Packaging structure for recording stress impact and stress impact monitoring method

Abstract

The invention discloses a packaging structure for recording stress impact and a stress impact monitoring method. The packaging structure comprises a packaging box body, an IOT board is arranged in the packaging box body, the IOT board is provided with a controller, a battery and a wireless communication module, a stress sensor is further arranged on the inner wall of the packaging box body, the stress sensor, the battery and the wireless communication module are all electrically connected to the controller, and the wireless communication module is in communication connection with a monitoring terminal. According to the packaging box, the IOT plate and the stress sensor are arranged in the packaging box body, the mechanical stress impact condition borne by a package in the transportation and storage process can be monitored in real time, the monitored impact data can be recorded and stored in the controller, the data can be used for subsequent analysis and processing, and the packaging box is convenient to use. According to the method, various stress conditions possibly suffered by the product in the transportation and storage process are helped to be known, so that the packaging design or transportation conditions are optimized, and the source and degree of impact can be traced through recorded impact data.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging, and in particular to a packaging structure for recording stress impact and a stress impact monitoring method. Background Art

[0002] With the use of valuable server components, such as GPU cards in GPU servers, there are occasional incidents of component or server component damage due to stress shock during transportation and storage.

[0003] During logistics transportation and storage, products may be subjected to various mechanical stress shocks, such as collision, vibration, and drop, etc. These shocks may damage the products, resulting in poor product quality and performance. Therefore, a packaging design that can record mechanical stress shocks is needed so that the source and extent of the shocks can be traced when problems occur, providing a basis for product quality control and liability identification. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a packaging structure for recording stress impact and a stress impact monitoring method.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] In the first aspect, an embodiment of the present invention provides a packaging structure for recording stress impacts, comprising: a packaging box, an IOT board is provided inside the packaging box, the IOT board is provided with a controller, a battery and a wireless communication module, a stress sensor is also provided on the inner wall of the packaging box, the stress sensor, the battery and the wireless communication module are all electrically connected to the controller, and the wireless communication module is communicatively connected to a monitoring terminal.

[0007] In a specific embodiment, a temperature sensor is further provided on the inner wall of the packaging box, and the temperature sensor is electrically connected to the controller.

[0008] In a specific embodiment, a humidity sensor is further provided on the inner wall of the packaging box, and the humidity sensor is electrically connected to the controller.

[0009] In a specific embodiment, the four side walls of the packaging box are provided with the stress sensors, and the bottom wall and the top wall of the packaging box are provided with pressure sensors.

[0010] In a specific embodiment, the wireless communication module adopts Bluetooth, SIM card or radio frequency identification communication mode.

[0011] In a specific embodiment, a fan component connected to the interior is further provided on the surface of the packaging box, and the fan component is electrically connected to the controller.

[0012] In a specific embodiment, an air pressure sensor is further provided inside the packaging box, and an air filling and exhaust module connected to the inside is further provided on the surface of the packaging box. Both the air pressure sensor and the air filling and exhaust module are electrically connected to the controller.

[0013] In a specific embodiment, a positioning module is further provided inside the packaging box, and the positioning module is electrically connected to the controller.

[0014] In a specific embodiment, the packaging box is made of cardboard, foam or metal.

[0015] The packaging structure for recording stress impact of the present invention has the following beneficial effects compared with the prior art: by arranging an IOT board (Internet of Things board) and a stress sensor in the packaging box, the mechanical stress impact to which the packaging is subjected during transportation and storage can be monitored in real time, and the monitored impact data can be recorded and stored in a controller. These data can be used for subsequent analysis and processing to help understand the various stress conditions that the product may suffer during transportation and storage, thereby optimizing the packaging design or transportation conditions. The recorded impact data can also be used to trace the source and degree of the impact, providing a basis for product quality control and responsibility identification.

[0016] In a second aspect, an embodiment of the present invention provides a stress impact monitoring method, based on the above-mentioned packaging structure for recording stress impact, comprising the following steps:

[0017] Obtaining information collected by the stress sensor, that is, collected values;

[0018] Determine whether the collected value exceeds a preset threshold;

[0019] If the collected value does not exceed the preset threshold, the collected value is stored and saved;

[0020] If the collected value exceeds the preset threshold, the collected value will be uploaded to the monitoring terminal and an early warning will be issued.

