Electronic device comprising microstrip transmission line

Abstract

According to an embodiment of the present disclosure, an electronic device includes: a housing; a circuit board accommodated in the housing; the first plate is at least partially arranged opposite to the circuit board in the shell; a transmission line disposed on a first surface of the two surfaces of the first board and electrically connected to the circuit board; a ground conductor disposed on a second surface of the two surfaces of the first board and electrically connected to the circuit board; and a radiating conductor pattern disposed on one of the first surface and the second surface and electrically connected to one end of the transmission line. The transmission line is arranged to at least partially overlap the ground conductor when viewed from one of the first surface and the second surface, and is configured to transmit a wireless signal transmitted or received through the radiating conductor pattern.

Description

Technical Field

[0001] An embodiment of the present disclosure relates to an electronic device, for example, an electronic device including a transmission line using a microstrip line. Background Art

[0002] Typically, an electronic device may refer to a device (e.g., an electronic scheduler, a portable multimedia player, a mobile communication terminal, a tablet computer, an image / sound device, a desktop / laptop computer, or a vehicle navigation system) and a household appliance that performs a specific function according to a program set therein. For example, these electronic devices may output information stored therein as sound or image. With the increasing degree of integration of electronic devices and the popularization of ultra-high-speed or high-capacity wireless communications, various functions may be provided in a single electronic device such as a mobile communication terminal recently. For example, in addition to the communication function, various functions such as entertainment functions such as games, multimedia functions such as music / video playback, or communication and security functions for mobile banking, etc. and / or functions of schedule management or electronic wallets are also integrated into a single electronic device. With the increasing degree of integration of electronic devices, portability is also improved, which has led to the commercialization of wearable electronic devices such as watch-type or glasses-type electronic devices, which can make electronic devices more convenient to carry and use.

[0003] The above information is provided as background technology to assist in understanding the present disclosure. No claim or determination is made as to whether any of the above content may be applied as prior art with respect to the present disclosure. Summary of the invention

[0004] According to an embodiment, an electronic device includes: a housing; a circuit board accommodated in the housing; a first board disposed in the housing to at least partially face the circuit board; a transmission line disposed on one of the opposite surfaces of the first board (hereinafter, "the first surface") and electrically connected to the circuit board; a ground conductor disposed on the other of the opposite surfaces of the first board (hereinafter, "the second surface") and electrically connected to the circuit board; and a radiation conductor pattern disposed on one of the first surface and the second surface and electrically connected to one end of the transmission line. When viewed from one of the first surface and the second surface, the transmission line is disposed to at least partially overlap the ground conductor, and the transmission line is configured to transmit a wireless communication signal sent or received via the radiation conductor pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] The above or other aspects, configurations and / or advantages of embodiments of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0006] Figure 1is a perspective view showing an electronic device viewed from the front side according to an embodiment of the present disclosure.

[0007] Figure 2 FIG. 1 is a diagram showing an embodiment of the present disclosure viewed from the rear side. Figure 1 A perspective view of an electronic device.

[0008] Figure 3 1 is a diagram showing an embodiment of the present disclosure viewed from the front side. Figure 1 An exploded perspective view of an electronic device.

[0009] Figure 4 FIG. 1 is a diagram showing an embodiment of the present disclosure viewed from the rear side. Figure 1 An exploded perspective view of an electronic device.

[0010] Figure 5 The embodiment according to the present disclosure is shown along Figure 2 A view of the electronic device cut along the line A-A' in FIG.

[0011] Figure 6 is a view illustrating a first surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0012] Figure 7 is a view illustrating a second surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0013] Figure 8 is a view illustrating a first surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0014] Fig. 9 The embodiment according to the present disclosure is shown along Figure 8 A view of the first board of the electronic device cut along the line CC'.

[0015] Fig.10 The embodiment according to the present disclosure is shown along Figure 2 A view of the electronic device cut along the line BB' in FIG.

[0016] Fig.11 is a view illustrating a first surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0017] Fig.12 is a view illustrating a second surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0018] Fig.13 is a view illustrating a first surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0019] Fig.14is a view illustrating a second surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0020] Fig.15 is a view illustrating a first surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0021] Fig.16 is a view illustrating a second surface of a first board of an electronic device according to an embodiment of the present disclosure.

[0022] Fig.17 The embodiment according to the present disclosure is shown along Figure 2 A view of the electronic device cut along the line A-A' in FIG.

[0023] Throughout the drawings, like reference numbers may be assigned to like parts, components and / or structures. DETAILED DESCRIPTION

[0024] As the use of portable electronic devices such as mobile communication terminals or tablet personal computers (PCs) becomes widespread, competition for miniaturization and lightweighting of electronic devices is becoming increasingly fierce. For example, since electronic devices have a narrow internal space, the degree of freedom of design may be reduced in arranging various electrical / electronic components or realizing an antenna structure (e.g., a radiating conductor and / or a transmission line between the radiating conductor and a communication circuit).

[0025] Embodiments of the present disclosure may provide an electronic device that improves the degree of design freedom in antenna structure arrangement by using a microstrip transmission line.

[0026] Embodiments of the present disclosure may provide an electronic device including a transmission line having a stable operating environment while being easily arranged in a narrow internal space.

[0027] The technical problems to be solved by the present disclosure are not limited to the above-mentioned technical problems, and other technical problems not described above can be clearly understood by ordinary technicians in the relevant fields to which the present disclosure belongs.

[0028] According to an embodiment of the present disclosure, by arranging a transmission line and / or a radiation conductor pattern using a microstrip line on a board provided in a housing, an antenna structure can be easily implemented or arranged even in a narrow space. In an embodiment, since a transmission line (or a radiation conductor pattern) can be formed on a board by printing, plating, deposition, or laser direct structuring (LDS) process, the degree of freedom in designing the shape or position of the transmission line (or radiation conductor pattern) can be increased. In an embodiment, by arranging a ground conductor corresponding to the transmission line on the board, a stable transmission environment for a feed signal can be provided.

[0029] Effects that can be obtained through the embodiments of the present disclosure are not limited to the above-described effects, and other effects not described above may be clearly understood by a person of ordinary skill in the art to which the present disclosure pertains based on the following description.

[0030] The following description with reference to the accompanying drawings may provide an understanding of various exemplary embodiments of the present disclosure (including claims and their equivalents). The exemplary embodiments disclosed in the following description include various specific details to aid understanding, but are considered to be one of various exemplary embodiments. Therefore, it is apparent to those skilled in the art that various changes and modifications may be made to the various embodiments described herein without departing from the scope of the present disclosure. In addition, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0031] The terms and words used in the following description and claims are not limited to the bibliographic meanings, but can be used to clearly and consistently describe the embodiments of the present disclosure. Therefore, it is apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for the purpose of explanation and not for limiting the disclosure which is defined as the scope of the rights and their equivalents.

[0032] It should be understood that unless the context clearly indicates otherwise, the singular includes the plural. Thus, for example, "a component surface" may be understood to include one or more surfaces of a component.

[0033] The electronic device according to an embodiment of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the above-mentioned electronic devices.

[0034] It will be understood that the embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms with respect to the corresponding embodiments. In conjunction with the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related components. It will be understood that, unless the relevant context clearly indicates otherwise, the noun in the singular form corresponding to the project may include one or more things. As used in the present disclosure, each of "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "first" or "second" may only be used to distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "coupled with" another element (e.g., a second element), "coupled to" another element (e.g., a second element), "connected with" another element (e.g., a second element), or "connected to" another element (e.g., a second element), with or without the terms "operably" or "communicatively", it means that the element may be coupled with the other element directly (e.g., wired), wirelessly, or via a third element.

[0035] As used in conjunction with the embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or part of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0036] Embodiments of the present disclosure may be implemented as software (program) including one or more instructions stored in a storage medium (e.g., an internal memory or an external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., the processor) of a machine (e.g., an electronic device) may call and run at least one of the one or more instructions stored in the storage medium. This allows the machine to be operated to perform at least one function according to at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish whether the data is semi-permanently stored in the storage medium or temporarily stored in the storage medium.

[0037] The method according to the embodiment of the present disclosure may be included and set in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a CD-ROM) or distributed via an application store (e.g., PlayStore). TM ) online distribution (e.g. download or upload), or directly between two user devices (e.g. smartphones). If distributed online, at least a part of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a relay server.

[0038] According to an embodiment, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to an embodiment, one or more of the above-mentioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may still perform one or more functions of the corresponding components in the multiple components in the same or similar manner as the manner in which the functions are performed by each of the multiple components before integration. According to an embodiment, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0039] In the following detailed description, the length direction, width direction and / or thickness direction of the electronic device may be mentioned, wherein the length direction may be defined as the "Y-axis direction", the width direction may be defined as the "X-axis direction", and / or the thickness direction may be defined as the "Z-axis direction". In an embodiment, "negative / positive (- / +)" may be mentioned together with the Cartesian coordinate system shown in the figure regarding the component orientation direction. For example, the front surface or housing of the electronic device may be defined as the "surface facing the +Z direction", and the rear surface may be defined as the "surface facing the -Z direction". In an embodiment, the side surface and / or housing of the electronic device may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, or an area facing the -Y direction. In an embodiment, the "X-axis direction" may include the "-X direction" and the "+X direction". It should be noted that for the sake of brevity of description, these are based on the Cartesian coordinate system described in the accompanying drawings, and the description of these directions or components does not limit the various embodiments of the present disclosure. For example, the direction the front surface or the rear surface faces may vary depending on a state in which the electronic device is placed on a plane or a relative alignment state of a shell when the electronic device includes multiple shells, and the above direction may be understood differently according to a user's gripping habits.

