A tunnel-type high-speed in-situ eutectic soldering station, patch equipment and patch method

Abstract

The present invention discloses a tunnel-type high-speed in-situ eutectic soldering station, patch equipment and patch method, which include a first support plate for horizontal movement, a second support plate arranged on the first support plate for vertical movement, a eutectic temperature control plate group arranged on the second support plate, a support module arranged on the first support plate for horizontal sliding and clamping a substrate to move horizontally above the eutectic temperature control plate group, a first drive module arranged on the first support plate and driving the second support plate to move up and down, and a second drive module driving the support module to move horizontally; the eutectic temperature control plate group includes a preheating plate, a eutectic table and a cooling plate arranged in sequence along the substrate movement direction. The present invention can meet the eutectic welding requirements of a number of chips on a single substrate and improve the chip mounting efficiency of intensive circuit boards.

Description

Technical Field

[0001] The present invention belongs to the technical field of eutectic patch equipment, and in particular relates to a tunnel-type high-speed in-situ eutectic soldering station, patch equipment and a patch method. Background Art

[0002] Eutectic refers to the phenomenon of eutectic fusion between eutectic solders. It is a process that forms a highly thermally and electrically conductive bond, which is often required for densely packed circuits in today's chips. It is a highly controlled chip attach process suitable for devices with high reliability and high precision requirements.

[0003] Patent CN116013805B in the prior art discloses a eutectic machine. Although the device realizes automatic eutectic welding of chips, the eutectic heating table can only realize eutectic welding of a single chip with a single heat sink substrate and a tube seat, and cannot realize eutectic welding of multiple chips on a single substrate, and cannot meet the requirements of intensive circuit board chip mounting process.

[0004] In addition, the traditional ceramic substrate eutectic patch heating soldering station uses a single temperature constant temperature. After the array is mounted, the chip is heated for a long time, which has a large thermal shock to the substrate chip. The eutectic yield is low and there are voids. The substrate is easily deformed and unqualified.

[0005] Therefore, it is necessary to provide a new tunnel-type high-speed in-situ eutectic soldering station, patch equipment and patch method to solve the above technical problems. Summary of the invention

[0006] The main purpose of the present invention is to provide a tunnel-type high-speed in-situ eutectic soldering station, which can meet the eutectic soldering requirements of a number of chips on a single substrate and improve the chip mounting efficiency of a dense circuit board.

[0007] The present invention achieves the above-mentioned purpose through the following technical scheme: a tunnel-type high-speed in-situ eutectic soldering table, which includes a first support plate that performs horizontal movement, a second support plate that is movably arranged on the first support plate up and down, a eutectic temperature control plate group arranged on the second support plate, a support module that is horizontally slidably arranged on the first support plate and clamps the substrate to move horizontally above the eutectic temperature control plate group, a first drive module that is arranged on the first support plate and drives the second support plate to move up and down, and a second drive module that drives the support module to move horizontally; the eutectic temperature control plate group includes a preheating plate, a eutectic table and a cooling plate that are arranged in sequence along the movement direction of the substrate.

[0008] Furthermore, the upper surfaces of the preheating plate, the eutectic table and the cooling plate are flush and together form a supporting plane for supporting the substrate; and the upper surface of the eutectic table is provided with a plurality of adsorption holes for adsorbing the chip mounting area of ​​the substrate.

[0009] Furthermore, the second driving module drives the supporting module to clamp the substrate and switch positions in sequence between the loading and unloading position, the preheating position, the chip mounting position, the cooling position and the loading and unloading position. The preheating plate is set corresponding to the preheating position, the eutectic table is set corresponding to the chip mounting position, and the cooling plate is set corresponding to the cooling position.

[0010] Furthermore, the support module includes a support base plate, a pair of support vertical plates relatively arranged on the support base plate, a pair of support clamping plates located on the inner side of the pair of support vertical plates and supporting the substrate, a cover plate located above the support clamping plates and cooperating with the support clamping plates to clamp the substrate, and a lifting drive module arranged on the support vertical plates and driving the support clamping plates or the cover plates to move up and down; a tunnel space for the substrate to enter and exit is formed between the support clamping plates and the cover plates, and the cover plate is provided with avoidance hollow grooves that expose all chip pasting areas on the substrate.

[0011] Furthermore, a docking plate docking with the tunnel space is provided at the material inlet and outlet positions.

[0012] Furthermore, the lifting drive module includes two independent sub-modules, which respectively drive the two supporting splints to move up and down; the sub-module includes a mounting seat fixed on the top of the supporting vertical plate, and a plurality of first air cavities are arranged in the mounting seat, and a piston rod is arranged in the first air cavity to move up and down, and the bottom end of the piston rod extends into the first air cavity and the top end extends out of the first air cavity, and a connecting block is fixedly arranged on the top of the piston rod; the connecting block is fixedly connected to the supporting splint or the cover plate; when the connecting block is fixedly connected to the supporting splint, the cover plate is fixedly arranged above the mounting seat, and when the connecting block is fixedly connected to the cover plate, the supporting splint is fixedly arranged in the inner space of the mounting seat.

