Display device

Abstract

A display device includes: a light emitting element layer on a substrate; a light control layer on the light emitting element layer, the light control layer including a light transmitting film and a light shielding film; and a first alignment mark between the substrate and the light control layer; the light-transmitting film and the light-shielding film alternate with each other, the light control layer includes a light-shielding film removal region in which the light-shielding film is not disposed, and the light-shielding film removal region overlaps the first alignment mark.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0087715 filed in the Korean Intellectual Property Office on July 6, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device. Background Art

[0004] With the development of the information age, the demand for display devices for displaying images has increased in various forms. The display device may be a flat panel display device, such as a liquid crystal display device, a field emission display device, and a light-emitting display device. The light-emitting display device may include an organic light-emitting display device or a light-emitting diode display device, and the organic light-emitting display device may include an organic light-emitting diode element as a light-emitting element, and the light-emitting diode display device may include a light-emitting diode (LED) such as an inorganic light-emitting diode as a light-emitting element.

[0005] In the case of a display device for a vehicle, in the case where an image displayed in the display device for a vehicle placed in front of a driver or a passenger is reflected on a windshield at night, since it may disturb the driver's driving, it is necessary to control the viewing angle of the image displayed in the display device for a vehicle. For privacy protection, it is necessary to control the viewing angle of the image displayed in the display device for a vehicle so that the image displayed in the display device for a vehicle placed in front of the driver is not provided to the passenger.

[0006] It will be understood that this background technology section is intended, in part, to provide a useful background for understanding the technology. However, this background technology section may also include concepts, ideas or perceptions of parts that were not known or appreciated by a person skilled in the relevant art before the corresponding effective filing date of the subject matter disclosed herein. Summary of the invention

[0007] An object of the present disclosure is to provide a display device having improved recognition of an alignment mark.

[0008] Another object of the present disclosure is to provide a display device that improves alignment accuracy between components during a bonding process.

[0009] The objects of the present disclosure are not limited to those mentioned above, and additional objects of the present disclosure will be clearly understood by those skilled in the art from the following description of the present disclosure.

[0010] According to one aspect of the present disclosure, a display device may include: a light-emitting element layer, disposed on a substrate; a light-control layer, disposed on the light-emitting element layer, the light-control layer including a light-transmitting film and a light-shielding film; and a first alignment mark, between the substrate and the light-control layer, wherein the light-transmitting film and the light-shielding film may alternate with each other, the light-control layer may include a light-shielding film removal area, in which the light-shielding film is not disposed, and the light-shielding film removal area may overlap with the first alignment mark.

[0011] In an embodiment, the first alignment mark may not overlap with the light shielding film.

[0012] In an embodiment, the light shielding film may extend in at least one direction in a plan view, and the light shielding film may be disconnected in the light shielding film removal region.

[0013] In an embodiment, the display device may further include: a display area including a plurality of light emitting elements and a non-display area on one side of the display area, wherein the light shielding film removal area may be provided in the non-display area.

[0014] In an embodiment, the light shielding film removal area may have a light transmittance greater than a light transmittance of a portion of the light control layer, the portion of the light control layer being disposed in the display area.

[0015] In an embodiment, a width of the light-transmitting film in the light-shielding film removal area may be greater than a width of the light-transmitting film in the display area.

[0016] In an embodiment, in a plan view, a size of the light control layer may be larger than a size of the display area.

[0017] In an embodiment, a size of the light shielding film removal area may be greater than or equal to a size of the first alignment mark.

[0018] In an embodiment, the display device may further include: a thin film transistor layer disposed between the substrate and the light emitting element layer, wherein the first alignment mark may be disposed on the thin film transistor layer.

[0019] In an embodiment, the display device may further include: a touch sensor layer disposed between the light emitting element layer and the light control layer, wherein the first alignment mark may be disposed on the touch sensor layer.

[0020] In an embodiment, the display device may further include: an upper member, on the light control layer, the upper member including a second alignment mark, wherein the second alignment mark may overlap with the light shielding film removal area.

[0021] In an embodiment, the first alignment mark may overlap with the second alignment mark.

[0022] According to aspects of the present disclosure, a display device may include: a light-emitting element layer, disposed on a substrate; a light-control layer, disposed on the light-emitting element layer, the light-control layer including a light-transmitting film and a light-shielding film; and an upper member, disposed on the light-control layer, the upper member including a first alignment mark, wherein the light-transmitting film and the light-shielding film may alternate with each other, the light-control layer may include a light-shielding film removal area, in which the light-shielding film is not disposed, and the light-shielding film removal area may overlap with the first alignment mark.

[0023] In an embodiment, the first alignment mark may not overlap with the light shielding film.

[0024] In an embodiment, the light shielding film may extend in at least one direction in a plan view, and the light shielding film may be disconnected in the light shielding film removal region.

[0025] In an embodiment, a size of the light shielding film removal area may be greater than or equal to a size of the first alignment mark.

[0026] According to one aspect of the present disclosure, a display device may include: a display area and a non-display area on one side of the display area; a light-emitting element layer, arranged on a substrate; and a light-control layer, arranged on the light-emitting element layer, the light-control layer including a light-transmitting film and a light-shielding film, wherein the light-control layer includes: a plurality of transmission areas, in which the light-shielding film is not arranged; a plurality of non-transmission areas, in which the light-shielding film is arranged, and the plurality of non-transmission areas alternate with the plurality of transmission areas; and a first area, in which the light-shielding film is not arranged in the non-display area, and a width of the first area may be greater than a width of one of the plurality of transmission areas.

[0027] In an embodiment, the display device may further include: an alignment mark on the non-display area, wherein the first area may overlap with the alignment mark.

[0028] In an embodiment, a size of the first region may be greater than or equal to a size of the alignment mark.

[0029] In an embodiment, in a plan view, a size of the light control layer may be larger than a size of the display area.

[0030] The display device according to one embodiment can improve the recognition of the alignment mark.

[0031] The display device according to one embodiment may improve alignment accuracy between components during a bonding process.

[0032] The effects according to the embodiments of the present disclosure are not limited to those mentioned above, and more various effects are included in the following description of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The above and other aspects and features of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0034] Figure 1 is an exploded perspective view showing a display device according to one embodiment;

[0035] Figure 2 is a schematic plan view showing a display device according to an embodiment;

[0036] Figure 3 is an exploded perspective view showing a display device according to an embodiment;

[0037] Figure 4 It is shown along Figure 2 A schematic cross-sectional view of the display device taken along line X1-X1';

[0038] Figure 5 is a schematic cross-sectional view showing an example of a display panel according to an embodiment;

[0039] Figure 6 is a schematic plan view showing a display panel according to an embodiment;

[0040] Figure 7 It is along Figure 6 A schematic cross-sectional view taken along line X2-X2';

[0041] Figure 8 and Fig. 9 It is along Figure 6 A schematic cross-sectional view taken along line X3-X3';

[0042] Fig.10 is a schematic cross-sectional view showing a bonding process of a display device according to an embodiment;

[0043] Fig.11 is a schematic plan view showing a display device according to an embodiment;

[0044] Fig.12 It is along Fig.11 A schematic cross-sectional view taken along line X4-X4';

[0045] Fig.13is a schematic cross-sectional view showing a bonding process of a display device according to an embodiment;

[0046] Fig.14 is a schematic plan view showing an alignment process of a second alignment mark and a light shielding film removal region of a display device according to an embodiment; and

[0047] Figures 15 to 17 is a schematic plan view showing a display device according to other embodiments. DETAILED DESCRIPTION

[0048] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments are shown. However, the present disclosure may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete and will fully convey the scope of the present disclosure to those skilled in the art.

