Closed transport equipment for semiconductor substrates

Abstract

The present invention discloses a closed transport device for semiconductor carriers, which relates to the technical field of semiconductor transport devices, wherein the closed transport device for semiconductor carriers comprises: a box body having a cavity, wherein the cavity is used to place the carrier; a box door connected to the box body and capable of covering at least a portion of the box body so that the cavity is sealed, and the carrier can enter and exit the cavity by opening the box door; and a driving member for driving the box body to move along a preset track. The technical solution provided by the present invention can solve the problem that the existing semiconductor carrier transport device has a poor dustproof effect.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor transportation technology, and in particular to a closed transportation device for a semiconductor carrier. Background Art

[0002] Semiconductor substrate transport equipment can transfer semiconductor substrates from the previous processing position to the next processing position; the existing semiconductor substrate transport equipment mostly uses open-type insert frames for transportation during the transportation process. This method of transportation has the problem of poor dust prevention effect, which is not effective for semiconductor substrates with high dust prevention requirements such as FC-BGA. For FC-BGA semiconductor substrates, dust and other particulate contaminants may cause product defects and affect the performance and reliability of the final product. Summary of the invention

[0003] The main purpose of the present invention is to provide a closed transport device for semiconductor carriers, aiming to solve the problem that the existing semiconductor carrier transport device has a poor dustproof effect.

[0004] To achieve the above-mentioned purpose, the closed type transport device for semiconductor carriers proposed by the present invention comprises:

[0005] The box body has a cavity, and the cavity is used for placing the carrier board;

[0006] A box door is connected to the box body and can cover at least a portion of the box body so that the cavity is in a sealed state. By opening the box door, the carrier board can enter and exit the cavity;

[0007] The driving member is used to drive the box to move along a preset track.

[0008] In one embodiment, the cavity is a prismatic structure, and the closed transport device for the semiconductor carrier further comprises a storage rack, which is arranged in the cavity and is used for placing the carrier, and the storage rack has a plurality of storage layers, and the plurality of storage layers are stacked;

[0009] The storage layer is arranged horizontally, and the box door can be moved from bottom to top and opened, or moved from top to bottom and closed.

[0010] In one embodiment, a guide assembly is provided between the box door and the box body, and the guide assembly enables the box door to have a tendency to move closer to the area where the box body moves or away from the box body when the box door is about to be closed or just opened.

[0011] In one embodiment, the box body has an opening of a rectangular structure, the carrier enters the cavity through the opening, a first notch is provided at the top of the opening, the box door has a rim of a rectangular ring structure, the rim can cover at least a portion of the box body, and a second notch is provided at the bottom of the rim;

[0012] The guide assembly includes a first guide member arranged on the two side walls and the bottom wall of the box body close to the opening, and a second guide member arranged on the box door. The second guide member is arranged in a one-to-one correspondence with the first guide member. During the process of punching or closing the box door, the second guide member can slide along the first guide member to move the box door closer to the box body or away from the box body.

[0013] In one embodiment, the storage rack includes storage boards arranged on two opposite side walls of the cavity, and a plurality of storage slots are stacked on both storage boards, and the storage slots on the two storage boards are arranged in a one-to-one correspondence;

[0014] A plurality of receiving members are also arranged in the cavity. The plurality of receiving members are located between the two storage plates and are stacked. The receiving members are arranged in a one-to-one correspondence with the storage slots.

[0015] In one embodiment, the driving member is configured as an AGV trolley, and the AGV trolley can receive the box and drive the box to move along a preset track.

[0016] In one embodiment, the box body is provided with an air intake component, an exhaust component, a power supply and a control component, the air intake component includes a filter module, the exhaust component includes a detection module, the filter module is used to filter the gas entering the box body, the detection module is used to detect the gas discharged from the box body, and the control component is used to control the opening and closing of the air intake component and the exhaust component.

[0017] In one embodiment, the closed transport device for the semiconductor carrier further comprises a pressure detection module, and the pressure detection module is used to detect the air pressure in the cavity in a closed state, so that the air pressure in the cavity in the closed state is maintained within a preset pressure range.

