Methods, apparatus, computer equipment, computer-readable storage media, and computer program products for digitally constructing simulation models of current-carrying connection structures.

Abstract

This application relates to a method, apparatus, computer equipment, storage medium, and computer program product for digitally constructing a simulation model of a current-carrying connection structure. It pertains to the field of power equipment technology. The method includes: constructing a fan-shaped ring as an equivalent body of a helical spring in the current-carrying connection structure; constructing a first conductive rod and a second conductive rod, with the equivalent body located between the first and second conductive rods; constructing contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of the helical spring contact finger; the contact areas are used to simulate contact resistance; and based on the constructed multiple equivalent models of the helical spring contact fingers, a simulation model of the current-carrying connection structure is formed. This method enables the constructed simulation model of the current-carrying connection structure to simultaneously meet the requirements of computational efficiency and computational accuracy.

Description

Technical Field

[0001] This application relates to the field of power equipment technology, and in particular to a method, apparatus, computer equipment, computer-readable storage medium, and computer program product for digitally constructing a simulation model of a current-carrying connection structure. Background Technology

[0002] With the development of power systems, the equipment within them has become more diverse. During regular maintenance, it has been found that the internal thermal performance of equipment is a crucial indicator affecting its operation. Thermal failures in equipment are typically caused by severe temperature rise due to localized contact deterioration, which gradually leads to the decomposition of the insulating medium. Therefore, real-time monitoring of the internal status of the equipment is necessary.

[0003] Currently, the methods for digitally monitoring the internal status information of equipment combine external monitoring data and simulation. These methods primarily involve establishing a proportional current-carrying connection model and directly calculating the helical spring contacts as equivalent rings. However, establishing a proportional current-carrying connection model is overly complex, and overly detailed models lead to low computational efficiency. Conversely, directly calculating the helical spring contacts as equivalent rings results in an overly simplistic model that ignores necessary structural elements, leading to low computational accuracy. Therefore, the current models used in acquiring thermal fault information for equipment cannot simultaneously meet the requirements of computational efficiency and accuracy. Summary of the Invention

[0004] Therefore, it is necessary to address the technical problem that the models used in the process of acquiring thermal faults of equipment cannot simultaneously meet the requirements of computational efficiency and computational accuracy, and to provide a digital construction method, device, computer equipment, computer-readable storage medium and computer program product for a simulation model of a current-carrying connection structure.

[0005] In a first aspect, this application provides a method for digitally constructing a simulation model of a current-carrying connection structure, the method comprising:

[0006] Construct a fan-shaped ring as the equivalent body of the helical spring in the current-carrying connection structure, and construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0007] Contact areas are constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a helical spring finger; the contact areas are used to simulate contact resistance;

[0008] Based on the constructed equivalent models of multiple helical spring fingers, a simulation model of the current-carrying connection structure is formed.

[0009] In one embodiment, the width of the equivalent body is less than a preset multiple of the pitch of the helical spring, the inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular region formed by the first conductive rod and the second conductive rod, and the outer diameter of the equivalent body is the outer diameter corresponding to the annular region minus the diameter of the spring wire of the helical spring.

[0010] In one embodiment, the length and width of the contact area are both greater than half the spring pitch of the helical spring and less than the spring pitch; the number of equivalent models of the helical spring is determined based on the total number of the pitches of the helical spring.

[0011] In one embodiment, after the simulation model of the current-carrying connection structure is formed based on the constructed multiple equivalent models of helical spring fingers, the process includes: obtaining a first conductivity parameter of the material constituting the equivalent body; obtaining a second conductivity parameter of the material constituting the contact area based on the first conductivity parameter; obtaining the heating power of different parts of the device to be monitored according to the first conductivity parameter and the second conductivity parameter, and then obtaining the thermal fault information of the device according to the heating power.

[0012] In one embodiment, obtaining the first conductivity parameter of the material constituting the equivalent body includes: obtaining a first resistance value of the equivalent body and obtaining a second resistance value of the helical spring model corresponding to the equivalent body; comparing the first resistance value and the second resistance value, adjusting the conductivity value of the equivalent body, and when the first resistance value and the second resistance value are equal, using the conductivity value of the equivalent body as the first conductivity parameter of the material constituting the equivalent body.

