Multi-switch module package for multi-level inverter

By integrating multiple switching modules in a single package, the problem of large space and parasitic effects of multi-level inverters at high voltages is solved, and the effects of high power density and low stress are achieved, reducing packaging cost and quality.

CN119276129APending Publication Date: 2025-01-07GM GLOBAL TECHNOLOGY OPERATIONS LLC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202311393749.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-07-06
Filing Date
2023-10-25
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

At high voltage, existing multi-level inverters have increased stress on equipment and motors and have large space occupancy, which affects packaging density and cost.

Method used

Multiple switches are attached to a single insulating substrate in a single package to form modules, reduce package size and reduce mass, and use power semiconductor devices such as silicon/silicon carbide or gallium nitride to provide the minimum required four terminals. Three-switch or six-switch inverter module layout, combined with the best integrated heat sink for thermal management.

Benefits of technology

Achieve high power density and minimum stress on the device at high voltages, reducing cumulative package size by 15%, reducing quality, saving package size and cost, and reducing stray parasitic effects between modules.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119276129A_ABST
    Figure CN119276129A_ABST
Patent Text Reader

Abstract

A multi-switch module package for a multi-level inverter is provided. The multi-level inverter is connected to the battery. The multi-level inverter includes three levels, each of the three levels having a first module and a second module. A first module is formed on a first insulating substrate material, and a second module is formed on a second insulating substrate material separate from the first insulating substrate material. The first module includes a first switch coupled to the battery via a positive power rail, a second switch coupled to the battery via a negative power rail, and a third switch coupled to the second module. The second module includes another first switch coupled to the battery, another second switch coupled to the battery, and another third switch coupled to the first module. The first module includes four terminals and the second module includes the other four terminals.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The subject disclosure relates to power control systems for vehicles, and more particularly to providing a multi-switch module package for a multilevel inverter. Background Art

[0002] Typically, a vehicle includes many different electrical systems, including but not limited to infotainment systems, lighting systems, power steering systems, power brake systems, driver assistance systems, various sensors, heating systems, and air conditioning systems.

[0003] Recently, electric vehicles and hybrid vehicles including high voltage (ie, >400V) battery packs have been developed, and improvements in battery inverters are desired. Summary of the invention

[0004] In an exemplary embodiment, a vehicle system is provided. The vehicle system includes a battery and a multilevel inverter connected to the battery. The multilevel inverter includes three levels, each of the three levels includes a first module and a second module, the first module is formed on a first insulating substrate material, and the second module is formed on a second insulating substrate material separated from the first insulating substrate material. The first module includes a first switch connected to the battery via a positive power rail, a second switch connected to the battery via a negative power rail, and a third switch connected to the second module. The second module includes another first switch connected to the battery, another second switch connected to the battery, and another third switch connected to the first module. The first module includes four terminals, and the second module includes another four terminals.

[0005] Except for one or more features described herein, the first module is a separate component from the second module.

[0006] In addition to one or more of the features described herein, the multilevel inverter includes a total of six individual modules.

[0007] In addition to one or more features described herein, the first module and the second module form one phase operably coupled to a motor such that a combination of three levels of the multi-level inverter provides a three-phase voltage to the motor.

[0008] In addition to one or more features described herein, a drain of a third switch in the first module is connected to a drain of another third switch in the second module.

[0009] In addition to one or more features described herein, the first module and the second module are each independently assembled and removable from the multi-level inverter.

[0010] In addition to one or more features described herein, one of the four terminals and the other four terminals is connected to the positive power rail and another of the four terminals and the other four terminals is connected to the negative power rail.

[0011] In an exemplary embodiment, a method for configuring a vehicle system is provided. The method includes coupling a multilevel inverter to a battery, the multilevel inverter including three levels, each of the three levels including a first module and a second module, the first module being formed on a first insulating substrate material, the second module being formed on a second insulating substrate material separate from the first insulating substrate material. The method includes configuring the first module using a first switch coupled to the battery via a positive power rail, a second switch coupled to the battery via a negative power rail, and a third switch coupled to the second module. In addition, the method includes configuring the second module using another first switch coupled to the battery, another second switch coupled to the battery, and another third switch coupled to the first module, wherein the first module includes four terminals and the second module includes another four terminals.