[0013] Furthermore, an inert gas blowing module is arranged on the support module; the inert gas blowing module includes an air guide strip arranged on the top of the mounting seat, the air guide strip is provided with a second air cavity capable of blowing air toward the space below the substrate and a plurality of third air cavities for blowing air toward the space above the substrate; the cover plate is provided with a plurality of blowing holes corresponding to the opening area of ​​the third air cavity, and the support splint is provided with a hollow groove for blowing the gas in the second air cavity into the space below the substrate; the support vertical plate is provided with a first air path connected to the first air cavity, and a second air path connected to the second air cavity and / or the third air cavity, the first air path end is provided with a first air nozzle, the second air path end is provided with a second air nozzle, and the first air nozzle and the second air nozzle are connected to an external air source.

[0014] Furthermore, a pair of support seats are provided on the first support plate; the first driving module includes a rotating shaft with two ends rotatably arranged on the support seats and located below the second support plate, a first motor fixed on the first support plate and driving the rotating shaft to rotate, and a cam fixed on the rotating shaft; a connecting plate is provided on the lower surface of the second support plate, a roller is provided on the connecting plate that cooperates with the cam and moves downward under the drive of the cam, and an avoidance groove is provided on the connecting plate for the rotating shaft to pass through and perform up and down floating motion.

[0015] Furthermore, an escape space is formed between the pair of supporting upright plates, and the second supporting plate and the eutectic temperature control plate group both pass through the escape space.

[0016] Another object of the present invention is to provide a tunnel-type high-speed in-situ eutectic bonding equipment, which includes a chip feeding station, a chip calibration station and a chip eutectic welding station arranged side by side, a first camera arranged above the chip feeding station, a chip angle calibration mechanism arranged at the chip calibration station, a eutectic soldering table arranged at the chip eutectic welding station and as described above, a chip loading and transporting mechanism that sucks chips at the chip feeding station and transfers them to the chip angle calibration mechanism, a second camera arranged above the chip calibration station, a chip mounting mechanism that sucks the chips after angle calibration on the chip angle calibration mechanism and transfers them to the eutectic soldering table for mounting, a third camera located above the chip eutectic welding station, a fourth camera located below the chip mounting mechanism transfer path and between the chip calibration station and the eutectic welding station, and a protective cover covering the eutectic soldering table.

[0017] Furthermore, it also includes a frame, and the first camera, the second camera, the third camera and the fourth camera are all fixedly arranged on the frame.

[0018] Another object of the present invention is to provide a chip bonding method based on the tunnel-type high-speed in-situ eutectic soldering station as described above, which comprises the following steps:

[0019] S1, at the material inlet and outlet position, the substrate is loaded into the tunnel space, the support clamp and the cover plate are switched from an open state to a clamping state, and the two side edges of the substrate are clamped up and down;

[0020] S2, the support module moves the substrate to the preheating position, aligns the first chip mounting area of ​​the substrate with the preheating plate, and the preheating plate rises to fit the lower surface of the first chip mounting area for preheating. After the preheating is completed, the preheating plate descends;

[0021] S3, the support module moves with the substrate to the chip mounting position, aligns the first chip mounting area with the eutectic table, and the eutectic table rises to fit the lower surface of the first chip mounting area for heating, and at the same time, completes the mounting of all chips in the first chip mounting area. After the mounting is completed, the eutectic table descends; during this process, the next chip mounting area on the substrate moves to the preheating position, and preheating is completed according to step S2;

[0022] S4, the support module moves with the substrate to the cooling position, aligns the first chip mounting area with the cooling plate, and the cooling plate rises to fit the lower surface of the first chip mounting area for cooling. After the cooling is completed, the cooling plate descends; during this process, the next chip mounting area on the substrate moves to the chip mounting position, and the chip mounting is completed according to step S3;

[0023] S5, the support module moves the substrate toward the feeding and discharging position by a set step distance until all chip pasting areas on the substrate complete substrate preheating, chip eutectic pasting, and substrate cooling operations in sequence;

[0024] S6. The support module moves with the substrate to the loading and unloading position, and the substrate is unloaded.

[0025] Compared with the prior art, the tunnel-type high-speed in-situ eutectic soldering station, chip mounting equipment and chip mounting method of the present invention have the beneficial effects of being able to meet the eutectic soldering requirements of a number of chips on a single substrate and improving the chip mounting efficiency of densely packed circuit boards. Specifically:

[0026] (1) All visual cameras are fixed on the frame to realize the automatic acquisition of in-situ chip position information and avoid the problem of inaccurate visual position information acquisition caused by motion spindle error;

[0027] (2) By cleverly designing the structure of the eutectic soldering station, a support module for clamping the substrate is set above the eutectic temperature control plate group. Under the horizontal drive of the second drive module, the drive support module clamps the substrate and moves it through the eutectic temperature control plate group in sequence according to the set step distance to perform regional array chip mounting, thereby realizing the array mounting of multiple chips on a single substrate, greatly improving the mounting efficiency;

