A flip alignment device for flip chip bonding

Abstract

The present invention discloses a flipping alignment device for flip chip bonding, and the present invention relates to the field of chip bonding technology. The flipping alignment device for flip chip bonding comprises a chip mounter body, a loading unit installed in the chip mounter body for conveying a substrate, and a chip mounter unit installed in the chip mounter body for mounting chips. The chip mounter body is provided with a flipping assembly for flipping the chip body and an alignment assembly for adjusting the position of the chip body. The flipping assembly comprises: a flipping motor, which is fixed in the chip mounter body through a motor box and is used to drive the flipping assembly to operate. By flipping the chip body and then attaching it to the substrate for packaging, the package can be made thinner and lighter, which is conducive to the design of miniaturized electronic equipment. At the same time, the chip body is aligned and then flipped, which can ensure that the solder bumps on the chip are accurately aligned with the pads on the substrate, and the subsequent welding process (such as reflow soldering) will be easier to control.

Description

Technical Field

[0001] The invention relates to the technical field of chip bonding, in particular to a flipping alignment device for flip chip bonding. Background Art

[0002] At present, chip packaging usually uses chip bonding, wire bonding and flip-chip connection technology. When using flip-chip connection technology, it is inevitable to fit the bump metallized chip to the substrate, which requires flipping the bump metallized chip. In order to ensure that the position of the chip does not change before and after flipping, the chip needs to be aligned. At present, when aligning the chip, it mostly occurs in the process of the chip placement unit sucking and putting down the chip. However, the alignment of the chip before flipping is mostly adjusted by the flip component chuck, and after flipping, it is aligned and sucked by the suction component. In the case of continuous operation, cumulative errors are prone to occur.

[0003] For example, the chip flipping mechanism of a semiconductor flip-chip disclosed in the announcement number CN221149976U can improve the suction degree of the chip during the flipping process by evenly opening suction holes on the folding plate. However, when flipping to the suction position, the flipping component will pause, causing the chip to shake and misalign, and it cannot be guaranteed that the position of the chip during suction and after flipping is still in the original set position. In addition, the position of the chip body will change due to fluctuations during the mechanical pause process during the process of conveying the chip to the flipping position. The chip alignment and mounting device and method disclosed in CN108962791B can shorten the intervals between various production steps. However, in the process of chip flipping, the position of the chip body is only aligned by the process of sucking and putting down the chip. In the case of continuous operation, cumulative errors are likely to occur, resulting in an increase in the time required for adjustment in the subsequent process, which will reduce the production speed.

[0004] Therefore, a flip alignment device for flip chip bonding is proposed. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a flipping alignment device for flip chip bonding, which solves the problem that most of the chips occur in the process of the placement machine unit sucking and placing the chip, but the alignment of the chip before flipping is mostly adjusted by the flip component chuck, and the alignment and suction after flipping are carried out by the suction component, which is prone to cumulative errors in the case of continuous operation.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a flipping and alignment device for flip chip bonding, comprising a chip mounter body, a loading unit installed in the chip mounter body for conveying substrates, and a chip mounter unit installed in the chip mounter body for mounting chips, wherein a flipping assembly for flipping the chip body and an alignment assembly for adjusting the position of the chip body are arranged inside the chip mounter body, and the flipping assembly includes:

[0007] A flip motor is fixed in the body of the SMT machine through a motor box to drive the flip assembly to operate, a rotating shaft is fixed on the output end of the flip motor, a flip frame is fixed on the rotating shaft, and a chuck is fixed on the flip frame;

[0008] An air pump is fixed in the body of the placement machine through a mounting plate and is used to deliver gas to the chuck. An output end of the air pump is connected to an air delivery pipe, one end of the air delivery pipe is connected to the chuck, and a gasket is fixed to the chuck;

[0009] The alignment component includes an upward-looking camera fixed on the chip mounter body and a downward-looking camera fixed on the chip mounter group.