[0012] Except for one or more features described herein, the first module is a separate component from the second module.

[0013] In addition to one or more of the features described herein, the multilevel inverter includes a total of six individual modules.

[0014] In addition to one or more features described herein, the first module and the second module form one phase operably coupled to a motor such that a combination of three levels of the multi-level inverter provides a three-phase voltage to the motor.

[0015] In addition to one or more features described herein, a drain of a third switch in the first module is connected to a drain of another third switch in the second module.

[0016] In addition to one or more features described herein, the first module and the second module are each independently assembled and removable from the multi-level inverter.

[0017] In an exemplary embodiment, a vehicle system is provided. The vehicle system includes a battery and a multilevel inverter connected to the battery. The multilevel inverter includes a module and three levels, each of the three levels includes one of the modules, each of the modules includes an insulating substrate material separated from another of the modules. Each module includes a first switch connected to the battery via a positive power rail, a second switch connected to the battery via a negative power rail, and a third switch connected to each other. Each module includes four terminals.

[0018] Each of the modules is a separate component from another of the modules except for one or more features described herein.

[0019] In addition to one or more of the features described herein, the multilevel inverter includes a total of three separate ones of the modules.

[0020] In addition to one or more features described herein, each of the modules forms one phase operably coupled to a motor such that a combination of three levels of the multi-level inverter provides a three-phase voltage to the motor.

[0021] In addition to one or more features described herein, drains of the third switches are connected together.

[0022] In addition to one or more features described herein, each of the modules is independently assembled and removable from the multilevel inverter.

[0023] In addition to one or more features described herein, one of the four terminals is connected to a positive power rail and another of the four terminals is connected to a negative power rail.

[0024] The above features and advantages and other features and advantages of the present disclosure are apparent from the following detailed description when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Other features, advantages and details appear, by way of example only, in the following detailed description, which refers to the accompanying drawings, in which:

[0026] Figure 1 is a schematic diagram of a vehicle for use in conjunction with one or more embodiments of the present disclosure;

[0027] Figure 2 is a schematic diagram showing a vehicle system having a power supply system connected to a motor according to an exemplary embodiment;

[0028] Figure 3 is a schematic diagram showing example modules in a level of an inverter for a vehicle according to an exemplary embodiment;

[0029] Figure 4 is a schematic diagram showing example modules in a level of an inverter for a vehicle according to an exemplary embodiment;

[0030] Figure 5A and 5B According to an exemplary embodiment, Figure 3 An example switch assembly of one of the modules depicted in;

[0031] Figure 5C According to an exemplary embodiment, Figure 5A and Figure 5B A portion of a multilevel inverter depicted in;

[0032] Fig. 6A According to an exemplary embodiment, Figure 4 An example switch assembly of module 420 is depicted in;

[0033] Figure 6B According to an exemplary embodiment, Fig. 6A A portion of a multilevel inverter depicted in;

[0034] Figure 7 is a schematic diagram illustrating an example multi-level inverter having two modules according to an exemplary embodiment;

[0035] Figure 8 is a schematic diagram illustrating an example multi-level inverter having two modules according to an exemplary embodiment;

[0036] Fig. 9 is a schematic diagram showing an example multi-level inverter having three modules according to an exemplary embodiment; and

[0037] Fig.10 is a flow chart of a method for providing a multi-switch module package for a multi-level inverter according to an exemplary embodiment. DETAILED DESCRIPTION

[0038] The following description is merely exemplary in nature and is not intended to limit the present disclosure, its application, or uses.

[0039] Multiple switches working together for any multi-level inverter application will require a larger mounting space due to the additional space for switch housing and protection. Multiple housings may introduce more stray inductance and parasitics, leading to higher equipment and motor stress, especially at higher voltages.

[0040] According to one or more exemplary embodiments, a multi-switch module package for a multi-level inverter. One or more embodiments provide an electronic solid-state multi-switch module that is capable of (but not required to) continuously carry, for example, at least 200 amperes (A), which is suitable for a multi-level inverter topology. The switch assembly may include, for example, three or six power semiconductor switches packaged together for compact assembly and minimal parasitic effects to achieve high power density and minimal stress on the device at higher voltages.