[0028] (3) A preheating plate, a eutectic table and a cooling plate are sequentially arranged in the eutectic temperature control plate group. The single substrate passes through the preheating plate, the eutectic table and the cooling plate in sequence to realize the preheating of the chip pasting area on the substrate, the chip mounting heating and the automatic cooling of the chip after mounting. After the previous chip mounting area completes preheating at the preheating plate position, it enters the eutectic table heating position for substrate heating and chip mounting. At the same time, the next chip mounting area moves to the preheating plate position for preheating; similarly, after the previous chip mounting area completes chip mounting at the eutectic table position, it enters the cooling plate position for cooling. At the same time, the next chip mounting area moves to the eutectic table heating position for substrate heating and chip mounting. By analogy, the partition mounting of chips in all chip mounting areas on the substrate can be completed like an assembly line, which greatly improves the mounting efficiency;

[0029] (4) By preheating, heating and mounting, and cooling in different zones, the problem of substrate deformation caused by the substrate being in a high temperature state for a long time can be effectively avoided, thereby improving the chip mounting accuracy;

[0030] (5) In the support module, a self-made lifting drive module is used to drive the cover plate or the support clamp plate to move up and down, so that the cover plate and the support clamp plate can switch between the clamping state and the open state, which saves space and meets the requirements of substrate clamping and opening. At the same time, it meets the requirements of horizontal movement of the substrate above the eutectic temperature control plate group, ensures the position accuracy of the substrate during movement, and lays an important foundation for accurate chip placement;

[0031] (6) An inert gas blowing module is also provided in the support module. By blowing inert gas into the space above and below the substrate, oxidation of the welding material at the welding point can be effectively avoided during eutectic welding of the chip, thereby ensuring welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the three-dimensional structure of an embodiment of the present invention;

[0033] Figure 2 It is a structural schematic diagram of a chip angle calibration mechanism in an embodiment of the present invention;

[0034] Figure 3 A schematic diagram of a portion of the structure of a chip mounting mechanism in an embodiment of the present invention;

[0035] Figure 4 It is a structural schematic diagram of a eutectic soldering station in an embodiment of the present invention;

[0036] Figure 5 It is a structural schematic diagram of the eutectic temperature control plate group and the first driving module in an embodiment of the present invention;

[0037] Figure 6It is a structural schematic diagram of a supporting module and a second driving module in an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of the exploded structure of the support module in an embodiment of the present invention;

[0039] Figure 8 It is a schematic diagram of the side structure of the support module in an embodiment of the present invention;

[0040] Fig. 9 It is a schematic diagram of the cross-sectional structure of the support module cut along the moving direction of the substrate on the support vertical plate according to an embodiment of the present invention;

[0041] Fig.10 This is a schematic diagram of the cross-sectional structure of a lifting drive module according to an embodiment of the present invention;

[0042] The numbers in the figure represent:

[0043] 100-Tunnel type high-speed in-situ eutectic bonding equipment; 200-Substrate;

[0044] 1-first camera; 2-chip angle calibration mechanism, 21-adsorption platform, 22-first driving member;

[0045] 3-eutectic soldering station, 31-XY transfer module, 32-first support plate, 33-second support plate, 331-connecting plate, 332-roller, 333-avoidance slot, 34-eutectic temperature control plate group, 341-preheating plate, 342-eutectic station, 3421-adsorption hole, 343-cooling plate, 35-support module, 351-support bottom plate, 352-support vertical plate, 3521-first air path, 3522-first air nozzle, 3523-second air path, 3524-second air nozzle, 353-cover plate, 3531-blowing hole, 3532-avoidance hollow slot, 354-support splint, 3541-hollow slot, 355-lifting drive module , 3551-mounting seat, 3552-first air cavity, 3553-piston rod, 3554-connecting block, 3555-guide rod, 3556-linear bearing, 356-tunnel space, 357-air guide strip, 3571-second air cavity, 3572-third air cavity, 358-avoidance space, 36-first drive module, 361-rotating shaft, 362-first motor, 363-cam, 364-first synchronous pulley, 365-first transmission belt, 37-second drive module, 371-second motor, 372-second synchronous belt, 373-slide rail, 374-slider, 375-fixed connector, 38-support seat, 39-connecting plate;

[0046] 4- chip loading and transporting mechanism; 5- second camera; 6- chip mounting mechanism, 61- XYZ three-axis transfer module, 62- mounting head; 7- third camera; 8- fourth camera; 9- rack; 10- position adjustment module. DETAILED DESCRIPTION

[0047] Embodiment 1:

[0048] Please refer to Figure 1-Figure 10 The present embodiment is a tunnel-type high-speed in-situ eutectic bonding equipment 100, which includes a chip feeding station, a chip calibration station and a chip eutectic welding station arranged side by side, a first camera 1 arranged above the chip feeding station, a chip angle calibration mechanism 2 arranged at the chip calibration station, a eutectic welding table 3 arranged at the chip eutectic welding station, a chip loading and transporting mechanism 4 for sucking chips at the chip feeding station and transferring them to the chip angle calibration mechanism 2, a second camera 5 arranged above the chip calibration station, a chip mounting mechanism 6 for sucking the chips after angle calibration on the chip angle calibration mechanism 2 and transferring them to the eutectic welding table 3 for mounting, a third camera 7 located above the chip eutectic welding station, and a fourth camera 8 located below the transfer path of the chip mounting mechanism 6 and between the chip calibration station and the eutectic welding station.

