An anti-interference power supply

Abstract

The application discloses an anti-interference power supply, which comprises a shell, a power amplifier assembly arranged in the shell and used for power management, and a plurality of electrical elements arranged on the back of a printed board; the back of the printed board is opposite to an inner wall of the shell; and a conductive part is arranged between the back of the printed board and the inner wall of the shell and covers the electrical elements arranged on the back of the printed board in a projection shape on a projection plane parallel to the extension direction of the printed board; the conductive part is electrically connected with a reference point with a ground potential in the power amplifier assembly; and the reference point with the ground potential in the power amplifier assembly is electrically connected with the shell through an approval device. The anti-interference power supply can reduce the power-off probability.

Description

Technical Field

[0001] This invention relates to the field of power supply equipment technology, and more specifically to an anti-interference power supply. Background Technology

[0002] In harsh external working environments, surface-mount components (SMDs) on the power amplifier board inside the power module of electrical equipment are prone to dust accumulation, leading to decreased electrical performance or even damage. To address this issue, SMDs are often placed on the back of the printed circuit board (PCB). In this case, the SMDs are positioned between the PCB and the power module's sheet metal housing, which provides protection and reduces dust accumulation. However, in practical use, placing the SMDs on the back of the PCB increases the probability of power module failure compared to a configuration where the SMDs are placed on the front of the PCB. Summary of the Invention

[0003] The purpose of this invention is to overcome the above-mentioned defects or problems in the prior art and to provide an anti-interference power supply that can reduce the probability of power failure.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] Technical Solution 1: An anti-interference power supply, comprising a housing, further comprising: a power amplifier assembly disposed within the housing for power management, comprising a printed circuit board and a plurality of electrical components located on the back side of the printed circuit board; the back side of the printed circuit board is opposite to an inner wall of the housing; and a conductive element disposed between the back side of the printed circuit board and the inner wall of the housing, and whose projected shape on a projection plane parallel to the extension direction of the printed circuit board covers the electrical components located on the back side of the printed circuit board; the conductive element is electrically connected to a reference point having ground potential in the power amplifier assembly; the reference point having ground potential in the power amplifier assembly is electrically connected to the housing via a safety device.

[0006] Technical Solution 2 based on Technical Solution 1: In the power amplifier assembly, a power module and a control module are further provided on the printed circuit board. The power module is used for power conversion, and the control module is used for controlling the power module. The projection shape of the conductive element on the projection surface covers the power module and the control module.

[0007] Technical Solution 3 based on Technical Solution 2: The conductive component includes a first conductive part corresponding to the position of the power module and a second conductive part corresponding to the position of the control module. The first conductive part and the second conductive part are electrically isolated within the conductive component. The first conductive part is electrically connected to a reference point with ground potential in the power module, and the second conductive part is electrically connected to a reference point with ground potential in the control module.

[0008] Technical solution four, based on technical solution three, also includes an electrical connector, one end of which is electrically connected to the side edge of the conductive element, and the other end of which is electrically connected to a reference point with ground potential in the power amplifier assembly.

[0009] Technical solution five, based on technical solutions one to four: the conductive component is located further away from the printed circuit board between the printed circuit board and the housing.

[0010] Technical solution six based on technical solution five: The conductive component includes a metal foil for forming the first conductive part and the second conductive part.

[0011] Technical solution seven based on technical solution six: The conductive component adopts a flexible circuit board, and the metal foil is the conductor layer in the flexible circuit board.

[0012] Technical solution eight based on technical solution seven: The power amplifier assembly further includes several electrical components located on the front side of the printed circuit board, wherein the electrical components located on the front side of the printed circuit board are low-voltage signal devices, and the electrical components located on the back side of the printed circuit board are high-voltage signal devices.

[0013] Technical solution nine based on technical solution eight: In the power amplifier assembly, the electrical components located on the front side of the printed circuit board are fixed by dispensing adhesive.