[0010] By flipping the chip body over and then attaching it to the substrate for packaging, there is no need to rely on gold wire bonding to connect to the substrate, and no wire bonding is required, thus saving the required space.

[0011] Preferably, the alignment assembly also includes a fixed frame fixed on the placement machine body, a support rod slidably inserted into the fixed frame, a movable shaft is hingedly installed on the support rod, a sliding plate is fixed on the movable shaft, a rear extrusion plate is abutted on the side wall of the sliding plate, and one end of the rear extrusion plate is fixed on the side wall of the fixed frame.

[0012] Preferably, a front extrusion plate is fixed on the fixing frame, the sliding plate is located between the front extrusion plate and the rear extrusion plate, a rear alignment clamp is fixed on the movable shaft, and one end of the rear alignment clamp is arranged in a rake shape.

[0013] Preferably, a fixing rod is slidably inserted into the fixing frame, an upper sliding rod is slidably inserted into the fixing rod, a front alignment clamp is fixed to the bottom of the upper sliding rod, the upper sliding rod is L-shaped, one end of the front alignment clamp is also rake-shaped, one end of the upper sliding rod is provided with an inclined surface, and the inclined surface of the upper sliding rod abuts against the lower sliding rod.

[0014] Preferably, the top of the lower slide bar is provided with an inclined surface adapted to the upper slide bar, one end of the lower slide bar is fixed to the side wall of the fixing frame, a spring 1 is fixed to the upper slide bar, and the other end of the spring 1 is fixed to the top of the fixing bar.

[0015] Preferably, the side walls of the support rod and the fixed rod are both abutted with bags, the bag is connected to an air intake pipe, one end of the air intake pipe is connected to a bellows, one end of the bellows is fixed to the side wall of the fixed frame, one end of the bellows is fixed with a pressure plate, and one end of the pressure plate is fixed with an electric push rod.

[0016] Preferably, one end of the electric push rod is installed in the SMT machine body through a mounting seat, a side alignment clamp is fixed to one end of the electric push rod, a guide rod fixed on a fixing frame is slidably penetrated through the side alignment clamp, and the chip body is located between the rear alignment clamp and the front alignment clamp.

[0017] Align the chip body before flipping it to avoid the situation where the position of the chip body changes due to slight fluctuations during transportation by a conveyor belt or other means, resulting in the chip body not being in the flip position when the flip component clamps it, and the flipped chip body cannot be accurately installed on the substrate.

[0018] Preferably, a reduction cylinder is fixed in the body of the placement machine, a power rod is slidably provided in the reduction cylinder, a reduction plate is fixed at one end of the power rod, the top of the reduction plate is matched with the top of the flip frame, a piston is fixed on the power rod, and a spring 2 for assisting the piston to reset is fixed in the reduction cylinder, and a control switch is installed under the power rod. The flip frame will first contact the reduction plate and press the reduction plate downward, so that the flip frame can move smoothly to the suction position, thereby avoiding the flip frame that has clamped the chip body from shaking and misaligning due to a sudden pause when flipping to the suction position, resulting in the chip body being unable to be accurately installed on the substrate after being flipped.

[0019] Preferably, a conveying motor is fixed in the body of the placement machine through a motor seat, an output shaft is connected to the output end of the conveying motor, a transmission unit and a conveying roller group are fixed on the output shaft, and a conveying belt for conveying the chip body is transmission-connected to the conveying roller group.