[0049] This embodiment further includes a frame 9 and a protective cover (not shown in the figure) that covers the eutectic soldering station 3 .

[0050] In the process of chip mounting, it is first necessary to use a camera to take pictures of the chip position, reference point position, and the predetermined pasting position of the chip, and then determine the chip posture and position coordinates, the reference point coordinates on the substrate, and the coordinates of the predetermined pasting position according to the computer processing results. Therefore, multiple cameras are set in this embodiment. Among them, the first camera 1 is to obtain the position of each chip at the chip feeding station so that the chip loading and handling mechanism 4 can accurately absorb the chip. The second camera 5 is to obtain the position information of the chip placed on the chip angle calibration mechanism 2 so that the chip angle calibration mechanism 2 can adjust the chip to the set angle state. The third camera 7 is to obtain the position information of the chip to be mounted on the eutectic soldering station 3 so that the chip mounting mechanism 6 can mount the chip in place. The fourth camera 8 is to obtain the position information of the chip on the chip mounting mechanism 6 so that the chip mounting mechanism 6 can mount the chip in place.

[0051] Since there are so many visual cameras mentioned above that need to perform recognition and calculation of target position information during the chip mounting process, there are many calculation steps in the process and the content is relatively complicated. In the original eutectic equipment, the third camera 7 will be integrated on the chip mounting mechanism 6. Since the camera is not fixed in situ for taking pictures, but is installed on the mounting motion axis, it is necessary to find the position and then take pictures to mount the chip, which increases the error caused by the mounting accuracy. In order to avoid the occurrence of this problem, in this embodiment, the first camera 1, the second camera 5, the third camera 7 and the fourth camera 8 are all fixedly set on the frame 9 for in-situ fixed-point photography. Each of the above cameras is equipped with a position adjustment module 10, and the position of each camera can be fine-tuned by the position adjustment module 10. The position adjustment module 10 can be configured with a two-dimensional adjustment function or a three-dimensional adjustment function according to needs. Its specific structure is a prior art and will not be repeated in this embodiment.

[0052] The chip loading and transporting mechanism 4 is a rotating swing arm structure with a lifting function, and a chip suction nozzle is provided at the movable end. The chip is sucked and released by lifting and lowering movement, and the chip is transferred between the chip feeding station and the chip calibration station by rotating the swing arm. The chip loading and transporting mechanism 4 can adopt the structure in the prior art, and will not be described in detail in this embodiment.

[0053] The chip angle calibration mechanism 2 includes an adsorption platform 21 and a first driving member 22 for driving the adsorption platform 21 to rotate around the Z axis according to the position information of the second camera 5 to adjust the chip posture.

[0054] The chip mounting mechanism 6 includes an XYZ three-axis transfer module 61 and a mounting head 62 arranged at the movable end of the XYZ three-axis transfer module 61. In this embodiment, in order to improve the mounting efficiency, the three-axis transfer drive in the XYZ three-axis transfer module 61 is driven by a linear motor. The mounting head 62 can adopt a structure in the prior art, such as the structure of the "mounting module" in patent CN115866921B, which will not be repeated in this embodiment.

[0055] In order to realize the mounting of multiple chips on a single substrate, the present embodiment optimizes the structure of the eutectic soldering station 3. Specifically, the eutectic soldering station 3 includes an XY transfer module 31, a first support plate 32 disposed at the movable end of the XY transfer module 31, a second support plate 33 disposed on the first support plate 32 for vertical movement, a eutectic temperature control plate group 34 disposed on the second support plate 33, a support module 35 disposed on the first support plate 32 for horizontal sliding and clamping the substrate 200 to be horizontally movable relative to the eutectic temperature control plate group 34, a first driving module 36 disposed on the first support plate 32 and driving the second support plate 33 to move up and down, and a second driving module 37 disposed on the first support plate 32 and driving the support module 35 to move horizontally.

[0056] In order to prevent the substrate 200 from being deformed by heat for a long time, and to avoid the eutectic welding area from being heated for too long during chip mounting, thereby reducing the mounting efficiency, the eutectic temperature control plate group 34 is optimized in this embodiment. Specifically, the eutectic temperature control plate group 34 includes a preheating plate 341, a eutectic table 342, and a cooling plate 343 arranged in sequence along the substrate movement direction. The support module 35 clamps the substrate 200 and moves horizontally along the substrate movement direction, passing through the preheating plate 341, the eutectic table 342, and the cooling plate 343 in sequence. When the substrate 200 passes through the preheating plate 341 area, the preheating plate 341 first preheats the substrate 200, allowing the substrate 200 to be heated to the set temperature first, preventing the substrate 200 from directly contacting the high-temperature eutectic table 342, and a large thermal shock acting on the substrate 200, causing the substrate 200 to deform. The temperature of the eutectic stage 342 is relatively high, and the area of ​​the substrate 200 after preheating reaches above the eutectic stage 342. The eutectic stage 342 is used to heat the chip mounting area on the substrate 200 to the temperature required by the mounting process to ensure effective chip mounting. The area of ​​the substrate 200 after the chip is mounted is then moved above the cooling plate 343, and the cooling plate 343 is used to quickly cool down the high-temperature area of ​​the substrate to prevent the substrate from being deformed due to excessive temperature rise.

