Film forming apparatus and adsorption method

Abstract

The invention provides a film forming apparatus and an adsorption method for adsorbing a substrate in a stable state through an adsorption member and stably maintaining the adsorption state. A film forming apparatus for forming a film by adhering a film forming material to a substrate is used, the film forming apparatus being characterized by comprising: a plurality of support members for supporting a peripheral edge portion of a first surface on which a film is to be formed in the substrate; a plurality of abutting members facing the plurality of support members, respectively, and abutting against a second surface of the substrate, the second surface being opposite to the first surface; a push-up member that pushes up a region of the first surface of the substrate inside of the peripheral edge portion in a state where the first surface of the substrate is supported by the plurality of support members and the plurality of contact members are in contact with the second surface; and an adsorption member that adsorbs the second surface of the substrate in a state in which the region on the inner side of the substrate is pushed up.

Description

Technical Field

[0001] The invention relates to a film forming device and an adsorption method. Background Art

[0002] In recent years, panels such as organic EL display devices have been widely used, and their application fields are expanding not only in smartphones but also in large panels such as large-scale televisions. As the size of such substrates increases, in film-forming devices that adhere evaporation materials to substrates to manufacture panels, adsorption members that adsorb substrates are used to stably support the substrates.

[0003] For example, Patent Document 1 discloses a method for reducing the deflection caused by the self-weight of a substrate that is enlarged. The method includes placing an electrostatic chuck on top of the substrate, applying a voltage to the electrostatic chuck, and utilizing electrostatic attraction to adsorb the upper surface of the substrate, thereby reducing the deflection of the substrate.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-099910 Summary of the invention

[0007] Problems to be solved by the invention

[0008] When the size of the substrate is further increased, the deflection of the substrate becomes larger in the stage where the substrate is placed on the support portion before being adsorbed to the adsorption member, and it becomes difficult for the adsorption member to stably adsorb the substrate, or even if the substrate can be adsorbed, it will peel off later. Therefore, it is required to be able to stably adsorb a large substrate with an adsorption member without causing the substrate to peel off or fall off later.

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technology for adsorbing a substrate in a stable state using an adsorption member and stably maintaining the adsorption state.

[0010] Solutions to Solve Problems

[0011] The present invention adopts the following structure. That is,

[0012] A film forming device is a film forming device for forming a film by attaching a film forming material to a substrate, characterized in that:

[0013] The film forming device comprises:

[0014] A plurality of supporting members supporting a peripheral portion of a first surface of the substrate on which film formation is to be performed;

[0015] a plurality of abutment members, facing the plurality of support members respectively, and abutting against a second surface of the substrate opposite to the first surface;

[0016] a pushing-up member for pushing up a region of the first surface of the substrate that is inside the peripheral portion, in a state where the first surface of the substrate is supported by the plurality of supporting members and the plurality of abutting members abut against the second surface; and

[0017] The suction member suctions the second surface of the substrate in a state where the inner region of the substrate is pushed up.

[0018] The present invention also adopts the following structure.

[0019] An adsorption method is an adsorption method for adsorbing and holding a substrate in a film forming device for forming a film by attaching a film forming material to the substrate, characterized in that:

[0020] The adsorption method has the following steps:

[0021] A step of supporting a peripheral portion of a first surface of the substrate on which a film is to be formed by using a plurality of supporting members;

[0022] a step of causing a plurality of contact members, each facing the plurality of support members, to contact a second surface of the substrate opposite to the first surface;

[0023] a step of pushing up a region of the first surface of the substrate that is located inside the peripheral portion by using a pushing-up member; and

[0024] A step of adsorbing the second surface of the substrate by using an adsorption member.

[0025] Effects of the Invention

[0026] According to the present invention, it is possible to provide a technology for adsorbing a substrate in a stable state using an adsorption member and for stably maintaining the adsorbed state. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a top view showing the structure of a film forming apparatus.

[0028] Figure 2 This is a schematic cross-sectional view of the film forming chamber.

[0029] Figure 3 This is a flow chart related to adsorption of a substrate.

[0030] Figure 4 This is a schematic cross-sectional view of a main portion of a film forming chamber related to the operation of the embodiment.

[0031] Figure 5 This is a schematic cross-sectional view of a main portion of a film forming chamber related to the operation of the embodiment.

[0032] Figure 6 This is a schematic cross-sectional view of a main portion of a film forming chamber related to the operation of the embodiment.

[0033] Figure 7 This is a schematic cross-sectional view of a main portion of a film forming chamber related to the operation of the embodiment.

[0034] Figure 8 This is a diagram illustrating an example of a push-up member.

[0035] Fig. 9 This is a diagram illustrating another example of the push-up member.

[0036] Fig.10 This is a diagram illustrating another example of the push-up member.

[0037] Fig.11 This is a diagram illustrating another example of the push-up member.

[0038] Fig.12 It is an explanatory diagram of an organic EL display device. DETAILED DESCRIPTION

[0039] The following is a detailed description of the embodiments of the present invention with reference to the accompanying drawings. However, the dimensions, materials, shapes, and relative configurations of the components described in the embodiments are not limited to these unless otherwise specified.