[0014] Based on technical solutions six to nine, technical solution ten: the power amplifier component, the conductive component and the housing are filled with resin material to fix the conductive component.

[0015] As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects:

[0016] Technical solution one provides an anti-interference power supply, which reduces the probability of power failure when electrical components are placed on the back of the printed circuit board.

[0017] The applicant's research revealed that in existing power supply structures, the printed circuit board (PCB) and the sheet metal housing are typically connected in a loop via safety devices, usually Y capacitors. Specifically, to suppress common-mode interference and achieve good safety performance, the art typically considers transferring interference generated by the power amplifier components themselves to ground via the PCB. Therefore, the PCB's ground potential reference point (reference ground) is connected to the sheet metal housing and then to ground via a Y capacitor. Thus, in the art, safety devices are generally considered beneficial for solving the overall interference problem of power supply equipment. However, the applicant also found that, when electrical components are placed on the back of the PCB in this application, it is precisely the presence of these safety devices that increases the probability of power failure.

[0018] Specifically, placing electrical components on the back of the printed circuit board (PCB) increases the probability of power failure because, compared to placing them on the front, placing them on the back results in the components being too close to the sheet metal housing. When powered on, the components and the housing form a large parasitic capacitance. In high-power power supplies, external interference (such as from the power grid) can cause interference to the grounded housing and conduct power back through it. This interference can then flow back to the electrical components through this parasitic capacitance, forming a loop through the safety devices between the PCB and the housing, interfering with the drive and control of the components and ultimately affecting the entire power supply. In this technical solution, a conductive component is placed between the power amplifier assembly and the housing. The conductive component covers the electrical components on the back of the printed circuit board in the power amplifier assembly, and is directly electrically connected to a reference point with ground potential in the power amplifier assembly. When powered on, parasitic capacitances are formed between the conductive component and the sheet metal housing, and between the conductive component and the electrical components. However, compared to the parasitic capacitance formed between the electrical components and the housing without the conductive component, the two parasitic capacitances formed are larger because the distance between the conductive component and the housing and the electrical components is smaller, and the area of ​​the conductive component is larger. When interference from the sheet metal housing forms a circuit, due to the larger capacitance and lower impedance, this interference will directly enter the reference point with ground potential on the printed circuit board through the conductive component, and then return to the housing through the safety device formed between the ground potential reference point on the printed circuit board and the sheet metal housing, thus bypassing the electrical components. This reduces the interference experienced by the electrical components, reduces the impact on the electrical components, and thus reduces the impact on the entire power supply, reducing the probability of power failure.

[0019] In technical solution two, the power amplifier assembly has a power module and a control module with corresponding functions on the printed circuit board. The components corresponding to the power module and the control module can be set on the front and back of the printed circuit board. At the same time, the projected shape of the conductive parts covers the power module and the control module, so that the conductive parts can protect the power module and the control module that are easily affected by interference, thereby improving the overall anti-interference performance of the power supply.

[0020] In technical solution three, the conductive components are divided into a first conductive part and a second conductive part according to their correspondence with the power module and control module. These two conductive parts are respectively connected to the corresponding reference points with ground potential in the power module and control module. Interference from the housing is dispersed to different locations of the power amplifier components through these two paths, and then fed back to the housing through the capacitor components, reducing the impact of interference on the components on the printed circuit board. Compared with the case without separation, this technical solution reduces the electromagnetic interference caused by the shared ground path between the power module and the control module through physical electrical isolation and independent feedback paths, thereby improving the overall anti-interference performance of the power supply.

[0021] In technical solution four, an electrical connector is provided to ensure a stable electrical connection between the conductive component and the power amplifier assembly. Furthermore, the electrical connector is positioned on the side edge of the conductive component, which facilitates the connection between the power amplifier assembly and the conductive component when the conductive component and the printed circuit board are very close.

