Clamp for testing optical module and optical module testing equipment

Abstract

The embodiment of the invention provides a clamp for testing an optical module and optical module testing equipment. The clamp comprises a shell; the first temperature control assembly and the second temperature control assembly are oppositely arranged in the shell in a spaced mode; the limiting structure is provided with a limiting through hole, the limiting structure is clamped between the first temperature control assembly and the second temperature control assembly, and a first limiting boss and a second limiting boss corresponding to the first temperature control assembly and the second temperature control assembly are arranged on the two opposite sides of the limiting through hole respectively; an insertion cavity for accommodating an optical module to be measured is formed between the first limiting boss and the second limiting boss; the driving mechanism is arranged in the shell, and the driving mechanism is in transmission connection with the first temperature control assembly and the second temperature control assembly so as to drive the first temperature control assembly and the second temperature control assembly to move in the direction close to the limiting structure to abut against the optical module to be measured.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the technical field of optoelectronic device performance testing, and specifically relate to a fixture for optical module testing and an optical module testing device. Background Art

[0002] The optical module test equipment includes a bit error tester. The optical module to be tested inserted into the fixture is connected to a test circuit board (DUT board) to establish a communication connection with the bit error tester to test the optical module to be tested.

[0003] Generally, different optical modules to be tested may have dimensional errors during manufacturing. When different optical modules to be tested are inserted into the fixture manually or by a robot to be plugged into the test circuit board socket, not every optical module to be tested matches the fixture slot, so it is impossible to ensure that the positions of each optical module to be tested are consistent in the three directions of X, Y, and Z. In this way, when the optical module to be tested is plugged into the test circuit board, its position deviation in any direction of X, Y or Z will, on the one hand, cause the test circuit board to be stressed and reduce its lifespan. More importantly, the poor contact caused by the deviation will seriously affect the signal transmission channel, resulting in the accuracy of the test signal transmission, which will directly affect the accuracy of the test results.

[0004] Therefore, how to solve the above problems has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art, and provide a fixture for testing an optical module and an optical module testing device.

[0006] According to a first aspect of an embodiment of the present disclosure, there is provided a fixture for testing an optical module, comprising: a housing;

[0007] A first temperature control component and a second temperature control component are arranged in the housing with a relative spacing;

[0008] A limiting structure of a limiting through hole is provided, the limiting structure is sandwiched between the first temperature control component and the second temperature control component, and first limiting bosses and second limiting bosses corresponding to the first temperature control component and the second temperature control component are respectively provided on opposite sides of the limiting through hole, and an insertion cavity for accommodating the optical module to be measured is formed between the first limiting boss and the second limiting boss;

[0009] A driving mechanism is disposed in the housing, and is respectively connected to the first temperature control component and the second temperature control component to drive the first temperature control component and the second temperature control component to move toward the limiting structure to abut against the optical module to be measured.

[0010] Optionally, the limiting structure includes a first limiting block and a second limiting block which are arranged relatively at an interval;

[0011] The first limiting block and the second limiting block are respectively provided with the first limiting boss on one side close to the first temperature control component;

[0012] The second limiting bosses are respectively arranged on one side of the first limiting block and the second limiting block close to the second temperature control component.

[0013] Optionally, the first limiting boss and the second limiting boss both extend along the depth direction of the insertion cavity.

[0014] Optionally, the driving mechanism includes a first cylinder and a second cylinder;

[0015] The cylinder body of the first cylinder is located at a side of the first temperature control component away from the second temperature control component and is connected to the housing, and the first piston rod of the first cylinder corresponds to the first temperature control component;

[0016] The cylinder body of the second cylinder is located at a side of the second temperature control component away from the first temperature control component and is connected to the shell, and the second piston rod of the second cylinder corresponds to the second temperature control component.

[0017] Optionally, the first temperature control component includes a first water cooling module, a first semiconductor refrigeration module and a first heat sink module; the first water cooling module is transmission-connected to the driving mechanism, the first heat sink module is located on a side of the limiting structure away from the second temperature control component, and the first semiconductor refrigeration module is sandwiched between the first water cooling module and the first heat sink module;

[0018] The second temperature control component includes a second water cooling module, a second semiconductor refrigeration module and a second heat sink module; the second water cooling module is transmission-connected to the driving mechanism, the second heat sink module is located on the side of the limiting structure away from the first temperature control component, and the second semiconductor refrigeration module is sandwiched between the second water cooling module and the second heat sink module.

[0019] Optionally, the first heat sink module includes a first heat sink and a first heat sink cover plate covered on the first heat sink, a first end of the first heat sink abuts against the first semiconductor refrigeration module, and a second end of the first heat sink passes through the first heat sink cover plate and corresponds to the limiting through hole of the limiting structure;

[0020] The second heat sink module includes a second heat sink and a second heat sink cover plate covering the second heat sink, the first end of the second heat sink abuts against the second semiconductor refrigeration module, and the second end of the second heat sink passes through the second heat sink cover plate and corresponds to the limiting through hole of the limiting structure.

