Wafer combined carrier

Abstract

The invention discloses a wafer combination carrier, and relates to the technical field of semiconductor manufacturing, the wafer combination carrier comprises a carrier upper bottom plate and a carrier lower bottom plate, a sealing strip is fixedly installed on the inner wall of the carrier lower bottom plate, a plurality of magnets are fixedly embedded in the top surface of the carrier upper bottom plate, the top surface of the carrier lower bottom plate is attracted with the embedded magnets, and the sealing strip is fixedly installed on the inner wall of the carrier lower bottom plate. A flaky product is arranged in the carrier lower bottom plate, a plurality of positioning pins are fixedly mounted on the bottom surface of the carrier upper bottom plate, a plurality of insertion holes are formed in the top surface of the carrier lower bottom plate, and the positioning pins are matched with the insertion holes; according to the wafer carrier, the detection assemblies are combined with the adjusting mechanism, the automation and intelligence level of the wafer carrier is improved, the position detection precision and the adjusting accuracy are remarkably improved, and higher production efficiency and sheet product quality are brought to the wafer manufacturing industry.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer assembly carrier. Background Art

[0002] A wafer assembly carrier, also known as a semiconductor carrier, is a precision carrying device designed specifically for semiconductor wafers. It is designed to meet stringent clean room standards to ensure the physical safety and chemical purity of the wafers throughout the manufacturing process.

[0003] However, in the prior art, when the sheet product is placed inside the lower bottom plate of the carrier, it cannot be kept in the middle part of the lower bottom plate of the carrier. The sheet product cannot be kept in the center position of the carrier, which will cause positioning errors when processing equipment such as photolithography machines and etchers process it. This error will directly affect the accuracy of the processed pattern, resulting in deviations in the circuit layout on the chip, and will also cause additional physical damage or chemical contamination during the processing, thereby increasing the number of defects on the sheet product. These defects include scratches, contamination particles, short circuits or open circuits, etc., which seriously affect the yield and reliability of the chip. The sheet product is easily damaged during the carrier clamping process. In addition, In the prior art, when adjusting sheet products, it is usually done manually or by a robot. Manual adjustment often relies on the operator's experience and skills, and it is difficult to achieve high-precision requirements. In particular, in the micron-level or even nanometer-level wafer manufacturing process, a small deviation may lead to serious quality problems, and manual adjustment takes a lot of time and effort. In particular, in a large-scale production environment, manual adjustment will significantly reduce production efficiency. In addition, when facing a complex and changeable wafer manufacturing environment, the flexibility of the robot adjustment may appear insufficient. For example, in some special cases, the robot may not be able to adapt to changes in the shape, size or position of the wafer, resulting in insufficient flexibility.

[0004] Therefore, based on the above search and in combination with the prior art, a wafer assembly carrier is proposed to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a wafer assembly carrier to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A wafer assembly carrier comprises: an upper base plate and a lower base plate of the carrier, a sealing strip is fixedly installed on the inner wall of the lower base plate of the carrier, a plurality of magnets are fixedly embedded in the top surface of the upper base plate of the carrier, the top surface of the lower base plate of the carrier is adsorbed by the embedded magnets, a sheet product is arranged inside the lower base plate of the carrier, a plurality of positioning pins are fixedly installed on the bottom surface of the upper base plate of the carrier, a plurality of sockets are provided on the top surface of the lower base plate of the carrier, the positioning pins and the sockets cooperate with each other; an adsorption component, four groups of adsorption components are arranged, respectively arranged on the bottom surface of the upper base plate of the carrier; a detection component, four groups of detection components are arranged, the detection components are arranged on a circular plate, and are used to detect the position of the sheet product; an adjustment mechanism, four groups of adjustment mechanisms are arranged, the adjustment mechanism is arranged on the circular plate, and is used to adjust the position of the sheet product.

[0008] Preferably, the adsorption component comprises: a disc, the disc is fixedly mounted on the bottom surface of the bottom plate on the carrier, the bottom surface of the disc is provided with a circular groove, the inner wall of the circular groove is fixedly provided with a circular plate, the top surface of the circular plate is provided with a movable groove, the side wall of the movable groove is rotatably connected with a sphere, the bottom surface of the sphere is fixedly provided with a suction cup.