[0041] Technical effects and solutions include multiple switches attached to a single insulating substrate within a single package to form a module, which can reduce the cumulative package size by 15% and reduce quality. Each switch can be composed of multiple power semiconductor devices configured as a hybrid device of silicon / silicon carbide (Si / SiC) metal oxide semiconductor field effect (MOSFET), gallium nitride (GaN) FET, Si insulated gate bipolar transistor (IGBT), or a combination of these. One or more embodiments provide a layout that functions as a three-switch or six-switch inverter module with (only) a minimum of four required terminals, thereby saving package size and cost. The package may include a gate driver for multiple switches. One or more embodiments can provide better thermal management with an optimal integrated heat sink. For the heat sink, there can be a single-sided cooling or double-sided cooling configuration. Multi-level module switches can reduce inter-module stray parasitics. In one or more embodiments, the switch 5 (SW5) die may have a different rating than the switch 1 (SW1) and switch 2 (SW2) dies within the module.

[0042] Reference now Figure 1 , a schematic diagram of a vehicle 100 for use in conjunction with one or more embodiments of the present disclosure is shown. The vehicle 100 includes a power supply system 200. In one embodiment, the vehicle 100 is a hybrid vehicle that utilizes both an internal combustion engine and an electric motor drive system. In another embodiment, the vehicle 100 is one of an electric vehicle that is propelled only by an electric motor or multiple electric motors 250. In another embodiment, the vehicle 100 may be of a conventional type and propelled by an internal combustion engine.

[0043] Electric vehicles (EVs), such as battery electric vehicles (BEVs), hybrid vehicles, and / or fuel cell vehicles, include one or more electric machines and a high voltage battery pack. A power control system (not shown) is used to control the charging and / or discharging of the high voltage battery system. The power control system includes an accessory power module (APM) configured to provide low voltage power to one or more electrical systems of the vehicle.

[0044] Now refer to Figure 2 , a block diagram of a portion of a power system 200 for a vehicle according to an exemplary embodiment is shown. The power system 200 includes a high voltage battery 210. The high voltage battery 210 may include a high voltage battery module having batteries connected in series to form a high voltage battery pack. The high voltage battery pack may be connected to a DC / DC converter (not shown) that is configured to provide a reduced or low voltage to a low voltage bus or a low voltage battery.

[0045] exist Figure 2, a power system 200 is connected to a motor 250. The power system 200 includes a multilevel inverter 260, which includes, for example, a level 230A, a level 230B, and a level 230C. Each level includes switches 201, 202, and 205 and switches 203, 204, and 206. Switch 201 may be referred to as switch 1 or SW1, switch 202 may be referred to as SW2, and switch 205 may be referred to as SW5. Similarly, switch 203 may be referred to as SW3, switch 204 may be referred to as SW4, and switch 206 may be referred to as SW6.

[0046] Switches 201, 203, 205, 202, 204, and 206 are each shown as a transistor in parallel with a diode, and can be referred to as a power semiconductor switch. As the input terminal of the switch, the gates of switches 201, 203, 205, 202, 204, and 206 are configured to be controlled for the desired operation. The multilevel inverter 260 is shown as having levels 230A, 230B, and 230C connected in parallel, and each level is connected to the motor 250. Levels 230A, 230B, and 230B are connected to a capacitor 275 in parallel with the high voltage battery 210. Each level is one phase, so that the three levels correspond to the three-phase voltage output to the motor 250. Although one level may sometimes be discussed, these discussions are applicable to other levels in the multilevel inverter by analogy.

[0047] Now refer to Figure 3 , shows a schematic diagram of a portion of a multi-level inverter 260 having two modules connected to a high voltage battery 210 according to an exemplary embodiment. Figure 3 In the embodiment, the level shown can represent any one of the levels 230A, 230B and 230C, wherein each level has the same topology. According to one or more embodiments, the example level of the multilevel inverter 260 includes two modules shown as module 320A and module 320B. Module 320A includes switches 201, 202 and 205, and has four terminals 301A, 302A, 303A and 304A. Terminal 301A is connected to the positive power rail, and terminal 303A is connected to the negative power rail. Terminal 302A is a terminal providing an output voltage A1, for example, a Vout A1 terminal.