[0057] In order to ensure that the chip mounting area on the substrate 200 can be fully and evenly heated and kept warm during chip mounting, a plurality of adsorption holes 3421 for adsorbing the chip mounting area of ​​the substrate are provided on the upper surface of the eutectic stage 342. The upper surfaces of the preheating plate 341, the eutectic stage 342 and the cooling plate 343 are flush and together form a support plane for supporting the substrate 200.

[0058] When mounting chips on the substrate of this embodiment, the chips are mounted in an array in sections. The substrate 200 is clamped by the support module 35, so that the chip pasting area on the substrate 200 is moved to the position of the eutectic table 342 in sections in sequence. The first driving module 36 is provided to drive the eutectic temperature control board group 34 to move up and down, so that it is in a low position for position avoidance before the chip pasting area moves into place, and rises to a high position to be close to the lower surface of the substrate 200 after the chip pasting area moves into place, so as to heat or cool the substrate 200 in sections.

[0059] A pair of support seats 38 are disposed on the first support plate 32, and both ends of the second support plate 33 are elastically floated up and down on the support seats 38. The second support plate 33 is supported upward by the elastic member to maintain a high position.

[0060] In this embodiment, since the support module 35 needs to clamp the substrate 200 to move horizontally above the eutectic temperature control plate group 34, and the space above the eutectic temperature control plate group 34 needs to be reserved for the chip mounting mechanism 6 to perform the chip mounting operation, the design space reserved for the first driving module 36 is relatively limited. Based on the above situation, in this embodiment, the first driving module 36 includes a rotating shaft 361 with two ends rotatably arranged on the support seat 38 and located below the second supporting plate 33, a first motor 362 fixed on the first supporting plate 32 and driving the rotating shaft 361 to rotate, and a cam 363 fixed on the rotating shaft 361. A connecting plate 331 is provided on the lower surface of the second supporting plate 33, and a roller 332 is provided on the connecting plate 331 to cooperate with the cam 363 and move downward under the drive of the cam 363, and an avoidance slot 333 is provided on the connecting plate 331 for the rotating shaft 361 to pass through and perform an up and down floating movement. The connecting plate 331 is arranged in an upright state on the lower surface of the second support plate 33, and the rotating shaft 361 passes through the connecting plate 331 from the avoidance groove 333 in a horizontal state. Its two ends are rotatably arranged on the support seat 38. The first synchronous pulley 364 is also fixedly arranged on the rotating shaft 361. The rotating end of the first motor 362 is connected to the first synchronous pulley 364 through the first transmission belt 365, driving the rotating shaft 361 to rotate. Under the cooperation of the cam 363 and the roller 332, the second support plate 33 is driven to move downward together with the eutectic temperature control plate group 34 thereon, switching from a high position to a low position.

[0061] The support module 35 includes a support base plate 351, a pair of support vertical plates 352 arranged relatively on the support base plate 351, a cover plate 353 whose two sides are fixedly mounted on the top of the pair of support vertical plates 352, a pair of support clamping plates 354 located inside the pair of support vertical plates 352 and below the cover plate 353, and a lifting drive module 355 embedded in the support vertical plates 352 and driving the support clamping plates 354 to move up and down. A tunnel space 356 for the substrate 200 to enter and exit is formed between the support clamping plates 354 and the cover plate 353. The second drive module 37 drives the support module 35 to clamp the substrate 200 and switch positions between the material inlet and outlet position, the preheating position, the chip mounting position, and the cooling position. At the material inlet and outlet position, the support clamp 354 is in a low position, waiting for the substrate to enter and exit. When the substrate completely enters the tunnel space 356, the support clamp 354 switches to a high position, and clamps the edge of the substrate together with the cover plate 353 in an upper and lower relative form. Under the action of the second drive module 37, the substrate is moved to a set position for preheating, chip mounting, cooling, and unloading. The substrate can enter and exit the tunnel space 356 through an external pushing mechanism, which can be achieved by clamping or adsorbing one end of the substrate and pushing or pulling it out of the tunnel space 356 horizontally.

[0062] In order to ensure that the substrate 200 can smoothly and safely enter and exit the tunnel space 356, a docking plate 39 docking with the tunnel space 356 is fixedly arranged on the support seat 38 at one end of the in-and-out position, and the docking plate 39 is provided with limiting slide grooves that support the bottom of both sides of the substrate 200 and limit the position of both sides of the substrate 200. The supporting plane of the limiting slide groove is flush with the supporting plane of the supporting clamping plate 354 in the low position state, and the supporting clamping plate 354 docks with the docking plate 39 at the in-and-out position.