[0009] Preferably, the detection component includes: a bracket, a plurality of the brackets are provided, the brackets are fixedly mounted on the top surface of the circular plate, a fixed plate is fixedly mounted between the plurality of the brackets, a mounting groove is provided on the bottom surface of the fixed plate, a visual sensor is fixedly mounted inside the mounting groove, a storage box is provided on the top surface of the sphere, a level bubble is provided inside the storage box, and the level bubble is located directly below the visual sensor.

[0010] Preferably, the adjustment mechanism includes: two suction cups 2, the two suction cups 2 are arranged on a circular plate, the top surface of the circular plate is located on the right side of the sphere and has a vertical groove, the top surface of the circular plate is located on the rear side of the sphere and has a horizontal groove, and the adjustment mechanism also includes a moving component and a driving component.

[0011] Preferably, the moving component includes: two T-shaped blocks, the two T-shaped blocks are slidably installed in the vertical groove and the horizontal groove respectively, the bottom surfaces of the two T-shaped blocks are provided with rectangular grooves, the insides of the two rectangular grooves are fixedly installed with electric push rods, and the side walls of the two T-shaped blocks are fixedly installed with racks.

[0012] Preferably, the driving assembly includes: gear one, which is arranged on a circular plate, a guide rail is provided on the top surface of the circular plate, a moving block is slidably connected to the inner wall of the guide rail, the top surface of the moving block is rotatably connected to the bottom surface of gear one, and a placement groove is provided on the top surface of the circular plate.

[0013] Preferably, the driving assembly also includes: a motor, which is fixedly mounted inside the placement slot, the top surface of the circular plate is located on one side of the two racks and is rotatably connected to gear 2, the output shaft of the motor is connected to the side wall of one of the gears 2, the top surfaces of the two gears 2 are fixedly mounted with couplings, and a belt is arranged between the two couplings.

[0014] Preferably, the output shafts of the two electric push rods are fixedly connected to the top surfaces of the two suction cups respectively.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the present invention, by providing a detection component, the visual sensor and the level bubble cooperate with each other, thereby realizing real-time and high-precision detection of the position of the sheet product. The tilt state of the level bubble is accurately captured by the visual sensor through the transparent material on its top, and even a small position offset can be quickly identified and quantified, thereby significantly improving the position detection accuracy of the chip in the carrier, and the automated operation of the detection component reduces manual intervention and reduces the error caused by human factors. At the same time, the seamless connection between real-time data transmission and the control system makes the entire detection process more intelligent and improves the overall automation level of the production line. High-precision position detection can quickly identify and feedback the position deviation of the chip, providing an accurate basis for subsequent position adjustment, thereby shortening the adjustment time and improving the efficiency of the entire production process;

[0017] 2. In the present invention, by providing an adjustment mechanism, precise adjustment of the chip position can be achieved. No matter in the horizontal direction or the vertical direction, the adjustment mechanism can respond quickly according to the data provided by the detection component, and accurately adjust the chip to the center position of the carrier, thereby ensuring the accuracy of processing and testing. The design of the adjustment mechanism fully considers the possibility of changes in the shape, size and position of the chip. Through the combination of adjustments in the horizontal and vertical directions, it can flexibly cope with various complex production environments. This flexibility enables the chip carrier of the present invention to maintain good performance in a variety of application scenarios. The automatic adjustment mechanism avoids possible misoperation and collision during manual adjustment, thereby reducing damage to the chip during the adjustment process. At the same time, precise position adjustment ensures the accuracy of processing and testing, reduces the defect rate caused by position deviation, and improves the yield and reliability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a bottom view structural schematic diagram of the present invention;

[0020] Figure 3 It is a schematic diagram of the explosion structure of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the upper base plate of the carrier of the present invention when viewed from above;

[0022] Figure 5 This is a schematic diagram of the internal structure of the disc of the present invention;

[0023] Figure 6 It is a schematic diagram of the disassembly structure of the circular plate, the second gear and the fixed plate of the present invention;

[0024] Figure 7 This is a schematic diagram of the structure of the fixed plate of the present invention when viewed from above;

[0025] Figure 8 For the present invention Figure 4 Enlarged structural diagram at A in the middle.