[0021] Optionally, a first avoidance through hole and a first mounting groove arranged outside the first avoidance through hole are arranged on a side of the first heat sink cover plate facing the first heat sink; a first protrusion protruding toward the first heat sink cover plate is arranged at the second end of the first heat sink, the first heat sink is arranged in the first mounting groove, and the first protrusion passes through the first avoidance through hole and corresponds to the limiting through hole;

[0022] A second avoidance through hole and a second mounting groove arranged on the outside of the second avoidance through hole are provided on the side of the second heat sink cover plate facing the second heat sink; a second protrusion protruding toward the second heat sink cover plate is provided at the second end of the second heat sink, the second heat sink is arranged in the second mounting groove, and the second protrusion passes through the second avoidance through hole and corresponds to the limiting through hole.

[0023] Optionally, the clamp further includes a guiding mechanism, which is connected to the shell and movably connected to the first temperature control component and / or the second temperature control component to guide the movement of the first temperature control component and / or the second temperature control component.

[0024] Optionally, the guide mechanism includes a first guide member and a second guide member;

[0025] The first end of the first guide member is connected to the housing, and the second end of the first guide member passes through the first temperature control component to guide the movement of the first temperature control component;

[0026] The first end of the second guide member is connected to the shell, and the second end of the second guide member passes through the second temperature control component to guide the movement of the second temperature control component.

[0027] Optionally, the guide mechanism further includes a first position-limiting member, a first elastic member, a second position-limiting member and a second elastic member;

[0028] The first stopper is disposed at the second end of the first guide member, and the first elastic member is sandwiched between the first temperature control component and the first stopper;

[0029] The second limiting member is arranged at the second end of the second guiding member, and the second elastic member is clamped between the second temperature control component and the second limiting member.

[0030] According to a second aspect of the embodiments of the present disclosure, there is provided an optical module testing device, which includes a test box and the optical module testing fixture described above; the optical module testing fixture is detachably connected to the test box.

[0031] The beneficial effects of the embodiments of the present disclosure include:

[0032] In the present disclosure, the insertion cavity formed by the first limiting boss and the second limiting boss can effectively limit the position of the optical module when it is inserted into the insertion cavity, thereby avoiding positional displacement of the optical module during the insertion process and friction with the heat sink that causes appearance wear. In addition, the first limiting boss can form a certain gap between the first temperature control component and the optical module, and the second limiting boss can form a certain gap between the second temperature control component and the optical module, thereby avoiding direct contact between the heat sink and the first temperature control component and the second temperature control component, further avoiding wear on the heat sink. Furthermore, by utilizing the limiting effect of the first limiting boss and the second limiting boss, the accuracy of the insertion position of the optical module can be ensured, the accuracy of the bit error test can be ensured, and the service life of the test circuit board can be prolonged. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic structural diagram of a fixture for testing an optical module according to an embodiment of the present disclosure;

[0034] Figure 2 This is a structural schematic diagram of a fixture for testing an optical module according to an embodiment of the present disclosure, wherein the positional relationship between the first temperature control component, the limiting structure, and the second temperature control component is illustrated;

[0035] Figure 3 for Figure 2 A partial structural enlarged schematic diagram of FIG. 1 , wherein the positional relationship between the first limiting boss, the second limiting boss and the insertion cavity is illustrated;

[0036] Figure 4 This is a schematic structural diagram of a fixture for testing an optical module according to another embodiment of the present disclosure;

[0037] Figure 5 for Figure 4 Schematic diagram of the explosion structure;

[0038] Figure 6 for Figure 5 A partial structural enlarged schematic diagram of FIG. 1 , wherein the positional relationship between the limiting through hole and the insertion cavity is illustrated;

[0039] Figure 7 It is a schematic diagram of the explosion structure of the first heat sink module and the second heat sink module;

[0040] Figure 8 This is a structural schematic diagram of a fixture for testing an optical module according to an embodiment of the present disclosure; it illustrates the positional relationship between the second temperature detection element and the second heat sink;

[0041] Fig. 9 for Figure 8 A partial structural enlarged schematic diagram;

[0042] Fig.10 This is a structural schematic diagram of a fixture for testing an optical module according to another embodiment of the present disclosure; it illustrates the positional relationship between the first temperature detection element and the first heat sink;

[0043] Fig.11 for Fig.10 A partial structural enlarged schematic diagram;

[0044] Fig.12 The present invention is a schematic diagram of the structure of an optical module testing device according to an embodiment of the present invention.

[0045] In the figure, 1, optical module testing equipment; 2, optical module; 10, fixture; 11, housing; 12, first temperature control component;

[0046] 121. a first water cooling module; 122. a first semiconductor refrigeration module; 123. a first heat sink module;

[0047] 1211, first water cooling seat; 1212, first water cooling head; 12111, first limiting groove; 1231, first heat sink; 1232, first heat sink cover; 1233, first temperature detection element; 12311, first protrusion; 12321, first avoidance through hole; 12322, first mounting groove;

[0048] 13. Second temperature control component; 131. Second water cooling module; 132. Second semiconductor refrigeration module; 133. Second heat sink module;

[0049] 1311, second water cooling seat; 1312, second water cooling head; 1331, second heat sink; 1332, second heat sink cover; 1333, second temperature detection element; 13311, second protrusion; 13321, second avoidance through hole;

[0050] 14. Limiting structure; 141. Limiting through hole; 142. First limiting boss; 143. Second limiting boss; 144. Insertion cavity; 145. First limiting block; 146. Second limiting block;

