A method and device for detecting lamination effect of three-layer circuit board

Abstract

The present invention discloses a method and device for detecting the lamination effect of a three-layer circuit board, comprising: setting a plurality of groups of detection pads on the first surface of an original double-sided board, setting a first copper-cutting area according to each group of detection pads, performing a first copper-cutting treatment on the first copper-cutting area, and obtaining a second double-sided board; wherein each group of detection pads includes a plurality of detection pads, setting a second copper-cutting area on the second surface of the second double-sided board according to the first copper-cutting area, performing a second copper-cutting treatment on the second copper-cutting area, and obtaining a first double-sided board; laminating a single-sided board and the first double-sided board to obtain a three-layer circuit board, determining the lamination effect of the three-layer circuit board according to the state of the first copper-cutting area, and the lamination effect of the three-layer circuit board includes compaction and non-compaction. The present invention can reduce the confirmation time of the lamination effect and can be applied to the technical field of circuit board preparation.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board preparation, and in particular to a method and a device for detecting the lamination effect of a three-layer circuit board. Background Art

[0002] A multilayer circuit board is a circuit board with multiple circuit layers stacked on the same board. Compared with single-layer and double-layer boards, multilayer circuit boards have higher integration, lower electromagnetic interference and better impedance control, so they are widely used in communication equipment, automotive industry, industrial control and aerospace fields. After the different layers of conventional multilayer circuit boards are combined, the outer copper layer of the product needs to be manually etched off to confirm whether there is any pressure mismatch between the inner layers, which takes a long time to confirm. Summary of the invention

[0003] In order to solve the above problems, the purpose of the present invention is to provide a method and device for detecting the lamination effect of a three-layer circuit board, which can reduce the confirmation time of the lamination effect.

[0004] In one aspect, the present invention provides a method for detecting a lamination effect of a three-layer circuit board, wherein the three-layer circuit board includes a single-sided board and a first double-sided board, and comprises the following steps:

[0005] A plurality of groups of detection pads are arranged on the first surface of the original double-sided board, a first copper-cutting area is arranged according to each group of the detection pads, and a first copper-cutting process is performed on the first copper-cutting area to obtain a second double-sided board; wherein each group of detection pads includes a plurality of detection pads;

[0006] According to the first copper-cut area, a second copper-cut area is provided on the second surface of the second double-sided board, and a second copper-cut process is performed on the second copper-cut area to obtain a first double-sided board;

[0007] Laminating the single-layer circuit board and the first double-layer circuit board to obtain the three-layer circuit board;

[0008] The pressing effect of the three-layer circuit board is determined according to the state of the first copper-cut area; the pressing effect of the three-layer circuit board includes pressing and not pressing.

[0009] Optionally, a plurality of groups of detection pads are arranged on the first side of the original double-sided board, specifically including:

[0010] Determine the position of each group of the detection pads on the first surface of the original double-sided board;

[0011] The spacing between the detection pads is determined, and a plurality of detection pads are respectively arranged at the positions of each group of the detection pads according to the spacing.

[0012] Optionally, setting a first copper-cutting area according to each group of detection pads specifically includes:

[0013] A first outward expansion area is expanded around each group of the detection pads on the first surface, and the gaps between the detection pads in each group of the detection pads and the first outward expansion area are set as the first copper hollowing area.

[0014] Optionally, providing a second copper-cut area on the second surface of the second double-sided board according to the first copper-cut area specifically includes:

[0015] The boundary of the first copper-cut area is determined, and an area on the second surface of the second double-sided board aligned with the boundary is set as the second copper-cut area.

[0016] Optionally, performing a first copper-cutting process on the first copper-cutting area to obtain a second double-sided board specifically includes:

[0017] The copper in the first copper-cut area is removed by etching technology or laser technology to obtain the second double-sided board.

[0018] Optionally, laminating the single-sided board and the first double-sided board to obtain the three-layer circuit board specifically includes:

[0019] Bonding the adhesive with the protective film to the first surface of the first double-sided board to obtain a glued circuit board;

[0020] Putting the glued circuit board into a rolling device for rolling to obtain a rolled circuit board;

[0021] The protective film on the adhesive is torn off, and the first surface of the rolled circuit board and the single-sided board are adhered to each other using the adhesive. The adhered circuit board is placed in a press for lamination to obtain the three-layer circuit board.