[0026] In the figure: 1. upper base plate of the carrier; 2. lower base plate of the carrier; 3. sealing strip; 4. magnet; 5. sheet product; 6. positioning pin; 7. socket; 8. disc; 9. round groove; 10. round plate; 11. movable groove; 12. sphere; 13. suction cup 1; 14. storage box; 15. level bubble; 16. bracket; 17. fixed plate; 18. installation groove; 19. visual sensor; 20. vertical groove; 21. horizontal groove; 22. T-shaped block; 23. rectangular groove; 24. electric push rod; 25. suction cup 2; 26. guide rail; 27. moving block; 28. gear 1; 29. ​​rack; 30. placement groove; 31. motor; 32. gear 2; 33. coupling; 34. belt. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Embodiment 1

[0029] In a typical implementation of this application, please refer to Figures 1 to 8 As shown, a wafer assembly carrier comprises: a carrier upper bottom plate 1 and a carrier lower bottom plate 2, a sealing strip 3 is fixedly installed on the inner wall of the carrier lower bottom plate 2, a plurality of magnets 4 are fixedly embedded in the top surface of the carrier upper bottom plate 1, the top surface of the carrier lower bottom plate 2 is adsorbed by the embedded magnets 4, a sheet product 5 is arranged inside the carrier lower bottom plate 2, a plurality of positioning pins 6 are fixedly installed on the bottom surface of the carrier upper bottom plate 1, a plurality of insertion holes 7 are opened on the top surface of the carrier lower bottom plate 2, and the positioning pins 6 and the insertion holes 7 cooperate with each other;

[0030] Through the above features, the upper carrier plate 1 and the lower carrier plate 2 can be used to fix the sheet product 5 inside the upper carrier plate 1 and the lower carrier plate 2 respectively through the magnet 4 .

[0031] Embodiment 2

[0032] In a typical implementation of this application, please refer to Figures 4 to 8 As shown, the adsorption components are provided in four groups, which are respectively arranged on the bottom surface of the bottom plate 1 of the carrier, and the adsorption components include:

[0033] A disc 8 is fixedly mounted on the bottom surface of the carrier upper bottom plate 1. A circular groove 9 is provided on the bottom surface of the disc 8. A circular plate 10 is fixedly mounted on the inner wall of the circular groove 9. A movable groove 11 is provided on the top surface of the circular plate 10. A sphere 12 is rotatably connected to the side wall of the movable groove 11. A suction cup 13 is fixedly mounted on the bottom surface of the sphere 12.

[0034] In the clean room, the sheet product 5 is carefully loaded into the wafer carrier, usually manually or by a robot arm, to ensure that the sheet product 5 will not be contaminated or damaged during transportation. A special transport device such as a robot arm, a conveyor belt, etc. is then used to transport the carrier containing the sheet product 5 from one place to another, such as from a storage area to a processing device on a production line. After the sheet product 5 undergoes a series of processing steps such as photolithography, etching, ion implantation, etc. on the production line, it needs to be tested to verify its performance and quality. During the test, the wafer carrier needs to maintain a stable and precise position to ensure the accuracy of the test results. After processing and testing are completed, the wafer carrier needs to be sent back to the storage area for storage or recycling. During the storage process, the cleanliness and integrity of the carrier need to be maintained for next use;

[0035] The above process is the basic process of the current wafer carrier operation.

[0036] However, in the prior art, when the sheet product 5 is placed inside the lower bottom plate 2 of the carrier, it cannot be kept in the middle part of the lower bottom plate 2 of the carrier, and the sheet product 5 cannot be kept in the center position of the carrier, which will cause positioning errors when processing equipment such as photolithography machines and etching machines. Such errors will directly affect the accuracy of the processed pattern, causing deviations in the circuit layout on the wafer, and will also cause additional physical damage or chemical contamination during the processing, thereby increasing the number of defects on the sheet product 5. These defects include scratches, contamination particles, short circuits or open circuits, etc., which seriously affect the yield and reliability of the wafer, and the sheet product 5 is easily damaged during the carrier clamping process;

[0037] In addition, in the prior art, when adjusting the sheet product 5, it is usually done manually or by a robotic arm. Manual adjustment often relies on the operator's experience and skills, and it is difficult to meet high-precision requirements, especially in the micron or even nanometer chip manufacturing process. Slight deviations may lead to serious quality problems, and manual adjustment requires more time and effort. Especially in a large-scale production environment, manual adjustment will significantly reduce production efficiency, and the flexibility of robotic arm adjustment may appear insufficient when facing a complex and changeable chip manufacturing environment. For example, in some special cases, the robotic arm may not be able to adapt to changes in the shape, size or position of the chip, resulting in insufficient flexibility.