[0051] 15. First cylinder; 16. Second cylinder; 17. First guide member; 18. Second guide member; 19. First limit member; 20. First elastic member; 21. Second limit member; 22. Second elastic member; 23. Third limit member; 24. Fourth limit member; 25. Fixing member; 26. Gasket; 210. Test box. DETAILED DESCRIPTION

[0052] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the present disclosure is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0053] The following is a further detailed description of the implementation methods of the present application in conjunction with the accompanying drawings and examples. The detailed descriptions and drawings of the following examples are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments. In the description of the present application, it should be noted that, unless otherwise specified, the meaning of "multiple" is more than two; the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "inside", "outside", etc. is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the error tolerance range. "Parallel" is not parallel in the strict sense, but within the error tolerance range.

[0054] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0055] like Figure 1-3 , as shown in FIG6 , a fixture 10 for testing an optical module includes a housing 11, a first temperature control component 12, a second temperature control component 13, a limiting structure 14, and a driving mechanism. The first temperature control component 12 and the second temperature control component 13 are arranged in the housing 11 with a relative interval. Specifically, the first temperature control component 12 and the second temperature control component 13 are arranged at the top and the bottom of the housing with a relative position and respectively, wherein the first temperature control component 12 and the second temperature control component 13 are spaced apart by a preset distance.

[0056] The limiting structure 14 is provided with a limiting through hole 141, and the limiting structure 14 is sandwiched between the first temperature control component 12 and the second temperature control component 13. The first limiting boss 142 and the second limiting boss 143 corresponding to the first temperature control component 12 and the second temperature control component 13 are respectively provided on opposite sides of the limiting through hole 141. An insertion cavity 144 for accommodating the optical module 2 to be measured is formed between the first limiting boss 142 and the second limiting boss 143, wherein the shape of the insertion cavity 144 is adapted to the shape of the optical module 2 to be measured. The first limiting boss 142 and the second limiting boss 143 both extend along the depth direction of the insertion cavity.

[0057] The driving mechanism is disposed in the housing 11 , and is respectively connected to the first temperature control component 12 and the second temperature control component 13 to drive the first temperature control component 12 and the second temperature control component 13 to move toward the limiting structure 14 to abut against the optical module 2 .

[0058] In the present disclosure, the insertion cavity formed by the first limiting boss 142 and the second limiting boss 143 can effectively limit the position of the optical module 2 when it is inserted into the insertion cavity 144, so as to avoid the optical module 2 from being offset and rubbing against the heat sink during the insertion process, resulting in appearance wear. Furthermore, the edges of the first limiting boss 142 and the second limiting boss 143 do not exceed the limiting structure 14, so that when the optical module 2 to be tested is inserted into the insertion cavity 144, the upper surface and the lower surface of the optical module 2 to be tested are respectively lower than the upper surface and the lower surface of the limiting structure 14. Therefore, when the optical module 2 is inserted into the insertion cavity 144, the first limiting boss 142 can form a certain gap between the first temperature control component 12 and the optical module 2, and the second limiting boss 143 can form a certain gap between the second temperature control component 13 and the optical module 2, thereby avoiding direct contact between the heat sink and the first temperature control component 12 and the second temperature control component 13, and further avoiding wear on the heat sink. Furthermore, by using the limiting function of the first limiting boss 142 and the second limiting boss 143, the accuracy of the insertion position of the optical module 2 can be ensured, the accuracy of the bit error test can be ensured, and the service life of the test circuit board can be extended. The test circuit board is a DUT board (Device Under Test), which receives test signals from the BERT board, processes these signals according to its functions, and then transmits the processed signals back to the BERT board.

[0059] In some embodiments, the limiting structure 14 is made of PIG (phosphor in glass) material. PIG has the high heat resistance and high thermal conductivity characteristics of inorganic materials and can significantly improve wear resistance.

[0060] In some embodiments, the limiting structure 14 is made of self-lubricating material, including non-metallic self-lubricating material or polymer self-lubricating material. The use of self-lubricating material can significantly reduce the friction between the insertion cavity 144 and the optical module 2, thereby effectively reducing the degree of wear.

[0061] In some embodiments, reference Figure 4-6The limiting structure 14 includes a first limiting block 145 and a second limiting block 146 that are relatively spaced apart. The first limiting block 145 and the second limiting block 146 are respectively provided with a first limiting boss 142 on one side close to the first temperature control component 12, and the first limiting block 145 and the second limiting block 146 are respectively provided with a second limiting boss 143 on one side close to the second temperature control component 13. The first limiting boss 142 and the second limiting boss 143 extend along the length direction of the insertion cavity 144, respectively. It can be understood that the extension length of the first limiting boss 142 and the second limiting boss 143 is designed according to the actual contact length between the first limiting boss 142 and the second limiting boss 143 and the optical module 2.