[0040] Figure 1 is a perspective view showing the electronic device 100 viewed from the front side according to an embodiment of the present disclosure. Figure 2 FIG. 1 is a diagram showing an embodiment of the present disclosure viewed from the rear side. Figure 1 1 is a perspective view of an electronic device 100.

[0041] Reference Figure 1 and Figure 2 , the electronic device 100 according to the embodiment may include a housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B. In an embodiment (not shown), the housing 110 may refer to a defined Figure 1 The first surface 110A and Figure 2The structure of some of the second surface 110B and the side surface 110C. According to an embodiment, at least a portion of the first surface 110A may be constructed with a substantially transparent front surface plate 102 (e.g., a glass plate or a polymer plate including various coatings). The second surface 110B may be constructed with a substantially opaque rear surface plate 111. The rear surface plate 111 may be made of, for example, coated or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of two or more of these materials. The side surface 110C may be constructed with a side surface structure 118 (e.g., a "side frame structure") connected to the front surface plate 102 and the rear surface plate 111 and including a metal and / or a polymer. In an embodiment, the rear surface plate 111 and the side surface structure 118 may be constructed integrally with each other and may include the same material (e.g., a metal material such as aluminum).

[0042] Although not shown, the front surface plate 102 may include an area extending seamlessly from at least a portion of the edge toward the rear surface plate 111. In an embodiment, the front surface plate 102 (or the rear surface plate 111) may include only one of the areas bent and extended toward the rear surface plate 111 (or the front surface plate 102) at one side edge of the first surface 110A. According to an embodiment, the front surface plate 102 or the rear surface plate 111 may have a substantially flat plate-like shape, in which case the bending and extension area may not be included. When the bending and extension area is included, the thickness of the electronic device 100 in the portion including the bending and extension area may be less than the thickness of other portions.

[0043] According to an embodiment, the electronic device 100 may include at least one of the display 101, the audio module 103, the audio module 107, and the audio module 114, the sensor module 104, and the sensor module 119, the camera module 105, the camera module 112, and the camera module 113, the key input device 117, the light emitting element 106, and the connector hole 108 and the connector hole 109. In an embodiment, in the electronic device 100, at least one of the components (for example, the key input device 117 or the light emitting element 106) may be omitted, or other components may be additionally included.

[0044] The display 101 may be exposed through, for example, a majority of the front surface plate 102. In an embodiment, at least a portion of the display 101 may be exposed through the front surface plate 102 defining the first surface 110A or through a portion of the side surface 110C. In an embodiment, the edge of the display 101 may be configured to have substantially the same shape as the periphery of the adjacent front surface plate 102. In an embodiment (not shown), in order to expand the exposed area of ​​the display 101, the distance between the periphery of the display 101 and the periphery of the front surface plate 102 may be substantially constant.

[0045] In an embodiment (not shown), a groove or opening may be provided in some parts of the screen display area of ​​the display 101, and one or more of the audio module 114, the sensor module 104, the camera module 105, and the light emitting element 106 may be aligned with the groove or opening. In an embodiment (not shown), the rear surface of the screen display area of ​​the display 101 may include at least one of the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor (not shown), and the light emitting element 106. In an embodiment (not shown), the display 101 may be connected to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus, or may be provided adjacent to the touch-sensitive circuit, the pressure sensor, and / or the digitizer. In an embodiment, at least some of the sensor modules 104 and 119 and / or at least some of the key input devices 117 may be provided in the first area 110D and / or the second area 110E.

[0046] The audio module 103, the audio module 107, and the audio module 114 may include a microphone hole 103 and speaker holes 107 and 114. The microphone hole 103 may include a microphone disposed therein to obtain external sound, and in an embodiment, a plurality of microphones may be disposed therein to be able to detect the direction of the sound. The speaker hole 107 and the speaker hole 114 may include an external speaker hole 107 and a call receiver hole 114. In an embodiment, the speaker hole 107 and the speaker hole 114 and the microphone hole 103 may be implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without the speaker hole 107 and the speaker hole 114.

[0047] The sensor module 104 and the sensor module 119 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 100. The sensor module 104 and the sensor module 119 may include, for example, a first sensor module 104 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 110A of the housing 110, and / or a third sensor module 119 and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on the second surface 110B of the housing 110. The fingerprint sensor may be disposed not only on the first surface 110A (e.g., the display 101) of the housing 110, but also on the second surface 110B or the side surface 110C of the housing 110. The electronic device 100 may further include, for example, at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 104.

[0048] The camera module 105, the camera module 112, and the camera module 113 may include a first camera device 105 disposed on a first surface 110A of the electronic device 100, and a second camera device 112 and / or a flash 113 disposed on a second surface 110B of the electronic device 100. The camera device 105 and the camera device 112 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, one or more lenses (e.g., an infrared camera lens, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 100. In an embodiment, the flash 113 may emit infrared light, and the infrared light emitted by the flash 113 and reflected by the object may be received by the third sensor module 119. The electronic device 100 or the processor of the electronic device 100 may detect the depth information of the object based on the time point at which the infrared light is received from the third sensor module 119.

[0049] The key input device 117 may be provided on the side surface 110C of the housing 110. In an embodiment, the electronic device 100 may not include some or all of the above-mentioned key input devices 117, and the key input device 117 not included may be implemented in another form (such as a soft key) on the display 101. In an embodiment, the key input device may include a sensor module provided on the second surface 110B of the housing 110.

[0050] The light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110. The light emitting element 106 may provide, for example, status information of the electronic device 100 in an optical form. In an embodiment, the light emitting element 106 may provide a light source interlocked with, for example, the operation of the camera module 105. The light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

[0051] The connector hole 108 and the connector hole 109 may include a first connector hole 108 capable of accommodating a connector (e.g., a USB connector) for sending power and / or data to an external electronic device or receiving power and / or data from an external electronic device, and / or a second connector hole 109 capable of accommodating a connector (e.g., a headphone jack) for sending audio signals to an external electronic device or receiving audio signals from an external electronic device.

[0052] Figure 3 is viewed from the front side according to an embodiment of the present disclosure Figure 1 2 is an exploded perspective view of an electronic device 200 shown in FIG. Figure 4 According to an embodiment of the present disclosure, the Figure 1 2 is an exploded perspective view of an electronic device 200 shown in FIG.

[0053] Reference Figure 3 and Figure 4 , the electronic device 200 (for example, in Figure 1 or Figure 2 The electronic device 100 in the embodiment may include a side surface structure 210, a first support member 211 (eg, a bracket), a front surface plate 220 (eg, Figure 1 102 in the front panel), the display 230 (e.g., in Figure 1 101 in the display), a printed circuit board (or substrate assembly) 240, a battery 250, a second support member 260 (eg, a rear case), an antenna, a camera assembly 207, and a rear surface plate 280 (eg, Figure 2 In an embodiment, in the electronic device 200, at least one of the components (eg, the first support member 211 or the second support member 260) may be omitted, or other components may be additionally included. At least one of the components of the electronic device 200 may be Figure 1 or Figure 2 At least one of the components of the electronic device 100 is the same or similar, and a redundant description thereof will be omitted below.

[0054] The first support member 211 may be disposed inside the electronic device 200 and may be connected to the side surface structure 210 or may be integrally constructed with the side surface structure 210. The first support member 211 may be made of, for example, a conductive material, a metal material, a non-conductive material, a dielectric material, and / or a non-metallic (e.g., polymer) material. When at least partially made of a metal material or a conductive material, a portion of the side surface structure 210 or the first support member 211 may be used as an antenna. The first support member 211 may include one surface to which the display 230 is connected and another surface to which the printed circuit board 240 is connected. The processor, memory, and / or interface may be mounted on the printed circuit board 240. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor.

[0055] According to an embodiment, the first support member 211 and the side surface structure 210 may be combined together and referred to as a front shell or housing 201. According to an embodiment, the housing 201 may generally be understood as a structure for accommodating, protecting or setting a printed circuit board 240 or a battery 250. In an embodiment, it is understood that the housing 201 includes structures that a user can visually or tactilely recognize from the appearance of the electronic device 200, such as the side surface structure 210, the front surface plate 220 and / or the rear surface plate 280. In an embodiment, the “front surface or rear surface of the housing 201” may be understood as the structure of the printed circuit board 240 or the battery 250. Figure 1 The first surface 110A in or Figure 2In an embodiment, the first support member 211 may be disposed on the front surface plate 220 (eg, Figure 1 The first surface 110A in the embodiment of the present invention is connected to the rear surface plate 280 (for example, Figure 2 The second surface 110B in the embodiment of the present invention is located between the second surface 110B in the embodiment of the present invention and can be used as a structure on which an electrical / electronic component (such as a printed circuit board 240 or a camera component 207) is disposed.