[0040] The present invention is applicable to a film forming device that forms a thin film of a film forming material on the surface of a film forming object such as a substrate by evaporation or the like. The present invention is understood as an electrostatic chuck, a substrate holding device, a film forming device, and a control method using these devices. The present invention is also understood as an electronic device manufacturing device and a control method thereof, and an electronic device manufacturing method. The present invention is also understood as a program that enables a computer to execute a control method or a manufacturing method, and a storage medium storing the program. The storage medium may also be a computer-readable non-temporary storage medium. The present invention can also be understood as a substrate adsorption method or a holding method.

[0041] As the material of the substrate in the present invention, any material such as glass, resin, metal, silicon, etc. can be used. As the film-forming material, any material such as organic material, inorganic material (metal, metal oxide) can be used. The "substrate" described below includes a substrate on which one or more films have been formed on the surface of the substrate material. The technology of the present invention is generally applicable to manufacturing devices for electronic devices and optical components. It is particularly suitable for organic electronic devices such as organic EL displays having organic EL elements and organic EL display devices using the organic EL displays. The present invention can also be used in thin-film solar cells and organic CMOS image sensors.

[0042] [Example 1]

[0043] (Device Structure)

[0044] Figure 1 1 is a top view schematically showing the structure of the film forming apparatus 1. Here, the production line of an organic EL display is described. When manufacturing an organic EL display, a substrate of a specified size is brought into the production line, and after the organic EL or metal layer is formed, a post-processing step such as cutting of the substrate is performed.

[0045] The film forming apparatus 1 includes a transfer chamber 130 arranged in the center, a plurality of film forming chambers 110 (110a to 110d) arranged around the transfer chamber 130, and a mask storage chamber 120 (120a, 120b). The film forming chamber 110 has a chamber for performing film forming processing on the substrate 10. The mask storage chamber 120 stores masks before and after use. The transfer robot 140 provided in the transfer chamber 130 transfers the substrate S or the mask M into and out of the transfer chamber 130. The transfer robot 140 is, for example, a robot having a manipulator for holding the substrate S or the mask M mounted on a multi-jointed arm.

[0046] The passage chamber 150 transfers the substrate S flowing from the upstream side in the substrate transfer direction to the transfer chamber 130. The buffer chamber 160 transfers the substrate S that has completed the film forming process in the transfer chamber 130 to other film forming groups on the downstream side. When receiving the substrate S from the passage chamber 150, the transfer robot 140 transfers the substrate S to one of the plurality of film forming chambers 110. The transfer robot 140 also receives the substrate S that has completed the film forming process from the film forming chamber 110 and transfers it to the buffer chamber 160.

[0047] Figure 1 The film forming apparatus 1 shown constitutes a film forming group, and can be connected to other film forming groups on the upstream side or downstream side. A swirl chamber 170 for changing the direction of the substrate 10 is provided on the upstream side of the passage chamber 150 and the downstream side of the buffer chamber 160. Each chamber such as the film forming chamber 110, the mask storage chamber 120, the transfer chamber 130, the buffer chamber 160, and the swirl chamber 170 is maintained in a high vacuum state during the manufacturing process.

[0048] The film-forming materials in the multiple film-forming chambers 110a to 110d of the film-forming device 1 may be the same or different. For example, different film-forming material film-forming sources may be respectively arranged in the film-forming chambers 110a to 110d, and the substrate S forms a stacked structure while sequentially moving in the film-forming chambers 110a to 110d. In addition, by arranging the same film-forming material film-forming sources in the film-forming chambers 110a to 110d, multiple substrates S may be film-formed in parallel. In addition, a first film-forming material may be arranged in the film-forming chambers 110a and 110c, and a second film-forming material may be arranged in the film-forming chambers 110b and 110d, and control may be performed so that after the first layer is formed in the film-forming chamber 110a or 110c, the second layer is formed in the film-forming chamber 110b or 110d.

[0049] Depending on the type of electrostatic chuck, when a conductor is attached to the substrate, the adsorption force of the substrate can be improved. In this case, when a thin film of a metal material as an electrode layer has been formed in the region of the substrate where the organic EL element is formed (typically the central portion of the substrate), effective adsorption can be achieved. For example, when an electrode layer is formed on a substrate in the film forming chamber 110a, and an organic layer is formed in sequence in the film forming chambers 110b to 110d, it is effective to configure an electrostatic chuck in the film forming chambers 110b to 110d.

[0050] (Film Forming Room)

[0051] Figure 2 1 is a cross-sectional view showing the internal structure of the film forming chamber 110. In the film forming chamber 110, a series of film forming processes are performed, including receiving the substrate S or the mask M from the transfer robot 140, handing over the substrate S or the mask M to the transfer robot 140, holding the substrate S using the electrostatic chuck C, adjusting the alignment of the relative position relationship between the substrate S and the mask M, fixing the substrate S to the mask M, and film forming. In the following description, an XYZ orthogonal coordinate system with the vertical direction as the Z direction is used, and θ represents the rotation around the Z axis. In addition, for components that appear symmetrically on the left and right, for simplicity, only one of the left and right sides is given a reference numeral.