[0013] In one embodiment, obtaining a second conductivity parameter of the material constituting the contact area based on the first conductivity parameter includes: obtaining a first total resistance value of the equivalent body and a second total resistance value of the helical spring model corresponding to the equivalent body; comparing the first total resistance value and the second total resistance value, adjusting the conductivity value of the contact area, and using the conductivity value of the contact area as the second conductivity parameter of the material constituting the contact area when the first total resistance value and the second total resistance value are equal.

[0014] Secondly, this application also provides a digital construction device for a simulation model of a current-carrying connection structure, the device comprising:

[0015] A sector ring construction module is used to construct a sector ring as an equivalent body of a helical spring in a current-carrying connection structure, and to construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0016] An equivalent model forming module is used to construct contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a helical spring finger; the contact areas are used to simulate contact resistance;

[0017] The simulation model component module is used to form a current-carrying connection structure simulation model based on the constructed equivalent models of multiple helical spring fingers.

[0018] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0019] Construct a fan-shaped ring as the equivalent body of the helical spring in the current-carrying connection structure, and construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0020] Contact areas are constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a helical spring finger; the contact areas are used to simulate contact resistance;

[0021] Based on the constructed equivalent models of multiple helical spring fingers, a simulation model of the current-carrying connection structure is formed.

[0022] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0023] Construct a fan-shaped ring as the equivalent body of the helical spring in the current-carrying connection structure, and construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0024] Contact areas are constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a helical spring finger; the contact areas are used to simulate contact resistance;

[0025] Based on the constructed equivalent models of multiple helical spring fingers, a simulation model of the current-carrying connection structure is formed.

[0026] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0027] Construct a fan-shaped ring as the equivalent body of the helical spring in the current-carrying connection structure, and construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0028] Contact areas are constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a helical spring finger; the contact areas are used to simulate contact resistance;

[0029] Based on the constructed equivalent models of multiple helical spring fingers, a simulation model of the current-carrying connection structure is formed.

[0030] The aforementioned digital construction method, apparatus, and computer equipment for the simulation model of the current-carrying connection structure have the following beneficial effects during the digital construction process: First, a fan-shaped ring is constructed as the equivalent body of the helical spring in the current-carrying connection structure, and a first conductive rod and a second conductive rod are constructed, with the equivalent body located between the first and second conductive rods; then, contact areas are constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, forming equivalent models of the helical spring contact fingers; the contact areas are used to simulate contact resistance; finally, based on the constructed equivalent models of multiple helical spring contact fingers, a simulation model of the current-carrying connection structure is formed. The above process, by constructing a fan-shaped ring as the equivalent body of the helical spring in the current-carrying connection structure and introducing contact areas in the equivalent model, can more realistically reflect the contact resistance between contacts, thereby improving the accuracy of the simulation results; by combining multiple models, the performance of different current-carrying connection structures can be evaluated, ultimately ensuring that the constructed simulation model of the current-carrying connection structure simultaneously meets the requirements of computational efficiency and computational accuracy. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a flowchart illustrating the digital construction method of a simulation model of a current-carrying connection structure in one embodiment;

[0033] Figure 2 This is a flowchart illustrating the steps for obtaining thermal fault information of a device in one embodiment;

[0034] Figure 3 This is a detailed flowchart illustrating the digital construction method of a simulation model of a current-carrying connection structure in one embodiment;

[0035] Figure 4 This is a schematic diagram illustrating the construction of an equivalent model of a helical spring in one embodiment;

[0036] Figure 5 This is a schematic cross-sectional view of the equivalent model in one embodiment;

[0037] Figure 6 This is a structural block diagram of a digital construction device for a simulation model of a current-carrying connection structure in one embodiment.

[0038] Figure 7 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0040] In one embodiment, such as Figure 1 As shown, a digital construction method for a simulation model of a current-carrying connection structure is provided. This embodiment illustrates the method by applying it to a terminal. It is understood that this method can also be applied to a server, and further to a system including both a terminal and a server, and is implemented through interaction between the terminal and the server. In this embodiment, the method includes the following steps S102 to S106. Wherein:

[0041] Step S102: Construct a fan-shaped ring as the equivalent body of the helical spring in the current-carrying connection structure, and construct a first conductive rod and a second conductive rod, with the equivalent body located between the first conductive rod and the second conductive rod.

