Display module and display device

Abstract

The invention provides a display module and a display device, the display module comprises a screen body, a chip on film substrate, packaging glue and an adsorption structure, the screen body comprises a display area and a non-display area, the non-display area comprises a bonding area, and the bonding area is provided with a first bonding pad; the chip-on-film substrate is located on one side of the screen body, a second bonding pad is arranged on the side, close to the screen body, of the chip-on-film substrate, and at least part of the second bonding pad is connected with the first bonding pad; the packaging adhesive is connected to the screen body and the chip-on-film substrate; the adsorption structure is arranged between the screen body and the chip on film substrate; wherein the orthographic projection of the adsorption structure on the chip-on-film substrate is located between the orthographic projection of the first bonding pad on the chip-on-film substrate and the orthographic projection of the packaging adhesive on the chip-on-film substrate. According to the display module, the water vapor entering from the gap of the packaging adhesive is adsorbed through the adsorption structure, so that the water vapor is prevented from invading the second bonding pad to cause a corrosion reaction, and the problem of display dark lines caused by short circuit of the second bonding pad is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) is an active light-emitting device with a sandwich structure consisting of multiple organic layers and electrodes on both sides. Currently, display screens based on AMOLED (Active-matrix organic light-emitting diode) have been commercialized in the fields of smartphones, watches, and laptops.

[0003] However, the performance of existing display screens needs to be improved. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a display module and a display device to prevent the problem of dark lines on the display caused by the intrusion of water vapor.

[0005] Based on the above objectives, the present application provides a display module, which includes:

[0006] The screen body comprises a display area and a non-display area, wherein the non-display area comprises a bonding area, and the bonding area is provided with a first pad;

[0007] A chip-on-film substrate is located at one side of the screen body, a second pad is provided on the side of the chip-on-film substrate close to the screen body, and at least a part of the second pad is connected to the first pad;

[0008] Packaging glue, connected to the screen body and the chip-on-film substrate;

[0009] An adsorption structure is arranged between the screen body and the COF substrate; wherein the orthographic projection of the adsorption structure on the COF substrate is located between the orthographic projection of the first pad on the COF substrate and the orthographic projection of the packaging glue on the COF substrate.

[0010] In one embodiment, the display module further includes:

[0011] A conductive adhesive layer, wherein the conductive adhesive layer is located between the first pad and the second pad, and the first pad and the second pad are electrically connected via the conductive adhesive layer;

[0012] Preferably, the orthographic projection of the adsorption structure on the COF substrate is located between the orthographic projection of the conductive adhesive layer on the COF substrate and the orthographic projection of the packaging adhesive on the COF substrate;

[0013] Preferably, the conductive adhesive layer includes an anisotropic conductive film, and the anisotropic conductive film includes conductive particles.

[0014] In one embodiment,

[0015] The first pad and the second pad extend along a first direction, the adsorption structure extends along a second direction, the first direction and the second direction are parallel to the plane where the COF substrate is located, and the first direction and the second direction are perpendicular to each other;

[0016] Preferably, a size of the adsorption structure in the second direction is greater than or equal to a size of the second pad in the second direction.

[0017] In one embodiment, the adsorption structure includes a main body, and a plurality of adsorption holes are provided on the main body;

[0018] Preferably, the adsorption hole passes through the main body;

[0019] Preferably, the adsorption hole penetrates the main body along a third direction, and the third direction is perpendicular to the plane where the chip-on-film substrate is located.

[0020] In one embodiment, the adsorption hole includes a capillary channel, the capillary channel includes a hydrophobic portion and a hydrophilic portion, the hydrophobic portion is at least partially in contact with the second pad, and the hydrophilic portion is at least partially in contact with the screen body.

