IGBT control circuit, control method, test circuit, storage medium and program product

Abstract

The embodiment of the invention belongs to the semiconductor circuit technology, and provides an IGBT control circuit, a control method, a test circuit, a storage medium and a program product, the control circuit comprises a plurality of IGBT modules, and each IGBT module comprises an input end used for connecting a load; the output end is used for grounding; a control terminal; wherein the input ends of the IGBT modules are connected; the control module is connected with the control end of each IGBT module; the control module is configured to obtain the temperature of each IGBT module; when the plurality of IGBTs are to be conducted, determining the conduction sequence of each IGBT according to the comparison result of the temperatures of the plurality of IGBT modules; and controlling the conduction of the IGBTs according to the conduction sequence. According to the invention, the service life of the IGBT can be ensured to be the same.

Description

Technical Field

[0001] The embodiments of the present application relate to semiconductor circuit technology, and more specifically, to an IGBT control circuit, a control method, a test circuit, a storage medium, and a program product. Background Art

[0002] In the related art, in order to meet the needs of high-power circuit design, high-power circuit design is usually carried out in the following two ways: 1. Using an IGBT module whose rated current is suitable for the power level for circuit design; 2. Using a single IGBT with a smaller current tolerance. Although the current it withstands is small, multiple IGBTs can be used in parallel to achieve the required power level.

[0003] When using the first solution, there may be problems of increasing costs and making the driving circuit more complicated. However, the second solution is more popular in the industry because of its advantages of relatively low cost, sufficient device sources, low driving power and simple driving circuit.

[0004] However, when a circuit is designed using multiple IGBTs and the power level required by the circuit is met, there is at least a problem of different service lives of the IGBTs. Summary of the invention

[0005] The embodiments of the present application provide an IGBT control circuit, a control method, a test circuit, a storage medium, and a program product, which can ensure that the service life of the IGBTs is the same.

[0006] In a first aspect, an embodiment of the present application provides an IGBT control circuit, the control circuit comprising:

[0007] Multiple IGBT modules, the IGBT modules include:

[0008] Input terminal, used to connect the load;

[0009] Output terminal, used for grounding;

[0010] Control terminal;

[0011] Wherein, the input terminals of each IGBT module are connected;

[0012] The control module is connected to the control terminals of each IGBT module; the control module is configured as follows:

[0013] Get the temperature of each IGBT module;

[0014] When multiple IGBTs are to be turned on, a turn-on sequence of each IGBT is determined according to a comparison result between the temperatures of the multiple IGBT modules;

[0015] The conduction of each IGBT is controlled in a conduction sequence.

[0016] The IGBT control circuit provided in the embodiment of the present application can determine the comparison results between the temperatures of multiple IGBT modules when multiple IGBTs need to be turned on, and further determine the turn-on sequence of each IGBT based on the comparison results between the temperatures, through the above structure and the above control method. In this way, the control module can control the turn-on of each IGBT in the above determined turn-on sequence, so that the IGBT with a smaller current bearing can be used, and the cost can be relatively low, while ensuring the consistency of the temperature rise of the IGBT, so that the service life of the IGBT is consistent, avoiding problems such as device damage.

[0017] In some embodiments of the present application, the control module is configured as follows:

[0018] When the temperatures of at least two IGBT modules are different, controlling the IGBT module with the lowest temperature among the at least two IGBT modules to be turned on first;

[0019] After a preset time, the IGBT module with the lowest temperature among the at least one IGBT module that is not turned on is controlled to be turned on.

[0020] The control method of the IGBT control circuit provided in this embodiment controls the IGBT module with the lowest temperature among at least two IGBT modules to be turned on first when the temperatures of at least two IGBT modules are different, and controls the IGBT module with the lowest temperature among at least one IGBT module that is not turned on to be turned on after a preset time, so that IGBTs with different temperatures can be controlled to be turned on in sequence after a preset time, thereby ensuring that the temperature rise of each IGBT is consistent.

[0021] In some embodiments of the present application, the control module is configured as follows:

[0022] When the temperatures of the multiple IGBT modules are the same, the multiple IGBT modules are controlled to be turned on simultaneously.

[0023] In this way, when the temperatures of multiple IGBT modules are the same, the temperature rise of the IGBT is consistent, the life of the IGBT can be consistent, and there is no need to control the IGBT to be turned on successively. Multiple IGBT modules can be controlled to be turned on at the same time, ensuring the correctness of the control of the IGBT modules.

[0024] In some embodiments of the present application, the circuit further includes:

[0025] Alarm module;

[0026] The control module is also configured to:

[0027] Obtaining currents at output terminals of multiple IGBT modules;

[0028] When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, the alarm module is controlled to issue an alarm message.

[0029] In this way, when the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, the alarm module can be controlled to issue an alarm message, thereby achieving the purpose of protecting the circuit by technical means of shutting down the abnormal IGBT.

[0030] In some embodiments of the present application, the alarm module includes:

[0031] Sound alarm;

[0032] The control module is configured as:

[0033] When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, the sound alarm is controlled to emit an alarm sound.

[0034] In this way, the alarm sound is controlled by the control module to sound the alarm, so as to achieve the purpose of reminding the staff to shut down the abnormal IGBT, thereby effectively protecting the circuit.