[0056] The memory may include, for example, volatile memory or non-volatile memory.

[0057] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect, for example, the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0058] The second support member 260 may include, for example, an upper support member 260a and a lower support member 260b. In an embodiment, the upper support member 260a may be configured to surround the printed circuit board 240 together with a portion of the first support member 211. A circuit device or various electrical / electronic components implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) may be disposed on the printed circuit board 240, and in some embodiments, the printed circuit board 240 may be provided with an electromagnetic shielding environment from the upper support member 260a. In an embodiment, the lower support member 260b may be utilized as a structure capable of disposing electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In an embodiment, the electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be disposed on an additional printed circuit board (not shown) (e.g., on Figure 5 340 in the example) or connected to an additional printed circuit board (not shown) (e.g., Figure 5 In this case, the lower support member 260b may be configured to wrap an additional printed circuit board together with another portion of the first support member 211. The additional printed circuit board (not shown) or the speaker module or interface provided on the lower support member 260b may be connected to the lower support member 260b. Figure 1 The audio module 207 or the connector hole 108 and the connector hole 109 are arranged correspondingly.

[0059] The battery 250 is a device for supplying power to at least one component in the electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 250 may be disposed on substantially the same plane as, for example, the printed circuit board 240. The battery 250 may be integrally disposed inside the electronic device 200, or may be disposed to be detachable from the electronic device 200.

[0060] Although not shown, an antenna (eg, Figure 5 and Figure 6 The radiating conductor pattern 353 may include a conductive pattern implemented on the surface of the second support member 260 by, for example, printing, deposition, electroplating and / or laser direct molding. In an embodiment, the antenna may include a printed circuit pattern disposed on the surface of the film, and the film-type antenna may be disposed between the rear surface plate 280 and the battery 250. The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna and / or a magnetic secure transmission (MST) antenna. The antenna may perform short-range communication with, for example, an external device, or may wirelessly send power required for charging to an external device or receive power required for charging from an external device. In an embodiment, another antenna structure may be provided by a portion of the side surface structure 210 and / or the first support member 211, or a combination thereof.

[0061] The camera assembly 207 may include at least one camera module. Inside the electronic device 200, the camera assembly 207 may receive at least some of the light incident through the optical hole or camera window 212, the camera window 213, and the camera window 219. In an embodiment, the camera assembly 207 may be disposed on the first support member 211 at a position adjacent to the printed circuit board 240. In an embodiment, the camera module of the camera assembly 207 may be substantially aligned with one of the camera windows 212, the camera window 213, and the camera window 219, and may be at least partially wrapped by the second support member 260 (e.g., the upper support member 260a).

[0062] It should be noted that in the following detailed description, reference may be made to the electronic device 100 and the electronic device 200 of the previous embodiments, and for components that can be easily understood through the previous embodiments, the same reference numerals may be assigned or omitted, and / or their detailed descriptions may also be omitted.

[0063] Figure 5 The embodiment according to the present disclosure is shown along Figure 2 The electronic device 300 cut by the straight line A-A' in Figures 1 to 4 1 or 200).

[0064] Reference Figure 5, the electronic device 300 (for example, in Figures 1 to 4 The electronic device 100 or the electronic device 200 in the embodiment may include a housing 301 (eg, Figure 3 or Figure 4 201 in the housing), the circuit board 340 (for example, in Figure 3 or Figure 4 PCB 240 in the first board 360b (for example, in Figure 3 or Figure 4 In one embodiment, the transmission line 351 and / or the ground conductor 355 may be disposed on different surfaces of the first plate 360b (for example, the first surface F1 and the second surface F2), respectively (more preferably, directly disposed), in the opposite surfaces of the first plate 360b. In an embodiment, when viewed from one of the opposite surfaces of the first plate 360b, the transmission line 351 may be disposed to at least partially overlap with the ground conductor 355. In an embodiment, when viewed from one of the opposite surfaces of the first plate 360b, the transmission line 351 may be disposed to overlap with the ground conductor 355 by between 50% and 100%, more preferably, between 80% and 100%, or between 90% and 100%.

[0065] According to an embodiment, the housing 301 may include a frame-shaped side surface structure 310 (eg, Figure 3 or Figure 4 The second plate 311 may be, for example, Figure 3 or Figure 4 The housing 301 may be provided to at least partially face the first plate 360b, wherein the circuit board 340 is inserted between the second plate 311 and the first plate 360b, and the side surface structure 310 and / or the second plate 311 may at least partially include a conductive material (such as a metal material). In an embodiment, the housing 301 may suppress electromagnetic interference of electrical / electronic components in the internal space of the electronic device 300, and may be electrically connected to the circuit board 340 (or Figure 4 The reference voltage is provided by the ground plane of the printed circuit board 240).

[0066] According to an embodiment, the circuit board 340 may be accommodated inside the housing 301 and may include an integrated circuit chip 341 or an integrated circuit chip 343 on which a circuit such as a processor or a communication module is mounted. Figure 3 or Figure 4In addition to the printed circuit board 240, a circuit board 340 may be further provided, and may be implemented in various ways according to the internal structure of the electronic device actually manufactured. Figure 3 or Figure 4 The printed circuit board 240 in the embodiment may be set as a main circuit board, and the circuit board 340 may be set as an auxiliary circuit board. However, the present disclosure is not limited thereto, and in an embodiment, Figure 3 or Figure 4 The printed circuit board 240 in the embodiment may be provided as an auxiliary circuit board, and the circuit board 340 may be provided as a main circuit board.

[0067] According to an embodiment, the first plate 360b may be Figure 3 or Figure 4 For example, as will be referred to Figures 11 to 16 As mentioned above, available Figure 4 The first plate 360b is realized by at least one of the upper support member 260a or the lower support member 260b. In an embodiment, the first plate 360b may have a second plate 311 (for example, Figure 3 or Figure 4 The shape or size of the first support member 211 in the embodiment substantially corresponds to the shape or size of the first plate 360b. According to an embodiment, the first plate 360b may include a non-conductive material, a dielectric material and / or a non-metallic (e.g., polymer) material, and may have a predetermined thickness (or height) h. In an embodiment, the line width of the transmission line 351 (e.g., in Figure 8 The first line width W1 in .

[0068] According to an embodiment, the transmission line 351 is disposed (more preferably directly disposed) on one surface of the first plate 360b (e.g., a first surface F1 substantially parallel to the XY plane and facing the -Z direction), and may include a line having a predetermined line width (e.g., Figure 8 A microstrip line having a first line width W1 in the transmission line 351. For example, the transmission line 351 may include a conductive pattern set by printing, electroplating, deposition and / or laser direct forming. In an embodiment, the transmission line 351 may extend along a predetermined track, and the track of the transmission line 351 may vary according to the specifications or internal structure of the electronic device 300 actually manufactured. In an embodiment, the transmission line 351 may transmit the sent and / or received wireless communication signals via the radiating conductor pattern 353 to be described later. In some embodiments, at least a portion of the side surface structure 310 may be used as an antenna for sending and / or receiving wireless signals. In this case, the transmission line 351 may transmit the sent and / or received wireless communication signals via the side surface structure 310.

[0069] According to an embodiment, the ground conductor 355 may be disposed (more preferably directly disposed) on a surface of the first plate 360b different from the surface for the transmission line 351 (e.g., a second surface F2 substantially parallel to the XY plane and facing the +Z direction). In an embodiment, the ground conductor 355 may include a line width at least partially different from the line width of the transmission line 351 (e.g., Figure 8 The ground conductor 355 may include a conductor pattern having a second line width W2 in the first plate 360b. For example, the ground conductor 355 may include a conductive pattern set by printing, electroplating, deposition and / or laser direct structuring. For example, the transmission line 351 and / or the ground conductor 355 may include a laser direct structuring pattern. The ground conductor 355 may extend at least partially parallel to the transmission line 351. In an embodiment, the transmission line 351 and the ground conductor 355 may be disposed on different surfaces of the first plate 360b so as to at least partially overlap each other when viewed from one surface of the first plate 360b (e.g., when viewed along the Z-axis direction).