[0020] The present invention provides a flip alignment device for flip chip bonding. Compared with the prior art, it has the following beneficial effects:

[0021] (1) The flipping alignment device for flip chip bonding is provided with a chip mounter body, a loading unit, a chip mounter unit, a conveying motor, an output shaft, a transmission unit, a conveying roller group, a conveyor belt, an upward camera, a flipping motor, a rotating shaft, a flipping frame, a chuck, a gasket, an air pipe, an air pump, and a chip body. The loading unit is used to convey the substrate to be mounted into the inside of the chip mounter body. The conveying motor drives the output shaft to rotate. The output shaft drives the conveying roller group to rotate through the transmission unit. The conveying roller group drives the conveyor belt to move. The chip body to be mounted is conveyed to the flipping position through the conveyor belt. The control console controls the flipping motor to rotate in the opposite direction, thereby flipping the clamped chip body so that the bumps of the chip body can be directly placed downward. The chips are then connected to the substrate. At this time, the control console controls the placement machine to run to the suction position. The upward camera installed in the placement machine body and the downward camera installed on the placement machine unit are positioned with each other to ensure that the placement machine unit is directly above the flipped chip body. After alignment, the flipped chip body is sucked by the placement machine unit and transferred to the substrate for subsequent processes. The chip body is flipped and then bonded to the substrate for packaging. There is no need to rely on gold wire bonding to connect to the substrate, and no wire bonding is required, which saves the required space. The package body can be made thinner and lighter, which is conducive to the design of miniaturized electronic equipment, reduces the complex steps required for traditional wire bonding, reduces production steps, and improves production speed to a certain extent.

[0022] (2) The flipping alignment device for flip chip bonding is provided with a fixing frame, a support rod, a fixing rod, a movable shaft, a sliding plate, a front alignment clamp, a front extrusion plate, a rear extrusion plate, an upper sliding rod, a lower sliding rod, a spring, a rear alignment clamp, a side alignment clamp, an electric push rod, a pressure plate, a bellows, an air intake pipe, and a bag. The fixing frame is installed above the conveyor belt. When the chip body moves to the alignment position under the drive of the conveyor belt, the electric push rod is controlled by the control console to start, and the electric push rods on both sides synchronously drive the side alignment clamps on both sides to move toward the chip body, and the side alignment clamps on both sides push the chip body to align it; at the same time, the front alignment clamp and the rear alignment clamp cooperate with each other to align the position of the chip body again, ensuring that the chip The chip body can be in the flip position, so that the position of the chip body clamped after the flip component is flipped to the flip position will not be offset; the chip body is aligned and then flipped to avoid the chip body being transported by a conveyor belt or other means. The position of the chip body changes due to slight fluctuations, resulting in the chip body not being in the flip position when the flip component clamps it, and the flipped chip body cannot be accurately installed on the substrate. This can ensure that the solder bumps on the chip are accurately aligned with the pads on the substrate, and subsequent soldering processes (such as reflow soldering) will be easier to control, reducing the situation of poor electrical connections, and can reduce the risk of the filling material deviating from the target area when flowing, thereby improving production speed and production accuracy.

[0023] (3) The flipping alignment device for flip chip bonding is provided with a reduction plate, a reduction cylinder, a second spring, a power rod, and a control switch. When the flip assembly clamps the chip body and flips it to the suction position, the flip frame will first contact the reduction plate and press the reduction plate downward, so that the flip frame can move smoothly to the suction position, thereby preventing the flip frame that has clamped the chip body from shaking and misaligning due to a sudden pause when flipping to the suction position, so that the flipped chip body cannot be accurately mounted on the substrate. At the same time, the start-up of the conveying motor is controlled by the mechanical parts adaptively, which makes it easy to find the fault point and convenient to maintain, and can shorten the conveying interval and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 Another perspective view of the overall structure of the present invention;

[0026] Figure 3 The internal structure diagram of the chip mounter body of the present invention;

[0027] Figure 4 It is a schematic diagram of the position of the conveying motor of the present invention;

[0028] Figure 5 It is a structural diagram of the flip assembly of the present invention;

[0029] Figure 6 It is a structural diagram of the turning frame of the present invention;

[0030] Figure 7 is a structural diagram of the fixing frame of the present invention;

[0031] Figure 8 It is a partial structural diagram of the alignment assembly of the present invention;

[0032] Fig. 9 This is an exploded state diagram of the fixing rod of the present invention;

[0033] Fig.10 It is a cross-sectional structural diagram of the reduction cylinder of the present invention;

[0034] Fig.11 For the present invention Fig.10 Enlarged view of point A in the middle.