[0049] In the drawings, the size, thickness, ratio, and dimensions of elements may be exaggerated for convenience of description and clarity. The same reference numerals refer to the same elements throughout.

[0050] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0051] In the specification and claims, for the purpose of its meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" may be understood to mean "A, B, or A and B". The terms "and" and "or" may be used in a conjunction or disjunction sense and may be understood to be equivalent to "and / or".

[0052] In the specification and claims, for the purpose of its meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group of..." For example, "at least one of A and B" can be understood to mean "A, B, or A and B".

[0053] It should be understood that, although the terms first, second, etc. may be used to describe various elements in this article, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0054] The term "overlap" or "overlapped" means that a first object may be above or below a second object or on one side of the second object, and vice versa. In addition, the term "overlap" may include stacking, stacking, facing or facing, extending over, covering or partially covering, or any other suitable term as will be appreciated and understood by a person of ordinary skill in the art.

[0055] When an element is described as “not overlapping or to not overlap” another element, this may include the elements being spaced apart, offset or separated from each other or any other suitable terminology as would be appreciated and understood by one of ordinary skill in the art.

[0056] The terms "facing" and "facing" mean that the first element may be directly or indirectly opposite to the second element. In the case where a third element is interposed between the first and second elements, the first and second elements may be understood to be indirectly opposite to each other, but still facing each other.

[0057] When used in this specification, the terms “comprises, comprising,” “includes, including,” and / or “has, have, having,” and variations thereof indicate the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0058] It will also be understood that when a layer or substrate is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers or substrates may also be present. Throughout the specification, the same reference numerals refer to the same components.

[0059] It should be understood that when an element (or region, layer or part, etc.) is referred to as being "on" another element, "connected to" or "coupled to" another element in the specification, the element can be directly set on the other element, directly connected to or directly coupled to the other element, or an intermediate element can be set between the element and the other element.

[0060] It should be understood that the terms “connected to” or “coupled to” may include a physical connection or physical coupling or an electrical connection or electrical coupling.

[0061] As used herein, "about" or "approximately" includes the stated value and means within the range of acceptable deviations for the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0062] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that, unless explicitly defined herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formalized sense.

[0063] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0064] Figure 1 is an exploded perspective view showing a display device according to one embodiment. Figure 2 is a schematic plan view showing a display device according to an embodiment. Figure 3 1 is an exploded perspective view showing a display device according to an embodiment. Figure 2 Omitted Figure 1 The upper member UM shown in .

[0065] Reference Figures 1 to 3 The display device 10 is a device that displays a moving image or a still image, and can be used as a display screen for various products such as a television, a laptop computer, a monitor, an advertising board, and a device for the Internet of Things (IoT), and a portable electronic device such as a mobile phone, a smart phone, a tablet personal computer (PC), a smart watch, a watch phone, a mobile communication terminal, an electronic diary, an electronic book, a portable multimedia player (PMP), a navigator, and an ultra mobile PC (UMPC). The display device 10 may be any one of an organic light emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light emitting display device, and a micro LED display device. The following description will be based on the display device 10 being an organic light emitting display device, but the present disclosure is not limited thereto.

[0066] The display device 10 according to one embodiment may include a display panel 100 , a display driving circuit 250 , a circuit board 300 , and a touch driving circuit 400 .

[0067] The display panel 100 may include pixels PX arranged or disposed in the first direction DR1 and the second direction DR2. Each of the plurality of pixels PX may have a planar shape such as a rectangular shape, a square shape, or a diamond shape. For example, as shown in the accompanying drawings, each of the plurality of pixels PX may have a square planar shape, but the present disclosure is not limited thereto. Each of the plurality of pixels PX may have various shapes on a plane such as another polygonal shape, a circular shape, and an elliptical shape.

[0068] In the drawings shown, the first direction DR1 and the second direction DR2 are horizontal directions and intersect each other. For example, the first direction DR1 and the second direction DR2 may be orthogonal to each other. The third direction DR3 intersects the first direction DR1 and the second direction DR2 and may be, for example, a vertical direction orthogonal to the first direction DR1 and the second direction DR2.

[0069] The display panel 100 may include a main area MA and a protrusion area PA protruding from one side of the main area MA.

[0070] The main area MA may be formed in a rectangular shape having short sides in a first direction DR1 and long sides in a second direction DR2 intersecting the first direction DR1. Corners where the short sides in the first direction DR1 and the long sides in the second direction DR2 intersect may be rounded to have an optional curvature or formed at right angles. The planar shape of the display device 10 is not limited to a rectangular shape, and may be formed in another polygonal shape, a circular shape, or an elliptical shape. The main area MA may be formed to be flat, but is not limited thereto. The main area MA may include curved portions formed at the left and right ends. The curved portion may have a constant curvature or a variable curvature.

[0071] The main area MA may include a display area DA in which pixels PX are formed to display an image and a non-display area NDA which is a peripheral area of ​​the display area DA.

[0072] Scan lines, data lines, and power lines connected to the pixels PX, and the pixels PX may be disposed in the display area DA. In the case where the main area MA may include a curved portion, the display area DA may be disposed in the curved portion. An image of the display panel 100 may be observed even in the curved portion.

[0073] The non-display area NDA may be defined as a region from the outside of the display area DA to the edge of the display panel 100. A scan driver for applying a scan signal to a scan line and a link line for connecting a data line with the display driving circuit 250 may be disposed in the non-display area NDA.

[0074] The protruding area PA may protrude from one side of the main area MA. Figure 2 As shown in , the protrusion area PA may protrude from the lower side of the main area MA. A length of the protrusion area PA in the first direction DR1 may be shorter than a length of the main area MA in the first direction DR1.

[0075] The protruding area PA may include a bending area BA and a pad area PDA. The pad area PDA may be disposed on one side of the bending area BA, and the main area MA may be disposed on the other side of the bending area BA. For example, in a plan view, the pad area PDA may be disposed below the bending area BA, and the main area MA may be disposed above the bending area BA.

[0076] The display panel 100 may be flexibly formed to be curved, bent, folded, or curled. Therefore, the display panel 100 may be bent in the thickness direction (e.g., the third direction DR3) in the bending area BA. Before the display panel 100 is bent, the surface of the pad area PDA of the display panel 100 is oriented upward, but after the display panel 100 is bent, the surface of the pad area PDA of the display panel 100 is oriented downward. As a result, the pad area PDA is disposed below the main area MA and may thus overlap the main area MA.

[0077] Pads electrically connected to the display driving circuit 250 and the circuit board 300 may be provided in the pad area PDA of the display panel 100 .

[0078] The display driving circuit 250 outputs a signal and a voltage for driving the display panel 100. For example, the display driving circuit 250 may supply a data voltage to a data line. The display driving circuit 250 may supply a power supply voltage to a power line and supply a scan control signal to a scan driver. The display driving circuit 250 may be formed by an integrated circuit (IC) and may be mounted on the display panel 100 in a pad region PDA in a chip on glass (COG) mode, a chip on plastic (COP) mode, or an ultrasonic bonding mode, but is not limited thereto. For example, the display driving circuit 250 may be mounted on a circuit board 300.

[0079] The pads may include a display pad electrically connected to the display driving circuit 250 and a touch pad electrically connected to the touch line.

[0080] The circuit board 300 may be attached to the pad by using an anisotropic conductive film. Therefore, the leads of the circuit board 300 may be electrically connected to the pad. The circuit board 300 may be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip on film.

[0081] The touch driving circuit 400 may be connected to the touch sensor layer TSU (see FIG. Figure 4) of the touch electrode. The touch drive circuit 400 sends a signal to the touch sensor layer TSU (see Figure 4 ) applies a driving signal to the touch electrode of the touch electrode and measures the capacitance value of the touch electrode. The driving signal may be a signal having a driving pulse. The touch driving circuit 400 may determine whether a touch is input according to the capacitance value and may calculate the touch coordinates to which the touch is input.