[0070] According to an embodiment, the electronic device 300 may further include a radiation conductor pattern 353 provided (more preferably directly provided) on at least one surface (e.g., the second surface F2 facing the +Z direction and / or the first surface F1 facing the -Z direction) of the first board 360b. The radiation conductor pattern 353 is a conductive pattern provided by, for example, printing, plating, deposition and / or laser direct structuring, and may be used as an antenna. According to an embodiment, the transmission line 351 may transmit a wireless communication signal transmitted and / or received through the radiation conductor pattern 353 between the circuit board 340 and the radiation conductor pattern 353. In an embodiment, a portion of one conductor pattern (e.g., a laser direct structuring pattern) may be provided as the transmission line 351, and another portion may be provided as the radiation conductor pattern 353. For example, in one conductor pattern located on one surface of the first board 360b, a portion provided to overlap with the ground conductor 355 may be used as the transmission line 351, and in one conductor pattern, a portion provided not to overlap with the ground conductor 355 may be used as the radiation conductor pattern 353 (e.g., an antenna). In an embodiment, regardless of whether the transmission line 351 and the radiation conductor pattern 353 overlap the ground conductor 355 , the transmission line 351 and the radiation conductor pattern 353 may be distinguished from each other by having different widths when provided in one conductor pattern.

[0071] According to an embodiment, when a wireless communication signal is transmitted via the transmission line 351, the ground conductor 355 may provide a reference potential for the transmission line 351 or provide an electromagnetic shielding environment. For example, an environment that suppresses electromagnetic interference when transmitting a wireless communication signal may be provided for the transmission line 351. Fig.17As described above, when the transmission line 351 is arranged to overlap with the circuit board 340 in the Z-axis direction, the ground conductor 355 is at least partially arranged between the transmission line 351 and the circuit board 340 to serve as an electromagnetic shielding structure between the transmission line 351 and / or the circuit board 340. However, the embodiments of the present disclosure are not limited to such an arrangement relationship, and the arrangement of the transmission line 351, the ground conductor 355 and / or the circuit board 340 may be variously changed.

[0072] According to an embodiment, the transmission line 351, the ground conductor 355 and / or the radiation conductor pattern 353 may be disposed on a surface of the internal structure of the electronic device 300 (e.g., one surface or the other surface of the first board 360b) by printing, plating, deposition and / or laser direct forming. In an embodiment, even when components such as the speaker 371, the connector (e.g., Fig.10 connector 491 in), a camera (e.g., in Figure 4 camera assembly 207 in the embodiment of the present invention) and / or an electromagnetic shielding member (e.g., in the embodiment of the present invention) Fig.10 When an electrical component (such as the electromagnetic shielding member 493 such as the shielding can) is arranged in the area between the circuit board 340 and the radiating conductor pattern 353 inside the housing 301, the transmission line 351 or the grounding conductor 355 can also stably transmit wireless communication signals between the circuit board 340 and the radiating conductor pattern 353. In a structure in which other electronic components are arranged in the area between the circuit board 340 and the radiating conductor pattern 353, the transmission line 351 or the grounding conductor 355 can be arranged to bypass the electronic component while at least partially overlapping the electronic component in the Z-axis direction. For example, since it is possible to reach the antenna (for example, the radiating conductor pattern 353) or reach the side structure 310 (for example, in the side structure 310) serving as an antenna without making substantial changes to the internal structure or shape of the electronic device 300, Figure 3 or Figure 4 The transmission line 351 of the side surface structure 210 in the antenna can be easily designed or arranged. In an embodiment, the transmission line 351 or the ground conductor 355 can be arranged to overlap the electronic component by 50% to 100% in the Z-axis direction, and more preferably at least 90%.

[0073] It should be noted that although in the disclosed embodiment, it is described that "the transmission line 351, the ground conductor 355, and / or the radiation conductor pattern 353 are disposed on the surface of the internal structure of the electronic device 300 (for example, one surface or the other surface of the first board 360b)", it should be noted that the embodiments of the present disclosure are not limited thereto. For example, after the transmission line 351, the ground conductor 355, and / or the radiation conductor pattern 353 are arranged, an additional injection molded product, a synthetic resin sheet, a film, or a coating is disposed on the surface of the first board 360b to cover the transmission line 351, the ground conductor 355, and / or the radiation conductor pattern 353. In the embodiment, even if covered by an additional layer, among the transmission line 351, the ground conductor 355, and / or the radiation conductor pattern 353, at least the radiation conductor pattern 353 can provide an environment capable of radiating a wireless signal to the outer space of the first board 360b and / or the electronic device 300.

[0074] According to an embodiment, the electronic device 300 and / or the first board 360b may include at least one signal terminal (e.g., a signal terminal S) and at least one ground terminal (e.g., a first ground terminal G1 and a second ground terminal G2). The signal terminal S and / or the ground terminal G1 and the ground terminal G2 may be located on one surface (e.g., the second surface F2) of the opposite surfaces of the first board 360b that faces the circuit board 340. In an embodiment, the signal terminal S may be electrically connected (more preferably directly electrically connected) to the transmission line 351, and may be electrically connected to the circuit board 340 via a contact member 345 such as a C-shaped clip. The first ground terminal G1 may be electrically connected (more preferably directly electrically connected) to the ground conductor 355, and may be electrically connected to the circuit board 340 via the contact member 345. For example, a plurality of contact members 345 may be provided (more preferably directly provided) on the circuit board 340, and when the circuit board 340 and the first board 360b are accommodated in the housing 201, the contact members 345 may each contact one of the signal terminal S and the first ground terminal G1. As described above, the transmission line 351 and / or the signal terminal S may be electrically connected to the circuit board 340 (e.g., a communication module) via one of the contact members 345, and the ground conductor 355 and / or the first ground terminal G1 may be electrically connected to the circuit board 340 (e.g., a ground plane) via another one of the contact members 345.

[0075] In an embodiment, the second ground terminal G2 may be electrically connected (more preferably directly electrically connected) to the ground conductor 355, and the ground conductor 355 may be electrically connected to another structure within the housing 201. For example, when Figure 4When the second board 311 or the first supporting member 211 includes a conductive material, the ground conductor 355 may be electrically connected to the second board 311. Although not shown, when the outer surface of an electronic component such as the speaker 371 includes a conductive material, an additional second ground terminal G2 may be provided to electrically connect the ground conductor 355 to the electronic component. In an embodiment, when the second ground terminal G2 is electrically connected to the second board 311 or the electronic component, the electronic device 300 may further include an additional contact member (not shown).

[0076] Figure 6 is a diagram showing an electronic device (for example, in Figures 1 to 5 The first plate 360b (eg, in the electronic device 100, the electronic device 200, or the electronic device 300) of Figure 4 The second support member 260 in Figure 5 A view of a first surface F1 of a first plate 360b). Figure 7 is a view showing a second surface F2 of the first board 360 b of the electronic device 300 according to an embodiment of the present disclosure. Figure 8 is a view showing a first surface F1 of a first board 360 b of an electronic device 300 according to an embodiment of the present disclosure. Fig. 9 The embodiment according to the present disclosure is shown along Figure 8 FIG. 1 is a view of the first board 360 b of the electronic device 300 cut along the straight line CC′ in FIG.

[0077] For example, Figure 6 The first surface F1 facing the -Z direction among the opposite surfaces of the first plate 360b can be exemplified. Figure 7The second surface F2 facing the +Z direction among the opposite surfaces of the first board 360b may be exemplified. The illustrated embodiment exemplifies a configuration in which the transmission line 351 and the ground conductor 355 are arranged on different surfaces of the first board 360b, respectively, and the transmission line 351 and the radiation conductor pattern 353 are arranged on the same surface (e.g., the first surface F1) of the first board 360b, but it should be noted that the embodiments of the present disclosure are not limited thereto. In an embodiment, the transmission line 351 may be arranged on the second surface F2 facing the +Z direction on the opposite side of the first board 360b, and the ground conductor 355 may be provided on the first surface F1 facing the -Z direction among the opposite surfaces of the first board 360b. In an embodiment, the radiation conductor pattern 353 may be arranged on the same surface as the ground conductor 355, and on a surface different from that for the transmission line 351. For example, the arrangement of the transmission line 351, the ground conductor 355, and / or the radiation conductor pattern 353 may be appropriately selected in consideration of the specifications of the electronic device 300 actually manufactured or the antenna radiation performance. In an embodiment, the arrangement of the signal terminal S or the ground terminal G1 and the ground terminal G2 may vary according to the shape and arrangement of the ground conductor 355 and / or the radiation conductor pattern 353. For example, the positions of the ground terminal G1 and the ground terminal G2 may be appropriately selected in consideration of the relative position of the circuit board 340 with respect to the ground conductor 355 and the shapes of the second board 311 or another electronic component and the ground conductor 355.

[0078] Further references Figures 6 to 9 , the radiation conductor pattern 353 may be manufactured in an appropriate shape at an appropriate position in consideration of the internal structure or radiation performance of the electronic device 300. When the radiation conductor pattern 353 is disposed at a position separated from the signal terminal S (e.g., a predetermined distance from a position where the circuit board 340 is disposed), the transmission line 351 may be disposed along a track leading from the signal terminal S to the radiation conductor pattern 353. In an embodiment, the ground conductor 355 may be disposed (more preferably, directly disposed) on a surface of the first board 360b different from the surface for the transmission line 351, and may be arranged to be parallel to the transmission line 351 while at least partially overlapping the transmission line 351.