[0021] In one embodiment, the display module further includes:

[0022] a driving module, located on a side of the second pad away from the COF substrate and on a side of the adsorption structure away from the display area, the driving module being electrically connected to the second pad;

[0023] a solder resist layer, located at a side of the second solder pad away from the COF substrate, wherein the orthographic projection of the driving module on the COF substrate is located within the orthographic projection of the solder resist layer on the COF substrate;

[0024] Preferably, the solder resist layer comprises solder resist ink;

[0025] Preferably, an orthographic projection of the encapsulation adhesive on the COF substrate at least partially overlaps with an orthographic projection of the solder resist layer on the COF substrate.

[0026] In one embodiment, one end of the screen body away from the display area includes a cutting edge, and the orthographic projection of the cutting edge on the COF substrate is located within the orthographic projection of the packaging glue and the adsorption structure on the COF substrate.

[0027] In one embodiment, the display module further includes:

[0028] A substrate, located at a side of the screen body away from the chip-on-film substrate;

[0029] The supporting film layer is located at a side of the substrate away from the screen body.

[0030] In one embodiment, the display module includes a plurality of the second pads, and the plurality of the second pads are arranged on the chip-on-film substrate at intervals;

[0031] Preferably, the material of the second pad includes copper.

[0032] Based on the same inventive concept, the present application also discloses a display device, which includes any one of the display modules described above.

[0033] Compared with the prior art, the display module provided by the present application, by setting an adsorption structure between the screen body and the chip-on-film substrate, and the adsorption structure is also located between the first pad and the packaging glue, so as to adsorb water vapor entering through the gap of the packaging glue, and prevent the water vapor from invading the second pad and causing corrosion reaction, thereby solving the problem of dark lines in the display caused by the short circuit of the second pad, thereby improving the performance and the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 is a schematic diagram of a related display module;

[0036] Figure 2 is a schematic diagram of a layer structure of a related display module;

[0037] Figure 3 A schematic diagram of the layer structure of a display module provided in one embodiment of the present application;

[0038] Figure 4 A schematic diagram of a display module provided in one embodiment of the present application;

[0039] Figure 5 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application;

[0040] Figure 6 A schematic diagram of an adsorption structure of a display module provided in another embodiment of the present application;

[0041] Figure 7 A partial schematic diagram of an adsorption structure of a display module provided by another embodiment of the present application;

[0042] Figure 8 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application;

[0043] Fig. 9 A schematic diagram of a display module provided in another embodiment of the present application;

[0044] Fig.10 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application.

[0045] Marking Description:

[0046] 100, display module; 101, display area; 102, non-display area; 103, bonding area; 104, cutting edge;

[0047] 10. Screen body; 11. First solder pad; 12. Substrate; 13. Support film layer; 20. Chip-on-film substrate; 21. Second solder pad; 30. Drive module; 40. Circuit board; 50. Packaging glue; 60. Adsorption structure; 61. Main body; 62. Adsorption hole; 621. Hydrophobic part; 622. Hydrophilic part; 70. Conductive glue layer; 80. Solder resist layer. DETAILED DESCRIPTION

[0048] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0049] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0050] With the development of new energy and smart driving cars, the demand for in-vehicle displays is increasing. Similarly, the demand for OLED in-vehicle displays in high-end models is also increasing. Therefore, the RA (Reliability Analysis) experimental characteristics of OLED displays also appear simultaneously. For example, in the in-vehicle display demand test, the screen display is prone to display dark lines, affecting the display performance.

[0051] For details, please refer to Figure 1 , Figure 2 As shown, a related display module 100 includes a screen body 10, a chip-on-film substrate 20, a driving module 30 and a circuit board 40, wherein the screen body 10 includes a display area 101 and a non-display area 102, the non-display area 102 includes a bonding area 103, a first pad 11 is arranged on the screen body 10, a second pad 21 is arranged on the chip-on-film substrate 20, a driving module 30 is arranged on the second pad 21, the driving module 30 is connected to the circuit board 40 via the second pad 21, and in the bonding area 103, the first pad 11 is electrically connected to the second pad 21.