[0022] Optionally, placing the bonded circuit boards into a press for pressing to obtain the three-layer circuit board specifically includes:

[0023] The press is configured to have a first pressure and a first temperature, and the bonded circuit boards are first pressed at the first pressure and the first temperature to obtain a first pressed circuit board;

[0024] Inserting the first pressed circuit board into the connecting pins to obtain a circuit board after inserting the pins;

[0025] The press is configured to a second pressure and a second temperature, and the nailed circuit board is subjected to a second pressing at the second pressure and the second temperature to obtain the three-layer circuit board; wherein the first pressure is less than the second pressure, and the first temperature is less than the second temperature.

[0026] Optionally, performing a second pressing on the nailed circuit board at the second pressure and the second temperature to obtain the three-layer circuit board specifically includes:

[0027] A release film, a first glass fiber cloth and a silicon-aluminum foil are sequentially wrapped on one side of the circuit board after the nailing, and a first glass fiber cloth, a second glass fiber cloth and a sintered iron plate are sequentially wrapped on the other side of the circuit board after the nailing to obtain a wrapped circuit board; the fiber fineness of the first glass fiber cloth is greater than that of the second glass fiber cloth;

[0028] The wrapped circuit board is subjected to a second pressing step at the second pressure and the second temperature to obtain the three-layer circuit board.

[0029] Optionally, determining the lamination effect of the three-layer circuit board according to the state of the first copper-cut area specifically includes:

[0030] If the state of the first copper-cut area is a compacted state, determining that the pressing effect of the three-layer circuit board is compacted;

[0031] If the state of the first copper-cut area is an uncompacted state, it is determined that the pressing effect of the three-layer circuit board is an uncompacted state.

[0032] On the other hand, the present invention provides a device for detecting the lamination effect of a three-layer circuit board, comprising a copper excavation device, a lamination device and an evaluation device, wherein:

[0033] The copper-cutting device is used to set a plurality of groups of detection pads on the first side of the original double-sided board, set a first copper-cutting area according to each group of detection pads, perform a first copper-cutting treatment on the first copper-cutting area, and obtain a second double-sided board; wherein each group of detection pads includes a plurality of detection pads; set a second copper-cutting area on the second side of the second double-sided board according to the first copper-cutting area, and perform a second copper-cutting treatment on the second copper-cutting area to obtain the first double-sided board;

[0034] The laminating device is used to laminar the single-layer PCB and the first double-layer PCB to obtain the three-layer PCB;

[0035] The evaluation device is used to determine the pressing effect of the three-layer circuit board according to the state of the first copper-cut area; the pressing effect of the three-layer circuit board includes pressing and not pressing.

[0036] The implementation of the present invention includes the following beneficial effects: the present invention arranges a plurality of groups of detection pads on the first surface of the original double-sided board, arranges a first copper-cut area according to each group of detection pads, performs a first copper-cut treatment on the first copper-cut area, and obtains a second double-sided board, wherein each group of detection pads includes a plurality of detection pads, arranges a second copper-cut area on the second surface of the second double-sided board according to the first copper-cut area, performs a second copper-cut treatment on the second copper-cut area, and obtains a first double-sided board, presses the single-sided board and the first double-sided board to obtain a three-layer circuit board, and determines the effect of pressing the three-layer circuit board according to the state of the first copper-cut area; the effect of pressing the three-layer circuit board includes compaction and non-compaction; by setting the first copper-cut area, after copper-cutting, the first copper-cut area has one less layer of copper compared with the part without copper-cutting, if the first copper-cut area can be compacted, it is considered that other areas can also be compacted, and it is not necessary to etch the outer copper of the product before confirming whether there is a problem of uncompacted pressing between the inner-layer circuits, which can reduce the confirmation time and reduce the damage to the three-layer board. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a flow chart of the steps of a method for detecting the lamination effect of a three-layer circuit board provided by the present invention;

[0038] Figure 2 It is a schematic diagram of the positions of several groups of detection pads provided by the present invention;

[0039] Figure 3 It is a schematic diagram of the positions of a group of detection pads and their first copper-cut areas provided by the present invention;

[0040] Figure 4 It is a schematic diagram of the spacing of a detection pad provided by the present invention;

[0041] Figure 5 It is a structural schematic diagram of a three-layer circuit board provided by the present invention;

[0042] Figure 6 is a comparison diagram of a compacted detection pad and an uncompacted detection pad provided by the present invention;

[0043] Figure 7 It is a schematic structural diagram of a circuit board after being nailed provided by the present invention;

[0044] Figure 8 It is a structural schematic diagram of a circuit board after being wrapped after being nailed, provided by the present invention;

[0045] Fig. 9 It is a structural schematic diagram of a device for detecting the lamination effect of a three-layer circuit board provided by the present invention.

