Adjustable wafer spraying mechanism and wafer processing device

Abstract

The invention discloses an adjustable wafer spraying mechanism and a wafer processing device, the adjustable wafer spraying mechanism comprises a processing cylinder, a liquid supply channel and a nozzle assembly, and the liquid supply channel is arranged in the cylinder wall of the processing cylinder; each group of nozzle assembly comprises a plurality of spray heads, and mounting holes corresponding to the spray heads are formed in the treatment barrel; each spray head comprises a first spray head and a second spray head, the first end of the second spray head extends into the cavity of the treatment barrel, the second end of the second spray head is provided with a groove, a liquid spray channel is arranged in the second spray head, the first end of the first spray head is provided with a convex part, and the second end of the first spray head is provided with an adjusting part. The protruding part is located in the groove, and a liquid separation channel is formed between the protruding part and the groove. According to the adjustable wafer spraying mechanism, through cooperation of the first spraying head and the second spraying head, the spraying angles of the spraying heads can be adjusted, meanwhile, liquid in the liquid supply channel is shunted, and the wafer processing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to an adjustable wafer spraying mechanism and a wafer processing device. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit element structures can be processed on silicon wafers to become electronic components with specific electrical functions. As the size of integrated circuits on semiconductor wafers develops towards the micron level, the processing requirements in the semiconductor wafer manufacturing process are also getting higher and higher. For example, cleaning, especially if semiconductor wafers are contaminated by dust particles and metals during the manufacturing process, it is easy to cause damage to the circuit function in the wafer, forming a short circuit or open circuit, etc., thereby causing the failure of the integrated circuit and affecting the formation of geometric features. Therefore, in addition to eliminating external pollution sources during the manufacturing process, cleaning work is also required to effectively use chemical solutions or gases to remove impurities such as dust, metal ions and organic matter remaining on the wafer without destroying the surface characteristics and electrical characteristics of the wafer.

[0003] In the wet processing of wafers, a spray mechanism is required to clean or perform other process treatments on the wafers in the wafer processing device. The spray heads of existing wafer processing devices are usually fixedly mounted on the processing barrel of the wafers, and the spray angle of the spray heads cannot be adjusted, which affects the processing effect of the wafers. Summary of the invention

[0004] In order to solve the related technical problems, the purpose of the present invention is to provide an adjustable wafer spray mechanism to solve the problem of low wafer cleaning efficiency; in addition, the present invention also provides a wafer processing device including the above-mentioned adjustable wafer spray mechanism.

[0005] To achieve the above objectives, the embodiments of the present invention adopt the following technical solutions:

[0006] An adjustable wafer spray mechanism includes a processing cylinder, a plurality of liquid supply channels and a plurality of nozzle assemblies, wherein:

[0007] The wall of the treatment cylinder is provided with a plurality of liquid supply channels at intervals along the circumferential direction, and each of the liquid supply channels corresponds to a group of the nozzle assemblies;

[0008] Each group of the nozzle assemblies comprises a plurality of nozzles spaced apart along the length direction of the liquid supply channel, and a mounting hole penetrating the liquid supply channel is provided on the treatment cylinder corresponding to each of the nozzles, and each of the nozzles is rotatably mounted in the corresponding mounting hole;

[0009] Each of the nozzles includes a first nozzle and a second nozzle. The first end of the second nozzle extends into the cavity of the treatment cylinder, the second end of the second nozzle is provided with a groove, and a liquid spraying channel is provided in the second nozzle. The first end of the first nozzle is provided with a protrusion, and the second end of the first nozzle is provided with an adjustment portion. After the first nozzle and the second nozzle are sealed and installed in the corresponding mounting holes, the protrusion is located in the groove, and a liquid separation channel is formed between the protrusion and the groove. The first end of the liquid separation channel is connected to the liquid supply channel, and the second end of the liquid separation channel is connected to the liquid spraying channel. The first nozzle is rotated by adjusting the adjustment portion, thereby driving the second nozzle to rotate to adjust the liquid spraying angle of the nozzle.

[0010] Optionally, each group of the nozzle assemblies further includes a pressing plate, which is detachably fixed to the outer wall of the processing cylinder and pressed against the adjusting parts of all the first nozzles of each group of the nozzle assemblies so as to fix all the nozzles of each group of the nozzle assemblies in the corresponding mounting holes, and a through hole is provided on the pressing plate corresponding to the adjusting part of each first nozzle.