[0082] The touch driving circuit 400 may be provided on the circuit board 300. The touch driving circuit 400 may be formed of an integrated circuit (IC) and mounted on the circuit board 300.

[0083] In the display device 10 according to the embodiment, the display panel 100 may further include a light control layer LCL.

[0084] The light control layer LCL may be directly disposed in the main area MA of the display panel 100. For example, the light control layer LCL may be embedded in the display panel 100 and directly disposed in the main area MA of the display panel 100. Since the light control layer LCL is embedded in the display panel 100, the thickness and manufacturing cost of the display device 10 may be reduced compared to a case where a separate light control film is attached.

[0085] However, the light control layer LCL is not limited to the above example, and the light control layer LCL may be configured separately from the display panel 100 and attached to the display panel 100 in the form of a light control film. Hereinafter, for convenience of description, the case where the light control layer LCL is embedded in the display panel 100 will be described as an example.

[0086] In an embodiment, the light control layer LCL may be disposed in the display area DA and the non-display area NDA of the main area MA. For example, as shown in the accompanying drawings, on a plane, the size of the light control layer LCL may be larger than the size of the display area DA. Therefore, the light control layer LCL may be disposed throughout both the display area DA and the non-display area NDA.

[0087] The light control layer LCL may adjust a viewing angle of light emitted from the display panel 100. The light control layer LCL may include a transmission area OA arranged or disposed in the first direction DR1 and the second direction DR2 and a non-transmission area LSA surrounding the transmission area OA.

[0088] The transmission area OA may be a region where the light shielding film LS is not provided (see Figure 7 The transmission area OA may extend along the third direction DR3 to a region through which light is transmitted.

[0089] like Figure 1 and Figure 2As shown in , each of the plurality of transmission areas OA may have a rectangular shape in plane, but is not limited thereto. Each of the plurality of transmission areas OA may have a circular shape, an elliptical shape, or another polygonal shape in plane.

[0090] In an embodiment, the transmission area OA may have a shape extending in the first direction DR1 or the second direction DR2. Figure 3 As shown in , the transmission area OA may extend in the first direction DR1 and may be disposed along the second direction DR2. For another example, the transmission area OA may extend in the second direction DR2 and may be disposed along the first direction DR1.

[0091] like Figure 1 As shown in , in the case where the transmission area OA is arranged along the first direction DR1 and the second direction DR2, the viewing angle can be controlled in both the first direction DR1 and the second direction DR2. Figure 3 As shown in , when the transmission area OA is arranged along the first direction DR1 or the second direction DR2, the viewing angle can be controlled in the first direction DR1 or the second direction DR2. For example, the arrangement and shape of the transmission area OA may be variously modified depending on the desired control direction of the viewing angle.

[0092] The non-transmission area LSA may be a remaining area of ​​the light control layer LCL except the transmission area OA. The non-transmission area LSA may be a region in which the light shielding film LS (see Figure 7 ) area.

[0093] In the drawings, the non-transmission area LSA is shown as being disposed to surround the transmission area OA, but is not limited thereto. In an embodiment, the non-transmission area LSA may extend in the same direction as the transmission area OA and may be disposed to alternate with the transmission area OA. Figure 3 As shown in FIG. 5 , in the case where the transmission area OA extends in the first direction DR1 , the non-transmission area LSA may extend in the first direction DR1 and may be disposed to alternate with the transmission area OA in the second direction DR2 .

[0094] The light control layer LCL may include a light emitting layer 172 (see FIG. Figure 5 ) light shielding film LS (see Figure 7 ) and a light-transmitting film LT (see Figure 7 ). The detailed structure of the light control layer LCL will be referred to later. Figure 6 describe.

[0095] The display device 10 may further include an upper member UM. The upper member UM may include functional layers such as optical members and a cover window. The upper member UM may be additionally disposed on the light control layer LCL. The light control layer LCL and the upper member UM may be attached to each other by a transparent adhesive member such as a pressure sensitive adhesive (PSA) film and an optically clear adhesive (OCA) film.

[0096] In the drawings, the size of the upper member UM is shown to be the same as that of the light control layer LCL, but is not limited thereto. For example, the size of the upper member UM may be larger than that of the light control layer LCL and the display panel 100, and may cover the upper surface and side surfaces of the light control layer LCL and the display panel 100.

[0097] Figure 4 It is shown along Figure 2 Schematic cross-sectional view of the display device taken along line X1-X1'.

[0098] Reference Figure 4 , the display device 10 may include a display panel 100 in which a light control layer LCL is embedded. The display panel 100 may include a display layer DU, a touch sensor layer TSU, and a light control layer LCL. The display layer DU may include a base member BS, a thin film transistor layer TFTL, a light emitting element layer EML, and a thin film encapsulation layer TFEL.

[0099] The base member BS may include a substrate. The substrate may be made of an insulating material such as glass, quartz or a polymer resin. Examples of polymer materials include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP) or a combination thereof. Alternatively, the substrate may include a metal material.

[0100] Within the spirit and scope of the present disclosure, the substrate may be a rigid substrate, or may be a flexible substrate capable of being subjected to bending, folding, curling, etc. In the case where the substrate is a flexible substrate, the substrate may be formed of polyimide (PI), but is not limited thereto.

[0101] The thin film transistor layer TFTL may be disposed on the base member BS. Scan lines, data lines, power lines, scan control lines, routing lines connecting pads with data lines, etc., and thin film transistors of each pixel may be formed in the thin film transistor layer TFTL. Each of the plurality of thin film transistors may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode.

[0102] The thin film transistor layer TFTL may be disposed in the display area DA and the non-display area NDA. In detail, the thin film transistors of each pixel of the thin film transistor layer TFTL, the scan lines, the data lines, and the power lines may be disposed in the display area DA. The scan control lines and the connection lines of the thin film transistor layer TFTL may be disposed in the non-display area NDA.

[0103] The light emitting element layer EML may be disposed on the thin film transistor layer TFTL. The light emitting element layer EML may include a light emitting element including a first electrode, a light emitting layer, and a second electrode, and a pixel defining layer for defining a pixel. The light emitting layer may be an organic light emitting layer including an organic material. The light emitting layer may include a hole transport layer, an organic light emitting layer, and an electron transport layer. When an optional voltage is applied to the first electrode through the thin film transistor of the thin film transistor layer TFTL and a cathode voltage is applied to the second electrode, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and recombine with each other in the organic light emitting layer to emit light. The light emitting element of the light emitting element layer EML may be disposed in the display area DA.

[0104] The thin film encapsulation layer TFEL may be disposed on the light emitting element layer EML. The thin film encapsulation layer TFEL may be used to prevent oxygen or moisture from penetrating into the light emitting element layer EML. To this end, the thin film encapsulation layer TFEL may include at least one inorganic layer. The inorganic layer may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but is not limited thereto. The thin film encapsulation layer TFEL may be used to protect the light emitting element layer EML from particles such as dust. To this end, the thin film encapsulation layer TFEL may include at least one organic layer. The organic layer may be an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, or a polyimide resin layer, but is not limited thereto.

[0105] The thin film encapsulation layer TFEL may be disposed in both the display area DA and the non-display area NDA. In detail, the thin film encapsulation layer TFEL may be disposed to cover the light emitting element layer EML of the display area DA and to cover the thin film transistor layer TFTL of the non-display area NDA.