[0052] In the vehicle display demand test, specifically in the high temperature and high humidity test, a 1000h test was carried out under environmental conditions of 65°C and 93% RH. Vertical dark lines will appear on the screen 10 of the vehicle-mounted OLED. The inventors have found that a packaging glue 50 is provided between the screen 10 and the second pad 21. A gap is easily generated between the packaging glue 50 and the end of the screen 10. Water vapor enters between the screen 10 and the second pad 21 through the gap, and reacts with the second pad 21 to corrode, resulting in a short circuit in the second pad 21, thereby causing the problem of displaying dark lines.

[0053] Based on this, the present application provides a display module solution to solve the above technical problems.

[0054] Please refer to Figure 3 , Figure 4 As shown, an embodiment of the present application discloses a display module 100 , which includes a screen body 10 , a COF substrate 20 , a packaging adhesive 50 and an adsorption structure 60 .

[0055] The screen body 10 includes a display area 101 and a non-display area 102, the non-display area 102 includes a bonding area 103, and the bonding area 103 is provided with a first pad 11. The chip-on-film substrate 20 is located at one side of the screen body 10, and a second pad 21 is provided on the side of the chip-on-film substrate 20 close to the screen body 10. The packaging glue 50 is connected to the screen body 10 and the chip-on-film substrate 20. The adsorption structure 60 is arranged between the screen body 10 and the chip-on-film substrate 20.

[0056] The orthographic projection of the adsorption structure 60 on the COF substrate 20 is located between the orthographic projection of the first pad 11 on the COF substrate 20 and the orthographic projection of the packaging glue 50 on the COF substrate 20 .

[0057] Exemplarily, the encapsulation glue 50 is simultaneously connected to the screen body 10 and the COF substrate 20, and the encapsulation glue 50 can cover the end of the screen body 10 away from the display area 101, and the encapsulation glue 50 is also simultaneously connected to the screen body 10 and the COF substrate 20. The first pad 11 can correspond to the pin in the bonding area 103 of the screen body 10, and the second pad 21 can correspond to the pin of the COF substrate 20. The length extension direction of the first pad 11 and the second pad 21 can be defined as the first direction (such as the X direction in the figure), the direction perpendicular to the plane where the COF substrate 20 is located is the third direction (such as the Z direction in the figure), and the second direction (such as the Y direction in the figure) is perpendicular to the first direction and the third direction. In this embodiment, in the third direction, the adsorption structure 60 is located between the screen body 10 and the COF substrate 20; in the first direction, the adsorption structure 60 is located between the first pad 11 and the encapsulation glue 50.

[0058] The display module 100 provided in the embodiment of the present application can adsorb water vapor entering between the screen body 10 and the chip-on-film substrate 20, and between the first soldering pad 11 and the packaging glue 50 by setting an adsorption structure 60, so as to prevent water vapor in the environment from invading the second soldering pad 21 through the gap between the packaging glue 50 and the screen body 10 and causing corrosion reaction, thereby solving the problem of dark lines in the display caused by short circuit of the second soldering pad 21 and improving the display performance.

[0059] Reference Figure 5As shown, in one embodiment, the display module 100 further includes a conductive adhesive layer 70, which is located between the first pad 11 and the second pad 21, and the first pad 11 and the second pad 21 are electrically connected through the conductive adhesive layer 70. The first pad 11 and the second pad 21 are electrically connected through the conductive adhesive layer 70, thereby ensuring the reliability of the bonding connection between the screen body 10 and the COF substrate 20. Specifically, the conductive adhesive layer 70 has a bonding portion corresponding to the bonding area 103 and a bonding portion outside the bonding area 103.

[0060] Preferably, the orthographic projection of the adsorption structure 60 on the COF substrate 20 is located between the orthographic projection of the conductive adhesive layer 70 on the COF substrate 20 and the orthographic projection of the encapsulation adhesive 50 on the COF substrate 20. The adsorption structure 60 blocks the side of the conductive adhesive layer 70 close to the encapsulation adhesive 50, further preventing the water vapor at the location of the encapsulation adhesive 50 from entering the second pad 21 along the conductive adhesive layer 70.