[0042] Among them, the sector ring is usually used to provide a stable mechanical link. In the current-carrying connection structure, the sector ring can simulate the shape and function of a helical spring and effectively conduct current. The current-carrying connection structure is an integral structure used for electrical connection and can be used to ensure smooth current conduction. The helical spring is a mechanical element with good elasticity and compressibility. In the current-carrying connection structure, it is usually used to provide a pressing force to ensure good electrical contact. The equivalent body is a model used to simplify complex structures and can represent the electrical and mechanical characteristics of the actual structure. The first conductive rod and the second conductive rod are important components of the current-carrying connection structure and are usually used to conduct current.

[0043] Specifically, the sector ring usually has a curved structure and should be made of materials with good conductivity and elasticity, such as copper and aluminum alloys, to ensure that the sector ring has sufficient conductivity. Correspondingly, the first and second conductive rods are used for current transmission, so metals with high conductivity, such as copper or nickel, can be selected to reduce losses when current passes through.

[0044] Step S104: Construct contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, to form an equivalent model of the helical spring finger; the contact areas are used to simulate contact resistance.

[0045] Optionally, the contact area is the contact surface between the equivalent body and the conductive rod; the contact resistance refers to the resistance generated when current passes through the two contact surfaces.

[0046] Specifically, in the simulation model of the current-carrying connection structure, the quality of the contact area directly affects the efficiency and stability of current flow; the contact resistance affects the current flow, and excessive contact resistance may lead to heat generation and reduce efficiency.

[0047] Step S106: Based on the constructed equivalent models of multiple helical spring fingers, a simulation model of the current-carrying connection structure is formed.

[0048] The equivalent model is a simplified model constructed based on the characteristics of the actual components, used to replace the complex physical structure in simulation; the simulation model is a model used to simulate the behavior of the real system.

[0049] In the aforementioned digital construction method for the simulation model of the current-carrying connection structure, a sector-shaped ring is first constructed as the equivalent body of the helical spring in the current-carrying connection structure, along with a first conductive rod and a second conductive rod, with the equivalent body located between the first and second conductive rods. Then, contact areas are constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, forming equivalent models of the helical spring contacts. These contact areas are used to simulate contact resistance. Finally, based on the constructed equivalent models of multiple helical spring contacts, a simulation model of the current-carrying connection structure is formed. This process, by constructing a sector-shaped ring as the equivalent body of the helical spring in the current-carrying connection structure and introducing contact areas into the equivalent model, can more realistically reflect the contact resistance between contacts, thereby improving the accuracy of the simulation results. By combining multiple models, the performance of different current-carrying connection structures can be evaluated, ultimately ensuring that the constructed simulation model of the current-carrying connection structure simultaneously satisfies both computational efficiency and computational accuracy.

[0050] In an exemplary embodiment, the width of the equivalent body is less than a preset multiple of the pitch of the helical spring, the inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular region formed by the first conductive rod and the second conductive rod, and the outer diameter of the equivalent body is the outer diameter corresponding to the annular region minus the diameter of the spring wire of the helical spring.

[0051] The pitch represents the center distance between adjacent spiral coils. The pitch setting affects the spring's stiffness and elastic deformation capability. Therefore, when designing the equivalent body, the relationship between the width of the sector ring and the pitch needs to be considered. The preset multiple is a design parameter that can be used to define that the width of the equivalent body should be less than 1.5 times the pitch of the spiral spring. This ensures the effectiveness of the equivalent model in simulating the behavior of actual spiral springs and avoids the negative impact of excessive structural volume on electrical contact performance.

[0052] Specifically, the width refers to the distance between the two sides of the sector ring. The width directly affects the current conduction efficiency and mechanical elasticity. Therefore, the width requirement is to ensure a reasonable ratio between the sector ring and the helical spring in the design, so as to better simulate the actual contact performance.

[0053] More specifically, the inner diameter refers to the circular diameter inside the equivalent body, specifically related to the annular region formed by the first and second conductive rods; correspondingly, the outer diameter refers to the circular diameter outside the equivalent body, which is the dimension of the outer edge of the annular region; the spring wire diameter is the thickness of the helical spring wire. When obtaining the outer diameter of the equivalent body, it is necessary to subtract the spring wire diameter from the outer diameter to ensure the fit between the equivalent body and the helical spring.