[0038] Therefore, based on the above problems, we first design a detection component. The detection component is provided with four groups. The detection component is provided on the circular plate 10 and is used to detect the position of the sheet product 5. The detection component includes:

[0039] A bracket 16, wherein a plurality of brackets 16 are provided, and the brackets 16 are fixedly mounted on the top surface of the circular plate 10, a fixed plate 17 is fixedly mounted between the plurality of brackets 16, a mounting groove 18 is provided on the bottom surface of the fixed plate 17, a visual sensor 19 is fixedly mounted inside the mounting groove 18, a storage box 14 is provided on the top surface of the sphere 12, a level bubble 15 is provided inside the storage box 14, the top surface of the level bubble 15 is made of a transparent material, and the level bubble 15 is located directly below the visual sensor 19;

[0040] Through the above characteristics, when the sheet product 5 is placed inside the lower bottom plate 2 of the carrier, the upper bottom plate 1 of the carrier first descends, so that the suction cup 13 contacts the top surface of the sheet product 5 and adsorbs the sheet product 5. After the sheet product 5 is adsorbed, the upper bottom plate 1 of the carrier will drive the sheet product 5 to move up a distance. At this time, if the sheet product 5 is not in the center, the sheet product 5 will tilt, and the suction cup 13 connected to the sheet product 5 will also tilt synchronously. When the suction cup 13 tilts, the level bubble 15 located in the storage box 14 will also tilt synchronously. At this time, the visual sensor 19 detects the offset distance of the level bubble 15, and transmits the data to the adjustment mechanism, so that it adjusts the position of the sheet product 5. If the sheet product 5 is in the center, the sheet product 5 will not tilt, and the level bubble 15 will not deviate, and the visual sensor 19 will not transmit the data to the adjustment mechanism.

[0041] It is worth mentioning that the initial position of the suction cup 13 is located above the center of the sheet product 5.

[0042] At the same time, based on the above problems, we also designed an adjustment mechanism, which has four groups. The adjustment mechanism is arranged on the circular plate 10 and is used to adjust the position of the sheet product 5. The adjustment mechanism includes: two suction cups 25, which are arranged on the circular plate 10. The top surface of the circular plate 10 is located on the right side of the sphere 12 and has a vertical groove 20. The top surface of the circular plate 10 is located on the rear side of the sphere 12 and has a horizontal groove 21. The adjustment mechanism also includes a moving component and a driving component.

[0043] As a preferred implementation in this embodiment, please refer to Figure 5 , Figure 6 and Figure 8 As shown, the moving assembly includes: two T-shaped blocks 22, the two T-shaped blocks 22 are slidably installed in the vertical groove 20 and the horizontal groove 21 respectively, the bottom surfaces of the two T-shaped blocks 22 are provided with rectangular grooves 23, the insides of the two rectangular grooves 23 are fixedly installed with electric push rods 24, the output shafts of the two electric push rods 24 are fixedly connected to the top surfaces of the two suction cups 25 respectively, and the side walls of the two T-shaped blocks 22 are fixedly installed with racks 29.

[0044] As a preferred implementation in this embodiment, please refer to Figure 5 , Figure 6 and Figure 8 As shown, the driving assembly includes: a gear 28, which is arranged on a circular plate 10, a guide rail 26 is provided on the top surface of the circular plate 8, and a moving block 27 is slidably connected to the inner wall of the guide rail 26, and the top surface of the moving block 27 is rotatably connected to the bottom surface of the gear 28, and a placement groove 30 is provided on the top surface of the circular plate 10. The output shafts of the two electric push rods 24 are respectively fixedly connected to the top surfaces of the two suction cups 25, and the driving assembly also includes: a motor 31, which is fixedly installed inside the placement groove 30, and the top surface of the circular plate 10 is located on one side of the two racks 29, and are rotatably connected to a gear 2 32, and the output shaft of the motor 31 is connected to the side wall of one of the gears 2 32, and the top surfaces of the two gears 2 32 are fixedly installed with couplings 33, and a belt 34 is arranged between the two couplings 33.