[0079] According to an embodiment, the first ground terminal G1 may be provided adjacent to one end (e.g., the signal terminal S) of the transmission line 351. Here, it can be understood from the description that “the first ground terminal G1 is provided adjacent to the signal terminal S” that the distance (or interval) between the first ground terminal G1 and the signal terminal S is smaller than the distance between the first ground terminal G1 and the radiation conductor pattern 353. In an embodiment, when the second ground terminal G2 is provided, the second ground terminal G2 may be provided adjacent to the other end of the transmission line 351 or the radiation conductor pattern 353. Here, it can be understood from the description that “the second ground terminal G2 is adjacent to the radiation conductor pattern 353” that the distance between the second ground terminal G2 and the radiation conductor pattern 353 is smaller than the distance between the second ground terminal G2 and the signal terminal S. According to an embodiment, as the distance between the first ground terminal G1 and the second ground terminal G2 on the ground conductor 355 increases, the reference potential or the electromagnetic shielding structure may be stabilized. However, the embodiments of the present disclosure are not limited thereto, and the second ground terminal G2 may be omitted or provided at a position different from the illustrated position. In one embodiment, when the transmission line 351 or the ground conductor 355 is connected to a speaker 371 or a connector (e.g., Fig.10 When an electronic component overlaps with the connector 491 in the figure, an additional second ground terminal G2 may be provided to electrically connect the electronic component and the ground conductor 355.

[0080] According to an embodiment, the electronic device 300 and / or the first board 360b may further include wiring grooves 361a and 361b disposed on at least one of the opposing surfaces of the first board 360b. The wiring grooves 361a and 361b may be, for example, areas or spaces recessed from the surface of the first board 360b. In an embodiment, when the wiring grooves 361a and 361b are disposed on one of the opposing surfaces of the first board 360b, one of the transmission line 351, the ground conductor 355, and / or the radiation conductor pattern 353 may be at least partially disposed in the wiring grooves 361a and 361b. The conductive pattern constituting the transmission line 351, the ground conductor 355, and / or the radiation conductor pattern 353 may be at least partially disposed in the wiring grooves 361a and 361b. In an embodiment, when the first wiring groove 361a may be provided in the first surface F1 of the opposite surface of the first plate 360b and the second wiring groove 361b may be provided in the second surface F2 of the opposite surface of the first plate 360b, each of the transmission line 351 (and / or the radiation conductor pattern 353) and the ground conductor 355 may be provided in one of the first wiring groove 361a or the second wiring groove 361b. By being accommodated in one of the wiring groove 361a and the wiring groove 361b, the transmission line 351, the ground conductor 355 and / or the radiation conductor pattern 353 may not substantially protrude from the surface of the first plate 360b. For example, the transmission line 351, the ground conductor 355 and / or the radiation conductor pattern 353 may be protected from damage caused by interference of another structure outside the first plate 360b.

[0081] According to an embodiment, the transmission line 351 is a conductive pattern extending in one direction (e.g., the X-axis direction) and may have a first line width W1. The ground conductor 355 is another conductive pattern extending substantially parallel to the transmission line 351 and may at least partially have a second line width W2 different from the first line width W1. In an embodiment, the ground conductor 355 may have a second line width W2 substantially greater than the first line width W1. In an embodiment, the line width (e.g., first line width W1) of the transmission line 351 may be determined by the thickness h or dielectric constant of the first plate 360b. For example, when the thickness h of the first plate 360b having a dielectric constant of about 3 to about 5 is about 0.5 mm, the first line width W1 of the transmission line 351 may be about 0.86 mm to about 1.24 mm. In an embodiment, when the thickness h of the first plate 360b having a dielectric constant of about 3 to about 5 is about 0.8 mm, the first line width W1 of the transmission line 351 may be about 1.34 mm to about 2.0 mm. The material (eg, dielectric constant) and thickness h of the first plate 360 ​​b and / or the first line width W1 of the transmission line 351 may be variously designed according to the specifications of the electronic device 300 actually manufactured.

[0082] According to an embodiment, the electronic device 300 may further include a radiating conductor pattern 353. In an embodiment, the radiating conductor pattern 353 may transmit a received wireless communication signal to the circuit board 340 via the transmission line 351, or may receive a wireless communication signal to be transmitted via the transmission line 351. For example, on the first board 360b, the radiating conductor pattern 353 may be disposed on the same surface as the transmission line 351 or on a surface different from the surface for the transmission line 351, and may be provided with a power signal to transmit and / or receive a wireless signal. In the present embodiment, the configuration of the radiating conductor pattern 353 disposed on the first board 360b is illustrated, but it should be noted that the embodiments of the present disclosure are not limited thereto. For example, Figure 4 A portion of the housing 201 (eg, the side surface structure 210) or Figure 5 A portion of the housing 301 may be used as a radiation conductor. In this case, on the first board 360b, the radiation conductor pattern 353 may be omitted, and the housing 201 or a portion of the housing 301 may be electrically connected to the circuit board 340 via the transmission line 351. In an embodiment, regardless of whether the housing 201 or a portion of the housing 301 is implemented as a radiation conductor, the radiation conductor pattern 353 may be provided on the first board 360b to be used as an antenna separate from a portion of the housing 201 or the housing 301.

[0083] According to an embodiment, the radiation conductor pattern 353 may extend along a predetermined track and, when provided on the first board 360b, may be substantially a conductive pattern extending from the transmission line 351. For example, when provided on the same surface of the first board 360b, the transmission line 351 and the radiation conductor pattern 353 may be substantially different portions in one conductive pattern. In an embodiment, in a structure in which the transmission line 351 and the radiation conductor pattern 353 are provided as one conductive pattern, when viewed from one of the opposite surfaces of the first board 360b, the transmission line 351 may be provided so as to overlap with the ground conductor 355, and the radiation conductor pattern 353 may be provided so as not to overlap with the ground conductor 355. For example, when viewed in the Z-axis direction, the conductive pattern of the portion overlapping with the ground conductor 355 may be used as the transmission line 351, and the conductive pattern of the portion not overlapping with the ground conductor 355 may be used as the radiation conductor pattern 353.

[0084] According to an embodiment, the transmission line 351 and the radiation conductor pattern 353 may have different line widths. For example, the radiation conductor pattern 353 may have a third line width A1 different from the first line width W1. In an embodiment, when the first line width W1 and the third line width A1 are different from each other, or according to the relative alignment state of the transmission line 351 and the radiation conductor pattern 353, the electronic device 300 may further include a matching line 359, which is provided (more preferably directly provided) between the transmission line 351 and the radiation conductor pattern 353. For example, the matching line 359 may have a first line width W1 at a point connected to the transmission line 351 and may have a line width that gradually increases or decreases in a direction away from the transmission line 351. For example, the matching line 359 may have a shape capable of suppressing connection loss or reflection loss at a connection point between the transmission line 351 and the radiation conductor pattern 353. In an embodiment, in a structure in which the transmission line 351 and the radiation conductor pattern 353 are aligned in a direction in which the transmission line 351 and the radiation conductor pattern 353 intersect each other, the matching line 359 may have a line width that may gradually increase in a direction away from one end of the transmission line 351. The line width of the matching line 359 at a point in contact with the radiation conductor pattern 353 may be greater than the line width of a point in contact with the transmission line 351.

[0085] Fig.10 The embodiment according to the present disclosure is shown along Figure 2 The electronic device 400 cut by the straight line BB' in Figures 1 to 5 1, 200, or 300).

[0086] Fig.10 The configuration in which the signal terminal S and the ground terminal G1 and the ground terminal G2 are arranged in a straight line along the X-axis direction is illustrated, but the embodiment is not limited thereto in terms of the positions and shapes of the signal terminal S and the ground terminal G1 and the ground terminal G2. For example, the signal terminal S and the ground terminal G1 and the ground terminal G2 of the actually manufactured electronic device 400 may be arranged in a straight line with Fig.10 In an embodiment, when the electronic device 400 is in a position different from the position in the cross section shown. Figure 2 or Fig.10 When the positions shown are cut differently, at least one of the signal terminal S and the ground terminal G1 and the ground terminal G2 may not be visible in the cross-sectional view, or Fig.10 Another terminal not shown in the figure may be visible. According to an embodiment, although in Fig.10 Some components are omitted, but when observed from a cross section of the actual electronic device 400, another internal component (for example, in Figure 4 camera assembly 207 or battery 250).

[0087] Further references Fig.10 , the electronic device 400 may include a housing 301 (eg, Figure 3 or Figure 4 The electronic components in the housing 201 in the embodiment of the present invention are arranged in a first board 360b (for example, Figure 4 The upper support member 260a or the lower support member 260b in the embodiment may be disposed to face the second plate 311 (eg, Figure 3 or Figure 4 The first support member 211 in the circuit board 340 is provided, wherein at least a portion of the circuit board 340 is inserted between the first plate 306b and the second plate 311. The electronic components may include, for example, a connector 491 and / or an electromagnetic shielding member 493 provided on the circuit board 340, and a speaker 371 and / or a camera provided separately from the circuit board 340 (for example, in Figure 4 The connector 491 may be at least partially received in a recess or opening, for example, provided in one side edge of the circuit board 340, and the electromagnetic shielding member 493 may be provided around other electrical / electronic components (e.g., in Figure 5 The electromagnetic shielding member 493 may be disposed on one surface of the circuit board 340 in a state where at least one of the integrated circuit chips 341 and the integrated circuit chip 343 in the housing 301 is connected. For example, the electromagnetic shielding member 493 may be electrically connected to the ground plane of the circuit board 340 and may provide an electromagnetic shielding environment for at least one electrical / electronic component. In an embodiment, an electronic component such as a speaker 371 and / or a camera may be separated from the circuit board 340 in the X-axis direction or the Y-axis direction, and may be at least partially disposed on the same plane as the circuit board 340 in the housing 301 (for example, in the Z-axis direction).