[0046] P-a group of test pads; A-spacing; B-L1 without copper digging; C-test pads; D-second copper digging area; ADL2-adhesive layer (thermosetting adhesive layer); Copper Foil-copper cladding; Base Film-base material (translucent material is selected); Adhesive-adhesive; Digging Copper-digging copper; E-unsolid pressure; F-stacking fixture; H-nail; FPC-three-layer circuit board; G1-silicon aluminum foil; G2-first glass fiber cloth; G3-release film; G4-release film; G5-first glass fiber cloth; G6-second glass fiber cloth; G7-burned iron plate. DETAILED DESCRIPTION

[0047] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The step numbers in the following embodiments are only provided for the convenience of explanation and description, and the order between the steps is not limited in any way. The execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0048] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0049] When the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims. In the description of the present application, it is necessary to understand that the terms "first / S100", "second / S200", "third / S300", etc. are only used to distinguish similar objects, and do not have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0050] In order to better understand the technical solution of the present invention, the following technical solution is now explained:

[0051] Three-layer circuit board: generally includes a single-sided board L1 and a double-sided board. The single-sided board includes a copper clad layer and a substrate PI. The double-sided board includes a copper clad layer L2, a substrate PI and a copper clad layer L3. L2 is a layer close to the single-sided board L1. For the single-sided board L1, the process flow of cutting → drilling → laminating is generally adopted. For the double-sided board, the process flow of cutting → drilling → inner layer circuit → punching → laminating is generally adopted.

[0052] like Figure 1-3 As shown, Figure 1 It is a flow chart of the steps of the method for testing the lamination effect of a three-layer circuit board. Figure 2 It is a schematic diagram of the positions of several groups of detection pads. Figure 3 The present invention provides a method for detecting the lamination effect of a three-layer circuit board, comprising the following steps:

[0053] S100, setting a plurality of groups of detection pads on the first surface of the original double-sided board, setting a first copper-cut area according to each group of the detection pads, and performing a first copper-cut process on the first copper-cut area to obtain a second double-sided board.

[0054] Each group of detection pads includes a plurality of detection pads, and the first side is L2. A plurality of groups refers to more than one group.

[0055] Specifically, Figure 2 As shown, the position of each detection pad is first determined on L2 of the original double-sided board. The present invention can respectively set a group of detection pads in the four corner waste areas and the central waste area of ​​the first side of the original double-sided board, that is, there are five groups of detection pads, and waste areas can also be set at other positions on the first side or a group of detection pads can be set in one of the waste areas in the four corner waste areas and the central waste area, as long as the detection purpose can be achieved. Among them, if more than two groups of detection pads are included, the size of each group of detection pads can be different or the same, and the size of a single detection pad in each group of detection pads can be the same or different, and is set to be the same in this embodiment.

[0056] After determining the position of the detection pads, for each group of detection pads, the number of detection pads and the spacing between each detection pad are determined according to the ratio of the inner layer substrate and the copper thickness, such as Figure 4 As shown, Figure 4 It is a schematic diagram of the spacing of the detection pads. Several detection pads are set on L2 according to the spacing. The 0.06 marked by the blue indicator line in the figure indicates that the spacing between the detection pads is 0.06mm, and the 0.10 marked by the blue indicator line in the figure indicates that the spacing between the detection pads and the surrounding copper-clad area is 0.10mm. For example, if the ratio of the inner substrate and the copper thickness is 1 / 3oz, the spacing of the detection pads is 0.06mm, and if the ratio of the inner substrate and the copper thickness is 1 / 2oz, the spacing of the detection pads is 0.08mm. Four detection pads are set in one row of each group of detection pads, and a total of four rows are set. The diameter of the detection pad can be but is not limited to φ=0.45mm.

[0057] like Figure 3 As shown in (c), the single-sided board L1 does not need to be processed with copper, and no holes need to be drilled to open windows. Figure 3As shown in (a), in the figure, the black area is the first copper-cut area. For each group of detection pads, the first expansion area can be expanded around each group of detection pads on the first surface, and the gap between the detection pads in each group of detection pads and the first expansion area are set as the first copper-cut area, wherein the shape of the detection pad is not limited to Figure 3 The cylinder in the figure can also be, but not limited to, a cuboid, a cube, etc.