[0048] Module 320B includes switches 203, 204, and 206, and has four terminals 301B, 302B, 303B, and 304B. Terminal 301B is connected to the positive power rail, and terminal 303B is connected to the negative power rail. Terminal 304B is a terminal that provides output voltage A2, such as a Vout A2 terminal. Each module 320A and 320B is assembled into a separate package that can be operably connected together to form one level of the multilevel inverter 260. The four terminals in each module can be pins extending from the module for connection.

[0049] Figure 4 2 is a schematic diagram showing a portion of a multilevel inverter 260 having a single module connected to a high voltage battery 210 according to an exemplary embodiment. The level shown may represent any one of the levels 230A, 230B, and 230C. According to one or more embodiments, an example level of the multilevel inverter 260 includes a single module shown as a module 420. In other words, each level uses a single module. Module 420 includes switches 201, 202, and 205, switches 203, 204, and 206, and four terminals 401, 402, 403, and 404. Terminal 401 is connected to a positive power rail, and terminal 403 is connected to a negative power rail. Terminal 402 is a terminal providing an output voltage A1, for example, a Vout A1 terminal. Terminal 404 is a terminal providing an output voltage A2, for example, a Vout A2 terminal. Module 420 is a single package assembled to be operably connected to two more modules 420, wherein each module 420 forms a level of the multilevel inverter 260.

[0050] Figure 5A and 5B According to an exemplary embodiment, Figure 3 An example switch assembly for one of the modules depicted in FIG. Figure 5A shows the front of the module, while Figure 5B The back side of the module is shown with one or more layers removed for clarity. Figure 5C A portion of a multilevel inverter 260 is shown. Figure 5A and 5B A topology with three switches is shown, using two modules per phase (one module is shown, but it should be understood that two modules per level are connected together), resulting in six modules per inverter. Figure 5C , source S1 and drain D1 are identified for switch 201, source S2 and drain D2 are identified for switch 202, and source S5 and drain D5 are identified for switch 205. This applies similarly to the modules of switches 203, 204, and 206.

[0051] exist Figure 5A and5B In the module, switch 201 includes one or more dies 501 connected in parallel, switch 202 includes one or more dies 502 connected in parallel, and switch 205 includes one or more dies 505 connected in parallel. Each of dies 501, 502, and 505 is an integrated circuit having semiconductor material to form a corresponding switch. Conductive material 530 connects the dies to form a corresponding switch, and conductive material 530 provides conductive lines for the source, gate, and drain of the switch and positive and negative power rails. In addition, conductive material 530 is used to interconnect the switches. Examples of conductive material 530 may include copper, aluminum, gold, etc. In order to avoid unnecessary ambiguity Figure 5A and 5B , each interconnect from the die to the corresponding source and gate conductive lines and the connection to the corresponding drain are not shown. For the purpose of explanation, one die 501 of the switch 201 is highlighted as die 501A to show the connection with Figure 5A Example connections for source and gate conductors in FIG. Figure 5A , a gate connector 501G for the gate of die 501A is connected to a gate conductive line 552, and a source connector 501S for the source of die 501A is connected to a source conductive line 554. The drain connector can be a pin / connector (not shown) on the back side of die 501A to drain D1. The drain conductive line can include a plate of conductive material 530. Conductive material 530 can be formed on and within insulating substrate material 532 to form appropriate connectors for the die forming the corresponding switches 201, 202, and 205 in module 320A, which are correspondingly applied to switches 203, 204, and 206 in module 320B. Other gate conductive lines 536 are shown. Insulating substrate material 532 can be formed on a heat sink 534. Insulating substrate material 532 includes an insulator that blocks the flow of current. Since each module is assembled in a separate package, each module has components formed on its own insulating substrate material 532 that is different and separate from another module in its own package.