[0011] Optionally, a group of fixing holes are opened on the pressure plate corresponding to each of the nozzles, threaded holes are opened on the processing tube corresponding to the fixing holes, and fixing screws pass through the fixing holes and are fixed in the corresponding threaded holes to detachably fix the pressure plate to the outer wall of the processing tube.

[0012] Optionally, the mounting hole comprises a first assembly hole and a second assembly hole that are connected, and the first assembly hole is located outside the second assembly hole, wherein:

[0013] The first nozzle is installed in the first assembly hole, and a first sealing ring is provided between the first nozzle and the first assembly hole;

[0014] A step portion is arranged in the second assembly hole, a convex shoulder portion is arranged on the outer wall of the second nozzle, the convex shoulder portion of the second nozzle is pressed against the step portion, and a second sealing ring is installed between the convex shoulder portion and the second assembly hole.

[0015] Optionally, the processing cylinder includes a first end cover, a cylinder body, a second end cover and a plurality of connecting rods, the cylinder body is provided with a plurality of through holes along its length direction, the first end cover and the second end cover are provided with a plurality of connecting holes corresponding to the through holes, both ends of the connecting rods are provided with threaded sections, each of the connecting rods is passed through the through hole and the connecting holes of the first end cover and the second end cover and is tightened by a nut to fix the first end cover, the cylinder body and the second end cover in connection.

[0016] Optionally, a clamp is further provided on the outer wall of the processing tube.

[0017] Optionally, a static electricity removal device is further provided on the outer wall of the processing cylinder, and the static electricity removal device is configured to eliminate static electricity in the processing cylinder.

[0018] A wafer processing device comprises the above-mentioned adjustable wafer spraying mechanism.

[0019] The beneficial effects of the present invention are as follows: compared with the prior art, the adjustable wafer spray mechanism provided by the present invention has the following beneficial effects:

[0020] 1. Through the cooperation of the first nozzle and the second nozzle, the nozzle can adjust the spray angle in the processing tube, and at the same time realize the diversion of the liquid in the liquid supply channel, so that the nozzle can clean the wafer more evenly, thereby improving the efficiency of wafer processing;

[0021] 2. The structure of fixing the nozzle by setting a pressure plate is simple, which improves the installation stability of the nozzle and is also convenient for disassembly and assembly, which is convenient for the later maintenance of the nozzle;

[0022] 3. By providing a convex shoulder on the second nozzle and installing the sealing ring in the second assembly hole, a high sealing effect is achieved;

[0023] 4. The first end cover, the cylinder and the second end cover are fixedly connected by the cooperation of several connecting rods and through holes, with a simple structure and strong connection stability;

[0024] 5. By setting the clamp, the connection stability between the first end cover, the cylinder and the second end cover is increased, and the stability of the pressure plate connection is improved;

[0025] 6. By setting up a static electricity removal device, the static electricity in the treatment cylinder is eliminated and the treatment efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following briefly introduces the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0027] Figure 1 It is a structural schematic diagram of an adjustable wafer spray mechanism provided by an embodiment of the present invention;

[0028] Figure 2 It is a cross-sectional structural schematic diagram of an adjustable wafer spray mechanism provided by an embodiment of the present invention;

[0029] Figure 3It is a cross-sectional structural schematic diagram of an adjustable wafer spray mechanism provided by an embodiment of the present invention;

[0030] Figure 4 It is a partial cross-sectional structural schematic diagram of an adjustable wafer spray mechanism provided by an embodiment of the present invention;

[0031] Figure 5 It is a structural schematic diagram of a nozzle in an adjustable wafer spray mechanism provided by an embodiment of the present invention;

[0032] Figure 6 is a structural schematic diagram of a first nozzle in an adjustable wafer spray mechanism provided by an embodiment of the present invention;