[0058] When making the inner layer circuit, the copper in the first copper-cut area on the circuit film can be removed by using, but not limited to, etching technology or laser technology to obtain a second double-sided board.

[0059] S200: Disposing a second copper-cut region on the second surface of the second double-sided board according to the first copper-cut region, and performing a second copper-cut process on the second copper-cut region to obtain a first double-sided board.

[0060] Specifically, Figure 3 As shown in (a), the boundary of the first copper-cut area is determined, and the area on the second surface L3 of the second double-sided board aligned with the boundary is set as the second copper-cut area.

[0061] When making the inner layer circuit, the copper in the second copper-cut area on the circuit film can be removed by using, but not limited to, etching technology or laser technology to obtain a first double-sided board.

[0062] S300: Laminating the single-layer PCB and the first double-layer PCB to obtain the three-layer PCB.

[0063] Specifically, Figure 5 As shown, Figure 5 It is a structural schematic diagram of a three-layer circuit board. After copper removal, the adhesive with a protective film is bonded to the L2 of the first double-sided board to obtain a glued circuit board. The glued circuit board is placed in a rolling device for rolling to obtain a rolled circuit board. The protective film on the adhesive is torn off, and the L2 of the first double-sided board (rolled circuit board) and the single-sided board are bonded with the adhesive. The bonded circuit board is placed in a press for pressing to obtain a three-layer circuit board.

[0064] S400: Determine the lamination effect of the three-layer circuit board according to the state of the first copper-cut area.

[0065] Among them, the effects of three-layer circuit board pressing include pressing and not pressing.

[0066] Specifically, Figure 6 As shown, Figure 6It is a comparison diagram of a compacted test pad and an uncompacted test pad. From the figure, it can be seen that there are no bubbles in the first copper-cut area of ​​the compacted three-layer circuit board on the left; from the figure, it can be seen that there are bubbles in the red area of ​​the first copper-cut area of ​​the uncompacted three-layer circuit board on the right. Step S400 specifically includes the following steps:

[0067] The state of the first copper-cut area can be detected manually or by image recognition technology. If the state of the first copper-cut area is a compacted state, it is determined that the pressing effect of the three-layer circuit board is compacted; if the state of the first copper-cut area is an uncompacted state, it is determined that the pressing effect of the three-layer circuit board is uncompacted.

[0068] In some embodiments, the step S300 of laminating the single-sided board and the first double-sided board to obtain the three-layer circuit board specifically includes:

[0069] S310, bonding the adhesive with the protective film to the first surface of the first double-sided board to obtain a glued circuit board.

[0070] Specifically, glue or other adhesive, for example, AD glue, is placed on the L2 surface of the double-sided board, and a heating and fixing method is used to obtain a glued circuit board.

[0071] S320, placing the glued circuit board into a rolling device for rolling to obtain a rolled circuit board.

[0072] Specifically, in some embodiments, after wrapping the rollers of the rolling equipment with release film and film, the temperature range of the rolling equipment is set to 130±10°C, the pressure range is 5±1kg / cm2, and the speed range is 0.8±0.2m / min, and the assembled circuit board is placed in the set rolling equipment for rolling to obtain the rolled circuit board. Rolling can drive out the air between the adhesive and the L2 layer, reducing the problem of uncompacted pressing due to residual air between the layers. Among them, the role of the release film is to reduce the adhesive on the copper surface, and the role of the film is to increase the coating and filling effect.

[0073] S330, tear off the protective film on the adhesive, use the adhesive to adhere the first surface of the rolled circuit board and the single-sided board, put the adhered circuit board into a press for pressing, and obtain the three-layer circuit board.

[0074] Specifically, the press can be but not limited to a four-opening press, and the press equipment consumable structure can be but not limited to an upper mold of silicon aluminum foil and a lower mold of sintered iron plate + coarse glass fiber cloth + green silica gel.

[0075] like Figure 7 As shown, Figure 7 The schematic diagram is a schematic diagram of the structure of a circuit board after being nailed, and step S330 specifically includes the following steps:

[0076] S331, configuring the press to a first pressure and a first temperature, and performing a first pressing on the bonded circuit board at the first pressure and the first temperature to obtain a first pressed circuit board.

[0077] The first pressure is a relatively small pressure, and the first temperature is a relatively small temperature. The first pressure is smaller than the second pressure of the second pressing, and the first temperature is smaller than the second temperature of the second pressing.