[0021] The stress shock monitoring method of the present invention has the following beneficial effects compared with the prior art: by acquiring information collected by the stress sensor, the stress shock suffered by the packaging structure during transportation and storage can be monitored in real time. When the collected stress value exceeds the preset threshold, the system will automatically trigger the early warning mechanism and upload the relevant information to the monitoring terminal, which helps to timely discover and deal with potential transportation problems and prevent product damage or quality degradation. For the collected values ​​that do not exceed the preset threshold, they are stored and saved. These data are very valuable for subsequent analysis of product transportation conditions and optimization of packaging design. By accumulating these data, enterprises can understand the normal stress level of products during transportation, thereby formulating more reasonable packaging and transportation strategies.

[0022] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 A schematic diagram of a packaging structure for recording stress impact provided by the present invention;

[0025] Figure 2 A schematic flow chart of the stress impact monitoring method provided by the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0033] See also Figure 1 As shown, the present invention discloses a specific embodiment of a packaging structure for recording stress impacts, including: a packaging box, an IOT board is provided inside the packaging box, the IOT board is provided with a controller, a battery and a wireless communication module, the inner wall of the packaging box is also provided with a stress sensor, the stress sensor, the battery and the wireless communication module are all electrically connected to the controller, and the wireless communication module is communicatively connected to a monitoring terminal.

[0034] Specifically, the IOT board (Internet of Things board) and stress sensor set in the packaging box can monitor the mechanical stress impact of the packaging during transportation and storage in real time, and the monitored impact data can be recorded and stored in the controller (i.e. MCU). These data can be used for subsequent analysis and processing to help understand the various stress conditions that the product may suffer during transportation and storage, thereby optimizing the packaging design or transportation conditions. The recorded impact data can also be used to trace the source and degree of the impact, providing a basis for product quality control and responsibility identification, which is very helpful for product quality control and responsibility identification; for example, if the product is damaged when it reaches the end user, the recorded impact data can be analyzed to determine at which stage the damage occurred and the degree of impact caused it. In addition, the use of high-precision sensors can accurately detect even tiny mechanical stress impacts, which is particularly important for some products that are extremely sensitive to vibration and impact (such as precision electronic equipment, biological products, etc.), and can ensure their safety during transportation. In addition, by real-time monitoring and recording of mechanical stress impacts on packaging during transportation and storage, the transparency of the supply chain is improved, which helps companies better understand the status of their products in the logistics process and make more informed decisions, such as improving packaging and optimizing transportation routes.

[0035] In one embodiment, the stress sensors are disposed on the four side walls of the packaging box, and the pressure sensors are disposed on the bottom wall and the top wall of the packaging box.

[0036] Specifically, by setting stress sensors on the four side walls of the packaging box, and setting pressure sensors on the bottom wall and the top wall, it is possible to comprehensively monitor the various stress shocks and pressure changes that the packaging box is subjected to during transportation and storage, which helps to more accurately understand the stress state of the packaging box and its internal products, thereby ensuring the safety and integrity of the products. In addition, when the packaging box is subjected to stress shock, the sensor will quickly collect stress data and transmit it to the MCU in real time through the IOT board. The MCU automatically judges by setting a threshold. When the external stress shock exceeds the set threshold, it will automatically trigger the early warning mechanism and transmit the relevant data to the monitoring terminal through the wireless communication module, which helps to timely discover and deal with potential transportation problems and prevent product damage or quality degradation. In addition, the MCU can filter and process the collected data to improve the accuracy and reliability of the judgment. By setting a reasonable threshold, the MCU can distinguish between normal transportation vibration and abnormal stress shock, thereby avoiding false alarms and missed alarms. In addition, the wireless communication module transmits data to the monitoring terminal, realizing remote monitoring and reminder functions. Users can view the stress of the packaging box in real time through the monitoring terminal, and conduct quality inspections on the transported items in a timely manner after receiving early warning information, which helps to strengthen product quality control and reduce losses and disputes caused by transportation problems. In addition, by analyzing the collected stress impact and pressure data, enterprises can understand the stress conditions under different transportation methods and conditions, thereby optimizing transportation plans and packaging designs, which helps to reduce transportation costs, improve the overall efficiency of the supply chain, and enhance the market competitiveness of products.

[0037] In one embodiment, a temperature sensor is further provided on the inner wall of the packaging box, and the temperature sensor is electrically connected to the controller.