[0106] The touch sensor layer TSU may be disposed on the thin film encapsulation layer TFEL. Since the touch sensor layer TSU is directly disposed on the thin film encapsulation layer TFEL, the thickness of the display device 10 may be reduced compared to a case where a separate touch panel including the touch sensor layer TSU is attached to the thin film encapsulation layer TFEL.

[0107] The touch sensor layer TSU may include a touch electrode for sensing a user's touch in a capacitive manner and a touch wire for connecting a pad with the touch electrode. For example, the touch sensor layer TSU may sense a user's touch in a self-capacitive manner or a mutual-capacitive manner.

[0108] The touch electrodes of the touch sensor layer TSU may be disposed in the touch sensor area overlapping the display area DA. The touch wires of the touch sensor layer TSU may be disposed in the touch peripheral area overlapping the non-display area NDA.

[0109] The light control layer LCL may be disposed on the touch sensor layer TSU. The light control layer LCL may be disposed in the display area DA and the non-display area NDA. The light control layer LCL may be used to absorb or shield light emitted from the light emitting element layer EML that leaves an optional angle relative to the third direction DR3. For example, the light control layer LCL may control the viewing angle.

[0110] The display device 10 may further include an upper member UM. The upper member UM may include functional layers such as optical members and a cover window. The upper member UM may be additionally disposed on the light control layer LCL. The light control layer LCL and the upper member UM may be attached to each other by a transparent adhesive member such as a pressure sensitive adhesive (PSA) film and an optically clear adhesive (OCA) film.

[0111] In an embodiment, the display panel 100 may include a display area DA and a non-display area NDA. The non-display area NDA may include a first non-display area NDA1 and a second non-display area NDA2.

[0112] The first non-display area NDA1 may be an area overlapping at least a portion of the light control layer LCL. The second non-display area NDA2 may be an area not overlapping the light control layer LCL.

[0113] The first non-display area NDA1 may be disposed at one side of the display area DA. The first non-display area NDA1 may be disposed to surround the display area DA. The second non-display area NDA2 may be disposed at one side of the first non-display area NDA1. The second non-display area NDA2 may be disposed to surround the first non-display area NDA1.

[0114] In an embodiment, the thin film transistor layer TFTL, the touch sensor layer TSU, the light control layer LCL, and the upper member UM may be disposed in the display area DA and the first non-display area NDA1. For example, the width W1 of the thin film transistor layer TFTL, the touch sensor layer TSU, the light control layer LCL, and the upper member UM may be greater than the width of the display area DA.

[0115] The display device 10 may include a first alignment mark MRK1 and a second alignment mark MRK2 disposed in the first non-display area NDA1.

[0116] The first alignment mark MRK1 may be included in the display panel 100. For example, the first alignment mark MRK1 may be disposed in the thin film transistor layer TFTL of the display panel 100. The second alignment mark MRK2 may be included in the upper member UM.

[0117] In an embodiment, the first alignment mark MRK1 may be formed of the same material on the same layer as at least one of the plurality of line layers of the thin film transistor layer TFTL, which will be described later. For example, the first alignment mark MRK1 may be aligned with a lower metal layer BML (see Figure 5 ), the first gate electrode TG1 (see Figure 5 ), the first capacitor electrode CAE1 (see Figure 5 ), the first anode connection electrode ANDE1 (see Figure 5 ) or the second anode connection electrode ANDE2 (see Figure 5 ) is formed of the same material on the same layer, which will be referred to later. Figure 5 describe.

[0118] The first alignment mark MRK1 and the second alignment mark MRK2 may overlap each other in the third direction DR3. In the display device 10 according to the embodiment, during the bonding process of the upper member UM and the display panel 100, the recognition device MRD (see FIG. Fig.10 ) identifies the first alignment mark MRK1 and the second alignment mark MRK2 so that the upper member UM and the display panel 100 can be correctly aligned.

[0119] In the display device 10 according to the embodiment, the light control layer LCL may include the light shielding film removal area SRA to improve recognition of the first alignment mark MRK1 and the second alignment mark MRK2 .

[0120] The light shielding film removal area SRA may be a region in which a light shielding film LS (see FIG. Figure 7 ) area. Transparent film LT (see Figure 7 ) may be disposed in the light shielding film removal area SRA. The light shielding film removal area SRA may have a higher light transmittance than other areas in which the light shielding film LS is disposed.

[0121] The light shielding film removal area SRA may overlap the first and second alignment marks MRK1 and MRK2 in the third direction DR3. Therefore, during the bonding process of the display device 10, alignment accuracy between the upper member UM and the display panel 100 may be improved.

[0122] In an embodiment, a size of the light shielding film removal area SRA may be greater than or equal to a size of the first alignment mark MRK1 and a size of the second alignment mark MRK2 .

[0123] In the present disclosure, the bonding process has been described based on the upper member UM disposed on the display panel 100, but is not limited thereto. For example, even if a lower member disposed below the display panel 100 is used for the bonding process, the second alignment mark MRK2 included in the lower member and the first alignment mark MRK1 included in the display panel 100 may be identified in the same manner as in the case of the upper member UM.

[0124] Figure 5 is a schematic cross-sectional view showing an example of a display panel according to an embodiment. Figure 5 For the convenience of description, the light control layer LCL is omitted (see Figure 4 ).

[0125] Reference Figure 5 The display panel 100 may include a display layer DU and a touch sensor layer TSU. The display layer DU may include a base member BS, a thin film transistor layer TFTL, a light emitting element layer EML, and a thin film encapsulation layer TFEL.

[0126] The base member BS may include a first substrate SUB1, a first buffer layer BF1 disposed on the first substrate SUB1, and a second substrate SUB2 disposed on the first buffer layer BF1.

[0127] The first substrate SUB1 and the second substrate SUB2 may be made of an insulating material such as glass, quartz or a polymer resin. Examples of polymer materials include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP) or a combination thereof. Alternatively, the substrate may include a metal material.

[0128] Within the spirit and scope of the present disclosure, each of the first substrate SUB1 and the second substrate SUB2 may be a rigid substrate, or may be a flexible substrate capable of being bent, folded, or curled, etc. In the case where the substrate is a flexible substrate, the substrate may be formed of polyimide (PI), but is not limited thereto.

[0129] The first buffer layer BF1 may be a layer for protecting the first thin film transistor ST1 and the light emitting layer 172 from moisture that penetrates through the first substrate SUB1 and the second substrate SUB2 susceptible to moisture penetration. The first buffer layer BF1 may include inorganic layers that may be alternately stacked with each other. For example, the first buffer layer BF1 may be formed of a multilayer in which one or more inorganic layers of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer may be alternately stacked with each other.

[0130] The thin film transistor layer TFTL may include a lower metal layer BML, a second buffer layer BF2, a first thin film transistor ST1, a first gate insulating layer GI1, a first interlayer insulating layer 141, a first capacitor electrode CAE1, a second interlayer insulating layer 142, a first anode connection electrode ANDE1, a first organic layer 160, a second anode connection electrode ANDE2, and a second organic layer 180. The interlayer insulating layer 140 may include a first interlayer insulating layer 141 and a second interlayer insulating layer 142.

[0131] The lower metal layer BML may be disposed on the second substrate SUB2. The lower metal layer BML may be disposed to overlap with the first active layer ACT1 of the first thin film transistor ST1 in the third direction DR3 to prevent leakage current from occurring when light is incident on the first active layer ACT1 of the first thin film transistor ST1. The lower metal layer BML may be formed of a single layer or multiple layers made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. The lower metal layer BML may be omitted.

