A probe structure and installation method for jaundice detection

Abstract

The present invention relates to the field of jaundice detection technology, and in particular to a probe structure and installation method for jaundice detection. The installation method of the probe structure for jaundice detection includes: installing a light guide column housing, performing a glue application at the contact point between a fourth shell and a first shell, and inserting the first shell into the fourth shell; installing a positioning plate and inserting the positioning plate into the first shell; welding a pin header to a first circuit board, preparing several groups of 5-pin pin headers, and welding the 5-pin pin headers to the first circuit board; applying glue to the front end outer layer of the emitting light guide column and the front end of the second reflecting light guide column, respectively, welding the 5-pin pin header to a third circuit board, and then installing the third circuit board into the third shell. The present invention achieves a firm connection and high-precision alignment between components through the use of glue application and positioning plates, significantly improving the stability and accuracy of installation. The standardized operation of the 5-pin pin header simplifies circuit board connection, and the modular installation design makes component replacement and upgrading more convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of jaundice detection, and in particular to a probe structure and an installation method for jaundice detection. Background Art

[0002] Existing jaundice measurement technologies face the problems of complex installation processes and insufficient precision. Xenon lamps, as the main light source, require high-voltage power supply, which necessitates the design of complex boost circuits, increases the complexity of the circuit board, and increases the difficulty and error rate of assembly. At the same time, although fiber optic technology provides a certain degree of flexibility in optical path design, ensuring uniform distribution of light, the precise alignment and fixation of optical fibers is a technical challenge that requires high-precision equipment and professional operators. In addition, jaundice measurement equipment needs to integrate multiple sensors and optical elements, which places high demands on the precise placement and fixed assembly of components, and traditional assembly technology often finds it difficult to achieve the required high-precision integration level. This complex assembly process not only increases the difficulty of equipment maintenance and upgrades, but in the event of a failure, it may also require professional disassembly and reassembly, thereby increasing maintenance costs and extending downtime. Summary of the Invention

[0003] The present invention aims to solve the technical problems of complex probe installation process and low installation precision of jaundice detection devices in the prior art and provides a probe structure and installation method for jaundice detection.

[0004] In view of the above technical problems, an embodiment of the present invention provides a probe structure for jaundice detection, comprising a first circuit board, a second circuit board, a third circuit board, an emitting light guide column, a first reflecting light guide column, and a second reflecting light guide column, which are sequentially installed in a housing. The first reflecting light guide column, the emitting light guide column, and the second reflecting light guide column are sequentially arranged from the inside to the outside and coaxially sleeved. The first circuit board, the second circuit board, and the first circuit board are sequentially connected along the length direction of the probe housing.

[0005] The emitting end of the emitting light guide column passes through the first circuit board and is arranged corresponding to the light source component installed on the second circuit board; the receiving end of the first reflective light guide column passes through the first circuit board and the second circuit board in sequence, and is arranged corresponding to the first sensor component installed on the third circuit board; the first reflective light guide column is arranged corresponding to the second sensor component installed on the first circuit board.

[0006] Optionally, the shell includes a first shell, a second shell, a third shell and a fourth shell inserted in the first shell, the fourth shell is wrapped around the outside of the emitting end of the second reflective light guide column, the first circuit board is installed in the first shell, the second circuit board is installed in the second shell, and the third circuit board is installed in the third shell.

[0007] Optionally, a positioning plate is further included between the first reflective light guide and the first circuit board, and the first circuit board is fixed to the first housing by pressing the positioning plate. Optionally, the first circuit board, the second circuit board, and the third circuit board are connected by welding using a plurality of 5-pin pin headers.

[0008] Optionally, a copper ring is provided between the emitting light guiding column and the second reflecting light guiding column.

[0009] Optionally, outer surfaces of the emitting light guiding column, the first reflecting light guiding column, and the second reflecting light guiding column are all provided with an electroplating layer.

[0010] Optionally, a sealing layer is provided at the connection between the first circuit board and the emitting light guide column, the connection between the second circuit board and the first reflecting light guide column, the connection between the first circuit board and the first shell, the connection between the second circuit board and the second shell, and the connection between the third circuit board and the third shell.