[0035] In the figure: 1, the main body of the chip mounter; 101, the loading unit; 102, the chip mounter unit; 2, the conveying motor; 21, the output shaft; 22, the transmission unit; 23, the conveying roller group; 24, the conveyor belt; 3, the upward camera; 4, the flip motor; 41, the rotating shaft; 42, the flip frame; 43, the chuck; 44, the gasket; 45, the air pipe; 46, the air pump; 5, the chip main body; 6, the fixing frame; 61, the support rod; 6101, the fixing rod; 62, the movable shaft; 63, sliding plate; 64, rear alignment clamp; 65, rear extrusion plate; 66, front extrusion plate; 67, upper slide bar; 671, lower slide bar; 68, spring one; 69, front alignment clamp; 610, side alignment clamp; 611, electric push rod; 612, pressure plate; 613, bellows; 614, air intake pipe; 615, bladder; 7, reduction plate; 71, reduction cylinder; 711, exhaust hole; 72, spring two; 73, power rod; 74, control switch. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] See also Figures 1 to 11 , the present invention provides the following technical solutions:

[0038] Embodiment 1: A flipping and alignment device for flip chip bonding, comprising a chip mounter body 1, a loading unit 101 fixedly installed in the chip mounter body 1 for conveying a substrate, and a chip mounter unit 102 movably installed in the chip mounter body 1 for mounting chips, wherein a flipping assembly for flipping a chip body 5 and an alignment assembly for adjusting the position of the chip body 5 are arranged inside the chip mounter body 1, and the flipping assembly comprises: a flipping motor 4, a rotating shaft 41, a flipping frame 42, a chuck 43, a gasket 44, an air pipe 45, and an air pump 46;

[0039] The bottom of the flip motor 4 is fixedly installed in the SMT machine body 1 through the motor box to drive the flip assembly to operate. A rotating shaft 41 is fixedly installed on the output end of the flip motor 4 through a coupling. The side wall of the rotating shaft 41 is movably installed on the support plate through a bearing. The bottom of the support plate is fixedly installed on the SMT machine body 1. A flip frame 42 is fixedly installed on the rotating shaft 41. The flip frame 42 is similar to a tweezers shape. Two chucks 43 are fixedly installed on the end of the flip frame 42 away from the rotating shaft 41.

[0040] The bottom of the air pump 46 is fixedly installed in the SMT machine body 1 through a mounting plate to deliver gas to the chuck 43 to expand the chuck 43. The output end of the air pump 46 is fixedly connected to an air pipe 45. There are three air pipes 45. The three air pipes 45 are connected through a tee. One end of two air pipes 45 is connected to the two chucks 43 respectively. A set of gaskets 44 are fixedly installed on the side walls of the two chucks 43 close to the chip body 5.

[0041] The alignment component includes an upward camera 3 and a downward camera. The bottom of the upward camera 3 is fixedly mounted on the placement machine body 1, and the side wall of the downward camera is fixedly mounted on the placement machine group 102. The upward camera 3 and the downward camera are adapted to each other so that after the placement machine group 102 moves to the suction position, the upward camera 3 and the downward camera determine whether the placement machine group 102 is aligned with the chip body 5. A conveying motor 2 is fixedly mounted in the placement machine body 1 through a motor seat, and an output shaft 21 is connected to the output end of the conveying motor 2. A group of transmission units 22 are fixedly mounted on the output shaft 21. The transmission unit 22 can be a pulley or a sprocket. A group of conveying roller groups 23 are also fixedly mounted on the output shaft 21. The conveying roller group 23 is transmission-connected to a conveyor belt 24 for conveying the chip body 5.