[0088] According to an embodiment, a ground conductor (e.g., Figures 5 to 9 The ground conductor 355 in the first plate 360b may be provided (for example, in Figure 3 or Figure 4 A surface of the second support member 260 in the embodiment of the present invention (eg, an inner surface facing the +Z direction or a surface of the second support member 260 in the embodiment of the present invention) Figure 5 The second surface F2 in the embodiment of the present invention is disposed on the circuit board 340 or the second board 311 (for example, Figure 4 The first support member 211 in the circuit board 340 is provided, and the first ground terminal G1 and the second ground terminal G2 may be electrically connected to the circuit board 340 (e.g., the ground plane of the circuit board 340) or a component used as a ground line (such as the second board 311) at opposite side edges of the ground conductor 355. In an embodiment, when viewed along the Z-axis direction, the ground conductor 355 may at least partially overlap with the electronic component (e.g., the speaker 371, the connector 491, and / or the electromagnetic shielding member 493). Although not shown, an additional second ground terminal (e.g., Fig.17The second ground terminal G2 in the first board 360b may be provided on one surface of the first board 360b. The additional second ground terminal may electrically connect, for example, the speaker 371, the connector 491, and / or the electromagnetic shielding member 493 to the ground conductor 355.

[0089] According to an embodiment, a transmission line (e.g., Figures 5 to 9 The transmission line 351 in the first plate 360b may be disposed on the first plate 360b (eg, Figure 3 or Figure 4 Another surface of the lower support member 260b) (eg, an outer surface facing the -Z axis or on the Figure 5 360b) and may at least partially overlap the ground conductor 355 in the Z-axis direction. For example, the transmission line 351 may extend from the position where the signal terminal S is provided on the outer surface of the first board 360b (e.g., the surface facing the -Z direction) in the X-axis direction, and the portion extending from the position where the first ground terminal G1 is provided to the +X direction may substantially overlap the ground conductor 355. The transmission line 351 may be electrically connected to the circuit board 340 (e.g., the communication circuit) via the signal terminal S, and may be electrically connected (more preferably directly electrically connected) to the radiation conductor pattern 353 provided on at least one of the opposite surfaces of the first board 360b and / or a portion of the housing 301 (e.g., the side surface structure 310) to transmit wireless communication signals. In an embodiment, at least a portion of the ground conductor 355 may be provided between the circuit board 340 and the transmission line 351, and when a wireless communication signal is provided via the transmission line 351, an electromagnetic shielding function may be provided between the transmission line 351 and the circuit board 340.

[0090] Fig.11 is a diagram showing an electronic device (for example, in Figures 1 to 5 The first board (eg, in the electronic device 100, the electronic device 200, or the electronic device 300) of Figure 4 The lower support member 260b in the Figure 5 A view of a first surface F1 of a first plate 360b). Fig.12 is a view showing a second surface F2 of the first board 360 b of the electronic device 300 according to an embodiment of the present disclosure.

[0091] Fig.11 and Fig.12 Example Figure 4 In the second supporting member 260, the lower supporting member 260b is provided as a first plate 360b, and the transmission line 351 is provided on the outer surface of the first plate 360b (eg, at Figure 5 The structure on the first surface F1) in FIG. Fig.11 and Fig.12In an embodiment, one conductive pattern may provide the transmission line 351 and the radiation conductor pattern 353 on the outer surface of the first board 360b. In an embodiment, the radiation conductor pattern 353 may have a line width greater than the line width of the transmission line 351, regardless of whether the radiation conductor pattern 353 overlaps with the ground conductor 355 in the Z-axis direction. In an embodiment, the ground conductor 355 provided in a region corresponding to the transmission line 351, the signal terminal S electrically connected (more preferably directly electrically connected) to the transmission line 351, and / or the ground terminal G1 and the ground terminal G2 electrically connected (more preferably directly electrically connected) to the ground conductor 355 may be provided on the inner surface of the first board 360b (for example, on Figure 5 The "inner surface of the first plate 360b" may be referred to as, for example, the second surface F2, and may be understood as being disposed on the housing (for example, in Figure 4 or Fig.10 In the state of facing the circuit board (for example, in the housing 201 or the housing 301) in Fig.10 340 in the circuit board) or the second board 311 (for example, in Fig.10 The signal terminal S may be arranged to correspond to one end of the transmission line 351. On the outer surface of the first plate 360b, the radiation conductor pattern 353 may extend from the other end of the transmission line 351. Of the ground terminal G1 and the ground terminal G2, the first ground terminal G1 may be provided at a position adjacent to the signal terminal S on the ground conductor 355, and the second ground terminal G2 may be provided at a position adjacent to the radiation conductor pattern 353 on the ground conductor 355.

[0092] Fig.13 is a diagram showing an electronic device (for example, in Figures 1 to 5 or Fig.10 The first board (eg, in the electronic device 100, the electronic device 200, the electronic device 300, or the electronic device 400) of Figure 4 The lower support member 260b in the Figure 5 A view of a first surface F1 of a first plate 360b). Fig.14 is a view showing a second surface F2 of the first board 360 b of the electronic device 300 according to an embodiment of the present disclosure.

[0093] Fig.13 and Fig.14 Illustrated Figure 4 The lower support member 260b of the second support member 260 is provided as the first plate 360b, and the transmission line 351 is provided on the inner surface of the first plate 360b. Fig.13 and Fig.14 , on the outer surface of the first plate 360b (for example, Figure 5The radiation conductor pattern 353 and the ground conductor 355 may include conductor patterns disposed in mutually independent regions. The transmission line 351 may be disposed on the inner surface of the first board 360b (eg, on the inner surface of the first board 360b). Figure 5 The first board 360b may be disposed on the second surface F2 in the Z-axis direction and may be disposed to at least partially overlap the ground conductor 355. The electronic device 300 and / or the first board 360b may include a ground terminal G1 and a ground terminal G2 disposed on the inner surface of the first board 360b to correspond to opposite side edges of the ground conductor 355, and a signal terminal S disposed at one end of the transmission line 351.

[0094] Although not directly shown, an embodiment in which the transmission line 351 and the radiation conductor pattern 353 are provided on the inner surface (e.g., the second surface F2) of the first board 360b, and the ground conductor 355 is provided on the outer surface (e.g., the first surface F1) of the first board 360b may be implemented. For example, an embodiment of the present disclosure may include a structure in which the transmission line 351 and the ground conductor 355 are provided on different surfaces of the first board 360b, respectively, and it should be noted that the transmission line 351, the ground conductor 355 and / or the radiation conductor pattern 353 are not limited to the above-mentioned embodiment.

[0095] Fig.15 is a diagram showing an electronic device (for example, in Figures 1 to 5 or Fig.10 The first board (eg, in the electronic device 100, the electronic device 200, the electronic device 300, or the electronic device 400) of Figure 4 The upper support member 260a in or Figure 5 A view of a first surface F1 of a first plate 360b). Fig.16 is a view showing a second surface F2 of the first board 360 a of the electronic device 300 according to an embodiment of the present disclosure.

[0096] Fig.15 and Fig.16 Example Figure 4 In the second supporting member 260, the upper supporting member 260a is provided as a first plate 360a, and the transmission line 351 is provided on the outer surface of the first plate 360a (for example, at Figure 5 The structure on the first surface F1) in FIG. Fig.15 and Fig.16 , one conductive pattern may provide the transmission line 351 and the radiation conductor pattern 353 on the outer surface of the first plate 360a. Regardless of whether the radiation conductor pattern 353 overlaps with the ground conductor 355 in the Z-axis direction, the radiation conductor pattern 353 may have a line width different from that of the transmission line 351. Although there is a difference in that the upper support member 260a is used as the first plate 360a, based on Fig.11 and Fig.12 The embodiments can be easily understood Fig.15 and Fig.16 , and thus a detailed description thereof will be omitted.

[0097] Fig.17 The embodiment according to the present disclosure is shown along Figure 2 The electronic device 500 cut by the straight line A-A' in Figures 1 to 5 or Fig.10 100, electronic device 200, electronic device 300 or electronic device 400).