[0018] In one embodiment, the control component further includes a marking module and a switch module, and the switch module is used to control the start and stop of the power supply;

[0019] The AGV vehicle includes an identification module, which can identify the marking module and send instructions to the switch module. The switch module receives the instructions and starts the power supply.

[0020] In one embodiment, the marking module is configured as an RFID tag, and the identification module is configured as an RFID reader / writer.

[0021] The technical solution of the present invention is to use a driving member to transport the box, and the box door covers at least a part of the box setting. By covering at least a part of the box setting with the box door, on the one hand, the cavity can be in a closed state, and on the other hand, the sealing of the cavity can be improved. At this time, it is difficult for external gas, dust and floating objects to enter the cavity during the movement of the box, thereby reducing the influence of dust and floating objects on the carrier, thereby solving the technical problems existing in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 A schematic structural diagram of an embodiment of a closed type transport device for semiconductor carriers provided by the present invention;

[0024] Figure 2 for Figure 1 A schematic diagram of the structure of the cavity and the rack in the closed transport device for semiconductor substrates;

[0025] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0026] Figure 4 for Figure 1 A schematic diagram of the structure of a box door in a closed transport device for semiconductor substrates;

[0027] Figure 5 for Figure 1 A schematic diagram of the internal structure of a box when the box door of a closed transport device for semiconductor substrates closes the box;

[0028] Figure 6 for Figure 5 A partial enlarged view of point B in the middle;

[0029] Figure 7 for Figure 5 A partial enlarged view of point C in the middle;

[0030] Figure 8 A schematic structural diagram of another embodiment of the closed transport device for semiconductor carriers provided by the present invention;

[0031] Fig. 9 A schematic structural diagram of an embodiment of an air intake assembly in a closed transport device for semiconductor carriers provided by the present invention;

[0032] Fig.10 A schematic structural diagram of an embodiment of an exhaust assembly in a closed transport device for a semiconductor carrier provided by the present invention.

[0033] Description of Figure Numbers:

[0034] 100, box body; 110, cavity; 120, opening; 130, first notch;

[0035] 200, box door; 210, edging; 220, second notch; 230, main frame; 240, back panel;

[0036] 300, driving part; 310, AGV trolley; 311, receiving end;

[0037] 400, storage rack; 410, storage board; 411, storage slot;

[0038] 500, guide assembly; 510, first guide member; 511, first inclined surface; 520, second guide member; 521, second inclined surface;

[0039] 600, receiving parts;

[0040] 700, air intake assembly; 710, filter module; 720, air intake fan; 730, air intake pipe; 740, first valve body;

[0041] 800, exhaust assembly; 810, detection module; 820, second valve body; 830, exhaust pipe;

[0042] 900. Control components.

[0043] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] Semiconductor carrier transport equipment can transfer semiconductor carriers from the previous processing position to the next processing position; the existing semiconductor carrier transport equipment mostly uses open-type insert frames for transportation during the transportation process. This method of transportation has the problem of poor dust prevention effect. It is not effective for semiconductor carriers with high dust prevention requirements such as FC-BGA. For FC-BGA semiconductor carriers, dust and other particulate contaminants may cause product defects and affect the performance and reliability of the final product. It should be noted that the above-mentioned semiconductor carrier is referred to as a carrier in the following description.

[0048] The present invention provides a closed transport device for semiconductor carriers, which is used in a workshop with a certain dustproof level, and the workshop can be understood as a dust-free workshop.

[0049] See also Figure 1 , Figure 5In one embodiment of the present invention, the closed transport device for semiconductor carriers comprises: a box 100, a box door 200 and a driving member 300; wherein the box 100 has a cavity 110, wherein the cavity 110 is the interior of the box 100, and the cavity 110 is used to place the carrier; the box door 200 is connected to the box 100 and can cover at least part of the box 100, so that the cavity 110 is in a sealed state, wherein when the box door 200 is closed, the box 100 is 0 can be in a sealed state, and further, the box door 200 covers at least a portion of the box body 100, that is, the box door 200 and the box body 100 are partially overlapped, which can increase the path of the gas when entering and exiting the cavity 110 through the connection between the box door 200 and the box body 100, thereby increasing the difficulty of the gas entering and exiting the cavity 110 through the connection. Further, by opening the box door 200, the carrier can enter and exit the cavity 110.