[0035] In some embodiments of the present application, the alarm module includes:

[0036] Display screen;

[0037] The control module is configured as:

[0038] When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, an alarm message is sent to a display screen, and the display screen is used to display the alarm message.

[0039] In this way, by displaying the alarm information on the display screen, the staff can clearly identify the specific abnormal IGBT, ensure that the staff correctly shuts down the abnormal IGBT, and thus effectively protect the circuit. At the same time, by displaying the alarm information on the display screen, the abnormal IGBT can be recorded, thereby effectively improving the correctness of IGBT maintenance.

[0040] In some embodiments of the present application, the control module is further configured to:

[0041] Get the current of the load;

[0042] When the load current is less than the preset current threshold, one of the IGBT modules is controlled to be turned on;

[0043] When the current of the load is greater than or equal to the current threshold, the multiple IGBT modules are controlled to be turned on.

[0044] In an embodiment of the present application, the conditions for the conduction of multiple IGBT modules can be determined through the above-mentioned possible control methods, and under this condition, the effect of consistent temperature rise of multiple IGBT modules can be achieved through the above-mentioned various embodiments or a combination of multiple embodiments. Therefore, the method steps provided in this implementation provide a control basis for the above-mentioned consistent temperature rise control method of the present application.

[0045] In a second aspect, an embodiment of the present application provides a test circuit, the test circuit comprising:

[0046] Safety components;

[0047] Load, the load is connected to the external power supply through the fuse element;

[0048] Such as the IGBT control circuit mentioned above.

[0049] The beneficial effects of the test circuit provided in the embodiment of this aspect can be referred to the beneficial effects brought about by the above-mentioned IGBT control circuit and its various possible implementation methods, which will not be elaborated here.

[0050] In a third aspect, an embodiment of the present application provides a control method for an IGBT control circuit, the control circuit comprising:

[0051] Multiple IGBT modules, the IGBT modules include:

[0052] Input terminal, used to connect the load;

[0053] Output terminal, used for grounding;

[0054] Control terminal;

[0055] Wherein, the input terminals of each IGBT module are connected;

[0056] A control module connected to the control terminals of each IGBT module;

[0057] The method is applied to the control module, and the method includes:

[0058] Get the temperature of each IGBT module;

[0059] When multiple IGBTs are to be turned on, a turn-on sequence of each IGBT is determined according to a comparison result between the temperatures of the multiple IGBT modules;

[0060] The conduction of each IGBT is controlled in a conduction sequence.

[0061] In some embodiments of the present application, the method includes:

[0062] When the temperatures of at least two IGBT modules are different, controlling the IGBT module with the lowest temperature among the at least two IGBT modules to be turned on first;

[0063] After a preset time, the IGBT module with the lowest temperature among the at least one IGBT module that is not turned on is controlled to be turned on.

[0064] In some embodiments of the present application, the method includes:

[0065] When the temperatures of the multiple IGBT modules are the same, the multiple IGBT modules are controlled to be turned on simultaneously.

[0066] In some embodiments of the present application, the circuit further includes:

[0067] Alarm module;

[0068] The method also includes:

[0069] Obtaining currents at output terminals of multiple IGBT modules;

[0070] When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, the alarm module is controlled to issue an alarm message.

[0071] In some embodiments of the present application, the alarm module includes:

[0072] Sound alarm;

[0073] Methods include:

[0074] When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, the sound alarm is controlled to emit an alarm sound.

[0075] In some embodiments of the present application, the alarm module includes:

[0076] Display screen;

[0077] Methods include:

[0078] When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, an alarm message is sent to a display screen, and the display screen is used to display the alarm message.

[0079] In some embodiments of the present application, the method further includes:

[0080] Get the current of the load;

[0081] When the load current is less than the preset current threshold, one of the IGBT modules is controlled to be turned on;

[0082] When the current of the load is greater than or equal to the current threshold, the multiple IGBT modules are controlled to be turned on.

[0083] The beneficial effects of the control method of the IGBT control circuit provided by the embodiment of this aspect can be referred to the beneficial effects brought about by the above-mentioned IGBT control circuit and its various possible implementation methods, which will not be elaborated here.

[0084] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, on which computer execution instructions are stored. When the computer execution instructions are executed by a control module, the above method is implemented.

[0085] The beneficial effects of the storage medium provided in the embodiment of this aspect can be referred to the beneficial effects brought about by the above-mentioned IGBT control circuit and its possible implementation methods, which will not be elaborated here.

[0086] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program, which implements the above method when executed by a control module.

[0087] The beneficial effects of the computer program product provided by the embodiment of this aspect can be referred to the beneficial effects brought about by the above-mentioned IGBT control circuit and its possible implementation methods, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0089] Figure 1 A schematic diagram of an IGBT control circuit structure provided in an embodiment of the present application Figure 1 ;

[0090] Figure 2 A flow chart of a control method for an IGBT control circuit provided in an embodiment of the present application Figure 1 ;

[0091] Figure 3 A flow chart of a control method for an IGBT control circuit provided in an embodiment of the present application Figure 2 ;

[0092] Figure 4 A schematic diagram of an IGBT control circuit structure provided in an embodiment of the present application Figure 2 ;

[0093] Figure 5 A flow chart of a control method for an IGBT control circuit provided in an embodiment of the present application Figure 3 ;