[0052] refer to Figure 5A , Figure 5B and Figure 5C There are four terminals 301A, 302A, 303A and 304A for connection outside the module. Figure 5A , terminals 301A, 302A, 303A, and 304A are shown connected to conductive material 530, while Figure 5B, terminals 301A, 302A, 303A, and 304A extend through a portion of insulating substrate material 532. Terminal 301A is connected to drain D1 and a positive power rail and has the same voltage potential as drain D1 and the positive power rail. Terminal 302A is connected to source S1, drain D2, and source S5 and has the same voltage potential as source S1, drain D2, and source S5. Terminal 303A is connected to source S2 and a negative power rail and has the same voltage potential as source S2 and the negative power rail. Terminal 304A is connected to drain D5 and has the same voltage potential as drain D5.

[0053] Fig. 6A According to an exemplary embodiment, Figure 4 An example switch assembly of module 420 is depicted in FIG. Figure 6B A portion of a multilevel inverter 260 is shown. Fig. 6A A layout with six switches is shown, which uses one module per phase, resulting in three modules per inverter. Each level has a single module. Although Fig. 6A One module 420 is depicted in FIG, but three modules are connected in parallel at the positive and negative power rails to form a multi-level inverter 260. Figure 6B , source S1 and drain D1 are identified for switch 201, source S2 and drain D2 are identified for switch 202, and source S5 and drain D5 are identified for switch 205. Similarly, source S3 and drain D3 are identified for switch 203, source S4 and drain D4 are identified for switch 204, and source S6 and drain D6 are identified for switch 206.

[0054] exist Fig. 6A In the module 420, the switch 201 includes one or more dies 501 connected in parallel, the switch 202 includes one or more dies 502 connected in parallel, and the switch 205 includes one or more dies 505 connected in parallel, similar to Figure 5A and 5B . In addition, in module 420, switch 203 includes one or more dies 603 connected in parallel, switch 206 includes one or more dies 606 connected in parallel, and switch 204 includes one or more dies 604 connected in parallel. As discussed herein, each of dies 501, 502, and 505, as well as dies 603, 604, and 606, is an integrated circuit having semiconductor material to form a corresponding switch. Conductive material 530 connects the dies to form a corresponding switch, and conductive material 530 provides conductive lines for the source, gate, and drain of the switch as well as positive and negative power rails. In addition, conductive material 530 is used to interconnect the switches. Examples of conductive material 530 may include copper, aluminum, gold, etc. In order to avoid unnecessary ambiguity Fig. 6A, each interconnect from the die to the corresponding source, drain, and gate conductive lines is not shown. Conductive material 530 can be formed on and within insulating substrate material 532 to form appropriate connections for the die forming the corresponding switches 201, 202, and 205 and the corresponding switches 203, 204, and 206 in module 420.

[0055] refer to Fig. 6A , there are four terminals 301A, 302A, 303A and 304A exposed and used for connection outside the module. Fig. 6A , terminals 401, 402, 403, and 404 extend through a portion of the insulating substrate material 532. Terminal 401 is connected to drain D1, drain D3, and a positive power rail, and has the same voltage potential as drain D1, drain D3, and the positive power rail. Terminal 402 is connected to source S1, drain D2, and source S5, and has the same voltage potential as source S1, drain D2, and source S5. Terminal 403 is connected to source S2, source S4, and a negative power rail, and has the same voltage potential as source S2, source S4, and the negative power rail. Terminal 404 is connected to source S3, source S6, and drain D5, and has the same voltage potential as source S3, source S6, and drain D5.

[0056] Figure 7 is a schematic diagram showing an example of a multilevel inverter 260 having two modules connected to a high voltage battery 210 according to an exemplary embodiment. Figure 7 , the inverter layout is shown as having two asymmetric modules 720A and 720B. Module 720A includes twelve switches and module 720B includes six switches. The technical effect or benefit is to utilize (only) two housings, thereby having a smaller volume and mass and providing a compact structure so as to reduce inter-module parasitic effects. Module 720A includes a repetition of switches 201, 203, 205 and 206 to produce twelve switches. Module 720B includes a repetition of switches 202 and 204 to produce six switches. Module 720A is connected to the positive power rail, while module 720B is connected to the negative power rail. Each module 720A and 720B is assembled into a separate package that is operably connected to form a multi-level inverter 260. In Figure 7 In the example, only one level is required.