[0011] The present invention also provides a method for installing a probe structure for jaundice detection, wherein the method comprises installing the above-mentioned probe structure for jaundice detection, and comprises the following steps:

[0012] S1. Install the light guide housing, perform glue treatment on the contact point between the fourth housing and the first housing, and insert the fourth housing into the first housing;

[0013] S2. Install the second reflective light guide column, apply glue to the outer layer of the second reflective light guide column and the inner layer of the fourth housing, and insert the second reflective light guide column into the fourth housing;

[0014] S3, installing the positioning plate, and installing the positioning plate into the first housing (101);

[0015] S4. Solder the pin headers to the first circuit board. Prepare several sets of 5-pin pin headers and solder the 5-pin pin headers to the first circuit board.

[0016] S5. Install and fix the first circuit board, fixing the first circuit board with the pin header welded thereon to the first housing with four bolts;

[0017] S6. Install the emitting light guide column, apply glue to the front outer layer of the emitting light guide column and the front end of the first reflective light guide column, and insert the emitting light guide column into the inner layer of the second reflective light guide column;

[0018] S7, installing the second housing of the probe, and installing the second housing onto the first housing;

[0019] S8. Install and solder the second circuit board, pass the 5-pin pin headers soldered on the first circuit board through the solder holes on the second circuit board, and install the second circuit board in the second housing and solder it securely.

[0020] S9. Install the first reflective light guide column, perform glue application on the front outer layer of the first reflective light guide column, pass the first reflective light guide column through the second circuit board, and insert it into the inner layer of the emitting light guide column;

[0021] S10, installing the first housing, and installing the third housing onto the first housing;

[0022] S11. Install and solder the third circuit board, pass several 5-pin pin headers extending from the solder holes of the second circuit board through the solder holes of the second circuit board, and then install the second circuit board into the second housing and solder it in place. Optionally, the method further includes:

[0023] In step S5, after the first circuit board is fixedly mounted on the positioning plate, black sealing silicone is applied to the connection between the first circuit board and the first housing;

[0024] In step S8, black sealing silicone is applied to the connection between the second circuit board and the second housing;

[0025] In step S11 , black sealing silicone is applied to the connection between the first circuit board and the first housing.

[0026] Optionally, the method further includes:

[0027] Apply glue to the copper ring and push the copper ring from the front end of the probe structure for jaundice detection into between the emitting light guide column and the second reflecting light guide column to complete the installation of the copper ring.

[0028] The present invention's method for installing a probe structure for jaundice detection achieves simplified installation and high precision through a series of carefully designed steps. First, the glue application process in key steps, such as S1, S2, and S9, not only ensures a secure connection between components but also provides the necessary elasticity to absorb vibration and thermal expansion, enhancing the stability of the overall structure. Second, the use of a positioning plate in step S3 plays a key role in ensuring the precise placement and alignment of the circuit board and other components, significantly improving installation precision. The standardized operation of the 5-pin pin header in steps S4, S8, and S11 simplifies the complexity of circuit board connections and provides a reliable method for electrical connection between the three circuit boards. The modular installation achieved through steps S5, S8, and S11 allows for independent installation of different circuit boards and individual light guides, facilitating individual replacement or upgrades, significantly improving maintenance convenience. The present invention's step-by-step assembly process allows for step-by-step inspection and testing of the installation quality of each component, helping to promptly identify and resolve problems and ensuring accurate and reliable installation. The precise glue application and use of the positioning plate reduce the need for manual adjustments, reduce the possibility of human error, and further improve installation precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of a probe structure for jaundice detection in one embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of a probe structure for jaundice detection in another embodiment of the present invention;

[0031] Figure 3 Schematic diagram of the installation structure of the first circuit board, the second circuit board and the third circuit board in one embodiment of the present invention.