[0094] Figure 6 A schematic diagram of an IGBT control circuit structure provided in an embodiment of the present application Figure 3 ;

[0095] Figure 7 A flow chart of a control method for an IGBT control circuit provided in an embodiment of the present application Figure 4 ;

[0096] Figure 8 A flow chart of a control method for an IGBT control circuit provided in an embodiment of the present application Figure 5 ;

[0097] Fig. 9 A schematic diagram of an IGBT control circuit provided in an embodiment of the present application Figure 6 ;

[0098] Fig.10 A schematic diagram of an IGBT control circuit provided in an embodiment of the present application Figure 7 . DETAILED DESCRIPTION

[0099] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0100] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0101] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0102] With the development of the semiconductor industry, IGBT has been widely used in technical fields such as industry, communications, computers, consumer electronics, and new energy vehicles. In addition, the demand for high-power applications in various industries is increasing, and higher demands are also placed on the current and power of IGBT.

[0103] In the related art, in order to meet the needs of high-power circuit design, high-power circuit design is usually carried out in the following two ways: 1. Using an IGBT module whose rated current is suitable for the power level for circuit design; 2. Using a single IGBT with a smaller current tolerance. Although the current it withstands is small, multiple IGBTs can be used in parallel to achieve the required power level.

[0104] When using the first solution, there may be problems of increasing costs and making the driving circuit more complicated. However, the second solution is more popular in the industry because of its advantages of relatively low cost, sufficient device sources, low driving power and simple driving circuit.

[0105] However, when multiple IGBTs are used for circuit design and the required power level of the circuit is met, factors such as inconsistent IGBT device parameters, unreasonable drive circuit design, and asymmetric structural layout may cause problems such as uneven current distribution and poor current sharing through multiple parallel IGBTs. Even if each IGBT device is produced by the same manufacturer and the same batch, there will still be slight differences, so their parameters and characteristics are not exactly the same, and the degree of current sharing will also vary.

[0106] Due to the above reasons, the IGBT temperature rise may be inconsistent, resulting in different IGBT service life and even device damage.

[0107] In view of this, the present application provides an IGBT control circuit, a control method, a test circuit, a storage medium and a program product, the main technical concepts of which are:

[0108] Through the above structure and the above control method, when multiple IGBTs need to be turned on, the comparison results between the temperatures of multiple IGBT modules can be determined, and the turn-on sequence of each IGBT can be further determined based on the comparison results between the temperatures. In this way, the control module can control the turn-on of each IGBT in the above determined turn-on sequence, so that the IGBT with a smaller current bearing can be used, and the cost can be relatively low, while ensuring the consistency of the temperature rise of the IGBT, so that the service life of the IGBT is consistent, avoiding problems such as device damage.

[0109] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0110] The IGBT control circuit provided in the embodiment of the present application can be applied to various implementation scenarios, for example, it can be a television, a smart TV, a laser projection device, a monitor, an electronic bulletinboard, an electronic table, etc. As an example, the IGBT control circuit provided in the embodiment of the present application can be specifically applied to a test device, for example, the IGBT control circuit can be used as part of a test circuit to test a load. The IGBT control circuit provided in the embodiment of the present application can control the circuit in the test circuit by controlling the on and off of the IGBT.

[0111] Figure 1 A schematic diagram of an IGBT control circuit structure provided in an embodiment of the present application Figure 1 ;like Figure 1 As shown, the IGBT control circuit includes: a plurality of IGBT modules and a control module.

[0112] The IGBT module includes: input end, output end and control end. Among them:

[0113] The input end of each IGBT module is used to connect the load; the load can be connected to the external power supply through the fuse element, and the load is powered by the external power supply. In addition, the input ends of each IGBT module are connected to form a parallel connection relationship, so that the current can be shunted to meet the high power requirements of the circuit.

[0114] The output end of each IGBT module is used for grounding; when the IGBT control circuit is turned on, a conduction loop can be formed between the external power supply, the load, the IGBT control circuit and the ground. Through the above structure, multiple IGBT modules can be connected in parallel.

[0115] The control terminal of each IGBT module can be used to access a control signal to control whether the IGBT module is turned on or off.

[0116] The control module can be connected to the control terminals of each IGBT module, so that the control module can control the on and off of each IGBT module through the connection structure.

[0117] The above-mentioned IGBT module may be a module formed by an IGBT device. An IGBT device refers to an insulated gate bipolar transistor, which is a three-terminal device. The above-mentioned control module may be a module including a single chip microcomputer and the like to realize the control function.

[0118] In some embodiments, the collector of the IGBT may be an input terminal of the IGBT, the emitter of the IGBT may be an output terminal of the IGBT, and the gate of the IGBT may be a control terminal of the IGBT.

[0119] In some embodiments, Figure 2 Schematic diagram of the control method of the IGBT control circuit Figure 1 ,like Figure 2 As shown, the control module is configured to perform the following steps:

[0120] S201 : Obtain the temperature of each IGBT module.

[0121] S202 : When a plurality of IGBTs are to be turned on, determining a turn-on sequence of each IGBT according to a comparison result between the temperatures of a plurality of IGBT modules.

[0122] S203 , controlling the conduction of each IGBT in a conduction sequence.