[0022] In technical solution five, the conductive component is further away from the printed circuit board, meaning it is closer to the housing. This results in a larger parasitic capacitance and lower impedance between the conductive component and the housing, making it easier for interference to pass through the conductive component and thus reducing the impact on the components on the printed circuit board. Furthermore, the greater distance between the conductive component and the printed circuit board also weakens the electromagnetic coupling between them, thereby reducing the electromagnetic interference from the conductive component to the printed circuit board.

[0023] In technical solution six, the conductive component includes a metal foil. The metal foil has an extremely small thickness and is flexible and deformable. When the distance between the printed circuit board and the housing is very small, the metal foil can be conveniently placed between the printed circuit board and the housing, and a certain gap is formed between the metal foil and both the printed circuit board and the housing.

[0024] In technical solution seven, the conductive component uses a flexible circuit board, the conductive layer of which is made of metal foil, and film layers are set above and below the conductive layer. The thickness of the flexible circuit board is also extremely low, which can be easily placed between the printed circuit board and the housing. The conductive layer plays a conductive role, while the film layer can protect the conductive layer and prevent the conductive layer from being worn or failing.

[0025] In technical solution eight, in addition to placing electrical components on the back of the printed circuit board, electrical components can also be placed on the front of the printed circuit board. Since the distance between the electrical components on the front of the printed circuit board and the housing is greater, external interference has less impact on the electrical components on the front of the printed circuit board. Furthermore, the electrical components on the front of the printed circuit board are low-voltage signal devices, while the electrical components on the back of the printed circuit board are high-voltage signal devices. Low-voltage signal devices are more susceptible to external interference, while high-voltage signal devices are less affected by external interference. Therefore, placing low-voltage signal devices on the front of the printed circuit board can further reduce the overall impact on the power amplifier assembly.

[0026] In technical solution nine, electrical components located on the front side of the printed circuit board are fixed by dispensing adhesive, thereby enhancing the installation firmness of these electrical components.

[0027] In technical solution ten, the conductive component is fixed by filling it with resin material, which prevents the conductive component from shifting and avoids contact between the conductive component and the printed circuit board and the housing. At the same time, the resin material itself has good electrical insulation properties, which can prevent electrical short circuits or leakage. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments are briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a side view schematic diagram of a portion of the structure of the anti-interference power supply provided in an embodiment of the present invention;

[0030] Figure 2 for Figure 1 A schematic diagram of the structure of the conductive component.

[0031] Explanation of key figure labels:

[0032] 1. Power amplifier assembly; 2. Housing; 3. Printed circuit board; 4. Electrical components; 5. Conductive parts; 6. Safety devices; 7. First conductive part; 8. Second conductive part; 9. Electrical connector. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are preferred embodiments of the present invention and should not be considered as excluding other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0034] Unless otherwise expressly defined, the use of terms such as "first," "second," or "third" in the claims, description, and accompanying drawings of this invention is for distinguishing different objects and not for describing a specific order.

[0035] Unless otherwise expressly defined, in the claims, description, and accompanying drawings of this invention, the use of directional terms such as "center," "lateral," "longitudinal," "horizontal," "vertical," "top," "bottom," "inner," "outer," "upper," "lower," "front," "rear," "left," "right," "clockwise," and "counterclockwise" to indicate orientation or positional relationships is based on the orientation and positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this invention.

[0036] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this invention should be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connection, detachable fixed connection, integral connection and fixed connection by other means or components.

[0037] In the claims, description and accompanying drawings of this invention, the terms "comprising," "having," and variations thereof are used to mean "including but not limited to."

[0038] Example

[0039] This invention provides an anti-interference power supply, as described in the following embodiment. Figure 1 The diagram illustrates a portion of the structure of the anti-interference power supply. The power supply includes a housing 2, a power amplifier assembly 1, conductive components 5, and electrical connectors 9. Of course, in specific implementations, the anti-interference power supply may also include other accessories to fulfill its corresponding power supply function; those skilled in the art can select these options according to the actual situation, and they will not be elaborated upon here.