[0052] The film forming chamber 110 has a chamber 200. The interior of the chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen during film forming. An electrostatic chuck C, a plurality of substrate support portions 232a (a plurality of support members), a mask stage 221, an evaporation source 240 (film forming source), etc. are provided inside the chamber 200. The following description of the interior of the chamber is centered on the structure for moving the substrate S, the mask M, the electrostatic chuck C, and the magnet G. In the following description, the mechanism for lifting or moving each component can be realized by a combination of an existing driving mechanism, such as a ball screw or a rack and pinion mechanism operated by the driving force of a motor, and therefore a detailed description is omitted.

[0053] The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate. As the mask M, for example, a metal mask formed around a metal foil with a pattern supported by a frame can be used. After the mask M is moved into the chamber 200, it is first placed on the temporary mask receiving portion 224a. The temporary mask receiving portion lifting mechanism 224 is fixed to the chamber ceiling 200a via the temporary mask receiving portion support plate 224b, and the temporary mask receiving portion 224a can be raised and lowered (indicated by arrow E in the figure). The temporary mask receiving portion 224a is lowered by the temporary mask receiving portion lifting mechanism 224, and the mask M placed on the temporary mask receiving portion 224a is placed on the mask stage 221.

[0054] The mask stage 221 of this embodiment is a magnetically suspended mechanism having a first magnetic generating unit 221a. In addition, the film forming chamber 110 is provided with a mask stage support mechanism 222 having a second magnetic generating unit 222a in the form of being suspended and fixed on the chamber ceiling 200a. The voltage applied to the first magnetic generating unit 221a and the second magnetic generating unit 222a is controlled by the control unit 270, and the mask stage 221 is magnetically suspended by electromagnetic force. In this suspended state, XY movement and θ rotation (indicated by the cross-shaped arrow L in the figure) can be performed by magnetic force. In addition, the mask stage support mechanism 222 also has a mask stage support part 222b that supports the mask stage 221 when the mask stage 221 is not suspended. However, the mechanism for supporting and moving the mask is not limited to the method using magnetic force. In addition, in the method using magnetic force, it is not limited to the method of suspending the mask stage 221. For example, in the method in which the mask stage 221 is moved by rolling through bearings, etc., magnetic force can also be used in the movement.

[0055] When the substrate S is carried into the chamber 200, it is pointed by a plurality of substrate support parts 232a in the shape of supporting claws. The substrate support part lifting mechanism 232 can change the height of the substrate S in the Z direction (a direction perpendicular to the substrate surface) (indicated by arrow F in the figure) by using a driving mechanism to lift and lower the substrate support part 232a. The substrate S of this embodiment is arranged roughly horizontally, with the film-forming surface facing downward, and the evaporation material discharged from the bottom is attached in an upward deposition method.

[0056] Here, above the chamber 200, a base portion 238 is fixed to the chamber ceiling 200a. A lifting plate 230 is also provided above the chamber 200 so as to be able to be lifted and lowered relative to the base portion 238. That is, the lifting plate 230 can move up and down in the Z direction while maintaining parallelism with the chamber ceiling 200a. On the lifting plate 230, an electrostatic chuck C is provided via an electrostatic chuck support shaft 230a, and a substrate support lifting mechanism 232 is provided. That is, by moving the lifting plate up and down, the electrostatic chuck C and the substrate support 232a can move together without changing the relative positional relationship.

[0057] Moreover, in the present embodiment, a push-up member 246a is connected to the lifting plate 230 via a push-up member support portion 246 such as an axis. It is preferred that a retraction mechanism be provided in the film forming chamber, and the retraction mechanism is used to move the push-up member 246a between a position facing the central portion of the film forming surface of the substrate S, i.e., a push-up position, and a retraction position separated from the area facing the substrate. The push-up member 246a can be made of any material such as metal, resin, rubber, etc., but at least in the abutment portion, it is preferred to use a material that will not damage the surface even when subjected to a load from the substrate S. In addition, the central portion of the film forming surface of the substrate S is at least a region different from the peripheral portion clamped by the substrate support portion 232a or the substrate abutment portion 232b, and can also be referred to as a pushed-up portion. The central portion is typically a region that is closer to the inside than the peripheral portion. In addition, if it is an unclamped region, the push-up member 246a can abut even the end portion of the substrate S, such as in the later-described Figure 8 In (b), the region facing the pushing-up member 246a is referred to as a pushed-up portion.

[0058] As the lifting plate 230 moves in the Z direction, the push-up member 246a also moves. Alternatively, the push-up member support portion 246 may also have a driving mechanism for moving the push-up member 246a up and down. The push-up member 246a moves (indicated by arrow P in the figure) through the operation of the driving mechanism, and when it abuts against the substrate S, it can support the load of the substrate S.

[0059] In addition, in the substrate support lifting mechanism 232, a plurality of substrate abutting portions 232b (a plurality of abutting members) are provided at positions facing the plurality of substrate support portions 232a, respectively. When the substrate S is placed on the substrate support portion 232a, the control unit 270 lowers the substrate abutting portion 232b, thereby clamping the substrate S between the substrate support portion 232a and the substrate abutting portion 232b. When clamping, the substrate S can be completely fixed, or it can be clamped with a certain degree of gap so that the substrate S can move within a specified limit range.