[0062] In a specific example, the first temperature control component 12 and the second temperature control component 13 are arranged vertically, the first temperature control component 12 is arranged at the top of the shell, and the second temperature control component 13 is arranged at the bottom of the shell. The first limit block 145 and the second limit block 146 are located between the first temperature control component 12 and the second temperature control component 13 and are arranged horizontally, and the first limit block 145 and the second limit block 146 are arranged at a relative interval, and jointly define an insertion cavity 144 extending along the insertion direction of the optical module 2, and a limit through hole 141 connected to the insertion cavity 144. There are two limit through holes 141, one limit through hole 141 corresponds to the position of the first temperature control component 12, and the first temperature control component 12 abuts against the top of the optical module 2 in the insertion cavity 144 by penetrating the limit through hole 141. Another limiting through hole 141 corresponds to the position of the second temperature control component 13, and the second temperature control component 13 abuts against the bottom end of the optical module 2 in the insertion cavity 144 by passing through the limiting through hole 141. It can be understood that the shell top is represented by the top of the shell 11, and the shell bottom is represented by the bottom of the shell 11. In some embodiments, the shell 11 is surrounded by a relative top plate and a bottom plate, and two relative side plates. Among them, the shell top is located on the top plate, and the shell bottom is located on the bottom plate.

[0063] In the present disclosure, by setting the first limiting boss 142 and the second limiting boss 143, the optical module 2 inserted into the insertion cavity 144 can be positioned circumferentially, so as to avoid the optical module 2 from being offset and rubbing against the heat sink during the insertion process, resulting in appearance wear. Furthermore, in the direction in which the second limiting boss 143 points to the first limiting boss 142, the edges of the first limiting boss 142 and the second limiting boss 143 do not exceed the limiting structure 14, so that when the optical module to be tested is inserted into the insertion cavity 144, the upper surface and the lower surface of the optical module to be tested are respectively lower than the upper surface and the lower surface of the limiting structure 14, that is, the first limiting boss 142 is lower than the upper surface of the limiting structure 14, and the second limiting boss is higher than the lower surface of the limiting structure 14. Therefore, the first limiting boss 142 and the second limiting boss 143 play a guiding role for the optical module 2 in the length direction of the insertion cavity 144, which can effectively ensure the insertion accuracy of the optical module 2 and avoid damage to the test circuit board caused by inaccurate insertion.

[0064] In some embodiments, the limiting structure 14 is an integral structural member, and an insertion cavity 144 and two limiting through holes 141 communicating with the upper and lower sides of the insertion cavity 144 are provided on the limiting structure 14, and the length of the insertion cavity 144 extends along the insertion direction of the optical module 2. The limiting structure 14 that uses an integral structural member can effectively ensure the structural strength of the limiting structure 14, and is also conducive to the maintenance of the equipment.

[0065] In some embodiments, reference Figure 7-11 The driving mechanism includes a first cylinder 15 and a second cylinder 16. The cylinder body of the first cylinder 15 is located on the side of the first temperature control component 12 away from the second temperature control component 13 and is connected to the housing 11, and the first piston rod of the first cylinder 15 corresponds to the first temperature control component 12. The cylinder body of the second cylinder 16 is located on the side of the second temperature control component 13 away from the first temperature control component 12 and is connected to the housing 11, and the second piston rod of the second cylinder 16 corresponds to the second temperature control component 13.

[0066] In a specific example, the cylinder body of the first cylinder 15 is connected to the shell top. One end of the first piston rod is connected to the cylinder body piston of the first cylinder 15, and the other end of the first piston rod is connected to the first temperature control component 12, wherein the piston movement of the first piston rod in the cylinder body of the first cylinder 15 drives the first temperature control component 12 to move toward the insertion cavity 144 to abut against the optical module 2.

[0067] The cylinder body of the second cylinder 16 is connected to the shell bottom. One end of the second piston rod is connected to the cylinder body piston of the second cylinder 16, and the other end of the second piston rod is connected to the second temperature control component 13, wherein the piston movement of the second piston rod in the cylinder body of the second cylinder 16 drives the second temperature control component 13 to move toward the insertion cavity 144 to abut against the optical module 2.

[0068] In the present disclosure, the first cylinder 15 and the second cylinder 16 are used as the transmission mechanism, which can reduce the production cost and facilitate maintenance and repair. In addition, the cylinder has the characteristics of fast response speed, which can achieve fast start and stop, and meet the test requirements of the optical module 2. Furthermore, the cylinder has the characteristics of adjustability, and the transmission speed and force can be adjusted as needed.

[0069] In some embodiments, the driving mechanism includes a first motor and a second motor. The first motor is located on a side of the first temperature control component 12 away from the second temperature control component 13 and connected to the housing 11, and the first motor is used to drive the first temperature control component 12 to move toward the insertion cavity 144. The second motor is located on a side of the second temperature control component 13 away from the first temperature control component 12 and connected to the housing 11, and the second motor is used to drive the second temperature control component 13 to move toward the insertion cavity 144.

[0070] In some embodiments, reference Figure 5 The first temperature control component 12 includes a first water cooling module 121, a first semiconductor refrigeration module 122 (TEC Thermoelectric Cooling) and a first heat sink module 123. The first water cooling module 121 is in transmission connection with the driving mechanism, the first heat sink module 123 is located on the side of the limiting structure 14 away from the second temperature control component 13, and the first semiconductor refrigeration module 122 is sandwiched between the first water cooling module 121 and the first heat sink module 123.