[0054] In this embodiment, by designing the width of the sector ring to be less than a multiple of the pitch of the helical spring, its effectiveness as an equivalent body is ensured. Simultaneously, current conduction performance and contact characteristics are considered, maintaining good performance of the entire current-carrying connection structure. A certain degree of flexibility is also reserved in the design to adapt to different operating conditions. By defining the inner and outer diameters when designing the equivalent body, compatibility between the equivalent body and the first and second conductive rods is ensured. The inner diameter needs to be sufficient to accommodate the conductive rods without interfering with their current flow; while the outer diameter needs to be reduced by the spring wire diameter to ensure structural stability and the normal function of the spring, ultimately achieving an efficient electrical connection.

[0055] In one exemplary embodiment, the length and width of the contact area are both greater than half the spring pitch of the helical spring and less than the spring pitch; the number of equivalent models of the helical spring is determined based on the total number of pitches of the helical spring.

[0056] The length of the contact area refers to the distance the contact area extends on the contact surface; the width of the contact area refers to the measured length of the contact area in the horizontal direction; the length of the contact area must be greater than half the spring pitch and less than the spring pitch to ensure sufficient contact surface, and the width of the contact area must be greater than half the spring pitch and less than the spring pitch to ensure good contact without forming excessive gaps; the spring pitch refers to the distance between two adjacent turns of the helical spring; the total number refers to the basis for determining the number of equivalent models by measuring the pitch of the helical spring, representing the total number of spring turns considered in the design. As the number of spring turns increases, the number of equivalent models will also increase.

[0057] For example, if the total number of spring pitches is D, then the number of equivalent models of spring contacts built around the conductor circumference is D / 1.5; if not divisible, then the length of the equivalent model body of the last spring contact is the remainder, and the number of contact areas of the first and second conductive rods is reduced by 1 each.

[0058] In this embodiment, by limiting the length and width of the contact area, good current conduction is ensured, and by determining the pitch of the helical spring to calculate the number of equivalent models, higher efficiency can be achieved in electrical and mechanical design.

[0059] Furthermore, in one embodiment, such as Figure 2 As shown, after constructing a simulation model of the current-carrying connection structure based on multiple equivalent models of helical spring fingers, it includes:

[0060] Step S201: Obtain the first conductivity parameter of the material constituting the equivalent body; Step S202: Based on the first conductivity parameter, obtain the second conductivity parameter of the material constituting the contact area; Step S203: Obtain the heating power of different parts of the device under monitoring according to the first conductivity parameter and the second conductivity parameter, and then obtain the thermal fault information of the device according to the heating power.

[0061] Among them, the first conductivity parameter refers to the conductivity value of the equivalent body material, which determines the material's ability to conduct current. The higher the conductivity, the better the material's conductivity. The second conductivity parameter refers to the conductivity of the contact area material, which affects the current flow efficiency and conduction ability. The heating power refers to the heat generated by the equipment during operation, which is usually proportional to the material's conductivity and the magnitude of the current. The thermal fault information refers to the potential fault state or risk inferred based on the heating power calculation results.

[0062] In this embodiment, by obtaining the first and second conductivity parameters of the material, the performance of different parts of the device under test is analyzed, the heat generation power of the device under test is calculated, and the thermal fault information of the device is further derived, which helps to make an accurate assessment of the performance of electrical equipment.

[0063] More specifically, in one embodiment, obtaining a first conductivity parameter of the material constituting the equivalent body includes: obtaining a first resistance value of the equivalent body and obtaining a second resistance value of the helical spring model corresponding to the equivalent body; comparing the first resistance value and the second resistance value, adjusting the conductivity value of the equivalent body, and using the conductivity value of the equivalent body as the first conductivity parameter of the material constituting the equivalent body when the first resistance value and the second resistance value are equal.

[0064] The first resistance value refers to the resistance measurement of the equivalent body, which is used to evaluate the degree of obstruction of the equivalent body when current flows through it. The larger the resistance value, the higher the loss when current flows through it. The second resistance value is the resistance value of the helical spring model corresponding to the equivalent body. The first resistance value and the second resistance value are analyzed and compared to determine their differences and their impact on conductivity. The first conductivity parameter is further adjusted. When the first resistance value and the second resistance value are the same, the conductivity value of the equivalent body is the first conductivity parameter.