[0033] Figure 7 It is a structural schematic diagram of a second nozzle in an adjustable wafer spray mechanism provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on the other component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] See also Figures 1 to 7As shown, this embodiment provides an adjustable wafer spray mechanism, which includes a processing barrel 1, a plurality of liquid supply channels 2 and a plurality of groups of nozzle assemblies 3. A plurality of liquid supply channels 2 are arranged at intervals along the circumferential direction in the barrel wall of the processing barrel 1, and each liquid supply channel 2 corresponds to a group of nozzle assemblies 3; each group of nozzle assemblies 3 includes a plurality of nozzles 4 arranged at intervals along the length direction of the liquid supply channel 2, and a mounting hole 10 penetrating the liquid supply channel 2 is arranged on the processing barrel 1 corresponding to each nozzle 4, and each nozzle 4 can be rotatably installed in the corresponding mounting hole 10; each nozzle 4 includes a first nozzle 40 and a second nozzle 41, and the first end of the second nozzle 41 extends into the cavity of the processing barrel 1, and the second nozzle 41 has a A groove 410 is provided at the second end, a liquid spraying channel 411 is provided in the second nozzle 41, a protrusion 400 is provided at the first end of the first nozzle 40, and an adjusting portion 401 is provided at the second end of the first nozzle 40. After the first nozzle 40 and the second nozzle 41 are sealed and installed in the corresponding mounting hole 10, the protrusion 400 is located in the groove 410, and a liquid separation channel 42 is formed between the protrusion 400 and the groove 410. The first end of the liquid separation channel 42 is connected to the liquid supply channel 2, and the second end of the liquid separation channel 42 is connected to the liquid spraying channel 411. The first nozzle 40 is rotated by adjusting the adjusting portion 401, thereby driving the second nozzle 41 to rotate, so as to adjust the liquid spraying angle of the nozzle 4.

[0037] It can be seen that through the cooperation between the first nozzle 40 and the second nozzle 41, the nozzle 4 can adjust the spray angle in the processing tube 1, and at the same time realize the diversion of the liquid in the liquid supply channel 2, so that the nozzle 4 can clean the wafer more evenly, thereby improving the efficiency of processing the wafer.

[0038] As an embodiment, each group of nozzle assemblies 3 also includes a pressing plate 5, which is detachably fixed to the outer wall of the processing cylinder 1 and pressed against the adjusting parts 401 of all the first nozzles 40 of each group of nozzle assemblies 3 to fix all the nozzles 4 of each group of nozzle assemblies 3 in the corresponding mounting holes 10, and a through hole is provided on the pressing plate 5 corresponding to the adjusting part 401 of each first nozzle 40.

[0039] It can be seen that by setting the pressing plate 5 , the structure of fixing the nozzle 4 is simple, the installation stability of the nozzle 4 is improved, and it is also easy to disassemble and assemble, which is convenient for the later maintenance of the nozzle 4 .

[0040] As an embodiment, a group of fixing holes are opened on the pressure plate 5 corresponding to each nozzle 4, and threaded holes are opened on the processing tube 1 corresponding to the fixing holes. The fixing screws pass through the fixing holes and are fixed in the corresponding threaded holes to detachably fix the pressure plate 5 to the outer wall of the processing tube 1.

[0041] It can be seen that the installation structure of the pressing plate 5 is simple and stable, and is easy to maintain.

[0042] As an embodiment, the mounting hole 10 includes a first assembly hole 100 and a second assembly hole 101 that are connected to each other, and the first assembly hole 100 is located on the outside of the second assembly hole 101, wherein: the first nozzle 40 is installed in the first assembly hole 100, and a first sealing ring 43 is arranged between the first nozzle 40 and the first assembly hole 100; a step portion 102 is arranged in the second assembly hole 101, and a boss portion 44 is arranged on the outer wall of the second nozzle 41, and the boss portion 44 of the second nozzle 41 is pressed against the step portion 102, and a second sealing ring 45 is installed between the boss portion 44 and the second assembly hole 101.

[0043] It can be seen that by providing the boss portion 44 on the second nozzle 41 and installing the matching sealing ring in the second assembly hole 101, a high sealing effect is achieved.

[0044] As an embodiment, the treatment cylinder 1 includes a first end cover 11, a cylinder body 12, a second end cover 13 and a plurality of connecting rods 14. The cylinder body 12 is provided with a plurality of through holes 15 along its length direction. The first end cover 11 and the second end cover 13 are provided with a plurality of connecting holes corresponding to the through holes 15. Both ends of the connecting rod 14 are provided with threaded sections. Each connecting rod 14 is inserted into the through hole 15 and the connecting holes of the first end cover 11 and the second end cover 13 and is tightened by a nut to fix the first end cover 11, the cylinder body 12 and the second end cover 13 in connection.

[0045] It can be seen that the first end cover 11, the cylinder 12 and the second end cover 13 are fixedly connected by the cooperation of a plurality of connecting rods 14 and the through holes 15, and the structure is simple and the connection stability is strong.

[0046] As an implementation mode, a clamp 6 is further provided on the outer wall of the treatment tube 1 .

[0047] It can be seen that by providing the clamp 6, the connection stability between the first end cover 11, the cylinder 12 and the second end cover 13 is increased, and the connection stability of the pressure plate 5 is improved.

