The invention belongs to the technical field of low-temperature
plasma, and particularly relates to a low-temperature injection type AP
plasma treatment device which comprises a
machining table and a
silicon wafer material plate arranged on the surface of the
machining table and further comprises a low-temperature cleaning
assembly arranged on the surface of the
machining table. Position movement of the movable frame on the
fixed frame is achieved more flexibly, an operator does not need to hold a
silicon wafer by hand to clean the surface of a
silicon wafer material, meanwhile, it needs to be guaranteed that the silicon wafer is cleaned more evenly, labor input is saved, cleaning efficiency is improved, and under pushing of a
hydraulic cylinder, the distance between a
plasma cleaning spray head and the silicon wafer can be adjusted, so that cleaning efficiency is improved. The plasma spraying distance can be conveniently adjusted, the surface of a silicon wafer can be better cleaned, the surface of the silicon wafer can be comprehensively cleaned by installing a moving
assembly, the use effect is good, a fixing
assembly is arranged, a silicon material plate is placed on the surface of a machining table, a clamping plate is tightened downwards under the tension of a spring, and therefore the machining efficiency is improved. And the silicon material plate on the
processing table is fixed.