[0050] Furthermore, the driving member 300 is used to drive the box 100 to move along a preset trajectory, wherein the driving member 300 is used to transfer the box 100, transferring the box 100 from the previous process to the next process. Specifically, the driving member 300 can transfer the box 100 from the waiting position to the loading position. After arriving at the loading position, the box door 200 is opened to place the carrier in the cavity 110. After the carrier is placed, the driving member 300 continues to drive the box 100 to move and transfer it from the loading position to the processing position. After arriving at the processing position, the box door 200 is opened. At this time, the material picking device (material picking robot) at the processing position can take out the carrier in the cavity 110. After the carrier in the cavity 110 is taken out, the driving member 300 drives the box 100 to transfer the cavity 110 from the processing position to the loading position or the waiting position.

[0051] When the driving member 300 transports the box body 100, the box door 200 covers at least a portion of the box body 100. By covering at least a portion of the box body 100 with the box door 200, on the one hand, the cavity 110 can be in a closed state, and on the other hand, the sealing of the cavity 110 can be improved. At this time, when the box body 100 is moving, it is difficult for external gas, dust and floating objects to enter the cavity 110, thereby reducing the influence of dust and floating objects on the carrier, thereby solving the technical problems existing in the prior art.

[0052] Furthermore, in this embodiment, by adopting a closed cavity 110 to transport the carrier, the transportation equipment of the present application can be used in a workshop with a lower dustproof level requirement, thereby reducing the construction cost of the dust-free workshop compared to building a workshop with a high dustproof level requirement.

[0053] In one embodiment, the cavity 110 is a prism structure. Furthermore, in this embodiment, the cavity 110 is a quadrangular prism structure. However, the present design is not limited thereto. In some embodiments, the shape of the cavity 110 can be set according to the shape of the carrier. For example, when the carrier is a pentagonal structure, the cavity 110 can be a pentagonal prism structure. Furthermore, the closed transport equipment for the semiconductor carrier also includes a rack 400, which is arranged in the cavity 110 for placing the carrier, and the rack 400 has a plurality of storage layers, and the plurality of storage layers are stacked. Further, the storage layers are arranged horizontally, and the box door 200 can be moved from bottom to top and opened, or moved from top to bottom and closed. The box door 200 is arranged in this way mainly considering that the horizontal space in many workshops is limited, but the vertical space is usually not well utilized. The box door 200 opens up and down to reduce the horizontal space occupation of the workshop, so that the equipment can be used in a workshop with a smaller horizontal space. In some embodiments, the box door 200 is opened up and down, and sealing strips (not shown) can be arranged around the box door 200 to ensure good sealing performance. Further, in combination with the above-mentioned box door 200 at least covering a portion of the box 100, the sealing effect of the cavity 110 can be better improved. At the same time, the box door 200 opens up and down, which can also reduce the risk of collision between people and objects when passing through the box 100.

[0054] In one embodiment, reference Figures 3 to 7 A guide assembly 500 is provided between the door 200 and the box body 100. The guide assembly 500 enables the door 200 to have a tendency to move closer to the moving area of ​​the box body 100 or away from the box body 100 when the door 200 is about to be closed or just opened. It can be understood that when the door 200 moves up and down for most of the time, there is a certain distance between the door 200 and the box body 100. Under the effect of this distance, the friction between the door 200 and the box body 100 can be reduced, thereby reducing the vibration between the box body 100 and the door 200. At the same time, when a sealing strip is provided on the door 200 or the box body 100, the friction of the sealing strip can be reduced under the effect of this gap, the loss of the sealing strip can be reduced, the service life of the sealing strip can be increased, and the sealing effect of the cavity 110 can be improved.