[0038] Specifically, the temperature sensor can monitor the ambient temperature inside the packaging box in real time, which is crucial for many temperature-sensitive products (such as food, medicine, biological products, etc.). By obtaining temperature data in a timely manner, companies can ensure that the temperature conditions of the products during transportation and storage meet the specified requirements. In addition, when the temperature value exceeds the preset value (for example: 50 degrees), the system will automatically trigger the early warning or alarm mechanism, and transmit the temperature data and related information to the monitoring terminal through the wireless communication module, which helps to timely discover and deal with potential temperature problems and prevent the product from being damaged or deteriorating due to excessively high or low temperatures. In addition, the system will record the temperature data and store it on the controller or remote server. This data can be used for subsequent analysis and processing to help companies understand the temperature changes of products during transportation and storage, thereby optimizing packaging design, transportation routes and storage conditions. In addition, by real-time monitoring and early warning of temperature problems, it helps to ensure the quality and safety of products during transportation and storage. For products that require strict temperature control, this technology can greatly reduce the losses and risks caused by temperature problems. In addition, through the wireless communication module, enterprises can remotely monitor and manage the temperature conditions inside the packaging box, which helps enterprises to understand the transportation and storage status of products in real time, make timely adjustments and decisions, and improve overall operational efficiency and customer satisfaction.

[0039] In one embodiment, a humidity sensor is further provided on the inner wall of the packaging box, and the humidity sensor is electrically connected to the controller.

[0040] Specifically, the humidity sensor can monitor the ambient humidity in the packaging box in real time, which is crucial for many humidity-sensitive products (such as electronic products, precision instruments, food, etc.). By obtaining humidity data in a timely manner, companies can ensure that the humidity conditions of the products during transportation and storage meet the specified requirements to prevent damage or deterioration caused by excessive or low humidity. In addition, when the humidity value exceeds the set value, the system will automatically trigger the early warning or alarm mechanism, and transmit the humidity data and related information to the monitoring terminal through the wireless communication module, which helps to timely discover and deal with potential humidity problems and ensure that the product is kept in the best condition in a suitable environment. In addition, the system will record the humidity data and store it on the controller or remote server. These data can be used for subsequent analysis and processing to help companies understand the humidity changes of products during transportation and storage, thereby optimizing packaging design, transportation routes and storage conditions to improve product stability and durability. In addition, real-time monitoring and early warning of humidity problems can help ensure the quality and safety of products during transportation and storage. For products that require strict humidity control, this technology can greatly reduce the losses and risks caused by humidity problems. In addition, through the wireless communication module, companies can remotely monitor and manage the humidity conditions inside the packaging box, which helps companies to understand the transportation and storage status of products in real time, make timely adjustments and decisions, and improve overall operational efficiency and customer satisfaction.

[0041] In one embodiment, the wireless communication module adopts Bluetooth, SIM card or radio frequency identification communication mode.

[0042] Specifically, the Bluetooth module can realize short-range wireless data transmission between the packaging box and nearby devices (such as smartphones, tablets or dedicated monitoring equipment). This communication method facilitates rapid data transmission within a short distance and is suitable for scenes such as warehouse management and logistics tracking, where staff can easily read and record the status information of the packaging box using mobile devices. Among them, the wireless communication module (such as 4G, 5G module) realized by the SIM card can support long-distance data transmission, so that the packaging box can be directly connected to the mobile network and transmit the data to the remote server or monitoring center in real time. This method is suitable for scenes that require real-time remote monitoring and management, such as cross-border logistics, cold chain logistics, etc. Among them, the RFID module communicates with the RFID tag through radio waves, and the information in the tag can be read without physical contact. This communication method is suitable for automated and semi-automated logistics systems, where the RFID reader can quickly identify and record the information of a large number of packaging boxes, improving logistics efficiency. In addition, the use of multiple communication modes can improve the compatibility and flexibility of the packaging box, and different application scenarios and customer needs may require different communication methods. For example, inside a warehouse, Bluetooth communication may be more convenient and economical; in long-distance transportation, SIM card communication provides wider data coverage and real-time performance; RFID communication has advantages in automation and intelligence, and is suitable for scenarios that require efficient identification and tracking of large numbers of items.

[0043] In one embodiment, a fan component connected to the interior is further provided on the surface of the packaging box, and the fan component is electrically connected to the controller.