[0057] Figure 8 is a diagram showing a circuit having a circuit connected to a high voltage battery 210 ( Figure 8 Schematic diagram of an example of a multilevel inverter 260 with two modules (not shown in FIG. 2 ). The inverter layout is provided with two symmetrical modules. Figure 8Two modules 820A and 820B are shown, each having nine switches. Module 820A is formed by the repetition of switches 201, 203, and 205, for a total of nine switches. Module 820B is formed by the repetition of switches 202, 204, and 206, for a total of nine switches. Figure 8 In the example, only one level is required.

[0058] Fig. 9 is a diagram showing a circuit having a circuit connected to a high voltage battery 210 ( Fig. 9 Schematic diagram of an example of a multilevel inverter 260 with three modules (not shown in FIG. 2 ). The inverter layout is provided with two symmetrical modules and one different module. Fig. 9 Two symmetrical modules 920A and 920B are shown, each having six switches performing complementary functions, with module 920A connected to the positive supply rail and module 920B connected to the negative supply rail. Module 920A is formed with a repetition of switches 201 and 203, for a total of six switches. Module 920B is formed with a repetition of switches 202 and 204, for a total of six switches. Module 920C is formed with a repetition of switches 205 and 206, for a total of six switches. Fig. 9 In the example, only one level is required.

[0059] Technical effects and solutions include a multi-switch module with four terminals. For each module, multiple switches are attached to a single insulating substrate within a single package, thereby reducing the cumulative package size by more than (>) 20% and providing a lower mass for a three-switch or six-switch module. A single package includes a power device with an optimal integrated heat sink (single-sided or double-sided cooling) and power and control terminals. The heat sink can be monolithic or distributed. The power module vertical thermal stack can be selected based on single-sided cooling or double-sided cooling. The package can also accommodate decoupling capacitors and gate driver circuits for switches. Each switch consists of multiple power semiconductor devices configured as Si / SiC MOSFETs, GaN FETs (vertical or lateral), Si IGBTs, or hybrid devices using a combination of these. One or more embodiments provide a layout that is functionally used as a three-switch or six-switch inverter module with (only) a minimum of four required terminals, thereby saving package size and cost. The gate-source signal terminal can be placed on a printed circuit board (PCB) integrated within the module, or on an etched trace on a directional bonded copper (DBC) substrate. Compared to three discrete devices for a three-switch module or a half-bridge with discrete switches, multi-module switches can reduce inter-module stray parasitics. In one or more embodiments, the SW5 / SW6 die can have a different voltage rating than the SW1 / SW3 and SW2 / SW4 die within the module. One or more embodiments can have a symmetrical optimal arrangement of the die.

[0060] Fig.10 is a flow chart of a method 1000 for providing a multi-switch module package for a multi-level inverter according to an exemplary embodiment. Reference may be made to any of the figures discussed herein.

[0061] At box 1002, method 1000 includes connecting a multilevel inverter 260 to a battery 210, the multilevel inverter 260 including three levels 230A, 230B and 230C, each of the three levels including a first module 320A and a second module 320B, the first module being formed on a first insulating substrate material 532 (in module 320A) and the second module being formed on a second insulating substrate material 532 (in module 320B) separate from the first insulating substrate material.

[0062] At box 1004, method 1000 includes configuring first module 320A using a first switch (e.g., switch 201) connected to battery 210 via a positive power rail, a second switch (e.g., switch 202) connected to battery 210 via a negative power rail, and a third switch (e.g., switch 205) connected to a second module (e.g., module 320B).

[0063] At box 1006, method 1000 includes configuring the second module 320B using another first switch (e.g., switch 203) connected to the battery 210, another second switch (e.g., switch 204) connected to the battery 210, and another third switch (e.g., switch 206) connected to the first module (e.g., module 320A), wherein the first module includes four terminals (e.g., terminals 301A, 302A, 303A, and 304A), and the second module includes another four terminals (e.g., terminals 301B, 302B, 303B, and 304B).