[0055] In one embodiment, reference Figure 4The box body 100 has an opening 120 of a rectangular structure, the carrier enters the cavity 110 through the opening 120, a first notch 130 is provided at the top of the opening 120, the box door 200 has a rectangular ring-shaped edge 210, the edge 210 can cover at least part of the box body 100, and a second notch 220 is provided at the bottom of the edge 210. It should be emphasized that when the edge 210 covers at least part of the box body 100, it is necessary to completely cover the first notch 130 so that the first notch 130 is not exposed. Specifically, the box door 200 also includes a main frame 230 and a back plate 240, wherein the edging 210 is connected to the main frame 230 or the back plate 240. When the edging 210 is connected to the main frame 230, the edging 210 is fixed on the main frame 230. When the edging 210 is connected to the back plate 240, the edging 210 is fixed on the back plate 240. Specifically, when the box door 200 makes the cavity 110 in a sealed state, the main frame 230 of the box door 200 can be against the opening 120 of the box body 100, and the edging 210 can cover at least part of the box body 100.

[0056] Further, refer to Figure 5 , Figure 6 , Figure 7 The guide assembly 500 includes a first guide member 510 disposed on the two side walls and the bottom wall of the box body 100 near the opening 120 and a second guide member 520 disposed on the box door 200. It can be understood that the first guide members 510 are configured in three pieces, and the three first guide members 510 are respectively disposed on the two inner side walls and the bottom wall of the box body 100 and are disposed near the opening 120. At the same time, the second guide members 520 are also configured in three pieces, and the second guide members 520 are disposed one by one with the first guide members 510. When the box door 200 is punched or closed, In the process of closing, the second guide member 520 can slide along the first guide member 510, so that the box door 200 moves closer to the box body 100 or moves away from the box body 100. Specifically, the first guide member 510 has a first inclined surface 511, and the second guide member 520 has a second inclined surface 521. When the box door 200 is about to close or just opened, the second inclined surface 521 can move relative to the first inclined surface 511, so that the second guide member 520 can slide along the first guide member 510, so that the box door 200 moves closer to or away from the box body 100. Further, in the process of opening the box door 200, the second guide member 520 provided on the box door 200 can move upward from the first notch 130. In this way, when the box door 200 moves in the up and down direction, the distance between the box door 200 and the box body 100 is small, which can further reduce the possibility of dust and floating objects entering the cavity 110.

[0057] In one embodiment, reference Figure 2 , Figure 4 The storage rack 400 includes a storage plate 410 disposed on two opposite side walls of the cavity 110, and a plurality of storage slots 411 are stacked on the two storage plates 410, wherein a certain gap is provided between the two storage slots 411, and the storage slots 411 on the two storage plates 410 are arranged one by one, and the storage slots 411 arranged in pairs form a storage layer; further, a plurality of receiving members 600 are further arranged in the cavity 110, and the plurality of receiving members 600 The receiving member 600 is located between the two storage plates 410 and is stacked. Specifically, the receiving member 600 is arranged in the middle position between the two storage plates 410. The receiving member 600 is arranged in a one-to-one correspondence with the storage slots 411, wherein the receiving member 600 is fixed in the box body 100, and the receiving member 600 is configured as a round tube. It should be noted that when the carrier plate is placed in the two storage slots 411 on the rack 400, the middle position of the carrier plate contacts the receiving member 600.

[0058] In one embodiment, reference Figure 1 , the driving member 300 is configured as an AGV trolley 310, and the AGV trolley 310 can undertake the box 100 and drive the box 100 to move along a preset track. Specifically, the box 100 is placed on the AGV trolley 310, and the AGV trolley 310 moves along a preset route track to transfer the box 100 from the previous process to the next process. In some embodiments, the AGV trolley 310 can be set to multiple units, and multiple route tracks are laid out in the workshop. Since the box door 200 is opened in the up and down direction, when the AGV trolley 310 drives the box 100 to move, there is no need to worry about the problem that other box doors 200 will occupy horizontal space when they are opened. In this way, when laying out multiple route tracks for the AGV trolley 310 to move, the distance between the two route tracks can be relatively close, which enables the workshop with limited horizontal space to obtain the maximum space utilization. It can be understood that setting more boxes 100 and AGV trolleys 310 can improve the transportation capacity. However, the present design is not limited thereto, and in other embodiments, the driving member 300 can also be configured as a suspension robot arm and a suspension rail, wherein the suspension robot arm can move along the suspension rail, the suspension rail is arranged along a preset track, and the suspension robot arm grabs the box 100 for movement.