[0044] Specifically, when the temperature inside the packaging box rises to a value exceeding the set value due to the external environment or internal heat source, the controller will automatically start the fan part. The fan accelerates the air flow inside the packaging box, which helps to dissipate heat, thereby reducing the temperature and protecting the internal products from high temperature damage. In addition, when the temperature inside the packaging box is lower than the set value, the fan part will stop working, avoiding unnecessary energy consumption and excessive wear of the fan, and extending the service life of the fan. In addition, for temperature-sensitive products (such as electronic components, precision instruments, food, etc.), temperature fluctuations may cause performance degradation, damage or deterioration. By automatically adjusting the fan work, the temperature inside the packaging box can be kept relatively stable, ensuring the safety and stability of the product during transportation and storage. In addition, under long-distance transportation or complex climatic conditions, the temperature inside the packaging box may fluctuate due to various factors. This technology can automatically adjust the fan work according to real-time temperature data, optimize transportation and storage conditions, and ensure that the product can maintain the best state in different environments. In addition, the automatic start and stop of the fan through the controller embodies the idea of ​​intelligent management. The controller can make decisions based on the preset temperature threshold and real-time temperature data without manual intervention, which improves management efficiency and accuracy. For products that require strict temperature control, such as high-end electronic products, biological products, etc., this technology can ensure the safety and stability of the products during transportation, thereby improving user satisfaction and trust in the products.

[0045] In one embodiment, an air pressure sensor is further provided inside the packaging box, and an air filling and exhaust module connected to the inside is further provided on the surface of the packaging box. Both the air pressure sensor and the air filling and exhaust module are electrically connected to the controller.

[0046] Specifically, the air pressure sensor can monitor the air pressure inside the packaging box in real time to ensure that the air pressure is within a safe and stable range. This is particularly important for some products that are sensitive to air pressure (such as precision instruments, electronic products, etc.), because air pressure fluctuations may damage their performance or structure. In addition, when the air pressure sensor detects that the air pressure inside the packaging box is lower than or higher than the set value, the controller will immediately start the inflation and exhaust module to work to adjust the internal air pressure to the normal range. This real-time monitoring and control mechanism helps to protect the integrity and safety of the product. In addition, during transportation and storage, the packaging box may be affected by external air pressure changes (such as extreme environments such as high-altitude flight and deep-sea transportation). By setting up an air pressure sensor and an inflation and exhaust module, it can ensure that the air pressure inside the packaging box remains relatively stable, thereby preventing the adverse effects of external air pressure changes on the product. In addition, in some special cases (such as leakage inside the packaging box, etc.), the air pressure sensor can also detect abnormal changes in air pressure in time, and make necessary adjustments through the inflation and exhaust module to ensure the safety of the product. In addition, by real-time monitoring and regulation of air pressure, this technology can optimize the transportation and storage conditions of products; for example, in an environment where constant air pressure needs to be maintained (such as vacuum packaging, inert gas protection, etc.), this technology can ensure that the air pressure inside the packaging box is always maintained within the set range, thereby extending the shelf life and performance stability of the product. In addition, this technology realizes the automatic connection and control of the air pressure sensor and the inflation and exhaust module through the controller, which improves the automation and intelligence level of the packaging box. This helps to reduce the risk of manual intervention and misoperation and improve overall transportation and storage efficiency. In addition, for products that require strict control of air pressure (such as high-end electronic products, precision instruments, etc.), this technology can ensure the safety and stability of the product during transportation and storage, which helps to enhance user trust and satisfaction with the product and improve brand reputation and market competitiveness.

[0047] Among them, the charging and exhaust module adopts the existing public technology, which will not be elaborated in detail here.

[0048] In one embodiment, a positioning module is further provided inside the packaging box, and the positioning module is electrically connected to the controller.