[0040] The housing 2 of the anti-interference power supply is a box-shaped component made of sheet metal, with an internal cavity to house the corresponding accessories for installing the anti-interference power supply. The sheet metal housing 2 is generally made of aluminum alloy. In typical power supply designs, the sheet metal housing 2 is grounded to ensure the safe operation of the power supply.

[0041] The power amplifier assembly 1 of the anti-interference power supply is housed within the housing 2 and is used for power management. It includes a printed circuit board 3 and several electrical components 4 located on the back of the printed circuit board 3. In this embodiment, several electrical components 4 are further provided on the front of the printed circuit board 3. The electrical components 4 here mainly refer to surface mount devices used in the power amplifier assembly 1. Surface mount devices are typically mounted on the circuit board using surface mount technology. Compared to traditional through-hole devices, surface mount devices do not require drilling holes in the circuit board; instead, they are directly mounted on the surface of the circuit board. Common surface mount devices include surface mount resistors, surface mount capacitors, surface mount inductors, surface mount diodes, surface mount transistors, and surface mount integrated circuits.

[0042] When the power amplifier assembly 1 is placed inside the housing 2, the back of its printed circuit board 3, which is the main body of the power amplifier assembly 1, faces one of the inner walls of the housing 2. In a specific embodiment, the power amplifier assembly 1 can be considered as being fixedly placed inside the housing 2 near its back plate, and the extended plane of the printed circuit board 3 of the power amplifier assembly 1 is parallel to the extended plane of the back plate of the housing 2. Typically, to ensure secure installation of the printed circuit board 3, the distance between the back of the printed circuit board 3 and the inner wall of the housing 2 is extremely small. In this embodiment, this distance is approximately between 4mm and 6mm.

[0043] Such a small spacing leads to power supply interference and abnormal power loss when electrical components 4 are placed on the back of the printed circuit board 3. Specifically, safety devices 6 are generally installed in the power supply to improve the overall safety and reliability of the power supply. In this embodiment, the power supply uses safety devices 6 to connect the reference point with ground potential in the power amplifier assembly 1 to the housing 2. The reference point with ground potential is generally located in the circuit of the printed circuit board 3 and can be regarded as the grounding point of each component on the printed circuit board 3 with electrical connection requirements. Of course, since the power amplifier assembly 1 includes electrical modules for implementing different functions, and the corresponding grounding points of these electrical modules may not be the same, multiple reference points with ground potential are set in the power amplifier assembly 1 to meet the corresponding needs. The reference point with ground potential, as a zero potential point, can be used to provide a reference for other voltage measurements and signal transmission in the circuit, and helps to suppress common-mode noise and electromagnetic interference in the circuit.

[0044] Typically, existing power supplies use Y capacitors as safety devices 6 to transfer interference signals generated by the components on the power amplifier assembly 1 to the housing 2 and ground via the printed circuit board 3 and the Y capacitors. However, when the electrical component 4 is located on the back of the printed circuit board 3, the distance between the back of the printed circuit board 3 and the corresponding inner wall of the housing 2 is extremely small. When power is applied, the electrical component 4 and the sheet metal housing 2 form a large parasitic capacitance. In high-power power supply equipment, external interference (such as the power grid) can cause interference to the sheet metal housing 2 connected to ground and be conducted back into the power supply from the sheet metal housing 2. This interference can flow back into the electrical component 4 through this parasitic capacitance, and then form a loop through the safety device 6 between the printed circuit board 3 and the sheet metal housing 2, interfering with the driving and control of the electrical component 4, and thus affecting the entire power supply.

[0045] In this embodiment, a conductive element 5 is provided, which is placed between the back side of the printed circuit board 3 and the inner wall of the housing 2. The conductive element 5 covers the electrical component 4 located on the back side of the printed circuit board 3 in a projection shape on a projection surface parallel to the extension direction of the printed circuit board 3. The conductive element 5 is electrically connected to a reference point with ground potential in the power amplifier assembly 1.