[0071] Further, the first piston rod of the first cylinder 15 is connected to the first water-cooling module 121. The first water-cooling module 121 includes a first water-cooling seat 1211 and a first water-cooling head 1212. The surface of the first water-cooling seat 1211 facing the first semiconductor refrigeration module 122 is provided with a first accommodating cavity, and the first water-cooling head 1212 is arranged in the first accommodating cavity. A cooling channel is arranged in the first water-cooling head 1212, and the cooling channel is used for the circulation of the cooling medium. The first water-cooling head 1212 also includes a pagoda head arranged at the inlet and outlet of the cooling channel, and a throat clamp arranged on the pagoda head, and the pagoda head is used to connect with the cooling pipeline. The first cylinder 15 is connected to the first water-cooling seat 1211.

[0072] In some embodiments, reference Figure 2 and Figure 8 The fixture 10 further includes a third stopper 23, which is located on a side of the first temperature control component 12 away from the second temperature control component 13 and connected to the housing 11. A first stopper groove 12111 is provided on a surface of the first water cooling seat 1211 away from the first semiconductor refrigeration module 122, and the first stopper groove 12111 corresponds to the position of the third stopper 23. When the first cylinder 15 contracts, the third stopper 23 is used to abut against the first stopper groove 12111 to limit the contraction stroke of the first temperature control component 12.

[0073] In some embodiments, there are multiple third limiting members 23, and a surface of the first water cooling seat 1211 away from the first semiconductor refrigeration module 122 is provided with multiple first limiting grooves 12111, and the multiple third limiting members 23 are provided in a one-to-one correspondence with the multiple first limiting grooves 12111. In the present disclosure, the third limiting member and the first limiting groove 12111 are provided to effectively limit the contraction stroke of the first cylinder 15.

[0074] The second temperature control assembly 13 includes a second water cooling module 131, a second semiconductor cooling module 132 (TECThermoelectric Cooling) and a second heat sink module 133. The second water cooling module 131 is in transmission connection with the driving mechanism, the second heat sink module 133 is located on the side of the limiting structure 14 away from the first temperature control assembly 12, and the second semiconductor cooling module 132 is sandwiched between the second water cooling module 131 and the second heat sink module 133.

[0075] Further, the second piston rod of the second cylinder 16 is connected to the second water-cooling module 131. The second water-cooling module 131 includes a second water-cooling seat 1311 and a second water-cooling head 1312. The second water-cooling seat 1311 is provided with a second accommodating cavity on the surface facing the second semiconductor refrigeration module 132, and the second water-cooling head 1312 is arranged in the second accommodating cavity. A cooling channel is arranged in the second water-cooling head 1312, and the cooling channel is used for the circulation of the cooling medium. The second water-cooling head 1312 also includes a pagoda head arranged at the inlet and outlet of the cooling channel, and a throat clamp arranged on the pagoda head, and the pagoda head is used to connect with the cooling pipeline. The second cylinder 16 is connected to the second water-cooling seat 1311.

[0076] In some embodiments, the clamp 10 further includes a fourth stopper 24, which is located on a side of the second temperature control component 13 away from the first temperature control component 12 and connected to the housing 11. A second stopper groove (not shown in the figure) is provided on the surface of the second water cooling seat 1311 away from the second semiconductor refrigeration module 132, and the second stopper groove corresponds to the position of the fourth stopper 24. When the second cylinder 16 contracts, the fourth stopper 24 is used to abut against the second stopper groove to limit the contraction stroke of the second temperature control component 13.

[0077] In some embodiments, there are multiple fourth limiting members 24, and a plurality of second limiting grooves are provided on the surface of the second water cooling seat 1311 away from the second semiconductor refrigeration module 132, and the plurality of fourth limiting members 24 are provided in a one-to-one correspondence with the plurality of second limiting grooves. In the present disclosure, the fourth limiting member 24 and the second limiting groove are provided to effectively limit the contraction stroke of the second cylinder 16.

[0078] In some embodiments, reference Figure 7 and Figure 10-11The first heat sink module 123 includes a first heat sink 1231 and a first heat sink cover plate 1232 covering the first heat sink 1231. The first end of the first heat sink 1231 abuts against the first semiconductor refrigeration module 122. The second end of the first heat sink 1231 passes through the first heat sink cover plate 1232 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0079] In a specific example provided by the present disclosure, a first avoidance through hole 12321 and a first mounting groove 12322 arranged outside the first avoidance through hole 12321 are arranged on a side of the first heat sink cover 1232 facing the first heat sink 1231. A first protrusion 12311 protruding toward the first heat sink cover 1232 is arranged at the second end of the first heat sink 1231. The first heat sink 1231 is arranged in the first mounting groove 12322. The first protrusion 12311 passes through the first avoidance through hole 12321 and corresponds to the position-limiting through hole 141. The first temperature control component 12 is driven by the first cylinder 15 so that the first protrusion 12311 penetrates the position-limiting through hole 141 and extends into the insertion cavity 144 to abut against the optical module 2.

[0080] Furthermore, the first installation groove 12322 corresponds to the position of the first accommodating cavity, and the first heat sink 1231 and the first semiconductor refrigeration module 122 are covered in the first accommodating cavity by the first heat sink cover plate 1232. This arrangement can protect the heat sink and the semiconductor refrigeration module and ensure the normal use of the equipment.