[0123] The temperature of the IGBT module may be the temperature generated by the IGBT module itself when current flows after the module is turned on. The temperature of the IGBT module may be the temperature rise of the IGBT module, and the temperature rise refers to the temperature of the module components above the environment. The comparison result refers to the result of the comparison between the temperatures of the IGBT modules. For example, if the temperature of IGBT1 is higher than that of IGBT2, then the comparison result between IGBT1 and IGBT2 is: the temperature of IGBT1>the temperature of IGBT2. The turn-on sequence refers to the sequence of controlling the turn-on of the IGBT. For example, the turn-on sequence of IGBT1 is before the turn-on sequence of IGBT2, and the control module may control the turn-on of IGBT1 first, and then control the turn-on of IGBT2.

[0124] Exemplarily, the control module may collect the temperature of each IGBT module. For example, the control module may collect the temperature of the IGBT module through a temperature collection module such as a temperature sensor, and the control module may obtain the temperature of each IGBT fed back by the temperature sensor.

[0125] When multiple IGBTs need to be turned on, the control module can determine the turn-on order of each IGBT based on the comparison result between the temperatures of the multiple IGBT modules. For example, the control module can compare based on the temperatures of the IGBT modules to determine the comparison result, or can sort based on the temperatures of the multiple IGBT modules as the comparison result.

[0126] The control module can determine the turn-on sequence of each IGBT according to the comparison result between the temperatures of the multiple IGBT modules. For example, when the temperatures of the multiple IGBT modules are sorted in descending order, the control module can use the reverse order of the sorting as the turn-on sequence of the IGBT, so that the IGBT with a low temperature is turned on first, so that the temperature rise of the IGBT with a low temperature caused by the large turn-on loss is increased, so that the temperature of each IGBT is consistent.

[0127] The control module can control the conduction of each IGBT in the conduction sequence determined above, so that when multiple IGBTs need to be turned on, the temperature rise between each IGBT is consistent, thereby ensuring that the service life of each IGBT is relatively consistent.

[0128] In some embodiments, each IGBT module may be configured with a temperature sensor to collect the temperature of each IGBT module.

[0129] In some embodiments, the control module may be a single chip microcomputer, which may receive the temperatures of multiple IGBTs through multiple input IO ports, and output multiple PWM signals through multiple output IO ports of the single chip microcomputer to control the on and off of multiple IGBTs.

[0130] In some embodiments, the single chip microcomputer can generate PWM signals for multiple output IO ports based on the temperatures received by multiple input IO ports, and the method of generating the PWM signals can be implemented through the above steps S201 to S203.

[0131] The IGBT control circuit provided in this embodiment can determine the comparison results between the temperatures of multiple IGBT modules when multiple IGBTs need to be turned on, and further determine the turn-on sequence of each IGBT based on the comparison results between the temperatures, through the above structure and the above control method. In this way, the control module can control the turn-on of each IGBT in the above determined turn-on sequence, so that the IGBT with a smaller current bearing can be used, and the cost can be relatively low, while ensuring the consistency of the temperature rise of the IGBT, so that the service life of the IGBT is consistent, and the problem of device damage is avoided.

[0132] In some embodiments, Figure 3 Schematic diagram of the control method of the IGBT control circuit provided in the embodiment of the present application Figure 2 ,like Figure 3 As shown, the control module is configured to perform the following steps:

[0133] S301 . When the temperatures of at least two IGBT modules are different, control the IGBT module with the lowest temperature among the at least two IGBT modules to be turned on first.

[0134] S302 . After a preset time, control the IGBT module with the lowest temperature among at least one IGBT module that is not turned on to turn on.

[0135] Exemplarily, if there are at least two IGBT modules with different temperatures, the control module can control the IGBT module with the lowest temperature among the at least two IGBT modules to be turned on first. For example, if the temperatures of the various IGBT modules are different, the turn-on order of the IGBT modules can be controlled based on the temperature sorting of the IGBT modules. For example, if the temperatures of the various IGBT modules are sorted in descending order, the IGBT module with the last sorting in the descending temperature is turned on first; if the temperatures of the various IGBT modules are sorted in ascending order, the IGBT module with the first sorting in the ascending temperature is turned on first. In this way, it can be ensured that the IGBT module with the lowest temperature is turned on first, so that the IGBT with a low temperature is turned on first, which can cause a large turn-on loss to cause the temperature rise of the IGBT with a low temperature to increase first, thereby making the temperature of each IGBT consistent.

[0136] After the lowest IGBT module is turned on, after a preset time, the IGBT module with the lowest temperature among the at least one IGBT module that has not been turned on can be controlled to be turned on. It can be understood that if only one IGBT module is not turned on, the IGBT module with the lowest temperature is the remaining IGBT module, and the control module can control it to be turned on.

[0137] It can be understood that the preset time here can be a time period, and the control module can control other IGBTs to turn on in turn after a period of time. In this way, after the preset time, the temperature of the IGBT with a lower temperature can be ensured to rise to a certain level, so that the temperature rise between each IGBT can be relatively consistent.

[0138] The control method of the IGBT control circuit provided in this embodiment controls the IGBT module with the lowest temperature among at least two IGBT modules to be turned on first when the temperatures of at least two IGBT modules are different, and controls the IGBT module with the lowest temperature among at least one IGBT module that is not turned on to be turned on after a preset time, so that IGBTs with different temperatures can be controlled to be turned on in sequence after a preset time, thereby ensuring that the temperature rise of each IGBT is consistent.