[0046] Specifically, refer to Figure 1The conductive component 5 can be considered as a conductive member with a planar unfolded shape. It is fixed between the back of the printed circuit board 3 and the inner wall of the housing 2. Simultaneously, one end of its side edge is electrically connected to one end of the electrical connector 9, and the other end of the electrical connector 9 is electrically connected to a reference point with ground potential in the power amplifier assembly 1. In this embodiment, the conductive component 5 includes a metal foil, which can be copper foil, having a high conductivity. The metal foil has an extremely small thickness and is flexible and deformable. When the distance between the printed circuit board 3 and the housing 2 is very small, the metal foil can be conveniently placed between the printed circuit board 3 and the housing 2, forming a certain gap between them.

[0047] Furthermore, as a preferred embodiment, the conductive element 5 is a flexible circuit board, and the aforementioned metal foil is the conductor layer in the flexible circuit board. A flexible circuit board typically includes a substrate, a conductor layer, an insulating layer, and a cover layer. The substrate is generally made of polyimide or polyester film to provide good flexibility and insulation properties. In this embodiment, the conductor layer is made of copper foil, and the entire copper foil is conductive. The insulating layer and cover layer can be made of the same material as the substrate to improve the protection capabilities on both sides of the flexible circuit board. The thickness of the flexible circuit board is also extremely low, allowing it to be easily positioned between the printed circuit board 3 and the housing 2. The conductive layer provides conductivity, while the film layer protects the conductive layer, preventing wear and failure.

[0048] The electrical connector 9 can be a wire, a metal foil, or a flexible circuit board. It can be integrally formed with the conductive component 5 or connected to a separate component. In addition, a reference point with ground potential on the printed circuit board 3 is set on the side of the printed circuit board 3. It can be a solderable terminal to facilitate connection and fixation with the electrical connector 9.

[0049] In this embodiment, resin material is filled between the power amplifier assembly 1, the conductive component 5, and the housing 2 to fix the conductive component 5. Fixing the conductive component 5 by filling it with resin material prevents displacement of the conductive component 5 and avoids contact between the conductive component 5 and the printed circuit board 3 and the housing 2. At the same time, the resin material itself has good electrical insulation properties, which can prevent electrical short circuits or leakage.

[0050] When energized, parasitic capacitances are formed between the conductive component 5 and the sheet metal housing 2, and between the conductive component 5 and the electrical component 4. However, compared to the parasitic capacitance formed between the electrical component 4 and the housing 2 when the conductive component 5 is not present, the two parasitic capacitances formed at this time are larger because the distance between the conductive component 5 and the housing 2 and the electrical component 4 is smaller, and the area of ​​the conductive component 5 is larger. When the interference from the sheet metal housing 2 forms a circuit, due to the larger capacitance and smaller impedance, this interference will directly enter the reference point with ground potential on the printed circuit board 3 through the conductive component 5, and then return to the housing 2 through the safety device 6 formed between the ground potential reference point on the printed circuit board 3 and the sheet metal housing 2, thus bypassing the electrical component 4. This reduces the interference received by the electrical component 4, reduces the impact on the electrical component 4, and thus reduces the impact on the entire power supply, reducing the probability of power failure.

[0051] In a preferred embodiment, the conductive element 5 is positioned further away from the printed circuit board 3 and the housing 2, meaning it is closer to the housing 2. This results in a larger parasitic capacitance and lower impedance between the conductive element 5 and the housing 2, making it easier for interference to pass through the conductive element 5 and thus reducing its impact on the components on the printed circuit board 3. Furthermore, the greater distance between the conductive element 5 and the printed circuit board 3 weakens the electromagnetic coupling between them, thereby reducing electromagnetic interference from the conductive element 5 to the printed circuit board 3. Since the conductive element 5 is a planar component, when it is laid flat along the extension direction of the printed circuit board 3, it can be considered parallel to the inner walls of the printed circuit board 3 and the housing 2. In this case, the distance between the conductive element 5 and the printed circuit board 3 and the housing 2 can be determined. Of course, in actual implementation, since the conductive component 5 is a soft metal foil, there may be displacement during the installation of the conductive component 5. In this case, the conductive component 5 may not be strictly parallel to the inner wall of the printed circuit board 3 and the housing 2. This situation still falls within the scope of the above-mentioned technical solution.