[0078] Specifically, the press is configured to a first pressure and a first temperature, and the bonded circuit board is subjected to a first pressing at the first pressure and the first temperature, the air between the line spacing of the L2 layer and the adhesive is discharged, and the adhesive is pressed tightly with L1 and L2 to obtain a circuit board after the first pressing.

[0079] S332, inserting the first pressed circuit board into the connecting pins to obtain a circuit board after the pins are inserted.

[0080] Specifically, the carrier film of the adhesive is torn off, and the pins are inserted through the double-sided board, the adhesive layer ( Figure 7 ADL2 layer in the middle) and single-sided board L1 are used to obtain the circuit board after nailing.

[0081] S333, configuring the press machine to a second pressure and a second temperature, and performing a second pressing on the nailed circuit board at the second pressure and the second temperature to obtain the three-layer circuit board.

[0082] Specifically, Figure 8 As shown, Figure 8 The invention is a schematic diagram of the structure after wrapping a circuit board after nailing; in the present embodiment, before the second pressing, because the product is a multi-layer soft board, in order to ensure that the product does not deform and expands and shrinks stably, a release film, a first glass fiber cloth and a silicon-aluminum foil are sequentially wrapped on one side of the circuit board after nailing or one side of the pressing roller of the pressing device, and a first glass fiber cloth, a second glass fiber cloth and a sintered iron plate are sequentially wrapped on the other side of the circuit board after nailing or the other side of the pressing roller of the pressing device to obtain a wrapped circuit board, wherein the fiber fineness of the first glass fiber cloth is greater than that of the second glass fiber cloth.

[0083] The press is configured to the second pressure and the second temperature, the wrapped circuit board is placed in the press, or the nailed circuit board is placed in the wrapped press, and high-temperature pressing is performed to obtain a three-layer circuit board.

[0084] The implementation of the present invention includes the following beneficial effects: the present invention sets a first copper-cut area, and after the copper-cutting, the first copper-cut area has one less layer of copper compared with the part without the copper-cutting. If the first copper-cut area can be compacted, it is considered that other areas can also be compacted. It is not necessary to etch away the outer copper layer of the product to confirm whether there is a problem of uncompacted compaction between the inner layer circuits, which can reduce the confirmation time and reduce the damage to the three-layer board.

[0085] The present invention also improves the structure of the pressing consumables equipment or the three-layer circuit board before the second pressing through step S333, which can reduce product deformation caused by the second pressing and achieve stable expansion and contraction.

[0086] like Fig. 9 As shown, Fig. 9 The present invention is a schematic diagram of a structure of a detection device for the lamination effect of a three-layer circuit board. The present invention also provides a detection device for the lamination effect of a three-layer circuit board, including a copper excavation device, a lamination device and an evaluation device, wherein:

[0087] The copper-cutting device is used to set a plurality of groups of detection pads on the first side of the original double-sided board, set a first copper-cutting area according to each group of detection pads, perform a first copper-cutting treatment on the first copper-cutting area, and obtain a second double-sided board; wherein each group of detection pads includes a plurality of detection pads; set a second copper-cutting area on the second side of the second double-sided board according to the first copper-cutting area, and perform a second copper-cutting treatment on the second copper-cutting area to obtain the first double-sided board;

[0088] The laminating device is used to laminar the single-layer PCB and the first double-layer PCB to obtain the three-layer PCB;

[0089] The evaluation device is used to determine the pressing effect of the three-layer circuit board according to the state of the first copper-cut area; the pressing effect of the three-layer circuit board includes pressing and not pressing.

[0090] Specifically, the copper-cutting device mainly implements step S100 and its subordinate steps, the pressing device mainly implements step S200 and its subordinate steps, and the evaluation device mainly implements step S300 and its subordinate steps.

[0091] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0092] The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application. In the present invention, the same or substantially equivalent methods between different embodiments are applicable to other embodiments.

Claims

1. A method for detecting the lamination effect of a three-layer circuit board, characterized in that: The three-layer circuit board includes a single-sided board and a first double-sided board, and includes the following steps: A plurality of groups of detection pads are arranged on the first surface of the original double-sided board, a first copper-cutting area is arranged according to each group of the detection pads, and a first copper-cutting process is performed on the first copper-cutting area to obtain a second double-sided board; wherein each group of detection pads includes a plurality of detection pads; According to the first copper-cut area, a second copper-cut area is provided on the second surface of the second double-sided board, and a second copper-cut process is performed on the second copper-cut area to obtain a first double-sided board; Laminating the single-layer circuit board and the first double-layer circuit board to obtain the three-layer circuit board; The pressing effect of the three-layer circuit board is determined according to the state of the first copper-cut area; the pressing effect of the three-layer circuit board includes pressing and not pressing.