[0042] When in use, the substrate to be mounted is transported to the mounting position inside the mounting machine body 1 through the loading unit 101, the output shaft 21 is driven to rotate by the conveying motor 2, the output shaft 21 drives the conveying roller group 23 to rotate through the transmission unit 22, the conveying roller group 23 drives the conveyor belt 24 to move, and the chip body 5 to be mounted is transported to the flipping position through the conveyor belt 24. At this time, the flipping motor 4 is controlled to start by the console, and the rotating shaft 41 is driven to rotate by the flipping motor 4. The rotating shaft 41 drives the flip frame 42 to rotate, and the chuck 43 and the gasket 44 are driven to rotate to the chip body 5 through the flip frame 42. The air pump 46 is controlled to start by the console to transport the gas to the chuck 43 through the gas pipe 45. The chuck 43 is expanded, and the expanded chuck 43 clamps the chip body 5 conveyed by the conveyor belt 24. Then the control console controls the flip motor 4 to rotate in the opposite direction, thereby flipping the clamped chip body 5 so that the bumps of the chip body 5 face downward and can be directly interconnected to the substrate. At this time, the control console controls the placement machine group 102 to run to the suction position, and the upward camera 3 installed in the placement machine body 1 and the downward camera installed on the placement machine group 102 are positioned with each other to ensure that the placement machine group 102 is located directly above the flipped chip body 5. After alignment, the flipped chip body 5 is sucked by the placement machine group 102 and transferred to the substrate for subsequent dipping and placement operations.

[0043] Embodiment 2, the technical solution of this embodiment is different from that of embodiment 1 in that: the alignment assembly further includes: a fixing frame 6, a support rod 61, a movable shaft 62, a sliding plate 63, a rear alignment clamp 64, a rear extrusion plate 65, a front extrusion plate 66, an upper slide bar 67, a lower slide bar 671, a spring 1 68, a front alignment clamp 69, a side alignment clamp 610, an electric push rod 611, a pressure plate 612, a bellows 613, an air intake pipe 614, and a bag 615;

[0044] There are two fixing frames 6, which are symmetrically distributed on both sides of the chip body 5. One end of the two fixing frames 6 is fixedly installed on the chip mounter body 1. A support rod 61 is slidably inserted in each of the two fixing frames 6. A movable shaft 62 is hingedly installed on the support rod 61 through a torsion spring. A sliding plate 63 is fixedly installed on the movable shaft 62. A rear extrusion plate 65 is slidably abutted on the side wall of the sliding plate 63. One end of the rear extrusion plate 65 is fixedly installed on the side wall of one of the fixing frames 6. A front extrusion plate 66 is fixedly installed on one of the fixing frames 6. The sliding plate 63 is located between the front extrusion plate 66 and the rear extrusion plate 65. A rear alignment clamp 64 is fixedly installed on the movable shaft 62. The rear alignment clamp 64 is set in a rake shape at one end away from the movable shaft 62.

[0045] A fixing rod 6101 is slidably provided in each of the two fixing frames 6, and an upper sliding rod 67 is slidably provided in the fixing rod 6101, and a front alignment clamp 69 is fixedly installed at the bottom of the upper sliding rod 67, and the upper sliding rod 67 is L-shaped, and the end of the front alignment clamp 69 away from the fixing rod 6101 is also rake-shaped, and an inclined surface is provided at one end of the upper sliding rod 67, and a sliding rod 671 is slidably abutted against the inclined surface of the upper sliding rod 67, and a sliding rod 671 is provided at the top of the sliding rod 67. One end of the sliding rod 671 is fixedly installed on the side wall of one of the fixing frames 6, and a spring 68 is fixedly installed on the upper sliding rod 67, and the other end of the spring 68 is fixedly installed on the top of the fixing rod 6101, and a bag 615 is abutted against the side walls of the support rod 61 and the fixing rod 6101, and the two bags 615 are connected to a An air inlet pipe 614 is used to convey gas, one end of the two air inlet pipes 614 are connected to the bellows 613, one end of the bellows 613 is fixedly mounted on the side wall of the fixing frame 6, one end of the bellows 613 is fixedly mounted with a pressing plate 612, there are two electric push rods 611, the two electric push rods 611 are symmetrically distributed on both sides of the chip body 5, one end of the pressing plate 612 is fixedly mounted on one of the electric push rods 611, one end of the two electric push rods 611 are respectively fixedly mounted in the placement machine body 1 through two mounting seats, one end of the two electric push rods 611 are fixedly mounted with a side alignment clamp 610, a guide rod is slidably inserted into the two side alignment clamps 610, the guide rod is T-shaped, one end of the guide rod is fixedly mounted on the fixing frame 6, and the chip body 5 is located between the rear alignment clamp 64 and the front alignment clamp 69.