[0045] Through the above-mentioned features, after receiving the data transmitted by the visual sensor 19, if it is necessary to adjust the sheet product 5 according to the direction of the vertical slot 20, first, the electric push rod 24 located below the T-shaped block 22 in the vertical slot 20 will drive the suction cup 25 to move downward, and absorb the sheet product 5 in the suction cup 25, and the moving block 27 will slide to one side of the vertical slot 20 in the guide rail 26, driving the gear 1 28 on the top surface to move to one side of the rack 29 on one side of the vertical slot 20, so that the rack 29 is meshed with the gear 1 28, and at this time, the rack 29 is also meshed with the gear 2 32 close to the side of the vertical slot 20. At this time, the motor 31 is started and stopped according to the data transmitted by the visual sensor 19, so that the gear 2 32 close to the side of the vertical slot 20 is meshed. When the gear 2 32 rotates, the gear 1 28 meshing with the gear 2 32 will rotate, thereby driving the rack 29 on one side of the vertical slot 20 meshing with the gear 1 28 to move, and when the rack 29 moves, the T-shaped block 22 located in the vertical slot 20 will also move synchronously, so that it can adjust the position of the sheet product 5. If it is necessary to adjust according to the direction of the horizontal slot 21, the moving block 27 drives the gear 1 28 to move to one side of the horizontal slot 21 and mesh with the rack 29 on one side of the horizontal slot 21, and then repeat the above steps. If both sides need to be adjusted, first adjust the sheet product 5 according to the direction of the vertical slot 20, and then adjust it according to the direction of the horizontal slot 21, and the steps are the same as the above steps;

[0046] It is worth mentioning that when one of the gears 2 32 rotates, the other gear 2 32 will rotate synchronously with the belt 34 through the coupling 33 on the two gears 2 32, and the motor 31 can rotate both forward and reverse, and the moving block 27 can move in the guide rail 26 by a cylinder, a hydraulic cylinder or a magnetic drive.

[0047] Working principle:

[0048] When in use, first place the upper bottom plate 1 of the carrier opposite to the lower bottom plate 2 of the carrier, ensure that the magnet 4 is fully adsorbed to the top surface of the lower bottom plate 2 of the carrier, so as to form a closed and stable wafer carrier environment. Then, in the clean room, carefully load the sheet product 5 such as a wafer into the interior of the lower bottom plate 2 of the carrier manually or by a robotic arm. When the sheet product 5 is placed in the lower bottom plate 2 of the carrier, the upper bottom plate 1 of the carrier begins to descend, driving the disc 8 and the suction cup 13 on its bottom surface to approach the sheet product 5. The initial position of the suction cup 13 is designed to be above the middle of the sheet product 5 to ensure that it can accurately align with and adsorb the sheet product 5. Once the suction cup 13 and the sheet product 5 are aligned, the suction cup 13 and the suction cup 13 are aligned. The top surface of the carrier contacts and is successfully adsorbed, the upper bottom plate 1 of the carrier will drive the sheet product 5 to move up a preset distance. If the sheet product 5 is not in the center position of the lower bottom plate 2 of the carrier, it will tilt under the action of gravity. This tilt will be synchronously transmitted to the suction cup 13 connected to the sheet product 5 and the level bubble 15 above it. The tilt state of the level bubble 15 is captured by the visual sensor 19 through the transparent material on its top surface. The visual sensor 19 detects the offset distance of the level bubble 15 in real time and transmits this data to the control system. If the sheet product 5 is in the center position, the level bubble 15 remains horizontal, the visual sensor 19 does not issue an adjustment command, and the control system receives the visual sensor After the offset data transmitted by 19 is received, the direction and distance that the sheet product 5 needs to be adjusted are analyzed and determined, and then the adjustment mechanism is started to perform position correction. If the sheet product 5 needs to be adjusted according to the direction of the vertical slot 20, the motor 31 is started to drive a gear 2 32 connected thereto to rotate, and through the transmission action of the coupling 33 and the belt 34, the other gear 2 32 also rotates synchronously. At this time, the moving block 27 slides in the guide rail 26 to one side of the vertical slot 20, so that the gear 1 28 is engaged with the rack 29 in the vertical slot 20. The gear 1 28 rotates under the drive of the gear 2 32, driving the rack 29 and the T-shaped block 22 connected thereto to move along the vertical slot 20, and the T-shaped block 22 The electric push rod 24 on the bottom surface extends according to the preset program, causing the suction cup 25 to descend and absorb one side of the sheet product 5. As the T-shaped block 22 moves, the sheet product 5 gradually moves to the center position under the joint action of the suction cup 13 and the suction cup 25. If the sheet product 5 needs to be adjusted according to the direction of the transverse groove 21, the above steps are repeated, but the moving block 27 will drive the gear 1 28 to move to one side of the transverse groove 21 and engage with the corresponding rack 29. Through the above-mentioned vertical and transverse adjustment combination, the sheet product 5 can be accurately adjusted to the center position of the lower bottom plate 2 of the carrier. After the adjustment is completed, the suction cup 25 releases the sheet product 5 and returns to the initial position to wait for the next adjustment.