[0064] In one or more embodiments, the first module is a component separate from the second module. The multilevel inverter 260 includes a total of six separate modules, for example, two modules 320A and 320B in each of the three levels 230A, 230B and 230C. The first module and the second module form a phase that is operably connected to the motor 250 so that the combination of the three levels of the multilevel inverter provides a three-phase voltage to the motor 250. The drain D5 of the third switch in the first module is connected to the drain D6 of another third switch in the second module. The first module 320A and the second module 320B are each independently assembled and can be removed from the multilevel inverter 260.

[0065] In one or more embodiments, the vehicle system includes a battery 210 and a multilevel inverter 260 connected to the battery. The multilevel inverter 260 includes a module 420 and three levels 230A, 230B, and 230C. Each of the three levels has one of the modules 420, and each of the modules 420 includes an insulating substrate material 532 separated from another of the modules 420. Each of the modules 420 includes a first switch (e.g., switches 201 and 203) connected to the battery 210 via a positive power rail, a second switch (e.g., switches 202 and 204) connected to the battery 210 via a negative power rail, and a third switch (e.g., switches 205 and 206) connected to each other. Each of the modules 420 includes four terminals (e.g., terminals 401, 402, 403, and 404).

[0066] The terms "a" and "an" do not indicate a limitation of quantity, but rather indicate the presence of at least one of the referenced item. Unless the context clearly indicates otherwise, the term "or" means "and / or". References to "aspects" throughout the specification mean that a particular element (e.g., a feature, structure, step, or characteristic) described in conjunction with that aspect is included in at least one aspect described herein, and may or may not be present in other aspects. In addition, it should be understood that the described elements may be combined in any suitable manner in the various aspects.

[0067] When an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.

[0068] Unless stated to the contrary herein, all test standards are the most current standards in effect as of the filing date of this application or, if priority is claimed, the filing date of the earliest priority application in which the test standards appear.

[0069] Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

[0070] Although the above disclosure has been described with reference to exemplary embodiments, it will be appreciated by those skilled in the art that various changes may be made and equivalents may be substituted for its elements without departing from its scope. In addition, many modifications may be made to adapt specific circumstances or materials to the teachings of the disclosure without departing from the basic scope of the disclosure. Therefore, the disclosure is intended to be limited to the specific embodiments disclosed, but will include all embodiments falling within its scope.

Claims

1. A vehicle system, comprising: Battery; as well as a multilevel inverter connected to the battery, the multilevel inverter comprising three levels, each of the three levels comprising a first module and a second module, the first module being formed on a first insulating substrate material and the second module being formed on a second insulating substrate material separate from the first insulating substrate material; wherein the first module includes a first switch coupled to the battery via a positive power rail, a second switch coupled to the battery via a negative power rail, and a third switch coupled to the second module; wherein the second module comprises another first switch coupled to the battery, another second switch coupled to the battery, and another third switch coupled to the first module; and The first module includes four terminals and the second module includes another four terminals. 2 . The vehicle system of claim 1 , wherein the first module is a separate component from the second module. 3 . The vehicle system of claim 1 , wherein the multilevel inverter comprises a total of six separate modules. 4 . The vehicle system of claim 1 , wherein the first module and the second module form one phase operably coupled to a motor such that a combination of three levels of the multilevel inverter provides a three-phase voltage to the motor. 5 . The vehicle system of claim 1 , wherein a drain of a third switch in the first module is connected to a drain of another third switch in the second module. 6 . The vehicle system of claim 1 , wherein the first module and the second module are each independently assembled and removable from the multilevel inverter. 7 . The vehicle system of claim 1 , wherein one of the four terminals and the other four terminals is connected to the positive power rail, and another of the four terminals and the other four terminals is connected to the negative power rail.

8. A vehicle system comprising: Battery; as well as a multilevel inverter connected to the battery, the multilevel inverter comprising a module and three levels, each of the three levels comprising one of the modules, each of the modules comprising an insulating substrate material separated from another of the modules; wherein each of the modules comprises a first switch coupled to the battery via a positive power rail, a second switch coupled to the battery via a negative power rail, and a third switch coupled to each other; and Each of the modules comprises four terminals.

9. The vehicle system of claim 8, wherein each of the modules is a separate component from another of the modules.

10. The vehicle system of claim 8, wherein the multi-level inverter includes a total of three separate modules among the modules.