[0061] Preferably, the conductive adhesive layer 70 includes an anisotropic conductive film, which includes conductive particles. The anisotropic conductive film is a transparent polymer connecting material having three major properties: bonding, conductivity, and insulation. It is electrically conductive in one direction and insulated in a plane perpendicular to the electrical conductive direction. The anisotropic conductive film uses conductive particles to connect the electrodes between the first pad 11 and the second pad 21 to make them conductive, while avoiding conductive short circuits between the electrodes in adjacent first pads 11 or second pads 21.

[0062] Optionally, in addition to the anisotropic conductive film, the conductive adhesive layer 70 may also be an isotropic conductive adhesive, which is used to connect the paired electrodes corresponding to the single first pad 11 and the single second pad 21. In other embodiments, the first pad 11 and the second pad 21 may also be directly connected by welding.

[0063] Reference Figures 3 to 7 As shown, in one embodiment, the first pad 11 and the second pad 21 extend along a first direction X, and the adsorption structure 60 extends along a second direction Y, wherein the first direction X and the second direction Y are parallel to the plane where the COF substrate 20 is located, and the first direction X and the second direction Y are perpendicular to each other.

[0064] Specifically, the adsorption structure 60 is a long strip structure, and the coverage area of ​​the adsorption structure 60 is large.

[0065] Preferably, the size of the adsorption structure 60 in the second direction is greater than or equal to the size of the second pad 21 in the second direction. The length of the adsorption structure 60 is not less than the width of the second pad 21 on the COF substrate 20, and the adsorption structure 60 can provide a wider range of water vapor protection for the corresponding second pad 21.

[0066] Reference Figure 6 As shown, in one embodiment, the adsorption structure 60 includes a main body 61, and a plurality of adsorption holes 62 are arranged on the main body 61. The adsorption structure 60 is made of porous material to ensure a good water vapor adsorption effect.

[0067] Preferably, the adsorption hole 62 penetrates the main body 61 along the third direction Z. Specifically, the third direction Z is perpendicular to the plane where the COF substrate 20 is located, that is, the adsorption hole 62 penetrates the main body 61 along a direction perpendicular to the COF substrate 20. The adsorption hole 62 penetrating the main body 61 is provided to fully absorb the water vapor entering between the second pad 21 and the screen body 10, thereby preventing the water vapor from corroding the second pad 21.

[0068] Reference Figure 7 As shown, in one embodiment, the adsorption hole 62 includes a capillary channel, and the capillary channel includes a hydrophobic portion 621 and a hydrophilic portion 622, wherein the hydrophobic portion 621 at least partially contacts the second pad 21, and the hydrophilic portion 622 at least partially contacts the screen body 10. The hydrophobic portion 621 located on the side where the second pad 21 is located does not infiltrate water vapor, and according to the capillary phenomenon, the water vapor will go downward, away from the side where the second pad 21 is located, and will not react with the second pad 21 to corrode; the hydrophilic portion 622 located on the side where the screen body 10 is located can absorb water vapor from the gap of the packaging glue 50 according to the capillary phenomenon, and prevent the water vapor from extending to other places.

[0069] Reference Figure 8 , Fig. 9 As shown, in one embodiment, the display module further includes a driving module 30, the driving module 30 is located on a side of the second pad 21 away from the COF substrate 20, and the driving module 30 is located on a side of the adsorption structure 60 away from the display area 101, and the driving module 30 is electrically connected to the second pad 21. The driving module 30 is connected to the first pad 11 through the second pad 21, thereby realizing the communication connection between the driving module 30 and the screen body 10. Specifically, the driving module 30 includes a driving chip IC.

[0070] Further, the display module further includes a solder resist layer 80, the solder resist layer 80 is located on a side of the second pad 21 away from the COF substrate 20, and the orthographic projection of the driving module 30 on the COF substrate 20 is located inside the orthographic projection of the solder resist layer 80 on the COF substrate 20. Specifically, the solder resist layer 80 is disposed around the driving module 30 to ensure the reliability of the connection between the driving module 30 and the second pad 21.