[0032] 1-probe housing, 101-first housing, 102-second housing, 103-third housing, 104-fourth housing, 2-first circuit board, 3-second circuit board, 4-second circuit board, 5-emitting light guide column, 6-first reflecting light guide column, 7-second reflecting light guide column, 8-light source assembly, 9-first sensor assembly, 10-second sensor assembly, 11-positioning plate, 12-5Pin pin header, 13-copper ring. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] In the description of the present invention, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0036] In one embodiment, if Figure 1-3 As shown, a probe structure for jaundice detection includes a first circuit board 2, a second circuit board 3, a first circuit board 4, an emitting light guide column 5, a first reflecting light guide column 6, and a second reflecting light guide column 7, which are sequentially installed in a housing. The first reflecting light guide column 6, the emitting light guide column 5, and the second reflecting light guide column 7 are sequentially arranged from the inside to the outside and coaxially sleeved. The first circuit board 2, the second circuit board 3, and the first circuit board 4 are sequentially connected along the length direction of the probe housing 1;

[0037] The emitting end of the emitting light guide column 5 passes through the first circuit board 2 and is arranged corresponding to the light source component 8 installed on the second circuit board 3; the receiving end of the first reflecting light guide column 6 passes through the first circuit board 2 and the second circuit board 3 in sequence, and is arranged corresponding to the first sensor component 9 installed on the third circuit board 4; the second reflecting light guide column 7 is arranged corresponding to the second sensor component 10 installed on the first circuit board 2.

[0038] Among them, the emitting light guide 5 is responsible for transmitting the light of a specific wavelength emitted by the light source component 8 to the skin surface, the first reflecting light guide 6 and the first reflecting light guide 7 receive the light reflected, scattered and refracted by the subcutaneous tissue of the skin, and convert it into an electrical signal through the first sensing component 9 and the second sensing component 10. The intensity and wavelength of the light reflected back by the first reflecting light guide 6 and the first reflecting light guide 7 are measured by the electrical signal to evaluate the color change of the skin. Due to the deposition of bilirubin, the presence of jaundice is determined based on the change in the spectrum reflected by the skin. The number of second reflecting light guides 7 can be set to multiple as needed, and multiple first reflecting light guides 7 are sequentially mounted on the emitting light guide 5 to offset the influence of skin melanin. The first reflecting light guide 6 is used to detect the jaundice value. Furthermore, the first reflective light guide column 6, the emitting light guide column 5 and the second reflective light guide column 5 can all be made of optical plastics such as acrylic transparent material PMMA, polycarbonate, epoxy resin, etc. by injection molding, so that the above three light guide columns have excellent light transmittance and stable physical properties, ensuring that the optical signal will not be significantly attenuated due to material absorption or scattering during transmission, thereby improving the precision and accuracy of jaundice detection.

[0039] In the present invention, the subtlety of the probe structure lies in its unique modular and layered layout concept. By cleverly connecting three carefully designed first circuit boards 2, second circuit boards 3 and third circuit boards 4 in series along the longitudinal axis of the probe housing 1, not only a high degree of space optimization is achieved and the overall integration density is significantly improved, but also close collaboration and efficient data transmission between the functional modules are ensured. At the same time, the introduction and layered setting of the three light guides further enhance the modular characteristics of the structure, allowing each key component to be independently installed and quickly replaced, greatly simplifying subsequent maintenance processes and assembly operations, reducing maintenance costs and improving work efficiency. This design philosophy not only reflects the ultimate pursuit of technical details, but also demonstrates a deep insight into user experience and equipment reliability. Therefore, the present invention not only greatly improves the integration and installation convenience of the probe structure, but also brings more outstanding performance, higher operating stability and a more user-friendly user operation experience to the overall equipment. It is an important step in promoting technological progress and industrial upgrading in related fields.

[0040] In one embodiment, if Figure 1 As shown, the first reflecting light guide column 6, the emitting light guide column 5 and the third reflecting light guide column 5 are all arranged into a trumpet-shaped or cone-shaped structure with one end small and the other end large, which can not only adapt to the layout requirements of the multi-layer optical path (layout requirements of the sensor and LED light group), but also reduce the reflection and scattering loss of light during the transmission process, so that more light can be focused on the detection area. The trumpet-shaped or cone-shaped light guide column can also reduce the interference of external ambient light on the measurement results to a certain extent.