[0098] Reference Fig.17 , the ground conductor 355 and / or the transmission line 351 may be arranged to substantially overlap the circuit board 340 in the Z-axis direction. According to an embodiment, the ground conductor 355 and / or the transmission line 351 may be arranged to at least partially overlap with an electronic component (e.g., a speaker 371 and / or an electromagnetic shielding member 493) within the electronic device 500. In some embodiments, in the electronic device 500 having a structure in which the ground conductor 355 is arranged close to the electronic component, the ground conductor 355 may be electrically connected to the electronic component via the second ground terminal G2 or an additional third ground terminal. For example, an electronic component such as the electromagnetic shielding member 493 may be electrically connected to the ground conductor 355 via the second ground terminal G2 or an additional third ground terminal to serve as a ground plane that at least partially provides a reference potential. In an embodiment, when the ground conductor 355 and / or the transmission line 351 are arranged to substantially overlap with the circuit board 340 in the Z-axis direction, the ground conductor 355 may be at least partially arranged between the transmission line 351 and the circuit board 340.

[0099] As described above, according to an embodiment of the present disclosure, an electronic device (for example, Figures 1 to 5 , Fig.10 and / or Fig.17 The electronic device 100, the electronic device 200, the electronic device 300, the electronic device 400 or the electronic device 500) includes: a housing (for example, Figures 1 to 5 , Fig.10 and / or Fig.17 The housing 201 or housing 301 in the housing), a circuit board accommodated in the housing (for example, Figures 3 to 5 , Fig.10 and / or Fig.17 The circuit board 240 or the circuit board 340 in the housing), a first plate (for example, Figure 4 The second support member 260 in Figures 5 to 17The transmission line (for example, on the first board 360a or the first board 360b in the circuit board) disposed on the first surface of the opposite surface of the first board and electrically connected to the circuit board Figures 5 to 9 and / or Fig.17 transmission line 351 in the circuit board), a ground conductor (e.g., Figures 5 to 9 and / or Fig.17 The ground conductor 355 in the first surface (for example, Figure 5 The first surface F1 in the embodiment and the second surface (for example, Figure 5 A radiation conductor pattern (for example, on one of the second surfaces F2) in FIG. 1 and electrically connected to one end of the transmission line Figures 5 to 9 and / or Fig.17 The transmission line is arranged to at least partially overlap the ground conductor when viewed from one of the first surface and the second surface, and the transmission line is configured to transmit a wireless communication signal sent or received via the radiation conductor pattern.

[0100] According to one embodiment, when viewed from one of the first surface and the second surface, the radiating conductor pattern may be arranged so as not to overlap with the ground conductor. In this arrangement, the radiating conductor pattern may function as an antenna.

[0101] According to one embodiment, the electronic device may further include: a signal terminal (eg, a signal terminal disposed on one of the first surface and the second surface facing the circuit board and electrically connected to the transmission line); Figure 5 or Fig.17 A signal terminal S in the first surface), and a first ground terminal (for example, in the first surface and the second surface) disposed on one surface facing the circuit board and electrically connected to the ground conductor Figure 5 or Fig.17 In an embodiment, at least one of the signal terminal and the first ground terminal may be electrically connected to a circuit board.

[0102] According to one embodiment, the electronic device may further include: at least one contact member (eg, Figure 5 or Fig.17 The contact member 345 in the circuit board is configured such that at least one contact member can provide an electrical connection between the signal terminal (or the first ground terminal) and the circuit board.

[0103] According to one embodiment, the electronic device may further include: a second board (eg, Figures 3 to 5 , Fig.10 and / or Fig.17The first supporting member 211 or the second plate 311 in the embodiment of the present invention (wherein the circuit board is inserted between the first plate and the second plate), and at least one second grounding terminal (for example, in the embodiment of the present invention) provided on one of the first plate and the second plate and electrically connected to the grounding conductor Figure 5 In an embodiment, the second ground terminal may electrically connect the ground conductor to the second plate. In an embodiment, the second plate may include a conductive material.

[0104] According to one embodiment, the electronic device may further include: an electromagnetic shielding member disposed on the circuit board (for example, Fig.10 or Fig.17 The electromagnetic shielding member 493 in the first surface and the second surface is provided on one surface and electrically connected to the ground conductor at least one second ground terminal (for example, in Fig.17 In an embodiment, the second ground terminal may electrically connect the ground conductor to the electromagnetic shielding member.

[0105] According to one embodiment, the transmission line may include a first line width (e.g., Figure 8 In an embodiment, the ground conductor may include a conductive pattern having a first line width W1 in the transmission line 351 and extending at least partially parallel to the transmission line 351 and having at least partially a second line width greater than the first line width (for example, in Figure 8 A conductive pattern with a second line width W2) in the embodiment of the present invention.

[0106] According to an embodiment, the electronic device may further include a matching line (eg, at Figure 6 In an embodiment, the radiating conductor pattern may be provided on the same surface as the transmission line of the first surface and the second surface. In an embodiment, the matching line may have a first line width at a point connected to the transmission line, and may have a line width that gradually increases or decreases in a direction away from the transmission line.

[0107] According to an embodiment, the electronic device may further include: a signal terminal disposed on one of the first and second surfaces facing the circuit board and electrically connected to the transmission line, a first grounding terminal disposed on one of the first and second surfaces facing the circuit board and electrically connected to the grounding conductor, a second board disposed at least partially facing the first board (wherein the circuit board is inserted between the first and second boards), and at least one second grounding terminal disposed on one of the first and second boards and electrically connected to the grounding conductor. In an embodiment, the radiating conductor pattern may be disposed on one of the first and second surfaces without overlapping the grounding conductor. In an embodiment, the second grounding terminal may electrically connect the grounding conductor to the second board.

[0108] According to an embodiment, the first ground terminal may be disposed adjacent to one end of the transmission line, and the second ground terminal may be disposed adjacent to the other end of the transmission line.

[0109] According to an embodiment, the first ground terminal may be disposed adjacent to the signal terminal.In an embodiment, the second ground terminal may be disposed adjacent to the radiation conductor pattern.

[0110] According to an embodiment, the electronic device may further include a wiring groove disposed on at least one of the first surface and the second surface (eg, Fig. 9 In an embodiment, a transmission line, a radiation conductor pattern, or a ground conductor may be at least partially disposed in the wiring groove.

[0111] According to an embodiment, the electronic device may further include a first wiring groove disposed in the first surface and a second wiring groove disposed in the second surface. In an embodiment, a transmission line, a radiation conductor pattern or a ground conductor may be disposed in one of the first wiring groove and the second wiring groove, respectively.

[0112] According to an embodiment, the electronic device may further include an electronic component disposed on one side of the circuit board in the housing (for example, Figure 4 The camera component 207 in Figure 5 or Fig.10 Speaker 371 and / or in Fig.10 In an embodiment, the transmission line or the ground conductor may be arranged to at least partially overlap the electronic component when viewed from one of the first surface and the second surface.

[0113] According to embodiments, the electronic component may include an electromagnetic shielding member, a speaker, or a camera module.

[0114] According to an embodiment, the transmission line, the radiating conductor pattern, or the ground conductor may include a laser direct structuring pattern.

[0115] According to an embodiment, an electronic device (e.g., Figures 1 to 5 , Fig.10 and / or Fig.17 The electronic device 100, the electronic device 200, the electronic device 300, the electronic device 400 or the electronic device 500 in the embodiment may include: a housing (for example, Figures 1 to 5 , Fig.10 and / or Fig.17 The housing 201 or housing 301 in the housing), a circuit board accommodated in the housing (for example, Figures 3 to 5 , Fig.10 and / or Fig.17The circuit board 240 or the circuit board 340 in the housing), a first plate (for example, in the housing) disposed in the housing to at least partially face the circuit board and including a dielectric material Figure 4 The second support member 260 in Figures 5 to 17 The first board 360a or the first board 360b in the first board, the predetermined trace extending on the first surface of the opposite surface of the first board and electrically connected to the circuit board having a first line width (for example, Figure 8 The first line width W1) of the transmission line (for example, in Figures 5 to 9 and / or Fig.17 The transmission line 351 in the circuit board is disposed on a second surface of the opposite surface of the first board, extending at least partially parallel to the transmission line and electrically connected to the circuit board having a second line width greater than the first line width (for example, Figure 8 The ground conductor of the second line width W2 in (for example, in Figures 5 to 9 and / or Fig.17 ), and a radiation conductor pattern (for example, in Figures 5 to 9 and / or Fig.17 In an embodiment, the transmission line may be configured to transmit a wireless communication signal sent or received via the radiating conductor pattern. In an embodiment, the transmission line may be arranged to at least partially overlap with a ground conductor when viewed from one of the first surface and the second surface. In an embodiment, the radiating conductor pattern may be arranged not to overlap with a ground conductor.

[0116] According to an embodiment, the electronic device may further include: a signal terminal (eg, a signal terminal disposed on one of the first surface and the second surface facing the circuit board and electrically connected to the transmission line); Figure 5 or Fig.17 A signal terminal S in the first surface), and a first ground terminal (for example, in the first surface and the second surface) disposed on one surface facing the circuit board and electrically connected to the ground conductor Figure 5 or Fig.17 In an embodiment, at least one of the signal terminal and the first ground terminal may be electrically connected to a circuit board.