[0046] When in use, by installing the fixing frame 6 above the conveyor belt 24, when the chip body 5 moves to the alignment position under the drive of the conveyor belt 24, the electric push rod 611 is started by the control console, and the electric push rods 611 on both sides synchronously drive the side alignment clamps 610 on both sides to move toward the chip body 5, and the side alignment clamps 610 on both sides push the chip body 5 to align;

[0047] At the same time, the electric push rod 611 drives the pressure plate 612 to move, and the pressure plate 612 drives the bellows 613 to move, so that the gas in the bellows 613 is transported to the bag 615 through the air inlet pipe 614 to expand the bag 615, and the expanded bag 615 pushes the support rod 61 and the fixing rod 6101 to move closer to each other;

[0048] When the support rod 61 and the fixed rod 6101 are approaching each other, the support rod 61 drives the movable shaft 62 to move, and the movable shaft 62 drives the sliding plate 63 to move, so that the sliding plate 63 is separated from the rear extrusion plate 65, and then the sliding plate 63 contacts the front extrusion plate 66 and under the extrusion of the front extrusion plate 66, the sliding plate 63 drives the movable shaft 62 to rotate, and the movable shaft 62 drives the rear alignment clamp 64 to flip around the movable shaft 62 as the axis, so that the sliding plate 63 and the rear alignment clamp 64 are finally kept in a state perpendicular to the chip body 5;

[0049] The fixed rod 6101 drives the upper slide bar 67 to move, and the upper slide bar 67 is separated from the lower slide bar 671. The upper slide bar 67 loses the squeezing force of the lower slide bar 671, and the spring 1 68 provides a downward pulling force to the upper slide bar 67, so that the upper slide bar 67 first drives the front alignment clamp 69 to move downward for a distance, and then the lowered front alignment clamp 69 continues to move toward the location of the chip body 5 under the drive of the upper slide bar 67 and the fixed rod 6101, and the position of the chip body 5 is re-aligned by the front alignment clamp 69 and the rear alignment clamp 64 to ensure that the chip body 5 can be in the flip position, so that the position of the chip body 5 clamped after the flip assembly is flipped to the flip position will not be offset;

[0050] After the chip body 5 is aligned to the flip position, the control console controls the electric push rods 611 on both sides to shrink, and the electric push rods 611 drive the side alignment clamps 610 and the pressure plate 612 to move synchronously, so that the side alignment clamps 610 move linearly along the fixing frame 6, and at the same time, the bellows 613 inflates again to extract the gas in the bag 615, so that the bag 615 deflates and drives the support rod 61 and the fixing rod 6101 to move. Figure 7 During the reset process, the sliding plate 63 separates from the front extrusion plate 66 and gradually contacts the rear extrusion plate 65, and moves downward under the extrusion of the rear extrusion plate 65. Figure 7The position shown is flipped so that the flipping assembly after clamping the chip body 5 will not be blocked by the rear alignment clamp 64 and affected by the flipping process. The upper slide bar 67 and the lower slide bar 671 gradually approach each other and gradually move upward under the squeezing of the lower slide bar 671. The upper slide bar 67 drives the front alignment clamp 69 to move upward, so that the gap between the front alignment clamp 69 and the conveyor belt 24 can ensure that the next chip body 5 can smoothly pass through the front alignment clamp 69 and move to the alignment position.