[0139] In some embodiments, the IGBT control circuit further includes a drive circuit 1 and a drive circuit 2. The IGBT module includes IGBT1 and IGBT2.

[0140] When both IGBT1 and IGBT2 need to be turned on, IGBT1 and IGBT2 work together in parallel, and the single-chip microcomputer controls the on and off of IGBT1 and IGBT2 respectively through the drive circuit 1 and the drive circuit 2. Among them, the single-chip microcomputer adjusts the on time of IGBT1 and IGBT2 by monitoring the temperature rise of IGBT1 and the temperature rise of IGBT2, as follows:

[0141] When the temperature rise of IGBT1 is greater than the temperature rise of IGBT2, in order to maintain the temperature rise of IGBT1 and IGBT2 consistent, in the IGBT switching cycle, the single-chip microcomputer sends a drive signal to the drive circuit 2 to control the IGBT2 with a lower temperature rise to turn on first. At this time, a larger total parallel current I will flow through IGBT2, causing a larger turn-on loss and leading to an increase in the temperature rise of IGBT2. Then, after a delay of one hundred nanoseconds, the single-chip microcomputer can send a drive signal to control the turn-on of IGBT1 with a higher temperature. Since IGBT2 has been turned on in advance, the current I1 flowing through the parallel branch IGBT1 is much smaller than the total parallel current I at this time, resulting in a smaller turn-on loss and causing the temperature rise of IGBT1 to be lower than that of IGBT2. Dynamic adjustment is thus used to control the temperature rise of the parallel IGBT1 and IGBT2 to maintain a consistent level.

[0142] When the temperature rise of IGBT1 is less than the temperature rise of IGBT2, in order to maintain the temperature rise of IGBT1 and IGBT2 consistent, in the IGBT switching cycle, the single-chip microcomputer sends a drive signal to the drive circuit 1 to control the IGBT1 with a lower temperature rise to turn on first. At this time, a larger parallel total current I will flow through IGBT1, causing a larger turn-on loss and leading to an increase in the temperature rise of IGBT1. Then, after a delay of one hundred nanoseconds, the single-chip microcomputer sends a drive signal to control the turn-on of IGBT2 with a higher temperature. Since IGBT1 has been turned on in advance, the current I2 flowing through the parallel branch IGBT2 is much smaller than the parallel total current I at this time, resulting in a smaller turn-on loss and causing the temperature rise of IGBT2 to be lower than that of IGBT1. Dynamic adjustment is thus used to control the temperature rise of the parallel IGBT1 and IGBT2 to maintain a consistent level.

[0143] In this way, the temperature rise balance between the parallel IGBTs is adjusted through the above method to achieve thermal balance and ensure that the devices can work stably for a long time.

[0144] In some embodiments, the control module is configured to:

[0145] When the temperatures of the multiple IGBT modules are the same, the multiple IGBT modules are controlled to be turned on simultaneously.

[0146] In this way, when the temperatures of multiple IGBT modules are the same, the temperature rise of the IGBT is consistent, the life of the IGBT can be consistent, and there is no need to control the IGBT to be turned on successively. Multiple IGBT modules can be controlled to be turned on at the same time, ensuring the correctness of the control of the IGBT modules.

[0147] As an example, the IGBT control circuit further includes a drive circuit 1 and a drive circuit 2. The IGBT module includes an IGBT1 and an IGBT2.

[0148] When the temperature rise of IGBT1 = the temperature rise of IGBT2, the single-chip microcomputer controls IGBT1 and IGBT2 to turn on and off at the same time, that is, the single-chip microcomputer sends drive signals to drive circuit 1 and drive circuit 2 at the same time, respectively controlling IGBT1 and IGBT2 to turn on and off at the same time without delay, thereby maintaining the temperature rise of IGBT1 and IGBT2 consistent.

[0149] The temperature rise balance between parallel IGBTs is adjusted in the above manner to achieve thermal balance and ensure that the devices can work stably for a long time.

[0150] In some embodiments, Figure 4 A schematic diagram of an IGBT control circuit structure provided in an embodiment of the present application Figure 2 ; Figure 5 Schematic diagram of the control method of the IGBT control circuit provided in the embodiment of the present application Figure 3 ;like Figure 4 As shown, the circuit also includes an alarm module.

[0151] like Figure 5 As shown, the control module is also configured to perform the following steps:

[0152] S501 : Obtain currents at output terminals of multiple IGBT modules.

[0153] S502: When the current difference between at least two IGBT modules is greater than a preset current difference threshold, the alarm module is controlled to issue an alarm message.

[0154] The current at the output end of the IGBT module may be used as the current flowing through the IGBT module. The current difference threshold may be a threshold set for alarming.

[0155] Exemplarily, the control module can collect the current at the output end of the IGBT module as the current flowing through the IGBT module. For example, when the control module is a single-chip microcomputer, the current at the output end of the IGBT module can be collected through the input IO port of the single-chip microcomputer. The control module can make a difference between the currents of two IGBT modules. If the current difference between the two IGBT modules is greater than a preset current difference threshold, it means that one of the IGBT modules has an abnormality, and an alarm message can be issued through the alarm module.