[0063] In consideration of the limited space, in order to realize the up and down movement of the support splint 354, the present embodiment optimizes the design of the lifting drive module 355. In the present embodiment, the lifting drive module 355 includes two independent submodules, which respectively drive the two support splints 354 to move up and down. The submodule includes a mounting seat 3551 fixed on the top of the support vertical plate 352, and a first air cavity 3552 is respectively arranged at the two end positions corresponding to the support splint 354 in the mounting seat 3551, and a piston rod 3553 is arranged in the first air cavity 3552 to move up and down, and the bottom end of the piston rod 3553 extends into the first air cavity 3552 and the top end extends out of the first air cavity 3552, and a connecting block 3554 is fixedly arranged on the top of the piston rod 3553, and the connecting block 3554 is fixedly connected to the support splint 354. By controlling the air pressure in the first air cavity 3552, the piston rod 3553 can be controlled to move up and down, thereby driving the support splint 354 to move up and down.

[0064] In order to ensure the stability of the up and down movement of the supporting splint 354 , a guide rod 3555 is provided on the connecting block 3554 , and a linear bearing 3556 cooperating with the guide rod 3555 is provided on the mounting seat 3551 .

[0065] A first air path 3521 communicating with the first air cavity 3552 and a first air nozzle 3522 communicating with an end of the first air path 3521 are provided in the support vertical plate 352 . The first air nozzle 3522 is connected to an external air source to control the air pressure in the first air cavity 3552 .

[0066] In order to ensure the quality of the chip during eutectic welding and to ensure that the chip is in an inert gas atmosphere during eutectic welding, this embodiment is also equipped with an inert gas blowing module (not marked in the figure) on the support module 35. The inert gas blowing module includes a gas guide strip 357 arranged on the top of the mounting seat 3551, and the gas guide strip 357 is provided with a second air cavity 3571 capable of blowing gas toward the space below the substrate and a plurality of third air cavities 3572 with openings facing upward. The mounting seat 3551 is fixedly mounted on the top of the supporting vertical plate 352, the gas guide strip 357 is fixedly mounted on the top of the mounting seat 3551, and the cover plate 353 is fixedly mounted on the top of the conductor strip 357, thereby realizing fixed installation above the top of the supporting vertical plate 352. The cover plate 353 is provided with a plurality of blowing holes 3531 corresponding to the opening area of ​​the third air cavity 3572, and an avoidance hollow notch 3532 that exposes all chip pasting areas on the substrate 200. The support clamping plate 354 is provided with a hollow groove 3541 for blowing the gas in the second air cavity 3571 into the space below the substrate. The opening range of the hollow groove 3541 covers the entire length range of the substrate, ensuring the purity and coverage of the inert gas atmosphere in the space below the substrate. The second air cavity 3571 is used to blow out the inert gas below the substrate, and the third air cavity 3572 is used to blow out the inert gas above the substrate. Through the arrangement of the second air cavity 3571 and the third air cavity 3572, in conjunction with the blowing holes 3531 on the cover plate 353 and the hollow groove 3541 on the support clamping plate 354, inert gas is blown out in the upper and lower spaces of the substrate, so that the substrate eutectic welding operation is carried out in an inert gas atmosphere, ensuring the quality of eutectic welding.

[0067] A second gas path 3523 connected to the second gas cavity 3571 and the third gas cavity 3572 respectively and a second gas nozzle 3524 connected to the end of the second gas path 3523 are provided in the supporting vertical plate 352. The second gas nozzle 3524 is connected to an external inert gas source.

[0068] The support clamp 354 moves up and down close to the inner surface of the conductor strip block 357 , and the support clamp 354 supports the lower surface of both side edges of the substrate. The inner surface of the conductor strip block 357 constitutes a position limit for the two side edges of the substrate, limiting the position of the substrate 200 in the tunnel space 356 .

[0069] The second driving module 37 includes a second motor 371 fixed on the first support plate 32 and a second synchronous belt 372 driven by the second motor 371 for horizontal transmission. A slide rail 373 parallel to the transmission direction of the second synchronous belt 372 is provided on the first support plate 32. A slider 374 cooperating with the slide rail 373 is provided at the bottom of the support module 35, and a fixed connecting piece 375 fixedly connected to the second synchronous belt 372 is provided on the side.

[0070] An escape space 358 is formed between the two supporting upright plates 352 , and the rotating shaft 361 , the second supporting plate 33 , and the eutectic temperature control plate group 34 all pass through the escape space 358 .