[0048] As an embodiment, a static electricity removal device (not shown in the figure) is further provided on the outer wall of the treatment barrel 1 , and the static electricity removal device is configured to eliminate static electricity in the treatment barrel 1 .

[0049] It can be seen that by providing the static electricity removal device, the static electricity in the processing tube 1 is eliminated, thereby improving the processing efficiency.

[0050] A wafer processing device comprises the above-mentioned adjustable wafer spraying mechanism.

[0051] In the embodiments disclosed in the present invention, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments disclosed in the present invention can be understood according to specific circumstances.

[0052] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above examples. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An adjustable wafer spraying mechanism, characterized in that: The adjustable wafer spray mechanism comprises a processing cylinder, a plurality of liquid supply channels and a plurality of nozzle assemblies, wherein: The wall of the treatment cylinder is provided with a plurality of liquid supply channels at intervals along the circumferential direction, and each of the liquid supply channels corresponds to a group of the nozzle assemblies; Each group of the nozzle assemblies comprises a plurality of nozzles spaced apart along the length direction of the liquid supply channel, and a mounting hole penetrating the liquid supply channel is provided on the treatment cylinder corresponding to each of the nozzles, and each of the nozzles is rotatably mounted in the corresponding mounting hole; Each of the nozzles includes a first nozzle and a second nozzle. The first end of the second nozzle extends into the cavity of the treatment cylinder, the second end of the second nozzle is provided with a groove, and a liquid spraying channel is provided in the second nozzle. The first end of the first nozzle is provided with a protrusion, and the second end of the first nozzle is provided with an adjustment portion. After the first nozzle and the second nozzle are sealed and installed in the corresponding mounting holes, the protrusion is located in the groove, and a liquid separation channel is formed between the protrusion and the groove. The first end of the liquid separation channel is connected to the liquid supply channel, and the second end of the liquid separation channel is connected to the liquid spraying channel. The first nozzle is rotated by adjusting the adjustment portion, thereby driving the second nozzle to rotate to adjust the liquid spraying angle of the nozzle.

2. The adjustable wafer spraying mechanism according to claim 1, characterized in that: Each group of the nozzle assemblies also includes a pressing plate, which is detachably fixed to the outer wall of the processing cylinder and pressed against the adjusting parts of all the first nozzles of each group of the nozzle assemblies to fix all the nozzles of each group of the nozzle assemblies in the corresponding mounting holes. A through hole is provided on the pressing plate corresponding to the adjusting part of each first nozzle.

3. The adjustable wafer spraying mechanism according to claim 2, characterized in that: A group of fixing holes are opened on the pressure plate corresponding to each of the nozzles, threaded holes are opened on the treatment tube corresponding to the fixing holes, and fixing screws pass through the fixing holes and are fixed in the corresponding threaded holes to detachably fix the pressure plate to the outer wall of the treatment tube.

4. The adjustable wafer spraying mechanism according to claim 1, characterized in that: The mounting hole comprises a first assembly hole and a second assembly hole that are connected, the first assembly hole is located outside the second assembly hole, wherein: The first nozzle is installed in the first assembly hole, and a first sealing ring is provided between the first nozzle and the first assembly hole; A step portion is arranged in the second assembly hole, a convex shoulder portion is arranged on the outer wall of the second nozzle, the convex shoulder portion of the second nozzle is pressed against the step portion, and a second sealing ring is installed between the convex shoulder portion and the second assembly hole.

5. The adjustable wafer spraying mechanism according to claim 1, characterized in that: The treatment cylinder includes a first end cover, a cylinder body, a second end cover and a plurality of connecting rods. The cylinder body is provided with a plurality of through holes along its length direction. The first end cover and the second end cover are provided with a plurality of connecting holes corresponding to the through holes. Both ends of the connecting rods are provided with threaded sections. Each of the connecting rods is inserted into the through holes and the connecting holes of the first end cover and the second end cover and is tightened by a nut to fix the first end cover, the cylinder body and the second end cover in connection.

6. The adjustable wafer spraying mechanism according to claim 1, characterized in that: A clamp is also provided on the outer wall of the treatment tube.

7. The adjustable wafer spraying mechanism according to claim 1, characterized in that: An anti-static device is also provided on the outer wall of the treatment cylinder, and the anti-static device is configured to eliminate static electricity in the treatment cylinder.

8. A wafer processing device, characterized in that: An adjustable wafer spraying mechanism comprising any one of claims 1 to 6.

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