[0059] In one embodiment, the box 100 is provided with an air intake assembly 700, an exhaust assembly 800, a power source (not shown) and a control assembly 900 (see FIG. Figure 8), the air intake component 700 includes a filter module 710, and the exhaust component 800 includes a detection module 810. The filter module 710 is used to filter the gas entering the box 100, and the detection module 810 is used to detect the gas discharged from the box 100. The control component 900 is used to control the opening and closing of the air intake component 700 and the exhaust component 800. Further, in this embodiment, when the door 200 is closed and the cavity 110 is in a sealed state, the air intake component 700 and the exhaust component 800 can be opened at the same time. At this time, the gas entering the box 100 through the air intake component 700 will be filtered by the filter module 710, and the gas discharged through the exhaust component 800 can be detected by the detection module 810. The detection module 810 detects the gas in the box 100. When the dust and floating objects in the gas in the box 100 are within a certain required range, the air intake component 700 stops intake, and the exhaust component 800 also stops exhausting. Further, in some embodiments, the air intake assembly 700 may be disposed on the top of the housing 100 , and the air exhaust assembly 800 may be disposed on both sides of the housing 100 .

[0060] Further, in one embodiment, referring to Fig. 9 The air intake assembly 700 also includes an air intake fan 720, an air intake pipe 730, and a first valve body 740 installed on the air intake pipe 730, wherein the first valve body 740 is opened during air intake, and the air intake fan 720 delivers the gas in the workshop into the cavity 110 through the air intake pipe 730, wherein the filter module 710 is arranged upstream and / or downstream of the air intake fan 720. Further, the filter module 710 can adopt a pre-filter, a high-efficiency particulate air filter, an ultra-high-efficiency particulate air filter, etc. When the filter modules 710 are installed upstream and downstream of the air intake fan 720, a pre-filter is arranged upstream of the air intake fan 720, and a high-efficiency particulate air filter is arranged downstream.

[0061] Further, in one embodiment, referring to Fig.10 The exhaust component 800 includes an exhaust pipe 830 and a second valve body 820 installed in the exhaust pipe 830. The second valve body 820 opens during exhaust. The detection module 810 can select a particle counter, wherein the particle counter is installed in the exhaust pipe 830. The particle counter detects the number of particles in the flowing gas during the exhaust process. When the number of particles is within a certain required range, the intake component 700 stops intake and the first valve body 740 and the second valve body 820 are closed.

[0062] Furthermore, in one embodiment, the first valve body 740 and the second valve body 820 are configured as electrically controlled valve bodies and are both connected to a control component 900, wherein the control component 900 has a control module (PLC: programmable logic controller), a data storage module, an input module, an output module, a communication module, etc. It should be noted that the air intake fan 720 in the air intake component 700 is electrically connected to the control component 900, and the particle counter is electrically connected to the control component 900. Before the carrier plate is loaded into the box body 100, the first valve body 740, the second valve body 820, the air intake fan 720 and the particle counter can be opened through the control component 900, and the environment in the cavity 110 can be checked and continuously monitored through the particle counter. The continuously monitored value can be fed back to the control component 900, and the control component 900 compares the fed-back value with a preset value range. When the value fed back by the particle counter falls into the preset value range, the control component 900 first closes the first valve body 740, the second valve body 820 and the particle counter, and then closes the air intake fan 720.

[0063] In one embodiment, the closed transportation equipment for the semiconductor carrier further includes a pressure detection module (not shown), which is used to detect the air pressure in the cavity 110 in a closed state, so that the air pressure in the cavity 110 in the closed state is maintained within a preset pressure range, wherein the cavity 110 in a closed state refers to the state in which the box door 200 and the box body 100 are closed, and the preset air pressure can be a micro-positive pressure, which can prevent external gas from entering the cavity 110. The range of the micro-positive pressure can be selected from 0.01 Pascal to 0.1 Pascal, or 0.1 Pascal to 1 Pascal. Further, in this embodiment, the pressure detection module can be configured as a differential pressure sensor. When using a differential pressure sensor, one port is required to be connected to the cavity 110, and the other port is connected to the air pressure in the workshop. When the workshop has a certain air pressure, the micro-positive pressure range in this embodiment is selected from 0.01 Pascal to 0.1 Pascal, wherein the micro-positive pressure is compared relative to the air pressure in the workshop. Furthermore, the pressure difference sensor is electrically connected to the control assembly 900, and when the other parts in the cavity 110 are not within the range of micro-positive pressure, the air intake assembly 700 replenishes a certain amount of gas into the cavity 110. Furthermore, in one embodiment, a trigger switch (not shown) is provided between the box body 100 and the door 200. When the box body 100 and the door 200 are closed, the trigger switch is closed, and the power supply supplies power to the pressure difference sensor. When the door 200 is opened, the trigger switch is disconnected, and the pressure difference sensor is powered off.