[0060] The electrostatic chuck C is an adsorption component of the substrate S inside the film forming chamber, and uses electrostatic force to adsorb and hold the substrate S supported by the substrate support part 232a. The electrostatic chuck C is in contact with the surface (second surface) of the substrate S opposite to the surface (first surface, film-forming surface) in contact with the mask M. As described above, as the lifting plate 230 moves in the Z direction, the electrostatic chuck C also moves. When the electrostatic chuck C holds the substrate S supported by the substrate support part 232a, first, the substrate support lifting mechanism 232 raises the substrate S and / or the lifting plate 230 lowers the electrostatic chuck C, so that the electrostatic chuck C is in contact with or sufficiently close to the substrate S. Then, the control unit 270 controls the power supply 290 to apply a specified adsorption voltage to the electrode buried in the electrostatic chuck C. As a result, an electrostatic force is generated, and the electrostatic chuck C adsorbs and holds the substrate S.

[0061] A magnet G for attracting the mask M is arranged at the upper part of the electrostatic chuck C in the Z direction. The magnet G is connected to a magnet lifting mechanism 244 provided on the base portion 238 via a shaft. The driving device is operated by the magnet lifting mechanism 244, and the magnetic force of the magnet G affects the mask M via the electrostatic chuck C and the substrate S, and the mask M is pulled upward. As a result, the adhesion between the mask M and the substrate S is improved, and the accuracy of film formation is improved. In addition, it is preferred to provide a cooling member inside or on the electrostatic chuck C and inside or on the magnet G to suppress the temperature rise of the substrate S during film formation and prevent the deterioration or degradation of the organic material.

[0062] The evaporation source 240 is a film-forming source including a container such as a crucible for accommodating the evaporation material, a heater, a baffle, a drive mechanism, an evaporation rate monitor, etc. As the evaporation material, a material required for forming a desired film can be used, such as a metal material or an organic material. In addition, the film-forming source is not limited to an evaporation source, and a sputtering device can also be used.

[0063] Thus, in the structure of the present embodiment, by driving the substrate S, the mask M and the electrostatic chuck C respectively, the position, height and relative distance of the substrate S, the mask M and the electrostatic chuck C can be adjusted. Thus, by combining the potential control based on the control unit 270, various actions required for film formation such as the holding of the substrate S or the mask M by the electrostatic chuck C or the magnet G, the relative position adjustment (alignment) of the substrate S and the mask M can be performed. In addition, as long as these actions can be performed, it is not limited to the structure of the present embodiment. For example, the alignment component of the substrate S and the mask M can move either the substrate S or the mask M, or both. In addition, with respect to the movement in the Z direction, any one of the substrate S, the mask M and the electrostatic chuck C can also be moved.

[0064] A camera 261 for optically photographing and generating image data is provided at the upper portion of the chamber 200. The camera 261 photographs through a vacuum sealing window provided in the chamber 200. In the present embodiment, a plurality (four) of cameras 261 are provided corresponding to the four corners of the substrate S. Each camera 261 is arranged so as to include the substrate alignment mark provided at the corner of the substrate S and the mask alignment mark provided at the corner of the mask M within the photographing range.

[0065] During alignment, the camera 261 captures the substrate S and the mask M, and outputs the image data to the control unit 270. The control unit 270 analyzes the image data and obtains the position information of the substrate alignment mark and the mask alignment mark by pattern matching processing or other methods. Then, based on the positional offset of the substrate alignment mark and the mask alignment mark, the XY direction, the moving distance, and the rotation angle θ when the substrate S and the mask M are relatively moved are calculated. Then, the calculated movement amount is converted into the driving amount of each driving mechanism to generate a control signal. In addition, a camera for rough alignment with a low resolution but a wide field of view and a camera for fine alignment with a narrow field of view but a high resolution can be used for two-stage alignment.

[0066] The control unit 270 is an information processing device that communicates with each component via a control line or wireless communication not shown in the figure, receives data or sends signals to control the action. The control unit 270 can be composed of a computer having a processor, a memory, a storage device, an I / O, etc. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or the storage device. As a computer, a general-purpose personal computer can be used, or an embedded computer or a PLC (Programmable Logic Controller) can be used. Alternatively, part or all of the functions of the control unit 270 can also be composed of a circuit such as an ASIC or an FPGA. In addition, a control unit 270 can be set in each film forming chamber, or a plurality of film forming chambers can be controlled by one control unit 270.

[0067] The power supply 290 is a high-voltage power supply device that supplies voltage to each component via a conductive line not shown. The power supply 290 controls the polarity and magnitude of the applied voltage according to the instruction from the control unit 270. By controlling the polarity or magnitude of the applied voltage (adsorption voltage) to the electrode of the electrostatic chuck C, the adsorption force to the substrate S can be controlled. In addition, by controlling the voltage applied to the first magnetic generating unit 221a and the second magnetic generating unit 222a, the suspension or alignment control of the mask stage 221 can be performed. In addition, it is also conceivable that the power supply 290 and the control unit 270 are combined to form the power supply of the film forming device.