[0041] In one embodiment, if Figure 1 and Figure 2 As shown, the shell includes a first shell 101, a first shell 102 and a third shell 103, and a fourth shell 104 inserted in the first shell 101. The fourth shell 104 is wrapped around the outside of the emitting end of the second reflective light guide column 7. The first circuit board 2 is installed in the first shell 101, the second circuit board 3 is installed in the second shell 102, and the first circuit board 4 is installed in the third shell 103. It can be understood that the first circuit board 2, the first circuit board 3 and the third circuit board 4 are installed in sequence along the length direction of the probe shell 1 and divide the accommodating cavity into three independent installation cavities, namely the first installation cavity, the second installation cavity and the third installation cavity. The receiving end of the first reflective light guide column 6 is located in the second installation cavity, and the emitting end of the emitting light guide column 5 passes through the first circuit board 2 and is located in the first installation cavity. The emitting light guide column 5 and the first reflective light guide column 6 are respectively installed in different installation cavities, thereby realizing physical isolation of the optical path and the circuit board. Furthermore, the first shell 101 forms a first installation cavity, the second shell 102 forms a second installation cavity, and the third shell 103 forms a third installation cavity. The first shell 101, the second shell 102 and the first shell 103 constitute the probe shell 1, which can protect the various circuit boards and optical components; the split design of the probe shell 1 is convenient for maintenance and replacement, and also helps to achieve clear distinction of functions.

[0042] In one embodiment, if Figure 2 As shown, the jaundice detection probe structure further includes a positioning plate 11 mounted between the first reflective light guide 7 and the first circuit board 2. The first circuit board 2 is fixed to the first housing 101 via bolts, pressing against the positioning plate 11. As can be understood, the positioning plate 11 effectively blocks some excess reflected light, and in conjunction with the first circuit board 2, further prevents this light from entering the cavity where the first circuit board 2 is located, thereby reducing optical interference.

[0043] In one embodiment, if Figure 1 and Figure 2 As shown, the second reflective light guide 7 also includes two bosses (not shown) symmetrically arranged at the receiving end of the first reflective light guide 7. The positioning plate 11 is provided with positioning holes that are compatible with the bosses. The positioning holes provided on the positioning plate 11 that are compatible with the bosses ensure that the bosses are accurately embedded in the positioning plate 11, avoiding optical path deviation caused by installation errors. The bosses can also accurately guide the reflected light to the corresponding second sensor assembly 10. The two symmetrically arranged bosses help maintain the symmetry of the optical path, making the intensity of the optical signal received by the second sensor assembly 10 more balanced.

[0044] In one embodiment, if Figure 1 and Figure 2 As shown, the second sensing assembly 10 includes a second sensor (not shown) and a third sensor (not shown). In order to meet the installation requirements of the second and third sensors (whose layout is strictly limited by the external dimensions and circuit pad packaging), and simultaneously avoid the problem of increased probe thickness caused by placing the second and third sensors one above the other, the second and first sensors are arranged on the left and right sides, which can effectively control the thickness of the probe and keep it within a relatively reasonable and aesthetically pleasing range. To adapt to the above layout, the outer contour of the receiving end of the second reflective light guide 7 can be designed to be elliptical, which can not only meet the installation requirements, but also optimize the optical path to a certain extent and improve the utilization rate of light.

[0045] In another embodiment, if Figure 1 and Figure 2 As shown, the boss is positioned relative to the second sensor or the third sensor, and the center of the boss is positioned opposite the center of the second sensor or the collection window of the second sensor. The cross-sectional area of ​​the boss is larger than the cross-sectional area of ​​the collection window (light receiving window) of the second sensor or the third sensor. It can be understood that the relative positioning of the boss and the sensor and the differential design of the area allow reflected light to enter the collection window directly and efficiently. The boss with a larger cross-sectional area can capture more reflected light and direct it to the collection window, which not only increases the receiving area of ​​the light signal and reduces light scattering and loss, but also improves the sensor's sensitivity to and reception of light signals.