[0132] The second buffer layer BF2 may be disposed on the lower metal layer BML. The second buffer layer BF2 is a layer for protecting the first thin film transistor ST1 and the light emitting layer 172 from moisture that penetrates through the first substrate SUB1 and the second substrate SUB2 susceptible to moisture penetration. The second buffer layer BF2 may include inorganic layers that may be alternately stacked with each other. For example, the second buffer layer BF2 may be formed of a multilayer in which one or more inorganic layers of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer may be alternately stacked with each other.

[0133] The first active layer ACT1 of the first thin film transistor ST1 may be disposed on the second buffer layer BF2. The first active layer ACT1 of the first thin film transistor ST1 may include polycrystalline silicon, single crystal silicon, low temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. Since the first active layer ACT1 of the first thin film transistor ST1 that is not covered by the first gate insulating layer GI1 and exposed is doped with impurities or ions, the first active layer ACT1 of the first thin film transistor ST1 may have conductivity. Therefore, a first source electrode TS1 and a first drain electrode TD1 of the first active layer ACT1 of the first thin film transistor ST1 may be formed.

[0134] The first gate insulating layer GI1 may be disposed on the first active layer ACT1 of the first thin film transistor ST1. Figure 5 , the first gate insulating layer GI1 is shown to be disposed between the first gate electrode TG1 of the first thin film transistor ST1 and the first active layer ACT1, but is not limited thereto. The first gate insulating layer GI1 may be disposed between the first interlayer insulating layer 141 and the first active layer ACT1, and between the first interlayer insulating layer 141 and the second buffer layer BF2. The first gate insulating layer GI1 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0135] The first gate electrode TG1 of the first thin film transistor ST1 may be disposed on the first gate insulating layer GI1. The first gate electrode TG1 of the first thin film transistor ST1 may overlap the first active layer ACT1 in the third direction DR3. The first gate electrode TG1 of the first thin film transistor ST1 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0136] The first interlayer insulating layer 141 may be disposed on the first gate electrode TG1 of the first thin film transistor ST1. The first interlayer insulating layer 141 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating layer 141 may include an inorganic layer.

[0137] The first capacitor electrode CAE1 may be disposed on the first interlayer insulating layer 141. The first capacitor electrode CAE1 may overlap with the first gate electrode TG1 of the first thin film transistor ST1 in the third direction DR3. Since the first interlayer insulating layer 141 has a selectable dielectric constant, a capacitor may be formed by the first capacitor electrode CAE1, the first gate electrode TG1, and the first interlayer insulating layer 141 disposed between the first capacitor electrode CAE1 and the first gate electrode TG1. The first capacitor electrode CAE1 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0138] The second interlayer insulating layer 142 may be disposed on the first capacitor electrode CAE1. The second interlayer insulating layer 142 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating layer 142 may include an inorganic layer.

[0139] The first anode connection electrode ANDE1 may be disposed on the second interlayer insulating layer 142. The first anode connection electrode ANDE1 may be connected to the first drain electrode TD1 of the first thin film transistor ST1 through the first anode contact hole ANCT1, which exposes the first drain electrode TD1 of the first thin film transistor ST1 by passing through the first interlayer insulating layer 141 and the second interlayer insulating layer 142. The first anode connection electrode ANDE1 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0140] The first organic layer 160 for planarization may be disposed on the first anode connection electrode ANDE 1. The first organic layer 160 may be formed of an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0141] The second anode connection electrode ANDE2 may be disposed on the first organic layer 160. The second anode connection electrode ANDE2 may be connected to the first anode connection electrode ANDE1 through a second anode contact hole ANCT2 that exposes the first anode connection electrode ANDE1 by passing through the first organic layer 160. The second anode connection electrode ANDE2 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0142] The second organic layer 180 may be disposed on the second anode connection electrode ANDE2. The second organic layer 180 may be formed of an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0143] exist Figure 5 In the embodiment, the first thin film transistor ST1 is formed in a top gate mode in which the first gate electrode TG1 is located above the first active layer ACT1, but is not limited thereto. The first thin film transistor ST1 may be formed in a bottom gate mode in which the first gate electrode TG1 is disposed below the first active layer ACT1 or in a dual gate mode in which the first gate electrode TG1 is disposed above and below the first active layer ACT1.

[0144] The light emitting element layer EML may be disposed on the second organic layer 180. The light emitting element layer EML may include a light emitting element 170 and a bank 190. Each of the plurality of light emitting elements 170 may include a first light emitting electrode 171, a light emitting layer 172, and a second light emitting electrode 173.

[0145] The first light emitting electrode 171 may be formed on the second organic layer 180 . The first light emitting electrode 171 may be connected to the second anode connection electrode ANDE2 through the third anode contact hole ANCT3 which exposes the second anode connection electrode ANDE2 by passing through the second organic layer 180 .

[0146] In a top emission structure based on the emission of light from the light emitting layer 172 toward the second light emitting electrode 173, the first light emitting electrode 171 may be formed of a metal material having high reflectivity such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0147] The bank 190 may be formed to separate the first light emitting electrode 171 on the second organic layer 180 for defining the light emitting area EA. The bank 190 may be formed to cover the edge of the first light emitting electrode 171. The bank 190 may be formed of an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0148] The emission area EA refers to a region where the first emission electrode 171, the emission layer 172, and the second emission electrode 173 are sequentially stacked on each other so that holes from the first emission electrode 171 and electrons from the second emission electrode 173 recombine with each other in the emission layer 172 to emit light.

[0149] The light emitting layer 172 is formed on the first light emitting electrode 171. The light emitting layer 172 may include an organic material to emit light of a selectable color. For example, the light emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0150] The second light emitting electrode 173 may be disposed on the light emitting layer 172 and the bank 190. The second light emitting electrode 173 may be formed to cover the light emitting layer 172. The second light emitting electrode 173 may be a common layer commonly formed in all the light emitting areas EA. In an embodiment, although not shown, a coating layer may be formed on the second light emitting electrode 173.

[0151] In the top emission structure, the second light emitting electrode 173 may be formed of a transparent conductive oxide (TCO) such as indium tin oxide (ITO) and indium zinc oxide (IZO) or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). In the case where the second light emitting electrode 173 is formed of a semi-transmissive conductive material, light emission efficiency may be improved by a microcavity.

[0152] The thin film encapsulation layer TFEL may be disposed on the second light emitting electrode 173. The thin film encapsulation layer TFEL may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the light emitting element layer EML. The thin film encapsulation layer TFEL may also include at least one organic layer to protect the light emitting element layer EML from particles such as dust. For example, the thin film encapsulation layer TFEL may include a first encapsulation layer TFE1, a second encapsulation layer TFE2, and a third encapsulation layer TFE3.

[0153] The first encapsulation layer TFE1 (e.g., a first inorganic encapsulation layer) may be disposed on the second light emitting electrode 173. The first encapsulation layer TFE1 may be a single-layer or multi-layer inorganic layer. The first encapsulation layer TFE1 may be formed of a single layer or a multi-layer, in which one or more inorganic layers of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer may be alternately stacked.

[0154] The second encapsulation layer TFE2 (e.g., the first organic encapsulation layer) may be disposed on the first encapsulation layer TFE1. The second encapsulation layer TFE2 may be a single-layer or multi-layer organic layer. The second encapsulation layer TFE2 may include a polymer material. The polymer material may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.), or any combination thereof.

[0155] The third encapsulation layer TFE3 (e.g., the second inorganic encapsulation layer) may be disposed on the second encapsulation layer TFE2. The third encapsulation layer TFE3 may be a single-layer or multi-layer inorganic layer. The third encapsulation layer TFE3 may include the same material as the first encapsulation layer TFE1. For example, the third encapsulation layer TFE3 may be formed of a single layer or a multi-layer, in which one or more inorganic layers of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer may be alternately stacked.