[0065] In this embodiment, by comparing and adjusting the first resistance value and the second resistance value, the conductivity of the material can be optimized, which helps in material design, enabling the material to achieve a balance between electrical and mechanical properties, and can be applied to electronic components, sensors, and other engineering materials that require comprehensive consideration of electrical and mechanical properties.

[0066] In one embodiment, obtaining a second conductivity parameter of the material constituting the contact region based on a first conductivity parameter includes:

[0067] Obtain the first total resistance value of the equivalent body and the second total resistance value of the helical spring model corresponding to the equivalent body; compare the first total resistance value and the second total resistance value, adjust the conductivity value of the contact area, and when the first total resistance value and the second total resistance value are equal, use the conductivity value of the contact area as the second conductivity parameter of the material constituting the contact area.

[0068] The first total resistance value is the total resistance value of the equivalent body, which is usually calculated by measuring current and voltage; the second total resistance value is the resistance value calculated by the helical spring model corresponding to the equivalent body; when the first total resistance value and the second total resistance value are equal, the resulting contact area conductivity is regarded as the second conductivity parameter of the material constituting the contact area.

[0069] In this embodiment, the resistance values ​​of the equivalent body and the helical spring model are obtained by measurement and calculation; by comparing the first total resistance value and the second total resistance value, it can be determined whether the electrical conductivity of the materials is matched; and, in order to achieve consistency between the first total resistance value and the second total resistance value, the conductivity of the contact area needs to be adjusted. When the two are equal, the conductivity value of the contact area is regarded as a new material property, namely the second conductivity parameter. The above process helps to optimize engineering design and improve the application effect of materials in practical applications.

[0070] This application provides a digital construction method for a simulation model of a current-carrying connection structure. To better understand the process of this digital construction method, combined with... Figure 3 As shown below, the specific process of digitally constructing a simulation model of the current-carrying connection structure of this application is described in detail, including the following steps:

[0071] Step S302: Establish a simulation model of the current-carrying connection structure.

[0072] The schematic diagram for constructing the equivalent model of the helical spring is shown below. Figure 4 As shown, it includes an equivalent body, a contact area, conductive rod 1 (first conductive rod), and conductive rod 2 (second conductive rod); and a cross-sectional schematic diagram of the equivalent model is shown below. Figure 5 As shown, it includes the equivalent body, the contact area, and the conductive rod wall.

[0073] Step S304: The helical spring is equivalent to a contact area and an equivalent body.

[0074] Specifically, the equivalent body is a fan-shaped ring with an inner diameter equal to the inner diameter of the ring containing the helical spring, an outer diameter equal to the diameter of the conductive rod 2 minus the diameter of the helical spring wire, and a width equal to 1.5 spring pitches. Each equivalent body has 4 contact areas attached to simulate contact resistance. The length and width of the contact areas are between 0.5 and 1 spring wire pitch.

[0075] For example, if the total number of spring pitches is D, then the number of equivalent models of spring contacts built around the conductor circumference is D / 1.5; if not divisible, then the length of the equivalent model body of the last spring contact is the remainder, and the number of contact areas of conductive rod 1 and conductive rod 2 is reduced by 1 each.

[0076] Step S306: Calculate the first conductivity parameter and the second conductivity parameter.

[0077] The specific process for obtaining the first conductivity parameter of the equivalent body material is as follows: Take a helical spring model with a pitch number corresponding to the length of the equivalent model, and apply current inlet and outlet at the contact points of conductive rod 1 and conductive rod 2 respectively (regardless of which side), and calculate the resistance value r (second resistance value); apply current inlet and outlet at the interface between the contact area on the conductive rod 1 and conductive rod 2 sides and the equivalent body respectively (regardless of which side), and calculate the equivalent resistance value R (first resistance value); modify the conductivity of the material used in the equivalent body so that the value of the equivalent resistance value R is equal to r, then the conductivity value of this material is the conductivity value used for loss calculation.