[0046] In one embodiment, if Figure 1 As shown, the light source assembly 8 includes a plurality of blue LEDs, a plurality of green LEDs, and a plurality of red LEDs arranged on the second circuit board 3. It is understandable that the second circuit board 3 is arranged relative to the emitting end of the emitting light guide column 5, that is, the plurality of blue LEDs, the plurality of green LEDs, and the plurality of red LEDs of the light source assembly 8 are all arranged relative to the emitting end of the emitting light guide column 5, so that the light emitted by the light source assembly 8 can directly illuminate the emitting end of the emitting light guide column 5, reducing the loss and scattering of light during the propagation process. The light emission direction of the light source assembly 8 is perpendicular to the emitting end of the emitting light guide column 5, which helps to reduce the angular deviation of the light at the time of incidence, improve the efficiency of the light entering the emitting light guide column 5, and promote the uniform distribution of light intensity at the output end.

[0047] In one embodiment, if Figure 1 As shown, there is a certain distance between the emitting end of the emitting light guide column 5 and the lamp beads of each LED of the light source group, which enhances the uniformity of the red, green and blue light. If the red, green and blue lamp beads are too close, the intensity is good but the uniformity is poor; maintaining a certain distance can not only ensure the intensity of the emitted light, but also enhance the uniformity of the emitted light.

[0048] In one embodiment, if Figure 3 As shown, the first circuit board 2, the second circuit board 3, and the third circuit board 4 are connected by welding via several groups of 5-pin pin headers 12. It is understandable that the use of several groups of 5-pin pin headers 12 to connect the second circuit board 4, the second circuit board 3, and the first circuit board 2 by welding has multiple advantages. First, the presence of the solder joints firmly fixes the first circuit board 2, the second circuit board 3, and the third circuit board 4 together, forming a stable whole, effectively resisting the influence of external factors such as vibration and impact on the stability of the circuit board connection, and preventing the occurrence of loosening or separation. Secondly, this welding connection method ensures the reliable transmission of electrical signals between the three circuit boards. Each group of 5-pin pin headers 12 is precisely connected to the corresponding pad, forming a low-impedance, high-stability electrical path, ensuring the integrity and accuracy of the signals between the three circuit boards. Furthermore, the use of 5-pin pin headers 12 for circuit board connection also significantly simplifies the assembly process and improves production efficiency. The pin header design makes the alignment between the circuit boards intuitive and easy to operate, reducing the complexity and human errors in the assembly process, while also shortening the assembly time and improving overall work efficiency.

[0049] In one embodiment, if Figure 1 As shown, a copper ring 13 is provided between the emitting light guide column 5 and the first reflecting light guide column 7. It is understandable that the metal ring can be a copper ring 13. The metal ring can increase the distance of the second reflected light path (long light path). The increased distance is the thickness of the metal ring, which can change the path length and attenuation characteristics of the light during propagation, thereby affecting the intensity and quality of the final received light signal. By mixing the signals of the first reflected light path (short light path) and the second reflected light path (long light path), and utilizing the different absorption characteristics of the two for different components (such as bilirubin and melanin) when penetrating the skin, the influence of melanin on the measurement results can be effectively removed or reduced.

[0050] In one embodiment, the outer surfaces of the emitting light guide 5, the first reflective light guide 6, and the second reflective light guide 7 are all provided with an electroplating layer. It is understood that the electroplating layer can isolate the first reflected light path, the emitting light path, and the first reflected light path, further preventing interference between the light paths. Each light path can propagate independently, thereby ensuring the stability and accuracy of the optical signal. The electroplating layer also provides a protective layer for the surface of the light guide, preventing it from being corroded and damaged by the external environment.