[0156] The touch sensor layer TSU may be disposed on the thin film encapsulation layer TFEL. The touch sensor layer TSU may include touch electrodes for sensing the touch of a user in a capacitive manner and touch lines for connecting the touch electrodes to a touch driving circuit. For example, the touch sensor layer TSU may sense the touch of a user in a mutual capacitance manner or a self-capacitance manner.

[0157] In an embodiment, the touch sensor layer TSU may be provided on a separate substrate provided on the display layer DU. The substrate for supporting the touch sensor layer TSU may be an encapsulation member for encapsulating the display layer DU.

[0158] The touch electrodes of the touch sensor layer TSU may be arranged in a manner parallel to the display area DA (see FIG. Figure 4 ). The touch line of the touch sensor layer TSU may be arranged in a touch sensor area overlapping with the non-display area NDA (see Figure 4 ) in the touch peripheral area that overlaps.

[0159] The touch sensor layer TSU may include a first touch insulating layer SIL1 , a first touch electrode REL, a second touch insulating layer SIL2 , a second touch electrode TEL, and a third touch insulating layer SIL3 .

[0160] The first touch insulating layer SIL1 may be disposed on the thin film encapsulation layer TFEL. The first touch insulating layer SIL1 may have insulating and optical functions. The first touch insulating layer SIL1 may include at least one inorganic layer. For example, the first touch insulating layer SIL1 may be an inorganic layer that may include at least one of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Optionally, the first touch insulating layer SIL1 may be omitted.

[0161] The first touch electrode REL may be disposed on the first touch insulating layer SIL1. The first touch electrode REL may not overlap the light emitting element 170. The first touch electrode REL may be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or indium tin oxide (ITO), or may be formed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0162] The second touch insulating layer SIL2 may cover the first touch electrode REL and the first touch insulating layer SIL1. The second touch insulating layer SIL2 may have insulating and optical functions. For example, the second touch insulating layer SIL2 may be formed of a material that may be used to form the first touch insulating layer SIL1 (eg, as discussed herein).

[0163] The second touch electrode TEL may be disposed on the second touch insulating layer SIL2. The second touch electrode TEL may not overlap the light emitting element 170. The second touch electrode TEL may be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or indium tin oxide (ITO), or may be formed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0164] The third touch insulating layer SIL3 may cover the second touch electrode TEL and the second touch insulating layer SIL2. The third touch insulating layer SIL3 may have insulating and optical functions. The third touch insulating layer SIL3 may be formed of a material that may be used to form the second touch insulating layer SIL2 (e.g., as discussed herein).

[0165] In an embodiment, the first touch insulating layer SIL1, the second touch insulating layer SIL2 and the third touch insulating layer SIL3 may be organic layers. For example, the first touch insulating layer SIL1, the second touch insulating layer SIL2 and the third touch insulating layer SIL3 may be organic layers such as acrylic resin layers, epoxy resin layers, phenolic resin layers, polyamide resin layers and polyimide resin layers.

[0166] The touch sensor layer TSU may further include a planarization layer PAS for planarization. The planarization layer PAS may be formed of an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer.

[0167] Figure 6 is a schematic plan view showing a display panel according to an embodiment. Figure 7 It is along Figure 6 Schematic cross-sectional view taken along line X2-X2'. Figure 8 and Fig. 9 It is along Figure 6 Schematic cross-sectional view taken along line X3-X3'.

[0168] exist Figure 6 In, similar to Figure 3 In the display device 10 of the embodiment, the case where the transmission area OA and the non-transmission area LSA extend in the first direction DR1 is shown as an example. Hereinafter, for the convenience of description, the case where the transmission area OA and the non-transmission area LSA extend in the first direction DR1 will be described as an example. For the convenience of description, only the main area MA of the display panel 100 is Figure 6 and highlighting the area PA (see Figure 3 ) is omitted.

[0169] Apart from Figures 1 to 3 In addition, refer to Figures 6 to 9 , the display panel 100 may include a display area DA and a non-display area NDA. The non-display area NDA may include a first non-display area NDA1 and a second non-display area NDA2. The light control layer LCL of the display panel 100 may be disposed in the display area DA and the first non-display area NDA1.

[0170] The display panel 100 may include a transmission area OA and a non-transmission area LSA. The transmission area OA may be an area where the light shielding film LS of the light control layer LCL is not disposed. The non-transmission area LSA may be an area where the light shielding film LS of the light control layer LCL is disposed. The light-transmitting film LT may be disposed in the transmission area OA.

[0171] In an embodiment, as shown in the drawings, the transmission area OA and the non-transmission area LSA may extend along the first direction DR1. The transmission area OA and the non-transmission area LSA may be alternately disposed in the second direction DR2.

[0172] like Figure 7 As shown in , the light control layer LCL may be provided on the touch sensor layer TSU. The light control layer LCL may control the viewing angle of the light emitted from the light emitting layer 172. For example, in the case where the light emitted from the light emitting layer 172 moves at an optional angle or less relative to the third direction DR3, the light may be emitted to the outside. On the other hand, in the case where the light emitted from the light emitting layer 172 moves more than the optional angle relative to the third direction DR3, the light may be absorbed or blocked by the light shielding film LS, and thus may not be emitted to the outside.

[0173] The light control layer LCL may include a light shielding film LS and a light transmitting film LT.

[0174] The light shielding film LS may be disposed on the touch sensor layer TSU. The light shielding film LS may be disposed in the non-transmission area LSA. Figure 6 As shown in FIG, the light shielding film LS may be disposed alternately with the light transparent film LT in the first direction DR1 or the second direction DR2. The light shielding film LS may surround the light transparent film LT.

[0175] The light shielding film LS can absorb or shield the light emitted from the light emitting layer 172. The light shielding film LS may include a light shielding organic material. For example, the light shielding film LS is a photosensitive resin capable of absorbing or shielding light, and may include an organic material containing an organic black pigment such as carbon black.

[0176] The light-transmitting film LT may be disposed on the touch sensor layer TSU. The light-transmitting film LT may be disposed in the transmission area OA. Figure 3 As shown in FIG. 1 , the light-transmitting film LT may be arranged to alternate with the light-shielding film LS in the first direction DR1 or the second direction DR2. Figure 1 As shown in , the light-transmitting film LT may be disposed in the opening of the light-shielding film LS and may be surrounded by the light-shielding film LS.

[0177] The light-transmitting film LT may transmit light emitted from the light-emitting layer 172. The light-transmitting film LT may include a transparent organic material. For example, the light-transmitting film LT may include an organic layer such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, and a polyimide resin layer. In an embodiment, the light-transmitting film LT may include silicon oxynitride or silicon oxide.

[0178] The light control layer LCL may include a light shielding film removal area SRA disposed in the first non-display area NDA1. The light shielding film removal area SRA may be an area in which the light shielding film LS is not disposed. The light-transmitting film LT may be disposed in the light shielding film removal area SRA. The light shielding film removal area SRA may have a higher light transmittance than other areas in which the light shielding film LS is disposed.

[0179] In an embodiment, the light shielding film removal area SRA may be defined by connecting the disconnected portions of the light shielding film LS. For example, the light shielding film LS extending in the first direction DR1 may be partially disconnected in the light shielding film removal area SRA. The first side Sa and the second side Sb of the light shielding film removal area SRA may extend in the second direction DR2 based on both ends of the light shielding film LS disconnected in the first direction DR1. The third side Sc and the fourth side Sd of the light shielding film removal area SRA may extend in the first direction DR1 along the light shielding film LS closest to the disconnected light shielding film LS among the undisconnected light shielding films LS.