[0049] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer assembly carrier, characterized in that: include: The carrier upper bottom plate (1) and the carrier lower bottom plate (2), the inner wall of the carrier lower bottom plate (2) is fixedly installed with a sealing strip (3), the top surface of the carrier upper bottom plate (1) is fixedly embedded with a plurality of magnets (4), the top surface of the carrier lower bottom plate (2) is adsorbed by the embedded magnets (4), a sheet product (5) is arranged inside the carrier lower bottom plate (2), the bottom surface of the carrier upper bottom plate (1) is fixedly installed with a plurality of positioning pins (6), the top surface of the carrier lower bottom plate (2) is provided with a plurality of insertion holes (7), and the positioning pins (6) and the insertion holes (7) cooperate with each other; Adsorption components, the adsorption components are provided in four groups, and are respectively arranged on the bottom surface of the carrier upper bottom plate (1); Detection components, four groups of which are arranged on the circular plate (10) and are used to detect the position of the sheet product (5); The adjusting mechanism is provided with four groups, and the adjusting mechanism is provided on the circular plate (10) and is used to adjust the position of the sheet product (5).

2. A wafer assembly carrier according to claim 1, characterized in that: Adsorption components include: A disc (8) is fixedly mounted on the bottom surface of a base plate (1) on a carrier, a circular groove (9) is provided on the bottom surface of the disc (8), a circular plate (10) is fixedly mounted on the inner wall of the circular groove (9), a movable groove (11) is provided on the top surface of the circular plate (10), a spherical body (12) is rotatably connected to the side wall of the movable groove (11), and a suction cup (13) is fixedly mounted on the bottom surface of the spherical body (12).

3. A wafer assembly carrier according to claim 1 or 2, characterized in that: The detection components include: A bracket (16), wherein a plurality of the brackets (16) are provided, wherein the brackets (16) are fixedly mounted on the top surface of the circular plate (10), wherein a fixed plate (17) is fixedly mounted between the plurality of the brackets (16), wherein a mounting groove (18) is provided on the bottom surface of the fixed plate (17), wherein a visual sensor (19) is fixedly mounted inside the mounting groove (18), wherein a storage box (14) is provided on the top surface of the sphere (12), wherein a level bubble (15) is provided inside the storage box (14), and wherein the level bubble (15) is located directly below the visual sensor (19).

4. The wafer assembly carrier according to claim 1, characterized in that: The regulatory agencies include: Two suction cups (25) are provided on the circular plate (10), the top surface of the circular plate (10) is located on the right side of the sphere (12) and is provided with a vertical groove (20), and the top surface of the circular plate (10) is located on the rear side of the sphere (12) and is provided with a transverse groove (21). The adjustment mechanism also includes a moving component and a driving component.

5. A wafer assembly carrier according to claim 4, characterized in that: The mobile components include: Two T-shaped blocks (22), the two T-shaped blocks (22) are respectively slidably mounted in the vertical groove (20) and the horizontal groove (21), the bottom surfaces of the two T-shaped blocks (22) are both provided with rectangular grooves (23), the interiors of the two rectangular grooves (23) are both fixedly mounted with electric push rods (24), and the side walls of the two T-shaped blocks (22) are both fixedly mounted with racks (29).

6. A wafer assembly carrier according to claim 2 or 4, characterized in that: The drive components include: Gear 1 (28), the gear 1 (28) is arranged on a circular plate (10), a guide rail (26) is provided on the top surface of the circular plate (8), a moving block (27) is slidably connected to the inner wall of the guide rail (26), the top surface of the moving block (27) is rotatably connected to the bottom surface of the gear 1 (28), and a placement groove (30) is provided on the top surface of the circular plate (10).

7. A wafer assembly carrier according to claim 6, characterized in that: The drive components also include: A motor (31) is fixedly mounted inside the placement groove (30); the top surface of the circular plate (10) is located on one side of the two racks (29) and is rotatably connected to a second gear (32); the output shaft of the motor (31) is connected to the side wall of one of the second gears (32); the top surfaces of the two second gears (32) are fixedly mounted with coupling shafts (33); and a belt (34) is provided between the two coupling shafts (33).

8. The wafer assembly carrier according to claim 5, characterized in that: The output shafts of the two electric push rods (24) are respectively fixedly connected to the top surfaces of the two suction cups (25).

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