[0068] The present invention is not limited to the above-mentioned cluster type film forming apparatus, but can also be applied to an in-line type film forming apparatus in which a plurality of chambers are connected in a vacuum manner and a film is formed while a substrate held on a substrate carrier moves between chambers.

[0069] (Electrostatic chuck)

[0070] The electrostatic chuck C has a structure in which a circuit such as a metal electrode is embedded in a plate-shaped substrate made of ceramic or the like. Generally speaking, there are types of electrostatic chucks such as gradient force type, Coulomb force type, and Johnson-Rabeck force type according to the principle of adsorption of the substrate, but in any case, the higher the adsorption voltage applied, the higher the adsorption force can be. An example of a method for manufacturing the electrostatic chuck C is a method in which an electrode is arranged on a ceramic thermal spray layer composed of a titanium base material and an insulating layer, a dielectric layer is formed, and finally a ceramic thermal spray is used for sealing.

[0071] The gradient force type electrostatic chuck uses the attraction generated toward the area with the potential gradient (gradient) generated by the potential difference between the electrodes to adsorb the adsorption object. Since the gradient force has the characteristic of being generated even if the adsorption object is an insulator, even a glass substrate with plain glass or a conductive material without a film formed can be held. When the gradient force is generated, the adsorption voltage is applied in such a way that the potential of the first electrode is higher than the reference and the potential of the second electrode is lower than the reference, taking the potential of the adsorption object as a reference. In order to increase the gradient force and to make the potential gradient as steep as possible, it is necessary to reduce the space between the electrodes and to arrange the electrodes densely. Therefore, as an electrode for a gradient force type electrostatic chuck, it is preferred to have two comb-tooth electrodes with a structure in which protruding comb teeth mesh with each other.

[0072] The Coulomb force type electrostatic chuck is a chuck that adsorbs the adsorbed object by generating electrostatic attraction by applying positive and negative potential voltages to two electrodes respectively, and is effective when the adsorbed object is a conductor. Therefore, if the electrode layer of the metal material is a substrate on which the film has been formed, it can be effectively adsorbed. When the adsorbed object is in an ungrounded floating state, by making both the positive electrode and the negative electrode face the adsorbed object, polarization can be generated in the adsorbed object and adsorption can be performed. In addition, when the adsorbed object is grounded, adsorption can be performed by at least one of the positive electrode and the negative electrode. The Coulomb force is generally stronger than the gradient force. In addition, the larger the area of ​​the electrode facing the adsorbed object, the stronger the adsorption force. Therefore, in order to increase the adsorption force, it is necessary to increase the proportion of the electrode area to the electrostatic chuck area as much as possible.

[0073] Johnson-Rabec force type electrostatic chucks adsorb the conductive adsorption object by passing leakage current in the order of positive electrode, adsorption object, and negative electrode. It is necessary to arrange a dielectric with a volume resistance value within a specified range between the electrode and the adsorption object. Johnson-Rabec force is generally stronger than Coulomb force. In addition, in Johnson-Rabec force type electrostatic chucks, the larger the contact area with the adsorption object, the stronger the adsorption force can be.

[0074] (Processing Flow)

[0075] Reference Figure 3The flowchart of FIG. 1 is used to illustrate the process of the adsorption method of the substrate S in this embodiment. Figures 4 to 7 This is a schematic cross-sectional view showing the state inside the chamber 200 of the film forming chamber 110 during processing, and parts not related to the description of this step are omitted.

[0076] This process starts when the substrate S is moved into the film forming chamber 110 by the transfer robot 140. In step S101, Figure 4 As shown in (a), the substrate support part 232a receives and supports the carried-in substrate S. Although it depends on the size of the substrate S, the center part of the substrate S supporting the end part is bent and drooped due to its own weight.

[0077] In step S102, Figure 4 As shown in (b), the substrate abutment portion 232b is lowered to clamp the end of the substrate S between the substrate support portion 232a (arrow T). At this time, the distance R in the Z direction between the substrate support portion 232a and the substrate abutment portion 232b is longer than the thickness of the substrate S. That is, the substrate support portion 232a and the substrate abutment portion 232b (the two together are also referred to as clamping portions) do not completely fix the substrate S, but are clamped with a certain degree of gap width. As a result, the substrate S can be moved in the XY plane while limiting the movement of the substrate S in the Z direction within a certain range.

[0078] In step S103, Figure 5 As shown in (a), the push-up member support portion 246 causes the push-up member 246a to rise, pushing up the central portion of the substrate S (arrow P). As a result, the deflection of the substrate S is reduced and the flatness is improved. At this time, due to the existence of the gap in the Z direction, the end of the substrate S extends along the peripheral direction of the substrate S while maintaining the position between the substrate support portion 232a and the substrate abutment portion 232b. Therefore, since the deflection of the central portion of the substrate S does not propagate when pushing up, the substrate S does not rise or fall, and becomes a flat shape.