[0081] The second heat sink module 133 includes a second heat sink 1331 and a second heat sink cover plate 1332 covering the second heat sink 1331. The first end of the second heat sink 1331 abuts against the second semiconductor refrigeration module 132. The second end of the second heat sink 1331 passes through the second heat sink cover plate 1332 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0082] In a specific example provided by the present disclosure, a second avoidance through hole 13321 and a second mounting groove (not shown in the figure) arranged outside the second avoidance through hole 13321 are arranged on the side of the second heat sink cover 1332 facing the second heat sink 1331. A second protrusion 13311 protruding toward the second heat sink cover 1332 is arranged at the second end of the second heat sink 1331, and the second heat sink 1331 is arranged in the second mounting groove, and the second protrusion 13311 passes through the second avoidance through hole 13321 and corresponds to the limiting through hole 141, wherein the second temperature control component 13 is driven by the second cylinder 16 so that the second protrusion 13311 penetrates the limiting through hole 141 and extends into the insertion cavity 144 to abut against the optical module 2.

[0083] Furthermore, the second mounting groove corresponds to the position of the second accommodating cavity, and the second heat sink 1331 and the second semiconductor refrigeration module 132 are covered in the second accommodating cavity by the second heat sink cover plate 1332. This arrangement can protect the heat sink and the semiconductor refrigeration module and ensure the normal use of the equipment.

[0084] In some embodiments, the first heat sink module 123 further includes a first temperature detection element 1233, and the second heat sink module 133 further includes a second temperature detection element 1333. The first end of the first temperature detection element 1233 is inserted into the first heat sink 1231, and the second end of the first temperature detection element 1233 is fixed to the first heat sink cover 1232.

[0085] In some embodiments, reference Figure 10-11 A first insertion hole is provided on the first protrusion 12311, and the first end of the first temperature detection element 1233 is inserted into the first insertion hole.

[0086] In some other embodiments, the first temperature detection element 1233 is bonded to the first heat sink cover 1232. By bonding, the connection reliability between the first temperature detection element 1233 and the first heat sink cover 1232 can be ensured.

[0087] In some embodiments, reference Figure 8-9 The first end of the second temperature detection element 1333 is inserted into the second heat sink 1331 , and the second end of the second temperature detection element 1333 is fixed to the second heat sink cover plate 1332 .

[0088] In some embodiments, the second protrusion 13311 is provided with a second insertion hole, and the first end of the second temperature detection element 1333 is inserted into the second insertion hole. The second heat sink module 133 further includes a fixing member 25, which is used to fix the second temperature detection element 1333 to the second heat sink cover 1332.

[0089] In a specific example provided by the present disclosure, a threaded hole is provided on the second heat sink cover plate 1332, and the fixing member 25 is a threaded connector, wherein the second temperature detection element 1333 is fixed to the second heat sink cover plate 1332 by threaded connection between the threaded connector and the threaded hole. It is understandable that the fixing method of the second temperature detection element 1333 to the second heat sink cover plate 1332 includes but is not limited to threaded connection between the threaded connector and the threaded hole, and can also be detachably fixed to the second heat sink cover plate 1332 by means of a snap connector, a magnetic connector, or a hook and loop connector.

[0090] In some embodiments, the second heat sink module 133 further includes a gasket 26, which is disposed between the fixing member 25 and the second temperature detection element 1333, wherein the gasket 26 is crimped to the second temperature detection element 1333 by connecting the threaded connector to the threaded hole, so as to fix the second temperature detection element 1333 to the second heat sink cover plate 1332. In the present disclosure, the connection between the threaded connector and the threaded hole is detachable, which facilitates the subsequent maintenance of the second temperature detection element 1333 and the user's experience.

[0091] In some other embodiments, the second temperature detection element 1333 is bonded to the second heat sink cover 1332. By bonding, the connection reliability between the second temperature detection element 1333 and the second heat sink cover 1332 can be ensured.

[0092] In some embodiments, the fixture 10 also includes a guiding mechanism, which is connected to the shell 11 and movably connected to the first temperature control component 12 and / or the second temperature control component 13 to guide the movement of the first temperature control component 12 and / or the second temperature control component 13.

[0093] In one embodiment provided by the present disclosure, the guide mechanism is connected to the housing 11 and is movably connected to the first temperature control component 12 to guide the movement of the first temperature control component 12 .

[0094] In another embodiment provided by the present disclosure, the guide mechanism is connected to the housing 11 and is movably connected to the second temperature control component 13 to guide the movement of the second temperature control component 13 .

[0095] In another embodiment provided by the present disclosure, the guide mechanism is connected to the shell 11 and is movably connected to the first temperature control component 12 and the second temperature control component 13 respectively, so as to guide the movement of the first temperature control component 12 and the second temperature control component 13 at the same time.

[0096] In some embodiments, reference Figure 2 , Figure 4-5 and Figure 8 The guide mechanism includes a first guide member 17 and a second guide member 18. The first end of the first guide member 17 is connected to the shell 11, and the second end of the first guide member 17 passes through the first temperature control component 12 to guide the movement of the first temperature control component 12.