[0051] Embodiment 3: The technical solution of this embodiment is different from that of embodiment 2, including: an auxiliary component for improving the alignment accuracy is arranged in the mounter body 1, and the auxiliary component includes: a reduction plate 7, a reduction cylinder 71, a second spring 72, a power rod 73, and a control switch 74;

[0052] A reduction cylinder 71 is fixedly installed, and a power rod 73 is slidably inserted in the reduction cylinder 71. A reduction plate 7 is fixedly installed at one end of the power rod 73. The top of the reduction plate 7 is slidably adapted to the top of the flip frame 42, so that the flip frame 42 can squeeze the reduction plate 7 to move downward during the flipping to the suction position. A piston is fixedly installed on the power rod 73, and the bottom of the piston is fixedly connected to one end of the spring 2 72. The other end of the spring 2 72 is fixedly installed in the reduction cylinder 71. The spring 2 72 is used to assist the piston to reset. An exhaust hole 711 is opened in the reduction cylinder 71. The exhaust holes 711 are arranged from large to small from the inside of the reduction cylinder 71 to the outside of the reduction cylinder 71. A control switch 74 is fixedly installed on the SMT machine body 1 below the power rod 73. The control switch 74 is used to control the start of the conveying motor 2.

[0053] When in use, in the process of the flip assembly clamping the chip body 5 and flipping it to the suction position, the flip frame 42 will first contact the reduction plate 7 and squeeze the reduction plate 7 downward, and the reduction plate 7 drives the piston to move downward, and the piston squeezes the air in the reduction cylinder 71, so that the air in the reduction cylinder 71 is discharged through the exhaust hole 711, so that the reduction plate 7 and the flip frame 42 can move smoothly to the suction position. After the flip frame 42 flips to the flip position, the piston and the reduction plate 7 can be reset to the position under the action of the spring 72. Fig.10 Position shown;

[0054] The reduction plate 7 simultaneously drives the power rod 73 to move downward during the downward movement, and the power rod 73 squeezes the control switch 74 to start, so that the control switch 74 controls the conveying motor 2 to start running a stroke, thereby moving the next chip body 5 to the alignment position.

[0055] In another embodiment different from the aforementioned embodiment, the front alignment clamp 69 and the rear alignment clamp 64 are replaced with detachable clamps mounted on the upper slide bar 67 and the movable shaft 62 to accommodate the flipping and alignment operation of chip bodies 5 of different models.

[0056] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0057] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flip alignment device for flip chip bonding, comprising a chip mounter body (1), a loading unit (101) installed in the chip mounter body (1) for conveying substrates, and a chip mounter unit (102) installed in the chip mounter body (1) for mounting chips, characterized in that: The chip mounter body (1) is provided with a flipping assembly for flipping the chip body (5) and an alignment assembly for adjusting the position of the chip body (5), wherein the flipping assembly comprises: A flip motor (4) is fixed in the SMT machine body (1) via a motor box and is used to drive the flip assembly to operate; a rotating shaft (41) is fixed to the output end of the flip motor (4); a flip frame (42) is fixed to the rotating shaft (41); and a chuck (43) is fixed to the flip frame (42); An air pump (46) is fixed in the SMT machine body (1) via a mounting plate and is used to deliver gas to the chuck (43); an output end of the air pump (46) is connected to an air delivery pipe (45); one end of the air delivery pipe (45) is connected to the chuck (43); and a gasket (44) is fixed to the chuck (43); The alignment component comprises an upward-looking camera (3) fixed on the chip mounter body (1) and a downward-looking camera fixed on the chip mounter group (102); A conveying motor (2) is fixed in the chip mounter body (1) via a motor seat, an output shaft (21) is connected to the output end of the conveying motor (2), a transmission unit (22) and a conveying roller unit (23) are fixed to the output shaft (21), and a conveying belt (24) for conveying the chip body (5) is connected to the conveying roller unit (23); The chip body (5) is transported to the flipping position, and the flipping motor (4) drives the flipping frame (42) to rotate to the chip body (5), and after the air pump (46) changes the state of the clamp (43) to clamp the chip body (5), the chip body (5) is flipped; After the chip body (5) is flipped, the chip placement machine unit (102) moves to the suction position and is aligned by the alignment component to ensure that the chip placement machine unit (102) is located directly above the flipped chip body (5). The chip placement machine unit (102) sucks the flipped chip body (5) and transfers it to the substrate for glue dipping and chip placement operations.