[0071] Preferably, the solder resist layer 80 includes solder resist ink. Specifically, the solder resist ink is used as a solder resist, and in the driver chip IC packaging process, the solder resist is usually used to protect the circuit board area around the driver chip IC. Since the pins of the driver chip IC are very dense, if the solder resist is not used for protection, it is easy to short-circuit during the welding process. Therefore, coating the surrounding area of ​​the driver module 30 on the second pad 21 with solder resist can improve the accuracy and reliability of the welding package.

[0072] Preferably, the orthographic projection of the encapsulant 50 on the COF substrate 20 at least partially overlaps with the orthographic projection of the solder resist layer 80 on the COF substrate 20. The encapsulant 50 at least partially covers the solder resist layer 80 to prevent moisture from entering the second pad 21 from the solder resist layer 80.

[0073] Reference Figure 8 As shown, in one embodiment, one end of the screen body 10 away from the display area 101 includes a cutting edge 104, and the orthographic projection of the cutting edge 104 on the COF substrate 20 is located inside the orthographic projection of the encapsulation glue 50 and the adsorption structure 60 on the COF substrate 20. When the cutting edge 104 of the screen body 10 is cut, hot melt electrons and metal chips may be generated, and the encapsulation glue 50 and the adsorption structure 60 overlap with the cutting edge 104, which not only prevents external water vapor from invading the second pads 21, but also prevents the short circuit phenomenon between the second pads 21 caused by hot melt electrons or metal chips, thereby further improving the display performance.

[0074] Reference Fig.10 As shown, in one embodiment, the display module further includes a substrate 12 and a supporting film layer 13, wherein the substrate 12 is located on a side of the screen body 10 away from the COF substrate 20, and the supporting film layer 13 is located on a side of the substrate 12 away from the screen body 10. Specifically, the material of the substrate 12 includes PI (polyimide).

[0075] Reference Fig.10 As shown, in one embodiment, the display module 100 includes a plurality of second pads 21, and the plurality of second pads 21 are disposed at intervals on the COF substrate 20. Specifically, the plurality of second pads 21 are arranged at intervals along the second direction Y.

[0076] Preferably, the material of the second pad 21 includes copper.

[0077] Specifically, a plurality of second pads 21 arranged side by side on the COF substrate 20 form a "gold finger". Accordingly, a plurality of first pads 11 are provided on the screen body 10, and the first pads 11 correspond to the second pads 21 one by one. The width of the first pad 11 may be greater than the width of the second pad 21.

[0078] Specifically, the first pad 11 is located on the side of the cutting edge 104 close to the display area 101, and the first pad 11 and the second pad 21 are bonded in the bonding area 103. The packaging glue 50 is UV (ultraviolet) sealing glue, and UV light can be irradiated from one side of the screen body 10 to cure the UV sealing glue. A gap is easily formed between the cutting edge 104 and the encapsulation glue 50. Water vapor in the external environment may enter the area between the screen body 10 and the COF substrate 20 through the gap along the encapsulation glue 50. In this area, the second pad 21 has an unbonded portion that exceeds the screen body 10. If water vapor invades the unbonded portion of the second pad 21, it will react with the second pad 21 to cause a short circuit in the adjacent second pad 21. Since the present application sets an adsorption structure 60 between the screen body 10 and the COF substrate 20 and on the side of the encapsulation glue 50 close to the display area 101, it can adsorb water vapor invading from the gap of the encapsulation glue 50, thereby preventing the adjacent second pad 21 from being corroded and short-circuited. In addition, the insulating structure formed by the solder mask 80, the encapsulation glue 50 and the adsorption structure 60 together covers or wraps the unbonded portion of the second pad 21, thereby achieving water vapor and insulation protection.

[0079] Another embodiment of the present application discloses a display device, which includes the display module 100 in the above embodiment.