[0097] Specifically, the first water-cooling seat 1211 is provided with a first guide through hole (not shown in the figure) penetrating the thickness thereof, the first guide member 17 is passed through the first guide through hole, and the first end of the first guide member 17 is connected to the shell top, and the second end of the first guide member 17 passes through the first water-cooling seat 1211. The above arrangement can provide guidance for the movement of the first temperature control component 12, thereby ensuring that the first protrusion 12311 of the first heat sink 1231 can accurately extend into the insertion cavity 144, and ensuring the temperature regulation effect of the first temperature control component 12 on the optical module 2.

[0098] In some embodiments, there are multiple first guide members 17, and multiple first guide members 17 are arranged around the circumference of the first cylinder 15. The first water-cooling seat 1211 is provided with multiple first guide through holes that penetrate its thickness, and multiple first guide members 17 are arranged one-to-one with multiple first guide through holes. The above arrangement can provide more accurate guidance for the movement of the first temperature control component 12, ensuring that the first protrusion 12311 of the first heat sink 1231 can be more accurately inserted into the insertion cavity 144, further ensuring the temperature regulation effect of the first temperature control component 12 on the optical module 2.

[0099] A first end of the second guide member 18 is connected to the housing 11 , and a second end of the second guide member 18 passes through the second temperature control component 13 to guide the movement of the second temperature control component 13 .

[0100] Specifically, the second water-cooling seat 1311 is provided with a second guide through hole (not shown in the figure) penetrating the thickness thereof, the second guide member 18 is penetrated through the second guide through hole, and the first end of the second guide member 18 is connected to the shell bottom, and the second end of the second guide member 18 passes through the second water-cooling seat 1311. The above arrangement can provide guidance for the movement of the second temperature control component 13, thereby ensuring that the second protrusion 13311 of the second heat sink 1331 can accurately extend into the insertion cavity 144, and ensuring the temperature regulation effect of the second temperature control component 13 on the optical module 2.

[0101] In some embodiments, there are multiple second guide members 18, and multiple second guide members 18 are arranged around the circumference of the second cylinder 16. The second water-cooling seat 1311 is provided with multiple second guide through holes that penetrate its thickness, and multiple second guide members 18 are arranged one-to-one with multiple second guide through holes. The above arrangement can provide more accurate guidance for the movement of the second temperature control component 13, ensuring that the second protrusion 13311 of the second heat sink 1331 can be more accurately inserted into the insertion cavity 144, further ensuring the temperature regulation effect of the second temperature control component 13 on the optical module 2.

[0102] In some embodiments, the guide mechanism further includes a first stopper 19, a first elastic member 20, a second stopper 21, and a second elastic member 22. The first stopper 19 and the first elastic member 20 are located on the side of the first water-cooling seat 1211 away from the shell top, the first stopper 19 is disposed at the second end of the first guide member 17, the first elastic member 20 is sandwiched between the first temperature control component 12 and the first stopper 19, and the first elastic member 20 is used to provide buffering and reset force to the first temperature control component 12. Specifically, the first elastic member 20 is sandwiched between the first water-cooling seat 1211 and the first stopper 19.

[0103] The second stopper 21 and the second elastic member 22 are located on the side of the second water-cooling seat 1311 away from the shell bottom, the second stopper 21 is arranged at the second end of the second guide member 18, the second elastic member 22 is sandwiched between the second temperature control assembly 13 and the second stopper 21, and the second elastic member 22 is used to provide a buffer and a reset force to the second temperature control assembly 13. Specifically, the second elastic member 22 is sandwiched between the second water-cooling seat 1311 and the second stopper 21.

[0104] In some embodiments, there are multiple first stoppers 19 and multiple first elastic members 20, and the multiple first stoppers 19 and multiple first elastic members 20 are arranged one by one with the multiple first guide members 17. In the present disclosure, the first temperature control component 12 can be reset to the initial position by the reset force provided by the first elastic member 20, and the multiple first elastic members 20 arranged around the circumference of the first cylinder 15 can also level the first temperature control component 12 to ensure the flatness of the first temperature control component 12, thereby ensuring the parallelism of the abutment between the first protrusion 12311 of the first heat sink 1231 and the optical module 2.

[0105] In some embodiments, there are multiple second stoppers 21 and second elastic members 22, and the multiple second stoppers 21 and second elastic members 22 are arranged one by one with the multiple second guide members 18. In the present disclosure, the second temperature control assembly 13 can be reset to the initial position by the reset force provided by the second elastic member 22, and the multiple second elastic members 22 arranged around the circumference of the second cylinder 16 can also level the second temperature control assembly 13 to ensure the flatness of the second temperature control assembly 13, thereby ensuring the parallelism of the second protrusion 13311 of the second heat sink 1331 and the abutment of the optical module 2.

[0106] In some embodiments, the first elastic member 20 and the second elastic member 22 are spring members.

[0107] In the present disclosure, the optical module insertion state includes: during the insertion of the optical module into the insertion cavity of the limiting structure, the heat sink moves away from the limiting structure under the drive of the driving mechanism, so that a gap is formed between the heat sink and the optical module. The optical module test state includes: before the test, the heat sink moves toward the limiting structure under the drive of the driving mechanism, so that the heat sink and the optical module fit together, and the semiconductor refrigeration module of the temperature control component adjusts the temperature of the optical module through the thermal conductivity characteristics of the heat sink.