[0079] In step S104, Figure 5 As shown in (a), the electrostatic chuck C adsorbs the substrate S. At this time, the electrostatic chuck C is lowered by the driving of the lifting plate 230. When the relative distance between the electrostatic chuck C and the substrate S is sufficiently close, the control unit 270 controls the power supply 290 to apply an adsorption voltage to the electrostatic chuck C. The electrostatic chuck C adsorbs and holds the substrate S through the electrostatic force thus generated. After the substrate S is held, since it is not necessary to clamp the substrate, the substrate support portion 232a, the substrate contact portion 232b, the push-up member 246a, etc. can be retracted.

[0080] In step S105, Figure 6As shown, the substrate S and the mask M are aligned. At this time, the mask M on the mask stage 221 and the substrate S are kept at a predetermined alignment distance in the Z direction, and are suspended by the electromagnetic force between the first magnetic generating portion 221a of the mask stage 221 and the second magnetic generating portion 222a of the mask stage supporting mechanism 222. Then, the control unit 270 controls the voltage applied to the first magnetic generating portion 221a and the second magnetic generating portion 222a to move the mask stage 221XY and θ-rotate so that the substrate alignment marks at the four corners of the substrate and the mask alignment marks at the four corners of the mask captured by the camera 261 are in a predetermined positional relationship.

[0081] When alignment is complete, Figure 7 As shown, in step S106, the control unit 270 raises the mask stage 221 so that the mask M contacts the substrate S. In addition, the magnet G is lowered to attract the mask M upward by magnetic force. Thus, the substrate S and the mask M are combined. Then, the control unit 270 causes the temperature in the crucible to rise by passing an electric current through the heater of the evaporation source 240, so that the evaporation material is vaporized. Thus, the evaporation material flies toward the film-forming surface of the substrate S, and forms a thin film corresponding to the prescribed pattern of the mask M.

[0082] According to the method shown in the above flow, when the electrostatic chuck C adsorbs the substrate S, the central portion of the substrate S is pushed up, thereby reducing the deflection and improving the flatness. Therefore, even for a relatively large substrate, the undulation and bounce can be suppressed when the electrostatic chuck C adsorbs, and the peeling and falling of the adsorbed substrate can be prevented.

[0083] (Push-up member)

[0084] Various examples of the push-up member 246a applicable to the present embodiment are described below. From the time when the substrate S is supported by the substrate support portion 232a to the time when it is adsorbed by the electrostatic chuck C, the push-up member 246a only needs to have the function of pushing the substrate S in the direction opposite to gravity, regardless of shape or material. In addition, in order not to hinder the push-up member 246a during alignment or vapor deposition, it is preferred to provide a structure for retreating the push-up member 246a from a position facing the substrate after the substrate S is adsorbed by the electrostatic chuck C. However, if alignment or vapor deposition is not hindered, a retreat mechanism is not necessarily required.

[0085] Figure 8 It is a diagram for explaining the rod-shaped push-up member 246a. Figure 8 (a) is Figure 2 The XZ cross section is different from the YZ cross section. By driving the push-up member 246a in the upward direction, the center portion of the substrate S is pushed up. Figure 8 (b) is an XY plane view showing the planar positional relationship between the substrate S and the push-up member 246a. Figure 8(c) is an example of the shape of a rod-shaped push-up member 246a, the end of which is connected to the driving mechanism, and the central part is in contact with the substrate S. The upper surface of the push-up member 246a in this figure is roughly rectangular, and the load of the substrate S is supported by the line contact between the sides of the upper surface and the film-forming surface of the substrate S. However, the structure of supporting the substrate S is not limited to this, for example, it can also be supported by surface contact of the upper surface, or a component with cushioning properties such as resin or rubber can be arranged on the upper surface. In addition, as a rod-shaped push-up member 246a, it can also be used by applying tension to a rope-shaped member formed of a metal material or the like.

[0086] In addition, Figure 8 Although only one push-up member 246a is provided in the figure, the number is not limited to one, and a number of push-up members 246a corresponding to the size of the substrate S may be provided. For example, three rod-shaped push-up members 246a may be provided in parallel.

[0087] Fig. 9 FIG. 2 is a diagram for explaining another example of the rod-shaped push-up member 246a. Fig. 9 As shown in (a), the push-up member 246a of this example is divided into two parts, which move up and down in the Z direction synchronously. Fig. 9 (b) Fig. 9 As shown in (c), when alignment or vapor deposition is performed, the left and right push-up members 246a can slide and move to the retreat position from the push-up position facing the substrate S. With such a structure, the substrate S can be stably adsorbed, and retreat becomes easy when no push-up is performed.

[0088] In addition, Fig. 9 In the example shown in FIG. 1 , only one set of push-up members 246 a is provided, but a number of push-up members 246 a corresponding to the size of the substrate S may be provided. For example, three sets of rod-shaped push-up members 246 a may be provided in parallel.