[0052] Furthermore, as described above, in this embodiment, in addition to placing electrical components 4 on the back of the printed circuit board 3, electrical components 4 are also placed on the front of the printed circuit board 3. That is, electrical components 4 are placed on both the front and back of the printed circuit board 3. The type of electrical component 4 located on the front of the printed circuit board 3 is a low-voltage signal device, and the type of electrical component 4 located on the back of the printed circuit board 3 is a high-voltage signal device. The electrical component 4 located on the front of the printed circuit board 3 is fixed by dispensing adhesive. Since the distance between the electrical component 4 on the front of the printed circuit board 3 and the housing 2 is larger, external interference has less impact on the electrical component 4 on the front of the printed circuit board 3. Moreover, the electrical component 4 on the front of the printed circuit board 3 is a low-voltage signal device, while the electrical component 4 on the back of the printed circuit board 3 is a high-voltage signal device. Low-voltage signal devices are more susceptible to external interference, while high-voltage signal devices are less affected by external interference. Therefore, placing the low-voltage signal device on the front of the printed circuit board 3 can further reduce the overall impact on the power amplifier assembly 1. Fixing the electrical component 4 located on the front of the printed circuit board 3 by dispensing adhesive enhances the installation firmness of these electrical components 4.

[0053] Furthermore, in the power amplifier assembly 1 of this embodiment, the printed circuit board 3 is also provided with a power module and a control module, wherein the power module is used to perform power conversion and the control module is used to control the power module; and the projection shape of the conductive element 5 on the projection surface covers the power module and the control module.

[0054] Specifically, the key function of power amplifier assembly 1 is to convert the input current into power through the power module, thereby increasing the output power and ensuring the stability of the power supply system. The control module plays a crucial role in controlling the power module, controlling the switching devices within it based on pre-programmed instructions or received control signals. The components used in the power module and control module include the aforementioned electrical components 4, such as surface-mount capacitors and resistors, as well as other corresponding electrical components, such as MOSFETs and IGBTs. These larger components are generally located on the front side of the printed circuit board 3. It should be noted that in power amplifier assembly 1, the power module and control module are separated on the printed circuit board 3; that is, corresponding areas are designated on the printed circuit board 3, and the components of the power module or control module are placed within those areas.

[0055] Reference Figure 2According to the structural characteristics of the power amplifier assembly 1, the conductive component 5 includes a first conductive part 7 corresponding to the position of the power module and a second conductive part 8 corresponding to the position of the control module. The first conductive part 7 and the second conductive part 8 are electrically isolated within the conductive component 5. The first conductive part 7 is electrically connected to a reference point with ground potential in the power module, and the second conductive part 8 is electrically connected to a reference point with ground potential in the control module. Correspondingly, two electrical connectors 9 are provided, which are respectively connected to the first conductive part 7 and the second conductive part 8. Furthermore, both the first conductive part 7 and the second conductive part 8 are formed of metal foil.

[0056] Through this design, interference from housing 2 is dispersed to different locations of power amplifier assembly 1 through these two paths, and then fed back to housing 2 through capacitors, reducing the impact of interference on components on printed circuit board 3. Compared to the case without separation, this technical solution reduces electromagnetic interference between power module and control module caused by shared grounding path through physical electrical isolation and independent feedback path, thereby improving the overall anti-interference performance of the power supply.