[0156] As an example, the current of one IGBT module can be subtracted from the current of any other IGBT module. If the current difference between the IGBT module and the other IGBT modules is greater than the current difference threshold, it means that the IGBT module is abnormal, and the control module can issue an alarm message through the alarm module.

[0157] In this embodiment, when the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, the alarm module can be controlled to issue an alarm message, thereby achieving the purpose of protecting the circuit by technical means of shutting down the abnormal IGBT.

[0158] In some embodiments of the present application, Figure 6 A schematic diagram of an IGBT control circuit structure provided in an embodiment of the present application Figure 3 , Figure 7 Schematic diagram of the control method of the IGBT control circuit provided in the embodiment of the present application Figure 4 ;

[0159] like Figure 6 As shown, the alarm module includes: a sound alarm.

[0160] like Figure 7 As shown, the control module is configured to execute the steps:

[0161] S701. When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, control a sound alarm to sound an alarm.

[0162] For example, the control module can make a difference between the currents of two IGBT modules. If the current difference between the two IGBT modules is greater than a preset current difference threshold, it means that one of the IGBT modules is abnormal, and the sound alarm can be used to control the alarm. In this way, the control module controls the alarm to sound an alarm, thereby achieving the purpose of reminding the staff to shut down the abnormal IGBT, and thus effectively protecting the circuit.

[0163] In some embodiments of the present application, Figure 6 As shown, the alarm module also includes a display screen.

[0164] like Figure 7 As shown, the control module is also configured as:

[0165] S702: When the current difference collected at the output ends of at least two IGBT modules is greater than a preset current difference threshold, an alarm message is sent to a display screen, and the display screen is used to display the alarm message.

[0166] Exemplarily, the current of one IGBT module can be subtracted from the current of any other IGBT module. If the current difference between the IGBT module and the other IGBT modules is greater than the current difference threshold, it means that the IGBT module is abnormal, and the control module can display the alarm information through the display screen. In this way, by displaying the alarm information on the display screen, the staff can clearly identify the specific abnormal IGBT, ensuring that the staff correctly shuts down the abnormal IGBT, so that the circuit can be effectively protected. At the same time, by using the display screen to display the alarm information, the abnormal IGBT can be recorded abnormally, so as to effectively improve the correctness of IGBT maintenance.

[0167] In some embodiments, the IGBT control circuit also includes a sampling resistor. When used in parallel, when the single-chip microcomputer obtains the current of IGBT1 and the current of IGBT2 through the sampling resistor, and the difference is large or one IGBT has current and the other has no current, it is an abnormal state. Because of the large current difference between IGBT1 and IGBT2, there will be a large temperature rise difference. At this time, the alarm will work and alarm and display the abnormal state information on the display screen. The single-chip microcomputer will turn off the IGBT through the driving circuit to achieve the purpose of protecting the circuit. The above method can also realize the protection of the circuit after the IGBT fails and short-circuits.

[0168] In some embodiments of the present application, Figure 8 Schematic diagram of the control method of the IGBT control circuit provided in the embodiment of the present application Figure 5 ,like Figure 8 As shown,

[0169] The control module is further configured to perform the following steps:

[0170] S801, obtain the load current.

[0171] S802, when the current of the load is less than a preset current threshold, controlling one of the IGBT modules to be turned on.

[0172] S803, when the current of the load is greater than or equal to the current threshold, control the multiple IGBT modules to be turned on.

[0173] The number of IGBT modules that are turned on may be determined by a current threshold, that is, the current threshold may be a threshold that is preset based on the number of IGBT modules that need to be turned on.

[0174] Exemplarily, the control module can collect the current flowing through the load, and if the current of the load is less than a preset current threshold, the control module can control one of the IGBT modules to turn on. If the current of the load is greater than or equal to the current threshold, the control module can control multiple IGBT modules to turn on, so that the effect of using multiple small current IGBT modules to shunt large current can be achieved.

[0175] As an example, when the current obtained by the single-chip microcomputer is large, IGBT1 and IGBT2 work together in parallel. When the current obtained by the single-chip microcomputer is small, only IGBT1 works. In this way, it is possible to achieve the effect of no need for shunting when the current is small and shunting when the current is large.

[0176] In this embodiment, the conditions for the conduction of multiple IGBT modules can be determined through the above-mentioned possible control methods, and under this condition, the effect of consistent temperature rise of multiple IGBT modules can be achieved through the above-mentioned various embodiments or a combination of multiple embodiments. Therefore, the method steps provided in this implementation provide a control basis for the above-mentioned consistent temperature rise control method of this application.

[0177] In some embodiments, Fig. 9 and Fig.10 This is a schematic diagram of the structure of an IGBT control circuit provided in an embodiment of the present application. Fig. 9 As shown, the IGBT control circuit includes:

[0178] Fuse 901, load 902, IGBT1, IGBT2, drive circuit 1, drive circuit 2, sampling resistor 1, sampling resistor 2, single chip computer 904, IGBT1 temperature rise, IGBT2 temperature rise, alarm 905. Among them, IGBT1 temperature rise and IGBT2 temperature rise are used to collect the temperature of IGBT1 and the temperature of IGBT2 respectively. Among them, alarm 905 can be the above-mentioned alarm module 140.

[0179] The main power loop of the above circuit is: VCC→fuse 901→load 902→IGBT1 / IGBT2→sampling resistor 1 / 2→GND.