[0089] Fig.10 24 shows an example of a push-up member 246a of a type in which the supported end rotates in a cantilever beam shape. Fig.10 (a) YX plane diagram and Fig.10 As shown in the cross-sectional view of the XZ plane of (b), the push-up member 246a is supported by the support base 246b at the fixed end while pushing up the substrate S at the free end. Then, after the substrate S is adsorbed and held by the electrostatic chuck C, as shown in FIG. Fig.10 As shown in (c), the fixing angle of the fixing end can be changed by the driving mechanism provided in the support base 246b, and the fixing end can be moved to the retracted position.

[0090] Fig.11 24 shows an example of a pin-shaped push-up member 246a that moves up and down in the Z direction. Fig.11As shown in the cross-sectional view of the XZ plane of (a), one end of the push-up member 246a is supported by the support base 246b, and the other end pushes up the substrate S. Then, after the substrate S is adsorbed and held by the electrostatic chuck C, as shown in FIG. Fig.11 As shown in (b), the push-up member 246a can be moved to the downward retreat position by the driving mechanism provided in the support base 246b. Fig.11 (c) shows an example of the position where the film formation surface of the substrate S is pushed up by the end of the pin, but the present invention is not limited to this.

[0091] As described above, according to the present invention, the deflection of the substrate S is reduced by pushing up the central portion of the substrate by the push-up member 246a. In addition, since the ends of the substrate S are not completely fixed but are lightly clamped to the extent that the substrate S can be extended, the deflection of the substrate S is driven toward the ends and absorbed. In such a state, the electrostatic chuck C adsorbs the substrate S, which can suppress the fluctuation and bounce during adsorption, so that the substrate can be stably held. Therefore, it is possible to prevent the substrate from peeling off or falling after adsorption.

[0092] [Method for manufacturing electronic device]

[0093] Hereinafter, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device will be shown, and a method for manufacturing the organic EL display device will be described.

[0094] First, the organic EL display device to be manufactured will be described. Fig.12 (a) is an overall view of an organic EL display device 180. Fig.12 (b) shows the cross-sectional structure of one pixel.

[0095] like Fig.12 As shown in (a), in the display area 151 of the organic EL display device 180, a plurality of pixels 152 having a plurality of light-emitting elements are arranged in a matrix. The details will be described later, and the light-emitting elements each have a structure having an organic layer clamped by a pair of electrodes. The pixel mentioned here refers to the smallest unit that can display a desired color in the display area 151. In the case of the organic EL display device of this embodiment, the pixel 152 is composed of a combination of a first light-emitting element 152R, a second light-emitting element 152G, and a third light-emitting element 152B representing different light emission. The pixel 152 is mostly composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it can also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and there is no particular limitation as long as it is at least one color.

[0096] Fig.12 (b) Yes Fig.12(a) is a partial cross-sectional schematic diagram of the AB line. The pixel 152 is composed of a plurality of light-emitting elements, each of which has a first electrode (anode) 154, a hole transport layer 155, any one of the light-emitting layers 156R, 156G, and 156B, an electron transport layer 157, and a second electrode (cathode) 158 on a substrate 153. Among them, the hole transport layer 155, the light-emitting layers 156R, 156G, 156B, and the electron transport layer 157 are equivalent to organic layers. In addition, in the present embodiment, the light-emitting layer 156R is an organic EL layer that emits red, the light-emitting layer 156G is an organic EL layer that emits green, and the light-emitting layer 156B is an organic EL layer that emits blue. The light-emitting layers 156R, 156G, and 156B are respectively formed into patterns corresponding to light-emitting elements (sometimes also described as organic EL elements) that emit red, green, and blue. In addition, the first electrode 154 is formed separately for each light-emitting element. The hole transport layer 155, the electron transport layer 157, and the second electrode 158 may be formed by the plurality of light-emitting elements 152R, 152G, and 152B together, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 154 and the second electrode 158 from being short-circuited due to foreign matter, an insulating layer 159 is provided between the first electrode 154. Furthermore, since the organic EL layer is degraded by moisture or oxygen, a protective layer 145 is provided to protect the organic EL element from moisture or oxygen.

[0097] exist Fig.12 In (b), the hole transport layer 155 and the electron transport layer 157 are represented by one layer, but according to the structure of the organic EL display element, they can also be formed by multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure can also be formed between the first electrode 154 and the hole transport layer 155, and the energy band structure can smoothly inject holes from the first electrode 154 to the hole transport layer 155. Similarly, an electron injection layer can also be formed between the second electrode 158 and the electron transport layer 157.

[0098] Next, an example of a method for manufacturing an organic EL display device will be described in detail.

[0099] First, a circuit (not shown) for driving the organic EL display device and the substrate 153 on which the first electrode 154 is formed are prepared.

[0100] Acrylic resin is formed by spin coating on the substrate 153 having the first electrode 154 formed thereon, and patterned by photolithography to form an opening at the portion where the first electrode 154 is formed, thereby forming an insulating layer 159. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0101] The substrate 153 patterned with the insulating layer 159 is carried into the first organic material film forming device, and the substrate is held by the substrate support table and the electrostatic chuck, and the hole transport layer 155 is formed as a common layer on the first electrode 154 in the display area. The hole transport layer 155 is formed by vacuum evaporation. In fact, the hole transport layer 155 is formed to a larger size than the display area 151, so a high-definition mask is not required.