[0049] Specifically, the positioning module uses Beidou or GPS positioning. The positioning module can obtain the geographic location information of the packaging box in real time and transmit it to the controller. Relevant personnel can monitor the movement trajectory and current location of the packaging box in real time. This real-time tracking and monitoring function is of great significance to logistics management, cargo transportation and warehousing management. It can help enterprises accurately grasp the transportation progress and location of goods and improve logistics efficiency and accuracy. In addition, through the positioning module, enterprises can understand the location information of goods in real time. Once the goods are abnormally moved or lost, they can take immediate measures to track and retrieve them, which helps to reduce the risk of goods loss and theft, protect the property safety of enterprises and the interests of customers. In addition, the location information provided by the positioning module can help enterprises optimize transportation routes and planning. According to real-time road conditions and weather conditions, enterprises can dynamically adjust transportation routes to avoid congestion and delays and improve transportation efficiency; at the same time, the positioning module can also help enterprises better grasp the distribution of goods, reasonably plan warehousing and distribution strategies, and reduce operating costs. In addition, in emergency situations (such as natural disasters, traffic accidents, etc.), the positioning module can quickly determine the location of the packaging box and provide key information for rescue and emergency response, which helps to reduce disaster losses and ensure the safety of personnel and the integrity of goods.

[0050] In one embodiment, the packaging box is made of cardboard, foam or metal.

[0051] Specifically, cardboard has certain strength and toughness, which can effectively protect the internal items from external impact and extrusion; cardboard packaging boxes are relatively light, easy to handle and transport, and help reduce logistics costs; cardboard is usually derived from renewable resources, and is easy to recycle and reuse, meeting environmental protection requirements; cardboard is easy to print and customize, and can easily add product information, brand logos, etc. Among them, foam materials have excellent cushioning properties, can effectively absorb external impact, and protect internal items from damage; foam materials also have certain sound insulation and heat insulation effects, suitable for the packaging of items sensitive to sound and temperature; foam packaging boxes are usually light and soft, easy to shape and adapt to items of different shapes. Among them, metal materials have extremely high strength and rigidity, can provide strong protection for internal items, and are suitable for the packaging of heavy or high-value items; metal packaging boxes have excellent durability and can withstand long-term use and harsh environments; metal materials have certain anti-theft and anti-destruction capabilities, which can increase the safety of packaging boxes; metal packaging boxes can usually be reused many times, reducing packaging costs and reducing resource waste.

[0052] Specifically, data below the threshold will be saved in the MCU, and users can perform quality analysis and optimize the design through the retained data. Users can also collect and analyze these monitoring data, and use different packaging designs for different goods to achieve optimal improvement in cost and quality. In other words, by real-time monitoring of data of specific parameters (such as temperature, humidity, pressure, etc.) and comparing them with preset thresholds, once the data is below the threshold, the system will automatically save the data to the MCU. This mechanism helps to discover potential problems in time and prevent damage or quality degradation of goods. As a medium for data storage, the MCU can reliably save data below the threshold to ensure the integrity and accuracy of the data. Users can access the data saved in the MCU at any time to perform quality analysis and optimize the design. This traceability helps users understand the transportation and storage conditions of the goods and their impact on the quality of the goods. In addition, by analyzing the data saved in the MCU, users can gain an in-depth understanding of the quality status of the goods, identify potential quality problems, and take corresponding improvement measures. In addition, users can also use different packaging designs for different goods based on the analysis results to achieve optimal improvement in cost and quality. This customized design helps to improve the transportation efficiency and safety of goods while reducing packaging costs.

[0053] Among them, the monitoring terminal includes but is not limited to smart phones, tablet computers and monitoring equipment, which will not be elaborated here.

[0054] Among them, the packaging structure can be adapted to the technical fields of high-precision electronic components and server products. With the rapid development of logistics and e-commerce, the requirements for product packaging are getting higher and higher. The packaging structure has the advantages of real-time monitoring, high-precision detection, data recording and storage, traceability, etc. It can provide better protection for products and reduce damage caused by impact during transportation and storage. Therefore, it has broad application prospects and market potential.

[0055] See also Figure 2 As shown, an embodiment of the present invention provides a stress impact monitoring method, based on the above-mentioned packaging structure for recording stress impact, comprising the following steps:

[0056] S1, obtaining information collected by the stress sensor, that is, collected values;

[0057] Specifically, the stress impact information borne by the packaging structure is collected in real time through the stress sensor, that is, the collected value, which enables the monitoring system to timely understand the stress conditions of the packaging structure during transportation, storage, etc.

[0058] S2, determining whether the collected value exceeds a preset threshold;

[0059] S3, if the collected value does not exceed the preset threshold, the collected value is stored and saved;

[0060] S4: If the collected value exceeds the preset threshold, the collected value is uploaded to the monitoring terminal and an early warning is issued.