[0064] In one embodiment, the control component 900 also includes a marking module (not shown) and a switch module (not shown), and the switch module is used to control the start and stop of the power supply. Furthermore, the switch module in this embodiment is a switch of the power supply. When the switch module is closed, the power supply can be started, and when the switch module is disconnected, the power supply can be turned off. The AGV cart 310 includes an identification module, and the identification module can identify the marking module and send instructions to the switch module. Furthermore, when the switch module receives the instruction, the switch module can be closed to start the power supply. In this way, in this embodiment, when the box 100 leaves the AGV cart 310, the switch module in the box 100 can be disconnected, thereby cutting off the power supply. After the power is cut off, the air intake component 700, the pressure detection module, the solenoid valve body, etc. are all powered off and do not work. Further, in the present embodiment, the marking module is configured as an RFID tag, and the identification module is configured as an RFID reader / writer, wherein the RFID selects a low-frequency identification range, wherein the identification range is about 10 centimeters. Further, the RFID tag is set at the bottom of the box 100, and the RFID reader / writer is set at the receiving end 311 of the AGV cart 310 or near the receiving end 311, wherein the receiving end 311 is used to receive the box 100. When the RFID radio frequency identification range is large, the position of the RFID reader / writer can be adjusted so that the box 100 and the receiving end 311 of the AGV cart 310 have a preset distance. The RFID reader / writer identifies the RFID tag, such as the one described above. The RFID selects a low-frequency identification range, wherein the identification range is 10 centimeters. At this time, if the user needs the box 100 to be close to or away from the receiving end 311 by five centimeters, the RFID reader / writer can identify the RFID tag or disconnect the identification. At this time, the RFID reader / writer only needs to be set five centimeters away from the receiving end 311. Further, in this embodiment, the AGV trolley 310 is provided with a wireless communication module and a control system (PLC), the switch module is configured as an electric control switch, and the control assembly 900 is also provided with a wireless communication module to cooperate with the wireless communication module in the AGV trolley 310. When the box 100 is close to the preset distance of the AGV trolley 310, the RFID reader in the AGV trolley 310 can identify the RFID tag at the bottom of the box 100. At this time, the wireless communication module sends a command to the control module (PLC) in the control assembly 900 according to the identification signal. At this time, the control module in the control assembly 900 closes the electric control switch, and the power supply can supply power to the air intake assembly 700, the pressure detection module, the solenoid valve body, etc. When the box 100 leaves the preset distance of the AGV trolley 310, the RFID reader cannot identify the RFID tag at the bottom of the box 100. At this time, the wireless communication module sends a command to the control module in the control assembly 900, and the control module in the control assembly 900 disconnects the electric control switch. The wireless communication module can be Bluetooth, wifi, etc.Further, in this embodiment, one AGV trolley 310 is equipped with one box 100. In some embodiments, one AGV trolley 310 can be equipped with multiple boxes 100. At this time, the information in the RFID tag in each box 100 is different. At this time, when the RFID reader in the AGV trolley 310 recognizes the corresponding RFID tag, the wireless communication module in the AGV trolley 310 can establish a connection with the control module in the corresponding box 100 according to the RFID tag information, and then send instructions.