[0057] Overall, the anti-interference power supply provided in this embodiment changes the interference transmission path of the housing 2 by setting a conductive element 5 between the printed circuit board 3 and the housing 2 and electrically connecting the conductive element 5 to a reference point with ground potential in the power amplifier assembly 1, thereby reducing interference to the electrical components 4 and lowering the probability of power failure. It not only has low improvement cost, but also effectively improves the problems existing in the current power supply.

[0058] The foregoing description of the specifications and embodiments is intended to explain the scope of protection of this invention, but does not constitute a limitation on the scope of protection of this invention. Modifications, equivalent substitutions, or other improvements to the embodiments of this invention or a portion thereof that can be obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation, based on the teachings of this invention or the foregoing embodiments, in conjunction with common knowledge, general technical knowledge, and / or existing technology, should all be included within the scope of protection of this invention.

Claims

1. An interference-immune power supply comprising a housing (2), characterized in that it further comprises The application relates to a power amplifier assembly. The power amplifier assembly (1) is arranged in the shell (2) and used for power management, and comprises a printed board (3) and a plurality of electrical elements (4) arranged on the back of the printed board (3); the back of the printed board (3) is opposite to an inner wall of the shell (2); and An electrically-conductive part (5) is arranged between the back of the printed board (3) and the inner wall of the shell (2), and the projection shape of the electrically-conductive part (5) on a projection plane parallel to the extension direction of the printed board (3) covers the electrical elements (4) arranged on the back of the printed board (3); the electrically-conductive part (5) is electrically connected with a reference point with a ground potential in the power amplifier assembly (1); The reference point with the ground potential in the power amplifier assembly (1) is electrically connected with the shell (2) through an anprotection device (6); In the power amplifier assembly (1), a power module and a control module are further arranged on the printed board (3); the power module is used for power conversion; and the control module is used for controlling the power module; The electrically-conductive part (5) comprises a first electrically-conductive part (7) corresponding to the position of the power module and a second electrically-conductive part (8) corresponding to the position of the control module; the first electrically-conductive part (7) and the second electrically-conductive part (8) are electrically isolated in the electrically-conductive part (5); the first electrically-conductive part (7) is electrically connected with the reference point with the ground potential in the power module; and the second electrically-conductive part (8) is electrically connected with the reference point with the ground potential in the control module.

2. An interference-immune power supply as claimed in claim 1, characterized in that The projection shape of the electrically-conductive part (5) on the projection plane covers the power module and the control module.

3. An interference-immune power supply as claimed in claim 2, characterized in that An electric connecting part (9) is further arranged, one end of the electric connecting part (9) is electrically connected with the side edge of the electrically-conductive part (5), and the other end of the electric connecting part (9) is electrically connected with the reference point with the ground potential in the power amplifier assembly (1).

4. An interference-immune power supply as claimed in claim 3, characterized in that The position of the electrically-conductive part (5) between the printed board (3) and the shell (2) is farther away from the printed board (3).

5. An interference-immune power supply as claimed in claim 4, characterized in that The electrically-conductive part (5) comprises a metal foil used for forming the first electrically-conductive part (7) and the second electrically-conductive part (8).

6. An interference-immune power supply as claimed in claim 5, characterized in that The electrically-conductive part (5) adopts a flexible circuit board, and the metal foil is a conductor layer in the flexible circuit board.

7. An interference-immune power supply as claimed in claim 6, characterized in that In the power amplifier assembly (1), a plurality of electrical elements (4) are arranged on the front of the printed board (3), and the types of the electrical elements (4) arranged on the front of the printed board (3) are weak electrical signal devices, and the types of the electrical elements (4) arranged on the back of the printed board (3) are strong electrical signal devices.

8. An interference-immune power supply as claimed in claim 7, characterized in that In the power amplifier assembly (1), the electrical elements (4) arranged on the front of the printed board (3) are fixed through a dispensing process.

9. An interference-immune power supply as claimed in any one of claims 5 to 8, characterized in that The power amplifier assembly (1), the electrically-conductive part (5) and the shell (2) are filled with a resin material to fix the electrically-conductive part (5).

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