[0051] In one embodiment, a sealing layer is provided at the connection between the first circuit board 2 and the emitting light guide column 5, the connection between the second circuit board 3 and the first reflecting light guide column 6, the connection between the first circuit board 2 and the first shell 101, the connection between the second circuit board 3 and the second shell 102, and the connection between the second circuit board 4 and the second shell 103. It can be understood that by providing a sealing layer at the connection between the circuit board and the light guide column and the circuit board and the shell, the sealing layer improves the sealing between the cavities, eliminates the risk of light leakage pollution caused by light penetration from the connection, and the enhanced structural stability ensures the firmness of the connection and prevents displacement or misalignment caused by external force. At the same time, the sealing layer effectively prevents the intrusion of external factors such as moisture and dust, thereby extending the service life of the equipment. The introduction of the sealing layer also simplifies the assembly process, reduces the difficulty of assembly, improves production efficiency, and reduces maintenance costs and simplifies maintenance work.

[0052] The present invention also provides a method for installing a probe structure for jaundice detection, wherein the method comprises installing the above-mentioned probe structure for jaundice detection, and comprises the following steps:

[0053] S1. Install the light guide column housing, perform glue treatment at the contact point between the fourth shell 104 and the first shell 101, and insert the fourth shell 104 into the first shell 101; glue is used to enhance the connection strength and sealing between the fourth shell 104 and the first shell 101, providing a solid foundation for the installation of subsequent components.

[0054] S2. Install the second reflective light guide column 7, apply glue to the outer layer of the second reflective light guide column 7 and the inner layer of the fourth shell 104 respectively, and insert the second reflective light guide column 7 into the fourth shell 104; the glue treatment in this step ensures the fixation of the light guide column and also helps to reduce the loss of light at the interface.

[0055] S3. Install the positioning plate 11 and install the positioning plate 11 into the first housing 101. The positioning plate 11 provides an accurate position reference for subsequent installation of the circuit board, ensuring the correct alignment of the circuit board and other components.

[0056] S4. Solder the pin headers 12 to the first circuit board 2. Prepare several groups of 5-pin pin headers 12 and solder the 5-pin pin headers 12 to the first circuit board 2. This step provides a standardized interface for electrical connection between circuit boards, facilitating subsequent connection and maintenance.

[0057] S5. Install and fix the first circuit board 2: Fix the first circuit board 2 with the pin header 12 to the first housing 101 with four bolts. This step ensures the stable installation of the first circuit board 2 and provides protection for the electrical performance of the entire probe.

[0058] S6. Install the emitting light guide column 5, apply glue to the front end outer layer of the emitting light guide column 5 and the front end of the second reflecting light guide column 7, and insert the emitting light guide column 5 into the inner layer of the second reflecting light guide column 7; this step helps to fix the emitting light guide column 5 and reduce the scattering of light at the interface.

[0059] S7, installing the second housing 102 of the probe, and installing the second housing 102 on the first housing 101; this step further constructs the outer shell structure of the probe, providing additional protection for the internal components of the probe structure.

[0060] S8. Install and solder the second circuit board 3, pass the 5-pin pin headers 12 soldered on the first circuit board 2 through the solder holes on the first circuit board 3, and install the first circuit board 3 in the first housing 102 and solder it in place; this step completes the stable installation of the second circuit board 3.

[0061] S9. Install the first reflective light guide column 6, perform glue treatment on the front end outer layer of the first reflective light guide column 6, pass the first reflective light guide column 6 through the second circuit board 3 and insert it into the inner layer of the emitting light guide column 5; the glue treatment in this step and the precise matching between the first reflective light guide column 6 and the first circuit board 3 ensure the fixation of the light guide column and the correctness of the optical path.

[0062] S10 , installing the third shell 103 , and installing the third shell 103 on the second shell 102 ; this step continues to construct the outer shell structure of the probe.

[0063] S11. Install and solder the third circuit board 4. Pass the 5-pin headers 12 extending from the solder holes of the second circuit board 3 through the solder holes of the third circuit board 4. Then install the first circuit board 4 into the first housing 103 and solder it in place. This step completes the final connection between the circuit boards and ensures a stable installation of the circuit boards.

[0064] In the above steps of the present invention, the step-by-step installation design effectively reduces the complexity of one-time processing and improves the manageability of the installation process by breaking down the entire installation process into steps that focus on a single or a few components.