[0180] For example, after the system is powered on, IGBT1 and IGBT2 are connected in parallel and work together. The microcontroller obtains the current of IGBT1 and IGBT2 respectively through the sampling resistor.

[0181] When the current obtained by the microcontroller is large, IGBT1 and IGBT2 work together in parallel;

[0182] When the current obtained by the microcontroller is small, only IGBT1 works.

[0183] When the current obtained by the MCU is large, IGBT1 and IGBT2 work together in parallel, and the MCU controls the opening and closing of IGBT1 and IGBT2 respectively through drive circuit 1 and drive circuit 2. The MCU adjusts the opening time of IGBT1 and IGBT2 by monitoring the temperature rise of the IGBT, as shown below:

[0184] When the temperature rise of IGBT1 = the temperature rise of IGBT2, the single-chip microcomputer controls IGBT1 and IGBT2 to turn on and off at the same time, that is, the single-chip microcomputer sends a driving signal to the driving circuit 1 and the driving circuit 2 at the same time, respectively controlling IGBT1 and IGBT2 to turn on and off at the same time without delay, thereby maintaining the temperature rise of IGBT1 and IGBT2 consistent;

[0185] When the temperature rise of IGBT1 is greater than the temperature rise of IGBT2, in order to maintain the temperature rise of IGBT1 and IGBT2 consistent, in the IGBT switching cycle, the single-chip microcomputer sends a drive signal to the drive circuit 2 to control the IGBT2 with a lower temperature rise to turn on first. At this time, a larger total parallel current I will flow through IGBT2, causing a larger turn-on loss and causing the temperature rise of IGBT2 to increase. Then, after a delay of one hundred nanoseconds, the single-chip microcomputer sends a drive signal to control the turn-on of IGBT1 with a higher temperature. Since IGBT2 has been turned on in advance, the current I1 flowing through the parallel branch IGBT1 is much smaller than the total parallel current I at this time, resulting in a smaller turn-on loss and causing the temperature rise of IGBT1 to be lower than that of IGBT2. Thus, the temperature rise of the parallel IGBT1 and IGBT2 is controlled to maintain a consistent level through dynamic adjustment.

[0186] When the temperature rise of IGBT1 is less than the temperature rise of IGBT2, in order to maintain the temperature rise of IGBT1 and IGBT2 consistent, in the IGBT switching cycle, the single-chip microcomputer sends a driving signal to the driving circuit 1 to control the IGBT1 with a lower temperature rise to turn on first. At this time, a larger parallel total current I will flow through IGBT1, causing a larger turn-on loss and causing the temperature rise of IGBT1 to increase. Then, after a delay of one hundred nanoseconds, the single-chip microcomputer sends a driving signal to control the turn-on of IGBT2 with a higher temperature. Since IGBT1 has been turned on in advance, the current I2 flowing through the parallel branch IGBT2 is much smaller than the parallel total current I at this time, resulting in a smaller turn-on loss and causing the temperature rise of IGBT2 to be lower than that of IGBT1. Thus, the temperature rise of the parallel IGBT1 and IGBT2 is controlled to maintain a consistent level through dynamic adjustment.

[0187] The temperature rise balance between parallel IGBTs is adjusted in the above manner to achieve thermal balance and ensure that the devices can work stably for a long time.

[0188] When used in parallel, when the microcontroller obtains the current of IGBT1 and IGBT2 through sampling resistors 1 and 2 respectively, and the difference is large or one IGBT has current and the other has no current, it is an abnormal state. Because of the large current difference between IGBT1 and IGBT2, there will be a large temperature rise difference. At this time, the alarm will work and display the abnormal state information on the display screen. The microcontroller will turn off the IGBT through the drive circuit to achieve the purpose of protecting the circuit. The above method can also protect the circuit after the IGBT fails and shorts.

[0189] Fig.10 As shown, the IGBT control circuit may specifically include:

[0190] IGBT1, IGBT2, resistor R1, sampling resistor R2, sampling resistor R3, resistor R4, current limiting resistor R5, current limiting resistor R6, resistor R7, resistor R8, single chip computer, drive circuit 1, drive circuit 2, diode Q3, alarm B1. Among them, resistor R8, diode Q3, alarm B1 form an alarm circuit.

[0191] The main power loop of the above circuit is: VCC→fuse F1→load 130→IGBT1 / IGBT2→sampling resistor R2 / R3→GND.

[0192] Exemplarily, the IGBT1 drive control loop includes: the PWM1 pin of the single-chip microcomputer controls the drive circuit 1, and controls the opening and closing of the IGBT1 through the current limiting resistor R5, wherein the resistor R1 serves to provide a low level in the default state to the IGBT1. The single-chip microcomputer obtains the current of the IGBT1 through the ADC1 pin, and obtains the temperature rise of the IGBT1 through the ADC3 pin. The single-chip microcomputer controls the switch of the IGBT1 in combination with these two parameter values.

[0193] The IGBT2 drive control circuit includes: the MCU PWM2 pin controls the drive circuit 2, and controls the opening and closing of IGBT2 through the current limiting resistor R6, wherein the resistor R4 is used to provide a low level in the default state for IGBT2. The MCU obtains the current of IGBT2 through the ADC2 pin, and obtains the temperature rise of IGBT2 through the ADC4 pin. The MCU controls the switch of IGBT2 based on these two parameter values.