[0071] A die bonding method of a tunnel-type high-speed in-situ eutectic die bonding device 100 in this embodiment includes the following steps:

[0072] S1. At the loading and unloading position, the substrate 200 is loaded into the tunnel space 356, and the support clamping plate 354 and the cover plate 353 are switched from the open state to the clamping state, clamping the two side edges of the substrate 200 up and down;

[0073] S2, the support module 35 moves the substrate 200 to the preheating position, aligns the first chip mounting area of ​​the substrate 200 with the preheating plate 341, and the preheating plate 341 rises to fit the lower surface of the first chip mounting area for preheating. After the preheating is completed, the preheating plate 341 descends;

[0074] S3, the support module 35 moves with the substrate 200 to the chip mounting position, aligns the first chip mounting area with the eutectic table 342, and the eutectic table 342 rises to fit the lower surface of the first chip mounting area for heating. At the same time, all chips in the first chip mounting area are mounted. After mounting is completed, the eutectic table 342 descends; during this process, the next chip mounting area moves to the preheating position and preheating is completed according to step S2;

[0075] S4, the support module 35 moves with the substrate 200 to the cooling position, aligns the first chip mounting area with the cooling plate 343, and the cooling plate 343 rises to fit the lower surface of the first chip mounting area for cooling. After the cooling is completed, the cooling plate 343 descends; during this process, the next chip mounting area moves to the chip mounting position, and the chip mounting is completed according to step S3;

[0076] S5, the support module 35 moves the substrate 200 toward the feeding and discharging position by a set step distance until all chip pasting areas on the substrate 200 complete the substrate preheating, chip eutectic pasting, and substrate cooling operations in sequence;

[0077] S6. The supporting module 35 moves the substrate 200 to the loading and unloading position, and the substrate is unloaded.

[0078] Embodiment 2:

[0079] The second embodiment is a tunnel-type high-speed in-situ eutectic bonding equipment, which has basically the same structure as the tunnel-type high-speed in-situ eutectic bonding equipment 100 in the first embodiment, and the difference is that: in the support module 35, the support clamp 354 remains fixed, and the cover plate 353 has the function of moving up and down relative to the support clamp 354. The cover plate 353 is driven by the lifting drive module 355 to move up and down, and clamps the substrate together with the support clamp 354.

[0080] Specifically, the support module 35 includes a support base plate 351, a pair of support vertical plates 352 relatively fixedly arranged on the support base plate 351, a cover plate 353 with two side edges movably installed above the top of the pair of support vertical plates 352, a pair of support clamping plates 354 located on the inner side of the pair of support vertical plates 352 and below the cover plate 353, and a lifting drive module 355 embedded in the support vertical plates 352 and driving the cover plate 353 to move up and down.

[0081] The support clamp plate 354 is fixedly arranged on the inner surface of the air guide block 357 or is designed as an integral structure with the air guide block 357 . The cover plate 353 is fixedly installed on the connecting block 3554 and is driven by the lifting drive module 355 to move up and down relative to the support clamp plate 354 .

[0082] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A tunnel-type high-speed in-situ eutectic soldering station, characterized in that: It includes a first support plate that performs horizontal movement, a second support plate that is movably arranged on the first support plate up and down, a eutectic temperature control plate group arranged on the second support plate, a support module that is horizontally slidably arranged on the first support plate and clamps the substrate to move horizontally above the eutectic temperature control plate group, a first driving module that is arranged on the first support plate and drives the second support plate to move up and down, and a second driving module that drives the support module to move horizontally; the eutectic temperature control plate group includes a preheating plate, a eutectic table and a cooling plate that are arranged in sequence along the movement direction of the substrate.

2. The tunnel-type high-speed in-situ eutectic soldering station according to claim 1, characterized in that: The upper surfaces of the preheating plate, the eutectic table and the cooling plate are flush and together form a supporting plane for supporting the substrate; the upper surface of the eutectic table is provided with a plurality of adsorption holes for adsorbing the chip mounting area of ​​the substrate.

3. The tunnel-type high-speed in-situ eutectic soldering station as claimed in claim 1, characterized in that: The second driving module drives the supporting module to clamp the substrate and switch positions in sequence between the loading and unloading position, the preheating position, the chip mounting position, the cooling position and the loading and unloading position. The preheating plate is set corresponding to the preheating position, the eutectic table is set corresponding to the chip mounting position, and the cooling plate is set corresponding to the cooling position.

4. The tunnel-type high-speed in-situ eutectic soldering station as claimed in claim 3, characterized in that: The support module includes a support base plate, a pair of support vertical plates relatively arranged on the support base plate, a pair of support clamping plates located on the inner side of the pair of support vertical plates and supporting the substrate, a cover plate located above the support clamping plates and cooperating with the support clamping plates to clamp the substrate, and a lifting drive module arranged on the support vertical plates and driving the support clamping plates or the cover plates to move up and down; a tunnel space for the substrate to enter and exit is formed between the support clamping plates and the cover plates, and the cover plate is provided with avoidance hollow grooves that expose all chip pasting areas on the substrate.

5. The tunnel-type high-speed in-situ eutectic soldering station as claimed in claim 4, characterized in that: A docking plate docking with the tunnel space is provided at the material inlet and outlet positions.