[0061] Specifically, a stress shock threshold value (for example, 5 kg, 20 kg, or 50 kg) is preset to determine whether the collected stress shock information exceeds the safety range. When the collected value exceeds the preset threshold, it indicates that the packaging structure may be subjected to excessive stress shock, and there is a risk of damage or damage to the internal product. At this time, the system uploads the collected value to the monitoring terminal and issues an early warning. For the collected values ​​that do not exceed the preset threshold, the system will store and save them, and these data can be used for subsequent quality analysis, optimization design, and accident tracing. Through the saved data, users can understand the stress conditions of the packaging structure during normal use, and then optimize the design of the packaging structure to improve its impact resistance. When the system issues an early warning, users can take timely measures, such as checking the integrity of the packaging structure, adjusting the transportation method or storage conditions, etc., to avoid or reduce damage to the internal products, which helps to reduce the company's economic losses and improve customer satisfaction and brand image. In addition, through real-time monitoring and early warning of stress shocks, the safety during transportation can be significantly improved. This monitoring is particularly important when transporting fragile, valuable, or environmentally sensitive items.

[0062] Among them, when the packaging box is subjected to stress impact, the stress data will be collected by the sensors installed in the packaging box. These stress data will be saved in the MCU, and the data will be filtered by the programmable unit in the MCU. The filtered data will be sent to the monitoring terminal through the wireless SIM card, or the monitoring terminal will access it through the wireless SIM card to monitor the transportation situation in real time; if the stress value exceeds the set stress, an early warning can be issued; the collected data can be analyzed and simulated through the background to judge the quality of the valuable electronic products being transported, and remind users to pay attention.

[0063] In other embodiments, by obtaining information collected by other sensors, such as temperature, humidity, air pressure, etc., the system can automatically compare and process them. That is, by monitoring these parameters in real time, the system can promptly detect potential environmental problems, such as excessive temperature, excessive humidity or abnormal air pressure, so as to take corresponding protective measures to prevent product damage or performance degradation.

[0064] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention may also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.

Claims

1. A packaging structure for recording stress impact, characterized in that: include: A packaging box body is provided with an IOT board inside the packaging box body, and the IOT board is provided with a controller, a battery and a wireless communication module. A stress sensor is also provided on the inner wall of the packaging box body. The stress sensor, the battery and the wireless communication module are all electrically connected to the controller, and the wireless communication module is communicatively connected to a monitoring terminal.

2. The packaging structure for recording stress impact according to claim 1, characterized in that: The inner wall of the packaging box is also provided with a temperature sensor, and the temperature sensor is electrically connected to the controller.

3. The packaging structure for recording stress impact according to claim 1, characterized in that: The inner wall of the packaging box is also provided with a humidity sensor, and the humidity sensor is electrically connected to the controller.

4. The packaging structure for recording stress impact according to claim 1, characterized in that: The four side walls of the packaging box are all provided with the stress sensors, and the bottom wall and the top wall of the packaging box are provided with pressure sensors.

5. The packaging structure for recording stress impact according to claim 1, characterized in that: The wireless communication module adopts Bluetooth, SIM card or radio frequency identification communication mode.

6. The packaging structure for recording stress impact according to claim 1, characterized in that: A fan component connected to the interior is also provided on the surface of the packaging box, and the fan component is electrically connected to the controller.

7. The packaging structure for recording stress impact according to claim 1, characterized in that: An air pressure sensor is also provided inside the packaging box, and an air filling and exhaust module connected to the inside is also provided on the surface of the packaging box. The air pressure sensor and the air filling and exhaust module are both electrically connected to the controller.

8. The packaging structure for recording stress impact according to claim 1, characterized in that: A positioning module is also provided inside the packaging box, and the positioning module is electrically connected to the controller.

9. The packaging structure for recording stress impact according to claim 1, characterized in that: The packaging box is made of cardboard, foam or metal.

10. A stress impact monitoring method, based on the packaging structure for recording stress impact according to any one of claims 1 to 9, characterized in that: The following steps are involved: Obtaining information collected by the stress sensor, that is, collected values; Determine whether the collected value exceeds a preset threshold; If the collected value does not exceed the preset threshold, the collected value is stored and saved; If the collected value exceeds the preset threshold, the collected value will be uploaded to the monitoring terminal and an early warning will be issued.

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