[0194] Alarm circuit: The microcontroller outputs a high level through the IO1 pin to control the alarm B1 to work and alarm when an abnormal state occurs.

[0195] Display screen circuit: The single chip microcomputer communicates with the display screen 142 through IIC and displays error information in abnormal conditions.

[0196] In this embodiment, through the above Fig. 9 and Fig.10 , the temperature of the parallel IGBT can be collected through thermocouples. The microcontroller adjusts the time difference between the two IGBTs based on temperature feedback, thereby controlling the current sharing of the IGBTs and achieving basically consistent temperature rise. The current is collected through sampling resistors, and the use mode of the parallel IGBT is adjusted according to current feedback. One IGBT is turned on with a small current, and two IGBTs are turned on with a large current. The current is collected through sampling resistors, and the current of the parallel IGBT is fed back according to the current. The alarm system works in abnormal situations and displays the abnormal status on the display.

[0197] In some embodiments, a test circuit is provided, the test circuit comprising:

[0198] Fuse element; wherein the fuse element can be the above-mentioned fuse.

[0199] Load, the load is connected to the external power supply through the fuse element;

[0200] Such as the IGBT control circuit mentioned above.

[0201] In this embodiment, the test circuit includes the above-mentioned GBT control circuit and has the effect of the above-mentioned GBT control circuit.

[0202] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0203] The present application also provides a computer-readable storage medium, in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the above method is implemented.

[0204] The present application also provides a computer program product, including a computer program, which implements the above method when executed by a processor.

[0205] An exemplary readable storage medium is coupled to a processor so that the processor can read information from the readable storage medium and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can be located in an application specific integrated circuit (Application Specific Integrated Circuits, referred to as: ASIC). Of course, the processor and the readable storage medium can also exist in the device as discrete components.

[0206] The division of units is only a logical function division, and there may be other divisions in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0207] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0208] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0209] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0210] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, disk or optical disk and other media that can store program codes.

[0211] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0212] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. An IGBT control circuit, characterized in that: The control circuit comprises: A plurality of IGBT modules, wherein the IGBT modules include: Input terminal, used to connect the load; Output terminal, used for grounding; Control terminal; Wherein, the input terminals of the IGBT modules are connected; A control module connected to the control terminals of the IGBT modules; the control module is configured as follows: Acquiring the temperature of each of the IGBT modules; When the multiple IGBTs are to be turned on, determining the turn-on sequence of the respective IGBTs according to the comparison result between the temperatures of the multiple IGBT modules; The conduction of each of the IGBTs is controlled in the conduction sequence.

2. The circuit according to claim 1, characterized in that The control module is configured to: When the temperatures of at least two of the IGBT modules are different, controlling the IGBT module with the lowest temperature among the at least two IGBT modules to be turned on first; After a preset time, the IGBT module with the lowest temperature among the at least one IGBT module that is not turned on is controlled to be turned on.

3. The circuit according to claim 1 or 2, characterized in that: The control module is configured to: When the temperatures of the multiple IGBT modules are the same, the multiple IGBT modules are controlled to be turned on simultaneously.

4. The circuit according to claim 1, characterized in that The circuit further comprises: Alarm module; The control module is further configured to: Acquire the current at the output end of the current difference collected by the output ends of the plurality of IGBT modules; When the current difference collected at the output ends of at least two of the IGBT modules is greater than a preset current difference threshold, the alarm module is controlled to issue an alarm message.

5. The circuit according to claim 4, characterized in that The alarm module comprises: Sound alarm; The control module is configured to: When the current difference collected at the output ends of at least two of the IGBT modules is greater than a preset current difference threshold, the sound alarm is controlled to emit an alarm sound.

6. The circuit according to claim 4 or 5, characterized in that The alarm module comprises: Display screen; The control module is configured to: When the current difference collected at the output ends of at least two of the IGBT modules is greater than a preset current difference threshold, the alarm information is sent to the display screen, and the display screen is used to display the alarm information.

7. The circuit according to claim 1, characterized in that The control module is further configured to: obtaining the current of the load; When the current of the load is less than a preset current threshold, controlling one of the IGBT modules to be turned on; When the current of the load is greater than or equal to the current threshold, the plurality of IGBT modules are controlled to be turned on.

8. A test circuit, characterized in that: The test circuit comprises: Safety components; A load, wherein the load is connected to an external power source through the fuse element; An IGBT control circuit as claimed in any one of claims 1 to 7.

9. A control method for an IGBT control circuit, characterized in that: The control circuit comprises: A plurality of IGBT modules, wherein the IGBT modules include: Input terminal, used to connect the load; Output terminal, used for grounding; Control terminal; Wherein, the input terminals of the IGBT modules are connected; A control module connected to the control terminals of the IGBT modules; The method is applied to the control module, and the method comprises: Acquiring the temperature of each of the IGBT modules; When the multiple IGBTs are to be turned on, determining the turn-on sequence of the respective IGBTs according to the comparison result between the temperatures of the multiple IGBT modules; The conduction of each of the IGBTs is controlled in the conduction sequence.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by the control module, the method described in claim 9 is implemented.

11. A computer program product, characterized in that The invention comprises a computer program, which implements the method according to claim 9 when being executed by a control module.

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