[0080] Furthermore, the display device includes a mobile phone, a VR device, a computer, a television, a vehicle-mounted display device, etc.

[0081] A display device provided in this embodiment has a display module 100 in which an adsorption structure 60 is arranged between the screen body 10 and the COF substrate 20 and between the first pad 11 and the packaging glue 50. The adsorption structure 60 can adsorb water vapor entering through the gap of the packaging glue 50 to prevent the water vapor from invading the second pad 21 and causing corrosion reaction, thereby solving the problem of dark lines in the display caused by the short circuit of the second pad 21 and improving the display performance.

[0082] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0083] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0084] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A display module, characterized in that: include: The screen body comprises a display area and a non-display area, wherein the non-display area comprises a bonding area, and the bonding area is provided with a first pad; A chip-on-film substrate is located at one side of the screen body, a second pad is provided on the side of the chip-on-film substrate close to the screen body, and at least a part of the second pad is connected to the first pad; Packaging glue, connected to the screen body and the chip-on-film substrate; An adsorption structure is arranged between the screen body and the COF substrate; wherein the orthographic projection of the adsorption structure on the COF substrate is located between the orthographic projection of the first pad on the COF substrate and the orthographic projection of the packaging glue on the COF substrate.

2. The display module according to claim 1, characterized in that: The display module also includes: A conductive adhesive layer, wherein the conductive adhesive layer is located between the first pad and the second pad, and the first pad and the second pad are electrically connected via the conductive adhesive layer; Preferably, the orthographic projection of the adsorption structure on the COF substrate is located between the orthographic projection of the conductive adhesive layer on the COF substrate and the orthographic projection of the packaging adhesive on the COF substrate; Preferably, the conductive adhesive layer includes an anisotropic conductive film, and the anisotropic conductive film includes conductive particles.

3. The display module according to claim 1, characterized in that the first pad and the second pad extend along a first direction, the adsorption structure extends along a second direction, the first direction and the second direction are parallel to the plane where the COF substrate is located, and the first direction and the second direction are perpendicular to each other; Preferably, a size of the adsorption structure in the second direction is greater than or equal to a size of the second pad in the second direction.

4. The display module according to claim 1, characterized in that: The adsorption structure comprises a main body, and a plurality of adsorption holes are arranged on the main body; Preferably, the adsorption hole passes through the main body; Preferably, the adsorption hole penetrates the main body along a third direction, and the third direction is perpendicular to the plane where the chip-on-film substrate is located.

5. The display module according to claim 4, characterized in that: The adsorption hole includes a capillary channel, and the capillary channel includes a hydrophobic portion and a hydrophilic portion. The hydrophobic portion is at least partially in contact with the second pad, and the hydrophilic portion is at least partially in contact with the screen body.

6. The display module according to claim 1, characterized in that: The display module also includes: a driving module, located at a side of the second pad away from the COF substrate and at a side of the adsorption structure away from the display area, the driving module being electrically connected to the second pad; A solder resist layer is located on a side of the second pad away from the COF substrate, and an orthographic projection of the driving module on the COF substrate is located within an orthographic projection of the solder resist layer on the COF substrate; Preferably, the solder resist layer comprises solder resist ink; Preferably, an orthographic projection of the encapsulation adhesive on the COF substrate at least partially overlaps with an orthographic projection of the solder resist layer on the COF substrate.

7. The display module according to claim 1, characterized in that: One end of the screen body away from the display area comprises a cutting edge, and the orthographic projection of the cutting edge on the COF substrate is located within the orthographic projection of the packaging glue and the adsorption structure on the COF substrate.

8. The display module according to claim 1, characterized in that: The display module also includes: A substrate, located at a side of the screen body away from the chip-on-film substrate; The supporting film layer is located at a side of the substrate away from the screen body.

9. The display module according to claim 1, characterized in that: The display module comprises a plurality of the second pads, and the plurality of the second pads are arranged on the chip-on-film substrate at intervals; Preferably, the material of the second pad includes copper.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-9.

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