[0180] However, the present disclosure is not limited to the above example. In the case where the light shielding film LS extends in the first direction DR1 and the second direction DR2 and is arranged in a mesh shape, the light shielding film removal area SRA can be defined based on each end of the light shielding film LS disconnected in the first direction DR1 and the second direction DR2. The light shielding film removal area SRA can be defined in various shapes such as a circular shape and a rectangular shape.

[0181] In one embodiment, Figure 6 As shown in , the shielding film removal area SRA may include a first shielding film removal area SRA1, a second shielding film removal area SRA2, a third shielding film removal area SRA3, and a fourth shielding film removal area SRA4. The first shielding film removal area SRA1, the second shielding film removal area SRA2, the third shielding film removal area SRA3, and the fourth shielding film removal area SRA4 may be disposed adjacent to a corner of the first non-display area NDA1. For example, the first shielding film removal area SRA1 may be disposed at a corner between one side in the first direction DR1 and one side in the second direction DR2, and the second shielding film removal area SRA2 may be disposed at a corner between one side in the first direction DR1 and the other side in the second direction DR2. The third shielding film removal area SRA3 may be disposed at a corner between the other side in the first direction DR1 and the other side in the second direction DR2, and the fourth shielding film removal area SRA4 may be disposed at a corner between the other side in the first direction DR1 and the one side in the second direction DR2.

[0182] The display panel 100 may include a first alignment mark MRK1. In the drawings, the shape of the first alignment mark MRK1 is shown as a rectangle on a plane, but is not limited thereto. For example, the first alignment mark MRK1 may have various shapes such as a T shape, an L shape, and an O shape. Similar to the shape of the first alignment mark MRK1, various modifications may be made to the shape of the second alignment mark MRK2.

[0183] Each of the first light shielding film removal area SRA1, the second light shielding film removal area SRA2, the third light shielding film removal area SRA3, and the fourth light shielding film removal area SRA4 can overlap with the first alignment mark MRK1 in the third direction DR3. Since the light shielding film LS is not provided in the first light shielding film removal area SRA1, the second light shielding film removal area SRA2, the third light shielding film removal area SRA3, and the fourth light shielding film removal area SRA4, the first light shielding film removal area SRA1, the second light shielding film removal area SRA2, the third light shielding film removal area SRA3, and the fourth light shielding film removal area SRA4 can have high transmittance. Therefore, during the bonding process of the display device 10, the recognition of the first alignment mark MRK1 is improved, so that the alignment accuracy with another component can be improved.

[0184] In an embodiment, Figure 7 and Figure 8 As shown in FIG. 1 , the light shielding film removal area SRA (see FIG. 1 ) such as the first light shielding film removal area SRA1 Figure 6 ) may be greater than a width D2 of the light-transmitting film LT in the display area DA. A size of the light-shielding film removal area SRA may be greater than or equal to a size of the first alignment mark MRK1.

[0185] like Figure 8 As shown in FIG. 1 , the first alignment mark MRK1 may be disposed in the display layer DU, but is not limited thereto. Fig. 9 As shown in , the first alignment mark MRK1 may be provided in the touch sensor layer TSU.

[0186] In one embodiment, in the case where the first alignment mark MRK1 is disposed in the display layer DU, the first alignment mark MRK1 may be formed of the same material on the same layer as at least one of the line layers of the thin film transistor layer TFTL or the line layers of the light emitting element layer EML. For example, the first alignment mark MRK1 may be formed of the same material on the same layer as at least one of the multiple line layers such as the lower metal layer BML, the first gate electrode TG1, the first capacitor electrode CAE1, the first anode connection electrode ANDE1, and the second anode connection electrode ANDE2. For another example, the first alignment mark MRK1 may be formed of the same material on the same layer as at least one of the first light emitting electrode 171 and the second light emitting electrode 173 disposed in the light emitting element layer EML.

[0187] In an embodiment, when the first alignment mark MRK1 is provided in the touch sensor layer TSU, the first alignment mark MRK1 may be formed of the same material on the same layer as at least one of the plurality of line layers in the touch sensor layer TSU. For example, the first alignment mark MRK1 may be formed of the same material on the same layer as at least one of the first touch electrode REL and the second touch electrode TEL.

[0188] Fig.10 is a schematic cross-sectional view illustrating a bonding process of a display device according to an embodiment.

[0189] Apart from Figures 6 to 9 In addition, refer to Fig.10 , during the bonding process of the display device 10, the recognition device MRD may be disposed above or below the display device 10. In the drawings, the recognition device MRD is illustrated as being disposed above the display device 10, but is not limited thereto.

[0190] The recognition device MRD may recognize the first alignment mark MRK1 of the display panel 100 and the second alignment mark MRK2 of the upper member UM. The recognition device MRD may check the alignment of the first alignment mark MRK1 and the second alignment mark MRK2 during the bonding process of the display device 10, thereby checking the alignment of each member. The recognition device MRD may be an optical device for recognizing light reflected from the first alignment mark MRK1 and the second alignment mark MRK2.

[0191] Since the light control layer LCL may include the light shielding film LS, light reflected from the first and second alignment marks MRK1 and MRK2 may be distorted while passing through the light control layer LCL. Therefore, it may be difficult for the recognition device MRD to correctly recognize the first and second alignment marks MRK1 and MRK2.

[0192] The display device 10 according to the embodiment may include a light shielding film removal area SRA in the light control layer LCL to improve recognition of the first and second alignment marks MRK1 and MRK2. The light shielding film removal area SRA may overlap the first and second alignment marks MRK1 and MRK2 in the third direction DR3.

[0193] Since the light shielding film LS is not provided in the light shielding film removal area SRA, deformation of light reflected from the first alignment mark MRK1 and the second alignment mark MRK2 may be hardly generated. Therefore, during the bonding process of the display device 10, recognition of the first alignment mark MRK1 and the second alignment mark MRK2 may be improved, and alignment accuracy between the upper member UM and the display panel 100 may be improved.

[0194] Hereinafter, a display device according to an embodiment will be described. In the following embodiment, the same elements as those of the previous embodiment will be denoted by the same reference numerals, and their redundant description will be omitted or simplified, and the following description will be based on the differences from the previous embodiment.

[0195] Fig.11 is a schematic plan view showing a display device according to an embodiment. Fig.12 It is along Fig.11 Schematic cross-sectional view taken along line X4-X4'. Fig.13 is a schematic cross-sectional view illustrating a bonding process of the display device according to the embodiment. Fig.14 1 is a schematic plan view illustrating an alignment process of a second alignment mark and a light shielding film removal region of a display device according to an embodiment.

[0196] Reference Figures 11 to 14 The display device 10 according to the embodiment and the reference Figure 6The display device 10 according to one embodiment described is different in that: Figures 11 to 14 The display device 10 does not include the first alignment mark MRK1.

[0197] In more detail, the display device 10 according to the embodiment may align the upper member UM and the display panel 100 by directly recognizing the second alignment mark MRK2 of the upper member UM as members to be joined and the light shielding film removal area SRA of the light control layer LCL.

[0198] In the display device 10 according to the embodiment, the display panel 100 may not include the first alignment mark MRK1 (see Fig.10 ). For example, the first alignment mark MRK1 may not be provided in the display layer DU and the touch sensor layer TSU of the display panel 100 .

[0199] Even if Fig.13 and Fig.14 As shown in , the recognition device MRD may also directly recognize the second alignment mark MRK2 of the upper member UM and the light shielding film removal area SRA of the light control layer LCL during the bonding process of the display device 10 .

[0200] The second alignment mark MRK2 and the light shielding film removal area SRA may overlap each other in the third direction DR3. In one embodiment, when the size of the second alignment mark MRK2 is smaller than the size of the light shielding film removal area SRA, the recognition device MRD may recognize the distance between each side of the second alignment mark MRK2 and each side of the light shielding film removal area SRA to check whether the second alignment mark MRK2 and the light shielding film removal area SRA are aligned.