[0078] More commonly, methods for determining the second conductivity parameter of the contact area material include: ① Experimental method: Establishing a simulation calculation model of the equivalent model of conductive rod 1, conductive rod 2, and helical spring contact finger, and building an experimental simulation model of the actual helical spring contact finger; obtaining the total resistance value r_total (second total resistance value) at both ends of conductive rod 1 and conductive rod 2 through experimental measurement; simulating and calculating the resistance value R_total (first total resistance value) at both ends of conductive rod 1 and conductive rod 2. At this time, the conductivity values ​​of conductive rod 1, conductive rod 2, and the equivalent body are constant. Modifying the conductivity value of the contact area to make r_total equal to R_total, obtaining the equivalent conductivity value of the contact area, and the resistance value at this location obtained is the contact resistance. ② Simulation method: The method for obtaining the r_total value is different. Establishing a refined simulation calculation model of the actual helical spring contact finger, and obtaining the r_total value through simulation.

[0079] Step S308: Thermal calculation of equivalent contact resistance.

[0080] Using the above-mentioned equivalent model construction method for helical spring finger, a GIS / GIL simulation calculation model of the head structure is established. The equivalent conductivity value obtained above is assigned to the corresponding parts to obtain the heating power of the corresponding parts. The overall temperature field distribution is obtained through the heat flow coupling calculation method.

[0081] In the above embodiments, the problem of equivalent modeling of helical spring contact fingers is solved, and the contact resistance is fully considered. While maintaining the calculation accuracy, the complex surface meshing of the helical spring is avoided, and the calculation efficiency and accuracy of temperature field analysis and evaluation are improved. Furthermore, due to the segmented equivalent modeling, the non-uniform distribution of resistance on the entire coil of the spring structure under non-uniform force can be considered.

[0082] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0083] Based on the same inventive concept, this application also provides a digital construction device for a current-carrying connection structure simulation model, which is used to implement the digital construction method for the current-carrying connection structure simulation model described above. The solution provided by this device is similar to the solution described in the above method. Therefore, the specific limitations of one or more embodiments of the digital construction device for a current-carrying connection structure simulation model provided below can be found in the limitations of the digital construction method for the current-carrying connection structure simulation model described above, and will not be repeated here.

[0084] In one exemplary embodiment, such as Figure 6 As shown, a digital construction device for a simulation model of a current-carrying connection structure is provided, comprising: a sector ring construction module 601, an equivalent model forming module 602, and a simulation model composition module 603, wherein:

[0085] The sector ring construction module 601 is used to construct a sector ring as an equivalent body of the helical spring in the current-carrying connection structure, and to construct a first conductive rod and a second conductive rod, with the equivalent body located between the first conductive rod and the second conductive rod.

[0086] The equivalent model forming module 602 is used to construct contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of the helical spring finger; the contact areas are used to simulate contact resistance.

[0087] The simulation model component module 603 is used to form a current-carrying connection structure simulation model based on the constructed equivalent models of multiple helical spring fingers.

[0088] Furthermore, in one embodiment, the sector ring construction module 601 is also used to construct an equivalent body whose width is less than a preset multiple of the pitch of the helical spring; the inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular region formed by the first conductive rod and the second conductive rod, and the outer diameter of the equivalent body is the outer diameter corresponding to the annular region minus the diameter of the spring wire of the helical spring.

[0089] Furthermore, in one embodiment, the equivalent model forming module 602 is also used to ensure that the length and width of the contact area are both greater than half of the spring pitch of the helical spring and less than the spring pitch; the number of equivalent models of the helical spring is determined based on the total number of pitches of the helical spring.

[0090] Furthermore, in one embodiment, the equivalent model forming module 602 is also used to obtain a first conductivity parameter of the material constituting the equivalent body; obtain a second conductivity parameter of the material constituting the contact area based on the first conductivity parameter; obtain the heating power of different parts of the device to be monitored according to the first conductivity parameter and the second conductivity parameter, and then obtain the thermal fault information of the device according to the heating power.

[0091] Furthermore, in one embodiment, the equivalent model forming module 602 is also used to obtain a first resistance value of the equivalent body and a second resistance value of the helical spring model corresponding to the equivalent body; compare the first resistance value and the second resistance value, adjust the conductivity value of the equivalent body, and when the first resistance value and the second resistance value are equal, use the conductivity value of the equivalent body as the first conductivity parameter of the material constituting the equivalent body.

[0092] Furthermore, in one embodiment, the equivalent model forming module 602 is also used to obtain a first total resistance value of the equivalent body and a second total resistance value of the helical spring model corresponding to the equivalent body; compare the first total resistance value and the second total resistance value, adjust the conductivity value of the contact area, and when the first total resistance value and the second total resistance value are equal, use the conductivity value of the contact area as the second conductivity parameter of the material constituting the contact area.