6. The tunnel-type high-speed in-situ eutectic soldering station as claimed in claim 4, characterized in that: The lifting drive module includes two independent sub-modules, which respectively drive the two supporting splints to move up and down; the sub-module includes a mounting seat fixed on the top of the supporting vertical plate, a plurality of first air cavities are arranged in the mounting seat, a piston rod is arranged in the first air cavity to move up and down, the bottom end of the piston rod extends into the first air cavity and the top end extends out of the first air cavity, and a connecting block is fixedly arranged on the top of the piston rod; the connecting block is fixedly connected to the supporting splint or the cover plate; when the connecting block is fixedly connected to the supporting splint, the cover plate is fixedly arranged above the mounting seat, and when the connecting block is fixedly connected to the cover plate, the supporting splint is fixedly arranged in the inner space of the mounting seat.

7. The tunnel-type high-speed in-situ eutectic soldering station as claimed in claim 6, characterized in that: An inert gas blowing module is arranged on the support module; the inert gas blowing module comprises an air guide strip arranged on the top of the mounting seat, the air guide strip is provided with a second air cavity capable of blowing air toward the space below the substrate and a plurality of third air cavities for blowing air toward the space above the substrate; a plurality of blowing holes corresponding to the opening area of ​​the third air cavity are provided on the cover plate, and a hollow groove for blowing the gas in the second air cavity into the space below the substrate is provided on the support splint; a first air path connected to the first air cavity and a second air path connected to the second air cavity and / or the third air cavity are provided in the support vertical plate, a first air nozzle is provided at the end of the first air path, and a second air nozzle is provided at the end of the second air path, and the first air nozzle and the second air nozzle are connected to an external air source.

8. The tunnel-type high-speed in-situ eutectic soldering station as claimed in claim 1, characterized in that: A pair of support seats are arranged on the first support plate; the first driving module includes a rotating shaft with two ends rotatably arranged on the support seats and located below the second support plate, a first motor fixed on the first support plate and driving the rotating shaft to rotate, and a cam fixed on the rotating shaft; a connecting plate is arranged on the lower surface of the second support plate, a roller is arranged on the connecting plate which cooperates with the cam and moves downward under the drive of the cam, and an avoidance groove is arranged on the connecting plate for the rotating shaft to pass through and perform up and down floating motion.

9. The tunnel-type high-speed in-situ eutectic soldering station as claimed in claim 4, characterized in that: An escape space is formed between the pair of supporting upright plates, and the second supporting plate and the eutectic temperature control plate group both pass through the escape space.

10. A tunnel-type high-speed in-situ eutectic bonding equipment, characterized in that: The invention comprises a chip feeding station, a chip calibration station and a chip eutectic welding station arranged side by side, a first camera arranged above the chip feeding station, a chip angle calibration mechanism arranged at the chip calibration station, a eutectic welding station arranged at the chip eutectic welding station and as claimed in claim 1, a chip loading and transporting mechanism for sucking chips at the chip feeding station and transferring them to the chip angle calibration mechanism, a second camera arranged above the chip calibration station, a chip mounting mechanism for sucking the chips after angle calibration on the chip angle calibration mechanism and transferring them to the eutectic welding station for mounting, a third camera located above the chip eutectic welding station, a fourth camera located below the transfer path of the chip mounting mechanism and between the chip calibration station and the eutectic welding station, and a protective cover covering the eutectic welding station.

11. The tunnel-type high-speed in-situ eutectic bonding equipment according to claim 10, characterized in that: It also includes a frame, and the first camera, the second camera, the third camera and the fourth camera are all fixedly arranged on the frame.

12. A chip bonding method based on the tunnel-type high-speed in-situ eutectic soldering station according to claim 4, comprising the following steps: S1, at the material inlet and outlet position, the substrate is loaded into the tunnel space, the support clamp and the cover plate are switched from an open state to a clamping state, and the two side edges of the substrate are clamped up and down; S2, the support module moves the substrate to the preheating position, aligns the first chip mounting area of ​​the substrate with the preheating plate, and the preheating plate rises to fit the lower surface of the first chip mounting area for preheating. After the preheating is completed, the preheating plate descends; S3, the support module moves with the substrate to the chip mounting position, aligns the first chip mounting area with the eutectic table, and the eutectic table rises to fit the lower surface of the first chip mounting area for heating, and at the same time, completes the mounting of all chips in the first chip mounting area. After the mounting is completed, the eutectic table descends; during this process, the next chip mounting area on the substrate moves to the preheating position, and preheating is completed according to step S2; S4, the support module moves with the substrate to the cooling position, aligns the first chip mounting area with the cooling plate, and the cooling plate rises to fit the lower surface of the first chip mounting area for cooling. After the cooling is completed, the cooling plate descends; during this process, the next chip mounting area on the substrate moves to the chip mounting position, and the chip mounting is completed according to step S3; S5, the support module moves the substrate toward the feeding and discharging position by a set step distance until all chip pasting areas on the substrate complete substrate preheating, chip eutectic pasting, and substrate cooling operations in sequence; S6. The support module moves with the substrate to the loading and unloading position, and the substrate is unloaded.

Images