2. The method according to claim 1, characterized in that Several groups of detection pads are set on the first side of the original double-sided board, including: Determine the position of each group of the detection pads on the first surface of the original double-sided board; The spacing between the detection pads is determined, and a plurality of detection pads are respectively arranged at the positions of each group of the detection pads according to the spacing.

3. The method according to claim 1, characterized in that The step of setting a first copper-cutting area according to each group of detection pads specifically includes: A first outward expansion area is expanded around each group of the detection pads on the first surface, and the gaps between the detection pads in each group of the detection pads and the first outward expansion area are set as the first copper hollowing area.

4. The method according to claim 1, characterized in that The step of setting a second copper-cut area on the second surface of the second double-sided board according to the first copper-cut area specifically includes: The boundary of the first copper-cut area is determined, and an area on the second surface of the second double-sided board aligned with the boundary is set as the second copper-cut area.

5. The method according to claim 1, characterized in that The first copper-cutting area is subjected to a first copper-cutting process to obtain a second double-sided board, specifically comprising: The copper in the first copper-cut area is removed by etching technology or laser technology to obtain the second double-sided board.

6. The method according to any one of claims 1 to 4, characterized in that: The laminating the single-sided board and the first double-sided board to obtain the three-layer circuit board specifically includes: Bonding the adhesive with the protective film to the first surface of the first double-sided board to obtain a glued circuit board; Putting the glued circuit board into a rolling device for rolling to obtain a rolled circuit board; The protective film on the adhesive is torn off, and the first surface of the rolled circuit board and the single-sided board are adhered to each other using the adhesive. The adhered circuit board is placed in a press for lamination to obtain the three-layer circuit board.

7. The method according to claim 6, characterized in that The step of placing the bonded circuit boards into a press for lamination to obtain the three-layer circuit board specifically includes: The press is configured to have a first pressure and a first temperature, and the bonded circuit boards are first pressed at the first pressure and the first temperature to obtain a first pressed circuit board; Inserting the first pressed circuit board into the connecting pins to obtain a circuit board after inserting the pins; The press is configured to a second pressure and a second temperature, and the nailed circuit board is subjected to a second pressing at the second pressure and the second temperature to obtain the three-layer circuit board; wherein the first pressure is less than the second pressure, and the first temperature is less than the second temperature.

8. The method according to claim 7, characterized in that The second pressing is performed on the nailed circuit board at the second pressure and the second temperature to obtain the three-layer circuit board, specifically comprising: A release film, a first glass fiber cloth and a silicon-aluminum foil are sequentially wrapped on one side of the circuit board after the nailing, and a first glass fiber cloth, a second glass fiber cloth and a sintered iron plate are sequentially wrapped on the other side of the circuit board after the nailing to obtain a wrapped circuit board; the fiber fineness of the first glass fiber cloth is greater than that of the second glass fiber cloth; The wrapped circuit board is subjected to a second pressing step at the second pressure and the second temperature to obtain the three-layer circuit board.

9. The method according to claim 1, characterized in that: The step of determining the lamination effect of the three-layer circuit board according to the state of the first copper-cut area specifically includes: If the state of the first copper-cut area is a compacted state, determining that the pressing effect of the three-layer circuit board is compacted; If the state of the first copper-cut area is an uncompacted state, it is determined that the pressing effect of the three-layer circuit board is an uncompacted state.

10. A device for detecting the lamination effect of a three-layer circuit board, characterized in that: Including copper mining equipment, pressing equipment and evaluation equipment, among which, The copper-cutting device is used to set a plurality of groups of detection pads on the first side of the original double-sided board, set a first copper-cutting area according to each group of detection pads, perform a first copper-cutting treatment on the first copper-cutting area, and obtain a second double-sided board; wherein each group of detection pads includes a plurality of detection pads; set a second copper-cutting area on the second side of the second double-sided board according to the first copper-cutting area, and perform a second copper-cutting treatment on the second copper-cutting area to obtain the first double-sided board; The laminating device is used to laminar the single-layer PCB and the first double-layer PCB to obtain the three-layer PCB; The evaluation device is used to determine the pressing effect of the three-layer circuit board according to the state of the first copper-cut area; the pressing effect of the three-layer circuit board includes pressing and not pressing.

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