[0201] For example, the recognition device MRD can measure a first distance Da1, a second distance Da2, a third distance Da3, and a fourth distance Da4, wherein the first distance Da1 is the distance between one side of the second alignment mark MRK2 in the first direction DR1 and one side of the shading film removal area SRA in the first direction DR1, the second distance Da2 is the distance between the other side of the second alignment mark MRK2 in the first direction DR1 and the other side of the shading film removal area SRA in the first direction DR1, the third distance Da3 is the distance between one side of the second alignment mark MRK2 in the second direction DR2 and one side of the shading film removal area SRA in the second direction DR2, and the fourth distance Da4 is the distance between the other side of the second alignment mark MRK2 in the second direction DR2 and the other side of the shading film removal area SRA in the second direction DR2. The recognition device MRD can compare the first distance Da1, the second distance Da2, the third distance Da3, and the fourth distance Da4 with the stored alignment data to determine whether the second alignment mark MRK2 and the shading film removal area SRA are aligned.

[0202] However, the present disclosure is not limited to the above example, and in the case where the second alignment mark MRK2 and the shading film removal area SRA are identical in size and shape to each other, it can be determined whether the second alignment mark MRK2 and the shading film removal area SRA completely match each other to determine whether the second alignment mark MRK2 and the shading film removal area SRA are aligned.

[0203] Even without the first alignment mark MRK1 , the display device 10 according to the embodiment may check whether each member is aligned by using the second alignment mark MRK2 and the light shielding film removal area SRA.

[0204] Figures 15 to 17 is a schematic plan view showing a display device according to other embodiments.

[0205] refer to Figures 15 to 17 The display device according to the embodiment may be different from the display device according to the reference in the number and position of the light shielding film removal areas SRA. Figure 6 and Fig.11 The display device 10 of the embodiment is described.

[0206] In more detail, in the display device according to the embodiment, the light shielding film removal area SRA may include a first light shielding film removal area SRA1 and a second light shielding film removal area SRA2 .

[0207] In accordance with Fig.15In the case of the display device of the embodiment, the light shielding film removal area SRA may be disposed adjacent to some of the plurality of corners of the first non-display area NDA1. For example, the first light shielding film removal area SRA1 may be disposed at a corner between one side in the first direction DR1 and the other side in the second direction DR2 among the plurality of corners of the first non-display area NDA1, and the second light shielding film removal area SRA2 may be disposed at a corner between the other side in the first direction DR1 and the one side in the second direction DR2 among the plurality of corners of the first non-display area NDA1.

[0208] In accordance with Fig.16 Examples and Fig.17 In case of the display device of the embodiment, the light shielding film removal area SRA may be disposed adjacent to some of the sides of the first non-display area NDA1.

[0209] For example, according to Fig.16 In the case of the display device of the embodiment of the present invention, the first light shielding film removal area SRA1 may be disposed on the other side of the first non-display area NDA1 in the second direction DR2, and the second light shielding film removal area SRA2 may be disposed on one side of the first non-display area NDA1 in the second direction DR2. Fig.17 In the case of the display device of an embodiment, the first shading film removal area SRA1 may be disposed on one side in the first direction DR1 among multiple sides of the first non-display area NDA1, and the second shading film removal area SRA2 may be disposed on the other side in the first direction DR1 among multiple sides of the first non-display area NDA1.

[0210] Although not shown in the drawings, the position of the light shielding film removal area SRA inside the first non-display area NDA1 may be variously modified.

[0211] In summarizing the detailed description, it will be appreciated by those skilled in the art that many changes and modifications may be made to the disclosed embodiments without departing from the principles of the present disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and not for the purpose of limitation.

Claims

1. A display device, wherein: The display device comprises: A light emitting element layer is disposed on the substrate; a light control layer, disposed on the light emitting element layer, the light control layer comprising a light-transmitting film and a light-shielding film; and A first alignment mark is disposed between the substrate and the light control layer, wherein: The light-transmitting films and the light-shielding films are alternately provided. The light control layer includes a light shielding film removal area in which the light shielding film is not provided, and The light shielding film removal area overlaps with the first alignment mark.

2. The display device according to claim 1, wherein: The first alignment mark does not overlap with the light shielding film.

3. The display device according to claim 1, wherein: The light shielding film extends in at least one direction in a plan view, and The light-shielding film is disconnected in the light-shielding film removal region.

4. The display device according to claim 1, wherein: The display device further includes: A display area including a plurality of light emitting elements and a non-display area on one side of the display area, Wherein, the light shielding film removal area is arranged in the non-display area.

5. The display device according to claim 4, wherein: The light shielding film removal region has a light transmittance greater than a light transmittance of a portion of the light control layer, the portion of the light control layer being disposed in the display region.

6. The display device according to claim 4, wherein: A width of the light-transmitting film in the light-shielding film removal area is greater than a width of the light-transmitting film in the display area.

7. The display device according to claim 4, wherein: In a plan view, a size of the light control layer is larger than a size of the display area.

8. The display device according to claim 1, wherein: The size of the light shielding film removal area is greater than or equal to the size of the first alignment mark.

9. The display device according to claim 1, wherein: The display device further includes: A thin film transistor layer is disposed between the substrate and the light emitting element layer. Wherein, the first alignment mark is arranged on the thin film transistor layer.

10. The display device according to claim 1, wherein: The display device further includes: A touch sensor layer is disposed between the light emitting element layer and the light control layer, Wherein, the first alignment mark is arranged on the touch sensor layer.

11. The display device according to claim 1, wherein: The display device further includes: an upper member, on the light control layer, the upper member comprising a second alignment mark, Wherein, the second alignment mark overlaps with the light shielding film removal area.

12. The display device according to claim 11, wherein: The first alignment mark overlaps with the second alignment mark.

13. A display device, wherein: The display device comprises: A light emitting element layer is disposed on the substrate; a light control layer, disposed on the light emitting element layer, the light control layer comprising a light-transmitting film and a light-shielding film; and An upper member is disposed on the light control layer, the upper member comprising a first alignment mark, wherein: The light-transmitting films and the light-shielding films are alternately provided. The light control layer includes a light shielding film removal area in which the light shielding film is not provided, and The light shielding film removal area overlaps with the first alignment mark.

14. The display device according to claim 13, wherein: The first alignment mark does not overlap with the light shielding film.

15. The display device according to claim 13, wherein: The light shielding film extends in at least one direction in a plan view, and The light shielding film is disconnected in the light shielding film removal region.

16. The display device according to claim 13, wherein: The size of the light shielding film removal area is greater than or equal to the size of the first alignment mark.

17. A display device, wherein: The display device comprises: a display area and a non-display area on one side of the display area; A light emitting element layer is disposed on the substrate; and A light control layer is disposed on the light emitting element layer, and the light control layer includes a light-transmitting film and a light-shielding film, wherein: The light control layer comprises: a plurality of transmission areas, wherein the light shielding film is not provided in the plurality of transmission areas; a plurality of non-transmission areas in which the light shielding film is disposed and the plurality of non-transmission areas alternate with the plurality of transmission areas; and a first region, in which the light shielding film is not disposed in the non-display region, and The width of the first region is greater than a width of one of the plurality of transmission regions.

18. The display device according to claim 17, wherein: The display device further includes: alignment mark, in the non-display area, Wherein, the first area overlaps with the alignment mark.

19. The display device according to claim 18, wherein: The size of the first region is greater than or equal to the size of the alignment mark.

20. The display device according to claim 17, wherein: In a plan view, a size of the light control layer is larger than a size of the display area.

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