[0108] In some embodiments, reference Fig.12 The present disclosure provides an optical module testing device 1, which includes a test box 210 and an optical module testing fixture 10, and the optical module testing fixture 10 is detachably connected to the test box 210.

[0109] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A fixture for testing an optical module, characterized in that: The fixture comprises: case; A first temperature control component and a second temperature control component are arranged in the housing with a relative spacing; A limiting structure of a limiting through hole is provided, the limiting structure is sandwiched between the first temperature control component and the second temperature control component, and first limiting bosses and second limiting bosses corresponding to the first temperature control component and the second temperature control component are respectively provided on opposite sides of the limiting through hole, and an insertion cavity for accommodating the optical module to be measured is formed between the first limiting boss and the second limiting boss; A driving mechanism is disposed in the housing, and is respectively connected to the first temperature control component and the second temperature control component to drive the first temperature control component and the second temperature control component to move toward the limiting structure to abut against the optical module to be measured.

2. The optical module testing fixture according to claim 1, characterized in that: The limiting structure comprises a first limiting block and a second limiting block which are arranged at a relative interval; The first limiting block and the second limiting block are respectively provided with the first limiting boss on one side close to the first temperature control component; The second limiting bosses are respectively arranged on one side of the first limiting block and the second limiting block close to the second temperature control component.

3. The optical module testing fixture according to claim 1 or 2, characterized in that: The first limiting boss and the second limiting boss both extend along the depth direction of the insertion cavity.

4. The optical module testing fixture according to claim 1 or 2, characterized in that: The driving mechanism comprises a first cylinder and a second cylinder; The cylinder body of the first cylinder is located at a side of the first temperature control component away from the second temperature control component and is connected to the housing, and the first piston rod of the first cylinder corresponds to the first temperature control component; The cylinder body of the second cylinder is located at a side of the second temperature control component away from the first temperature control component and is connected to the shell, and the second piston rod of the second cylinder corresponds to the second temperature control component.

5. The optical module testing fixture according to claim 1 or 2, characterized in that: The first temperature control component includes a first water cooling module, a first semiconductor refrigeration module and a first heat sink module; the first water cooling module is transmission-connected to the driving mechanism, the first heat sink module is located on a side of the limiting structure away from the second temperature control component, and the first semiconductor refrigeration module is sandwiched between the first water cooling module and the first heat sink module; The second temperature control component includes a second water cooling module, a second semiconductor refrigeration module and a second heat sink module; The second water cooling module is transmission-connected to the driving mechanism, the second heat sink module is located on the side of the limiting structure away from the first temperature control component, and the second semiconductor refrigeration module is sandwiched between the second water cooling module and the second heat sink module.

6. The optical module testing fixture according to claim 5, characterized in that: The first heat sink module comprises a first heat sink and a first heat sink cover plate covered on the first heat sink, a first end of the first heat sink abuts against the first semiconductor refrigeration module, and a second end of the first heat sink passes through the first heat sink cover plate and corresponds to the limiting through hole of the limiting structure; The second heat sink module includes a second heat sink and a second heat sink cover plate covering the second heat sink, the first end of the second heat sink abuts against the second semiconductor refrigeration module, and the second end of the second heat sink passes through the second heat sink cover plate and corresponds to the limiting through hole of the limiting structure.

7. The optical module testing fixture according to claim 6, characterized in that: A first avoidance through hole and a first mounting groove arranged outside the first avoidance through hole are arranged on a side of the first heat sink cover plate facing the first heat sink; a first protrusion protruding toward the first heat sink cover plate is arranged at the second end of the first heat sink, the first heat sink is arranged in the first mounting groove, and the first protrusion passes through the first avoidance through hole and corresponds to the limiting through hole; A second avoidance through hole and a second mounting groove arranged on the outside of the second avoidance through hole are provided on the side of the second heat sink cover plate facing the second heat sink; a second protrusion protruding toward the second heat sink cover plate is provided at the second end of the second heat sink, the second heat sink is arranged in the second mounting groove, and the second protrusion passes through the second avoidance through hole and corresponds to the limiting through hole.

8. The optical module testing fixture according to claim 1 or 2, characterized in that: The fixture also includes a guiding mechanism, which is connected to the shell and movably connected to the first temperature control component and / or the second temperature control component to guide the movement of the first temperature control component and / or the second temperature control component.

9. The optical module testing fixture according to claim 8, characterized in that: The guide mechanism comprises a first guide member and a second guide member; The first end of the first guide member is connected to the housing, and the second end of the first guide member passes through the first temperature control component to guide the movement of the first temperature control component; The first end of the second guide member is connected to the shell, and the second end of the second guide member passes through the second temperature control component to guide the movement of the second temperature control component.

10. The optical module testing fixture according to claim 9, characterized in that: The guide mechanism further includes a first limiting member, a first elastic member, a second limiting member and a second elastic member; The first stopper is disposed at the second end of the first guide member, and the first elastic member is sandwiched between the first temperature control component and the first stopper; The second limiting member is arranged at the second end of the second guiding member, and the second elastic member is clamped between the second temperature control component and the second limiting member.

11. An optical module testing device, characterized in that: The optical module testing equipment comprises a test box and an optical module testing fixture according to any one of claims 1 to 10; The optical module testing fixture is detachably connected to the testing box.

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