[0065] The present invention utilizes dispensing in multiple key steps, such as S1, S2, and S9, to ensure a secure connection between components while providing elasticity to absorb vibration and thermal expansion, thereby enhancing the stability of the overall structure. The use of the positioning plate 11 is particularly critical in step S3, ensuring precise placement and alignment of the circuit board and other components, improving installation accuracy. The standardized operation of the 5-pin pin header 12 in steps S4, S8, and S11 simplifies the complexity of connecting the three circuit boards, providing a reliable method for electrical connection between the three circuit boards.

[0066] The modular installation process of the present invention, achieved through steps S5, S8, and S11, allows for independent installation of different circuit boards and light guides, facilitating individual replacement or upgrades, thereby improving maintenance convenience. The step-by-step assembly process in steps S6, S7, S9, and S10 allows for the gradual inspection and testing of the installation quality of each component, facilitating the timely identification and resolution of problems. The use of precise dispensing and positioning plates 11 reduces the need for manual adjustment of components during installation, reducing the likelihood of human error.

[0067] In addition, the step-by-step installation method provides the possibility for future automated installation, which can be performed by robots or automated equipment, further improving installation efficiency and consistency.

[0068] In one embodiment, the method further comprises:

[0069] In step S5, after the first circuit board 2 is fixedly mounted on the positioning plate 11, black sealing silicone is applied to the connection between the first circuit board 2 and the first housing 101;

[0070] In step S8, black sealing silicone is applied to the connection between the second circuit board 3 and the second housing 102;

[0071] In step S11 , black sealing silicone is applied to the connection between the third circuit board 4 and the first housing 103 .

[0072] In this embodiment, black sealing silicone is applied in steps S5, S8 and S11.

[0073] The cavity seal is achieved, eliminating the risk of light leakage and contamination caused by light penetrating through the joints. In addition, the enhanced structural stability ensures the firmness of the connection and prevents displacement or misalignment caused by external forces. At the same time, it effectively prevents the intrusion of external factors such as moisture and dust, extending the service life of the equipment.

[0074] In one embodiment, the method further includes applying glue to the copper ring 13 and pushing the copper ring 13 from the front end of the jaundice detection probe structure into the space between the emitting light guide column 5 and the second reflecting light guide column 7 to complete the installation of the copper ring 13. It is understood that after applying glue, the copper ring 13 can be accurately positioned between the emitting light guide column 5 and the second reflecting light guide column 7, ensuring the correct relative position between the copper ring 13 and the optical path component, thereby ensuring the accuracy of optical signal transmission.

[0075] The above is merely an embodiment of the probe structure and installation method for jaundice detection of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A probe structure for jaundice detection, characterized in that: The invention comprises a first circuit board (2), a second circuit board (3), a third circuit board (4), an emitting light guide column (5), a first reflecting light guide column (6) and a second reflecting light guide column (7) which are sequentially installed in a housing (1); the first reflecting light guide column (6), the emitting light guide column (5) and the second reflecting light guide column (7) are sequentially arranged from the inside to the outside and are coaxially sleeved; the first reflecting light guide column (6), the emitting light guide column (5) and the second reflecting light guide column (7) are all arranged in a trumpet-shaped or cone-shaped structure with one end being small and the other end being large; the outer surfaces of the emitting light guide column (5), the first reflecting light guide column (6) and the second reflecting light guide column (7) are all provided with an electroplating layer for optical path isolation; the first circuit board (2), the second circuit board (3) and the third circuit board (4) are sequentially connected along the length direction of the housing (1); The emitting end of the emitting light guide column (5) passes through the first circuit board (2) and is arranged corresponding to the light source component (8) mounted on the second circuit board (3); the receiving end of the first reflecting light guide column (6) passes through the first circuit board (2) and the second circuit board (3) in sequence and is arranged corresponding to the first sensor component (9) mounted on the third circuit board (4); the second reflecting light guide column (7) is arranged corresponding to the second sensor component (10) mounted on the first circuit board (2), and a positioning plate (11) for blocking reflected light is installed between the second reflecting light guide column (7) and the first circuit board (2).