[0102] Next, the substrate 153 formed up to the hole transport layer 155 is carried into the second organic material film forming device and held by the substrate support table and the electrostatic chuck. The substrate and the mask are aligned, the substrate is placed on the mask, and the red light emitting layer 156R is formed on the portion of the substrate 153 where the red light emitting element is arranged.

[0103] Similar to the film formation of the light-emitting layer 156R, the green light-emitting layer 156G is formed by the third organic material film-forming device, and the blue light-emitting layer 156B is further formed by the fourth organic material film-forming device. After the film formation of the light-emitting layers 156R, 156G, and 156B is completed, the electron transport layer 157 is formed on the entire display area 151 by the fifth film-forming device. The electron transport layer 157 is formed as a common layer on the three-color light-emitting layers 156R, 156G, and 156B.

[0104] The substrate on which the electron transport layer 157 has been formed is moved in a metallic vapor deposition material film forming apparatus to form a second electrode 158 .

[0105] Thereafter, the process moves to a plasma CVD device to form a protective layer 145 , thereby completing the organic EL display device 180 .

[0106] If the substrate 153 having the insulating layer 159 patterned thereon is exposed to an atmosphere containing moisture or oxygen from the time when it is carried into the film forming apparatus to the completion of the film forming of the protective layer 145, the light-emitting layer composed of the organic EL material may be degraded by moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0107] Description of Reference Numerals

[0108] 1: film forming device; 232a: substrate supporting portion; 232b: substrate abutting portion; 246a: push-up portion; C: electrostatic chuck; S: substrate.

Claims

1. A film forming device, which is a film forming device for forming a film by attaching a film forming material to a substrate, characterized in that: The film forming device comprises: A plurality of supporting members supporting a peripheral portion of a first surface of the substrate on which film formation is to be performed; a plurality of abutment members, facing the plurality of support members respectively, and abutting against a second surface of the substrate opposite to the first surface; a pushing-up member for pushing up a region of the first surface of the substrate that is closer to the inner side than the peripheral portion, in a state in which the first surface of the substrate is supported by the plurality of supporting members and the plurality of abutting members abut against the second surface; as well as The suction member suctions the second surface of the substrate in a state where the inner region of the substrate is pushed up.

2. The film forming device according to claim 1, characterized in that: The film forming device further includes a film forming source that discharges the film forming material from a position below the substrate. The film is formed on the substrate in a state where the first surface faces downward.

3. The film forming device according to claim 1, characterized in that: In a direction perpendicular to the substrate, a distance between the support member and the abutment member is longer than a thickness of the substrate.

4. The film forming device according to claim 3, characterized in that: The push-up member pushes up the inner region of the substrate in a state where the substrate is sandwiched between the support member and the abutment member with a gap therebetween.

5. The film forming device according to any one of claims 1 to 4, characterized in that: The adsorption member is an electrostatic chuck that utilizes electrostatic force to adsorb and hold the substrate. The film forming apparatus further includes a control unit that controls an adsorption voltage applied to the adsorption member.

6. The film forming device according to claim 5, characterized in that: After the inner region of the substrate is pushed up by the push-up member, the control unit applies the adsorption voltage in a state where the distance between the adsorption member and the substrate is close.

7. The film forming apparatus according to any one of claims 1 to 4, characterized in that: The film forming device forms a film in a predetermined pattern by causing a film forming material to adhere to the substrate via a mask.

8. The film forming device according to claim 7, characterized in that: The mask is a metal mask, The film forming apparatus further includes a magnet configured to attract the mask by magnetic force via the adsorption member and the substrate.

9. The film forming device according to claim 7, characterized in that: The film forming apparatus further includes an alignment member that performs relative position adjustment between the substrate and the mask.

10. The film forming apparatus according to any one of claims 1 to 4, characterized in that: The film forming apparatus further includes a retracting mechanism that retracts the push-up member from a region facing the substrate after the adsorption member adsorbs the substrate.

11. The film forming apparatus according to any one of claims 1 to 4, characterized in that: The push-up member is a rod-shaped member.

12. The film forming device according to claim 11, characterized in that: The rod-shaped push-up member is slidably retracted from a region facing the substrate.

13. The film forming apparatus according to any one of claims 1 to 4, characterized in that: The push-up member has a free end for pushing up the substrate and a fixed end fixed to the support base. The support base is capable of moving the push-up member between a push-up position and a retracted position.

14. The film forming apparatus according to any one of claims 1 to 4, characterized in that: The push-up member is a pin-shaped member that pushes up the substrate from below.

15. An adsorption method for adsorbing and holding a substrate in a film forming device for forming a film by attaching a film forming material to the substrate, characterized in that: The adsorption method has the following steps: A step of supporting a peripheral portion of a first surface of the substrate on which a film is to be formed by using a plurality of supporting members; a step of causing a plurality of contact members, each facing the plurality of support members, to contact a second surface of the substrate opposite to the first surface; A step of pushing up a region of the first surface of the substrate that is located inside the peripheral portion by using a pushing-up member; as well as A step of adsorbing the second surface of the substrate by using an adsorption member.

Images