[0117] According to an embodiment, the electronic device may further include: a second plate (eg, Figures 3 to 5 , Fig.10 and / or Fig.17 The first supporting member 211 or the second plate 311 in the embodiment of the present invention (wherein the circuit board is inserted between the first plate and the second plate), and at least one second grounding terminal (for example, in the embodiment of the present invention) provided on one of the first plate and the second plate and electrically connected to the grounding conductor Figure 5In an embodiment, the second ground terminal may electrically connect the ground conductor to the second board.

[0118] According to an embodiment, the first ground terminal may be disposed adjacent to the signal terminal.In an embodiment, the second ground terminal may be disposed adjacent to the radiation conductor pattern.

[0119] According to an embodiment, the electronic device may further include an electronic component disposed on one side of the circuit board in the housing (for example, Figure 4 Camera assembly in Figure 5 or Fig.10 Speaker 371 and / or in Fig.10 In an embodiment, the transmission line or the ground conductor may be arranged to at least partially overlap the electronic component when viewed from one of the first surface and the second surface.

[0120] Although the present disclosure has been described with reference to the embodiments as examples, it should be understood that the embodiments are intended to illustrate the present disclosure rather than to limit the present disclosure. It will be apparent to those skilled in the art that various changes in form and details may be made without departing from the full scope of the present disclosure (including the appended claims and their equivalents). For example, in the configuration of the upper support member 260a or the second plate 360a, the radiating conductor pattern may be disposed on the same plane as the ground conductor, such as Fig.13 As shown in the embodiment. According to the embodiment, an embodiment in which the transmission line and the radiation conductor pattern are provided on the inner surface of the upper support member 260a or the second plate 360a and the ground conductor is provided on the outer surface of the upper support member 260a or the second plate 360a can be realized. In the embodiment, the signal terminal and the transmission line can be provided on the same surface or on different surfaces of the first plate, and the arrangement of the ground terminal and the ground conductor can be similar thereto. For example, the signal terminal and the ground terminal can be provided on the surface of the first plate facing the circuit board, and the surface on which the transmission line and the ground conductor are provided can be selected differently.

Claims

1. An electronic device (100, 200, 300, 400, 500), comprising: Housing (201, 301); A circuit board (240, 340) is accommodated in the housing (201, 301); A first plate (260, 360a, 360b) disposed in the housing (201, 301) to at least partially face the circuit board (240, 340); a transmission line (351) disposed on a first surface (F1) of the opposing surfaces of the first board (260, 360a, 360b) and electrically connected to the circuit board (240, 340); a ground conductor (355) provided on a second surface (F2) of the opposing surfaces of the first board (260, 360a, 360b) and electrically connected to the circuit board (240, 340); as well as a radiating conductor pattern (353) disposed on the first surface (F1) or the second surface (F2) and electrically connected to the first end of the transmission line (351), Wherein, when observed from one of the first surface (F1) and the second surface (F2), the transmission line (351) is arranged to at least partially overlap with the ground conductor (355), and the transmission line (351) is configured to transmit a wireless communication signal sent or received via the radiating conductor pattern (353).

2. The electronic device (100, 200, 300, 400, 500) according to claim 1, wherein: The radiation conductor pattern (353) is arranged not to overlap with the ground conductor (355) when viewed from one of the first surface (F1) and the second surface (F2).

3. The electronic device (100, 200, 300, 400, 500) according to any one of claims 1 to 2, further comprising: a signal terminal (S) disposed on one of the first surface (F1) and the second surface (F2) facing the circuit board (240, 340) and electrically connected to the transmission line (351); as well as a first grounding terminal (G1) disposed on the one surface of the first surface (F1) and the second surface (F2) facing the circuit board (240, 340) and electrically connected to the grounding conductor (355), At least one of the signal terminal (S) and the first ground terminal (G1) is electrically connected to the circuit board (240, 340).

4. The electronic device (100, 200, 300, 400, 500) according to claim 3, further comprising: At least one contact member (345) is arranged at a position on the circuit board (240, 340) corresponding to the signal terminal (S) or the first ground terminal (G1).

5. The electronic device (100, 200, 300, 400, 500) according to any one of claims 1 to 4, further comprising: a second plate (211, 311) arranged to at least partially face the first plate (260, 360a, 360b), wherein the circuit board (240, 340) is inserted between the first plate (260, 360a, 360b) and the second plate (211, 311); and at least one second grounding terminal (G2) provided on one of the first plate (260, 360a, 360b) and the second plate (211, 311) and electrically connected to the grounding conductor (355), The second ground terminal (G2) is configured to electrically connect the ground conductor (355) to the second plate (211, 311).

6. The electronic device (100, 200, 300, 400, 500) according to any one of claims 1 to 5, further comprising: An electromagnetic shielding member (493) is disposed on the circuit board (240, 340); as well as at least one second ground terminal (G2) disposed on one of the first surface (F1) and the second surface (F2) and electrically connected to the ground conductor (355), The second ground terminal (G2) is configured to electrically connect the ground conductor (355) to the electromagnetic shielding member (493).

7. The electronic device (100, 200, 300, 400, 500) according to any one of claims 1 to 6, wherein: The transmission line (351) includes a conductive pattern extending along a predetermined track and having a first line width (W1), and The ground conductor (355) includes another conductive pattern extending at least partially in parallel with the transmission line (351) and at least partially having a second line width (W2) greater than the first line width (W1).

8. The electronic device (100, 200, 300, 400, 500) according to claim 7, further comprising: a matching line (359) electrically interconnecting the transmission line (351) and the radiation conductor pattern (353), wherein the radiation conductor pattern (353) is provided on the same surface as the transmission line (351) among the first surface (F1) and the second surface (F2), and The matching line (359) has the first line width (W1) at the point where it is connected to the transmission line (351), and has a line width that gradually increases or decreases in a direction (-X) away from the transmission line (351).

9. The electronic device (100, 200, 300, 400, 500) according to claim 1, further comprising: a signal terminal (S) disposed on one of the first surface (F1) and the second surface (F2) facing the circuit board (240, 340) and electrically connected to the transmission line (351); a first grounding terminal (G1) disposed on the one surface of the first surface (F1) and the second surface (F2) facing the circuit board (240, 340) and electrically connected to the grounding conductor (355); a second plate (211, 311) arranged to at least partially face the first plate (260, 360a, 360b), wherein the circuit board (240, 340) is inserted between the first plate (260, 360a, 360b) and the second plate (211, 311); and at least one second grounding terminal (G2) provided on one of the first plate (260, 360a, 360b) and the second plate (211, 311) and electrically connected to the grounding conductor (355), wherein, when viewed from one of the first surface (F1) and the second surface (F2), the radiation conductor pattern (353) is provided on one of the first surface (F1) and the second surface (F2) without overlapping with the ground conductor (355), and The second ground terminal (G2) is configured to electrically connect the ground conductor (355) to the second plate (211, 311).

10. The electronic device (100, 200, 300, 400, 500) according to claim 5 or claim 9, wherein: The first ground terminal (G1) is arranged adjacent to the second end of the transmission line (351), and the second ground terminal (G2) is arranged adjacent to the first end of the transmission line (351); or The first ground terminal (G1) is arranged adjacent to the signal terminal (S), and the second ground terminal (G2) is arranged adjacent to the radiation conductor pattern (353).

11. The electronic device (100, 200, 300, 400, 500) according to any one of claims 1 to 10, further comprising: A wiring groove (361a, 361b) is provided in at least one of the first surface (F1) and the second surface (F2), The transmission line (351), the radiation conductor pattern (353) or the ground conductor (355) is at least partially disposed in the wiring groove (361a, 361b).

12. The electronic device (100, 200, 300, 400, 500) according to any one of claims 1 to 10, further comprising: A first wiring groove (361a) is provided in the first surface (F1); as well as A second wiring groove (361b) is provided in the second surface (F2), The transmission line (351), the radiation conductor pattern (353) or the ground conductor (355) is respectively arranged in one of the first wiring groove (361a) and the second wiring groove (361b).

13. The electronic device (100, 200, 300, 400, 500) according to any one of claims 1 to 12, further comprising: An electronic component (207, 371, 491, 493) is arranged on one side of the circuit board (240, 340) in the housing (201, 301), Wherein, when observed from one of the first surface (F1) and the second surface (F2), the transmission line (351) or the ground conductor (355) is arranged to at least partially overlap with the electronic component (207, 371, 491, 493).

14. The electronic device (100, 200, 300, 400, 500) according to claim 13, wherein: The transmission line (351), the radiation conductor pattern (353) or the ground conductor (355) includes a laser direct structuring pattern.

15. The electronic device (100, 200, 300, 400, 500) according to any one of claims 2 to 6 and claims 10 to 14, wherein: The first plate (260, 360a, 360b) comprises a dielectric material; wherein the transmission line (351) has a first line width (W1) and extends along a predetermined track; and The ground conductor (355) has a second line width (W2) greater than the first line width (W1), and extends at least partially parallel to the transmission line (351).

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