2. The probe structure for jaundice detection according to claim 1, characterized in that: The housing (1) comprises a first housing (101), a second housing (102), a third housing (103), and a fourth housing (104) plugged into the first housing (101), wherein the fourth housing (104) is wrapped around the outside of the emitting end of the second reflective light guide column (7), the first circuit board (2) is mounted in the first housing (101), the second circuit board (3) is mounted in the second housing (102), and the third circuit board (4) is mounted in the third housing (103).

3. The probe structure for jaundice detection according to claim 2, characterized in that: The first circuit board (2) presses down the positioning plate (11) and is fixedly mounted on the first housing (101) via bolts.

4. The probe structure for jaundice detection according to claim 2, characterized in that: The first circuit board (2), the second circuit board (3) and the third circuit board (4) are connected by welding via a plurality of groups of 5-pin headers (12).

5. The probe structure for jaundice detection according to claim 1, characterized in that: A copper ring (13) is sleeved between the emitting light guide column (5) and the second reflecting light guide column (7).

6. The probe structure for jaundice detection according to claim 2, characterized in that: Sealing layers are provided at the connection between the first circuit board (2) and the emitting light guide column (5), the connection between the second circuit board (3) and the first reflecting light guide column (6), the connection between the first circuit board (2) and the first shell (101), the connection between the second circuit board (3) and the second shell (102), and the connection between the third circuit board (4) and the third shell (103).

7. A method for installing a probe structure for jaundice detection, characterized in that: The installation method is to install the probe structure for jaundice detection according to any one of claims 1 to 6, comprising the following steps: S1, installing the light guide column housing, performing glue dispensing at the contact point between the fourth housing (104) and the first housing (101), and inserting the fourth housing (104) into the first housing (101); S2, installing the second reflective light guide column (7), applying glue to the outer layer of the second reflective light guide column (7) and the inner layer of the fourth shell (104), and inserting the second reflective light guide column (7) into the fourth shell (104); S3, installing the positioning plate (11), and installing the positioning plate (11) into the first housing (101); S4, welding the pin headers (12) to the first circuit board (2), preparing several groups of 5-pin pin headers (12), and welding the 5-pin pin headers (12) to the first circuit board (2); S5, installing and fixing the first circuit board (2), and fixing the first circuit board (2) with the pin header (12) welded thereto to the first housing (101) with four bolts; S6, installing the emitting light guide column (5), applying glue to the front end outer layer of the emitting light guide column (5) and the front end of the second reflecting light guide column (7), and inserting the emitting light guide column (5) into the inner layer of the second reflecting light guide column (7); S7, installing the second housing (102) of the probe, and installing the second housing (102) onto the first housing (101); S8, installing and soldering the second circuit board (3), passing the plurality of 5-pin pin headers (12) soldered on the first circuit board (2) through the soldering holes on the second circuit board (3), and installing the second circuit board (3) in the second housing (102) and soldering it in place; S9, installing the first reflective light guide column (6), performing glue dispensing on the front outer layer of the first reflective light guide column (6), passing the first reflective light guide column (6) through the second circuit board (3) and inserting it into the inner layer of the emitting light guide column (5); S10, installing the third housing (103), installing the third housing (103) onto the second housing (102); S11, installing and soldering the third circuit board (4), passing a plurality of 5-pin pin headers (12) extending from the soldering holes of the second circuit board (3) through the soldering holes of the third circuit board (4), and then installing the third circuit board (4) into the third housing (103) and soldering and fixing it.

8. The method for installing a probe structure for jaundice detection according to claim 7, characterized in that: Also includes: In step S5, after the first circuit board (2) is fixedly mounted on the positioning plate (11), black sealing silica gel is applied to the connection between the first circuit board (2) and the first housing (101); In step S8, black sealing silica gel is applied to the connection between the second circuit board (3) and the second housing (102); In step S11, black sealing silica gel is applied to the connection between the third circuit board (4) and the third housing (103).

9. The method for installing a probe structure for jaundice detection according to claim 7, characterized in that: The following steps are also included: Glue is applied to the copper ring (13), and the copper ring (13) is pushed from the front end of the probe structure for jaundice detection into between the emitting light guide column (5) and the second reflecting light guide column (7) to complete the installation of the copper ring (13).

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