[0093] Each module in the digital construction device of the aforementioned current-carrying connection structure simulation model can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device in hardware form, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0094] In one exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 7As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operating system and computer programs stored in the non-volatile storage media. The database stores the digital construction data of the current-carrying connection structure simulation model. The I / O interfaces are used for information exchange between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements a method for digitally constructing a current-carrying connection structure simulation model.

[0095] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0096] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0097] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0098] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0099] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0100] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0101] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for digitally constructing a simulation model of a current-carrying connection structure, characterized in that, The method includes: A fan-shaped ring is constructed as the equivalent body of the helical spring in the current-carrying connection structure, and a first conductive rod and a second conductive rod are constructed. The equivalent body is located between the first conductive rod and the second conductive rod. The width of the equivalent body is less than a preset multiple of the pitch of the helical spring. The inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular region formed by the first conductive rod and the second conductive rod. The outer diameter of the equivalent body is the outer diameter corresponding to the annular region minus the diameter of the spring wire of the helical spring. Contact areas are constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a helical spring finger; the contact areas are used to simulate contact resistance; the length and width of the contact areas are both greater than half the spring wire pitch of the helical spring and less than the spring wire pitch. Based on the constructed equivalent models of multiple helical spring fingers, a simulation model of the current-carrying connection structure is formed.

2. The method according to claim 1, characterized in that, The number of equivalent models for the helical spring is determined based on the total number of pitches of the helical spring.

3. The method according to claim 1, characterized in that, After constructing a simulation model of the current-carrying connection structure based on multiple equivalent models of helical spring fingers, the model includes: Obtain the first electrical conductivity parameter of the material constituting the equivalent bulk; Based on the first conductivity parameter, the second conductivity parameter of the material constituting the contact area is obtained; The heat generation power of different parts of the device under monitoring is obtained based on the first conductivity parameter and the second conductivity parameter, and then the thermal fault information of the device is obtained based on the heat generation power.

4. The method according to claim 3, characterized in that The acquisition of the first electrical conductivity parameter of the material constituting the equivalent bulk includes: Obtain the first resistance value of the equivalent body, and obtain the second resistance value of the helical spring model corresponding to the equivalent body; By comparing the first resistance value and the second resistance value, the conductivity value of the equivalent body is adjusted. When the first resistance value and the second resistance value are equal, the conductivity value of the equivalent body is used as the first conductivity parameter of the material constituting the equivalent body.

5. The method according to claim 3, characterized in that, The step of obtaining the second conductivity parameter of the material constituting the contact area based on the first conductivity parameter includes: Obtain the first total resistance value of the equivalent body and the second total resistance value of the helical spring model corresponding to the equivalent body; By comparing the first total resistance value and the second total resistance value, the conductivity value of the contact area is adjusted. When the first total resistance value and the second total resistance value are equal, the conductivity value of the contact area is used as the second conductivity parameter of the material constituting the contact area.

6. A digital construction device for a simulation model of a current-carrying connection structure, characterized in that, The device includes: A sector ring construction module is used to construct a sector ring as an equivalent body of a helical spring in a current-carrying connection structure, and to construct a first conductive rod and a second conductive rod. The equivalent body is located between the first conductive rod and the second conductive rod. The width of the equivalent body is less than a preset multiple of the pitch of the helical spring. The inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular region formed by the first conductive rod and the second conductive rod. The outer diameter of the equivalent body is the outer diameter corresponding to the annular region minus the diameter of the spring wire of the helical spring. An equivalent model forming module is used to construct contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a helical spring finger; the contact area is used to simulate contact resistance; the length and width of the contact area are both greater than half of the spring wire pitch of the helical spring, and less than the spring wire pitch; The simulation model component module is used to form a current-carrying connection structure simulation model based on the constructed equivalent models of multiple helical spring fingers.

7. The apparatus according to claim 6, characterized in that, The equivalent model forming module is further configured to obtain a first resistance value of the equivalent body and a second resistance value of the helical spring model corresponding to the equivalent body; compare the first resistance value and the second resistance value, adjust the conductivity value of the equivalent body, and when the first resistance value and the second resistance value are equal, use the conductivity value of the equivalent body as the first conductivity parameter of the material constituting the equivalent body.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 5.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 5.

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