[0065] In one implementation scenario, the box 100 can be set in the waiting position. At this time, the AGV trolley 310 goes to the waiting position to receive the box 100. At this time, the box door 200 seals the box 100, so that the cavity 110 is in a closed state. After the AGV trolley 310 receives the box 100, the power supply on the box 100 is powered. At this time, the air intake component 700, the detection module 810, the pressure detection module, the solenoid valve body and other equipment work to filter and purify the gas inside the box 100, and at the same time keep the gas in the cavity 110 in a slightly positive pressure state. At this time, the AGV trolley 310 drives the box 100 from the waiting position When moving to the loading position, the box 100 can reduce the amount of dust and other particles entering the box 100 during the movement. When the box 100 enters the loading position, in order to load smoothly, the box 100 will leave the receiving end 311 of the AGV trolley 310 by a preset distance under the action of the clamping device or other equipment. At this time, the connection between the AGV trolley 310 and the box 100 is disconnected, that is, the RFID reader cannot recognize the RFID tag. At this time, the carrier is loaded into the box 100. In this way, before the carrier is loaded into the box 100, the internal environment of the box 100 can be better, thereby improving the dustproof effect. After the carrier is loaded into the box 100, the box 100 is located at the receiving end 311 of the AGV trolley 310. At this time, the AGV trolley 310 transfers the box 100 from the loading position to the processing position. During the transfer process, the inside of the box 100 still maintains a slightly positive pressure state.

[0066] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A closed transport device for semiconductor carriers, characterized in that: include: The box body has a cavity, and the cavity is used for placing the carrier board; A box door is connected to the box body and can cover at least a portion of the box body so that the cavity is in a sealed state. By opening the box door, the carrier board can enter and exit the cavity; A driving member, used for driving the box to move along a preset track; The cavity is a prismatic structure, and the closed transport device for the semiconductor carrier further comprises a storage rack, which is arranged in the cavity and used for placing the carrier, and the storage rack has a plurality of storage layers, and the plurality of storage layers are stacked; The storage layer is arranged horizontally, and the box door can be moved from bottom to top and opened, or moved from top to bottom and closed; A guide assembly is provided between the box door and the box body, and the guide assembly enables the box door to have a tendency to move closer to the moving area of ​​the box body or away from the box body when the box door is about to be closed or just opened; The box body has an opening of a rectangular structure, the carrier plate enters the cavity through the opening, a first notch is arranged at the top of the opening, the box door has a rim of a rectangular ring structure, the rim can cover at least a part of the box body, and a second notch is arranged at the bottom of the rim; The guide assembly includes a first guide member arranged on the two side walls and the bottom wall of the box body close to the opening, and a second guide member arranged on the box door. The second guide member is arranged in a one-to-one correspondence with the first guide member. During the process of punching or closing the box door, the second guide member can slide along the first guide member to move the box door closer to the box body or away from the box body.

2. The closed transport device for semiconductor carriers according to claim 1, characterized in that: The storage rack includes storage plates arranged on two opposite side walls of the cavity, and a plurality of storage slots are stacked on the two storage plates, and the storage slots on the two storage plates are arranged one by one; A plurality of receiving members are also arranged in the cavity. The plurality of receiving members are located between the two storage plates and are stacked. The receiving members are arranged in a one-to-one correspondence with the storage slots.

3. The closed transport device for semiconductor carriers according to claim 1 or 2, characterized in that: The driving member is configured as an AGV trolley, and the AGV trolley can receive the box and drive the box to move along a preset track.

4. The closed transport device for semiconductor carriers according to claim 3, characterized in that: The box body is provided with an air intake component, an exhaust component, a power supply and a control component. The air intake component includes a filter module, and the exhaust component includes a detection module. The filter module is used to filter the gas entering the box body, and the detection module is used to detect the gas exhausted from the box body. The control component is used to control the opening and closing of the air intake component and the exhaust component.

5. The closed transport device for semiconductor carriers according to claim 4, characterized in that: The closed transport device for the semiconductor carrier further comprises a pressure detection module, which is used to detect the air pressure in the cavity in a closed state, so that the air pressure in the cavity in the closed state is maintained within a preset pressure range.

6. The closed transport device for semiconductor carriers according to claim 5, characterized in that: The control component also includes a marking module and a switch module, and the switch module is used to control the start and stop of the power supply; The AGV vehicle includes an identification module, which can identify the marking module and send instructions to the switch module. The switch module receives the instructions and starts the power supply.

7. The closed transport device for semiconductor carriers according to claim 6, characterized in that: The marking module is configured as an RFID tag, and the identification module is configured as an RFID reader / writer.

Images