direction, and the first guide rail and the first guide rail groove are slidably connected as one body; A horizontal mounting plate is provided above the Z-axis mover, the horizontal mounting plate is fixed on the unit base, a second guide rail extending along the V-axis is provided on the lower surface of the horizontal mounting plate, a second guide rail groove extending along the V-axis direction is connected to the second guide rail, and the second guide rail groove is slidably connected to form a whole; A transfer block is fixed on the second guide rail groove, the Z-axis mover is provided with a third guide rail extending along the Z-axis direction, the transfer block is provided with a third guide rail groove extending along the Z-axis direction, and the third guide rail and the third guide rail groove are slidably connected as a whole.

3. The wire bonding device according to claim 1, wherein: A fourth guide rail extending along the Z-axis direction is provided on the side of the U-axis body, and a fourth guide rail groove extending along the Z-axis direction is provided on the Z-axis body, and the fourth guide rail and the fourth guide rail groove are slidably connected as a whole; The U-axis body is also provided with a fifth guide rail extending along the U-axis direction, and the V-axis body is provided with a fifth guide rail groove extending along the U-axis direction, and the fifth guide rail and the fifth guide rail groove are slidably connected as one body; The V-axis body is further provided with a sixth guide rail groove extending along the V-axis direction, and the unit base is provided with a sixth guide rail extending along the V-axis direction. The sixth guide rail and the sixth guide rail groove are slidably connected as a whole.

4. The wire bonding device according to claim 1, wherein: The XY platform unit includes: The platform base includes an X-axis drive assembly mounting position and a Y-axis drive assembly mounting position; An X-axis drive assembly is installed on the X-axis drive assembly installation position; A Y-axis drive assembly is installed on the Y-axis drive assembly installation position; The bonding unit mounting seat is connected to the X-axis driving assembly and the Y-axis driving assembly, and carries the first bonding unit and the second bonding unit to move in the X-axis and / or Y-axis directions.

5. The wire bonding device according to claim 4, characterized in that: The X-axis driving assembly includes an X-axis linear motor and an X-axis body, the X-axis linear motor includes an X-axis stator and an X-axis mover, the X-axis stator is fixed on the platform base, the X-axis mover is connected to and drives the X-axis body to move horizontally in the X-axis direction, and the X-axis body is movably mounted on the platform base through a cross guide rail extending along the X-axis direction; The Y-axis driving assembly includes a Y-axis linear motor and a Y-axis body, the Y-axis linear motor includes a Y-axis stator and a Y-axis mover, the Y-axis stator is fixed on the platform base, the Y-axis mover is connected to and drives the Y-axis body to move horizontally in the Y-axis direction, the Y-axis body is connected to the bonding unit mounting seat through a guide rail assembly, and an inner buckle structure is provided between the guide rail and the guide groove of the guide rail assembly, so that the guide rail and the guide groove can move relative to each other in the X-axis direction and cannot be separated in the Y-axis direction.

6. A wire bonding device, characterized in that The method comprises at least two wire bonding devices according to any one of claims 1 to 5.

7. A wire bonding method based on the wire bonding device according to any one of claims 1 to 5, characterized in that: Includes steps: Get the X-axis range of the bonding processing area; The bonding processing zones are divided according to the comparison result of the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and the first bonding unit and / or the second bonding unit are controlled to perform bonding processing in the bonding processing zones.

8. The wire bonding method according to claim 7, wherein: The step of dividing the bonding processing zone according to the comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and controlling the first bonding unit and / or the second bonding unit to perform bonding processing in the bonding processing zone further comprises: When the X-axis range of the bonding processing area is less than or equal to twice the U-axis travel, the bonding processing area is equally divided along the U-axis direction into at least two areas less than or equal to the U-axis travel; The first bonding unit or the second bonding unit is controlled to perform bonding processing independently.

9. The wire bonding method according to claim 7, wherein: The step of dividing the bonding processing zone according to the comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and controlling the first bonding unit or the second bonding unit to perform bonding processing in the bonding processing zone further comprises: When the bonding processing area in the X-axis direction is greater than 2 times the U-axis stroke and less than or equal to 4 times the U-axis stroke, the bonding processing area is equally divided into at least two adjacent bonding processing partitions less than or equal to the U-axis stroke according to a preset length along the U-axis direction; If there is a remaining area after the bonding processing area is divided into bonding processing partitions according to a preset length, the remaining area is set on one side of the bonding processing area as the remaining bonding processing partition; Controlling the first bonding unit or the second bonding unit to perform bonding processing in the remaining bonding processing partitions; The second bonding unit or the first bonding unit is controlled to perform bonding processing in the bonding processing zone.

10. The wire bonding method according to claim 7, wherein: The step of dividing the bonding processing zone according to the comparison result between the X-axis direction range of the bonding processing area and the U-axis travel multiples of the first bonding unit and the second bonding unit, and controlling the first bonding unit or the second bonding unit to perform bonding processing in the bonding processing zone further comprises: When the X-axis direction of the bonding processing area is greater than 4 times the U-axis travel; divide the bonding processing area into two bonding processing partitions along the center line; The two bonding processing partitions are further equally divided into a plurality of adjacent bonding processing sub-partitions divided equally according to a preset length into at least two adjacent bonding processing sub-partitions less than or equal to the U-axis stroke; If there is a remaining area after dividing the bonding processing sub-area, the remaining area is set on one side of the bonding processing area as the remaining processing area; The first bonding unit or the second bonding unit is controlled to perform bonding processing on the bonding processing sub-partition and the remaining processing partitions in sequence in one bonding processing partition respectively.

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