2. The flip alignment device for flip chip bonding according to claim 1, characterized in that: The alignment assembly also includes a fixed frame (6) fixed to the SMT machine body (1), a support rod (61) slidably penetrates the fixed frame (6), a movable shaft (62) is hingedly mounted on the support rod (61), a sliding plate (63) is fixed on the movable shaft (62), a rear extrusion plate (65) is abutted against the side wall of the sliding plate (63), and one end of the rear extrusion plate (65) is fixed to the side wall of the fixed frame (6).

3. The flip alignment device for flip chip bonding according to claim 2, characterized in that: A front extrusion plate (66) is fixed on the fixing frame (6), the sliding plate (63) is located between the front extrusion plate (66) and the rear extrusion plate (65), and a rear alignment clamp (64) is fixed on the movable shaft (62), one end of the rear alignment clamp (64) being arranged in a rake shape.

4. The flip alignment device for flip chip bonding according to claim 2, characterized in that: A fixing rod (6101) is slidably inserted into the fixing frame (6), an upper sliding rod (67) is slidably inserted into the fixing rod (6101), a front alignment clamp (69) is fixed to the bottom of the upper sliding rod (67), the upper sliding rod (67) is L-shaped, one end of the front alignment clamp (69) is also rake-shaped, one end of the upper sliding rod (67) is provided with an inclined surface, and the inclined surface of the upper sliding rod (67) abuts against the lower sliding rod (671).

5. The flip alignment device for flip chip bonding according to claim 4, characterized in that: The top of the lower slide bar (671) is provided with an inclined surface adapted to the upper slide bar (67); one end of the lower slide bar (671) is fixed to the side wall of the fixed frame (6); a spring 1 (68) is fixed to the upper slide bar (67); the other end of the spring 1 (68) is fixed to the top of the fixed bar (6101).

6. The flip alignment device for flip chip bonding according to claim 5, characterized in that: The side walls of the support rod (61) and the fixing rod (6101) are both butted against by bags (615), the bag (615) is connected to an air intake pipe (614), one end of the air intake pipe (614) is connected to a bellows (613), one end of the bellows (613) is fixed to the side wall of the fixing frame (6), one end of the bellows (613) is fixed to a pressure plate (612), and one end of the pressure plate (612) is fixed to an electric push rod (611).

7. The flip alignment device for flip chip bonding according to claim 6, characterized in that: One end of the electric push rod (611) is mounted in the SMT machine body (1) via a mounting seat, a side alignment clamp (610) is fixed to one end of the electric push rod (611), a guide rod fixed to a fixing frame (6) is slidably inserted into the side alignment clamp (610), and the chip body (5) is located between the rear alignment clamp (64) and the front alignment clamp (69).

8. The flip alignment device for flip chip bonding according to claim 1, characterized in that: A reduction cylinder (71) is fixed in the SMT machine body (1), a power rod (73) is slidably inserted in the reduction cylinder (71), a reduction plate (7) is fixed at one end of the power rod (73), the top of the reduction plate (7) is matched with the top of the flip frame (42), a piston is fixed on the power rod (73), a spring 2 (72) for assisting the piston to return is fixed in the reduction cylinder (71), and a control switch (74) is installed below the power rod (73).

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